TW201408499A - Fabricating a fluid ejection device - Google Patents

Fabricating a fluid ejection device Download PDF

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Publication number
TW201408499A
TW201408499A TW102121517A TW102121517A TW201408499A TW 201408499 A TW201408499 A TW 201408499A TW 102121517 A TW102121517 A TW 102121517A TW 102121517 A TW102121517 A TW 102121517A TW 201408499 A TW201408499 A TW 201408499A
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Taiwan
Prior art keywords
layer
chamber
channel
fluid
forming
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TW102121517A
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Chinese (zh)
Inventor
Brian M Taff
Michael Hager
Thomas R Strand
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Hewlett Packard Development Co
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Publication of TW201408499A publication Critical patent/TW201408499A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14024Assembling head parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14032Structure of the pressure chamber
    • B41J2/1404Geometrical characteristics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14403Structure thereof only for on-demand ink jet heads including a filter
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14467Multiple feed channels per ink chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/12Embodiments of or processes related to ink-jet heads with ink circulating through the whole print head

Abstract

In an embodiment, a method of fabricating a fluid ejection device includes forming on a substrate, a primer layer having a center-of-slot rib feature. The method also includes forming over the primer layer, a chamber layer that extends the center-of-slot rib. The method further includes forming over the chamber layer, a first layer of a two-layer tophat that further extends the center-of-slot rib. The method then includes forming over the first layer, a second layer of the two-layer tophat.

Description

製造流體噴出裝置之技術 Technology for manufacturing fluid ejection devices

本發明係有關於一種製造流體噴出裝置之技術。 The present invention relates to a technique for manufacturing a fluid ejection device.

發明背景 Background of the invention

噴墨印表機中之流體噴出裝置提供依照需求佈下之液滴噴出方式。噴墨印表機藉著透過多個噴嘴將墨水液滴噴出到諸如紙張的一列印媒體上而產生影像。該等噴嘴典型係佈置於一個或更多陣列中,以至於從該等噴嘴依適當順序噴出之墨水液滴使得字元或是其他影像隨著列印頭與列印媒體彼此相對移動而列印在該列印媒體上。在一特定範例中,一熱噴墨列印頭藉由使電流通過一加熱元件產生熱量而蒸發少量位於一擊發腔室中的流體,進而從噴嘴噴出液滴。在其他範例中,一壓電噴墨列印頭使用一壓電材料致動器產生壓力脈衝,迫使墨水液滴離開一噴嘴。 The fluid ejection device in the ink jet printer provides a droplet ejection method that is disposed as required. Inkjet printers produce images by ejecting ink droplets through a plurality of nozzles onto a print medium such as paper. The nozzles are typically arranged in one or more arrays such that ink droplets ejected from the nozzles in a proper sequence cause the characters or other images to be printed as the print head and the print medium move relative to each other. On the print media. In a particular example, a thermal inkjet printhead evaporates a small amount of fluid in a firing chamber by causing a current to pass through a heating element to generate heat, thereby ejecting droplets from the nozzle. In other examples, a piezoelectric inkjet printhead uses a piezoelectric material actuator to generate a pressure pulse that forces ink droplets away from a nozzle.

當噴嘴靜置暴露於大氣條件,同時處於待命未噴出狀態時,透過噴嘴孔隙蒸發的水份流失會改變墨水體積在該等孔隙、擊發腔室中的局部成分,且在某些案例中,則會超過一入口而到達層架/槽溝(墨水槽)介面。噴嘴未作用經過一段時間以後,這些局部化體積之性質變化可 能會改變液滴噴出動力學(例如,液滴軌跡、速度、形狀以及顏色)。當經過一段未使用時間後重新列印時,在噴嘴孔隙中之局部墨水體積重新充填以前,會有一段固有的延遲,該延遲以及經過一段無噴出時間後對於液滴噴出動力學的相關影響係統稱之為去封(decap)反應。業界對於噴墨印表機以及其他流體噴出系統持續改良一部分係著重於融解反應問題。 When the nozzle is left to be exposed to atmospheric conditions while being in a standby state, the loss of water evaporating through the pores of the nozzle changes the local composition of the ink volume in the pores, the firing chamber, and in some cases, It will exceed the entrance to the shelf/groove (ink tank) interface. After the nozzle has not been applied for a period of time, the properties of these localized volumes can be changed. It can change the droplet ejection kinetics (eg, droplet trajectory, velocity, shape, and color). When reprinting after an unused period of time, there is an inherent delay before the local ink volume in the nozzle aperture is refilled, and the delay and the associated effect on droplet kinetics after a period of no ejection time. It is called a decap reaction. The industry's continued improvement in inkjet printers and other fluid ejection systems focuses on melting reactions.

依據本發明之一實施例,係特地提出一種一種製造流體噴出裝置之方法,其包含:在一基體上形成一具有一溝槽中心肋材之底塗料層;在該底塗料層上形成一腔室層,其垂直於基體延伸該溝槽中心肋材;在該腔室層上形成一雙層式頂環之第一層,其進一步垂直於該基體延伸溝槽中心肋材;在該第一層上形成該雙層式頂環的一第二層。 According to an embodiment of the present invention, a method for manufacturing a fluid ejection device is specifically provided, comprising: forming a primer layer having a groove center rib on a substrate; forming a cavity on the primer layer a chamber layer extending the center rib of the groove perpendicular to the substrate; forming a first layer of a double-layer top ring on the chamber layer, further extending perpendicular to the base extending groove center rib; A second layer of the double-layered top ring is formed on the layer.

100‧‧‧噴墨列印系統 100‧‧‧Inkjet printing system

102‧‧‧噴墨列印頭總成 102‧‧‧Inkjet print head assembly

104‧‧‧墨水供應總成 104‧‧‧Ink supply assembly

106‧‧‧安置總成 106‧‧‧Relocation assembly

108‧‧‧媒體輸送總成 108‧‧‧Media delivery assembly

110‧‧‧電子印表機控制器 110‧‧‧Electronic printer controller

111‧‧‧處理器 111‧‧‧ Processor

112‧‧‧電源供應器 112‧‧‧Power supply

113‧‧‧記憶體 113‧‧‧ memory

114‧‧‧列印頭 114‧‧‧Print head

116‧‧‧噴嘴 116‧‧‧Nozzles

118‧‧‧列印媒體 118‧‧‧Printing media

119‧‧‧雙層式頂環層 119‧‧‧Double top ring layer

120‧‧‧貯存器 120‧‧‧Storage

122‧‧‧墨水液滴 122‧‧‧Ink droplets

124‧‧‧資料 124‧‧‧Information

128‧‧‧泵模組 128‧‧‧ pump module

200‧‧‧基體 200‧‧‧ base

202‧‧‧流體溝槽 202‧‧‧ fluid trench

202a、202b‧‧‧流體供應溝槽 202a, 202b‧‧‧ fluid supply trench

204‧‧‧底塗料層 204‧‧‧Under paint layer

206‧‧‧擊發阻抗器 206‧‧‧fire resistor

208‧‧‧腔室 208‧‧‧ chamber

210‧‧‧腔室層 210‧‧‧ chamber layer

212‧‧‧射流通道 212‧‧‧jet channel

214‧‧‧第一層 214‧‧‧ first floor

216‧‧‧第二層 216‧‧‧ second floor

218‧‧‧噴嘴孔隙 218‧‧‧ nozzle aperture

220‧‧‧較大空腔 220‧‧‧large cavity

222‧‧‧較小空腔 222‧‧‧ Small cavity

224‧‧‧次要流體流動路徑 224‧‧‧Secondary fluid flow path

300‧‧‧通道入口 300‧‧‧channel entrance

302‧‧‧通道出口 302‧‧‧Channel exit

304‧‧‧阻抗器泵 304‧‧‧ Impedance pump

306‧‧‧流體導管 306‧‧‧ Fluid conduit

308‧‧‧泵孔隙 308‧‧‧ pump pores

310‧‧‧泵腔室 310‧‧‧ pump chamber

312‧‧‧顆粒耐受構造 312‧‧‧Particle tolerant structure

600‧‧‧第一部分 600‧‧‧Part 1

602‧‧‧終端 602‧‧‧ Terminal

604‧‧‧凹口通道 604‧‧‧ notch channel

606‧‧‧第二部分 606‧‧‧Part II

608‧‧‧開端 608‧‧‧ Beginning

800‧‧‧通氣孔 800‧‧‧ vents

900‧‧‧蠟材料 900‧‧‧Wax material

1100‧‧‧溝槽中心肋材 1100‧‧‧ Grooved center ribs

1200~1400‧‧‧示範性方法 1200~1400‧‧‧ exemplary method

1202~1210、1302~1314、 1402~1410‧‧‧區塊 1202~1210, 1302~1314, Block 1402~1410‧‧‧

現在將藉由範例,並參考所附圖式,描述本發明之實施例,其中;圖1顯示根據一實施例之一種作為一噴墨列印系統之流體噴出系統;圖2a與2b分別顯示根據一實施例之一種示範性流體噴出裝置的一部分之一側面圖以及一平面圖;圖3到7顯示根據不同實施例之一種具有不同的聊體流動特性用於一雙層式頂帽(tophat)中之流體噴出裝置的範例; 圖8顯示根據一實施例之一種流體噴出裝置的範例,其具有一通氣孔形成於一雙層式頂環之第一層中;圖9a到9d顯示根據一實施例之圖8具有該通氣孔的流體噴出裝置的一範例;圖10顯示根據一實施例之一種具有一些通氣孔形成於一雙層式頂環之第一層中的流體噴出裝置的另一範例;圖11顯示根據一實施例之一種具有形成一”通道”支撐特徵跨過一流體槽,用以支撐該雙層式頂環之流體噴出裝置的一範例;及圖12到14顯示根據不同實施例之用以製造一流體噴出裝置的示範性方法之流程圖。 Embodiments of the present invention will now be described, by way of example, with reference to the accompanying drawings, in which FIG. 1 shows a fluid ejection system as an inkjet printing system in accordance with an embodiment; FIGS. 2a and 2b respectively show A side view of a portion of an exemplary fluid ejection device of an embodiment and a plan view; FIGS. 3 through 7 show a different flow characteristics of a chat body for use in a double top hat according to various embodiments. An example of a fluid ejection device; Figure 8 shows an example of a fluid ejection device having a vent formed in a first layer of a double-layered top ring, according to an embodiment; Figures 9a through 9d show Figure 8 having the vent according to an embodiment. An example of a fluid ejection device; FIG. 10 shows another example of a fluid ejection device having a plurality of vent holes formed in a first layer of a double-layer top ring, according to an embodiment; FIG. 11 shows an embodiment according to an embodiment. An example of a fluid ejection device having a "channel" support feature that spans a fluid channel for supporting the dual layer top ring; and Figures 12 through 14 illustrate a method for fabricating a fluid ejection device in accordance with various embodiments. Flow chart of an exemplary method.

較佳實施例之詳細說明 Detailed description of the preferred embodiment 縱觀說明 Throughout the description

如先前所述,融解反應會影響滯留墨水體積局部處到噴嘴孔隙、擊發腔室,以及其他位於流體噴出裝置中於未噴墨待命期間與周遭環境交界之鄰近區域。一般而言,融解行為傾向於色料墨水媒液分離(PIVS)以及黏性塞依附模式之形式中會產生”首次擊發滴落(first-drop-out)”列印影像的併發問題。在PIVS融解模式中,在暴露孔隙蒸發的水份會使位於該孔隙且/或裝置擊發腔室中非揮發性墨水成分產生局部濃度增加的現象。該墨水成分於特定區域中之變化會消耗掉其局部腔室內且/或孔隙內的墨水體積。當一受此動態影響之噴嘴恢復作用狀態時,從該噴嘴 噴出之第一個液滴的色澤會不同於大量補充墨水的色澤,如此便會影響列印液滴在紙張上所產生的影像品質。同樣地,黏性塞融解模式係源自於蒸發導致停駐於孔隙中(且在某些案例中位於腔室中)之墨水由於墨水中水分子消耗且接著在局部墨水黏性中蒸發而”增厚”或”硬化”。此類型之融解反應會影響液滴噴出動力,且從而產生錯向液滴、降速液滴,且在某些案例中則完全不會產生液滴。 As previously described, the melt reaction affects the localized ink volume to the nozzle aperture, the firing chamber, and other adjacent regions in the fluid ejection device that interface with the surrounding environment during the non-jetting standby. In general, the melting behavior tends to produce a "first-drop-out" print image concurrency problem in the form of pigmented ink media separation (PIVS) and viscous plug attachment mode. In the PIVS melting mode, the moisture that evaporates in the exposed pores causes a local concentration increase in the non-volatile ink components located in the pores and/or in the device firing chamber. Variations in the ink composition in a particular region can consume the volume of ink within its local chamber and/or within the pores. When the nozzle is subjected to the dynamic recovery state, from the nozzle The color of the first droplet ejected will be different from the color of the replenishing ink, which will affect the image quality of the printed droplet on the paper. Similarly, the viscous plug melt mode is derived from the evaporation of ink that causes docking in the pores (and in some cases in the chamber) due to the consumption of water molecules in the ink and subsequent evaporation in the local ink viscosity." Thicken or "harden". This type of melting reaction affects the droplet ejection power and thus produces misdirected droplets, decelerating droplets, and in some cases, no droplets at all.

緩和融解反應之先前方法大部分著重於墨水配方化學性質、輕微的結構調整、調校噴嘴擊發參數,且/或服務演算法方式。然而,這些解決方法通常係傾向特定的印表機/平台之實行方式,且因此無法提供普遍適用的解決方案。 Previous methods of mitigating the melting reaction have mostly focused on ink formulation chemistry, minor structural adjustments, adjustment of nozzle firing parameters, and/or service algorithm approach. However, these solutions are often biased towards the implementation of a particular printer/platform and therefore do not provide a universally applicable solution.

對於透過調整墨水配方而緩解融解反應方面的努力通常著重於例如加入關鍵添加劑,其通常僅對於搭配特定的色散化學性質有所幫助。著重結構的策略典型係在於制衡縮短儲放(亦即,從擊發電阻器之中心到入口墨水供料槽之邊緣的長度)、包含或不包含埋頭孔隙、以及修改電阻器尺寸。然而,這些技術通常僅能提供些微的性能增益。擊發脈衝子程式已知當作為子開啟能量(sub-TOE)混和協定,用以攪拌位於噴嘴中之墨水,以克服色料墨水媒液分離(PIVS)形式的融解動態影響,或者是藉以輸送更多的腔室內墨水體積之能量激發(以較高電壓輸送或是透過經修改先質脈衝組態),以對抗黏性塞形式之融解反應時對於特定目的之結構有些許的改良性。然而,同樣地, 此策略對於特定的非通用情況而言僅能提供邊緣性的助益。服務演算法典型會衍生浪費墨水以及該浪費墨水貯存、印表機內噴霧、以及僅能夠在作業進行前或作業執行後實施的列印/擦拭通訊協定之相關問題。 Efforts to mitigate the melting reaction by adjusting the ink formulation often focus on, for example, the addition of key additives, which are often only helpful in collocation with specific dispersion chemistries. A structurally focused strategy typically consists in balancing the storage (ie, the length from the center of the firing resistor to the edge of the inlet ink supply slot), with or without buried holes, and modifying the resistor size. However, these techniques typically only provide a slight performance gain. The firing pulse subroutine is known as a sub-TOE mixing protocol for agitating the ink located in the nozzle to overcome the melt dynamics of the pigment ink separation (PIVS) form, or to deliver more The energy of the ink volume in a plurality of chambers is excited (either at a higher voltage or through a modified precursor pulse configuration) to counteract a slightly improved structure for a specific purpose in the melt reaction of the viscous plug. However, as such, This strategy can only provide marginal benefits for specific non-generic situations. Service algorithms typically derive waste inks and associated waste ink storage, printer sprays, and print/wipe communication protocols that can only be implemented before or after job execution.

本發明揭露之實施例提供流體噴出裝置的製造技術係透過一種系統等級的硬體方式減緩融解反應,其優於現有市場上用以抵消PIVS為主的融解模式,並直接地解決黏性塞為主的融解反應。此解決方法進行一複合式多層孔隙製造,以產生新形式的噴嘴內流動通道,使得大量墨水供應能夠透過孔隙之部分進行處理。一標準式單獨頂環層係隔入一雙層式堆疊構造中作為一第一層,該層具有流動通道特徵,其透過噴嘴孔隙而匯集部分的晶粒級(die-level)重新循環流。該雙層式頂環堆疊之第二層的功用係在於以類似於傳統頂環層之方式界定出一噴嘴孔隙出口。 The disclosed embodiments of the present invention provide a manufacturing technique for a fluid ejection device that mitigates the melting reaction through a system-level hardware approach that is superior to the existing market-based melt mode for offsetting PIVS and directly addresses the viscous plug. The main melt reaction. This solution performs a composite multilayer void fabrication to create a new form of intra-nozzle flow channels that allow a large amount of ink supply to be processed through portions of the pores. A standard individual top ring layer is interposed as a first layer in a two-layer stack configuration having a flow channel feature that collects a portion of the die-level recirculating flow through the nozzle aperture. The second layer of the two-layer top ring stack functions to define a nozzle aperture outlet in a manner similar to a conventional top ring layer.

有許多不同的技術適合產生晶粒級流體循環。儘管晶粒級流體循環在本文中係與噴嘴內或穿過孔隙之流體流動的觀念整合在一起,用以產生此等循環之技術並非本文的焦點。簡而言之,此等技術能夠包括例如將流體-引動器驅動整合泵整合於主要流體重新循環通道中。整合於射流通道中之不對稱位置處(例如,朝向通道尾端)的流體引動器之選擇性作動能夠產生通過該通道的單向以及雙向流體流動。依照所使用的引動器機構,對於引動器之機械運作或運動的時間性控制亦能夠提供流體經過一射流通 道之流動方向控制。流體引動器能夠藉由許多引動器機構加以驅動,諸如熱氣泡電阻器、壓電薄膜引動器、靜電薄膜(MEMS)引動器、機械/衝擊驅動薄膜引動器、發聲線圈引動器、磁伸縮驅動引動器、交流電滲透(ACEO)泵機構,以及其他等等機構。流體引動器能夠整合於微射流系統(例如流體噴出裝置)之通道中。其他用以產生晶粒級流體循環的技術包括藉由諸如一外部氣動泵或注射器之晶粒外(off-die)機構的壓力差異驅動。然而,此等機構典型係相當笨重,難以處理與規劃,且具有不可靠的相關問題。 There are many different techniques suitable for producing grain-level fluid circulation. While the grain-level fluid circulation is integrated herein with the notion of fluid flow within or through the pores, the techniques used to generate such cycles are not the focus of this paper. In short, such techniques can include, for example, integrating a fluid-exciter drive integrated pump into a primary fluid recirculation passage. Selective actuation of a fluid actuator integrated at an asymmetrical location in the jet channel (e.g., toward the trailing end of the channel) can create unidirectional and bi-directional fluid flow through the channel. Depending on the actuator mechanism used, time control of the mechanical operation or movement of the actuator can also provide fluid flow through a single shot. The flow direction of the road is controlled. The fluid actuator can be driven by a number of actuator mechanisms, such as thermal bubble resistors, piezoelectric film actuators, electrostatic thin film (MEMS) actuators, mechanical/impact driven film actuators, acoustic coil actuators, magnetically telescopic drive actuation , AC electroosmosis (ACEO) pump mechanisms, and more. The fluid actuator can be integrated into the passage of a microfluidic system, such as a fluid ejection device. Other techniques for creating a grain-level fluid cycle include driving by a differential pressure of an off-die mechanism such as an external pneumatic pump or syringe. However, such institutions are typically cumbersome, difficult to handle and plan, and have unreliable related problems.

在流體噴出裝置中,這些與其他的晶粒級重新循環技術能夠有助於將補充墨水沖洗通過流體/墨水擊發腔室。然而,本發明揭露之製造技術則提供一種經由孔隙的墨水補充解決方法,其直接地克服形成孔隙內黏性塞之蒸發驅動形成形式的問題。此策略延伸了先前印表機系統為主的領域,以便管理列印輸出與融解動力相關的併發問題,且達成一理想的”即刻開啟”噴嘴,其並不需要一系列的重清吐墨或服務子程式確保經過一段待機未噴墨期間以後所列印的第一液滴係能夠完美符合參考線之品質。 These and other grain level recirculation techniques can assist in flushing the supplemental ink through the fluid/ink firing chamber in the fluid ejection device. However, the fabrication techniques disclosed herein provide an ink replenishment solution via voids that directly overcomes the problem of forming an evaporative drive formation in the pores. This strategy extends the field of previous printer systems to manage the concurrency issues associated with print output and melt power, and achieves an ideal "on-the-fly" nozzle that does not require a series of re-inking or The service subroutine ensures that the first drop system printed after a period of standby and no ink jetting is perfectly matched to the quality of the reference line.

本文所揭露之製造技術使得具有多層孔隙構造之流體噴出裝置的總成能夠提供穿過孔隙之流體流動。該多層孔隙構造係形成於該流體噴出裝置之多層頂環層中。當藉由傳統技術形成此多層頂環層時可能會產生併發問題,其可能導致諸如由於下方裝置層中之受困空氣袋之阻礙而在該頂環中產生真空的問題。一般而言,藉由在中心 溝槽區域中的多層頂環層下方設置額外的結構支撐,並藉著避免空氣受困於該多層頂環層下方的其他區域中,本發明揭露內容之製造技術可以避免產生此併發問題。 The fabrication techniques disclosed herein enable an assembly of fluid ejection devices having a multi-layered pore configuration to provide fluid flow through the pores. The multilayer pore structure is formed in a multilayer top ring layer of the fluid ejection device. Concurrency problems may arise when such a multilayer top ring layer is formed by conventional techniques, which may cause problems such as creating a vacuum in the top ring due to obstruction of trapped air pockets in the lower device layer. In general, by the center Additional structural support is provided beneath the multi-layer top ring layer in the trench region, and by avoiding air trapping in other regions below the multi-layer top ring layer, the fabrication techniques of the present disclosure can avoid this concurrency problem.

在一示範性實施例中,一種製造一流體噴出裝置之方法包括在一基體上形成一底塗料層。該底塗料層具有一溝槽中心肋材。亦即,形成該底塗料層包括形成一該底塗料層之加強件,其位於一接續形成之流體溝槽的中心內。該製造方法亦包括在該底塗料層上形成一腔室層,且該腔室層垂直於該基體延伸該溝槽中心肋材。因此,形成該腔室層會疊加在該溝槽中心肋材上。一雙層式頂環層之第一層接著係形成於該腔室層上,其再度延伸該溝槽中心肋材。該雙層式頂環之第二層接著係形成於該第一層上。 In an exemplary embodiment, a method of making a fluid ejection device includes forming a primer layer on a substrate. The primer layer has a grooved center rib. That is, forming the primer layer includes forming a reinforcement of the primer layer in the center of a subsequently formed fluid channel. The method of manufacturing also includes forming a chamber layer on the primer layer, and the chamber layer extends the trench center rib perpendicular to the substrate. Thus, the formation of the chamber layer will be superimposed on the central rib of the trench. A first layer of a two-layer top ring layer is then formed on the chamber layer that extends the groove center rib again. A second layer of the double layer top ring is then formed on the first layer.

在另一示範性實施例中,一種製造一流體噴出裝置之方法包括在一基體上形成一底塗料層,並在該底塗料層上形成一腔室層,其中該腔室層包括一流體通道與一腔室。接著一雙層式頂環層之第一層係形成於該腔室層上,該第一層係形成包括一通氣孔,該通氣孔延伸穿過該第一層到達流體通道。在一實施方式中,該流體通道包含一U形流體通道,其在兩邊之通道尾端處耦合到一溝槽,且該通氣孔係位於該U形流體通道的彎曲處或是頂端上。在另一實施方式中,該流體通道在兩個不同的溝槽之間延伸。 In another exemplary embodiment, a method of making a fluid ejection device includes forming a primer layer on a substrate and forming a chamber layer on the primer layer, wherein the chamber layer includes a fluid channel With a chamber. A first layer of a two-layer top ring layer is then formed on the chamber layer, the first layer forming comprising a venting aperture extending through the first layer to the fluid channel. In one embodiment, the fluid passageway includes a U-shaped fluid passageway coupled to a groove at the end of the channel at both sides, and the venting opening is located at a bend or a top end of the U-shaped fluid passage. In another embodiment, the fluid passage extends between two different grooves.

在另一示範性實施例中,一種製造一流體噴出裝置之方法包括在一基體上形成一底塗料層,且在該底塗料層上形成一腔室層,其中該腔室層包括一通道。一雙層 式頂環層之第一層係形成於該底塗料層上,且包括一通氣孔在該通道上方,且該雙層式頂環層之第二層係形成於該第一層上。各層亦包含一部分之溝槽中心肋材,其在該第二層與基體之間延伸。 In another exemplary embodiment, a method of making a fluid ejection device includes forming a primer layer on a substrate and forming a chamber layer on the primer layer, wherein the chamber layer includes a channel. One double layer A first layer of the top ring layer is formed on the primer layer and includes a vent hole above the channel, and a second layer of the double layer top ring layer is formed on the first layer. Each layer also includes a portion of the grooved center rib that extends between the second layer and the substrate.

示範性實施例之說明 Description of the exemplary embodiments

圖1顯示根據本發明揭露之一實施例的一種作為一噴墨列印系統100之流體噴出系統。噴墨列印系統100一般而言包括一噴墨列印頭總成102、一墨水供應總成104、一安置總成106、一媒體輸送總成108、一電子印表機控制器110、以及至少一個電源供應器112,其供應電力到噴墨列印系統100的各種不同的電子元件。在此實施例中,流體噴出裝置114係用以作為流體液滴噴出列印頭114。噴墨列印頭總成102包括至少一個流體液滴噴出列印頭114,其透過多個孔隙或是噴嘴116將墨水液滴噴向列印媒體118,以便列印在該列印媒體118上。噴嘴116典型而言係佈置成一個或更多的列或陣列,以至於當噴墨列印頭總成102以及列印媒體118彼此相對移動時,使以適當順序從噴嘴116噴出的墨水形成欲列印於列印媒體118上的字元、符號且/或其他圖案或影像。列印媒體118可為任何類型的適當片狀或捲狀材料,諸如紙張、卡片疊、投影片、美拉以及類似材料。如同以下進一步之描述,各個列印頭114包含一個具有流動通道特徵之雙層式頂環層119,其透過噴嘴孔匯集部分的晶粒級重新循環流動。 1 shows a fluid ejection system as an inkjet printing system 100 in accordance with an embodiment of the present disclosure. The inkjet printing system 100 generally includes an inkjet print head assembly 102, an ink supply assembly 104, a mounting assembly 106, a media delivery assembly 108, an electronic printer controller 110, and At least one power supply 112 that supplies power to various different electronic components of the inkjet printing system 100. In this embodiment, the fluid ejection device 114 is used to eject the print head 114 as a fluid droplet. The inkjet printhead assembly 102 includes at least one fluid droplet ejection printhead 114 that ejects ink droplets through a plurality of apertures or nozzles 116 to a print medium 118 for printing on the print medium 118. . The nozzles 116 are typically arranged in one or more columns or arrays such that when the inkjet printhead assembly 102 and the print medium 118 are moved relative to each other, the ink ejected from the nozzles 116 in an appropriate sequence is formed. Characters, symbols, and/or other patterns or images printed on the print media 118. Print media 118 can be any type of suitable sheet or roll material such as paper, card stacks, transparencies, mela, and the like. As further described below, each of the printheads 114 includes a two-layer top ring layer 119 having flow channel features that recirculate through the grain level of the collection portion of the nozzle holes.

墨水供應總成104將液態墨水供應到列印頭總成 102,且包括一用以儲存墨水之貯存器120,墨水從貯存器120流動到列印頭總成102。墨水供應總成104以及噴墨列印頭總成102能夠形成單向墨水輸送系統或是一微重新循環墨水輸送系統。在一單向墨水輸送系統中,大致上所有供應到噴墨列印頭總成102之墨水在列印期間係消耗殆盡。然而,在一微重新循環墨水輸送系統中,供應到列印頭總成102之墨水僅有一部分於列印期間消耗掉,列印期間未消耗之墨水係返回到墨水供應總成104。 The ink supply assembly 104 supplies liquid ink to the print head assembly 102, and including a reservoir 120 for storing ink, the ink flows from the reservoir 120 to the printhead assembly 102. The ink supply assembly 104 and the inkjet printhead assembly 102 can form a one-way ink delivery system or a micro-recirculating ink delivery system. In a one-way ink delivery system, substantially all of the ink supplied to the inkjet printhead assembly 102 is consumed during printing. However, in a micro recirculating ink delivery system, only a portion of the ink supplied to the printhead assembly 102 is consumed during printing, and the ink that was not consumed during printing is returned to the ink supply assembly 104.

在某些實施方式中,噴墨列印頭總成102以及墨水供應總成104係一起容納在一墨水匣或盤中。在其他實施方式中,墨水供應總成104係與噴墨列印頭總成102分開,並透過一諸如一供應管之介面連接,將墨水供應到噴墨列印頭總成102。在另一實施方式中,墨水供應總成104之貯存器120能夠加以去除、更換且/或重填。在噴墨列印頭總成102以及墨水供應總成104係一起容納於噴墨匣的案例中,貯存器120能夠包括一個位於該卡匣內之近端貯存器以及一個與該卡匣隔開之較大的貯存器,一單獨隔開之較大的貯存器係用以重填該近端貯存器。因此,一單獨隔開之較大貯存器且/或近端貯存器能夠加以去除、更換且/或重填。 In some embodiments, the inkjet printhead assembly 102 and the ink supply assembly 104 are housed together in an ink cartridge or tray. In other embodiments, the ink supply assembly 104 is separate from the inkjet printhead assembly 102 and supplies ink to the inkjet printhead assembly 102 through a interface such as a supply tube. In another embodiment, the reservoir 120 of the ink supply assembly 104 can be removed, replaced, and/or refilled. In the case where the inkjet printhead assembly 102 and the ink supply assembly 104 are housed together in an inkjet cartridge, the reservoir 120 can include a proximal reservoir within the cassette and a septum spaced from the cartridge. The larger reservoir, a separately spaced larger reservoir, is used to refill the proximal reservoir. Thus, a separately spaced larger reservoir and/or proximal reservoir can be removed, replaced and/or refilled.

安置總成106對於媒體輸送總成108定位噴墨列印頭總成102,且媒體輸送總成108則對於噴墨列印頭總成102定位列印媒體118。因此,一列印區域係界定於噴墨列印頭總成102以及列印媒體118之間鄰接噴嘴116的一區域 中。在一實施方式中,噴墨列印頭總成102係為一種掃描類型列印頭總成。因此,安置總成106包括一卡匣,其用以對於媒體輸送總成108移動噴墨列印頭總成102,以掃描列印媒體118。在其他實施方式中,噴墨列印頭總成102係為一非掃描式噴墨列印頭總成。因此,安置總成106將噴墨列印頭總成102相對於媒體輸送總成108固定在一描述位置。所以,媒體輸送總成108會對於噴墨列印頭總成102定位該列印媒體118。 The placement assembly 106 positions the inkjet printhead assembly 102 for the media delivery assembly 108, and the media delivery assembly 108 positions the print media 118 for the inkjet printhead assembly 102. Thus, a print area is defined between the ink jet print head assembly 102 and the print medium 118 adjacent a region of the nozzle 116. in. In one embodiment, the inkjet printhead assembly 102 is a scan type printhead assembly. Accordingly, the mounting assembly 106 includes a cassette for moving the inkjet printhead assembly 102 to the media delivery assembly 108 to scan the print medium 118. In other embodiments, the inkjet printhead assembly 102 is a non-scanning inkjet printhead assembly. Accordingly, the placement assembly 106 secures the inkjet printhead assembly 102 relative to the media delivery assembly 108 in a depicted position. Therefore, the media delivery assembly 108 will position the print media 118 for the inkjet printhead assembly 102.

在一實施方式中,噴墨列印頭總成102包括一個列印頭114。在其他實施例中,噴墨列印頭總成102係為一具有多重列印頭114之寬陣列式總成。在寬陣列式總成中,一噴墨列印頭總成102係典型包括一載體,其承載列印頭114、提供列印頭114與電子控制器110之間的電氣連接、並且提供列印頭114與墨水供應總成104之間的流體連接。 In one embodiment, the inkjet printhead assembly 102 includes a printhead 114. In other embodiments, the inkjet printhead assembly 102 is a wide array assembly having multiple printheads 114. In a wide array assembly, an inkjet printhead assembly 102 typically includes a carrier that carries a printhead 114, provides an electrical connection between the printhead 114 and the electronic controller 110, and provides printing. The fluid connection between the head 114 and the ink supply assembly 104.

在一實施方式中,噴墨列印系統100係為一種依需求噴出液滴之熱氣泡噴墨列印系統,其中該列印頭114係為一個熱噴墨(TIJ)列印頭。該熱噴墨列印頭配置一熱阻噴出元件在一墨水腔室中,用以蒸發墨水並產生氣泡,其迫使墨水或其他流體液滴離開一噴嘴118。在另一實施例中,噴墨列印系統100係為一種依需求噴出液滴之壓電噴墨列印系統,其中該列印頭114係為一種壓電噴墨(PIJ)列印頭,其以一壓電材料引動器作為一噴出元件,用以產生壓力脈衝,其迫使墨水液滴離開一噴嘴。 In one embodiment, the inkjet printing system 100 is a thermal bubble inkjet printing system that ejects droplets as desired, wherein the printhead 114 is a thermal inkjet (TIJ) printhead. The thermal inkjet printhead is configured with a thermal resistance ejection element in an ink chamber for evaporating ink and creating bubbles that force ink or other fluid droplets away from a nozzle 118. In another embodiment, the inkjet printing system 100 is a piezoelectric inkjet printing system that ejects droplets as needed, wherein the printing head 114 is a piezoelectric inkjet (PIJ) printing head. It uses a piezoelectric material actuator as a discharge element for generating a pressure pulse that forces the ink droplets away from a nozzle.

電子列印控制器110典型包括一個或更多的處理 器111、韌體、軟體、一個或更多的電腦/處理器可讀記憶體組件113,包括依電性以及非依電性記憶體組件(亦即,非暫態具體媒介)、以及其他用以通聯與控制噴墨列印頭總成102之印表機電子元件、安置總成106、以及媒體輸送總成108。電子控制器110接收來自於一諸如一電腦之主機系統的資料124,並且暫時地將資料124貯存在一記憶體113中。典型而言,資料124係沿著一電子、紅外線、光學或其他資訊傳遞路徑傳送到噴墨列印系統100。資料124表示例如欲進行列印之一文件且/或檔案。因此,資料124對於噴墨列印系統100而言會形成一列印工作,並包括一個或更多的列印工作指令且/或指令參數。 The electronic print controller 110 typically includes one or more processes 111, firmware, software, one or more computer/processor readable memory components 113, including electrical and non-electrical memory components (ie, non-transitory specific media), and others The printer electronics, the mounting assembly 106, and the media delivery assembly 108 of the inkjet printhead assembly 102 are coupled and controlled. The electronic controller 110 receives the data 124 from a host system such as a computer and temporarily stores the data 124 in a memory 113. Typically, data 124 is transmitted to inkjet printing system 100 along an electronic, infrared, optical or other information transfer path. The data 124 represents, for example, one of the documents and/or files to be printed. Thus, the data 124 will form a print job for the inkjet printing system 100 and include one or more print job instructions and/or command parameters.

在一實施方式中,電子印表機控制器110控制噴墨列印頭總成102,用以從噴嘴116噴出墨水液滴。因此,電子控制器110界定出噴出墨水液滴之圖案,在列印媒體118上形成字元、符號、且/或其他圖形或影像。噴出墨水液滴之圖案係藉由該列印工作指令且/或指令參數加以決定。 In one embodiment, electronic printer controller 110 controls inkjet printhead assembly 102 for ejecting ink droplets from nozzles 116. Thus, electronic controller 110 defines a pattern of ejected ink drops that form characters, symbols, and/or other graphics or images on print medium 118. The pattern of ejected ink droplets is determined by the print job command and/or command parameters.

在一實施方式中,電子控制器110包括一流體泵模組128存放於控制器110的記憶體113中。泵模組128包括經過編碼的指令,其能夠藉由控制器110之一個或更多的處理器111加以執行,以便使該控制器110實行能夠在列印頭114之射流通道中運作的射流泵(圖1中未顯示)之各種不同功能,以產生透過射流通道循環之晶粒級流體流動。泵模組128管理諸如流體流通過該等通道的方向、速率以及時機。一射流泵能夠包括各種不同類型之泵引動器,包括 例如一阻抗式泵,其藉由加熱流體以產生膨脹且伴生蒸汽氣泡而產生流體位移、一產生壓電脈衝之壓電材料引動器、以及一交流電滲透(ACEO)泵機構,其透過電子在該列印頭114之射流通道中的電氣刺激而產生一流體網流。在某些實施方式中,通過列印頭114之射流循環能夠使用脫晶壓力差異所達成。 In one embodiment, the electronic controller 110 includes a fluid pump module 128 that is stored in the memory 113 of the controller 110. The pump module 128 includes encoded instructions that can be executed by one or more processors 111 of the controller 110 to cause the controller 110 to implement a jet pump that can operate in the jet channel of the printhead 114. Various functions of (not shown in Figure 1) are utilized to create a grain-level fluid flow that circulates through the jet channel. Pump module 128 manages the direction, rate, and timing of fluid flow through the channels. A jet pump can include a variety of different types of pump actuators, including For example, an impedance pump that generates fluid displacement by heating a fluid to generate expansion and associated with vapor bubbles, a piezoelectric material actuator that generates piezoelectric pulses, and an alternating current permeation (ACEO) pump mechanism through which electrons are transmitted. The electrical stimulation in the jet channel of the print head 114 produces a fluid network stream. In some embodiments, the jet flow through the printhead 114 can be achieved using a difference in decrystallization pressure.

圖2顯示根據本發明揭露內容之一實施例的一示範性流體噴出裝置114(亦即列印頭114)之一側視圖(圖2a)以及一平面圖(圖2b)。列印頭114於圖2中所顯示之部分係為液滴產生部分,其中流體/墨水液滴係從列印頭114經由一噴嘴116噴出。列印頭114部分係形成一層疊構造,其包括一基體200(例如玻璃、矽氧烷),一流體溝槽202或槽溝係形成於其中。一般而言,列印頭114諸如流體溝槽202之特徵係使用各種不同的精密微製造技術所形成,諸如電氣成形、雷射切割、等向異性蝕刻、噴濺、旋轉塗佈、乾式蝕刻、光微影、鑄造、模製、壓印、切削加工以及類似方式。 2 shows a side view (FIG. 2a) and a plan view (FIG. 2b) of an exemplary fluid ejection device 114 (ie, printhead 114) in accordance with an embodiment of the present disclosure. The portion of the print head 114 shown in FIG. 2 is a drop generating portion in which fluid/ink droplets are ejected from the print head 114 via a nozzle 116. The print head 114 portion is formed in a laminated configuration comprising a substrate 200 (e.g., glass, decane) with a fluid channel 202 or trench formed therein. In general, the features of the print head 114, such as the fluid channel 202, are formed using a variety of different precision microfabrication techniques, such as electrical forming, laser cutting, anisotropic etching, sputtering, spin coating, dry etching, Photolithography, casting, molding, stamping, cutting, and the like.

參考圖2,列印頭114在該基體200上進一步包括一底塗料層204。底塗料層204典型係由SU8環氧化物所形成,但亦能夠由諸如聚醯胺之其他材料所形成。一擊發阻抗器206亦形成於該基體200上,其藉著加熱位於一腔室208中之一微小層的周圍流體,進而產生一蒸汽氣泡,迫使墨水離該噴嘴116而透過該噴嘴116噴出墨水液滴。腔室208係藉由一腔室層210所界定,其係形成於底塗料層204以及基體200上方。該腔室層210亦界定出一射流通道 212,其係為墨水流入與流出該流體溝槽202的主要流動路徑,例如,諸如圖3中所示者。經由腔室層210之主要流體流動路徑(亦即射流通道212)在圖2a中係藉由三個筆直箭號所顯示。圖2中並未顯示形成腔室層210的材料(亦即,僅顯示射流通道212以及藉由該腔室層210所界定出的腔室208)。然而,與底塗料層204相似,該腔室層210典型係由SU8環氧化物所形成,但亦能夠由諸如聚醯胺之其他材料所形成。 Referring to FIG. 2, the print head 114 further includes a primer layer 204 on the substrate 200. The primer layer 204 is typically formed from SU8 epoxide, but can also be formed from other materials such as polyamine. A firing resistor 206 is also formed on the substrate 200 by heating a surrounding fluid located in a microlayer of a chamber 208 to generate a vapor bubble that forces ink from the nozzle 116 to eject ink through the nozzle 116. Droplet. The chamber 208 is defined by a chamber layer 210 formed over the primer layer 204 and the substrate 200. The chamber layer 210 also defines a jet channel 212, which is the primary flow path for ink to flow into and out of the fluid channel 202, such as, for example, as shown in FIG. The primary fluid flow path (i.e., jet channel 212) via chamber layer 210 is shown in Figure 2a by three straight arrows. The material forming the chamber layer 210 is not shown in FIG. 2 (i.e., only the jet channel 212 and the chamber 208 defined by the chamber layer 210 are shown). However, similar to the primer layer 204, the chamber layer 210 is typically formed from SU8 epoxide, but can also be formed from other materials such as polyamidamine.

一雙層式頂環層119係形成於腔室層210上。該雙層式頂環119形成一個雙層堆疊,其包括一第一層214以及一第二層216。因此,該第一層214係為位於該雙層式頂環119中之一內層,其佈置於該雙層式頂環119之第二層216(亦即最頂層)以及該腔室層210之間。該雙層式頂環119之厚度大約為20微米左右。然而,在某些實施方式中,該厚度能夠多於或少於20微米。第一層214之厚度大約為15微米左右,而第二層216的厚度則為5微米左右。儘管這些尺寸在某些實施方式中會有所變化,該雙層式頂環119之第一層214的厚度一般而言係為該雙層式頂環層119之整體厚度的50~75%之間。該雙層式頂環119典型而言係由SU8環氧化物所形成,但其亦能夠由諸如聚醯胺之其他材料所製成。 A two-layer top ring layer 119 is formed on the chamber layer 210. The two-layer top ring 119 forms a two-layer stack that includes a first layer 214 and a second layer 216. Therefore, the first layer 214 is located in an inner layer of the double-layer top ring 119, which is disposed on the second layer 216 (ie, the topmost layer) of the double-layer top ring 119 and the chamber layer 210. between. The double-layered top ring 119 has a thickness of about 20 microns. However, in certain embodiments, the thickness can be more or less than 20 microns. The first layer 214 has a thickness of about 15 microns and the second layer 216 has a thickness of about 5 microns. Although these dimensions may vary in certain embodiments, the thickness of the first layer 214 of the double-layer top ring 119 is generally 50 to 75% of the overall thickness of the double-layer top ring layer 119. between. The two-layer top ring 119 is typically formed from SU8 epoxide, but it can also be made from other materials such as polyamine.

一個雙重尺寸噴嘴孔隙218係形成於該雙層式頂環119中,其跨過該頂環層119之第一層214與第二層216。如圖2a中所示,該雙重尺寸孔隙218包括兩個不同形狀的 空腔。該噴嘴孔隙218包括一較大空腔220,其形成於該雙層式頂環119之第一層214中、以及一較小空腔222,其形成在該雙層式頂環119的第二層216中。該較大空腔220包覆之一體積係大於較小空腔222所包覆的體積。然而,如圖2b中所示,藉由較大空腔所包覆的體積並未包括與佈置於下方之腔室208相同的寬度尺寸。取而代之的是,該較大空腔之寬度係較佈置於其下方之腔室208的寬度為窄。 A double-sized nozzle aperture 218 is formed in the double-layered top ring 119 that spans the first layer 214 and the second layer 216 of the top ring layer 119. As shown in Figure 2a, the dual sized aperture 218 comprises two different shapes Cavity. The nozzle aperture 218 includes a larger cavity 220 formed in the first layer 214 of the dual layer top ring 119 and a smaller cavity 222 formed in the second layer of the double top ring 119 216. The larger cavity 220 covers one volume than the smaller cavity 222. However, as shown in Figure 2b, the volume covered by the larger cavity does not include the same width dimension as the chamber 208 disposed below. Instead, the larger cavity has a wider width than the chamber 208 disposed below it.

再次參考圖2a,儘管射流通道212在腔室層210中形成用於晶粒級流體循環之主要流體流動路徑,位於噴嘴孔隙218中之較大空腔220能夠產生一次要流體流動路徑224,其透過該噴嘴孔隙218匯集一部分在射流通道212中流動的晶粒級流體/墨水。此透過噴嘴孔隙218經由該次要路徑224之流體流係能夠瓦解位於該噴嘴區域中的滯留流體體積,該滯留流體體積能夠在噴嘴116待機且未噴出流體期間發展。通過噴嘴孔隙218之流體/墨水流動提供了嶄新且大量的墨水體積,其緩解了PIVS以及黏性塞融解反應模式,並改良了由列印頭114”首發液滴滴出”之列印品質。如以下所述,形成於該雙層式頂環119之第一/中間層214中的其他流體流動特徵提供了額外透過該噴嘴孔隙218流動的流體。 Referring again to FIG. 2a, although the jet channel 212 forms a primary fluid flow path for the grain level fluid circulation in the chamber layer 210, the larger cavity 220 located in the nozzle aperture 218 is capable of generating a primary fluid flow path 224 through which The nozzle aperture 218 collects a portion of the grain level fluid/ink flowing in the jet channel 212. This fluid flow through the nozzle aperture 218 via the secondary path 224 can disrupt the volume of retentate fluid located in the nozzle region, which can develop during the standby of the nozzle 116 and without ejecting fluid. The fluid/ink flow through the nozzle apertures 218 provides a new and substantial volume of ink that alleviates the PIVS and viscous plug melt reaction modes and improves the print quality of the first drop of droplets by the print head 114". Other fluid flow features formed in the first/intermediate layer 214 of the dual layer top ring 119 provide additional fluid flow through the nozzle apertures 218, as described below.

圖3~7顯示根據本發明揭露內容之實施例的具有不同流體流動特徵實行於一種雙層式頂環119中的流體噴出裝置114(亦即列印頭114)之範例。圖3~7中之各個示範性列印頭114係利用平面圖加以顯示,其顯示腔室層210佈 置、該雙層式頂環119之第一層214佈置、該雙層式頂環119的第二層216佈置的個別視圖、以及一整體設計佈置圖,其將各層整合到一單一視圖中。注意到的是,底塗料層204並未顯示在這些視圖中,但其會在安裝腔室層210以前置入。擊發阻抗器206以及在某些案例中的泵引動器(例如泵阻抗器)亦顯示於該整體設計佈置圖中。 3-7 illustrate examples of fluid ejection devices 114 (i.e., printheads 114) having different fluid flow characteristics implemented in a double-layered top ring 119 in accordance with an embodiment of the present disclosure. Each of the exemplary print heads 114 of Figures 3-7 is shown in plan view showing the chamber layer 210. The first layer 214 of the two-layer top ring 119 is arranged, the individual views of the second layer 216 of the two-layer top ring 119 are arranged, and an overall design layout that integrates the layers into a single view. It is noted that the primer layer 204 is not shown in these views, but would be placed prior to mounting the chamber layer 210. The firing resistor 206 and, in some cases, a pump actuator (e.g., a pump resistor) are also shown in the overall design layout.

參考圖3,腔室層210界定出擊發腔室208、一泵腔室310、以及射流通道212,其在該通道212之一第一尾端300處從流體溝槽212延伸圍繞到該通道212的一第二尾端302。該第一與第二通道尾端300、302能夠分別稱之為通道入口300以及通道出口302,依照流體流動通過該通道212之方向而定。如先前所知,位於腔室層210中之射流通道212形成用於晶粒級流體循環的主要流體流動路徑。如同圖3之整體佈置圖中所示,位於泵腔室310中之例如一個阻抗器泵304,或者是其他類型之射流泵,諸如一壓電引動器或ACEO泵,或是一產生流體壓力差異之脫離基體機構,將流體/墨水從溝槽202泵送通過該通道212與擊發腔室208,並透過通道出口302回到溝槽202。在某些實施方式中,列印頭114亦包括顆粒耐受構造312。如本文中所使用,顆粒耐受構造(PTA)係稱之為佈置於流體/墨水路徑中(例如通道入口300以及出口302)中之阻礙物,以協助避免諸如灰塵以及氣泡等顆粒干擾流體/墨水流動,並避免堵塞噴出腔室且/或噴嘴116。 Referring to FIG. 3, the chamber layer 210 defines a firing chamber 208, a pump chamber 310, and a jet channel 212 that extends from the fluid channel 212 to the channel 212 at a first end 300 of the channel 212. A second end 302. The first and second passage ends 300, 302 can be referred to as a passage inlet 300 and a passage outlet 302, respectively, depending on the direction in which the fluid flows through the passage 212. As previously known, the jet channels 212 located in the chamber layer 210 form a primary fluid flow path for grain level fluid circulation. As shown in the overall layout of Figure 3, for example, a resistor pump 304 located in the pump chamber 310, or other type of jet pump, such as a piezoelectric actuator or ACEO pump, or a difference in fluid pressure Disengaging the substrate mechanism, fluid/ink is pumped from the channel 202 through the channel 212 and the firing chamber 208 and through the channel outlet 302 back to the channel 202. In some embodiments, the printhead 114 also includes a particle-resistant formation 312. As used herein, a particle-tolerant construct (PTA) is referred to as an obstruction disposed in a fluid/ink path (eg, channel inlet 300 and outlet 302) to help prevent particles such as dust and bubbles from interfering with the fluid/ The ink flows and avoids clogging the ejection chamber and/or the nozzle 116.

一流體導管306係形成於該雙層式頂環119之第 一層214中的阻抗器泵304上。該流體導管306與泵孔隙308係顯示於圖3之該第一層214視圖中,並顯示噴嘴孔隙218,其包括較大空腔220以及較小空腔222,如先前對於圖2之描述者。在圖3之實施方式中,該流體導管306從泵孔隙308延伸到該噴嘴孔隙218之較大空腔220,接續其上方之射流通到212的路徑。在諸如圖4a所示的其他實施方式中,該流體導管306從泵孔隙308延伸到該噴嘴孔隙218的較大空腔220,但並未接續上方的射流通道212之路徑。該流體導管306交叉且運行穿過圖2之噴嘴孔隙218的較大空腔220。另一種說法為,該噴嘴孔隙218之較大空腔220在雙層式頂環119之第一層214中形成一部分的流體導管306。此外,注意到的是,此設計與其他設計之流體導管306能夠延伸超過該通道出口302,並從溝槽202區域上方接出(亦即超過該顆粒耐受構造312)。 A fluid conduit 306 is formed in the double top ring 119 The resistor pump 304 in a layer 214. The fluid conduit 306 and pump aperture 308 are shown in the first layer 214 view of FIG. 3 and show a nozzle aperture 218 that includes a larger cavity 220 and a smaller cavity 222, as previously described for FIG. In the embodiment of FIG. 3, the fluid conduit 306 extends from the pump aperture 308 to the larger cavity 220 of the nozzle aperture 218, following the path of the flow therethrough to 212. In other embodiments, such as that shown in Figure 4a, the fluid conduit 306 extends from the pump aperture 308 to the larger cavity 220 of the nozzle aperture 218, but does not follow the path of the upper jet channel 212. The fluid conduit 306 intersects and runs through the larger cavity 220 of the nozzle aperture 218 of FIG. Alternatively, the larger cavity 220 of the nozzle aperture 218 forms a portion of the fluid conduit 306 in the first layer 214 of the dual layer top ring 119. In addition, it is noted that this design and other designs of fluid conduits 306 can extend beyond the channel outlet 302 and exit above the region of the trench 202 (i.e., beyond the particle-resistant formation 312).

隨著流體/墨水藉由阻抗器泵304泵送,並且在一圍繞該射流通道212之主要流體流動通道中循環時,形成於該雙層式頂環119之第一層214中的流體導管306會虜獲某些流動並使其運行通過位於噴嘴孔隙218內的較大空腔220。此外,此設計使得藉由阻抗器泵304泵送的流體/墨水直接地從泵孔隙308,經過導管306,並進入該噴嘴孔隙218,而不會行進經過該主要射流通道212。因此,流體/墨水經由一次要路徑經過噴嘴孔隙218,並供應大量、重新補充的墨水體積,其瓦解了位於該噴嘴區域內的滯留體積,並改良了第一個列印出液滴之列印品質。 As the fluid/ink is pumped by the impeder pump 304 and circulated in a primary fluid flow path around the jet channel 212, a fluid conduit 306 formed in the first layer 214 of the dual layer top ring 119 Some flow is captured and allowed to pass through a larger cavity 220 located within the nozzle aperture 218. Moreover, this design allows fluid/ink pumped by the impeder pump 304 to pass directly from the pump aperture 308, through the conduit 306, and into the nozzle aperture 218 without traveling through the primary jet passage 212. Thus, the fluid/ink passes through the nozzle aperture 218 through a primary path and supplies a large, replenished volume of ink that disintegrates the retention volume in the nozzle area and improves the printing of the first printed droplet. quality.

如先前所知者,圖4(圖4a與4b)顯示另一種形成於一列印頭114之雙層式頂環119的第一層214中之一流體導管306的實施方式。如同圖3中之實施方式,流體導管306與泵孔隙308係顯示於圖4a與4b的圖式之第一層214中,圖式亦顯示噴嘴孔隙218,其包括如先前對於圖2所描述之較大空腔220以及較小空腔222。在圖4a之實施方式中,該流體導管306從泵孔隙308延伸到噴嘴孔隙218之較大空腔222,但並未順著(亦即位於其上方)射流通道212之路徑。取而代之的是,圖4a實施方式中之導管306直接跨過該腔室層210的一部分,透過雙層式頂環119之第一層以射流方式耦合該泵孔隙308以及噴嘴孔隙218。因此,與圖3中所指出的設計不同,流動經過該導管306並進入噴嘴孔隙218之流體/墨水,其並非透過該射流通道212循環之主要流體流的一部分。取而代之的是,在圖4a之設計中,隨著阻抗器泵304泵送流體/墨水,透過該射流通道212提供主要流體循環,並環繞擊發腔室208時,基本上所有沖洗通過噴嘴孔隙218之較大空腔220的流體/墨水會直接流過形成於該雙層式頂環119之第一層214中的流體導管306。該流體導管306與噴嘴孔隙218之較大空腔220相交,並透過其運行,且該較大空腔220形成位於該雙層式頂環119之第一層214中的流體導管306之一部分。 As previously known, FIG. 4 (FIGS. 4a and 4b) shows another embodiment of a fluid conduit 306 formed in the first layer 214 of the two-layer top ring 119 of a row of print heads 114. As with the embodiment of FIG. 3, fluid conduit 306 and pump aperture 308 are shown in first layer 214 of the drawings of FIGS. 4a and 4b, which also shows nozzle aperture 218, which includes the prior description of FIG. Larger cavity 220 and smaller cavity 222. In the embodiment of Figure 4a, the fluid conduit 306 extends from the pump aperture 308 to the larger cavity 222 of the nozzle aperture 218, but does not follow (i.e., above) the path of the jet channel 212. Instead, the conduit 306 of the embodiment of Figure 4a directly spans a portion of the chamber layer 210 and is fluidically coupled to the pump aperture 308 and the nozzle aperture 218 through a first layer of the dual layer top ring 119. Thus, unlike the design indicated in FIG. 3, the fluid/ink flowing through the conduit 306 and into the nozzle aperture 218 is not part of the primary fluid flow that circulates through the jet passage 212. Instead, in the design of Figure 4a, as the impeder pump 304 pumps fluid/ink, a primary fluid circulation is provided through the jet channel 212, and substantially all of the irrigation passes through the nozzle aperture 218 as it surrounds the firing chamber 208. The fluid/ink of the larger cavity 220 flows directly through the fluid conduit 306 formed in the first layer 214 of the double top ring 119. The fluid conduit 306 intersects and runs through the larger cavity 220 of the nozzle aperture 218, and the larger cavity 220 forms a portion of the fluid conduit 306 located in the first layer 214 of the dual layer top ring 119.

在圖4b中所示之實施方式中,位於腔室層210中之射流通道212係為非連續,且並未延伸通過位於泵腔室310與擊發腔室208之間的腔室層210。因此,藉由阻抗器 泵304所產生的流體流並不會在該泵腔室310與擊發腔室208之間循環通過該射流通道212。取而代之的是,所有藉由該阻抗器泵304所產生的流體流會直接地在泵孔隙308與噴嘴孔隙308之間循環通過該流體導管306。 In the embodiment shown in FIG. 4b, the jet channel 212 located in the chamber layer 210 is discontinuous and does not extend through the chamber layer 210 between the pump chamber 310 and the firing chamber 208. Therefore, by means of a resistor The fluid flow generated by pump 304 does not circulate through the fluid passage 212 between the pump chamber 310 and the firing chamber 208. Instead, all of the fluid flow generated by the impeder pump 304 will circulate directly through the fluid conduit 306 between the pump aperture 308 and the nozzle aperture 308.

圖5顯示另一種形成於一列印頭114之雙層式頂環119的第一層214中之流體通道的實施方式。圖5之實施方式中所顯示的流體導管306啟始端並非位於泵孔隙308,且從而並不會從泵孔隙308與阻抗器泵304延伸到噴嘴孔隙218。取而代之的是,圖5實施方式中之流體導管306部分借道啟始於主要射流通道212。因此,在此設計中,流動通過該流體導管306,並進入該噴嘴孔隙218的較大空腔220之墨水會匯集進入導管306,完全地形成晶粒級流體流,而透過該射流通道212循環。 FIG. 5 shows another embodiment of a fluid passage formed in the first layer 214 of the double top ring 119 of a row of print heads 114. The fluid conduit 306 starting end shown in the embodiment of FIG. 5 is not located at the pump aperture 308 and thus does not extend from the pump aperture 308 and the impeder pump 304 to the nozzle aperture 218. Instead, the fluid conduit 306 portion of the embodiment of Figure 5 is initiated by the primary jet channel 212. Thus, in this design, ink flowing through the fluid conduit 306 and into the larger cavity 220 of the nozzle aperture 218 will collect into the conduit 306, completely forming a grain-level fluid flow through which it circulates.

圖6顯示一種形成於一列印頭114之雙層式頂環119的第一層214中之流體導管306的另一種實施方式。在此實施方式中,腔室層210界定出一不連續的射流通道212。也就是說,該不連續射流通道212之第一部分600從該通道入口300延伸穿過該腔室層210的一部分,且接著到其終端602。在此通道212上方,形成於該雙層式頂環119之第一層中者係為一凹口通道604,其一尾端以射流方式耦合到射流通道212之第一部分的終結尾端602。因此,來自於溝槽202流動之流體在通道入口300處能夠流動通過該不連續通道212,且接著向上進入該凹口通道604。凹口通道604延伸一小段距離,穿過該雙層式頂環119之第一層214,且接著於 其另一尾端以射流方式耦合在該不連續射流通道212之第二部分608的一開端606。因此,來自於溝槽202流動之流體在通道入口300處能夠流動通過該不連續通道212之第一部分600,且接著向上進入凹口通道604,並接著向下返回進入該不連續通道212的第二部分608。該不連續通道212之第二部分608延伸通過擊發腔室208,並到達通道出口302。一形成於第一層214中之導管306接著係以射流方式使凹口通道604與噴嘴孔隙218的較大空腔220相耦合。因此,由於阻抗器泵304之作用而產生的流體循環在流動通過循環導管306且接著通過噴嘴孔隙218之前會流動通過該不連續通道212,並通過凹口通道604。 FIG. 6 shows another embodiment of a fluid conduit 306 formed in a first layer 214 of a double top ring 119 of a row of print heads 114. In this embodiment, the chamber layer 210 defines a discontinuous jet channel 212. That is, the first portion 600 of the discontinuous jet channel 212 extends from the channel inlet 300 through a portion of the chamber layer 210 and then to its terminal 602. Above the passage 212, a first formation formed in the double layer top ring 119 is a notch passage 604 having a trailing end that is fluidically coupled to the terminating end 602 of the first portion of the jet passage 212. Thus, fluid flowing from the groove 202 can flow through the discontinuous passage 212 at the passage inlet 300 and then upwardly into the notch passage 604. The notch channel 604 extends a short distance through the first layer 214 of the double layer top ring 119 and then The other end is fluidically coupled to an open end 606 of the second portion 608 of the discontinuous jet channel 212. Thus, fluid flowing from the channel 202 can flow through the first portion 600 of the discontinuous channel 212 at the channel inlet 300 and then into the notch channel 604 and then back down into the discontinuous channel 212. Two parts 608. The second portion 608 of the discontinuous passage 212 extends through the firing chamber 208 and reaches the passage outlet 302. A conduit 306 formed in the first layer 214 then fluidly couples the notch passage 604 with the larger cavity 220 of the nozzle aperture 218. Thus, fluid circulation due to the action of the impeder pump 304 will flow through the discontinuous passage 212 and through the notch passage 604 before flowing through the circulation conduit 306 and then through the nozzle aperture 218.

圖7顯示另一種形成於一列印頭114之雙層式頂環119的第一層214中之流體導管306的實施方式。在此實施方式中,腔室層210界定之射流通道212延伸跨過該基體200位於兩個流體供應溝槽202a與202b之間的一中央區域。阻抗器泵304順著一溝槽202a泵送流體,使該流體/墨水沿著一延伸跨過該基體之中央區域的主要流動路徑循環通過射流通道212到達擊發腔室208,且接著到達第二溝槽202b。注意到的是,儘管泵腔室310圍繞著阻抗器泵304,但此實施方式中並未顯示任何的泵孔隙。形成於雙層式頂環119之第一層214的循環導管306會提取一部分的循環流體,並使其繞道通過噴嘴孔隙218之較大腔室220。如同先前對於前一種設計之描述,該循環之流體/墨水經由一次要路徑流動通過噴嘴孔隙218,並提供大量且重新補充的墨水體積,其消 除了位於該噴嘴區域中的滯留體積,並改良了首次列印液滴之列印品質。 FIG. 7 shows another embodiment of a fluid conduit 306 formed in the first layer 214 of the double top ring 119 of a row of print heads 114. In this embodiment, the jet channel 212 defined by the chamber layer 210 extends across a central region of the substrate 200 between the two fluid supply channels 202a and 202b. The impeder pump 304 pumps fluid along a groove 202a such that the fluid/ink circulates through the main flow path extending across the central region of the substrate through the jet channel 212 to the firing chamber 208, and then to the second Trench 202b. It is noted that although the pump chamber 310 surrounds the impeder pump 304, no pump aperture is shown in this embodiment. The circulation conduit 306 formed in the first layer 214 of the double top ring 119 extracts a portion of the circulating fluid and bypasses it through the larger chamber 220 of the nozzle aperture 218. As previously described for the former design, the circulating fluid/ink flows through the nozzle aperture 218 via a primary path and provides a large and replenished volume of ink, In addition to the retention volume in the nozzle area, the print quality of the first print drop is improved.

圖8顯示根據本發明揭露內容之一實施例的一種具有一通氣孔800形成於一雙層式頂環119之第一層214中的流體噴出裝置114之一範例。該流體噴出裝置114係以單獨的平面圖顯示腔室層210、雙層式頂環119之第一層214、雙層式頂環119的第二層216之佈置,以及將各種不同的層結合在一單獨圖式中的整體設計佈置。通氣孔800係為在製造期間形成在該第一層214中之特徵,其有助於後續進行該雙層式頂環119之第二層216的形成。通氣孔800係形成穿過該第一層214,並連結到位於下方腔室層210中的U形射流通道212。U形射流通道212最後在其二尾端處耦合到流體溝槽202。儘管圖8僅顯示形成於第一層214中之通氣孔800特徵,注意到的是,一個或更多諸如一如先前對於圖3~6所討論之導管306的流體流動特徵亦可形成於該第一層214中。流體流動導管306並未顯示於圖8中,而將其挪除,用以提供更為清楚的視圖以及通氣孔800特徵之描述。 FIG. 8 shows an example of a fluid ejection device 114 having a vent 800 formed in a first layer 214 of a double-layered top ring 119 in accordance with an embodiment of the present disclosure. The fluid ejection device 114 shows the arrangement of the chamber layer 210, the first layer 214 of the double-layered top ring 119, the second layer 216 of the double-layered top ring 119, and the various layers in a separate plan view. The overall design layout in a single schema. The vent 800 is a feature formed in the first layer 214 during fabrication that facilitates subsequent formation of the second layer 216 of the dual layer top ring 119. A vent 800 is formed through the first layer 214 and joined to a U-shaped jet channel 212 located in the lower chamber layer 210. U-shaped jet channel 212 is finally coupled to fluid channel 202 at its two ends. Although FIG. 8 only shows features of the vent 800 formed in the first layer 214, it is noted that one or more fluid flow features such as the catheter 306 as previously discussed with respect to FIGS. 3-6 may be formed in the In the first layer 214. Fluid flow conduit 306 is not shown in Figure 8, but is removed to provide a clearer view and a description of the features of vent 800.

圖9a~d顯示根據本發明揭露內容之一實施例的圖8具有通氣孔800之流體噴出裝置114的數個圖式。圖9a之整體設計佈置圖式顯示該空氣孔800,且於兩個不同位置通過通氣孔800之橫剖面圖式係顯示於圖9b、圖9c與9d之中。圖9b之橫剖面圖顯示出位於下方的矽基體200、底塗料層204、腔室層210、雙層式頂環119之第一層214、以及該雙層式頂環119的第二層216。圖式中並未顯示出一個或更多 額外的薄膜層208,其能夠包括例如電氣組件以及電路跡。儘管圖9b包括雙層式頂環119最頂部的第二層216,但圖9c與9d則並未顯示。圖9c與9d中並未顯示該雙層式頂環119最頂部的第二層216,以便展示通氣孔800在流體噴出裝置114製造期間的功能目的。一般而言,通氣孔800能夠在該通道212之用以在層214中形成通氣孔以及其他特徵的圖案成形步驟之後所進行的蠟充填製造步驟期間,避免空氣受困於該U形通道212之彎曲或是肘管部分。若未設置通氣孔800,則空氣可能會在製造該第二層時,例如在熱循環製造步驟期間困在該U形通道212之肘管部分中,且導致起泡,並使該第二層中出現空腔。因此,如圖9c與9d中所示,在施加第一頂環層214之後便進行一蠟充填製造步驟。在蠟充填步驟期間,蠟材料900之功能旨在充填位於該腔室層210中之空腔,包括該U形通道212。通氣孔800能夠使該U形通道212達成完整的蠟充填,而不會在該通道212之彎曲/肘管部分中留下空氣袋。完整的蠟充填係由於蠟材料由兩端進入通道212時,通道中之空氣透過該通氣孔800排出所達成。 Figures 9a-d show several diagrams of the fluid ejection device 114 of Figure 8 having a vent 800 in accordance with one embodiment of the present disclosure. The overall design layout of Figure 9a shows the air hole 800 and is shown in Figures 9b, 9c and 9d in a cross-sectional view through the vent 800 at two different locations. Figure 9b is a cross-sectional view showing the underlying base of the base 200, the primer layer 204, the chamber layer 210, the first layer 214 of the double top ring 119, and the second layer 216 of the double top ring 119. . The diagram does not show one or more An additional film layer 208, which can include, for example, electrical components as well as circuit traces. Although Figure 9b includes the secondmost layer 216 of the topmost top ring 119, Figures 9c and 9d are not shown. The topmost second layer 216 of the double top ring 119 is not shown in Figures 9c and 9d to illustrate the functional purpose of the vent 800 during manufacture of the fluid ejection device 114. In general, the vent 800 can prevent air from being trapped in the U-shaped channel 212 during the wax filling manufacturing step performed after the patterning step of the channel 212 to form vent holes in the layer 214 and other features. Bend or elbow part. If the vent 800 is not provided, air may become trapped in the elbow portion of the U-shaped channel 212 during the manufacturing of the second layer, such as during the thermal cycling manufacturing step, and cause foaming and the second layer A cavity appears in the middle. Thus, as shown in Figures 9c and 9d, a wax filling manufacturing step is performed after the application of the first top ring layer 214. During the wax filling step, the function of the wax material 900 is intended to fill the cavity in the chamber layer 210, including the U-shaped channel 212. The vent 800 enables the U-shaped channel 212 to achieve a complete wax fill without leaving an air pocket in the bend/elbow portion of the passage 212. The complete wax filling is achieved by the passage of air from the channels through the vent 800 as the wax material enters the channel 212 from both ends.

圖10顯示根據本發明揭露內容之一實施例的一種具有一些通氣孔800形成於雙層式頂環119之第一層214中的流體噴出裝置114之另一範例。在圖10之範例中,該射流通道212延伸跨過該基體200位於兩個流體供應溝槽202a與202b之間的一中央區域。如同圖9中所示之範例,圖10中之通氣孔800能夠使通道212達成完整的蠟充填,而不會在該通道212中留下空氣袋,其可能導致併發問題,諸如在製 造第二層216期間產生起泡與空腔。完整的蠟充填係由於蠟材料由兩端進入通道212時,通道中之空氣透過該通氣孔800排出所達成。 FIG. 10 shows another example of a fluid ejection device 114 having a plurality of vents 800 formed in a first layer 214 of a double-layered top ring 119 in accordance with an embodiment of the present disclosure. In the example of FIG. 10, the jet channel 212 extends across a central region of the substrate 200 between the two fluid supply channels 202a and 202b. As with the example shown in FIG. 9, the vent 800 of FIG. 10 enables the passage 212 to achieve a complete wax fill without leaving an air pocket in the passage 212, which can cause concurrency problems, such as Foaming and cavities are created during the second layer 216. The complete wax filling is achieved by the passage of air from the channels through the vent 800 as the wax material enters the channel 212 from both ends.

圖11顯示根據本發明揭露內容之一實施例的一種形成有一"跑道"支撐特徵1100,用以支撐一雙層式頂環之最頂層跨過一流體溝槽202的流體噴出裝置114之一範例。該跑道特徵1100向下運行到溝槽之中心,在位於下方基體200以及雙層式頂環119之最頂部的第二層216之間形成一溝槽中心肋材"跑道"1100。該溝槽中心肋材1100跨過三層,包括底塗料層204、腔室層210,以及雙層室頂環119之第一層214。在一多層式頂環之各層形成圖案時所使用的熱循環可能會產生併發問題,其會阻礙有效密封,尤其是跨過一溝槽202之寬度時。併發問題包括例如在最頂部的第二層216中產生氣泡以及真空。因此,第一層214並不會跨過溝槽202,因為未受支撐區域(亦即未出現溝槽中心肋材之位置)可能會下凹,並使空氣在第二層216形成時可能受困,其同樣會導致後續加工時的氣泡與真空。然而,該溝槽中心肋材1100能夠在雙層式頂環119中形成均勻且密封的第二層216。 11 shows an example of a fluid ejection device 114 formed with a "runway" support feature 1100 for supporting a topmost layer of a double-layered top ring across a fluid channel 202, in accordance with an embodiment of the present disclosure. . The runway feature 1100 runs down to the center of the groove, forming a grooved center rib "race" 1100 between the lower base 200 and the second layer 216 at the top of the double top ring 119. The trench center rib 1100 spans three layers and includes a primer layer 204, a chamber layer 210, and a first layer 214 of the double chamber top ring 119. The thermal cycling used in patterning the layers of a multi-layer top ring can create complications that can hinder effective sealing, especially across the width of a trench 202. Concurrency issues include, for example, the creation of bubbles and vacuum in the topmost second layer 216. Thus, the first layer 214 does not straddle the trench 202 because the unsupported regions (i.e., where no trench center ribs are present) may be recessed and may cause air to be formed when the second layer 216 is formed. Sleepy, it also causes bubbles and vacuum during subsequent processing. However, the groove center rib 1100 is capable of forming a uniform and sealed second layer 216 in the double layer top ring 119.

圖12~14顯示根據本發明揭露內容之實施例的製造一種流體噴出裝置114之示範性方法1200、1300以及1400之流程圖。方法1200、1300與1400係與先前對於圖1~11所描述之實施例相應。一般而言,流體噴出裝置/列印頭114中之特徵,諸如射流通道與腔室、噴嘴孔隙、流體溝槽、 液滴噴出引動器等係使用一混和的積體電路與MEMS技術。這些技術能夠包括,但並非限定於一般光微影程序、雷射切削、濕式蝕刻、乾式蝕刻、電漿蝕刻、砂鑽、鋸切以及其他方式。 12-14 show flow diagrams of exemplary methods 1200, 1300, and 1400 for fabricating a fluid ejection device 114 in accordance with an embodiment of the present disclosure. The methods 1200, 1300 and 1400 correspond to the embodiments previously described for Figures 1-11. In general, features in the fluid ejection device/printing head 114, such as jet channels and chambers, nozzle apertures, fluid channels, A droplet discharge actuator or the like uses a mixed integrated circuit and MEMS technology. These techniques can include, but are not limited to, general photolithography, laser cutting, wet etching, dry etching, plasma etching, sand drilling, sawing, and the like.

更具體而言,在圖12~14所描述之方法1200、1300與1400中,其所使用之製造步驟主要涉及一習用的光微影程序中之步驟的效能。這些步驟一般包括藉著噴濺塗佈應用或藉由層疊乾薄膜應用沈積一(例如SU8或其他材料)之塗層或層、使用一光微影工具(例如一遮罩或是光)使該層形成圖案、使該層進行顯影(例如使用一溶劑),以便形成特徵、以及使該層固化,以便使特徵固定在定位。 More specifically, in the methods 1200, 1300, and 1400 described in Figures 12-14, the manufacturing steps used are primarily related to the performance of the steps in a conventional photolithography procedure. These steps generally involve depositing a coating or layer of (e.g., SU8 or other material) by a spray coating application or by laminating a dry film application, using a photolithographic tool such as a mask or light. The layer is patterned, the layer is developed (e.g., using a solvent) to form features, and the layer is cured to secure the features in position.

參考圖12,方法1200首先在區塊1202於一基體上形成一底塗料層,該底塗料層包含一溝槽中心肋材。在區塊1204該方法1200繼續在該底塗料層上形成一腔室層,其以一垂直於基體之方向延伸該溝槽中心肋材。也就是說,該溝槽中心肋材係延伸穿過腔室層,以至於使其包括部分的底塗料層以及部分的腔室層。在不同的實施方式中,形成該腔室層包括形成一腔室以及位於該腔室層中的一射流通道。 Referring to Figure 12, the method 1200 first forms a primer layer on a substrate at block 1202, the primer layer comprising a trench center rib. At block 1204, the method 1200 continues to form a chamber layer on the primer layer that extends the trench center ribs in a direction perpendicular to the substrate. That is, the groove center rib extends through the chamber layer such that it includes a portion of the primer layer and a portion of the chamber layer. In various embodiments, forming the chamber layer includes forming a chamber and a jet channel located in the chamber layer.

在方法1200之區塊1206,一雙層式頂環之第一層係形成於該腔室層上。該第一層亦進一步以垂直於基體之方式延伸該溝槽中心肋材,以至於使該肋材包括部分的底塗料層、腔室層以及該第一層。在某些實施方式中,形成第一層包括在該第一層中形成一通氣孔,其連接到一位於 下方之腔室層中的射流通道。在某些實施方式中,形成第一層亦包括形成一配置於腔室上方之噴嘴孔隙以及形成一位於該射流通道上方的導管,以提供由該射流通道穿過該噴嘴孔隙之一流體流動路徑。 In block 1206 of method 1200, a first layer of a two-layer top ring is formed on the chamber layer. The first layer further extends the trench center rib perpendicular to the substrate such that the rib includes a portion of the primer layer, the chamber layer, and the first layer. In some embodiments, forming the first layer includes forming a vent in the first layer that is connected to a A jet channel in the lower chamber layer. In certain embodiments, forming the first layer also includes forming a nozzle aperture disposed above the chamber and forming a conduit above the jet channel to provide a fluid flow path through the nozzle aperture through the nozzle aperture .

方法1200一包括在該第一層上方形成雙層式頂環之一第二層,如區塊1208所示。該第二層密封住列印頭,並安裝其餘之噴嘴孔隙。在方法1200之區塊1210,一溝槽接著係在溝槽中心肋材下方形成於該基體中。 The method 1200 includes forming a second layer of a double layer top ring over the first layer, as shown by block 1208. This second layer seals the print head and installs the remaining nozzle apertures. In block 1210 of method 1200, a groove is then formed in the substrate below the center rib of the groove.

現在參考圖13,方法1300首先在區塊1302於一基體上形成一底塗料層。在區塊1304,一腔室層係形成於該底塗料層上。該腔室層包含一射流通道以及一腔室。在一實施方式中,該射流通道係形成一U形通道,在其兩尾端處耦合到一溝槽。注意到的是在形成該U形通道時,溝槽尚未形成。在另一實施方式中,該射流通道係形成為一通道,其在兩個不同的流體溝槽之間延伸。同樣的,儘管該等溝槽係在形成射流通道之步驟中提及,該等流體溝槽能夠在形成射流通道以後方形成。 Referring now to Figure 13, method 1300 first forms a primer layer on a substrate at block 1302. At block 1304, a chamber layer is formed on the primer layer. The chamber layer includes a jet channel and a chamber. In one embodiment, the fluidic channel forms a U-shaped channel that is coupled to a trench at its two ends. It is noted that the grooves have not been formed when the U-shaped channel is formed. In another embodiment, the fluidic channel is formed as a channel that extends between two different fluid channels. Likewise, although the grooves are mentioned in the step of forming the jet channels, the fluid channels can be formed behind the jet channels.

在區塊1306,方法1300繼續在該腔室層上形成一雙層式頂環之第一層。該第一層包含一通氣孔,其延伸穿過該第一層而到達位於該腔室層中的射流通道。在一實施方式中,該通氣孔係位於一U形射流通道的彎曲處之上。在另一實施方式中,該通氣孔包含複數個通氣孔,其沿著該射流通道佈置於兩個不同的溝槽之間。 At block 1306, method 1300 continues by forming a first layer of a double top ring on the chamber layer. The first layer includes a vent extending through the first layer to a jet channel located in the chamber layer. In one embodiment, the vent is located above the bend of a U-shaped jet channel. In another embodiment, the vent includes a plurality of vents disposed along the jet channel between two different grooves.

在區塊1308係施加一蠟充填層,以致於使蠟完全 充滿該射流通道。此蠟層對於接續的射流層形成提供結構支撐以及圖案形成增強能力。射流通道之充填係藉由空氣隨著蠟進入通道之兩尾端時透過通氣孔離開該射流通道而得到助益。由於蠟充填程序之溢流物接著係使用一CMP(化學機械加工)程序使其平順。方法1300在區塊1310繼續在該第一層上形成一第二層。該第二層包含一較小空腔之噴嘴孔隙,其係佈置於該腔室上方。 Applying a wax filling layer at block 1308 so that the wax is completely Fill the jet channel. This wax layer provides structural support and patterning enhancement capabilities for successive jet layer formation. The filling of the jet channel is facilitated by the air exiting the jet channel through the vent as it enters the two ends of the channel. The overflow due to the wax filling procedure is then smoothed using a CMP (Chemical Machining) procedure. The method 1300 continues with forming a second layer on the first layer at block 1310. The second layer includes a nozzle aperture of a smaller cavity that is disposed above the chamber.

方法1300在區塊1312繼續使一較大空腔之噴嘴孔隙形成進入該第一層內。該較大空腔亦佈置於該腔室上方,並在雙層式頂環中形成部分的噴嘴孔隙。在區塊1314,方法1300包括形成一導管進入該第一層,其提供從射流通道通過較大空腔之噴嘴孔隙的一流體流動路徑。 The method 1300 continues at block 1312 to form a nozzle aperture of a larger cavity into the first layer. The larger cavity is also disposed above the chamber and forms a partial nozzle aperture in the double layer top ring. At block 1314, method 1300 includes forming a conduit into the first layer that provides a fluid flow path from the jet passage through the nozzle aperture of the larger cavity.

現在參考圖14,方法1400首先在區塊1402在一基體上形成一底塗料層。在區塊1404,包含一通道之一腔室層係形成於該底塗料層上。一雙層式頂環之第一層接著係形成於該腔室層上,如區塊1406所示。該第一層在通道上包含一通氣孔。在方法1400之區塊1408,該雙層式頂環之一第二層係形成於該第一層上。如同區塊1410所示,各層包含一部分之溝槽中心肋材,其在該第二層與基體之間延伸。 Referring now to Figure 14, method 1400 first forms a primer layer on a substrate at block 1402. At block 1404, a chamber layer comprising a channel is formed on the primer layer. A first layer of a two-layer top ring is then formed over the chamber layer as shown by block 1406. The first layer includes a vent on the channel. At block 1408 of method 1400, a second layer of the two-layer top ring is formed on the first layer. As shown by block 1410, each layer includes a portion of the trench center rib that extends between the second layer and the substrate.

100‧‧‧噴墨列印系統 100‧‧‧Inkjet printing system

102‧‧‧噴墨列印頭總成 102‧‧‧Inkjet print head assembly

104‧‧‧墨水供應總成 104‧‧‧Ink supply assembly

106‧‧‧安置總成 106‧‧‧Relocation assembly

108‧‧‧媒體輸送總成 108‧‧‧Media delivery assembly

110‧‧‧電子印表機控制器 110‧‧‧Electronic printer controller

111‧‧‧處理器 111‧‧‧ Processor

112‧‧‧電源供應器 112‧‧‧Power supply

113‧‧‧記憶體 113‧‧‧ memory

114‧‧‧列印頭 114‧‧‧Print head

116‧‧‧噴嘴 116‧‧‧Nozzles

118‧‧‧列印媒體 118‧‧‧Printing media

119‧‧‧雙層式頂環層 119‧‧‧Double top ring layer

120‧‧‧貯存器 120‧‧‧Storage

122‧‧‧墨水液滴 122‧‧‧Ink droplets

124‧‧‧資料 124‧‧‧Information

128‧‧‧泵模組 128‧‧‧ pump module

Claims (15)

一種製造流體噴出裝置之方法,其包含:在一基體上形成一具有一溝槽中心肋材之底塗料層;在該底塗料層上形成一腔室層,其垂直於基體延伸該溝槽中心肋材;在該腔室層上形成一雙層式頂環之第一層,其進一步垂直於該基體延伸溝槽中心肋材;在該第一層上形成該雙層式頂環的一第二層。 A method of manufacturing a fluid ejection device, comprising: forming a primer layer having a grooved center rib on a substrate; forming a chamber layer on the primer layer, extending the center of the groove perpendicular to the substrate a first layer of a double-layered top ring formed on the chamber layer, further extending perpendicular to the base extending groove center rib; forming a first layer of the double-layered top ring on the first layer Second floor. 如請求項1中所述之方法,其進一步包含在該基體中之溝槽中心肋材下方形成一溝槽。 The method of claim 1 further comprising forming a trench below the central rib of the trench in the substrate. 如請求項1中所述之方法,其中形成該第一層包含形成一通氣孔,其連接到一位於下方腔室層中的射流通道。 The method of claim 1 wherein forming the first layer comprises forming a vent that is coupled to a jet channel located in the lower chamber layer. 如請求項1中所述之方法,其中該腔室層包含一腔室以及一射流通道,該方法進一步包含:在該第一層中形成一佈置於該腔室上方之噴嘴孔隙,以及一位於射流通道上方的導管,以便提供從該流體通道穿過噴嘴孔隙之一流體流動路徑。 The method of claim 1, wherein the chamber layer comprises a chamber and a jet channel, the method further comprising: forming a nozzle aperture disposed above the chamber in the first layer, and a A conduit above the jet channel to provide a fluid flow path from the fluid passage through the nozzle aperture. 如請求項3中所述之方法,其中該射流通道包含一通道,其兩尾端皆耦合到一相同的流體溝槽。 The method of claim 3, wherein the fluidic channel comprises a channel having both ends coupled to an identical fluid channel. 如請求項3中所述之方法,其中該射流通道包含一通道,其具有一第一尾端耦合到一第一流體溝槽,以及一第二尾端耦合到一第二流體溝槽。 The method of claim 3, wherein the fluidic channel comprises a channel having a first tail coupled to a first fluid channel and a second tail coupled to a second fluid channel. 一種製造一流體噴出裝置之方法,其包含: 在一基體上形成一底塗料層;在該底塗料層上形成一腔室層,該腔室層包含一射流通道以及一腔室;在該腔室層上形成一雙層式頂環之第一層,該第一層包含一通氣孔,其延伸穿過該第一層而到達該射流通道。 A method of making a fluid ejection device comprising: Forming a primer layer on a substrate; forming a chamber layer on the primer layer, the chamber layer comprising a jet channel and a chamber; forming a double-layer top ring on the chamber layer A layer, the first layer comprising a vent extending through the first layer to the jet channel. 如請求項7中所述之方法,其中該射流通道包含一在其兩尾端耦合到一溝槽之U形射流通道,且該通氣孔係佈置於該U形射流通道之彎曲處的頂端上。 The method of claim 7, wherein the jet channel comprises a U-shaped jet channel coupled to a groove at both ends thereof, and the venting hole is disposed at a top end of the curved portion of the U-shaped jet channel . 如請求項7中所述之方法,其中該射流通道在兩個不同的溝槽之間延伸,且該通氣孔包含複數個通氣孔,其在該射流通道上方的第一層中連結該兩個不同的溝槽。 The method of claim 7, wherein the jet channel extends between two different grooves, and the vent includes a plurality of vents that join the two in a first layer above the jet channel Different grooves. 如請求項7中所述之方法,其進一步包含施加一蠟塗層,以至於同時藉由空氣透過該通氣孔離開射流通道之協助而使蠟完全地充滿該射流通道。 The method of claim 7, further comprising applying a wax coating such that the wax completely fills the jet channel with the aid of air passing through the vent opening away from the jet channel. 如請求項10中所述之方法,其進一步包含:透過一CMP(化學機械研磨)程序將蠟磨平順;及在該第一層上形成該雙層式頂環之一第二層,其腔室上方包含一噴嘴。 The method of claim 10, further comprising: smoothing the wax through a CMP (Chemical Mechanical Polishing) procedure; and forming a second layer of the double-layer top ring on the first layer, the cavity A nozzle is included above the chamber. 如請求項7中所述之方法,其進一步包含在該第一層中形成一較大空腔之噴嘴孔隙。 The method of claim 7, further comprising forming a larger cavity nozzle aperture in the first layer. 如請求項12中所述之方法,其進一步包含在該第一層中形成一導管,該導管用以提供一個從射流通道穿過該較大空腔之噴嘴孔隙的流體流動路徑。 The method of claim 12, further comprising forming a conduit in the first layer, the conduit for providing a fluid flow path from the jet passage through the nozzle aperture of the larger cavity. 如請求項12中所述之方法,其進一步包含在該第一層上 形成包含一較小空腔之噴嘴孔隙的一第二層。 The method of claim 12, further comprising the first layer A second layer of nozzle apertures comprising a smaller cavity is formed. 一種製造一流體噴出裝置之方法,其包含:在一基體上形成一底塗料層;在該底塗料層上形成一腔室層,該腔室層包含一通道;在該腔室層上形成一雙層式頂環之第一層,該第一層在該通道上方包含一個通氣孔;在該第一層上形成該雙層式頂環之一第二層;其中各個層包含一部分的溝槽中心肋材,其在該第二層與基體之間延伸。 A method of manufacturing a fluid ejection device, comprising: forming a primer layer on a substrate; forming a chamber layer on the primer layer, the chamber layer comprising a channel; forming a layer on the chamber layer a first layer of a double-layer top ring, the first layer including a vent hole above the channel; a second layer of the double-layer top ring formed on the first layer; wherein each layer includes a portion of the trench A central rib extending between the second layer and the base.
TW102121517A 2012-06-29 2013-06-18 Fabricating a fluid ejection device TW201408499A (en)

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