TW201346396A - Backlight module - Google Patents
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- TW201346396A TW201346396A TW101116964A TW101116964A TW201346396A TW 201346396 A TW201346396 A TW 201346396A TW 101116964 A TW101116964 A TW 101116964A TW 101116964 A TW101116964 A TW 101116964A TW 201346396 A TW201346396 A TW 201346396A
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Abstract
Description
本發明係有關一種背光模組，特別是一種強化結構強度之背光模組。The invention relates to a backlight module, in particular to a backlight module with enhanced structural strength.
隨著顯示器技術快速的進步與演進，傳統的陰極射線管因存在空間利用不佳與消耗大量能源等問題，已逐漸被市場所淘汰，取而代之的是具有輕、薄、短、小等優點的液晶顯示器。With the rapid advancement and evolution of display technology, traditional cathode ray tubes have been gradually eliminated by the market due to problems such as poor space utilization and large consumption of energy, and replaced by liquid crystals with advantages of lightness, thinness, shortness, and smallness. monitor.
在朝向輕薄、窄邊框的液晶顯示器領域中，液晶顯示器的尺寸隨著科技的發展及演進而越作越大，同時厚度也越來越薄，並且，由於厚度愈漸輕薄，液晶顯示器的結構強度亦必須提高，其中，習知液晶顯示器為確保整體結構強度，在零組件的設置及裝配上必須克服諸多限制，例如窄邊、抗扭力或成本考量，因此也造成了液晶顯示器在設計上的難題，如此，有待所屬技術領域人員解決的問題。In the field of liquid crystal displays facing a thin, narrow frame, the size of liquid crystal displays has become larger and larger with the development and evolution of technology, and the thickness is also thinner and thinner, and the structural strength of liquid crystal displays is thinner due to the thinner thickness. It must also be improved. Among them, the conventional liquid crystal display must overcome many limitations in the assembly and assembly of components, such as narrow side, anti-torque or cost considerations, in order to ensure the overall structural strength, thus also causing the design problem of the liquid crystal display. Thus, the problem to be solved by those skilled in the art.
有鑑於此，本發明提出一種背光模組，包含：光學組件、光源模組、背蓋及框架；其中，光源模組包含基板與發光元件，發光元件位於基板；背蓋包含本體與承載件，本體承載光學組件，承載件連接於本體並朝遠離光學組件之方向彎折，光源模組位於承載件，其中，發光元件位於光學組件之側邊，承載件與本體相連之處形成段差，段差之高度大於等於基板之厚度；框架一端與承載件相結合，另一端夾持光學組件。In view of the above, the present invention provides a backlight module, including: an optical component, a light source module, a back cover, and a frame; wherein the light source module includes a substrate and a light emitting component, and the light emitting component is located on the substrate; the back cover includes a body and a carrier. The body carries the optical component, the carrier is connected to the body and is bent away from the optical component, and the light source module is located on the carrier. The light-emitting component is located at the side of the optical component, and the carrier is connected with the body to form a step, and the step is The height is greater than or equal to the thickness of the substrate; one end of the frame is combined with the carrier and the other end is clamped to the optical component.
本發明的實施例中，背光模組可藉由承載件朝遠離光學組件之方向彎折，而形成段差高度的結構形式，以有效提升抗扭轉力及整體背光模組的強度，並且，光源模組定位在承載件後可減少佔用邊框空間與方便裝配作用，待框架與光源模組及承載件結合後，有效降低背光模組的邊框距離以及組裝成本的效果。In the embodiment of the present invention, the backlight module can be bent in a direction away from the optical component to form a step height structure to effectively improve the anti-torsion force and the strength of the overall backlight module, and the light source mode After the group is positioned on the carrier, the space of the frame can be reduced and the assembly is facilitated. After the frame is combined with the light source module and the carrier, the frame distance of the backlight module and the assembly cost are effectively reduced.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art.
第1圖及第2圖，係本發明的第一實施例。第1圖為外觀剖面示意圖，第2圖為側視剖面示意圖。Figs. 1 and 2 show a first embodiment of the present invention. Figure 1 is a schematic cross-sectional view of the appearance, and Figure 2 is a schematic cross-sectional view of the side.
如第1圖及第2圖，於本發明第一實施例中之背光模組100包含光學組件1、光源模組3、背蓋5及框架7。為了清楚呈現光源模組3，第1圖並未顯示光學組件1。As shown in FIG. 1 and FIG. 2, the backlight module 100 in the first embodiment of the present invention includes an optical component 1, a light source module 3, a back cover 5, and a frame 7. In order to clearly present the light source module 3, the optical assembly 1 is not shown in FIG.
光學組件1在本實施例中主要可由導光板、光學膜片組所組成，在此說明關於光學組件之結構僅為舉例，本發明非以此為限。The optical component 1 is mainly composed of a light guide plate and an optical film set in this embodiment. The structure of the optical component is merely an example, and the invention is not limited thereto.
光源模組3包含基板31與發光元件32，其中，基板31呈長條狀，發光元件32間隔地排列於基板31上。The light source module 3 includes a substrate 31 and a light-emitting element 32. The substrate 31 has an elongated shape, and the light-emitting elements 32 are arranged on the substrate 31 at intervals.
請參閱第2圖，背蓋5主要可由一體成形之本體51與承載件52所組成，其中，承載件52之一端連接於本體51，另一端朝遠離光學組件1之方向彎折，換言之，承載件52之另一端沿第一方向D1彎折(即朝下方)。又框架7的一端與承載件52相結合，框架7的另一端夾持光學組件1。在此，承載件52與本體51相連之處經由彎折而形成段差50，在本實施例中，段差50之高度等於基板31之厚度，因此基板31定位於段差50處後，基板31之上表面(即面向光學組件1之一面)不會突凸本體51之表面，並且，光源模組3之基板31定位於承載件52後，發光元件32位於光學組件1之側邊並朝向光學組件1投射光線。此外，由於段差50之高度等於基板31之厚度，因此，本體51承載光學組件1後，光學組件1之一部分位於本體51上，光學組件1之另一部分位於基板31上，使光學組件1平整地抵貼在本體51與基板31上而同時由本體51與基板31所支撐。Referring to FIG. 2, the back cover 5 can be mainly composed of an integrally formed body 51 and a carrier 52. One end of the carrier 52 is connected to the body 51, and the other end is bent away from the optical component 1, in other words, carried. The other end of the member 52 is bent in the first direction D1 (i.e., facing downward). Further, one end of the frame 7 is coupled to the carrier 52, and the other end of the frame 7 holds the optical component 1. Here, the portion of the carrier 52 connected to the body 51 is formed by bending to form a step 50. In the present embodiment, the height of the step 50 is equal to the thickness of the substrate 31, so that the substrate 31 is positioned at the step 50, above the substrate 31. The surface (ie, facing one side of the optical component 1) does not protrude from the surface of the body 51, and after the substrate 31 of the light source module 3 is positioned on the carrier 52, the light-emitting element 32 is located on the side of the optical component 1 and faces the optical component 1. Project light. In addition, since the height of the step 50 is equal to the thickness of the substrate 31, after the body 51 carries the optical component 1, one portion of the optical component 1 is located on the body 51, and another portion of the optical component 1 is located on the substrate 31, so that the optical component 1 is flat. It is attached to the body 51 and the substrate 31 while being supported by the body 51 and the substrate 31.
在前述說明中，係以段差50之高度等於基板31之厚度為例說明，本發明非以此為限，段差50之高度可大於基板31之厚度，使基板31之一端可輕易地置入光學組件1與承載件52之間所形成之空間。In the foregoing description, the height of the step 50 is equal to the thickness of the substrate 31 as an example. The present invention is not limited thereto, and the height of the step 50 may be greater than the thickness of the substrate 31, so that one end of the substrate 31 can be easily placed into the optical A space formed between the assembly 1 and the carrier 52.
在一些實施例中，請繼續參閱第1圖及第2圖，承載件52主要可由基部53、第一承載部54及第二承載部55所組成，其中，基部53之截面概呈U字體型，基部53的二側分別為第一端531與第二端532，第一承載部54之一端連接於基部53之第一端531(如第2圖基部的左側)，第一承載部54之另一端連接於本體51，第二承載部55之一端連接於基部53之第二端532(如第2圖基部的右側)。在本實施例中，第一承載部54與第二承載部55較佳地為平面板體的結構，兩者位於同一平面上而形成承載面，用以承載光源模組3。並且，基部53所在位置之水平面與基板31所在位置之水平面形成為間距H的落差。In some embodiments, please refer to FIG. 1 and FIG. 2 , the carrier 52 can be mainly composed of a base portion 53 , a first bearing portion 54 and a second bearing portion 55 , wherein the base portion 53 has a U-shaped cross section. The two sides of the base portion 53 are respectively a first end 531 and a second end 532. One end of the first receiving portion 54 is connected to the first end 531 of the base portion 53 (such as the left side of the base portion of FIG. 2), and the first carrying portion 54 is The other end is connected to the body 51, and one end of the second carrier portion 55 is connected to the second end 532 of the base portion 53 (as shown on the right side of the base portion of FIG. 2). In this embodiment, the first bearing portion 54 and the second bearing portion 55 are preferably planar plate bodies, and the two are located on the same plane to form a bearing surface for carrying the light source module 3. Further, the horizontal plane at the position where the base portion 53 is located and the horizontal plane at the position where the substrate 31 is located are formed as a difference in the pitch H.
在一些實施例中，請參閱第2圖，第一承載部54與第二承載部55分別由基部53朝相反之方向延伸，換言之，第一承載部54沿第二方向D2(即朝向本體51)延伸，第二承載部55沿第三方向D3(即朝向框架7)延伸，可進一步提升背蓋5結構的抗扭轉效果。在此，前述說明關於第二承載部55所延伸的方向僅為舉例，本發明非以此為限，在一些實施例中，第二承載部55可以由基部53朝第一承載部54之方向延伸(如第7圖及第8圖)，換言之，第二承載部55沿第二方向D2延伸(即朝向本體51)。In some embodiments, referring to FIG. 2, the first carrier portion 54 and the second carrier portion 55 respectively extend from the base portion 53 in opposite directions. In other words, the first carrier portion 54 is along the second direction D2 (ie, toward the body 51). The extension, the second bearing portion 55 extends in the third direction D3 (ie, toward the frame 7), which further enhances the anti-twist effect of the structure of the back cover 5. Herein, the foregoing description of the direction in which the second carrier portion 55 extends is only an example, and the present invention is not limited thereto. In some embodiments, the second carrier portion 55 may be directed from the base portion 53 toward the first carrier portion 54. The extension (as in Figures 7 and 8), in other words, the second carrier 55 extends in the second direction D2 (i.e. towards the body 51).
在一些實施例中，請參閱第2圖，框架7之截面概呈ㄈ字體型，其一端形成鉤部70，另一端夾持光學組件1，並且，鉤部70可與承載件52相結合。在此實施例中，框架7之一端設置定位部71，定位部71較佳地為凹槽結構。In some embodiments, referring to FIG. 2, the frame 7 is generally in the form of a font having a hook 70 at one end and an optical assembly 1 at the other end, and the hook 70 can be coupled to the carrier 52. In this embodiment, one end of the frame 7 is provided with a positioning portion 71, which is preferably a groove structure.
在此，前述說明關於定位部71之結構僅為舉例，本發明非以此為限，在一些實施例中，定位部71可以是貫穿框架的孔洞結構(如第6圖及第7圖所示)，其中，在一些實施例中，請參閱第2圖，第二承載部55與基板31之一端嵌合於定位部71，然而，本發明非以此為限，在一些實施例中，定位部71可單以基板31嵌合定位(如第7圖及第8圖所示)。Herein, the foregoing description is not limited to the structure of the positioning portion 71. In some embodiments, the positioning portion 71 may be a hole structure extending through the frame (as shown in FIGS. 6 and 7). In some embodiments, referring to FIG. 2, the second carrying portion 55 and one end of the substrate 31 are fitted to the positioning portion 71. However, the present invention is not limited thereto, and in some embodiments, positioning The portion 71 can be simply positioned by the substrate 31 (as shown in FIGS. 7 and 8).
在一些實施例中，請參閱第2圖，框架7之一端設有傾斜面72，承載件52之基部53設有卡合面533，由於卡合面533與傾斜面72對應角度傾斜，因此當卡合面533抵貼傾斜面72時，可使承載件52卡合於框架7上。In some embodiments, referring to FIG. 2, one end of the frame 7 is provided with an inclined surface 72, and the base portion 53 of the carrier 52 is provided with an engaging surface 533. Since the engaging surface 533 is inclined at an angle corresponding to the inclined surface 72, When the engaging surface 533 abuts against the inclined surface 72, the carrier 52 can be engaged with the frame 7.
在此，前述說明關於框架7之一端與承載件52之結合方式僅為舉例，本發明非以此為限，在一些實施例中，框架7與承載件52可以膠合方式黏合(未圖示)。Herein, the foregoing description is directed to the manner in which one end of the frame 7 and the carrier 52 are combined. The present invention is not limited thereto. In some embodiments, the frame 7 and the carrier 52 may be glued together (not shown). .
在一些實施例中，承載件52之基部53可為其他的結構態樣。請參閱第2圖，基部53之截面概呈U字體型，內部寬度距離至開口寬度距離形成逐漸擴張；請參閱第3圖，基部53之截面概呈U字體型，內部寬度距離至開口寬度距離形成相同大小；請參閱第4圖，基部53之截面概呈U字體型，內部寬度距離大於開口寬度距離。在此，前述說明關於基部53之結構態樣僅為舉例，本發明非以此為限。In some embodiments, the base 53 of the carrier 52 can be in other structural aspects. Referring to FIG. 2, the base portion 53 has a U-shaped cross section, and the inner width distance to the opening width distance is gradually expanded; referring to FIG. 3, the base portion 53 has a U-shaped cross section, and the inner width distance to the opening width distance. The same size is formed; referring to Fig. 4, the base portion 53 has a U-shaped cross section with an internal width distance greater than the opening width distance. Herein, the foregoing description of the structure of the base 53 is merely an example, and the present invention is not limited thereto.
在一些實施例中，請參閱第5圖，背蓋5之承載件52可直接由複數基部53、第一承載部54及第二承載部55所組成，換言之，各個基部53左右側分別連接第一承載部54及第二承載部55，並且，一個基部53右側的第二承載部55連接另一個基部53左側的第一承載部54，形成一體成形的結構，在此，二個基部53之間的第一承載部54與第二承載部55連接處抵貼在基板31下表面，此實施例的圖式以示意的方式呈現，本領域之研究人員應可理解，承載件52之變形可能不會達到如本實施例的圖式所示之承載件52的彎折程度，因此，本發明之實施例所指之承載件52變形，並非以本發明之實施例的圖式中所呈現的變形程度為限。In some embodiments, referring to FIG. 5, the carrier 52 of the back cover 5 can be directly composed of the plurality of bases 53, the first carrier portion 54, and the second carrier portion 55. In other words, the left and right sides of the respective base portions 53 are respectively connected to the first and second sides. a carrying portion 54 and a second carrying portion 55, and a second carrying portion 55 on the right side of one base portion 53 is coupled to the first carrying portion 54 on the left side of the other base portion 53 to form an integrally formed structure, where the two base portions 53 are The connection between the first bearing portion 54 and the second carrier portion 55 abuts against the lower surface of the substrate 31. The drawing of this embodiment is presented in a schematic manner. It should be understood by those skilled in the art that the deformation of the carrier 52 may be The degree of bending of the carrier 52 as shown in the drawings of the present embodiment is not achieved, and therefore, the carrier 52 referred to in the embodiment of the present invention is deformed, not in the drawings of the embodiment of the present invention. The degree of deformation is limited.
在一些實施例中，請參閱第7圖，承載件52經由結合件6固定於框架7上，在本實施例中，承載件52之基部53設置扣孔534，框架7一端設置結合件6，結合件6包含卡扣部61(例如為凸部)卡制在扣孔534上，使結合件6固定承載件52於框架7。In some embodiments, referring to FIG. 7 , the carrier member 52 is fixed to the frame 7 via the coupling member 6 . In the embodiment, the base portion 53 of the carrier member 52 is provided with a fastening hole 534 , and the frame 7 is provided with a coupling member 6 at one end thereof. The coupling member 6 includes a latching portion 61 (for example, a convex portion) that is snapped onto the buckle hole 534 such that the coupling member 6 fixes the carrier member 52 to the frame 7.
在一些實施例中，請參閱第8圖，承載件52經由結合件6固定於框架7上，在本實施例中，承載件52之基部53設置鎖孔535，框架7之一端設置孔洞73，結合件6為螺固件62穿過孔洞73鎖固在鎖孔535上，使結合件6固定承載件52於框架7，其中，螺固件62是穿過傾斜面72而鎖固在基部53，在此，前述說明關於螺固件62的鎖接方向僅為舉例，本發明非以此為限，在一些實施例中，螺固件62可以是穿過框架7之一端而鎖固在第二承載部55(如第9圖所示)。In some embodiments, referring to FIG. 8 , the carrier 52 is fixed to the frame 7 via the coupling member 6 . In the embodiment, the base 53 of the carrier 52 is provided with a locking hole 535 , and one end of the frame 7 is provided with a hole 73 . The coupling member 6 is screwed to the locking hole 535 through the hole 73, so that the coupling member 6 fixes the carrier 52 to the frame 7, wherein the screw 62 is locked to the base portion 53 through the inclined surface 72. Therefore, the foregoing description of the locking direction of the screw 62 is only an example, and the invention is not limited thereto. In some embodiments, the screw 62 may be locked to the second bearing portion 55 through one end of the frame 7 . (as shown in Figure 9).
綜上所述，根據本發明之背光模組可藉由承載件朝遠離光學組件之方向彎折，而形成段差高度的結構形式，以有效提升抗扭轉力及整體背光模組的強度，並且，光源模組定位在承載件後可減少佔用邊框空間與方便裝配作用，待框架與光源模組及承載件結合後，有效降低背光模組的邊框距離以及組裝成本的效果。In summary, the backlight module according to the present invention can be bent in a direction away from the optical component to form a step height structure to effectively improve the anti-torsion force and the strength of the overall backlight module. After the light source module is positioned on the carrier, the space of the frame can be reduced and the assembly is facilitated. After the frame is combined with the light source module and the carrier, the frame distance of the backlight module and the assembly cost are effectively reduced.
雖然本發明的技術內容已經以較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神所作些許之更動與潤飾，皆應涵蓋於本發明的範疇內，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
100．．．背光模組100. . . Backlight module
1．．．光學組件1. . . Optical component
3．．．光源模組3. . . Light source module
31．．．基板31. . . Substrate
32．．．發光元件32. . . Light-emitting element
5．．．背蓋5. . . Back cover
50．．．段差50. . . Step difference
51．．．本體51. . . Ontology
52．．．承載件52. . . Carrier
53．．．基部53. . . Base
531．．．第一端531. . . First end
532．．．第二端532. . . Second end
533．．．卡合面533. . . Engagement surface
534．．．扣孔534. . . Buckle hole
535．．．鎖孔535. . . keyhole
54．．．第一承載部54. . . First carrier
55．．．第二承載部55. . . Second carrier
6．．．結合件6. . . Joint piece
61．．．卡扣部61. . . Buckle
62．．．螺固件62. . . Screw firmware
7．．．框架7. . . frame
70．．．鉤部70. . . Hook
71．．．定位部71. . . Positioning department
72．．．傾斜面72. . . Inclined surface
73．．．孔洞73. . . Hole
D1．．．第一方向D1. . . First direction
D2．．．第二方向D2. . . Second direction
D3．．．第三方向D3. . . Third direction
H．．．間距H. . . spacing
第1圖為本發明之第一實施例之外觀剖面示意圖。Fig. 1 is a schematic cross-sectional view showing the appearance of a first embodiment of the present invention.
第2圖為本發明之第一實施例之側視剖面示意圖。Figure 2 is a side cross-sectional view showing the first embodiment of the present invention.
第3圖為本發明之承載件之側視示意圖(一)。Figure 3 is a side elevational view (I) of the carrier of the present invention.
第4圖為本發明之承載件之側視示意圖(二)。Figure 4 is a side elevational view (2) of the carrier of the present invention.
第5圖為本發明之承載件之側視示意圖(三)。Figure 5 is a side elevational view (3) of the carrier of the present invention.
第6圖為本發明之第二實施例之外觀剖面示意圖。Figure 6 is a schematic cross-sectional view showing the appearance of a second embodiment of the present invention.
第7圖為本發明之第三實施例之外觀剖面示意圖。Figure 7 is a schematic cross-sectional view showing the appearance of a third embodiment of the present invention.
第8圖為本發明之第四實施例之外觀剖面示意圖。Figure 8 is a cross-sectional view showing the appearance of a fourth embodiment of the present invention.
第9圖為本發明之第五實施例之外觀剖面示意圖。Figure 9 is a cross-sectional view showing the appearance of a fifth embodiment of the present invention.
100．．．背光模組100. . . Backlight module
1．．．光學組件1. . . Optical component
3．．．光源模組3. . . Light source module
31．．．基板31. . . Substrate
32．．．發光元件32. . . Light-emitting element
5．．．背蓋5. . . Back cover
50．．．段差50. . . Step difference
51．．．本體51. . . Ontology
52．．．承載件52. . . Carrier
53．．．基部53. . . Base
531．．．第一端531. . . First end
532．．．第二端532. . . Second end
533．．．卡合面533. . . Engagement surface
54．．．第一承載部54. . . First carrier
55．．．第二承載部55. . . Second carrier
7．．．框架7. . . frame
70．．．鉤部70. . . Hook
71．．．定位部71. . . Positioning department
72．．．傾斜面72. . . Inclined surface
D1．．．第一方向D1. . . First direction
D2．．．第二方向D2. . . Second direction
D3．．．第三方向D3. . . Third direction
H．．．間距H. . . spacing
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101116964A TWI456314B (en) | 2012-05-11 | 2012-05-11 | Backlight module |
| CN201210321652.6A CN102927497B (en) | 2012-05-11 | 2012-09-03 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101116964A TWI456314B (en) | 2012-05-11 | 2012-05-11 | Backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201346396A true TW201346396A (en) | 2013-11-16 |
| TWI456314B TWI456314B (en) | 2014-10-11 |
Family
ID=47642366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101116964A TWI456314B (en) | 2012-05-11 | 2012-05-11 | Backlight module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102927497B (en) |
| TW (1) | TWI456314B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114779532B (en) * | 2018-12-05 | 2023-09-08 | 友达光电股份有限公司 | Backlight module |
| TWI712842B (en) * | 2019-09-02 | 2020-12-11 | 高雄晶傑達光電科技股份有限公司 | Display module and backlight module thereof |
| CN113970952A (en) * | 2020-07-25 | 2022-01-25 | 神讯电脑(昆山)有限公司 | Electronic device and frame assembly thereof |
| TWI789927B (en) * | 2020-09-29 | 2023-01-11 | 瑞儀光電股份有限公司 | Frame structure, backlight module and display device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201019009A (en) * | 2008-11-10 | 2010-05-16 | Chi Mei Optoelectronics Corp | Backlight module and liquid crystal display using the same |
| CN101936509A (en) * | 2010-09-20 | 2011-01-05 | 友达光电股份有限公司 | Backlight structure and production method thereof |
| CN101956940B (en) * | 2010-10-12 | 2012-12-12 | 友达光电股份有限公司 | Backlight module |
| CN101975361B (en) * | 2010-10-19 | 2015-07-08 | 友达光电股份有限公司 | Side lighting type backlight module |
| TWM410896U (en) * | 2011-01-31 | 2011-09-01 | Chunghwa Picture Tubes Ltd | Backlight module |
| TWM415319U (en) * | 2011-03-28 | 2011-11-01 | Chunghwa Picture Tubes Ltd | Backlight module and liquid crystal display |
| TWI446072B (en) * | 2011-10-05 | 2014-07-21 | Au Optronics Corp | Backlight module |
-
2012
- 2012-05-11 TW TW101116964A patent/TWI456314B/en not_active IP Right Cessation
- 2012-09-03 CN CN201210321652.6A patent/CN102927497B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI456314B (en) | 2014-10-11 |
| CN102927497A (en) | 2013-02-13 |
| CN102927497B (en) | 2014-12-10 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |