TW201343743A - Thermoplastic resin composition for led reflector plates - Google Patents

Thermoplastic resin composition for led reflector plates Download PDF

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TW201343743A
TW201343743A TW102106077A TW102106077A TW201343743A TW 201343743 A TW201343743 A TW 201343743A TW 102106077 A TW102106077 A TW 102106077A TW 102106077 A TW102106077 A TW 102106077A TW 201343743 A TW201343743 A TW 201343743A
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thermoplastic resin
acid
resin composition
polyamide resin
carbon atoms
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TW102106077A
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TWI570173B (en
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Junichi Nakao
Makoto Tamatsushima
Tatsuya Oi
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Toyo Boseki
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/36Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091Scattering means in or on the semiconductor body or semiconductor body package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements

Abstract

The present invention provides a thermoplastic resin composition for LED reflector plates, which contains 3-100 parts by mass of (B) a white pigment and 5-100 parts by mass of (C) a needle-like or fibrous reinforcing material per 100 parts by mass of (A) a thermoplastic resin, and which satisfies [{the refractive index of the thermoplastic resin (A)} - {the refractive index of the reinforcing material (C)} ≥ 0.02]. This thermoplastic resin composition for LED reflector plates has excellent reinforcing effect of the reinforcing material and scarcely inhibits light reflection/scattering effect of the white pigment such as titanium oxide. Consequently, the thermoplastic resin composition for LED reflector plates is effective for luminance enhancement and durability improvement of an LED.

Description

LED反射板用熱可塑性樹脂組成物 Thermoplastic resin composition for LED reflector

本發明係關於一種表面反射率、耐熱變色性等優良,且對於LED之高亮度化為有效的LED反射板用熱可塑性樹脂組成物。 The present invention relates to a thermoplastic resin composition for an LED reflector which is excellent in surface reflectance, heat discoloration resistance, and the like, and which is effective for increasing the luminance of an LED.

近年來LED(發光二極體)係活用低消費電力、壽命長、高亮度、可小型化等之特徵,應用於照明器具、光學元件、行動電話、液晶顯示器用背光、汽車儀表板、信號裝置、顯示板等,但需要更進一步的高亮度化與耐久性。 In recent years, LEDs (light-emitting diodes) are characterized by low power consumption, long life, high brightness, and miniaturization, and are used in lighting fixtures, optical components, mobile phones, backlights for liquid crystal displays, automobile dashboards, and signal devices. , display panels, etc., but need further high brightness and durability.

作為提高LED之亮度的一個方法,有提高LED反射板之光反射特性的方法。為了提升LED反射板的光反射特性,並且提升尺寸穩定性或機械強度,有人提出使聚醯胺等基礎樹脂中含有氧化鈦等之白色顏料與強化材(專利文獻1~3)。 As a method of increasing the brightness of the LED, there is a method of improving the light reflection characteristics of the LED reflector. In order to improve the light reflection characteristics of the LED reflector and to improve dimensional stability or mechanical strength, it has been proposed to contain a white pigment such as titanium oxide and a reinforcing material in a base resin such as polyamine (Patent Documents 1 to 3).

例如,專利文獻1中,係揭露在包含由對苯二甲酸單元100莫耳%組成的二羧酸單元與2-甲基-1,5-五亞甲二胺及六亞甲二胺各別50莫耳%的共聚合聚醯胺中,含有鈦酸鉀纖維或矽灰石與氧化鈦的聚醯胺樹脂組成物。專利文獻2中,係揭露在包含由對苯二甲酸單元100莫耳%組成的二羧酸單元與由1,9-壬二胺單元:2-甲基-1,8辛二胺單元之莫耳比為80:20組成的二胺單元之共聚合聚醯胺中,含有二氧化鈦與硼酸鋁晶鬚或矽酸鈣晶鬚的聚醯胺樹脂組成物。又,在專利文獻3中,係揭露在部分芳香族聚醯胺中含有鈦酸鉀與氧化鈦的聚醯胺樹脂組成物。 For example, in Patent Document 1, it is disclosed that a dicarboxylic acid unit consisting of 100% by mole of terephthalic acid unit and 2-methyl-1,5-pentamethylenediamine and hexamethylenediamine are separately different. 50 mol% of the copolymerized polyamine contains a potassium silicate fiber or a polyamide resin composition of strontite and titanium oxide. Patent Document 2 discloses a dicarboxylic acid unit consisting of 100% by mole of terephthalic acid unit and a unit of 1,9-nonanediamine: 2-methyl-1,8-octanediamine A polyamine resin composition containing titanium dioxide and aluminum borate whisker or calcium silicate whisker in a copolymerized polyamine having an ear ratio of 80:20. Further, Patent Document 3 discloses a polyamine resin composition containing potassium titanate and titanium oxide in a partially aromatic polyamine.

然而,已解:該等樹脂組成物中,用以提升尺寸穩定性或機械強度而摻合的強化材會吸收來自LED發光元件的光或來自氧化鈦等之白色顏料的反射光之一部分,因此阻礙白度或光反射率之提升效果,且成為欲製造更高亮度的LED之際的障礙。 However, it has been explained that in the resin composition, the reinforcing material blended for improving dimensional stability or mechanical strength absorbs light from the LED light-emitting element or a part of the reflected light from white pigment such as titanium oxide, and thus It hinders the improvement of whiteness or light reflectance, and becomes an obstacle to the manufacture of LEDs with higher brightness.

先前技術文獻 Prior technical literature

專利文獻 Patent literature

專利文獻1:日本特開2002-294070號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-294070

專利文獻2:日本特開2004-75994號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-75994

專利文獻3:日本特開2008-182172號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2008-182172

本發明的目的在於提供一種LED反射板用熱可塑性樹脂組成物,不僅作為強化材的補強效果佳,而且幾乎沒有作為新發現的問題之阻礙氧化鈦等之白色顏料的光反射、散射效果之問題,並對於LED之高亮度化與耐久性提升為有效。 An object of the present invention is to provide a thermoplastic resin composition for an LED reflector, which is excellent not only as a reinforcing material but also as a newly discovered problem, which hinders the light reflection and scattering effects of a white pigment such as titanium oxide. It is effective for high brightness and durability improvement of LEDs.

本案發明人為了達成前述目的,藉由白色顏料與強化材系仔細探討不阻礙白色顏料之反射特性的強化材組成之結果,進而完成本發明。 In order to achieve the above object, the inventors of the present invention have completed the present invention by carefully examining the results of the composition of the reinforcing material which does not hinder the reflection characteristics of the white pigment by the white pigment and the reinforcing material.

亦即,本發明係具有以下(1)~(10)的構成。 That is, the present invention has the following configurations (1) to (10).

(1)一種LED反射板用熱可塑性樹脂組成物,其係相對於熱可塑性樹脂(A)100質量份,含有白色顏料(B)3~100質量份、以及針狀或纖維狀的強化材(C)5~100質量份,且滿足下述(i); (i){熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}≧0.02。 (1) A thermoplastic resin composition for an LED reflector comprising 3 to 100 parts by mass of a white pigment (B) and a acicular or fibrous reinforcing material with respect to 100 parts by mass of the thermoplastic resin (A). C) 5 to 100 parts by mass, and satisfying the following (i); (i) {refractive index of thermoplastic resin (A)} - {refractive index of reinforcing material (C)} ≧ 0.02.

(2)如(1)之LED反射板用熱可塑性樹脂組成物,其中,該強化材(C)為鹼性硫酸鎂晶鬚。 (2) The thermoplastic resin composition for an LED reflector according to (1), wherein the reinforcing material (C) is a basic magnesium sulfate whisker.

(3)如(1)或(2)之LED反射板用熱可塑性樹脂組成物,其中,該熱可塑性樹脂(A)為熔點290~350℃的半芳香族聚醯胺樹脂(A1)。 (3) The thermoplastic resin composition for an LED reflector according to (1) or (2), wherein the thermoplastic resin (A) is a semi-aromatic polyamide resin (A1) having a melting point of 290 to 350 °C.

(4)如(3)之LED反射板用熱可塑性樹脂組成物,其中,半芳香族聚醯胺樹脂(A1)含有50莫耳%以上的由碳數2~12的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,並且滿足下述(a)及(b); (a)7.5≦聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數;以及 (b)聚醯胺樹脂中之芳香環上的碳原子數/聚醯胺樹脂中的總碳原子數≦0.35。 (4) A thermoplastic resin composition for an LED reflector according to (3), wherein the semi-aromatic polyamide resin (A1) contains 50 mol% or more of a diamine having a carbon number of 2 to 12 and a p-benzoic acid a constituent unit obtained by equating a molar amount of formic acid, and satisfying the following (a) and (b); (a) 7.5 carbon atoms in the polyamine resin / number of guanamine bonds in the polyamide resin; (b) The number of carbon atoms in the aromatic ring in the polyamide resin / the total number of carbon atoms in the polyamide resin ≦ 0.35.

(5)如(3)或(4)之LED反射板用熱可塑性樹脂組成物,其中,該半芳香族聚醯胺樹脂(A1)含有50莫耳%以上的由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,並滿足下述(a’)及(b’),且熱可塑性樹脂組成物滿足下述(c); (a’)7.5≦聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數≦8.2; (b’)0.28≦聚醯胺樹脂中之芳香環上的碳原子數/聚醯胺樹脂中的總碳原子數≦0.35;以及 (c)存在於源自熱可塑性樹脂組成物之聚醯胺樹脂的最低溫側之DSC熔融峰溫度為300~340℃。 (5) The thermoplastic resin composition for LED reflectors according to (3) or (4), wherein the semi-aromatic polyamide resin (A1) contains 50 mol% or more of carbon number 2 to 8 a constituent unit obtained by equating a molar amount of an amine with terephthalic acid, and satisfying the following (a') and (b'), and the thermoplastic resin composition satisfies the following (c); (a') 7.5 碳 polyamine resin in the number of carbon atoms / polyamine resin in the number of guanamine bonds ≦ 8.2; (b') the number of carbon atoms in the aromatic ring in the 0.28 Å polyamine resin / the total number of carbon atoms in the polyamide resin ≦ 0.35; (c) The DSC melting peak temperature of the lowest temperature side of the polyamide resin derived from the thermoplastic resin composition is 300 to 340 °C.

(6)如(4)或(5)之LED反射板用熱可塑性樹脂組成物,其中,該半芳香族聚醯胺樹脂(A1)係將作為由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元以外的成分的碳數11~18的胺基羧酸或內醯胺中之一種或是多種共聚合而成。 (6) The thermoplastic resin composition for LED reflectors according to (4) or (5), wherein the semi-aromatic polyamide resin (A1) is used as a diamine and a para-benzene having 2 to 8 carbon atoms. One or a mixture of one or more of an aminocarboxylic acid having a carbon number of 11 to 18 or a decylamine having a component other than the constituent unit derived from an equivalent amount of the dicarboxylic acid.

(7)如(3)~(6)中任一項之LED反射板用熱可塑性樹脂組成物,其中,該半芳香族聚醯胺樹脂(A1)係由得自於六亞甲二胺與對苯二甲酸之等量莫耳鹽的構成單元55~75莫耳%與得自於11-胺基十一酸或十一內醯胺的構成單元45~25莫耳%組成。 (7) The thermoplastic resin composition for an LED reflector according to any one of (3) to (6) wherein the semi-aromatic polyamide resin (A1) is derived from hexamethylenediamine and The constituent unit of the equivalent molar salt of terephthalic acid is 55 to 75 mol% and is composed of 45 to 25 mol% of the constituent unit derived from 11-aminoundecanoic acid or undecanoin.

(8)如(1)~(7)中任一項之LED反射板用熱可塑性樹脂組成物,其中,該白色顏料(B)係選自於由氧化鈦、氧化鋅、氧化鋯、氧化錫、氧化鋁、氧化矽、氧化鎂、氧化鈣、氧化銻、氫氧化鈦、氫氧化鋅、氫氧化鋯、氫氧化鋁、氫氧化鎂、氫氧化鉛、硫酸鋇、硫酸鈣、硫化鋅、磷酸鋁、磷酸鈣、碳酸鈣、碳酸鉛、碳酸鋇、及碳酸鎂組成的群組中之至少一種。 (8) The thermoplastic resin composition for an LED reflector according to any one of (1) to (7) wherein the white pigment (B) is selected from the group consisting of titanium oxide, zinc oxide, zirconium oxide, and tin oxide. , alumina, cerium oxide, magnesium oxide, calcium oxide, cerium oxide, titanium hydroxide, zinc hydroxide, zirconium hydroxide, aluminum hydroxide, magnesium hydroxide, lead hydroxide, barium sulfate, calcium sulfate, zinc sulfide, phosphoric acid At least one of the group consisting of aluminum, calcium phosphate, calcium carbonate, lead carbonate, cesium carbonate, and magnesium carbonate.

(9)如(1)~(8)中任一項之LED反射板用熱可塑性樹脂組成物,其中,回焊耐熱溫度為280℃以上。 (9) The thermoplastic resin composition for an LED reflector according to any one of (1) to (8), wherein the reflow heat resistance temperature is 280 ° C or higher.

(10)一種LED反射板用熱可塑性樹脂組成物之製造方法,在製造含有熱可塑性樹脂(A)、白色顏料(B)、以及針狀或纖維狀的強化材(C)的熱可塑性樹脂組成物之際,係以滿足下述(i)的方式選擇熱可塑性樹脂(A)與強化材(C); (i){熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}≧0.02。 (10) A method for producing a thermoplastic resin composition for an LED reflector, comprising: a thermoplastic resin comprising a thermoplastic resin (A), a white pigment (B), and a needle-like or fibrous reinforcing material (C); At the time of the object, the thermoplastic resin (A) and the reinforcing material (C) are selected in such a manner as to satisfy the following (i); (i) {refractive index of thermoplastic resin (A)} - {refractive index of reinforcing material (C)} ≧ 0.02.

由於本發明的LED反射板用熱可塑性樹脂組成物,其強化材的折射率較基礎樹脂的折射率為更低的折射率,所以可抑制來自LED發光元件的光或白色顏料所反射的光由基礎樹脂入射至強化材。其結果為:本發明的LED反射板用熱可塑性樹脂組成物,可提高LED發光元件之光的取出效率。 Since the thermoplastic resin composition for an LED reflector of the present invention has a refractive index lower than that of the base resin, the refractive index of the reinforcing material can be suppressed by light or white pigment reflected from the LED light-emitting element. The base resin is incident on the reinforcing material. As a result, the thermoplastic resin composition for an LED reflector of the present invention can improve the light extraction efficiency of the LED light-emitting element.

又,基礎樹脂為聚醯胺樹脂的情況中,根據強化材的pH為鹼性,可抑制熱變色,且可提供耐久性更佳的LED反射板。 Further, in the case where the base resin is a polyamide resin, the pH of the reinforcing material is alkaline, and thermal discoloration can be suppressed, and an LED reflector having better durability can be provided.

本發明的LED反射板用樹脂組成物係包含熱可塑性樹脂(A)、白色顏料(B)、選自於由纖維狀強化材以及針狀強化材組成的群組中之至少1種的強化材(C)。 The resin composition for an LED reflector according to the present invention comprises a thermoplastic resin (A), a white pigment (B), and at least one selected from the group consisting of a fibrous reinforcing material and a needle-shaped reinforcing material. (C).

本發明所使用的熱可塑性樹脂,可舉出聚醯胺(PA)、聚苯硫醚(PPS)、液晶聚合物(LCP)、芳香族聚醯胺樹脂、聚醚醚酮(PEEK)、聚醚酮(PEK)、聚醚醯亞胺(PEI)、熱可塑性聚醯亞胺、聚醯胺醯亞胺(PAI)、聚醚酮酮(PEKK)、聚苯醚(PPE)、聚醚碸(PES)、聚碸(PSU)、聚芳香酯(PAR)、聚酯(PEs)、聚碳酸酯(PC)、聚甲醛(POM)、聚丙烯(PP)、聚乙烯(PE)、聚甲基戊 烯(TPX)、聚苯乙烯(PS)、聚甲基丙烯酸甲酯、丙烯腈-苯乙烯共聚物(AS)、丙烯腈-丁二烯-苯乙烯共聚物(ABS)、氟樹脂、聚丙烯酸酯等。其中,聚醯胺、聚酯、液晶聚合物、環聚烯烴、對排聚苯乙烯之熔點高,且可適應於表面安裝技術,因而較為理想。其中,聚醯胺、聚酯更佳,聚醯胺特佳。 The thermoplastic resin used in the present invention may, for example, be polyamine (PA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), aromatic polyamide resin, polyether ether ketone (PEEK), or poly Ether ketone (PEK), polyether quinone imine (PEI), thermoplastic polyimine, polyamidimide (PAI), polyether ketone ketone (PEKK), polyphenylene ether (PPE), polyether oxime (PES), polyfluorene (PSU), polyarylate (PAR), polyester (PEs), polycarbonate (PC), polyoxymethylene (POM), polypropylene (PP), polyethylene (PE), polymethyl Ke Alkene (TPX), polystyrene (PS), polymethyl methacrylate, acrylonitrile-styrene copolymer (AS), acrylonitrile-butadiene-styrene copolymer (ABS), fluororesin, polyacrylic acid Ester and the like. Among them, polyamines, polyesters, liquid crystal polymers, cyclic polyolefins, and aligned polystyrene have high melting points and are suitable for surface mounting technology, which is preferable. Among them, polyamine and polyester are better, and polyamine is especially preferred.

本發明所使用的聚醯胺樹脂,並沒有特別限定,但在LED反射板用途中,因為希望儘可能為高熔點且耐熱性佳,所以半芳香族聚醯胺、半脂環族聚醯胺、或是該等之聚醯胺的共聚合聚醯胺、該等之聚醯胺的混摻物較為理想,在成形易度、處理性、省能源等之方面,熔點為290~350℃左右較為實用。 The polyamine resin used in the present invention is not particularly limited, but in the use of an LED reflector, since it is desirable to have a high melting point and heat resistance as much as possible, a semi-aromatic polyamine or a semi-alicyclic polyamine Or the copolymerized polyamine of the polyamines, and the blend of the polyamines, and the melting point is about 290 to 350 ° C in terms of ease of formation, handleability, energy saving, and the like. More practical.

作為半芳香族聚醯胺(A1),可舉出6T系聚醯胺(例如,由對苯二甲酸/間苯二甲酸/六亞甲二胺構成的聚醯胺6T6I、由對苯二甲酸/己二酸/六亞甲二胺構成的聚醯胺6T66、由對苯二甲酸/間苯二甲酸/己二酸/六亞甲二胺構成的聚醯胺6T6I66、由對苯二甲酸/六亞甲二胺/2-甲基-1,5-五亞甲二胺構成的聚醯胺6T/M-5T、由對苯二甲酸/六亞甲二胺/ε-己內醯胺構成的聚醯胺6T6、由對苯二甲酸/六亞甲二胺/四亞甲二胺構成的聚醯胺6T/4T)、9T系聚醯胺(對苯二甲酸/1,9-壬二胺/2-甲基-1,8-辛二胺)、10T系聚醯胺(對苯二甲酸/1,10-癸二胺)、12T系聚醯胺(對苯二甲酸/1,12-十二烷二胺)、由癸二酸/對二甲苯二胺構成的聚醯胺等。 Examples of the semi-aromatic polyamine (A1) include 6T polyamine (for example, polyamine 6T6I composed of terephthalic acid/isophthalic acid/hexamethylenediamine, and terephthalic acid. Polyamide 6T66 consisting of adipic acid/hexamethylenediamine, polyamine 6T6I66 consisting of terephthalic acid/isophthalic acid/adipic acid/hexamethylenediamine, from terephthalic acid/ Polyamine 6T/M-5T composed of hexamethylenediamine/2-methyl-1,5-pentamethylenediamine, composed of terephthalic acid/hexamethylenediamine/ε-caprolactam Polyamide 6T6, polyamine 6T/4T composed of terephthalic acid/hexamethylenediamine/tetramethylenediamine, 9T polyamine (terephthalic acid/1,9-壬2) Amine/2-methyl-1,8-octanediamine), 10T polyamine (terephthalic acid/1,10-decanediamine), 12T polyamine (terephthalic acid/1,12) - dodecanediamine), polydecylamine composed of azelaic acid/p-xylenediamine, and the like.

作為半脂環族聚醯胺,例如,可舉出由1,4-環己烷二羧酸/六亞甲二胺構成的聚醯胺、由1,4-環己烷二羧酸/1,9-壬二胺/2-甲基-1,8-辛二胺構成的聚醯胺、由1,4-環己烷二羧酸/1,10-癸二胺構成的聚醯胺等。 Examples of the semialicyclic polyamines include polyamines composed of 1,4-cyclohexanedicarboxylic acid/hexamethylenediamine and 1,4-cyclohexanedicarboxylic acid/1. a polydecylamine composed of 9-nonanediamine/2-methyl-1,8-octanediamine, a polyamine composed of 1,4-cyclohexanedicarboxylic acid/1,10-decanediamine, and the like .

該等聚醯胺樹脂之中,在可實現高熔點、低吸水性以外尚可實現優異的耐UV性方面,下述的半芳香族聚醯胺樹脂(A1)較為理想。 Among the above-mentioned polyamide resins, the above-mentioned semi-aromatic polyamide resin (A1) is preferable in that it can achieve excellent UV resistance in addition to high melting point and low water absorption.

該半芳香族聚醯胺樹脂(A1)含有50莫耳%以上的由碳數2~12的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,並且滿足下述(a)及(b)較理想。 The semi-aromatic polyamide resin (A1) contains 50 mol% or more of a constituent unit obtained from an equivalent amount of a molar amount of a diamine having 2 to 12 carbon atoms and terephthalic acid, and satisfies the following (a). And (b) is ideal.

(a)7.5≦聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數 (a) 7.5 碳 Polyamine resin in the number of carbon atoms / the number of guanamine bonds in the polyamide resin

(b)聚醯胺樹脂中之芳香環上的碳原子數/聚醯胺樹脂中的總碳原子數≦0.35 (b) The number of carbon atoms in the aromatic ring in the polyamide resin / the total number of carbon atoms in the polyamide resin ≦ 0.35

再者,該半芳香族聚醯胺樹脂(A1)含有50莫耳%以上的由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,並滿足下述(a’)及(b’),且熱可塑性樹脂組成物也滿足下述(c)較為理想。 Further, the semi-aromatic polyamide resin (A1) contains 50 mol% or more of a constituent unit derived from an equivalent amount of a molar amount of a diamine having 2 to 8 carbon atoms and terephthalic acid, and satisfies the following (a') and (b'), and the thermoplastic resin composition also satisfies the following (c).

(a’)7.5≦聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數≦8.2 (a') Number of carbon atoms in 7.5 ≦ polyamine resin / number of guanamine bonds in polyamide resin ≦ 8.2

(b’)0.28≦聚醯胺樹脂中之芳香環上的碳原子數/聚醯胺樹脂中的總碳原子數≦0.35 (b') The number of carbon atoms in the aromatic ring in the 0.28 ≦polyamine resin / the total number of carbon atoms in the polyamide resin ≦0.35

(c)存在於源自熱可塑性樹脂組成物之聚醯胺樹脂(A)的最低溫側之DSC熔融峰溫度為300~340℃ (c) The DSC melting peak temperature of the lowest temperature side of the polyamidamide resin (A) derived from the thermoplastic resin composition is 300 to 340 ° C

半芳香族聚醯胺樹脂(A1)中之碳數2~12的二胺成分,可舉出1,2-乙二胺、1,3-三亞甲二胺、1,4-四亞甲二胺、1,5-五亞甲二胺、2-甲基-1,5-五亞甲二胺、1,6-六亞甲二胺、1,7-七亞甲二胺、1,8-八亞甲二胺、1、9-九亞甲二胺、2-甲基-1,8-辛二胺、1,10-癸二胺、1,11-十一烷二胺、1,12-十二烷二胺,該等可單獨使用或是使用多種。當由碳數2~12的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元小於50莫耳%時,結晶性、力學物性會下降,較不理想。 The diamine component having 2 to 12 carbon atoms in the semi-aromatic polyamide resin (A1) may, for example, be 1,2-ethylenediamine, 1,3-trimethylenediamine or 1,4-tetramethylene. Amine, 1,5-pentamethylenediamine, 2-methyl-1,5-pentamethylenediamine, 1,6-hexamethylenediamine, 1,7-heptethylenediamine, 1,8 - octamethyldiamine, 1,9-non-methylenediamine, 2-methyl-1,8-octanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1, 12-dodecanediamine, these may be used singly or in combination. When the constituent unit obtained from the equivalent molar amount of the diamine having 2 to 12 carbon atoms and the terephthalic acid is less than 50 mol%, the crystallinity and mechanical properties are lowered, which is not preferable.

然而,為由得自於碳數為9以上的二胺與對苯二甲酸之等量莫耳鹽的構成單元構成的半芳香族聚醯胺之情況中,因為有時在300℃以下具有熔點,所以含有50莫耳%以上的由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,且在最低溫側之熔點為300℃以上的聚醯胺樹脂較為理想。 However, in the case of a semi-aromatic polyamine which is composed of a constituent unit derived from an equivalent amount of a molar amount of a diamine having a carbon number of 9 or more and terephthalic acid, it may have a melting point at 300 ° C or lower. Therefore, it contains 50 mol% or more of a constituent unit derived from an equivalent amount of a molar amount of a diamine having 2 to 8 carbon atoms and terephthalic acid, and a polyamine resin having a melting point of 300 ° C or higher on the lowest temperature side. More ideal.

在半芳香族聚醯胺樹脂(A1)中,於構成單元中50%莫耳以下可共聚合其他的成分。作為可共聚合的二胺成分,可舉出如1,13-十三烷二胺、1,16-十六烷二胺、1,18-十八烷二胺、2,2,4(或是2,4,4)-三甲基六亞甲二胺之類的脂肪族二胺、如二氮陸圜、環己烷二胺、雙(3-甲基-4-胺己基)甲烷、雙-(4,4’-胺基環己基)甲烷、異佛爾酮二胺之類的脂環式二胺、間二甲苯二胺、對二甲苯二胺、對苯二胺、間苯二胺等之芳香族二胺及該等之氫化物等。 In the semi-aromatic polyamide resin (A1), other components may be copolymerized in an amount of 50% by mole or less in the constituent unit. Examples of the copolymerizable diamine component include 1,13-tridecanediamine, 1,16-hexadecanediamine, 1,18-octadecanediamine, 2,2,4 (or Is an aliphatic diamine such as 2,4,4)-trimethylhexamethylenediamine, such as diazonium, cyclohexanediamine, bis(3-methyl-4-aminohexyl)methane, An alicyclic diamine such as bis-(4,4'-aminocyclohexyl)methane or isophorone diamine, m-xylylenediamine, p-xylenediamine, p-phenylenediamine, isophthalic acid An aromatic diamine such as an amine or a hydride or the like.

作為可共聚合的酸成分,可舉出間苯二甲酸、鄰苯二甲酸、1,5-萘二羧酸、2,6-萘二羧酸、4,4’-二苯基二羧酸、2,2’-二苯基二羧酸、4,4’-二苯醚二羧酸、5-磺酸鈉間苯二甲酸、5-羥基間苯二甲酸等之芳香族二羧酸、富馬酸、馬來酸、琥珀酸、衣康酸、己二酸、壬二酸、癸二酸、1,11-十一烷二酸、1,12-十二烷二酸、1,14-十四烷二酸、1,18-十八烷二酸、1,4-環己烷二羧酸、1,3-環己烷二羧酸、1,2-環己烷二羧酸、4-甲基-1,2-環己烷二羧酸、二聚酸等之脂肪族或脂環族二羧酸等。又,可舉出ε-己內醯胺、11-胺基十一酸、十一內醯胺、12-胺基十二烷酸、12-月桂內醯胺等之內醯胺及該等開環後的結構之胺基羧酸等。 Examples of the copolymerizable acid component include isophthalic acid, phthalic acid, 1,5-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, and 4,4'-diphenyldicarboxylic acid. An aromatic dicarboxylic acid such as 2,2'-diphenyldicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, sodium 5-sulfonate isophthalic acid or 5-hydroxyisophthalic acid, Fumaric acid, maleic acid, succinic acid, itaconic acid, adipic acid, azelaic acid, sebacic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,14 -tetradecanedioic acid, 1,18-octadecanedioic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, An aliphatic or alicyclic dicarboxylic acid such as 4-methyl-1,2-cyclohexanedicarboxylic acid or a dimer acid. Further, examples thereof include decylamine such as ε-caprolactam, 11-aminoundecanoic acid, eleven meglumine, 12-aminododecanoic acid, and 12-laurol decylamine, and the like. Aminocarboxylic acid or the like of the structure after the ring.

其中,作為共聚合成分,宜將碳數10~18的二胺、二羧酸、胺基羧酸或內醯胺中之一種或是多種共聚合較為理想。更佳為將碳數11~18的胺基羧酸或內醯胺中之一種或是多種共聚合較為理想。 Among them, as the copolymerization component, it is preferred to copolymerize one or more of a diamine having a carbon number of 10 to 18, a dicarboxylic acid, an aminocarboxylic acid or an indoleamine. More preferably, it is preferred to copolymerize one or more of an aminocarboxylic acid having a carbon number of 11 to 18 or an indoleamine.

共聚合成分由二羧酸與二胺構成時,根據其組合,熔點會成為小於300℃,因而較不理想。碳數11~18的胺基羧酸或內醯胺,具有調整熔點以及升溫結晶化溫度並提升成形性的作用、減低吸水率且改善吸水時之物性變化或尺寸變化導致的事故之作用、以及藉由導入可撓性的骨架改善熔融時之流動性的作用。 When the copolymerization component is composed of a dicarboxylic acid and a diamine, the melting point becomes less than 300 ° C depending on the combination, which is not preferable. An aminocarboxylic acid or an indoleamine having a carbon number of 11 to 18, which has an effect of adjusting a melting point, raising a temperature of crystallization, and improving formability, reducing water absorption, and improving an accident caused by a change in physical properties or dimensional change upon water absorption, and The effect of fluidity at the time of melting is improved by introducing a flexible skeleton.

本發明的半芳香族聚醯胺樹脂(A1)滿足7.5≦[聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數]較為理想。(以下有時將[聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數]簡稱為醯胺鍵間的平均碳原子數。) The semi-aromatic polyamide resin (A1) of the present invention preferably satisfies 7.5 Å [the number of carbon atoms in the polyamide resin/the number of guanamine bonds in the polyamide resin). (The following is a case where [the number of carbon atoms in the polyamide resin/the number of guanamine bonds in the polyamide resin] is simply referred to as the average number of carbon atoms between the guanamine bonds.)

當[聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數]小於7.5時,因為吸水性變得過高,所以有時會於之後的回焊步驟中產生發泡,而且容易因熱或光而變色。另一方面,在LED的封裝中於反射器密封矽酮樹脂或環氧樹脂時,矽酮樹脂或環氧樹脂之反應活性點會減少,且密合性會下降,並有使LED封裝體之可靠性大幅下降的情況,因此[聚醯胺樹脂中的碳原子 數/聚醯胺樹脂中的醯胺鍵數]滿足8.2以下更為理想。 When [the number of carbon atoms in the polyamine resin/the number of guanamine bonds in the polyamide resin] is less than 7.5, since the water absorbability becomes too high, foaming may occur in the subsequent reflow step. Moreover, it is easy to change color due to heat or light. On the other hand, when the ketone resin or epoxy resin is sealed in the reflector of the LED, the reaction point of the fluorenone resin or the epoxy resin is reduced, and the adhesion is lowered, and the LED package is made. Reliability is greatly reduced, so [carbon atoms in polyamine resin It is more preferable that the number of guanamine bonds in the number/polyamide resin is 8.2 or less.

再者,本發明的半芳香族聚醯胺樹脂(A1)滿足[聚醯胺樹脂中的芳香環上之碳原子數/聚醯胺樹脂中的全碳原子數]≦0.35較為理想。(以下有時將[聚醯胺樹脂中的芳香環上之碳原子數/聚醯胺樹脂中的總碳原子數]簡稱為芳香環上之碳原子比率。) Further, the semi-aromatic polyamide resin (A1) of the present invention satisfies [the number of carbon atoms in the aromatic ring in the polyamine resin/the total number of carbon atoms in the polyamide resin] ≦ 0.35. (The following is a case where [the number of carbon atoms in the aromatic ring in the polyamine resin/the total number of carbon atoms in the polyamide resin] is simply referred to as the carbon atom ratio on the aromatic ring.)

在照明或汽車內外裝用的LED反射器中,不僅連續地接受到由LED晶片發射的光,而且在屋外使用之際接受到紫外線,因此材料需要高耐UV性。當[聚醯胺樹脂中的芳香環上之碳原子數/聚醯胺樹脂中的總碳原子數]超過0.35時,特別是在紫外線區域的光之吸收會變大,且其光導致的聚醯胺樹脂之劣化係為顯著。又,存在有芳香環時,聚醯胺樹脂因劣化而容易形成成為變色之主因的共軛結構且展現顯著的變色。因此,聚醯胺樹脂中的芳香環濃度低者較為理想。另一方面,從達成耐熱性或高熔點的目的,聚醯胺樹脂中的[芳香環上之碳原子數/聚醯胺樹脂中的總碳原子數]滿足0.28以上更為理想。 In the LED reflector for illumination or automotive interior and exterior, not only the light emitted by the LED chip is continuously received, but also ultraviolet rays are received when used outdoors, so the material needs high UV resistance. When [the number of carbon atoms in the aromatic ring in the polyamine resin/the total number of carbon atoms in the polyamine resin] exceeds 0.35, the absorption of light particularly in the ultraviolet region becomes large, and the light-induced aggregation The deterioration of the guanamine resin is remarkable. Further, when an aromatic ring is present, the polyamide resin is likely to form a conjugated structure which is a main cause of discoloration due to deterioration, and exhibits remarkable discoloration. Therefore, the concentration of the aromatic ring in the polyamide resin is preferably low. On the other hand, from the viewpoint of achieving heat resistance or high melting point, it is more preferable that the number of carbon atoms in the aromatic ring/the total number of carbon atoms in the polyamide resin is 0.28 or more in the polyamide resin.

本發明中的半芳香族聚醯胺樹脂(A1),特佳為由六亞甲二胺/對苯二甲酸/11-胺基十一酸(十一內醯胺)、六亞甲二胺/對苯二甲酸/12-胺基十二烷酸(12-月桂內醯胺)、癸二胺/對苯二甲酸/11-胺基十一酸(十一內醯胺)、癸二胺/對苯二甲酸/12-胺基十二烷酸(12-月桂內醯胺)構成的聚醯胺。其中,從高熔點的觀點,作為由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,在具有得自於六亞甲二胺與對苯二甲酸之等量莫耳鹽的構成單元時,除了實現高耐熱性、流動性、低吸水性以外,為了實現更優異的成形性,由該構成單元55~75莫耳%與得自於11-胺基十一酸或十一內醯胺的構成單元45~25莫耳%組成的共聚合聚醯胺樹脂較為理想。 The semi-aromatic polyamide resin (A1) in the present invention is particularly preferably composed of hexamethylenediamine/terephthalic acid/11-aminoundecanoic acid (undeceneamine) or hexamethylenediamine. /terephthalic acid/12-aminododecanoic acid (12-lauryl decylamine), guanidine diamine/terephthalic acid/11-aminoundecanoic acid (undeceneamine), guanidine diamine Polydecylamine composed of terephthalic acid/12-aminododecanoic acid (12-lauryl decylamine). Among them, from the viewpoint of high melting point, a constituent unit derived from an equivalent amount of a molar salt of a diamine having a carbon number of 2 to 8 and terephthalic acid has a derived from hexamethylenediamine and terephthalic acid. In the case of a constituent unit of the same amount of the molar salt, in addition to achieving high heat resistance, fluidity, and low water absorbability, in order to achieve more excellent formability, the constituent unit 55 to 75 mol% and the 11-amino group. A copolymerized polyamine resin having a composition of 45 to 25 mol% of the constituent units of undecanoic acid or eleven indoleamine is preferred.

該半芳香族聚醯胺樹脂(A1)具有以下特徵:不僅大幅改良作為以往的6T系聚醯胺(例如,由對苯二甲酸/間苯二甲酸/六亞甲二胺構成的聚醯胺6T6I、由對苯二甲酸/己二酸/六亞甲二胺構成的聚醯胺6T66、由對苯二甲酸 /間苯二甲酸/己二酸/六亞甲二胺構成的聚醯胺6T6I66、由對苯二甲酸/六亞甲二胺/2-甲基-1,5-五亞甲二胺構成的聚醯胺6T/M-5T、由對苯二甲酸/六亞甲二胺/ε-己內醯胺構成的聚醯胺6T6)之缺點的高吸水性,且也高度滿足LED反射板所需要的耐熱性或表面反射率。再者,因為具有來自於聚醯胺11成分之可撓性的長鏈脂肪骨架,所以也具有容易確保流動性的特徵。 The semi-aromatic polyamide resin (A1) is characterized in that it is not only greatly improved as a conventional 6T-based polyamine (for example, polyamine composed of terephthalic acid/isophthalic acid/hexamethylenediamine). 6T6I, polyamine 6T66 consisting of terephthalic acid/adipic acid/hexamethylenediamine, from terephthalic acid / Polyamido 6T6I66 composed of isophthalic acid / adipic acid / hexamethylenediamine, composed of terephthalic acid / hexamethylenediamine/2-methyl-1,5-pentamethylenediamine Polyacetamide 6T/M-5T, polyacetamide 6T6 consisting of terephthalic acid / hexamethylenediamine / ε-caprolactam, high water absorption, and also highly meet the needs of LED reflectors Heat resistance or surface reflectance. Further, since it has a long-chain fat skeleton derived from the flexibility of the polyamide 11 component, it is also characterized in that fluidity is easily secured.

相當於藉由使六亞甲二胺(6)與對苯二甲酸(T)以等量莫耳進行共縮聚合而得到的6T聚醯胺之成分(以下為6T),具體而言為下述式(I)所示者。 Corresponding to a component of 6T polydecylamine obtained by co-condensation polymerization of hexamethylenediamine (6) and terephthalic acid (T) by an equivalent amount of Mo (hereinafter, 6T), specifically, The one shown in the formula (I).

上述6T成分為半芳香族聚醯胺樹脂(A1)的主成分,且具有對半芳香族聚醯胺樹脂(A1)賦予優異的耐熱性、機械特性等之作用。半芳香族聚醯胺樹脂(A1)中的6T成分之摻合比例,較佳為55~75莫耳%,更佳為60~70莫耳%,特佳為62~68莫耳%。6T成分的摻合比例小於上述下限時,作為結晶成分的6T聚醯胺會因共聚合成分而受到結晶阻礙,且有造成成形性或高溫特性之下降的可能。另一方面,超過上述上限時,有熔點變得過高且於加工時進行分解的可能,較不理想。 The 6T component is a main component of the semi-aromatic polyamide resin (A1), and has an effect of imparting excellent heat resistance, mechanical properties, and the like to the semi-aromatic polyamide resin (A1). The blending ratio of the 6T component in the semi-aromatic polyamide resin (A1) is preferably 55 to 75 mol%, more preferably 60 to 70 mol%, and particularly preferably 62 to 68 mol%. When the blending ratio of the 6T component is less than the above lower limit, the 6T polyamine which is a crystal component may be inhibited by the crystal due to the copolymerization component, and may have a decrease in formability or high-temperature characteristics. On the other hand, when the above upper limit is exceeded, the melting point may become too high and decomposition may occur during processing, which is not preferable.

藉由使11-胺基十一酸或十一內醯胺進行聚縮合而得到的11聚醯胺成分(以下為11NY),具體而言為下述式(II)所示者。 The 11-polyamide component (hereinafter referred to as 11NY) obtained by polycondensing 11-aminoundecanoic acid or undecanoin, specifically, is represented by the following formula (II).

11NY成分係為用以改良作為6T成分的缺點之吸水性、流動性者,具有調整半芳香族聚醯胺樹脂(A1)之熔點以及升溫結晶化溫度並提升成形性的作用、減低吸水率且改善吸水時之物性變化或尺寸變化導致的事故之作用、以及藉由導入可撓性的骨架改善熔融時之流動性的作用。半芳香族聚醯胺樹脂(A1)中的11NY成分之摻合比例,較佳為45~25莫耳%,更佳為40~30莫耳%,特佳為38~32莫耳%。11NY成分的摻合比例小於上述下限時,半芳香族聚醯胺樹脂(A1)的熔點沒有充分地下降,且有成形性不足的可能,同時會使得到的樹脂之吸水率減低的效果不充分,並於吸水時有造成機械特性下降等物性之不穩定的可能。超過上述上限時,半芳香族聚醯胺樹脂(A1)的熔點會過度下降且結晶化速度變慢,並有成形性反而變差的可能,同時6T成分的量變少,且有機械特性或耐熱性不足的可能,較不理想。 The 11NY component is a water-absorbent property and fluidity for improving the disadvantage of the 6T component, and has a function of adjusting the melting point of the semi-aromatic polyamide resin (A1) and raising the temperature of crystallization to improve the formability, and to reduce the water absorption rate. The effect of an accident caused by a change in physical properties or a change in size at the time of water absorption, and an effect of improving the fluidity at the time of melting by introducing a flexible skeleton. The blending ratio of the 11NY component in the semi-aromatic polyamide resin (A1) is preferably 45 to 25 mol%, more preferably 40 to 30 mol%, and particularly preferably 38 to 32 mol%. When the blending ratio of the 11NY component is less than the above lower limit, the melting point of the semi-aromatic polyamide resin (A1) is not sufficiently lowered, and the formability is insufficient, and the effect of reducing the water absorption rate of the obtained resin is insufficient. And when it absorbs water, it may cause instability of physical properties such as a decrease in mechanical properties. When the above upper limit is exceeded, the melting point of the semi-aromatic polyamide resin (A1) may be excessively lowered and the crystallization rate may be slow, and the formability may be deteriorated, and the amount of the 6T component may be small, and mechanical properties or heat resistance may be obtained. The possibility of sexual deficiencies is less than ideal.

本發明的LED反射板用熱可塑性樹脂組成物,其熱可塑性樹脂(A)為半芳香族聚醯胺樹脂(A1)時,在DSC測定中,存在於源自聚醯胺樹脂的最低溫側之DSC熔融峰溫度(雙峰值的情況中為低溫側的熔融峰溫度),亦即低溫側熔點(Tm)為290~350℃較佳。Tm更佳為300~340℃,特佳為310~340℃。Tm超過上述上限時,因為在將本發明的熱可塑性樹脂組成物予以射出成形之際需要的加工溫度變得極高,所以於加工時熱可塑性樹脂組成物會分解,且有得不到目的之物性或外觀的情況。反之,Tm小於上述下限時,結晶化速度會變慢,有成形全都變困難的情況,再者,有造成焊接耐熱性之下降的可能。當Tm為310~340℃時,係滿足280℃的回焊耐熱性,且也可適應於金/錫共晶焊接步驟,因而較為理想。作為熔點的測定方法,在鋁製皿(TA Instruments公司製、零件編號900793.901)上計量於105℃ 減壓乾燥15小時後的聚醯胺樹脂10mg,以鋁製蓋(TA Instruments公司製、零件編號900794.901)使其成為密封狀態,並製備測定試料後,使用微差掃描熱量計DSCQ100(TA INSTRUMENTS製),自室溫以20℃/分進行升溫,在350℃保持3分鐘後將測定試料皿取出,浸泡至液態氮,使其急速冷卻。之後,自液態氮取出樣本,於室溫放置30分鐘後,再度使用微差掃描熱量計DSCQ100(TA INSTRUMENTS製),自室溫以20℃/分進行升溫,並於350℃保持3分鐘。此時,係將熔解導致的吸熱之峰值溫度作為熔點(Tm)。 The thermoplastic resin composition for an LED reflector of the present invention, wherein the thermoplastic resin (A) is a semi-aromatic polyamide resin (A1), is present in the DSC measurement from the lowest temperature side of the polyamide resin. The DSC melting peak temperature (the melting peak temperature on the low temperature side in the case of double peak), that is, the low temperature side melting point (Tm) is preferably 290 to 350 °C. The Tm is preferably 300 to 340 ° C, and particularly preferably 310 to 340 ° C. When Tm exceeds the above upper limit, the processing temperature required for the injection molding of the thermoplastic resin composition of the present invention is extremely high, so that the thermoplastic resin composition is decomposed during processing, and the purpose is not obtained. Physical condition or appearance. On the other hand, when Tm is less than the above lower limit, the crystallization rate becomes slow, and it may become difficult to form all of them. Further, there is a possibility that the solder heat resistance may be lowered. When the Tm is 310 to 340 ° C, it is suitable for the reflow heat resistance of 280 ° C, and can also be adapted to the gold/tin eutectic soldering step, which is preferable. As a method of measuring the melting point, it was measured at 105 ° C in an aluminum dish (manufactured by TA Instruments, part number 900793.901). 10 mg of the polyamide resin after drying for 15 hours under reduced pressure was sealed with aluminum (manufactured by TA Instruments, part number 900794.901), and a measurement sample was prepared, and then a differential scanning calorimeter DSCQ100 (manufactured by TA INSTRUMENTS) was used. The temperature was raised from room temperature at 20 ° C / min, and after holding at 350 ° C for 3 minutes, the test sample was taken out, immersed in liquid nitrogen, and rapidly cooled. Thereafter, the sample was taken out from liquid nitrogen, and after standing at room temperature for 30 minutes, the differential scanning calorimeter DSCQ100 (manufactured by TA INSTRUMENTS) was again used, and the temperature was raised from room temperature at 20 ° C /min, and held at 350 ° C for 3 minutes. At this time, the peak temperature of the endotherm caused by the melting is taken as the melting point (Tm).

本發明中的半芳香族聚醯胺樹脂(A1),由於將得自於碳數2~8的二胺與對苯二甲酸之等量莫耳鹽的構成單元作為主成分,同時將醯胺鍵濃度與芳香環濃度設定為特定的範圍,故除了高熔點或成形性以外,低吸水性或流動性之平衡也佳,而且耐光性也優異。因此,由該半芳香族聚醯胺樹脂(A1)得到的本發明之LED反射板用熱可塑性樹脂組成物,在表面安裝型LED的反射板之成形中,除了為300℃以上之高熔點、低吸水以外,也可能為薄壁、高週轉的成形。 In the semi-aromatic polyamine resin (A1) of the present invention, a constituent unit derived from an equivalent amount of a molar salt of a diamine having a carbon number of 2 to 8 and terephthalic acid is used as a main component, and a guanamine is simultaneously used. Since the bond concentration and the aromatic ring concentration are set to a specific range, in addition to the high melting point or formability, the balance between low water absorption and fluidity is also good, and the light resistance is also excellent. Therefore, the thermoplastic resin composition for LED reflecting sheets of the present invention obtained from the semi-aromatic polyamide resin (A1) has a high melting point of 300 ° C or higher in the formation of the reflecting plate of the surface mount type LED. In addition to low water absorption, it may also be a thin-walled, high-turn forming.

半芳香族聚醯胺樹脂(A1)亦可將得自於上述碳數2~8的二胺與對苯二甲酸之等量莫耳鹽的構成單元、或是得自於上述碳數10~18的二胺、二羧酸、胺基羧酸或內醯胺中之一種或多種之構成單元以外的胺基羧酸或是內醯胺的構成單元以最多20莫耳%予以共聚合。 The semi-aromatic polyamide resin (A1) may also be a constituent unit derived from the same amount of the molar salt of the diamine having 2 to 8 carbon atoms and terephthalic acid, or obtained from the above carbon number 10~ The constituent unit of the aminocarboxylic acid or the indoleamine other than the constituent unit of one or more of the diamine, the dicarboxylic acid, the aminocarboxylic acid or the indoleamine of 18 is copolymerized at a maximum of 20 mol%.

在製造半芳香族聚醯胺樹脂(A1)之際,作為使用的觸媒,可舉出磷酸、亞磷酸、次亞磷酸或是其金屬鹽或銨鹽、酯。作為金屬鹽的金屬,具體而言,可舉出鉀、鈉、鎂、釩、鈣、鋅、鈷、錳、錫、鎢、鍺、鈦、銻等。做為酯,可添加乙酯、異丙酯、丁酯、己酯、異癸酯、十八酯、癸酯、硬脂醯酯、苯酯等。又,從熔融滯留穩定性提升之觀點,添加氫氧化鈉、氫氧化鉀、氫氧化鎂、氧化鎂等之鹼化合物較為理想。 In the production of the semi-aromatic polyamide resin (A1), phosphoric acid, phosphorous acid, hypophosphorous acid or a metal salt or an ammonium salt or an ester thereof may be mentioned as a catalyst to be used. Specific examples of the metal of the metal salt include potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, rhenium, titanium, ruthenium and the like. As the ester, ethyl ester, isopropyl ester, butyl ester, hexyl ester, isodecyl ester, stearyl ester, decyl ester, stearyl ester, phenyl ester or the like can be added. Further, from the viewpoint of improving the melt retention stability, an alkali compound such as sodium hydroxide, potassium hydroxide, magnesium hydroxide or magnesium oxide is preferably added.

半芳香族聚醯胺樹脂(A1)在96%濃硫酸中於20℃測得的相對黏度(RV)為0.4~4.0較佳,更佳為1.0~3.0,特佳為1.5~2.5。使聚醯胺的相對黏度成 為一定範圍的方法,可舉出調整分子量的方法。 The relative viscosity (RV) of the semi-aromatic polyamide resin (A1) measured at 20 ° C in 96% concentrated sulfuric acid is preferably 0.4 to 4.0, more preferably 1.0 to 3.0, and particularly preferably 1.5 to 2.5. Making the relative viscosity of polyamine into A method of adjusting the molecular weight is mentioned as a method of a certain range.

半芳香族聚醯胺樹脂(A1),可藉由調整胺基量與羧基之莫耳比並進行聚縮合的方法、或添加末端封鎖劑的方法調整聚醯胺的末端基量及分子量。在使胺基量與羧基之莫耳比以一定比率進行聚縮合的情況中,將使用的總二胺與總二羧酸之莫耳比調整為二胺/二羧酸=1.00/1.05至1.10/1.00的範圍較為理想。 The semi-aromatic polyamide resin (A1) can adjust the terminal group amount and molecular weight of the polyamide by adjusting the molar ratio of the amine group to the molar ratio of the carboxyl group and performing polycondensation or by adding a terminal blocking agent. In the case where the molar ratio of the amine group to the molar ratio of the carboxyl group is polycondensed at a certain ratio, the molar ratio of the total diamine to the total dicarboxylic acid used is adjusted to diamine/dicarboxylic acid = 1.00/1.05 to 1.10. The range of /1.00 is ideal.

作為添加末端封鎖劑的時期,可舉出原料加入時、聚合起始時、聚合後期、或聚合結束時。作為末端封鎖劑,只要為具有與聚醯胺末端之胺基或羧基之反應性的單官能性化合物,則沒有特別限制,可使用單羧酸或單胺、鄰苯二甲酸酐等之酸酐、單異氰酸酯、單酸鹵化物、單酯類、單醇類等。作為末端封止劑,例如,可舉出乙酸、丙酸、丁酸、戊酸、己酸、辛酸、月桂酸、十三酸、肉豆蔻酸、棕櫚酸、硬脂酸、三甲基乙酸、異丁酸等之脂肪族單羧酸、環己烷羧酸等之脂環式單羧酸、苯甲酸、甲苯甲酸、α-萘羧酸、β-萘羧酸、甲基萘羧酸、苯乙酸等之芳香族單羧酸、馬來酸酐、鄰苯二甲酸酐、六氫鄰苯二甲酸酐等之酸酐、甲胺、乙胺、丙胺、丁胺、己胺、辛胺、癸胺、硬脂胺、二甲胺、二乙胺、二丙胺、二丁胺等之脂肪族單胺、環己胺、二環己胺等之脂環式單胺;苯胺、甲苯胺、二苯胺、萘胺等之芳香族單胺等。 The period at which the terminal blocking agent is added may be, for example, when the raw material is added, at the time of starting the polymerization, at the later stage of the polymerization, or at the end of the polymerization. The terminal blocking agent is not particularly limited as long as it is a monofunctional compound having reactivity with an amine group or a carboxyl group at the terminal of polyamine, and an acid anhydride such as a monocarboxylic acid, a monoamine or a phthalic anhydride can be used. Monoisocyanates, monoacid halides, monoesters, monoalcohols, and the like. Examples of the terminal blocking agent include acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, and trimethylacetic acid. Aliphatic monocarboxylic acid such as isobutyric acid, alicyclic monocarboxylic acid such as cyclohexanecarboxylic acid, benzoic acid, toluic acid, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, benzene An anhydride such as acetic acid or the like, an aromatic acid such as maleic anhydride, phthalic anhydride or hexahydrophthalic anhydride, methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine or decylamine. An alicyclic monoamine such as stearylamine, dimethylamine, diethylamine, dipropylamine or dibutylamine, an alicyclic monoamine such as cyclohexylamine or dicyclohexylamine; aniline, toluidine, diphenylamine, naphthalene An aromatic monoamine such as an amine.

作為半芳香族聚醯胺樹脂(A1)的酸價及胺價,各別為0~200eq/ton、0~100eq/ton較為理想。當末端官能基超過200eq/ton時,不僅會於熔融滯留時促進膠化或劣化,而且在使用環境下也會引起著色或水解等之問題。另一方面,在混合玻璃纖維或馬來酸變性聚烯烴等之反應性化合物之際,配合反應性及反應基,使酸價及/或胺價成為5~100eq/ton較為理想。 The acid value and the amine value of the semi-aromatic polyamide resin (A1) are preferably from 0 to 200 eq/ton and from 0 to 100 eq/ton. When the terminal functional group exceeds 200 eq/ton, not only gelation or deterioration is promoted at the time of melt retention, but also problems such as coloring or hydrolysis are caused in the use environment. On the other hand, when a reactive compound such as a glass fiber or a maleic acid-denatured polyolefin is mixed, it is preferred to blend the reactivity and the reactive group to have an acid value and/or an amine price of 5 to 100 eq/ton.

半芳香族聚醯胺樹脂(A1)可藉由以往公知的方法製造,例如,藉由使原料單體進行共縮合反應而可輕易地合成。共縮聚合反應的順序並沒有特別限定,可使全部的原料單體全部一起反應,亦可使一部分的原料單體先反 應,接著使殘餘的原料單體反應。又,聚合方法並沒有特別限定,可在連續的步驟中由原料加入進展至聚合物製作,亦可使用先製作寡聚物後,在別的步驟藉由擠製機等進行聚合,或者將寡聚物利用固相聚合予以高分子量化等之方法。藉由調整原料單體之加入比率,可控制合成的共聚合聚醯胺中的各構成單元之比例。 The semi-aromatic polyamide resin (A1) can be produced by a conventionally known method, and can be easily synthesized, for example, by subjecting a raw material monomer to a co-condensation reaction. The order of the co-condensation polymerization reaction is not particularly limited, and all of the raw material monomers may be all reacted together, or a part of the raw material monomers may be reversed. Should, the residual starting monomer is then reacted. Further, the polymerization method is not particularly limited, and the addition of the raw material may be progressed to the production of the polymer in a continuous step, or the oligomer may be first produced, or the polymerization may be carried out by an extruder or the like in another step, or the oligomer may be used. The method of polymerizing a polymer by solid phase polymerization. The ratio of each constituent unit in the synthesized copolymerized polyamine can be controlled by adjusting the addition ratio of the raw material monomers.

本發明所使用的聚酯樹脂,可將作為酸成分之對苯二甲酸、間苯二甲酸、鄰苯二甲酸、1,5-萘二羧酸、2,6-萘二羧酸、4,4’-二苯基二羧酸、2,2’-二苯基二羧酸、4,4’-二苯醚二羧酸等之芳香族二質子酸、琥珀酸、富馬酸、馬來酸、己二酸、壬二酸、癸二酸、十二烷二酸、1,4-環己烷二羧酸、1,3-環己烷二羧酸、1,2-環己烷二羧酸、4-甲基-1,2-環己烷二羧酸、二聚酸等之脂肪族或脂環族二質子酸、偏苯三甲酸、均苯四酸、二苯甲酮四羧酸、乙二醇雙(苯偏三酸酐)、丙三醇參(苯偏三酸酐)等之多質子酸共聚合。該等之中,為了得到具有耐熱性或目的之熔點的聚酯,使用對苯二甲酸、萘二羧酸、間苯二甲酸、鄰苯二甲酸、1,4-環己烷二羧酸、4,4’-二苯基二羧酸更為理想。 The polyester resin used in the present invention may be terephthalic acid, isophthalic acid, phthalic acid, 1,5-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, 4 as an acid component. Aromatic diprotonic acid such as 4'-diphenyldicarboxylic acid, 2,2'-diphenyldicarboxylic acid or 4,4'-diphenyl ether dicarboxylic acid, succinic acid, fumaric acid, and Malay Acid, adipic acid, sebacic acid, sebacic acid, dodecanedioic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexane Aliphatic or alicyclic diprotonic acid, trimellitic acid, pyromellitic acid, benzophenone tetracarboxylate, such as carboxylic acid, 4-methyl-1,2-cyclohexanedicarboxylic acid, dimer acid, etc. Multi-protonic acid copolymerization of acid, ethylene glycol bis(benzene trimellitic anhydride), glycerol ginseng (benzene trimellitic anhydride), and the like. Among these, in order to obtain a polyester having heat resistance or a melting point of interest, terephthalic acid, naphthalene dicarboxylic acid, isophthalic acid, phthalic acid, 1,4-cyclohexanedicarboxylic acid, 4,4'-diphenyldicarboxylic acid is more desirable.

又,作為二醇成分,並沒有特別限制,可共聚合乙二醇、二乙二醇、丙二醇、1,3-丙二醇、2-甲基-1,3-丙二醇、1,2-丁二醇、1,3-丁二醇、1,5-戊二醇、1,6-己二醇、3-甲基-1,5-戊二醇、新戊二醇、二丙二醇、2,2,4-三甲基-1,5-戊二醇、新戊基羥基三甲基乙酸酯、雙酚A的氧乙烯加成物及氧丙烯加成物、氫化雙酚A的氧乙烯加成物及氧丙烯加成物、1,9-壬二醇、2-甲基辛二醇、1,10-癸二醇、2-丁基-2-乙基-1,3-丙二醇、1,4-環己烷二甲醇、三環癸烷二甲醇、聚碳酸酯二醇、甘油、三羥甲基丙烷、季戊四醇、二羥甲基丁酸、二羥甲基丙酸等。該等之中,為了得到具有耐熱性或目的之熔點的聚酯,使用乙二醇、二乙二醇、1,3-丙二醇、1,4-丁二醇、1,6-己二醇、1,4-環己烷二甲醇、新戊二醇較為理想。 Further, the diol component is not particularly limited, and ethylene glycol, diethylene glycol, propylene glycol, 1,3-propanediol, 2-methyl-1,3-propanediol, and 1,2-butanediol may be copolymerized. , 1,3-butanediol, 1,5-pentanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, neopentyl glycol, dipropylene glycol, 2, 2, 4-Trimethyl-1,5-pentanediol, neopentylhydroxytrimethylacetate, oxyethylene adduct of bisphenol A and oxypropylene adduct, oxyethylene addition of hydrogenated bisphenol A And oxypropylene adduct, 1,9-nonanediol, 2-methyloctanediol, 1,10-nonanediol, 2-butyl-2-ethyl-1,3-propanediol, 1, 4-cyclohexanedimethanol, tricyclodecane dimethanol, polycarbonate diol, glycerin, trimethylolpropane, pentaerythritol, dimethylolbutanoic acid, dimethylolpropionic acid, and the like. Among these, in order to obtain a polyester having heat resistance or a melting point of interest, ethylene glycol, diethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, Preferably, 1,4-cyclohexanedimethanol or neopentyl glycol is preferred.

特別是作為LED反射板用樹脂使用的情況中,從回焊耐熱的觀點,熔點為290℃以上較為理想,作為樹脂組成,將對苯二甲酸/1,4-環己烷二甲 醇、萘二羧酸/任意的二醇、二苯基二羧酸/任意的二醇作為主成分者較為理想,對苯二甲酸/1,4-環己烷二甲醇更為理想。 In particular, when it is used as a resin for an LED reflector, it is preferable that the melting point is 290 ° C or more from the viewpoint of reflow heat resistance, and terephthalic acid / 1,4-cyclohexane is preferred as a resin composition. An alcohol, a naphthalene dicarboxylic acid/arbitrary diol, a diphenyldicarboxylic acid/arbitrary diol is preferable as the main component, and terephthalic acid/1,4-cyclohexanedimethanol is more preferable.

熱可塑性樹脂(A),在本發明的熱可塑性樹脂組成物中以25~90質量%的比例存在較為理想,更佳為40~75質量%。當熱可塑性樹脂(A)比例小於上述下限時,機械強度會變低,當超過上述上限時,白色顏料(B)或強化材(C)的摻合量不足,變得難以得到所需的效果。 The thermoplastic resin (A) is preferably present in the thermoplastic resin composition of the present invention in an amount of from 25 to 90% by mass, more preferably from 40 to 75% by mass. When the proportion of the thermoplastic resin (A) is less than the above lower limit, the mechanical strength becomes low, and when it exceeds the above upper limit, the blending amount of the white pigment (B) or the reinforcing material (C) is insufficient, and it becomes difficult to obtain a desired effect. .

白色顏料(B)為用以提高反射板的表面反射率而摻合者,作為白色顏料(B)係選自於由氧化鈦、氧化鋅、氧化鋯、氧化錫、氧化鋁、氧化矽、氧化鎂、氧化鈣、氧化銻、氫氧化鈦、氫氧化鋅、氫氧化鋯、氫氧化鋁、氫氧化鎂、氫氧化鉛、硫酸鋇、硫酸鈣、硫化鋅、磷酸鋁、磷酸鈣、碳酸鈣、碳酸鉛、碳酸鋇、及碳酸鎂組成的群組中之至少一種。白色顏料(B),其折射率較基礎樹脂的折射率更高較為理想。在該等白色顏料之中,於折射率高,穩定且可廉價地取得的方面,氧化鈦較為理想。 The white pigment (B) is blended to increase the surface reflectance of the reflecting plate, and the white pigment (B) is selected from the group consisting of titanium oxide, zinc oxide, zirconium oxide, tin oxide, aluminum oxide, cerium oxide, and oxidation. Magnesium, calcium oxide, barium oxide, titanium hydroxide, zinc hydroxide, zirconium hydroxide, aluminum hydroxide, magnesium hydroxide, lead hydroxide, barium sulfate, calcium sulfate, zinc sulfide, aluminum phosphate, calcium phosphate, calcium carbonate, At least one of the group consisting of lead carbonate, cesium carbonate, and magnesium carbonate. The white pigment (B) preferably has a refractive index higher than that of the base resin. Among these white pigments, titanium oxide is preferred because it has a high refractive index, is stable, and can be obtained at low cost.

作為氧化鈦,例如,可舉出利用硫酸法或氯法製作之金紅石型及銳鈦礦型的二氧化鈦(TiO2)、一氧化鈦(TiO)、三酸化二鈦(Ti2O3)等,且特宜使用金紅石型的二氧化鈦(TiO2)。氧化鈦的平均粒徑,一般為0.05~2.0μm,較佳為0.15~0.5μm的範圍,可使用1種,亦可組合具有不同粒徑的氧化鈦而使用。氧化鈦成分濃度為90%以上,較佳為95%以上,更佳為97%以上。又,氧化鈦可使用經二氧化矽、氧化鋁、氧化鋅、氧化鋯等之金屬氧化物、偶合劑、有機酸、有機多元醇、矽氧烷等施以表面處理者。 Examples of the titanium oxide include rutile-type and anatase-type titanium oxide (TiO 2 ), titanium oxide (TiO), and titanated titanium (Ti 2 O 3 ) produced by a sulfuric acid method or a chlorine method. It is particularly preferable to use rutile-type titanium oxide (TiO 2 ). The average particle diameter of the titanium oxide is generally 0.05 to 2.0 μm, preferably 0.15 to 0.5 μm, and one type may be used, or titanium oxide having a different particle diameter may be used in combination. The concentration of the titanium oxide component is 90% or more, preferably 95% or more, and more preferably 97% or more. Further, the titanium oxide may be subjected to surface treatment using a metal oxide such as cerium oxide, aluminum oxide, zinc oxide or zirconium oxide, a coupling agent, an organic acid, an organic polyol, a decane or the like.

白色顏料(B)的比例,相對於熱可塑性樹脂(A)100質量份為3~100質量份,較佳為10~70質量份。當白色顏料(B)的比例小於上述下限時,表面反射率會下降,當超過上述上限時,有物性之大幅的下降或流動性下降等之成形加工性下降的可能。 The ratio of the white pigment (B) is from 3 to 100 parts by mass, preferably from 10 to 70 parts by mass, per 100 parts by mass of the thermoplastic resin (A). When the ratio of the white pigment (B) is less than the above lower limit, the surface reflectance is lowered, and when it exceeds the above upper limit, there is a possibility that the workability such as a large drop in physical properties or a decrease in fluidity may be lowered.

作為針狀或纖維狀的強化材(C),只要是折射率比起基礎樹脂的熱可塑 性樹脂(A)之折射率低了0.02以上者即可,沒有特別限定,可因應基礎樹脂的折射率而使用以往公知的強化材。{熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}為0.03以上較為理想。 As a acicular or fibrous reinforcing material (C), as long as it is a thermoplastic resin with a refractive index higher than that of the base resin The refractive index of the resin (A) is not particularly limited as long as it is less than 0.02, and a conventionally known reinforcing material can be used depending on the refractive index of the base resin. {Refractive index of thermoplastic resin (A)} - {Refractive index of reinforcing material (C)} is preferably 0.03 or more.

作為針狀強化材,例如,可舉出鈦酸鉀晶鬚、硼酸鋁晶鬚、氧化鋅晶鬚、碳酸鈣晶鬚、鹼性硫酸鎂晶鬚、矽灰石等。使用選自於纖維狀強化材以及針狀強化材中之至少1種。作為纖維狀強化材,例如,可舉出玻璃纖維、碳纖維、硼纖維、陶瓷纖維、金屬纖維等,作為玻璃纖維,可使用具有0.1mm~100mm之長度的切股或連續單絲纖維。玻璃纖維的剖面形狀,可使用圓形剖面以及非圓形剖面的玻璃纖維。圓形剖面玻璃纖維的直徑為20μm以下,較佳為15μm以下,更佳為10μm以下。又,根據物性面或流動性,非圓形剖面的玻璃纖維較為理想。作為非圓形剖面的玻璃纖維,也包括相對於纖維長的長度方向成垂直的剖面為略橢圓形、略長圓形、略繭形者,且扁平度為1.5~8較為理想。在此之扁平度係假定外接在垂直於玻璃纖維的長邊方向之剖面的最小面積的長方形,並將該長方形的長邊之長度作為長徑,將短邊的長度作為短徑時的長徑/短徑之比。玻璃纖維的厚度並沒有特別限定,但短徑為1~20μm,長徑為2~100μm左右。又,玻璃纖維宜使用成為纖維束,且切割為纖維長1~20mm左右的切股狀者。 Examples of the needle-shaped reinforcing material include potassium titanate whiskers, aluminum borate whiskers, zinc oxide whiskers, calcium carbonate whiskers, basic magnesium sulfate whiskers, and apatite. At least one selected from the group consisting of a fibrous reinforcing material and a needle-shaped reinforcing material is used. Examples of the fibrous reinforcing material include glass fibers, carbon fibers, boron fibers, ceramic fibers, and metal fibers. As the glass fibers, diced or continuous monofilament fibers having a length of 0.1 mm to 100 mm can be used. For the cross-sectional shape of the glass fiber, a circular cross section and a glass fiber having a non-circular cross section can be used. The diameter of the circular cross section glass fiber is 20 μm or less, preferably 15 μm or less, more preferably 10 μm or less. Further, glass fibers having a non-circular cross section are preferred depending on the physical surface or fluidity. The glass fiber having a non-circular cross section also includes a cross section perpendicular to the longitudinal direction of the fiber length, which is slightly elliptical, slightly rounded, and slightly rounded, and preferably has a flatness of 1.5 to 8. Here, the flatness is assumed to be a rectangle having a minimum area perpendicular to the cross section perpendicular to the longitudinal direction of the glass fiber, and the length of the long side of the rectangle is taken as the long diameter, and the length of the short side is taken as the long diameter of the short diameter. / Short diameter ratio. The thickness of the glass fiber is not particularly limited, but the short diameter is 1 to 20 μm and the long diameter is about 2 to 100 μm. Further, it is preferable to use a fiber bundle as a fiber bundle and cut into a strand having a fiber length of about 1 to 20 mm.

一般而言,熱可塑性樹脂的折射率為1.35~1.74左右,當考慮到可作為強化材使用的物質之折射率時,{熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}為0.4以下較佳。強化材(C)的折射率為1.70以下較佳,1.65以下更佳,1.60以下特佳,1.54以下最佳。 In general, the refractive index of the thermoplastic resin is about 1.35 to 1.74, and when considering the refractive index of a substance which can be used as a reinforcing material, {the refractive index of the thermoplastic resin (A)}-{the reinforcing material (C) The refractive index} is preferably 0.4 or less. The refractive index of the reinforcing material (C) is preferably 1.70 or less, more preferably 1.65 or less, particularly preferably 1.60 or less, and most preferably 1.54 or less.

作為熱可塑性樹脂(A),使用上述的半芳香族聚醯胺樹脂或聚酯樹脂時,為了滿足上述折射率之差,強化材(C)的折射率為1.54以下較佳。 When the semi-aromatic polyamide resin or the polyester resin described above is used as the thermoplastic resin (A), the refractive index of the reinforcing member (C) is preferably 1.54 or less in order to satisfy the difference in refractive index.

在上述強化材之中,鹼性硫酸鎂晶鬚,其折射率較低,且容易取得與基礎樹脂的折射率之差,因此特別理想。其中,至少表面具有鹼性者,其抑制聚醯胺樹脂之熱變色的傾向高,較為理想。 Among the above-mentioned reinforcing materials, basic magnesium sulfate whiskers have a low refractive index and are easy to obtain a difference in refractive index from the base resin, which is particularly preferable. Among them, at least the surface is alkaline, and it is preferable to suppress the thermal discoloration of the polyamide resin.

針狀或纖維狀之強化材(C)的比例,相對於熱可塑性樹脂(A)100質量份為5~100質量份,較佳為10~60質量份。當強化材(C)的比例小於上述下限 時,成形品之機械強度會下降,當超過上述上限時,表面反射率、成形加工性有下降的傾向。 The ratio of the acicular or fibrous reinforcing material (C) is 5 to 100 parts by mass, preferably 10 to 60 parts by mass, per 100 parts by mass of the thermoplastic resin (A). When the proportion of the reinforcing material (C) is less than the above lower limit When the mechanical strength of the molded article is lowered, the surface reflectance and the formability tend to decrease when the upper limit is exceeded.

在不損及本發明的效果之範圍,因應其目的可包含非纖維狀或非針狀填充材。作為非纖維狀或非針狀填充材,依不同目的可舉出強化用填料或導電性填料、磁性填料、阻燃填料、熱傳導填料、熱黃變抑制用填料等,具體而言,可舉出玻璃珠、玻璃碎片、玻璃氣球、二氧化矽、滑石、高嶺土、雲母、氧化鋁、水滑石、蒙脫土、石墨、奈米碳管、富勒烯、氧化銦、氧化錫、氧化鐵、氧化鎂、氫氧化鋁、氫氧化鎂、氫氧化鈣、紅磷、碳酸鈣、鈦酸鋯酸鉛、鈦酸鋇、氮化鋁、氮化硼、硼酸鋅、硫酸鋇、及非針狀的矽灰石、鈦酸鉀、硼酸鋁、硫酸鎂、氧化鋅、碳酸鈣等。該等填充劑不僅可單獨使用1種,且亦可組合多種而使用。該等之中,滑石可使升溫時結晶化溫度(Tc1)下降並使成形性提升,因此較為理想。填充材的添加量,只要選擇最適當的量即可,但相對於熱可塑性樹脂(A)100質量份,最大可添加50質量份,而從樹脂組成物的機械強度之觀點,0.1~20質量份較佳,更佳為1~10質量份。又,纖維狀強化材、填充材,為了提升與熱可塑性樹脂之親和性,可使用經有機處理或偶合劑處理者,或者在熔融合成時與偶合劑並用較為理想,作為偶合劑,亦可使用矽烷系偶合劑、鈦酸酯系偶合劑、鋁系偶合劑中之任一者,但其中尤以胺基矽烷偶合劑、環氧矽烷偶合劑最為理想。 Non-fibrous or non-needle fillers may be included for the purpose thereof without departing from the scope of the effects of the present invention. Examples of the non-fibrous or non-needle-shaped filler include reinforcing fillers, conductive fillers, magnetic fillers, flame-retardant fillers, heat-conductive fillers, and fillers for suppressing thermal yellowing, and specific examples thereof. Glass beads, glass cullet, glass balloon, cerium oxide, talc, kaolin, mica, alumina, hydrotalcite, montmorillonite, graphite, carbon nanotubes, fullerenes, indium oxide, tin oxide, iron oxide, oxidation Magnesium, aluminum hydroxide, magnesium hydroxide, calcium hydroxide, red phosphorus, calcium carbonate, lead zirconate titanate, barium titanate, aluminum nitride, boron nitride, zinc borate, barium sulfate, and non-acicular bismuth Gray stone, potassium titanate, aluminum borate, magnesium sulfate, zinc oxide, calcium carbonate, and the like. These fillers may be used alone or in combination of two or more. Among these, talc is preferable because the crystallization temperature (Tc1) at the time of temperature rise is lowered and the formability is improved. The amount of the filler to be added may be selected in an optimum amount, but may be added up to 50 parts by mass based on 100 parts by mass of the thermoplastic resin (A), and from 0.1 to 20% from the viewpoint of mechanical strength of the resin composition. Preferably, it is preferably 1 to 10 parts by mass. Further, in order to improve the affinity with the thermoplastic resin, the fibrous reinforcing material or the filler may be used by an organic treatment or a coupling agent, or may be used in combination with a coupling agent during melt synthesis, and may be used as a coupling agent. Any one of a decane coupling agent, a titanate coupling agent, and an aluminum coupling agent, among which an amino decane coupling agent and an epoxy decane coupling agent are particularly preferable.

在本發明的LED反射板用熱可塑性樹脂組成物中,可使用以往的LED反射板用熱可塑性樹脂組成物之各種添加劑。作為添加劑,可舉出穩定劑、衝擊改良材、阻燃劑、脫模劑、滑動性改良材、著色劑、可塑劑、結晶核劑、與熱可塑性樹脂(A)不同的樹脂等。 In the thermoplastic resin composition for an LED reflector of the present invention, various additives of a thermoplastic resin composition for a conventional LED reflector can be used. Examples of the additive include a stabilizer, an impact-improving material, a flame retardant, a mold release agent, a slidability-improving material, a colorant, a plasticizer, a crystal nucleating agent, and a resin different from the thermoplastic resin (A).

作為穩定劑,可舉出受阻酚系抗氧化劑、硫系抗氧化劑、磷系抗氧化劑等之有機系抗氧化劑或熱穩定劑、受阻胺系、二苯甲酮系、咪唑系等之光穩定劑或紫外線吸收劑、金屬鈍化劑等。作為聚醯胺用穩定劑的銅化合物,可使用氯化銅(I)、溴化銅(I)、碘化銅(I)、氯化銅(II)、溴化銅(II)、碘化 銅(II)、磷酸銅(II)、焦磷酸銅(II)、硫化銅、硝酸銅、乙酸銅等之有機羧酸的銅鹽等。再者,作為銅化合物以外的構成成分,包含鹵化鹼金屬化合物較為理想,作為鹵化鹼金屬化合物,可舉出氯化鋰、溴化鋰、碘化鋰、氟化鈉、氯化鈉、溴化鈉、碘化鈉、氟化鉀、氯化鉀、溴化鉀、碘化鉀等。該等添加劑不僅可單獨使用1種,且亦可組合多種而使用。穩定劑的添加量,只要選擇最適當的量即可,但相對於熱可塑性樹脂(A)100質量份,最大可添加5質量份。 Examples of the stabilizer include organic antioxidants such as hindered phenol-based antioxidants, sulfur-based antioxidants, and phosphorus-based antioxidants, and heat stabilizers, hindered amine-based, benzophenone-based, and imidazole-based light stabilizers. Or UV absorbers, metal passivators, etc. As the copper compound for the stabilizer for polyamine, copper (I) chloride, copper (I) bromide, copper (I) iodide, copper (II) chloride, copper (II) bromide, iodide can be used. a copper salt of an organic carboxylic acid such as copper (II), copper (II) phosphate, copper (II) pyrophosphate, copper sulfide, copper nitrate or copper acetate. Further, as a constituent component other than the copper compound, a halogenated alkali metal compound is preferable, and examples of the halogenated alkali metal compound include lithium chloride, lithium bromide, lithium iodide, sodium fluoride, sodium chloride, and sodium bromide. Sodium iodide, potassium fluoride, potassium chloride, potassium bromide, potassium iodide, and the like. These additives may be used alone or in combination of two or more. The amount of the stabilizer to be added may be selected in an optimum amount, but may be added in an amount of up to 5 parts by mass based on 100 parts by mass of the thermoplastic resin (A).

作為衝擊改良劑,可舉出乙烯-丙烯橡膠(EPM)、乙烯-丙烯-二烯橡膠(EPDM)、乙烯-丙烯酸共聚物、乙烯-丙烯酸酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸酯共聚物、乙烯乙酸乙烯共聚物等之聚烯烴系樹脂、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)、苯乙烯-異戊二烯-苯乙烯共聚物(SIS)、丙烯酸酯共聚物等之乙烯聚合物系樹脂、將聚對苯二甲酸丁二酯或聚萘二甲酸丁二酯作為硬鏈段並將聚四亞甲基二醇或聚己內酯、或是聚碳酸酯二醇作為軟鏈段而得的聚酯嵌段共聚物、聚醯胺彈性體、胺基甲酸酯彈性體、丙烯酸酯彈性體、矽橡膠、氟系橡膠、由不同的2種聚合物構成之具有核殼結構的聚合物粒子等。衝擊改良劑的添加量,只要選擇最適當的量即可,但相對於熱可塑性樹脂(A)100質量份,最大可添加30質量份。 Examples of the impact modifier include ethylene-propylene rubber (EPM), ethylene-propylene-diene rubber (EPDM), ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, ethylene-methacrylic acid copolymer, and ethylene. Polyolefin resin such as methacrylate copolymer, ethylene vinyl acetate copolymer, styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butylene-styrene block copolymer (SEBS), ethylene polymer resin such as styrene-isoprene-styrene copolymer (SIS), acrylate copolymer, etc., using polybutylene terephthalate or polybutylene naphthalate as Polyester block copolymer, polyamidamide elastomer, urethane obtained by hard segment and polytetramethylene glycol or polycaprolactone, or polycarbonate diol as soft segment An elastomer, an acrylate elastomer, a ruthenium rubber, a fluorine-based rubber, a polymer particle having a core-shell structure composed of two different polymers, and the like. The amount of the impact modifier to be added may be selected in an optimum amount, but may be added up to 30 parts by mass based on 100 parts by mass of the thermoplastic resin (A).

作為阻燃劑,可組合鹵系阻燃劑與阻燃助劑,作為鹵系阻燃劑,可列舉溴化聚苯乙烯、溴化聚苯醚、溴化雙酚型環氧系聚合體、溴化苯乙烯馬來酸酐聚合體、溴化環氧樹脂、溴化苯氧樹脂、十溴二苯醚、十溴聯苯、溴化聚碳酸酯、全氯環十五烷以及溴化交聯芳香族聚合體等較佳,作為阻燃助劑,可舉出三氧化銻、五氧化銻、銻酸鈉、錫酸鋅、硼酸鋅、蒙脫土等之層狀矽酸鹽、氟系聚合物、矽酮等。其中,從熱穩定性的方面,作為鹵系阻燃劑之二溴聚苯乙烯,與作為阻燃助劑之三氧化銻、銻酸鈉、錫酸鋅中之任一者組合較佳。又,作為非鹵系阻燃劑,可舉出三聚氰胺三聚氰酸酯、紅磷、次膦酸之金屬鹽、含氮磷酸系的化合物。特別是次膦酸金屬鹽與含氮磷酸系化合物之組合較佳,作為含氮磷酸系化合物,係包含如三 聚氰胺、或蜜白胺、三聚二氰亞胺之類的三聚氰胺之縮合物與聚磷酸的反應性生物或是該等的混合物。其他的阻燃劑、阻燃助劑,在使用該等阻燃劑之際,係添加水滑石系化合物或鹼化合物防止模具等之金屬腐蝕較為理想。阻燃劑的添加量,只要選擇最適當的量即可,但相對於熱可塑性樹脂(A)100質量份,最大可添加50質量份。 As the flame retardant, a halogen-based flame retardant and a flame retardant auxiliary agent can be combined, and examples of the halogen-based flame retardant include brominated polystyrene, brominated polyphenylene ether, and brominated bisphenol epoxy polymer. Brominated styrene maleic anhydride polymer, brominated epoxy resin, brominated phenoxy resin, decabromodiphenyl ether, decabromobiphenyl, brominated polycarbonate, perchlorocyclopentadecane and brominated crosslink An aromatic polymer or the like is preferable, and examples of the flame retardant auxiliary agent include layered niobate such as antimony trioxide, antimony pentoxide, sodium antimonate, zinc stannate, zinc borate, and montmorillonite, and fluorine polymerization. Things, fluorenone and the like. Among them, from the viewpoint of thermal stability, dibromopolystyrene as a halogen-based flame retardant is preferably combined with any of antimony trioxide, sodium citrate, and zinc stannate as a flame retardant auxiliary. Further, examples of the non-halogen flame retardant include melamine cyanurate, red phosphorus, a metal salt of phosphinic acid, and a nitrogen-containing phosphate-based compound. In particular, a combination of a metal phosphinate and a nitrogen-containing phosphate compound is preferred, and as a nitrogen-containing phosphate compound, A reactive organism of melamine, or a melamine condensate such as melam, a trimeric dicyandiamide, and a polyphosphoric acid or a mixture thereof. When a flame retardant or a flame retardant auxiliary agent is used, it is preferable to add a hydrotalcite-based compound or an alkali compound to prevent metal corrosion such as a mold. The amount of the flame retardant to be added is not particularly limited, and may be added in an amount of up to 50 parts by mass based on 100 parts by mass of the thermoplastic resin (A).

作為脫模劑,可舉出長鏈脂肪酸或其酯或是金屬鹽、醯胺系化合物、聚乙烯蠟、矽酮、聚氧乙烯等。作為長鏈脂肪酸,特別是碳數12以上較佳,例如,可舉出硬脂酸、12-羥基硬脂酸、二十二酸、二十八酸等,部分或全部的羧酸可利用單二醇或聚二醇予以酯化,或者亦可形成金屬鹽。作為醯胺系化合物,可舉出伸乙基雙對苯二甲醯胺、亞甲基雙硬脂醯胺等。該等脫模劑可單獨使用或是作為混合物使用。脫模劑的添加量,只要選擇最適當的量即可,但相對於熱可塑性樹脂(A)100質量份,最大可添加5質量份。 The release agent may, for example, be a long-chain fatty acid or an ester thereof, or a metal salt, a guanamine-based compound, a polyethylene wax, an anthrone or a polyoxyethylene. The long-chain fatty acid is preferably a carbon number of 12 or more, and examples thereof include stearic acid, 12-hydroxystearic acid, behenic acid, and octadecanoic acid, and some or all of the carboxylic acid may be used alone. The diol or polyglycol is esterified or a metal salt can also be formed. Examples of the guanamine-based compound include ethyl bis-p-xylyleneamine and methylenebisstearylamine. These release agents may be used singly or as a mixture. The amount of the release agent to be added may be selected in an optimum amount, but may be added in an amount of up to 5 parts by mass based on 100 parts by mass of the thermoplastic resin (A).

本發明的LED反射板用熱可塑性樹脂組成物,可藉由將上述之各構成成分利用以往公知的方法摻合而製造。例如,可舉出在熱可塑性樹脂(A)之聚縮合反應時添加各成分,或將熱可塑性樹脂(A)與其他成分進行乾式混摻,或是使用雙軸螺桿型之擠製機,將各構成成分予以熔融混練的方法。 The thermoplastic resin composition for an LED reflector of the present invention can be produced by blending each of the above-described constituent components by a conventionally known method. For example, a component may be added during the polycondensation reaction of the thermoplastic resin (A), or the thermoplastic resin (A) may be dry-blended with other components, or a twin-screw type extrusion machine may be used. A method in which each component is melted and kneaded.

實施例 Example

以下根據實施例更進一步具體地說明本發明,但本發明並沒有限定於該等實施例。再者,實施例所記載測定值係藉由以下的方法測定。 The present invention will be further specifically described below based on examples, but the present invention is not limited to the examples. Further, the measured values described in the examples were measured by the following methods.

(1)折射率 (1) Refractive index

熱可塑性樹脂的折射率,對於未拉伸的薄膜,係依據JIS K-7142的A法,將鈉D線(波長589nm)作為光源,使用阿貝折射計4形(Atago(股)製)進行測定。此時,接觸液係使用1-溴萘,並於溫度23℃、相對濕度65%的條件下進行測定。 The refractive index of the thermoplastic resin is based on the A method of JIS K-7142, and the sodium D line (wavelength: 589 nm) is used as a light source, and an Abbe refractometer type 4 (manufactured by Atago Co., Ltd.) is used for the unstretched film. Determination. At this time, the contact liquid was measured using 1-bromonaphthalene under the conditions of a temperature of 23 ° C and a relative humidity of 65%.

強化材的折射率係依據JIS K-7142的B法(貝克線法),將鈉D線(波長589nm)作為光源,並於溫度23℃、相對濕度65%的條件下進行測定。又, 有文獻值者、以及測定有困難者係根據文獻值。 The refractive index of the reinforcing material was measured in accordance with the B method (Becker method) of JIS K-7142, using a sodium D line (wavelength: 589 nm) as a light source, and measuring at a temperature of 23 ° C and a relative humidity of 65%. also, Those who have literature values and who have difficulty in measuring are based on literature values.

(2)擴散反射率以及其保持率 (2) Diffusion reflectivity and its retention rate

使用東芝機械製射出成形機EC-100,缸筒溫度設定為樹脂的熔點+20℃,模具溫度設定為140℃,射出成形縱100mm、橫100mm、厚度2mm的平板,製作評價用試驗片。使用該試驗片,在日立製作所製的自動記錄分光光度計「U3500」設置同公司製的積分球,測定350nm至800nm之波長的反射率。在反射率的比較中,係求出460nm、600nm之波長的擴散反射率。又,在耐熱變色性的評價中,測定於烘箱、170℃處理2小時後的樣本之擴散反射率。再者,記載含有各強化材之評價用試驗片的擴散反射率相對於未含有強化材的情況中之評價用試驗片的擴散反射率之比率作為保持率(%)。 Toshiba mechanical injection molding machine EC-100 was used, the cylinder temperature was set to the melting point of the resin + 20 ° C, the mold temperature was set to 140 ° C, and a flat plate having a longitudinal direction of 100 mm, a width of 100 mm, and a thickness of 2 mm was injection-molded, and a test piece for evaluation was produced. Using the test piece, an integrating sphere made by the company was placed in an automatic recording spectrophotometer "U3500" manufactured by Hitachi, Ltd., and the reflectance at a wavelength of 350 nm to 800 nm was measured. In the comparison of the reflectances, the diffuse reflectances at wavelengths of 460 nm and 600 nm were obtained. Further, in the evaluation of the heat-resistant discoloration property, the diffusion reflectance of the sample after being treated at 170 ° C for 2 hours in an oven was measured. In addition, the ratio of the diffuse reflectance of the test piece containing the evaluation of each reinforcing material to the diffuse reflectance of the test piece for evaluation in the case where the reinforcing material is not contained is described as the retention ratio (%).

(3)彎曲特性、熱變形溫度 (3) Bending characteristics, heat distortion temperature

實施例、比較例的圓粒係依照ISO 294-1,射出成形試驗片並進行物性評價。物性評價的方法如下所述。 The pellets of the examples and the comparative examples were subjected to injection molding test pieces according to ISO 294-1, and physical properties were evaluated. The method of physical property evaluation is as follows.

彎曲特性…ISO 178 Bending properties...ISO 178

熱變形溫度(荷重1.8MPa)…ISO 75-1 Heat distortion temperature (load 1.8MPa)...ISO 75-1

(4)焊接耐熱性 (4) Solder heat resistance

使用東芝機械製射出成形機EC-100,缸筒溫度設定為樹脂的熔點+20℃,模具溫度設定為140℃,射出成形長度127mm、寬12.6mm、厚度0.8mmt的UL燃燒試驗用試片,製作試驗片。試驗片係放置於85℃、85%RH(相對濕度)的氣體環境中72小時。使試驗片在空氣回流爐中(Eightech製AIS-20-82C),花費60秒鐘從室溫升溫至150℃,進行預備加熱後,以0.5℃/分的升溫速度實施預熱直到190℃。之後,以100℃/分的速度升溫至所定的設定溫度,在所定的溫度保持10秒鐘後,進行冷卻。使設定溫度從240℃以5℃的間距增加,並將未產生表面之膨脹或變形的最高之設定溫度作為回流耐熱溫度,作為焊接耐熱性之指標使用。 Toshiba mechanical injection molding machine EC-100 was used, the cylinder temperature was set to the melting point of the resin + 20 ° C, the mold temperature was set to 140 ° C, and a test piece for UL combustion test having a molding length of 127 mm, a width of 12.6 mm, and a thickness of 0.8 mm was injected. Make a test piece. The test piece was placed in a gas atmosphere at 85 ° C and 85% RH (relative humidity) for 72 hours. The test piece was heated in an air reflow furnace (AIS-20-82C manufactured by Eightech) from room temperature to 150 ° C for 60 seconds, and after preliminary heating, preheating was carried out at a temperature increase rate of 0.5 ° C /min to 190 ° C. Thereafter, the temperature was raised to a predetermined set temperature at a rate of 100 ° C/min, and after cooling at a predetermined temperature for 10 seconds, it was cooled. The set temperature was increased from 240 ° C at a pitch of 5 ° C, and the highest set temperature at which no expansion or deformation of the surface was generated was used as the reflow heat resistance temperature, and was used as an index of solder heat resistance.

◎:回流耐熱溫度為280℃以上 ◎: Reflow heat resistance temperature is 280 ° C or higher

○:回流耐熱溫度為260℃以上、小於280℃ ○: Reflow heat resistance temperature is 260 ° C or more and less than 280 ° C

×:回流耐熱溫度小於260℃ ×: Reflow heat resistance temperature is less than 260 ° C

<聚醯胺樹脂1之合成例> <Synthesis Example of Polyamine Resin 1>

將1,6-六亞甲二胺7.54kg、對苯二甲酸10.79kg、11-胺基十一酸7.04kg、作為觸媒之二亞磷酸鈉9g、作為末端調整劑之乙酸40g及離子交換水17.52kg加入50公升的高壓釜,以N2從常壓加壓至0.05MPa,並予以排壓使其恢復為常壓。進行該操作3次,並進行N2取代後,於攪拌下135℃、0.3MPa使其均勻溶解。之後,將溶解液利用送液泵連續地供給,並以加熱配管升溫至240℃,加熱1小時。接著,對加壓反應罐供給反應混合物,加熱為290℃,使罐內壓維持於3MPa,餾出水之一部分,得到低級縮合物。之後,使該低級縮合物維持熔融狀態而直接供給至雙軸擠製機(螺桿徑37mm、L/D=60),使樹脂溫度為330℃,一邊從3處的孔排出水,一邊於熔融下進行聚縮合,得到聚醯胺樹脂1。 7.54 kg of 1,6-hexamethylenediamine, 10.79 kg of terephthalic acid, 7.04 kg of 11-aminoundecanoic acid, 9 g of sodium diphosphite as a catalyst, 40 g of acetic acid as a terminal regulator, and ion exchange 17.52 kg of water was placed in a 50-liter autoclave, pressurized with N 2 from normal pressure to 0.05 MPa, and discharged to a normal pressure. This operation was carried out three times, and after N 2 substitution, it was uniformly dissolved at 135 ° C and 0.3 MPa with stirring. Thereafter, the solution was continuously supplied by a liquid feeding pump, and the mixture was heated to 240 ° C in a heating pipe and heated for 1 hour. Next, the reaction mixture was supplied to the pressurized reaction tank, and the mixture was heated to 290 ° C to maintain the internal pressure of the tank at 3 MPa, and one part of the water was distilled off to obtain a lower condensate. After that, the lower condensate was supplied to the biaxial extruder (screw diameter: 37 mm, L/D = 60), and the resin temperature was 330 ° C. The water was discharged from the three holes while melting. Polycondensation was carried out to obtain a polyamine resin 1.

得到的聚醯胺樹脂1,其6T/11=65/35(莫耳比),相對黏度為2.1,醯胺鍵間的平均碳原子數為8.0,芳香環上之碳原子比率為0.281,熔點為314℃,折射率為1.56。 The obtained polyamide resin 1 had a 6T/11=65/35 (mole ratio), a relative viscosity of 2.1, an average carbon number of 8.0 between the guanamine bonds, and a carbon atom ratio of 0.281 on the aromatic ring. At 314 ° C, the refractive index is 1.56.

<聚醯胺樹脂2之合成例> <Synthesis Example of Polyamine Resin 2>

將1,10-癸二胺15.51kg、對苯二甲酸14.95kg、11-胺基十一酸2.01kg、作為觸媒之二亞磷酸鈉9g、作為末端調整劑之乙酸40g及離子交換水17.52kg加入50公升的高壓釜,採用與聚醯胺樹脂1同樣的手法合成聚醯胺樹脂2。 15.51 kg of 1,10-decanediamine, 14.95 kg of terephthalic acid, 2.01 kg of 11-aminoundecanoic acid, 9 g of sodium diphosphite as a catalyst, 40 g of acetic acid as a terminal regulator, and ion exchange water of 17.52 The kg is added to a 50-liter autoclave, and the polyamide resin 2 is synthesized in the same manner as the polyamide resin 1.

得到的聚醯胺樹脂2,其10T/11=90/10(莫耳比),相對黏度為2.0,醯胺鍵間的平均碳原子數為9.1,芳香環上之碳原子比率為0.312,熔點為304℃,折射率為1.57。 The obtained polyamide resin 2 has a 10T/11 = 90/10 (mole ratio), a relative viscosity of 2.0, an average carbon number of 9.1 between the guanamine bonds, and a carbon atom ratio of 0.312 on the aromatic ring. The refractive index was 1.57 at 304 °C.

<聚酯樹脂1之合成例> <Synthesis Example of Polyester Resin 1>

根據記載於美國專利第2901466號說明書的方法,可得到聚環己烷對苯二甲酸二亞甲酯(PCT樹脂)。該PCT樹脂的熔點為290℃,折射率為1.57。 Polycyclohexane terephthalic acid dimethylene methyl ester (PCT resin) can be obtained according to the method described in the specification of U.S. Patent No. 2,901,466. The PCT resin had a melting point of 290 ° C and a refractive index of 1.57.

相對於實施例、比較例以及參考例、合成例的熱可塑性樹脂100質量份,使氧化鈦的含量成為55質量份、下述各強化材的含量成為30質量份,且使脫模劑以及穩定劑的含量各別成為0.6質量份,使用Coperion(股)製雙軸擠製機STS-35,關於聚醯胺樹脂1、聚醯胺樹脂2為在330℃予以熔融混練,關於聚酯樹脂1為在310℃予以熔融混練,得到實施例以及比較例的熱可塑性樹脂組成物。又,也獲得僅有不摻合強化材之點為不同的組成物作為參考例。評價結果示於表1~3。 With respect to 100 parts by mass of the thermoplastic resin of the examples and the comparative examples and the reference examples and the synthesis examples, the content of the titanium oxide is 55 parts by mass, the content of each of the following reinforcing materials is 30 parts by mass, and the release agent is stabilized. The content of the agent was changed to 0.6 parts by mass, and a biaxial extruder STS-35 manufactured by Coperion Co., Ltd. was used. The polyamide resin 1 and the polyamide resin 2 were melt-kneaded at 330 ° C, and the polyester resin 1 was used. The thermoplastic resin composition of the examples and the comparative examples was obtained by melt-kneading at 310 °C. Further, a composition having only a point where the reinforcing material was not blended was obtained as a reference example. The evaluation results are shown in Tables 1 to 3.

白色顏料(B) White pigment (B)

氧化鈦:石原產業(股)製TIPAQUE CR-60、金紅石型TiO2、平均粒徑0.2μm Titanium oxide: TIPAQUE CR-60, rutile TiO 2 , average particle size 0.2 μm

強化材(C) Reinforced material (C)

鹼性硫酸鎂晶鬚(簡稱:MS):Ube Material製、MOS HIGEA-1、pH9.5、折射率1.53、平均纖維徑0.7μm、平均纖維長28μm、寬高比28 Basic magnesium sulfate whisker (abbreviation: MS): manufactured by Ube Material, MOS HIGEA-1, pH 9.5, refractive index 1.53, average fiber diameter 0.7 μm, average fiber length 28 μm, aspect ratio 28

玻璃纖維(簡稱:GF):日本電氣玻璃(股)製、T-275H Glass fiber (abbreviation: GF): Japan Electric Glass Co., Ltd., T-275H

針狀矽灰石(簡稱:WN):NYCO(股)製、NYGLOS8 Acicular apatite (abbreviation: WN): NYCO (share) system, NYGLOS8

碳酸鈣晶鬚(簡稱:CC):白石鈣製、WHISCAL Calcium carbonate whisker (abbreviation: CC): white stone calcium, WHISCAL

硼酸鋁晶鬚(簡稱:AB):四國化成製、ALBOREX Aluminum borate whisker (abbreviation: AB): Four countries, ALBOREX

脫模劑:硬脂酸鎂 Release agent: magnesium stearate

穩定劑:肆[3-(3,5-二-t-丁基-4-羥苯基)丙酸]季戊四醇酯(Ciba Specialty Chemicals製、Irganox 1010) Stabilizer: 肆[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionic acid] pentaerythritol ester (manufactured by Ciba Specialty Chemicals, Irganox 1010)

【表1】 【Table 1】

【表3】 【table 3】

在白色LED中,為了更提升發光效率,提高藍色LED(發光峰值440~460nm)、黃色螢光體(發光峰值550~650nm)的反射率係為重要。從表1~3得知,藉由使用具有{熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}≧0.02的特性的鹼性硫酸鎂晶鬚,相較於其他的強化材,在460nm、600nm之初期的反射率較高。 In the white LED, in order to further improve the luminous efficiency, it is important to increase the reflectance of the blue LED (luminous peak 440 to 460 nm) and the yellow phosphor (luminous peak 550 to 650 nm). It is known from Tables 1 to 3 that alkaline magnesium sulfate whiskers having characteristics of {refractive index of thermoplastic resin (A)}-{refractive index of reinforcing material (C)} ≧ 0.02 are compared with others. The reinforced material has a high reflectance at the beginning of 460 nm and 600 nm.

又,即使在170℃2小時之熱處理後,也可維持高反射率。再者,鹼性硫酸鎂晶鬚,因為得到足夠的補強效果,所以在回流耐熱試驗中也展現高耐熱性。 Further, even after heat treatment at 170 ° C for 2 hours, high reflectance can be maintained. Further, the basic magnesium sulfate whisker exhibits high heat resistance in the reflow heat resistance test because a sufficient reinforcing effect is obtained.

根據前述,可確認滿足{熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}≧0.02的特性之組合對於LED反射板所需的初期反射率及長期的反射率維持有特別的效果。 According to the above, it is confirmed that the combination of the characteristics satisfying the {refractive index of the thermoplastic resin (A)}-{the refractive index of the reinforcing material (C)} ≧ 0.02 is maintained for the initial reflectance and the long-term reflectance required for the LED reflector. Has a special effect.

產業上利用性 Industrial use

因為本發明的LED反射板用熱可塑性樹脂組成物,其光的反射特性佳,且可提高LED發光元件之光的取出效率,而且可抑制熱變色,所以有助於LED之高亮度化、耐久性之提升。 The thermoplastic resin composition for an LED reflector of the present invention has excellent light reflection characteristics, improves light extraction efficiency of the LED light-emitting element, and suppresses thermal discoloration, thereby contributing to high luminance and durability of the LED. Sexual improvement.

Claims (10)

一種LED反射板用熱可塑性樹脂組成物,係相對於熱可塑性樹脂(A)100質量份,含有白色顏料(B)3~100質量份、以及針狀或纖維狀的強化材(C)5~100質量份的熱可塑性樹脂組成物,且滿足下述(i);(i){熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}≧0.02。 A thermoplastic resin composition for an LED reflector comprising 3 to 100 parts by mass of a white pigment (B) and a acicular or fibrous reinforcing material (C) 5 to 100 parts by mass of the thermoplastic resin (A). 100 parts by mass of the thermoplastic resin composition, and satisfying the following (i); (i) {refractive index of the thermoplastic resin (A)} - {refractive index of the reinforcing material (C)} ≧ 0.02. 如申請專利範圍第1項之LED反射板用熱可塑性樹脂組成物,其中,該強化材(C)為鹼性硫酸鎂晶鬚。 The thermoplastic resin composition for an LED reflector according to the first aspect of the invention, wherein the reinforcing material (C) is a basic magnesium sulfate whisker. 如申請專利範圍第1或2項之LED反射板用熱可塑性樹脂組成物,其中,該熱可塑性樹脂(A)為熔點290~350℃的半芳香族聚醯胺樹脂(A1)。 The thermoplastic resin composition for LED reflectors according to claim 1 or 2, wherein the thermoplastic resin (A) is a semi-aromatic polyamide resin (A1) having a melting point of 290 to 350 °C. 如申請專利範圍第3項之LED反射板用熱可塑性樹脂組成物,其中,半芳香族聚醯胺樹脂(A1)含有50莫耳%以上之由碳數2~12的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,並且滿足下述(a)及(b);(a)7.5≦聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數;以及(b)聚醯胺樹脂中之芳香環上的碳原子數/聚醯胺樹脂中的總碳原子數≦0.35。 The thermoplastic resin composition for LED reflectors of claim 3, wherein the semi-aromatic polyamide resin (A1) contains 50 mol% or more of diamine and p-benzoic acid having 2 to 12 carbon atoms. a constituent unit obtained by equating a molar amount of formic acid, and satisfying the following (a) and (b); (a) 7.5 碳 a number of carbon atoms in the polyamide resin / a number of guanamine bonds in the polyamide resin; And (b) the number of carbon atoms in the aromatic ring in the polyamide resin / the total number of carbon atoms in the polyamide resin ≦ 0.35. 如申請專利範圍第3或4項之LED反射板用熱可塑性樹脂組成物,其中,該半芳香族聚醯胺樹脂(A1)含有50莫耳%以上之由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元,並滿足下述(a’)及(b’),且熱可塑性樹脂組成物滿足下述(c);(a’)7.5≦聚醯胺樹脂中的碳原子數/聚醯胺樹脂中的醯胺鍵數≦8.2;(b’)0.28≦聚醯胺樹脂中之芳香環上的碳原子數/聚醯胺樹脂中的總碳原子數≦0.35;(c)存在於源自熱可塑性樹脂組成物之聚醯胺樹脂的最低溫側之DSC熔融峰溫度為300~340℃。 The thermoplastic resin composition for LED reflectors according to claim 3, wherein the semi-aromatic polyamide resin (A1) contains 50 mol% or more of a diamine having 2 to 8 carbon atoms. A constituent unit obtained by equating a molar amount of terephthalic acid, and satisfying the following (a') and (b'), and the thermoplastic resin composition satisfies the following (c); (a') 7.5 ≦ The number of carbon atoms in the amine resin / the number of guanamine bonds in the polyamide resin ≦ 8.2; (b') 0.28 碳 The number of carbon atoms in the aromatic ring in the polyamide resin / the total carbon atoms in the polyamide resin The number of ≦0.35; (c) the DSC melting peak temperature of the lowest temperature side of the polyamide resin derived from the thermoplastic resin composition is 300 to 340 °C. 如申請專利範圍第4或5項之LED反射板用熱可塑性樹脂組成物,其中,該半芳香族聚醯胺樹脂(A1)係將作為由碳數2~8的二胺與對苯二甲酸之等量莫耳鹽得到的構成單元以外的成分的碳數11~18的胺基羧酸或內醯胺中之一種或是多種共聚合而成。 The thermoplastic resin composition for LED reflectors of claim 4 or 5, wherein the semi-aromatic polyamide resin (A1) is used as a diamine and terephthalic acid having 2 to 8 carbon atoms. The component other than the constituent unit obtained by the same amount of the molar component is obtained by copolymerizing one or more of an aminocarboxylic acid having 11 to 18 carbon atoms or an indoleamine. 如申請專利範圍第3~6項中任一項之LED反射板用熱可塑性樹脂組成物,其中,該半芳香族聚醯胺樹脂(A1)係由得自於六亞甲二胺與對苯二甲 酸之等量莫耳鹽的構成單元55~75莫耳%與得自於11-胺基十一酸或十一內醯胺的構成單元45~25莫耳%組成。 The thermoplastic resin composition for LED reflectors according to any one of claims 3 to 6, wherein the semi-aromatic polyamide resin (A1) is derived from hexamethylenediamine and para-benzoic acid. Dimethyl The constituent unit of the acid equivalent amount of the molar salt is 55 to 75 mol% and is composed of 45 to 25 mol% of the constituent unit derived from 11-aminoundecanoic acid or undecanoin. 如申請專利範圍第1~7項中任一項之LED反射板用熱可塑性樹脂組成物,其中,該白色顏料(B)係選自於由氧化鈦、氧化鋅、氧化鋯、氧化錫、氧化鋁、氧化矽、氧化鎂、氧化鈣、氧化銻、氫氧化鈦、氫氧化鋅、氫氧化鋯、氫氧化鋁、氫氧化鎂、氫氧化鉛、硫酸鋇、硫酸鈣、硫化鋅、磷酸鋁、磷酸鈣、碳酸鈣、碳酸鉛、碳酸鋇、及碳酸鎂組成的群組中之至少一種。 The thermoplastic resin composition for LED reflectors according to any one of claims 1 to 7, wherein the white pigment (B) is selected from the group consisting of titanium oxide, zinc oxide, zirconium oxide, tin oxide, and oxidation. Aluminum, cerium oxide, magnesium oxide, calcium oxide, cerium oxide, titanium hydroxide, zinc hydroxide, zirconium hydroxide, aluminum hydroxide, magnesium hydroxide, lead hydroxide, barium sulfate, calcium sulfate, zinc sulfide, aluminum phosphate, At least one of the group consisting of calcium phosphate, calcium carbonate, lead carbonate, cesium carbonate, and magnesium carbonate. 申請專利範圍第1~8項中任一項之LED反射板用熱可塑性樹脂組成物,其中,回焊耐熱溫度為280℃以上。 The thermoplastic resin composition for LED reflectors according to any one of claims 1 to 8, wherein the reflow heat resistance temperature is 280 ° C or higher. 一種LED反射板用熱可塑性樹脂組成物之製造方法,在製造含有熱可塑性樹脂(A)、白色顏料(B)、以及針狀或纖維狀的強化材(C)的熱可塑性樹脂組成物之際,係滿足下述(i)的方式選擇熱可塑性樹脂(A)與強化材(C);(i){熱可塑性樹脂(A)的折射率}-{強化材(C)的折射率}≧0.02。 A method for producing a thermoplastic resin composition for an LED reflector, in the production of a thermoplastic resin composition comprising a thermoplastic resin (A), a white pigment (B), and a needle-like or fibrous reinforcing material (C) The thermoplastic resin (A) and the reinforcing material (C) are selected in the following manner (i); (i) {refractive index of the thermoplastic resin (A)} - {refractive index of the reinforcing material (C) ≧ 0.02.
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CN104145347A (en) 2014-11-12
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JP6015652B2 (en) 2016-10-26
TWI570173B (en) 2017-02-11
KR101910698B1 (en) 2018-10-22
CN104145347B (en) 2017-09-19

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