TW201351449A - Integrated flat cable structure of flexible standard flat cable and circuit board - Google Patents
Integrated flat cable structure of flexible standard flat cable and circuit board Download PDFInfo
- Publication number
- TW201351449A TW201351449A TW101120027A TW101120027A TW201351449A TW 201351449 A TW201351449 A TW 201351449A TW 101120027 A TW101120027 A TW 101120027A TW 101120027 A TW101120027 A TW 101120027A TW 201351449 A TW201351449 A TW 201351449A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- cable
- flexible
- standard cable
- integrated
- Prior art date
Links
Landscapes
- Insulated Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本發明係為一種電路排線,尤指一種結合了軟性標準排線例如俗稱FFC(Flexible Flat Cable)的軟性扁平型排線與一般電路板的電路排線。 The invention relates to a circuit cable, in particular to a circuit cable which combines a soft standard cable, such as a flexible flat cable commonly known as FFC (Flexible Flat Cable), and a general circuit board.
一般軟性電路板依製程可概分為(一)影像轉移及蝕刻導電層並壓合絕緣層而構成之軟板(二)直接將導電層印刷於絕緣基材的軟板(三)將數條平行直銅線經由捲式機械拉張並與絕緣層壓合而成之標準排線。若依功能可區分為載板及排線或兼具載板與排線功能之軟性電路板,因而軟性電路板具有其他多種名稱,例如軟性印刷電路板、軟性排線等。其實皆屬相同之產品。若以製造成本分類,經由蝕刻所製造之軟板最為昂貴,其次為印刷,最便宜的則為標準排線。 Generally, the flexible circuit board can be roughly divided into (1) a soft board formed by image transfer and etching a conductive layer and pressing the insulating layer (2) a flexible board directly printing the conductive layer on the insulating substrate (3) The parallel straight copper wire is stretched by a roll-type mechanical and laminated with insulation to form a standard cable. If the function can be divided into a carrier board and a cable or a flexible circuit board having both a carrier board and a cable function, the flexible circuit board has various other names, such as a flexible printed circuit board and a flexible cable. In fact, they are all the same products. If classified by manufacturing cost, the soft board manufactured by etching is the most expensive, followed by printing, and the cheapest one is standard wiring.
隨著電子產業競爭及大量製作,為求進一步降低成本,其內部零件的設計越來越簡化,各模組之間可藉由軟性標準排線(俗稱FFC)的相互連接而得到訊號傳輸的途徑,更重要的,同時可降低成本。然而由於標準排線在傳輸訊號時,不但易於產生高頻高能量的電磁波,通常本身所傳遞的訊號也易於受到外界的高頻雜訊的干擾,以致於訊號失真。再者,當軟性排線或電路板因常要通過運動中的軸孔,致產生高壓之靜電,此時快速及有效的接地連接導通將更為重要。 With the competition and mass production of the electronics industry, in order to further reduce costs, the design of internal parts has become more and more simplified, and the transmission of signals between the modules can be obtained through the interconnection of soft standard cables (commonly known as FFC). More importantly, at the same time, it can reduce costs. However, since the standard cable transmits signals, it is not only easy to generate high-frequency and high-energy electromagnetic waves, but the signals transmitted by the signals are also easily interfered by external high-frequency noise, so that the signals are distorted. Moreover, when a flexible cable or a circuit board often passes through a moving shaft hole, a high-voltage static electricity is generated, and a quick and effective ground connection conduction is more important.
為解決前述的缺點,習知的手段是在軟性電路板的表面覆設一層金屬屏蔽層,用以阻擋外界的電磁雜訊,然而該金屬屏蔽層雖可達到阻隔外界電磁雜訊干擾的效果,但是由於所覆設的金屬屏蔽層實際上並未有效連接於電子裝置的地線,故金屬屏蔽層遮蔽電磁雜訊及靜電消除的效果並非良好。 In order to solve the above-mentioned shortcomings, a conventional method is to cover a surface of a flexible circuit board with a metal shielding layer for blocking external electromagnetic noise, but the metal shielding layer can achieve the effect of blocking external electromagnetic noise interference. However, since the metal shield layer that is covered is not effectively connected to the ground of the electronic device, the effect of shielding the metal shield from electromagnetic noise and static electricity is not good.
因而,習知電子裝置內部的模組皆普遍利用易於連接地線之蝕刻製程之傳統軟性電路板做為訊號的連接。但由於傳統軟性電路板在成本上仍高於一般軟性標準排線甚多,再者,軟性標準排線除未具有電磁雜訊遮蔽的效果亦因其製程係拉張銅線壓合而成致銅線寬度無法細小致阻抗控制產生困難。因此如何以一般的軟性標準排線取代部分傳統軟性電路板之使用面積以降低成本,並提供有效的電磁雜訊之遮蔽效果及訊號之阻抗控制,同時具有靜電消除的導接結構已為目前業界急需待解決的問題。另外,部分產品之應用,尚須經過窄孔或轉軸孔,並需通過數萬次之耐彎折之實驗,經由部份切割而成之束狀結構應用亦無法避免。 Therefore, the conventional flexible circuit boards which are easy to connect to the grounding wire are generally used as the signal connection by the modules inside the conventional electronic device. However, because the traditional flexible circuit board is still higher in cost than the general soft standard cable, in addition, the soft standard cable has the effect of not being shielded by electromagnetic noise. The copper wire width cannot be made small and the impedance control is difficult. Therefore, how to replace the use area of some traditional flexible circuit boards with general soft standard cables to reduce the cost, and provide effective electromagnetic noise shielding effect and signal impedance control, and the static elimination guide structure has been the industry. Urgently needed to be solved. In addition, the application of some products still needs to pass through narrow holes or shaft holes, and it is necessary to pass tens of thousands of bending-resistance experiments, and the beam-shaped structure through partial cutting cannot be avoided.
為了能夠有效克服前述所提到的缺點,本發明之一目的即是設計一種結合軟性標準排線與傳統蝕刻製程之電路板的複合電路排線。 In order to effectively overcome the aforementioned drawbacks, it is an object of the present invention to design a composite circuit cable that combines a flexible standard wiring and a conventional etching process circuit board.
本發明之又一目的是使軟性標準排線具有遮蔽面接地及具跳線連接之功能結構同時於軟性標準排線表面的屏蔽 層亦可經由適當之絶緣厚度控制或屏蔽開孔來達到阻抗控制之目的。 Another object of the present invention is to provide a flexible standard cable with a shielding surface grounding and a jumper connection functional structure simultaneously shielding the soft standard wiring surface. The layers can also be controlled by appropriate insulation thickness or shielded openings for impedance control purposes.
本發明之又另一目的是提供一種應用更為廣泛的電路排線,其中所使用的電路板可為硬式電路板、軟式電路板、軟硬結合板之一。若採用軟性標準排線或軟性電路板時,為方便通過狹小窄孔或轉軸孔,可經沿著訊號間隙切割出數條切割線並可進一步予以疊置之束狀結構,在應用時更可方便將軟性標準排線通過狹小窄孔或轉軸孔。 Still another object of the present invention is to provide a more widely used circuit cable in which the circuit board used can be one of a hard circuit board, a flexible circuit board, and a hard and soft board. If a flexible standard cable or flexible circuit board is used, in order to facilitate the passage of narrow narrow holes or shaft holes, a plurality of cutting lines can be cut along the signal gap and the bundle structure can be further stacked, which can be applied in application. It is convenient to pass the soft standard cable through the narrow narrow hole or the shaft hole.
為了達到上述的目的,本發明所設計的軟性標準排線與電路板的整合排線結構包括一軟性標準排線,具有複數條平行直線排列且互不跳線的導線線路及二絕緣層,二絕緣層分別構成於該導線線路的上、下表面,該導線線路位在該軟性標準排線一端的下表面處外露有一組接點,且該接點中的至少一接點係作為地線接點;一屏蔽層,覆設於該軟性標準排線的上表面,且在相對應於該接點處向外延伸有一延伸部;以及一電路板,該電路板的其中一端具有一組導電接點,該軟性標準排線的接點電連接於該導電接點,該電路板的表面另具有至少一地線導接區域,該屏蔽層的延伸部覆設於該地線導接區域且該地線導接區域與該軟性標準排線的地線接點相連接(如採用雙面板或多層板時,可經由貫孔完成連接,如採用單面板則可於地線區覆蓋絶綠膜直接開孔即可)。 In order to achieve the above object, the integrated cable structure of the flexible standard cable and the circuit board designed by the invention comprises a soft standard cable, and has a plurality of parallel and straight line wires and two insulation layers, and two insulation layers. The insulating layers are respectively formed on the upper and lower surfaces of the wire line, and the wire line is exposed at a lower surface of one end of the flexible standard wire with a set of contacts, and at least one of the contacts is grounded a shielding layer disposed on an upper surface of the flexible standard cable and having an extending portion extending outwardly corresponding to the contact; and a circuit board having a conductive connection at one end thereof The contact point of the flexible standard cable is electrically connected to the conductive contact, and the surface of the circuit board further has at least one ground connection area, and the extension of the shielding layer is disposed on the ground connection area and the The ground wire guiding area is connected with the grounding wire joint of the soft standard cable (for example, when a double panel or a multi-layer board is used, the connection can be completed through the through hole, and if a single panel is used, the ground layer can be directly covered with the green film directly Open the hole)
再者,電路板的兩端可設置相對應的交錯導電接點,兩者之間可透過在電路板上設置至少一貫孔達到跳線功能,以便於在該導電接點及該對應交錯導電接點之間的線路上達成電連接。 Furthermore, corresponding staggered conductive contacts can be disposed at both ends of the circuit board, and at least a consistent hole can be disposed on the circuit board to achieve a jumper function, so as to facilitate the conductive connection at the conductive contact and the corresponding staggered conductive connection An electrical connection is made on the line between the points.
請參閱第1圖至第3圖所示,為本發明第一實施例的立體分解圖、組合圖及剖面圖。如圖所示,本發明的軟性標準排線與電路板的整合排線結構包括有一軟性標準排線10、一屏蔽層20及一電路板40,其中軟性標準排線10具有複數條平行直線排列且互不跳線的導線線路12、一上絕緣層14及一下絕緣層16,二絕緣層14、16分別位於導線線路12的上表面及下表面,以使該導線線路12達成絕緣之目的。絕緣層14、16係可為PET或PI絕緣材料所構成。 1 to 3 are exploded perspective views, combined views, and cross-sectional views of the first embodiment of the present invention. As shown in the figure, the integrated cable structure of the flexible standard cable and the circuit board of the present invention comprises a flexible standard cable 10, a shielding layer 20 and a circuit board 40, wherein the flexible standard cable 10 has a plurality of parallel straight lines. And the non-jumping wire line 12, an upper insulating layer 14 and the lower insulating layer 16, the two insulating layers 14, 16 are respectively located on the upper surface and the lower surface of the wire line 12, so that the wire line 12 achieves the purpose of insulation. The insulating layers 14, 16 may be constructed of PET or PI insulating material.
導線線路12則在該軟性標準排線10一端的下表面處外露有一組接點122。屏蔽層20覆設於上絕緣層14的上表面,且屏蔽層20在相對應於導線線路12一端的接點122處向外再延伸有一適當長度的延伸部22。屏蔽層20可選擇以銅箔、銀箔、鋁箔、銀漿塗佈等導電性金屬薄膜所構成,且屏蔽層20可選擇藉由一膠合層30貼覆於上絕緣層14的上表面。屏蔽層20係選擇以銀漿印刷的方式進行,此時膠合層30則可為一般之絕緣油墨印刷或膠合層30亦可為一般之絕緣材料如PET或PI,此時膠合層30要略為延長超過外露區,以防止銀漿印刷時將導電材料灌入延伸部22與導電接點42之電導接區內。 The wire line 12 is exposed with a set of contacts 122 at the lower surface of one end of the flexible standard cable 10. The shielding layer 20 is disposed on the upper surface of the upper insulating layer 14, and the shielding layer 20 is further extended outwardly at a contact 122 corresponding to one end of the wire line 12 by an extension 22 of an appropriate length. The shielding layer 20 may be formed of a conductive metal film such as copper foil, silver foil, aluminum foil or silver paste coating, and the shielding layer 20 may be selectively attached to the upper surface of the upper insulating layer 14 by a bonding layer 30. The shielding layer 20 is selected to be printed by silver paste. At this time, the bonding layer 30 can be a general insulating ink printing or bonding layer 30 or a general insulating material such as PET or PI. At this time, the bonding layer 30 is slightly extended. Exceeding the exposed area to prevent the conductive material from being poured into the electrically conductive joint region of the extension portion 22 and the conductive contact 42 during the printing of the silver paste.
電路板40可選擇單面板、雙面板或單面板雙面可接通或多層電路板之一,電路板40的一對邊處的兩端分別具有一組導電接點42及一組對應導電接點44,導電接點42及對應導電接點44則是透過電路板40內部所設的線路422 電連接,並可有跳線結構。當電路板40屬於雙面板且導電接點42及對應導電接點44分別設置於電路板40之不同表面時,則可透過在電路板40上設置至少一貫孔(圖未示)的方式,在導電接點42及對應導電接點44之間的線路上達成電連接甚或跳接。導電接點42係供軟性標準排線10的接點122電連接其上,導電接點42與軟性標準排線10的接點122之間可選擇以銲接或導電膠膠合方式相連接。 The circuit board 40 can select one of a single-panel, double-panel or single-panel double-sided or multi-layer circuit board. The two ends of the circuit board 40 have a set of conductive contacts 42 and a corresponding set of conductive contacts. Point 44, the conductive contact 42 and the corresponding conductive contact 44 are through the line 422 provided inside the circuit board 40. Electrical connection and jumper structure. When the circuit board 40 belongs to the double panel and the conductive contacts 42 and the corresponding conductive contacts 44 are respectively disposed on different surfaces of the circuit board 40, at least a consistent hole (not shown) can be disposed on the circuit board 40. Electrical connections or even jumps are made on the lines between the conductive contacts 42 and the corresponding conductive contacts 44. The conductive contacts 42 are electrically connected to the contacts 122 of the flexible standard cable 10, and the conductive contacts 42 and the contacts 122 of the flexible standard cable 10 are optionally connected by soldering or conductive bonding.
在靠近導電接點42的電路板40表面則具有一地線導接區域46,地線導接區域46是選擇以金屬鍍膜、印刷塗佈或以貼覆金屬薄膜等方式構成於電路板40表面,並可透過一延伸線路462與其中至少一地線導電接點462G呈一電連接,且所連接的導電接點462G是與軟性標準排線10上所預先定義用於提供連接地線的地線接點122G相連接。 The surface of the circuit board 40 adjacent to the conductive contact 42 has a ground guiding area 46 which is selected from the surface of the circuit board 40 by metal plating, printing coating or metal film coating. And electrically connected to at least one of the ground conductive contacts 462G through an extension line 462, and the connected conductive contacts 462G are pre-defined on the flexible standard cable 10 for providing a ground connection. The line contacts 122G are connected.
屏蔽層20的延伸部22則是覆設於電路板40的地線導電接點46表面,使得屏蔽層20可以分別經由地線導電接點46及導電接點462G而與軟性標準排線10上用於接地的地線接點122G呈一電連接。 The extension portion 22 of the shielding layer 20 is disposed on the surface of the ground conductive contact 46 of the circuit board 40, so that the shielding layer 20 can be connected to the flexible standard cable 10 via the ground conductive contact 46 and the conductive contact 462G, respectively. The ground contact 122G for grounding is electrically connected.
在屏蔽層20的延伸部22及電路板40的地線導電接點46之間設置有一導電膠層48,用以提供將延伸部22貼覆於地線導電接點46及延伸線路462、並在二者間構成一電連接。電路板40位在對應導電接點44一端處則可以插接方式與外部的一連接器(圖未示)相連接而達成訊號之連接。 A conductive adhesive layer 48 is disposed between the extension portion 22 of the shielding layer 20 and the ground conductive contact 46 of the circuit board 40 for providing the extension portion 22 to the ground conductive contact 46 and the extension line 462, and An electrical connection is formed between the two. The circuit board 40 is located at one end of the corresponding conductive contact 44 and can be connected in a plugged manner to an external connector (not shown) to achieve signal connection.
另請參閱第4圖所示,為本發明第二實施例的剖面圖。如圖所示,在第二實施例中的結構大抵皆與第一實施例相同,所不同者,僅在於軟性標準排線10的下表面同樣包覆 有一屏蔽層20a,且屏蔽層20a同樣可藉由膠合層30a貼覆於下絕緣層16的下表面,以便於在軟性標準排線10的下表面處提供電磁遮蔽之效果。 Referring to Figure 4, there is shown a cross-sectional view of a second embodiment of the present invention. As shown in the figure, the structures in the second embodiment are generally the same as those in the first embodiment, except that the lower surface of the flexible standard cable 10 is also covered. There is a shielding layer 20a, and the shielding layer 20a can also be attached to the lower surface of the lower insulating layer 16 by the bonding layer 30a to provide an electromagnetic shielding effect at the lower surface of the flexible standard wiring 10.
參閱第5圖所示,本發明中所使用的電路板可為硬式電路板、軟式電路板、軟硬結合板之一。若採用軟性標準排線或軟性電路板時,為方便通過狹小窄孔或轉軸孔。設計上可經沿著平行於導線線路12間的間隙切割出數條切割線70,在應用時更可方便將軟性標準排線10通過狹小窄孔或轉軸孔。同時於軟性標準排線10表面的屏蔽層亦可經由適當之絶緣厚度控制或屏蔽層開孔來達到阻抗控制之目的,此時可選擇銀漿印刷等較為簡易之製程。 Referring to FIG. 5, the circuit board used in the present invention may be one of a hard circuit board, a flexible circuit board, and a hard and soft board. If a soft standard cable or flexible circuit board is used, it is convenient to pass narrow narrow holes or shaft holes. It is designed to cut a plurality of cutting lines 70 along a gap parallel to the wire lines 12, and it is more convenient to pass the soft standard wire 10 through narrow narrow holes or shaft holes in application. At the same time, the shielding layer on the surface of the flexible standard cable 10 can also achieve the purpose of impedance control through appropriate insulation thickness control or shielding layer opening. In this case, a relatively simple process such as silver paste printing can be selected.
又請參閱第6圖所示,為本發明第三實施例的外觀示意圖。如圖所示,在第三實施例中,軟性標準排線50的一端除了可以電連接於電路板40上以外,軟性標準排線50線材本身尚可選擇以沿著導線線路12間的間隙切割出數條切割線70並予以疊合之後以束狀方式向後延伸,藉以使得軟性標準排線50可以廣泛適用於轉軸結構中。相同地,該束狀疊合結構亦可同時應用於以軟性材料製成的電路板40或擇一實施進行。 Please also refer to FIG. 6, which is a schematic view of the appearance of the third embodiment of the present invention. As shown, in the third embodiment, one end of the flexible standard cable 50 can be electrically connected to the circuit board 40, and the flexible standard cable 50 itself can be selected to be cut along the gap between the wire lines 12. The plurality of cutting lines 70 are folded and extended rearward in a bundle manner, so that the soft standard cable 50 can be widely applied to the hinge structure. Similarly, the bundle-like laminated structure can also be applied to a circuit board 40 made of a soft material or alternatively.
第7圖顯示第6圖中的軟性標準排線50以切割線70切割出之複數條排線可進一步以一綁束構件71予以綁束的示意圖。經綁束後的軟性標準排線50可後容易通過一轉軸構件72的軸孔73。 Fig. 7 is a view showing that the plurality of flexible wires of the soft standard cable 50 in Fig. 6 cut by the cutting line 70 can be further tied by a binding member 71. The tied soft standard cable 50 can then be easily passed through the shaft hole 73 of a shaft member 72.
請參閱第8圖所示,為本發明電路板的另一實施例示意圖。如圖所示,在本實施例中,提供了一電路板60,該電 路板60可構成為一具有適當夾角α的結構,使得電路板60兩端的導電接點62及對應導電接點64互呈一適當角度α方向延伸,藉此使得應用該等電路板60的軟性標準排線與電路板的整合排線結構可以提供多方向性的走線設計。同時該電路板可為軟性電路板,並具有沿著導線線路間的間隙切割出數條切割線並予以反折疊合呈束狀結構。請參閱第9圖所示,為本發明第四實施例的剖面圖。如圖所示,在屏蔽層20與軟性標準排線10之間更可以包括有至少一層以絕緣材料、絕緣油墨之一製成之阻抗匹配層81,以做為訊號阻抗匹配之控制。除了以增加該阻抗匹配層81來控制訊號阻抗匹配之外,亦可以採用增加膠合層30的厚度來達到訊號阻抗匹配控制之目的。再者,屏蔽層20亦可包括有至少一開孔結構82,以降低電容效應,並提高阻抗控制值以做為該整合排線之傳輸阻抗匹配。 Please refer to FIG. 8 , which is a schematic diagram of another embodiment of the circuit board of the present invention. As shown, in the present embodiment, a circuit board 60 is provided, the electric The circuit board 60 can be configured to have a proper angle α such that the conductive contacts 62 and the corresponding conductive contacts 64 at both ends of the circuit board 60 extend in an appropriate angle α direction, thereby making the application board 60 soft. The integrated cable structure of the standard cable and the circuit board can provide a multi-directional routing design. At the same time, the circuit board can be a flexible circuit board, and has several cutting lines cut along the gap between the wire lines and is folded back into a bundle structure. Referring to Figure 9, there is shown a cross-sectional view of a fourth embodiment of the present invention. As shown in the figure, between the shielding layer 20 and the flexible standard wiring 10, at least one impedance matching layer 81 made of one of insulating material and insulating ink may be included as the signal impedance matching control. In addition to increasing the impedance matching layer 81 to control signal impedance matching, it is also possible to increase the thickness of the bonding layer 30 to achieve signal impedance matching control. Furthermore, the shielding layer 20 may also include at least one opening structure 82 to reduce the capacitance effect and increase the impedance control value as the transmission impedance matching of the integrated wiring.
軟性標準排線10在相對於該屏蔽層20之表面(底面)亦可更包括有一底面屏蔽層21,以增加該軟性標準排線10的遮蔽及靜電導接之效果。至於電路板40方面,在該電路板40的上表面及下表面更可各別配置有一電路板屏蔽層83、84以增加該本發明整合排線之遮蔽及靜電導接之效果。 The flexible standard cable 10 may further include a bottom shield layer 21 on the surface (bottom surface) of the shield layer 20 to increase the shielding and electrostatic conduction effects of the flexible standard cable 10. As for the circuit board 40, a circuit board shielding layer 83, 84 may be separately disposed on the upper surface and the lower surface of the circuit board 40 to increase the shielding and electrostatic conduction effect of the integrated wiring of the present invention.
由前述說明可知,本發明提供了一種軟性標準排線與電路板的整合排線結構,其包括有一軟性標準排線、一屏蔽層及一電路板,其主要係在軟性標準排線外表面包覆有屏蔽層,經由屏蔽層阻擋外界的電磁雜訊對於軟性標準排線的電磁干擾並具有阻抗控制等功能,再者,屏蔽層具有一延伸部,覆設於電路板表面上所設的接地導接區域,地線導電接 點則與電路板上的其中一導電接點呈一電連接,且導電接點為一預先定義用於提供連接地線的軟性標準排線之接點相連接,使得屏蔽層所吸收的電磁雜訊或因排線軸孔之運動磨搓所產生之高壓靜電得以透過地線的導引而迅速消除,提升電磁遮蔽及靜電消除的效果。而本發明並具有下列的優點: It can be seen from the foregoing description that the present invention provides an integrated cable structure of a flexible standard cable and a circuit board, which comprises a flexible standard cable, a shielding layer and a circuit board, which are mainly wrapped on the outer surface of the soft standard cable. The shielding layer is covered, and the electromagnetic noise of the outside is blocked by the shielding layer for electromagnetic interference of the soft standard cable and has impedance control function. Further, the shielding layer has an extending portion and is grounded on the surface of the circuit board. Conduction area, ground wire conductive connection The point is electrically connected to one of the conductive contacts on the circuit board, and the conductive contact is a contact of a soft standard cable pre-defined to provide a ground connection, so that the electromagnetic interference absorbed by the shielding layer The high-voltage static electricity generated by the movement of the wire shaft hole can be quickly eliminated by the guidance of the ground wire, thereby improving the effect of electromagnetic shielding and static elimination. The invention also has the following advantages:
1.以軟性標準排線提供訊號的連接,相對於使用軟性電路板傳遞訊號的方式,本發明可以降低電子裝置的生產成本。 1. The signal connection is provided by a flexible standard cable, and the invention can reduce the production cost of the electronic device relative to the manner in which the signal is transmitted using the flexible circuit board.
2.本發明的軟性標準排線表面覆設有屏蔽層,且可經由電路板上所設的地線導接區域的導引,而與電子裝置上的地線達成連接,而可提供較佳的電磁遮蔽及靜電消除效果。 2. The surface of the flexible standard cable of the present invention is covered with a shielding layer, and can be connected to the ground line on the electronic device through the guiding of the ground guiding area provided on the circuit board, and can provide better. Electromagnetic shielding and static elimination.
3.本發明可藉由改變屏蔽層的結構,例如在屏蔽層上穿設適當數量及大小的穿孔,藉以提供及調整軟性標準排線之阻抗匹配。 3. The present invention can provide and adjust the impedance matching of the soft standard cable by changing the structure of the shielding layer, for example, by arranging an appropriate number and size of perforations on the shielding layer.
4.本發明尚可利用束狀之軟性標準軟性標準排線與電路板的整合排線結構,而可適用在電子裝置轉軸部分的走線設計。 4. The invention can also utilize the bundled soft standard soft standard cable and the integrated cable structure of the circuit board, and can be applied to the wiring design of the rotating shaft portion of the electronic device.
5.本發明的電路板的導電接點及對應導電接點之間可被設計互呈一適當角度方向延伸,使得應用該等電路板的軟性標準排線與電路板的整合排線結構可以提供更多方向性的走線設計及更適合的空間應用。此外亦可利用貫孔的技術將導線做跳接的功能。 5. The conductive contacts of the circuit board of the present invention and the corresponding conductive contacts can be designed to extend in an appropriate angular direction, so that the flexible standard cable and the integrated circuit cable structure of the circuit board can be provided. More directional routing design and more suitable space applications. In addition, the technology of the through hole can be used to make the wire jumper.
綜上所陳,僅為本發明之較佳實施例而已,並非用以限定本發明;凡其他未脫離本發明所揭示之精神下而完成的等 效修飾或置換,均應包含於後述申請專利範圍內。 In the above, it is merely a preferred embodiment of the present invention, and is not intended to limit the present invention; other things that are not accomplished without departing from the spirit of the present invention. Modifications or substitutions should be included in the scope of the patent application described later.
10‧‧‧軟性標準排線 10‧‧‧Soft standard cable
12‧‧‧導線線路 12‧‧‧Wire lines
122‧‧‧接點 122‧‧‧Contacts
122G‧‧‧地線接點 122G‧‧‧ ground contact
14‧‧‧上絕緣層 14‧‧‧Upper insulation
16‧‧‧下絕緣層 16‧‧‧lower insulation
20、20a‧‧‧屏蔽層 20, 20a‧‧‧Shield
21‧‧‧底面屏蔽層 21‧‧‧Bottom shield
22‧‧‧延伸部 22‧‧‧Extension
30、30a‧‧‧膠合層 30, 30a‧‧ ‧ glue layer
40‧‧‧電路板 40‧‧‧ boards
42‧‧‧導電接點 42‧‧‧Electrical contacts
422‧‧‧線路 422‧‧‧ lines
44‧‧‧對應導電接點 44‧‧‧corresponding to conductive contacts
46‧‧‧地線導接區域 46‧‧‧Ground junction area
462‧‧‧延伸線路 462‧‧‧Extended lines
462G‧‧‧地線導電接點 462G‧‧‧ ground wire conductive contacts
48‧‧‧導電膠層 48‧‧‧Electrical adhesive layer
50‧‧‧軟性標準排線 50‧‧‧Soft standard cable
60‧‧‧電路板 60‧‧‧ boards
62‧‧‧導電接點 62‧‧‧Electrical contacts
64‧‧‧對應導電接點 64‧‧‧corresponding to conductive contacts
70‧‧‧切割線 70‧‧‧ cutting line
71‧‧‧綁束構件 71‧‧‧Bundle members
72‧‧‧轉軸構件 72‧‧‧Shaft members
73‧‧‧軸孔 73‧‧‧Axis hole
81‧‧‧阻抗匹配層 81‧‧‧ impedance matching layer
82‧‧‧開孔結構 82‧‧‧opening structure
83‧‧‧電路板屏蔽層 83‧‧‧Board shield
84‧‧‧電路板屏蔽層 84‧‧‧Circuit board shield
α‧‧‧角度 ‧‧‧‧ angle
第1圖為本發明第一實施例的立體分解圖。 Fig. 1 is an exploded perspective view showing a first embodiment of the present invention.
第2圖為本發明第一實施例的組合示意圖。 Fig. 2 is a schematic view showing the combination of the first embodiment of the present invention.
第3圖為本發明第一實施例的剖面圖。 Figure 3 is a cross-sectional view showing a first embodiment of the present invention.
第4圖為本發明第二實施例的剖面圖。 Figure 4 is a cross-sectional view showing a second embodiment of the present invention.
第5圖顯示第2圖中的軟性標準排線可進一步切割出數條切割線的示意圖。 Fig. 5 is a view showing the soft standard cable in Fig. 2 for further cutting a plurality of cutting lines.
第6圖為本發明第三實施例的外觀示意圖。 Figure 6 is a schematic view showing the appearance of a third embodiment of the present invention.
第7圖顯示第6圖中的軟性標準排線切割出之複數條排線可進一步予以綁束的示意圖。 Fig. 7 is a view showing a plurality of lines cut by the soft standard cable in Fig. 6 which can be further tied.
第8圖為本發明電路板的另一實施例示意圖。 Figure 8 is a schematic view of another embodiment of the circuit board of the present invention.
第9圖為本發明第四實施例的剖面圖。 Figure 9 is a cross-sectional view showing a fourth embodiment of the present invention.
10‧‧‧軟性標準排線 10‧‧‧Soft standard cable
12‧‧‧導線線路 12‧‧‧Wire lines
122‧‧‧接點 122‧‧‧Contacts
122G‧‧‧地線接點 122G‧‧‧ ground contact
14‧‧‧絕緣層 14‧‧‧Insulation
16‧‧‧絕緣層 16‧‧‧Insulation
20‧‧‧屏蔽層 20‧‧‧Shield
22‧‧‧延伸部 22‧‧‧Extension
30‧‧‧膠合層 30‧‧‧ glue layer
40‧‧‧電路板 40‧‧‧ boards
42‧‧‧導電接點 42‧‧‧Electrical contacts
422‧‧‧線路 422‧‧‧ lines
44‧‧‧對應導電接點 44‧‧‧corresponding to conductive contacts
46‧‧‧地線導電接點 46‧‧‧ ground wire conductive contacts
462‧‧‧延伸線路 462‧‧‧Extended lines
462G‧‧‧地線導電接點 462G‧‧‧ ground wire conductive contacts
48‧‧‧導電膠層 48‧‧‧Electrical adhesive layer
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101120027A TWI476788B (en) | 2012-06-04 | 2012-06-04 | Flexible standard cable and circuit board integrated cable structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101120027A TWI476788B (en) | 2012-06-04 | 2012-06-04 | Flexible standard cable and circuit board integrated cable structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201351449A true TW201351449A (en) | 2013-12-16 |
TWI476788B TWI476788B (en) | 2015-03-11 |
Family
ID=50158105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101120027A TWI476788B (en) | 2012-06-04 | 2012-06-04 | Flexible standard cable and circuit board integrated cable structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI476788B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112703566A (en) * | 2018-09-19 | 2021-04-23 | 株式会社自动网络技术研究所 | Wiring member and method for manufacturing wiring member |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW595282B (en) * | 2003-07-29 | 2004-06-21 | Accton Technology Corp | Circuit board apparatus |
TWI236782B (en) * | 2004-04-23 | 2005-07-21 | Adv Flexible Circuits Co Ltd | The structure of the flat flexible circuit board with the shielding planar layer |
TWM295805U (en) * | 2006-01-17 | 2006-08-11 | Cvilux Corp | Improved structure of flexible flat cable |
TW200945374A (en) * | 2008-04-28 | 2009-11-01 | Hon Hai Prec Ind Co Ltd | Flexible flat cable with impedance modulating function |
TWM367401U (en) * | 2009-04-21 | 2009-10-21 | P Two Ind Inc | The flexible flat cable |
TW201104979A (en) * | 2009-07-29 | 2011-02-01 | Adv Flexible Circuits Co Ltd | Circuit substrate inserting and positioning connector |
TWM379203U (en) * | 2009-11-24 | 2010-04-21 | P Two Ind Inc | The connector device with the flexible flat cable |
-
2012
- 2012-06-04 TW TW101120027A patent/TWI476788B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112703566A (en) * | 2018-09-19 | 2021-04-23 | 株式会社自动网络技术研究所 | Wiring member and method for manufacturing wiring member |
US11387015B2 (en) | 2018-09-19 | 2022-07-12 | Autonetworks Technologies, Ltd. | Wiring member and method of manufacturing wiring member |
Also Published As
Publication number | Publication date |
---|---|
TWI476788B (en) | 2015-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI453768B (en) | Composite flexible circuit cable | |
TWI503848B (en) | Differential mode signal transmission module | |
TWI596995B (en) | Printed wiring board | |
WO2019131286A1 (en) | Multilayer substrate and transmission line device | |
JP7196909B2 (en) | shielded flat cable | |
KR20110031074A (en) | Bundled flexible flat circuit cable | |
TWI387407B (en) | Flexible printed circuit and fabrication method thereof | |
JP4414365B2 (en) | High-speed transmission board | |
JP2012238848A5 (en) | ||
US10726971B2 (en) | Shielded flat cable | |
CN205584642U (en) | Resin multilayer substrate | |
JP2015005744A (en) | Attenuation reduction grounding structure for differential-mode signal transmission lines of flexible circuit board | |
TWM601500U (en) | Flexible circuit board | |
JP2013033851A (en) | Flexible wiring module and flexible wiring device | |
JP2007234258A (en) | Printed circuit board unit | |
TWI573503B (en) | The Power Supply Path Structure of Soft Circuit Board | |
JP5835274B2 (en) | Connecting member and flat cable with connecting member | |
WO2020187091A1 (en) | Ffc cable and electronic device | |
TWI476788B (en) | Flexible standard cable and circuit board integrated cable structure | |
CN103491707B (en) | The integration bus-bar construction of soft standard winding displacement and circuit board | |
CN109585068B (en) | Long straight high-frequency transmission cable | |
JP2017139180A (en) | Flexible flat cable and manufacturing method thereof | |
JP7060171B2 (en) | Transmission line and circuit board | |
JPWO2018139382A1 (en) | Multilayer substrate and electronic device | |
JPH04306507A (en) | Flat cable |