TW201406876A - Polysiloxane composition, cured coating, electronic device and manufacturing method thereof, and optical device and manufacturing method thereof - Google Patents

Polysiloxane composition, cured coating, electronic device and manufacturing method thereof, and optical device and manufacturing method thereof Download PDF

Info

Publication number
TW201406876A
TW201406876A TW102125785A TW102125785A TW201406876A TW 201406876 A TW201406876 A TW 201406876A TW 102125785 A TW102125785 A TW 102125785A TW 102125785 A TW102125785 A TW 102125785A TW 201406876 A TW201406876 A TW 201406876A
Authority
TW
Taiwan
Prior art keywords
group
mol
decane
polyoxyalkylene
methyl
Prior art date
Application number
TW102125785A
Other languages
Chinese (zh)
Other versions
TWI591136B (en
Inventor
Takenori Fujiwara
Yugo Tanigaki
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201406876A publication Critical patent/TW201406876A/en
Application granted granted Critical
Publication of TWI591136B publication Critical patent/TWI591136B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80Siloxanes having aromatic substituents, e.g. phenyl side groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

A polysiloxane composition suitable for ink is provided, which has excellent adhesion of pattern cured coating and excellent transferability of printing pattern. A cured coating, an electronic device and an optical device, which are formed from the polysiloxane composition are provided. The polysiloxane composition suitable for ink is characterized by containing: (A) a polysiloxane obtained by conducting hydrolysis and condensation of a silane compound having one or more silane compound selected from general formula (1) to general formula (3); and (B) a solvent. R02-nR1nSi(OR9)2 (1) R2Si(OR10)3 (2) (R11O)mR43-mSi-R3-Si(OR12)1R53-1 (3)

Description

聚矽氧烷組成物、電子元件及光學元件 Polyoxane composition, electronic component and optical component

本發明是有關於一種有效用於電子元件及光學元件的圖案形成用油墨的聚矽氧烷組成物及由該組成物形成的硬化被膜、以及電子元件及光學元件。 The present invention relates to a polyoxyalkylene composition effective for use in an ink for pattern formation of an electronic component and an optical component, and a cured film formed of the composition, and an electronic component and an optical component.

近年來,作為以更低成本且簡便地製造電子元件或光學元件的技術,受到關注的是藉由印刷進行塗佈液的圖案形成的可印刷電子(Printable Electronics)技術。由於藉由印刷法可直接形成圖案被膜,因此具有材料的使用效率高的優點。另外,與作為通常的圖案形成法的光刻法(photolithography)相比,曝光、顯影等的步驟少、且無需顯影液或顯影廢液的管理等,而帶來低成本化。另外,由於不產生顯影廢液,因此亦可抑制對環境的負載。在容易對塑膠基板製作圖案形成被膜的方面亦為印刷法的優點,對電子元件的可撓化(flexible)而言印刷法為有用的方法。 In recent years, as a technology for manufacturing electronic components or optical components at a lower cost and more easily, a printable electronic technology in which a pattern of a coating liquid is formed by printing has been attracting attention. Since the pattern film can be directly formed by the printing method, there is an advantage that the use efficiency of the material is high. In addition, compared with photolithography which is a normal pattern forming method, steps such as exposure and development are small, and management of a developing solution or developing waste liquid is not required, and cost reduction is achieved. Further, since the developing waste liquid is not generated, the load on the environment can be suppressed. The printing method is also advantageous in that it is easy to form a film on a plastic substrate, and the printing method is a useful method for flexibility of an electronic component.

可印刷電子用印刷法與先前的印刷法相比,必需高精細、高精度、高的表面平滑性等。作為此種印刷法,提出有凹版 印刷、噴墨印刷、網版印刷、套版印刷、反轉套版印刷法(例如參照專利文獻1)、剝離套版印刷法(例如參照專利文獻2)、及微接觸印刷法(例如參照專利文獻3、非專利文獻1)等。 The printable electronic printing method requires high precision, high precision, high surface smoothness, and the like as compared with the prior printing method. As such a printing method, a gravure is proposed. Printing, inkjet printing, screen printing, stencil printing, reverse stencil printing (for example, refer to Patent Document 1), peeling lithography (for example, refer to Patent Document 2), and microcontact printing (for example, refer to patents) Document 3, Non-Patent Document 1) and the like.

作為電子元件或光學元件的用途,例如可列舉:薄膜電晶體(Thin Film Transistor,TFT)的閘極絕緣膜、TFT用平坦化膜、彩色濾光片的保護層、光間隔物、觸控感測器的保護膜或絕緣膜、抗反射膜、抗反射板、濾光器及半導體元件的層間絕緣膜等。作為這些製造方法,期望可直接形成高精細且表面平滑的圖案的高精細的印刷法,例如報告有利用凸版反轉套版印刷法的絕緣膜形成用油墨組成物(例如參照專利文獻4)。另外,報告有利用聚矽氧烷的油墨組成物(例如參照專利文獻5)。 Examples of the use of the electronic component or the optical element include a gate insulating film of a thin film transistor (TFT), a planarizing film for a TFT, a protective layer of a color filter, a photo spacer, and a touch feeling. A protective film or an insulating film, an antireflection film, an antireflection plate, a filter, and an interlayer insulating film of a semiconductor element. As such a production method, a high-definition printing method in which a high-definition and smooth-surface pattern can be directly formed is desired. For example, an ink composition for forming an insulating film by a relief reverse stencil printing method is reported (for example, see Patent Document 4). Further, an ink composition using polyoxyalkylene has been reported (for example, refer to Patent Document 5).

[現有技術文獻] [Prior Art Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平11-58921號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 11-58921

[專利文獻2]日本專利特開2004-249696號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-249696

[專利文獻3]日本專利特開2010-147408號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2010-147408

[專利文獻4]日本專利特開2010-265423號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2010-265423

[專利文獻5]日本專利特開2011-219544號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2011-219544

[非專利文獻] [Non-patent literature]

[非專利文獻1]朗繆爾(Langmuir)(美國)、1994年、第10卷、第5號、1498頁-1511頁 [Non-Patent Document 1] Langmuir (USA), 1994, Vol. 10, No. 5, 1498 pages - 1511

可印刷電子用油墨組成物與先前的油墨用組成物相比,印刷圖案的轉印性、與基板的密接性不足,而必須改善。本發明的目的在於提供一種圖案硬化被膜的密接性、及印刷圖案的轉印性優異的聚矽氧烷組成物。並且,進一步的課題是提供一種由聚矽氧烷組成物形成的硬化被膜、及電子元件或光學元件。 The printable electronic ink composition is inferior to the previous ink composition, and the transfer property of the printed pattern and the adhesion to the substrate are insufficient, and it is necessary to improve. An object of the present invention is to provide a polyoxyalkylene composition which is excellent in adhesion between a pattern-hardened film and transfer property of a printed pattern. Further, a further object is to provide a cured film formed of a polysiloxane composition, an electronic component, or an optical component.

本發明是一種矽氧烷組成物,其特徵在於包含:(A1)聚矽氧烷,其藉由使至少包含選自通式(1)~通式(3)的1種以上矽烷化合物的矽烷化合物組成物水解及縮合而得,及(B)溶劑:R0 2-nR1 nSi(OR9)2 (1) The present invention relates to a oxoxane composition comprising: (A1) polydecane which is obtained by containing at least one decane compound selected from the group consisting of formula (1) to formula (3) Hydrolysis and condensation of the compound composition, and (B) solvent: R 0 2-n R 1 n Si(OR 9 ) 2 (1)

R0表示氫、烷基、烯基、苯基或這些的取代體;R1表示多環式芳香族基或其取代體;R9表示氫、甲基、乙基、丙基或丁基,可相同亦可不同;n為1或2;n為2時,多個R1可相同亦可不同;R2Si(OR10)3 (2) R 0 represents hydrogen, an alkyl group, an alkenyl group, a phenyl group or a substituent of these; R 1 represents a polycyclic aromatic group or a substituent thereof; and R 9 represents a hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group; It may be the same or different; n is 1 or 2; when n is 2, a plurality of R 1 may be the same or different; R 2 Si(OR 10 ) 3 (2)

R2表示多環式芳香族基或其取代體;R10表示氫、甲基、乙基、丙基或丁基,可相同亦可不同;(R11O)mR4 3-mSi-R3-Si(OR12)1R5 3-1 (3) R 2 represents a polycyclic aromatic group or a substituent thereof; R 10 represents hydrogen, methyl, ethyl, propyl or butyl, which may be the same or different; (R 11 O) m R 4 3-m Si- R 3 -Si(OR 12 ) 1 R 5 3-1 (3)

R3表示2價多環式芳香族基或其取代體;R4及R5表示氫、烷基、烯基、芳基或這些的取代體,分別可相同亦可不同;R11及R12表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;m及1分別獨立地為1~3的整數。 R 3 represents a divalent polycyclic aromatic group or a substituent thereof; and R 4 and R 5 represent a hydrogen, an alkyl group, an alkenyl group, an aryl group or a substituent of these, which may be the same or different; R 11 and R 12 The hydrogen, methyl group, ethyl group, propyl group or butyl group may be the same or different, and m and 1 are each independently an integer of 1 to 3.

而且本發明是一種矽氧烷組成物,其包含:(A2)聚矽氧烷,其藉由使包含選自上述通式(1)~通式(3)的1種以上矽烷化合物及通式(7)所示的矽烷化合物的矽烷化合物組成物水解及縮合而得,及(B)溶劑:R9 aSi(OR16)4-a (7) Further, the present invention is a siloxane composition comprising: (A2) polydecane which comprises one or more kinds of decane compounds selected from the above formula (1) to formula (3) and a general formula (7) The decane compound composition of the decane compound is hydrolyzed and condensed, and (B) the solvent: R 9 a Si(OR 16 ) 4-a (7)

R9表示包含乙烯基、環氧基及氧雜環丁基的至少1種的碳數為3~20的有機基,分別可相同亦可不同;R16表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;a為1~3的整數。 R 9 represents at least one organic group having 3 to 20 carbon atoms including a vinyl group, an epoxy group and an oxetanyl group, and may be the same or different; R 16 represents hydrogen, methyl, ethyl or propyl. The base or the butyl group may be the same or different, and a is an integer of 1 to 3.

而且本發明是一種矽氧烷組成物,其包含:(A3)聚矽氧烷,其藉由使包含選自上述通式(1)~通式(3)的1種以上矽烷化合物、上述通式(7)所示的矽烷化合物及通式(8)所示的矽烷化合物的矽烷化合物組成物水解及縮合而得,及(B)溶劑: R10 bSi(OR17)4-b (8) Further, the present invention is a composition of a decane which comprises (A3) a polydecane which contains one or more kinds of decane compounds selected from the above formula (1) to formula (3), and the above-mentioned Hydrogenation and condensation of a decane compound represented by the formula (7) and a decane compound represented by the formula (8), and (B) a solvent: R 10 b Si(OR 17 ) 4-b (8) )

此處,R10表示具有苯基的碳數為3~20的有機基,分別可相同亦可不同;R17表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;b為1~3的整數。 Here, R 10 represents an organic group having a phenyl group having 3 to 20 carbon atoms, and may be the same or different, and R 17 represents hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group, and may be the same or different. ;b is an integer from 1 to 3.

藉由使用本發明的矽氧烷系樹脂組成物,而可簡便且以低成本製造印刷圖案的轉印性、圖案硬化被膜的密接性優異、印刷特性所必需的油墨組成物、由該油墨組成物形成的硬化被膜、及電子元件或光學元件。 By using the oxyalkylene-based resin composition of the present invention, it is possible to easily and inexpensively produce transferability of a printed pattern, excellent adhesion of a pattern-hardened film, and an ink composition necessary for printing characteristics, and consist of the ink. A hardened film formed by the object, and an electronic component or an optical component.

1‧‧‧橡皮布滾筒 1‧‧‧ blanket roller

2‧‧‧矽酮橡皮布 2‧‧‧矽 ketone blanket

3‧‧‧油墨塗佈機 3‧‧‧Ink coating machine

4‧‧‧油墨 4‧‧‧Ink

4'‧‧‧畫線部油墨 4'‧‧‧Drawing line ink

4"‧‧‧未畫線部油墨 4"‧‧‧Unlined ink

5‧‧‧除去凸版 5‧‧‧Remove the letterpress

6‧‧‧被印刷物 6‧‧‧Printed matter

7‧‧‧印刷圖案 7‧‧‧Printed pattern

8‧‧‧支撐體 8‧‧‧Support

9‧‧‧親油墨層 9‧‧‧Ink layer

10‧‧‧油墨剝離層 10‧‧‧Ink stripping layer

11‧‧‧刮刀塗佈機 11‧‧‧Scraper coating machine

12‧‧‧PDMS凸版 12‧‧‧PDMS Letterpress

13‧‧‧油墨標記台 13‧‧‧Ink marking station

14‧‧‧基板 14‧‧‧Substrate

15‧‧‧閘極電極 15‧‧‧gate electrode

16‧‧‧閘極絕緣層 16‧‧‧ gate insulation

17‧‧‧活性層 17‧‧‧Active layer

18‧‧‧源極電極 18‧‧‧Source electrode

19‧‧‧汲極電極 19‧‧‧汲electrode

圖1是表示作為印刷方法的一例的反轉套版印刷法的概略圖。 FIG. 1 is a schematic view showing a reverse offset printing method as an example of a printing method.

圖2是表示作為印刷方法的一例的剝離套版印刷法的概略圖。 FIG. 2 is a schematic view showing a peeling card printing method as an example of a printing method.

圖3是表示作為印刷方法的一例的微接觸印刷法的概略圖。 3 is a schematic view showing a microcontact printing method as an example of a printing method.

圖4是表示閘極絕緣膜具備絕緣膜的TFT的示意剖面圖。 4 is a schematic cross-sectional view showing a TFT in which a gate insulating film is provided with an insulating film.

本發明是一種矽氧烷組成物,其特徵在於包含:(A1)聚矽氧烷,其藉由使至少包含選自上述通式(1)~通式(3)的1種以上矽烷化合物的矽烷化合物水解及縮合而得,及(B)溶劑。另外,所謂本發明中的油墨用途,是指供於用以利用印刷法形成膜或印刷圖案的油墨的用途。 The present invention relates to a decane composition comprising: (A1) polyoxyalkylene, which comprises at least one decane compound selected from the group consisting of the above formula (1) to formula (3) The decane compound is hydrolyzed and condensed, and (B) a solvent. Moreover, the use of the ink in the present invention means the use of an ink for forming a film or a printed pattern by a printing method.

本發明中所用的(A1)聚矽氧烷具有多環式芳香族環。含有該聚矽氧烷的矽氧烷組成物在塗佈於印刷版時,具有以下優點:抑制組成物的收縮,並且在印刷版上的塗佈性良好,而且在對象基材(被印刷基材)上的印刷圖案的轉印良好。其原因認為,由於樹脂中存在具有高的π電子密度的多環式芳香族基,而溶劑中的氫原子與芳香族環之間的相互作用增強,從而溶劑與聚矽氧烷的親和性增大。而且,由本發明的油墨用組成物形成的硬化被膜不會損害耐化學品性,並具有高的可見透光率。認為這是由於多環式芳香族基所具有的耐化學品性或蓬鬆性所致。 The (A1) polyfluorene oxide used in the present invention has a polycyclic aromatic ring. The rhodium oxide composition containing the polyoxyalkylene has the following advantages when applied to a printing plate: suppressing shrinkage of the composition, and good coatability on a printing plate, and on a target substrate (printed base) The transfer of the printed pattern on the material is good. The reason for this is considered to be that since a polycyclic aromatic group having a high π electron density exists in the resin, the interaction between the hydrogen atom and the aromatic ring in the solvent is enhanced, and the affinity of the solvent with the polyoxyalkylene is increased. Big. Moreover, the cured film formed of the ink composition of the present invention does not impair chemical resistance and has high visible light transmittance. This is considered to be due to the chemical resistance or bulkiness of the polycyclic aromatic group.

(A1)的聚矽氧烷可藉由以下方式獲得:藉由利用酸或鹼觸媒將至少包含選自下述通式(1)~通式(3)的1種以上矽烷化合物的矽烷化合物水解,而生成具有矽烷醇基的矽烷醇化合物後,使該矽烷醇化合物進行縮合反應。可使用2種以上的選自通式(1)~通式(3)的矽烷化合物,亦可進一步使用以後述通式(4)~通式(6)的任一通式表示的矽烷化合物或通式(7)、通式(8)所示的矽烷化合物。 The polyoxyalkylene of (A1) can be obtained by using a decane compound containing at least one decane compound selected from the following general formulae (1) to (3) by using an acid or a base catalyst; After hydrolysis to form a stanol compound having a stanol group, the stanol compound is subjected to a condensation reaction. Two or more kinds of decane compounds selected from the general formulae (1) to (3) may be used, and a decane compound or a general formula represented by any one of the following general formulas (4) to (6) may be further used. a decane compound represented by the formula (7) or the formula (8).

首先,對通式(1)所示的化合物進行說明。 First, the compound represented by the formula (1) will be described.

R0 2-nR1 nSi(OR9)2 (1) R 0 2-n R 1 n Si(OR 9 ) 2 (1)

R0直接鍵結於矽原子,表示氫、烷基、烯基、苯基或這些的取代體。R1表示1價基團,並表示多環式芳香族基或其取代 體。R9表示氫、甲基、乙基、丙基或丁基,可相同亦可不同。n為1或2。n為2時,多個R1可相同亦可不同。 R 0 is directly bonded to a halogen atom and represents hydrogen, an alkyl group, an alkenyl group, a phenyl group or a substituent of these. R 1 represents a monovalent group and represents a polycyclic aromatic group or a substituent thereof. R 9 represents hydrogen, methyl, ethyl, propyl or butyl, and may be the same or different. n is 1 or 2. When n is 2, a plurality of R 1 's may be the same or different.

在R0為烷基時,作為碳數,較佳為1~20的範圍,為烯基時,作為碳數,較佳為1~20的範圍,作為苯基或其取代體,較佳為碳數1~20的範圍。作為R0的較佳的具體例,可列舉:氫、甲基、乙基、丙基、甲氧基、丁基、乙氧基、丙氧基、丁氧基、苯基等。 When R 0 is an alkyl group, the carbon number is preferably in the range of 1 to 20, and when it is an alkenyl group, the carbon number is preferably in the range of 1 to 20, and as the phenyl group or a substituent thereof, it is preferably The range of carbon number is 1~20. Preferable specific examples of R 0 include hydrogen, a methyl group, an ethyl group, a propyl group, a methoxy group, a butyl group, an ethoxy group, a propoxy group, a butoxy group, and a phenyl group.

此處,多環式芳香族基是指2個以上芳香族環縮合或連結而成的基團。作為多環式芳香族基的較佳的例子,可列舉:在萘、蒽、菲、稠四苯、苯并(a)蒽、苯并(c)菲、稠五苯、芘、茀、茀酮、茚、薁、苊(acenaphthene)、苊烯(acenaphthylene)、咔唑、聯苯、聯三苯等中具有單鍵的1價基團。作為多環式芳香族基的取代體的較佳的例子,可列舉:被環氧基、胺基、巰基、羧酸基、酸酐基、脲基、異氰酸酯基、丙烯基、甲基丙烯基、氟基等取代者。就硬化被膜的耐熱性與透明性的方面而言,較佳為具有萘、菲、芘、茀、茀酮、茚、苊、苊烯、聯苯、聯三苯的結構的1價基團。 Here, the polycyclic aromatic group means a group obtained by condensing or linking two or more aromatic rings. Preferable examples of the polycyclic aromatic group include naphthalene, anthracene, phenanthrene, fused tetraphenyl, benzo(a)pyrene, benzo(c)phenanthrene, fused pentabenzene, anthracene, anthracene, anthracene. A monovalent group having a single bond in ketone, hydrazine, hydrazine, acenaphthene, acenaphthylene, carbazole, biphenyl, terphenyl, and the like. Preferable examples of the substituent of the polycyclic aromatic group include an epoxy group, an amine group, a mercapto group, a carboxylic acid group, an acid anhydride group, a urea group, an isocyanate group, a propenyl group, a methacryl group, and the like. Substitutes such as fluorine groups. In terms of heat resistance and transparency of the cured film, a monovalent group having a structure of naphthalene, phenanthrene, anthracene, anthracene, anthracene, anthracene, decene, biphenyl or terphenyl is preferable.

作為通式(1)所示的矽烷化合物的較佳的例子,可列舉:二(1-萘基)二甲氧基矽烷、二(1-萘基)二乙氧基矽烷、二(1-萘基)二正丙氧基矽烷、二(1-萘基)二甲氧基矽烷、二(1-萘基)二甲氧基矽烷、二(2-萘基)二甲氧基矽烷、1-萘基甲基二甲氧基矽烷、1-萘基乙基二甲氧基矽烷、1-萘基苯基二甲氧基矽烷、二(1-蒽基)二 甲氧基矽烷、二(9-蒽基)二甲氧基矽烷、二(9-菲基)二甲氧基矽烷、二(9-茀基)二甲氧基矽烷、二(2-茀基)二甲氧基矽烷、二(2-茀酮基)二甲氧基矽烷、二(1-芘基)二甲氧基矽烷、二(2-茚基)二甲氧基矽烷、二(5-苊基)二甲氧基矽烷、二(4-聯苯)二甲氧基矽烷、二(2-聯苯)二甲氧基矽烷、二(4-對聯三苯)二甲氧基矽烷、二(4-間聯三苯)二甲氧基矽烷、二(4-鄰聯三苯)二甲氧基矽烷等。 Preferable examples of the decane compound represented by the formula (1) include bis(1-naphthyl)dimethoxydecane, bis(1-naphthyl)diethoxydecane, and di(1-). Naphthyl)di-n-propoxydecane, bis(1-naphthyl)dimethoxydecane, bis(1-naphthyl)dimethoxydecane, bis(2-naphthyl)dimethoxydecane, 1 -naphthylmethyldimethoxydecane, 1-naphthylethyldimethoxydecane, 1-naphthylphenyldimethoxydecane, bis(1-indenyl)di Methoxydecane, bis(9-fluorenyl)dimethoxydecane, bis(9-phenanthryl)dimethoxydecane, bis(9-fluorenyl)dimethoxydecane, di(2-indenyl) Dimethoxydecane, bis(2-indolyl)dimethoxydecane, bis(1-indenyl)dimethoxydecane, bis(2-indenyl)dimethoxydecane, di(5) - mercapto) dimethoxydecane, bis(4-biphenyl)dimethoxydecane, bis(2-biphenyl)dimethoxydecane, bis(4-p-triphenyl)dimethoxydecane, Bis(4-m-triphenyl)dimethoxydecane, bis(4-o-triphenyl)dimethoxydecane, and the like.

接著,對通式(2)所示的化合物進行說明。 Next, the compound represented by the formula (2) will be described.

R2Si(OR10)3 (2) R 2 Si(OR 10 ) 3 (2)

R2表示多環式芳香族基或其取代體。R10表示氫、甲基、乙基、丙基或丁基,可相同亦可不同。多環式芳香族基及其取代體的說明與上述相同。 R 2 represents a polycyclic aromatic group or a substituent thereof. R 10 represents hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group, and may be the same or different. The description of the polycyclic aromatic group and its substituent is the same as described above.

作為通式(2)所示的矽烷化合物的較佳的具體例,可列舉:1-萘基三甲氧基矽烷、1-萘基三乙氧基矽烷、1-萘基三正丙氧基矽烷、2-萘基三甲氧基矽烷、1-蒽基三甲氧基矽烷、9-蒽基三甲氧基矽烷、9-菲基三甲氧基矽烷、9-茀基三甲氧基矽烷、2-茀基三甲氧基矽烷、2-茀酮基三甲氧基矽烷、1-芘基三甲氧基矽烷、2-茚基三甲氧基矽烷、5-苊基三甲氧基矽烷、4-聯苯三甲氧基矽烷、2-聯苯三甲氧基矽烷、4-對聯三苯三甲氧基矽烷、4-間聯三苯三甲氧基矽烷、4-鄰聯三苯三甲氧基矽烷等。 Preferable specific examples of the decane compound represented by the formula (2) include 1-naphthyltrimethoxydecane, 1-naphthyltriethoxydecane, and 1-naphthyltri-n-propoxydecane. , 2-naphthyltrimethoxydecane, 1-mercaptotrimethoxydecane, 9-fluorenyltrimethoxydecane, 9-phenanthryltrimethoxydecane, 9-fluorenyltrimethoxydecane, 2-mercapto Trimethoxy decane, 2-fluorenyltrimethoxydecane, 1-mercaptotrimethoxydecane, 2-mercaptotrimethoxydecane, 5-mercaptotrimethoxydecane, 4-biphenyltrimethoxydecane , 2-biphenyltrimethoxydecane, 4-pair triphenyltrimethoxydecane, 4-m-triphenyltrimethoxydecane, 4-orthotriphenyltrimethoxydecane, and the like.

接著,對通式(3)所示的化合物進行說明。 Next, the compound represented by the formula (3) will be described.

(R11O)mR4 3-mSi-R3-Si(OR12)1R5 3-1 (3) (R 11 O) m R 4 3-m Si-R 3 -Si(OR 12 ) 1 R 5 3-1 (3)

R3表示2價多環式芳香族基或其取代體。R4及R5為直接鍵結於矽原子的1價基團,並表示氫、烷基、烯基、芳基或這些的取代體,分別可相同亦可不同。R11及R12表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同。m及l分別獨立地為1~3的整數。多環式芳香族基及其取代體的說明與上述相同。 R 3 represents a divalent polycyclic aromatic group or a substituent thereof. R 4 and R 5 are a monovalent group directly bonded to a ruthenium atom, and represent a hydrogen, an alkyl group, an alkenyl group, an aryl group or a substituent of these, and may be the same or different. R 11 and R 12 represent hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group, and may be the same or different. m and l are each independently an integer of 1 to 3. The description of the polycyclic aromatic group and its substituent is the same as described above.

下述表示通式(3)所示的矽烷化合物的較佳的具體例。 Preferred specific examples of the decane compound represented by the formula (3) are shown below.

本發明中,(A1)聚矽氧烷較佳為可藉由以下方式獲得:使上述通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、與下述通式(4)~通式(6)的任一通式所示的1種以上矽烷化合物進行水解及縮合。通式(4)~通式(6)所示的矽烷化合物可使用2種以上。 In the present invention, the (A1) polyoxa oxide is preferably obtained by one or more kinds of decane compounds represented by any one of the above formulas (1) to (3), and the following One or more kinds of decane compounds represented by any one of the general formulae (4) to (6) are subjected to hydrolysis and condensation. Two or more kinds of the decane compounds represented by the general formulae (4) to (6) can be used.

R6Si(OR13)3 (4) R 6 Si(OR 13 ) 3 (4)

R6表示氫、烷基、烯基、苯基或這些的取代體。R13表示氫、甲基、乙基、丙基或丁基,可相同亦可不同。 R 6 represents hydrogen, an alkyl group, an alkenyl group, a phenyl group or a substituent of these. R 13 represents hydrogen, methyl, ethyl, propyl or butyl, and may be the same or different.

R7R8Si(OR14)2 (5) R 7 R 8 Si(OR 14 ) 2 (5)

R7及R8分別為直接鍵結於矽原子的1價基團,分別獨立地表示氫、烷基、烯基、苯基或這些的取代體。R14表示氫、甲基、乙基、丙基或丁基,可相同亦可不同。 R 7 and R 8 are each a monovalent group directly bonded to a ruthenium atom, and each independently represents a hydrogen, an alkyl group, an alkenyl group, a phenyl group or a substituent of these. R 14 represents hydrogen, methyl, ethyl, propyl or butyl, and may be the same or different.

Si(OR15)4 (6) Si(OR 15 ) 4 (6)

R15表示甲基、乙基、丙基或丁基,可相同亦可不同。 R 15 represents a methyl group, an ethyl group, a propyl group or a butyl group, and may be the same or different.

作為通式(4)及通式(5)中的取代體的較佳例,可列 舉:被環氧基、胺基、巰基、羧酸基、酸酐基、脲基、異氰酸酯基、丙烯基、甲基丙烯基、氟基等取代者。 Preferred examples of the substituents in the general formula (4) and the general formula (5) can be listed. It is substituted by an epoxy group, an amine group, a mercapto group, a carboxylic acid group, an acid anhydride group, a urea group, an isocyanate group, a propenyl group, a methacryl group, a fluorine group or the like.

作為通式(4)所示的矽烷化合物,例如可列舉:甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三(甲氧基乙氧基)矽烷、甲基三丙氧基矽烷、甲基三異丙氧基矽烷、甲基三丁氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、己基三甲氧基矽烷、十八烷基三甲氧基矽烷、十八烷基三乙氧基矽烷、苯基三甲氧基矽烷、苯基三乙氧基矽烷、苯基三異丙氧基矽烷、4-甲基苯基甲氧基矽烷、4-甲基苯基乙氧基矽烷、4-甲氧基苯基甲氧基矽烷、4-甲氧基苯基乙氧基矽烷、苯基乙炔基三甲氧基矽烷、苯基乙炔基三乙氧基矽烷、3-胺基丙基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-(N,N-二縮水甘油基)胺基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-甲基丙烯醯氧基丙基三乙氧基矽烷、γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、β-氰基乙基三乙氧基矽烷、縮水甘油氧基甲基三甲氧基矽烷、縮水甘油氧基甲基三乙氧基矽烷、α-縮水甘油氧基乙基三甲氧基矽烷、α-縮水甘油氧基乙基三乙氧基矽烷、β-縮水甘油氧基乙基三甲氧基矽烷、β-縮水甘油氧基乙基三乙氧基矽烷、α-縮水甘油氧基丙基三甲氧基矽烷、α-縮水甘油氧基丙基三乙氧基矽烷、β-縮水甘 油氧基丙基三甲氧基矽烷、β-縮水甘油氧基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三丙氧基矽烷、γ-縮水甘油氧基丙基三異丙氧基矽烷、γ-縮水甘油氧基丙基三丁氧基矽烷、γ-縮水甘油氧基丙基三(甲氧基乙氧基)矽烷、α-縮水甘油氧基丁基三甲氧基矽烷、α-縮水甘油氧基丁基三乙氧基矽烷、β-縮水甘油氧基丁基三甲氧基矽烷、β-縮水甘油氧基丁基三乙氧基矽烷、γ-縮水甘油氧基丁基三甲氧基矽烷、γ-縮水甘油氧基丁基三乙氧基矽烷、δ-縮水甘油氧基丁基三甲氧基矽烷、δ-縮水甘油氧基丁基三乙氧基矽烷、(3,4-環氧環己基)甲基三甲氧基矽烷、(3,4-環氧環己基)甲基三乙氧基矽烷、2-(3,4-環氧環己基)乙基三丙氧基矽烷、2-(3,4-環氧環己基)乙基三丁氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三乙氧基矽烷、2-(3,4-環氧環己基)乙基三苯氧基矽烷、3-(3,4-環氧環己基)丙基三甲氧基矽烷、3-(3,4-環氧環己基)丙基三乙氧基矽烷、4-(3,4-環氧環己基)丁基三甲氧基矽烷、4-(3,4-環氧環己基)丁基三乙氧基矽烷、三氟甲基三甲氧基矽烷、三氟甲基三乙氧基矽烷、三氟丙基三甲氧基矽烷、三氟丙基三乙氧基矽烷、全氟丙基乙基三甲氧基矽烷、全氟丙基乙基三乙氧基矽烷、全氟戊基乙基三甲氧基矽烷、全氟戊基乙基三乙氧基矽烷、十三氟辛基三甲氧基矽烷、十三氟辛基三乙氧基矽烷、十三氟辛基三丙氧基矽烷、十三氟辛基三異丙氧基矽烷、十七氟癸基三甲氧基矽烷、十七氟癸基三乙氧基矽烷、對苯乙烯基三甲氧基矽烷、3- 甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、3-脲丙基三乙氧基矽烷、3-巰基丙基三甲氧基矽烷、3-異氰酸酯丙基三乙氧基矽烷、3-乙基-3-[3-(三甲氧基矽烷基)丙氧基甲基]氧雜環丁烷、烯丙基三甲氧基矽烷等。這些中,就所得的塗膜的耐龜裂性的觀點而言,較佳為甲基三甲氧基矽烷、甲基三乙氧基矽烷、苯基三甲氧基矽烷、及苯基三乙氧基矽烷。 Examples of the decane compound represented by the formula (4) include methyltrimethoxydecane, methyltriethoxydecane, methyltris(methoxyethoxy)decane, and methyltripropoxy group. Decane, methyl triisopropoxy decane, methyl tributoxy decane, ethyl trimethoxy decane, ethyl triethoxy decane, hexyl trimethoxy decane, octadecyl trimethoxy decane, ten Octaalkyltriethoxydecane, phenyltrimethoxydecane, phenyltriethoxydecane, phenyltriisopropoxydecane, 4-methylphenylmethoxydecane, 4-methylphenyl Ethoxy decane, 4-methoxyphenyl methoxy decane, 4-methoxyphenyl ethoxy decane, phenyl ethynyl trimethoxy decane, phenyl ethynyl triethoxy decane, 3- Aminopropyltriethoxydecane, vinyltrimethoxydecane, vinyltriethoxydecane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, 3-chloro Propyltrimethoxydecane, 3-(N,N-diglycidyl)aminopropyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, vinyltrimethoxydecane, vinyl Ethoxy decane, γ-methyl propylene methoxy propyl trimethoxy decane, γ-methyl propylene methoxy propyl triethoxy decane, γ-aminopropyl trimethoxy decane, γ-amine Propyltriethoxydecane, N-β-(aminoethyl)-γ-aminopropyltrimethoxydecane, β-cyanoethyltriethoxydecane, glycidoxymethyltrimethyl Oxy decane, glycidoxymethyl triethoxy decane, α-glycidoxyethyl trimethoxy decane, α-glycidoxyethyl triethoxy decane, β-glycidoxy B Trimethoxy decane, β-glycidoxyethyl triethoxy decane, α-glycidoxypropyl trimethoxy decane, α-glycidoxypropyl triethoxy decane, β-shrinkage sweet Oloxypropyltrimethoxydecane, β-glycidoxypropyltriethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropyltriethoxydecane , γ-glycidoxypropyl tripropoxy decane, γ-glycidoxypropyl triisopropoxy decane, γ-glycidoxypropyl tributoxy decane, γ-glycidyloxy Propyltris(methoxyethoxy)decane, α-glycidoxybutyltrimethoxydecane, α-glycidoxybutyltriethoxydecane, β-glycidoxybutyltrimethoxy Base decane, β-glycidoxybutyl triethoxy decane, γ-glycidoxy butyl trimethoxy decane, γ-glycidoxy butyl triethoxy decane, δ-glycidyloxy Butyl trimethoxy decane, δ-glycidoxy butyl triethoxy decane, (3,4-epoxycyclohexyl)methyltrimethoxy decane, (3,4-epoxycyclohexyl)methyl Triethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltripropoxydecane, 2-(3,4-epoxycyclohexyl)ethyl tributoxy decane, 2-(3 , 4-epoxycyclohexyl)ethyl three Oxydecane, 2-(3,4-epoxycyclohexyl)ethyltriethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltriphenoxydecane, 3-(3,4 -Epoxycyclohexyl)propyltrimethoxydecane, 3-(3,4-epoxycyclohexyl)propyltriethoxydecane, 4-(3,4-epoxycyclohexyl)butyltrimethoxy Decane, 4-(3,4-epoxycyclohexyl)butyltriethoxydecane, trifluoromethyltrimethoxydecane, trifluoromethyltriethoxydecane, trifluoropropyltrimethoxydecane, Trifluoropropyltriethoxydecane, perfluoropropylethyltrimethoxydecane, perfluoropropylethyltriethoxydecane, perfluoropentylethyltrimethoxydecane, perfluoropentylethyl Triethoxy decane, tridecafluorooctyltrimethoxydecane, tridecafluorooctyltriethoxydecane, tridecafluorooctyltripropoxydecane, tridecafluorooctyltriisopropoxydecane, Heptadecyl decyl trimethoxy decane, heptadecafluorodecyl triethoxy decane, p-styryl trimethoxy decane, 3- Methyl propylene methoxy propyl trimethoxy decane, 3-methyl propylene methoxy propyl triethoxy decane, 3- propylene methoxy propyl trimethoxy decane, 3-ureido propyl triethoxy Baseline, 3-mercaptopropyltrimethoxydecane, 3-isocyanatepropyltriethoxydecane, 3-ethyl-3-[3-(trimethoxydecylalkyl)propoxymethyl]oxirane Butane, allyltrimethoxydecane, and the like. Among these, from the viewpoint of the crack resistance of the obtained coating film, methyl trimethoxy decane, methyl triethoxy decane, phenyl trimethoxy decane, and phenyl triethoxy group are preferable. Decane.

作為通式(5)所示的矽烷化合物,例如可列舉:二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、二苯基二甲氧基矽烷、二苯基二乙氧基矽烷、甲基苯基二甲氧基矽烷、二乙烯基二甲氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、γ-縮水甘油氧基丙基甲基二甲氧基矽烷、γ-胺基丙基甲基二甲氧基矽烷、γ-胺基丙基甲基二乙氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、γ-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、γ-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、縮水甘油氧基甲基二甲氧基矽烷、縮水甘油氧基甲基甲基二乙氧基矽烷、α-縮水甘油氧基乙基甲基二甲氧基矽烷、α-縮水甘油氧基乙基甲基二乙氧基矽烷、β-縮水甘油氧基乙基甲基二甲氧基矽烷、β-縮水甘油氧基乙基甲基二乙氧基矽烷、α-縮水甘油氧基丙基甲基二甲氧基矽烷、α-縮水甘油氧基丙基甲基二乙氧基矽烷、β-縮水甘油氧基丙基甲基二甲氧基矽烷、β-縮水甘油氧基丙基甲基二乙氧基矽烷、γ-縮水甘油氧基丙基甲基二甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基 矽烷、γ-縮水甘油氧基丙基甲基二丙氧基矽烷、β-縮水甘油氧基丙基甲基二丁氧基矽烷、γ-縮水甘油氧基丙基甲基二(甲氧基乙氧基)矽烷、γ-縮水甘油氧基丙基乙基二甲氧基矽烷、γ-縮水甘油氧基丙基乙基二乙氧基矽烷、γ-縮水甘油氧基丙基乙烯基二甲氧基矽烷、γ-縮水甘油氧基丙基乙烯基二乙氧基矽烷、三氟丙基甲基二甲氧基矽烷、三氟丙基甲基二乙氧基矽烷、三氟丙基乙基二甲氧基矽烷、三氟丙基乙基二乙氧基矽烷、三氟丙基乙烯基二甲氧基矽烷、三氟丙基乙烯基二乙氧基矽烷、十七氟癸基甲基二甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基甲基二乙氧基矽烷、環己基甲基二甲氧基矽烷、十八烷基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷等。這些中,為了對所得的塗膜賦予可撓性,可較佳地使用:二甲基二烷氧基矽烷、二苯基二烷氧基矽烷。 Examples of the decane compound represented by the formula (5) include dimethyldimethoxydecane, dimethyldiethoxydecane, diphenyldimethoxydecane, and diphenyldiethoxy group. Decane, methylphenyldimethoxydecane, divinyldimethoxydecane, methylvinyldimethoxydecane,methylvinyldiethoxydecane,γ-glycidoxypropyl A Dimethoxyoxane, γ-aminopropylmethyldimethoxydecane, γ-aminopropylmethyldiethoxydecane, N-(2-aminoethyl)-3-amino Propylmethyldimethoxydecane, γ-methylpropenyloxypropylmethyldimethoxydecane, γ-methylpropenyloxypropylmethyldiethoxydecane, glycidoxy Methyldimethoxydecane, glycidoxymethylmethyldiethoxydecane, α-glycidoxyethylmethyldimethoxydecane, α-glycidoxyethylmethyldiethyl Oxydecane, β-glycidoxyethylmethyldimethoxydecane, β-glycidoxyethylmethyldiethoxydecane, α-glycidoxypropylmethyldimethoxy Decane, α- Glycidoxypropylmethyldiethoxydecane, β-glycidoxypropylmethyldimethoxydecane, β-glycidoxypropylmethyldiethoxydecane, γ-glycidol Oxypropyl propyl dimethoxy decane, γ-glycidoxypropyl methyl diethoxy Decane, γ-glycidoxypropylmethyldipropoxydecane, β-glycidoxypropylmethyldibutoxydecane, γ-glycidoxypropylmethyldi(methoxy B) Oxy) decane, γ-glycidoxypropyl ethyl dimethoxy decane, γ-glycidoxy propyl ethyl diethoxy decane, γ-glycidoxy propyl vinyl dimethoxy Base decane, γ-glycidoxypropyl vinyl diethoxy decane, trifluoropropyl methyl dimethoxy decane, trifluoropropyl methyl diethoxy decane, trifluoropropyl ethyl Methoxydecane, trifluoropropylethyldiethoxydecane, trifluoropropylvinyldimethoxydecane, trifluoropropylvinyldiethoxydecane, heptadecafluoromethylmethyl Oxydecane, 3-chloropropylmethyldimethoxydecane, 3-chloropropylmethyldiethoxydecane, cyclohexylmethyldimethoxydecane, octadecylmethyldimethoxy Decane, 3-methacryloxypropylmethyldimethoxydecane, and the like. Among these, in order to impart flexibility to the obtained coating film, dimethyl dialkoxy decane or diphenyl dialkoxy decane can be preferably used.

作為通式(6)所示的四官能性矽烷化合物,例如可列舉:四甲氧基矽烷、四乙氧基矽烷等。 The tetrafunctional decane compound represented by the formula (6) may, for example, be tetramethoxy decane or tetraethoxy decane.

本發明中的(A1)聚矽氧烷中的全部矽原子數100莫耳%中,源自通式(1)~通式(3)中任一通式所示的1種以上矽烷化合物的矽原子,較佳為5莫耳%以上、70莫耳%以下。在併用通式(1)~通式(3)的矽烷化合物時,矽原子的量是指源自通式(1)~通式(3)的矽烷化合物的矽原子之和。為了進一步提高印刷圖案的轉印性,矽原子的量較佳為10莫耳%以上,更佳為15莫耳%以上,尤佳為20莫耳%以上,特佳為25莫耳%以上。另外, 為了進一步提高硬化被膜的耐化學品性,矽原子的量較佳為60莫耳%以下,更佳為50莫耳%以下,尤佳為40莫耳%以下。聚矽氧烷溶液狀態下的莫耳分率可藉由1H-NMR、13C-NMR、29Si-NMR進行分析,硬化膜的莫耳分率可藉由固體1H-NMR、固體13C-NMR、固體29Si-NMR進行分析。 In the (A1) polyfluorene oxide of the present invention, the ruthenium of one or more kinds of decane compounds represented by any one of the general formulae (1) to (3) is contained in 100% by mole of the ruthenium atom. The atom is preferably 5 mol% or more and 70 mol% or less. When the decane compound of the formula (1) to the formula (3) is used in combination, the amount of the ruthenium atom means the sum of the ruthenium atoms derived from the decane compound of the formulae (1) to (3). In order to further improve the transfer property of the printed pattern, the amount of germanium atoms is preferably 10 mol% or more, more preferably 15 mol% or more, particularly preferably 20 mol% or more, and particularly preferably 25 mol% or more. Further, in order to further improve the chemical resistance of the cured film, the amount of the ruthenium atom is preferably 60 mol% or less, more preferably 50 mol% or less, and still more preferably 40 mol% or less. The molar fraction in the state of polyoxyalkylene solution can be analyzed by 1 H-NMR, 13 C-NMR, 29 Si-NMR, and the molar fraction of the cured film can be obtained by solid 1 H-NMR, solid 13 Analysis was carried out by C-NMR and solid 29 Si-NMR.

在本發明的較佳的聚矽氧烷的構成成分中,在通式(4)~通式(6)的矽烷化合物中,更佳為具有乙烯基、環氧基或氧雜環丁基。這些官能基具有π電子或環狀醚上的氧,可使絕緣膜上的抗蝕劑或半導體塗液的塗佈性變得良好,並且在用作閘極絕緣膜形成用途時,可獲得遲滯(hysteresis)小且優異的TFT。 Among the constituent components of the preferred polyoxyalkylene of the present invention, the decane compound of the formulae (4) to (6) preferably has a vinyl group, an epoxy group or an oxetanyl group. These functional groups have oxygen on the π-electron or cyclic ether, and the coating property of the resist or the semiconductor coating liquid on the insulating film can be improved, and hysteresis can be obtained when used as a gate insulating film forming application. (hysteresis) Small and excellent TFT.

並且,作為較佳的聚矽氧烷,為(A2)聚矽氧烷,其藉由使包含通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、及通式(7)所示的矽烷化合物的矽烷化合物水解及縮合而得。 Further, as a preferred polyoxane, (A2) polyadenine is obtained by including one or more kinds of decane compounds represented by any one of the general formulae (1) to (3), and The decane compound of the decane compound represented by the formula (7) is obtained by hydrolysis and condensation.

本發明中所用的包含選自乙烯基、環氧基、氧雜環丁基的1種以上取代基的矽烷化合物,可較佳地使用下述通式(7)所示的矽烷化合物。 In the decane compound containing one or more substituents selected from the group consisting of a vinyl group, an epoxy group and an oxetanyl group used in the present invention, a decane compound represented by the following formula (7) can be preferably used.

R9 aSi(OR16)4-a (7) R 9 a Si(OR 16 ) 4-a (7)

R9表示包含乙烯基、環氧基、氧雜環丁基的至少1種的碳數為2~20的有機基。分別可相同亦可不同。R16表示氫、甲基、 乙基、丙基或丁基,分別可相同亦可不同。a為1~3的整數。 R 9 represents at least one organic group having 2 to 20 carbon atoms including a vinyl group, an epoxy group, and an oxetanyl group. They can be the same or different. R 16 represents hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group, and may be the same or different. a is an integer from 1 to 3.

下述表示通式(7)所示的矽烷化合物的具體例。可列舉:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、二乙烯基二甲氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、三氟丙基乙烯基二甲氧基矽烷、三氟丙基乙烯基二乙氧基矽烷、三氟丙基乙烯基二甲氧基矽烷、三氟丙基乙烯基二乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、β-(3,4-環氧環己基)乙基三乙氧基矽烷、γ-縮水甘油氧基丙基三異丙氧基矽烷、β-(3,4-環氧環己基)乙基三異丙氧基矽烷、γ-縮水甘油氧基丙基甲基二甲氧基矽烷、β-(3,4-環氧環己基)乙基甲基二甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基甲基二乙氧基矽烷、γ-縮水甘油氧基丙基甲基二異丙氧基矽烷、β-(3,4-環氧環己基)乙基甲基二異丙氧基矽烷、γ-縮水甘油氧基丙基乙基二甲氧基矽烷、β-(3,4-環氧環己基)乙基乙基二甲氧基矽烷、γ-縮水甘油氧基丙基乙基二乙氧基矽烷、β-(3,4-環氧環己基)乙基乙基二乙氧基矽烷、γ-縮水甘油氧基丙基乙基二異丙氧基矽烷、β-(3,4-環氧環己基)乙基乙基二異丙氧基矽烷、β-(3,4-環氧環己基)丙基三甲氧基矽烷、γ-縮水甘油氧基乙基三甲氧基矽烷、3-乙基-3-[3-(三甲氧基矽烷基)丙氧基甲基]氧雜環丁烷、烯丙基三甲氧基矽烷等。 Specific examples of the decane compound represented by the formula (7) are shown below. There may be mentioned vinyl trimethoxy decane, vinyl triethoxy decane, divinyl dimethoxy decane, methyl vinyl dimethoxy decane, methyl vinyl diethoxy decane, trifluoropropyl Vinyl dimethoxy decane, trifluoropropyl vinyl diethoxy decane, trifluoropropyl vinyl dimethoxy decane, trifluoropropyl vinyl diethoxy decane, γ-glycidyl oxygen Propyltrimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltriethoxydecane, β-(3,4-epoxy Cyclohexyl)ethyltriethoxydecane, γ-glycidoxypropyltriisopropoxydecane, β-(3,4-epoxycyclohexyl)ethyltriisopropoxydecane, γ-shrinkage Glyceroxypropylmethyldimethoxydecane, β-(3,4-epoxycyclohexyl)ethylmethyldimethoxydecane, γ-glycidoxypropylmethyldiethoxydecane , β-(3,4-epoxycyclohexyl)ethylmethyldiethoxydecane, γ-glycidoxypropylmethyldiisopropoxydecane, β-(3,4-epoxy ring Hexyl)ethylmethyldiisopropoxydecane, γ-glycidyl Oxypropylethyldimethoxydecane, β-(3,4-epoxycyclohexyl)ethylethyldimethoxydecane, γ-glycidoxypropylethyldiethoxydecane, --(3,4-epoxycyclohexyl)ethylethyldiethoxydecane, γ-glycidoxypropylethyldiisopropoxydecane, β-(3,4-epoxycyclohexyl Ethylethyldiisopropoxydecane, β-(3,4-epoxycyclohexyl)propyltrimethoxydecane, γ-glycidoxyethyltrimethoxydecane, 3-ethyl-3 -[3-(Trimethoxydecyl)propoxymethyl]oxetane, allyltrimethoxydecane, and the like.

這些中,為了提高交聯密度、耐化學品性與絕緣特性,較佳為具有環氧基者,較佳為使用:γ-縮水甘油氧基丙基三甲氧基 矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、β-(3,4-環氧環己基)乙基三乙氧基矽烷、γ-縮水甘油氧基丙基三異丙氧基矽烷、β-(3,4-環氧環己基)乙基三異丙氧基矽烷、β-(3,4-環氧環己基)丙基三甲氧基矽烷、γ-縮水甘油氧基乙基三甲氧基矽烷。另外,就量產性的觀點而言,特佳為使用:R16為甲基的γ-縮水甘油氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、β-(3,4-環氧環己基)丙基三甲氧基矽烷、γ-縮水甘油氧基乙基三甲氧基矽烷。 Among these, in order to increase the crosslinking density, chemical resistance and insulating properties, those having an epoxy group are preferred, and γ-glycidoxypropyltrimethoxydecane and β-(3,4 are preferably used. -Epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltriethoxydecane, β-(3,4-epoxycyclohexyl)ethyltriethoxydecane, γ-shrinkage Glyceroxypropyl triisopropoxydecane, β-(3,4-epoxycyclohexyl)ethyltriisopropoxydecane, β-(3,4-epoxycyclohexyl)propyltrimethoxy Decane, γ-glycidoxyethyltrimethoxydecane. Further, from the viewpoint of mass productivity, it is particularly preferable to use: γ-glycidoxypropyltrimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethyl, wherein R 16 is a methyl group. Oxydecane, β-(3,4-epoxycyclohexyl)propyltrimethoxydecane, γ-glycidoxyethyltrimethoxydecane.

此處,相對於作為聚矽氧烷的共聚合成分的矽烷化合物的全部結構單元的矽原子,源自包含乙烯基、環氧基、氧雜環丁基的任一種的含有矽烷化合物的結構單元的矽的含量較佳為0.1莫耳%~40莫耳%。若矽的含量為0.1莫耳%以上,則可獲得與底層的密接性更良好的硬化被膜,更佳為1莫耳%以上。另一方面,若矽的含量為40莫耳%以下,則可獲得聚矽氧烷在溶劑中的良好的溶解性,更佳為35莫耳%以下。聚矽氧烷溶液時的莫耳分率、硬化膜的莫耳分率可藉由上述的各種核的NMR進行分析。 Here, the germanium atom of all the structural units of the decane compound which is a copolymerization component of polyoxyalkylene is derived from a structural unit containing a decane compound containing any one of a vinyl group, an epoxy group, and an oxetanyl group. The content of cerium is preferably from 0.1 mol% to 40 mol%. When the content of cerium is 0.1 mol% or more, a cured film having better adhesion to the underlayer can be obtained, and more preferably 1 mol% or more. On the other hand, when the content of cerium is 40 mol% or less, good solubility of polyoxyalkylene in a solvent can be obtained, and it is more preferably 35 mol% or less. The molar fraction of the polyoxyalkylene solution and the molar fraction of the cured film can be analyzed by NMR of various cores as described above.

本發明中所用的聚矽氧烷更佳為進一步具有苯基。藉此,可更精密地控制印刷圖案的轉印性。此種聚矽氧烷可藉由以下方式獲得:使通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、與具有苯基的矽烷化合物水解及縮合。 More preferably, the polyoxyalkylene used in the present invention further has a phenyl group. Thereby, the transfer property of the printed pattern can be controlled more precisely. Such a polyoxyalkylene can be obtained by hydrolyzing and condensing one or more kinds of decane compounds represented by any one of the general formulae (1) to (3) and a decane compound having a phenyl group.

作為本發明中所用的具有苯基的矽烷化合物,較佳為下述通式(8)所示的矽烷化合物。 The decane compound having a phenyl group used in the present invention is preferably a decane compound represented by the following formula (8).

R10 bSi(OR17)4-b (8) R 10 b Si(OR 17 ) 4-b (8)

R10表示具有苯基的碳數為3~20的有機基。分別可相同亦可不同。R17表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同。b為1~3的整數。 R 10 represents an organic group having a phenyl group having 3 to 20 carbon atoms. They can be the same or different. R 17 represents hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group, and may be the same or different. b is an integer from 1 to 3.

下述表示通式(8)所示的矽烷化合物的具體例。可列舉:苯基三甲氧基矽烷、苯基三乙氧基矽烷、苯基三異丙氧基矽烷、二苯基二甲氧基矽烷、二苯基二乙氧基矽烷、甲基苯基二甲氧基矽烷、4-甲基苯基甲氧基矽烷、4-甲基苯基乙氧基矽烷、4-甲氧基苯基甲氧基矽烷、4-甲氧基苯基乙氧基矽烷、苯基乙炔基三甲氧基矽烷、苯基乙炔基三乙氧基矽烷等。 Specific examples of the decane compound represented by the formula (8) are shown below. There may be mentioned phenyl trimethoxy decane, phenyl triethoxy decane, phenyl triisopropoxy decane, diphenyl dimethoxy decane, diphenyl diethoxy decane, methyl phenyl di Methoxy decane, 4-methylphenyl methoxy decane, 4-methylphenyl ethoxy decane, 4-methoxyphenyl methoxy decane, 4-methoxyphenyl ethoxy decane , phenyl ethynyl trimethoxy decane, phenyl ethynyl triethoxy decane, and the like.

此處,相對於作為聚矽氧烷的共聚合成分的矽烷化合物的全部結構單元的矽原子,源自具有苯基的矽烷化合物的結構單元的含量較佳為5莫耳%~60莫耳%。若含量為5莫耳%以上,則轉印性良好,且可獲得高解析度圖案被膜,較佳為10莫耳%以上,更佳為15莫耳%以上,尤佳為20莫耳%。另一方面,若含量為60莫耳%以下,則可獲得聚矽氧烷溶液中的良好的保存穩定性,較佳為50莫耳%以下,更佳為40莫耳%以下,尤佳為30莫耳%以下。聚矽氧烷溶液的莫耳分率可藉由1H-NMR、13C-NMR、29Si-NMR進行分析。硬化膜的莫耳分率可藉由固體1H-NMR、固體13C-NMR、固體29Si-NMR進行分析。 Here, the content of the structural unit derived from the decane compound having a phenyl group is preferably from 5 mol% to 60 mol% with respect to the ruthenium atom of all the structural units of the decane compound which is a copolymerization component of polysiloxane. . When the content is 5 mol% or more, the transfer property is good, and a high-resolution pattern film can be obtained, preferably 10 mol% or more, more preferably 15 mol% or more, and still more preferably 20 mol%. On the other hand, when the content is 60 mol% or less, good storage stability in the polyoxane solution can be obtained, and is preferably 50 mol% or less, more preferably 40 mol% or less, and particularly preferably 30% or less. The molar fraction of the polyoxyalkylene solution can be analyzed by 1 H-NMR, 13 C-NMR, and 29 Si-NMR. The molar fraction of the cured film can be analyzed by solid 1 H-NMR, solid 13 C-NMR, solid 29 Si-NMR.

本發明中更佳的聚矽氧烷為(A3)聚矽氧烷,其藉由使至少包含通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、通式(7)所示的矽烷化合物及通式(8)所示的矽烷化合物的矽烷化合物水解及縮合而得。 More preferably, the polyoxyalkylene oxide in the present invention is (A3) polyoxyalkylene, which comprises at least one decane compound represented by any one of the general formulae (1) to (3). The decane compound represented by the formula (7) and the decane compound of the decane compound represented by the formula (8) are hydrolyzed and condensed.

藉由設為該組合,而印刷性變得良好,並可實現高解析度的圖案,因此較佳。相對於作為聚矽氧烷的共聚合成分的矽烷化合物的全部結構單元的矽原子,通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物的矽原子、通式(7)所示的具有選自乙烯基、環氧基及氧雜環丁基的官能基的1種以上矽烷化合物的矽原子、通式(8)所示的具有苯基的矽烷化合物的矽原子的較佳的比率,為5莫耳%~70莫耳%/0.1莫耳%~40莫耳%/5莫耳%~60莫耳%,較佳為10莫耳%~50莫耳%/1莫耳%~20莫耳%/10莫耳%~50莫耳%,更佳為20莫耳%~40莫耳%/5莫耳%~15莫耳%/10莫耳%~30莫耳%。 By using this combination, printability is improved, and a high-resolution pattern can be realized, which is preferable. The ruthenium atom of one or more kinds of decane compounds represented by any one of the general formulae (1) to (3) is a ruthenium atom of all the structural units of the decane compound which is a copolymerization component of the polysiloxane. a fluorene atom having one or more decane compounds having a functional group selected from the group consisting of a vinyl group, an epoxy group and an oxetanyl group, and a decane compound having a phenyl group represented by the formula (8), represented by the formula (7) A preferred ratio of germanium atoms is from 5 mole % to 70 mole % / 0.1 mole % to 40 mole % / 5 mole % to 60 mole %, preferably 10 mole % to 50 moles %/1 mol%~20 mol%/10 mol%~50 mol%, more preferably 20 mol%~40 mol%/5 mol%~15 mol%/10 mol%~ 30 moles %.

相對於除去溶劑的固體成分總量,本發明的矽氧烷組成物中的(a)聚矽氧烷的含量較佳為10質量%以上,更佳為20質量%以上。藉由在該範圍內含有(a)聚矽氧烷,而可進一步提高塗膜的透射率與耐龜裂性。 The content of the (a) polyoxyalkylene in the oxoxane composition of the present invention is preferably 10% by mass or more, and more preferably 20% by mass or more, based on the total amount of the solid component of the solvent. By containing (a) polyoxyalkylene in this range, the transmittance and crack resistance of the coating film can be further improved.

(A1)聚矽氧烷可藉由以下方式獲得:藉由將上述通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、以及根據需要而添加的通式(4)~通式(6)的任一通式所示的矽烷化合物,較佳為在溶劑中利用酸或鹼觸媒進行水解,而生成矽烷 醇化合物後,使該矽烷醇化合物進行縮合反應。 (A1) Polyoxane can be obtained by one or more kinds of decane compounds represented by any one of the above formulas (1) to (3), and a formula added as needed. (4) The decane compound represented by any one of the formula (6) is preferably hydrolyzed by an acid or a base catalyst in a solvent to form a decane. After the alcohol compound, the stanol compound is subjected to a condensation reaction.

另外,(A2)聚矽氧烷、(A3)聚矽氧烷可藉由以下方式獲得:藉由將上述通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、以及根據需要而添加的通式(7)及/或通式(8)的矽烷化合物,較佳為在溶劑中利用酸或鹼觸媒進行水解,而生成矽烷醇化合物後,使該矽烷醇化合物進行縮合反應。 Further, (A2) polyadenine or (A3) polyoxyalkylene can be obtained by one or more kinds of decane represented by any one of the above formula (1) to formula (3). The compound and the decane compound of the formula (7) and/or the formula (8) which are added as needed are preferably hydrolyzed by an acid or a base catalyst in a solvent to form a stanol compound, and then the decane is obtained. The alcohol compound undergoes a condensation reaction.

水解反應是在通式(1)~通式(3)的任一通式所示的1種以上矽烷化合物、以及根據需要而添加的通式(7)及/或通式(8)的矽烷化合物所具有的矽原子上所直接鍵結的烷氧基,藉由水一邊產生副產物醇,一邊生成羥基者。水解反應較佳為在矽烷化合物的溶液中歷時1分鐘~180分鐘添加酸觸媒或鹼觸媒、及水後,在室溫~150℃下進行1分鐘~180分鐘。藉由在此種條件下進行水解反應,而可抑制急遽的反應。反應溫度更佳為40℃~115℃。 The hydrolysis reaction is one or more kinds of decane compounds represented by any one of the general formulae (1) to (3), and a decane compound of the formula (7) and/or the formula (8) which are added as needed. The alkoxy group directly bonded to the ruthenium atom is produced by generating a by-product alcohol by water. The hydrolysis reaction is preferably carried out by adding an acid catalyst or a base catalyst and water in a solution of a decane compound for 1 minute to 180 minutes, and then performing the reaction at room temperature to 150 ° C for 1 minute to 180 minutes. By carrying out the hydrolysis reaction under such conditions, the impatient reaction can be suppressed. The reaction temperature is more preferably from 40 ° C to 115 ° C.

通常的縮合反應是具有羥基的矽烷化合物(矽烷醇化合物)與具有羥基的其他矽烷化合物反應,一邊脫水一邊生成矽氧烷鍵的反應。具有烷氧基的矽烷化合物與具有羥基的矽烷化合物根據條件而反應,一邊產生副產物醇,一邊生成矽氧烷鍵。 The usual condensation reaction is a reaction in which a decane compound having a hydroxyl group (a stanol compound) is reacted with another decane compound having a hydroxyl group to form a decane bond while dehydrating. The decane compound having an alkoxy group and a decane compound having a hydroxyl group are reacted according to conditions, and a by-product alcohol is produced to form a decane bond.

藉由縮合而得的聚矽氧烷無須完全清除烷氧基及羥基。相反,通常聚矽氧烷具有烷氧基或羥基。 The polyoxyalkylene obtained by condensation does not have to completely remove the alkoxy group and the hydroxyl group. In contrast, polyoxyalkylene usually has an alkoxy group or a hydroxyl group.

縮合反應較佳為在水解反應後,在50℃以上、溶劑的沸點以下將反應液加熱1小時~100小時,而進行縮合反應。為了提 高聚矽氧烷的聚合度,亦可進行再加熱或觸媒的再添加。另外,亦可在獲得矽烷化合物的部分縮合物後,混合通式(4)~通式(6)以及通式(7)及通式(8)的任一通式所示的矽烷化合物。 The condensation reaction is preferably carried out by heating the reaction liquid at a temperature of 50 ° C or higher and a boiling point or lower of the solvent for 1 hour to 100 hours after the hydrolysis reaction. To mention The degree of polymerization of the high polyoxyalkylene can also be reheated or re-added by the catalyst. Further, after obtaining a partial condensate of a decane compound, a decane compound represented by any one of the formulae (4) to (6) and the formula (7) and the formula (8) may be mixed.

關於水解反應及縮合反應中的各種條件,考慮反應規模、反應容器的大小、形狀等,而設定例如觸媒濃度、反應溫度、反應時間等,藉此可獲得適合於目標用途的物性。 With regard to various conditions in the hydrolysis reaction and the condensation reaction, physical properties suitable for the intended use can be obtained by setting, for example, the catalyst concentration, the reaction temperature, the reaction time, and the like in consideration of the reaction scale, the size and shape of the reaction vessel, and the like.

作為水解反應及縮合反應中所用的酸觸媒,可列舉:鹽酸、乙酸、甲酸、硝酸、草酸、硫酸、磷酸、聚磷酸、多元羧酸或其酐、離子交換樹脂等酸觸媒。特佳為使用甲酸、乙酸或磷酸的酸性水溶液。另外,作為鹼觸媒,可列舉:作為無機鹼的氫氧化鈉、氫氧化鉀等,或作為有機鹼化合物的三乙基胺、二乙基胺、單乙醇胺、二乙醇胺、三乙醇胺、氨水、四甲基氫氧化銨、具有胺基的烷氧基矽烷、胺基丙基三甲氧基矽烷等,鹼金屬會在電子元件等中引起故障,因此作為鹼觸媒,較佳為有機鹼。 Examples of the acid catalyst used in the hydrolysis reaction and the condensation reaction include acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acid or anhydride thereof, and ion exchange resins. It is particularly preferred to use an acidic aqueous solution of formic acid, acetic acid or phosphoric acid. Further, examples of the base catalyst include sodium hydroxide, potassium hydroxide, and the like as an inorganic base, or triethylamine, diethylamine, monoethanolamine, diethanolamine, triethanolamine, and ammonia as an organic base compound. An alkali metal may cause a failure in an electronic component or the like due to tetramethylammonium hydroxide, an alkoxydecane having an amine group, or an aminopropyltrimethoxydecane. Therefore, an alkali base is preferred as the base catalyst.

相對於水解反應時所使用的全部矽烷化合物100質量份,作為這些觸媒的較佳的含量較佳為0.1質量份以上,且較佳為5質量份以下。此處,全部矽烷化合物量是指包括矽烷化合物、其水解物及其縮合物的全部的量,以下相同。 The content of the catalyst is preferably 0.1 part by mass or more, and preferably 5 parts by mass or less, based on 100 parts by mass of all the decane compounds used in the hydrolysis reaction. Here, the total amount of the decane compound means the total amount including the decane compound, the hydrolyzate thereof, and the condensate thereof, and the same applies hereinafter.

水解反應及縮合反應中所用的溶劑並無特別限定,較佳為使用具有醇性羥基的化合物。作為具有醇性羥基的化合物的具體例,可列舉:丙酮醇(acetol)、3-羥基-3-甲基-2-丁酮、4-羥基-3-甲基-2-丁酮、5-羥基-2-戊酮、4-羥基-4-甲基-2-戊酮(二丙酮 醇)、乳酸乙酯、乳酸丁酯、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丙醚、丙二醇單正丁醚、丙二醇單第三丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二丙二醇單甲醚、二丙二醇單乙醚、3-甲氧基-1-丁醇、3-甲基-3-甲氧基-1-丁醇等。另外,這些具有醇性羥基的化合物可單獨使用,或亦可組合2種以上而使用。 The solvent used in the hydrolysis reaction and the condensation reaction is not particularly limited, and a compound having an alcoholic hydroxyl group is preferably used. Specific examples of the compound having an alcoholic hydroxyl group include acetol, 3-hydroxy-3-methyl-2-butanone, 4-hydroxy-3-methyl-2-butanone, and 5- Hydroxy-2-pentanone, 4-hydroxy-4-methyl-2-pentanone (diacetone) Alcohol), ethyl lactate, butyl lactate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, propylene glycol mono-tert-butyl ether, diethylene glycol monomethyl ether, diethylene glycol Alcohol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, 3-methoxy-1-butanol, 3-methyl-3-methoxy-1-butanol and the like. Further, these compounds having an alcoholic hydroxyl group may be used singly or in combination of two or more.

亦可含有其他溶劑。作為其他溶劑,可列舉:乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸異丁酯、丙二醇單甲醚乙酸酯、乙酸3-甲氧基-1-丁酯、乙酸3-甲基-3-甲氧基-1-丁酯、乙醯乙酸乙酯等酯類,甲基異丁基酮、二異丙基酮、二異丁基酮、乙醯丙酮等酮類,二乙醚、二異丙醚、二正丁醚、二苯醚、二乙二醇乙基甲醚、二乙二醇二甲醚等醚類,γ-丁內酯、γ-戊內酯、δ-戊內酯,碳酸丙二酯,N-甲基吡咯烷酮、環戊酮、環己酮、環庚酮等。 It can also contain other solvents. Examples of the other solvent include ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate. And esters such as 3-methyl-3-methoxy-1-butyl acetate and ethyl acetate, methyl isobutyl ketone, diisopropyl ketone, diisobutyl ketone, acetamidine acetone, etc. Ethers such as ketones, diethyl ether, diisopropyl ether, di-n-butyl ether, diphenyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, γ-butyrolactone, γ-pentane Ester, δ-valerolactone, propylene carbonate, N-methylpyrrolidone, cyclopentanone, cyclohexanone, cycloheptanone, and the like.

另外,藉由在水解反應結束後或縮合反應結束後進一步添加溶劑,而作為組成物調整為恰當的濃度,亦為較佳的操作。另外,亦可將藉由在水解反應後或縮合反應後進行加熱及/或減壓而生成的醇等的全部或一部分餾出、除去。然後可添加較佳的溶劑。 Further, it is also preferable to adjust the solvent to an appropriate concentration after completion of the hydrolysis reaction or after completion of the condensation reaction to adjust the composition to an appropriate concentration. Further, all or a part of the alcohol or the like which is produced by heating and/or decompression after the hydrolysis reaction or the condensation reaction may be distilled off or removed. A preferred solvent can then be added.

相對於全部矽烷化合物100質量份,水解反應時所使用的溶劑的量較佳為80質量份以上,且較佳為1000質量份以下。另外,作為水解反應中所用的水,較佳為離子交換水。水的量可任意選擇,相對於矽烷化合物1莫耳,較佳為在1.0莫耳~4.0莫 耳的範圍內使用。 The amount of the solvent used in the hydrolysis reaction is preferably 80 parts by mass or more, and preferably 1000 parts by mass or less, based on 100 parts by mass of the total decane compound. Further, as the water used in the hydrolysis reaction, ion-exchanged water is preferred. The amount of water can be arbitrarily selected, preferably from 1.0 mole to 4.0 moles relative to 1 mole of the decane compound. Used within the scope of the ear.

本發明的矽氧烷組成物含有(B)溶劑。作為(B)溶劑的量,相對於聚矽氧烷100質量份,較佳為50質量份以上、10000質量份以下。 The oxoxane composition of the present invention contains (B) a solvent. The amount of the solvent (B) is preferably 50 parts by mass or more and 10,000 parts by mass or less based on 100 parts by mass of the polysiloxane.

作為(B)溶劑,若為可溶解或良好地分散聚矽氧烷、且藉由加熱處理而揮發者,則並無特別限定。作為溶劑,可單獨使用,亦可將多種溶劑加以混合而使用,就在印刷版上的塗佈性、在對象基材上的轉印性的觀點而言,較佳為慢乾性溶劑與快乾性溶劑的混合溶劑。 The solvent (B) is not particularly limited as long as it is soluble or well dispersed in polyoxyalkylene and volatilized by heat treatment. The solvent may be used singly or in combination of a plurality of solvents, and is preferably a slow-drying solvent and a fast-drying property from the viewpoint of coatability on a printing plate and transferability on a target substrate. A solvent mixture of solvents.

此處,所謂慢乾性溶劑,是ASTM D3539所規定的蒸發速度(參閱日譯版,“塗料的流動與塗膜形成”、中道敏彥著、技報堂出版社、1995年發行、參照107頁~109頁)為0.8以下的溶劑,較佳為0.5以下的溶劑。具體可例示:(i)十二烷、十一烷等烴類,(ii)二甲苯、均三甲苯等芳香族烴類,(iii)正丁醇、己醇、3-甲基-3-甲氧基丁醇、3-甲氧基丁醇、甲基溶纖劑、乙基溶纖劑、丁基溶纖劑、甲基卡必醇、乙基卡必醇、丁基卡必醇、丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單正丁醚、丙二醇單第三丁醚、乙二醇單第三丁醚、二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇單丙醚、二丙二醇單丁醚、二丙酮醇等醇類,(iv)二乙二醇甲基乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二丙二醇二甲醚、二乙二醇二丁醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、丙二醇單丙醚乙酸酯、二丙二醇單甲醚乙酸酯、 乙酸戊酯等醚/酯類,(v)二異丁基酮、乙基戊基酮、2-庚酮、2-己酮、2-辛酮、環戊酮、環己酮等酮類,(vi)N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺類,(vii)γ-丁內酯等內酯類。 Here, the slow-drying solvent is the evaporation rate specified by ASTM D3539 (see Japanese translation, "Flow of Coatings and Film Formation", Zhong Dao Min Yan, Technical Newspaper Publishing House, issued in 1995, refer to page 107~ The 109 page) is a solvent of 0.8 or less, preferably a solvent of 0.5 or less. Specific examples thereof include (i) hydrocarbons such as dodecane and undecane, (ii) aromatic hydrocarbons such as xylene and mesitylene, and (iii) n-butanol, hexanol, and 3-methyl-3-. Methoxybutanol, 3-methoxybutanol, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol Methyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol mono-n-butyl ether, propylene glycol mono-tert-butyl ether, ethylene glycol mono-tert-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether , dipropylene glycol monobutyl ether, diacetone alcohol and other alcohols, (iv) diethylene glycol methyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, diethylene glycol Dibutyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monomethyl ether acetate, An ether/ester such as amyl acetate, (v) a ketone such as diisobutyl ketone, ethyl amyl ketone, 2-heptanone, 2-hexanone, 2-octanone, cyclopentanone or cyclohexanone. (vi) phthalamides such as N,N-dimethylformamide and N,N-dimethylacetamide, and (vii) lactones such as γ-butyrolactone.

所謂快乾性溶劑,是ASTM D3539所規定的蒸發速度大於0.8的溶劑,較佳為1.0以上的溶劑。具體可例示:(i)正己烷、正辛烷、異辛烷、環己烷等烴,(ii)甲苯、二甲苯、均三甲苯等芳香族烴,(iii)甲醇、乙醇、正丙醇、異丙醇等醇,(iv)二乙醚、二丙醚、二丁醚、四氫呋喃、二噁烷、環戊基甲醚等醚,(v)乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯等酯,(vi)丙酮、甲基乙基酮、甲基正丁基酮、甲基異丁基酮等酮。 The fast-drying solvent is a solvent having an evaporation rate of more than 0.8 as defined in ASTM D3539, preferably a solvent of 1.0 or more. Specific examples thereof include (i) hydrocarbons such as n-hexane, n-octane, isooctane, and cyclohexane; (ii) aromatic hydrocarbons such as toluene, xylene, and mesitylene; and (iii) methanol, ethanol, and n-propanol. , an alcohol such as isopropanol, (iv) an ether such as diethyl ether, dipropyl ether, dibutyl ether, tetrahydrofuran, dioxane or cyclopentyl methyl ether, (v) ethyl acetate, n-propyl acetate, and isopropyl acetate An ester such as ester or n-butyl acetate; (vi) a ketone such as acetone, methyl ethyl ketone, methyl n-butyl ketone or methyl isobutyl ketone.

這些溶劑亦可使用在聚矽氧烷的聚縮合反應中所使用的溶劑,並依次添加。另外,慢乾性溶劑與快乾性溶劑的比率為選自慢乾性溶劑/快乾性溶劑=100/0~0/100的任意的質量比即可,就塗佈性與轉印性的平衡而言,較佳為慢乾性溶劑/快乾性溶劑=10/90~10/90的質量比。若慢乾性溶劑的比率少,則所塗佈的油墨在版上過度乾燥而導致黏性消失,而難以轉印至對象基材上。另一方面,若快乾性溶劑的比率少,則塗佈於版上的油墨的流動性過大,而圖案形狀崩潰而容易變得不良。 These solvents may also be used in the solvent used in the polycondensation reaction of polyoxyalkylene, and are sequentially added. Further, the ratio of the slow-drying solvent to the fast-drying solvent is any mass ratio selected from the group consisting of a slow-drying solvent/quick-drying solvent=100/0 to 0/100, and in terms of balance between coatability and transferability, Good slow dry solvent / fast drying solvent = 10/90~10/90 mass ratio. If the ratio of the slow-drying solvent is small, the applied ink is excessively dried on the plate to cause the stickiness to disappear, and it is difficult to transfer to the target substrate. On the other hand, when the ratio of the fast drying solvent is small, the fluidity of the ink applied to the plate is excessively large, and the pattern shape is broken and it is likely to be defective.

關於微細圖案的形狀,對印刷基材的潤濕性成為重要的因素,較佳為使用1種以上的非質子性溶劑;就保存穩定性的觀點而言,較佳為使用1種以上的質子性溶劑。較佳為包括兩者,而使用1種以上的非質子性溶劑及1種以上的質子性溶劑。作為 質子性溶劑,可列舉上述的醇、醯胺類,較佳為可列舉:丙酮醇、3-羥基-3-甲基-2-丁酮、4-羥基-3-甲基-2-丁酮、5-羥基-2-戊酮、4-羥基-4-甲基-2-戊酮(二丙酮醇)、乳酸乙酯、乳酸丁酯、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丙醚、丙二醇單正丁醚、丙二醇單第三丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二丙二醇單甲醚、二丙二醇單乙醚、3-甲氧基-1-丁醇、3-甲基-3-甲氧基-1-丁醇等。 The shape of the fine pattern is an important factor for the wettability of the printing substrate, and it is preferred to use one or more kinds of aprotic solvents. From the viewpoint of storage stability, it is preferred to use one or more kinds of protons. Solvent. It is preferable to use one or more kinds of aprotic solvents and one or more kinds of protic solvents. As Examples of the protic solvent include the above alcohols and guanamines, and preferred examples thereof include acetol, 3-hydroxy-3-methyl-2-butanone, and 4-hydroxy-3-methyl-2-butanone. , 5-hydroxy-2-pentanone, 4-hydroxy-4-methyl-2-pentanone (diacetone alcohol), ethyl lactate, butyl lactate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl Ether, propylene glycol mono-n-butyl ether, propylene glycol mono-tert-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, 3-methoxy-1-butyl Alcohol, 3-methyl-3-methoxy-1-butanol, and the like.

另外,作為非質子性溶劑,可列舉:上述的烴、芳香族烴、醚、酯、酮,較佳為可列舉:乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、二乙二醇甲基乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二丙二醇二甲醚、二乙二醇二丁醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、丙二醇單丙醚乙酸酯、二丙二醇單甲醚乙酸酯、乙酸戊酯等。 Further, examples of the aprotic solvent include the above hydrocarbons, aromatic hydrocarbons, ethers, esters, and ketones, and examples thereof include ethyl acetate, n-propyl acetate, isopropyl acetate, and n-butyl acetate. Diethylene glycol methyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate Ester, propylene glycol monopropyl ether acetate, dipropylene glycol monomethyl ether acetate, amyl acetate, and the like.

本發明的油墨用組成物可進一步包含具有下述通式(9)所示的熱交聯性基的(C)熱硬化劑。 The ink composition of the present invention may further comprise a (C) thermal curing agent having a heat crosslinkable group represented by the following formula (9).

-(CH2-OR18) (9) -(CH 2 -OR 18 ) (9)

上述通式(9)中,R18表示氫原子或碳數為1~4的烷基。就樹脂組成物的經時穩定性與熱硬化劑的反應性的觀點而言,較佳為甲基或乙基。 In the above formula (9), R 18 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. From the viewpoint of the temporal stability of the resin composition and the reactivity of the thermosetting agent, a methyl group or an ethyl group is preferred.

本發明的油墨用組成物藉由含有(C)熱硬化劑,而可 獲得高的耐熱循環性,並可形成反覆熱負載後的耐龜裂性優異的硬化被膜。本發明中的(C)熱硬化劑若具有上述通式(9)所示的熱交聯性基,則並無特別限定,就可進一步提高可見透光率的方面而言,更佳為具有下述通式(10)所示的熱交聯性基者。 The composition for ink of the present invention can be obtained by containing (C) a heat hardener A high heat cycle resistance is obtained, and a hardened film excellent in crack resistance after repeated heat load can be formed. The (C) thermal curing agent in the present invention is not particularly limited as long as it has the thermal crosslinkable group represented by the above formula (9), and it is more preferable to further improve the visible light transmittance. The thermally crosslinkable group represented by the following formula (10).

通式(10)中,R19、R20表示氫原子或碳數為1~4的烷基。就組成物的經時穩定性與熱硬化劑的反應性的觀點而言,較佳為甲基或乙基。 In the formula (10), R 19 and R 20 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. From the viewpoint of the stability with time of the composition and the reactivity of the thermosetting agent, a methyl group or an ethyl group is preferred.

另外,為了進一步提高硬化被膜的可見透光率,上述(C)熱硬化劑較佳為不含酚性羥基。 Further, in order to further increase the visible light transmittance of the cured film, the above (C) heat hardener preferably does not contain a phenolic hydroxyl group.

以下表示(C)熱硬化劑的具體例。 Specific examples of the (C) thermal curing agent are shown below.

上述中,具有通式(10)所示的熱交聯性基的「NIKALAC」(註冊商標。以下相同)MX-290、「NIKALAC」MX-280、「NIKALAC」MX-270(以上為商品名、三和化工(SANWA CHEMICAL)(股)製造),可進一步提高硬化被膜的可見透光率,故而較佳。 In the above, "NIKALAC" (registered trademark. The same applies MX-290, "NIKALAC" MX-280, "NIKALAC" MX-270 (the above is the trade name) having the thermal crosslinkable group represented by the formula (10). , Sanhe Chemical (SANWA It is preferable to further improve the visible light transmittance of the hardened film by chemical).

本發明中,(c)熱硬化劑的含量在組成物中的固體成分中較佳為0.1質量%以上,更佳為0.5質量%以上。並且(c)熱硬化劑的含量較佳為30質量%以下,更佳為20質量%以下。 In the present invention, the content of the (c) thermal curing agent is preferably 0.1% by mass or more, and more preferably 0.5% by mass or more, based on the solid content of the composition. Further, the content of the (c) thermal curing agent is preferably 30% by mass or less, more preferably 20% by mass or less.

另外,為了對本發明的組成物賦予硬化促進性,亦可含有光硬化劑。例如藉由含有(D)光酸產生劑或光鹼產生劑,而可賦予光硬化促進。 Further, in order to impart curing-promoting properties to the composition of the present invention, a light-curing agent may be contained. For example, by containing a (D) photoacid generator or a photobase generator, photohardening promotion can be imparted.

作為(D)光酸產生劑,可列舉:鎓鹽化合物、含有鹵素的化合物、重氮甲酮化合物、重氮甲烷化合物、碸化合物、磺酸酯化合物、磺醯亞胺化合物等作為例子。作為這些光酸產生劑的具體例,可列舉:日本專利特開2007-246877號公報或美國專利說明書7374856B2所例示的化合物,或SI-100、SI-101、SI-105、SI-106、SI-109、PI-105、PI-106、PI-109、NAI-100、NAI-1002、NAI-1003、NAI-1004、NAI-101、NAI-105、NAI-106、NAI-109、NDI-101、NDI-105、NDI-106、NDI-109、PAI-01、PAI-101、PAI-106、PAI-1001(以上為商品名、綠化學(Midori Kagaku)(股)製造),SP-077、SP-082(以上為商品名、艾迪科(ADEKA)(股)製造),TPS-PFBS(以上為商品名、東洋合成工業(股)製造),CGI-MDT(以上為商品名、賀利氏(Heraeus)(股)製造),WPAG-281、WPAG-336、WPAG-339、WPAG-342、WPAG-344、WPAG-350、WPAG-370、WPAG-372、WPAG-449、WPAG-469、WPAG-505、 WPAG-506(以上為商品名、和光純藥工業(股)製造),亦可含有2種以上光酸產生劑。相對於聚矽氧烷的總量100質量份,光酸產生劑的含量通常為0.01質量份~20質量份。 Examples of the (D) photoacid generator include an onium salt compound, a halogen-containing compound, a diazomethanone compound, a diazomethane compound, a hydrazine compound, a sulfonate compound, and a sulfonimide compound. Specific examples of such a photoacid generator include compounds exemplified in Japanese Patent Laid-Open Publication No. 2007-246877 or U.S. Patent Specification No. 7,374,856 B2, or SI-100, SI-101, SI-105, SI-106, SI. -109, PI-105, PI-106, PI-109, NAI-100, NAI-1002, NAI-1003, NAI-1004, NAI-101, NAI-105, NAI-106, NAI-109, NDI-101 , NDI-105, NDI-106, NDI-109, PAI-01, PAI-101, PAI-106, PAI-1001 (above, trade name, manufactured by Midori Kagaku Co., Ltd.), SP-077, SP-082 (The above is the trade name, manufactured by ADEKA (share)), TPS-PFBS (above is the trade name, manufactured by Toyo Synthetic Industrial Co., Ltd.), CGI-MDT (above is the trade name, Heraeus) (made by Heraeus), WPAG-281, WPAG-336, WPAG-339, WPAG-342, WPAG-344, WPAG-350, WPAG-370, WPAG-372, WPAG-449, WPAG-469, WPAG-505, WPAG-506 (the above is a trade name, manufactured by Wako Pure Chemical Industries Co., Ltd.), and may contain two or more kinds of photoacid generators. The content of the photoacid generator is usually from 0.01 part by mass to 20 parts by mass per 100 parts by mass of the total amount of the polysiloxane.

本發明的組成物中亦可含有促進組成物的固體成分的硬化、或使硬化變得容易的除(C)成分、(D)成分以外的交聯劑或硬化劑、硬化助劑。作為具體例,可列舉:矽酮樹脂硬化劑、金屬醇化物、金屬螯合化合物、異氰酸酯化合物及其聚合物、多官能丙烯酸系樹脂、藉由熱而產生強酸的熱酸產生劑等。亦可含有2種以上這些成分。其中較佳為熱酸產生劑。作為熱酸產生劑,例如可列舉:「San-Aid」(註冊商標)SI-200、SI-210、SI-220、SI-300(以上為商品名、三新化學(股)製造)等。 The composition of the present invention may contain a crosslinking agent, a curing agent other than the component (C), a hardening agent, or a curing agent, which promotes hardening of the solid component of the composition or facilitates curing. Specific examples thereof include an anthrone resin hardener, a metal alkoxide, a metal chelate compound, an isocyanate compound and a polymer thereof, a polyfunctional acrylic resin, and a thermal acid generator which generates a strong acid by heat. It is also possible to contain two or more of these components. Among them, a thermal acid generator is preferred. Examples of the thermal acid generator include "San-Aid" (registered trademark) SI-200, SI-210, SI-220, and SI-300 (the above are trade names, manufactured by Sanshin Chemical Co., Ltd.).

另外,作為金屬醇化物的較佳的具體例,可列舉:二乙醇鎂、三異丙醇鋁、四(正丁醇)氧化鋯、四(第三丁醇)氧化鋯、四異丙醇鉿、四異丙醇鈦等。金屬螯合化合物可藉由使金屬烷氧化合物與螯合化劑反應而容易獲得。作為金屬螯合化劑的例子,可使用:乙醯丙酮、苯甲醯丙酮、二苯甲醯甲烷等β-二酮,乙醯乙酸乙酯、苯甲醯乙酸乙酯等β-酮酸酯等。具體而言,例如可列舉:乙基乙醯乙酸二異丙醇鋁、三(乙基乙醯乙酸)鋁、烷基乙醯乙酸二異丙醇鋁、單乙醯乙酸雙(乙基乙醯乙酸)鋁、三(乙醯丙酮酸)鋁等鋁螯合化合物,乙基乙醯乙酸單異丙醇鎂、雙(乙基乙醯乙酸)鎂、烷基乙醯乙酸單異丙醇鎂、雙(乙醯丙酮酸)鎂等鎂螯合化合物,四(乙基乙醯乙酸)氧化鋯、四(乙醯丙酮酸)氧化鋯等氧化鋯螯合化合 物,四(乙基乙醯乙酸)鈦、四(乙醯丙酮酸)鈦等鈦螯合化合物。 Further, as preferred specific examples of the metal alkoxide, magnesium dimethoxide, aluminum triisopropoxide, zirconium tetra(n-butoxide), zirconium tetra(tert-butoxide), and strontium tetraisopropoxide may be mentioned. , titanium tetraisopropoxide, and the like. The metal chelate compound can be easily obtained by reacting a metal alkoxide with a chelating agent. As an example of the metal chelating agent, β-ketoacetate such as acetamidineacetone, benzamidineacetone or benzotrimethane, β-ketoacetate such as ethyl acetate or ethyl benzoate may be used. Wait. Specific examples thereof include ethyl acetoacetate aluminum diisopropoxide, aluminum tris(ethyl acetoacetate), aluminum alkyl acetoacetate, aluminum diisopropylate, and acetoacetic acid bis(ethyl acetonitrile). Aluminum chelating compound such as aluminum acetate, aluminum tris(acetate pyruvate), ethyl acetoacetate magnesium monoisopropoxide, magnesium bis(ethyl acetonitrile acetate), magnesium alkyl acetoacetate monoisopropoxide, Magnesium chelate compound such as bis(acetonitrile pyruvate)magnesium, zirconia chelate compound such as tetrakis(ethylacetamidineacetate) zirconia or tetrakis(acetylpyruvate) zirconia A titanium chelate compound such as tetrakis(ethylacetamidineacetic acid) titanium or tetrakis(acetylpyruvate) titanium.

這些金屬化合物可單獨使用,並且亦可將2種以上金屬化合物加以混合而使用。金屬化合物的含量較佳為聚矽氧烷的0.1質量%~30質量%。若含量為0.1質量%以下,則硬化會充分地進行,而可獲得具有良好的耐化學品性或絕緣性的硬化被膜。另一方面,若含量為30質量%以下,則作為油墨用組成物,而保存穩定性變得良好。這些金屬化合物發揮出作為聚矽氧烷的硬化劑的作用,可獲得藉由硬化被膜的交聯所得的耐久性的提高的效果、及提高遷移率或開關比等TFT特性的效果。 These metal compounds may be used singly or in combination of two or more kinds of metal compounds. The content of the metal compound is preferably from 0.1% by mass to 30% by mass based on the polysiloxane. When the content is 0.1% by mass or less, the hardening is sufficiently performed, and a cured film having good chemical resistance or insulating properties can be obtained. On the other hand, when the content is 30% by mass or less, the composition for the ink is excellent in storage stability. These metal compounds function as a curing agent for polysiloxane, and an effect of improving durability by crosslinking of the cured film and an effect of improving TFT characteristics such as mobility or switching ratio can be obtained.

本發明的油墨用組成物較佳為含有表面調整劑。此處,所謂表面調整劑,是指藉由添加於溶液中而可控制該溶液的表面張力的界面活性劑,可列舉:氟系界面活性劑、矽酮系界面活性劑、烷基系界面活性劑及極性基改質矽酮等,就大幅降低表面張力的觀點而言,較佳為氟系界面活性劑、矽酮系界面活性劑、極性基改質矽酮。 The ink composition of the present invention preferably contains a surface conditioning agent. Here, the surface conditioning agent refers to a surfactant capable of controlling the surface tension of the solution by being added to a solution, and examples thereof include a fluorine-based surfactant, an anthrone-based surfactant, and an alkyl-based interface activity. From the viewpoint of greatly reducing the surface tension, a fluorine-based surfactant, an anthrone-based surfactant, and a polar-based modified fluorenone are preferable from the viewpoint of greatly reducing the surface tension.

作為氟系界面活性劑,例如可列舉:「MEGAFAC」(註冊商標)F-444、MEGAFAC F-472、MEGAFAC F-477、MEGAFAC F-552、MEGAFAC F-553、MEGAFAC F-554、MEGAFAC F-555、MEGAFAC F-443、MEGAFAC F-470、MEGAFAC F-475、MEGAFAC F-482、MEGAFAC F-483、MEGAFAC F-489、MEGAFAC R-30(以上為大日本油墨化學(Dainippon Ink and Chemicals,DIC)(股)製造),「Eftop」(註冊商標)EF301、Eftop 303、Eftop 352(以上 為新秋田化成(股)製造),「Fluorad」(註冊商標)FC-430、Fluorad FC-431(以上為住友3M(股)製造),「Asahiguard」(註冊商標)AG710、「Surflon」(註冊商標)S-382、Surflon SC-101、Surflon SC-102、Surflon SC-103、Surflon SC-104、Surflon SC-105、Surflon SC-106(以上為旭硝子(股)製造),BM-1000、BM-1100(以上為裕商(股)製造),NBX-15、FTX-218(以上為勒奧斯(NEOS)(股)製造)。 Examples of the fluorine-based surfactant include "MEGAFAC" (registered trademark) F-444, MEGAFAC F-472, MEGAFAC F-477, MEGAFAC F-552, MEGAFAC F-553, MEGAFAC F-554, and MEGAFAC F- 555, MEGAFAC F-443, MEGAFAC F-470, MEGAFAC F-475, MEGAFAC F-482, MEGAFAC F-483, MEGAFAC F-489, MEGAFAC R-30 (above is Dainippon Ink and Chemicals, DIC ) (manufacturing), "Eftop" (registered trademark) EF301, Eftop 303, Eftop 352 (above) "made for the new Akita Chemicals Co., Ltd.", "Fluorad" (registered trademark) FC-430, Fluorad FC-431 (above is Sumitomo 3M (share)), "Asahiguard" (registered trademark) AG710, "Surflon" (registered Trademarks) S-382, Surflon SC-101, Surflon SC-102, Surflon SC-103, Surflon SC-104, Surflon SC-105, Surflon SC-106 (above manufactured by Asahi Glass), BM-1000, BM -1100 (above is manufactured by Yushang Co., Ltd.), NBX-15, FTX-218 (above is manufactured by NEOS).

作為矽酮系界面活性劑,例如可列舉:BYK-300、BYK-302、BYK-306、BYK-307、BYK-310、BYK-330、BYK-331、BYK-333、BYK-337、BYK-341、BYK-344、BYK-370、BYK-375(以上為日本畢克化學(BYK-Chemie Japan)(股)),FZ-2110、FZ-2166、FZ-2154、FZ-2120、L-720、L-7002、SH8700、L-7001、FZ-2123、SH8400、FZ-77、FZ-2164、FZ-2203、FZ-2208(以上為東麗道康寧(Dow Corning Toray)(股)),KF-353、KF-615A、KF-640、KF-642、KF-643、KF-6020、X-22-6191、KF-6011、KF-6015、X-22-2516、KF-410、X-22-821、KF-412、KF-413、KF-4701(以上為信越化學(股))。 Examples of the anthrone-based surfactant include BYK-300, BYK-302, BYK-306, BYK-307, BYK-310, BYK-330, BYK-331, BYK-333, BYK-337, and BYK-. 341, BYK-344, BYK-370, BYK-375 (above is BYK-Chemie Japan), FZ-2110, FZ-2166, FZ-2154, FZ-2120, L-720 , L-7002, SH8700, L-7001, FZ-2123, SH8400, FZ-77, FZ-2164, FZ-2203, FZ-2208 (above is Dow Corning Toray (share)), KF- 353, KF-615A, KF-640, KF-642, KF-643, KF-6020, X-22-6191, KF-6011, KF-6015, X-22-2516, KF-410, X-22- 821, KF-412, KF-413, KF-4701 (above is Shin-Etsu Chemical Co., Ltd.).

作為極性基改質矽酮,為將重複單元中具有下述通式(11)的聚烷基矽氧烷的飽和烴基的一部分轉變為具有極性基的烴基者。由於未經極性基改質的矽酮與聚矽氧烷或溶劑的相互作用小,因此存在容易引起相分離等的問題。轉變為含有極性基的官能基的部位,可為主鏈末端、主鏈中、側鏈的任一部位。另外, 改質基當量通常為500g/mol~10,000g/mol,但並不限定這些。 The polar group-modified fluorenone is a group in which a part of a saturated hydrocarbon group having a polyalkyl siloxane of the following formula (11) in a repeating unit is converted into a hydrocarbon group having a polar group. Since the interaction of an anthrone having no polar group modification with a polyoxyalkylene or a solvent is small, there is a problem that phase separation or the like is likely to occur. The moiety which is converted into a functional group containing a polar group may be any part of the main chain end, the main chain, or the side chain. In addition, The modified base equivalent is usually from 500 g/mol to 10,000 g/mol, but is not limited thereto.

x為2以上的整數。R21及R22分別獨立地表示碳數為1~10的飽和烴基。就表面張力降低性的觀點而言,較佳為R21及R22的全部的50莫耳%以上為甲基。 x is an integer of 2 or more. R 21 and R 22 each independently represent a saturated hydrocarbon group having 1 to 10 carbon atoms. From the viewpoint of surface tension reducing property, it is preferred that 50 mol% or more of all of R 21 and R 22 be a methyl group.

此處,所謂極性基,可例示:胺基、羥基、巰基、羧基、酯基、醯胺基、環氧基、丙烯基、甲基丙烯基等。這些極性基可直接鍵結於矽氧烷主鏈上,亦可經由伸烷基、伸芳基等碳鏈而鍵結。另外,一分子中可具有二種以上極性基。這些中,就以相對少的量而對塗佈性的提高有效的方面而言,可較佳地使用胺基改質矽酮、巰基改質矽酮。具體可例示:FZ-3760、BY16-849、BY16-892、FZ-3785、BY16-891、FZ-3789(以上為東麗道康寧(股)),KF-868、KF-860、X-22-3939A、KF-2001、KF-8010、X-22-161B、KF-8012、X-22-167B(以上為信越化學(股))。 Here, the polar group may, for example, be an amine group, a hydroxyl group, a mercapto group, a carboxyl group, an ester group, a decylamino group, an epoxy group, a propenyl group or a methacryl group. These polar groups may be directly bonded to the siloxane chain, or may be bonded via a carbon chain such as an alkyl group or an aryl group. Further, two or more polar groups may be present in one molecule. Among these, an amine-based modified fluorenone or a thiol-modified fluorenone can be preferably used from the viewpoint that the coating property is improved in a relatively small amount. Specific examples are: FZ-3760, BY16-849, BY16-892, FZ-3785, BY16-891, FZ-3789 (above is Toray Dow Corning (share)), KF-868, KF-860, X-22- 3939A, KF-2001, KF-8010, X-22-161B, KF-8012, X-22-167B (above is Shin-Etsu Chemical Co., Ltd.).

這些表面調整劑可單獨使用,亦可將2種以上加以混合而使用。另外,就形成無收縮的均質的塗佈面的觀點而言,表面調整劑在油墨用組成物中的含量較佳為0.1質量%以上,更佳為1 質量%以上,尤佳為2質量%以上,進而較佳為3質量%以上,特佳為4質量%以上,最佳為8質量%以上。另外,就保持良好的轉印性且不會對所形成的塗膜的功能造成不良影響的觀點而言,較佳為30質量%以下,更佳為20質量%以下。 These surface conditioning agents may be used singly or in combination of two or more. Further, from the viewpoint of forming a uniform coated surface having no shrinkage, the content of the surface conditioner in the ink composition is preferably 0.1% by mass or more, more preferably 1 The mass% or more is more preferably 2% by mass or more, further preferably 3% by mass or more, particularly preferably 4% by mass or more, and most preferably 8% by mass or more. In addition, from the viewpoint of maintaining good transferability and not adversely affecting the function of the formed coating film, it is preferably 30% by mass or less, and more preferably 20% by mass or less.

本發明的組成物中,聚矽氧烷成為硬化被膜的成分,是不揮發性成分。所謂不揮發成分,是將組成物的被膜在200℃以上的溫度下加熱處理1小時後,不進行氣化而殘存的成分。經硬化的聚矽氧烷可直接殘存,此外,以上所說明的熱硬化劑或光酸產生劑、熱酸產生劑、表面調整劑等亦可殘留。而且,在加熱硬化、或光硬化時所生成者亦可殘存。 In the composition of the present invention, polyoxyalkylene is a component of the cured film and is a nonvolatile component. The non-volatile component is a component which remains after the film of the composition is heat-treated at a temperature of 200 ° C or higher for 1 hour without being vaporized. The hardened polyoxyalkylene may remain as it is, and the above-mentioned thermosetting agent, photoacid generator, thermal acid generator, surface conditioner, etc. may remain. Further, it may be left in the case of heat hardening or photohardening.

就塗佈性與膜形成性的觀點而言,本發明的不揮發性成分相對於油墨用組成物的含量較佳為1質量%~90質量%,更佳為5質量%~70質量%。若含量過低,則塗膜變得過薄而膜厚不均變大。另外,若含量過多,則產生以下等不良狀況:因流動性降低而難以引起塗膜的流平而產生塗佈不均,或者塗佈膜厚無均勻性而無法實現微細的圖案硬化被膜。 The content of the nonvolatile component of the present invention relative to the ink composition is preferably from 1% by mass to 90% by mass, and more preferably from 5% by mass to 70% by mass, from the viewpoint of coatability and film formability. When the content is too low, the coating film becomes too thin and the film thickness unevenness becomes large. In addition, when the content is too large, there is a problem that the coating film is not easily leveled due to a decrease in fluidity, uneven coating is caused, or the coating film thickness is not uniform, and a fine pattern-hardened film cannot be realized.

接著,對本發明的硬化被膜進行說明。本發明的硬化被膜藉由以下方式而獲得:使用本發明的組成物,使用凹版印刷、噴墨印刷、網版印刷、套版印刷、反轉套版印刷法、剝離套版印刷法、微接觸印刷法等任一種方法,在被印刷物上印刷圖案被膜,將其在烘箱或加熱板上在100℃~400℃的範圍下進行熱處理,或者使用PLA等紫外可見曝光機,對整個面曝光10J/m2~20000J/m2 左右(波長為365nm時的測定曝光量),而進行光硬化。就可形成印刷被膜的微細圖案的觀點而言,更佳為反轉套版印刷法、剝離套版印刷法、微接觸印刷法。 Next, the cured film of the present invention will be described. The hardened film of the present invention is obtained by using the composition of the present invention, using gravure printing, inkjet printing, screen printing, stencil printing, reverse offset printing, peeling offset printing, microcontacting Any method such as printing method, printing a pattern film on a printed matter, heat-treating it in an oven or a hot plate at a range of 100 ° C to 400 ° C, or exposing the entire surface to 10 J/ using an ultraviolet visible exposure machine such as PLA. Photohardening was carried out at about m 2 to 20000 J/m 2 (measured exposure at a wavelength of 365 nm). From the viewpoint of forming a fine pattern of a printing film, it is more preferably a reverse offset printing method, a peeling offset printing method, or a microcontact printing method.

使用本發明的組成物而製作的硬化被膜,較佳為波長為400nm時每1μm膜厚的透光率為90%以上,更佳為92%以上。若透光率低於90%,則用作液晶顯示元件的TFT基板用平坦化膜時,會在背光通過時引起色變化,而白色顯示帶有黃色調。 The cured film produced by using the composition of the present invention preferably has a light transmittance of 90% or more, more preferably 92% or more, per 1 μm of the film thickness at a wavelength of 400 nm. When the light transmittance is less than 90%, when a flattening film for a TFT substrate is used as a liquid crystal display element, a color change is caused when the backlight passes, and a white color is displayed with a yellow color.

上述波長為400nm時每1μm膜厚的透射率可藉由以下方法而求出。在TEMPAX玻璃板上,使用旋塗機,以獲得所期望的膜厚的轉速,旋塗組成物,使用加熱板,在100℃下預烘烤2分鐘。使用烘箱在空氣中在220℃下熱硬化1小時而製作膜厚為1μm的硬化被膜。使用島津製作所(股)製造的「MultiSpec」(註冊商標)-1500,測定所得的硬化被膜的紫外可見吸收光譜,求出波長為400nm時的透射率。 The transmittance per 1 μm film thickness at the above wavelength of 400 nm can be obtained by the following method. On a TEMPAX glass plate, a spin coater was used to obtain a desired film thickness, and the composition was spin-coated, and preheated at 100 ° C for 2 minutes using a hot plate. The hardened film having a film thickness of 1 μm was formed by heat-hardening in an air at 220 ° C for 1 hour in an air oven. The "Viscovisible absorption spectrum" of the obtained cured film was measured using "MultiSpec" (registered trademark)-1500 manufactured by Shimadzu Corporation, and the transmittance at a wavelength of 400 nm was determined.

作為印刷的例子,可根據專利文獻1~專利文獻3或非專利文獻1所記載的方法進行。 The printing example can be carried out according to the methods described in Patent Document 1 to Patent Document 3 or Non-Patent Document 1.

對使用本發明的矽氧烷組成物作為油墨的印刷方法的一例進行說明。圖1是作為印刷方法的一例的反轉套版印刷法的概略圖。如圖1中的(a)所示,在捲繞於橡皮布滾筒(blanket cylinder)1上的矽酮橡皮布(silicone blanket)2上使用油墨塗佈機3塗佈油墨4。接著,如圖1中的(b)所示,將除去凸版5抵壓於矽酮橡皮布2上,而將未畫線部油墨4"除去。接著,如圖1 中的(c)所示,將殘留於矽酮橡皮布2上的畫線部油墨4'轉印至被印刷物6,而形成印刷圖案7。 An example of a printing method using the siloxane composition of the present invention as an ink will be described. FIG. 1 is a schematic view of a reverse offset printing method as an example of a printing method. As shown in (a) of FIG. 1, the ink 4 is applied using an ink coater 3 on a silicone blanket 2 wound on a blanket cylinder 1. Next, as shown in (b) of FIG. 1, the relief 5 is removed against the fluorenone blanket 2, and the unlined ink 4" is removed. Next, as shown in FIG. As shown in (c), the ink portion 4' remaining on the fluorenone blanket 2 is transferred to the to-be-printed material 6 to form a printed pattern 7.

圖2是作為另外一例的剝離套版印刷的概略圖。如圖2中的(a)所示,藉由對在支撐體8上至少依序具有親油墨層9與油墨剝離層10的印刷版原版進行圖案加工,而獲得形成了油墨剝離性部位與親油墨性部位的印刷版。如圖2中的(b)所示,使用刮刀塗佈機11在印刷版的整個面上塗佈油墨4。如圖2中的(c)所示,將捲繞於轉印筒1的矽酮橡皮布2抵壓於印刷版而選擇性地轉印油墨剝離性部位上的油墨(畫線部油墨4')。此處,所謂選擇性地轉印油墨剝離性部位上的油墨(畫線部油墨4'),是指實質上不轉印未畫線部油墨4",而實質上僅轉印油墨剝離性部位上的油墨(畫線部油墨4')。圖2中的(d)中,將轉印至矽酮橡皮布2上的油墨(畫線部油墨4')再轉印至被印刷物6,而形成印刷圖案7。 Fig. 2 is a schematic view showing another example of peeling offset printing. As shown in (a) of FIG. 2, by performing patterning on the printing plate precursor having at least the ink-receiving layer 9 and the ink-releasing layer 10 on the support 8, the ink-disbonding portion and the pro-form are obtained. A printing plate for inky parts. As shown in (b) of FIG. 2, the ink 4 is applied to the entire surface of the printing plate using a knife coater 11. As shown in (c) of FIG. 2, the fluorenone blanket 2 wound around the transfer cylinder 1 is pressed against the printing plate to selectively transfer the ink on the ink releasable portion (line portion ink 4' ). Here, the selective transfer of the ink on the ink releasable portion (the line portion ink 4') means that the unlined ink 4" is not substantially transferred, and only the ink releasable portion is transferred. The upper ink (line portion ink 4'). In (d) of Fig. 2, the ink (the line portion ink 4') transferred onto the fluorenone blanket 2 is re-transferred to the to-be-printed object 6, and A printed pattern 7 is formed.

圖3是進一步作為另外一例的微接觸印刷法的概略圖。如圖3中的(a)所示,將包含聚二甲基矽氧烷(Polydimethylsiloxane,PDMS)的凸版12抵壓於油墨標記台13。如圖3中的(b)及圖3中的(c)所示,將在凸版的凸部載置有畫線部油墨4'的凸版12抵壓於被印刷物6。圖3中的(d)中,拆卸PDMS凸版12而形成印刷圖案7。 Fig. 3 is a schematic view showing a microcontact printing method as another example. As shown in (a) of FIG. 3, the relief 12 containing polydimethylsiloxane (PDMS) is pressed against the ink marking stage 13. As shown in (b) of FIG. 3 and (c) of FIG. 3, the relief 12 on which the ink of the drawing portion 4' is placed on the convex portion of the relief is pressed against the to-be-printed object 6. In (d) of FIG. 3, the PDMS relief 12 is detached to form a printed pattern 7.

本發明中所用的被印刷物並無特別限定,在電子元件或光學元件用途中需要印刷物的熱處理時,較佳為具有耐熱性的材 料。作為此種材料,例如可列舉:聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)、聚萘二甲酸乙二酯(Polyethylene Naphthalate,PEN)、聚苯硫醚(Polyphenylene Sulfide,PPS)、聚醚碸(Polyether Sulfone,PES)、聚醯亞胺(Polyimide,PI)、聚芳族聚醯胺、聚碳酸酯(Polycarbonate,PC)、環烯烴聚合物等耐熱塑膠的膜或片,鹼石灰或石英等的玻璃板,矽晶圓等。 The object to be printed used in the present invention is not particularly limited, and when heat treatment of the printed matter is required for use in an electronic component or an optical component, it is preferably a material having heat resistance. material. Examples of such a material include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), and poly Membrane or sheet of heat-resistant plastic such as Polyether Sulfone (PES), Polyimide (PI), polyaramid, Polycarbonate (PC), cycloolefin polymer, etc. Glass plates such as quartz, silicon wafers, etc.

另外,在基板上藉由其他方法形成某個圖案後,可在其上使用本發明的組成物進行印刷。例如可列舉:在薄膜電晶體的製造中在閘極電極上形成閘極絕緣膜的情形、在液晶顯示器的製造中在畫素TFT上形成層間絕緣膜或平坦化膜的情形、在觸控感測器的製造中在氧化銦錫(Indium Tin Oxide,ITO)圖案上形成絕緣膜或保護膜的情形等。 Further, after a certain pattern is formed on the substrate by another method, the composition of the present invention can be used for printing thereon. For example, a case where a gate insulating film is formed on a gate electrode in the manufacture of a thin film transistor, an interlayer insulating film or a planarizing film formed on a pixel TFT in the manufacture of a liquid crystal display, and a touch feeling are mentioned. In the manufacture of the detector, an insulating film or a protective film is formed on an Indium Tin Oxide (ITO) pattern.

本發明的硬化被膜可較佳地用作TFT的閘極絕緣膜。本發明的TFT的半導體可為多晶矽、非晶矽、有機半導體、氧化物半導體的任一種。另外,可為頂部閘極型或底部閘極型等的任一種構成。 The hardened film of the present invention can be preferably used as a gate insulating film of a TFT. The semiconductor of the TFT of the present invention may be any of polycrystalline germanium, amorphous germanium, organic semiconductor, or oxide semiconductor. Further, it may be of any of a top gate type or a bottom gate type.

另外,本發明的硬化被膜可較佳地用於電子元件或光學元件。所謂電子元件,例如可列舉:液晶顯示器或有機電致發光(Electroluminescence,EL)顯示器等的顯示元件、半導體元件、太陽電池、彩色濾光片、觸控感測器等。所謂光學元件,例如可列舉:抗反射膜、抗反射板、濾光器、或影像感測器等中所用的微透鏡陣列等。但均不限定於這些。作為本發明的硬化被膜的具 體的用途,例如為:液晶顯示器或有機EL顯示器等的顯示元件中的TFT用平坦化膜或半導體元件中的層間絕緣膜、彩色濾光片的保護層、光間隔物、觸控感測器的保護膜或絕緣膜、抗反射膜、抗反射板、濾光器的抗反射層(最表層)等。另外,亦可用於微透鏡陣列或太陽電池的最表層。 Further, the hardened film of the present invention can be preferably used for an electronic component or an optical component. Examples of the electronic component include a display element such as a liquid crystal display or an organic electroluminescence (EL) display, a semiconductor element, a solar cell, a color filter, a touch sensor, and the like. Examples of the optical element include an antireflection film, an antireflection plate, a filter, a microlens array used in an image sensor, and the like. However, they are not limited to these. As a hardened film of the present invention The use of the body is, for example, a flattening film for a TFT in a display element such as a liquid crystal display or an organic EL display, or an interlayer insulating film in a semiconductor element, a protective layer of a color filter, a photo spacer, and a touch sensor. Protective film or insulating film, anti-reflection film, anti-reflection plate, anti-reflection layer (most surface layer) of the filter, and the like. In addition, it can also be used for the microscopic lens array or the outermost layer of solar cells.

[實施例] [Examples]

以下,使用實施例對本發明進行說明。 Hereinafter, the present invention will be described using examples.

<聚矽氧烷溶液(a)的製備> <Preparation of polyoxyalkylene solution (a)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷54.48g(0.40莫耳)、1-萘基三甲氧基矽烷74.51g(0.30莫耳)、苯基三甲氧基矽烷59.49g(0.30莫耳)、二丙酮醇(以下為DAA)176.36g,在浴溫度40℃下歷時30分鐘添加在水54.00g中溶解有磷酸0.56g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(a)。對於聚矽氧烷中的有機矽烷結構的比率,進行1H-NMR、13C-NMR、29Si-NMR的測定,根據整體的積分值,算出相對於各有機矽烷的積分值的比例並計算比率。其結果是源自甲基三甲氧基矽烷的結構為40莫耳%,源自1-萘基三甲氧基矽烷的結構為30莫耳%,源自苯基三甲氧基矽烷的結構為30莫耳%。 In a separable flask, 54.48 g (0.40 mol) of methyltrimethoxydecane, 74.51 g (0.30 mol) of 1-naphthyltrimethoxydecane, and 59.49 g of phenyltrimethoxydecane (0.30 mol) were added. 176.36 g of diacetone alcohol (hereinafter referred to as DAA), and a phosphoric acid solution in which 0.56 g of phosphoric acid was dissolved in 54.00 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (a) having a solid concentration of 50%. The ratio of the organic decane structure in the polyoxyalkylene was measured by 1 H-NMR, 13 C-NMR, and 29 Si-NMR, and the ratio of the integral value to each organic decane was calculated from the overall integrated value and calculated. ratio. As a result, the structure derived from methyltrimethoxydecane was 40 mol%, the structure derived from 1-naphthyltrimethoxydecane was 30 mol%, and the structure derived from phenyltrimethoxydecane was 30 mol. ear%.

以下表示29SiNMR的測定條件。試樣(液體)是注入至直徑為10mm的「Teflon」(註冊商標)製NMR樣品管中而用於測定。 The measurement conditions of 29 Si NMR are shown below. The sample (liquid) was injected into a NMR sample tube made of "Teflon" (registered trademark) having a diameter of 10 mm for measurement.

裝置:日本電子公司製造的JNM GX-270、測定法:閘控去偶法(gated decoupling method) Device: JNM GX-270 manufactured by JEOL, measuring method: gated decoupling method

測定核頻率:53.6693MHz(29Si核)、光譜寬度:20000Hz Determination of nuclear frequency: 53.6693MHz ( 29 Si core), spectral width: 20000Hz

脈衝寬度:12μsec(45°脈衝)、脈衝重複時間:30.0sec Pulse width: 12μsec (45° pulse), pulse repetition time: 30.0sec

基準物質:四甲基矽烷、測定溫度:室溫、試樣轉速:0.0Hz。 Reference material: tetramethyl decane, measurement temperature: room temperature, sample rotation speed: 0.0 Hz.

<聚矽氧烷溶液(b)的製備> <Preparation of polyoxyalkylene solution (b)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷81.72g(0.60莫耳)、1-萘基三甲氧基矽烷74.51g(0.30莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.10莫耳)、3-甲氧基丁醇(以下為MB)165.36g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.54g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(b)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷 的矽原子為60莫耳%,源自1-萘基三甲氧基矽烷的結構為30莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為10莫耳%。 In a separable flask, 81.72 g (0.60 mol) of methyltrimethoxydecane, 74.51 g (0.30 mol) of 1-naphthyltrimethoxydecane, and 2-(3,4-epoxycyclohexyl) were added. Ethyltrimethoxydecane 24.46g (0.10 mole), 3-methoxybutanol (hereinafter MB) 165.36g, added in a bath temperature of 40 ° C for 30 minutes, dissolved in water 55.80g dissolved in 0.54g of phosphoric acid Phosphoric acid solution. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (b) having a solid concentration of 50%. The ratio of the organodecane structure in the polyaluminoxane was determined in the same manner as in Example 1, derived from methyltrimethoxydecane. The germanium atom is 60 mol%, the structure derived from 1-naphthyltrimethoxydecane is 30 mol%, and the germanium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane It is 10% by mole.

<聚矽氧烷溶液(c)的製備> <Preparation of polyoxyalkylene solution (c)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷54.48g(0.4莫耳)、1-萘基三甲氧基矽烷124.18g(0.50莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.10莫耳)、DAA 192.67g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.61g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(c)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的矽原子為40莫耳%,源自1-萘基三甲氧基矽烷的矽原子為50莫耳%,源自2-(3,4-環氧環己基)乙基三.甲氧基矽烷的矽原子為10莫耳%。 In a separable flask, 54.48 g (0.4 mol) of methyltrimethoxydecane, 124.18 g (0.50 mol) of 1-naphthyltrimethoxydecane, and 2-(3,4-epoxycyclohexyl) were added. Ethyltrimethoxydecane 24.46 g (0.10 mol) and DAA 192.67 g were added to a phosphoric acid solution in which 0.61 g of phosphoric acid was dissolved in 55.80 g of water at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (c) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the germanium atom derived from methyltrimethoxydecane was 40 mol% derived from 1-naphthyltrimethoxynonane. The ruthenium atom was 50 mol%, and the ruthenium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane was 10 mol%.

<聚矽氧烷溶液(d)的製備> <Preparation of polyoxyalkylene solution (d)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷54.48g(0.4莫耳)、1-萘基三甲氧基矽烷99.34g(0.40莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.10莫耳)、3-丙烯醯氧基丙基三甲氧基矽烷66.97g(0.10莫耳)、丙二醇單乙醚(以下為PGEE) 147.67g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.61g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(d)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的結構為40莫耳%,源自1-萘基三甲氧基矽烷的矽原子為40莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為10莫耳%,源自3-丙烯醯氧基丙基三甲氧基矽烷的矽原子為10莫耳%。 In a separable flask, 54.48 g (0.4 mol) of methyltrimethoxydecane, 99.34 g (0.40 mol) of 1-naphthyltrimethoxydecane, and 2-(3,4-epoxycyclohexyl) were added. Ethyltrimethoxydecane 24.46g (0.10 mole), 3-propenyloxypropyltrimethoxydecane 66.97g (0.10 mole), propylene glycol monoethyl ether (hereinafter PGEE) 147.67 g, a phosphoric acid solution in which 0.61 g of phosphoric acid was dissolved in 55.80 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (d) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the structure derived from methyltrimethoxydecane was 40 mol%, and the peptone derived from 1-naphthyltrimethoxynonane was used. The atom is 40 mol%, and the ruthenium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane is 10 mol% derived from 3-propenyloxypropyltrimethoxydecane. The germanium atom is 10 mol%.

<聚矽氧烷溶液(e)的製備> <Preparation of polyoxyalkylene solution (e)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷27.24g(0.2莫耳)、1-萘基三甲氧基矽烷173.85g(0.70莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.10莫耳)、DAA 220.09g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.61g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(e)。 In a separable flask, methyltrimethoxydecane 27.24 g (0.2 mol), 1-naphthyltrimethoxydecane 173.85 g (0.70 mol), 2-(3,4-epoxycyclohexyl) were added. Ethyltrimethoxydecane 24.46 g (0.10 mol) and DAA 220.09 g were added to a phosphoric acid solution in which 0.61 g of phosphoric acid was dissolved in 55.80 g of water at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (e) having a solid concentration of 50%.

以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的結構為20莫耳%,源自1-萘基三甲氧基矽烷的矽原子為70莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為10莫耳%。 The ratio of the organic decane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the structure derived from methyltrimethoxydecane was 20 mol%, and the oxime derived from 1-naphthyltrimethoxynonane was used. The atom is 70 mol%, and the ruthenium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane is 10 mol%.

<聚矽氧烷溶液(f)的製備> <Preparation of polyoxyalkylene solution (f)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷54.48g(0.4莫耳)、1-萘基三甲氧基矽烷74.51g(0.3莫耳)、苯基三甲氧基矽烷39.66g(0.20莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.10莫耳)、DAA 180.44g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(f)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的結構為40莫耳%,源自1-萘基三甲氧基矽烷的矽原子為30莫耳%,源自苯基三甲氧基矽烷的結構為20莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的結構為10莫耳%。 In a separable flask, 54.48 g (0.4 mol) of methyltrimethoxydecane, 74.51 g (0.3 mol) of 1-naphthyltrimethoxydecane, and 39.66 g of phenyltrimethoxydecane (0.20 mol) were added. , 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane 24.46g (0.10 mole), DAA 180.44g, added in a bath temperature of 40 ° C for 30 minutes, dissolved in water 55.80g dissolved in phosphoric acid 0.58 g of phosphoric acid solution. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (f) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the structure derived from methyltrimethoxydecane was 40 mol%, and the peptone derived from 1-naphthyltrimethoxynonane was used. The atom is 30 mol%, the structure derived from phenyltrimethoxydecane is 20 mol%, and the structure derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane is 10 mol%. .

<聚矽氧烷溶液(g)的製備> <Preparation of polyoxyalkylene solution (g)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷54.48g(0.40莫耳)、1-萘基三甲氧基矽烷74.51g(0.30莫耳)、苯基三 甲氧基矽烷39.66g(0.20莫耳)、乙烯基三甲氧基矽烷14.82g(0.10莫耳)、DAA 160.44g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(g)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的結構為40莫耳%,源自1-萘基三甲氧基矽烷的矽原子為30莫耳%,源自苯基三甲氧基矽烷的矽原子為20莫耳%,源自乙烯基三甲氧基矽烷的結構為10莫耳%。 In a separable flask, 54.48 g (0.40 mol) of methyltrimethoxydecane, 74.51 g (0.30 mol) of 1-naphthyltrimethoxydecane, and phenyltriene were added. 39.66g (0.20 moles) of methoxydecane, 14.82g (0.10 moles) of vinyltrimethoxydecane, 160.44g of DAA, added in a bath temperature of 40 ° C for 30 minutes, dissolved in water 55.80g dissolved in phosphoric acid 0.58g Phosphoric acid solution. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (g) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the structure derived from methyltrimethoxydecane was 40 mol%, and the peptone derived from 1-naphthyltrimethoxynonane was used. The atom was 30 mol%, the ruthenium atom derived from phenyltrimethoxydecane was 20 mol%, and the structure derived from vinyl trimethoxydecane was 10 mol%.

<聚矽氧烷溶液(h)的製備> <Preparation of polyoxyalkylene solution (h)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷47.67g(0.35莫耳)、1-萘基三甲氧基矽烷124.18g(0.50莫耳)、乙烯基三甲氧基矽烷22.23g(0.15莫耳)、DAA 185.44g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(h)。以與 實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的矽原子為35莫耳%,源自1-萘基三甲氧基矽烷的矽原子為50莫耳%,源自乙烯基三甲氧基矽烷的矽原子為15莫耳%。 In a separable flask, 47.67 g (0.35 mol) of methyltrimethoxydecane, 124.18 g (0.50 mol) of 1-naphthyltrimethoxydecane, and 22.23 g of vinyltrimethoxydecane (0.15 mol) were added. And DAA 185.44g, a phosphoric acid solution in which 0.58 g of phosphoric acid was dissolved in 55.80 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (h) having a solid concentration of 50%. With In the same manner as in Example 1, the ratio of the organodecane structure in the polyoxyalkylene was measured, and the ruthenium atom derived from methyltrimethoxydecane was 35 mol%, and the ruthenium atom derived from 1-naphthyltrimethoxynonane was used. At 50 mol%, the ruthenium atom derived from vinyltrimethoxydecane was 15 mol%.

<聚矽氧烷溶液(i)的製備> <Preparation of polyoxyalkylene solution (i)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷54.48g(0.40莫耳)、1-萘基三甲氧基矽烷74.51g(0.30莫耳)、苯基三甲氧基矽烷39.66g(0.20莫耳)、3-乙基-3-[3-(三甲氧基矽烷基)丙氧基甲基]氧雜環丁烷27.84g(0.10莫耳)、DAA 160.44g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(i)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的矽原子為40莫耳%,源自1-萘基三甲氧基矽烷的矽原子為30莫耳%,源自苯基三甲氧基矽烷的矽原子為20莫耳%,源自3-乙基-3-[3-(三甲氧基矽烷基)丙氧基甲基]氧雜環丁烷的矽原子為10莫耳%。 In a separable flask, 54.48 g (0.40 mol) of methyltrimethoxydecane, 74.51 g (0.30 mol) of 1-naphthyltrimethoxydecane, and 39.66 g of phenyltrimethoxydecane (0.20 mol) were added. , 3-ethyl-3-[3-(trimethoxydecyl)propoxymethyl]oxetane 27.84 g (0.10 mol), DAA 160.44 g, at a bath temperature of 40 ° C for 30 A phosphoric acid solution in which 0.58 g of phosphoric acid was dissolved in 55.80 g of water was added in a minute. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (i) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the germanium atom derived from methyltrimethoxydecane was 40 mol% derived from 1-naphthyltrimethoxynonane. The ruthenium atom is 30 mol%, and the ruthenium atom derived from phenyltrimethoxydecane is 20 mol% derived from 3-ethyl-3-[3-(trimethoxydecyl)propyloxymethyl] The oxetane has a fluorene atom of 10 mol%.

<聚矽氧烷溶液(j)的製備> <Preparation of polyoxyalkylene solution (j)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷48.86g (0.30莫耳)、1-萘基三甲氧基矽烷124.18g(0.50莫耳)、3-乙基-3-[3-(三甲氧基矽烷基)丙氧基甲基]氧雜環丁烷55.68g(0.20莫耳)、DAA 215.8g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(j)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的矽原子為30莫耳%,源自1-萘基三甲氧基矽烷的矽原子為50莫耳%,源自3-乙基-3-[3-(三甲氧基矽烷基)丙氧基甲基]氧雜環丁烷的矽原子為20莫耳%。 In a separable flask, methyltrimethoxydecane 48.86g was added. (0.30 mol), 1-naphthyltrimethoxydecane 124.18 g (0.50 mol), 3-ethyl-3-[3-(trimethoxydecyl)propoxymethyl]oxetane 55.68 g (0.20 mol) and DAA 215.8 g were added to a phosphoric acid solution in which 0.58 g of phosphoric acid was dissolved in 55.80 g of water at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (j) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the germanium atom derived from methyltrimethoxydecane was 30 mol% derived from 1-naphthyltrimethoxydecane. The ruthenium atom was 50 mol%, and the ruthenium atom derived from 3-ethyl-3-[3-(trimethoxydecyl)propoxymethyl]oxetane was 20 mol%.

<聚矽氧烷溶液(k)的製備> <Preparation of polyoxyalkylene solution (k)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷13.62g(0.10莫耳)、1-萘基三甲氧基矽烷198.68g(0.80莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.64g(0.10莫耳)、DAA 222.12g,在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.68g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重 量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(k)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的矽原子為10莫耳%,源自1-萘基三甲氧基矽烷的矽原子為80莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為10莫耳%。 In a separable flask, 13.62 g (0.10 mol) of methyltrimethoxydecane, 198.68 g (0.80 mol) of 1-naphthyltrimethoxydecane, and 2-(3,4-epoxycyclohexyl) were added. Ethyltrimethoxydecane 24.64 g (0.10 mol), DAA 222.12 g, and a phosphoric acid solution in which 0.68 g of phosphoric acid was dissolved in 55.80 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. Weigh the polymerization solution in an aluminum cup and weigh it at 250 ° C for 30 minutes. The solid component concentration was calculated and calculated to obtain a polyoxane solution (k) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the germanium atom derived from methyltrimethoxydecane was 10 mol% derived from 1-naphthyltrimethoxynonane. The ruthenium atom was 80 mol%, and the ruthenium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane was 10 mol%.

<聚矽氧烷溶液(1)的製備> <Preparation of polyoxyalkylene solution (1)>

在可分離式燒瓶中,加入1-萘基三甲氧基矽烷124.18g(0.50莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.50莫耳)、DAA 239.44g,在浴溫度40℃下歷時30分鐘添加在水63.80g中溶解有磷酸0.74g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(1)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自1-萘基三甲氧基矽烷的矽原子為50莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為50莫耳%。 In a separable flask, 124.18 g (0.50 mol) of 1-naphthyltrimethoxydecane and 24.46 g (0.50 mol) of 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane were added. DAA 239.44 g, a phosphoric acid solution in which 0.74 g of phosphoric acid was dissolved in 63.80 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (1) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the germanium atom derived from 1-naphthyltrimethoxynonane was 50 mol% derived from 2-(3,4- The ruthenium atom of epoxycyclohexyl)ethyltrimethoxydecane is 50 mol%.

<聚矽氧烷溶液(m)的製備> <Preparation of polyoxyalkylene solution (m)>

在可分離式燒瓶中,加入1-萘基三甲氧基矽烷49.67g(0.20莫耳)、苯基三甲氧基矽烷39.66g(0.70莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷24.46g(0.10莫耳)、DAA 160.44g, 在浴溫度40℃下歷時30分鐘添加在水55.80g中溶解有磷酸0.64g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(m)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自1-萘基三甲氧基矽烷的結構為20莫耳%,源自苯基三甲氧基矽烷的矽原子為70莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為10莫耳%。 In a separable flask, 49.67 g (0.20 mol) of 1-naphthyltrimethoxydecane, 39.66 g (0.70 mol) of phenyltrimethoxydecane, and 2-(3,4-epoxycyclohexyl) were added. Ethyltrimethoxydecane 24.46g (0.10 mole), DAA 160.44g, A phosphoric acid solution in which 0.64 g of phosphoric acid was dissolved in 55.80 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (m) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the structure derived from 1-naphthyltrimethoxydecane was 20 mol%, and ruthenium derived from phenyltrimethoxydecane The atom is 70 mol%, and the ruthenium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane is 10 mol%.

<聚矽氧烷溶液(n)的製備> <Preparation of polyoxyalkylene solution (n)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷53.12g(0.39莫耳)、1-萘基三甲氧基矽烷99.34g(0.40莫耳)、苯基三甲氧基矽烷1.98g(0.01莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷49.28g(0.20莫耳)、DAA 191.40g,在浴溫度40℃下歷時30分鐘添加在水57.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(n)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自 甲基三甲氧基矽烷的結構為39莫耳%,源自1-萘基三甲氧基矽烷的矽原子為40莫耳%,源自苯基三甲氧基矽烷的結構為1莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為20莫耳%。 In a separable flask, 53.12 g (0.39 mol) of methyltrimethoxydecane, 99.34 g (0.40 mol) of 1-naphthyltrimethoxydecane, and 1.98 g of phenyltrimethoxydecane (0.01 mol) were added. , 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane 49.28g (0.20 mole), DAA 191.40g, added phosphoric acid in 57.80g of water at a bath temperature of 40 ° C for 30 minutes 0.58 g of phosphoric acid solution. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (n) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, derived from The structure of methyltrimethoxydecane is 39 mol%, the atomic origin derived from 1-naphthyltrimethoxynonane is 40 mol%, and the structure derived from phenyltrimethoxydecane is 1 mol%, source The ruthenium atom from 2-(3,4-epoxycyclohexyl)ethyltrimethoxynonane is 20 mol%.

<聚矽氧烷溶液(o)的製備> <Preparation of polyoxyalkylene solution (o)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷53.12g(0.39莫耳)、1-萘基三甲氧基矽烷2.48g(0.01莫耳)、苯基三甲氧基矽烷79.32g(0.40莫耳)、2-(3,4-環氧環己基)乙基三甲氧基矽烷49.28g(0.20莫耳)、DAA 168.44g,在浴溫度40℃下歷時30分鐘添加在水57.80g中溶解有磷酸0.58g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度115℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(o)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的結構為39莫耳%,源自1-萘基三甲氧基矽烷的結構為1莫耳%,源自苯基三甲氧基矽烷的矽原子為40莫耳%,源自2-(3,4-環氧環己基)乙基三甲氧基矽烷的矽原子為20莫耳%。 In a separable flask, 53.12 g (0.39 mol) of methyltrimethoxydecane, 2.48 g (0.01 mol) of 1-naphthyltrimethoxydecane, and 79.32 g of phenyltrimethoxydecane (0.40 mol) were added. , 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane 49.28g (0.20 mole), DAA 168.44g, added phosphoric acid in 57.80g of water at a bath temperature of 40 ° C for 30 minutes 0.58 g of phosphoric acid solution. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 115 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (o) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the structure derived from methyltrimethoxydecane was 39 mol%, and the structure derived from 1-naphthyltrimethoxynonane was used. 1 mol%, the ruthenium atom derived from phenyltrimethoxydecane is 40 mol%, and the ruthenium atom derived from 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane is 20 mol. %.

<聚矽氧烷溶液(p)的製備> <Preparation of polyoxyalkylene solution (p)>

在可分離式燒瓶中,加入甲基三甲氧基矽烷136.20g(1.00莫耳)、DAA 88.37g,在浴溫度40℃下歷時30分鐘添加在水54.00g中溶解有磷酸0.41g的磷酸溶液。將所得的溶液在浴溫 度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(p)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自甲基三甲氧基矽烷的矽原子為100莫耳%。 In a separable flask, 136.20 g (1.00 mol) of methyltrimethoxydecane and 88.37 g of DAA were added, and a phosphoric acid solution in which 0.41 g of phosphoric acid was dissolved in 54.00 g of water was added at a bath temperature of 40 ° C for 30 minutes. The resulting solution is at bath temperature The mixture was heated and stirred at 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was reacted. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polysiloxane solution (p) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the germanium atom derived from methyltrimethoxydecane was 100 mol%.

<聚矽氧烷溶液(q)的製備> <Preparation of polyoxyalkylene solution (q)>

在可分離式燒瓶中,加入苯基三甲氧基矽烷198.30g(1.00莫耳)、DAA 160.44g,在浴溫度40℃下歷時30分鐘添加在水54.00g中溶解有磷酸0.59g的磷酸溶液。將所得的溶液在浴溫度70℃下加熱攪拌1小時,接著在浴溫度105℃下加熱攪拌3小時,將水解所得的副產物即甲醇、水蒸餾除去並使溶液反應。反應結束後,進行冰浴冷卻。在鋁杯中秤量聚合溶液,秤量在250℃下加熱乾燥30分鐘後的重量並計算固體成分濃度,而獲得固體成分濃度為50%的聚矽氧烷溶液(q)。以與實施例1相同的方式,測定聚矽氧烷中的有機矽烷結構的比率,源自苯基三甲氧基矽烷的矽原子為100莫耳%。 In a separable flask, 198.30 g (1.00 mol) of phenyltrimethoxydecane and 160.44 g of DAA were added, and a phosphoric acid solution in which 0.59 g of phosphoric acid was dissolved in 54.00 g of water was added at a bath temperature of 40 ° C for 30 minutes. The obtained solution was heated and stirred at a bath temperature of 70 ° C for 1 hour, and then heated and stirred at a bath temperature of 105 ° C for 3 hours, and methanol, water, which is a by-product of hydrolysis, was distilled off and the solution was allowed to react. After the reaction was completed, it was cooled in an ice bath. The polymerization solution was weighed in an aluminum cup, and the weight after heating and drying at 250 ° C for 30 minutes was weighed and the solid content concentration was calculated to obtain a polyoxyalkylene solution (q) having a solid concentration of 50%. The ratio of the organodecane structure in the polyoxyalkylene was measured in the same manner as in Example 1, and the ruthenium atom derived from phenyltrimethoxydecane was 100 mol%.

<<實施例1>> <<Example 1>>

<油墨用組成物的製備> <Preparation of composition for ink>

將聚矽氧烷溶液(a)20g與三乙醯丙酮酸鋁(以下為Al(acac))0.1g(相對於聚矽氧烷為1質量%)添加於DAA 8g、 乙酸異丙酯(以下為IPAc)64g中並攪拌(DAA/IPAc=20/80)。於其中,添加界面活性劑BYK-333(日本畢克化學股份有限公司製造)0.5g(相對於聚矽氧烷為5質量%),接著進行攪拌,而獲得油墨用組成物A。 20 g of the polyoxoxane solution (a) and 0.1 g of aluminum triacetate pyruvate (hereinafter referred to as Al(acac)) (1% by mass based on polyoxyalkylene) were added to DAA 8 g, Isopropyl acetate (hereinafter IPAc) was stirred in 64 g (DAA/IPAc = 20/80). Into this, 0.5 g of a surfactant (manufactured by Nippon Chemical Co., Ltd.) (5 mass% with respect to polyoxyalkylene) was added, followed by stirring to obtain a composition A for ink.

<印刷圖案的轉印性的評價> <Evaluation of transferability of printed pattern>

在10cm見方的矽酮橡膠橡皮布(商品名:「SILBLAN」(註冊商標)、金陽公司(股)製造)上,使用棒塗機(#6、松尾產業(股)製造),在整個面上以厚度為0.5μm將油墨用組成物A製膜。然後,在形成有線/間隙=15μm/15μm、高度10μm的圖案的矽晶圓上擠壓該塗膜,自橡皮布上藉由輥施加1個往復壓力。然後,放置1分鐘後,將橡皮布自矽晶圓分離。此時,在矽晶圓的凸的部分(線部分)轉印矽橡皮布上的膜,而在矽酮橡膠橡皮布上形成圖案膜。然後,在矽酮橡膠橡皮布上與玻璃基板擠壓1分鐘,將形成了圖案的膜轉印至玻璃基板上,藉由反轉套版印刷法印刷線/間隙=15μm/15μm的圖案。將經印刷的玻璃基板在250℃下進行1小時加熱處理,使經印刷的油墨用組成物的膜硬化。然後,藉由光學顯微鏡觀察硬化膜的圖案,根據下述基準進行評價。將評價結果表示於表3。 On the 10cm square crepe rubber blanket (trade name: "SILBLAN" (registered trademark), manufactured by Jinyang Co., Ltd.), using a bar coater (#6, Matsuo Industry Co., Ltd.), the entire surface The ink composition A was formed into a film having a thickness of 0.5 μm. Then, the coating film was pressed on a crucible wafer having a pattern of wire/gap = 15 μm / 15 μm and a height of 10 μm, and one reciprocating pressure was applied from the blanket by a roller. Then, after standing for 1 minute, the blanket was separated from the wafer. At this time, the film on the crepe blanket was transferred on the convex portion (line portion) of the enamel wafer, and the pattern film was formed on the fluorene rubber blanket. Then, the film was pressed against a glass substrate for 1 minute on an anthrone rubber blanket, and the film on which the pattern was formed was transferred onto a glass substrate, and a pattern of line/gap = 15 μm / 15 μm was printed by reverse offset printing. The printed glass substrate was heat-treated at 250 ° C for 1 hour to cure the film of the printed ink composition. Then, the pattern of the cured film was observed by an optical microscope, and evaluation was performed based on the following criteria. The evaluation results are shown in Table 3.

S:整個面上再現所期望的線/間隙的圖案 S: the desired line/gap pattern is reproduced on the entire surface

A:雖然再現圖案,但一部分圖案存在歪曲 A: Although the pattern is reproduced, some of the patterns are distorted.

B:整個面上圖案存在歪曲或呈現鋸齒狀。或見到針孔狀收縮 B: The pattern on the entire surface is distorted or jagged. Or see pinhole contraction

C:由於轉印不良或收縮,而圖案崩潰 C: The pattern collapses due to poor transfer or shrinkage

D:無法形成圖案。 D: No pattern can be formed.

另外,使用將存在於最上層的矽酮橡膠層作為油墨排斥層的無水平版(商品名:「東麗無水平版」(註冊商標)TAN-E(負型)、東麗(Toray)(股)製造、10cm見方),藉由曝光、顯影,而形成線/間隙=15μm/15μm的矽酮橡膠層的圖案。線上存在矽酮橡膠層,間隙上無矽酮橡膠層。在形成有圖案的平版上,使用棒塗機(#6、松尾產業(股)製造),在整個面上將油墨用組成物A製膜。在經製膜的平版上,擠壓於與上述所用者相同的矽酮橡膠橡皮布上,藉由輥施加1個往復壓力。然後,放置1分鐘後,將矽酮橡膠橡皮布自平版分離。此時,轉印上述平版的凸的部分(線部分)的膜,而在矽酮橡膠橡皮布上形成圖案膜。然後,將具有圖案膜的矽酮橡膠橡皮布在玻璃基板上擠壓1分鐘。拆卸矽酮橡膠橡皮布,藉由剝離套版印刷法在玻璃基板上印刷線/間隙=15μm/15μm的油墨用組成物的膜的圖案。除此以外,以與上述方法相同的方式,製作硬化被膜,根據與上述相同的基準進行評價。將評價結果表示於表3。 In addition, a non-horizontal version (trade name: "Toray No Horizontal Edition" (registered trademark) TAN-E (negative type), Toray (Toray) which is the top layer of the fluorenone rubber layer is used. (manufacturing, 10 cm square), by exposure and development, a pattern of an fluorenone rubber layer having a line/gap = 15 μm / 15 μm was formed. The fluorenone rubber layer is present on the line and there is no ketone rubber layer on the gap. On the lithographic plate on which the pattern was formed, the ink composition A was formed on the entire surface by using a bar coater (#6, manufactured by Matsuo Industries Co., Ltd.). On the film-formed lithographic plate, it was extruded on the same crepe rubber blanket as that used above, and a reciprocating pressure was applied by the roller. Then, after standing for 1 minute, the anthrone rubber blanket was separated from the lithographic plate. At this time, a film of the convex portion (line portion) of the above lithographic plate was transferred, and a pattern film was formed on the fluorenone rubber blanket. Then, an anthrone rubber blanket having a pattern film was pressed on the glass substrate for 1 minute. The oxime rubber blanket was removed, and a pattern of a film of the ink composition having a line/gap = 15 μm / 15 μm was printed on the glass substrate by a lift-off lithography method. Otherwise, a cured film was produced in the same manner as the above method, and evaluated according to the same criteria as above. The evaluation results are shown in Table 3.

另外,在形成有線/間隙=15μm/15μm、高度10μm的圖案的矽晶圓上,流入矽彈性體(商品名:「Sylgard」(註冊商標)184 Silicone Elastomer、東麗道康寧(股)製造)並脫氣,在150℃下加熱硬化10分鐘,而在整個面上形成矽彈性體,並形成凸部的高度為10μm的聚二甲基矽氧烷(PDMS)標記。在該PDMS標記上,使用棒塗機(#6、松尾產業(股)製造),在整個面上將油墨 組成物A製膜。將該PDMS標記擠壓於玻璃基板,藉由微接觸印刷法在玻璃基板上印刷線/間隙=15μm/15μm的油墨用組成物的膜的圖案。然後,以與上述方法相同的方式,製作硬化被膜,並根據與上述相同的基準進行評價。將評價結果表示於表3。 In addition, a ruthenium elastomer (trade name: "Sylgard" (registered trademark) 184 Silicone Elastomer, manufactured by Toray Dow Corning Co., Ltd.) was introduced onto a ruthenium wafer having a pattern of a wire/gap = 15 μm / 15 μm and a height of 10 μm. Degassing, heat hardening at 150 ° C for 10 minutes, and forming a ruthenium elastomer on the entire surface, and forming a polydimethyl siloxane (PDMS) mark having a convex portion having a height of 10 μm. On the PDMS mark, the ink was applied over the entire surface using a bar coater (#6, manufactured by Matsuo Industries Co., Ltd.). Composition A was formed into a film. The PDMS mark was pressed against a glass substrate, and a pattern of a film of an ink composition having a line/gap = 15 μm / 15 μm was printed on the glass substrate by a microcontact printing method. Then, a cured film was produced in the same manner as the above method, and evaluated according to the same criteria as above. The evaluation results are shown in Table 3.

<硬化被膜的密接性試驗> <Adhesion test of hardened film>

藉由上述反轉套版印刷,在玻璃基板上在整個面上製作硬化被膜,交叉切割為1mm×1mm的100塊(mass),然後,進行膠帶剝離試驗(交叉切割法:JIS K5400(日本工業標準))。關於剝離後的方格(square)的評價,根據下述進行評價。 By the above reverse printing, a hardened film was formed on the entire surface of the glass substrate, and it was cross-cut into 100 masses of 1 mm × 1 mm, and then tape peeling test was performed (cross cutting method: JIS K5400 (Japanese Industrial Industry) standard)). The evaluation of the square after peeling was evaluated based on the following.

5B:剝離的面積小於5% 5B: The area of peeling is less than 5%

4B:剝離的面積為5%以上、小於15% 4B: The area of peeling is 5% or more and less than 15%

3B:剝離的面積為15%以上、小於35% 3B: The area of peeling is 15% or more and less than 35%

2B:剝離的面積為35%以上、小於65% 2B: The area of peeling is 35% or more and less than 65%

1B:剝離的面積為65%以上、小於95% 1B: The area of peeling is 65% or more and less than 95%

0B:剝離的面積為95%以上、100%以下。 0B: The area of peeling is 95% or more and 100% or less.

關於實施例中所使用的化合物,以下闡述縮寫符號。 Regarding the compounds used in the examples, the abbreviations are explained below.

二丙酮醇:DAA Diacetone alcohol: DAA

3-甲氧基丁醇:MB 3-methoxybutanol: MB

丙二醇單乙醚:PGEE Propylene glycol monoethyl ether: PGEE

異丙醇:IPA Isopropyl alcohol: IPA

乙酸丁酯:BAc Butyl acetate: BAc

乙酸異丙酯:IPAc Isopropyl acetate: IPAc

二丙二醇二甲醚:DMM Dipropylene glycol dimethyl ether: DMM

三乙醯丙酮酸鋁:Al(acac) Triethylpyruvate aluminum: Al(acac)

三乙醯丙酮酸鈦:Ti(acac) Titanium triacetate pyruvate: Ti(acac)

三乙醯丙酮酸鋯:Zr(acac) Zirconium triacetate pyruvate: Zr(acac)

三異丙醇鋁:AlIP Aluminum triisopropoxide: AlIP

光酸產生劑CGI-MDT(賀利氏(股)製造):CGI-MDT Photoacid generator CGI-MDT (made by Heraeus): CGI-MDT

熱酸產生劑「San-Aid」(註冊商標)SI-200(三新化學(股)製造):SI-200 Thermal acid generator "San-Aid" (registered trademark) SI-200 (manufactured by Sanshin Chemical Co., Ltd.): SI-200

界面活性劑BYK-333(日本畢克化學股份有限公司製造):BYK-333 Surfactant BYK-333 (made by Japan BYK Chemical Co., Ltd.): BYK-333

界面活性劑BYK-307(日本畢克化學股份有限公司製造):BYK-307 Surfactant BYK-307 (made by Japan BYK Chemical Co., Ltd.): BYK-307

界面活性劑X-22-161B(信越化學(股)):X-22-161B Surfactant X-22-161B (Shin-Etsu Chemical Co., Ltd.): X-22-161B

界面活性劑「MEGAFAC」(註冊商標)F-554(DIC(股)製造):F-554。 Surfactant "MEGAFAC" (registered trademark) F-554 (manufactured by DIC): F-554.

<<實施例2~實施例39、比較例1~比較例2>> <<Example 2 to Example 39, Comparative Example 1 to Comparative Example 2>>

關於實施例2~實施例39、比較例1~比較例2的油墨用組成物,設為如表1~表2所示般,除此以外,以與實施例1相同的方式進行。將評價結果表示於表3。 The ink compositions of Examples 2 to 39 and Comparative Examples 1 to 2 were carried out in the same manner as in Example 1 except that the compositions for the inks of Tables 1 to 2 were used. The evaluation results are shown in Table 3.

根據表3亦可知,藉由在油墨用聚矽氧烷組成物中包含具有多環式芳香族基的矽氧烷化合物,而印刷圖案的轉印性及密接性良好。 According to Table 3, it is also known that the polyoxyalkylene compound having a polycyclic aromatic group is contained in the polysiloxane composition for ink, and the transfer property and the adhesion of the printed pattern are good.

<<實施例40>> <<Example 40>>

<碳奈米管(Carbon Nano Tubes,CNT)複合物分散液的製作> <Production of Carbon Nano Tubes (CNT) Composite Dispersion>

在加入了氯仿5ml的燒瓶中,添加作為共軛系聚合物的聚-3-己基噻吩(數量平均分子量(Mn):13000、以下為P3HT)0.10g,在超音波清洗機中進行超音波攪拌,藉此獲得P3HT的氯仿溶液。接著,取該溶液至點滴器(spuit)中,在甲醇20ml與0.1N鹽酸10ml的混合溶液中,各滴加0.5ml,進行再沈澱。藉由四氟乙烯製0.1μm孔徑的膜濾器(聚四氟乙烯(Polytetrafluoroethylene,PTFE)公司製造)過濾分離收集成為固體的P3HT,藉由甲醇充分洗滌後,藉由真空乾燥除去溶劑。接著再次進行溶解與再沈澱,而獲得90mg的再沈澱P3HT。 In a flask containing 5 ml of chloroform, 0.10 g of poly-3-hexylthiophene (number average molecular weight (Mn): 13,000 or less) of P3HT as a conjugated polymer was added, and ultrasonic agitation was performed in an ultrasonic cleaner. Thereby, a chloroform solution of P3HT was obtained. Next, the solution was taken up in a spuit, and 0.5 ml of each was added dropwise to a mixed solution of 20 ml of methanol and 10 ml of 0.1 N hydrochloric acid to carry out reprecipitation. The solid P3HT was collected by filtration through a membrane filter (manufactured by Polytetrafluoroethylene, PTFE) having a pore size of 0.1 μm made of tetrafluoroethylene, washed thoroughly with methanol, and then the solvent was removed by vacuum drying. Subsequent dissolution and reprecipitation were carried out to obtain 90 mg of reprecipitated P3HT.

在10ml的氯仿中添加單層CNT(CNI公司製造的單層碳奈米管、純度為95%)1.0mg、及上述P3HT 1.0mg,一邊進行冰浴冷卻,一邊使用超音波均質器(東京理化器械(股)製造的VCX-500),以輸出功率250W進行30分鐘超音波攪拌。在進行了30分鐘的超音波照射的時刻,停止一次照射,追加1.0mg上述 P3HT,接著進行1分鐘超音波照射,藉此獲得CNT複合物分散液A(相對於溶劑的CNT濃度為0.1g/l)。 Into 10 ml of chloroform, a single layer of CNT (a single-layer carbon nanotube manufactured by CNI, 95% purity) of 1.0 mg and 1.0 mg of the above P3HT were added, and an ultrasonic homogenizer (Tokyo Physicochemical) was used while cooling in an ice bath. The VCX-500 manufactured by the instrument (stock) was subjected to ultrasonic agitation for 30 minutes at an output of 250 W. At the time of the 30-minute ultrasonic irradiation, one irradiation is stopped, and 1.0 mg of the above is added. P3HT was further subjected to ultrasonic irradiation for 1 minute, whereby CNT composite dispersion A (the CNT concentration with respect to the solvent was 0.1 g/l) was obtained.

為了調查在CNT複合物分散液A中P3HT是否附著於CNT上,而使用膜濾器將5ml分散液A進行過濾,在過濾器上收集CNT。將所收集的CNT在溶劑未乾時迅速地轉印至矽晶圓上,而獲得乾燥的CNT。使用X射線光電子分光法(X-ray Photoelectron Spectroscopy,XPS),對該CNT進行元素分析,結果檢測到包含於P3HT中的硫元素。因此可確認,CNT複合物分散液A中的CNT上附著P3HT。 In order to investigate whether or not P3HT adhered to the CNT in the CNT composite dispersion A, 5 ml of the dispersion A was filtered using a membrane filter, and CNTs were collected on the filter. The collected CNTs were quickly transferred onto a tantalum wafer while the solvent was not dried to obtain dried CNTs. Elemental analysis of the CNT was carried out by X-ray photoelectron spectroscopy (XPS), and as a result, sulfur element contained in P3HT was detected. Therefore, it was confirmed that P3HT adhered to the CNTs in the CNT composite dispersion A.

在上述CNT複合物分散液A中添加鄰二氯苯(沸點為180℃、以下為o-DCB)5ml後,使用旋轉蒸發器,將作為低沸點溶劑的氯仿蒸餾除去,用o-DCB置換溶劑,而獲得CNT複合物分散液B。接著,使用膜濾器(孔徑為3μm、直徑為25mm、米立波亞(Millipore)公司製造的Omnipore膜),將分散液B進行過濾,而將長度為10μm以上的CNT除去。在所得的濾液中添加o-DCB進行稀釋,而製成CNT複合物分散液C(相對於溶劑的CNT濃度為0.06g/l)。 5 ml of o-dichlorobenzene (boiling point: 180 ° C or less) was added to the CNT composite dispersion A, and then chloroform as a low boiling point solvent was distilled off using a rotary evaporator, and the solvent was replaced with o-DCB. And CNT composite dispersion B was obtained. Next, a membrane filter (Omnipore membrane manufactured by Millipore Co., Ltd. having a pore diameter of 3 μm and a diameter of 25 mm) was used, and the dispersion B was filtered to remove CNTs having a length of 10 μm or more. To the obtained filtrate, o-DCB was added and diluted to prepare a CNT composite dispersion C (the CNT concentration with respect to the solvent was 0.06 g/l).

<TFT的製作與評價> <Production and evaluation of TFT>

製作圖4所示的形態的TFT。在玻璃製基板14(厚度為0.7mm)上,藉由電阻加熱法,經由金屬遮罩,真空蒸鍍厚度5nm的鉻、接著真空蒸鍍厚度50nm的金,而形成閘極電極15。接著,使用實施例1中所製備的油墨用組成物而藉由反轉套版印刷法形 成印刷物,將其在氮氣流下在220℃下加熱處理1小時,藉此獲得膜厚為500nm的閘極絕緣膜,而形成閘極絕緣層16。在形成有該閘極絕緣層的基板上,以厚度為50nm的方式真空蒸鍍金。接著,滴加正型抗蝕劑溶液,使用旋轉塗佈機塗佈後,藉由90℃的加熱板乾燥,而形成抗蝕劑膜。對所得的抗蝕劑膜,使用曝光機,通過光罩進行紫外線照射。接著,將基板浸漬於鹼性水溶液中,而將紫外線照射部除去,而獲得經圖案加工成電極形狀的抗蝕劑膜。將所得的基板浸漬於金蝕刻液(阿爾多里奇(Aldrich)公司製造、Gold etchant,standard)中,將除去了抗蝕劑膜的部分的金溶解、除去。將所得的基板浸漬於丙酮中,將抗蝕劑除去後,藉由純水清洗,藉由100℃的加熱板乾燥30分鐘。如此獲得電極的寬度(通道寬度)0.2mm、電極的間隔(通道長度)20μm、厚度50nm的金源極電極18及汲極電極19。 A TFT of the form shown in Fig. 4 was produced. On the glass substrate 14 (thickness: 0.7 mm), a thickness of 5 nm of chromium was vacuum-deposited through a metal mask by a resistance heating method, followed by vacuum deposition of gold having a thickness of 50 nm to form a gate electrode 15. Next, using the ink composition prepared in Example 1 by reverse printing The printed matter was heated and treated at 220 ° C for 1 hour under a nitrogen stream, whereby a gate insulating film having a film thickness of 500 nm was obtained, and a gate insulating layer 16 was formed. Gold was vacuum-deposited on the substrate on which the gate insulating layer was formed so as to have a thickness of 50 nm. Next, a positive resist solution was dropped, and after coating with a spin coater, it was dried by a hot plate at 90 ° C to form a resist film. The obtained resist film was irradiated with ultraviolet rays through a photomask using an exposure machine. Next, the substrate is immersed in an alkaline aqueous solution, and the ultraviolet ray irradiated portion is removed to obtain a resist film patterned into an electrode shape. The obtained substrate was immersed in a gold etching solution (manufactured by Aldrich Co., Ltd., Gold etchant, standard), and gold in a portion from which the resist film was removed was dissolved and removed. The obtained substrate was immersed in acetone, and after the resist was removed, it was washed with pure water and dried by a hot plate at 100 ° C for 30 minutes. Thus, the gold source electrode 18 and the drain electrode 19 having a width (channel width) of 0.2 mm, an electrode spacing (channel length) of 20 μm, and a thickness of 50 nm were obtained.

接著,在形成有電極的基板上,藉由噴墨法塗佈所製備的CNT複合物分散液C,在加熱板上在氮氣流下在150℃下進行30分鐘的熱處理,而製作將CNT複合物分散膜作為活性層17的TFT。此時,噴墨裝置是使用簡易噴出實驗套組PIJL-1(聯科(CLUSTER TECHNOLOGY)股份有限公司製造)。 Next, the prepared CNT composite dispersion C was applied onto the substrate on which the electrode was formed by an inkjet method, and heat-treated at 150 ° C for 30 minutes on a hot plate to prepare a CNT composite. The dispersion film is used as the TFT of the active layer 17. At this time, the inkjet apparatus was a PIJL-1 (manufactured by CLUSTER TECHNOLOGY Co., Ltd.) using a simple ejection test kit.

對如此製作的TFT測定改變閘極電壓(Vg)時的源極、汲極間電流(Id)-源極、汲極間電壓(Vsd)特性。測定是使用半導體特性評價系統4200-SCS型(吉時利(Keithley Instruments)股份有限公司製造),在大氣中測定。根據在Vg=+30V~-30V 內變化時的Vsd=-5V時的Id的值的變化,求出線形區域的遷移率,結果為0.5cm2/Vsec。另外,根據此時的Id的最大值與最小值之比求出開關比,結果為1×106。另外,關於遲滯,測定將Id=10-9A時的閘極電壓自正向負掃描時的閘極電壓(Vg1)、與自負向正掃描時的閘極電壓(Vg2),將其差定義為遲滯並算出,結果為10V。 The source and the inter-deuterium current (Id)-source and the inter-deuterium voltage (Vsd) characteristics when the gate voltage (Vg) was changed were measured for the TFT thus fabricated. The measurement was carried out in the atmosphere using a semiconductor characteristic evaluation system Model 4200-SCS (manufactured by Keithley Instruments Co., Ltd.). The mobility of the linear region was determined from the change in the value of Id at Vsd = -5 V when Vg = +30 V to -30 V, and was 0.5 cm 2 /Vsec. Further, the switching ratio was obtained from the ratio of the maximum value to the minimum value of Id at this time, and the result was 1 × 10 6 . In addition, regarding the hysteresis, the gate voltage (Vg1) when the gate voltage is Id=10 -9 A and the gate voltage (Vg2) when the gate voltage is scanned from the negative direction is measured, and the difference is defined. For hysteresis and calculation, the result is 10V.

<<實施例40~實施例45>> <<Example 40 to Example 45>>

將油墨用組成物變更為表4所示者,除此以外,以與實施例40相同的方式,進行TFT的製作、評價。將結果表示於表4。 The production and evaluation of the TFT were carried out in the same manner as in Example 40 except that the ink composition was changed to those shown in Table 4. The results are shown in Table 4.

<<比較例3>> <<Comparative Example 3>>

使用表2所記載的比較例1中所製備的油墨用組成物Z1,以與實施例26相同的方式,進行TFT的製作,但無法形成圖案。 Using the ink composition Z1 prepared in Comparative Example 1 described in Table 2, the TFT was produced in the same manner as in Example 26, but the pattern could not be formed.

1‧‧‧橡皮布滾筒 1‧‧‧ blanket roller

2‧‧‧矽酮橡皮布 2‧‧‧矽 ketone blanket

3‧‧‧油墨塗佈機 3‧‧‧Ink coating machine

4‧‧‧油墨 4‧‧‧Ink

4'‧‧‧畫線部油墨 4'‧‧‧Drawing line ink

4"‧‧‧未畫線部油墨 4"‧‧‧Unlined ink

5‧‧‧除去凸版 5‧‧‧Remove the letterpress

6‧‧‧被印刷物 6‧‧‧Printed matter

7‧‧‧印刷圖案 7‧‧‧Printed pattern

Claims (12)

一種聚矽氧烷組成物,其特徵在於包含:(A1)聚矽氧烷,藉由使至少包含選自通式(1)~通式(3)的1種以上的矽烷化合物的矽烷化合物水解及縮合而得;以及(B)溶劑,R0 2-nR1 nSi(OR9)2 (1)(R0表示直接鍵結於矽原子的氫、烷基、烯基、苯基或這些的取代體;R1為1價基團,並表示多環式芳香族基或其取代體;R9表示氫、甲基、乙基、丙基或丁基,可相同亦可不同;n為1或2;n為2時,多個R1可相同亦可不同)R2Si(OR10)3 (2)(R2表示多環式芳香族基或其取代體;R10表示氫、甲基、乙基、丙基或丁基,可相同亦可不同)(R11O)mR4 3-mSi-R3-Si(OR12)1R5 3-1 (3)(R3表示2價多環式芳香族基或其取代體;R4及R5表示氫、烷基、烯基、芳基或這些的取代體,分別可相同亦可不同;R11及R12表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;m 及1分別獨立地為1~3的整數)。 A polyoxane composition comprising: (A1) a polyoxyalkylene, which is hydrolyzed by a decane compound containing at least one decane compound selected from the group consisting of the general formulae (1) to (3) And (B) a solvent, R 0 2-n R 1 n Si(OR 9 ) 2 (1) (R 0 represents a hydrogen, an alkyl group, an alkenyl group, a phenyl group directly bonded to a halogen atom or a substituent of these; R 1 is a monovalent group and represents a polycyclic aromatic group or a substituent thereof; and R 9 represents hydrogen, a methyl group, an ethyl group, a propyl group or a butyl group, which may be the same or different; 1 or 2; when n is 2, a plurality of R 1 's may be the same or different) R 2 Si(OR 10 ) 3 (2) (R 2 represents a polycyclic aromatic group or a substituent thereof; and R 10 represents hydrogen Methyl, ethyl, propyl or butyl, which may be the same or different) (R 11 O) m R 4 3-m Si-R 3 -Si(OR 12 ) 1 R 5 3-1 (3)( R 3 represents a divalent polycyclic aromatic group or a substituent thereof; and R 4 and R 5 represent a hydrogen, an alkyl group, an alkenyl group, an aryl group or a substituent of these, which may be the same or different; R 11 and R 12 Represents hydrogen, methyl, ethyl, propyl or butyl, which may be the same or different; m and 1 are each independently an integer from 1 to 3) 如申請專利範圍第1項所述的聚矽氧烷組成物,其中相對於(A1)聚矽氧烷的全部矽原子,源自以通式(1)~通式(3)中任一通式表示的1種以上的矽烷化合物的矽原子為5莫耳%以上、70莫耳%以下。 The polyoxane composition according to claim 1, wherein all of the ruthenium atoms of the (A1) polyoxane are derived from any one of the formulae (1) to (3). The germanium atom of one or more kinds of the decane compounds shown is 5 mol% or more and 70 mol% or less. 一種聚矽氧烷組成物,其特徵在於:包含(A2)聚矽氧烷以及(B)溶劑,所述(A2)聚矽氧烷是藉由使至少包含選自通式(1)~通式(3)的1種以上的矽烷化合物以及通式(7)所示的矽烷化合物的矽烷化合物水解及縮合而得;而且相對於作為聚矽氧烷的共聚合成分的矽烷化合物的全部結構單元的矽原子,源自通式(1)~通式(3)的矽烷化合物的矽原子、及源自通式(7)所示的矽烷化合物的矽原子的比率分別為10莫耳%~70莫耳%/0.1莫耳%~40莫耳%的範圍,R0 2-nR1 nSi(OR9)2 (1)(R0表示直接鍵結於矽原子的氫、烷基、烯基、苯基或這些的取代體;R1為直接鍵結於矽原子的1價基團,並表示多環式芳香族基或其取代體;R9表示氫、甲基、乙基、丙基或丁基,可相同亦可不同;n為1或2;n為2時,多個R1可相同亦可不同) R2Si(OR10)3 (2)(R2表示多環式芳香族基或其取代體;R10表示氫、甲基、乙基、丙基或丁基,可相同亦可不同)(R11O)mR4 3-mSi-R3-Si(OR12)1R5 3-1 (3)(R3表示2價多環式芳香族基或其取代體;R4及R5表示氫、烷基、烯基、芳基或這些的取代體,分別可相同亦可不同;R11及R12表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;m及1分別獨立地為1~3的整數)R9 aSi(OR16)4-a (7)(R9表示包含乙烯基、環氧基、氧雜環丁基的至少1種的碳數為3~20的有機基,分別可相同亦可不同;R16表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;a為1~3的整數)。 A polyoxyalkylene composition characterized by comprising (A2) polyadenine and (B) a solvent, wherein the (A2) polyoxane is formed by at least one selected from the group consisting of the formula (1) Hydrolysis and condensation of one or more kinds of the decane compound of the formula (3) and the decane compound of the decane compound represented by the formula (7); and all the structural units of the decane compound as a copolymerization component of the polyoxyalkylene oxide The germanium atom, the ratio of the germanium atom derived from the germane compound of the general formulae (1) to (3) and the germanium atom derived from the germane compound represented by the general formula (7) is 10 mol% to 70, respectively. Mohr%/0.1 mol%~40 mol% range, R 0 2-n R 1 n Si(OR 9 ) 2 (1) (R 0 represents hydrogen, alkyl, alk directly bonded to a halogen atom a substituent, a phenyl group or a substituent of these; R 1 is a monovalent group directly bonded to a ruthenium atom, and represents a polycyclic aromatic group or a substituent thereof; and R 9 represents hydrogen, methyl, ethyl or propyl The base or the butyl group may be the same or different; n is 1 or 2; when n is 2, a plurality of R 1 's may be the same or different) R 2 Si(OR 10 ) 3 (2) (R 2 represents a polycyclic ring thereof or a substituted aromatic group; R 10 represents hydrogen, methyl, ethyl , Propyl or butyl, may be identical or different) (R 11 O) m R 4 3-m Si-R 3 -Si (OR 12) 1 R 5 3-1 (3) (R 3 represents a divalent plurality a cyclic aromatic group or a substituent thereof; R 4 and R 5 represent hydrogen, an alkyl group, an alkenyl group, an aryl group or a substituent of these, and may be the same or different; R 11 and R 12 represent hydrogen, methyl, Ethyl, propyl or butyl may be the same or different; m and 1 are each independently an integer of 1 to 3) R 9 a Si(OR 16 ) 4-a (7) (R 9 represents a vinyl group) At least one of the epoxy group and the oxetanyl group having 3 to 20 carbon atoms may be the same or different; R 16 represents hydrogen, methyl, ethyl, propyl or butyl, respectively It can be the same or different; a is an integer from 1 to 3). 如申請專利範圍第3項所述的聚矽氧烷組成物,其中包含:(A3)聚矽氧烷,藉由使至少包含選自通式(1)~通式(3)的1種以上的矽烷化合物、通式(7)所示的矽烷化合物以及通式(8)所示的矽烷化合物的矽烷化合物水解及縮合而得;以及(B)溶劑,而且 相對於作為(a)聚矽氧烷的共聚合成分的矽烷化合物的全部結構單元的矽原子,源自以通式(1)~通式(3)的任一通式表示的1種以上的矽烷化合物的矽原子、源自通式(7)所示的矽烷化合物的矽原子、源自通式(8)所示的矽烷化合物的矽原子的比率,分別為10莫耳%~70莫耳%/0.1莫耳%~40莫耳%/5莫耳%~50莫耳%的範圍,R10 bSi(OR17)4-b (8)(R10表示含有苯基的碳數為3~20的有機基,分別可相同亦可不同;R17表示氫、甲基、乙基、丙基或丁基,分別可相同亦可不同;b為1~3的整數)。 The polyoxane composition according to claim 3, which comprises: (A3) polyoxyalkylene, which comprises at least one selected from the group consisting of general formula (1) to formula (3) Hydrogenation and condensation of a decane compound, a decane compound represented by the formula (7), and a decane compound represented by the formula (8); and (B) a solvent, and relative to (a) polyoxyl The ruthenium atom of all the structural units of the decane compound of the copolymerization component of the alkane is derived from a ruthenium atom of one or more kinds of decane compounds represented by any one of the general formulae (1) to (3). The ratio of the ruthenium atom of the decane compound shown in (7) to the ruthenium atom derived from the decane compound represented by the general formula (8) is 10 mol% to 70 mol%/0.1 mol% to 40 mol%, respectively. %/5mol %~50 mol% range, R 10 b Si(OR 17 ) 4-b (8) (R 10 represents an organic group having a phenyl group having 3 to 20 carbon atoms, respectively R 17 represents hydrogen, methyl, ethyl, propyl or butyl, which may be the same or different; b is an integer of 1 to 3). 如申請專利範圍第1項至第4項中任一項所述的聚矽氧烷組成物,其中相對於聚矽氧烷而進一步包含1質量%以上的表面調整劑。 The polyoxyalkylene composition according to any one of claims 1 to 4, further comprising a surface conditioning agent in an amount of 1% by mass or more based on the polysiloxane. 如申請專利範圍第1項至第5項中任一項所述的聚矽氧烷組成物,其中溶劑進一步含有質子性溶劑及非質子性溶劑。 The polyoxyalkylene composition according to any one of claims 1 to 5, wherein the solvent further contains a protic solvent and an aprotic solvent. 如申請專利範圍第1項至第6項中任一項所述的聚矽氧烷組成物,其中表面調整劑包含選自氟系界面活性劑、矽酮系界面活性劑以及極性基改質矽酮的1種以上。 The polyoxyalkylene composition according to any one of claims 1 to 6, wherein the surface conditioning agent comprises a surfactant selected from the group consisting of a fluorine-based surfactant, an anthrone-based surfactant, and a polar group-modified surfactant. One or more kinds of ketones. 如申請專利範圍第1項至第7項中任一項所述的聚矽氧烷系組成物,其中進一步包含金屬螯合化合物及/或金屬烷氧化合物。 The polyoxyalkylene-based composition according to any one of claims 1 to 7, further comprising a metal chelate compound and/or a metal alkoxide compound. 一種硬化被膜,其特徵在於:使用如申請專利範圍第1項至第8項中任一項所述的聚矽氧烷組成物而形成。 A hardened film formed by using the polyoxyalkylene composition according to any one of claims 1 to 8. 一種電子元件或光學元件,其包括如申請專利範圍第9項所述的硬化被膜。 An electronic component or an optical component comprising the hardened film according to claim 9 of the patent application. 一種電子元件或光學元件的製造方法,包括:將如申請專利範圍第1項至第8項中任一項所述的聚矽氧烷組成物塗佈於基板上,並進行加熱而使其硬化的步驟。 A method of producing an electronic component or an optical component, comprising: applying a polysiloxane composition according to any one of claims 1 to 8 on a substrate, and heating and hardening it A step of. 如申請專利範圍第11項所述的電子元件或光學元件的製造方法,其中基板為薄膜電晶體用基板。 The method of manufacturing an electronic component or an optical component according to claim 11, wherein the substrate is a substrate for a thin film transistor.
TW102125785A 2012-07-19 2013-07-18 Polysiloxane composition, cured coating, electronic device and manufacturing method thereof, and optical device and manufacturing method thereof TWI591136B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012160155 2012-07-19

Publications (2)

Publication Number Publication Date
TW201406876A true TW201406876A (en) 2014-02-16
TWI591136B TWI591136B (en) 2017-07-11

Family

ID=49948812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102125785A TWI591136B (en) 2012-07-19 2013-07-18 Polysiloxane composition, cured coating, electronic device and manufacturing method thereof, and optical device and manufacturing method thereof

Country Status (5)

Country Link
JP (1) JP6176248B2 (en)
KR (1) KR20150032528A (en)
CN (1) CN104487516B (en)
TW (1) TWI591136B (en)
WO (1) WO2014013986A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752122B (en) * 2016-11-28 2022-01-11 德商默克專利有限公司 Thin film transistor substrate with protective film and method for producing the same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6565902B2 (en) * 2015-03-18 2019-08-28 デクセリアルズ株式会社 Light emitting device manufacturing method
KR102478337B1 (en) * 2016-10-04 2022-12-19 닛산 가가쿠 가부시키가이샤 Coating composition for pattern reversal
CN108587448B (en) * 2018-04-09 2020-05-29 歌尔股份有限公司 Electronic device surface treatment method and electronic product
CN110172155A (en) * 2019-05-27 2019-08-27 武汉华星光电半导体显示技术有限公司 The preparation method and display device hardened layer material, harden layer material
JP7264771B2 (en) * 2019-08-30 2023-04-25 信越化学工業株式会社 Resist material and pattern forming method
CN110845961A (en) * 2019-10-23 2020-02-28 武汉华星光电半导体显示技术有限公司 Hardened layer material, preparation method of hardened layer material and display device
JP2021082755A (en) * 2019-11-21 2021-05-27 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH Composition for amorphous silicon formation, and production method of amorphous silicon film by use thereof
CN111574715A (en) * 2020-05-22 2020-08-25 中国乐凯集团有限公司 Composition, packaging film containing composition, preparation method of packaging film and electronic device
KR20220039575A (en) * 2020-09-21 2022-03-29 주식회사 쎄코 Compound for ultra-thin reinforced coating agent and reinforced coating agent comprising the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0118473D0 (en) * 2001-07-28 2001-09-19 Dow Corning High refractive index polysiloxanes and their preparation
JP4553113B2 (en) * 2004-06-10 2010-09-29 信越化学工業株式会社 Porous film-forming composition, pattern-forming method, and porous sacrificial film
JP5407860B2 (en) * 2008-03-18 2014-02-05 東レ株式会社 Gate insulating material, gate insulating film, and organic field effect transistor
JP5509675B2 (en) * 2008-05-30 2014-06-04 東レ株式会社 Siloxane resin composition and optical device using the same
WO2011040248A1 (en) * 2009-09-29 2011-04-07 東レ株式会社 Positive photosensitive resin composition, cured film obtained using same, and optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752122B (en) * 2016-11-28 2022-01-11 德商默克專利有限公司 Thin film transistor substrate with protective film and method for producing the same

Also Published As

Publication number Publication date
KR20150032528A (en) 2015-03-26
TWI591136B (en) 2017-07-11
CN104487516A (en) 2015-04-01
JPWO2014013986A1 (en) 2016-06-30
WO2014013986A1 (en) 2014-01-23
CN104487516B (en) 2017-10-24
JP6176248B2 (en) 2017-08-09

Similar Documents

Publication Publication Date Title
TWI591136B (en) Polysiloxane composition, cured coating, electronic device and manufacturing method thereof, and optical device and manufacturing method thereof
JP5407860B2 (en) Gate insulating material, gate insulating film, and organic field effect transistor
JP5874819B2 (en) Field effect transistor
KR101271783B1 (en) Siloxane resin composition and method for producing same
JP6064570B2 (en) Radiation sensitive resin composition for display element, cured film, method for producing cured film, semiconductor element and display element
TW201120144A (en) Positive photosensitive resin composition, a cured film and an optical device using the same
WO2013054771A1 (en) Silane composition and cured film thereof, and method for forming negative resist pattern using same
KR20200129037A (en) Radiation-sensitive composition, insulating film for display device, display device, process for forming the insulating film, and silsesquioxane
WO2013125637A1 (en) Negative photosensitive resin composition, cured film, and member for touch panel
TW201905594A (en) Negative photosensitive resin composition and cured film
JP2010026360A (en) Negative photosensitive siloxane resin composition
JP5821313B2 (en) A printing ink composition for forming an insulating film, and an insulating film formed from the printing ink composition for forming an insulating film.
JP5353011B2 (en) Siloxane resin composition, optical device using the same, and method for producing siloxane resin composition
CN116034127A (en) Silicon-containing monomer mixture, polysiloxane, resin composition, photosensitive resin composition, cured film, method for producing cured film, pattern cured film, and method for producing pattern cured film
TW201900769A (en) Transparent resin composition, transparent film, and glass substrate coated with transparent resin
JP6455160B2 (en) Radiation-sensitive composition for forming cured film, cured film, display element and method for forming cured film
JP2011219544A (en) Printing ink composition and method for producing printed matter
JP2012119423A (en) Gate insulating material, gate insulating film, and field effect transistor
JP2014084384A (en) Polysiloxane including a biphenyl skeleton and composition for film formation
JP2012158743A (en) Non-photosensitive resin composition, cured film formed therefrom, and element for touch panel having cured film

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees