TW201347858A - Coating method and coating apparatus - Google Patents

Abstract

This invention provides a coating method and a coating apparatus which corresponds to any coated pattern while maintaining high pattern coating precision originally provided by a slit coating method and a stripe coating method. The coating method includes: a bead forming process, discharging coating liquid from a discharging opening of a nozzle to form beads including the coating liquid between a substrate and the discharging opening; and a coating process, relatively moving the nozzle in regard to the substrate to coat the coating liquid on the substrate, wherein in the coating process, a coating end position of the coating liquid on the substrate is adjusted by changing a space between the discharging opening of the nozzle and the substrate.

Description

Coating method and coating device

The present invention relates to a coating method and a coating apparatus, and more particularly to a coating method and a coating apparatus for a solution of a semiconductor substrate coating material.

As a structure of a solar cell, a back surface bonding type solar cell in which a pn junction is formed on a back surface of a main surface of a semiconductor substrate opposite to a light receiving surface on which sunlight is incident is known. In the back-junction type solar cell, since the electrode does not exist on the light-receiving surface, it is expected to have high conversion efficiency in principle and excellent in designability from the light-receiving side. This back-junction type solar cell has begun to be practical. Chemical.

In the back junction type solar cell, the n-type region and the p-type region and the protective film or electrode corresponding to the regions are formed only on the back surface to form a pattern, and therefore a pattern processing technique with high precision is required. In this regard, Patent Document 1 discloses a technique in which a film to be subjected to pattern processing is directly subjected to pattern coating by a stripe coating method, thereby simplifying the manufacturing process of the back surface bonding type solar cell.

The strip coating method refers to a coating method as described below, that is, one side A coating nozzle (nozzle) provided with a plurality of openings (discharge ports) is relatively moved with respect to the substrate, and a solution is continuously ejected from the plurality of ejection ports, thereby forming a plurality of strip-shaped patterns, and the openings ( Spray outlet) A solution (paste) of the material ejected. In the stripe coating method, since the coating nozzle is not in contact with the substrate, it is possible to avoid cracking or scratching of the substrate or contamination of the substrate which is worried in the screen printing method (for example, refer to Patent Document 2 to Patent Document 4). Deterioration of influence and positional accuracy. Further, according to the technique disclosed in Patent Document 1, since the paste is ejected downward from the coating nozzle, the other paste can be pattern-coated even in a state in which a certain paste is applied first.

Further, in the stripe coating method, the coating is performed while continuously discharging the solution. Therefore, in the case of the ink jet method in which the solution is intermittently ejected (for example, refer to Patent Document 4 and Patent Document 5), the solution forms a combination pattern of a plurality of circles as shown in FIG. The method has the advantage of being able to apply a pattern to a stripe shape with higher precision.

Prior art literature

Patent literature

Patent Document 1: International Publication No. 2011/074467

Patent Document 2: Japanese Patent Laid-Open Publication No. 2008-186927

Patent Document 3: Japanese Patent Laid-Open Publication No. 2010-205839

Patent Document 4: International Publication No. 2007/081510

Patent Document 5: Japanese Patent Laid-Open Publication No. 2004-221149

Patent Document 6: Japanese Patent Laid-Open Publication No. 2001-269610

Patent Document 7: Japanese Patent Laid-Open Publication No. 2001-96213

However, a single crystal germanium substrate suitable for use in a back junction type solar cell is cut out from a cylindrical ingot. Therefore, as shown in FIG. 28, the semiconductor substrate 91a is not square but has a notched portion 92 at four corners. shape. In the previous stripe coating method, it is difficult to form the coating shape 93a along the slit portion 92. Further, as shown in FIG. 29, even in the case of the square substrate 91b, it is difficult to form the coating shape 93b having a different length in the coating direction. In other words, in the conventional stripe coating method, the coating shape of the shape in which the shape of the application start position and the application end position is parallel to the arrangement of the discharge ports, for example, in a rectangular shape, can be applied accurately. However, it is difficult to apply a pattern to a region having an arbitrary coating shape other than this, which is a problem.

There is also known a slit coating method which is different from the strip coating method in which a paste is applied to a pattern, but uses a coating nozzle provided with a slit-like discharge port (coating head (head) )) Apply the paste to the entire surface. For example, in Patent Document 6, as a technique for applying the slit coating method to a circular-shaped substrate, a technique is disclosed in which a circular substrate is embedded in a substrate stage having a concave substrate holding portion. The paste is applied to the entire upper surface of the substrate stage by the coating head. However, in this method, it is difficult to completely remove the paste adhering to the substrate stage every time the paste is applied to the substrate. Further, there is a concern that the paste invades the gap between the substrate and the substrate stage, or the paste temporarily attached to the substrate stage flows into the concave substrate holding portion or the like, and the paste adheres to the bottom of the concave substrate holding portion. , hindering the loading and unloading of the next substrate.

Moreover, for example, in Patent Document 7, there is disclosed the following technique: A flexible film-like substrate is subjected to slit coating on the entire upper surface of the sample stage while being adsorbed on an endless groove formed on the upper surface of the sample stage. However, in this method, it is necessary to make the region in the middle of the substrate along the endless groove, and thus it is only possible to use a substrate which is flexible like a resin film.

Further, the film-form substrate is adsorbed to the endless groove to perform slit coating In the case of the following, there are still the following problems. In the state in which the film substrate 96 is adsorbed along the endless groove 95 of the substrate stage 94, the coating liquid (paste) 98 is ejected from the nozzle 97, and the application is started. 30B is a cross-sectional view taken along line A9-A9' of FIG. 30A. In addition, in FIG. 30B, the description of the internal structure of the nozzle 97 is abbreviate|omitted.

Figure 31B is a cross-sectional view taken along line A10-A10' of Figure 31A. Furthermore, in Figure 31B In the middle, the description of the internal structure of the nozzle 97 is omitted. As shown in Fig. 31A, when the nozzle 97 is adjacent to the endless groove 95, as shown in Fig. 31B, the paste 98 does not adhere to the portion of the film substrate 96 which is lower than the surrounding portion, but since the paste 98 is continuously ejected from the front end of the nozzle 97, Therefore, the accumulation of the paste 98 in this portion is increased.

Figure 32B is a cross-sectional view taken along line A11-A11' of Figure 32A, and Figure 33B is Figure 33A A12-A12' section view. As shown in FIG. 32A, when the nozzle 97 is adjacent to the circular application target region in this state, the paste excess adhesion portion 99 is formed at the end portion of the application target region of the film substrate 96. As a result, as shown in FIG. 33A and FIG. 33B, the paste excess adhesion portion 99 is formed on the upstream side of the circular application target region, and thus the film thickness of the portion is increased.

Even the same principle as this slit coating is applied to strip coating In the case of the method, the paste adheres excessively to the upstream side. Therefore, there is a problem in that not only the film thickness of the portion is increased, but also the lateral direction is developed, and the stripe width is increased.

The present invention has been made in view of the above problems, and an object thereof is to provide a coating The cloth method and the coating device can correspond to an arbitrary coating shape in a state in which high pattern coating precision originally provided by the slit coating method or the stripe coating method is maintained.

In order to solve the above problems and achieve the object, the coating method of the present invention The method includes a liquid bead forming step of ejecting a coating liquid from a discharge port of a nozzle, forming a liquid bead including the coating liquid between the substrate and the ejection port, and a coating step of relatively moving the nozzle relative to the substrate The coating liquid is applied onto the substrate, and in the coating step, the application end position of the coating liquid on the substrate is adjusted by changing the interval between the discharge port of the nozzle and the substrate.

In the above coating method, the nozzle has a slit-shaped discharge port, and In the coating step, the coating liquid is applied to a wide pattern from one end of the substrate toward the other end by a nozzle having the slit-shaped discharge port, and the shape of the slit is different from the coating described above. The shape of the end position.

In the above coating method, the nozzle has a plurality of discharges arranged in a dispersed arrangement The coating step of applying the coating liquid into a stripe pattern by a nozzle having the plurality of ejection ports from one end of the substrate toward the other end, and the arrangement of the plurality of ejection ports is different from the above The arrangement of the coating end position.

In the above coating method, the above-mentioned discharge port is along a straight line, a curve or A slit shape provided at least at a portion where the line is curved.

In the above coating method, the plurality of discharge ports are along a straight line and a curve Or arranged at least at a line where the portion is curved.

In the above coating method, the coating step is performed on the substrate The coating liquid is applied to the region enclosed by the closing line, and the closed line includes a polygonal shape, a closed curve or a combination of a straight line and a curved line, and the slit-shaped discharge port is a coating start position along the coating liquid in the region. shape.

In the above coating method, the coating step is performed on the substrate The coating liquid is applied to the region enclosed by the closing line, and the closing line includes a polygonal shape, a closed curve, or a combination of a straight line and a curved line, and the plurality of discharge ports are arranged along a coating start position of the coating liquid in the region.

In the above coating method, the substrate has a peripheral shape including a closed line In the shape, the closed line includes a polygon, a closed curve, or a combination of a straight line and a curved line, and the outer peripheral shape of the region is a shape along an outer peripheral shape of the substrate.

In the above coating method, by making the above coating end position relative to the upper The application target region of the coating liquid in the substrate is lowered to change the interval between the discharge port of the nozzle and the substrate.

In the above coating method, by self-holding a part of the substrate The end portion of the stage of the substrate protrudes, and a downward force is applied to the portion to lower the coating end position.

In the above coating method, by setting a step or a tilt to the substrate It is inclined so that the above coating end position is lowered.

In the above coating method, by causing at least a portion of the nozzle to face upward The nozzle moves away from the substrate to change the interval between the discharge port of the nozzle and the substrate.

The coating apparatus of the present invention is characterized by comprising: a stage holding the substrate; a nozzle that ejects a coating liquid from a discharge port; a unit that relatively moves at least one of the substrate and the nozzle with respect to the other; and a unit that changes a distance between the ejection orifice of the nozzle and the substrate.

In the above coating apparatus, the nozzle has a slit-shaped discharge port, By moving at least one of the substrate and the nozzle relative to the other, the coating liquid is applied from one end of the substrate toward the other end by a nozzle having the slit-shaped discharge port. It is applied in a wide pattern, and the shape of the slit is different from the shape of the coating end position described above.

In the above coating apparatus, the nozzle has a plurality of discharges arranged in a dispersed arrangement The port is applied to the coating liquid in a stripe pattern by relatively moving at least one of the substrate and the nozzle relative to the other, and the arrangement of the plurality of ejection ports is different from the coating The arrangement of the end positions.

In the above coating apparatus, the stage has a substrate mounting surface, and the base The plate mounting surface is a non-planar shape that is convex with respect to the discharge port of the nozzle, and a means for changing a distance between the discharge port of the nozzle and the substrate is a holding mechanism, and the holding mechanism holds the substrate with respect to the substrate mounting surface. .

In the above coating apparatus, a part of the substrate is from the stage a unit in which the end portion protrudes, wherein the substrate is disposed on the stage, and a unit that changes a distance between the discharge port of the nozzle and the substrate is a holding mechanism, and the holding mechanism is The protruding portion of the substrate applies a downward force, and the substrate is held by the stage.

In the above coating apparatus, the means for changing the distance between the discharge port of the nozzle and the substrate is a mechanism for moving at least a part of the nozzle toward the nozzle away from the substrate.

In the above coating apparatus, the slit-shaped discharge port is formed in a slit shape along a straight line, a curved line, or a line bent at at least one portion.

In the above coating apparatus, the plurality of discharge ports are arranged along a straight line, a curved line, or a line bent at at least one portion.

According to the present invention, since the application end position of the coating liquid is adjusted by changing the interval between the discharge port of the nozzle and the substrate, even in the case of the region having an arbitrary coating shape, the slit coating method or the strip coating can be maintained. The coating liquid is applied with high precision in a state in which the pattern coating accuracy is originally provided.

10‧‧‧Back junction solar cells

11, 11a~11g, 11d', 91b‧‧‧ substrate

12‧‧‧n type area

13‧‧‧p-type area

14, 15‧ ‧ protective film

15a‧‧‧ Opening

16‧‧‧n type contact electrode (electrode)

17‧‧‧p type contact electrode (electrode)

18, 92‧‧‧cut section

19, 19'‧‧‧ Coating area

21, 21'‧‧‧ diffuse mask

24‧‧‧n type solid phase diffusion source

25‧‧‧p-type solid phase diffusion source

26‧‧‧Increase

31, 31a~31h‧‧‧

34, 34a~34d, 34g~34i, 97‧‧‧ nozzle

34g (C) ‧ ‧ central nozzle section

34g (L) ‧ ‧ left nozzle

34g (R) ‧ ‧ right nozzle

35, 98‧ ‧ coating liquid (paste)

37, 38, 38 (C), 38 (L), 38 (R) ‧ ‧ spout

38a, 38b, 38c‧‧ slit

39‧‧‧Bend points

40‧‧‧ Coating device

41‧‧‧Linear drive (X direction)

42‧‧‧Linear drive (Y direction)

43, 53‧‧‧ bracket

44‧‧‧CCD camera

45‧‧‧Sensor

46‧‧‧coating solution

47‧‧‧Liquid beads

48‧‧‧pressure port

49‧‧‧ coating liquid supply port

52‧‧‧Linear drive (Z direction)

54‧‧‧Servo motor

91a‧‧‧Semiconductor substrate

93a, 93b‧‧‧ coated shape

94‧‧‧Substrate stage

95‧‧‧ Endless slot

96‧‧‧film substrate

99‧‧‧Paste excess attachment

100‧‧ ‧ step

101‧‧‧ inclined section

C1, C2, C2'‧‧‧ a little chain line

F‧‧‧ force

LC‧‧‧ interval

P, Q‧‧‧ coating end position

X, Y, Z, θ‧‧‧ directions

FIG. 1 is a cross-sectional view showing a state in which a liquid bead is formed between a substrate and a discharge port of a nozzle in the coating method according to the embodiment of the present invention.

2 is a cross-sectional view showing a state in which a liquid bead between a substrate and a discharge port of a nozzle is interrupted in the coating method according to the embodiment of the present invention.

3A is a view for explaining an example of a coating method according to Embodiment 1 of the present invention.

Fig. 3B is a cross-sectional view taken along the line A1-A1' in a state where the nozzle shown in Fig. 3A is moved to the position of the two-dot chain line A1-A1'.

Fig. 3C is a cross-sectional view taken along the line B1-B1' in a state where the nozzle shown in Fig. 3A is moved to the position of the two-dot chain line A1-A1'.

FIG. 4A is a view for explaining an example of a coating method according to Embodiment 2 of the present invention.

4B is a cross-sectional view taken along the line A2-A2' in a state where the nozzle shown in FIG. 4A is moved to the position of the two-dot chain line A2-A2'.

4C is a cross-sectional view taken along the line B2-B2' in a state where the nozzle shown in FIG. 4A is moved to the position of the two-dot chain line A2-A2'.

FIG. 5A is a view for explaining an example of a coating method according to Embodiment 3 of the present invention, and is a plan view showing a substrate and a nozzle at the application start timing.

Fig. 5B is a cross-sectional view taken along line A3-A3' of Fig. 5A.

FIG. 6A is a view for explaining an example of a coating method according to Embodiment 3 of the present invention, and shows a plan view of a substrate and a nozzle at the time of ending the application in the middle of the substrate.

Fig. 6B is a cross-sectional view taken along line A4-A4' of Fig. 6A.

FIG. 7A is a view for explaining an example of a coating method according to Embodiment 4 of the present invention.

Fig. 7B is a cross-sectional view taken along the line A5-A5' in a state where the nozzle shown in Fig. 7A is moved to the position of the two-dot chain line A5-A5'.

Fig. 7C is a cross-sectional view taken along the line B5-B5' in a state where the nozzle shown in Fig. 7A is moved to the position of the two-dot chain line A5-A5'.

FIG. 8A is a view for explaining another example of the coating method according to Embodiment 4 of the present invention.

FIG. 8B is a view for explaining another example of the coating method according to Embodiment 4 of the present invention.

FIG. 9 is a view for explaining a first modification of the coating method according to the first embodiment and the second embodiment of the present invention.

FIG. 10 is a view for explaining a first modification of the coating method according to the first embodiment and the second embodiment of the present invention.

FIG. 11A is a plan view illustrating a second modification of the coating method according to the third embodiment of the present invention.

FIG. 11B is a front view for explaining a second modification of the coating method according to the third embodiment of the present invention.

FIG. 12A is a plan view showing a state in which coating is completed in the middle of the substrate shown in FIG. 11A.

Fig. 12B is a front elevational view showing a state in which coating is completed in the middle of the substrate shown in Fig. 11A.

FIG. 13A is a plan view illustrating an example in which the coating method according to Embodiment 1 of the present invention is applied to a slit coating method.

Fig. 13B is a cross-sectional view taken along the line A6-A6' in a state where the nozzle shown in Fig. 13A is moved to the position of the two-dot chain line A6-A6'.

Fig. 13C is a cross-sectional view taken along the line B6-B6' in a state where the nozzle shown in Fig. 13A is moved to the position of the two-dot chain line A6-A6'.

FIG. 14A is a plan view illustrating an example in which the coating method according to Embodiment 2 of the present invention is applied to a slit coating method.

Fig. 14B is a cross-sectional view taken along the line A7-A7' in a state where the nozzle shown in Fig. 14A is moved to the position of the two-dot chain line A7-A7'.

Fig. 14C is a cross-sectional view taken along the line B7-B7' in a state where the nozzle shown in Fig. 14A is moved to the position of the two-dot chain line A7-A7'.

Fig. 15A is a plan view showing a modification of the slit-shaped discharge port.

Fig. 15B is a plan view showing a modification of the slit-shaped discharge port.

Fig. 15C is a plan view showing a modification of the slit-shaped discharge port.

FIG. 16 is a perspective view showing an example of a coating device that can be used in the coating methods of the first to fourth embodiments.

Fig. 17 is a cross-sectional view showing a typical structure of a back junction type solar cell.

Fig. 18 is a plan view of the back surface bonding type solar cell shown in Fig. 17 as seen from the back.

FIG. 19A is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19B is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19C is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19D is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19E is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19F is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19G is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

19H is a cross-sectional view for explaining an example of a method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

FIG. 20A is a cross-sectional view for explaining a modification of the method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

FIG. 20B is a cross-sectional view for explaining a modification of the method of manufacturing the back surface bonding type solar cell shown in FIG. 17.

FIG. 21A is a plan view illustrating an example of a coating method according to Embodiments 1 to 4 of the present invention in the method of manufacturing the back-bonding type battery shown in FIGS. 19A to 19H.

FIG. 21B is a plan view illustrating an example of a coating method according to Embodiments 1 to 4 of the present invention in the method of manufacturing the back-bonding type battery shown in FIGS. 19A to 19H.

FIG. 21C is a plan view illustrating an example of a coating method according to Embodiments 1 to 4 of the present invention in the method of manufacturing the back-bonding type battery shown in FIGS. 19A to 19H.

FIG. 21D is a plan view for explaining an example of a coating method according to Embodiments 1 to 4 of the present invention in the method of manufacturing the back-bonding type battery shown in FIGS. 19A to 19H.

Fig. 22 is a plan view for explaining a method of applying a dopant paste in Comparative Example 1.

Fig. 23 is a plan view for explaining a method of applying a dopant paste in Comparative Example 2.

Fig. 24 is a plan view for explaining a method of applying a dopant paste in Comparative Example 3.

Fig. 25A is a plan view for explaining a method of applying a dopant paste in Example 2 of the present invention.

Fig. 25B is a plan view for explaining a method of applying a dopant paste in Example 2 of the present invention.

Fig. 25C is a plan view for explaining a method of applying a dopant paste in Example 2 of the present invention.

Fig. 25D is a plan view schematically showing an n-type solid phase diffusion source and a p-type solid phase diffusion source formed on a substrate in the second embodiment of the present invention.

Fig. 26A is a plan view for explaining a method of applying a dopant paste in Example 3 of the present invention.

Fig. 26B is a plan view for explaining a method of applying a dopant paste in Example 3 of the present invention.

Fig. 26C is a plan view for explaining a method of applying a dopant paste in Example 3 of the present invention.

Fig. 26D is a plan view schematically showing an n-type solid phase diffusion source and a p-type solid phase diffusion source formed on a substrate in the third embodiment of the present invention.

Fig. 27 is a schematic view showing a bonding pattern of a solution formed in the prior stripe coating method.

28 is a plan view showing an example of a coating shape along a notch portion of a substrate.

29 is a plan view showing an example of a coating shape other than a rectangle formed on a square substrate.

FIG. 30A is a plan view illustrating an example of a method of applying a circular shape by a slit coating method.

Figure 30B is a cross-sectional view taken along line A9-A9' of Figure 30A.

Fig. 31A is a plan view showing a state in which the nozzle is adjacent to the endless groove in the prior slit coating method.

Figure 31B is a cross-sectional view taken along line A10-A10' of Figure 31A.

FIG. 32A is a plan view showing a state in which a paste excess adhesion portion is formed at an end portion of a coating target region of a film substrate in the prior slit coating method.

Figure 32B is a cross-sectional view taken along line A11-A11' of Figure 32A.

FIG. 33A is a plan view showing a state in which a paste excess adhesion portion is formed on the upstream side of the application target region of the film substrate in the previous slit coating method.

Figure 33B is a cross-sectional view taken along line A12-A12' of Figure 33A.

Hereinafter, embodiments of the coating method and coating apparatus of the present invention will be described in detail based on the drawings. Furthermore, the invention is not limited by the embodiments.

First, the steps included in the coating method of each embodiment of the present invention will be described.

(Bead formation step)

In the bead formation step, the coating liquid is ejected from the ejection port of the nozzle, and a liquid bead containing the coating liquid is formed between the substrate and the ejection port. In addition, the liquid bead is defined as a liquid that continuously fills a gap between the discharge port and the surface of the substrate as the coated surface.

1 and 2 are schematic views for explaining a coating method according to each embodiment of the present invention. As shown in FIG. 1, a nozzle 34 that ejects a coating liquid onto the substrate 11 is arranged above the substrate 11 on which the pattern of the coating liquid is formed. Inside the nozzle 34, the coating liquid 46 supplied from the coating liquid supply port 49 is filled. When the nozzle 34 is opposed to the substrate 11 and the inside of the nozzle 34 is pressurized from the pressurizing port 48 of the nozzle 34, the coating liquid 46 is extruded from the discharge port 37. At this time, when the distance LC between the tip end of the nozzle 34 and the upper surface (coated surface) of the substrate 11 is smaller than a predetermined length, the liquid droplet 47 is formed between the nozzle 34 and the substrate 11.

(coating step)

The coating step is to relatively move the nozzle relative to the substrate, and apply the coating liquid on the substrate. As shown in FIG. 1, in a state in which the liquid droplets 47 are formed between the substrate 11 and the discharge port 37 of the nozzle 34, the nozzle 34 and the substrate 11 are relatively moved to be coated. At this time, the substrate 11 can be stopped and only the nozzle 34 can be moved, or the nozzle 34 can be stopped at the same time to move only the substrate 11. Moreover, both the substrate 11 and the nozzle 34 can be moved. Further, in order to move the substrate 11, it is only necessary to move the stage (not shown in FIG. 1) holding the substrate 11.

(Adjustment of coating end position)

In the above coating step, by changing the discharge port of the nozzle during the coating process The interval between the substrates is adjusted to adjust the coating end position on the substrate. That is, as shown in FIG. 2, if the gap LC between the discharge port 37 and the substrate 11 is widened, the liquid droplet 47 will not be formed. Therefore, the coating is finished by changing the interval LC while applying the coating liquid 46, and widening the interval LC to a distance at which the liquid droplets 47 are no longer formed at the coating end position of the coating liquid 46. According to the method, it is not necessary to change the amount of pressurization from the pressurizing port 48, and the end position of the coating can be adjusted by simply adjusting the interval LC.

As a specific method for changing the interval LC during the coating process and widening at the coating end position of the coating liquid 46 to a distance at which the liquid bead 47 is no longer formed, the following method may be mentioned: when the substrate is held on the stage The substrate is held in a non-planar manner that is convex toward the nozzle, or the stage is tilted, or tilted toward the traveling direction of the nozzle, or a step or inclination is set on the substrate, so that other regions and the discharge port 37 are provided. The distance is larger than the distance between the coating target region in the substrate and the discharge port 37. Alternatively, a method in which the height of the substrate is kept constant and the nozzle is moved away from the substrate may be mentioned. These more specific methods are described in more detail in the following embodiments.

Next, the coating method of the embodiment of the present invention will be described in detail.

(Embodiment 1)

A coating method according to Embodiment 1 of the present invention will be described with reference to Figs. 3A to 3C.

In the coating method of the first embodiment, a nozzle having a plurality of discharge ports arranged in a distributed manner is used, and a stripe-shaped pattern is applied to a substantially rectangular substrate on a substantially triangular shape (application target region). Fig. 3A is a plan view showing the substrate 11a and the nozzle 34a at the application start timing. Moreover, FIG. 3B is the nozzle 34a shown in FIG. 3A. A1-A1' cross-sectional view in a state of moving to the position of the two-dot chain line A1-A1', and FIG. 3C is a cross-sectional view taken along the line B1-B1' in this state. In addition, in FIG. 3A, the application target region 19 of the paste 35 is indicated by a solid line. Further, in FIGS. 3B and 3C, the description of the internal structure of the nozzle 34a is omitted.

The stage 31a is a holding unit that holds the substrate 11a, and has a substrate mounted thereon. The surface is a non-planar shape in which the discharge port 37 toward the nozzle 34a is convex, and a holding mechanism for holding the substrate 11a by vacuum suction on the substrate mounting surface. Specifically, in the plan view of FIG. 3A, the thickness of the left side region of the one-point chain line G1 is fixed by the point line C1 drawn from the upper right of the loading table 31a to the lower left, and the thickness of the right side region of the one-point chain line C1. The thinner the direction is toward the lower right. Therefore, the substrate 11a held here is also bent along the one-point chain line C1, and the upper surface of the substrate 11a is inclined toward the lower right end portion, and the distance from the discharge port 37 is changed. Big. In this manner, the substrate 11a is held by the stage 31a in a non-planar shape that is convex toward the nozzle 34a. That is, the tilting and holding mechanism provided to the stage 31a corresponds to means for changing the interval between the discharge port 37 of the nozzle 34a and the substrate 11a.

Furthermore, in the present case, the term "non-planar or non-planar" means the substrate 11a. The whole is not in a plane. Therefore, the inclination from the one-point chain line C1 toward the lower right direction shown in FIG. 3A can be either planar or curved. This point is also common in other embodiments.

In the first embodiment, the substrate 11a can follow the stage 31a. A non-planarly curved substrate can be used regardless of material or thickness.

The nozzle 34a has a plurality of discharge ports 37 arranged in a substantially straight line. and Further, the nozzle 34a is provided with a drive mechanism that moves the nozzle 34a in a direction different from the direction in which the plurality of discharge ports 37 are arranged (for example, a direction substantially orthogonal to the arrangement direction). Further, the cross-sectional shape of each of the discharge ports 37 on the orthogonal surface in the discharge direction of the paste 35 may be a circular shape as shown in FIG. 3A, or may be a polygon of a triangle, a quadrangle or a pentagon or more. The ellipse and a part of the elliptical shape have a shape of a curved surface portion, and the like can be used without particular limitation.

In this state, since the nozzles 34a are arranged on a substantially straight line The discharge port 37 ejects the coating liquid 35 (hereinafter sometimes referred to as the paste 35), and a liquid bead 47 is formed between the substrate 11a and the discharge port 37 (see FIG. 1), and the nozzle 34a is opposed to the substrate 11 mobile. Thereby, the paste 35 is applied to the substrate 11a in a stripe shape. At the time of the application, as the nozzle 34a moves downstream (downward in FIG. 3A), the interval between the discharge port 37 and the substrate 11a gradually changes from the right side of the substrate 11a due to the inclination provided on the stage 31a and the substrate 11a. width. As a result, the discharge port 37 having a predetermined length or more from the gap LC (see FIG. 1) of the discharge port 37 and the substrate 11a is sequentially interrupted (from the right side of FIG. 3A), and the liquid droplet 47 is interrupted, and the discharge port 37 is terminated to the paste 35. Coating. In this manner, the application end position P of the paste 35 on the substrate 11a can be controlled.

In Embodiment 1, a plurality of discharge ports 37 are arranged in alignment with the nozzle 34a. Unlike the straight line in which the moving direction is orthogonal, the application end position P of the paste 35 is arranged on a straight line which is inclined with respect to the moving direction of the nozzle 34a along the one-point chain line C1. As a result, the outer peripheral shape of the final coating shape of the paste 35 is triangular.

Furthermore, in Embodiment 1, the drive machine is provided by the nozzle 34a. The nozzle 34a is moved to move the nozzle 34a relative to the substrate 11a, but the relative movement can be realized by moving the stage 31a on which the substrate 11a is placed.

(Embodiment 2)

The coating method according to the second embodiment of the present invention will be described with reference to Figs. 4A to 4C. The coating method according to the second embodiment is a nozzle having a plurality of discharge ports arranged in a distributed manner and arranged not in a straight line shape, and is formed on a substrate having slit portions 18 at substantially square corners, and has a shape substantially along the outer periphery of the substrate. The area of the shape (application target area) is coated with a stripe pattern. 4A is a plan view showing the substrate 11b and the nozzle 34b at the application start timing. 4B is a cross-sectional view taken along the line A2-A2' in a state where the nozzle 34b shown in FIG. 4A is moved to the position of the two-dot chain line A2-A2', and FIG. 4C is a cross-sectional view taken along the line B2-B2' in this state. In addition, in FIG. 4A, the application target region 19 of the paste 35 is indicated by a solid line. Further, in FIGS. 4B and 4C, the description of the internal structure of the nozzle 34b is omitted.

The stage 31b is a holding unit for holding the substrate 11b, and has a substrate mounting surface that is convex in a non-planar shape toward the discharge port 37 of the nozzle 34b, and a holding mechanism that is held by vacuum suction on the substrate mounting surface. The substrate 11a described above. Specifically, in the plan view of FIG. 4A, the one-point chain lines C2 and C2' drawn from the left and right sides of the loading table 31b toward the center of the lower side are bounded, and the stage 31b is closer to the one-point chain lines C2 and C2'. The thickness of the region on the center side is fixed, and the thickness of the region closer to the end side than the one of the chain lines C2 and C2' is thinner toward the end portion. Further, the C2 and C2' are provided in parallel with the side where the notch portion 18 is provided. Therefore, the substrate 11b held here It is also bent at the one-point chain lines C2 and C2', and the upper surface of the substrate 11b is inclined toward the end portion with the one-point chain lines C2 and C2' as the boundary, and the distance from the discharge port 37 is increased. In this manner, the substrate 11b is held by the stage 31b in a non-planar shape that is convex toward the nozzle 34b. That is, the tilting and holding mechanism provided to the stage 31b corresponds to means for changing the interval between the discharge port of the nozzle 34b and the substrate 11b.

In the nozzle 34b, the plurality of discharge ports 37 are different from the example in the first embodiment. The arrangement is arranged substantially in a straight line, but is arranged so as to be along the outer peripheral shape of the substrate 11b at the coating start position. Specifically, the plurality of discharge ports 37 are arranged on a line that is curved at two locations. Further, the nozzle 34b is provided with a drive mechanism that makes the nozzle 34b in a direction different from the direction in which the plurality of discharge ports 37 are arranged (for example, a direction substantially orthogonal to the arrangement of the discharge ports arranged in the center portion) mobile.

By relatively moving the nozzle 34b relative to the substrate 11b, The paste 35 is ejected from the ejection port 37, and the paste 35 is applied to the substrate 11b in a stripe shape. At the time of this application, as the nozzle 34b moves downstream (downward in FIG. 4A), the inclination of the stage 31b and the substrate 11b is separated from the left and right sides of the substrate 11b by the discharge port 37 and the substrate 11b. Gradually widened. Thereby, the discharge port 37 having a predetermined length or more from the interval LC (see FIG. 1) of the discharge port 37 and the substrate 11b is sequentially interrupted (sequentially from the left and right ends of FIG. 4A), and the discharge port 37 is closed. Coating of agent 35. In this manner, the application end position P of the paste 35 on the substrate 11b can be controlled.

In the second embodiment, the plurality of discharge ports 37 are arranged to face the nozzle 34b. The difference is that the moving direction is substantially C-shaped, and the coating of the paste 35 is different. The bundle position P is arranged in a substantially C-shape which is opened in a direction opposite to the arrangement of the discharge ports 37 along the one-point chain lines C2 and C2'. As a result, the final applied shape of the paste 35 is a shape substantially along the outer peripheral shape (for example, an octagon) of the substrate 11b.

Furthermore, in the second embodiment, the substrate 11b at the application start position is blended. In the outer peripheral shape, the plurality of discharge ports 37 are arranged on a line bent at two places, but may be changed to various arrangements in accordance with the application shape of the paste 35. For example, when the paste 35 is applied to a region having a polygonal shape (triangle or pentagon or more) other than a rectangle, the discharge port 37 may be arranged on a line bent at at least one portion. Further, for example, when the paste 35 is applied to a region surrounded by a closed curve such as a circular shape or an elliptical shape, the discharge port 37 may be arranged on a curved line such as an arc. Further, when the paste 35 is applied to a region surrounded by a closed line including a combination of a straight line and a curved line, the discharge port 37 may be arranged on a line that is appropriately bent or bent in accordance with the shape of the region.

Further, a plurality of discharge ports 37 may be arranged in a line or in a line. Lines can also be arranged along the lines or curves in the vicinity of a line or curve. For example, a plurality of discharge ports 37 may be alternately arranged on both sides of a straight line or a curved line.

(Embodiment 3)

A coating method according to Embodiment 3 of the present invention will be described with reference to Figs. 5A to 6B. In the coating method of the third embodiment, in the same manner as in the first embodiment, a stripe pattern having a triangular outer peripheral shape is applied onto a substantially rectangular substrate by nozzles having a plurality of discharge ports arranged on a substantially straight line. 5A is a plan view showing a substrate and a nozzle at the start of coating, and FIG. 5B is a cross-sectional view taken along line A3-A3' of FIG. 5A. and, 6A is a plan view showing a substrate and a nozzle at the time of ending the application in the middle of the substrate, and FIG. 6B is a cross-sectional view taken along line A4-A4 of FIG. 6A. In addition, in FIG. 5B and FIG. 6B, the description of the internal structure of the nozzle 34c is abbreviate|omitted.

The stage 31c is a holding unit that holds the substrate 11c by vacuum suction. In the third embodiment, unlike the first embodiment, the thickness of the stage 31c is uniform as a whole, and the substrate 11c is held substantially in a planar shape on the stage 31c.

On the nozzle 34c, there are a plurality of discharge ports arranged on a substantially straight line 37. Further, the nozzle 34c is provided with a drive mechanism that moves the nozzle 34c in a direction (for example, a substantially orthogonal direction) different from the direction in which the plurality of discharge ports 37 are arranged. Further, a nozzle elevating mechanism for gradually raising and lowering the nozzle 34c from the end portion is provided in the nozzle 34c. The nozzle elevating mechanism is a mechanism that moves at least a part of the nozzle 34c in a direction away from the substrate 11c, and corresponds to a means for changing the interval between the discharge port 37 of the nozzle 34c and the substrate 11c.

As shown in FIG. 5A, by simultaneously making the nozzle 34c relative to the substrate 11c The paste 35 is ejected from the discharge port 37 while being relatively moved, and the paste 35 is applied to the substrate 11c in a stripe shape. At the time of this coating, as the nozzle 34c moves downstream (downward in FIG. 5A), the one side of the nozzle 34c is gradually raised, and the interval between the discharge port 37 and the substrate 31c is gradually widened from the end portion. Further, in Fig. 6B, the right side of the nozzle 34c is raised. In addition, the discharge port 37 having a predetermined length or more from the interval LC (see FIG. 1) of the discharge port 37 and the substrate 11c is interrupted sequentially (from the right side) (see FIG. 1), and the discharge port 37 is closed to the paste. 35 coating. In this manner, the application end position P of the paste 35 on the substrate 11c can be controlled. That is, the adjustment nozzle 34c The amount of rise and the rate of increase, and the interval LC between the discharge port 37 reaching the application end position P and the substrate 11c is controlled to be equal to or greater than a predetermined value, thereby obtaining the desired coating shape of the paste 35.

In the third embodiment, at the coating end position P of the paste 35, The discharge port 37 at the left end of the nozzle 34c is raised to interrupt the liquid droplet so that the outer peripheral shape of the final coating shape of the paste 35 is triangular. At this time, the plurality of discharge ports 37 are arranged on a substantially straight line orthogonal to the moving direction of the nozzles 34c, and the application end position P of the paste 35 is arranged in the moving direction with respect to the nozzles 34c. The slope is roughly straight.

(Embodiment 4)

A coating method according to Embodiment 4 of the present invention will be described with reference to Figs. 7A to 7C. Fig. 7A is a plan view showing a substrate and a nozzle at the start of coating. 7B is a cross-sectional view taken along line A5-A5' in a state where the nozzle 34d is moved to the position of the two-dot chain line A5-A5', and FIG. 7C is a cross-sectional view taken along line B5-B5' in this state. In addition, in FIG. 7A, the application target region 19 of the paste 35 is indicated by a solid line. Further, in FIGS. 7B and 7C, the description of the internal structure of the nozzle 34d is omitted.

The stage 31d is a holding unit that holds the substrate 11d by vacuum suction. In the third embodiment, the thickness of the stage 31d is uniform as a whole, and the substrate 11d is held substantially in a planar shape on the stage 31d.

The substrate 11d is provided with cutout portions 18 at four corners of a substantially rectangular shape (square shape). shape. Further, in a region closer to the substrate 11d on the outer peripheral side than the coating end position P of the paste 35, a step 100 is provided which is coated with respect to the paste 35. The cloth target region 19 is made thinner, and the upper surface is lowered with respect to the upper surface of the substrate 11d, that is, the application target region 19 of the paste 35. This step difference 100 corresponds to a means for changing the interval between the discharge port 37 of the nozzle 34d and the substrate 11d.

The height of the step 100 (the upper surface of the step 100 and the coating of the paste 35) The difference between the target regions 19 is equal to or larger than the interval between the discharge port 37 and the substrate 11d in which the liquid droplets 47 (see FIGS. 1 and 2) are not formed. Further, in the fourth embodiment, the step difference 100 is provided along the outer peripheral shape of the substrate 11d on the application end position P side of the paste 35. The form in which the step difference 100 is formed is not particularly limited, and various known methods can be used. Preferably, machining (cutting removal processing) or etching (etching) or the like can also be used.

The nozzle 34d has a plurality of discharge ports 37 that are arranged in a distributed manner. The spray outlets In the same manner as in the second embodiment, 37 is arranged on a line curved at two locations so as to be along the outer peripheral shape of the substrate 11d at the application start position. Further, the nozzle 34b is provided with a drive mechanism that moves the nozzle 34b in a predetermined direction (downward in FIG. 7A).

By relatively moving the nozzle 34d relative to the substrate 11d, The paste 35 is ejected from the ejection port 37, and the paste 35 is applied to the substrate 11d in a stripe shape. The nozzle 34d moves downstream (downward in FIG. 7A), and when the discharge port 37 sequentially reaches the step 100, the interval between the discharge port 37 and the substrate 11d (the upper surface of the step 100) is widened to interrupt the liquid bead 47 ( Referring to Fig. 1), the application of the paste 35 to the discharge port 37 is completed. Thereby, the application end position P of the paste 35 on the substrate 11d can be controlled. In the fourth embodiment, the plurality of discharge ports 37 are arranged to move toward the nozzle 34d. In contrast to the substantially C-shaped shape, the application end position P of the paste 35 is matched with the shape of the step 100, and is arranged in a substantially C-shape that is open in a direction opposite to the arrangement of the discharge ports 37.

Moreover, the preferred height of the step difference 100 cannot be generalized, but as long as it is The properties of the paste 35, the coating conditions, and the like are set in advance by cutting the liquid droplets, and the height may be determined according to the conditions and the like. Alternatively, the properties of the paste 35, the coating conditions, and the like may be set according to the height of the step difference 100.

As another example of the coating method of the fourth embodiment, it may be replaced with a substrate. The step difference 100 is set on 11d, and as shown in FIGS. 8A and 8B, the inclined portion 101 is provided to the substrate 11d'. 8A is a view showing a state in which the substrate 11d' provided with the inclined portion 101 is placed on the stage 31d shown in FIG. 7A, and the nozzle 34d is moved to the position of the two-dot chain line A5-A5' of FIG. 7A. -A5' cross-sectional view, and Fig. 8B is a cross-sectional view taken along line B5-B5' of Fig. 7A in this state. In addition, in FIGS. 8A and 8B, the description of the internal structure of the nozzle 34d is omitted.

At this time, similarly to the case of the above-described step difference 100, when the nozzle 34d is made When the discharge port 37 reaches the inclined portion 101, the interval between the discharge port 37 and the substrate 11d' is gradually widened to interrupt the liquid droplet, and the application of the paste 35 to the discharge port 37 is completed. Thereby, the coating end position on the substrate 11d' can be controlled.

Next, a modification of each of Embodiments 1 to 4 will be described. Bright.

(Modification 1)

The first and second embodiments of the present invention will be described with reference to FIGS. 9 and 10 . Modification 1 of the coating method. In the first embodiment and the second embodiment, the substrate is held by the stages 31a and 31b (see FIGS. 3B and 4B) having the thickness change. However, the stage for changing the interval between the discharge port 37 and the substrate is not limited thereto. For example, as shown in FIG. 9, a stage 31e having a bending point 39 may be used. At this time, the substrate 11e is held by the stage 31e in a state of being bent at the bending point 39.

Moreover, as shown in FIG. 10, a part of the end of the stage 31f may be self-supported. The substrate 11f is arranged in a protruding manner, and a downward force F is applied to the protruding portion of the substrate 11f to hold the substrate 11f. The means for applying the force F and holding the substrate 11f may be configured by combining a pressurizing mechanism that mechanically applies the downward force F as shown in FIG. 10 and a mechanism that adsorbs and holds the substrate 11f on the stage 31f. Further, the hook or the adhesive may be used to stretch and mechanically fix the end portion of the substrate 11f downward, and may also be applied by electrostatic force or wind pressure, gravity (self-weight of the substrate 11f), magnetic force, electric field, or the like. Force F. Alternatively, the substrate having a shape retaining property like a metal substrate may be bent in a non-planar shape to directly use the substrate.

(Modification 2)

A modification 2 of the coating method according to Embodiment 3 of the present invention will be described with reference to FIGS. 11A to 12B. 11A is a plan view of a substrate and a nozzle at the application start timing, and FIG. 11B is a front view of the substrate and the nozzle at the application start timing. In addition, FIG. 12A is a plan view showing a state in which the application is completed in the middle of the substrate 11g shown in FIG. 11A, and FIG. 12B is a front view showing a state in which the application is completed in the middle of the substrate 11g shown in FIG. 11A.

In the third embodiment, the movement of the nozzle 34c (refer to FIG. 6B) is shown. An example of raising the one side of the nozzle during the process. On the other hand, in the second modification, as shown in FIG. 11A, the nozzle 34g is divided into a central nozzle portion 34g (C) and left nozzle portions 34g (L) and right nozzle portions 34g (R) at both ends. The left nozzle portion 34g (L) and the right nozzle portion 34g (R) are provided in such a manner that the outer peripheral shape of the substrate 11g at the application start position is opposite to the discharge port 37 in the central nozzle portion 34g (C). Arrange and arrange the discharge ports 37 obliquely.

As shown in FIG. 12A, the nozzle 34g is made to be planar with respect to one side. The substrate 11g held by the stage 31g is relatively moved, and the paste 35 is ejected from the ejection port 37, and the paste 35 is applied to the substrate 11g in a stripe shape. At the time of this coating, as shown in FIG. 12B, the left nozzle portion 34g (L) and the right nozzle portion 34g (R) are gradually raised from the end portion, whereby the paste can be sequentially terminated from the left and right end portions of the substrate 11g. Coating of agent 35. Thereby, the paste 35 can be applied in a shape along the outer peripheral shape of the substrate 11g.

Furthermore, the left nozzle portion 34g (L) and the right nozzle portion 34g (R) can be Only one of them may be raised in the desired coating shape, or the two may be shifted from each other by timing.

(Modification 3)

In the above-described first to fourth embodiments, the first and second modifications, the stripe coating method in which the paste 35 is applied in a stripe shape by using the nozzle having the plurality of discharge ports 37 has been described. However, the first to fourth embodiments, the first modification, and the second modification can be applied to the slit coating method in the same manner.

13A to 13C are views for applying the coating method of the first embodiment to a narrow An example of the slit coating method will be described. Fig. 13A is a plan view showing the substrate 11a and the nozzle 34h at the application start timing. 13B is a cross-sectional view taken along line A6-A6' in a state where the nozzle 34h shown in FIG. 13A is moved to the position of the two-dot chain line A6-A6', and FIG. 13C is a cross-sectional view taken along line B6-B6' in this state. In addition, in FIG. 13A, the application target region 19' of the paste 35 is indicated by hatching. Further, in FIGS. 13B and 13C, the description of the internal structure of the nozzle 34h is omitted.

A slit-shaped discharge port 38 that ejects the paste 35 is provided on the nozzle 34h. Further, the nozzle 34h is provided with a drive mechanism that moves the nozzle 34h in a direction different from the longitudinal direction of the discharge port 38 (for example, a direction substantially orthogonal to the longitudinal direction).

By relatively moving the nozzle 34h relative to the substrate 11a, The paste 35 is ejected from the discharge port 38, and a liquid bead is formed in a range substantially equal to the width (length in the longitudinal direction) of the discharge port 38, and the paste 35 is applied onto the substrate 11a. At the time of the coating, as the nozzle 34h moves downstream (downward in FIG. 13A), the interval between the discharge port 38 and the substrate 11a gradually widens from the right side of the substrate 11a due to the inclination provided on the stage 31a, thereby interrupting The liquid bead ends the application of the paste 35 of this portion. Thereby, the paste 35 can be applied to a desired shape (triangular shape in Fig. 13A). At this time, the discharge port 38 has a slit shape along a straight line orthogonal to the moving direction of the nozzle 34h, and the shape of the application end position Q of the paste 35 is relatively along the one-point chain line C1. A straight line that is inclined in the moving direction of the nozzle 34h.

Furthermore, the discharge port 38 can be a linear slit as shown in FIG. 13A. It is also possible to change to various shapes in accordance with the coating shape of the paste 35. For example, when the pair is moment When the paste 35 is applied to a polygonal shape (triangle or pentagon or more) other than the shape, a slit-shaped discharge port 38 may be provided along a line bent at at least one portion. Further, for example, when the paste 35 is applied to a region surrounded by a closed curve such as a circular shape or an elliptical shape, for example, a slit-shaped discharge port 38 along a curved line such as an arc may be provided. Further, when the paste 35 is applied to a region surrounded by a closed line including a combination of a straight line and a curved line, a slit-shaped discharge port 38 that is appropriately bent or bent is provided in accordance with the shape of the region.

14A to 14C are views for applying the coating method of the second embodiment to a narrow An example of the slit coating method will be described. Fig. 14A is a plan view showing the substrate 11b and the nozzle 34i at the application start timing. Further, Fig. 14B is a cross-sectional view taken along the line A7-A7' in a state where the nozzle 34i shown in Fig. 14A is moved to the position of the two-dot chain line A7-A7', and Fig. 14C is a cross-sectional view taken along the line B7-B7' in this state. In addition, in FIG. 14A, the application target region 19' of the paste 35 is indicated by hatching. Further, in FIGS. 14B and 14C, the description of the internal structure of the nozzle 34i is omitted.

A slit-shaped discharge port 38 for ejecting the paste 35 is provided on the nozzle 34i. (C), 38 (L), 38 (R). The discharge ports 38 (C), 38 (L), and 38 (R) are disposed so as to have an outer peripheral shape of the substrate 11b along the application start position. Specifically, it is arranged such that the longitudinal direction of the left discharge port 38 (L) and the right discharge port 38 (R) has an angle with respect to the longitudinal direction of the center discharge port 38 (C). Further, the nozzle 34i is provided with a drive mechanism that moves the nozzle 34i in a direction (for example, a substantially orthogonal direction) different from the longitudinal direction of the central discharge port 38 (C).

When such a nozzle 34i is used to apply the paste 35 to the substrate 11b, The nozzle 34i moves downstream (downward in FIG. 14A), and the interval between the discharge ports 38 (L), 38 (R) and the substrate 11b gradually widens from the left and right ends of the substrate 11b due to the inclination provided on the stage 31b. Thereby, the liquid bead is interrupted to terminate the application of the paste 35 in this portion. Thereby, the paste 35 can be applied in a desired shape (octagonal shape in Fig. 14A).

At this time, the entire discharge ports 38 (C), 38 (L), and 38 (R) are sprayed toward each other. The difference in the direction in which the nozzle 34i travels is substantially C-shaped, and the application end position Q of the paste 35 is directed to the discharge ports 38 (C) and 38 along the one-point chain lines C2 and C2'. And 38 (R) has a substantially C-shape that is open in the opposite direction.

Furthermore, FIG. 14A shows the discharge port 38 (C) divided into three, 38 (L), 38 (R), but the discharge ports may be integrally provided. In other words, one slit-shaped discharge port that is bent at least at one location may be provided.

15A to 15C are planes showing a modified example of the slit-shaped discharge port. Figure. As the discharge port provided in the nozzle 34, for example, a slit 38a integrally provided along a straight line or a curved line as shown in Fig. 15A may be used. Further, for example, as shown in FIG. 15B, the plurality of slits 38b may be arranged on one straight line or curved line to form a discharge port. Further, for example, as shown in FIG. 15C, the plurality of slits 38c may be alternately arranged on both sides of one straight line or curved line to form a discharge port.

The coating method of the present invention is not limited to the above-described respective embodiments 1 to In the fourth embodiment and the modifications 1 to 3, for example, they may be appropriately combined. For example, in the first embodiment, the nozzles exemplified in the third embodiment or the second modification are applied. Further, the above coating method is merely an example, and within the range that does not impair the effects of the present invention, Design changes or steps may be added by those skilled in the art.

Further, in the above-described first to fourth embodiments and the first to fourth modifications In the third example, the rectangular substrate (substrates 11a, 11c) or the octagonal substrates (substrates 11b, 11d, 11d', 11g) in which the rectangular corners are cut are coated with the coating liquid 35, but the outer peripheral shape of the substrate It is not limited to these shapes. The outer peripheral shape of the substrate may be, for example, a polygon having a triangle or a pentagon or more, a shape including a closed curve such as a circular shape or an elliptical shape, or a shape including a closed line including a combination of a straight line and a curved line. . By determining the coating shape of the coating liquid 35 along the outer peripheral shape of such a substrate, it is possible to effectively utilize the region on the substrate.

Next, the above various embodiments 1 to 3 can be used in the present invention. The coating device in the coating method of the fourth embodiment will be described with reference to Fig. 16 . The coating device 40 shown in Fig. 16 has a stage 31 for holding the substrate 11 by vacuum suction, a nozzle 34, a coating liquid 35 ejected from the ejection port 37, a mechanism for relatively moving the substrate 11 and the nozzle 34, and a nozzle changing A mechanism for spacing the discharge ports of 34 from the substrate 11. As the nozzle 34 and the stage 31 in these members, the above-described 34a to 34i and the stages 31a to 31f can be suitably applied.

As a mechanism for relatively moving the substrate 11 and the nozzle 34, a known mechanism can be applied. A position alignment mechanism or the like for adjusting the position of the nozzle 34 may be further provided. As a mechanism for changing the interval between the discharge port 37 of the nozzle 34 and the substrate 11, as has been described in detail, the implementation thereof is not particularly limited as long as the object can be attained.

In the coating device 40, a linear drive device 41 and a linear drive device 42 constitute a mechanism for relatively moving the nozzle 34 relative to the substrate 11. The linear drive device 41 moves the stage 31 in the X direction, and the linear drive device 42 moves the bracket 43 that supports the nozzle 34 in the Y direction. Further, a linear drive device 52 and a servo motor 54 constitute a mechanism (nozzle lift mechanism) that changes the distance between the discharge port 37 of the nozzle 34 and the substrate 11, and the linear drive device 52 supports the bracket that supports the nozzle 34. The 53 moves in the Z direction, and the servo motor 54 rotates the nozzle 34 in the θ direction (i.e., in the XZ plane). At this time, the nozzle 34 can be aligned with respect to the substrate 11 by the camera 44, and the height of the sensor 45 can control the distance between the discharge port 37 of the nozzle 34 and the substrate 11.

Next, the back side of the coating method using the embodiment of the present invention A method of manufacturing a solar cell will be described. As shown in FIG. 17 and FIG. 18, the back surface bonding type solar cell 10 has, for example, a configuration in which the back surface of the substrate 11 including the single crystal n-type germanium semiconductor (the side opposite to the light receiving surface) has a carrier concentration ratio. The n-type region 12 and the p-type region 13 which are high in the substrate 11 are formed in a stripe shape. On the surface on which the n-type region 12 and the p-type region 13 are formed, a protective film 15 having an opening for obtaining contact between the n-type region 12 and the p-type region 13 and the electrode is formed ( Contact). Further, on the surface layer, an electrode (n-type contact electrode) 16 that is in contact with the n-type region 12 and an electrode (p-type contact electrode) 17 that is in contact with the p-type region 13 are formed by connecting one end portion of each stripe. shape. On the other hand, a protective film 14 is formed on substantially the entire surface of the light receiving surface of the substrate 11. A texture structure or an anti-reflection film for reducing light reflection loss is sometimes formed on the light-receiving side.

Further, as the substrate 11, a half other than a p-type 矽 or 矽 may be used. The substrate of the conductor. Further, in the present embodiment, the substrate 11 having the shape of the notched portion 18 is provided at the four corners of the square, but the shape of the substrate 11 is not particularly limited.

The back junction type solar cell 10 will be described with reference to FIGS. 19A to 19H. An example of the manufacturing method. First, as shown in FIG. 19A, a protective film 14 is formed on the surface of the substrate 11 to be the light receiving surface. Then, as shown in FIG. 19B, an n-type dopant paste is applied to the back surface of the substrate 11 in a stripe shape and dried to form an n-type solid phase diffusion source 24. Similarly, the p-type solid phase diffusion source 25 shown in Fig. 19C is formed in a stripe shape in the gap of the stripe of the n-type solid phase diffusion source 24. In the coating step of forming the dopant paste when the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are formed, the coating methods of the first to fourth embodiments can be applied.

Then, an n-type solid phase diffusion source 24 and a p-type solid phase diffusion source 25 are provided. The substrate 11 is heated to diffuse the n-type dopant and the p-type dopant solid phase contained in the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25, respectively, in the substrate 11. The n-type region 12 and the p-type region 13 shown in Fig. 19D are formed. Subsequently, as shown in FIG. 19E, the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are removed.

Then, as shown in FIG. 19F, the entire surface of the back surface of the substrate 11 is formed. The protective film 15 is patterned as shown in FIG. 19G by etching or the like to form an opening 15a. Further, as shown in FIG. 19H, the electrode paste is pattern-coated and fired in a region including the opening 15a by a stripe coating method or a screen printing method, thereby forming an n-type contact electrode 16 and a p-type contact. Electrode 17. Thereby, the back junction type solar cell 10 is obtained.

Furthermore, as a modification, an n-type solid phase diffusion source 24 may be formed in the pair. Before the substrate 11 (see FIG. 19C) of the p-type solid phase diffusion source 25 is heated, as shown in FIG. 20A, the entire surface of the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 is masked (masking). A paste is formed to form a diffusion mask 21 covering the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25. Further, as shown in FIG. 20B, a stripe-shaped diffusion mask 21' may be formed between the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25. The coating method of the first to fourth embodiments can also be applied to the coating step of the masking paste when the diffusion mask 21' is formed.

Here, the system of the back junction solar cell illustrated in FIGS. 19A to 19H In the method, the n-type dopant paste is applied in a stripe shape and then temporarily dried to form an n-type solid phase diffusion source 24, and then the p-type dopant paste is applied in a stripe shape and then again It is dried, thereby forming a p-type solid phase diffusion source 25. When the coating method of the first embodiment to the fourth embodiment is applied to the method for producing the back surface bonded solar cell, the n-type dopant paste and the p-type dopant paste are applied from opposite directions. A pattern of a stripe shape (also referred to as a comb shape) in which the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are alternately arranged is easily obtained.

Hereinafter, the n-type and p-type will be specifically described with reference to FIGS. 21A to 21D. A method of coating a doped paste. In the following description, the coating method of the second embodiment is applied as an example (see FIGS. 4A to 4C).

First, as shown in FIG. 21A, the stage 31b explained in the second embodiment will be described. The nozzle 34b is provided in a coating device (for example, see FIG. 16), and the substrate 11 is placed on the back side so as to be placed on the stage 31b. Then on the back The n-type doping paste is applied in a stripe shape to form a stripe-shaped n-type doping pattern corresponding to the outer peripheral shape of the substrate 11 having the notched portion 18. The n-type doping pattern is dried to form an n-type solid phase diffusion source 24 (see FIG. 21B).

Then, as shown in FIG. 21C, the substrate 11 is reversed from FIG. 21A. It is placed and adsorbed and held on the stage 31b. Then, the p-type doping paste is applied in a stripe shape to form a stripe-shaped p-type doping pattern corresponding to the outer peripheral shape of the substrate 11 having the notched portion 18. At this time, alignment is performed in such a manner that a p-type doping pattern is formed between the previously formed n-type solid phase diffusion sources 24. Further, the p-type doping pattern is dried to form a p-type solid phase diffusion source 25, thereby obtaining a stripe pattern in which the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are alternately arranged (refer to the figure). 21D).

Moreover, not only for doping paste, but also for etching paste or masking paste, electricity The paste or the like may be applied in a stripe shape by the coating methods of the above-described first to fourth embodiments.

Here, the composition of the dopant paste is not particularly limited as long as it contains a dopant component. set. For example, a known material centering on a paste for forming a doped oxide film by a spin-on-glass (SOG) method can be used. As a typical component thereof, it is preferred to contain at least a matrix material, a solvent, and a dopant. Sometimes known tackifiers are added as needed.

As a preferred matrix material for the dopant paste, it can be mentioned after calcination. An antimony compound of a silica membrane. Specifically, alkoxy silanol, alkoxy silane, alkyl silanol, alkyl silane, silsesquioxane can be exemplified. , Silanolate and aromatic substituents of such compounds or generalized siloxane materials which oligomerize these compounds. Other glassy materials or organic binders may be added to the matrix material.

The solvent is not particularly limited as long as it is a matrix material, and an alcohol can be exemplified. Or esters, ethers, aldehydes, ketones, water, acids, and the like.

The n-type dopant of the tantalum semiconductor substrate may, for example, be a compound containing phosphorus, arsenic or antimony. Examples of the p-type dopant include compounds containing boron or aluminum. Specific examples thereof include phosphorus pentoxide or phosphorus oxide, phosphoric acid, phosphorus salts, organic phosphorus compounds, boron oxide, boric acid, boron salts, organic boron compounds, boron-aluminum compounds, aluminum salts, and organoaluminum compounds. example.

The matrix material is adjusted to a concentration of 50% by mass or less in the dopant paste. The dopant is preferably added at a concentration of 10% by mass or less of the dopant paste, and more preferably 5% by mass or less. Further, it is also possible to use a solution containing only a dopant and a solvent without using a matrix material, but care must be taken to prevent vapor phase diffusion caused by the matrix material. Further, the viscosity of the dopant paste is not particularly limited, and is preferably 0.5 mPa. s~3000mPa. s use, more preferably at 5mPa. s~500mPa. s use.

Further, as the material of the masking paste, an anthracene compound which forms a ceria film after calcination similarly to the above-mentioned dopant paste can be exemplified. Specifically, alkoxystanol, alkoxydecane, alkylstanol, alkylnonane, sesquiterpene oxide, stanol, and aromatic substituents of the compounds may be exemplified or oligomerized Materialized generalized siloxane material.

The material of the etching paste is not particularly limited, but for example, it is preferably The following material contains at least one of hydrogen fluoride, ammonium, phosphoric acid, sulfuric acid, and nitric acid as an etching component, and contains water, an organic solvent, a tackifier, or the like as a component other than the above.

As a material of the electrode paste, a guide of silver or aluminum, copper or the like can be preferably used. A mixture of an electrical particulate component and a solvent and/or polymer component. The polymer may remain after calcination. However, since the polymer is thermally decomposed during calcination, the adhesion of the conductive fine particles can be improved, and the conductivity of the electrode can be improved. As the polymer component, a known material such as a propylene-based or epoxy-based material can be used.

The material of the substrate 11 used in each embodiment of the present invention is not particularly Do not limit. It is possible to use glass; ceramics such as alumina or zirconia; metals such as aluminum or copper, stainless steel; bismuth or antimony, gallium arsenide, gallium nitride, zinc oxide, sapphire, Semiconductors such as tantalum carbide; polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), acrylic acid, polycarbonate, polyimine A resin substrate such as (polyimide) or aromatic aramid. The thickness thereof is also not particularly limited. The substrate which is curved non-planarly as in the first embodiment and the second embodiment may, for example, be a glass substrate having a thickness of 10 μm to 3 mm, more preferably 50 μm to 1 mm, and a crucible having a thickness of 10 μm to 2 mm, more preferably 50 μm to 0.5 mm. The substrate is a particularly good substrate. In particular, in a solar cell application, a substrate having a thickness of a crystalline germanium substrate of less than 300 μm and a thickness of about 120 μm is suitably used, so that the substrate can be easily deflected. Moreover, suitable for use in displays The thickness of the glass substrate used for (display) is also 0.7 mm or less, and the substrate can be easily deflected. Therefore, the substrate can be bent non-planarly by holding it on the stage with a force greater than the rebounding force of the substrate.

In various embodiments of the present invention, the discharge port 37 required to interrupt the liquid bead The distance LC from the substrate 11 (see FIGS. 1 and 2 ) changes depending on the viscosity or surface tension of the paste 35 , the relative moving speed of the nozzle 34 , the adhesion between the substrate 11 and the paste 35 , and the like. . A masking paste or a doping paste which is relatively thinly coated on a single crystal germanium substrate to produce a back-bonded solar cell with a relatively low viscosity (for example, 5 mPa·s to 500 mPa·s in a coating environment at room temperature). In the example of the agent, the interval between the typical discharge port and the substrate at the time of coating is 20 μm to 200 μm, and by further widening the interval in the range of 10 μm to 100 μm, the bead can be interrupted. In the example of the slit coating, the interval between the typical discharge port and the substrate at the time of coating is 50 μm to 500 μm, and by further widening the interval in the range of 30 μm to 300 μm, the bead can be interrupted. Therefore, even in the case where the substrate is held in a non-planar shape, the displacement amount is typically 10 μm to 300 μm, and it suffices that the substrate has a weak flexibility.

In each embodiment of the present invention, the stripe coating on one substrate is completed. At the time of the deposition, the accumulation of the paste adheres to the discharge port of the nozzle, and the amount of adhesion is uneven depending on the coating shape. Before the next substrate is applied, it may be initialized by wiping the accumulation attached to the discharge port.

As described above, the coating method and the coating apparatus according to each embodiment of the present invention can be preferably used in the form of stripes on the back surface of the semiconductor substrate. In the manufacture of a back junction type solar cell in which an n-type region and a p-type region are formed.

Coating in any coating shape according to various embodiments of the present invention In the target region, the doping paste, the masking paste, or the like can be pattern-coated in a stripe shape with high precision. Therefore, the conversion efficiency of the back surface bonding type solar cell is not impaired, the manufacturing process can be greatly shortened, and the area on the substrate 11 can be effectively utilized, and the cost can be reduced.

In the above description, it is centered on the manufacturing method of the back type solar cell. For example, the coating method and the coating device according to each embodiment of the present invention may be a semiconductor device in which a p-type and/or n-type region pattern is formed on a semiconductor surface, for example, a transistor array (transistor array). Or developed in a method of manufacturing a diode array, a photodiode array, a transducer, or the like. Further, it can also be applied to a display member such as a color filter that applies a color paste or the like to a glass substrate.

Example

Hereinafter, the present invention will be more specifically described by way of examples. However, the content of the present invention is not limited to the following embodiments.

(Example 1)

A back junction type solar cell was fabricated based on the methods shown in FIGS. 19A to 19H and 21A to 21D.

First, a substrate 11 including an n-type single crystal germanium semiconductor having a thickness of about 200 μm and a notched portion of about 14 mm at a square corner of 125 mm on one side was prepared. The impurity concentration of the substrate 11 is about 3 × 10 ¹⁶ /cm ³ . After the surface is etched by an alkali solution for about 20 μm to remove slice damage, as shown in FIG. 19A, a chemical vapor deposition (CVD) method is formed on the light-receiving surface of the substrate 11. A protective film 14 containing tantalum nitride.

Then, as shown in FIG. 21A, the substrate 11 is vacuum-adsorbed and used for The non-planar stage 31b. Thereby, the area of the substrate 11 closer to the end side than the chain lines C2 and C2' is held in a state of being lowered toward the notch portion 18. The height of the drop is about 200 μm at the end of the substrate 11.

In this state, the row is arranged along the outer peripheral shape of the substrate 11. The nozzles 34b having the discharge ports 37 are moved to the lower side of the drawing at a speed of 15 mm/s, and the n-type doping paste is applied to the substrate 11 in a stripe shape. The interval between the discharge port 37 and the substrate 11 at the time of coating was 40 μm. As the n-type doping paste, a mixed solution containing 5% by mass of a cerium compound starting with tetraethoxysilane as a host material and containing 3% by mass is used. Phosphorus pentoxide is used as the n-type dopant, and the solvent is 70% by mass of isopropyl alcohol and 30% by mass of ethyl acetate. The paste has a viscosity of about 20 mPa in a coating environment at room temperature. s.

When the nozzle 34b crosses a portion of the chain line C2, C2', the discharge port 37 Since the distance from the substrate 11 is widened, the liquid droplets are sequentially interrupted from the left and right end sides of the substrate 11 to terminate the application of the paste 35. Finally, the application end position of the control paste 35 is substantially along the outer peripheral shape of the substrate 11 in front of the notch portion 18.

Subsequently, the substrate 11 coated with the n-type doping paste was heated in nitrogen at 150 ° C for 10 minutes, and then heated at 500 ° C for 30 minutes, thereby forming a pattern having FIG. 19B. And an n-type solid phase diffusion source 24 of a striped coating pattern shown in FIG. 21B. The pattern of the n-type solid phase diffusion source 24 has a thickness of 0.3 μm, a width of 160 μm, and a pitch of 600 μm.

Then, the substrate 11 on which the n-type solid phase diffusion source 24 is formed is as shown in FIG. 21C. As shown in the figure, the coating step of the n-type doping paste is held on the stage 31b in the reverse direction, and the p-type dopant paste is applied in a stripe shape in the same manner as the n-type dopant paste. The interval between the discharge port 37 and the substrate 11 at the time of coating was 40 μm. As the p-type doping paste, a mixed solution containing 5% by mass of a cerium compound starting with tetraethoxy decane as a host material and containing 3% by mass of boron oxide was used as a mixed solution. The p-type dopant was used, and the solvent was 70% by mass of isopropyl alcohol and 30% by mass of ethyl acetate. The paste has a viscosity of about 20 mPa in a coating environment at room temperature. s.

Subsequently, the substrate 11 coated with the p-type doping paste was 150 ° C in nitrogen. After heating for 10 minutes and then heating at 500 ° C for 30 minutes, a p-type solid phase diffusion source 25 having a stripe-like coating pattern shown in FIGS. 19C and 21D was formed. The pattern of the p-type solid phase diffusion source 25 has a thickness of 0.3 μm, a width of 360 μm, and a pitch of 600 μm.

Then, as shown in FIG. 19D, the substrate 11 is heated at 950 ° C in nitrogen. The n-type dopant (phosphorus atom) and the p-type dopant (boron atom) contained in the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are respectively diffused into the substrate 11 for 60 minutes, This forms the n-type region 12 and the p-type region 13. Subsequently, as shown in FIG. 19E, the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are removed by etching using hydrofluoric acid.

Then, as shown in FIG. 19F, the back surface of the substrate 11 is dry. Oxidation, thereby forming a protective film 15 containing ruthenium oxide having a thickness of about 0.2 μm over the entire surface. Then, as shown in FIG. 19G, a resist is patterned on the protective film 15, and then etched by hydrofluoric acid, thereby forming an opening 15a having a width of about 100 μm. Further, as shown in FIG. 19H, an electrode paste was applied to the region pattern including the opening 15a by screen printing, and calcined at 800 ° C, whereby the n-type contact electrode 16 and the p-type contact electrode 17 were formed.

Thus, the back junction type solar cell shown in FIGS. 17 and 18 is manufactured. 10. The n-type region 12 and the p-type region 13 are completed along the outer peripheral shape of the substrate 11 in front of the notch portion 18, and the area of the substrate 11 can be effectively utilized. Moreover, the n-type region 12 and the p-type region 13 do not overlap with the opposite polarity contact electrodes, so that good power generation performance can be obtained.

(Comparative Example 1)

The back surface bonding type solar cell 10 was produced in the same manner as in Example 1 except for the application steps of the n-type and p-type dopant pastes. In the application step of the n-type and p-type dopant pastes, as shown in FIG. 22, the substrate 11 is held in a planar shape on the planar stage 31h, and the nozzles 34b are accommodated in all the discharge ports 37. The substrate 11 moves in the range within the plane. During the movement of the nozzle 34b, the interval between the discharge port 37 and the substrate 11 is always fixed. At this time, the pattern of the doping paste at the application start position and the application end position is the same, and therefore, the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source formed by heating the dopant paste are formed. The area of 25 effectively adjacent is smaller than that of the first embodiment, and the power generation efficiency is lowered.

(Comparative Example 2)

The back surface bonding type solar cell 10 was produced in the same manner as in Example 1 except for the application steps of the n-type and p-type dopant pastes. In the application step of the n-type and p-type dopant pastes, as shown in FIG. 23, the substrate 11 is held in a planar shape on the planar stage 31h so as to have a plurality of sprays arranged in a line. The nozzle 34a of the outlet 37 moves in a range in which all of the discharge ports 37 are housed in the plane of the substrate 11. During the movement of the nozzle 34a, the interval between the discharge port 37 and the substrate 11 is always fixed. At this time, the area in which the n-type solid phase diffusion source 24 and the p-type solid phase diffusion source 25 are effectively adjacent to each other is smaller than that in the first embodiment, and the power generation efficiency is lowered.

(Comparative Example 3)

The back surface bonding type solar cell 10 was produced in the same manner as in Example 1 except for the application steps of the n-type and p-type dopant pastes. In the application step of each of the n-type and p-type dopant pastes, as shown in FIG. 24, a nozzle 34a having a plurality of discharge ports 37 arranged in a substantially straight line is used, and the end portions of the substrate 11 and the substrate 11 are used. The application is started at substantially the same position, and the nozzle 34a is moved to the end on the opposite side of the substrate 11. During the movement of the nozzle 34a, the interval between the discharge port 37 and the substrate 11 is always fixed.

At this time, the movement from the start nozzle 34a and the discharge of the paste 35 are accumulated in the front end of the discharge port 37 until the discharge port 37 at the left and right end portions of the nozzle 34a on the slit portion 18 reaches the upper portion of the substrate 11. The increase is increased, and the accumulation is adhered to the application start position on the substrate 11 in the vicinity of the notch portion 18. As a result, at the end of the n-type solid phase diffusion source 24 or the p-type solid phase diffusion source 25, an enlarged portion 26 which is formed larger than the original design is produced, and power generation efficiency and reliability are higher than those of the first embodiment. Big The decline. Further, since the n-type region 12 and the p-type region 13 are overlapped with the opposite-polarity contact electrode at the end portion of the substrate 11, a short circuit may occur due to an incomplete portion of the protective film 15.

(Example 2)

The back surface bonding type solar cell 10 was produced in the same manner as in Example 1 except for the application steps of the n-type and p-type dopant pastes and the shape of the substrate 11. In the second embodiment, when the n-type and p-type dopant pastes were applied, the coating method of the fourth embodiment was applied.

As shown in FIG. 25A, for the substrate 11 having a thickness of 200 μm, a step 100 having a width of 1.5 mm and a height of 40 μm was provided so as to be along the application end position of the n-type and p-type doping paste. The substrate 11 is adsorbed and held in a planar shape on the stage 31d which is planar.

In this state, the nozzles 34d having the plurality of discharge ports 37 arranged along the outer peripheral shape of the substrate 11 are arranged in parallel with one side of the substrate 11, and are located 1.5 mm inside from the outer periphery of the substrate 11. The movement of the nozzle 34d is started, and the n-type dopant paste is applied to the substrate 11 in a stripe shape. At the application end position, the liquid bead is interrupted by the phenomenon that the interval between the discharge port 37 and the substrate 11 is widened by the step difference 100 provided on the substrate 11, thereby ending the application of the n-type dopant paste. Subsequently, the substrate 11 is heated to form an n-type solid phase diffusion source 24. Thereby, as shown in FIG. 25B, the end position of the stripe-shaped n-type solid phase diffusion source 24 can be made substantially uniform to the outer peripheral shape of the substrate 11.

Then, as shown in FIG. 25C, a p-type dopant paste is applied in a stripe shape in the gap of the stripe of the n-type solid phase diffusion source 24, and further, the substrate 11 is applied. Heat, thereby forming the p-type solid phase diffusion source 25 shown in Fig. 25D. In addition, the step of applying the p-type dopant paste is the same as the step of applying the n-type dopant paste, except that the substrate 11 is placed on the stage 31d in the reverse direction of FIG. 25A.

By the n-type solid phase diffusion sources 24 and p thus provided on the substrate 11. The n-type region 12 and the p-type region 13 which are formed by heating the solid phase diffusion source 25 to diffuse the dopant solid phase start in front of the notch portion 18 and along the shape of the outer peripheral shape of the substrate 11 and At the end, the area of the substrate 11 can be effectively utilized. Further, since the n-type region 12 and the p-type region 13 do not overlap with the reverse polarity contact electrode, good power generation performance equivalent to that of the first embodiment can be obtained.

(Example 3)

The back surface bonding type solar cell 10 was produced in the same manner as in Example 1 except for the application steps of the n-type and p-type dopant pastes and the shape of the substrate 11. In the second embodiment, when the n-type and p-type dopant pastes were applied, the coating method of the second modification of the third embodiment was applied.

As shown in FIG. 26A, the substrate 11 is adsorbed and held in a planar shape on the stage 31g. Further, the nozzle 34g is prepared, and the nozzle 34g is divided into three parts: a left nozzle portion 34g (L) and a right nozzle portion 34g (R) in which the discharge portion 37 is arranged in correspondence with the oblique side of the notch portion 18 on the application start position side. And the central nozzle portion 34g (C).

The nozzle 34g is disposed such that the central nozzle portion 34g (C) is parallel to one side of the substrate 11, and the nozzle 34g is moved from a position inside the outer circumference of the substrate 11 to a position of 1.5 mm, and is applied to the substrate 11 in a stripe shape. N-type dopant paste. At the coating end position, the left nozzle portion 34g (L) and the right nozzle portion 34g (R) are made from the end portion. On the side, the direction perpendicular to the paper surface (Z direction) is gradually increased at a speed of 100 μm/s, and finally, the left end of the left nozzle portion 34g (L) and the right end of the right nozzle portion 34g (R) are made closer to the center nozzle portion 34g (C). ) rises by 100μm. By such a phenomenon that the distance between the discharge port 37 and the substrate 11 is widened, the liquid bead is interrupted, and the application of the n-type dopant paste is completed. Thereby, as shown in FIG. 26B, the end position of the n-type dopant paste can be made substantially uniform to the outer peripheral shape of the substrate 11. Subsequently, the substrate 11 is heated, thereby forming an n-type solid phase diffusion source 24.

Then, as shown in FIG. 26C, the stripe of the n-type solid phase diffusion source 24 In the gap, a p-type dopant paste is applied in a stripe shape, and further, the substrate 11 is heated to form a p-type solid phase diffusion source 25 shown in FIG. 26D. In addition, the step of applying the p-type doping paste is the same as the step of applying the n-type doping paste, except that the substrate 11 is placed on the stage 31g in the reverse direction of FIG. 26A.

By the n-type solid phase diffusion sources 24 and p thus provided on the substrate 11. The n-type region 12 and the p-type region 13 which are formed by heating the solid phase diffusion source 25 to diffuse the dopant solid phase start in front of the notch portion 18 and along the shape of the outer peripheral shape of the substrate 11 and At the end, the area of the substrate 11 can be effectively utilized. Further, since the n-type region 12 and the p-type region 13 do not overlap with the reverse polarity contact electrode, good power generation performance equivalent to that of the first embodiment can be obtained.

11a‧‧‧Substrate

19‧‧‧Coating area

31a‧‧‧ stage

34a‧‧‧Nozzles

37‧‧‧Spray outlet

C1‧‧‧Little chain

P‧‧‧ Coating end position

Claims (21)

A coating method comprising: a bead forming step of ejecting a coating liquid from a discharge port of a nozzle, forming a liquid bead comprising the coating liquid between the substrate and the ejection port; and a coating step of making the nozzle relatively The coating liquid is relatively moved on the substrate to apply the coating liquid on the substrate, and in the coating step, the coating liquid on the substrate is adjusted by changing a distance between the discharge port of the nozzle and the substrate. Coating end position. The coating method according to claim 1, wherein the nozzle has a slit-shaped discharge port, and the coating step is from the one end of the substrate toward the other end, and the spray having the slit shape The above-mentioned nozzle is discharged to apply the coating liquid into a wide pattern, and the shape of the slit is different from the shape of the coating end position. The coating method according to claim 1, wherein the nozzle has a plurality of the discharge ports arranged in a dispersed manner, and the coating step is from one end of the substrate toward the other end, by having a plurality of the discharge ports In the nozzle, the coating liquid is applied in a stripe pattern, and the arrangement of the plurality of ejection ports is different from the arrangement in the coating end position. The coating method according to claim 2, wherein the discharge port is a slit shape provided along a line that is curved along a straight line, a curved line, or at least one portion. The coating method according to claim 3, wherein the plurality of the discharge ports are arranged along a straight line, a curved line, or a line bent at at least one portion. The coating method according to Item 2 or 4, wherein the coating step is to apply the coating liquid to a region surrounded by a closed line on the substrate, wherein the closed line comprises a polygonal shape and a closed curve. Alternatively, in combination with a straight line and a curved line, the slit-shaped discharge port has a shape along a coating start position of the coating liquid in the region. The coating method according to Item 3 or 5, wherein the coating step is to apply the coating liquid to a region enclosed by a closed line on the substrate, wherein the closed line comprises a polygonal shape and a closed curve. Alternatively, in combination with a straight line and a curved line, the plurality of discharge ports are arranged along the application start position of the coating liquid in the above region. The coating method according to claim 6, wherein the substrate has a peripheral shape including a closed line, and the closed line includes a polygon, a closed curve, or a combination of a straight line and a curved line, and the outer peripheral shape of the region is along the above The shape of the outer peripheral shape of the substrate. The coating method according to claim 7, wherein the substrate has a peripheral shape including a closed line, and the closed line includes a polygon, a closed curve, or a combination of a straight line and a curved line. The outer peripheral shape of the above region is a shape along the outer peripheral shape of the substrate. The coating method according to the first aspect of the invention, wherein the coating end position is lowered with respect to a coating target region of the coating liquid in the substrate, thereby changing the discharge port of the nozzle and the above The spacing of the substrates. The coating method according to claim 10, wherein a part of the substrate protrudes from an end portion of a stage on which the substrate is held, and a downward force is applied to the portion to end the coating. The position is down. The coating method according to claim 10, wherein the coating end position is lowered by setting a step or a tilt to the substrate. The coating method according to claim 1, wherein the distance between the discharge port of the nozzle and the substrate is changed by moving at least a portion of the nozzle toward the nozzle away from the substrate. A coating apparatus comprising: a stage holding a substrate; a nozzle ejecting a coating liquid from the ejection outlet; a unit moving relative to at least one of the substrate and the nozzle relative to the other; and changing the above a unit that is spaced apart from the substrate by the discharge port of the nozzle. The coating device of claim 14, wherein The nozzle has a slit-shaped discharge port, and at least one of the substrate and the nozzle is relatively moved relative to the other, and the slit is provided from one end of the substrate toward the other end. In the nozzle of the discharge port, the coating liquid is applied to a wide pattern, and the shape of the slit is different from the shape of the coating end position. The coating device according to claim 14, wherein the nozzle has a plurality of the discharge ports arranged in a distributed manner, and at least one of the substrate and the nozzle is relatively moved relative to the other, Thereby, the coating liquid is applied in a stripe pattern, and the arrangement of the plurality of discharge ports is different from the arrangement of the coating end positions. The coating apparatus according to any one of claims 14 to 16, wherein the stage has a substrate mounting surface, and the substrate mounting surface is convex with respect to the ejection port of the nozzle The unit that changes the distance between the discharge port of the nozzle and the substrate is a holding mechanism, and the holding mechanism holds the substrate with respect to the substrate mounting surface. The coating device according to any one of claims 14 to 16, wherein the substrate is placed on the stage so that a part of the substrate protrudes from an end of the stage, and the substrate is changed. The unit in which the discharge port of the nozzle is spaced from the substrate is a holding mechanism, and the holding mechanism applies a downward force to the protruding portion of the substrate, and the upper portion The substrate is held on the stage. The coating device according to any one of claims 14 to 16, wherein the unit for changing a distance between the discharge port of the nozzle and the substrate is such that at least a portion of the nozzle faces the nozzle away from the substrate The direction of the moving mechanism. The coating apparatus according to claim 15, wherein the slit-shaped discharge port has a slit shape provided along a line curved, a curved line, or a line bent at at least one portion. The coating apparatus according to claim 16, wherein the plurality of the discharge ports are arranged along a line curved, curved, or curved at least at one location.