MX2012009270A - Micron-gap thermal photovoltaic large scale sub-micron gap method and apparatus. - Google Patents

Abstract

The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic ceils are pushed outward against the emitter chips in order to press them against the inner wail. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.

Description

METHOD AND APPARATUS OF SUBMICROSEPARACION A GRAN ESCALA PHOTOVOLTAIC THERMAL MICROSEPARATION FIELD OF THE INVENTION The present invention relates to thermal photoelectric microseparation (MTPV) technology for the conversion in the solid state of heat to electricity. More broadly, the invention generates electric power when it is inserted in a high temperature environment such as an industrial melting furnace.

BACKGROUND OF THE INVENTION Thermo-photovoltaic (TPV) devices consist of a heated black body which radiates electromagnetic energy through a separation on a photovoltaic device which converts the radiant energy into electrical energy. The amount of energy of a given area of the POS device is limited by the temperature of the hot side of the device and generally requires very high temperatures, which generates limits for its practical use. In contrast, thermal photoelectric microseparation (MTPV) systems allow the transfer of more energy between the emitter and receiver of energy by reducing the size of the separation between them. Through the use of sub-micro-spread technology, the energy density available for MTVP devices can be increased by approximately one order of magnitude compared to a conventional POS. Equivalently, for a given active area and energy density, the temperature on the hot side of the MTPV device can be reduced. This allows new applications for energy in a chip, waste heat energy generation and energy converters.

It has been shown that the transfer of electromagnetic energy between a hot body and a cold body is a function of the close separation of bodies due to evanescent coupling of nearby fields. In this way, the closer the bodies are, approximately to a micrometer or less, the greater the energy transfer will be. For separations from a distance of 0.1 micrometers, increases in the factor energy transfer rate of five and greater are observed.

However, the dilemma is to form and then maintain the narrow distance between two bodies in a submicroseparation in order to maintain an improved performance. Although it is possible to obtain a submicroseparation distance, the thermal effects on the hot and cooled surfaces induce widening, warping or deformation of the elements resulting in variations in the separation distance resulting in uncontrollable variations in the energy output.

Typically, in order to increase the energy output, given the lower energy density of the devices of the prior art, it has been necessary to increase the temperature. However, temperature increases are limited by the material of the device and the components of the system.

Thermal photoelectric microseparation (MTPV) systems are a potentially more efficient way to use photovoltaic cells to convert heat to electricity. Thermal photoelectric microseparation devices are an improved method of thermal photovoltaic equipment which is the thermal version of the "solar cell" technology. Both methods use the ability of photons to excite electrons through the band gap of a semiconductor and thus generate useful electrical current. The lower the temperature of the heat source, the narrower the semiconductor band gap must be to provide the best match with the incoming energy spectrum of the photons. Only those photons with energy equal to or greater than band separation can generate electricity. Photons with less energy can only generate heat and are a mechanism of loss for efficiency. A preferred thermal microeparation photovoltaic system includes a heat source irradiated or transported to a emitting layer which is suspended at a submicroscreen above the surface of an infrared detector photovoltaic cell.

By utilizing submicroseparation between a heat emitting surface and a photovoltaic collector, an increased photon transfer rate from solid to solid is observed than is possible with large separations. Additional transfer mechanisms are involved besides simply Planck's law of irradiation, although the spectral distribution of the photons is that of a blackbody. However, the use of submicroseparations means that an empty environment is used to avoid excessive heat conduction through separation by low energy photons that can not excite the electrons in the conduction band. To make efficient use of the heat source, a high fraction of high energy photons must be generated. The structure used to separate the emitting surface of the photovoltaic cell must be of small diameter and also a very good thermal insulator for the same considerations of efficiency. The photovoltaic cell should generally be cooled in a certain way so that it works properly. At high temperatures, the generation of intrinsic carrier pools the PN junction and is no longer an efficient electron collector.

Thermal photoelectric microseparation systems work as the emitter having an emissivity value greater than one is considered. The definition of a black body is that it has an emissivity value equal to one and this value can not be exceeded for large separation radiant energy transfer. Equivalent emissivity factors of 5-10 have been experimentally demonstrated using separations in the region of 0.30 to 0.10 micrometers.

There are at least two ways to take advantage of this phenomenon. In a comparable system, if the temperature of the emitting surfaces remains the same, the thermal photoelectric microseparation system can be made proportionally smaller and cheaper while producing the same amount of electricity. Or, if a system of comparable size is used, the thermal microeparation photovoltaic system will operate at a considerably lower temperature so that the cost of materials used in the elaboration of the system will be reduced. In a preliminary calculation, it is considered that by using microseparation technology the operating temperature of a typical system can be reduced from 1.40"0 ° C to 1,000 ° C and still produce the same output of electricity. in the temperature it can generate a difference in the practicality of the system due to a greater availability and lower cost of possible materials.

The US patents are incorporated herein by reference. 7,390,962; 6,232,546 and 6,084,173 as well as the patent applications of E.U.A. 12 / 154,120; 11 / 500,062; 10 / 895,762; 12 / 011,677; 12 / 152,196 and 12 / 152,195.

Additional energy transfer mechanisms have been postulated and the ability to build systems using thermally isolated, narrow separations can find use in many types of applications in accordance with the present invention.

BRIEF DESCRIPTION OF THE INVENTION Therefore, an object of the invention is to provide a novel microseparation thermal photovoltaic device structure that is also easier to manufacture.

A further objective of this invention is to provide a thermal microeparation photovoltaic device that results in high thermal insulation between the emitter and the photovoltaic substrate.

A further objective of the invention is to provide a thermal microeparation photovoltaic device which can have a large area and be capable of high performance.

A further objective of this invention is to provide a thermal photoelectric microeparation device that allows lateral thermal expansion.

A further objective of the invention is to provide the thermal microeparation photovoltaic device which is efficient.

A further objective of this invention is to provide a thermal microeparation photoelectric device with a uniform submicrospraying.

A further objective of this invention is to provide a thermal microeparation photovoltaic device which provides greater energy transfer.

A further objective of this invention is to provide a thermal photoelectric microseparation device which is constructed without assembling multiple separate pieces.

A further objective of this invention is to provide a method for making a photoelectric microseparation device.

A further objective of this invention is to provide a microseparation device useful as a thermal photovoltaic system and also useful in other applications.

The thermophotovoltaic system and apparatus generates electrical energy when it is inserted in a high temperature environment, such as an industrial melting furnace. It consists of a vacuum-tight cover, resistant to heat and corrosion and a mechanical assembly cooled by liquid inside that makes contact with the inner walls of the heated cover.

The mechanical assembly facilitates and provides a means to obtain submicroseparation between a large emitter and photovoltaic surfaces. Heat is conducted from the inner surface of the cover to a spectrally controlled radiator surface (hot side). The radiator surface emits heat in the form of electromagnetic energy, through a submicroseparation to a photovoltaic (PV) device (cold side). A portion of the heat is converted to electricity by the photovoltaic cell. The rest of the thermal energy is removed from the opposite side of the photovoltaic cell by a heat sink cooled with liquid, with nails or with fins.

A major aspect of the design is to allow close contact of the emitter chips with the inner surface of the cover so that there is good heat transfer. The photovoltaic cells are pushed out against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves heat transfer between the inner surface of the cover and the emitter chip. The thin separators on the emitter chips always maintain a submicroseparation between the hot radiating surface and the photovoltaic cells.

The mechanical assembly is designed to push the hot and cold chips against the interior surface of the roof as the roof warms, expands and warps. To obtain this, the photovoltaic cells are joined to a deformable body that is able to adapt to the shape of the inner surface of the cover. The deformable body is a thin metal foil (membrane). Pressure is imparted to the membrane by means of a pneumatic diaphragm and a cavity filled with liquid metal.

The liquid metal cavity serves two purposes: 1) to impart pressure to the back side of the membrane which in turn pushes the photovoltaic chips against the emitter chips while allowing the membrane to flex and adapt to the shape of the surface interior of the cover; and 2) to transfer the excess heat away from the photovoltaic system to a heat sink cooled with liquid.

The empty space inside the cover is an almost perfect vacuum (<10 ~ 3 Torr) so that heat is not conducted by air through the submicroseparation and between the exposed indoor deck surfaces and the heat sink.

This invention is useful because it generates electrical energy from heat that would otherwise be wasted. The electricity can be used to power other devices within the plant or it can be sold to a power company.

Of course, the invention described herein is capable of materializing in many different ways. In the drawings, preferred embodiments of the invention are shown and described in the following. However, it should be understood that the present disclosure is an exemplification of the principles of the invention and does not limit the invention to the illustrated embodiments.

BRIEF DESCRIPTION OF THE FIGURES For a further understanding of the nature and objects of the present invention, reference should be made to the following detailed description, taken in conjunction with the accompanying figures in which similar elements are provided with like reference numbers or the like, and wherein: Figure 1 illustrates the thermophotovoltaic and thermophotovoltaic microseparation technology, according to the present invention; Figure 2A illustrates one mode of a single side MTPV device; Figure 2B illustrates an embodiment of a two-sided MTPV device; Figure 3 illustrates an operation mode 300 of the MTPV device; Figure 4 illustrates a practical embodiment 400 of a cross-sectional view of a front end of a "Quad" MTPV device; Figure 5 is a cross sectional view 500 of a Quad; Figure 6 illustrates a complete Quad mounted at the end of its assembly; Figure 7 illustrates the various parts that are assembled to form a Quad; Figure 8 illustrates a completely assembled Quad; Figure 9 illustrates a single Quad within its housing with its upper cover removed; Figure 10 illustrates a Quad module slid into its heated housing through a furnace wall; Figure 11 shows a module containing four Quad in refrigerant connection; Figure 12 shows an array of Quad modules connected to common refrigerant lines; Y Figure 13 shows the required control modules connected to an MTPV panel comprising one or more Quad.

DETAILED DESCRIPTION OF THE INVENTION With reference to Figure 1, Figure 1 illustrates the thermophotovoltaic 104 and thermophotovoltaic 106 microseparation technologies, in accordance with the present invention. Both technologies can use heat from the combustion of gas, oil or coal 110, nuclear energy 120, waste heat from industrial processes 130 or solar heat 140. The thermophotovoltaic (TPV) devices 104 consist of a heated black body 150 which radiates electromagnetic energy through a macro-scale separation 190 on a photovoltaic device 160 which converts the radiant energy into electrical energy. The amount of energy extracted from a given area of the POS device is limited by the temperature of the hot side of the device and generally requires very high temperatures, which creates limitations to its practical use. In contrast, the microspreach 195 thermophotovoltaic (MTPV) devices 106 allow the transfer of more energy between the power emitter 150 and the receiver 160 by reducing the size of the separation 195 between them. By using submicroseparation technology, the available energy density for the 106 MTPV devices can be increased by approximately one order of magnitude compared to conventional POS devices. Equivalently, for a given active area and energy density, the temperature on the hot side of an MTPV device can be reduced. This allows new applications for chip energy, energy generation with waste heat and energy converters.

It has been shown that the transfer of electromagnetic energy between a hot body and a cold one is a function of the close separation of the bodies due to evanescent coupling of the nearby fields. In this way, the closer the bodies 170 are, approximately to a micrometer or smaller, the greater the energy transfer. For a separation with a distance 180 of 0.1 micrometers, increases in the rate of energy transfer after five and greater have been observed. By utilizing submicrospheres 195 between a light emitting surface 150 and a photovoltaic collector 160, an increased photon transfer rate from solid to solid is observed compared to that which is possible with large separations 190. Additional transfer mechanisms are involved besides simply Planck's law of irradiation, although the spectral distribution of photons is that of a black body. However, the use of submicrosupplies implies that an empty environment is used to avoid excessive heat conduction through separation by low energy photons that can not excite the electrons in the conduction band. To make an efficient use from the heat source, a high fraction of high energy photons must be generated. The structure used to separate the emitting surface of the photovoltaic cell must be both small in diameter and also with very good thermal insulator for the same considerations of efficiency. The photovoltaic cell should generally be cooled to a certain extent so that it functions properly. At high temperatures, the generation of intrinsic carrier bogs down the PN junction and is no longer an effective electron collector.

Returning to FIG. 2A, FIG. 2A illustrates a mode 200 of a single-sided POS device. The embodiment includes a thermal interface 210 for conducting heat between the housing that is exposed to a high temperature and an emitter 215 on the hot side. The emitter 215 on the hot side is separated from a photovoltaic cell 225 on the cold side by a microseparation which is maintained by the separators 220. A foil membrane 230 is placed between the photovoltaic part 225 on the cold side of the chamber 235 which contains a metal liquid that is maintained under controlled pressure. This pressurized chamber 235 ensures that the emitter 205 on the hot side and the thermal interface 210 are kept in close contact with the housing over a wide temperature range. Adjacent to the liquid metal chamber 235 is a heat sink 240 which is cooled by a continuous flow of refrigerant in a refrigerant chamber 245. The chamber 245 of the refrigerant is separated from a pneumatic chamber 260 by a refrigerant chamber seal 250 and a pneumatic chamber flexible seal 255. The pneumatic chamber 260 is maintained at a controlled pressure to further ensure that close contact is maintained between the heat sink 240, the liquid metal chamber 235, the cold side emitter 225, the hot side emitter 215, the thermal interface 210 and the accommodation. A fixed seal 265 of the pneumatic chamber is placed between the pneumatic chamber 260 and a cooling water manifold 270 which is connected to a continuous supply of circulating cooling water for cooling the heatsink 240.

Returning to Figure 2B, Figure 2B illustrates a mode 205 of a two-sided MTPV device. The two-sided MTPV device includes the structure described above in relation to FIG. 2A and an additional structure that is an inverted image of that shown in FIG. 2A attached to a common cooling water manifold 270. This structure allows the collection of heat from both sides of an MTPV device.

Returning to Figure 3, Figure 3 illustrates a mode 300 showing the operation of the MTPV device. The device 305 MTPV is exposed to a flow 310 of radiant and convective heat which heats the outer surface and the hot side of the hot side / cold side 320, 330. It is kept empty inside the device 305 MTPV and the photovoltaic cell on the cold side it is cooled from the inside by circulating water 340, 350. The output energy 360, 370 is obtained from the device 305.

Returning to Figure 4, Figure 4 illustrates a practical embodiment 400 of a cross-sectional view of a front end of a "Quad" MTPV device. The Quad is a basic building block to implement MTPV technology. The front end includes a thermally conductive graphite interface 410 between a high temperature housing and a hot side emitter 420. A microseparation 430 is maintained between the emitter 420 on the hot side and a photovoltaic cell 440 on the cold side. A foil membrane 450 is placed between the transmitter 440 on the cold side and a chamber 160 of liquid metal. A surface of a heatsink 470 and the foil membrane 450 encloses the liquid metal chamber 460.

The purpose of the emitters 420 is to absorb heat from the interior of the Quad housing. A chip emitter 420 typically, although not necessarily made of silicon and has micromachined silicon dioxide separators on the separation side. The uniform side of the emitter 420 is pressed against the interior of the hot housing. A graphite thermal inferium material 410 is interposed between the emitter 420 and the housing to improve heat transfer. The housing is heated by radiant and convective energy inside a furnace and heat is conducted through the housing, through a thermally inferible material 410 and inside the silicon emitter 420 which causes it to become very hot.

Photovoltaic cells 420 are designed to convert part of the light emitted from a hot body into electricity. More specifically, the photovoltaic cells 440 have a very flat surface so that when they are pressed against the separators on the emitting surface 420 a very small vacuum gap is formed. The spacers are designed so that very little heat flow is conducted from the hot emitter 420 to the relatively cold photovoltaic cell 440. The photovoltaic cell 440 and the emitter 420 are also manufactured from high index materials to obtain a maximum amount of near-field coupled energy enhancement. A percentage of the light that passes from the emitters 420 to the photovoltaic cells 440 is converted into electricity.

Returning to Figure 5, Figure 5 is a cross sectional view 500 of a Quad. This view is a macroscopic perspective that includes the elements shown in Figure 4. The Quad includes a water distribution housing, also known as a refillable water manifold 510, a bellows sub-assembly 560, 570, a sub-assembly 470 of heat sink, a pneumatic sub-assembly 530, 540, 550, a liquid metal compartment 460 (see also figure 4), a membrane and a photovoltaic sub-assembly 440, 450 (see also figure 4), an emitting arrangement of the side hot 410, 420 (see also Figure 4) and a linear actuator pressure regulator (within the water distribution housing). These elements form the basic Quad building block. Normally one or more Quad encloses in an evacuated enclosure or hot housing that is exposed to high temperatures to generate electrical power.

The membrane 450, the liquid metal 460, the heat sink 470 and the bellows sub-assemblies 570 are highly functionally coupled. The metal bellows 570 transfers water between the water distribution housing 510 and the heat sink 470, a set of bellows 570 on the input side in the other assembly on the output side. The bellows 570 also act as expansion joints so that when the housing is heated and expanded, the bellows 570 become enlarged. The bellows 570 are always compressed in a way that they provide a force that pushes the heat sink and the membrane assemblies towards the hot cover, and in this way push the photovoltaic cells 440 against the emitter separators and push the emitter 420 against a hot wall. While the heat sink 470 has internal holes for water to pass through, it also acts as a suspended platform for the photovoltaic cells. By flexing the bellows 570, the platform can move in and out and tilt around two axes. This articulation allows the photovoltaic array 420 to adapt, macroscopically, to the orientation of the hot housing. The flexible membrane 450 is located there to adapt to the curvature of the hot housing.

The membrane 450 is a second suspension for the chips. The first suspension takes care of rigid body movements due to thermal expansion and tilt deviations due to machining tolerances and differential heating. The membrane 450 is a flexible suspension for the photovoltaic cells 440 which allows the arrangement of the cells to push against the emitters 420 and bend and flex so that the chips adapt to the curved shape of the housing. It is important to note that when heat flows normally to a flat plate, there is a temperature drop across the plate which causes thermal bending or warping. The photovoltaic cells 440 are joined to the membrane 450. The metal membrane 450 has an insulating layer and a layer with a pattern of electrical conductors. In this sense, the membrane 450 acts as a printed circuit board, joining the photovoltaic cells 440 in series and / or parallel and transporting the electricity to the edge of the membrane 450.

The membrane 450 is sealed around the edges to the platform, desiring a small separation between the membrane 450 and the platform. This space is then filled with liquid metal. Liquid metal has two purposes.

First, it provides a thermal path between the photovoltaic cells 440 and the heat sink 470. Second, because it is a fluid, it allows the membrane 450 to flex.

The hot housing is made of high temperature metal and closes securely after quads are placed inside. The size of the accommodation depends on the number and distribution of the Quads. The interior surfaces are polished so that they have a low emissivity. The exterior surfaces are intentionally oxidized to a black finish so that they will absorb more radiant heat from the oven. The housing has through holes for cooling fluid, vacuum pump and electrical cables.

The pneumatic sub-assembly 530, 540, 550 is housed between the water distribution housing 510 and the heatsink 470. In parallel with the bellows 570, the pneumatic diaphragm 530 pushes the heatsink 470 outward towards the hot housing, and for it thus compresses the photovoltaic cells 440 and the emitters 420 between the membrane 450 and the hot housing. With the appropriate amount of pneumatic force and pressure in the liquid metal cavity, the membrane 450, the chips and the housing will acquire the same shape and the separation between the emitter 420 and the photovoltaic cells 440 will be even (though not necessarily flat).

The heat flows into the housing, through the thermal interface material 410 and into the emitter 420. It is then irradiated through a submicron vacuum gap to the photovoltaic cell 440, where part of the energy is converted to electricity and is extracted by the metallization of the membrane surface. The rest of the heat passes through the membrane 450, the liquid metal, copper, copper bolts and into the cooling water, which is constantly replenished.

If the photovoltaic cells 440 are all placed in series, the bypass diodes can be connected at the ends of each row of cells. so that, if the photovoltaic cell 440 within a row will fail, the entire row can be derived and the electric current will pass to the next row.

Returning to Figure 6, Figure 6 illates a complete Quad 600 mounted on the end of its assembly. Shown in FIG. 6 is a hot side emitter array 410, 420, a membrane and a photovoltaic assembly 440, 450, a liquid metal chamber 460, a heat sink 470, a water distribution housing 510, a chamber 540 pneumatics, 610 electrical connections and pneumatic connections 620, 630.

The linear actuator consists of a front screw motor and is housed within the water distribution housing 510. Its purpose is to control the amount of liquid that is behind the membrane 450. The actuator drives a piston, which is attached to a rotating diaphragm. The inside of the diaphragm is filled with liquid metal which can be pumped through the channels that are directed to the liquid metal chamber / membrane 460. To increase or decrease the amount of liquid metal behind the membrane 450, the actuator is pushed outward or inward, respectively. The actuator is also used to control the pressure in the liquid metal. Between the linear actuator and the piston is a die spring. The force from the actuator advances through the spring and into the piston so that the spring is always in compression. This allows the actuator to modify the liquid metal pressure, even if the piston remains stationary. The compression of the die spring is directly related to the pressure of the liquid metal.

Returning to Fig. 7, Fig. 7 illustrates the various parts that are assembled to form a Quad 700. These include a photovoltaic array 710 and a heatsink top portion 715, a lower heatsink portion 720, a top cover 735 of water housing, servomotor bellows 725, covers 730 on the water housing side, water housing 740, bellows connectors 745, bellows 750 of servomotor and bellows 755 tubes.

Returning to Figure 8, Figure 8 illustrates a fully assembled Quad 800. As shown in Figure 8, a Quad includes a photovoltaic array 710 and the upper portion 715 of a heat sink, servo-bellows 725, water-receiving side covers 730, water housing 740, and electrical and pneumatic 770 connections to modules. of external control.

Returning to Figure 9, Figure 9 illustrates a unique Quad 900 within its housing with its top cover removed. A complete assembled Quad 800 shown in Figure 8, a hot housing 910, water cooling connections 930, 940 and a vacuum orifice 920 is shown. A connection to a pneumatic control module is not shown.

Returning to FIG. 10, FIG. 10 illustrates a slide 1000 of the Quad module within its heated housing through a furnace wall, a Quad 800, a hot housing 1020, the furnace wall 1030, an enclosure 910 of Quad module, water cooling connections 930, 940 and connections to electric power installations, vacuum control module and a 1010 pneumatic control module.

Returning to Figure 11, Figure 11 shows a module containing four Quads and a refrigerant connection 1100. It can include up to four double-sided quad 800 modules and refrigerant connections 1130, 1140.

Returning to figure 12, figure 12 shows an array of 1200 Quad modules connected to common refrigerant lines. 24 Quad 800 modules are shown connected to common 1230, 1240 refrigerant lines. Although each Quad contains arrays of photovoltaic cells and emitter chips, a panel may contain M x N Quads arrangement, where M and N are greater than or equal to one. The Quad arrangements can be connected together by cooling tubes so that the units are cooled in series or in parallel.

Returning to Figure 13, Figure 13 shows the required control modules connected to an MTPV panel comprising one or more Quads 1300. A 1350 MPTV panel, a cooling control module 1310, a vacuum control module 1320 are shown. and a pneumatic pressure control module 1330.

Claims (25)

1. Method for converting heat energy into electrical energy using sub-cryoseparation thermophotovoltaic technology, comprising the steps of: collecting thermal energy by a collection surface of a radiation emitting layer from an inner surface of a thermally conductive cover, the outer surface of the cover is exposed to a source of high temperature heat energy; maintaining a receiving surface of a photovoltaic cell within one micrometer distance from a emitting surface of the radiation emitting layer; receiving electromagnetic radiation by the receiving surface from the emitting surface to generate electrical energy by the photovoltaic cell; providing pressure on the photovoltaic cell by a deformable, thermally conductive, pressurized membrane, to maintain the collection surface of the radiation emitting layer and close contact with the inner surface of the cover and to maximize cooling; and providing pressure on a heat sink in contact with the thermally conductive deformable membrane to maximize cooling.

2. Method as described in claim 1, further comprising creating a vacuum between the emitting surface and the receiving surface to minimize heat conduction.

3. Method as described in claim 2, wherein the vacuum is less than 10"3 Torr.

4. Method as described in claim 1, further comprising maintaining a vacuum within the cover.

5. Method as described in claim 1, wherein the distance between the receiving surface of the photovoltaic cell and the emitting surface of the irradiation emission layer is typically between 0.10 and 0.30 micrometers.

6. Method as described in claim 1, further comprising maintaining the distance between the receiving surface of the photovoltaic cell and the emitting surface of the radiation emitting layer by the use of thermally insulated separators.

7. Method as described in claim 1, wherein the deformable membrane is pressurized by a linear actuator and a cavity filled with liquid metal.

8. Method as described in claim 1, further comprising interposing a thermal interface between the collection surface of an irradiation emitting layer and the inner surface of the thermally conductive cover.

9. Method as described in claim 8, wherein the thermal interface comprises thermally conductive graphite.

10. Method as described in claim 1, further comprising reducing a temperature of the photovoltaic cell, the heat sink, the liquid metal chamber and the deformable membrane by circulating coolant liquid through the heat sink cavities.

11. Method as described in claim 10, further comprising distributing coolant through the use of flexible bellows and a water distribution housing.

12. Apparatus for converting heat energy into electrical energy using submicroseparation thermophotovoltaic technology, comprising: a collection surface of a radiation emitting layer for collecting heat energy from an inner surface of a thermally conductive cover, the outer surface of the cover is exposed to a source of heat energy, high temperature; a receiving surface of a photovoltaic cell is maintained at a distance of less than one micrometer from a emitting surface of the irradiation emitting layer; the electromagnetic radiation is received by the receiving surface from the emitting surface for generation of electrical energy by the photovoltaic cell; the photovoltaic cell is pressurized by a deformable, thermally conductive membrane, pressurized to keep the collection surface of the radiation emitting layer in close contact with the inner surface of the cover and to maximize cooling; and a heat sink is pressurized to be in contact with the thermally conductive deformable membrane to maximize cooling.

13. Apparatus as described in claim 12, further comprising interposing a thermal interface between the collection surface of an irradiation emitting layer and the inner surface of a thermally conductive cover.

14. Apparatus as described in claim 12, wherein the thermal interface is comprised of thermally conductive graphite.

15. Apparatus as described in claim 12, wherein vacuum is maintained between the emitting surface and the receiving surface.

16. Apparatus as described in claim 12, wherein vacuum is maintained within the cover.

17. Apparatus as described in claim 12, further comprising thermally insulated separators for maintaining the distance between the receiving surface of the photovoltaic cell and the emitting surface of the irradiation emitting layer.

18. Apparatus as described in claim 12, wherein the deformable membrane is pressurized by a linear actuator and a cavity filled with liquid metal.

19. Apparatus as described in claim 12, further comprising a refrigerant liquid distributed through the use of flexible bellows and a water distribution housing.

20. Apparatus for converting heat energy into electrical energy using the submicroseparation thermophotovoltaic technology comprising a cover for enclosing the components of a Quad, including: an array of emitter chip maintained in close thermal contact with the cover via a graphite thermal interface; a membrane of a photovoltaic array sub-assembly separated from another emitter chip array by thermally insulated separators; a liquid metal chamber in contact with the membrane to keep the emitter chip array in close thermal contact with the cover; a sub-assembly of heat sink to accept coolant to cool the membrane, the liquid metal chamber and the photovoltaic array; water distribution housing for distributing liquid refrigerant to the heat sink sub-assembly via a sub-assembly of bellows; pneumatic subassembly to keep the heat sink in close contact with the liquid metal refrigerant and the photovoltaic array; and a linear actuator of pressure actuator to maintain the pressure in the pneumatic subassembly.

21. Apparatus as described in claim 20, wherein the vacuum is kept inside the cover.

22. Apparatus as described in claim 20, wherein the membrane is pressurized by the linear actuator and a cavity filled with liquid metal.

23. Apparatus as described in claim 20, wherein the Quad contains a multiplicity of photovoltaic arrays and chip emitters.

24. Apparatus as described in claim 20, wherein a cover can be an M x N arrangement of Quads, wherein M and N are greater than one or equal to one.

25. Apparatus as described in claim 20, further comprising a cooling control module, a vacuum control module and a pneumatic pressure control module.