TW201339485A - Lamp - Google Patents

Abstract

A first conductive plate (71) for power feeding and a second conductive plate (72) for power feeding are provided within a circuit case (60). The first conductive plate (71) and the second conductive plate (72), respectively, abutting and electrically connected to a pair of connection terminals (101) that constitute a mouthpiece (100), extend from the connection terminals to a circuit case (60), and also extend in the tubular axial direction of the circuit case (60) (namely the lamp axial direction J) towards a substrate (52) constituting a circuit unit (50). Besides, the first conductive plate (71) and the second conductive plate (72), respectively, abut a first power receiving pad (53) and a second power receiving pad (54) formed on the main surface of the substrate (52) so as to electrically connect the circuit unit (50).

Description

Lamp

The invention relates to a luminaire with a semiconductor illuminating element as a light source, in particular to an electrical connection structure between a lamp cap and a circuit unit.

In recent years, a lamp having a semiconductor light-emitting element such as a light-emitting body (LED) as a light source, for example, a bulb-type lamp represented by an LED bulb, has been attracting attention due to its low power consumption and long service life compared with a white heat bulb. The LED light bulb is housed in a casing having a bottomed cylindrical shape, for example, in a circuit unit that is driven by a light having a low DC voltage (Patent Document 1).

In the circuit unit, a power receiving pad (conductive layer) formed on a substrate and a contact piece and a case of a pair of terminals constituting the base are electrically connected by a pair of wires to receive power (Patent Document 2). For the connection work of the pair of wires, for example, the power receiving pads of the substrate are connected to the respective wires by soldering or the like, and after the circuit unit is housed in the case, the respective wires are respectively connected to the contact piece and the case by soldering or the like. connection. Since the connection work of the pair of wires is performed by manual work, there is a problem that the work efficiency is lowered. Therefore, it is required to easily perform an electrical connection structure between the circuit unit and the base of the connection work.

As a technical processing method for the above problem, although it relates to a bulb-type fluorescent lamp, a technique disclosed by the prior art is to use one of the substrates mounted on one of the connection terminals as a contact piece, and the other to contact the case (Patent Document 3). It will be specifically described using the drawings. Figure 19 (a) shows that A perspective view of the connection terminal mounted on the substrate, and Fig. 19(b) is a front view of a portion of the bulb-type fluorescent lamp. As shown in FIGS. 19(a) and 19(b), a connection terminal 201 serving as a contact piece and a connection terminal 202 connected to the outer case 212 are mounted on the substrate 200. Here, the connection terminals 201 and 202 are not formed as a planar member such as a power receiving pad, but are formed by bending a metal plate having physical strength. The main surface of the substrate 200 is housed in the casing 213 (so-called vertical storage) in parallel with the cylinder axis of the base. When the substrate 200 is vertically stored, the connection terminal 201 is fitted into the contact piece of the base, and the connection terminal 202 is fitted into the cover 212 of the base.

[Practical Technical Literature] [Patent Literature]

Patent Document 1 Japanese Patent Laid-Open Publication No. 2007-12288

Patent Document 2 Japanese Patent Laid-Open Publication No. 2010-153220

Patent Document 3 Japanese Patent Laid-Open Publication No. 2001-195902

The above disadvantages caused by the connection method using the wires are solved by employing the technique of the above Patent Document 3. However, as shown in FIG. 19, since the connection terminal 201 mounted on the substrate 200 is used as a contact piece, it is difficult to adopt a structure other than the vertical storage in the storage structure of the substrate 200 to the casing 213. As a result, the substrate 200 is tilted from the cylinder axis of the base to be housed in the casing 213 or the like, and the degree of freedom in designing the storage structure of the circuit unit including the substrate 200 is limited. Further, the connection terminal 201 as a contact piece must be formed on the front side (upper side of the drawing) of the substrate 200. This result, for example, does not correspond to the shape of the circuit component mounted on the substrate 200. The type of formation of the connection terminal 201 is arbitrarily selected, and the degree of freedom in designing the arrangement position of the circuit unit including the substrate 200 is limited.

In view of the above problems, an object of the present invention is to provide a lamp having a semiconductor light-emitting element as a light source, and to provide an electrical connection structure between a circuit unit capable of performing a simple connection operation and a lamp cap, which ensures a degree of freedom in designing a circuit unit. Lighting.

In order to achieve the above object, in a lamp according to an aspect of the present invention, a lamp cap having a pair of connection terminal portions is attached to one end of a tubular circuit case, and the semiconductor light emitting module is outwardly oriented in the direction of the cylinder axis at the other end opening side. Arranged in the light-emitting direction, a circuit unit for supplying power to the semiconductor light-emitting module is housed in the circuit case, wherein the circuit unit includes a substrate on which the circuit component is mounted, and the circuit is not mounted on the surface of the substrate a part of the part forms a pair of power receiving pads; the pair of power receiving pads are connected to the connecting terminal portion of the pair of the lamp head via a pair of power supply conductive plates; the pair of power supply conductive plates are respectively provided at one end, Connected to the pair of connection terminal portions in the inner side of the base, extending from the connection terminal portion to the inside of the circuit cover, and extending along the cylindrical axis toward the substrate in the opening direction of the other end of the circuit cover, and respectively The other end is located in the circuit cover and is in contact with the pair of power receiving pads of the substrate.

In a luminaire according to an aspect of the present invention, a pair of power supply conductive plates that are electrically connected to one of the pair of bases and the connection terminal portions are electrically connected from the connection terminal portion and are disposed in the circuit case. structure.

A pair of power supply conductive plates are disposed in the circuit case in a cylindrical axis direction of the circuit case toward the substrate constituting the circuit unit. Therefore, when the operation of accommodating the circuit unit in the circuit case is performed, the pair of power supply conductive plates may be brought into contact with the pair of power receiving pads formed on the substrate surface constituting the circuit unit. Further, since the pair of power supply conductive plates are configured to be electrically connected to the lamp terminal by abutting one of the bases and the connection terminal portions, the lamp base and the circuit unit can be used as compared with the structure using the conventional wire. Electrical connection is easy.

Further, the present invention has a structure in which a pair of power supply conductive plates are disposed in the circuit case without mounting the terminals on the substrate surface. Therefore, the shape and arrangement of the power receiving pad and the power supply conductive plate can be determined corresponding to the design of the circuit unit such as the housing structure in the circuit case of the circuit unit and the arrangement position of the components constituting the circuit unit. position.

In the above, the luminaire according to one aspect of the present invention ensures the design freedom of the circuit unit and facilitates the electrical connection between the circuit unit and the lamp cap.

Further, in one of the present invention, the conductive plate for power supply extends along the cylindrical axis of the circuit case to the substrate constituting the circuit unit. Here, the "along the cylinder axis" means not only the direction parallel to the cylinder axis but also the direction inclined to the cylinder axis. That is, the conductive plate for power supply can extend toward the substrate in the direction of the cylinder axis.

1, 301‧‧‧ lamps

10, 310‧‧‧ bulb shell

10a, 310a‧‧‧ open side end

10b, 310b‧‧‧ outer perimeter

11‧‧‧ditch

12‧‧‧ gap

20,320‧‧‧Semiconductor lighting module

21, 321‧‧‧ semiconductor light-emitting components

22, 322‧‧‧ Mounting substrate

22a‧‧‧Gap section

23, 323‧‧‧ Sealing body

30, 330‧‧‧ abutments

30a‧‧‧ outer perimeter

31, 33‧‧‧ recess

31a, 40c‧‧‧through holes

32‧‧‧ remaining

40‧‧‧Circuit cover

40a‧‧‧Upper end

40b‧‧‧End

41‧‧‧Protection setting department

41a‧‧‧Clock Department

43‧‧‧ claws

50, 350‧‧‧ circuit unit

51, 351‧‧‧ circuit parts (electronic parts)

51a, 351a‧‧‧ anti-flow coil

51b, 351b‧‧‧ electrolytic capacitor

51c, 351c‧‧ ‧ capacitor

51d, 351d‧‧‧IC

51e, 351e‧‧‧ noise filter

51f, 351f‧‧‧ resistance

52, 200, 352‧‧‧ substrate (circuit board)

52a, 352a‧‧‧ front side end

52b, 352b‧‧‧ rear side end

52c, 352c‧‧‧ back

53, 353‧‧‧1st power receiving pad (1st conductive layer part)

54, 354‧‧‧2nd power receiving mat (2nd conductive layer part)

55, 355‧‧‧ Body Department

55a, 355a‧‧‧ rear side end

56‧‧‧ front end

57‧‧‧Power supply mat

60, 360‧‧‧ circuit cover

60a‧‧‧Open side end

360a‧‧‧Upper end

60b, 360b‧‧‧ bottom

60s, 360s‧‧‧ open face

61, 361‧‧ ‧ locking part (clamping part)

361a, 361b‧‧‧ holding piece

62, 362‧‧ ‧ guidance department (protrusion)

62s, 362a‧‧‧ sloped surface

63‧‧‧Supporting the ditch

64‧‧‧Clock Department

65, 365‧‧‧ Large diameter section (inclined section)

65b, 365b‧‧‧ rear side end

66, 366‧‧‧ Small diameter section (cylinder section)

67‧‧‧Reducing section

67a‧‧‧ front side end

68‧‧‧Extension

68a‧‧‧ inner circumference

70, 370‧‧‧ Conductive plates for power supply (terminals)

71, 371‧‧‧1st power supply conductive plate (1st terminal)

72, 372‧‧‧Second power supply conductive plate (second terminal)

73, 373‧‧‧ The first end of the first power supply conductive plate (the substrate side deformation portion of the first terminal)

73a, 74a, 373a, 374a‧‧‧1st bend position

73b, 74b, 373b, 374b‧‧‧2nd bend position

73c, 74c‧‧‧bend

73d, 74d‧‧‧1st bending position

74, 374‧‧‧2nd front end of the second power supply conductive plate (substrate side deformation part of the second terminal)

75, 76‧‧‧ back end

77, 78‧‧‧ remaining

80, 380‧‧‧ external casing

80a, 380a‧‧‧ inner circumference

90, 390‧‧‧Insulation ring

100, 400, 404‧‧ ‧ lamp holder

100a, 400a‧‧‧ open side end

101, 401‧‧‧ Connection terminal

102, 402‧‧‧Contacts

103, 212, 403‧‧‧ shell

104‧‧‧Insulation

120‧‧‧Electrical components for power supply

121‧‧‧ Rear side end

121a‧‧‧bend position

122‧‧‧ front side end

123‧‧‧Shell

124‧‧‧Insulation coated members

201, 202‧‧‧ connection terminals

213‧‧‧Shell

331‧‧‧Bottom tube

331a‧‧‧ mounting surface

331b‧‧‧Protruding

332‧‧‧Flange

332a‧‧‧ dent

333‧‧‧ Inner Week

340‧‧‧Circuit cover

340a‧‧‧Bottom tube

340b‧‧‧Flange

340c‧‧‧Gap section

343‧‧‧Care Department

343a‧‧‧Snap convex

356‧‧‧Outreach

363‧‧‧ convex

366a‧‧‧tube section

366b‧‧‧ bottom part

366c‧‧‧孔部

367‧‧‧ Linkage Department

368‧‧‧The Department of Engagement

368a‧‧‧Clamping recess

369‧‧‧ interval keeping mechanism

369a, 369b‧‧‧ convex

375, 376‧‧‧ lamp head side deformation

375a, 376a‧‧‧1st bend position

375b, 376b‧‧‧2nd bend position

375c‧‧‧3rd bend position

375d‧‧‧4th bend position

377, 378‧‧‧ Straight line

391‧‧‧ recess

Fig. 1 is a perspective view showing a lamp according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view showing the lamp of the embodiment of the present invention.

Fig. 3 is a view showing the arrow of the lamp of the embodiment taken along the line A-A' in Fig. 2 from the direction a1.

Fig. 4 is a perspective view showing only the circuit unit and the power supply conductive plate taken out from the cross-sectional perspective view of the lamp shown in Fig. 3.

Fig. 5 only shows an arrow view of the circuit case, the power supply conductive plate, the insulating ring, and the lamp cap in the lamp of the embodiment of the A-A' cross section of Fig. 2 viewed from the a2 direction.

Fig. 6 is a cross-sectional view showing a state in which a circuit unit in the lamp of the embodiment is housed in a circuit case; (a) is a B-B which is perpendicular to the A-A' cross section shown in Fig. 2 as viewed from the b1 direction. 'The arrow view of the section; (b) is the arrow view of the B-B' section viewed from the b2 direction.

Fig. 7 is a perspective view showing only the power supply conductive plate in the lamp of the embodiment.

Fig. 8 is a cross-sectional view showing the housing structure of the circuit case of the lamp of the first modification; (a) is an arrow view of the B-B' section perpendicular to the A-A' section shown in Fig. 2 as viewed from the b1 direction. (b) is an arrow view of the B-B' section viewed from the b2 direction.

9(a) and 9(b) are cross-sectional views showing the storage structure of the circuit case of the lamp of the second modification, and the components, the cross-section and the arrow direction shown in the respective drawings are the same as those in Fig. 8.

Figs. 10(a) and 10(b) are cross-sectional views showing the storage structure of the circuit case of the lamp of the third modification, and the components, the cross section, and the arrow direction shown in the respective drawings are the same as those of Fig. 8 except for the support groove portion.

Fig. 11 is an exploded perspective view showing the lamp of Modification 4.

Fig. 12 is an exploded perspective view showing the electrical connection structure of the semiconductor light emitting module and the circuit unit in the lamp of the fifth modification.

Fig. 13 (a) is a perspective view showing only the power supply conductive member in the lamp of the fifth modification shown in Fig. 12; (b) only the circuit unit in the lamp of the modification 5 shown in Fig. 12; A perspective view of the power supply conductive plate, the power supply conductive member, and the insulating member.

Fig. 14 is a partial cross-sectional view showing a portion of a C-C' cross section in the lamp of the fifth modification shown in Fig. 12.

Fig. 15 is an exploded perspective view showing the electrical connection structure of the semiconductor light emitting module and the circuit unit in the lamp of the sixth modification.

Fig. 16 is a perspective view showing only the circuit unit, the power supply conductive plate, and the power supply conductive member in the lamp of the sixth modification shown in Fig. 15 .

Figure 17 (a) is a partial cross-sectional view showing a portion of a C-C' cross section of the lamp of the modification 6 shown in Figure 15; (b) is a perspective view of the circuit cover case of Modification 7; The partial cross-sectional view of a portion of the C-C' cross section in the lamp of the modification 7 shown in (b) is shown.

Fig. 18 is a partial cross-sectional view showing a portion of a C-C' section in the lamp of Modification 8.

19(a) and (b) are diagrams for explaining a conventional technique.

Fig. 20 is a perspective view showing a lamp according to an embodiment of the present invention.

Fig. 21 is an exploded perspective view showing the lamp of the embodiment of the present invention.

Fig. 22 is a view showing the arrow of the lamp of the embodiment taken along the line A-A' in Fig. 21 from the a1 direction.

Fig. 23 is a view showing only an arrow view of the circuit case, the terminal, the insulating ring, and the base of the lamp of the embodiment of the A-A' cross section of Fig. 21 as viewed from the a1 direction.

Fig. 24 is only an arrow view showing the circuit case, the terminal, the insulating ring and the base of the lamp of the embodiment of the A-A' cross section in Fig. 21 viewed from the a2 direction.

Fig. 25 is a perspective view showing the entire circuit unit and the terminal only when the circuit unit and the terminal are taken out from the cross-sectional perspective view of the lamp shown in Fig. 22.

Figure 26 is a perspective view showing only the terminals in the lamp of the embodiment.

Fig. 27 is a cross-sectional view showing a state in which the circuit unit in the lamp of the embodiment is housed in the circuit case; (a) is a B-B which is perpendicular to the A-A' cross section shown in Fig. 21 as viewed from the b1 direction. 'The arrow view of the section; (b) is the arrow view of the B-B' section viewed from the b2 direction.

[Best Mode for Carrying Out the Invention]

Hereinafter, an embodiment of a lamp according to the present invention will be described with reference to the drawings.

A little chain line in each figure represents the lamp axis J. Above the paper is the front of the lamp 1, and below the paper is the rear of the lamp 1. Here, the "lamp axis" refers to an imaginary line of the center of the bulb case 10 when the bulb case 10 is viewed from the front side and the center when the cap 100 is viewed from the rear side.

(general composition)

1 is a perspective view showing a lamp according to the embodiment, FIG. 2 is an exploded perspective view showing the lamp of the embodiment, and FIG. 3 is a view showing the embodiment taken along line A-A' of FIG. 2 from the a1 direction. Arrow view of the luminaire. Further, in Fig. 3, the circuit component 51 located at the A-A' cross section is removed.

As shown in Fig. 1, the lamp 1 of the present embodiment is formed of a structure according to the specification of a white heat bulb, and is a bulb type lamp having the same shape as that of an incandescent light bulb (60W type or 40W type). As shown in FIG. 2 , the lamp 1 includes a bulb shell 10 , a semiconductor light emitting module 20 , a base 30 , a circuit cover cover 40 , a circuit unit 50 , a circuit cover 60 , a power supply conductive plate 70 , an outer casing 80 , Insulation ring 90 and lamp cap 100.

(light head)

The base 100 has a substantially cylindrical shape as shown in FIG. 2, and is formed such that the cylinder shaft coincides with the lamp J. The base 100 is a mounting mechanism for attaching the lamp 1 to the lighting fixture, and is a member that receives power from a socket (not shown) of the lighting fixture. As shown in FIG. 3, the base 100 includes, as a pair of connection terminal portions, a casing 103 having an outer peripheral surface which is externally threaded, and a contact piece 102 which is attached to the casing 103 via the insulating portion 104; and the base 100 is externally fitted The small diameter portion 66 of the circuit case 60.

The type of the base 100 is not particularly limited, but in the present embodiment, an Edison type E26 base is used.

(circuit cover)

As shown in FIG. 2, the circuit case 60 has a bottomed cylindrical shape such as a front side opening and a rear side bottom side, and has a large diameter portion 65 and an outer diameter and an inner diameter large diameter portion 65. Small diameter portion 66. The large-diameter portion 65 having a cylindrical shape and the small-diameter portion 66 having a bottomed cylindrical shape are integrally formed to be connected to each other in the direction of the cylinder axis so that the cylindrical shafts of the two portions coincide with the axis line J of the lamp.

As shown in FIG. 3, the circuit unit 50 is housed in the circuit case 60. The circuit case 60 has a function of ensuring an electrically insulating environment of the circuit unit 50 in addition to being electrically connected to a predetermined member. Therefore, the circuit case 60 is formed of, for example, an insulating material such as resin or ceramic.

The circuit cover case 40, which is an insulating member, is engaged with the opening side end portion 60a of the circuit case 60 so as to close the opening of the circuit case 60. As a result, the electrical insulation of the circuit unit 50 from the base 30 is ensured. The base portion 100 is fitted to the outer casing 103 by fitting the small-diameter portion 66 having the outer peripheral surface of the outer peripheral surface to the rear end portion of the circuit casing 60.

In addition, the shape of the circuit cover 60 is not limited to a bottomed cylindrical shape. The circuit case 60 may have a shape of at least a cylindrical shape, and may have a shape in which the base 100 is attached to one end (rear end portion) in the axial direction and opened at the other end (front end) in the cylinder axis direction.

(conductive plate for power supply)

4 is a perspective view showing only the circuit unit and the power supply conductive plate taken out from the cross-sectional perspective view of the lamp shown in FIG. 3 . Fig. 5 is a view showing only an arrow view of the circuit case, the power supply conductive plate, the insulating ring, and the base of the lamp of the embodiment of the A-A' cross section shown in Fig. 2 viewed from the a2 direction.

As shown in FIGS. 4 and 5, the power supply conductive plate 70 is composed of a pair of first power supply conductive plates 71 and a second power supply conductive plate 72. The power supply conductive plate 70 has a plate shape elongated in the direction of the lamp axis J, and is composed of the following elements: the front end portions 73 and 74 on the side of the substrate 52 on the other end side, and the rear end portions 75 and 76 on the one end side. Side of the lamp head 100 side; and the remaining parts 77, 78, especially remaining Partial composition. The front end portions 73 and 74 have the first bending positions 73a and 74a and the second bending positions 73b and 74b, and have a bent shape.

The power supply conductive plate 70 has a function of electrically connecting the base 100 to the circuit unit 50. Therefore, the power supply conductive plate 70 is formed using a conductive material, and for example, a copper alloy having excellent conductivity is preferably used. Further, the power supply conductive plate 70 must be disposed at a predetermined position in the circuit case 60, and it is preferable to use a metal material having excellent rigidity in order to maintain the predetermined position. For example, a copper alloy excellent in rigidity is preferably used.

As shown in FIG. 5, the pair of power supply conductive plates 70 are disposed in the circuit case 60 such that the remaining portions 77 and 78 are not recessed into the side walls. The first power supply conductive plate 71 constituting the power supply conductive plate 70 is electrically connected to the contact piece 102 constituting one of the bases 101 in the connection terminal portion 101. The rear end portion 75 extends from the contact piece 102 toward the bottom portion 60b of the circuit case 60 and is disposed to extend along the inner surface of the bottom portion 60b. The remaining portion 77 connected to the rear end portion 75 is disposed in a region (a broken line portion in the drawing) that is embedded in the small-diameter portion 66 so as to extend toward the front side in the direction of the cylinder axis of the circuit case 60. The front end portion 73 is connected to the remaining portion 77, and the conventional substrate 52 is extended from the front end side inner peripheral surface of the small diameter portion 66 toward the front side of the cylindrical shaft, and is disposed in the large diameter portion 65.

On the other hand, the second power supply conductive plate 72 has a rear end portion 76 that is electrically connected to the outer casing 103 and the opening-side end portion 100a of the outer casing 103, which constitute one of the bases 100 of the base. The rear end portion 76 is disposed to extend from the outer casing 103 toward the outer peripheral surface of the circuit casing 60. The remaining portion 78 connected to the rear end portion 76 is disposed in a region (a broken line portion in the drawing) embedded in the small-diameter portion 66 so as to extend toward the front side in the direction of the cylinder axis of the circuit case 60. The front end portion 74 is connected to the remaining portion 78, and the conventional substrate 52 is extended from the inner peripheral surface of the small-diameter portion 66 toward the front side of the cylindrical shaft to be disposed in the large-diameter portion 65.

The first power supply conductive plate 71 and the second power supply conductive plate 72 are arranged to extend toward the substrate 52 constituting the circuit unit 50 in the cylinder axis direction of the circuit case 60. As shown in FIG. 4, the first power receiving pad 53 and the second surface are formed of a metal material on the main surface of the side end portion 52b behind the substrate 52. Power receiving pad 54. The first power supply conductive plate 71 and the second power supply conductive plate 72 are brought into contact with the first power receiving pad 53 by the second bending positions 73b and 74b from the front end portions 73 and 74, respectively. The second power receiving pad 54 is electrically connected to the circuit unit 50.

In the present embodiment, the first power feeding conductive plate 71 and the second power feeding conductive plate 72 constituting the power feeding conductive plate 70 are integrally molded with the circuit case 60. The integrated molding can be carried out by a method such as insert molding or two-color molding using a mold. The shape of the power supply conductive plate 70 corresponds to the shape or arrangement position of the members constituting the stored circuit unit 50. Therefore, for example, it is possible to form a conductive plate 70 for power supply which is formed by a complicated zigzag shape such as a plurality of bendings. As a result, the operation of arranging the power supply conductive plate 70 in the circuit case 60 becomes difficult, and the power supply conductive plate 70 cannot be disposed so as to ensure that the electrical connection between the lamp base 100 and the circuit unit 50 is as good as possible. When the location is configured. However, by integrally molding the power supply conductive plate 70 and the circuit cover 60, the power supply conductive plates 70 having various shapes can be disposed in the circuit cover 60.

In the portion other than the connection terminal portion 101, the first power receiving pad 53, and the second power receiving pad 54, the power supply conductive plate 70 must be disposed in such a manner as to prevent electrical contact with other members. In the present embodiment, the circuit cover 60 is formed using an insulating material. The circuit case 60 is integrally formed with the power supply conductive plate 70, and the remaining portions of the end portions 75 and 76 that abut against the front end portions 73 and 74 of the power receiving pads 53 and 54 after the connection terminal portion 101 are removed are removed. The portions 77 and 78 are buried in the circuit case 60. As a result, the electrical insulation of the power supply conductive plate 70 and other members is ensured.

Further, the power supply conductive plate 70 is not limited to being formed integrally with the circuit cover 60. The power supply conductive plate 70 and the circuit cover 60 may be formed separately, for example, by forming a groove corresponding to the shape of the remaining portions 77, 78 on the inner circumferential surface of the small diameter portion 66, and embedding the remaining portions 77, 78 therein. The groove has a structure in which the power supply conductive plate 70 is disposed in the circuit case 60. The form in which the remaining portions 77 and 78 are embedded in the side wall or the groove formed in the side wall may be selected from the inside of the side wall, that is, the inside of the side wall or the radial direction is larger than the inner diameter of the cylinder, and the cylinder shaft The form of extending parallel to the substrate. The remaining portions 77 and 78 are extended in parallel with the cylindrical axis in the side wall, and are electrically insulated as members other than the power supply conductive plate 70 and the circuit cover 60. The state is better. In addition to this aspect, as an embodiment of the present invention, at least the remaining portions 77 and 78 may be extended to the substrate 52 in parallel with the cylinder axis, or the remaining portion may be disposed in the circuit casing 60 without including the side wall. 77, 78 form.

(circuit unit)

The circuit unit 50 is for lighting the LED 21 of the semiconductor light emitting element. The circuit unit 50 includes, for example, a rectifier circuit that rectifies AC power supplied from a commercial power source into DC power, and a lighting circuit that is configured by an adjustment circuit that adjusts a voltage value of DC power rectified by the rectifier circuit. As shown in FIG. 4, the circuit unit 50 includes circuit components 51 such as a choke coil 51a, an electrolytic capacitor 51b, a capacitor 51c, an IC 51d, a noise filter 51e, and a resistor 51f. The circuit functions of the circuit unit 50 are achieved by the circuit components 51a to 51f.

As shown in FIG. 3, the circuit unit 50 is housed in the circuit case 60 at a position between the base 100 and the base 30 in the direction of the cylinder axis of the circuit case 60. Here, the direction of the cylinder axis refers to the cylinder shaft itself, and the circuit unit 50 is located between the respective intersections of the base 100 and the base 30 with the cylinder axis.

The circuit unit 50 includes a substrate 52 and various circuit components 51. The substrate 52 is composed of a main body portion 55 and a front end portion 56. The former is located on the base 30 side, and the circuit component 51 other than the electrolytic capacitor 51b, which is a circuit component, is mounted on the main surface, and the latter is located on the base 100 side. Hereinafter, the main surface of the mounting circuit component 51 is referred to as a surface on the principal surface of the substrate 52, and the other principal surface is referred to as a back surface.

The main body portion 55 and the front end portion 56 are slightly square, and the front end portion (end portion on the base 30 side) 52a of the substrate 52 is formed at the front side end portion of the main body portion 55; the rear side end portion of the substrate 52 (the base portion) The end portion 52b on the 100 side is constituted by the rear end portion and the front end portion 56 of the main body portion 55.

The first power receiving pad 53 and the second power receiving pad 54 are formed on the surface of the rear side end portion of the main body portion 55. The first power receiving pad 53 and the second power receiving pad 54 are formed of a thin film by a vapor deposition method or the like using a metal material. Therefore, the first power receiving pad 53 is compared with the mounting area of the circuit component 51 in the main surface or the height direction (the direction perpendicular to the main surface) of the substrate 52. The formation region of the second power receiving pad 54 is a small member in the main surface and the height direction, and is particularly small in the height direction. As a result, the mounting area of the circuit component in the substrate can be more ensured than in the conventional device in which the terminal is mounted on the substrate.

In the present embodiment, the first power receiving pad 53 and the second power receiving pad 54 are formed on the surface of the rear side end portion 52b of the substrate 52. The front end portions 73 and 74 of the first power supply conductive plate 71 and the second power supply conductive plate 72 have a shape in which the conventional substrate 52 extends, and the conventional substrate 52 has a shape in which the rear end portion 52b extends. The inner peripheral surface of the front end of the diameter portion 66 protrudes toward the front side of the cylindrical shaft and is disposed in the large diameter portion 65. Therefore, when the substrate 52 is housed in the large-diameter portion 65, the first power supply conductive plate 71 and the second power supply conductive plate 72 are in contact with the first power receiving pad 53 and the second power receiving pad 54. There may be no configuration configuration in which the substrate 52 or the circuit component 51 mounted on the substrate 52 is in contact (refer to FIG. 3). As a result, the electrical connection between the base 100 and the circuit unit 50 is better, and the circuit unit 50 can be easily accommodated in the circuit cover 60.

Electrical wiring (such as a lead wire) not shown in the drawings is led out from the circuit unit 50, and the electric wiring and the power receiving pad (not shown) formed on the main surface of the mounting substrate 22 constituting the semiconductor light emitting module 20 (not shown) Connected. The electric power is supplied in the electrical connection structure, whereby the semiconductor light emitting module 20 emits light.

(circuit cover)

As shown in FIG. 3, the circuit cover cover 40 is disposed between the base 30 and the circuit unit 50 in the lamp axis J direction. The circuit cover cover 40 is made of an insulating material such as resin or ceramic, and functions to ensure electrical insulation between the base 30 and the circuit unit 50. Through holes (not shown) are formed in the thickness direction of the circuit cover cover 40 and the base 30. The electric wires led out from the circuit unit 50 are connected to a power receiving pad (not shown) formed on the main surface of the mounting substrate 22 constituting the semiconductor light emitting module 20 via the through holes.

As shown in FIG. 2, a pair of claw portions 43 are provided in the circumferential direction at the lower end portion 40b of the circuit cover 40 which is slightly rounded. A pair of engaging portions 64 are provided at the opening-side end portion 60a of the circuit cover 60, and the circuit cover cover 40 is held by the circuit cover 60 by locking the claw portion 43 to the engaging portion 64.

(base)

The base 30 is slightly circular as shown in FIG. 2 and is a member for mounting the semiconductor light emitting module 20 on its main surface. Specifically, the semiconductor light emitting module 20 is mounted on a main surface (hereinafter also referred to as a surface) located on the side opposite to the base 100 of the base 30. In addition, the base 30 also functions as a heat sink for the conduction path of the heat generated from the semiconductor light emitting module 20, as shown in FIG. 3, the outer peripheral side surface 30a of the base 30, and the inner peripheral surface 80a of the outer casing 80. The shape is tapered to match the inner peripheral surface 80a. Therefore, heat generated from the semiconductor light emitting module 20 can be conducted to the base 30 via the mounting substrate 22 and conducted to the outer casing 80. Thereafter, the heat conducted to the outer casing 80 is radiated from the outer casing 80 to transfer heat to the air or to the outside through the base 100. In order to fully exert the effect of the heat sink, the base 30 is formed using a metal such as aluminum. Naturally, it may be formed of a thermally conductive resin other than metal.

The base 30 is disposed on the other end side (front side) in the direction of the cylinder axis of the circuit case 60, but the main surface on the rear side of the base 30 is fitted to the circular shape of the upper end portion 40a of the circuit cover cover 40. A recess 33 is formed. By fitting the upper end portion 40a to the concave portion 33, the concave portion 33 is brought into surface contact with the upper end portion 40a, and heat generated from the semiconductor light-emitting module 20 acts as one of the heat conduction paths through the base 30.

(semiconductor light module)

The semiconductor light-emitting module 20 is a light source body of the lamp 1. As shown in FIG. 2, the LED 21 as a semiconductor light-emitting element used as a light source includes a mounting substrate 22 to which the LED 21 is mounted, and a sealing body 23 on the mounting substrate 22. The LED 21 is covered. A power receiving pad (not shown) for receiving power for causing the LEDs 21 to emit light from the circuit unit 50 is formed in a portion that is not covered by the sealing body 23 of the mounting substrate 22.

The sealing body 23 is mainly formed of a light-transmitting material. However, when it is necessary to convert the wavelength of light emitted from the LED 21 to a predetermined wavelength, the light-transmitting material is mixed with a wavelength-converting material having a wavelength of converted light. As the light transmissive material, for example, a silicone resin can be used, and as the wavelength conversion material, for example, phosphor particles can be used. In this embodiment, the LED 21 that emits cyan light is used, and A sealed body 23 formed of a light-transmitting material that converts a cyan light wavelength into a yellow light phosphor particle, and a part of the cyan light emitted from the LED 21 is wavelength-converted into yellow light by the sealing body 23, and the unconverted cyan light The white light generated by the color mixture with the converted yellow light is emitted from the semiconductor light emitting module 20.

The semiconductor light emitting module 20 is mounted on the surface of the base 30. The LED 21 is mounted on the surface of the base 30 such that the main emitting direction of the LED 21 as the semiconductor light emitting element is located in front of the lamp 1. The semiconductor light emitting module 20 is fixed to the surface of the base 30 by an adhesive or a screw.

Further, in the present embodiment, the base 30 and the mounting substrate 22 are separately formed, but the base 30 may be used as the mounting substrate 22. In this case, the LED 21 as a semiconductor light-emitting element is mounted on the surface of the base 30.

(bulb case)

The bulb case 10, as shown in FIG. 2, is a shape that is molded by a bulb ball of a general bulb shape, for example, an A-type bulb, and is a member that covers the semiconductor light-emitting module 20. A diffusion process for diffusing light from the semiconductor light emitting module 20 is applied to the inner surface of the bulb case 10. This diffusion treatment is carried out, for example, with cerium oxide, a white pigment or the like. The light incident on the inner surface of the bulb case 10 passes through the bulb case 10 and is taken out to the outside of the bulb case 10.

The bulb case 10 is held by fixing its open side end portion 10a to the edge of the surface of the base 30 by using an adhesive or the like. Specifically, the opening-side end portion 10a is fixed to the surface of the remaining portion 32 excluding the concave portion 31 provided in the central portion of the base 30 for mounting the semiconductor light-emitting module 20.

Further, the holding form of the bulb case 10 may be in the form of the outer peripheral surface 10b of the bulb case 10 and the outer peripheral surface 30a of the base 30, abutting against the open side end of the outer casing 80. Inner peripheral surface 80a. Since the groove 11 is formed between the bulb shell 10, the base 30 and the outer casing 80, for example, an adhesive is injected into the groove 11, at which the bulb shell 10, the base 30 and the outer casing 80 are integrally fixed. Can also be connected.

The inside of the bulb case 10 is heated by the heat generated by the semiconductor light emitting module 20. Due to this increase in temperature, the number of years of durability of the LEDs 21 of the semiconductor light-emitting device is lowered, and countermeasures must be taken. Therefore, in the present embodiment, the gap 12 is formed between the opening-side end portion 10a and the edge of the recess portion 31 by fixing the opening-side end portion 10a of the bulb case 10 to the surface of the remaining portion 32 of the base 30. By providing the gap 12, the internal gas which is heated in the bulb case 10 and the outside air can be recirculated, and the countermeasure against the high temperature of the bulb case 10 can be obtained.

(outer housing)

As shown in FIG. 2, the outer casing 80 is formed of, for example, a cylindrical shape having both ends open, and the cylinder shaft coincides with the lamp axis J. The diameter of the cylinder corresponds to the shape of the large-diameter portion 65 of the circuit cover 60 that is housed, and gradually increases in diameter from the rear toward the front. As shown in FIG. 3, the outer casing 80 is fixed to the front end portion of the insulating ring 90 by using an adhesive or the like to be held by the insulating ring 90. Further, the outer casing 80 has its inner circumferential surface 80a abutting against the outer circumferential side surface 30a of the base 30, and is fixed to the abutment portion by an adhesive to support the form of the base 30.

The outer casing 80 plays the role of heat generated by the semiconductor light-emitting module 20 that is conducted through the base 30, and is further transmitted to the base 100 to dissipate heat to the outside. Therefore, the outer casing 80 is formed using a metal material. For example, aluminum, which is suitable for heat dissipation, heat resistance, and lightness, is preferable. Naturally, it may be formed of a thermally conductive resin other than metal.

The outer casing 80 is disposed so as to surround at least the outer side surface of the end portion (rear end portion) of the lamp cap 100 in the circuit casing 60 so as to surround the outer surface of the circuit casing 60. Inside the outer casing 80, the large diameter portion 65 of the circuit casing 60 is housed. Inside the large diameter portion 65, the circuit unit 50 other than the circuit component 51b and the front end portions 73 and 74 of the power supply conductive plate 70 are disposed (refer to FIG. 3 or FIG. 5). Therefore, in the large diameter portion 65, it is necessary to ensure electrical insulation of the circuit unit 50 and the power supply conductive plate 70. However, in the present embodiment, the circuit case 60 is formed by using an insulating material. However, in the configuration in which the circuit case 60 is formed using an insulating material, it becomes difficult to make the circuit cover 60 function as a heat sink. In the current situation, as the LED 21 is brightened, it is strongly required to ensure the heat dissipation path generated by the semiconductor light emitting module 20. Thus by using metal By arranging the outer casing 80, the circuit casing 60 can significantly achieve the function of ensuring electrical insulation from the components housed therein, and the outer casing 80 can significantly achieve the function of the radiator.

In addition, when the heat radiation countermeasure corresponding to the high luminance of the LED 21 is removed, the configuration in which the outer casing 80 is not used as the lamp 1 can be selected from the viewpoint of weight reduction of the lamp 1 . In this case, for example, the bulb case 10 and the semiconductor light are supported by the circuit cover 60 by causing the inner peripheral edge of the front side end portion of the large diameter portion 65 to protrude forwardly from the outer peripheral surface 10b of the bulb case 10. The module 20 and the base 30 can be used.

(insulation ring)

As shown in FIG. 2, the insulating ring 90 has a substantially annular shape and is held by the circuit case 60 by being embedded in the small diameter portion 66 of the circuit case 60. The insulating ring 90 is disposed between the outer casing 80 and the base 100, thereby achieving a function of ensuring electrical insulation between the two members. Therefore, the insulating ring 90 is formed of an insulating material such as resin or ceramic. Since the insulating ring 90 is interposed between the outer casing 80 and the heat transfer path of the base 100, it is preferable to form the insulating ring 90 by using an insulating thermally conductive resin having electrical insulating properties and thermal conductivity. As the insulating heat conductive resin, a resin in which a polyester resin and a thermally conductive filler are combined can be used.

(the storage state of the circuit unit to the circuit case)

Fig. 6 is a cross-sectional view showing the storage state of the circuit unit in the circuit case. Fig. 6 shows only the circuit unit, the circuit cover, the power supply conductive plate, the base, and the insulating ring except for one of the circuit components in the lamp of the embodiment. Fig. 6(a) is an arrow view of the BB' cross section perpendicular to the A-A' cross section shown in Fig. 2(a) viewed from the b1 direction; Fig. 6(b) is a view B from the b2 direction. Arrow view of the -B' section.

As shown in FIG. 6, the substrate 52 is housed in the circuit case 60 from the opening surface 60s of the circuit cover 60 and the cylindrical axis (coaxial with the lamp axis J). The lamp axis J is perpendicular to the opening face 60s. The circuit component 51 constituting the circuit unit 50 tends to have a relatively large size in the housing space of the circuit case 60 as the size of the lamp 1 is reduced, particularly in response to the miniaturization of the circuit case 60. Therefore, the substrate 52 is stored obliquely as in the present embodiment (hereinafter also In the circuit case 60, for example, the circuit case 60 can be secured, and the circuit case 51, which is required to secure the storage space in the height direction, can be secured in the circuit case 60.

In detail, it is as follows. In the circuit component 51 mounted on the surface of the substrate 52, for example, the choke coil 51a must have a mounting height as compared with the other circuit components 51. When the circuit casing 60 is miniaturized in the direction of the cylinder shaft (lamp axis J), first, the circuit casing 60 is parallel to the cylinder axis of the substrate 52 (corresponding to a so-called vertical storage which is inclined by 90 degrees from the opening surface 60s). And accommodating the circuit unit in such a manner that the distance between the inner circumferential surface of the circuit casing 60 adjacent to the back surface of the substrate 52 and the radial direction of the back surface is smaller than the inner diameter of the circuit casing 60 in the place where the substrate is located 50. As a result, the storage space of the circuit component 51 in the height direction can be ensured. In this aspect, the distance between the surface of the substrate 52 and the inner circumferential surface of the circuit cover 60 adjacent to the surface is also predetermined, and the mounting height of the circuit component 51 may cause the storage space not to be secured. Further, when the circuit case 60 is also miniaturized in the radial direction, there is a possibility that a storage space for the height direction of the circuit component 51 cannot be secured.

Therefore, the substrate 52 is housed in the inclined housing (not in the embodiment) so as not to be not only the opening surface 60s but also inclined from the cylinder axis (this embodiment), thereby ensuring the surface of the substrate 52 and the surface adjacent thereto. The distance between the inner circumferential surfaces of the circuit casing 60 is a long distance. Naturally, it does not mean that the mounting height can be more ensured in all the surface areas, but refers to the central area except the end of the substrate 52. Here, as the form of the oblique storage, it is preferable to reduce the shortest distance between the back surface of the front side end portion 52a of the substrate 52 and the inner peripheral surface of the circuit cover 60 adjacent to the back surface, and to make the substrate The surface of the rear side end portion 52b after 52 is further reduced in the shortest distance from the inner peripheral surface of the circuit casing 60 adjacent to the surface. Therefore, the main surface of the mounting circuit component 51 of the substrate 52 intersects with the cylindrical axis of the circuit casing 60, and the substrate 52 is tilted from the opening surface 60s of the circuit casing 60 and the cylindrical axis (coaxial with the lamp axis J). The shape disposed in the circuit case 60 is preferably good. Further, as shown in the present embodiment, it is preferable that the large-diameter portion 65 of the circuit cover 60 that houses the substrate 52 has a shape that gradually increases in diameter from the rear toward the front.

A locking portion 61, a guiding portion 62, and a reduced diameter portion 67 constituting the large diameter portion 65 are formed on the inner circumferential surface of the circuit casing 60. The locking portion 61 is formed from the inner peripheral surface of the opening-side end portion 60a of the large-diameter portion 65 A pair of sandwich members having a substantially rectangular parallelepiped shape projecting inward in the radial direction. The holding members are formed to face each other in the circumferential direction of the circuit case 60. The substrate 52 is slightly square (refer to FIG. 4), and the substrate 52 is housed in the circuit case 60 so that the substrate 52 is inserted into the circuit case from the rear side end portion 52b, so that the front side end portion 52a is located in the circuit case 60. The opening side end portion 60a. Here, the locking portion 61 is sandwiched between the corners of the front side end portion 52a of the two main breadboard substrates 52 in the circuit case 60, and the function of the locking substrate 52 is achieved. In order to lock the two corners of the front end portion 52a of the substrate 52, the locking portion 61 is symmetrical with respect to the cross section (the BB' section of FIG. 2) shown in FIG. A pair of inner peripheral faces of the case 60 is formed (cf. Fig. 6 (a), (b)).

The guide portion 62 is located at the rear side end portion 65b of the large-diameter portion 65, and has a slightly semi-cylindrical shape in which the diameter portion is smaller than the inner diameter of the rear-side end portion 65b, and is a portion that protrudes toward the inner side in the radial direction. An inclined surface 62s is provided in the guiding portion 62. The inclined surface 62s is formed in a pair of planes (B-B' section in Fig. 2) in a plane symmetry to be included in the same imaginary plane (refer to Figs. 6(a) and 6(b)). The inclination angle of the inclined surface 62s from the opening surface 60s of the circuit casing 60 corresponds to the inclination angle of the substrate 52 from the opening surface 60s of the circuit casing 60. The guide portion 62 has a function of guiding the substrate 52 to the arrangement position along the inclined surface 62s when the substrate 52 is housed in the circuit cover 60. Specifically, the boundary portion between the rear side surface and the back surface 52c of the front end portion 56 of the substrate 52 or the back surface 52c of the substrate 52 is brought into contact with the inclined surface 62s to guide the substrate 52 to the arrangement position.

The reduced diameter portion 67 is located at the rear side end portion 65b of the large diameter portion 65, and has a cylindrical shape in which the inner diameter gradually decreases from the front side toward the rear side. In the front side end portion 67a of the reduced diameter portion 67, the rear side end portion 55a of the main body portion 55 of the substrate 52 is brought into contact with the one corner portion. In the reduced diameter portion 67, when the substrate 52 is housed in the circuit case 60, the substrate 52 is locked in the direction of the lamp axis J so as not to move further toward the rear side of the reduced diameter portion 67.

The locking portion 61 and the reduced diameter portion 67 formed on the inner circumferential surface of the circuit cover 60 each function to lock the substrate 52. However, the two members are members that restrict the movement of the substrate 52 in the direction of the lamp axis J. Therefore, the direction of the radial direction of the substrate 52 (the direction perpendicular to the axis J of the lamp) remains. Degree of freedom. Therefore, in the present embodiment, the substrate 52 is locked by using the power supply conductive plate 70 (the first power supply conductive plate 71 and the second power supply conductive plate 72), and the power is supplied from the substrate 52 in the radial direction. The direction of the conductive plate 70 limits the movement of the substrate 52. Specifically, it is as follows. The first power supply conductive plate 71 and the second power supply conductive plate 72 are in contact with the first power receiving pad 53 and the second power receiving pad 54 formed on the surface of the substrate 52 in order to electrically connect them. Therefore, in the abutting state, the locking is also the rear side end portion 55a of the main body portion 55 of the rear side end portion 52b of the substrate 52. As a result, the power supply conductive plate 70 restricts the movement of the substrate 52 in the direction from the substrate 52 to the power supply conductive plate 70 in the radial direction.

In the movement restriction of the substrate 52 in the direction of the lamp axis J, the front side is formed by locking the front end portion 52a of the substrate 52 with the locking portion 61. However, when there is no movement restriction in the radial direction, as the substrate 52 moves in the radial direction, it also moves in the direction of the lamp axis J, and only the locking portion 61 cannot more effectively achieve the movement restriction in the direction of the lamp axis J. Therefore, by using the locking structure by the locking portion 61 and the power supply conductive plate 70, it is possible to more preferably achieve the power supply conductive plate 70 from the substrate 52 in the front direction and the radial direction in the lamp axis J direction. The direction of movement of the substrate 52 is limited. The movement in the circuit case 60 of the substrate 52 accommodated is restricted, and the substrate 52 is more preferably restricted from coming into contact with the power supply conductive plate 70 in the removal of the first power receiving pad 53 and the second power receiving pad 54. As a result, the electrical connection between the base 100 and the circuit unit 50 generated by the power supply conductive plate 70 can be made better.

Although the locking structure of the power supply conductive plate 70 in the present embodiment has been described above, the substrate 52 can be similarly applied in the form in which the substrate 52 is inclined from the opening surface 60s of the circuit cover 60. In the movement restriction of the substrate 52 caused by the locking structure, the radial direction of the power supply conductive plate 70 from the substrate 52 is as follows. The other end (front end portion) 52a of the substrate 52 is locked by a locking portion 61 formed on the inner surface of the other end (opening end portion) 60a of the circuit case 60. The first power receiving pad 53 and the second power receiving pad 54 are formed on the surface on the one end side of the base end side of the base plate 52 (the surface on the rear end side end portion 52b). Therefore, one end of the substrate 52 is locked by the first power supply conductive plate 71 and the second power supply conductive plate 72 which are respectively in contact with the first power receiving pad 53 and the second power receiving pad 54.

In the movement restriction in the radial direction, the movement of the substrate 52 in the direction from the power supply conductive plate 70 toward the substrate 52 is restricted by the locking portion 61 and the inclined surface 62s that abuts against the back surface 52c of the substrate. The portion 62 is formed.

The first power supply conductive plate 71 and the second power supply conductive plate 72 are caused by the front end portions 73 and 74 from the second bending positions 73b and 74b to the front end region, the first power receiving pad 53 and the second power. The receiving pads 54 abut each other to lock the substrate 52. Here, the front end portions 73, 74 are elastic bodies having a plate spring action. The front end portions 73 and 74 are elastically deformed and press the first power receiving pad 53 and the second power receiving pad 54 with their restoring forces, respectively. As a result, the substrate 52 can be more well locked.

Further, the major axis of the portion from the first bending position 73a, 74a to the second bending position 73b, 74b is parallel to the normal direction of the main surface of the substrate 52, or is the first folding for the normal line. The curved positions 73a and 74a are such that the fulcrum is inclined toward the front side end portion 52a of the substrate 52. Further, the long axis from the second bending position 73b, 74b to the front end portion is parallel to the main surface of the substrate 52, or the main surface is inclined toward the substrate 52 with the second bending positions 73b and 74b as fulcrums. form. With this configuration, the elastic deformation of the distal end portions 73 and 74 can be made more conspicuous, and the first power receiving pad 53 and the second power receiving pad 54 can be more sufficiently pressed. Here, the length of the long axis of the portion from the first bending position 73a, 74a to the second bending position and the long axis of the portion from the second bending position to the front end are considered to be The strength of the bending fatigue of the member is appropriately selected.

Further, in the present embodiment, the distal end portions 73 and 74 are elastic members that function as a leaf spring generated by a bent shape, but may be formed by using, for example, a material having a higher elastic modulus than a copper alloy. The portion where the power receiving pad 53 and the second power receiving pad 54 are in contact with each other is in a form in which the portion is pressed more elastically.

Fig. 7 is a perspective view showing only the power supply conductive plate in the lamp of the embodiment. As shown in FIG. 7, the front end portions 73 and 74 of the first power supply conductive plate 71 and the second power supply conductive plate 72 are disposed at a plane symmetrical position on the surface S. The surface S includes the lamp axis J (also the cylinder shaft of the circuit casing 60), and is based, for example, on the second bending position 73b of the front end portion 73. The line perpendicular to the axis J of the lamp is the normal. Here, the surface S corresponds to the B-B' section of Fig. 2 . By arranging the front end portions 73 and 74 opposite to each other in a plane symmetry, when the front end portions 73 and 74 are elastically deformed to press the first power receiving pad 53 and the second power receiving pad 54 respectively, uniformity can be applied to the substrate 52. Push. When the pressing of the front end portions 73 and 74 is not uniform, the substrate 52 may be rotated or the like to suppress the locking action. However, the pressing of the front end portions 73 and 74 is uniform, so that the pressing can be performed more satisfactorily. Substrate 52.

The substrate 52 is housed in the circuit case 60 along the inclined surface 62s of the guide portion 62. After that, the first power receiving pad 53 and the second power receiving pad 54 are guided to a position in contact with the first power feeding conductive plate 71 and the second power feeding conductive plate 72. In the movement restriction of the substrate 52 in the radial direction, the inclined surface 62s of the guide portion 62 has a function of restricting the movement in the direction from the power supply conductive plate 70 to the substrate 52. Therefore, in order to make the movement restriction more favorable, the substrate 52 is abutting on the inclined surface 62s, and the first power supply conductive plate 71 and the second power supply conductive plate 72 are connected to the first power receiving pad 53 and the second. The power receiving pad 54 is pushed. Specifically, the back surface 52c of the substrate 52 or the side surface on the rear side of the rear side end portion 55a of the main body portion 55 (corresponding to the lead-out position of the lead line of the symbol 55a in Fig. 6) is in contact with the boundary portion of the back surface 52c. It is a fulcrum at the inclined surface 62s. As a result, by making the pressing position an action point and making the substrate 52 and the locking portion 61 abutting, the force generated by the pressing can be efficiently transmitted to the substrate 52, and the substrate 52 can be made. The mobile limit is more effective.

In addition, the first power receiving pad 53 and the second power receiving pad 54 are pressed by the first power feeding conductive plate 71 and the second power feeding conductive plate 72, and finally the back surface 52c of the substrate 52 is separated from the inclined surface 62s. can. At least, it is sufficient that one portion of the inclined surface 62s is brought into contact with a portion of the substrate 52 at the start of pressing. Further, the rear end of the inclined surface 62s is continuous with the front end of the reduced diameter portion 67. Therefore, when the rear end of the inclined surface 62s is pressed as a fulcrum, it is assumed that the front end portion of the reduced diameter portion 67 is used as a fulcrum. However, in this case, the substrate 52 is abutted against the inclined surface 62s. Pushing for the fulcrum.

The structure of the locking portion 52 generated by the locking portion 61, the power supply conductive plate 70, and the guide portion 62 also achieves an adjustment function for positioning when the circuit unit 50 is housed in the circuit cover 60. 1st The power receiving pad 53 and the second power receiving pad 54 are formed on the surface of the rear end portion 52b of the substrate 52. When the substrate 52 is housed in the circuit case 60, the substrate 52 is adjusted at a position where the first power supply conductive plate 71 and the second power supply conductive plate 72 are in contact with the first power receiving pad 53 and the second power receiving pad 54, respectively. Storage location. The inclined surface 62s of the guide portion 62 has a function of adjusting the position of the substrate 52 between the power supply conductive plate 70 and the inclined surface 62s. The reduced diameter portion 67 has a function of adjusting the position of the substrate 52 in the axial direction of the lamp. By locking the substrate 52 so as to sandwich the main surface of the front end portion 52a of the substrate 52, the locking portion 61 assists in the positional adjustment of the radial direction of the power supply conductive plate 70 and the guide portion 62, respectively. And the function of adjusting the position of the reduced diameter portion 67 in the axial direction of the lamp. When the circuit unit 50 is housed in the circuit case 60 by arranging the member for positioning in the circuit case, the first power receiving pad 53 and the second power receiving pad 54 can be easily and satisfactorily supplied with power. The conductive plate 70 is abutted.

As shown in FIG. 6, the circuit component 51 other than the electrolytic capacitor 51b which is a circuit component shown in FIG. 4 is accommodated in the large diameter part 65, and the circuit component 51b which is an electrolytic capacitor is accommodated in the small diameter part 66. The electrolytic capacitor 51b, which is a circuit component, is less heat-resistant than the other circuit components 51, and therefore it is required to be disposed as far as possible from the semiconductor light-emitting module 20. Further, the electrolytic capacitor 51b, which is a circuit component, has a larger volume than the other circuit components, and the mounting area and the mounting height are large. Since the size of the main surface of the substrate 52 is limited by the size of the circuit case 60, it is a problem in the current state how the circuit component 52 is mounted on the substrate 52 and how it is housed in the circuit cover 60. As means for solving this problem, it is preferable to arrange the electrolytic capacitor 51b in the small diameter portion 66. Although it is particularly required to secure the region for mounting the circuit component 51 on the substrate 52, by using the power supply conductive plate 70, it is not necessary to secure the region where the terminal is mounted on the substrate 52 as in the past, as a result, for the circuit mounted on the substrate 52. The position of the part 51 ensures its degree of freedom.

[Modification]

As described above, the lamp of the present invention is specifically described based on the embodiment, but the lamp of the present invention is not limited to the above embodiment, and for example, the following modifications are conceivable.

(Storage structure of circuit cover: Modifications 1 to 3)

Fig. 8 is a cross-sectional view showing a housing structure of a circuit case of the lamp of the first modification. Fig. 8 shows only the circuit case and the power supply conductive plate in the lamp of the embodiment. Figure 8 (a) is, from An arrow view of the B-B' section perpendicular to the A-A' section shown in Fig. 2 is observed from the b1 direction, and Fig. 8(b) is an arrow view of the B-B' section viewed from the b2 direction. The dotted circle area shown in Fig. 8(a) is an enlarged view of the main part.

As shown in FIG. 8, a support groove portion 63 is provided on the inner surface of the circuit cover 60. The configuration other than the support groove portion 63 is the same as that shown in Fig. 6 . The support groove portion 63 has a concave shape and communicates with the internal space of the circuit cover 60. The support groove portion 63 is provided in a pair on the first power supply conductive plate 71 side (Fig. 8(a)) and the second power supply conductive plate 72 side (Fig. 8(b)). The main body portion 55 of the substrate 52 shown in FIG. 4 has a pair of support groove portions 63 which are diagonally opposed to one end portion of the rear end portion. As a result, the movement restriction within the circuit case 60 of the substrate 52 is more favorable. Further, since the positioning accuracy in the circuit case 60 of the substrate 52 is improved, the first power receiving pad 53 and the second power receiving pad 54 can be made more accurate when the substrate 52 is housed in the circuit case 60. It is easily disposed at a position where it is in contact with each of the first power supply conductive plate 71 and the second power supply conductive plate 72.

Fig. 9 is a cross-sectional view showing a housing structure of a circuit unit of the lamp of the second modification. The constituent members, the cross-section, and the arrow direction shown in the respective drawings are the same as those in Fig. 8. The dotted circle area shown in Fig. 9(a) is an enlarged view of the main part.

As shown in FIG. 9, the support groove portion 63 is provided on the inner surface of the circuit cover 60 in the same manner as in FIG. On the inner surface of the pair of support groove portions 63, the front end portion 73 of the first power supply conductive plate 71 (Fig. 9 (a)) and the front end portion 74 of the second power supply conductive plate 72 (Fig. 9 (b)) are protruded. Ground configuration. The distal end portions 73 and 74 are elastic members having a plate spring action from a portion formed by the inner bottom surface of the support groove portion 63 to the distal end portion via the first bending positions 73a and 74a. A pair of corner portions of the rear end portion of the main body portion 55 of the substrate 52 shown in Fig. 4 are inserted into the pair of support groove portions 63. In the support groove portion 63, the front end portions 73, 74 are disposed between the inner surface of the support groove portion 63 and the substrate 52. Therefore, when the substrate 52 is fitted into the support groove portion 63, even if the substrate 52 is slightly displaced in the height direction perpendicular to the main surface, the front end portions 73 and 74 are elastic bodies, and the positional deviation can be absorbed by the elastic deformation. . As a result, the first power receiving pad 53 and the second power receiving pad 54 can be placed at a position where they are in contact with the first power feeding conductive plate 71 and the second power feeding conductive plate 72 with higher precision and more easily.

Fig. 10 is a cross-sectional view showing a housing structure of a circuit unit of the lamp of the third modification. The constituent members, the cross-section, and the arrow direction shown in the respective drawings are the same as those in Fig. 8 except for the support groove portion. The dotted circle area shown in Fig. 10 (a) is an enlarged view of the main part.

As shown in FIG. 10, in the circuit case 60, instead of the support groove portion 63 shown in FIG. 8, the first power supply conductive plate 71 having the bifurcated shape front end portions 73, 74 is disposed (FIG. 10(a) And the second power supply conductive plate 72 (Fig. 10(b)). The distal end portions 73 and 74 have a portion formed by the curved portions 73c and 74c from the first bending positions 73d and 74d to the distal end, and are elastic bodies having a plate spring action. The main body portion 55 of the substrate 52 shown in Fig. 4 has a pair of diagonal portions at the rear end portions of the main body portion 55 of the substrate 52, and is fitted into the curved portions 73c and 74c of the pair of front end portions 73 and 74. At this time, the distal end portions 73 and 74 are elastically deformed, and the first power receiving pad 53 and the second power receiving pad 54 are pressed by the restoring force. By arranging the first power supply conductive plate 71 and the second power supply conductive plate 72, it is possible to ensure a better contact state between the first power receiving pad 53 and the second power receiving pad 54 and the power supply conductive plate 70.

(Components constituting the lamp: Modification 4)

Fig. 11 is an exploded perspective view showing the lamp of Modification 4.

As shown in Fig. 11, the lamp 1 is different from the lamp of the embodiment shown in Fig. 2 in that it does not include the circuit cover cover 40, the outer casing 80, and the insulating ring 90. Further, the configuration other than the shape other than the circuit case 60 is the same as that of the embodiment shown in FIG. 2.

The heat generated from the semiconductor light-emitting module 20 is related to the magnitude of the light-emitting amount of the light-emitting element 21, the magnitude of the light-emitting efficiency, and the like. Therefore, in the case where the amount of heat generated from the semiconductor light-emitting module 20 is small, it is not necessary to provide a configuration in which the outer casing 80 that realizes the heat sink function is provided. Therefore, this modification is a configuration that does not include the outer casing 80. Further, since the outer casing 80 is not provided, it is not necessary to ensure electrical insulation between the base 100 and the outer casing 80, so that the insulating ring 90 is not required. Further, in the present modification, the base 30 is not made of a conductive material, but is made of, for example, the above-described insulating thermally conductive resin having electrical insulating properties and thermal conductivity. Therefore, it becomes unnecessary to ensure the electrical insulation of the base 30 and the circuit unit 50, so that the circuit cover cover 40 is not required.

As described above, as in the present modification, the weight of the lamp 1 can be reduced by adopting a configuration in which the circuit cover cover 40, the outer case 80, and the insulating ring 90 are not provided. Further, since the design value of the inner diameter and the height of the circuit case 60 is allowed to increase to the occupied area of the outer casing 80, the storage space of the circuit unit 50 can be satisfactorily secured.

Further, the outer casing 80 has a function of supporting the base 30, the semiconductor light emitting module 20, and the bulb casing 10 in the inner circumferential surface 80a. Therefore, the circuit case 60 shown in FIG. 11 is provided with an extending portion 68 that protrudes forward from the front end portion of the large diameter portion 65. The extending portion 68 has the same outer shape as the front end portion of the outer casing 80, and supports the base 30, the semiconductor light emitting module 20, and the bulb shell 10 on the inner peripheral surface 68a.

(Electrical connection structure of semiconductor light-emitting module and circuit unit: Modifications 5 to 8)

In the lamp according to the above-described embodiment, the power receiving pad formed on the mounting substrate constituting the semiconductor light emitting module and the power supply pad formed on the substrate constituting the circuit unit are electrically connected by electric wiring (insulated coated wire or the like). Sexual connection structure.

Therefore, similarly to the case where the circuit unit is connected to the base by using the electric wiring, the connection work must be performed manually, and an electrical connection structure capable of performing a simple connection work is required. Hereinafter, an electrical connection structure between a semiconductor light-emitting module and a circuit unit that can be easily connected can be described as a representative of several modifications.

<Basic composition>

Fig. 12 is a view showing the electrical connection structure of the semiconductor light emitting module and the circuit unit in the lamp of the fifth modification. As shown in FIG. 12, the lamp of the fifth modification includes a power supply conductive member 120, and the semiconductor light-emitting module 20 is electrically connected to the circuit unit 50, and is formed by the power supply conductive member 120. Here, the lamp of the present modification has the same configuration as the lamp of the embodiment shown in FIG. 2 except for the configuration in which the power supply conductive member 120 is provided.

As shown in FIG. 12, the posture is maintained in the direction of the axis J of the lamp (the direction of the cylinder axis of the circuit case 60). The long-side power supply conductive member 120 is housed in the casing 123 of the insulating member in a state in which both end portions thereof protrude. More specifically, the power supply conductive member 120 has an inverted L shape as shown in the perspective view of Fig. 13(a), and is a rear end portion 121 at one end portion thereof at a bent position 121a. The shape is folded toward the axis J of the lamp.

Further, as shown in FIG. 12, the element power receiving pad 24 is formed on the surface of the mounting substrate 22 constituting the semiconductor light emitting module 20, and the power supply pad 57 is formed on the surface of the substrate 52 constituting the circuit unit 50.

On the other hand, the front end portion 122 of the other end of the power supply conductive member 120 abuts against the component power receiving pad 24, and the rear end portion 121 abuts against the power supply pad 57, thereby causing the semiconductor light emitting module 20 and the circuit. The unit 50 is electrically connected. Here, the power supply conductive member 120 is held in the direction of the lamp axis J. Therefore, in the assembly work of the lamp, only the both end portions of the power supply conductive member 120 are in contact with the component power receiving pad 24 and the power supply pad 57, respectively, and the semiconductor light emitting module 20 and the circuit unit 50 can be secured. Electrical connection. That is, the electrical connection between the semiconductor light emitting module and the circuit unit can be simplified as compared with the structure using the conventional electric wiring.

The power supply conductive member 120 is a long member that maintains a posture in the direction of the lamp axis J, similarly to the power supply conductive plate 70 that electrically connects the circuit unit 50 and the base 100. Therefore, from the viewpoint of improving the posture holding force, the conductive member 120 for power supply is preferably made of a material having excellent rigidity in the conductive material. For example, it is preferably composed of a copper alloy.

<connection form>

The connection between the power supply conductive member and the component power receiving pad and the power supply pad is not particularly limited as long as it is in contact with each other. However, from the viewpoint of the improvement of the joining force, in the present modification, the joining of the front side end portion 122 of the power feeding conductive member 120 and the component power receiving pad 24 is performed by welding. Further, the joining of the rear side end portion 121 of the power feeding conductive member 120 to the power supply pad 57 is caused by the elastic bias of the rear side end portion 121. More specifically, as shown in the perspective view of FIG. 13(b), in the same manner as the power supply conductive plate 70, the rear side end portion 121 of the power supply conductive member 120 has a plate spring shape, and a board is applied to the power supply pad 57. Spring action The elastic bias of life.

<Alignment function>

As shown in FIG. 12, through holes 31a and 40c penetrating the direction of the lamp axis J (the direction of the cylinder axis of the circuit case 60) are formed in the base 30 and the circuit cover cover 40, respectively. Further, a notch portion 22a is formed on the mounting substrate 22. The cross-sectional shapes of the through holes 31a and 40c and the notch portion 22a (the surface perpendicular to the lamp axis J) are square in shape in accordance with the shape of the cross section of the casing 123.

As shown in a partial cross-sectional view (FIG. 14) of a portion of the C-C' section in FIG. 12, the power supply conductive member 120 penetrates the notch portion 22a and the through hole 31a via the housing 123 of the insulating member. 40c.

Here, the power supply conductive member 120 is inserted through the cutout portion 22a and the through holes 31a and 40c through the case 123, whereby the mounting substrate 22 is notched when the surface of the mounting substrate 22 is viewed in a plan view from the lamp axis J direction. The portion 22a is placed on the main surface of the base 30 so as to overlap the through holes 31a and 40c. That is, the position of the mounting substrate 22 can be relatively defined based on the position of the through hole 31a of the base 30, and the alignment for placing the mounting substrate 22 on the base 30 can be easily performed. Therefore, for example, when the position of the through hole 31a of the base 30 is the alignment reference with respect to the lamp axis J, the operation of the power supply conductive member 120 through the notch portion 22a and the through holes 31a and 40c can be performed. The alignment of the lamp axis J of the mounting substrate 22.

The alignment function of the mounting substrate 22 having the through hole 31a is such that the cross-sectional shape of the through hole 31a of the base 30 corresponds to the cross-sectional shape of the casing 123, and this function can be satisfactorily secured. In particular, it is preferred that the shape of the cross sections be consistent to the extent that they can be penetrated. However, the configuration for arranging at least the through hole 31a is such that the through hole 31a and the power supply conductive member 120, the power supply conductive member 120, and the case 123 are inserted as the cross section. The shape corresponding to the composition can be. Therefore, when the position where the front side end portion 122 of the power feeding conductive member 120 abuts against the component power receiving pad 24 is the reference position for aligning the mounting substrate 22 corresponding to the position of the through hole 31a, the notch portion 22a is not a necessary component. In addition, in the present modification, since the base 30 is made of a conductive material, the exterior is installed. The structure of the casing 123 which is the insulating member of the electrically-conductive conductive member 120. However, if the base 30 is made of an insulating material, it is not necessary to provide the casing 123 so that the shape of the through hole provided in the base 30 corresponds to the shape of the power supply conductive member 120. For example, a configuration may be adopted in which two through holes are provided in the base 30 in correspondence with the pair of power supply conductive members 120. Further, although the notch portion 22a is provided in the mounting substrate 22, a through hole having the same shape as the through hole 31a of the base 30 may be provided on the mounting substrate 22 instead of the notch portion 22a.

<Other Modifications>

Fig. 15 is a view showing the electrical connection structure of the semiconductor light emitting module and the circuit unit in the lamp of the sixth modification.

As shown in FIG. 15, this modification is a configuration in which the semiconductor light-emitting module 20 and the circuit unit are electrically connected by the power supply conductive member 120, similarly to the fifth modification shown in FIG. The point different from the fifth modification shown in FIG. 12 is that the shape of the power supply conductive member 120 and the protrusion providing portion 41 as the insulating member are disposed on the upper end portion 40a of the circuit cover cover 40 without providing the casing 123. The surface.

The power supply conductive member 120 is formed in a long shape in which the posture is maintained in the direction of the lamp axis J. In detail, the electric wire member having the diameter capable of maintaining the posture is covered with the insulating covering member 124 in a state where the both end portions are protruded. Here, the power supply conductive member 120 is preferably made of a conductive material having excellent rigidity, and is preferably made of, for example, a copper alloy. In the case where the power supply conductive member 120 is configured by the electric wire member, the diameter of the electric wire member is not particularly limited as long as the posture can be maintained.

As shown in the perspective view of FIG. 16, the rear side end portion 121 of the power supply conductive member 120 abuts against the power supply pad 57 formed on the surface of the substrate 52. In the present modification, from the viewpoint of improving the joining force, the rear end portion 121 is joined to the power supply pad 57 by welding. Here, the form in which the joining force is increased may be a form in which the rear end portion 121 is inserted into the recessed portion in which the power supply pad 57 is provided, and is not limited to the form of welding.

Further, the front side end portion 122 of the power supply conductive member 120 abuts on the mounting substrate. The components on the face of 22 are powered by the power receiving pad 24. In the present modification, the front end portion 122 is joined to the component power receiving pad 24 by soldering from the viewpoint of improving the bonding force. Here, as a form of improving the joining force, the groove portion of the communication notch portion 22a may be provided in the element power receiving pad 24, and the front end portion 122 may be inserted into the groove portion, and the welding is not limited to the welding.

As described above, the power supply conductive member 120 for maintaining the posture in the direction of the lamp axis J can make the electrical connection between the semiconductor light emitting module and the circuit unit simpler than the configuration using the conventional electric wiring.

In the present modification, in place of the casing 123 of the insulating member shown in FIG. 12, a projection-shaped portion 41 having a rectangular parallelepiped shape is provided on the surface of the upper end portion 40a of the circuit cover cover 40. As shown in a partial cross-sectional view (FIG. 17(a)) of a portion of the C-C' cross section in FIG. 15, the power supply conductive member 120 penetrates the notch portion 22a and the through hole 31a via the protrusion providing portion 41, 40c. Further, as shown in FIG. 15, the engagement portion 41a is provided in the projection installation portion 41, and the front end portion 122 of the power supply conductive member 120 is engaged with the shape of the cross-sectional shape corresponding to the front end portion 122. The portion 41a is engaged. In the same manner as the case 123, the protrusion setting portion 41 achieves a function as an exterior member for ensuring insulation between the power supply conductive member 120 and other members.

Further, when the power supply conductive member 120 is inserted through the notch portion 22a and the through holes 31a and 40c via the protrusion setting portion 41, the position of the mounting substrate 22 can be relatively defined based on the position of the through hole 31a of the base 30. Thereby, alignment for mounting the mounting substrate 22 on the base 30 can be easily performed.

Further, in the present modification, the power feeding conductive member 120 is joined to the power supply pad 57 by welding. Therefore, in the assembly work of the lamp 1, for example, in a state where the front end portion 122 does not have a bent shape, the linear power supply conductive member along the lamp axis J direction is joined to the power supply pad 57, and then sequentially The power supply conductive member is inserted through the cutout portion 22a and the through holes 31a and 40c, and the front end portion is bent to engage with the engagement portion 41a.

In addition, the engagement portion 41a is provided to mechanically engage the power supply conductive member 120 and the protrusion installation portion 41, and to control the positional displacement of the front side end portion 122 with respect to the component power receiving pad 24. Therefore, in the configuration in which the groove portion is provided in the power receiving pad 24 for the element, the configuration in which the engaging portion 41a is not provided may be employed.

In the other configuration, as shown in the perspective view of the circuit cover cover 40 of the seventh modification of FIG. 17(b), the through hole 40c may be provided in a protrusion-shaped portion 41 having a rectangular parallelepiped shape, and a through hole. The cross-sectional shape of 40c matches the cross-sectional shape of the insulating covering member 124 covering the pair of power supply conductive members 120. In this case, as shown in FIG. 17(c) which is a partial cross-sectional view at the same cross-sectional position as the cross-sectional view shown in FIG. 17(a), the electric conductive member 120 can penetrate the internal space of the through-hole 40c. There is no gap in the state of possession. Therefore, the configuration in which the engaging portion 41a is not provided may be employed.

Here, in the configuration of the modification 7 shown in FIG. 17(c), the power feeding conductive member 120 penetrates the notch portion 22a, and the front end portion 122 abuts against the component power receiving pad 24. However, for example, as in the modification 8 shown in FIG. 18 which is a partial cross-sectional view at the same cross-sectional position as the cross-sectional view shown in FIG. 17(c), the following configuration may be employed: instead of the notch portion 22a, the mounting substrate 22 is mounted. The through hole 22a that penetrates the lamp axis J direction is formed, and the insertion terminal 25 that is electrically connected to the component power receiving pad 24 is buried in the through hole 22a. The insertion terminal 25 has a bifurcated shape similar to the distal end portion 73 of the power supply conductive plate 71 shown in Fig. 10(a), and the front side end portion 122 of the power supply conductive member 120 is inserted into the terminal 25 to be forward. The side end portion 122 is connected to the terminal 25. In the case of the above-described configuration, the power supply conductive member 120 that penetrates the through hole 31a of the base 30 through the projection portion 41 of the insulating member is defined by the position of the through hole 31a to be aligned with the mounting substrate 22 The base position. Thereafter, alignment of the mounting substrate 22 is performed by inserting the front end portion 122 into the terminal 25.

In the modification 8 shown in FIG. 18, when the mounting substrate 22 is made of a conductive material, a member (not shown) for preventing electrical conduction is interposed between the mounting substrate 22 and the terminal 25. For example, the outer surface of the terminal 25 abutting on the mounting substrate 22 is covered with an insulating film.

Further, as shown in FIG. 18, when the through hole 22a is formed in the mounting substrate 22, The through hole 22a is formed with a conductive layer filled with a conductive material, and a component power receiving pad 24 electrically connected to the conductive layer is formed on the back surface of the mounting substrate 22. Further, in the configuration in which the component power receiving pad 24 is formed on the back surface of the mounting substrate 22, the shape of the front side end portion 122 of the power feeding conductive member 120 and the rear side end portion 121 shown in FIG. 13(a) are formed. The shape of the plate spring is the same, and the front end portion 122 is configured to be elastically biased and connected to the component power receiving pad 24. Here, when the mounting substrate 22 is made of a conductive material, an insulating layer for preventing electrical conduction is interposed between the conductive layer formed in the through hole 22a and the mounting substrate 22.

(automation of assembly work)

In the lamp according to the embodiment, the electrical connection structure between the base and the circuit unit is connected to the power supply conductive plate. Further, in the lamp of Modification 5 or 7, the electrical connection structure between the circuit unit and the semiconductor light-emitting module has a connection between the power supply conductive members. These power supply conductive plates and power supply conductive members are different from the electric wires such as wires, and are members that hold the posture in the direction of the lamp axis J. Therefore, the connection work can be easily performed as compared with the conventional connection work using the electric wiring. Further, in the connection work using the electric wiring, it is necessary to visually confirm that the electric wiring is prevented from being entangled with other members and reliably connected, and thus it is difficult to automate the assembly work of the lamp. However, by using the conductive plate for power supply and the conductive member for power supply instead of the electric wiring, it is possible to automate the assembly work of the lamp.

〔other〕

The above description of the lamp according to the embodiment and the modification of the present invention is specifically described, but the above embodiments and modifications are for the purpose and function of the present invention. The effect is easily explained with an explanation of the examples used, and the content of the present invention is not limited to the above embodiment.

(conductive plate for power supply)

In the present embodiment, the front end portions 73 and 74 of the first power feeding conductive plate 71 and the second power feeding conductive plate 72 have a bent shape. Although it has a sheet spring action by being formed in a bent shape, it is not limited thereto. Further, the tip end portion itself may be made of a material having excellent elastic modulus, and for example, a material which can be used for mixing an elastic filler with a metal filler to improve conductivity and rigidity. In this case, it is necessary that the remaining portion of the power supply conductive plate embedded in the circuit case and the front end portion provided in the circuit cover and the front projection are not excessively loaded. That is, using a plate spring The reason for this is because it is an elastic body which is moderately rigid and has excellent electrical conductivity. Further, the shape of the distal end portions 73 and 74 may be, for example, a shape that faces the first power receiving pad 53 and the second power receiving pad 54 so as to face the power receiving pad protrusion, and may be easily contacted. Specially limited.

Further, in the present embodiment, the remaining portions 77 and 78 are disposed in the side wall of the circuit case 60 and extend in parallel with the cylindrical axis of the circuit case 60 in the side wall, but are not limited thereto. For this form. The remaining portions 77 and 78 of the power supply conductive plate 70 may be disposed in the side wall of the circuit case 60 or in the circuit case 60 so as to extend toward the substrate 52 at least in parallel with the cylindrical axis.

(circuit cover)

In the present embodiment, the locking portion 61 is constituted by a sandwiching member, but is not limited thereto. For example, similarly to the shape of the support groove portion 63, the locking portion 61 formed of a concave groove portion that communicates with the circuit cover 60 may be formed in the circuit cover 60 so that the front side is opened and the rear side is the bottom. In this case, only the corner portion of the front end portion 52a of the substrate 52 is formed in a diagonal shape so as to be widened in the radial direction of the circuit case 60, and the corner portion is fitted into the locking portion. The ditch of 61 is used to stop.

In the present embodiment, the movement restriction of the substrate 52 toward the rear side in the direction of the lamp axis J is performed by the reduced diameter portion 67. However, for example, when the support groove portion 63 or the power supply conductive plate 70 shown in Fig. 10 is provided, The necessity of the movement restriction of the reduced diameter portion 67 is low. Further, when the locking portion 61 is formed as the concave groove portion, the movement restriction of the substrate 52 in the height direction and the radial direction is improved. Therefore, it can be said that the function of the movement restriction of the other members is low. In other words, the locking portion 61, the guiding portion 62, the supporting groove portion 63, and the reduced diameter portion 67 may be appropriately provided in accordance with the necessary locking structure, and the arrangement position and shape thereof may be appropriately selected in the same manner.

(substrate)

In the present embodiment, the substrate 52 is housed in the circuit case 60 from the opening surface 60s of the circuit cover 60 and the cylindrical axis. However, for example, it may be inclined only from the opening surface 60s of the circuit casing 60, and the substrate 52 may be housed in the circuit casing 60 in a form parallel to the cylinder shaft (so-called vertical storage). Inside. In this case, the locking structure of the substrate 52 is such that the locking portion 61 is the concave groove portion and the front end portion of the substrate 52 is locked, and the support groove portion 63 is provided to lock the substrate 52. You can do it. The power supply conductive plate 70 may be disposed corresponding to FIG. 8 or FIG.

In the present embodiment, the first power receiving pad 53 and the second power receiving pad 54 are formed on the surface of the rear side end portion 52b of the substrate 52. It can also be in other forms. For example, it may not be provided on the surface of the rear side end portion 52b of the substrate 52, but may be provided on the surface other than the mounting region of the mounted circuit component 51, or may be provided on the back surface or the side surface of the substrate 52. Further, the first power receiving pad 53 and the second power receiving pad 54 may not be formed on the same surface of the substrate 52. For example, from the rear end portion 75 of the first power supply conductive plate 71 that is in contact with the contact piece 102, the first power supply conductive plate 71 is more linearly abutted on the substrate 52 in the lamp axis J direction. The first power receiving pad 53 is formed on the back surface of the substrate 52, and the second power receiving pad 54 may be formed on the front surface or the side surface of the substrate 52.

Further, for example, when the first power receiving pad 53 or the second power receiving pad 54 is provided on the back surface of the substrate 52, a through hole from the surface to the back surface is provided on the substrate 52, and a conductive material made of a conductive material is buried in the through hole. unit. Thereafter, the first power receiving pad 53 or the second power receiving pad 54 formed on the back surface of the substrate 52 may be connected to the conductive portion.

The arrangement position of the first power receiving pad 53 and the second power receiving pad 54 may be appropriately selected depending on the storage form in the circuit case 60 of the substrate 52 or the form of the circuit component 51 mounted on the substrate 52. In addition, the power supply conductive plate 70 may have a shape and an arrangement position depending on the arrangement positions of the first power receiving pad 53 and the second power receiving pad 54.

(semiconductor light emitting element)

In the present embodiment, a light-emitting body (LED) is used as the semiconductor light-emitting element, but a laser diode (LD) or the like can also be used.

[related invention]

Hereinafter, the lamp of the related art in which the above-described lamp of the present invention is technically related will be described.

(related)

The present invention relates to a lamp in which a circuit unit that receives electric power from a base and that illuminates a semiconductor light-emitting element as a light source is housed in a casing, and the lamp of the present invention is related to the technical field. Further, the present invention has a problem common to the subject of the present invention in order to secure the degree of freedom in designing the circuit unit in the subject of the present invention, and in particular, to ensure the degree of freedom in designing the storage structure of the circuit unit.

In the following description, the "circuit case" is one of the following "casings", and the "large diameter portion" and the "small diameter portion" of the above-mentioned "circuit case" respectively correspond to the following "tilt" The "cylinder" of the "circuit cover" corresponds to the "central axis" of the "circuit cover" described below, and the "power supply conductive plate" corresponds to the following "terminal". The "substrate" and "circuit component" constituting the "circuit unit" described above correspond to the following "circuit board" and the following "electronic parts". Further, the present invention is also referred to as the present invention hereinafter.

(Background technique)

A lamp using a LED which is one of semiconductor light-emitting elements as a light source is used as a substitute for a white heat bulb. The circuit unit of these lamps is generally composed of a plurality of electronic components and a circuit board on which the electronic components are mounted, and is disposed inside the insulating cylindrical casing.

On the other hand, there has been a desire for miniaturization of lamps. As one of methods for miniaturizing a lamp, it is conceivable to downsize the casing. However, in this case, since the internal volume of the casing becomes small, it is difficult to store a circuit unit of a conventional size.

In the prior art, a technique for vertically arranging circuit units in a cylindrical casing is disclosed (Japanese Laid-Open Patent Publication No. 2010-212073). In the vertical arrangement, the circuit unit is disposed so that the circuit board is parallel to the central axis of the casing, whereby the circuit board which is one of the most space-consuming members can be efficiently housed in the casing.

(Summary of the Invention)

(Problems to be solved by the present invention)

Where the circuit unit is longitudinally arranged in a cylindrical casing, it is preferably in the vicinity of the casing. The circuit board is placed at the position of the mandrel. Thereby, the widest area of the inside of the casing can be effectively utilized, and the circuit board having a width equal to the inner diameter of the casing can be accommodated.

However, if the circuit board is placed close to the central axis, the maximum distance between the mounting surface of the circuit board and the inner circumferential surface of the casing is slightly half of the inner diameter of the casing. Therefore, it becomes difficult to mount a highly high-sized electronic component on a circuit board.

In view of the above problems, an object of the present invention is to provide a lamp in which a circuit unit in which a high-high electronic component is mounted on a circuit board can be housed in a casing.

(Technical means to solve the problem)

In order to achieve the above object, a lamp according to an aspect of the present invention is characterized in that a circuit unit that receives electric power from a lamp cap and illuminates a semiconductor light-emitting element as a light source is housed in a cylindrical casing, and is characterized in that the circuit unit has a circuit. a substrate and a plurality of electronic components mounted on the circuit board; the cylindrical casing having an inclined portion having an inner diameter that increases from a first position on the central axis toward a second position; and the circuit substrate is at the first position A state in which the first position side and the central axis of the inclined portion intersect with each other at a central position of the second position is inclined toward the central axis.

(Effect of the present invention)

A lamp according to an aspect of the present invention is configured such that a lamp cap is disposed on one end side of the casing and a semiconductor light-emitting element is disposed on the other end side thereof in the central axis direction of the cylindrical casing. Further, the casing has an inclined portion, and the inner diameter increases from the first position on the one end side on the central axis toward the second position on the other end side. Therefore, a large space is generated in the inclined portion at the second position side of the circuit board, and an electronic component having a high height can be mounted in this space.

Further, the inclined portion has an annular cross-sectional shape, and the casing has a cylindrical shape protruding from an end portion on the first position side of the inclined portion toward the opposite side of the second position. a cylindrical portion; an electrolytic capacitor for smoothing which is one of the plurality of electronic components, wherein a body portion is located in the cylindrical portion. Thereby, the electronic components housed in the inclined portion can be reduced, and the space for storing the remaining electronic components can be secured.

Further, the base is attached to the cylindrical portion. Therefore, it is not necessary to set up the lamp cap installation. The member or part can effectively utilize the cylindrical portion.

Further, the base is attached to the first position side of the inclined portion, and the electrolytic capacitor for smoothing included in the plurality of electronic components has a main body portion located in the base. Thereby, the internal space of the lamp cap can be effectively utilized.

Further, the casing has a guide portion that guides the circuit board to an inclined state. Thereby, the circuit board can be simply tilted.

Further, the semiconductor light emitting element is mounted on a base that closes the second position side of the inclined portion, and the electronic component that is relatively easy to generate heat when the semiconductor light emitting element is turned on is mounted on the plurality of electronic components. The first position side of the circuit board. Thereby, the electronic component that generates heat in the first position side is brought close to the inclined portion, and the heat of the electronic component is discharged through the inclined portion.

Moreover, the electronic component (electronic component which is relatively easy to generate heat) attached to the first position side is attached to the position of the casing which is close to the peripheral wall on the first position side. Thereby, the electronic component which is relatively easy to generate heat is brought close to the inclined portion, and the heat of the electronic component is discharged through the inclined portion.

(Best form for carrying out the invention)

Hereinafter, an embodiment of a lamp according to the present invention will be described with reference to the drawings.

The dotted line in the figure represents the lamp axis J. The upper side of the paper is the front or the upper side of the lamp 301, and the lower side of the paper is the rear or the lower side of the lamp 301. Here, the "lamp axis" means an imaginary line of the center of the bulb case 310 when the bulb case 310 is viewed from the front side and the center when the cap 400 is viewed from the rear side.

1. Rough composition

Fig. 20 is a perspective view showing the lamp of the embodiment: Fig. 21 is an exploded perspective view showing the lamp of the embodiment; and Fig. 22 is a view showing the embodiment taken along line A-A' of Fig. 21 from the a1 direction. Arrow view of the luminaire. In addition, in Fig. 22, the electronic component 351 located in the A-A' section is removed.

In the lamp 301 of the present embodiment, as shown in Fig. 20, the base 400 is formed of a structure according to the specifications of the incandescent bulb, and is a bulb-type lamp having the same (or similar appearance) shape as the appearance of the incandescent bulb.

The lamp unit 301 is formed by accommodating the circuit unit 350 that lights the LED 321 of the semiconductor light-emitting element that receives the electric power from the base 400 as a light source in the circuit case 360 of the tubular casing; and the circuit unit 350 includes the circuit board 352 and a plurality of electronic components 351 mounted on the circuit board 352; the circuit casing 360 of the cylindrical casing has an inclined portion 365 having an inner diameter that increases from a first position (A1) on the central axis toward a second position (A2); The circuit board 352 is inclined to the center axis in a state in which the center position (C) of the first position (A1) and the second position (A2) is closer to the first position (A1) side and the center axis of the inclined portion 365. .

The lamp 301, specifically, as shown in FIGS. 20 to 22, includes a bulb case 310, a light-emitting module 320, a base 330, a circuit cover cover 340, a circuit unit 350, a circuit cover 360, a terminal 370, and an exterior. The housing 380, the insulating ring 390, and the base 400.

2. Composition of each department

(1) lamp holder

The base 400 is a mounting mechanism for attaching the lamp 301 to the lighting fixture, and is also a member for receiving power from the socket (not shown) when the lighting fixture is mounted.

The base 400, here using the so-called Edison type. That is, as shown in FIG. 22, the base 400 includes a cylindrical outer casing 403 having an outer peripheral surface which is externally threaded, and a contact piece 402 which is attached to the lower end of the outer casing 403 via the insulating portion 404. The base 400 is mounted (embedded) to the bottomed cylindrical portion 366 of the circuit case 360 in a state in which the central axis of the outer casing 403 is aligned with the lamp axis J.

(2) circuit cover

Fig. 23 is a view showing only the arrow cover of the circuit case, the terminal, the insulating ring and the base of the lamp of the embodiment of the A-A' cross section shown in Fig. 21 viewed from the a1 direction; Fig. 24 is only for display The arrow cover of the circuit case, the terminal, the insulating ring, and the base of the lamp of the embodiment of the A-A' cross section shown in Fig. 21 is observed from the a2 direction.

As shown in FIG. 22, the circuit case 360 has a function of housing the circuit unit 350 therein. In addition to the circuit unit housing function, the circuit case 360 is provided with, for example, an electrical connection between a component disposed on the periphery of the circuit unit 350 such as the base 330, the outer casing 380, and the base 400, and the like. The function of the electrically insulating environment of circuit unit 350. Therefore, the circuit case 360 is formed of, for example, an insulating material such as resin or ceramic.

Further, the circuit case 360 also has a function of fixing the outer casing 380 with the insulating ring 390 and a function of mounting the base 400.

The circuit case 360 has an inclined portion 365 whose inner diameter and outer diameter increase from the first position (A1) on the central axis toward the second position (A2). In addition, the circuit unit 350 is mostly disposed in the inclined portion 365.

As shown in FIG. 21, the circuit cover 360 in the present embodiment has a bottomed cylindrical shape having a front side opening and a rear side as a bottom, and has an inclined portion 365 located on the front side and a bottomed cylindrical portion 366. The rear side is provided; and the connecting portion 367 connects the inclined portion 365 and the bottomed cylindrical portion 366.

Further, when the inclined portion 365 and the bottomed tubular portion 366 are assembled as the lamp 301, the inclined portion 365 and the central axis of the bottomed cylindrical portion 366 are aligned with the lamp axis J so as to extend in the direction of the central axis (hereinafter also The central axis direction is connected to each other and integrated.

In the present embodiment, the opening of the upper end portion 360a of the circuit cover 360 is sealed by the circuit cover 340. Thereby, electrical insulation between the circuit unit 350 and the base 330 is ensured.

(2-1) Inclined section

The inclined portion 365 has an inner diameter and an outer diameter on the central axis of the circuit casing 360, and moves to the upper end (the second position A2 on the central axis from the lower end (the first position A1 on the central axis, see FIG. 27). The shape becomes larger with reference to FIG. 27).

The upper end portion 360a of the circuit case 360, that is, the inner periphery of the upper end portion of the inclined portion 365 is provided with a part of a mounting mechanism for mounting the circuit cover 340. The mounting mechanism, specifically, the engaging structure, is formed by the engaging portion 368 engaged with the engaging portion 343 of the circuit cover cover 340, and corresponding to the engaging portion 343. Further, the engaging portion 343 and the engaged portion 368 are formed at two opposite positions by sandwiching the central axis of the circuit case 360.

Here, the engaging portion 343 is formed to have an engaging convex portion 343a that protrudes outward (in a direction away from the central axis) in a direction perpendicular to the central axis of the circuit casing 360. The engaged portion 368 is formed to have an engagement recess 368a that is recessed outward in a direction perpendicular to the central axis of the circuit casing 360.

A support mechanism for supporting the upper end side of the circuit board 352 is provided on the upper end portion 360a of the circuit case 360, that is, on the inner circumference of the upper end portion of the inclined portion 365. Specifically, the support mechanism is a sandwich structure that supports the front and back sides of the circuit board 352, and the one set of the sandwiching portions 361 abuts against the front and back surfaces of the circuit board 352 to be sandwiched.

The clamping portion 361 is composed of two holding pieces 361a and 361b which sandwich the two sides of the circuit board 352 which is inclined to the central axis of the circuit case 360 (the circuit to the circuit board 352) The insertion direction of the casing 360 is slightly parallel to the surface, and in other words, in the vicinity of the side opposite to the inner circumferential surface of the circuit casing 360. Each of the holding portions 361 is formed such that the holding pieces 361a and 361b of the holding portion 361 protrude toward the inner circumferential surface of the circuit casing 360 toward the holding pieces 361a and 361b of the other holding portion 361.

The circuit case 360, that is, the inclined portion 365, is provided with a space maintaining mechanism 369 for maintaining a constant interval from the circuit cover cover 340. The spacer holding mechanism 369 is formed at two opposite positions by sandwiching the central axis of the circuit case 360.

The space holding mechanism 369 is constituted by a pair of convex portions 369a and 369b that protrude upward from the upper end portion 360a of the circuit casing 360. By making the protruding amount of the convex portions 369a and 369b constant, The spacing between the circuit cover 360 and the circuit cover cover 340 is kept constant.

In addition, the circuit cover cover 340 has a notch portion 340c corresponding to the position of the spacer holding mechanism 369 when mounted on the circuit case 360. The pair of convex portions 369a, 369b are separated in the circumferential direction. Thereby, the electrical wiring (the insulated covered conductor) connecting the circuit unit 350 and the light-emitting module 320 is led between the pair of convex portions 369a and 369b and the notch portion 340c, and is led to the front side of the base 330.

(2-2) bottomed tube

The bottomed cylindrical portion 366 has a cylindrical portion 366a located at a position close to the inclined portion 365, and a bottom portion 366b present at a position (a position away from the inclined portion 365) at a position opposite to the inclined portion 365 of the cylindrical portion 366a .

On the side of the bottom portion 366b of the outer circumference of the cylindrical portion 366a, as shown in Fig. 21, a screw member is formed to be screwed with the outer casing 403 of the base 400. Further, the outer diameter of the end portion of the inclined portion 365 on the bottomed cylindrical portion 366 side is larger than the outer diameter of the end portion of the bottomed cylindrical portion 366 on the inclined portion 365 side, and is connected to the stepped portion by the connecting portion 367. .

(2-3) Linkage

The connecting portion 367 extends from the end portion of the inclined portion 365 on the bottomed cylindrical portion 366 side to the end portion of the bottomed cylindrical portion 366 on the inclined portion 365 side, and extends toward the central axis. As shown in FIG. 22, the connecting portion 367 also has a function of supporting the circuit board 352 of the circuit unit 350 from the bottomed cylindrical portion 366 side.

A support mechanism for supporting the circuit board 352 from the back side is formed on the connecting portion 367 inside the circuit case 360. Specifically, the protruding portion 362 includes an inclined surface 362a that protrudes from the top surface of the connecting portion 367 toward the base 330 side and abuts against the back surface of the circuit board 352 in an inclined state.

As shown in FIG. 23, the protruding portion 362 is formed in an arc shape along the inner circumferential surface of the circuit board 352 on the back surface side of the circuit case 360, and the circumferential end surface is an inclined surface 362a that abuts on the circuit board 352.

The inclined surface 362a has a case where the circuit board 352 is housed in the circuit case 360 as a The circuit board 352 is guided to function as a guide portion in an inclined state. By moving the circuit board 352 disposed on the protruding portion 362 to the inclined surface 362a, the circuit board 352 is guided to the inclined state along the inclined surface 362a.

(3) terminal

Fig. 25 is a perspective view showing the entire circuit unit and the terminal only when the circuit unit and the terminal are taken out from the cross-sectional perspective view of the lamp shown in Fig. 22 . Fig. 26 is a perspective view showing only the terminals of the lamp of the embodiment taken out.

The terminal 370 has a function of electrically connecting the base 400 to the circuit unit 350. Therefore, as the terminal 370, a copper alloy having excellent conductivity is preferably used. Terminal 370, a portion of which is disposed within circuit housing 360. There is a need to be disposed at a predetermined position within the circuit case 360. Therefore, in order to maintain the predetermined position, it is preferable to use a copper alloy excellent in rigidity, and for example, a copper alloy is preferably used. Further, in the present embodiment, the terminal 370 is partially embedded in the circuit case 360 as shown in FIG. Therefore, it is easy to maintain the arrangement position of the terminal 370 at a predetermined position.

As shown in FIGS. 24 and 25, the terminal 370 is composed of a pair of first terminals 371 and second terminals 372. When the first terminal 371 and the second terminal 372 are viewed in the circuit case 360 from the extending direction of the imaginary line connecting the two terminals 371 and 372 (FIG. 27), the circuit is formed on the central axis (also the lamp axis J). The region of the casing 360 divided into two portions is disposed on the side of the extension portion 356 of the circuit board 352. The first terminal 371 and the second terminal 372 are provided in a state of extending from the inner surface around the intersection of the connection portion 367 of the circuit cover 360 and the bottomed cylindrical portion 366 toward the bulb side (upper side).

The first terminal 371 and the second terminal 372 are configured to have a common shape, and are deformed by bending a square bar, for example, by bending both end sides of the center portion or the like. The first terminal 371 and the second terminal 372 are configured such that the substrate-side deformed portions 373 and 374 are located on the circuit board 352 side, the base-side deformed portions 375 and 376 are located on the base 400 side, and the linear portions 377 and 378 are located at the respective positions. The substrate-side deformed portion 373 and the base-side deformed portion 375, and the substrate-side deformed portion 374 and the base-side deformed portion 376.

Here, one of the straight portions 377 and 378 is embedded in the bottomed cylindrical portion 366 of the circuit case 360, and the portions on the side of the substrate-side deformed portions 373 and 374 of the straight portions 377 and 378 are at the end of the bottomed cylindrical portion 366. The portion or joint portion 367 extends from the inclined portion 365 in parallel with the lamp axis J.

The first terminal 371 and the second terminal 372 constituting the terminal 370 are integrally formed with the circuit cover 360. This integrated molding can be accomplished by a method of insert molding or two-color molding using a mold. Naturally, it is also possible to employ a method of positioning by inserting a terminal into a groove formed in a circuit case without using an integrated molding method.

As shown in FIG. 26, the substrate-side deformed portions 373 and 374 of the first terminal 371 and the second terminal 372 are disposed in a plane symmetrical position on the surface S. The surface S includes the lamp axis J (also the central axis of the circuit case 360), and a straight line perpendicular to the lamp axis J based on, for example, the second bending position 373b of the substrate-side deformation portion 373 is a normal line. By this, when the substrate-side deformed portions 373 and 374 are elastically deformed and the first conductive layer portion 353 and the second conductive layer portion 354 are pressed, respectively, uniform pressing can be applied to the circuit board 352.

(3-1) Terminal 1

The first terminal 371 is electrically connected to the contact piece 402 of the base 400 and the circuit board 352. Further, the first terminal 371 is in contact with the first conductive layer portion 353 formed on the end portion of the circuit board 352 on the base 400 side.

As shown in FIGS. 24, 25, and 26, the substrate-side deforming portion 373 has a first bent position 373a and a second bent position 373b from the side of the straight portion 377, as shown in FIG. The first bending position 373a has a shape that is folded toward the side of the straight portion 377 that is parallel to the central axis.

The portion between the second bending position 373b and the front end of the substrate-side deforming portion 373 (the side opposite to the end portion on the straight portion 377 side) and the circuit board 352 housed in the circuit case 360 in an inclined state are provided. The substrate-side deformation portion 373 is formed in such a manner that the surfaces are in contact with each other.

The portion between the first bending position 373a and the second bending position 373b, and the second folding The portion between the curved position 373b and the front end of the substrate-side deformed portion 373 is bent at the first bent position 373a and the second bent position 373b so that the portions are at nearly right angles to each other.

The linear portion 377 extends in the cylindrical portion 366a of the bottomed cylindrical portion 366 (in the peripheral wall of the tubular portion 366a) except for a portion on the side of the substrate-side deformed portion 373.

The base side deformation portion 375 has a first bending position 375a, a second bending position 375b, a third bending position 375c, and a fourth bending position 375d from the side of the straight portion 377.

Thereby, as shown in FIG. 24, the portion on the base side deformation portion 375 side of the linear portion 377 and the portion between the first bending position 375a and the second bending position 375b in the base-side deformation portion 375 are formed in the circuit. The inside of the cylindrical portion 366a of the bottomed cylindrical portion 366 of the casing 360 extends in a direction parallel to the central axis and a direction perpendicular to the direction.

A portion between the second bending position 375b and the fourth bending position 375d in the cap side deformation portion 375 extends along the inner surface of the bottom portion 366b of the bottomed cylindrical portion 366 of the circuit case 360.

A portion between the fourth bending position 375d of the cap side deformation portion 375 and the tip end (opposite to the end portion on the side of the straight portion 377) is led out from the bottom portion 360b of the circuit case 360 and extends toward the contact piece 402.

(3-2) 2nd terminal

The second terminal 372 is electrically connected to the outer casing 403 of the base 400 and the circuit board 352. Further, the second terminal 372 is in contact with the second conductive layer portion 354 formed on the end portion of the circuit board 352 on the base 400 side.

As shown in FIGS. 24, 25, and 26, the substrate-side deformed portion 374 has a first bent position 374a and a second bent position 374b from the side of the straight portion 378 as shown in FIG. The first bent position 374a has a shape that is folded toward the side of the straight portion 378 that is parallel to the central axis.

The second bending position 374b and the front end of the substrate-side deformation portion 374 (with the straight portion 378 side) The substrate-side deformed portion 374 is formed so as to be in contact with the surface of the circuit board 352 housed in the circuit case 360 in an inclined state in a portion between the opposite ends.

The portion between the first bending position 374a and the second bending position 374b and the portion between the second bending position 374b and the front end of the substrate-side deformation portion 374 are approximately at right angles to each other. The method is bent at the first bending position 374a and the second bending position 374b.

The linear portion 378 extends in the cylindrical portion 366a of the bottomed cylindrical portion 366 (in the peripheral wall of the cylindrical portion 366a) except for a portion on the side of the substrate-side deformed portion 374.

The base side deformation portion 376 has a first bending position 376a and a second bending position 376b from the side of the straight portion 378.

As a result, as shown in FIG. 24, the portion of the straight portion 378 on the base side deformation portion 376 side and the portion between the first bending position 376a and the second bending position 376b in the base side deformation portion 376 are formed in the circuit. The inside of the cylindrical portion 366a of the bottomed cylindrical portion 366 of the casing 360 extends in a direction parallel to the central axis and a direction perpendicular to the direction.

A portion between the second bent position 376b and the front end (opposite to the end on the side of the straight portion 378) in the cap side deformation portion 376 is provided from the cylindrical portion of the bottomed cylindrical portion 366 as shown in FIG. The hole portion 366c of the 366a is led out to the outside of the bottomed cylindrical portion 366.

(4) Circuit unit

Fig. 27 is a cross-sectional view showing a state in which the circuit unit in the lamp of the embodiment is housed in the circuit case; (a) is a view perpendicular to the A-A' cross section shown in Fig. 21 from the b1 direction. The arrow view of the -B' section; (b) is the arrow view of the B-B' section viewed from the b2 direction.

The circuit unit 350 is for illuminating the LED 321 of the semiconductor light emitting element with the power received via the lamp cap 400. The circuit unit 350, for example, includes: a rectifier circuit that will be supplied by a commercial power source The AC power is rectified into DC power; the smoothing circuit is rectified to smooth the current; and the lighting circuit is composed of an adjustment circuit for adjusting the voltage value of the DC power smoothed by the smoothing circuit (boosting or stepping down).

As shown in FIG. 25, the circuit unit 350 has a plurality of electronic components mounted on the circuit board 352. As shown in FIGS. 22 and 27, the circuit unit 350 is housed in the circuit case 360. Examples of the electronic component include a choke coil 351a, an electrolytic capacitor 351b, a capacitor 351c, an IC portion 351d, a noise filter 351e, and a resistor 351f. Further, these electronic components 351 are also described as electronic components 351a to 351f and the like.

The circuit board 352 is crossed in the inclined portion 365 of the circuit case 360 so as to intersect the center axis of the inclined portion 365 on the bottomed cylindrical portion 366 side ("B" in Fig. 27, hereinafter referred to as "intersection point B"), to the center State configuration of the axis tilt angle D. In particular, the intersection B with the central axis exists on the central axis of the inclined portion 365 at the first position corresponding to the lower end ("A1" in Fig. 27, hereinafter referred to as "first position A1"), and equivalent The midpoint of the second position ("A2" in Fig. 27, hereinafter referred to as "second position A2") at the upper end ("C" in Fig. 27, hereinafter referred to as "midpoint C") is closer to the first position A1. side. The circuit board 352 is mounted with an electronic component 351 on a main surface facing the circuit cover 340 that is opened by the plugging inclined portion 365.

The circuit substrate 352, in the circuit case 360, is mostly located within the inclined portion 365 and partially within the bottomed cylindrical portion 366. In other words, the circuit board 352 is configured by a main body portion 355 disposed in the inclined portion 365 and a protruding portion 356 protruding from the inclined portion 365 into the bottomed cylindrical portion 366.

The projecting portion 356 projects from the central portion of the body portion 355 on the lower end side of the body portion 355. Further, a central portion of the body portion 355 is a central portion in a direction perpendicular to a central axis of the body portion 355, and the central axis is a central axis of the body portion 355 which projects a projection line of the lamp axis J on the main surface of the body portion 355. .

Hereinafter, on the principal surface of the circuit board 352, the main surface on which the electronic component 351 is mounted is referred to as a surface, and the other principal surface is referred to as a back surface.

The body portion 355 and the projecting portion 356 are slightly square (refer to FIG. 25). Further, the front side end portion (end portion on the base 330 side) 352a of the circuit board 352 is constituted by the front side end portion of the main body portion 355, and the rear side end portion (end portion of the base 400 side) 352b of the circuit board 352, The rear end portion of the main body portion 355 and the projecting portion 356 are formed.

Each of the electronic components 351 is mounted on the surface of the circuit board 352, and a wiring pattern for forming a circuit such as a rectifier circuit and a first conductive layer portion 353 and a second conductive layer portion 354 for connecting the circuit unit 350 and the base 400 are formed.

In the first conductive layer portion 353 and the second conductive layer portion 354, a conductive layer portion having a small thickness is formed by a vapor deposition method or the like using a metal material. The first conductive layer portion 353 and the second conductive layer portion 354 are formed on the bottomed cylindrical portion 366 side of the main body portion 355, that is, on the side of the connecting portion 367.

When the first conductive layer portion 353 and the second conductive layer portion 354 are observed on the surface of the circuit board 352 (see FIG. 25), the lamp axis J is sandwiched and disposed on both sides of the lamp axis (left and right sides of the drawing: reference Figure 22). The first conductive layer portion 353 and the second conductive layer portion 354 have a rectangular shape, but may have other shapes such as a polygonal shape such as a circular shape, an elliptical shape, a triangular shape, or a pentagon shape.

The energization of the light-emitting module 320 will be described. The electric wiring (not shown) is led out from the circuit unit 350, and the electric wiring is connected to a power receiving portion (not shown) formed on the main surface of the mounting substrate 322 constituting the light-emitting module 320. connection. The light emitting module 320 emits light by supplying power in the electrical connection structure.

(5) circuit cover cover

As shown in FIG. 22, the circuit cover cover 340 is disposed between the base 330 and the circuit unit 350 in the extending direction of the lamp axis J (also referred to as the lamp axis direction). The circuit cover case 340 is formed of an insulating material such as resin or ceramic, and has a function of ensuring electrical insulation between the base 330 and the circuit unit 350.

A through hole (not shown) is formed in the thickness direction of the base 330. Through the through hole, will be self The electric wiring led out by the circuit unit 350 through the notch 340c of the circuit cover 340 is connected to a conductive layer (not shown) formed on the main surface of the mounting substrate 322 constituting the light-emitting module 320 by, for example, solder.

The circuit cover cover 340 is in the shape of a disk having a substantially circular shape in plan view (refer to FIG. 21). Specifically, the circuit cover cover 340 has a bottomed cylindrical portion 340a having a low-bottomed bottomed cylindrical shape, and a flange portion 340b that protrudes outward from the opening-side end portion of the bottomed cylindrical portion 340a.

In the flange portion 340b, a plurality of engaging portions 343 are provided at intervals in the circumferential direction. The engaging portion 343 is engaged with the engaged portion 368 provided on the upper end portion 360a of the circuit cover 360. Thereby, the circuit cover cover 340 is held (mounted) on the circuit case 360.

(6) Abutment

As shown in Figs. 21 and 22, the base 330 has a function of closing an end opening on the opposite side of the base 400 of the outer casing 380. Further, the base 330 has a function of mounting the light-emitting module 320 on its surface. Further, when the heat generated by the light-emitting module 320 is radiated from the outer casing 380, the base 330 has a function as a conduction path for conducting heat of the light-emitting module 320 to the outer casing 380, for example.

The base 330 has a disk shape that is slightly circular in plan view, and has a mounting surface 331a on which the light-emitting module 320 is mounted on the main surface (the main surface on the side opposite to the base 400 side).

As shown in Fig. 22, the base 330 has a bottomed cylindrical portion 331 having a low-bottomed bottomed cylindrical shape and a flange protruding outward from the open-side end portion (lower end portion) of the bottomed cylindrical portion 331. Part 332.

The bottomed cylindrical portion 331 has a mounting surface 331a on the surface (the surface on the far side of the base 400). The bottomed tubular portion 331 has a restriction mechanism around the mounting surface 331a, and the light-emitting module 320 mounted on the mounting surface 331a is restricted from sliding along the surface (moving along the mounting surface 331a).

The restricting mechanism is configured to protrude from the periphery of the mounting surface 331a toward the protruding portion 331b that protrudes in a direction perpendicular to the mounting surface 331a. The protrusion 331b (side surface) is rectangular in plan view The light-emitting module 320 is disposed to abut on a side surface corresponding to the four sides thereof.

The bottomed cylindrical portion 331 has an inner circumference of the inner peripheral portion 333 corresponding to the outer circumference of the bottomed cylindrical portion 340a of the circuit cover cover 340. That is, the bottomed cylindrical portion 340a of the circuit cover 340 is embedded in the bottomed cylindrical portion 331 of the base 330.

The flange portion 332 has a tapered outer peripheral side surface. This taper shape matches the shape of the inner peripheral surface 380a of the outer casing 380, and has a shape in which the outer diameter becomes smaller as it goes away from the bottomed cylindrical portion 331 side. Thereby, the flange portion 332 is in surface contact with the inner circumferential surface 380a of the outer casing 380, and heat generated from the light-emitting module 320 can be conducted to the outer casing 380 via the mounting substrate 322 and the base 330.

Further, in order to fully realize the role of the heat sink, the base 330 is formed using a metal such as aluminum. Naturally, it may be formed of a thermally conductive resin other than metal.

The flange portion 332 has a plurality of recesses 332a recessed from the outer peripheral surface toward the central axis at intervals in the circumferential direction. The attachment of the base 330 to the outer casing 380 inserts (presses) the abutment 330 into the upper end portion of the outer casing 380, and in this state, recesses the flange portion 332 with the outer casing 380. A portion corresponding to 332a is recessed (stamped) from the outer side of the outer casing 380 to be performed. Therefore, the base 330 is attached to the outer casing 380 by engaging the recessed portion of the outer casing 380 so as to project into the recess 332a of the base 330.

(7) Light-emitting module

The light-emitting module 320 is a light source body of the lamp 301. As shown in FIG. 21, the light-emitting module 320 includes an LED 321 as a semiconductor light-emitting element used as a light source, a mounting substrate 322 to which an LED 321 is mounted, and a sealing body 323 on the mounting substrate 322. The LED 321 is covered.

A portion of the mounting substrate 322 that does not cover the sealing body 323 is provided with a conductive layer (a portion electrically connected to the circuit unit 350, which is omitted from the circuit unit 350) for receiving power for causing the LED 321 to emit light from the circuit unit 350.

The sealing body 323 is mainly formed of a light-transmitting material. However, when it is necessary to convert the wavelength of light emitted from the LED 321 to a predetermined wavelength, the light-transmitting material is mixed with a wavelength-converting material having a wavelength of converted light.

As the light transmissive material, for example, a silicone resin can be used, and as the wavelength conversion material, for example, phosphor particles can be used. In the present embodiment, the LED 321 that emits cyan light and the sealed body 323 formed of a light-transmitting material that incorporates phosphor particles that convert the cyan light wavelength into yellow light are used, and a part of the cyan light emitted from the LED 321 is sealed. The 323 wavelength is converted into yellow light, and the white light generated by the color mixture of the unconverted cyan light and the converted yellow light is emitted from the light emitting module 320.

The light-emitting module 320 is mounted on the mounting surface 331a of the base 330. At this time, the main emission direction of the LED 321 is mounted in front of the lamp 301. The light emitting module 320 is fixed to the surface of the base 330 by an adhesive or a screw.

Further, in the present embodiment, the base 330 and the mounting substrate 322 are separately formed, but the base 330 may be used as the mounting substrate 322. In this case, the LED 321 as a semiconductor light-emitting element is mounted on the surface of the base 330.

(8) bulb shell

The bulb shell 310, as shown in FIGS. 21 and 22, is a member that encloses the light emitting module 320. Here, since the LED lamp 301 is an alternative to a general bulb, the bulb case 310 is shaped like a bulb ball of a general bulb shape such as an A-type bulb.

A diffusion process for diffusing light from the light-emitting module 320 is applied to the inner surface of the bulb shell 310. This diffusion treatment is carried out, for example, with cerium oxide, a white pigment or the like. Light incident on the inner surface of the bulb shell 310 passes through the bulb shell 310 and is taken out to the outside of the bulb shell 310.

The bulb case 310 is held by fixing its open side end portion 310a to the edge of the surface of the base 330 by using an adhesive or the like. Specifically, the opening side end portion 310a is fixed to be attached The surface of the protruding portion 331b other than the mounting surface 331a of the central region of the base 330 is used for the light-emitting module 320.

(9) External housing

The outer casing 380 has a function of housing the circuit casing 360 therein. Further, in the case where the outer casing 380 has a function of releasing the heat of the light-emitting module 320 conducted through the base 330 and conducting the light to the base 400 (this embodiment), it is preferable to use a metal material. In particular, aluminum is preferably considered to have heat dissipation, heat resistance, and lightness. Naturally, it may be formed of a thermally conductive resin other than metal.

Further, even if the outer casing 380 is made of metal, electrical insulation between the circuit unit 350 and the base 400 on the lower end side is ensured by the circuit casing 360 and the insulating ring 390.

The outer casing 380 has a cylindrical shape as shown in Figs. Specifically, it has a cylindrical shape in which both ends are opened, and the inner diameter and the outer shape are increased from the lower end (the side of the base 400) to the upper end (the side of the base 330). The outer casing 380 has a central axis that coincides with the lamp axis J in a state in which it is assembled as the lamp 301.

The diameter of the outer casing 380 gradually increases in diameter in accordance with the shape of the inclined portion 365 of the stored circuit casing 360. The outer casing 380 houses the circuit casing 360 (inclined portion 365) in a state in which the bottomed cylindrical portion 366 of the circuit casing 360 protrudes from the opening on the side of the base 400.

The opening of the outer casing 380 on the side of the bulb casing 310 is sealed by the base 330. The mounting of the base 330 to the outer casing 380 is as described in the above (6) base; the outer casing 380, the circuit casing 360, the insulating ring 390 and the base 400 are insulated by the following (10) Ring description.

(10) Insulation ring

The insulating ring 390 has a function of ensuring electrical insulation between the outer casing 380 and the base 400 when the outer casing 380 is made of a metal material. Therefore, the insulating ring 390 is formed of an insulating material such as resin or ceramic, and is disposed between the outer casing 380 and the base 400.

The insulating ring 390 has an annular shape as shown in FIG. Specifically, the shape in plan view is circular, and the cross section has a notched shape having two corners which are opposite to each other in a quadrangular shape.

The insulating ring 390 is externally fitted to the circuit cover 360 projecting from the lower end side opening of the outer casing 380, and has a joint portion 367 side of the bottomed cylindrical portion 366, and the threaded portion of the bottomed cylindrical portion 366 is screwed to the base 400.

Since the insulating ring 390 is interposed in the heat transfer path from the outer casing 380 to the base 400, it is preferable to use an insulating thermally conductive resin having electrical insulating properties and thermal conductivity in order to improve the thermal conductivity to the base 400. As the insulating heat conductive resin, a resin in which a polyester resin and a thermally conductive filler are combined can be used.

The insulating ring 390 is provided with a part of a rotation restricting mechanism that restricts rotation of the circuit case 360. Specifically, a concave portion 391 that is fitted to the convex portion 363 formed by the bottomed cylindrical portion 366 of the circuit casing 360 is formed. One or more recesses 391 may be used. Here, three convex portions 363 corresponding to the circuit cover 360 are formed at intervals in the circumferential direction.

3. Storage of circuit unit

(1) Storage space

The circuit case 360 is such that the circuit board 352 on which the plurality of electronic components are mounted is closer to the first position (A1) side and the inclined portion 365 than the center position (C) of the first position (A1) and the second position (A2). The way the center axis intersects is supported in a tilted state. On the other hand, the inner diameter (and outer diameter) of the inclined portion 365 of the circuit casing 360 becomes larger on the central axis as it moves from the side of the base 400 toward the side of the circuit cover 340. Thereby, the space between the surface of the circuit board 352 (the surface facing the circuit cover 340) and the inner peripheral surface of the inclined portion 365 moves toward the base 330 side from the side of the base 400. Become bigger. Or, the distance between the surface of the circuit board 352 and the inner peripheral surface of the inclined portion 365 becomes larger as it moves from the side of the base 400 toward the side of the base 330.

Therefore, in the plurality of electronic components 351 mounted on the circuit board 352, by placing the electronic component having a high height on the circuit cover 340 side of the circuit board 352, the electronic zero having a high height can be disposed. The pieces are housed in the circuit case 360. Here, the electronic component 351 having a high height has a choke coil 351a, a capacitor 351c, and the like.

(2) Mounting area of the circuit board

When the circuit board is arranged in a vertical shape so as to include the central axis of the circuit case (here, the inclined portion), the mounting area of the circuit board can be increased. However, in this case, the distance between the circuit board and the inner surface of the circuit case becomes small, and it becomes difficult to arrange an electronic component having a high height.

In the present embodiment, the circuit board 352 is made to intersect the center axis of the first position (A1) and the center axis of the inclined portion 365 at the center position (C) of the first position (A1) and the second position (A2). State, tilted to the center axis. In this case, when the cross-sectional shape of the circuit case 360 is annular, the circuit board 352 is tilted to approach the inner peripheral surface of the circuit case, and the width of the circuit board 352 is reduced (the mounting area is small). .

However, in the present embodiment, the ratio (F/G) of the diameter F to the height G of the inclined portion 365 shown in Fig. 27(b) is set to 2. Therefore, the circuit board 352 having a wide width can be utilized, and even if the circuit board 352 is tilted, a sufficient mounting area can be secured.

In the present embodiment, the ratio (F/G) of the diameter F to the height G of the inclined portion 365 is 2, but the ratio is preferably 0.5 or more, and more preferably 1.15 or more. In order to suppress the temperature rise of the LED 321 as much as possible, it is necessary to move away from the circuit unit which is one of the heat sources. Therefore, although it is difficult to secure the mounting area of the electronic component, when the electronic component mounted vertically on the circuit board 352 is a high-electronic component, the diameter F of the inclined portion 365 is the same as the height G. The above is set to ensure the height area of the electronic component and away from the LED 321 . This ensures a sufficient installation area.

Further, since the circuit board 352 having a wide width can be used, for example, the choke coil 351a and the IC component 351d can be arranged side by side in the direction perpendicular to the lamp axis J (the horizontal direction in the drawing of FIG. 25). In general, since the lamp is used with the lamp cap as the upper side, the configuration of the present embodiment can reduce the use of the IC component 351d on the upper side of the choke coil 351a. state. Therefore, when the lamp is lit, the influence of the heat that the IC component 351d receives from the choke coil 351a can be reduced.

(3) Mounting form of electronic parts

The plurality of electronic components 351 include electronic components of a wire type in which a body portion of the electronic component is mounted on the circuit substrate 352 via a wire. By disposing the body portion of the one-wire type electronic component inside the lamp cap 400 (also inside the bottomed cylindrical portion 366 of the circuit cover 360), the number of electronic components housed inside the inclined portion 365 can be reduced. The figure seeks to miniaturize the circuit case 360. In particular, by disposing the bulk portion of the bulky electrolytic capacitor 351b in the base 400 (in the bottomed cylindrical portion 366), the space (volume) of the remaining electronic components in the inclined portion 365 can be efficiently reduced. ).

(4) Electronic component mounting surface

Most of the plurality of electronic components are mounted on the surface opposite to the circuit cover cover 340 in the circuit substrate 352. That is, most of the electronic components are housed in the housing space surrounded by the circuit case 360 (inclined portion 365), the circuit board 352, and the circuit cover cover 340. Therefore, when the lamp is turned on, the temperature in the storage space surrounded by the circuit case 360 (the inclined portion 365), the circuit board 352, and the circuit cover cover 340 is likely to rise.

Further, the circuit board 352 has a shape in which the side surface along the lamp axis J is in contact with the inner peripheral surface of the circuit case 360 (although not in contact but in the vicinity of the inner peripheral surface). Therefore, by lighting the lamp, the temperature in the storage space is likely to rise.

Further, in a state where the surface is opposed to the circuit cover cover 340, the circuit board 352 is inclined so as to be away from the lamp axis J toward the side of the circuit cover cover 340. Therefore, when lighting, the heat generated by the light-emitting module 320 is transmitted from the base 330 to the circuit cover 340 and released into the storage space, and the temperature in the storage space is likely to rise.

As described above, when the lamp is turned on, the temperature in the storage space on the front side of the circuit board 352 in the circuit case 360 is more likely to rise than the temperature in the space on the back side of the circuit board 352. Therefore, the temperature difference between the front and the back of the circuit board 352 becomes large, and the inside of the circuit case 360 is likely to be generated. Air convection can reduce the thermal load of the electronic component 351 constituting the circuit unit 350.

4. Circuit substrate

(1) Tilt of the circuit board

The circuit board 352 is inclined at an angle D to the lamp axis J. On the other hand, the inclined portion 365 is inclined at an angle E to the lamp axis J. In particular, the angle D is larger than the angle E (refer to Fig. 27 (a)). Here, in the graph of Fig. 27, in order to make the difference between the angle D and the angle E easy to visually recognize, the angle E is shown as an angle with respect to the axis J' which moves the lamp axis J in parallel.

By the difference between the angle D and the angle E, the space between the surface of the circuit board 352 and the inner peripheral surface of the circuit case 360 and the entire space inside the circuit case 360 are compared as a straight line. The amount of change in the area of the lamp axis in the cross section when the face of the lamp axis J is cut is compared with the amount of change in the area on the side of the lamp cover 340 with respect to the area on the side of the base 400, and is located on the surface of the circuit board 352. The space between the inner peripheral faces of the circuit casing 360 becomes larger. That is, the space between the surface of the circuit board 352 and the inner peripheral surface of the circuit case 360 has a large volume change in the extending direction of the lamp axis J as compared with the space inside the circuit case 360.

Thereby, the moving speed of the air from the inclined portion 365 in the circuit casing 360 to the bottomed cylindrical portion 366 side can be accelerated, and convection in the circuit casing 360 can be promoted. Further, in the present embodiment, the angle D is 30 [°], and the angle E is 17 [°].

(2) Configuration of electronic parts

In the present embodiment, the ratio (F/G) of the diameter F to the height G of the inclined portion 365 is 2, and the IC component 351d is arranged in parallel with the choke coil 351a. As a result, when the lamp 301 is turned up with the base 400 facing upward, the air heated by the capacitor 351e and the choke coil 351a rises toward the base 400, and the heat load to the IC component 351d can be reduced.

In particular, in the circuit board 352, the electronic components disposed on the opposite side of the choke coil 351a and the base 400 are capacitors 351c and 351e, and the capacitor 351e is disposed to be disposed opposite to the base 400 of the IC component 351d. The capacitor 351c at the side portion is larger. Thereby, the temperature of the column in which the choke coil 351a is disposed and its surroundings become matched with the IC component 351d. The temperature in the column and its surroundings is higher. Therefore, when the lamp is turned on, the air around the arrangement of the choke coils 351a flows toward the base 400, and the air around the arrangement of the IC components 351d flows toward the row side where the choke coils 351a are arranged, thereby reducing the heat to the IC parts 351d. load.

[Modification]

Although the lamp 301 according to the embodiment of the present invention is specifically described above, the above embodiment is for the purpose and function of the present invention. The effect is easily explained with an explanation of the examples used, and the content of the present invention is not limited to the above embodiment.

1. Circuit cover

(1) External housing

In the present embodiment, the circuit unit 350 is housed in the circuit case 360, and the circuit case 360 is covered with the outer case 380.

However, in the state in which the circuit board 352 is inclined, the circuit unit 350 is disposed in the inclined portion in which the inner diameter and the outer diameter are increased from the first position A1 on the central axis to the second position A2. It may be a construction that is not covered with an outer casing.

However, in order to protect the circuit case from the function of the heat sink, it is necessary to ensure the insulation between the circuit unit and the base when the circuit cover is made of metal. As an example of ensuring insulation, an insulating layer may be formed in a portion of the circuit unit and the base in contact with or in proximity to the circuit case, or an insulating treatment may be applied to the circuit case (for example, in the case where the metal is aluminum, for example, alumina) Membrane treatment).

(2) shape

The circuit case 360 of the present embodiment has the inclined portion 365, the bottomed cylindrical portion 366, and the connecting portion 367. However, the circuit case 360 has at least an inclined portion, and the shape thereof is not particularly limited.

For example, the tubular portion may be provided on the other end side of the inclined portion (the end side of the semiconductor light-emitting element of the central axis), or may be one end of the inclined portion (the end side of one of the positions of the central axis) The cylindrical portion is directly extended without interposing the connecting portion on the opposite side of the other end side.

(3) circuit cover cover

In the present embodiment, the circuit cover 340 closes the base 330 side of the circuit cover 360, but may have a structure without the circuit cover 340. In this case, if it is necessary to ensure insulation between the circuit unit and the base, for example, an insulating layer may be formed on the back surface of the base or an insulating treatment may be applied to the base.

In addition, it is also possible to integrate the circuit cover and the circuit cover cover. In this case, for example, a member divided into two imaginary planes including a central axis may be combined and implemented after the circuit unit is housed.

2. Circuit substrate

(1) Types of electronic parts

In the present embodiment, the circuit unit includes a rectifier circuit, a smoothing circuit, a voltage swing (boost and lower voltage) circuit, and a control circuit, and has a capacitor, a coil, a resistor, a diode, an IC circuit, etc., but other components may be used. The electronic component constitutes, for example, a transformer (buck-boost) circuit and a control circuit.

(2) Mounting surface

In the present embodiment, a plurality of electronic components are mounted on the surface of the circuit board 352 (the portion where the electronic component and the substrate are connected to each other), but the plurality of electronic components may not be mounted on the front side.

For example, a diode bridge (diode) for a rectifier circuit can be mounted on the back side. However, if convection of the air in the circuit case is considered, the electronic component mounted on the surface should be a component that is relatively easy to heat when the lamp is lit. Similarly, the electronic component mounted on the back side should be a component that does not generate heat even when the lamp is lit.

51‧‧‧Circuit parts (electronic parts)

52‧‧‧Substrate (circuit board)

52a‧‧‧ front side end

52c‧‧‧Back

53‧‧‧1st power receiving mat (1st conductive layer part)

54‧‧‧2nd power receiving mat (2nd conductive layer part)

55a‧‧‧ Rear side end

60‧‧‧Circuit cover

60a‧‧‧Open side end

60s‧‧‧Open face

61‧‧‧Clocking part (clamping part)

62‧‧‧Guidance (protrusion)

62s‧‧‧ sloped surface

65‧‧‧ Large diameter section (inclined section)

65b‧‧‧ rear side end

66‧‧‧ Small diameter section (cylinder section)

67‧‧‧Reducing section

67a‧‧‧ front side end

71‧‧‧1st power supply conductive plate (1st terminal)

72‧‧‧Second power supply conductive plate (second terminal)

73‧‧‧Before the first power supply conductive plate front end (substrate side deformation part of the first terminal)

73a, 74a‧‧‧1st bend position

73b, 74b‧‧‧2nd bend position

74‧‧‧Before the second power supply conductive plate front end (substrate side deformation part of the second terminal)

90‧‧‧Insulation ring

100‧‧‧ lamp holder

Claims (23)

A lamp is provided with a pair of lamp terminals having a pair of connection terminal portions at one end of a cylindrical circuit cover, and the semiconductor light-emitting module is disposed outward in the direction of the cylinder axis toward the light-emitting direction at the other end opening side, in the circuit cover case A circuit unit that supplies electric power to the semiconductor light-emitting module, wherein the circuit unit includes a substrate on which the circuit component is mounted, and a pair of power receiving pads are formed on a surface of the substrate on which the circuit component is not mounted; a pair of power receiving pads are connected to the connection terminal portion of the pair of power supply plates via a pair of power supply conductive plates; and the pair of power supply conductive plates are respectively connected to the inner side of the lamp cap a pair of connecting terminal portions extending from the connecting terminal portion to the inside of the circuit case, extending toward the substrate along the axis of the tube toward the other end of the circuit case, and the other ends of the circuit housing are located in the circuit case The pair of power receiving pads respectively contacting the substrate. The luminaire of claim 1, wherein the pair of power supply conductive plates extend in the side wall of the circuit cover along the cylindrical axis toward the other end of the circuit cover. The luminaire of claim 2, wherein the pair of power supply conductive plates are such that the one end is not in the wall from the inner side of the side wall of the circuit casing closest to the circuit casing, and the circuit casing is further along the cylinder axis. The opening direction of one end extends in the wall, and the other end of the circuit is formed in the inner space of the circuit case near the end of the substrate of the circuit unit, and is in contact with the power receiving pad of the substrate. The luminaire according to any one of claims 1 to 3, wherein the substrate is disposed obliquely from an opening surface of the circuit casing and a cylindrical shaft. The luminaire according to any one of claims 1 to 3, wherein an outer casing is disposed, and a peripheral surface of the circuit casing is surrounded by a peripheral surface other than the base. The luminaire according to any one of claims 1 to 3, wherein the substrate is disposed obliquely from an opening surface of the circuit case; the pair of power receiving pads are formed on one end side of the base side of the substrate Face One end of the substrate is locked by the other end of the pair of power supply conductive plates in contact with the pair of power receiving pads; the other end of the substrate is formed at the other end of the circuit case The inner locking portion is locked. The luminaire of claim 6, wherein the other end of each of the pair of power supply conductive plates is biased toward the power receiving pad by the spring property of each of the power supply conductive plates. The luminaire of claim 7, wherein the other end of the pair of power supply conductive plates is attached to the shaft shaft of the circuit casing and the other end is a base point perpendicular to the cylinder shaft The plane whose straight line is the normal line is placed at a position that is symmetrical. The luminaire of claim 7, wherein a guiding portion is formed on an inner surface of the circuit casing, the guiding portion having an inclined surface corresponding to an inclination of the substrate from an opening surface of the circuit casing; When the substrate is disposed in the circuit case, the guiding portion guides the substrate toward the disposed position along the inclined surface; the biasing is performed by the substrate abutting on the inclined surface as a fulcrum. The luminaire of claim 7, wherein one end of the substrate is inserted into a support groove formed on an inner surface of the circuit cover; and the other end of the pair of power supply conductive plates is at the support groove The inner surface is disposed between the inner surface of the support groove and the substrate. The luminaire of claim 7, wherein the other end of the pair of power supply conductive plates has a bent shape. The luminaire of claim 7, wherein the other end of the pair of power supply conductive plates has a bifurcated shape. The luminaire according to any one of claims 1 to 3, wherein the circuit casing and the pair of power supply conductive plates are integrally formed. A luminaire as claimed in any one of claims 1 to 3, wherein The semiconductor light emitting module is configured to include a mounting substrate and a semiconductor light emitting element mounted on a main surface of the mounting substrate opposite to the circuit case side, and is formed on a surface of the mounting substrate for receiving a power receiving pad for the component for supplying power of the circuit unit; forming a surface for supplying the semiconductor light emitting module to a surface of the substrate constituting the circuit unit in a portion where the circuit component and the pair of power receiving pads are not present A power supply pad for electric power; a power supply conductive member that maintains a posture in a cylinder axis direction of the circuit casing, one end of which is connected to the power supply pad, and the other end of which is connected to the component power receiving pad. The lamp according to claim 14, wherein the power supply conductive member has a plate shape, and one of the one end portion and the other end portion is connected to the one end portion of the power supply conductive member by the spring property of the power supply conductive member. Pad bias. The luminaire of claim 14, wherein the mounting substrate is mounted on a main surface of the base between the circuit casing and the semiconductor light emitting module in a direction of a cylinder axis of the circuit casing; The base is formed with a through hole penetrating in the direction of the cylinder axis of the circuit case, and the power supply conductive member penetrates the through hole through the electrically insulating member. The lamp of claim 4, wherein the circuit case has an inclined portion, and an inner diameter of the inclined portion becomes larger from a first position on one end side of the cylindrical shaft toward a second position on the other end side The substrate is disposed in a state to be described later, which is closer to the first position than the center position of the first position and the second position, and intersects the cylindrical axis of the inclined portion. The luminaire of claim 17, wherein the inclined portion has a circular cross-sectional shape; the circuit cover has a cylindrical portion, and the cylindrical portion is from the end of the first position side of the inclined portion a portion protruding toward the opposite side of the second position in a cylindrical shape; the circuit component mounted on the substrate is composed of a plurality of components, and the electrolytic capacitor for smoothing one of the plurality of circuit components has the body portion located therein Inside the cylinder. The luminaire of claim 18, wherein the lamp cap is mounted on the cylindrical portion. The luminaire of claim 17, wherein the lamp cap is mounted on the first position side of the inclined portion; The circuit component mounted on the substrate is composed of a plurality of electrolytic capacitors for smoothing one of the plurality of circuit components, and the body portion is located in the base. The luminaire of claim 17, wherein the circuit casing has a guiding portion for guiding the substrate to an inclined state. The lamp of claim 17, wherein the circuit component mounted on the substrate is composed of a plurality of components, and the component that is relatively easy to generate heat when the semiconductor light emitting module is turned on is mounted on the plurality of circuit components. The first position side of the substrate. In the lamp according to the twenty-second aspect of the invention, the circuit component mounted on the first position side is mounted on a position close to the peripheral wall on the first position side of the circuit case.