TW201339583A - A testing probe device - Google Patents

Abstract

This invention provides a testing probe device, including a probe foundation and a plurality of probe. The probe foundation comprises a shell with rounding to define a plurality of space. Also, the plurality of probe are set into the corresponding space. Each of probe comprises a rod, a header with setting in a terminal of the rod, and a wire with connecting to the rod.

Description

Test probe device

The present invention relates to a test probe, and more particularly to a test probe device that extends the life of the needle and accurately transmits the test signal.

With the advancement of semiconductor technology, the precision of testing and verification of semiconductor component testing machines is higher, and the more common one is that the probes are in contact with the semiconductor device under test, and the test signals are transmitted.

Please refer to the first figure. The first figure is a side cross-sectional view of a conventional test probe. As shown in the figure, the test probe 1 is set in a test with two corresponding openings 20, 20'. In the accommodating space 21 of the seat 2, a cover body 22 is disposed on the test seat 2, and a through port 23 that communicates with the accommodating space 21 is disposed on the cover body 22.

The test probe 1 includes a housing 10 having an upper opening 100 and a lower opening 101. The housing 10 is provided with an upper probe 11 and a corresponding one connected by two ends of a resilient member 13. The probe 12, wherein the upper probe 11 and the lower probe 12 are respectively provided with bumps 110, 110' and bumps 120, 120', and the front ends of the upper probe 11 and the lower probe 12 are respectively The upper needle 111 and the lower needle 121 are disposed, and when the elastic member 13 pushes the upper probe 11 and the lower probe 12 upward and downward respectively, the protrusions 110, 110' and the convex portions of the upper probe 11 and the lower probe 12 are convex. The blocks 120 and 120' respectively abut against the inner wall of the casing 10 at the upper opening 100 and the lower opening 101, and the upper needle 111 and the lower needle 121 are respectively disposed outside the upper opening 100 and the lower opening 101.

As described above, the upper needle 111 and the lower needle 121 are respectively provided with a conducting portion 24 and a receiving portion 25, wherein the conducting portion 24 and the receiving portion 25 are respectively provided with an upper needle 111 and a lower needle 121. Conduction point 240 and receiving point 250.

Referring to the second drawing, the second drawing is a side view of a conventional test probe. As shown in the figure, when the test probe 1 is implemented, the conduction point 240 of the conductive portion 24 is The upper needle 111 is in contact with each other, and the receiving point 250 of the receiving portion 25 is brought into contact with the lower needle 121, so that the conducting portion 24 and the receiving portion 25 press the upper probe 11 and the lower probe 12 toward the elastic member 13, and at this time, The upper probe 11 and the lower probe 12 are biased against the inner wall of the casing 10 by a half-turn surface contact with the elastic member 13, and the elastic member 13 is subjected to the upper probe 11 and the lower probe. The thrust of 12 is irregularly skewed and abuts against the inner wall of the casing 10, so that the conductive point 240, the upper probe 11, the casing 10, the lower probe 12, and the receiving point 250 form an electrical signal path, or may be conducted by conduction. Point 240, upper probe 11, spring element 13, lower probe 12, and receiving point 250 form an electrical signal path.

According to the above, the electrical signal path formed by the conductive point 240, the upper probe 11, the elastic element 13, the lower probe 12 and the receiving point 250 is conventionally known, and since the elastic element 13 is conventionally spring-based, it has The high impedance and the inability to withstand large currents, therefore, the signal attenuation of the electrical signal after passing through the elastic element 13 is very serious, thereby affecting the accuracy of the semiconductor component test, and will result in a reduced test range; and conventionally, through the conduction point 240, The signal path formed by the upper probe 11, the housing 10, the lower probe 12 and the receiving point 250 can eliminate the signal attenuation caused by the elastic member 13, but the inner wall of the housing 10 is subjected to the probe 11 for a long time. The friction of the elastic member 13 and the lower probe 12 generates metal debris, and causes metal debris to accumulate in the casing 10, thereby affecting signal transmission and accuracy.

In addition, as the number of tests of the test probe 1 increases, the wear of the conductive point 240 and the upper needle 111 and the receiving point 250 and the lower needle 121 becomes more serious, thereby affecting the test signal, causing the user to replace the test probe 1 to maintain The accuracy of the test signal, however, when the test probe 1 is replaced, the cover 22 must be opened first, so that the test probe 1 has been taken out, and the entire affected work line is bound to be delayed, and only the upper needle 111 or If the lower needle 121 is worn, the entire test probe 1 must be replaced, which is completely uneconomical.

In view of this, the inventor of this case, based on his years of research and development experience in related fields, conducted in-depth discussions on the aforementioned shortcomings, and actively sought solutions based on the above-mentioned needs. After a long period of hard work and repeated tests, this was finally completed. creation.

Accordingly, it is an object of the present invention to provide a test probe apparatus that extends probe life and accurately transmits test signals and reduces production costs.

According to the above object, the test probe device of the present invention comprises a test stand and a plurality of probes. The test stand includes a housing surrounding the plurality of accommodating spaces. The plurality of probes are respectively disposed in the accommodating space, and each of the probes includes a rod body portion, a head portion disposed at a top end of the rod body portion, and a wire connecting the rod body portion.

It can be seen from the above description that the present invention is a test probe for testing semiconductor components, and its main function is to sequentially pass the test signal from top to bottom through the head of the probe, the body of the rod and the wire, and finally by the wire. An external semiconductor device under test is connected to form a telecommunication path for conducting test signals to the external semiconductor device under test for semiconductor test operations. Since the test signal is directly connected by wires, there is no problem of signal attenuation and inability to withstand large currents or transmit high frequency signals, which is indeed in line with the industry.

The details of the related patents and the technical contents of the present invention will be apparent from the following detailed description of the preferred embodiments of the drawings.

First, please refer to the third drawing; the third drawing is a side cross-sectional view of the first preferred embodiment of the present invention.

As can be seen from the figure, the test probe device of the present invention is suitable for being electrically connected to an external semiconductor device under test 5 having a plurality of contacts 51 (only one contact is shown in the figure). The test probe device includes a test stand 3 and a plurality of probes 4. The test seat 3 includes a housing 31 that defines a plurality of accommodating spaces 30. The plurality of probes 4 are respectively disposed in the accommodating space 30, and each of the probes 4 includes a rod body portion 41, a head portion 42 disposed at the top end of the rod body portion 41, and a connecting rod portion 41. The wire 43 and an elastic member 44 disposed in the accommodating space and disposed inside the rod portion 41.

In the first preferred embodiment, the test socket 3 further includes a cover 32 disposed above the housing 31. The cover 32 defines a plurality of through holes 321 corresponding to the plurality of receiving spaces 30. The head 42 of the probe 4 can protrude from the cover 32 via the plurality of through holes 321 .

Each of the probes 4 further has a shoulder portion 45 disposed between the head portion 42 and the rod portion 41. The shoulder portion 45 is for connecting the head portion 42 and the rod portion 41. Both ends of the elastic member 44 are supported against the shoulder portion 45 and the housing 31.

Here, it should be noted that in the first preferred embodiment, the wire 43 is connected to the top end of the rod portion 41 and below the shoulder portion 45, and the connection manner thereof may be a wire bonding method. Connections can also be made by soldering them.

Referring to FIGS. 4 and 5, when the semiconductor device under test 5 and the probe 4 are brought into contact, the head 42 of the probe 4 is pressed downward by the contact 51, thereby causing the rod body. The portion 41 goes down to the accommodating space 30, and the elastic member 44 accumulates an elastic restoring force. Similarly, when the semiconductor device under test 5 and the probe 4 are not touched together, the elastic member 44 The elastic restoring force drives the rod body portion 41 to protrude above the accommodating space 30 until the shoulder portion 45 of the probe 4 and the cover body 32 abut each other.

As can be seen from the above description, the probe device for testing of the present invention does not transmit the signal by the structure of the probe 4 itself, but uses the wire 43 as a channel for signal transmission. Therefore, the conventional elastic element can be avoided. The resulting signal attenuation, because the conductor 43 can withstand higher current and high frequency signals than the conventional signal transmission, and the impedance of the transmitted signal is also low, so that the limitation of signal transmission can be overcome, and the accuracy of the test signal can be improved. .

Please refer to FIG. 6 , which is a perspective view of a general test system, which mainly includes a test host 6 and a test board 7 electrically connected to the test host 6 . The test probe device of the present invention is electrically connected to the test host 6 by the plurality of wires 43, thereby forming a complete test environment.

Please refer to the seventh figure, which is a side cross-sectional view showing a second preferred embodiment of the present invention. The second preferred embodiment is substantially the same as the first preferred embodiment, and the details are not described herein again, except that the head 42 of the probe 4 is disposed at a non-center of the shoulder 45. That is, the head 42 of the probe 4 is eccentrically disposed, and a recess 451 is formed on the shoulder 45. The head 42 of the probe 4 is detachably spaced from the recess 451 on the shoulder 45. connected. It is worth mentioning that the head 42 is made of tungsten steel.

When the test probe device of the present invention causes the head 42 of the probe 4 to be damaged due to long-term testing, the user only needs to replace the head 42 through the through hole 321 of the cover 32 without having to pay much attention. Opening the cover and replacing the entire set of probes can significantly reduce the cost and improve the testing efficiency of the semiconductor components, which is completely economical.

Please refer to the sixth and eighth figures, which are schematic side views of a third preferred embodiment of the present invention. The third preferred embodiment is substantially the same as the second preferred embodiment, and the same is not described herein except that the wire 43 is connected to the bottom end of the rod portion 41, and the wire is 43 is an embodiment in which the test probe device is electrically connected to the outside of the housing 31 and is electrically connected to the test board 7 to provide another test probe device.

In summary, the test probe device of the present invention does have the following advantages:

(1) Improve the accuracy of the test signal

The test probe device of the present invention does not transmit the signal by the structure of the probe 4 itself, but uses the wire 43 as a channel for signal transmission, thereby avoiding the signal attenuation caused by the use of the elastic element. Moreover, since the conductor 43 is subjected to a large current and a high frequency signal in a manner of transmitting a signal, the impedance of the transmitted signal is also low, so that the limitation of the signal transmission can be overcome, and the accuracy of the test signal can be improved.

(two), low loss wear

In the test probe device of the present invention, the head portion 42 is made of a tungsten steel material, so that the head portion 42 can be damaged by the long-term friction of the contact 51 of the semiconductor device under test 5, and can Maintaining the accuracy of the test signal greatly reduces the replacement rate of the needle and prolongs the life of the needle.

(3), reduce costs and improve efficiency

In the test probe device of the present invention, when the head 42 needs to be replaced due to long-term testing, the user only needs to change the head 42 through the through hole 321 of the cover 32 without paying a large fee. Zhou Zhang's opening of the cover 32 and replacement of the entire set of probes 4 can greatly reduce the cost and improve the testing efficiency of the semiconductor components, which is completely economical. The invention further provides an eccentricity in which the head 42 is inserted into the recess 451 of the shoulder 45. Therefore, the test signal can also be accurately transmitted by the wire 43 to achieve the benefit of conducting accurate test signals.

Therefore, the present invention has excellent advancement and practicability in similar products. At the same time, after searching for such technical materials at home and abroad, it is true that no identical or similar documents exist before the application of the case, so the case should have been met. Patent requirements such as "novelty", "progressiveness" and "combination with industrial use" are submitted in accordance with the law.

However, the above description is only for the three preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change of the patent application scope and the description of the invention is Modifications are still within the scope of the invention.

3. . . Test stand

30. . . Housing space

31. . . case

32. . . Cover

321. . . Through hole

4. . . Probe

41. . . Rod body

42. . . head

43. . . wire

44. . . Elastic component

45. . . Shoulder

451. . . Groove

5. . . Semiconductor test component

51. . . contact

6. . . Test host

7. . . Test board

The first figure is a side cross-sectional view of a conventional test probe;

The second figure is a side view of a conventional test probe;

The third drawing is a side cross-sectional view showing a first preferred embodiment of the test probe device of the present invention;

4 is a side cross-sectional view showing a state in which a semiconductor device under test is in contact with the probe in the first preferred embodiment;

5 is a side cross-sectional view showing a state in which a semiconductor device under test and the probe are not in contact with each other in the first preferred embodiment;

Figure 6 is a perspective view of a test environment, illustrating that the test environment includes a test host and a test board;

Figure 7 is a side elevational cross-sectional view showing a second preferred embodiment of the test probe device of the present invention;

Figure 8 is a side elevational cross-sectional view showing a third preferred embodiment of the test probe device of the present invention.

3. . . Test stand

30. . . Housing space

31. . . case

32. . . Cover

321. . . Through hole

4. . . Probe

41. . . Rod body

42. . . head

43. . . wire

44. . . Elastic component

45. . . Shoulder

5. . . Semiconductor test component

51. . . contact

Claims (10)

A test probe device includes: a test seat including a housing surrounding a plurality of accommodating spaces; and a plurality of probes respectively disposed in the accommodating space, each probe including a body portion, a head disposed at a top end of the body portion and a wire connecting the body portion of the rod. The test probe device of claim 1, wherein the test stand further comprises a cover body disposed above the housing, wherein the cover body has a plurality of through holes formed in the plurality of accommodation spaces. The head of the plurality of probes may protrude from the cover through the plurality of through holes. The test probe device of claim 2, wherein each probe further has a shoulder disposed between the head and the rod body for connecting the head and the rod Body. The test probe device of claim 3, wherein each of the probes further comprises an elastic member disposed in the accommodating space. The test probe device of claim 4, wherein the wire is attached to a top end of the shaft portion. The test probe device of claim 4, wherein the wire is connected to a bottom end of the shaft portion. The test probe device of claim 5 or 6, wherein the head of each probe is disposed at the center of the shoulder. The test probe device of claim 5, wherein the head of each probe is disposed at a non-center of the shoulder. The test probe device of claim 7, wherein the shoulder is formed with a groove, and the head of the probe is detachably coupled to the groove on the shoulder. The test probe device of claim 8, wherein the shoulder is formed with a groove, and the head of the probe is detachably coupled to the groove on the shoulder.