TW201343027A - Periphery circuit of touch panel and manufacturing method thereof - Google Patents

Abstract

A method for manufacturing periphery circuit of touch panel includes: printing a radiation curable conductive material on a substrate having a transparent conductive pattern; irradiating the radiation curable conductive material by a radiated ray to cure parts of the radiation curable conductive material; and removing non-cured parts of the radiation curable conductive material to form the periphery circuit.

Description

Peripheral circuit of touch panel and manufacturing method thereof

The present invention relates to a peripheral circuit of a touch panel and a method of fabricating the same.

With the advancement of technology, in order to make electronic devices more efficient, the processes and designs used are moving toward reducing the size of internal components and increasing the density of circuit settings.

In general, the conductive pattern and the conductive line can be formed by a yellow light lithography process, and the conventional yellow light lithography process comprises the following steps: first, forming a metal layer on the substrate by deposition or electroplating; a photoresist layer is coated on the metal layer, and then the photoresist layer is selectively exposed; then, the exposed photoresist layer is developed with a developing solution to obtain a patterned photoresist layer; finally, the pattern is utilized. The photoresist layer is used as an etching mask to etch a metal layer to form a conductive pattern or a conductive line on the substrate.

However, the conventional yellow light lithography process is complicated in implementation and requires a large amount of chemicals to be used. Therefore, it is not only costly, but also inconsistent with the environmental protection needs and trends emphasized by today's technology.

In order to solve the problems caused by the conventional yellow light lithography process, a manufacturer has proposed a manufacturing method for forming a conductive pattern and a conductive line by a printing process. Although, this method has a relatively simple process step compared to the conventional yellow light lithography process. However, by using the conductive pattern and the conductive line formed by the printing process, the adhesion of the printing ink to the substrate is poor, and peeling occurs, which causes the conductive line to be broken, and the method is only applicable to the line width and the line spacing. Large conductive patterns and conductive lines cannot effectively increase the density of circuit settings.

Therefore, how to provide a peripheral circuit of a touch panel and a manufacturing method thereof, which can reduce the line width or the line spacing, thereby having a higher integration degree and being able to meet environmental protection requirements, has become an important Question.

In view of the above problems, an object of the present invention is to provide a peripheral circuit of a touch panel and a method of manufacturing the same that can reduce the line width or the line pitch and have a higher degree of integration while also meeting environmental protection requirements.

In order to achieve the above object, a method for manufacturing a peripheral circuit of a touch panel according to the present invention comprises the steps of: printing a radiation-curable conductive material on a substrate, and the substrate has a transparent conductive pattern; and irradiating the radiation with a radiation to cure the conductive a material that cures the portion of the radiation-curable conductive material; and removes the uncured radiation-cured conductive material to form a peripheral circuit.

In one embodiment of the invention, the wavelength of the radiation ranges from about 230 to about 600 nanometers.

In an embodiment of the invention, the transparent conductive pattern is connected to a peripheral circuit.

In one embodiment of the invention, the line width of the peripheral circuitry is less than or equal to about 70 microns.

In one embodiment of the invention, the radiation curable conductive material is a radiation curable silver paste, a radiation curable silver paste, or a radiation curable ink.

In an embodiment of the invention, the cured portion of the radiation-curable conductive material is selectively cured by providing a reticle on the radiation-curable conductive material, wherein the material of the reticle comprises glass, quartz or poly Ethylene terephthalate.

In one embodiment of the invention, the radiation illuminates the radiation curable conductive material in at least two different wavelength ranges.

In one embodiment of the invention, the radiation curable conductive material is screen printed onto the substrate.

In an embodiment of the invention, the substrate is a transparent plastic substrate, a transparent glass substrate or a polyethylene terephthalate film substrate.

To achieve the above objective, a touch panel according to the present invention comprises a substrate and a peripheral circuit. The substrate has a transparent conductive pattern. The peripheral circuit is electrically connected to the transparent conductive pattern. The material of the peripheral circuit is a radiation-curable conductive material.

In one embodiment of the invention, the line width of the peripheral circuitry is less than or equal to 70 microns.

In one embodiment of the invention, the radiation curable conductive material is a radiation curable silver paste, a radiation curable silver paste, or a radiation curable ink.

In an embodiment of the invention, the substrate is a transparent plastic substrate, a transparent glass substrate or a polyethylene terephthalate film substrate.

To achieve the above object, the peripheral circuit of the touch panel according to the present invention is manufactured by the aforementioned manufacturing method.

According to the above, the peripheral circuit of the touch panel of the present invention and the method of manufacturing the same, by printing the radiation-curable conductive material as a printing material to the substrate, and then curing the conductive material through the curing portion of the radiation, and removing the uncured Radiation solidifies the conductive material to form a peripheral circuit, thereby achieving a reduction in line width or line spacing, and having a higher degree of accumulation, while also meeting environmental requirements. In summary, the peripheral circuit of the touch panel of the present invention and the manufacturing method thereof can combine the advantages of the printing and the lithography process, and the touch panel can be produced in a low cost and fast manufacturing method without losing the slight line width. Or the advantage of the line spacing, which is very advantageous for the application of small electronic devices, and breaks through the obstacles of the past two processes which have their own shortcomings but are incompatible. In addition, by using the peripheral circuit of the touch panel of the present invention and the manufacturing method thereof, the range of the visible area can be increased to facilitate the operation of the user.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a peripheral circuit of a touch panel and a method of manufacturing the same according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

First, please refer to FIG. 1A and FIG. 1B , which are schematic diagrams of a touch panel 1 according to a preferred embodiment of the present invention. The touch panel 1 includes a substrate 11 and a peripheral circuit 12 . The substrate 11 can be, for example, a transparent plastic substrate or a transparent glass substrate. Of course, the substrate 11 can also be a polyethylene terephthalate (PET) film substrate or other thin film substrate. The substrate 11 has an outer surface S1 and an inner surface S2. The user usually views the touch panel 1 from the outer surface S1 and performs various functions on the outer surface S1. The remaining structures and components of the touch panel 1 are disposed on the inner surface S2 side of the substrate 11.

The inner surface S2 of the substrate 11 has a transparent conductive pattern 111, a masking decorative layer 112 and a conductive layer 113. The transparent conductive pattern 111 is disposed on the inner surface S2 of the substrate 11 and defines a touch sensing circuit, and the material thereof is, for example, indium tin oxide (ITO). The shielding decorative layer 112 is adjacent to one end of the transparent conductive pattern 111, and the material of the shielding decorative layer 112 is, for example, an insulating material or an ink of various colors having insulating properties (Ink). The conductive layer 113 is disposed on the shielding decorative layer 112 and the transparent conductive pattern 111 and extends from one end of the transparent conductive pattern 111 toward the shielding decorative layer 112. The material of the conductive layer 113 includes a transparent polymer conductive material or indium tin oxide, and the conductive layer 113 can be formed on the shielding decorative layer 112 and the transparent conductive pattern 111 by printing.

The peripheral circuit 12 is disposed on the conductive layer 113 and the shielding decorative layer 112 and extends toward the conductive layer 113 and does not exceed the edge of the shielding decorative layer 112. In other words, the projection of the peripheral circuitry 12 falls on the shaded decorative layer 112 or is aligned with the edge of the shaded decorative layer 112. The peripheral circuit 12 is made of a radiation-curable conductive material, such as a radiation-cured silver paste, a radiation-cured silver paste or a radiation-curable ink, and the peripheral circuit 12 defines a fine line by using a screen printing device with a fine-line screen. Formed on the transparent conductive pattern 111 and a masking decorative layer 112 in a printed manner. It is worth mentioning that, in the above process, the radiation-curable conductive material is more preferably printed directly by the printing device on the substrate, in which no screen of the fine line is used, but after printing The circuit can be additionally combined with lithography to form a thinner circuit. As a result of this implementation, the line width of the peripheral circuit 12 can be less than or equal to 70 microns, and the need to use a high-precision screen can be reduced, which helps to reduce costs. And improve yield. As for how to cooperate with lithography technology, especially the yellow light lithography technology, it will be explained in detail below.

Further, the radiation-curable conductive material described above is not limited to a specific composition, but may be any material having a certain conductive property and being dried or cured after being irradiated by short-wavelength radiation, specifically It can be ultraviolet (UV) curing or UV drying conductive material, which is liquid or thick when printed. However, after printing, the UV irradiated part will quickly dry or solidify and adhere to the substrate. Of course, the unexposed portion remains liquid or thick and can be easily removed by appropriate means. In addition, conductive materials that dry or solidify after irradiation in other wavelength bands can also be used without being limited to the UV series.

In addition, as shown in FIG. 1B , the touch panel 1 further includes an insulating layer 13 and a conductive adhesive 14 . The insulating layer 13 can be overlaid on a portion of the peripheral circuit 12 by screen printing to prevent oxidation of the peripheral circuit 12 due to exposure to air. The conductive adhesive 14 is used for bonding the peripheral circuit 12 and the pin P of a flexible printed circuit board (FPC), and the touch sensing signal generated by the transparent conductive pattern 111 is transmitted through the conductive layer 113, The peripheral circuit 12 and the conductive adhesive 14 are transferred to the pins P of the flexible printed circuit board. Of course, in other embodiments, the conductive adhesive 14 can be an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). In addition, in actual use, the touch panel may not be provided with an insulating layer, and the present invention is not limited thereto.

It should be noted that in this embodiment, the transparent conductive pattern 111 is directly formed on the substrate 11, and the substrate 11 is an embodiment in which the touch sensing and the cover are simultaneously provided. However, the use of the industry is not limited to this. In practice, the present invention can be applied to various forms of touch panels. For example, the present invention can also be applied to a two-layer structure composed of two substrates, wherein the upper layer and the lower substrate are each provided with a transparent conductive pattern.

2A and FIG. 2B are schematic diagrams of another touch panel 2 according to a preferred embodiment of the present invention. The touch panel 2 includes a substrate 21 and a peripheral circuit 22 . The substrate 21 can be a transparent substrate, such as a plastic substrate or a glass substrate, or in other aspects, the substrate 21 can be a polyethylene terephthalate film substrate or other substrate in the form of a film. The user usually views the touch panel 2 from the outer surface S1 of the substrate 21 and operates on the outer surface S1. The remaining structures and components of the touch panel 2 are disposed on the inner surface S2 side of the substrate 21.

The inner surface S2 of the substrate 21 has a transparent conductive pattern 211, a masking decorative layer 212 and a conductive layer 213. The transparent conductive pattern 211 is used to define a touch sensing circuit, and the material thereof is, for example, indium tin oxide. The conductive layer 213 is disposed on the substrate 21 and extends toward one end of the transparent conductive pattern 211 and covers a portion of the transparent conductive pattern 211. The masking decorative layer 212 is disposed on the substrate 21 and the conductive layer 213 and extends toward the conductive layer 213, and has an opening H on the conductive layer 213. The shielding decorative layer 212 is disposed at a position that does not exceed the edge of the conductive layer 213.

The material of the conductive layer 213 includes a conductive carbon paste, and the material of the shielding decorative layer 212 is, for example, an insulating material or an ink of various colors having an insulating property. Among them, in the selection of the color of the masking decorative layer 212, it is preferable to select a color similar to that of the conductive layer 213. Therefore, when the user views the touch panel 2 from the outer surface S1, the color change between the masking decorative layer 212 and the conductive layer 213 will be less noticeable. In addition, the conductive layer 213 and the masking decorative layer 212 can be formed on the substrate 21 by printing.

The peripheral circuit 22 is disposed on the shielding decorative layer 212, and a portion thereof is filled in the opening H and electrically connected to the conductive layer 213. The material of the peripheral circuit 22 is a radiation-curable conductive material, such as radiation-cured silver glue, radiation-cured silver paste or radiation-curable ink, and the peripheral circuit 12 is formed on the shielding decorative layer 212 by means of printing and radiation.

In addition, as shown in FIG. 2B , the touch panel 2 further includes an insulating layer 23 and a conductive adhesive 24 . The insulating layer 23 is disposed on the peripheral circuit 22 to prevent oxidation of the peripheral circuit 22 due to exposure to air. The conductive adhesive 24 bonds the peripheral circuit 22 and the pin P of a flexible printed circuit board. The pin P is electrically connected to the conductive layer 213 through the conductive adhesive 24 and the peripheral circuit 22 to receive the touch sensing signal generated by the transparent conductive pattern 211. The conductive adhesive 24 may be an anisotropic conductive film or an anisotropic conductive paste. Of course, in other embodiments, the insulating layer may not be provided, and the present invention is not limited thereto.

Next, referring to the flowchart of FIG. 3 and FIG. 1A, a method for manufacturing a peripheral circuit of a touch panel according to a preferred embodiment of the present invention can be used to manufacture a periphery of the touch panel 1 as described above. Circuit 12, and the steps of the manufacturing method include steps S01 to S03.

Step S01 is to print a radiation-curable conductive material on a substrate 11, and the substrate 11 has a transparent conductive pattern 111. In practice, step S01 may have at least two aspects. First, the radiation-curable conductive material is formed on the transparent conductive pattern of the substrate 11 by printing, especially screen printing, by using a screen printing device with a screen of fine lines. 111 and the masking decorative layer 112, wherein the thin lines of the printed radiation-curable conductive material are processed by subsequent radiation irradiation to form a finer peripheral circuit 12; and the second preferred aspect is that no fine lines are used. The screen plate directly prints the radiation-curable conductive material on the substrate 11 in a block or region manner, and the formed pattern can be processed by a subsequent means to form a plurality of peripheral circuits 12.

The radiation-curable conductive material described above may be a radiation-cured silver paste, a radiation-cured silver paste or a radiation-curable ink. In addition, the substrate 11 is a transparent substrate, such as a plastic substrate or a glass substrate, or in other aspects, the substrate 11 may be a polyethylene terephthalate film substrate or other substrate in the form of a film. The material of the transparent conductive pattern 111 is, for example, indium tin oxide, and the material of the shielding decorative layer 112 is, for example, an insulating material or an ink of various colors having an insulating property. The transparent conductive pattern 111 can be formed on the substrate 11 by sputtering and etching, and the shielding decorative layer 112 can be deposited or printed on the substrate 11 according to the material.

Step S02 irradiates the radiation-curable conductive material with a radiation to cure a portion of the radiation-cured conductive material. In practice, the radiation curable conductive material is irradiated with radiation having a wavelength in the range of from about 230 to about 600 nanometers. Wherein, in order to make the alignment of the circuit layout more precise, the curing of the radiation-cured conductive material is performed by providing a photomask on the radiation-curable conductive material so that the radiation can be based on the requirements of the product or the design of the circuit. The radiation curing conductive material is selectively cured. The material of the reticle comprises glass, quartz or polyethylene terephthalate (PET), and the form of the reticle is not limited to a positive film or a negative film, and the material properties of the end view and the configuration of the peripheral circuit 12 Need.

In addition, in order to increase the degree of bonding of the radiation-curable conductive material to the transparent conductive pattern 111 and the masking decorative layer 112, and accelerate the curing speed of the radiation-curable conductive material, the radiation may be irradiated to the radiation-curable conductive material in at least two stages, wherein In the two-stage irradiation process, the radiation is in two different wavelength ranges, for example, radiation irradiation of the conductive material with radiation in the wavelength range of 300 to 400 nm, and then in the wavelength range of 230 to 600 nm. The radiation of the rice illuminates the radiation to solidify the conductive material. It is to be understood that the foregoing numerical ranges are illustrative and are not intended to limit the invention.

Step S03 removes the uncured radiation-cured conductive material to form the peripheral circuit 12. In practice, the cured radiation-curable conductive material can be formed into the peripheral circuitry 12 by, for example, removing the uncured radiation-cured conductive material from pure water. The peripheral circuit 12 is connected to the transparent conductive pattern 111 and can transmit the touch sensing signal generated by the transparent conductive pattern 111 to a flexible printed circuit board. Since the present invention integrates printing and a portion of the yellow lithography process, the peripheral circuit 12 can be fabricated in a simple and low-cost manner, and the line width formed is less than or equal to about 70 microns, thereby achieving an effect of increasing the degree of accumulation. In addition, the present invention also eliminates the use of a large amount of chemicals, thereby not only greatly simplifying the process, but also conforming to the thinking of environmental protection and energy conservation.

In addition, the peripheral circuit 22 of the touch panel 2 of the present invention can also be manufactured by the above manufacturing method, but the structural description or the process flow can refer to the above description, and thus Let me repeat.

In summary, the peripheral circuit of the touch panel of the present invention and the method of manufacturing the same, by printing the radiation-curable conductive material as a printing material to the substrate, and then curing the conductive material through the curing portion of the radiation, and removing the uncured Radiation solidifies the conductive material to form a peripheral circuit, thereby achieving a reduction in line width or line spacing, and having a higher degree of accumulation, while also meeting environmental requirements. In summary, the peripheral circuit of the touch panel of the present invention and the manufacturing method thereof can combine the advantages of the printing and the lithography process, and the touch panel can be produced in a low cost and fast manufacturing method without losing the slight line width. Or the advantage of the line spacing, which is very advantageous for the application of small electronic devices, and breaks through the obstacles of the past two processes which have their own shortcomings but are incompatible. In addition, by using the peripheral circuit of the touch panel of the present invention and the manufacturing method thereof, the range of the visible area can be increased to facilitate the operation of the user.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1, 2. . . Touch panel

11, 21. . . Substrate

111, 211. . . Transparent conductive pattern

112, 212. . . Shading decorative layer

113, 213. . . Conductive layer

12, 22. . . Peripheral circuit

13,23. . . Insulation

14, 24. . . Conductive adhesive

H. . . Opening

P. . . Pin

S01～S03. . . Manufacturing method steps

S1. . . The outer surface

S2. . . The inner surface

1A and 1B are schematic views of a touch panel according to a preferred embodiment of the present invention;

2A and 2B are schematic diagrams showing another touch panel according to a preferred embodiment of the present invention;

3 is a flow chart of a method of manufacturing a peripheral circuit of a touch panel according to a preferred embodiment of the present invention.

S01～S03. . . Manufacturing method steps

Claims (15)

A method for manufacturing a peripheral circuit of a touch panel, comprising the steps of: printing a radiation-curable conductive material on a substrate, and the substrate has a transparent conductive pattern; irradiating the radiation-curable conductive material with a radiation to cure the portion Radiation curing the electrically conductive material; and removing the uncured radiation curable electrically conductive material to form the peripheral circuit. The manufacturing method of claim 1, wherein the radiation has a wavelength ranging from about 230 to about 600 nm. The manufacturing method of claim 1, wherein the transparent conductive pattern is connected to the peripheral circuit. The manufacturing method of claim 1, wherein the peripheral circuit has a line width of less than or equal to about 70 microns. The manufacturing method of claim 1, wherein the radiation-curable conductive material is a radiation-cured silver paste, a radiation-cured silver paste or a radiation-curable ink. The manufacturing method of claim 1, wherein the cured portion of the radiation-curable conductive material selectively cures the radiation-curable conductive material by providing a photomask on the radiation-curable conductive material. The manufacturing method of claim 6, wherein the material of the reticle comprises glass, quartz or polyethylene terephthalate (PET). The manufacturing method of claim 1, wherein the radiation illuminates the radiation-curable conductive material in at least two different wavelength ranges. The manufacturing method of claim 1, wherein the radiation-curable conductive material is screen printed on the substrate. The manufacturing method according to claim 1, wherein the substrate is a transparent plastic substrate, a transparent glass substrate or a polyethylene terephthalate film substrate. A touch panel includes: a substrate having a transparent conductive pattern; and a peripheral circuit electrically connected to the transparent conductive pattern, wherein the peripheral circuit is made of a radiation curable conductive material. The touch panel of claim 11, wherein the peripheral circuit has a line width of less than or equal to 70 micrometers. The touch panel of claim 11, wherein the radiation-curable conductive material is a radiation-cured silver paste, a radiation-cured silver paste or a radiation-curable ink. The touch panel of claim 11, wherein the substrate is a transparent plastic substrate, a transparent glass substrate or a polyethylene terephthalate film substrate. A peripheral circuit of a touch panel manufactured by the manufacturing method according to any one of claims 1 to 10.