TW201401380A - Semiconductor device and fabricating method thereof - Google Patents

Abstract

A semiconductor device includes a substrate; an inter layer dielectric disposed on the substrate; a through silicon via (TSV), penetrating the substrate and parts of the dielectric layer. In addition, a plurality of shallow trench isolation (STI) is disposed in the substrate, and a shield ring is disposed in the dielectric layer surrounding the TSV on the STI. During the process of forming the TSV, the contact ring can protect adjacent components from metal contamination.

Description

Semiconductor component and manufacturing method

The present invention provides a semiconductor component, and more particularly to a semiconductor component having a turn-by-turn and contact ring.

In the modern information society, the microprocessor system consisting of integrated circuits has been widely used in all aspects of life, such as automatic control of household appliances, mobile communication devices, personal computers, etc., all of which have traces of integrated circuits. . With the increasing advancement of technology and the imagination of human society for electronic products, the integrated circuit has also developed in the direction of more yuan, more precision and smaller.

Generally, an integrated circuit is formed by a die produced in a conventional semiconductor process. The process of fabricating a die begins with the production of a wafer: first, a plurality of regions are distinguished on a wafer, and in each region, through various semiconductor processes such as deposition, lithography, etching, or flattening. The steps to form various required circuit paths, and then, the respective regions on the wafer are cut into individual chips, packaged into chips, and finally the wafer is electrically connected to a circuit board. Such as a printed circuit board (PCB), after the chip is electrically connected to the pins of the printed circuit board, a variety of stylized processing can be performed.

In order to improve the function and performance of the wafer and increase the degree of integration to accommodate more semiconductor components in a limited space, the related manufacturers have developed a number of semiconductor wafer stacking technologies, including flip chip technology (Flip-Chip) technology, multi-chip package ( Multi-chip Package (MCP) technology, package on package (PoP) technology, package in package (PiP) technology, etc., can be stacked by die or package. Increase the degree of integration of semiconductor components per unit volume. Under the above various package architectures, a technology called Through Silicon Via (TSV) has been developed in recent years to promote internal interconnection of the crystal grains in the package to improve stacking efficiency. Further advancement.

The principle of boring is to form a through-wafer via in the wafer by etching or laser, and then fill a via hole with a conductive material such as copper, polysilicon, tungsten, etc., and finally wafer or die. Thinned and stacked, Bonded, and become a 3D solid crystal grain stack structure. Since the connection path of the internal lines of each chip is the shortest, the transmission speed between the wafers is faster, the noise is smaller, and the performance is better, which is one of the currently promising technologies.

However, at present, there are still many technical problems to be overcome in the integration of the perforation with other components. One of them is that in the process of making the perforation, the port formed by laser or other means may directly expose the metal connection pad, but Located in 矽 Other components around the perforations cause metal contamination problems.

According to a preferred embodiment of the present invention, a semiconductor device includes a substrate, an interlayer dielectric layer disposed on the substrate, a via electrode, a through-substrate and a portion of the interlayer dielectric layer, and A contact ring is disposed around the turns of the turn in the interlayer dielectric layer.

According to another preferred embodiment of the present invention, a semiconductor device includes a substrate, an interlayer dielectric layer disposed on the substrate, a via electrode, a through-substrate, and a portion of the interlayer dielectric layer. And a liner layer is located within the crucible perforated electrode and is located only in the substrate.

In accordance with another preferred embodiment of the present invention, a method of fabricating a semiconductor device includes the steps of providing a substrate having a front side and a back side, and then forming an interlevel dielectric layer on the front side of the substrate, And forming a metal line on the surface of the interlayer dielectric layer, and then forming an opening through the substrate and exposing the interlayer dielectric layer on the back surface of the substrate, and then forming a liner layer inside the opening, through the opening The liner layer and the interlayer dielectric layer are etched to form a via hole, and the metal trace is exposed, and then a barrier layer is formed to cover the interior of the via hole, and finally a conductive layer is formed in the via hole.

The semiconductor device of the present invention has a contact ring around the perforated electrode and The liner layer can effectively protect the circuit around the perforation from metal contamination during the formation of the perforation.

The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .

For the convenience of description, the drawings of the present invention are only for the purpose of understanding the present invention, and the detailed proportions thereof can be adjusted according to the design requirements. As described in the text for the relative relationship between the relative elements in the figure, it should be understood by those skilled in the art that it refers to the relative position of the object, and therefore can be flipped to present the same member, which should belong to the same specification. The scope of the disclosure is hereby stated.

Please refer to FIGS. 1~5 first, and FIGS. 1~5 are schematic diagrams showing the manufacturing process of the semiconductor device of the first preferred embodiment of the present invention. As shown in FIG. 1, first, a substrate 10 is provided, such as a silicon substrate, an epitaxial silicon substrate, a silicon germanium substrate, or a silicon carbide substrate. Or a silicon-on-insulator (SOI) or the like on the insulating layer, the substrate 10 has a front surface 12 and a back surface 14, and then forms various ion wells (N-well or P-well) required (Fig. And a plurality of shallow trench isolations 16 in the substrate 10.

Next, as shown in FIG. 2, at least one gate structure 18 is formed on the substrate 10, and the source/drain regions 20 are formed in the substrate 10 on both sides of the gate structure 18 by ion implantation or the like. The gate structure 18 can be a polysilicon gate, a metal gate or a dummy gate, etc., to form the gate structure 18 and the source/drain region 20, or even A method of forming a self-aligned metal salicide (not shown) on the surface of the source/drain region 20 is common in the art and will not be described herein. Then, an interlayer dielectric layer 22 is overlying the gate structure 18 and the front surface 12, and then a metal interconnect process is further performed to prepare a plurality of inter-metal dielectric layers on the interlayer dielectric layer 22. IMD) (not shown) and the metal lines (not shown) required to be placed in the dielectric layers between the metal layers. For convenience of description, FIG. 2 only shows that a metal line 24 corresponding to a subsequently formed turns (TSV) is formed on the surface of the interlayer dielectric layer 22, and other metal lines and dielectric layers between the metal layers are omitted. The bottom surface of the metal line 24 can directly contact the subsequently formed via via (TSV) and be electrically connected to other components by metal lines (not shown) in the upper inter-metal dielectric layer (IMD). In addition, a contact etch stop layer (CESL) (not shown) may be selectively formed between the interlayer dielectric layer 22 and the substrate 10 to cover the gate structure 18 and the source/drain regions 20.

It should be noted that, before forming the metal line 24, the present invention first performs a contact plug process to form a plurality of contact plugs 28, and simultaneously forms a contact ring 26 in the contact plug process. Interlayer dielectric layer 22 in. The contact plugs 28 are respectively disposed on the gate structure 18 and the source/drain regions 20 for electrically connecting the metal lines in the inter-metal dielectric layer (IMD) above the interlayer dielectric layer 22 (not shown). The contact ring 26 is located on the shallow trench isolation 16, preferably a ring structure that surrounds but does not contact the through hole (TSV), so the inner diameter is larger than the outer diameter of the through hole (TSV) and smaller than the metal line 24. The width, and the contact ring 26 is in direct contact with the metal line 24, so that the contact ring 26 is electrically connected to the metal line 24 and equipotentially for better shielding. In this embodiment, the material of the metal line 24, the contact ring 26 and the contact plug 28 may be selected from a group of conductive metals such as copper, aluminum, tungsten, titanium, titanium nitride, tantalum and tantalum nitride. Group, but not limited to this.

After the metal interconnection process on the front side 12 of the substrate 10 and the bonding pad process on the dielectric layer between the metal layers are completed. The substrate 10 is thinned from the back side 14 of the substrate 10, and then, as shown in FIG. 3, at least one opening 30 is formed on the back surface 14 of the substrate 10 by lithography and etching to define the position of the ruthenium perforation (TSV). The opening 30 extends through the substrate 10 and the shallow trench isolation 16 and the bottom of the opening 30 rests on the bottom surface of the interlayer dielectric layer 22. The etching process is not limited to the use of dry etching or wet etching or a combination thereof, and the dry etching conditions may be CF ₄ , O ₂ and Ar, and the wet etching conditions may be diluted hydrofluoric acid or the like. After the opening 30 is formed, a liner layer 32 is deposited in the back surface 14 and the opening 30 to cover the sidewalls and the bottom of the opening 30. The material of the liner layer 32 is, for example, a single material such as tantalum nitride (SiN) or yttrium oxide (SiO ₂ ). Layer or composite structure layer, but is not limited thereto. It should be noted that since the bottom of the opening 30 only stays on the surface of the interlayer dielectric layer 22, the pad layer 32 formed inside the opening 30 is not located in the interlayer dielectric layer 22, and is only located in the substrate 10. .

An opening step is then performed on the opening 30 again, as shown in FIG. 4, to form a turn aperture 34, and the bottom of the turn 34 is resting on the bottom surface of the metal line 24. The etching step only needs to pass through the pad layer 32 and the interlayer dielectric layer 22 through the opening 30. Therefore, the etching time is shorter and the control is better, and the uniformity of etching is relatively improved. A barrier layer 36 is then deposited over the interior of the via 34 to cover the sidewalls and bottom of the interior of the via 34, and the barrier layer 36 is substantially in contact with the metal line 24. The barrier layer 36 may be selected from the group consisting of titanium, titanium nitride, tantalum, and tantalum nitride, but is not limited thereto.

As shown in FIG. 5, a conductive layer 38 is formed on the surface of the barrier layer 36 and filled with the via holes 34 to form the via electrodes 40. The conductive layer 38 may be selected from a metal having good conductivity, and a method for forming the same. In the case of copper, a copper seed layer (not shown) may be formed after depositing the barrier layer 36, and then A yellow light process of a back bump is formed to form a patterned photoresist layer (not shown), and then after plating the copper, the patterned photoresist layer is removed, that is, the semiconductor device having the germanium perforated electrode of the present invention is completed. 1. Therefore, the semiconductor device 1 of the present invention comprises a substrate 10, a plurality of shallow trench isolations 16 in the substrate 10, an interlayer dielectric layer 22 disposed on the substrate 10, a via electrode 40 extending through the substrate 10, shallow trench isolation 16 and An interlayer dielectric layer 22, a contact ring 26 disposed around the germanium via electrode 40 in the interlayer dielectric layer 22, and disposed on the interlayer dielectric layer 22 The shallow trench isolation 16 and a liner layer 32 are only located in the substrate 10 around the perforated electrode 40, in other words, the liner layer 32 is not located in the interlayer dielectric layer 22.

One of the features of the present invention is that the substrate 10 is first etched back to form the opening 30, and the bottom of the opening 30 rests on the interlayer dielectric layer 22, not directly exposing the metal line 24, and then to the bottom of the opening 30. After the sidewalls are formed with the liner layer 32, the inter-layer dielectric layer 22 is etched through the inter-layer dielectric layer 22 to form the germanium vias 34 to expose the metal lines 24. In this way, the opening 30 can be prevented from directly exposing the metal line 24 during the etching process, causing the metal component 24 to diffuse to cause metal contamination, thereby affecting the surrounding gate structure 18 or other components. At this time, the interlayer dielectric layer 22 can cover the metal line 24 as a protective layer to prevent metal contamination from affecting other components. In addition, the present invention can also avoid the problem of directly etching the substrate 10, the shallow trench isolation 16 and the interlayer dielectric layer 22, thereby eroding or destroying the metal wiring 24.

Another feature of the present invention resides in contact ring 26, which forms a contact ring 26 around the perforated electrode 40 prior to forming the metal line 24 prior to forming the metal line 24. As a result, when the inter-layer dielectric layer 22 is etched through the opening 30 to form the crucible vias 34, the contact ring 26 can effectively prevent metal contamination of the exposed metal lines 24, thereby affecting the surrounding gate structure 18 or other components. Further, in general, the perforated electrode 40 is connected to various semiconductor elements such as a transistor, a memory, an inductor, a resistor, etc., and various kinds of stylized processes can be performed. Since the perforated electrode 40 acts as a power pin, when When the power source passes, strong electromagnetic interference (EMI) is generated, and interference is generated to a semiconductor element such as the gate structure 18 located near the 矽-perforated electrode 40. Therefore, the contact ring 26 contact ring of the present invention is disposed on the periphery of the ruthenium perforated electrode 40, particularly in the interlayer dielectric layer 22 in which the semiconductor element such as the gate structure 18 is located, to completely improve the problem. In this way, the contact ring 26 can effectively shield the generation of the coupling noise from the large amount of current flowing through the surrounded perforated electrode 40 or the metal line 24. The material of the contact ring 26 may be selected from the group consisting of copper, aluminum, tungsten, titanium, titanium nitride, tantalum and tantalum nitride, and the compatibility between the product structure design and the semiconductor process is considered. But not limited to the above.

The different embodiments of the present invention and the method for fabricating the same are described below, and for the sake of simplification of the description, the following description mainly focuses on the differences of the embodiments, and the details are not repeated. . In addition, the same elements in the embodiments of the present invention are denoted by the same reference numerals to facilitate the comparison between the embodiments.

As shown in FIG. 6, a schematic structural view of a second preferred embodiment of the present invention is shown. As in the first preferred embodiment of the present invention, the semiconductor device 2 includes a substrate 10, and a plurality of shallow trenches are isolated 16 from the substrate 10. The interlayer dielectric layer 22 is disposed on the substrate 10, a via electrode 40 is penetrated through the substrate 10 and the interlayer dielectric layer 22, and a liner layer 32 is located only in the substrate 10 and surrounds the via electrode 40. The difference between this embodiment and the first preferred embodiment of the present invention is that the original The contact ring is combined with the metal circuit to form a unitary structure, that is, the contact ring 42. Although in the first preferred embodiment, the metal line is formed after the contact ring is formed first, the contact ring is in this embodiment. Simultaneously fabricated with the metal circuit, the contact ring and the metal circuit are combined into an integrally formed structure. In addition, the contact plugs 28 and the contact rings 42 can also be fabricated in the same step or separately in different steps. If the contact plug 28 is made with the contact ring 42, the process can be further simplified. In addition, the material of the contact ring 42 and the contact plug 28 in this embodiment may be selected from the group consisting of a metal having good conductivity, such as copper, aluminum, tungsten, titanium, titanium nitride, tantalum, and tantalum nitride, but Not limited to this. The features, material characteristics, and manufacturing methods of the remaining components are similar to those of the first preferred embodiment described above except for the contact ring, and thus will not be described herein.

In the present invention, in order to enhance the shielding effect of the contact ring 26, the contact ring 26 can be connected to a signal ground (not shown) or floating. This signal ground can be connected to the most stable ground, such as the ground or chip group level grounding of a system board (not shown) mounted with a semiconductor package to more efficiently avoid noise. Furthermore, a high frequency filter can be additionally provided between the ground of the system board to selectively avoid and remove high frequency noise.

The foregoing preferred embodiments are only embodiments of the present invention. The steps and contact rings disclosed in the present invention can be applied to various Via-first processes, Via-Middle processes, or In the TSV process such as the Via-last process, it is effectively integrated into the current semiconductor process.

In summary, the present invention provides a semiconductor device having a ruthenium perforated electrode, wherein a contact ring is distributed in the interlayer dielectric layer around the ruthenium perforated electrode, and a lining layer is distributed in the substrate around the ruthenium perforation. The contact ring and the liner layer can also effectively protect the circuit around the perforation from metal contamination during the formation of the perforation.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1‧‧‧Semiconductor components

2‧‧‧Semiconductor components

3‧‧‧Semiconductor components

10‧‧‧Base

12‧‧‧ positive

14‧‧‧ Back

16‧‧‧Shallow trench isolation

18‧‧‧ gate structure

20‧‧‧Source/bungee area

22‧‧‧Interlayer dielectric layer

24‧‧‧Metal lines

26‧‧‧Contact ring

28‧‧‧Contact

30‧‧‧ openings

32‧‧‧ liner

34‧‧‧矽Perforated

36‧‧‧Barrier layer

38‧‧‧ Conductive layer

40‧‧‧矽perforated electrode

42‧‧‧Contact Ring

44‧‧‧Virtual gate

1 to 5 are views showing a process of manufacturing the semiconductor device of the first preferred embodiment of the present invention.

Fig. 6 is a view showing the structure of a semiconductor element of a second preferred embodiment of the present invention.

1‧‧‧Semiconductor components

10‧‧‧Base

12‧‧‧ positive

14‧‧‧ Back

16‧‧‧Shallow trench isolation

18‧‧‧ gate structure

20‧‧‧Source/bungee area

22‧‧‧Interlayer dielectric layer

24‧‧‧Metal lines

26‧‧‧Contact ring

28‧‧‧Contact plug

32‧‧‧ liner

36‧‧‧Barrier layer

38‧‧‧ Conductive layer

40‧‧‧矽perforated electrode

Claims (20)

A semiconductor device comprising: a substrate; an interlayer dielectric layer disposed on the substrate; a via electrode extending through the substrate and the interlayer dielectric layer; and a contact ring disposed in the interlayer dielectric layer Located around the perforated electrode of the crucible. The semiconductor device of claim 1, further comprising a metal line disposed on the surface of the interlayer dielectric layer, wherein the germanium via electrode contacts the metal line. The semiconductor component of claim 2, wherein the contact ring is equipotential to the metal line. The semiconductor component of claim 2, further comprising a barrier layer in the via-perforated electrode, and the barrier layer is in substantial contact with the metal trace. A semiconductor component according to claim 1, further comprising a liner layer located in the crucible via electrode and located only in the substrate. The semiconductor device of claim 1, further comprising a gate structure disposed on the substrate, the gate structure comprising a metal gate, a polysilicon gate or a dummy gate. The semiconductor component of claim 1, further comprising at least one shallow trench isolation disposed in the substrate, wherein the contact ring is disposed on the shallow trench isolation. A semiconductor device comprising: a substrate; an interlevel dielectric layer disposed on the substrate; a via electrode extending through the substrate and the interlayer dielectric layer; and a liner layer disposed within the crucible via electrode and only Located in the substrate. The semiconductor device of claim 8 , further comprising a contact ring disposed around the 矽-perforated electrode in the interlayer dielectric layer, and a plurality of shallow trenches are disposed in the substrate, wherein the contact ring is disposed Isolated on the shallow trench. The semiconductor component of claim 8 further comprising a metal line disposed on the surface of the interlayer dielectric layer, and the germanium via electrode contacts the metal line. The semiconductor device of claim 10, wherein the contact ring is equipotential to the metal line. The semiconductor component of claim 10, further comprising a barrier layer in the via-perforated electrode, and the barrier layer is in substantial contact with the metal trace. The semiconductor component of claim 8 of the patent application, further comprising a gate structure The gate structure comprises a metal gate, a polysilicon gate or a dummy gate. A method of fabricating a semiconductor device, comprising the steps of: providing a substrate having a front surface and a back surface; forming an interlayer dielectric layer on the front surface of the substrate; forming a metal line on the surface of the interlayer dielectric layer; Forming an opening through the substrate and exposing the interlayer dielectric layer on the back surface of the substrate; forming a liner layer inside the opening; etching the liner layer and the interlayer dielectric layer through the opening to form a stack Perforating and exposing the metal line; forming a barrier layer covering the interior of the crucible, and forming a conductive layer on the barrier layer. The method of fabricating a semiconductor device according to claim 14, further comprising forming a contact ring in the interlayer dielectric layer around the via hole. The method for fabricating a semiconductor device according to claim 15 further comprises forming a plurality of shallow trench isolations in the substrate, and the contact ring is located on the shallow trench isolation. A method of fabricating a semiconductor device according to claim 15 wherein the The contact ring is equipotential to the metal line. The method of fabricating a semiconductor device according to claim 15 further comprises forming a plurality of contact plugs in the interlayer dielectric layer, and the contact ring is formed in the same step as each contact plug. The method of fabricating a semiconductor device of claim 15, further comprising forming a plurality of contact plugs in the interlayer dielectric layer, and the contact ring and the contact plug are formed by different steps. The semiconductor device manufacturing method of claim 14, further comprising forming at least one gate structure, and the gate comprises a metal gate, a polysilicon gate or a dummy gate.