TW201346935A - Electrode substrate, input device and display device comprising same, and preparation method thereof - Google Patents

Abstract

Disclosed herein are an electrode substrate, an input device and display device comprising same, and a preparation method thereof. The electrode substrate comprises: an insulating substrate; and an electrode layer disposed on the insulating substrate, wherein the electrode layer comprises a conductive pattern containing a conductive polymer, and a non-conductive pattern, and the conductive pattern and the non-conductive pattern are integrally disposed in the same layer.

Description

Electrode substrate, input device and display device including the same, and manufacturing method thereof Field of invention

The present invention relates to an electrode substrate, an input device and a display device including the electrode substrate, and a method of manufacturing the same.

Background of the invention

Currently, polyaniline (PAN), polypyrrole (PPy), polythiophene (PT), and the like are widely used as conductive polymers. They are easily polymerized and have excellent electrical conductivity, as well as thermal and oxidative stability.

Due to the electrical characteristics of the conductive polymers, they have been proposed for various applications including electrodes for secondary batteries, materials for shielding electromagnetic waves, flexible electrodes, antistatic materials, corrosion-resistant coating materials, and the like. However, due to their problems, such as poor processability, heat and atmospheric instability, environmental tolerance, cost, etc., they have not been commercialized in large quantities.

However, recently, as dustproof and antistatic coating materials have become more and more popular, the standards for shielding electromagnetic waves have become more and more strict, and thus conductive polymers are used as shielding for emission by various electronic appliances. Electromagnetic waves have caused considerable attention.

In particular, polyethylene dioxythiophene (PEDT), a conductive polymer based on thiophene, is known in the art, as disclosed in U.S. Patent Nos. 5,035,926 and 5,391,472. The material of the glass surface of the Lawn tube has received considerable attention. These conductive polymers have excellent transparency compared to polyaniline and polypyrrole-based polymers and other polythiophene-based conductive polymers.

The polythiophene-based conductive polymer may generally be polyethylene dioxythiophene, and particularly polystyrene sulfonate doped polyethylene dioxythiophene. A typical example of such a water-dispersible polyethylene dioxythiophene is the product Clevios P available from Heraeus. However, even when a polymer film composed of the conductive polymer is used, a conductive polymer film which can be accurately patterned and whose pattern is not easily seen is required.

Therefore, the present inventors have found that an oxidizing agent containing a chlorine-based compound has excellent oxidizing ability to a conductive polymer film, and when a conductive polymer film is patterned by lithography using the chlorine-containing compound oxidizing agent At the time, the invisibility of the pattern of the conductive polymer film is increased.

Summary of invention

Accordingly, it is an object of the present invention to provide an electrode substrate which is excellent in pattern invisibility and which can be easily manufactured. Further, another object of the present invention is to provide an input device and a display device including the electrode substrate, and a method of manufacturing the electrode substrate.

According to an aspect of the present invention, an electrode substrate is provided, which comprises And comprising: an insulating substrate; and an electrode layer disposed on the insulating substrate, wherein the electrode layer comprises a conductive pattern containing a conductive polymer, and a non-conductive pattern, and the conductive pattern and the non-conductive pattern are integrated The ground is set in the same layer.

According to another aspect of the present invention, an input device including the electrode substrate is provided.

According to still another aspect of the present invention, a display device including the electrode substrate is provided.

According to still another aspect of the present invention, a method for fabricating an electrode substrate comprising the steps of: (a) applying a conductive polymer on an insulating substrate; and (b) reducing conductive polymerization by the application The electrical conductivity of a portion of the material forms an electrode layer on the insulating substrate, wherein the electrode layer comprises a conductive pattern containing the conductive polymer, and a non-conductive pattern containing the polymer having reduced conductivity.

According to another aspect of the present invention, there is provided a conductivity reducing agent comprising a chlorine-based compound and a solvent, wherein the chlorine-based compound is used in an amount of from 0.5 to 50% by weight.

According to the electrode substrate of the present invention, the non-conductive pattern can be formed by reducing the conductivity of a portion of the electrode layer. Therefore, a bump is rarely formed between the conductive pattern and the non-conductive pattern, and an optical difference is hardly generated between the conductive pattern and the non-conductive pattern. Therefore, the electrode substrate of the present invention has excellent pattern invisibility and optical uniformity. Therefore, the input device and the display device can have better image quality and can be reduced by one. Distortion of the image.

11‧‧‧Upper substrate

12‧‧‧ Lower substrate

100‧‧‧Insert substrate

101‧‧‧First insulating substrate

102‧‧‧Second insulating substrate

103‧‧‧ front substrate

200‧‧‧electrode layer

201‧‧‧ Conductive layer

202‧‧‧First electrode layer

203‧‧‧Second electrode layer

204‧‧‧ third electrode layer

205‧‧‧fourth electrode layer

210‧‧‧ conductive pattern

220‧‧‧ non-conductive pattern

300‧‧‧ mask pattern

400‧‧‧Lighting layer

500‧‧‧Conductivity reducing agent

1 to 4 are cross-sectional views showing the fabrication of an electrode substrate in a staged program according to an embodiment of the present invention.

Figure 5 is a cross-sectional view showing a touch panel type input device in accordance with an embodiment of the present invention.

Figure 6 is a cross-sectional view showing a display device in accordance with an embodiment of the present invention.

Detailed description of the preferred embodiment

In the description of the embodiments, when a substrate, a pattern, an electrode, a layer, and the like are respectively formed "on" or "down" on another substrate, another pattern, another electrode, another layer, etc., they may each be "Directly" is formed "on" or "under" the corresponding component, or may be "indirectly" formed "on" or "under" the corresponding component. In addition, the upper/lower or upper/lower components of each component are described in accordance with the drawings. In the figures, the dimensions of the various components may be exaggerated for the purpose of illustration and may be different from the actual dimensions.

Electrode substrate and method of manufacturing same

1 to 4 are cross-sectional views showing a flow of manufacturing an electrode substrate in a staged program according to an embodiment of the present invention.

First, a conductive polymer is applied on an insulating substrate.

Referring to FIG. 1, an insulating substrate 100 is coated with a conductive polymer to form a conductive layer 201.

The insulating substrate 100 is an insulator. The insulating substrate 100 can It is transparent. The insulating substrate 100 may be flexible. Conversely, the insulating substrate 100 may be rigid.

The insulating substrate 100 may include a polymer film. More specifically, the insulating substrate 100 may comprise a polyethylene terephthalate film, a polyethylene film, a polyethylene-2,6-naphthalate or the like.

Further, the insulating substrate 100 may be a substrate made of a transparent material such as any one selected from the group consisting of glass, cast polypropylene (CPP), polycarbonate, and acrylic resin.

The conductive polymer is a polymer having electrical conductivity. In detail, examples of the conductive polymer may include a conductive polymer mainly composed of polythiophene, a conductive polymer mainly composed of polyaniline, a conductive polymer mainly composed of polypyrrole, and the like. Preferably, the conductive polymer may be a conductive polymer mainly composed of polythiophene.

The conductive polymer may be mixed with a solvent to form a conductive polymer solution, and the obtained conductive polymer solution may be added to the insulating substrate 100. Next, the solvent is removed, and thus the conductive layer 201 is formed on the insulating substrate 100.

The solvent contained in the conductive polymer solution may include an organic solvent mainly composed of an alcohol and/or a solvent mainly composed of decylamine. The conductive polymer solution may further comprise a binder. Examples of the binder may include a polyester resin, a polyurethane resin, a polyacrylic resin, an alkoxysilane, and the like.

The alcohol-based organic solvent may be selected from the group consisting of methanol, ethanol, propanol, isopropanol, butanol, and the like. The 醯 The amine-based solvent may be selected from the group consisting of formamide, N-methylformamide, N,N-dimethylformamide, acetamide, N-methylacetamide, N-methylpyrrolidone. And a group of such mixtures.

The polyester resin and polyurethane resin generally used in the art can be used as the binder. Preferably, the alkoxydecane may be a trifunctional or tetrafunctional alkoxydecane compound. More specifically, the alkoxydecane may be trimethoxy decane and/or tetraethoxy decane.

The conductive polymer may be a conductive polymer mainly composed of polythiophene, a conductive polymer mainly composed of polyaniline or a conductive polymer mainly composed of polypyrrole, and preferably, polythiophene is mainly used. The conductive polymer, more preferably, a conductive polymer mainly composed of polyethylene dioxythiophene (PEDT), and most preferably polystyrene sulfonate doped polyethylene dioxythiophene.

The method of applying the conductive polymer solution can be carried out by a conventional method known in the art. For example, the conductive polymer solution can be applied by bar coating, roll coating, dip coating, spin coating or the like. Next, the applied conductive polymer solution can be dried at a temperature of 100 to 145 ° C for 1 to 10 minutes. The conductive layer 201 formed by applying and drying the conductive polymer solution may have a thickness of about 1 to 5 μm.

According to an embodiment, the conductive polymer solution (for example, a conductive polymer solution mainly composed of polythiophene) may be applied on a transparent substrate (for example, a polyethylene terephthalate film) by a rod coating. . The applied conductive polymer solution can then be dried in an oven at about 125 ° C for about 5 minutes. Therefore, a conductive polymer containing a polythiophene-based conductive polymer and having a conductive layer equal to or less than about 5 μm can be formed on the insulating substrate 100. 201.

The next step is to form an electrode layer on the insulating substrate by reducing the conductivity of a portion of the applied conductive polymer. For example, this step can include the additional step of spraying a chlorine-based compound onto the applied conductive polymer to reduce its conductivity. In another example, the step may include the steps of: forming a mask pattern on the applied conductive polymer; and spraying the coated conductive polymer with chlorine based on the mask pattern. Compound. In still another example, this step can include the step of oxidizing a portion of the applied conductive polymer to reduce its conductivity.

Referring to FIG. 2, a mask pattern 300 is formed on the conductive layer 201. The mask pattern 300 exposes a portion of the conductive layer 201 and covers other portions of the conductive layer 201. In other words, the mask pattern 300 includes an open area exposing one of the portions of the conductive layer 201 and a cover area covering the other portion of the conductive layer 201.

The mask pattern 300 can be formed by a photolithography method.

First, a photoresist layer is formed on the conductive layer 201. The photoresist layer may have a thickness of about 0.5 to 10 μm. The photoresist layer may comprise a positive photoresist or a negative photoresist. The positive type resist resin is a resin whose etched portion is etched by a developer, and the negative type resist resin is a resin which is etched by a developer without being affected by the light.

In order to remove the organic solvent remaining after the formation of the photoresist layer, a soft baking procedure can be performed. Therefore, contamination by the remaining solvent can be prevented and the reaction characteristics of the photoresist layer can be kept constant. The soft baking program can be in one It is carried out at a temperature of 60 to 140 °C.

Then, the photoresist layer passes through an exposure process and a development process, and thus a mask pattern 300 is formed on the conductive layer 201.

This development procedure was carried out as follows. The photoresist layer is selectively irradiated with light. Therefore, the chemistry of the light-irradiated portion of the photoresist layer is changed. When the photoresist layer is sprayed with a developer, the light-irradiated portion of the photoresist layer is removed or the portion of the photoresist layer that is not affected by the light is removed.

The developer may be a conventionally used alkaline aqueous solution (for example, tetraammonium hydroxide, sodium hydroxide, potassium hydroxide, sodium carbonate). After the development process, a hard baking process can be carried out at a temperature of 80 to 180 °C.

As described above, the desired portion of the photoresist layer is removed, and thus the mask pattern 300 is formed.

Referring to FIG. 3, a conductivity reducing agent 500 is applied to a portion of the conductive layer 201 through the mask pattern 300. In other words, the conductivity reducing agent 500 can be selectively applied to the conductive layer 201 through the mask pattern 300. More specifically, the conductive layer 201 and the mask pattern 300 may be impregnated together by the conductivity reducing agent 500.

The conductivity reducing agent 500 can be an oxidizing agent. In more detail, the conductivity reducing agent 500 can oxidize a portion of the conductive layer 201. Therefore, the conductivity reducing agent 500 oxidizes a portion of one of the conductive polymers included in the conductive layer 201, thereby reducing the conductivity of a portion of the conductive layer 201. In detail, the conductivity reducing agent 500 chemically changes the conjugated double bond structure of one of the conductive polymers included in the conductive layer 201, thereby significantly reducing the conductivity of the conductive polymer.

Further, the conductivity reducing agent 500 changes only the electrical characteristics of a portion of the conductive layer 201, and the conductive layer 201 can be hardly etched. In other words, the conductivity reducing agent 500 reduces the conductivity of a portion of the conductive layer 201, but can hardly remove a portion of the conductive layer 201.

The conductivity reducing agent 500 may comprise a chlorine-based compound. In detail, the chlorine-based compound may be a chloride of isocyanic acid. More specifically, the chlorine-based compound may be a metal salt of a chloride of isocyanic acid.

Further, the chlorine-based compound may include a Group I metal. In detail, the chlorine-based compound may be a salt of a Group I metal. In more detail, the Group I metal can be sodium.

More specifically, the chlorine-based compound may be selected from the group consisting of sodium dichloroisocyanurate (C ₃ Cl ₂ N ₃ NaO ₃ ), sodium hypochlorite (NaOCl), and the like.

The conductivity reducing agent 500 may contain a solvent. In this case, the chlorine-based compound may be used in an amount of from 0.5 to 50% by weight based on the total weight of the conductivity reducing agent. Preferably, the chlorine-based compound can be used in an amount of from 1 to 50% by weight based on the total weight of the conductivity reducing agent. More preferably, the chlorine-based compound may be used in an amount of from 25 to 48% by weight based on the total weight of the conductivity reducing agent.

When the amount of the chlorine-based compound in the conductivity reducing agent is too high, the stability of the conductivity reducing agent 500 is reduced. In other words, when the amount of the chlorine-based compound exceeds 50% by weight, the chlorine-based compound aggregates, and thus the conductivity of the conductivity reducing agent 500 is reduced. If it will decrease.

Further, when the amount of the chlorine-based compound in the conductivity reducing agent is too low, the reactivity (oxidation power) of the conductivity reducing agent 500 is decreased, and thus the conductivity of the conductivity reducing agent 500 is lowered. The reduction effect will be reduced.

The solvent included in the conductivity reducing agent 500 is not particularly limited, but distilled water is preferred.

The temperature of the conductivity reducing agent 500 may be about 10 to 80 ° C, and is preferably about 20 to 60 ° C. In addition, the immersion time of the conductive layer 201 by the conductivity reducing agent 500 may be about 0.1 to 30 minutes, and preferably about 0.3 to 20 minutes.

The conductivity of a portion of the conductive layer 201 is significantly reduced by the conductivity reduction procedure. Therefore, in the conductive layer 201, a portion of the exposed portion of the mask pattern 300 forms a non-conductive pattern 220. That is, in the conductive layer 201, the portion having the significantly reduced conductivity is the non-conductive pattern 220. In other words, the non-conductive pattern 220 may comprise a polymer formed by oxidizing the conductive polymer.

At the same time, other portions of the conductive layer 201 are protected by the mask pattern 300, and their conductivity is not affected. Therefore, in the conductive layer 201, the portion of the conductive unaffected portion forms a conductive pattern 210. In other words, the other portion of the conductive layer 201 is the conductive pattern 210.

Therefore, the electrode layer 200 including the conductive pattern 210 and the non-conductive pattern 220 is formed. In other words, the electrode layer 200 is formed by changing the electrical characteristics of a portion of the conductive layer 201.

The conductive pattern 210 and the non-conductive pattern 220 are formed such that they are integrated with each other. That is, only one electrical interface exists between the conductive pattern 210 and the non-conductive pattern 220, and a mechanical interface does not exist between the conductive pattern 210 and the non-conductive pattern 220.

Further, the difference in optical properties between the conductive pattern 210 and the non-conductive pattern 220 hardly exists. In other words, the difference in transmittance between the conductive pattern 210 and the non-conductive pattern 220 may be about 0.0001 to 0.1%. Moreover, the difference in refractive index between the conductive pattern 210 and the non-conductive pattern 220 may be about 0.0001 to 0.01.

The difference in electrical conductivity between the conductive pattern 210 and the non-conductive pattern 220 is quite large. For example, the conductivity of the conductive pattern 210 may be about 10 times or more than the conductivity of the non-conductive pattern 220. In detail, the conductivity of the conductive pattern 210 may be about 100 times or more of the conductivity of the non-conductive pattern 220. In more detail, the conductivity of the conductive pattern 210 may be about 1,000 times or more than the conductivity of the non-conductive pattern 220. And more particularly to the conductive pattern 210 of conductive may be for more than about ¹⁰⁶ times or ¹⁰⁶ times the conductive pattern 220 of the non-conductive. In more detail, the conductivity of the conductive pattern 210 may be about 10 ¹⁰ or 10 ¹⁰ times or more of the conductivity of the non-conductive pattern 220. In more detail, the conductivity of the conductive pattern 210 may be about 10 ²⁰ times or more than 10 ²⁰ times the conductivity of the non-conductive pattern 220. Therefore, the conductive pattern 210 can be a conductor, and the non-conductive pattern 220 can be an insulator.

The conductivity of the conductive pattern 210 may be about 100 to 10,000 S/cm. In detail, the conductivity of the conductive pattern 210 can be large. About 500 to 3,000 S/cm. Also, the surface resistance of the conductive pattern 210 may be about 10 to 5,000 Ω/sq. In detail, the surface resistance of the conductive pattern 210 may be about 50 to 1,000 Ω/sq. In more detail, the surface resistance of the conductive pattern 210 may be about 100 to 500 Ω/sq.

The non-conductive pattern 220 may have a conductivity of about 10 ^-5 to 10 ^-15 S/cm. In detail, the conductivity of the non-conductive pattern 220 may be about 10 ^-7 to 10 ^-9 S/cm. Also, the surface resistance of the non-conductive pattern 220 may be approximately equal to or greater than 10 ¹² Ω/sq. In detail, the non-conductive pattern 220 may have a surface resistance of about 10 ¹² to 10 ²⁰ Ω/sq. In more detail, the non-conductive pattern 220 may have a surface resistance of about 10 ¹³ to 10 ²⁰ Ω/sq.

The conductive pattern 210 and the non-conductive pattern 220 are disposed in the same layer. In detail, the surface of the conductive pattern 210 and the surface of the non-conductive pattern 220 may be disposed in the same plane.

For example, the lower surface of the conductive pattern 210 and the lower surface of the non-conductive pattern 220 may be disposed in the same plane. Moreover, since the non-conductive pattern 220 is hardly etched, the upper surface of the conductive pattern 210 and the upper surface of the non-conductive pattern 220 may also be disposed in the same plane. In other words, a bump may be hardly formed between the non-conductive pattern 220 and the conductive pattern 210.

Therefore, the pattern on the electrode layer 200 can have better invisibility. That is, since an optical interface is hardly present between the conductive pattern 210 and the non-conductive pattern 220, the electrode layer 200 can have better light uniformity.

Referring to Figure 4, the mask pattern is removed. The mask pattern can be borrowed Removed by a stripping procedure. In this case, the stripping solution may comprise a solvent, an amine compound, and a monoammonium salt. . Next, the electrode layer 200 can be rinsed with distilled water.

Examples of the solvent used in the stripping solution may include a mixture of dimethyl hydrazine, ethylene carbonate, and the like. Examples of the amine compound may include N-methylpyrrolidone, N,N-dimethylformamide, acetamide, N-methylacetamide, and the like.

In the above method of manufacturing an electrode substrate, the developing process and the peeling process may be carried out by dipping or spraying, but are not limited thereto.

Input device and display device

Figure 5 is a cross-sectional view showing a touch panel type input device in accordance with an embodiment of the present invention. This touch panel type input device can be explained with reference to the above description of the electrode substrate. In other words, the description of the above electrode substrate can be practically used to explain the touch panel type input device.

Referring to FIG. 5 , a touch panel type input device according to an embodiment of the invention includes an upper substrate 11 and a lower substrate 12 .

The upper substrate 11 and the lower substrate 12 face each other. Further, the upper substrate 11 and the lower substrate 12 may be separated from each other by a predetermined interval. Further, a spacer (not shown in FIG. 5) may be disposed between the upper substrate 11 and the lower substrate 12. The spacer may separate the upper substrate 11 and the lower substrate 12 by a predetermined interval.

The upper substrate 11 includes a first insulating substrate 101 and a first electrode layer 202. The first electrode layer 202 is disposed under the first insulating substrate 101.

The first insulating substrate 101 may have substantially the same structure as that of the insulating substrate 100 of the electrode substrate. Further, the first electrode layer 202 may have substantially the same structure as that of the electrode layer 200 described above.

The lower substrate 12 includes a second insulating substrate 102 and a second electrode layer 203. The second electrode layer 203 is disposed on the second insulating substrate 102.

The second insulating substrate 102 may have substantially the same structure as that of the insulating substrate 100 of the electrode substrate. Further, the second electrode layer 203 may have substantially the same structure as that of the electrode layer 200 described above.

The first electrode layer 202 and the second electrode layer 203 face each other. Moreover, the first electrode layer 202 and the second electrode layer 203 can be separated from each other by a predetermined interval.

The upper substrate 11 and the lower substrate 12 are in contact with each other by an external pressure. Therefore, a current can flow through the first electrode layer 202 and the second electrode layer 203. In this case, the total resistance of the input device can be changed according to the position at which the first electrode layer 202 and the second electrode layer 203 contact each other. Therefore, the contact portion of the upper substrate 11 can be determined by the difference in resistance values.

The touch panel type input device according to this embodiment includes electrode layers 202 and 203 having better pattern invisibility. Therefore, when the input device is applied to display one of the image display devices, distortion of an image can be prevented.

Figure 6 is a cross-sectional view showing a display device in accordance with an embodiment of the present invention. This display device can be explained with reference to the description of the electrode substrate described above. In other words, the description of the above electrode substrate can be practically used to illustrate the display. Display device.

Referring to FIG. 6 , a touch panel type input device according to an embodiment of the invention includes a front substrate 103 , a third electrode layer 204 , a light emitting layer 400 and a fourth electrode layer 205 .

The front substrate 103 can be substantially identical to the insulating substrate 100 of the above electrode substrate. An image can be displayed in the upward direction by the front substrate 103.

The third electrode layer 204 is disposed under the front substrate 103. The third electrode layer 204 may be substantially identical to the electrode layer 200 described above.

The light emitting layer 400 may include an organic light emitting layer. Moreover, the light emitting layer 400 can include an electron transport layer and a hole transport layer. The luminescent layer 400 can include a body and a dopant applied to the body. Examples of the material used as the main body may include an organic material mainly composed of carbazole and an organic material mainly composed of ruthenium. Examples of the material used as the dopant may include blue, green, and red fluorescent materials and phosphorescent materials. Conversely, the luminescent layer 400 can include an inorganic luminescent material.

The fourth electrode layer 205 is disposed under the light emitting layer 400. In other words, the light emitting layer 400 is sandwiched between the third electrode layer 204 and the fourth electrode layer 205. A current is applied to the light emitting layer 400 through the third electrode layer 204 and the fourth electrode layer 205, and thus the light emitting layer 400 can display an image.

The display device according to this embodiment comprises an electrode layer 200 having a better pattern invisibility. Therefore, the display device can prevent distortion of an image and can have better image quality.

The electrode substrate according to this embodiment can be applied to various touch surfaces The plate type input device and various display devices are not limited to the input device and display device shown in FIGS. 5 and 6. Moreover, the electrode substrate according to the embodiment can be used for an electromagnetic wave shielding film, an electroluminescence (EL) electrode film, a transparent electrode film for a display, an electromagnetic wave shielding layer for a TV Braun tube and a computer monitor, for Used in touch panel type conductive films for electrical and electronic appliances.

Furthermore, the features, structures, and effects described in the above embodiments may be shown in one or more embodiments and they are not limited to being included in a particular embodiment. In addition, those skilled in the art can variously combine and modify the features, structures, and effects in other embodiments. Accordingly, such combinations and modifications are to be construed as included within the scope of the invention.

While the invention has been described with respect to the specific embodiments of the present invention, it is understood that various modifications and changes can be made to the invention. For example, each component specifically described in the embodiments can be variously modified. Such modifications and variations are to be construed as falling within the scope of the invention as defined by the following claims.

Examples 1 to 4 and Comparative Examples 1 to 7

Step (1): preparing a conductivity reducing agent

The components exemplified in Table 1 below were separately mixed with distilled water to prepare a conductivity reducing agent having a corresponding solid content.

Step (2): forming a conductive layer

A conductive polymer solution comprising polyethylene dioxythiophene doped with polystyrene sulfonate, methanol, propanol, N-methylacetamide and trimethoxy decane was prepared. Applying the prepared conductive polymer solution to a polyparaphenylene The ethylene formate film was then dried in an oven at about 125 ° C for about 5 minutes to form a conductive layer. The conductive layer thus obtained had a thickness of about 5 μm and a conductivity of about 1,000 S/cm.

Step (3): forming a pattern

The conductive layer obtained in the step (2) is patterned by photolithography using the conductivity reducing agent prepared in the step (1). Specifically, a resist layer is applied to the conductive layer to a thickness of 2 to 4 μm, followed by soft baking at a heating temperature of 120 °C. Then, the resist layer is selectively exposed using a mask, and then a modified portion of the resist layer is removed using a developer, and then hard baked at a heating temperature of 140 ° C to form a conductive layer on the conductive layer. Mask pattern. Next, the conductivity reducing agent prepared in the step (1) is applied on the conductive layer to reduce the conductivity of the portion not covered by the mask pattern. Therefore, one electrode layer having one conductive pattern and one non-conductive pattern is formed. Then, the mask pattern is removed, and then the electrode layer is rinsed with distilled water.

Test case

Test (1): Reactivity of a conductivity reducing agent

The reactivity of each of the conductivity reducing agents prepared in the examples and the comparative examples was evaluated. In detail, in the step (3) of each of the examples and the comparative examples, the surface resistance of the electrode substrate which is reacted with the conductivity reducing agent is measured by a resistance meter (Tuustat work surface tester ST-3 (SIMCO)) The time taken to obtain the insulation performance corresponding to a surface resistance equal to or greater than 10 ¹³ Ω/□ is classified into the following types: ○: less than 20 minutes, Δ: equal to or greater than 20 minutes to less than 30 minutes, ×: equal to or greater than 30 minutes

Test (2): Stability of a conductivity reducing agent

Each of the conductivity reducing agents prepared in the steps (1) of the above examples and comparative examples was allowed to stand at room temperature for 5 days, and then its stability was evaluated in accordance with the degree of aggregation thereof. In other words, when each of the conductivity reducing agents is not aggregated, its stability is regarded as "good", and when each of the conductivity reducing agents is aggregated, its stability is regarded as "poor". However, in Table 1 below, the stability of the conductivity-reducing agent having low reactivity was not evaluated.

Test (3): Invisibility of a pattern

The invisibility of one of the patterns formed on each of the electrode substrates manufactured in the examples and the comparative examples was evaluated by the chromaticity difference. In other words, by using a UV spectrometer (CM-3500d, Minolta Corporation), the non-conductive pattern exposed to the conductivity reducing agent and the conductive pattern pair not exposed to the conductivity reducing agent are respectively transmitted to have a wavelength of 550 nm. The b ^* value, and then the visibility of each pattern is evaluated by the difference between the b ^* values as follows: Δb ^* 1.5: Good (not easy to see the pattern), △b ^* > 1.5 (easy to see the pattern).

However, in Table 1 below, the invisibility of each pattern was not evaluated for the conductivity reducing agent having low reactivity.

At the same time, it is determined that the surface resistance of the conductive pattern is not changed after the conduction reduction procedure has been terminated. In other words, a portion of the electrode substrate that does not react with the conductivity reducing agent has the same surface resistance as that of the initially prepared conductive layer.

The results of evaluation of the reactivity and stability of the conductivity reducing agents and the invisibility of the pattern are shown in Table 1 below.

C ₃ Cl ₂ N ₃ NaO ₃ : sodium dichloroisocyanurate (Aldrich)

(NH ₄ ) ₂ Ce(NO ₃ ) ₆ : ammonium cerium nitrate (Aldrich)

NaOCl: sodium hypochlorite (Aldrich)

NaClO ₃ : sodium chlorate (Aldrich)

Na ₂ SO ₃ : sodium sulfate (Aldrich)

KMnO ₄ : potassium permanganate (Aldrich)

Ce(SO ₄ ) ₂ : barium sulfate (Aldrich)

NaHSO: sodium bisulfite (Aldrich)

Solvent: distilled water

As shown in Table 1 above, it has been observed that the pattern is invisible when an appropriate amount of the chlorine-based conductivity reducing agent in Examples 1 to 4 is used. And the inductivity and stability of the conductivity reducing agents are good.

On the contrary, it has been observed that the pattern invisibility is unfavorable when the cerium nitrate-containing oxidizing agent of Comparative Example 1 used in a conventional conduction reduction procedure is used as a conductivity reducing agent.

Further, it was confirmed that when the oxidizing agents of Comparative Examples 2 to 6 were used as a conductivity reducing agent, a reaction did not occur even when a conductive polymer film was immersed in each oxidizing agent for 20 minutes.

Further, it was confirmed that the conductivity reducing agents of Comparative Examples 7 to 9 each containing a chlorine-based oxidizing agent in an amount of equal to or more than 50% by weight in excess of each other had poor stability.

Although the present invention has been described in terms of the specific embodiments, it is understood by those of ordinary skill in the art that various modifications and changes can be made in the present invention. Within the scope of the invention as defined.

11‧‧‧Upper substrate

12‧‧‧ Lower substrate

101‧‧‧First insulating substrate

102‧‧‧Second insulating substrate

202‧‧‧First electrode layer

203‧‧‧Second electrode layer

Claims (19)

An electrode substrate comprising: an insulating substrate; and an electrode layer disposed on the insulating substrate, wherein the electrode layer comprises a conductive pattern containing a conductive polymer, and a non-conductive pattern, and the conductive pattern and the non-conductive layer The conductive patterns are integrally disposed in the same layer. The electrode substrate of claim 1, wherein the non-conductive pattern comprises a polymer formed by oxidizing the conductive polymer. The electrode substrate of claim 1, wherein the surface of the conductive pattern and the surface of the non-conductive pattern are disposed in the same plane. The electrode substrate of claim 1, wherein the conductivity of the conductive pattern is about 1,000 times or more of the conductivity of the non-conductive pattern. The scope of the patent application electrode substrate, Paragraph 4, wherein the conductive lines of the non-conductive pattern of more than about ¹⁰⁶ times the conductivity of the conductive pattern or ^106-fold. The electrode substrate of claim 1, wherein the conductivity of the conductive pattern is about 100 to 10,000 S/cm, and the conductivity of the non-conductive pattern is about 10 ^-5 to 10 ^-15 S/cm. The electrode substrate of claim 1, wherein the conductive pattern serves as a conductor, and the non-conductive pattern serves as an insulator. An input device comprising the electrode substrate of claim 1 of the patent application. A display device comprising the electrode substrate of claim 1 of the patent application. A method for manufacturing an electrode substrate, comprising the steps of: (a) applying a conductive polymer on an insulating substrate; and (b) forming an electrode layer on the insulating substrate by reducing conductivity of a portion of the applied conductive polymer, wherein the electrode The layer comprises a conductive pattern comprising the conductive polymer and a non-conductive pattern comprising the reduced conductivity polymer. The method of claim 10, wherein the step (b) further comprises the step of spraying a chlorine-based compound on a portion of the applied conductive polymer to reduce its conductivity. The method of claim 11, comprising the steps of: (b-1) forming a mask pattern on the applied conductive polymer; and (b-2) transmitting the mask pattern through the mask. A chlorine-based compound is sprayed onto the conductive polymer. The method of claim 10, wherein the step (b) comprises the step of oxidizing a portion of the applied conductive polymer to reduce its conductivity. The method of claim 10, wherein the conductive pattern and the non-conductive pattern are disposed in the same layer. The method of claim 14, wherein the surface of the conductive pattern and the surface of the non-conductive pattern are disposed in the same plane. The method of claim 10, wherein the conductivity of the conductive pattern is about 100 times or more of the conductivity of the non-conductive pattern. A conductivity reducing agent comprising a chlorine-based compound and a solvent, wherein the chlorine-based compound is in an amount of about 0.5 to 50% by weight To use. The conductivity reducing agent according to claim 17, wherein the chlorine-based compound is a chloride of isocyanic acid. The conductivity reducing agent according to claim 17, wherein the chlorine-based compound comprises a Group I metal.