TW595282B - Circuit board apparatus - Google Patents

Circuit board apparatus Download PDF

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Publication number
TW595282B
TW595282B TW92120592A TW92120592A TW595282B TW 595282 B TW595282 B TW 595282B TW 92120592 A TW92120592 A TW 92120592A TW 92120592 A TW92120592 A TW 92120592A TW 595282 B TW595282 B TW 595282B
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Taiwan
Prior art keywords
circuit board
patent application
item
bottom panel
scope
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TW92120592A
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Chinese (zh)
Inventor
Bau-Chian Guo
Shr-Ying Lin
Tzung-Yi Li
Ji-Chang Wang
Ya-Wen Shiu
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Accton Technology Corp
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Priority to TW92120592A priority Critical patent/TW595282B/en
Priority to US10/751,401 priority patent/US20040240190A1/en
Priority to JP2004023696A priority patent/JP2004364249A/en
Application granted granted Critical
Publication of TW595282B publication Critical patent/TW595282B/en

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Abstract

A circuit board apparatus is especially suitable for PC card with wireless communication function. It contains a mutually connected multi-layer first circuit board and single-layer second circuit board. The main electronic components are installed on the first circuit board, and the wireless transmitting and receiving components are installed on the second circuit board. The wireless transmitting and receiving components are not located at the overlapped part with the first circuit board. Hence the general ground layer of the multi-layer first circuit board doesn't block the transmitting and receiving of wireless signal. On the other hand, the use of single-layer second circuit board also reduces the total cost.

Description

595282 五、發明說明(1) 【發明所屬之技術領域] 本發明疋有關於—福雷玫"k;驻要 ,, 、立 ^ , , μ 種^路板裝置’特別是有關於一藉 適用於無線網路卡上,藉由規格化之電 模組化組裝及降低± i i % Μ ^扳相連接而達到 座成本功效的一種電路板裝置。 【先前技術】 電腦用之擴充卡(或稱為電腦週邊卡,以下以595282 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention is related to—Freme "k; A circuit board device suitable for wireless network cards, which is assembled by standardized electrical modules and reduced by ± ii% Μ ^ to achieve cost efficiency. [Previous technology] Expansion cards for computers (or computer peripheral cards)

:!稱之i不僅提供了可攜式電腦及其他電子產品進行:能 κ充之能^,更增進了使用上之便利性。這些電腦卡(PC c^d)目丽存在有許多標準規格,例如由個人 卡國際協會(Personal Computer Mem〇ry Card 。體:! Said that i not only provides portable computers and other electronic products: can κ charge the energy ^, but also improves the convenience of use. These computer cards (PC c ^ d) have many standard specifications, such as the Personal Computer International Card (Personal Computer Memry Card).

International Association ;縮寫為PCMCIA)所建立之 PCMCIA標準規格便是其中一例。而電腦卡所能提供之 擴充功能則有包括:數據機卡(Fax M〇dem Card)、網路 卡Card)、記憶卡(Memory Card)、以及無線網 路卡(Wireless LAN Card ) ···等等。 為了讓電腦卡(PC Card )切合時代的需求,PCMCU 也不斷地研議、發展電腦卡的新規格,未來,預料將有更 多不同功能的電腦卡會被開發出來。 這些電腦卡除了在外觀尺寸與結構強度上必須符合 PCMCIA所制訂之國際標準規範之外,對於其電性安全"(例 如電磁干擾之遮蔽)以及功能規範亦有嚴格之限制。近年 來,電腦卡所提供之功能已有愈來愈強且愈來愈複雜之趨 勢’相對地’所需使用之電子元件數量以及電路設計之複The International Association (abbreviation: PCMCIA) establishes the PCMCIA standard specification as an example. The expansion functions that computer cards can provide include: Fax Card, Network Card, Memory Card, and Wireless LAN Card. and many more. In order to make PC Cards meet the needs of the times, PCMCU also continuously researches and develops new specifications for computer cards. In the future, it is expected that more computer cards with different functions will be developed. In addition to the external dimensions and structural strength of these computer cards, they must comply with international standards and specifications established by PCMCIA. They also have strict restrictions on their electrical safety (such as shielding of electromagnetic interference) and functional specifications. In recent years, the functions provided by computer cards have become stronger and more complex. The number of electronic components required for "relatively" and the design of circuits have increased.

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性::都呈劇幅比例增力σ。這些電腦卡由於受限於其可攜 之雷枚尺寸之要求,為了能提供足夠之面積之來容置所需 採i f計,目前,絕大部分功能較強的電腦卡内部均係 日2 —夕層結構(Multi-Layer )之電路板」,以供容納 皱馒雜的電路設計需求。 雷^而,並非所有的電腦卡都需要使用此種多層結構之 电路板。例如,無線網路卡便是其中一例。 叫苓考第1圖,第1圖係為習知使用單一電路板盔 =路卡電路板之立體視圖。在第!圖巾,無線網路卡中^ 衣設的電路板裝置100内部主要包括有:一多層電路板 ; 一或多個主要電子電路元件1 10以及一無線收發元件 〇等其中,無線收發元件1 2 0係為一類比高頻無線訊號 (Radio Frequency)之收發器,而該些主要電子電路元 件1 1 〇則提供進行無線通訊所需之包括類比/數位訊號之轉 換、數據資料之邏輯運算、以及與其他外界裝置(例如 PCMCIA插槽或電腦等)連接通訊等等功能,且係由包含多 數各式電子元件所構成。於習用技術中,該主要電子電路 元件110與無線收發元件丨20均是設置在同一多層電路板 130 上。 热悉此技藝者均知,由於無線收發元件丨2 〇極易受到 主要電子電路元件110運作時之電磁干擾,因此一般而 言,無線收發元件120均需與該些主要電子電路元件110相 隔一定距離,且以線路丨35來連接並進行兩者間之訊號傳 遞,以降低電磁干擾之影響。並且,為了提供較強功能與Sexuality: Both increase dramatically in proportion σ. Because these computer cards are limited by the size of the mines they can carry, in order to provide enough area to accommodate the required meter, at present, most of the most powerful computer cards are internally 2 — "Multi-Layer circuit board" to accommodate rugged circuit design requirements. However, not all computer cards require such a multilayer circuit board. One example is the wireless network card. It is called Lingkao Picture 1. Picture 1 is a perspective view of a conventional circuit board helmet = Luca circuit board. In the first! In the figure, the circuit board device 100 of the wireless network card 100 mainly includes: a multi-layer circuit board; one or more main electronic circuit elements 110 and a wireless transceiver element 0, etc. Among them, the wireless transceiver element 1 2 0 is a kind of analog high-frequency wireless signal (Radio Frequency) transceiver, and these main electronic circuit components 1 1 0 provide analog / digital signal conversion, logical operation of data and data required for wireless communication, It can also communicate with other external devices (such as PCMCIA sockets or computers), and is composed of a variety of electronic components. In conventional technology, the main electronic circuit element 110 and the wireless transceiver element 20 are both disposed on the same multilayer circuit board 130. Those who know this art well know that since the wireless transceiver element 丨 2 is extremely susceptible to electromagnetic interference during the operation of the main electronic circuit element 110, in general, the wireless transceiver element 120 needs to be separated from the main electronic circuit element 110 by a certain distance. Distance, and connected with line 丨 35 to carry out signal transmission between the two to reduce the influence of electromagnetic interference. And, in order to provide stronger functions and

較局效率的無線網路通 必須包含相當多數力此孩主要電子電路元件11 〇 計亦非常複雜。所以,,電子π件且其所需之相關電路設 置該些主要電子雷政:一般均需使用多層電路板130來承 之功能與運作:匕; 將因單層電路板所能六細尚右僅使用早層電路板的話, 網路卡所能提供之過於簡單而導致無線 刀月匕或疋運作效能受限。 但疋,由於多層電路板丨 路板延伸分佈的金屬接地層 有層 120直接設置於該多層電路曰板13戶=m線收發元件 m ^ M -¾ - ^ ^ /电路板13〇上,則無線收發元件120 Ιΐ30Φ ^ 中之至屬接地層所遮蔽而影響通訊品質與效能。因 此% ^般的解決方法多不於無線收發元件12 〇之投影方向 十i屬接地層,然而此舉將必然增加電子電路佈局上 的困難度以及複雜性。 π參考第2圖,第2圖係為習知無線網路卡所使用之多 層電路板1 3 0的剖面結構示意圖。於多層電路板丨3 〇所具有 之多層電路結構中,係包含有一層金屬接地層2 5 〇。一般 而言,這層金屬接地層250通常是以電鍍形成或是一整片 之銅箔貼合於整個多層電路板13〇之其中一層(可以為底 層或是中間夾層),而金屬接地層25 0的面積尺寸常是廣 泛涵蓋整個多層電路板1 3 0的。然而,對於無線網路卡之 技術領域而言,為了避免金屬接地層2 5 0阻擒到無線收發 元件1 2 0朝下發射之收發無線訊號2 0 0。於是,習用技術必More efficient wireless network communication must include a considerable majority of the main electronic circuit components of this device. The calculation is also very complicated. Therefore, the electronic π pieces and their related circuits are set up with these main electronic thunder policies: generally need to use the multi-layer circuit board 130 to perform functions and operations: dagger; due to the ability of a single-layer circuit board If only the early-layer circuit board is used, the network card can provide too simple and cause the wireless knives or puppets to have limited operating performance. However, since the multi-layer circuit board 丨 the extended metal ground layer of the circuit board has a layer 120 directly disposed on the multi-layer circuit board 13 households = m-line transceiver elements m ^ M -¾-^ ^ / circuit board 13〇, then The wireless transmitting and receiving element 120 I ΐ 30Φ ^ is shielded by the ground layer, which affects the communication quality and performance. Therefore, there are more common solutions than the projection direction of the wireless transceiver element 120, which is a ground plane. However, this will inevitably increase the difficulty and complexity of the layout of the electronic circuit. Refer to FIG. 2, which is a schematic cross-sectional structure diagram of a multi-layer circuit board 130 used in a conventional wireless network card. The multi-layer circuit structure of the multi-layer circuit board 301 includes a metal ground layer 250. Generally speaking, this metal ground layer 250 is usually formed by electroplating or a whole piece of copper foil is bonded to one of the entire multilayer circuit board 130 (which can be a bottom layer or an interlayer), and the metal ground layer 25 The area size of 0 often covers the entire multilayer circuit board 130. However, in the technical field of the wireless network card, in order to avoid the metal ground layer 250 from intercepting the wireless transmitting and receiving component 12 downward transmitting and receiving wireless signals 2000. Therefore, conventional technology must

595282 五、發明說明(4) 須使用額外的製程將位於無線收發元件丨2 〇投影方向上 金屬接地層去除。此舉不僅導致製程的複雜與成本之增、 加,且更因部分位於無線收發元件丨2 〇投影方向上的曰 1 3 1無法直接藉由導通孔(v i a )直接耦合(接地)至 接地層25 0,而造成電子電路佈局上的困難度以及複 相對提高。再且,由於多層電路板! 3 〇的成本係為單肩 “路板成本的好幾倍,而如前所述,由於無線收發元 I 2 0與主要電子電路元件丨丨〇必須相隔一定距離以上,苴益 形中勢必增加所需使用多層電路板13〇的面積大小、並、淮、 而相對提高生產成本。事實上,由前述之内容亦可得知, 由於無線收發元件1 2 0與主要電子電路元件丨丨〇之間 簡單之線路135進行電性連接。所以,除了電子電路元而 II 〇所涵蓋之區域需要使用到多層電路板丨3 〇結構之外,豆 他的部分並不需使用到相對昂貴且複雜的多層電路板。由 此可知,習用技術之電路板裝置確實仍有被進一步改進之 空間。 此外,也由於習用技術之無線網路卡係使用單一電 板來设置無線收發元件120與主要電子電路元件11〇。 此,當欲改變無線網路卡之規格或功能時,例如,當欲變 ,通訊協定、無線訊號頻率或功率、或是其他附加功能 日守,只要無線收發元件12〇或主要電子電路元件u〇中任一 ::或電路需要改變,便須完全重新設計整個電路 僅生產與設計成本均相對較高且於亦較不且使用彈性。595282 V. Description of the invention (4) An additional process must be used to remove the metal ground layer located in the projection direction of the wireless transceiver element. This not only causes the complexity of the process and the increase and cost of the process, but also because part of the wireless transceiving element, which is located in the projection direction, cannot be directly coupled (grounded) to the ground plane through the via. 25 0, and the difficulty and complexity of the electronic circuit layout are increased. Moreover, thanks to multilayer circuit boards! The cost of 30% is several times of the cost of a single-shoulder board. As mentioned earlier, since the wireless transceiver I20 and the main electronic circuit components must be separated by a certain distance or more, the benefits are bound to increase. It is necessary to use the area of the multi-layer circuit board 130, and the production cost is relatively increased. In fact, from the foregoing, it can also be known that since the wireless transceiver element 120 and the main electronic circuit element 丨 丨 〇 The simple line 135 is electrically connected. Therefore, in addition to the electronic circuit element and the area covered by II 〇 requires the use of multilayer circuit boards 丨 3 〇 structure, the other parts do not need to use relatively expensive and complex multilayer Circuit board. It can be seen that the circuit board device of the conventional technology still has room for further improvement. In addition, the wireless network card of the conventional technology uses a single electrical board to set the wireless transceiver 120 and the main electronic circuit component 11 〇. Therefore, when you want to change the specifications or functions of the wireless network card, for example, when you want to change, communication protocols, wireless signal frequency or power, or other additional Functional day watch, as long as any of the wireless transceiver element 12 or the main electronic circuit element u :: or the circuit needs to be changed, the entire circuit must be completely redesigned. Only the production and design costs are relatively high, and the cost is also relatively low. elasticity.

第8頁 595282 五 發明說明(5) 【發明内容】 於且明的主要目的是提供一種電路板裝置,其可適用 計彈ί热ί通訊功能之電腦卡上,且可提供較高之電路設 蔽’以故1便宜之生產成本、以及降低之無線通訊訊號遮 改善習用技術之種種缺失。 中之t ^明的另一目的是提供一種適於使用在無線網路卡 二雷牧4板裝置。藉由提供模組化設計之第一電路板與第 第一與^來分別設置電子電路元件與無線收發元件,而該 多声雷攸厂電路板可分別為成本較高但可設計複雜電路之 此,不描=、以及成本低且不具接地層之單層電路板。藉 發不會总二f生產成本相對降低、無線收發元件之訊號收 行功二=函夕層電路板中之接地層所遮蔽,並且,當欲進 更時,可以僅改變其中一電路板之電路設計、而 之設ί ΐϋ料直接使用+需重新料,形A —模組化 於本# _ > σα之整體设計彈性與設計成本均相對降低。 較佳實施例中,電路板裝置中之第-電路板 ”弟一電路板可以表面接著(SMT)、嵌合 方接鲜接(weldlng)或膠合(邊一)等 作為例Γ可以扁排線(Flat Cable) 線收終-从 9弟一電路板來進行電子電路元件與無 線收發7G件之間的電性連接。 卞/… 了該11 ΐ ί本發明之較佳實施例的無線網路卡中,除 電路板裝置之外,纟包括有由塑膠材質之底面板、金 595282 五 發明說明(6) ______ 頂^以及塑膠柯質之頂面板所組 之卡合結構可與底面板上之卡合=:體。其中’頂蓋 ;與底面板上卡合結構;上之卡合結構 底面板形成一容置空間,篦 使頁面板、頂蓋以及 元件部分將恰可置於丁蓋路板以及主要電子電路 曰’,而無線收發元件則恰巧可置之£域各置空 之區域容置空間。 ;、板與底面板所形成 上 結 【實施方式】 本發明之電路板裝置的設計概冬,日 通訊功能所需之電子電路元件鱼無::字用來提供無 兩組不同之第-與第二電路板上’:、、再將:;件分別設置 :硬#電路之:層電路板,而第二電路板則可為成本低 具接地層之單層電路板或扁排線。不僅本發明之電路 I置的整體生產成本相對降低、無線收發元件之訊號收Page 8 595282 Five invention descriptions (5) [Summary of the invention] The main purpose of Yu and Ming is to provide a circuit board device, which can be applied to computer cards with communication functions and can provide higher circuit design. In order to reduce the cost of production and reduce the use of wireless communication signals to improve the conventional technology, all the shortcomings are lacking. Another purpose of the China t ^ Ming is to provide a four-board device suitable for use in a wireless network card. Electronic circuit components and wireless transceiver components are provided by providing a first circuit board and first and first modules with modular design, respectively, and the multi-thunder circuit board can be a higher cost but can design complex circuits Therefore, it does not describe a single-layer circuit board with low cost and no ground layer. Borrowing will not reduce the total production cost, and the signal receiving function of the wireless transceiver components will be covered by the ground layer in the circuit board. And when you want to make more changes, you can only change one of the circuit boards. The circuit design, and the design ί use the material directly + need to re-material, Form A — modularized in this # _ > The overall design flexibility and design cost of σα are relatively reduced. In a preferred embodiment, the first circuit board in the circuit board device can be surface-bonded (SMT), mated square welded (weldlng), or glued (side one), etc. Γ can be flat cable (Flat Cable) End of the line-the electrical connection between the electronic circuit element and the wireless transceiver 7G is performed from the 9th circuit board. 卞 /… The 11 ΐ wireless network of the preferred embodiment of the present invention In addition to the circuit board device, the card includes a bottom plate made of plastic material, gold 595282, five invention descriptions (6) ______ top ^ and the plastic structure of the top plate can be combined with the bottom plate. Engagement =: body. Among them, the 'top cover' and the engaging structure on the bottom panel; the engaging structure on the bottom panel forms an accommodating space, so that the page board, the top cover, and the component part can be placed on the Dinggao Road The board and the main electronic circuit are said to be ', and the wireless transceiver element happens to be able to be placed in the empty space to accommodate the space. The board and the bottom panel form a knot [Embodiment] The design of the circuit board device of the present invention Almost winter, electronic circuit components required for Japanese communication functions :: The word is used to provide no two sets of different first- and second circuit boards': ,, and then :; pieces are set separately: hard #circuit of: layer circuit board, and the second circuit board can be low cost A single-layer circuit board or flat cable with a ground layer. Not only the overall production cost of the circuit of the invention is relatively reduced, but also the signal reception of the wireless transceiver element

不會受到多層電路板中之接地層所遮蔽,旅且,當欲進行 設計變更時,僅需改變第一電路板之電路設計、而第二電 路板與無線收發元件則仍可直接使用不需重新設計,反之 亦然,而為一模組化之設計概念,進而提高產品之設計彈 性,並降低產品之設計成本。 為使 貴審查委員能對本發明之特徵、目的及功能有 更進一步的認知與瞭解,茲配合圖式詳細說明如後:Will not be shielded by the ground layer in the multilayer circuit board. Moreover, when design changes are required, only the circuit design of the first circuit board needs to be changed, while the second circuit board and wireless transceiver components can still be used directly without the need Redesign, and vice versa, is a modular design concept, which improves product design flexibility and reduces product design costs. In order to allow your reviewers to further understand and understand the features, objectives, and functions of the present invention, the detailed description with the drawings is as follows:

第10頁 595282Page 10 595282

請參考第3圖,其係為本發明之電路板裝置之較佳實 側:向立體視圖。在第3圖中,電路板裝置3〇〇為使 用包括一多層電路板330 (以下亦稱為第_電路板)及一 單層電路板340 (以下亦稱為第二電路板 二,且電路板3 30、340上分別設置有主要電子電路:件 二無線收發元件320。多層電路板33〇與單層電路板 340之間係以電性連接機構355相互結合,而主 元件320之間則以分別位於多層電路板 330共早層電路板34〇上之線路35〇、36〇加以電性連接。盆 中’線收發元件320係為一類比高頻無線訊號(Uio 二7“之、收發器,而該主要電子電路元件310則提供 件32()與進行無線通訊之功能’例如包 Λ訊號之轉換、數據資料之邏輯運算、以及 等功处二七(例如PCMCIA插槽或電腦等)連接通訊等 #力此,而係由包含多數各式電子元件所構成。 之1 =路i;佳實施例雖然是以適用於符合PCMHA規格 腐、線、,·罔路卡中的電路板裝置3〇〇來舉例說明,然而,苴 不應用於限制本發明的可每妳铲 八 30 0亦可適用二Λ貝把圍,本發明之電路板裝置 發元件320之1 # ^二、有主要電子電路元件310以及無線收 之^其他種類或規袼的無線通訊裝置者。 施例:ΐ: 。其係為本發明之電路板裝置30 0較佳實 層電路板電路板裝&置30 0為使用單 發元件32G於單層電^34 “路板結構’且無線收 電路板340上所處之位置並不與主要電子 595282Please refer to FIG. 3, which is a preferred real side of the circuit board device of the present invention: a perspective view. In FIG. 3, the circuit board device 300 uses a multi-layer circuit board 330 (hereinafter also referred to as the _ circuit board) and a single-layer circuit board 340 (hereinafter also referred to as the second circuit board two, and The main electronic circuits are respectively provided on the circuit boards 3, 30, 340: the second wireless transmitting and receiving element 320. The multi-layer circuit board 33 and the single-layer circuit board 340 are mutually connected by an electrical connection mechanism 355, and the main element 320 is It is electrically connected by the lines 35 and 36 which are respectively located on the multilayer circuit board 330 and the early-layer circuit board 34. The 'line transmitting and receiving element 320 in the basin is an analog high-frequency wireless signal (Uio 2 7 ", Transceiver, and the main electronic circuit element 310 provides a piece 32 () and functions for wireless communication, such as the conversion of Λ signals, the logical operation of data and data, and other functions such as PCMCIA slots or computers ) 连接 通信 等 # Force this, and it is composed of a variety of electronic components. 1 = circuit; although the preferred embodiment is suitable for circuit boards in line with PCMHA specifications Device 300 to illustrate, however, 苴It should not be used to limit the present invention. It can also be used for two shovels. The circuit board device according to the present invention has a component 320-1 # ^ 2. It has a main electronic circuit component 310 and a wireless receiver. ^ Others The type or standard of the wireless communication device. Example:: It is the circuit board device 300 of the present invention, preferably a solid circuit board circuit board installation & setting 300 is a single-use component 32G on a single layer Electrical ^ 34 "board structure" and the position of the wireless receiving circuit board 340 is not the same as the main electronic 595282

電路元件310所處之多層電路板3 3〇疊合。 、,由於無線收發元件320於單層電路板34〇上之所處位置 亚不與主要電子電路元件3 1〇所處之多層電路板3 3〇疊合, 所以夕層電路板3 3 0所具有的金屬接地層5丨〇 (其係沿著整 :rf電路板3 3 〇面積延伸分佈)並不會遮蔽無線收發元 牛20所收發的訊號5〇〇。並且,單層電路板34〇上並不具 =接+地層510,因此,當無線收發元件32〇收發無線訊號、 # %,汛號5 0 0於各方向上均完全不受接地層所影響或屏 敝,所以無線收發元件320的無線訊號5〇〇收發品質盥效 均可大幅改善。 、/' 明苓閱第5A圖及第5B圖,其揭露有本發明用以结人多 層電路板330與單層電路板340之電性連接機構49〇的°實°施 1列不意圖。、其中,第5A圖係為單層電路板34〇與多層電路 = 330之透視不意圖,而第5B圖係為單層電路板gw與多層 電路板330電性連接後之俯視與側視示意圖。 /、 如第5A圖所示,於多層電路板33〇及單層電路板34〇上 之相對應位置處可分別設置有若干個訊號接點(signai ^d)441、443 以及若干銲墊(Welding pad) 445、447。 接點441、443的對縣合可進行多層電路板33〇 人早層電路板340之間的電性連接,而電路板33〇、34〇上 之銲墊445、447則提供進行焊接結合的區域,以便使電路 J3 3 0、340可被結合固《成一體’並提供所需的結合強 J丄如第5B圖所示’當多層電路板33〇及單層電路板34〇被 、、,。曰完成後,該些訊號接點441、443與銲墊445、447將被 595282 五、發明說明(9) 夾置於兩電路板33〇、34〇之 4 9 0表示之。 、’虛線之電性連接機構 (w^Adlng) 以表面接¥ (SMT)、嵌人(P广例中、,本發明亦可選擇 "λ 八· ; ° (PluSging )或膠合 者。⑴叫)等其他方式來電性連接兩電路板330、340 字說自f?至第5β圖所示之若干實施例圖及其文 設叶f迕之盂ί ^明之電路板裝置300主要係使用模組化 口又口t衣&之電路板33〇、34〇决八 31〇與無線收發元件32〇 刀別承載主要電子電路元件 之電路板可為多層電路板,承電子電路元件 32〇之電路板則可板33 0,而承載無線收發元件 在本#Μ s、為層電路板34〇或甚至是一扁排線。而 路^另一實施例中,承載該無線收發元件320之電 ":、不具有金屬接地層之另一多層電路板,且承載 ^ :: 赉兀件3 2 〇之該多層電路板的層數係少於該第一 而反的層數,所以仍然具有成本較低之優勢。並且,當 雷1路板3 3 0、340組裝結合後,無線收發元件32()於單層 ' 板340上之位置並不與多層電路板3 3 0相重疊,因此, 夕層電路板3 3 0所具有之接地層5丨〇將不會阻礙到無線收發 件3 2 0所收發之訊號。而當欲進行設計變更時,僅需針 及=路板330、340中的其中之一變更設計、而另一電路板 其上之電子元件與電路設計則可不必變動。於是,不僅 本發明之電路板裝置的整體生產成本相對降低、無線收發The multilayer circuit board 330 where the circuit element 310 is located is stacked. Since the position of the wireless transceiver element 320 on the single-layer circuit board 34o does not overlap with the multi-layer circuit board 330, where the main electronic circuit element 3110 is located, the evening circuit board 3300 The metal ground layer 5 (which extends along the entire area of the rf circuit board 3 300) does not obscure the signal 500 transmitted and received by the wireless transceiver 20. In addition, the single-layer circuit board 34o does not have a connection + ground layer 510. Therefore, when the wireless transmitting and receiving element 32o transmits and receives wireless signals, #%, the flood number 500 is completely unaffected by the ground layer in all directions or Screen, so the wireless signal transmission and reception quality of the wireless signal 500 of the wireless receiving and receiving element 320 can be greatly improved. / 'Mingling read Figures 5A and 5B, which reveals that it is not intended to apply a row of 49 ° to the electrical connection mechanism of the multi-layer circuit board 330 and the single-layer circuit board 340 of the present invention. Among them, FIG. 5A is a perspective view of a single-layer circuit board 34 and a multilayer circuit = 330, and FIG. 5B is a schematic plan and side view of a single-layer circuit board gw and a multilayer circuit board 330 after being electrically connected. . / As shown in FIG. 5A, a plurality of signal contact points (signai ^ d) 441, 443, and a plurality of pads ( Welding pad) 445, 447. The pair of contacts 441 and 443 can be used for electrical connection between the multilayer circuit board 340 and the early-layer circuit board 340, and the solder pads 445 and 447 on the circuit board 340 and 340 provide soldering bonding Area, so that the circuits J3 3 0, 340 can be combined together to provide the required bonding strength. As shown in Figure 5B, when the multilayer circuit board 33 ° and the single-layer circuit board 34 ° are, . After the completion, the signal contacts 441, 443 and the solder pads 445, 447 will be indicated by 595282 V. Invention description (9) is sandwiched between two circuit boards 340 and 340. , 'The dotted line electrical connection mechanism (w ^ Adlng) is connected to the surface (SMT), embedded (P wide example, the present invention can also choose "λ · · ° (PluSging)" or glued. ⑴ Calling) and other ways to electrically connect the two circuit boards 330, 340. Words from f? To 5β are shown in the figures of some embodiments and their design. The circuit board device 300 of the Ming is mainly used in the mode. The circuit board 33, 34, 80, 31, and 32 for wireless transmission and reception, and the circuit board that carries the main electronic circuit components can be a multi-layer circuit board. The circuit board may be 330, and the wireless transmitting and receiving element is in the present #Ms, is a layer circuit board 340, or even a flat cable. In another embodiment, the multi-layer circuit board carrying the wireless transceiver element 320 ":, another multilayer circuit board without a metal ground layer, and the multi-layer circuit board carrying ^ :: 赉 件 3 2 〇 The number of layers is less than the first and opposite layers, so it still has the advantage of lower cost. In addition, when the Thunder 1 circuit board 3 3 0, 340 is assembled and combined, the position of the wireless transceiver element 32 () on the single-layer 'board 340 does not overlap with the multi-layer circuit board 3 3 0. Therefore, the evening circuit board 3 The ground layer 5 of the 30 will not hinder the signals sent and received by the wireless transceiver 3 2 0. When design changes are required, only one of the circuit boards 330 and 340 needs to be changed, and the electronic components and circuit designs on the other circuit board need not be changed. Therefore, not only the overall production cost of the circuit board device of the present invention is relatively reduced,

595282 五、發明說明(ίο) 元件之訊號收發不會受到多層電路板中之接地層所遮蔽。 請參考第6圖,其係為本發明之另一較佳實施例電路板裝 置配合裝設於一符合PCMCIA規格之無線網路卡6〇〇中的立 體分解圖。在第6圖中,無線網路卡6 0 0包括有··一多層電 路板615、設置於多層電路板615上之一主要電子電路元件 Sl〇、一扁平排線(Flat Cable ) 6 6 0、透過扁平排線66() 與多層電路板615電性連接之一無線收發元件62〇等之内部 π件結構,以及由電磁波可穿透材質(例如塑膠材質)之 一底面板630、電磁波不可穿透材質(例如金屬材質)之 一頂蓋6 5 0、及一電磁波可穿透材質之頂面板64〇所組成之 外部殼體結構。 於本較佳實施例中,扁平排線6 6 〇係作為一連接裝置 以電性連接主要電子電路元件61〇與無線收發元件62〇,因 此,該扁平排線660之功能實質上即等同於前述之單層電 路板640(或稱為第二電路板)。 曰595282 V. Description of the Invention (ίο) The signal transmission and reception of components will not be shielded by the ground layer in the multilayer circuit board. Please refer to FIG. 6, which is an exploded perspective view of a circuit board device according to another preferred embodiment of the present invention installed in a wireless network card 600 that complies with the PCMCIA specification. In FIG. 6, the wireless network card 600 includes a multi-layer circuit board 615, one of the main electronic circuit components S10 disposed on the multi-layer circuit board 615, and a flat cable 6 6 0. The internal π-piece structure of a wireless transceiver element 62, which is electrically connected to the multilayer circuit board 615 through the flat cable 66 (), and a bottom panel 630, which is one of the materials that can be penetrated by electromagnetic waves (such as plastic materials), electromagnetic waves An outer shell structure composed of a top cover 6 50 of a non-penetrable material (such as a metal material) and a top plate 64 0 of an electromagnetic wave penetrable material. In the preferred embodiment, the flat cable 66 is used as a connection device to electrically connect the main electronic circuit element 61o and the wireless transceiver element 62. Therefore, the function of the flat cable 660 is substantially equivalent to The aforementioned single-layer circuit board 640 (also referred to as a second circuit board). Say

其中,藉由底面板630、頂蓋6 5 0以及頂面板64〇皆分 別具有卡合結構(包括第一卡合結構63 5、第二卡合結構 6 5 5以及第三卡合結構645 )。藉由將頂蓋65〇之卡構 6 5 5與底面板63 0之卡合結構635相互嵌合以將頂蓋65〇^吉合 並定位於底面板630 —側位置處,且頂面板64〇之卡合結 645與该底面板630之卡合結構635相互嵌合,以使底面板 6 30、頂蓋6 5 0以及頂面板640之間可形成一容置空間。此 時,該無線收發元件620的位置係大體上位於塑膠材質之 頂面板640與底面板630所形成容置空間之區域,且主要電Among them, the bottom panel 630, the top cover 650, and the top panel 640 each have an engaging structure (including a first engaging structure 63 5, a second engaging structure 6 5 5 and a third engaging structure 645). . The top cover 65 ° and the engaging structure 635 of the bottom panel 63 0 are fitted to each other to fit and position the top cover 65 ° at the side of the bottom panel 630, and the top panel 64 °. The engaging knot 645 and the engaging structure 635 of the bottom panel 630 are fitted together, so that an accommodation space can be formed between the bottom panel 6 30, the top cover 6 50 and the top panel 640. At this time, the position of the wireless transceiving element 620 is generally located in the area formed by the top panel 640 and the bottom panel 630 made of plastic, and the main electrical

595282 五、發明說明(11) 子電路裝置610則大體上位於金屬材質之頂蓋65〇與塑膠底 面板6 3 0所形成容置空間之區域。於是便可將本發明之電 路板裝置固定於無線網路卡600殼體内之預定位置。藉由 此種殼體結構之設計,該無線網路卡6 0 〇之無線收發元件 6 2 0所收發之無線訊號將可順利通過塑膠材質之頂面板64〇 與底面板6 3 0,而於各方向上均不受限制與阻礙。而主要 電子電路元件6 1 0所產生之電磁波,則將受到金屬材質之 頂蓋6 5 0以及多層電路板615中所具有的接地層所遮蔽而不 會外洩至外界。所以,藉由本發明之電路板裝置設計(亦 即夕層電路板與單層電路板的搭配使用),使得本發明之 電路板衣置於使用於無線網路卡㈤〇上時,該無線網路卡 6〇〇之殼體結構將僅需要塑膠材質之底面板63〇、金屬材質 ^頂蓋6 5 0、及塑膠材質之頂面板64〇共三個元件,便可同 時達成將電路板裝置進行結合定位、防止主 電磁干擾(EMI)、以及提供讓無線收發元件62〇 丨員利收發無線訊號之功效者。 置於:芩考第7圖,第7圖係為本發明之電路板裝置配合裝 於:::無f網路卡7“之另一實施例的立體分解圖。由 所示分元件係相同或類似於第3圖與第6圖 且不i $ 同的元件將直接給予相同的元件名稱 且不再贅述其詳細構成。 ]兀仵名% ^第7圖所示之實施例中’無線網路卡7 路板330其電性連接於單層電路板34。之内部元二 構(電路議,。上原本所設置之主要電子;:=結595282 V. Description of the invention (11) The sub-circuit device 610 is generally located in the area of the accommodation space formed by the metal cover 65 and the plastic bottom panel 630. Thus, the circuit board device of the present invention can be fixed at a predetermined position in the housing of the wireless network card 600. With the design of this housing structure, the wireless signals transmitted and received by the wireless transmitting and receiving element 6 2 0 of the wireless network card 600 can pass through the plastic top plate 64 and the bottom plate 6 30, and There are no restrictions or obstacles on all sides. The electromagnetic waves generated by the main electronic circuit components 6 1 0 will be shielded by the top cover 6 50 made of metal and the ground layer in the multilayer circuit board 615 and will not leak to the outside. Therefore, by using the circuit board device design of the present invention (that is, the use of the evening circuit board and the single-layer circuit board), when the circuit board clothing of the present invention is placed on a wireless network card, the wireless network The housing structure of Luca 600 will only need three components, namely the bottom plate 63 of plastic material, the top cover 650 of metal material, and the top plate 64 of plastic material. Those who perform combined positioning, prevent main electromagnetic interference (EMI), and provide the function of allowing wireless transceiver elements 62 to send and receive wireless signals. Placed in: Examination of Fig. 7, which is a perspective exploded view of another embodiment of the circuit board device of the present invention installed at ::: f network card 7 ". The components shown are the same Or similar components in FIG. 3 and FIG. 6 without the same components will be given the same component names and will not be described in detail.] Vulgar name% ^ 'Wireless network in the embodiment shown in FIG. 7 Luca 7 circuit board 330 is electrically connected to the single-layer circuit board 34. The internal structure of the two elements (circuit board ,. The main electronics set by the original SSE;: = knot

第15頁 595282 五、發明說明(12) 3 1 0以及無線收發元件3 2 0未繪示於本圖中),以及底面 1 〇 a、頂蓋2 〇 a、與頂面板3 0 a所組成之外部殼體結構。而& 第7圖所示之實施例與前述實施例之不同點在於:電腦 結構7a在底面板10a、頂蓋2〇a及多層電路板33〇、單層 ,板340的相對應位置上設置有若干螺絲孔丨9、29、^。 藉由將若干螺絲50自頂蓋20a側朝向底面板1〇a鎖入,除。 可完成頂蓋20a側與底面板10a的結合定位工作外,且同日士 更可將單層電路板34G、多層電路板33G直接夾置 α ^ 成之容置空間中板以及頂面板3〇8與底面板間所形 路板m由本發明提出適用於無線通訊裝置之-種電 件、並以多^ ^不具接地層之單層電路板承置無線收發元 無線收蘇-1電路板來承置其他主要電子電路元件,可使 所阻礙:ΐ弱所::t訊號!會受到多層電路板之接地層 本發明之雷政 δ日寸,因單層電路板的成本較低而使得 電路板(多層It置的整體生產成本更為低廉。並且,兩 當欲進行1 ί板來與單層電路板)均可模組化設計, 電路板的設計7讯裝置之功能變更時,僅需改變其中之一 電路板(例如單3如置換不同的多層電路板設計)而另一 需改變繼續沿=層電路板及其上之無線收發元件)則可不 成本的功效’而可達到增進使用彈性與降低設計製造 唯以上所述者 之限制本發明的〜,僅為本發明之較佳實施例,當不能以 、範圍。即大凡依本發明申請專利範圍所做 595282 五、發明說明(13) 之均等變化及修飾,仍將不失本發明之要義所在,亦不脫 離本發明之精神和範圍,故都應視為本發明的進一步實施 狀況。 595282 圖式簡單說明 【圖式簡單說明】 弟1圖係為習知你用置— 之立體視圖; 一電路板之無線網路卡電路板 第2圖係為習知無線網路 夕 面結構示意圖; 使用之夕層電路板的剖 第3圖係為本發明之電路一 侧方向立體視圖; 、 較佳實施例的上 第4圖係為如第3圖所示之本發明 例的剖面方向示意圖; 板裝置較佳實施 ^圖係為本發明之單層電路板與多 不思圖 3電路板之透視 第5B圖係為本發明之單層電路板 接後之俯視與側視示意圖。 層電路板電性連 於一無線網路卡 第6圖係為本發明之電路板裝置配置 中之另厂較佳實施例的立體分解圖; 無線網路卡 第7圖」系為本發明之電路板裝置配置於 中之另一實施例的立體分解圖。 ; 圖號說明: 29、49、19:螺絲孔 5 0 :螺絲 100、300 :電路板裝置 6 0 0 :無線網路卡 110 ^310 λ61〇 · φ φ φ υ•主要電子電路元件 595282 圖式簡單說明 1 2 0、3 2 0、6 2 0 :無線收發元件 130、330、615 :多層電路板 1 3 1 :線路 135、350、360 :線路 2 0 0、5 0 0 :訊號 2 5 0 :接地層 3 4 0 :單層電路板 4 4 1、4 4 3 :訊號接點 445、447 :銲墊Page 15 595282 V. Description of the invention (12) 3 1 0 and wireless transceiver element 3 2 0 (not shown in this figure), and the bottom surface 1 〇a, the top cover 2 〇a, and the top panel 3 0 a External shell structure. The & FIG. 7 embodiment is different from the foregoing embodiment in that the computer structure 7a is at the corresponding position of the bottom panel 10a, the top cover 20a, the multilayer circuit board 33o, and the single layer 340. There are several screw holes 丨 9, 29, ^. The plurality of screws 50 are locked in from the top cover 20a side toward the bottom panel 10a and removed. It can complete the combined positioning of the top cover 20a side and the bottom panel 10a, and can also directly sandwich the single-layer circuit board 34G and the multi-layer circuit board 33G with the middle space of the storage space and the top panel 308. The circuit board m formed between the circuit board and the bottom panel is provided by the present invention, which is suitable for wireless communication devices. It is a kind of electrical components, and the wireless receiving and receiving unit -1 is provided by a single-layer circuit board without a ground layer. The placement of other major electronic circuit components can hinder: weak place :: t signal! Will be affected by the ground layer of multi-layer circuit boards. The thunderstorm δ inch of the present invention, because the cost of a single-layer circuit board is lower, the overall production cost of the circuit board (multi-layer It) is lower. Both the board and the single-layer circuit board) can be modularized. When the function of the device is changed, only one of the circuit boards needs to be changed (for example, the single-layer circuit board is replaced by a different multi-layer circuit board design). If you need to continue to change = layer circuit board and wireless transceiver components on it), you can achieve cost-effectiveness without increasing the flexibility of use and reduce the design and manufacture. The above-mentioned limitations of the present invention are only limited to the present invention. In the preferred embodiment, the range cannot be used. That is to say, any changes and modifications made equally according to the scope of the patent application of the present invention 595282 V. Description (13) of the invention will still be within the spirit of the present invention and do not depart from the spirit and scope of the invention, so they should be regarded as the present invention. Further implementation status of the invention. 595282 Schematic description [Schematic illustration] Brother 1 is a three-dimensional view of a device you are familiar with; a wireless network card circuit board of a circuit board. Figure 2 is a schematic diagram of a conventional wireless network structure. ; Section 3 of the used circuit board is a perspective view of one side of the circuit of the present invention; and Section 4 of the preferred embodiment is a schematic view of the section direction of the example of the present invention as shown in FIG. 3 The preferred implementation of the board device ^ is a perspective view of the single-layer circuit board of the present invention and the circuit board of Fig. 3 in FIG. 5B is a schematic plan and side view of the single-layer circuit board of the present invention after connection. The layer circuit board is electrically connected to a wireless network card. FIG. 6 is an exploded perspective view of another preferred embodiment of the circuit board device configuration of the present invention; FIG. 7 of the wireless network card is the present invention. An exploded perspective view of another embodiment in which the circuit board device is disposed. ; Description of drawing number: 29, 49, 19: screw holes 5 0: screws 100, 300: circuit board device 6 0 0: wireless network card 110 ^ 310 λ61〇 · φ φ φ υ • Main electronic circuit components 595282 Schematic Brief description 1 2 0, 3 2 0, 6 2 0: wireless transceiver 130, 330, 615: multilayer circuit board 1 3 1: lines 135, 350, 360: lines 2 0 0, 5 0 0: signal 2 5 0 : Ground layer 3 4 0: Single-layer circuit board 4 4 1, 4 4 3: Signal contacts 445, 447: Solder pads

4 9 0 :電性連接機構 630、10a :底面板 6 3 5、6 4 5、6 5 5 :卡合結構 640、3 0a :頂蓋 6 5 0、2 0 a :頂面板 6 6 0 :扁平排線 7a :無線網路卡4 9 0: Electrical connection mechanism 630, 10a: Bottom panel 6 3 5, 6, 6 4 5, 6 5 5: Engagement structure 640, 3 0a: Top cover 6 5 0, 2 0 a: Top panel 6 6 0: Flat cable 7a: wireless network card

第19頁Page 19

Claims (1)

^5282 六 申請專利範圍 一種電路 一第一電 一主要電 —第二電 無線收 該第一 板裝置 路板; 子電路 路板, 發元件 電路板 •如申請專利範圍 電路板係為一多 板面積延伸分佈 3 ·如申請專利範圍 電路板係為一不 一電路板的層數 4·如申請專利範圍 電路板為一單層 5 ·如申請專利範圍 電路板為一扁排 如申請專利範圍 電路板與該第二 如申請專利範圍 6. 7. 連 接 機 構 至 少 包 8 ·如 中 請 專 利 範 圍 板 裝 置 係 設 置 於 9 ·如 中 請 專 利 範 圍 板 裝 置 係 設 置 於 ,至少包括: 元件,係設置於該第 总盥兮筐一 Φ⑽ 弟一電路板上; 係與该弟電路板電性碴拉· ^ ,係設置於該第二二杜連接,以及 相重疊之位置上。路板上且位於不與 ^項所述之電路板裝 層電路板且更具有 /、甲忒弟 之-金屬接地層者整個該第-電路 第2項所述之電路板裝置, 具有金屬接地層之+ ,、中3亥第一 ;ι少於該“:::層電:板,且該第 電路板。 板名置,其中該第二 :1。項所述之電路板裝置,其中該第二 項所述之電路板袭置,其中該第一 :路板係以-電性連接機構相互結合。 =6項所述之電路板裝置,其中該電性 ^有若干訊號接點以及若干銲墊。 項所述之電路板裝置,其中該電路 〜無線通訊裝置中。 項所述之電路板裝置,其中該電路 符合PCMCIA規袼之無線網路卡中。^ 5282 Six patent application scopes: one circuit, the first electricity, the main electricity-the second electricity wirelessly receives the first board device circuit board; the sub circuit board, the component circuit board • if the patent application scope, the circuit board is a multi-board Area extension distribution 3 · If the patent application circuit board is a layer of a different circuit board 4 · If the patent application scope circuit board is a single layer 5 · If the patent application scope circuit board is a flat row like the patent application circuit The board and the second such as the scope of the patent application 6. 7. The connection mechanism at least 8 · If the patent scope board device is set at 9 · The patent scope board device is set at, including at least: The second general basket is a circuit board; it is electrically connected to the circuit board of the brother, and is arranged at the position of the second and second connection and overlapping. The circuit board is located on a circuit board that is not laminated with the circuit board described in item ^ and further has a metal ground layer of /, and the entire circuit board device described in the second circuit item has metal connection. The ground layer is +, and is the first in the middle of the year; ι is less than the "::: layer electricity: board, and the first circuit board. The board name is set, where the second: 1. The circuit board device described in the item, wherein The circuit board arrangement described in the second item, wherein the first: the circuit boards are combined with each other by an -electrical connection mechanism. = The circuit board device described in the item 6, wherein the electrical device has a plurality of signal contacts and Several solder pads. The circuit board device according to the item, wherein the circuit is in a wireless communication device. The circuit board device according to the item, wherein the circuit is in a wireless network card conforming to the PCMCIA regulations. 六、申請專利範圍 1 0 ·如申請專利範圍第9項所述之電路板裝置,其中,該無 線網路卡至少包括· 一底面板,具有一第一卡合結構; 一頂蓋,具有一第二卡合、结構,該頂蓋之該第二卡合 結構可與該底面板之該第一卡合結構相互嵌合以將 该頂蓋結合並定位於該底面板上;以及 一頂面板,具有一第三卡合結構,該頂面板之該第三卡 合結構可與該底面板之該第 ^合結構相互嵌合,並 於該頂面板、該頂蓋與該底面板之間形成一容置空 間; 其中’ 5亥第一電路板以及該主要電子電路元件係大體上 位於該頂蓋與該底面板之間,且該無線收發元件係大 體上位於該頂面板與該底面板之間。 11.如申請專利範圍第丨0項所述之電路板裝置,其中,該 底面板與3亥頂面板係以電磁波可穿透之材質所製成, 且該頂蓋係以電磁波不可穿透之材質所製成。τ 1 2. —種電路板裝置,至少包括: 一第一電路板; 一主要電子電路元件,係設置於該第一電路板上· 一無線收發元件;以及 一連接裝置,用以電性連接該第一電路板與該無線收 發元件,且使該無線收發元件的位置大體上不重暴 於該第一電路板上。 且 1 3·如申請專利範圍第! 2項所述之電路板裝置,其中該連 595282 、申請專利範I 接裝置為一扁平排線。 1 4·如申請專利範圍第丨2項所述之電路板裝置,其中該連 接裝置係為一第二電路板,該第二電路板係與該第一 電路板電性連接,該無線收發元件係設置於該第二電 路板上大體上位於不與該第一電路板相重疊之位置 上。 1 5 ·如申請專利範圍第丨2項所述之電路板裝置,其中該第 電路板係為一多層電路板且更具有沿著整個該第一 電路板面積延伸分佈之一金屬接地層。6. The scope of patent application 10 The circuit board device according to item 9 of the scope of patent application, wherein the wireless network card includes at least a bottom panel with a first engaging structure; a top cover with a A second engaging structure, the second engaging structure of the top cover and the first engaging structure of the bottom panel can be fitted into each other to combine and position the top cover on the bottom panel; and a top panel With a third engaging structure, the third engaging structure of the top panel and the third engaging structure of the bottom panel can be fitted into each other, and formed between the top panel, the top cover and the bottom panel An accommodating space; wherein the first circuit board and the main electronic circuit element are generally located between the top cover and the bottom panel, and the wireless transceiver element is generally located between the top panel and the bottom panel; between. 11. The circuit board device as described in the scope of application for patent item No. 丨 0, wherein the bottom panel and the top panel are made of electromagnetic wave-permeable material, and the top cover is made of electromagnetic wave-impermeable material. Made of material. τ 1 2. A circuit board device, including at least: a first circuit board; a main electronic circuit element, which is disposed on the first circuit board; a wireless transceiver element; and a connection device for electrical connection The first circuit board and the wireless transceiving element, so that the position of the wireless transceiving element is not substantially violent to the first circuit board. And 1 3 · If the scope of patent application is the first! The circuit board device described in item 2, wherein the connection 595282 and the patent application fan connection device is a flat cable. 14. The circuit board device according to item 2 of the patent application scope, wherein the connection device is a second circuit board, the second circuit board is electrically connected to the first circuit board, and the wireless transceiver element It is arranged on the second circuit board at a position which does not overlap with the first circuit board. 1 5. The circuit board device according to item 2 of the patent application scope, wherein the first circuit board is a multilayer circuit board and further has a metal ground layer extending along the entire area of the first circuit board. 1 6 ·如申請專利範圍第丨2項所述之電路板裝置,其中該連 接衣置係為一不具有金屬接地層之多層電路板,且該 連接裝置之多層電路板的層數係少於該第一電路板的 層數。 1 7·如申請專利範圍第1 2項所述之電路板裝置,其中該電 路板裝置係設置於一無線通訊裳置中。 ~ 1 8.如申請專利範圍第1 2項所述之電路板裝置,其中該 路板裝置係裝置於一符合PCMCIA規格之無線網路^ “ 中016 · The circuit board device according to item 2 of the scope of the patent application, wherein the connection device is a multilayer circuit board without a metal ground layer, and the number of layers of the multilayer circuit board of the connection device is less than The number of layers of the first circuit board. 17. The circuit board device according to item 12 of the scope of patent application, wherein the circuit board device is arranged in a wireless communication device. ~ 1 8. The circuit board device described in item 12 of the scope of patent application, wherein the circuit board device is installed in a wireless network that complies with the PCMCIA specification ^ "Medium 0 19.如申請專利範圍第18項所述之電路板裝置,其中,爷 無線網路卡至少包括: 一底面板,其具有一第一卡合結構; 一頂蓋,其具有一第二卡合結構,該頂蓋之該第二卡 合結構可與該底面板之該第一卡合結構相互歲合以 將該頂蓋結合並定位於該底面板上;以及 口19. The circuit board device according to item 18 of the scope of patent application, wherein the wireless network card includes at least: a bottom panel having a first engaging structure; a top cover having a second engaging Structure, the second engaging structure of the top cover and the first engaging structure of the bottom panel may be engaged with each other to combine and position the top cover on the bottom panel; and 595282 六、申請專利範圍 一頂面板,其具有一第三卡合結構,該頂面板之該第 三卡合結構可與該底面板之該第一卡合結構相互嵌 合,並於該頂面板、該頂蓋與該底面板之間形成一 容置空間; 其中,該第一電路板以及該主要電子電路元件係大體 上位於該頂蓋與該底面板之間,且該無線收發元件 係大體上位於該頂面板與該底面板之間。595282 VI. Patent application scope A top panel having a third engaging structure, the third engaging structure of the top panel and the first engaging structure of the bottom panel can be fitted into each other, and the top panel An accommodation space is formed between the top cover and the bottom panel; wherein the first circuit board and the main electronic circuit element are generally located between the top cover and the bottom panel, and the wireless transceiver element is generally The upper is located between the top panel and the bottom panel. 2 〇.如申請專利範圍第1 9項所述之電路板裝置,其中,該 底面板與該頂面板係以電磁波可穿透之材質所製成, 且頂蓋係以電磁波不可穿透之材質所製成。2 〇. The circuit board device described in item 19 of the scope of patent application, wherein the bottom panel and the top panel are made of a material that can be penetrated by electromagnetic waves, and the top cover is made of a material that cannot be penetrated by electromagnetic waves Made of. 第23頁Page 23
TW92120592A 2003-05-30 2003-07-29 Circuit board apparatus TW595282B (en)

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Application Number Priority Date Filing Date Title
TW92120592A TW595282B (en) 2003-07-29 2003-07-29 Circuit board apparatus
US10/751,401 US20040240190A1 (en) 2003-05-30 2004-01-06 Communication card and method of making the same
JP2004023696A JP2004364249A (en) 2003-05-30 2004-01-30 Communication card and its manufacturing method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7916118B2 (en) 2006-05-05 2011-03-29 Innocom Technology (Shenzhen) Co., Ltd. Printed circuit board module with single and double layer printed circuit boards
TWI476788B (en) * 2012-06-04 2015-03-11 Adv Flexible Circuits Co Ltd Flexible standard cable and circuit board integrated cable structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7916118B2 (en) 2006-05-05 2011-03-29 Innocom Technology (Shenzhen) Co., Ltd. Printed circuit board module with single and double layer printed circuit boards
TWI476788B (en) * 2012-06-04 2015-03-11 Adv Flexible Circuits Co Ltd Flexible standard cable and circuit board integrated cable structure

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