TW201403834A - Micron-gap thermal photovoltaic large scale sub-micron gap method and apparatus - Google Patents

Abstract

The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.

Description

Method and device for large sub-micron gap of micro-gap thermal photoelectric

This application claims the benefit of U.S. Provisional Application No. 61/308,972, filed on Feb. 28, 2010, which is incorporated herein by reference.

The present invention relates to microgap thermal optoelectronic (MTPV) technology for thermal to electrical solid state conversion. More broadly, the present invention produces electrical power when it is inserted into a high temperature environment, such as an industrial melting furnace.

A thermo-optical device (TPV) consists of a heated black body that radiates electromagnetic energy across a gap to an optoelectronic device that converts the radiated power into electrical power. The amount of power from a known TPV device area is limited by the temperature of the hot side of the device and generally requires a very high temperature, which creates an obstacle to its actual use. In contrast, by reducing the size of the gap between the power transmitter and the receiver, a micro-gap thermoelectric (MTPV) system allows for more power transfer between the power transmitter and receiver. Compared to conventional TPVs, the achievable power density for MTPV devices can be increased by about an order of magnitude by employing sub-micron gap technology. Equally effective, for a given effective area and power density, the temperature on the hot side of the MTPV device can be reduced. This provides new applications for power on the wafer, cogeneration, and converter power.

Due to the gradual disappearance of the near-field coupling, it has been shown that the electromagnetic energy between the hot body and the cold body is transferred to the close spacing of the bodies. number. As such, the closer the bodies are, approximately one micron and lower, the greater the power transfer. For a gap spacing of 0.1 microns, it can be observed that the ratio of energy transfer factors is increased by five or even higher.

However, this dilemma is forming and then maintaining the close spacing between the two bodies in the sub-micron gap in order to maintain enhanced performance. Although it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce a concave pressure, warpage, or deformation of the elements, resulting in a change in gap spacing, thereby resulting in the power output. Uncontrollable variation.

Typically, in order to increase power output, the lower power density of prior art devices is given, which has been required to increase this temperature. However, the increase in temperature is limited by the materials of the device and system components.

Micro-gap thermoelectric (MTPV) systems are a potentially more efficient way to use photovoltaic cells to convert heat into electricity. The micro-gap thermo-optical device is an improved method of the thermo-optical device, which is a hot version of the "solar cell" technology. Both methods utilize photons to excite the ability of electrons to cross the band gap of the semiconductor and thereby generate useful current. The lower the temperature of the heat source, the narrower the band gap of the semiconductor must be to provide the best match to the input spectrum of photon energy. Only those photons having energy equal to or greater than the band gap can generate electricity. Lower energy photons can only generate heat and are a loss mechanism for efficiency. A preferred micro-gap thermo-optical system will contain heat radiation or a source of conduction to an emitter layer suspended in a sub-micron gap above the surface of the infrared sensing photocell.

By using a submicron gap between the heat radiating surface and the photocollector, we have observed that the transfer ratio of photons from solid to solid has a large gap. Can have a more enhanced ratio. In addition to only the Planck radiation law, an additional transfer mechanism is involved, although the spectral distribution of the photons is a black body spectral distribution. However, the use of sub-micron gaps implies that a vacuum environment is used to avoid excessive heat conduction across the gap by low energy photons that are unable to excite electrons into the conduction band. In order to efficiently utilize this source of heat, a high share of high energy photons must be produced. The structure used to separate the radiating surface from the photovoltaic cell must be small in diameter, and the same efficiency considerations must also be a very good thermal insulator. The photocell will generally need to be cooled slightly so that it will function properly. At high temperatures, the essential carrier creates a collector that sinks the PN junction and is no longer an effective electron.

The micro-gap thermo-optical system functions as if the emitter had an emission coefficient value greater than one. Blackbody is defined as having an emission coefficient value equal to one, and this value cannot be exceeded by the value used for large-gap radiant energy transfer. The equivalent emission coefficient factors of 5-10 have been experimentally demonstrated using gaps in the region of 0.30 to 0.10 microns.

There are at least two ways to take advantage of this phenomenon. In a comparable system, if the temperatures of the radiating surfaces are kept the same, the micro-gap thermo-optical system can be made proportionally smaller and less expensive, while producing the same amount of electricity. Alternatively, if a comparable size system is used, the micro-gap thermo-optical system will operate at very low temperatures, thereby reducing the cost of manufacturing the materials used in the system. In a preliminary assessment, by using the micro-gap technique, the operating temperature of a typical system can be calculated to be reduced from 1,400 degrees Celsius to 1,000 degrees Celsius, and still produce the same power. Output. This reduction in temperature can cause differences in the utility of the system due to the wider availability of possible materials and lower cost.

U.S. Patent Nos. 7,390,962, 6, 232, 546 and 6, 084, 173, and U.S. Patent Application Serial Nos. 12/154,120, 11/500,062, 10/895,762, 12/011,677, 12/152,196, and 12/152, 195 are incorporated herein by reference.

Additional energy transfer mechanisms have been hypothesized, and the ability to make systems using narrow thermal insulation gaps can be found in accordance with the present invention for many types of applications.

Accordingly, it is an object of the present invention to provide a novel micro-gap thermo-optical device structure that is also easier to manufacture.

It is a further object of the present invention to provide such a microgap thermal optoelectronic device that results in a high degree of thermal insulation between the emitter and the photovoltaic substrate.

It is a further object of the present invention to provide such a microgap thermoelectric device that can have a large area and can have a high throughput.

It is a further object of the present invention to provide such a microgap thermoelectric device that allows for thermal expansion of the lateral side.

It is a further object of the present invention to provide such an efficient micro-gap thermo-optical device.

It is a further object of the present invention to provide such a microgap thermoelectric device having a uniform submicron gap.

A further object of the present invention is to provide the one-micron gap thermal photoelectric device The micro-gap thermo-optical device provides greater energy transfer.

It is a further object of the present invention to provide such a one-micron gap thermo-optical device that is fabricated without the assembly of a plurality of separate components.

It is a further object of the present invention to provide a method of making a micro-gap optoelectronic device.

It is a further object of the present invention to provide a microgap device that is useful as a thermal optoelectronic system and that is also useful in other applications.

The thermo-optical systems and devices generate electrical power when they are inserted into a high temperature environment, such as an industrial melting furnace. The thermo-optical system consists of a heat and corrosion resistant vacuum sealed housing and a liquid cooled mechanical assembly with contact with the inner side wall surface of the heated housing inside the mechanical assembly.

The mechanical assembly facilitates and provides a mechanism for achieving a sub-micron pitch between the large emitter and the photovoltaic surface. The heat is conducted from the inner surface of the housing to the spectrally controlled radiator surface (the hot side). The surface of the radiator emits this heat in the form of electromagnetic energy across the submicron gap to the photovoltaic (PV) device (cold side). A portion of this heat is converted to electricity by the photovoltaic cell. The remainder of the thermal energy is removed from the opposite side of the photovoltaic cell by a liquid cooled, pinned, or heat sink with a heat sink.

A primary aspect of the design allows for intimate contact of the emitter wafers to the inside surface of the housing for good heat transfer. The photovoltaic cells are pushed outward against the emitter wafer to press them against the inner wall. a high temperature thermal interface material to improve the inner surface of the housing and the Heat transfer between transmitter wafers. The tiny spacers on the emitter wafers always maintain the hot radiating surface and the sub-micron gap between the photocells.

The mechanical assembly is designed to urge the hot and cold wafer against the inside surface of the housing as the housing heats, expands, and warps. To achieve this, the photovoltaic cells are attached to a deformable body that is capable of engaging the shape of the inside surface of the housing. The deformable system is a thin metal foil (diaphragm). The pressure is imparted to the diaphragm by a pneumatic diaphragm and a cavity filled with liquid metal.

The liquid metal bore serves two purposes: 1) imparting pressure to the back side of the diaphragm, which in turn urges the optoelectronic wafer against the emitter wafer while allowing the diaphragm to expand and contract and engage the shell The shape of the inner side surface of the body: and 2) the excess heat is carried away from the photovoltaic wafer to a liquid cooled heat sink.

The evacuated space inside the casing is an almost perfect vacuum (<10 ^-3 Torr) so that heat is not conducted through the air passing through the sub-micron gap and is not conducted to the exposed inside surface of the casing and Between the radiators.

The invention is useful because it produces electrical power from heat that would otherwise be wasted. The power can be used to power other devices in the plant or it can be sold to the utility company.

Of course, the invention disclosed herein is susceptible to many specific embodiments in various forms. Preferred embodiments of the invention are shown in the drawings and described in detail below. However, it will be appreciated that the present disclosure is an example of the principles of the invention and is not intended to limit the invention Specific embodiments of the invention.

Turning to Figure 1, Figure 1 illustrates a thermo-optical device 104 and a micro-gap thermo-optical device 106 technique in accordance with the present invention. Both techniques may use the heat of combustion from gas, oil or coal 110, nuclear energy 120, waste heat from industrial process 130, or solar heat 140. The thermo-optical device (TPV) 104 includes a heated black body 150 that radiates electromagnetic energy across a large-sized gap 190 onto the optoelectronic device 160, which converts the radiated power into electrical power. The amount of power from a given TPV device area is limited by the temperature of the hot side of the device and generally requires a very high temperature, which creates an obstacle to its actual use. By contrast, by reducing the size of the gap 195 between the power transmitter 150 and the receiver 160, the micro-scale gap 195 thermo-optical (MTPV) device 106 allows for more power between the power transmitter 150 and the receiver 160. Transfer. By employing sub-micron gap techniques, the achievable power density for the MTPV device 106 can be increased by an order of magnitude as compared to conventional TPV devices 104. Equally, for a given effective area and power density, the temperature on the hot side of the MTPV device can be reduced. This allows for new applications in power, waste heat generation and converter power on the wafer.

Due to the gradual disappearing coupling of the near field, it has been shown that the electromagnetic energy transfer between the hot and cold bodies is a function of the close spacing between the bodies. As such, the closer the bodies 170 are, approximately one micron and lower, the greater the power transfer. For a 0.1 micron gap spacing of 180, observable The ratio of energy transfer factors is increased by five or even higher. By using the submicron gap 195 between the heat radiating surface 150 and the photocollector 160, we have observed that the transfer of photons from solid to solid may have a more enhanced ratio than having a large gap 190. In addition to only the Planck radiation law, an additional transfer mechanism is involved, although the spectral distribution of the photons is a black body spectral distribution. However, the use of sub-micron gaps implies that a vacuum environment is used to avoid excessive heat conduction across the gap by low energy photons that are unable to excite electrons into the conduction band. In order to efficiently utilize this source of heat, a high share of high energy photons must be produced. The structure used to separate the radiating surface from the photovoltaic cell must be small in diameter, and the same efficiency considerations must also be a very good thermal insulator. The photocell will generally need to be cooled slightly so that it will function properly. At high temperatures, the essential carrier creates a collector that sinks the PN junction and is no longer an effective electron.

Turning to Figure 2A, Figure 2A illustrates a specific embodiment 200 of a single-sided MTPV device. This embodiment includes a thermal interface 210 for conducting heat between the outer casing exposed to high temperatures and the hot side emitter 215. The hot side emitter 215 is separated from the cold side photocell 225 by a micron gap maintained by the spacer 220. The foil diaphragm 230 is positioned between the cold side photocell 225 and a liquid metal containing chamber 235 which is maintained under controlled pressure. The pressurized chamber 235 ensures that the hot side emitter 215 and the thermal interface 210 are maintained in intimate contact with the outer casing over a wide temperature range. Adjacent to the liquid metal chamber 235 is a heat sink 240 that is continuously flowed through the coolant chamber 245. The coolant is cooled. The coolant chamber 245 is separated from the pneumatic chamber 260 by a coolant chamber seal 250 and a pneumatic chamber flexible seal 255. The pneumatic chamber 260 is maintained at a controlled pressure to further ensure the heat sink 240, the liquid metal chamber 235, the cold side emitter 225, the hot side emitter 215, the thermal interface 210, and Close contact is maintained between the outer casings. A pneumatic chamber fixed seal 265 is positioned between the pneumatic chamber 260 and the cooling water manifold 270 that is connected to the continuously supplied circulating cooling water for cooling the heat sink 240.

Turning to Figure 2B, Figure 2B illustrates a specific embodiment 205 of a two-sided MTPV device. The two-sided MTPV device includes the structure described above with respect to FIG. 2A and an additional structure that is an inverted image of the structure shown in FIG. 2A and that is attached to the shared cooling water manifold 270. This structure is capable of collecting heat from both sides of the MTPV device.

Turning to Figure 3, Figure 3 illustrates a specific embodiment 300 showing the operation of the MTPV device. The MTPV device 305 is exposed to a radiated and conducted heat flux 310 that heats the outer surface and the hot side of the hot side/cold side pair 320, 330. A vacuum is maintained inside the MTPV device 305, and the cold side photovoltaic cells are cooled from the inside by circulating water 340,350. Output power 360, 370 is obtained by the device 305.

Turning to Figure 4, Figure 4 illustrates a practical embodiment 400 of a cross-sectional view of the front end of a "Quad" MTPV device. The Quad MTPV device is used to implement the basic building blocks of the MTPV technology. The front end includes a thermally conductive graphite interface 410 between the high temperature outer casing and the hot side emitter 420. Micron The gap 430 is maintained between the hot side emitter 420 and the cold side photocell 440. A foil diaphragm 450 is positioned between the cold side emitter 440 and the liquid metal chamber 460. The surface of the heat sink 470 and the foil diaphragm 450 surround the liquid metal chamber 460.

The purpose of the emitters 420 is to absorb heat from the inside of the outer casing of the Quad MTPV device. The emitter wafer 420 is typically, but not necessarily, made of tantalum and has a micromachined ceria spacer on the side of the gap. The smooth side of the emitter 420 is pressed against the inside of the hot outer casing. A graphite thermal interface material 410 is sandwiched between the emitter 420 and the outer casing to improve heat transfer. The outer casing is heated by the radiation and convection energy in a blast furnace, and the heat is conducted through the outer casing, over a thermal interface material 410, and into the crucible emitter 420, causing the crucible emitter 420 to become very heat.

The photovoltaic cells 440 are designed to convert a portion of the light emitted by a hot body into electrical power. More specifically, the photovoltaic cells 440 have a very flat surface such that a very small vacuum gap is formed as they are pressed against the spacers on the radiation surface 420. The spacers are designed such that little thermal flow is conducted by the hot emitter 420 to the relatively cool photovoltaic cell 440. The photocell 440 and emitter 420 are also made of a high index material to achieve the maximum number of near field coupling energy enhancements. A certain percentage of the light transmitted by the emitters 420 to the photovoltaic cells 440 is converted to electricity.

Turning to Figure 5, Figure 5 is a cross-sectional view 500 of a Quad MTPV device. This view is a macroscopic perspective view of the elements shown in Figure 4. The Quad The MTPV device includes a water distribution housing, also known as a cooling water manifold 510, telescoping hose sub-assembly 560, 570, radiator sub-assembly 470, pneumatic sub-assembly 530, 540, 550, liquid metal compartment 460 (see also Figure 4), diaphragm and optoelectronic subassembly 440, 450 (see also Figure 4), hot side emitter array 410, 420 (see also Figure 4), and linear actuator pressure regulator (in the water distribution housing) Inside). These elements form the basic Quad MTPV device building block. One or more Quad MTPV devices are typically enclosed in an evacuated attachment or thermal enclosure that is exposed to high temperatures for electrical power generation.

The diaphragm 450, liquid metal 460, heat sink 470, and telescoping hose subassembly 570 have many coupling functionalities. The metal bellows 570 transfers water between the water distribution housing 510 and the heat sink 470, a set of telescoping hoses 570 on the inlet side, and another set of telescoping hoses on the outlet side. The telescoping hoses 570 also function as expansion joints such that the telescoping hoses 570 are elongated as the outer casing heats and expands. The telescoping hoses 570 are always compressed such that they provide a force to urge the heat sink and diaphragm assembly toward the hot cover member such that the photovoltaic cells 440 are pushed against the emitter spacers And pushing the emitter 420 against the hot wall. Although the heat sink 470 has an internal space for allowing water to pass through, the heat sink 470 is also used as a suspension platform for the photovoltaic cells. Through the expansion and contraction of the telescoping hoses 570, the platform can be moved in and out and tilted about the two axes. This manner of engagement allows the photovoltaic array 420 to macroscopically conform to the orientation of the hot outer casing. The flexible diaphragm 450 is here to treat the curvature of the hot outer casing.

The diaphragm 450 is used for the second suspension of the wafers. The first suspension The set handles the rigid body action due to thermal expansion and is tilt biased due to machining tolerances and differential temperature heating. The diaphragm 450 is a flexible suspension for the photovoltaic cells 440 that allows the photovoltaic cells of the array to be pushed against the emitters 420 and bent and stretched such that the wafers conform to the curved shape of the outer casing. Note that when the heat is orthogonal to a plate, it is important that there is a temperature drop across the plate which causes thermal bending, or distortion. The photovoltaic cells 440 are bonded to the diaphragm 450. The metal diaphragm 450 has an insulating layer and a patterned layer of an electrical conductor. In this sense, the diaphragm 450 acts as a printed circuit board that bundles the photovoltaic cells 440 in series and/or in parallel and carries the electrical power to the edges of the diaphragm 450.

The diaphragm 450 is sealed to the platform around the edges leaving a small gap between the diaphragm 450 and the platform. This space is then filled with liquid metal. The liquid metal has a dual purpose. First, it provides a thermal path between the photovoltaic cells 440 and the heat sink 470. Second, because it is a fluid, it allows the diaphragm 450 to expand and contract.

The hot outer casing is made of high temperature metal and is securely closed after the Quad MTPV device is placed inside. The dimensions of the enclosure depend on the number and distribution of the Quad MTPV devices. The inner side surfaces are polished such that they have a low emission coefficient. The outer surfaces are deliberately oxidized to the black top layer such that they will absorb more radiant heat from the blast furnace. The housing has a through port for cooling fluid, vacuum pumping, and electrical wiring.

The pneumatic subassembly 530, 540, 550 is disposed between the water distribution housing 510 and the heat sink 470. Parallel to the telescoping hoses 570, the pneumatic The diaphragm 530 pushes the heat sink 470 outward toward the hot outer casing such that the photocell 440 and the emitter 420 are squeezed between the diaphragm 450 and the hot outer casing. With the appropriate amount of aerodynamic force and pressure in the liquid metal cavity, the diaphragm 450, the wafer, and the outer casing will all adopt the same shape, and the gap between the emitter 420 and the photocell 440 will be uniform (but not Must be flat).

The heat flows into the outer casing, through the thermal interface material 410, and into the emitter 420. It is then irradiated across the submicron vacuum gap to the photocell 440 where a portion of the energy is converted to electricity and removed by metallization on the surface of the diaphragm. The remainder of the heat passes through the diaphragm 450, liquid metal, copper, copper pins, and into the cooling water that is being continuously replenished.

If the photovoltaic cells 440 are all placed in series, the bypass diodes can be connected to the ends of each column of cells so that if the photovoltaic cells 440 in a column fail, all of the photovoltaic cells of the column can be bypassed, and Current will be delivered to the next column of photovoltaic cells.

Turning to Figure 6, Figure 6 illustrates the entire Quad MTPV device 600 mounted on the end of its assembly. The hot side emitter arrays 410, 420, diaphragm and optoelectronic assemblies 440, 450, liquid metal chamber 460, heat sink 470, water distribution housing 510, pneumatic chamber 540, electrical connector 610 are shown in FIG. And pneumatic connectors 620, 630.

The linear actuator includes a motor and a lead screw and is disposed inside the water distribution housing 510. The purpose is to control the amount of liquid behind the diaphragm 450. The actuator drives a piston that is attached to the rolling diaphragm. The interior of the diaphragm is filled with a liquid metal that can be pumped through a passage that conducts to the liquid metal/membrane chamber 460. To increase or decrease in The number of liquid metals behind the diaphragm 450 is driven externally or inwardly, respectively. The actuator is also used to control the pressure in the liquid metal. A mold spring is coupled between the linear actuator and the piston. The force from the actuator passes through the spring and into the piston such that the spring is always compressed. This allows the actuator to adjust the liquid metal pressure even though the piston remains stationary. The compression of the mold spring is directly related to the liquid metal pressure.

Turning to Figure 7, Figure 7 illustrates the various components that are assembled to form a Quad MTPV device 700. These parts include a photovoltaic array 710 and a heat sink top 715, a heat sink bottom 720, a water housing top cover 735, a servo meter telescoping hose 725, a water housing side cover 730, a water housing 740, a telescoping hose connector. 745, servo metering flexible hose 750, and telescopic hose fitting 755.

Turning to Figure 8, Figure 8 illustrates a fully assembled Quad MTPV device 800. As shown in FIG. 8, the Quad MTPV device includes a photovoltaic array 710 and a heat sink top 715, a servo metering flexible hose 725, a water housing side cover 730, a water housing 740, and electrical and pneumatic connections to an external control module. 770.

Turning to Figure 9, Figure 9 illustrates a single Quad MTPV device 900 within its housing and the top cover of the housing has been removed. Shown is a fully assembled Quad MTPV device 800, a hot outer casing 910, water coolant connections 930, 940, and a vacuum port 920 as shown in FIG. A connector that is not shown is a connection to the pneumatic control module.

Turning to Figure 10, Figure 10 illustrates the Quad that slides through the furnace wall into its hot outer casing. MTPV device module 1000. The display is a Quad MTPV device 800, a hot outer casing 1020, a furnace wall 1030, a Quad MTPV device module attachment 910, a water coolant connection 930, 940, and to an electrical equipment, a vacuum control module, and a pneumatic control module. The connector of group 1010.

Turning to Figure 11, Figure 11 shows a module comprising four Quad MTPV devices and a coolant connection 1100. It can include up to four double-sided Quad MTPV device modules 800 and coolant connections 1130, 1140.

Turning to Figure 12, Figure 12 shows an array of Quad MTPV device modules 1200 that are connected to a common coolant line. It shows 24 Quad MTPV device modules 800 that are connected to a common coolant line 1230, 1240. While each Quad MTPV device contains an array of photovoltaic cells and emitter wafers, a panel may contain an M x N array of Quad MTPV devices, where the M and N systems are greater than or equal to one. The array of Quad MTPV devices can be connected together by cooling tubes such that the cells are cooled in series or in parallel.

Turning to Figure 13, Figure 13 shows the control modules required to be connected to an MTPV panel comprising one or more Quad MTPV devices 1300. The display is an MPTV panel 1350, a cooling control module 1310, a vacuum control module 1320, and a pneumatic pressure control module 1330.

The detailed description of the nature and the aspects of the present invention should be understood by reference to the accompanying drawings in which Thermal photoelectric and micro-gap thermal photoelectric technology of the present invention; 2A illustrates a specific embodiment of a single-sided MTPV device; FIG. 2B illustrates a specific embodiment of a dual-sided MTPV device; FIG. 3 illustrates a specific embodiment 300 of operation of the MTPV device; FIG. 4 illustrates "four groups of (Quad) A practical embodiment of a cross-sectional view of the front end of the MTPV device; Figure 5 is a cross-sectional view 500 of the Quad MTPV device; Figure 6 illustrates the entire Quad MTPV device mounted on the end of its assembly: Figure 7 illustrates Assembly to form the various components of the Quad MTPV device; Figure 8 illustrates a fully assembled Quad MTPV device; Figure 9 illustrates a single Quad MTPV device in its housing with its top cover removed; Figure 10 illustrates the furnace The Quad MTPV device module with the wall sliding into its hot outer casing; Figure 11 shows a module containing four Quad MTPV devices and coolant connections; Figure 12 shows an array of Quad MTPV connected to a common coolant line. The device module; and Figure 13 shows the control modules required to be connected to an MTPV panel comprising one or more Quad MTPV devices.

Claims (25)

A method of converting thermal energy into electrical power using sub-micron gap thermal optoelectronic technology, comprising the steps of: collecting thermal energy from an inner surface of a thermally conductive casing by a collecting surface of a radiation emitting layer, the outer surface of the casing being exposed to high temperature heat a source of energy; maintaining a distance between the receiving surface of the photovoltaic cell and the radiating surface of the radiation emitting layer of less than one micron; receiving electromagnetic radiation from the radiating surface for generating electricity by the photovoltaic cell; a pressurized, thermally conductive, deformable diaphragm provides pressure on the photovoltaic cell for maintaining the collection surface of the radiation emitting layer in intimate contact with the inner surface of the housing and for maximizing cooling; and in conducting the heat transfer The deformable diaphragm contacts the heat sink to provide pressure for maximizing cooling. A method of converting thermal energy into electrical power using sub-micron gap thermo-optical technology, as in claim 1, further includes establishing a vacuum between the radiating surface and the receiving surface for minimizing heat transfer. A method of converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 2, wherein the vacuum system is less than 10 ^-3 Torr. For example, the method of using the sub-micron gap thermo-optical technology to convert thermal energy into electric power, as in claim 1, further includes maintaining a vacuum inside the casing. A method for converting thermal energy into electric power using sub-micron gap thermo-optical technology, as in the first application of the patent scope, wherein the receiving surface of the photovoltaic cell The distance between the radiating surfaces of the radiation-emitting layer is typically between 0.10 and 0.30 microns. A method of converting thermal energy into electrical power using sub-micron gap thermo-optical technology, as in claim 1, further comprising maintaining a distance between a receiving surface of the photovoltaic cell and a radiating surface of the radiation radiating layer by using a thermally insulating spacer. A method of converting thermal energy into electrical power using sub-micron gap thermo-optical technology, as in claim 1, wherein the deformable diaphragm is pressurized by a linear actuator and a cavity filled with liquid metal. For example, the method of using the sub-micron gap thermo-optical technology to convert thermal energy into electric power, as in claim 1, further includes placing a thermal interface between the collecting surface of the radiation emitting layer and the inner surface of the heat conducting casing. A method of converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 8, wherein the thermal interface comprises thermally conductive graphite. The method of using the sub-micron gap thermo-optical technology to convert thermal energy into electric power, as in claim 1, further comprising reducing the photocell, the radiator, the liquid metal chamber by circulating a coolant liquid through the radiator cavity, And the temperature of the deformable membrane. A method of converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 10, further includes dispensing a coolant liquid by using a flexible bellows and a water distribution housing. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, including: a collecting surface of the radiation radiation layer for collecting thermal energy from the inner surface of the heat conducting casing, the outer surface of the casing being exposed to a source of high temperature heat energy; the receiving surface of the photovoltaic cell being maintained from the radiation surface of the radiation emitting layer At a distance of one micron; electromagnetic radiation from the radiating surface is received by the receiving surface for generating electricity by the photovoltaic cell; the photovoltaic cell is pressurized by a pressurized, thermally conductive, deformable membrane Maintaining the collection surface of the radiation emissive layer in intimate contact with the inner surface of the housing and for maximizing cooling; and the heat sink being pressurized to contact the thermally conductive deformable diaphragm for maximizing cooling Chemical. A device for converting thermal energy into electric power using sub-micron gap thermo-optical technology, as in claim 12, further includes placing a thermal interface between the collecting surface of the radiation emitting layer and the inner surface of the thermally conductive casing. For example, in the scope of claim 12, sub-micron gap thermo-optical technology is used to convert thermal energy into electric power, wherein the thermal interface is composed of heat-conducting graphite. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 12, wherein a vacuum is maintained between the radiating surface and the receiving surface. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 12, wherein a vacuum is maintained within the housing. For example, in the scope of claim 12, sub-micron gap thermo-optical technology is used to convert thermal energy into electric power, and thermal insulation spacers are used for The distance between the receiving surface of the photovoltaic cell and the emitting surface of the radiation emitting layer is maintained. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 12, wherein the deformable diaphragm is pressurized by a linear actuator and a cavity filled with liquid metal. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 12, and a coolant liquid distributed via the use of a flexible bellows and a water distribution housing. A device for converting thermal energy into electrical power using sub-micron gap thermo-optical technology, comprising a housing for a component surrounding a Quad MTPV device, the device comprising: an array of emitter wafers maintained via a graphite thermal interface and the housing Intimate thermal contact; the diaphragm and the photovoltaic array subassembly are separated from the emitter wafer array by a thermally insulating spacer; a liquid metal chamber in contact with the diaphragm for maintaining the emitter wafer array and the housing The body maintains intimate thermal contact; a heat sink subassembly for receiving cooling of the diaphragm, the liquid metal chamber and the liquid coolant for the photovoltaic array; and a water distribution housing for dispensing liquid coolant via the telescopic hose subassembly to a heat sink subassembly; a pneumatic subassembly for maintaining the heat sink in intimate contact with the liquid metal coolant and the photovoltaic array; and a linear actuator or pressure actuator for maintaining the pneumatic subassembly The pressure. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 20, wherein a vacuum is maintained within the housing. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 20, wherein the diaphragm is pressurized by the linear actuator and a cavity filled with liquid metal. A device for converting thermal energy into electricity using sub-micron gap thermo-optical technology, as in claim 20, wherein the Quad MTPV device contains a plurality of photovoltaic and emitter wafer arrays. For example, in claim 20, the sub-micron gap thermo-optical technology is used to convert thermal energy into electric power, wherein the casing may be a M x N array of Quad MTPV devices, wherein the M and N systems are greater than or equal to one. For example, in the scope of claim 20, the sub-micron gap thermo-optical technology is used to convert thermal energy into electric power, and further includes a cooling control module, a vacuum control module, and a pneumatic pressure control module.