TW201342459A - Chemical mixer - Google Patents

Abstract

The present invention proposes a chemical mixer that can supply a chemical mixture to a substrate treating device without degradation over time, and can suppress variations in a mixing ratio for sulfuric acid and hydrogen peroxide and produce a chemical mixture that maintains a constant mixing ratio when producing a chemical mixture. In a chemical mixer (10), a sulfuric acid flow rate is stabilized by pressure feeding the sulfuric acid by a pressure feeding means (35), and also a hydrogen peroxide flow rate is stabilized by injecting the hydrogen peroxide with a supply rate lower than that of the sulfuric acid using a metering pump (38) in a fixed small amount. The mixture is produced from the sulfuric acid and hydrogen peroxide in an interflow part (105), and the chemical mixture is supplied to a substrate treating device (1) as is, directly after production. Thus, the chemical mixture can be supplied to the substrate treating device (1) without degradation over time, and variations in the mixing ratio for the sulfuric acid and hydrogen peroxide can be suppressed when producing the chemical mixture, allowing for production of a chemical mixture in which a fixed mixing ratio is maintained.

Description

Liquid mixing device

The invention relates to a chemical liquid mixing device, which is very suitable for mixing sulfuric acid (H ₂ SO ₄ ) and hydrogen peroxide (H ₂ O ₂ ) to form a photoresist for removing the surface of a semiconductor substrate (hereinafter referred to as “substrate”). a mixture of agents.

Previously, the photoresist on the surface of the substrate is removed, and the substrate is cleaned by mixing sulfuric acid with hydrogen peroxide to form a mixed solution, and the mixed solution is used to remove the photoresist from the substrate surface. The law is well known (for example, refer to Patent Document 1). Here, the mixed chemical liquid is produced by mixing the reaction heat generated by the combination of sulfuric acid and hydrogen peroxide to form persulfuric acid (H ₂ SO ₅ , also called Peroxoacid), and can be promoted by heating to about 180 ° C to 200 ° C. Persulfuric acid is produced. In the chemical solution processing method, a mixed chemical solution in a state in which persulfuric acid is sufficiently formed is supplied to the surface of the substrate, and the photoresist adhered to the surface of the substrate is dissolved by persulfuric acid in the mixed chemical solution to wash the surface of the substrate. net.

Here, the persulfuric acid which is formed in the mixed chemical liquid is known to have a very short life cycle, and starts to decompose soon after the formation, and gradually decreases as time passes. Therefore, for example, a mixed chemical solution in which hydrogen peroxide and sulfuric acid are mixed is stored in a chemical solution storage tank in advance, and the mixed chemical solution is used to remove the photoresist on the surface of the substrate (hereinafter, referred to as In the "medical solution storage method", in the chemical solution storage tank, the mixed chemical liquid is gradually deteriorated for a long time and the persulfuric acid is reduced. Here, in the chemical liquid storage method, it is necessary to add hydrogen peroxide and sulfuric acid to the mixed chemical solution at any time, and always generate new persulfuric acid in the mixed chemical liquid. As a result, there is a problem that a large amount of hydrogen peroxide and sulfuric acid are required in this liquid storage method.

Here, in order to solve this problem, it is considered to remove the substrate table. Before the photoresist is formed, a mixed chemical solution is generated, and the mixed solution is used to remove the photoresist from the substrate surface before the mixed solution is degraded for a long time. In such a chemical solution processing method, the mixed chemical solution can be produced at a minimum required usage amount, and the amount of the mixed chemical solution can be greatly reduced as compared with the above-described chemical liquid storage method.

Here, Fig. 4 shows that shortly after the formation of the mixed drug solution, The substrate cleaning device 101 for removing the photoresist on the surface of the substrate is prepared by using the mixed chemical solution. Actually, the substrate cleaning apparatus 101 has a substrate processing apparatus 102 that supplies a mixed chemical liquid to the surface of the substrate to remove the photoresist on the surface of the substrate, and a chemical liquid mixing apparatus 100 that is to be removed by the substrate processing apparatus 102. In the case of the photoresist, hydrogen peroxide and sulfuric acid are mixed to form a mixed chemical solution, and the mixed chemical solution is supplied to the substrate processing apparatus 102.

Here, the chemical liquid mixing device 100 has a hydrogen peroxide storage tank 103. The sulfuric acid storage tank 104 and the mixed chemical solution generating unit 108 have a configuration in which the substrate processing apparatus 102 is connected to the mixed chemical solution generating unit 108. Further, the mixed chemical solution generating unit 108 includes a hydrogen peroxide supply pipe 111a, supplies hydrogen peroxide of the hydrogen peroxide storage tank 103 to the merging portion 105, and a sulfuric acid supply pipe 111b for supplying sulfuric acid of the sulfuric acid storage tank 104 to the merging portion. 105; the merging portion 105, the hydrogen peroxide supply pipe 111a merges with the sulfuric acid supply pipe 111b, and the mixed chemical liquid supply pipe 111c, and supplies the mixed chemical liquid generated in the merging portion 105 to the substrate processing apparatus 102.

In fact, in the hydrogen peroxide supply pipe 111a, in the hydrogen peroxide storage A bellows 106a is provided between the reservoir 103 and the merging portion 105, and a valve body 113a is provided between the bellows pump 106a and the merging portion 105. Further, in the hydrogen peroxide supply pipe 111a, a circulation pipe 114a connected to the hydrogen peroxide storage tank 103 is provided between the bellows pump 106a and the valve body 113a. Thereby, the hydrogen peroxide supply pipe 111a can form a circulation path 110a, and the circulation path 110a is in a state where the valve body 113a is closed, and when the bellows pump 106a is driven, the telescopic bag pump 106a is stored from the hydrogen peroxide. The hydrogen peroxide discharged from the tank 103 is returned to the hydrogen peroxide storage tank 103 via the circulation pipe 114a.

In addition, the sulfuric acid supply pipe 111b is also in the sulfuric acid storage tank 104 A bellows 106b is provided between the merging portions 105, and a valve body 113b is provided between the bellows pump 106b and the merging portion 105. Further, in the sulfuric acid supply pipe 111b, a circulation pipe 114a connected to the sulfuric acid storage tank 104 is provided between the bellows pump 106b and the valve body 113b. Thereby, the sulfuric acid supply pipe 111b can form a circulation path 110b which is discharged from the sulfuric acid storage tank 104 by the bellows pump 106b when the bellows pump 106b is driven in a state where the valve body 113b is closed. The sulfuric acid is returned to the sulfuric acid storage tank 104 via the circulation pipe 114b.

The chemical liquid mixing device 100 is in this state, the hydrogen peroxide supply pipe When the valve bodies 113a and 113b of the 111a and the sulfuric acid supply pipe 111b are opened, hydrogen peroxide and sulfuric acid can be supplied to the confluence unit by pressure displacement by the expansion and contraction operation of the bellows portions of the bellows pumps 106a and 106b, respectively. 105. Thereby, the merging portion 105 is mixed with hydrogen peroxide and sulfuric acid to form a mixed chemical solution, and is supplied to the substrate processing apparatus 102 by mixing the mixed chemical solution supply tube 111c of hydrogen peroxide and sulfuric acid. Moreover, the mixed chemical supply pipe connected to the substrate processing apparatus 102 111c, a mixed medicine hydraulic pressure feeding mechanism 118 is provided, and the mixed chemical liquid supplied from the chemical liquid mixing device 100 is pressure-fed, for example, with an inert gas such as nitrogen gas, so that the mixed chemical liquid can be surely supplied to the substrate processing apparatus 102.

Here, the mixed chemical supplied to the substrate processing apparatus 102, The optimum mixing ratio for the formation of persulfuric acid is preferably set to, for example, hydrogen peroxide and sulfuric acid of 1:4 to 8. Here, in the chemical liquid mixing device 100, the mixing ratio of the mixed chemical liquid can be adjusted by adjusting the discharge flow rate of each of the bellows pumps 106a and 106b. Actually, the discharge flow rates of the respective bellows pumps 106a and 106b in the chemical liquid mixing device 100 are individually set to the optimum mixing ratio of the mixed chemical liquid (for example, hydrogen peroxide and sulfuric acid are 1:4). . Next, the flow rate (not shown) provided in the hydrogen peroxide supply pipe 111a and the sulfuric acid supply pipe 111b is actually measured to vary the flow rates of the hydrogen peroxide flow rate and the sulfuric acid flow rate when the mixed chemical liquid is generated. As a result, in the liquid chemical mixing device 100, the results shown in Fig. 5 were obtained.

In this chemical liquid mixing device 100, the expansion and contraction portion 105 is stretched and contracted. The pressure change of the capsule pumps 106a, 106b is very small 0.02Mpa, which greatly affects the supply of hydrogen peroxide and sulfuric acid, as shown in Fig. 5, because of the various reasons such as the pulsation of the bellows pump 106a, 106b, etc. A large flow rate fluctuation occurs irregularly between the hydrogen peroxide flow rate and the sulfuric acid flow rate, and is different from the desired mixing ratio. As described above, in the chemical-solution mixing device 100 having the above configuration, when hydrogen peroxide and sulfuric acid are mixed, the mixing ratio of hydrogen peroxide to sulfuric acid in the mixed chemical solution frequently fluctuates, so that it is difficult to maintain a certain mixing. The ratio of the mixed chemical solution is stably supplied to the substrate processing apparatus 102.

Therefore, this flow rate change is when the mixed liquid is generated in advance. When storing in the drug solution storage tank, it is only necessary to adjust the mixing ratio of the mixed drug solution by the drug solution storage tank. Therefore, even if the mixing ratio of hydrogen peroxide and sulfuric acid is mixed, there is some variation, and no major problem is caused. However, when the mixed solution is supplied as it is to the surface of the substrate to remove the photoresist, when the mixing ratio of hydrogen peroxide to sulfuric acid in the mixed solution is not adjusted to a desired value, there is The excessive formation of persulfate in the mixed chemical solution causes a major problem that it is difficult to remove the photoresist on the surface of the substrate.

Here, to solve this because of the bellows pump 106a, 106b The variation of the mixing ratio of the mixed chemical solution generated by the pulsation is unstable, as shown in Fig. 6 which is given the same number in the corresponding portion of Fig. 4, and the substrate including the chemical liquid mixing device 120 which does not use the bellows pump is also considered. The cleaning device 121. The chemical liquid mixing device 120 has a bellows pump which is a cause of pulsation when hydrogen peroxide and sulfuric acid are supplied, and the pulsation-free pressure feeding mechanisms 127a and 127b are respectively provided in the hydrogen peroxide storage tank 103 and sulfuric acid. The composition of the storage tank 104. In this case, in the chemical liquid mixing device 120, an inert gas such as nitrogen gas is supplied from the respective pressure feeding mechanisms 127a, 127b to the hydrogen peroxide storage tank 103 and the sulfuric acid storage tank 104.

Thereby, the hydrogen peroxide in the hydrogen peroxide storage tank 103 is The inert gas from the pressure feed mechanism 127a is pressurized and can be supplied to the hydrogen peroxide supply pipe 124a. Further, the sulfuric acid in the sulfuric acid storage tank 104 is also pressurized by the inert gas from the pressure feed mechanism 127b, and can be supplied to the sulfuric acid supply pipe 124b. The chemical liquid mixing device 120 is opened by the valve bodies 126a, 126b respectively provided on the hydrogen peroxide supply pipe 124a and the sulfuric acid supply pipe 124b, and the hydrogen peroxide pressurized by the inert gas of the pressure feeding mechanisms 127a, 127b can be used. Sulfuric acid, which is supplied to the junction 105. In addition, the chemical solution mixing device 120 can be supplied to the substrate processing apparatus 102 through the mixed chemical supply pipe 111c shortly after the mixed chemical solution generated by the merging portion 105 is generated.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-41794

Here, in the chemical-solution mixing device 120, a flow meter (not shown) is provided in each of the hydrogen peroxide supply pipe 124a and the sulfuric acid supply pipe 124b, and the flow rate fluctuations of the hydrogen peroxide flow rate and the sulfuric acid flow rate are investigated. Specifically, the supply amount of the inert gas of each of the pressure feeding mechanisms 127a and 127b is set individually so that the mixing ratio of the mixed chemical liquid is an optimum value, and the hydrogen peroxide flow rate and the sulfuric acid flow rate after actually generating the mixed chemical liquid are actually generated. Each flow rate is varied and measured by each flow meter. As a result, in the liquid chemical mixing device 120, the results shown in Fig. 7 were obtained.

As a result of the seventh drawing, when the mixed chemical solution is generated, the flow rate is increased, and the sulfuric acid having a relatively high viscosity is separated from the former chemical liquid mixing device 100 after the valve body 126a is opened for a predetermined period of time (Fig. 3). In comparison, a pulsation-free and stable flow of sulfuric acid can be maintained. However, with regard to hydrogen peroxide having a small flow rate and low viscosity, even if the valve body 126b is opened and a predetermined period of time elapses, an irregular disorder occurs in the flow rate of the hydrogen peroxide, and it is difficult to maintain a stable flow rate of hydrogen peroxide.

As a result, the reason why hydrogen peroxide and sulfuric acid produce different results is presumed to be that the amount of hydrogen peroxide contained in the mixed chemical solution is much lower than that of sulfuric acid. That is, in order to supply a small amount of hydrogen peroxide to the merging portion 105, it is necessary to reduce the pressure by the inert gas of the pressure feeding mechanism 127a, in the inert gas. The portion of the body pressure reduction is easily affected by the pressure state or the like in the hydrogen peroxide supply pipe 124a. As a result, even if pressurized with an inert gas, the flow rate of hydrogen peroxide becomes unstable. In the liquid chemical mixing device 100, 120 of the former and the latter, the mixing ratio of sulfuric acid and hydrogen peroxide in the mixed chemical solution changes irregularly shortly after the mixed chemical solution is generated. It is difficult to maintain the mixing ratio of the mixed liquid to be a certain problem.

Here, the present invention has been developed in consideration of the above points, the purpose of which is It is proposed to supply a substrate processing apparatus without deteriorating the mixed chemical solution for a long period of time, and to suppress a change in the mixing ratio of sulfuric acid and hydrogen peroxide when the mixed chemical liquid is generated, thereby generating a mixed drug that maintains a certain mixing ratio. Liquid chemical mixing device.

In order to solve the above problems, the patent application scope of the present invention is the first item, The invention relates to a substrate processing device which mixes sulfuric acid and hydrogen peroxide to form a mixed chemical solution, and supplies the mixed liquid to the photoresist for removing the substrate, which is characterized in that: the pressure feeding mechanism is included Pressurizing the sulfuric acid with an inert gas, and pumping the sulfuric acid to the confluent portion; and quantifying the pump so that the hydrogen peroxide is less than a certain amount of the sulfuric acid, and is emitted to the confluent portion; and the mixed liquid supply mechanism is The mixed chemical solution obtained by mixing the hydrogen peroxide and the sulfuric acid by the merging portion is supplied to the substrate processing apparatus.

According to the first item of the patent application scope of the present invention, the sulfuric acid is pressure-fed by the pressure feeding mechanism, thereby stabilizing the flow rate of the sulfuric acid, thereby quantifying the pump to emit a certain amount of hydrogen peroxide and stabilizing the flow rate of the hydrogen peroxide. The merging unit generates a mixed liquid solution from sulfuric acid and hydrogen peroxide, so that the mixed liquid solution is supplied as it is after the generation. When the substrate processing apparatus is supplied, the mixed chemical solution can be supplied to the substrate processing apparatus without deterioration for a long period of time, and when the mixed chemical liquid is generated, the fluctuation ratio of the hydrogen peroxide to the sulfuric acid can be suppressed, and the mixture can be maintained and maintained. A mixture of ratios.

1‧‧‧Substrate processing unit

10‧‧‧Drug and liquid mixing device

25a‧‧‧Circular path

25b‧‧‧Auxiliary circulation path

26‧‧‧In-tube heater (heating mechanism)

28c‧‧‧ Mixed liquid supply pipe (mixed liquid supply mechanism)

31a‧‧‧Upstream side valve (path switching mechanism)

31b‧‧‧ downstream side valve (path switching mechanism)

32a‧‧‧sulfuric acid supply valve (path switching mechanism)

32b‧‧‧Auxiliary circulation side valve (path switching mechanism)

33‧‧‧Quantitative storage tubes (quantitative storage mechanism)

35‧‧‧pressure feeding mechanism

38‧‧‧Quantitative pump

105‧‧‧Confluence Department

Fig. 1 is a schematic view showing the overall configuration of a substrate processing apparatus connected to the chemical-solution mixing apparatus of the present invention.

Fig. 2 is a view showing the overall configuration of a substrate cleaning apparatus including the chemical liquid mixing device of the present invention.

Fig. 3 is a graph showing the flow rate of sulfuric acid of the chemical liquid mixing device of the present invention.

Fig. 4 is a view showing the overall configuration of a substrate cleaning apparatus having a prior chemical liquid mixing device using a bellows pump.

Fig. 5 is a graph showing the flow rate of hydrogen peroxide and the flow rate of sulfuric acid in the chemical liquid mixing device shown in Fig. 4.

Fig. 6 is a view showing the overall configuration of a substrate cleaning apparatus having a prior chemical liquid mixing device using a pressure feeding mechanism.

Fig. 7 is a graph showing the flow rate of hydrogen peroxide and the flow rate of sulfuric acid in the chemical liquid mixing device shown in Fig. 6.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

(1) Outline of a substrate processing apparatus used in the chemical liquid mixing device of the present invention

In the first drawing, reference is made to a substrate processing apparatus using a mixed chemical solution produced by the following chemical mixing device of the present invention. Here, first explain the use of a small amount of mixed drugs The configuration of the substrate processing apparatus 1 for removing the substrate surface 3a photoresist can be described. Next, the chemical liquid mixing device of the present invention will be described. Actually, the substrate processing apparatus 1 includes a casing 1d having a bottomed cylindrical shape and having an opening 1a on its upper surface, and the rotary table 2 composed of a plate-like member has a structure horizontally disposed in the casing 1d, thereby being rotatable The stage 2 holds the substrate 3. At the turntable 2, the plurality of holding members 4 holding the substrate 3 are formed on the other surface, and the cylindrical member 5 extending from the bottom surface 1b of the casing 1d and serving as a rotating shaft is coupled to the other surface.

A plurality of clamping members 4 are arranged along the outer circumference of the rotary table 2 The substrate 3 is sandwiched from the outer periphery and kept away from the turntable 2 by a predetermined distance, so that the substrate 3 can be kept substantially parallel with respect to the turntable 2. In this embodiment, the sandwiching member 4 is formed of a pin shape, and the step portion 4a is formed at a predetermined distance from the tip end, and the substrate 3 abuts against the step portion 4a, whereby the substrate 3 can be surely set to a predetermined height. Position horizontally. Further, the step portion 4a is formed such that the height from the turntable 2 to the substrate 3 becomes an optimum position. Here, when the substrate 3 is held by the holding member 4, the substrate 3 is positioned such that the surface of the circuit is finally formed, and the processing surface (substrate surface 3a) on which the photoresist is formed to form the circuit faces the rotating table 2.

Further, the substrate processing apparatus 1 holds the substrate 3 on the turntable 2 so that the substrate processing apparatus 1 The substrate surface 3a faces the outer casing 1d while maintaining the substrate 3 in the vicinity of the opening 1a of the outer casing 1d. Thereby, the substrate processing apparatus 1 can form a small gap between the peripheral edge of the opening 1a and the opposing portion of the outer periphery of the substrate 3. Further, the cylindrical member 5 coupled to the other surface of the turntable 2 is rotatably supported by a bearing 5a provided on the bottom surface 1b of the casing 1d. Further, the cylindrical member 5 is driven by the rotational driving force of the electric motor M through the belt 7 and the pulley 6. Thereby, the cylindrical member 5 is driven by the electric motor M to be rotated while being supported by the bearing 5a, so that the rotatably The other end of the rotary table 2.

Further, at the cylindrical member 5, the treatment liquid pipe 8 and the water delivery pipe 9 The processing liquid pipe 8 is supplied to the outer casing 1d as a mixed chemical liquid for the photoresist stripping treatment liquid, and the water supply pipe 9 supplies the pure water as the cleaning liquid to the outer casing 1d. Inside. The processing liquid pipe 8 is connected to a mixed chemical supply pipe of the following chemical liquid mixing device 10 at one end, and the tip end opening of the other end is disposed so as to face the central portion of the substrate 3 sandwiched by the sandwiching member 4. Thereby, the processing liquid pipe 8 releases the mixed chemical liquid from the chemical liquid mixing device 10 from the tip opening, and the mixed chemical liquid can be supplied toward the central portion of the substrate surface 3a. Further, a cleaning liquid supply mechanism 11 is connected to one end of the water delivery pipe 9. The tip opening of the other end of the water delivery pipe 9 is disposed such that the central portion of the substrate 3 held by the holding member 4 causes the pure water from the cleaning liquid supply mechanism 11 to be released from the tip opening, so that the pure water can be made It is supplied toward the central portion of the substrate surface 3a.

Further, the outer casing 1d is connected to the discharge port 1c of the suction mechanism 12 Included in the bottom surface 1b, the outer casing 1d is attracted by the suction mechanism 12, whereby the outside air is sucked from the gap between the opening 1a and the substrate 3 to form a gas flow flowing from the upper side to the lower side, whereby the air flow can be made inside the outer casing 1d. The mixed chemical or steam is discharged to the outside from the lower discharge port 1c. Further, an infrared lamp 13 as a substrate heating mechanism is provided above the opening 1a of the outer casing 1d. The infrared lamp 13 is supported by the support mechanism 15 and can be retracted from the opening 1a, and positioned above the opening 1a, in the outer casing 1d, from the opening 1a toward the inner surface of the substrate 3 held on the rotary table 2. The substrate 3 can be heated by directly irradiating infrared rays. Further, a supply pipe 16 for supplying the pure water upper portion is provided above the opening 1a, and the inner surface of the substrate 3 can be washed by the pure water supplied from the upper water pipe 16.

In the above configuration, in the substrate processing apparatus 1, the liquid medicine At the time of the treatment, the electric motor M is first driven to rotate the holding table 2 of the substrate 3, and the suction mechanism 12 sucks the gas in the casing 1d, whereby the outside air is sucked into the casing 1d from the opening 1a to form an external gas flow from above. The air flow to the lower discharge port 1c. In this state, the mixed chemical liquid supplied from the chemical liquid mixing device 10 is supplied from the tip end opening of the processing liquid pipe 8 to the central portion of the substrate surface 3a at the substrate processing apparatus 1. By the rotation of the substrate 3, the mixed chemical solution is uniformly expanded toward the outer circumference while being radioactively expanded toward the circumferential direction. At this time, the infrared lamp 13 is placed above the opening 1a, and the substrate 3 is heated from the inner surface side by the infrared lamp 13 to about 130 ° C to 300 ° C. Thereby, the mixed chemical solution contacting the substrate surface 3a is optimally heated by the heat of the substrate 3, and the formation of persulfuric acid is promoted, and the photoresist of the substrate surface 3a can be further removed by the persulfuric acid.

Therefore, it is assumed that when the substrate 3 is not heated by the infrared lamp 13, it is separate When the mixed chemical solution is supplied to the substrate 3, when the mixed chemical solution contacts the lower temperature substrate 3, the heat of the mixed chemical solution is absorbed by the substrate 3, and as a result, the temperature of the mixed chemical solution is lowered, and the generation of persulfuric acid is not promoted. . Therefore, in this case, it is necessary to supply a large amount of the mixed chemical solution heated to a high temperature to the substrate 3 to prevent the temperature of the mixed chemical solution from being lowered.

On the other hand, in the substrate processing apparatus 1, infrared rays are used. The lamp 13 heats the substrate 3 in advance, so that the substrate 3 itself is also heated to a high temperature. Therefore, the temperature of the mixed chemical solution does not decrease due to contact with the substrate 3, and it is not necessary to supply a large amount of mixed chemical solution to the substrate 3, for example, 50 (ml/min). The photoresist of the substrate 3 can be efficiently removed by mixing a small amount of the left and right liquid. In this way, in the substrate processing apparatus 1 In this case, the amount of the mixed chemical solution used can be reduced, and as a result, the amount of the mixed chemical solution generated by the chemical liquid mixing device 10 when the photoresist is removed by the substrate processing apparatus 1 can be reduced.

Therefore, in the substrate processing apparatus 1, self-contact is heated The object which generates the steam to the mixed liquid of the substrate 3 at a high temperature is guided by the airflow flowing downward from the outside air taken in by the opening 1a, and the steam is guided to the discharge port 1c to be discharged to the outside of the casing 1d. Further, in the substrate processing apparatus 1, it is possible to prevent the mixed chemical liquid or vapor from leaking from the opening 1a to the outside of the outer casing 1d, and it is also difficult to adhere the mixed chemical liquid or steam to the inner wall of the outer casing 1d, and the inside of the outer casing 1d can be reduced. The number of washing operations. Further, in the substrate processing apparatus 1, the substrate 3 is provided between the opening 1a above the casing 1d and the tip opening of the processing liquid pipe 8 below the casing 1d, and the substrate 3 functions as a lid of the opening 1a. The mixed chemical solution or steam can be prevented from being discharged from the opening 1a by the substrate 3, and the ceiling surface or the lid covering the opening 1a need not be provided, and as a result, the cleaning operation or the drying operation of the ceiling surface or the lid can be saved.

(2) The composition of the chemical liquid mixing device of the present invention

Next, a liquid chemical mixing device 10 of the present invention in which the mixed chemical liquid is generated so as to be supplied to the substrate processing apparatus 1 shortly after the production will be described. Here, in FIG. 2, reference numeral 21 denotes a substrate cleaning apparatus 21 which is composed of a plurality of substrate processing apparatuses 1 and a plurality of chemical liquid mixing apparatuses 10, and is provided for one substrate processing apparatus 1 A liquid chemical mixing device 10 can be provided. Therefore, in the second drawing, only one substrate processing apparatus 1 and one chemical liquid mixing apparatus 10 provided corresponding to the substrate processing apparatus 1 are focused, and since the other substrate processing apparatuses and the chemical liquid mixing apparatuses all have the same configuration, Therefore, the description is omitted.

In fact, the substrate cleaning device 21 has one of the stored sulfuric acid. The sulfuric acid storage tanks 104 are configured such that the sulfuric acid storage tanks 104 are shared by a plurality of chemical liquid mixing devices 10. Each of the chemical liquid mixing devices 10 is provided with a hydrogen peroxide supply pipe 28a, supplying hydrogen peroxide to the merging portion 105, a sulfuric acid supply pipe 28b, supplying sulfuric acid to the merging portion 105, a merging portion 105, a hydrogen peroxide supply pipe 28a, and a sulfuric acid supply. The tube 28b is merged; and the mixed chemical supply tube 28c is supplied to the processing liquid tube 8 of the substrate processing apparatus 1 (Fig. 1).

A sulfuric acid storage tank 104 is connected to the sulfuric acid supply pipe 28b in the sulfuric acid Between the storage tank 104 and the merging portion 105, the in-pipe heater 26, the circulation pump 27, the upstream side valve body 31a, and the sulfuric acid supply valve body 32a are sequentially provided from the sulfuric acid storage tank 104. Further, between the sulfuric acid supply valve body 32a and the sulfuric acid storage tank 104, sulfuric acid discharged from the sulfuric acid storage tank 104 by the circulation pump 27 is provided, and the circulation path 25a and the auxiliary circulation path 25b of the sulfuric acid storage tank 104 are returned again. The path of the two systems. Actually, the sulfuric acid supply pipe 28b is closed by the sulfuric acid supply valve body 32a, the supply path to the merging portion 105 is blocked, and the sulfuric acid discharged from the sulfuric acid storage tank 104 is not supplied to the merging portion 105, so that the circulation is continued in the circulation path. One of 25a or the auxiliary circulation path 25b.

In this case, a circulation pipe 30a extending to the sulfuric acid storage tank 104 is provided between the upstream side valve body 31a and the sulfuric acid supply valve body 32a in the sulfuric acid supply pipe 28b, whereby the circulation pipe 30a can be formed. Loop path 25a. The circulation path 25a is a sulfuric acid discharged from the sulfuric acid storage tank 104 by the circulation pump 27, passes through the in-pipe heater 26, the circulation pump 27, and the upstream side valve body 31a, passes through the circulation pipe 30a, passes through the quantitative storage pipe 33, and The downstream side valve body 31b is returned to the sulfuric acid storage tank 104 again. Moreover, the sulfuric acid supply pipe 28b is attached to the circulation pump The auxiliary circulation pipe 30b is provided between the upstream side valve body 31b and the sulfuric acid storage tank 104, and the auxiliary circulation pipe 30b has the auxiliary circulation side valve body 32b. The auxiliary circulation path 25b can be formed by the piping 30b.

Here, at the beginning, the sulfuric acid supply pipe 28b is supplied with sulfuric acid. The valve body 32a and the auxiliary circulation side valve body 32b are closed, and the upstream side valve body 31a and the downstream side valve body 31b which are disposed in the circulation path 25a are opened, whereby the circulation path 25a can be formed. Thereby, in the sulfuric acid supply pipe 28b, the sulfuric acid discharged from the sulfuric acid storage tank 104 flows through the in-line heater 26, the circulation pump 27, the upstream side valve body 31a, and the quantitative storage pipe 33 by the circulation pump 27. The downstream side valve body 31b is returned to the circulation path 25a of the sulfuric acid storage tank 104 again. At this time, in the circulation path 25a, fresh sulfuric acid preheated to the inner heater 26 to about 60 ° C is continuously supplied to the quantitative storage tube 33.

Here, the quantitative storage tube 33 has an inner diameter ratio of a sulfuric acid supply tube The large-sized cylindrical tube body of 28b, and the necessary flow rate (here, 25 ml) of the photoresist of the substrate 3 provided in the outer casing 1d by the substrate processing apparatus 1 can be stored in the tube body. Specifically, the tube system of the quantitative storage tube 33 is formed, for example, by a length of 315 mm and an inner diameter of 22 mm, and the cross-sectional area from the upper portion to the lower portion of the hollow portion in which sulfuric acid is stored (the cross-sectional area orthogonal to the longitudinal direction of the tube body) is approximately Similarly, when pressure is applied from the upper portion to the lower portion, the pressure system is uniformly applied in the longitudinal direction of the tube body.

Further, between the quantitative storage tube 33 and the downstream side valve body 31b, A pressure feed mechanism 35 for supplying an inert gas such as nitrogen gas into the quantitative storage tube 33 from the upper side of the quantitative storage tube 33 is provided. The pressure feed mechanism 35 is made by inert gas The pressure is such that the sulfuric acid stored in the quantitative storage tube 33 can be pressure-fed to the mixed chemical supply pipe 28c through the merging portion 105. Actually, when the sulfuric acid supply pipe 28b is circulated in the circulation path 25a, when the upstream side valve body 31a and the downstream side valve body 31b are closed, the circulation path 25a is blocked, and the sulfuric acid supplied into the quantitative storage pipe 33 is isolated. The sulfuric acid can be temporarily stored in the quantitative storage tube 33.

At this time, in the sulfuric acid supply pipe 28b, it is provided in the auxiliary circulation path. The auxiliary circulation side valve body 32b of 25b is opened, and the sulfuric acid discharged from the sulfuric acid storage tank 104 by the circulation pump 27 flows through the in-tube heater 26, the circulation pump 27, and the auxiliary circulation piping 30b, and returns to the sulfuric acid again. The auxiliary circulation path 25b of the storage tank 104. In this way, in the sulfuric acid supply pipe 28b, even if sulfuric acid is temporarily stored in the quantitative storage pipe 33, the path through which the sulfuric acid flows is switched from the circulation path 25a to the auxiliary circulation path 25b, and the in-pipe heater 26 can be preheated. The fresh sulfuric acid is always continuously circulated in the auxiliary circulation path 25b. Thereby, after the path through which the sulfuric acid flows is again switched from the auxiliary circulation path 25b to the circulation path 25a, the preheated fresh sulfuric acid is supplied to the quantitative storage tube 33 as it is, so that it can be adjusted to generate the mixture in advance. The sulfuric acid at the optimum temperature of the chemical solution is again stored in the quantitative storage tube 33.

Moreover, the sulfuric acid supply pipe 28b is opened by the substrate processing apparatus 1. When the photoresist of the substrate 3 is removed, the inert gas system is supplied from the pressure feed mechanism 35 to the quantitative storage tube 33, and the sulfuric acid supply valve body 32a is opened, and the pressure is supplied by the inert gas supplied from the pressure feed mechanism 35. The sulfuric acid in the quantitative storage tube 33 can be sent to the merging portion 105. At this time, in the quantitative storage tube 33, all of the sulfuric acid stored in the tube body is not discharged, and sulfuric acid may remain only in the tube body. Thereby, the sulfuric acid supply pipe 28b can be stored only in the quantitative storage pipe 33. The sulfuric acid is supplied to the merging portion 105 so that the inert gas supplied to the quantitative storage tube 33 can be prevented from being supplied to the merging portion 105 as it is.

Thereafter, the sulfuric acid supply pipe 28b is a sulfuric acid supply valve body 32a and auxiliary The circulation side valve body 32b is closed again, and the upstream side valve body 31a and the downstream side valve body 31b are opened, the path through which the sulfuric acid flows is switched from the auxiliary circulation path 25b to the circulation path 25a, and the sulfuric acid in the sulfuric acid storage tank 104 starts to circulate again. In the circulation path 25a. Further, in the sulfuric acid supply pipe 28b, when the substrate processing apparatus 1 starts to remove the photoresist of the substrate 3, the sulfuric acid temporarily stored in the quantitative storage tube 33 is supplied by the inert gas to the merging portion 105, and then When the photoresist of the substrate 3 is removed by the substrate processing apparatus 1, the stored sulfuric acid can be supplied again to the quantitative storage tube 33. As a result, in the sulfuric acid supply pipe 28b, the photoresist removal operation of the substrate processing apparatus 1 is performed, and the storage and pressure transfer operation of sulfuric acid is repeated by the quantitative storage tube 33.

In addition, the hydrogen peroxide supply pipe 28a flowing through the hydrogen peroxide is detached. The hydrogen peroxide storage tank 36 is connected to each of the chemical liquid mixing devices 10, and has a quantitative pump 38 between the hydrogen peroxide storage tank 36 and the merging portion 105, so that it can be stored in the hydrogen peroxide storage tank 36. Hydrogen peroxide is supplied to the merging portion 105 by the metering pump 38. In fact, the quantitative pump 38 can emit a certain amount of hydrogen peroxide to the merging portion 105 in one shot, and repeatedly emit the plurality of times at a high speed for a certain period of time, whereby the substrate processing apparatus 1 can be removed. In the case of the photoresist of the substrate 3, one of the necessary amounts of hydrogen peroxide is supplied to the merging portion 105.

Here, the quantitative pump 38 is fired once at a single shot. The amount of discharge is very small, and the trace amount of hydrogen peroxide is instantaneously emitted to the hydrogen peroxide supply pipe 28a at a high pressure, so that the total amount of discharge can be instantaneously injected. It is to maintain stability. Further, the quantitative pump 38 system repeats such a single shot intermittently in a predetermined cycle, and the moment between one shot and one shot is extremely short. Therefore, when observing the continuous flow of hydrogen peroxide supplied to the merging portion 105, The hydrogen peroxide flow does not cause irregular disturbances, and becomes a regular flow of hydrogen peroxide, so that a stable flow of hydrogen peroxide can always be supplied to the junction portion 105.

In fact, in this embodiment, the quantitative pump 38 has a use case. For example, the electromagnetically driven diaphragm type quantitative pump is adjusted to have a discharge amount of 0.8 ml at a time of 0.7 seconds, and the stroke number is 0.2 MPa because the mixing ratio and the flow rate are 65 to 240 spm. Therefore, the electromagnetically driven diaphragm type quantitative pump system applies a voltage to the electromagnetic tube, and the driving force generated in the electromagnetic tube is used to drive the plunger, so that the diaphragm provided at the tip end of the plunger can reciprocate at a certain distance in the pump chamber. Thereby, in the electromagnetically driven diaphragm type quantitative pump, hydrogen peroxide is sucked from the hydrogen peroxide storage tank 36 in response to the reciprocating movement of the diaphragm, and the inhaled amount of hydrogen peroxide is discharged as it is to the merging portion 105, thereby realizing There is no irregular and stable flow of hydrogen peroxide in the flow of hydrogen peroxide.

Therefore, in this embodiment, the quantitative pump 38 system is arranged in the joint In the vicinity of the flow portion 105, the amount of discharge of one shot is small, and the small amount of hydrogen peroxide can surely reach the merging portion 105.

In this way, at the merging portion 105, there is no disorder and The hydrogen peroxide having a stable flow rate of hydrogen peroxide is supplied from the hydrogen peroxide supply pipe 28a, and the sulfuric acid having no irregular disorder and stable sulfuric acid flow rate is supplied from the sulfuric acid supply pipe 28b, and these peroxidations can be mixed. Hydrogen and sulfuric acid to form a mixed chemical solution.

Here, in the merging portion 105, the hydrogen peroxide is adjusted in advance. The flow rate is stably supplied from the hydrogen peroxide supply pipe 28a, and the previously adjusted sulfuric acid flow rate is stably supplied from the sulfuric acid supply pipe 28b, so that the mixing ratio of hydrogen peroxide and sulfuric acid is not disordered, compared with the previous object. A mixed chemical solution in which the mixing ratio is maintained at a certain value can be generated. Further, the merging portion 105 is opened by the valve body 39 of the mixed chemical supply pipe 28c, and is supplied through the mixed chemical supply pipe 28c to supply the mixed chemical to the substrate processing apparatus 1 side.

Therefore, the liquid chemical mixing device 10 of the present invention is supplied to the substrate The mixed chemical solution of the device 102 is an optimal mixing ratio of persulfuric acid. Preferably, for example, hydrogen peroxide and sulfuric acid are set to 1:4 to 8, and the chemical liquid mixing device 10 adjusts the pressure feeding mechanism 35 and the quantitative aid separately. Pu 38, for example, the mixing ratio of hydrogen peroxide to sulfuric acid is 1:4, so that the mixed ratio of the thus adjusted mixing ratio can be supplied to the substrate at a flow rate of 50 to 100 (ml/nin) for about 30 seconds. Processing device 1.

At the mixed chemical supply pipe 28c, there is a branching portion and a mixed drug The hydraulic feed mechanism 118 is supplied with the mixed chemical solution from the merging portion 105, and is supplied to the branching portion by an inert gas such as nitrogen gas supplied from the mixed drug hydraulic pressure transmitting mechanism 118. Here, one of the branch portions has a substrate processing apparatus connection tube 43a connected to the substrate processing apparatus 1, and on the other side, a collection unit connection tube 43b connected to the mixed chemical solution recovery unit (not shown). In this case, when the mixed chemical solution is supplied from the merging portion 105, the valve body 42a provided in the substrate processing apparatus connecting pipe 43a is closed, and the valve body 42b provided in the collecting portion connecting pipe 43b is opened. Thereby, the mixed chemical liquid supplied from the merging portion 105 is not supplied to the substrate processing apparatus 1, and can be supplied to the mixed chemical liquid collecting unit through the collecting portion connecting pipe 43b.

Here, the supply from the sulfuric acid supply pipe 28b to the merging portion 105 is started. As shown in Fig. 3, the sulfuric acid at the time is greatly changed from the beginning to the start of the generation of the mixed chemical solution, and after a predetermined period of time (about 50 seconds in the graph of Fig. 3, hereinafter referred to as "supply stabilization time") , becomes a disorderly and stable sulfuric acid flow without irregularities. Therefore, the mixed chemical liquid at the initial stage when the mixing unit 105 starts mixing hydrogen peroxide and sulfuric acid changes the mixing ratio in accordance with the fluctuation of the sulfuric acid flow rate. Here, in the mixed chemical supply pipe 28c, the valve body 42a of the substrate processing apparatus connection pipe 43a is closed, and the valve body 42b of the collection part connection pipe 43b is opened, and the mixed chemical liquid of the initial stage after the mixing ratio is changed can be made. It flows to the collection part connection pipe 43b to supply only to the mixed chemical solution collection part.

Thereafter, the mixed chemical supply pipe 28c is a self-contained portion 105 After the start of the production of the mixed chemical solution, the valve body 42a of the substrate processing apparatus connection tube 43a is opened after the supply stabilization time set in advance, and the valve body 42b of the recovery unit connection tube 43b is closed. Thereby, the mixed chemical solution supply pipe 28c is a mixed chemical solution in which the flow rate of sulfuric acid from the sulfuric acid supply pipe 28b is stable, and the mixing ratio of the mixed chemical liquid generated by the joining unit 105 is also stabilized, and is transmitted through the substrate processing apparatus connecting pipe 43a. It is supplied to the substrate processing apparatus 1. Further, in the substrate processing apparatus 1, the mixed chemical solution selected to produce the optimum mixing ratio of persulfuric acid is supplied from the chemical liquid mixing device 10, and the photoresist of the substrate 3 can be surely removed using the mixed chemical solution.

(3) Actions and effects

In the above configuration, in the chemical liquid mixing device 10, the sulfuric acid stored in the quantitative storage tube 33 is pressurized by the inert gas by the pressure feeding mechanism 35, and the sulfuric acid is pressure-fed to the confluent portion 105 so that the supply amount is larger than this. Hydrogen peroxide is further reduced in sulfuric acid, and the amount of the pump 38 is intermittently discharged to the merging portion 105 in a certain amount, and the hydrogen peroxide and the sulfuric acid are mixed by the combining portion 105 to form a mixed chemical solution. Also, in the liquid mixture In the joining device 10, the mixed chemical liquid which is generated shortly after the merging portion 105 is generated is supplied to the substrate processing apparatus through the mixed chemical liquid supply pipe 28c as it is.

In this way, in the chemical liquid mixing device 10, shortly after the generation Since the mixed chemical solution is not temporarily stored and directly supplied to the substrate processing apparatus 1, the mixed chemical liquid which is not deteriorated in the substrate processing apparatus 1 for a long period of time can be used, and the photoresist of the substrate can be removed. Further, in the chemical-solution mixing device 10, when the sulfuric acid is pressure-fed by the pressure-feeding mechanism and the sulfuric acid is supplied to the merging portion 105, the pulsation-free and stable sulfuric acid flow rate can be maintained. Further, in the chemical liquid mixing device, hydrogen peroxide having a small supply amount to the merging portion 105 is supplied to the quantitative pump 33, whereby a certain amount of hydrogen peroxide flow in an injection can be stably emitted. At the same time, one shot is intermittently repeated at a high speed, whereby the hydrogen peroxide continuously supplied to the merging portion 105 is disordered, and a stable hydrogen peroxide flow rate can be supplied to the merging portion 105.

Moreover, in the liquid chemical mixing device 10, it is set to store sulfuric acid The sulfuric acid discharged from the storage tank 104 is returned to the circulation path 25a of the sulfuric acid storage tank 104, and the in-pipe heater 26 of the circulation path 25a is supplied, so that the sulfuric acid circulating in the circulation path 25a is always preheated. In this way, in the chemical liquid mixing device 10, the sulfuric acid is preheated in advance until it is immediately supplied to the substrate processing apparatus, whereby when the substrate processing apparatus 1 is to remove the photoresist, the temperature of the mixed chemical solution can be simply and quickly Rise to the necessary high temperature areas that promote the formation of persulfuric acid. As a result, in the liquid chemical mixing device 10, compared with the case where the substrate processing apparatus 1 heats and mixes the chemical liquid to the high temperature field at a normal temperature, the substrate processing apparatus 1 can heat the mixed chemical liquid to the high temperature field for a short time, only This part can quickly remove the photoresist of the substrate 3.

Moreover, in the chemical liquid mixing device 10, in the sulfuric acid storage tank 104 In addition, when the substrate processing apparatus 1 removes the photoresist of the substrate 3, it is used once. The used amount of sulfuric acid is temporarily stored in the quantitative storage tube 33, and the sulfuric acid in the quantitative storage tube 33 is pressurized by the inert gas from the pressure feeding mechanism 35 to supply sulfuric acid to the merging portion 105. Thereby, the chemical liquid mixing device 10 is applied to the entire large-capacity sulfuric acid storage tank 104 for storing sulfuric acid used for the next removal of the photoresist or for all the sulfuric acid used in the other chemical mixing device. In the comparison of the pressures, it is only necessary to pressurize the sulfuric acid which is the minimum necessary for the action of removing the photoresist once, so that the sulfuric acid can be stably pressure-fed to the merging portion 105 by a small pressurization.

Moreover, in the chemical liquid mixing device 10, it is fixed for a small capacity. The volume storage tube 33 supplies an inert gas so that the sulfuric acid stored in the quantitative storage tube 33 is smoothly fed to the merging portion 105 by the inert gas, whereby the self-quantitative pump 38 is not supplied to the merging portion 105. The influence of the supply pressure by the hydrogen peroxide maintains a stable sulfuric acid flow rate in the merging portion 105.

Moreover, in the liquid chemical mixing device 10, the corresponding substrate processing The quantitative storage tube 33 is separately provided in the apparatus 1. Therefore, the quantitative storage tube 33 can be disposed in the vicinity of the substrate processing apparatus 1, and the inert gas can be supplied to the sulfuric acid storage tank 104 provided away from the substrate processing apparatus 1 to pressurize the sulfuric acid. In contrast, the supply pressure of the inert gas is continuously lowered, and the sulfuric acid in the quantitative storage tube 33 is surely reached to the merging portion 105 and the mixed chemical supply pipe 28c.

Moreover, in this chemical liquid mixing device 10, quantitative storage is provided. In addition to the circulation path 25a of the pipe 33, an auxiliary circulation path 25b for returning the sulfuric acid to the sulfuric acid storage tank 104 is provided, so that the upstream side valve body 31a, the downstream side valve body 31b, and the sulfuric acid supply are used as the path switching mechanism by the opening and closing control. The valve body 32a and the auxiliary circulation side valve body 32b are supplied with sulfuric acid from the sulfuric acid storage tank 104 to the circulation path. One of the diameter 25a and the auxiliary circulation path 25b. In the chemical-solution mixing device 10, the upstream side valve body 31a, the downstream side valve body 31b, the sulfuric acid supply valve body 32a, and the auxiliary circulation side valve body 32b are controlled by opening and closing to control the supply route of sulfuric acid. The sulfuric acid is temporarily stored in the quantitative storage tube 33, and after the sulfuric acid is stored in the quantitative storage tube 33, it can be circulated while preheating the sulfuric acid with the auxiliary circulation path 25b. Thereby, in the chemical liquid mixing device 10, the circulation path 25a is again switched from the auxiliary circulation path 25b, and when the sulfuric acid is stored in the quantitative storage tube 33, the fresh sulfuric acid preheated by the tube heater 26 can be re-heated again. It is quickly stored in the quantitative storage tube 33.

According to the above configuration, in the liquid chemical mixing device 10, The pressure feeding mechanism 35 pressurizes the sulfuric acid to stabilize the flow rate of the sulfuric acid, and at the same time, the hydrogen peroxide is supplied in a smaller amount than the sulfuric acid, and the quantitative pump 38 is injected at a high speed (high-speed injection) in a certain amount, thereby stabilizing the peroxidation. In the hydrogen flow rate, the mixed liquid chemical is generated from the sulfuric acid and the hydrogen peroxide by the merging portion 105, and the mixed chemical liquid is supplied to the substrate processing apparatus 1 as it is, so that the mixed chemical liquid can be supplied without being deteriorated for a long period of time. When the mixed chemical solution is generated in the substrate processing apparatus 1, the mixing ratio of sulfuric acid and hydrogen peroxide can be suppressed from changing, and a mixed chemical solution which maintains a certain mixing ratio can be produced.

(4) Other implementation forms

Further, the present invention is not limited to the embodiment, and various modifications can be made within the scope of the gist of the invention. For example, a heating mechanism other than the in-pipe heater 26 may be used as the heating means. Further, when sulfuric acid is supplied to the merging portion 105, it is not always necessary to temporarily store the sulfuric acid in the quantitative storage tube 33. For example, a pressure feeding mechanism may be provided in the sulfuric acid storage tank 104, and sulfuric acid may be directly fed from the sulfuric acid storage tank 104. Confluence unit 105.

Further, in the above embodiment, the configuration is described The storage tube 33 is in the circulation path 25a. However, the present invention is not limited thereto, and various positions of the sulfuric acid supply tube 28b of the quantitative storage tube 33 other than the circulation path 25a and the auxiliary circulation path 25b may be disposed. A sulfuric acid supply pipe 28b which is not provided with the circulation path 25a and the auxiliary circulation path 25b is applied.

Further, in the above embodiment, the connection liquid medicine has been described. The mixing device 10 to the single-wafer processing type substrate processing apparatus 1 and the mixed liquid chemical necessary for removing the photoresist of one substrate by the substrate processing apparatus 1 are generated by the chemical liquid mixing device 10, but the present invention The present invention is not limited thereto, and the chemical liquid mixing device 10 may be applied to a substrate processing apparatus in which a plurality of substrates are once removed from a photoresist, or a mixture in which the substrate processing apparatus removes a plurality of substrates may be used. The chemical solution is produced by the chemical liquid mixing device 10.

Moreover, in the above embodiment, it is made less than sulfuric acid. The quantitative pump that emits a small amount of hydrogen oxide to the merging portion, although it is described that when the sulfuric acid is supplied from the quantitative storage tube 33 to the merging portion 105, the hydrogen peroxide is less than sulfuric acid and is intermittently and intermittently The quantitative pump 38 is emitted to the merging portion. However, the present invention is not limited thereto, and when the sulfuric acid is supplied from the quantitative storage tube 33 to the merging portion 105, the hydrogen peroxide is not intermittently emitted, so that a certain amount of The quantitative pump for the hydrogen peroxide to be emitted to the confluence portion only once, in this case, as long as the supply pressure of the hydrogen peroxide flow rate which is stable and the hydrogen peroxide flow rate is not changed, and does not affect the quantitative storage tube 33 The supply pressure of the pressure feed can be used to emit hydrogen peroxide to the quantitative pump of the merging portion 105.

In this case, the quantitative pump 38 as in the above embodiment makes one A certain amount of hydrogen peroxide is continuously injected into the quantitative pump of the merging portion 105, and for example, an electromagnetically driven piston type quantitative pump, or an injection pump, a rotary volume type one-axis eccentric thread pump, and the like can be applied. . Further, here, the injection pump has a driving force that causes the syringe to be ejected at a predetermined speed by the driving force of the motor, whereby a certain amount of hydrogen peroxide is continuously emitted to the merging portion 105. Further, the rotary volume type one-axis eccentric threaded pump is a rotor having a male thread in a stator of two female threads, and rotates one of the shaft-shaped structures while being eccentrically moved, and is connected to the stator to rotate the rotor to fill the stators and The hydrogen peroxide in the gap between the rotors is sent out in the axial direction, whereby a certain amount of hydrogen peroxide is continuously emitted to the merging portion 105.

1‧‧‧Substrate processing unit

10‧‧‧Drug and liquid mixing device

21‧‧‧Substrate cleaning device

25a‧‧‧Circular path

25b‧‧‧Auxiliary circulation path

26‧‧‧In-tube heater

27‧‧‧Circular pump

28a‧‧‧Hydrogen peroxide supply pipe

28b‧‧‧ sulfuric acid supply pipe

28c‧‧‧mixed liquid supply tube

30a‧‧‧Circulation piping

30b‧‧‧Assisted circulation piping

31a‧‧‧Upstream side valve body

31b‧‧‧ downstream side valve body

32a‧‧‧Sulphuric acid supply valve body

32b‧‧‧Auxiliary circulation side valve body

33‧‧‧Quantum storage tube

35‧‧‧pressure feeding mechanism

36‧‧‧ Hydrogen peroxide storage tank

38‧‧‧Quantitative pump

39‧‧‧ valve body

42a‧‧‧ body

42b‧‧‧ valve body

43a‧‧‧Substrate processing device connection tube

43b‧‧‧Recycling section connecting pipe

104‧‧‧ sulfuric acid storage tank

105‧‧‧Confluence Department

118‧‧‧Mixed drug hydraulic feeding mechanism

Claims (5)

A liquid chemical mixing device which mixes sulfuric acid and hydrogen peroxide to form a mixed chemical liquid, and supplies the mixed chemical liquid to a substrate processing apparatus using the mixed chemical liquid to remove a photoresist of a substrate, characterized in that it comprises: a pressure feeding mechanism, Pressurizing the sulfuric acid with an inert gas, and pressurizing the sulfuric acid to the confluent portion; and quantifying the pump to make the hydrogen peroxide smaller than the sulfuric acid a certain amount, and ejecting the confluent portion; and mixing the chemical supply mechanism, The mixed chemical solution obtained by mixing the hydrogen peroxide and the sulfuric acid by the merging portion is supplied to the substrate processing apparatus. The chemical-solution mixing device according to the first aspect of the invention, wherein the quantitative pump discharges a predetermined amount of hydrogen peroxide continuously to the merging portion. The chemical liquid mixing device according to claim 1 or 2, further comprising: a circulation path for returning the sulfuric acid discharged from the sulfuric acid storage tank to the sulfuric acid storage tank; and a heating mechanism provided in the foregoing The circulation path is preheated in advance of the sulfuric acid before being supplied to the substrate processing apparatus. The chemical liquid mixing device according to claim 3, wherein the quantitative liquid storage mechanism has a quantitative storage mechanism and the sulfuric acid storage tank Differently, the sulfuric acid used for removing the photoresist of the substrate by the substrate processing device is stored, and the sulfuric acid of the quantitative storage mechanism is pressurized by the inert gas from the pressure feeding mechanism to supply the sulfuric acid to the foregoing Confluence department. The chemical liquid mixing device according to claim 4, further comprising: an auxiliary circulation path, which is different from the circulation path, and returns to the sulfuric acid storage tank by the sulfuric acid heated by the heating mechanism; and the path switching mechanism And flowing the sulfuric acid supplied from the sulfuric acid storage tank to any one of the circulation path and the auxiliary circulation path, wherein the quantitative storage mechanism is disposed in the circulation path, and the path switching mechanism controls the sulfuric acid The supply path stores the sulfuric acid in the quantitative storage mechanism, and at the same time, in the state in which the sulfuric acid is stored in the quantitative storage mechanism, the sulfuric acid is looped through the auxiliary circulation path.