TW201338881A - Instrument reprocessor and instrument reprocessing methods - Google Patents

Instrument reprocessor and instrument reprocessing methods Download PDF

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TW201338881A
TW201338881A TW101138554A TW101138554A TW201338881A TW 201338881 A TW201338881 A TW 201338881A TW 101138554 A TW101138554 A TW 101138554A TW 101138554 A TW101138554 A TW 101138554A TW 201338881 A TW201338881 A TW 201338881A
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fluid
valve
post
pump
passage
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TW101138554A
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TWI620602B (en
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Nick N Nguyen
Ujjal Bhaumik
Hal Williams
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Ethicon Inc
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/24Apparatus using programmed or automatic operation
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/12Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements
    • A61B1/121Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements provided with means for cleaning post-use
    • A61B1/123Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements provided with means for cleaning post-use using washing machines
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/12Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements
    • A61B1/121Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements provided with means for cleaning post-use
    • A61B1/125Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with cooling or rinsing arrangements provided with means for cleaning post-use using fluid circuits
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/70Cleaning devices specially adapted for surgical instruments
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/16Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
    • A61L2/18Liquid substances or solutions comprising solids or dissolved gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027Cleaning the internal surfaces; Removal of blockages
    • B08B9/032Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00Control of fluid pressure
    • G05D16/20Control of fluid pressure characterised by the use of electric means
    • G05D16/2006Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2013Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/70Cleaning devices specially adapted for surgical instruments
    • A61B2090/701Cleaning devices specially adapted for surgical instruments for flexible tubular instruments, e.g. endoscopes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7761Electrically actuated valve
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/85978With pump
    • Y10T137/85986Pumped fluid control
    • Y10T137/86002Fluid pressure responsive
    • Y10T137/8601And pilot valve

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Engineering & Computer Science (AREA)
  • Veterinary Medicine (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Epidemiology (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Endoscopes (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Flow Control (AREA)
  • Loading And Unloading Of Fuel Tanks Or Ships (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)

Abstract

An instrument reprocessor for cleaning, disinfecting, and/or sterilizing a medical instrument is disclosed. To reprocess instruments having one or more channels defined therein, the reprocessor can include one or more flow control systems configured to control a flow of fluid through each channel. In various embodiments, a flow control system can include a differential pressure sensor and a proportional valve for controlling the fluid flow in a channel. The reprocessor can also include, one, a fluid circulation pump which can be configured to supply the flow control systems with fluid and, two, a system for controlling the pressure of the fluid supplied to the flow control systems. The reprocessor can also include a system for supplying a metered amount of fluid to the fluid circulation system. The system can include a reservoir having a fluid height sensor to monitor the amount of fluid therein and a pump configured to supply the reservoir with fluid.

Description

器具後處理器及器具後處理方法 Post-processor and appliance post-processing method

本發明係一般性關於醫療器具之後處理、清洗、消毒及/或淨化。 The present invention relates generally to the subsequent treatment, cleaning, disinfection and/or purification of medical devices.

在各種情況下,內視鏡可以包括具有遠側端的細長部分或管,該遠側端可組態成插入病患體內,而且此外,內視鏡可以包括複數個延伸穿過該細長部分的通道,該等通道可組態成導入水、空氣及/或任何其他合適的流體進入外科手術部位。在一些情況下,內視鏡中的一或多個通道可組態成導引外科手術器具進入該外科手術部位。在任何情況下,內視鏡可以進一步包括具有與該等通道流體連接的入口之近側端,而且此外,內視鏡可以進一步包括具有一或多個閥及/或開關的控制頭部分,該控制頭部分組態成控制通過該等通道的流體之流動。在至少一情況下,內視鏡可以包括空氣通道、水通道以及該控制頭內的一或多個閥,該一或多個閥組態成控制通過該等通道的空氣及水之流動。 In various circumstances, the endoscope can include an elongated portion or tube having a distal end that can be configured to be inserted into a patient, and further, the endoscope can include a plurality of channels extending through the elongated portion The channels can be configured to introduce water, air, and/or any other suitable fluid into the surgical site. In some cases, one or more channels in the endoscope may be configured to guide the surgical instrument into the surgical site. In any event, the endoscope may further include a proximal end having an inlet fluidly coupled to the channels, and further, the endoscope may further include a control head portion having one or more valves and/or switches, The control head portion is configured to control the flow of fluid through the channels. In at least one instance, the endoscope can include an air passage, a water passage, and one or more valves within the control head, the one or more valves configured to control the flow of air and water through the passages.

可以使用淨化系統來後處理先前使用過的醫療裝置,例如內視鏡,使得該醫療裝置可被再次使用。存在各種用以後處理內視鏡的淨化系統。一般來說,這樣的系統可包括至少一沖洗槽,其中可將待清洗及/或殺菌的內視鏡放置於該沖洗槽中。沖洗槽通常是由殼體支撐,該殼體係支撐由管線、幫浦及閥組成的循環系統,該循環系統之目的係用以引導清洗及/或殺菌劑進入及/或到已經被放置在洗槽中的內視鏡上。在淨化處理的過程中,可以對內視鏡內的通道進行評估,以便驗證通道未被阻塞。在各種實施例中,循環系統可以藉由連接器與內視鏡通道流體式耦接,該連接器係可釋放地接合可以界定通道末端的端口。這 種連接器可以在附接到內視鏡的時候實現流體密封,而在淨化處理結束時卻可以很容易地脫開。 A purification system can be used to post-process a previously used medical device, such as an endoscope, such that the medical device can be reused. There are various purification systems for processing endoscopes later. Generally, such a system can include at least one irrigation tank in which an endoscope to be cleaned and/or sterilized can be placed. The rinsing tank is typically supported by a housing that supports a circulation system consisting of a line, a pump, and a valve for guiding cleaning and/or sterilant entry and/or to have been placed in the wash. On the endoscope in the slot. During the purification process, the channels within the endoscope can be evaluated to verify that the channel is not blocked. In various embodiments, the circulatory system can be fluidly coupled to the endoscope channel by a connector that releasably engages a port that can define the end of the channel. This The connector can be fluidly sealed when attached to the endoscope and can be easily disengaged at the end of the cleaning process.

不應將以上的討論視為對權利要求範圍的否定。 The above discussion should not be considered as a denial of the scope of the claims.

在至少一個形式中,一種用以清洗醫療器具的器具後處理器可以包含組態成容置該醫療器具的腔室、後處理流體之供應、與該後處理流體之供應處於流體連接的供應幫浦,其中該供應幫浦包含正排量幫浦、以及與該供應幫浦處於流體連接的儲存器,其中該儲存器包含頂部及底部,以及其中該儲存器可以包含介於該頂部與該底部之間的後處理流體高度。該器具後處理器可以進一步包含延伸於該儲存器頂部與該儲存器底部之間的線性感測器,其中該線性感測器組態成偵測該後處理流體高度,而且此外,與該線性感測器處於訊號通訊的處理器,其中該處理器組態成於該後處理流體高度低於預定高度時操作該供應幫浦,以及其中該預定高度係介於該儲存器頂部與該儲存器底部之間。該器具後處理器可以進一步包含與該儲存器底部及該腔室處於流體連接的分配幫浦,其中該分配幫浦包含正排量幫浦,以及其中該處理器組態成操作該分配幫浦。 In at least one form, an appliance post processor for cleaning a medical device can include a chamber configured to receive the medical device, a supply of post-treatment fluid, and a supply gang that is in fluid connection with the supply of the post-treatment fluid Pu, wherein the supply pump comprises a positive displacement pump, and a reservoir in fluid connection with the supply pump, wherein the reservoir comprises a top and a bottom, and wherein the reservoir can be contained between the top and the bottom The height of the post-treatment fluid. The appliance post processor may further include a line sensor extending between the top of the reservoir and the bottom of the reservoir, wherein the line sensor is configured to detect the height of the post-treatment fluid and, in addition, with the line The sensor is in the processor of signal communication, wherein the processor is configured to operate the supply pump when the post process fluid level is below a predetermined height, and wherein the predetermined height is between the top of the reservoir and the reservoir Between the bottom. The appliance post processor may further include a dispensing pump in fluid connection with the reservoir bottom and the chamber, wherein the dispensing pump includes a positive displacement pump, and wherein the processor is configured to operate the dispensing pump .

在至少一個形式中,一種控制通過一器具之後處理流體的流動之方法,該器具具有至少一第一通道及一第二通道,該方法包含以下步驟:操作一與一後處理流體來源處於流體連接的幫浦;使該後處理流體流經一第一流體迴路,該第一流體迴路包含一第一閥及一第一壓差感測器,其中該第一流體迴路與該幫浦及該第一通道處於流體連接;以及使該後處理流體流經一第二流體迴路,該第二流體迴路包含一第二閥及一第二壓差感測器,其中該第二流體迴路與該幫浦及該第二通道處於流體連接。該方法可以進一步包含以下步驟:使用該第一壓差感測器偵測流入該第一閥的該後處理流體中之一第一壓差;使用該第二壓差感測器偵測流入該第二閥的該後處理流體中之一第二壓差;使用來自該第一壓差感測器的一輸出調變該第一閥,以控制通過該第一通道的後處理流體之第一流速;以及使用來自該第二壓差感測器的一輸出調變該第二閥,以控制通過該第二通道的後處理流體之第二流速。在至少一個形式 中,一種用於清洗一包括一通路的醫療器具之器具後處理器可以包含:一組態成容置該醫療器具之腔室;一組態成與該通路流體式耦接之供應連接器;一組態成加壓一後處理流體及供應該後處理流體至該供應連接器之幫浦,該幫浦包含一入口及一出口;以及一定位以感測流自該幫浦出口的該後處理流體之錶壓的錶壓感測器。該器具後處理器可以進一步包含一流動控制系統,該流動控制系統包括與該供應連接器處於流體連接之閥,其中該閥組態成控制後處理流體通過該通路之一流速,而且其中該閥包含一入口及一出口。該器具後處理器可以進一步包括一壓差感測器,該壓差感測器組態成感測於一固定流孔之相對側上的該後處理流體中之一壓降,其中該壓差感測器係位於該錶壓感測器下游及該閥出口上游;以及一與該壓差感測器處於訊號通訊之處理器,其中該處理器組態成基於該壓降解譯該流速,並且命令該閥進行至少部分關閉及至少部分開啟中之至少一者。 In at least one form, a method of controlling the flow of a fluid after passing an appliance, the apparatus having at least a first passage and a second passage, the method comprising the steps of: operating one in fluid connection with a source of post-treatment fluid a pump for flowing the post-treatment fluid through a first fluid circuit, the first fluid circuit comprising a first valve and a first differential pressure sensor, wherein the first fluid circuit and the pump and the first a channel is in fluid connection; and the post-treatment fluid flows through a second fluid circuit, the second fluid circuit comprising a second valve and a second differential pressure sensor, wherein the second fluid circuit and the pump And the second passage is in fluid connection. The method may further comprise the steps of: detecting, by the first differential pressure sensor, a first differential pressure in the post-treatment fluid flowing into the first valve; and detecting the inflow using the second differential pressure sensor a second differential pressure in the post-treatment fluid of the second valve; modulating the first valve with an output from the first differential pressure sensor to control the first of the aftertreatment fluid passing through the first passage a flow rate; and modulating the second valve using an output from the second differential pressure sensor to control a second flow rate of the aftertreatment fluid through the second passage. In at least one form An apparatus for cleaning a medical device including a passage may include: a chamber configured to receive the medical device; and a supply connector configured to be fluidly coupled to the passage; a pump configured to pressurize a post-treatment fluid and supply the post-treatment fluid to the supply connector, the pump including an inlet and an outlet; and a positioning to sense the flow from the pump outlet A gauge pressure sensor that treats the gauge pressure of a fluid. The appliance after processor may further include a flow control system including a valve in fluid connection with the supply connector, wherein the valve is configured to control a flow rate of the post-treatment fluid through the passage, and wherein the valve Includes an entrance and an exit. The appliance post processor may further include a differential pressure sensor configured to sense a pressure drop in the post-treatment fluid on an opposite side of a fixed flow orifice, wherein the differential pressure a sensor is located downstream of the gauge sensor and upstream of the valve outlet; and a processor in signal communication with the differential pressure sensor, wherein the processor is configured to translate the flow rate based on the pressure degradation, And instructing the valve to perform at least one of at least partial closing and at least partial opening.

在至少一個形式中,一種使用一監控系統來維持用於器具後處理器之一流體循環系統的一供應儲存器內之後處理流體體積的方法可以包含以下步驟:從一後處理流體來源供應一後處理流體量至該供應儲存器,感測該後處理流體於該供應儲存器中之量,以及判斷該後處理流體於該供應儲存器中之量是否大於一預定量。 In at least one form, a method of using a monitoring system to maintain a volume of fluid after treatment in a supply reservoir for a fluid circulation system of an appliance post-processor can include the steps of: supplying a post-treatment from a post-treatment fluid source The amount of fluid is supplied to the supply reservoir, the amount of the post-treatment fluid in the supply reservoir is sensed, and the amount of the post-treatment fluid in the supply reservoir is determined to be greater than a predetermined amount.

該方法可以進一步包含以下步驟:假使後處理流體於該供應儲存器中之量少於該預定量,則操作一正排量填充幫浦以供應後處理流體至該供應儲存器,其中該正排量填充幫浦組態成於每次抽動供應一固定體積的後處理流體,當操作該正排量填充幫浦時監控後處理流體於該供應儲存器中之量,判斷後處理流體於該供應儲存器中之量是否已經增加一等於每次抽動的推動體積與該正排量填充幫浦的抽動次數之乘積的再供應體積,以及假使後處理流體於該供應儲存器中之量未增加該再供應體積,則廣播一警報。 The method may further comprise the steps of: operating a positive displacement fill pump to supply a post-treatment fluid to the supply reservoir, provided that the amount of post-treatment fluid in the supply reservoir is less than the predetermined amount, wherein the positive row The quantity filling pump is configured to supply a fixed volume of post-treatment fluid per twitch, monitor the amount of post-treatment fluid in the supply reservoir when operating the positive displacement filling pump, and determine the post-treatment fluid at the supply Whether the amount in the reservoir has increased by a re-supply volume equal to the product of the push volume of each twitch and the number of twitches of the positive displacement fill pump, and if the amount of post-treatment fluid in the supply reservoir is not increased When the volume is re-supply, an alarm is broadcast.

在至少一個形式中,一種控制通過一包含一通道的器具之後處理流體的流動之方法,該方法可以包含以下步驟:操作一與一後處理流體來源處於流體連接的幫浦;測量流自該幫浦的該後處理流體之錶壓;調整該後處理流體的流動,以調整該後處理流體的錶壓;以及使 該後處理流體流經一流體迴路,該流體迴路包含一閥及一壓差感測器,其中該流體迴路與該幫浦及該通道處於流體連接。該方法可以進一步包含以下步驟:使用該壓差感測器偵測流入該閥的該後處理流體中之一壓差,以及使用來自該壓差感測器之一輸出來調變該閥,以控制後處理流體通過該通道之流速。 In at least one form, a method of controlling the flow of a fluid after passing through an apparatus comprising a channel, the method can include the steps of: operating a pump in fluid connection with a source of post-treatment fluid; measuring flow from the gang The gauge pressure of the post-treatment fluid; adjusting the flow of the post-treatment fluid to adjust the gauge pressure of the post-treatment fluid; The post-treatment fluid flows through a fluid circuit that includes a valve and a differential pressure sensor, wherein the fluid circuit is in fluid connection with the pump and the passage. The method may further comprise the steps of: using the differential pressure sensor to detect a pressure differential in the post-treatment fluid flowing into the valve, and using the output from the differential pressure sensor to modulate the valve to The flow rate of the treated fluid through the passage is controlled.

在至少一個形式中,一種控制流動通過一器具之後處理流體的之方法,該器具具有至少一第一通道及一第二通道,其中該第一通道係由一參數之一第一值所界定,而該第二通道係由該參數之一第二值所界定,該方法包含以下步驟:初始化一與一後處理流體來源處於流體連接的幫浦,以開始一操作循環;供應該後處理流體至一包含一第一閥的第一流體迴路,其中該第一流體迴路與該幫浦及該第一通道處於流體連接;以及供應該後處理流體至一包含一第二閥的第二流體迴路,其中該第二流體迴路與該幫浦及該第二通道處於流體連接該方法可以進一步包含以下步驟:調變該第一閥以限制通過該第一通道的後處理流體之流動,其中後處理流體之流動受限於基於該參數之該第一值與該參數之該第二值之間的差異之量,藉此,當初始化該幫浦時,該後處理流體流經該第一通道與該第二通道。 In at least one form, a method of controlling fluid flow after passing through an apparatus, the apparatus having at least a first passage and a second passage, wherein the first passage is defined by a first value of one of the parameters, And the second channel is defined by a second value of one of the parameters, the method comprising the steps of: initializing a pump in fluid connection with a source of post-treatment fluid to initiate an operational cycle; supplying the post-treatment fluid to a first fluid circuit including a first valve, wherein the first fluid circuit is in fluid connection with the pump and the first passage; and the post-treatment fluid is supplied to a second fluid circuit including a second valve, Wherein the second fluid circuit is in fluid connection with the pump and the second channel, the method may further comprise the step of modulating the first valve to restrict flow of a post-treatment fluid through the first passage, wherein the post-treatment fluid The flow is limited by an amount based on a difference between the first value of the parameter and the second value of the parameter, whereby the post-treatment fluid is initialized when the pump is initialized Through the first channel and the second channel.

不應將以上討論視為對權利要求範圍的否定。 The above discussion should not be taken as a negation of the scope of the claims.

100‧‧‧後處理器 100‧‧‧post processor

101‧‧‧內視鏡 101‧‧‧Endoscope

102‧‧‧部分 Section 102‧‧‧

103‧‧‧部分 103‧‧‧Parts

104‧‧‧部分 104‧‧‧Parts

110‧‧‧洗槽 110‧‧‧washing tank

111‧‧‧底板 111‧‧‧floor

112‧‧‧噴嘴 112‧‧‧Nozzles

114‧‧‧端口 114‧‧‧Port

116‧‧‧排出口 116‧‧‧Export

120‧‧‧托架 120‧‧‧ bracket

130‧‧‧折疊門/蓋體 130‧‧‧Folding door/cover

140‧‧‧框架 140‧‧‧Frame

150‧‧‧控制面板 150‧‧‧Control panel

157‧‧‧流體反饋環路 157‧‧‧ fluid feedback loop

158‧‧‧比例閥 158‧‧‧Proportional valve

159‧‧‧錶壓感測器 159‧‧‧ gauge pressure sensor

160‧‧‧通道流動子系統/流體循環系統 160‧‧‧Channel Flow Subsystem/Fluid Circulation System

161‧‧‧入口 161‧‧‧ entrance

162‧‧‧幫浦 162‧‧‧

163‧‧‧出口 163‧‧ Export

164‧‧‧供應管線 164‧‧‧Supply pipeline

165‧‧‧第二入口 165‧‧‧ second entrance

166‧‧‧歧管 166‧‧‧Management

167‧‧‧閥 167‧‧‧ valve

168‧‧‧入口 168‧‧‧ entrance

170‧‧‧控制單元/控制單元組件 170‧‧‧Control unit/control unit components

171‧‧‧殼體 171‧‧‧Shell

172‧‧‧差壓感測器/壓力感測器 172‧‧‧Differential pressure sensor / pressure sensor

173a‧‧‧入口 173a‧‧‧ entrance

173b‧‧‧出口 173b‧‧‧Export

174‧‧‧比例閥 174‧‧‧ proportional valve

175‧‧‧流孔 175‧‧‧ orifice

176‧‧‧錶壓感測器 176‧‧‧ gauge pressure sensor

177‧‧‧電觸點 177‧‧‧Electrical contacts

178‧‧‧差壓感測器/壓力感測器 178‧‧‧Differential pressure sensor / pressure sensor

179‧‧‧PCB組件 179‧‧‧PCB components

180‧‧‧腔室 180‧‧‧ chamber

183‧‧‧出口 183‧‧‧Export

185‧‧‧通路 185‧‧‧ pathway

187‧‧‧電觸點 187‧‧‧Electrical contacts

190‧‧‧加壓空氣源 190‧‧‧ pressurized air source

191‧‧‧酒精供應 191‧‧‧Alcohol supply

192‧‧‧單向閥 192‧‧‧ check valve

200‧‧‧流體分配系統 200‧‧‧Fluid distribution system

200a‧‧‧流體分配子系統 200a‧‧‧Fluid distribution subsystem

200b‧‧‧流體分配子系統 200b‧‧‧Fluid distribution subsystem

201a‧‧‧消毒劑容器/流體來源 201a‧‧‧Disinfectant container/fluid source

201b‧‧‧消毒劑容器/流體來源 201b‧‧‧Disinfectant container/fluid source

210‧‧‧供應幫浦/分配幫浦/儲存器 210‧‧‧Supply pump/distribution pump/storage

211‧‧‧儲存器空腔/內部空腔/入口 211‧‧‧Storage cavity / internal cavity / entrance

212‧‧‧活塞 212‧‧‧Piston

213‧‧‧圓筒 213‧‧‧Cylinder

214‧‧‧出口 214‧‧‧Export

215‧‧‧閥提升器 215‧‧‧Valve lifter

220‧‧‧儲存器 220‧‧‧Storage

221‧‧‧空腔/腔室 221‧‧‧cavity/chamber

222‧‧‧底部部分 222‧‧‧ bottom part

223‧‧‧殼體 223‧‧‧Shell

224‧‧‧頂部部分 224‧‧‧ top part

225‧‧‧底部 225‧‧‧ bottom

226‧‧‧頂部 226‧‧‧ top

227‧‧‧溢流管線 227‧‧‧ overflow pipeline

228‧‧‧端口 228‧‧‧port

229‧‧‧O環 229‧‧‧O-ring

230‧‧‧分配幫浦 230‧‧‧Assignment of pumps

238‧‧‧端口 238‧‧‧port

240‧‧‧液位感測器 240‧‧‧ Liquid level sensor

241‧‧‧第一端 241‧‧‧ first end

242‧‧‧第二端 242‧‧‧ second end

250‧‧‧PCB組件 250‧‧‧PCB components

280a‧‧‧閥 280a‧‧‧Valve

280b‧‧‧閥 280b‧‧‧ valve

290a‧‧‧循環系統 290a‧‧ Circulatory system

290b‧‧‧循環系統 290b‧‧ Circulatory System

藉由參照以下對本發明實施例連同附圖的描述,本發明的特徵與優點以及實現該等特徵與優點的方式將會變得更加顯而易見,而且將可更好地瞭解本發明本身,其中:圖1為依據至少一個包含二個洗槽的實施例的內視鏡後處理器之立體圖;圖2為圖1之內視鏡後處理器的洗槽之立體圖;圖3為圖1之內視鏡後處理器的通道流動子系統之圖;圖3A為用以控制流經其間的流體壓力的通道流動子系統之圖;圖4為包括複數個流動控制單元的歧管組件之立體圖;圖5為圖4的歧管組件之歧管的立體圖;圖6為組態成控制通過內視鏡通道供應管線的流體流動之流動控制 單元的立體圖;圖7為圖6的流動控制單元之比例閥的立體圖;圖8為圖6的流動控制單元移去圖7的比例閥後之立體圖;圖9為圖6的控制單元之子組件的立體圖,該子組件包括印刷電路板(PCB)組件、錶壓感測器以及兩個差壓感測器;圖10為圖9的控制單元之差壓感測器的立體圖;圖11為圖9的控制單元之錶壓感測器的立體圖;圖12為流體輸送系統之立體圖;圖13為圖12的流體輸送系統之俯視圖;圖14為圖12的流體輸送系統之剖視圖;圖15為圖12的流體輸送系統之正視圖;圖16為圖12的流體輸送系統之示意圖;以及圖17圖示位於圖2的洗槽中之內視鏡托架內的內視鏡。 The features and advantages of the present invention, as well as the manner in which the features and advantages are realized, will become more apparent from the <RTIgt; 1 is a perspective view of an endoscope rear processor according to at least one embodiment including two washing tanks; FIG. 2 is a perspective view of the washing machine of the endoscope rear processor of FIG. 1; FIG. 3 is an endoscope of FIG. Figure 3A is a diagram of a channel flow subsystem for controlling the pressure of a fluid flowing therethrough; Figure 4 is a perspective view of a manifold assembly including a plurality of flow control units; Figure 3 is a perspective view of the manifold of the manifold assembly; Figure 6 is a flow control configured to control fluid flow through the endoscope channel supply line Figure 7 is a perspective view of the proportional valve of the flow control unit of Figure 6; Figure 8 is a perspective view of the flow control unit of Figure 6 after removing the proportional valve of Figure 7; Figure 9 is a subassembly of the control unit of Figure 6 Stereo view, the sub-assembly comprises a printed circuit board (PCB) component, a gauge pressure sensor and two differential pressure sensors; FIG. 10 is a perspective view of the differential pressure sensor of the control unit of FIG. 9; FIG. 11 is FIG. Figure 12 is a perspective view of the fluid delivery system; Figure 13 is a plan view of the fluid delivery system of Figure 12; Figure 14 is a cross-sectional view of the fluid delivery system of Figure 12; Figure 15 is Figure 12 A front view of the fluid delivery system; FIG. 16 is a schematic illustration of the fluid delivery system of FIG. 12; and FIG. 17 illustrates an endoscope positioned within the interior lens holder of the wash tank of FIG.

不同圖式中對於對應之部件係以相同之參考符號標示。本文中提出的例證說明了本發明在一種形式中的某些實施例,並且這樣的例證不應解釋為以任何方式限制本發明的範圍。 In the different figures, the corresponding components are denoted by the same reference symbols. The exemplifications set forth herein are illustrative of certain embodiments of the invention in one form and are not intended to limit the scope of the invention in any way.

現將敘述某些例示性實施例,以提供對本文所揭示之裝置及方法的結構、功能、製造與使用之原理的全面了解。這些實施例的一或多個實例係繪示在伴隨的圖式中。那些在本技術領域中具有通常知識者將瞭解到,本文中特別敘述並繪示於附圖中的裝置與方法為非限制的例示性實施例,而且本發明各種實施例的範圍獨由申請專利範圍界定。關於一例示性實施例所繪示或敘述的特徵結構可與其他實施例的特徵結構相結合。這類的改良及變異係打算包含在本發明的範圍內。 Some illustrative embodiments are now described to provide a thorough understanding of the principles of the structure, function, manufacture and use of the devices and methods disclosed herein. One or more examples of these embodiments are illustrated in the accompanying drawings. Those having ordinary skill in the art will appreciate that the devices and methods specifically recited and illustrated in the drawings are non-limiting exemplary embodiments, and that the scope of various embodiments of the present invention is solely claimed. Scope. Features illustrated or described with respect to an exemplary embodiment may be combined with features of other embodiments. Such modifications and variations are intended to be included within the scope of the invention.

本說明書各處提及之「各種實施例」、「一些實施例」、「一個實施例」或「一實施例」或類似者意指所描述關於該實施例之一特定特徵、結構或特性係包括於至少一實施例中。因此,在本說明書各處出現之說詞「在各種實施例中」、「在一些實施例中」、「在一個實施例中」或「在一實施例中」或類似者未必全部指稱同一個實施例。再者,在一或多個實施例中可以任何適用之方式組合該等特定特徵、結構 或特性。因此,關於一個實施例所示出或描述的特定特徵、結構或特性可全部或部分地與一或多個其他實施例的特徵結構或特性結合,沒有受限制。這類的改良及變異係打算包含在本發明的範圍內。 The various embodiments, "some embodiments", "one embodiment" or "an embodiment" or the like referred to throughout the specification are intended to describe a particular feature, structure, or characteristic of the embodiment. Included in at least one embodiment. Thus, appearances of the phrases "in the various embodiments", "in the embodiments", "in an embodiment" or "in an embodiment" or the like Example. Furthermore, the particular features, structures may be combined in any suitable manner in one or more embodiments. Or characteristics. Thus, the particular features, structures, or characteristics shown or described with respect to one embodiment may be combined in whole or in part with the features or characteristics of one or more other embodiments without limitation. Such modifications and variations are intended to be included within the scope of the invention.

本文中使用的用語「近側」及「遠側」係關於外科手術器具。用語「近側」係指最接近臨床醫生的部分,而用語「遠側」係指位於遠離臨床醫生的部分。將進一步理解到,關於圖示,為了方便和清楚,本文中可以使用空間用語如「垂直的」、「水平的」、「上方的」以及「下方的」。然而,在一些情況下,本文中揭示的裝置可被使用於許多方位和位置中,而且該等用語非意圖為限制性及/或絕對的。 The terms "proximal" and "distal" as used herein relate to surgical instruments. The term "proximal" refers to the portion closest to the clinician, and the term "distal" refers to the portion that is located away from the clinician. It will be further understood that with regard to the illustrations, spatial terms such as "vertical", "horizontal", "above" and "below" may be used herein for convenience and clarity. However, in some instances, the devices disclosed herein can be used in a number of orientations and positions, and such terms are not intended to be limiting and/or absolute.

如上所述,參照圖1,醫療器具後處理器,例如內視鏡後處理器100,可組態成清洗一或多個內視鏡。在某些實施例中,內視鏡後處理器可組態成殺菌及/或消毒內視鏡。在各種實施例中,內視鏡後處理器可包含至少一洗槽110,其中每個洗槽110內可組態成接收內視鏡。雖然內視鏡後處理器100包含例如二個洗槽,但可以設想各種包含任何適當數量的洗槽110之替代性實施例。在各種實施例中,後處理器100可進一步包括一或多個內部組態成支撐內視鏡的內視鏡托架120,可將內視鏡托架120放置於每個洗槽110中。在使用中,臨床醫生可將內視鏡放入內視鏡托架120,然後將內視鏡托架120放置於洗槽110內。或者,臨床醫生可將托架120放置於洗槽110中,然後將內視鏡放置於托架120中。在任一情況下,一旦內視鏡已被適當地放置於洗槽110內,則可將折疊門130關閉、關緊及/或緊閉於處理器框架140,以將內視鏡封入洗槽110內。之後,臨床醫生可以例如藉由以控制面板150為介面來操作內視鏡後處理器100。洗槽110、托架120以及折疊門130的例示性實施例係描述於同時提出申請的、共有的美國專利申請案中,其標題為器具後處理器、系統及方法(INSTRUMENT REPROCESSORS,SYSTEMS,AND METHODS),律師卷號第110515號,以引用方式將該申請案之全部揭示併入本文中。現在參照圖17,圖示內視鏡101係被放置於托架120內,托架120被放置於洗槽110中。在各種實施例中,內視鏡101可以包含可被支撐於托架120內的各種部分102、103及/或104。 As described above, referring to FIG. 1, a medical device post processor, such as endoscope post processor 100, can be configured to clean one or more endoscopes. In some embodiments, the endoscope post processor can be configured to sterilize and/or sterilize the endoscope. In various embodiments, the endoscope post processor can include at least one wash tank 110, wherein each wash tank 110 can be configured to receive an endoscope. Although the endoscope post processor 100 includes, for example, two wash tanks, various alternative embodiments including any suitable number of wash tanks 110 are contemplated. In various embodiments, the post-processor 100 can further include one or more endoscope brackets 120 that are internally configured to support an endoscope, and the endoscope bracket 120 can be placed in each of the wash basins 110. In use, the clinician can place the endoscope into the endoscope holder 120 and then place the endoscope holder 120 in the wash tank 110. Alternatively, the clinician can place the cradle 120 in the wash tank 110 and then place the endoscope in the cradle 120. In either case, once the endoscope has been properly placed in the wash tank 110, the folding door 130 can be closed, closed, and/or closed to the processor frame 140 to enclose the endoscope in the wash tank 110. . Thereafter, the clinician can operate the endoscope post processor 100, for example, by interfacing with the control panel 150. Illustrative embodiments of the wash tank 110, the cradle 120, and the folding door 130 are described in the co-pending U.S. Patent Application Serial No. U.S. Patent Application Serial No. The entire disclosure of this application is incorporated herein by reference. Referring now to Figure 17, the illustrated endoscope 101 is placed within a cradle 120 that is placed in the wash tank 110. In various embodiments, endoscope 101 can include various portions 102, 103, and/or 104 that can be supported within bracket 120.

在各種實施例中,對於上述進一步地,內視鏡後處理器 100可以包括循環系統,該循環系統可以循環一或多個後處理流體,例如清潔劑、消毒劑、殺菌劑、水、酒精及/或任何其他適當的流體通過內視鏡及/或噴灑該流體於內視鏡上。該循環系統可以包含流體供應及循環幫浦,其中該循環幫浦可以與該流體供應流體式連接,使得該流體可被從該流體供應抽出而進入該循環系統。在某些實施例中,該循環系統可以包括混合室,於該混合室中該流體可與另一流體(例如水)混合,其中該混合室可與該循環幫浦流體連接。在任一情況下,現在參照圖2,每個洗槽110可以包含一或多個噴嘴112,噴嘴112可與該循環幫浦流體連接,使得由該循環幫浦加壓的流體可被從該循環系統噴出而通過噴嘴112並到內視鏡上。在至少一個這樣的實施例中,每個洗槽110可以包括複數個位於其周邊附近的噴嘴112以及一或多個可以從洗槽底板111或後擋板向上噴灑的噴嘴112。某些例示性實施例更加詳細地描述於同時提出申請的、共有的美國專利申請案中,其標題為器具後處理器、系統及方法(INSTRUMENT REPROCESSORS,SYSTEMS,AND METHODS),律師卷號第110515號,以引用方式將該申請案之全部揭示併入本文中。 In various embodiments, for the above, the endoscope rear processor 100 can include a circulation system that can circulate one or more aftertreatment fluids, such as detergents, disinfectants, bactericides, water, alcohol, and/or any other suitable fluid through the endoscope and/or spray the fluid On the endoscope. The circulation system can include a fluid supply and a circulation pump, wherein the circulation pump can be fluidly coupled to the fluid supply such that the fluid can be withdrawn from the fluid supply into the circulation system. In certain embodiments, the circulation system can include a mixing chamber in which the fluid can be mixed with another fluid, such as water, wherein the mixing chamber can be fluidly coupled to the circulating pump. In either case, referring now to Figure 2, each wash tank 110 can include one or more nozzles 112 that can be fluidly coupled to the recycle pump such that fluid pressurized by the recycle pump can be from the cycle The system ejects through nozzle 112 and onto the endoscope. In at least one such embodiment, each wash tank 110 can include a plurality of nozzles 112 located adjacent the periphery thereof and one or more nozzles 112 that can be sprayed upwardly from the wash tank floor 111 or the tailgate. Certain exemplary embodiments are described in more detail in the co-pending, co-pending U.S. Patent Application Serial No. U.S. Patent Application Serial No. The entire disclosure of this application is incorporated herein by reference.

在各種實施例中,對於上述進一步地,每個洗槽110可組態成將其內噴灑的流體向下導引至位於其底部的排出口116,其中之後該流體可再次進入該循環系統。為了清洗、殺菌及/或消毒內視鏡內的內部通道,內視鏡後處理器100可以包括一或多個與該循環系統幫浦流體連接的供應管線,可將該供應管線置放成與該內視鏡的內部通道流體連接。在各種實施例中,再次參照圖2,每個洗槽110可以包括一或多個端口114,端口114可以包含供應管線的末端。在圖示的實施例中,每個洗槽110具有位於其相對側邊上的一排四個端口114,雖然亦可以設想各種包含任何適當數量與配置的端口114之其他替代性實施例。在某些實施例中,內視鏡後處理器110可以進一步包含一或多個可撓性導管,該導管可與端口114及內視鏡中界定的通道連接及/或密封地接合,使得來自該循環系統的加壓流體可以流經端口114、可撓性導管、然後進入內視鏡。可撓性導管及用以將可撓性導管與內視鏡密封接合的連接器係描述於2011年8月29日提出申請的美國專利申請案序號第12/998,459號、標題為用於內視鏡後處理系統之流體連接器(FLUID CONNECTOR FOR ENDOSCOPE REPROCESSING SYSTEM)以及亦於2011年8月29日提出申請的美國專利申請案序號第12/998,458號、標題為快速切斷的流體連接器(QUICK DISCONNECT FLUID CONNECTOR)中,以引用方式將該等申請案之全部揭示併入本文中。 In various embodiments, further to the above, each wash tank 110 can be configured to direct fluid sprayed therein down to a discharge port 116 at its bottom, after which the fluid can re-enter the circulatory system. To clean, sterilize, and/or sterilize internal passages within the endoscope, the endoscope post processor 100 can include one or more supply lines that are fluidly coupled to the circulation system pump, which can be placed in The internal passage of the endoscope is fluidly connected. In various embodiments, referring again to FIG. 2, each wash tank 110 can include one or more ports 114, and port 114 can include an end of a supply line. In the illustrated embodiment, each wash tank 110 has a row of four ports 114 on opposite sides thereof, although various alternative embodiments including any suitable number and configuration of ports 114 are also contemplated. In some embodiments, the endoscope post processor 110 can further include one or more flexible catheters that can be coupled and/or sealingly engaged with the ports defined in the port 114 and the endoscope such that The pressurized fluid of the circulatory system can flow through the port 114, the flexible catheter, and then into the endoscope. A flexible catheter and a connector for sealingly engaging a flexible catheter with an endoscope are described in U.S. Patent Application Serial No. 12/998,459, filed on Aug. 29, 2011, entitled Mirror post-processing system fluid connector (FLUID CONNECTOR FOR EN 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The entire disclosure of the application is incorporated herein.

在各種情況中,對於上述進一步地,界定於內視鏡內的通道會變得例如被碎片堵住或阻塞,該等碎片會造成內視鏡無法被適當地清洗、殺菌及/或消毒。在一些情況中,位於內視鏡通道內的碎片會至少部分地堵住通過其間的流體流動,從而降低該流體流經該通道的速率。本文中亦設想各種內視鏡後處理器的實施例,其中可以監測該流體通過內視鏡通道的流速,以評估該通道中是否存在阻塞。在這樣的實施例中,監測系統可以測量流體的實際流速並將其與已知壓力(其中該流體係經該循環幫浦加壓)下可預期的流體流速比較。某些監測系統也可以評估可撓性導管的連接器是否與例如內視鏡通道及/或洗槽端口114密封接合。在這樣的系統中,監測系統可以例如偵測流體的流速是否高於預期的流速。以引用方式將於2011年2月1日核准、標題為自動化內視鏡後處理器自殺菌連接(AUTOMATED ENDOSCOPE REPROCESSOR SELF-DISINFECTION CONNECTION)的美國專利第7,879,289號之全部揭示併入本文中。 In various circumstances, further to the above, the channels defined within the endoscope may become blocked or blocked, for example by debris, which may cause the endoscope to be improperly cleaned, sterilized and/or sterilized. In some cases, debris located within the endoscope channel will at least partially block fluid flow therethrough, thereby reducing the rate at which the fluid flows through the channel. Embodiments of various endoscope post-processors are also contemplated herein in which the flow rate of the fluid through the endoscope passage can be monitored to assess if there is a blockage in the passage. In such an embodiment, the monitoring system can measure the actual flow rate of the fluid and compare it to the expected fluid flow rate at a known pressure (where the flow system is pressurized by the circulation pump). Certain monitoring systems may also evaluate whether the connector of the flexible catheter is in sealing engagement with, for example, the endoscope channel and/or the sink port 114. In such systems, the monitoring system can, for example, detect if the flow rate of the fluid is higher than the expected flow rate. The entire disclosure of U.S. Pat.

現在參照圖3的圖,內視鏡後處理器可以包含通道流動子系統160,通道流動子系統160包括歧管166,歧管166與循環系統幫浦(指稱為幫浦162)流體連接,幫浦162可組態成分配加壓流體至內視鏡後處理器的通道供應管線然後到內視鏡的通道。內視鏡後處理器之這樣的通道供應管線係以供應管線164指示於圖3的圖中。在各種實施例中,每個內視鏡後處理器供應管線164可以包括至少一個差壓感測器172、至少一個比例閥174以及至少一個錶壓感測器176。在某些實施例中,現在參照圖6與圖9,每個後處理器通道供應管線164可以包括控制單元組件170,控制單元組件170包含殼體171、差壓感測器172、比例閥174以及錶壓感測器176。在至少一個這樣的實施例中,每個殼體171可以包括入口168及內部通路,該內部通路可組態成引導流體流動通過差壓感測器172的入口173a以及之後的出口173b。在差壓感測器172的 入口173a與出口173b之間可以界定具有固定直徑的流孔175(圖10)。在至少一個這樣的實施例中,流孔175的直徑可以沿著其長度為固定。這樣的流孔例如可以藉由鑽孔製程形成。在各種其他的實施例中,流孔175的直徑可以沿著其長度不為固定。在任一情況中,這樣的流孔可為不變的之意在於其不隨著時間改變或至少不實質地改變。如以下更詳細的描述,現在參照圖9與圖10,差壓感測器172可以進一步包含複數個電觸點177,電觸點177可使差壓感測器172與控制單元組件170的印刷電路板(PCB)組件179處於電通訊。電觸點177也可組態成供應電力給差壓感測器172。各種的差壓感測器可於市場上例如向Honeywell購得。 Referring now to the diagram of FIG. 3, the endoscope rear processor may include a channel flow subsystem 160 that includes a manifold 166 that is in fluid communication with a circulatory system pump (referred to as a pump 162). The Pu 162 can be configured to dispense pressurized fluid to the channel supply line of the endoscope rear processor and then to the endoscope mirror. Such a channel supply line for the endoscope rear processor is indicated by supply line 164 in the diagram of FIG. In various embodiments, each endoscope post processor supply line 164 can include at least one differential pressure sensor 172, at least one proportional valve 174, and at least one gauge sensor 176. In some embodiments, referring now to FIGS. 6 and 9, each of the post processor channel supply lines 164 can include a control unit assembly 170 that includes a housing 171, a differential pressure sensor 172, and a proportional valve 174. And gauge pressure sensor 176. In at least one such embodiment, each housing 171 can include an inlet 168 and an internal passage that can be configured to direct fluid flow through the inlet 173a of the differential pressure sensor 172 and the subsequent outlet 173b. At the differential pressure sensor 172 A flow hole 175 having a fixed diameter (Fig. 10) may be defined between the inlet 173a and the outlet 173b. In at least one such embodiment, the diameter of the orifice 175 can be fixed along its length. Such a flow hole can be formed, for example, by a drilling process. In various other embodiments, the diameter of the orifice 175 may not be fixed along its length. In either case, such a flow orifice may be constant in that it does not change over time or at least does not substantially change. As described in more detail below, referring now to FIGS. 9 and 10, the differential pressure sensor 172 can further include a plurality of electrical contacts 177 that enable printing of the differential pressure sensor 172 and the control unit assembly 170. Circuit board (PCB) assembly 179 is in electrical communication. Electrical contact 177 can also be configured to supply power to differential pressure sensor 172. Various differential pressure sensors are commercially available, for example, from Honeywell.

如以上之概述,差壓感測器172可與PCB組件179處於電性及/或訊號通訊。更具體地說,PCB組件179除了其他的之外還可以包括例如微處理器及/或任何適當的電腦,其中差壓感測器172可組態成產生傳遞到PCB組件179的微處理器的電壓位能。在至少一個這樣的實施例中,PCB組件179的微處理器可組態成解譯由差壓感測器172供應的電壓位能並計算流經差壓感測器172的流體之流速。 As outlined above, the differential pressure sensor 172 can be in electrical and/or signal communication with the PCB assembly 179. More specifically, PCB assembly 179 can include, for example, a microprocessor and/or any suitable computer, among others, wherein differential pressure sensor 172 can be configured to generate a microprocessor that is passed to PCB assembly 179. Voltage potential. In at least one such embodiment, the microprocessor of PCB assembly 179 can be configured to interpret the voltage potential energy supplied by differential pressure sensor 172 and calculate the flow rate of fluid flowing through differential pressure sensor 172.

在某些實施例中,對於上述進一步地,可將複數個流體流速值例如儲存於查詢表中,該查詢表係定義於PCB組件179上的可編程記憶體內。在各種實施例中,往往可以理論上地預測查詢表中的預期流體流速之值,然而在某些實施例中,可以憑經驗地測試該等值然後將該等值儲存於可編程記憶體中。在任一情況下,可將流體流速判定為正由循環幫浦162釋出並供應至歧管166的流體之錶壓的函數。在至少一個這樣的實施例中,可將錶壓感測器,例如錶壓感測器159(圖3)放置在循環幫浦162的出口下游,以度量供應至每個後處理器通道供應管線164的流體之錶壓。在這樣的實施例中,可將錶壓感測器159放置成與流動控制單元170的每個PCB組件179處於電性及/或訊號通訊,使得流體的錶壓可以電壓位能的形式傳達給每個PCB組件179的微處理器。在各種實施例中,一旦流體的錶壓已被傳達給PCB組件179,則微處理器可以從查詢表產生該流體的流體流速並將該流體流速值與目標流體流速比較。實際的流速往往不會確切地與目標流速相符,因此,介於最小目標值與最大目標值之間的實際流速值範圍是可接受的。 In some embodiments, for the above, a plurality of fluid flow rate values can be stored, for example, in a lookup table defined in a programmable memory on the PCB assembly 179. In various embodiments, the value of the expected fluid flow rate in the lookup table can often be theoretically predicted, however in some embodiments, the equivalent can be tested empirically and then stored in programmable memory. . In either case, the fluid flow rate can be determined as a function of the gauge pressure of the fluid being released by the circulation pump 162 and supplied to the manifold 166. In at least one such embodiment, a gauge pressure sensor, such as gauge pressure sensor 159 (FIG. 3), can be placed downstream of the outlet of the circulation pump 162 to measure the supply to each of the post processor channel supply lines. The gauge pressure of the fluid of 164. In such an embodiment, the gauge sensor 159 can be placed in electrical and/or signal communication with each of the PCB components 179 of the flow control unit 170 such that the gauge pressure of the fluid can be communicated to the voltage potential energy. A microprocessor for each PCB assembly 179. In various embodiments, once the gauge pressure of the fluid has been communicated to the PCB assembly 179, the microprocessor can generate a fluid flow rate for the fluid from the lookup table and compare the fluid flow rate value to the target fluid flow rate. The actual flow rate often does not exactly match the target flow rate, so the range of actual flow rate values between the minimum target value and the maximum target value is acceptable.

在各種實施例中,對於上述進一步地,可以將通過後處理器通道供應管線164的流體流速判定為二個變數的函數,即來自錶壓感測器159的錶壓讀值(如上所述)以及此外來自對應的流動控制單元170之差壓感測器172的壓差讀值。這樣的系統可使用複數個查詢表來導出流體的流速。舉例來說,對於每個可被供應至歧管166的流體之可能錶壓,例如每平方吋35磅(psi),可將關聯差壓感測器172的讀值與預期的流速之表儲存在每個PCB組件179內。在這樣的實施例中,可能需要考慮到大範圍的錶壓,因此可能需要大量的查詢表。在各種其他的實施例中,可將被供應至後處理器供應管線164的流體之壓力限制於特定的壓力或受限的壓力範圍。在至少一個這樣的實施例中,參照圖3A,器具後處理器100的流體循環系統可以包括壓力限制閥,例如比例閥158,比例閥158可與循環幫浦162的出口及流體反饋環路157處於流體連接。在至少一個這樣的實施例中,比例閥158可組態成使部分由幫浦162釋出的流體改向,並使改向的流體例如在位於幫浦162上游的入口回到循環系統,使得被供應至歧管166的流體之壓力係以恆壓或至少實質的恆壓提供,例如每平方吋35表讀磅(psig)。在至少一個這樣的實施例中,可以使用例如包括微處理器及/或任何適當電腦的PCB組件,該PCB組件係與錶壓感測器159及比例閥158處於電性及/或訊號通訊。在使用中,當流體的錶壓例如高於35 psig時,PCB組件可以命令比例閥158打開某量或額外的量,以允許流體或更多的流體流經流體反饋環路157。在這樣的情況中,這樣的動作可降低流到歧管166的流體之壓力。在流體的壓力仍大於35 psig的情況中,PCB組件可以命令比例閥158打開額外的量。可以重複這樣的步驟任意適當的次數,以達到需要的流體壓力。相應地,當流體的錶壓例如低於35 psig時,PCB組件可以命令比例閥158關閉某量,以降低流經流體反饋環路157的流體之速率。在這樣的情況中,這樣的動作可提高流到歧管166的流體之壓力。在流體壓力仍低於35 psig的情況下,PCB組件可以命令比例閥158關閉額外的量。可以重複這樣的步驟任意適當的次數,以達到需要的流體壓力。 In various embodiments, for the above, the fluid flow rate through the after-processor channel supply line 164 can be determined as a function of two variables, namely the gauge reading from the gauge sensor 159 (described above). And furthermore, a differential pressure reading from the differential pressure sensor 172 of the corresponding flow control unit 170. Such a system can use a plurality of lookup tables to derive the flow rate of the fluid. For example, for each possible gauge pressure of fluid that can be supplied to the manifold 166, such as 35 pounds per psi, the associated differential pressure sensor 172 can be stored in a table of expected flow rates. Within each PCB assembly 179. In such an embodiment, a wide range of gauge pressures may need to be considered, and thus a large number of lookup tables may be required. In various other embodiments, the pressure of the fluid supplied to the after-processor supply line 164 can be limited to a particular pressure or a limited pressure range. In at least one such embodiment, referring to FIG. 3A, the fluid circulation system of the appliance after-processor 100 can include a pressure limiting valve, such as a proportional valve 158, which can be coupled to the outlet of the circulation pump 162 and the fluid feedback loop 157. In fluid connection. In at least one such embodiment, the proportional valve 158 can be configured to redirect a portion of the fluid released by the pump 162 and return the redirected fluid to the circulatory system, for example, at an inlet upstream of the pump 162, such that The pressure of the fluid supplied to the manifold 166 is provided at a constant pressure or at least a substantially constant pressure, such as 35 psig per square inch. In at least one such embodiment, a PCB assembly can be used, for example, including a microprocessor and/or any suitable computer that is in electrical and/or signal communication with gauge pressure sensor 159 and proportional valve 158. In use, when the gauge pressure of the fluid is, for example, above 35 psig, the PCB assembly can command the proportional valve 158 to open a certain amount or additional amount to allow fluid or more fluid to flow through the fluid feedback loop 157. In such a case, such an action can reduce the pressure of the fluid flowing to the manifold 166. In the event that the pressure of the fluid is still greater than 35 psig, the PCB assembly can command the proportional valve 158 to open an additional amount. Such steps can be repeated any suitable number of times to achieve the desired fluid pressure. Accordingly, when the gauge pressure of the fluid is, for example, less than 35 psig, the PCB assembly can command the proportional valve 158 to close a certain amount to reduce the rate of fluid flowing through the fluid feedback loop 157. In such a case, such an action can increase the pressure of the fluid flowing to the manifold 166. With the fluid pressure still below 35 psig, the PCB assembly can command the proportional valve 158 to close an additional amount. Such steps can be repeated any suitable number of times to achieve the desired fluid pressure.

鑑於以上,在各種實施例中,可以控制供應至後處理器供應管線164的流動控制單元170之流體的錶壓,使得其可維持於恆壓 或至少實質上的恆壓。因此,可將用以計算流動經後處理器供應管線164的流體之流速的變數中之一者保持為常數或至少實質上的常數。因此,作為結果,通過每個後處理器供應管線164及其相關控制單元170的流體之流速可以僅為一個變數的函數,亦即來自差壓感測器172的讀值。在至少一個這樣的實施例中,可以只需要一個查詢表來計算實際的、經計算的流速及/或將實際的、經計算的流速與目標流速關聯,以測定該實際的、經計算的流速是否介於通過後處理器供應管線164的流體流速之最小與最大可接受值之間。 In view of the above, in various embodiments, the gauge pressure of the fluid supplied to the flow control unit 170 of the post-processor supply line 164 can be controlled such that it can be maintained at a constant pressure Or at least substantially constant pressure. Thus, one of the variables used to calculate the flow rate of the fluid flowing through the post-processor supply line 164 can be maintained as a constant or at least a substantial constant. Thus, as a result, the flow rate of fluid through each of the post-processor supply lines 164 and its associated control unit 170 can be a function of only one variable, i.e., from the differential pressure sensor 172. In at least one such embodiment, only one lookup table may be needed to calculate the actual, calculated flow rate and/or correlate the actual, calculated flow rate to the target flow rate to determine the actual, calculated flow rate. Whether it is between the minimum and maximum acceptable values of the fluid flow rate through the after-processor supply line 164.

在實際流體流速介於給定的內視鏡通道之最小與最大可接受值之間的情況下,如由後處理器供應管線164向其供應,相應的流動控制單元170之PCB組件179可不調整比例閥174,取而代之,可持續監測流經流動控制單元170的流體之流速。在通過後處理器供應管線164的實際流體流速低於最小可接受值或高於最大可接受值之情況下(該等可接受值係儲存於用於給定的後處理器供應管線164之給定錶壓的查詢表中),PCB組件179可以打開、部分打開、關閉及/或部分關閉與其關聯的比例閥174。在至少一個實施例中,參照圖6至圖8,比例閥174可以包含流孔或腔室180、位於腔室180內的閥元件以及螺線管,可以啟動該螺線管來將腔室180內的該元件於開啟位置、關閉位置及/或任何其他介於這兩者間的適當位置之間轉動,其中在該開啟位置流體可流經腔室,在該關閉位置該元件阻礙通過其間的流體之流動。 Where the actual fluid flow rate is between the minimum and maximum acceptable values for a given endoscope channel, as supplied by the post processor supply line 164, the PCB assembly 179 of the corresponding flow control unit 170 may not be adjusted. Proportional valve 174, in turn, continuously monitors the flow rate of fluid flowing through flow control unit 170. Where the actual fluid flow rate through the after-processor supply line 164 is below a minimum acceptable value or above a maximum acceptable value (the acceptable values are stored for a given post-processor supply line 164) In the look-up table of the gauge pressure, the PCB assembly 179 can open, partially open, close, and/or partially close the proportional valve 174 associated therewith. In at least one embodiment, referring to FIGS. 6-8, the proportional valve 174 can include a flow orifice or chamber 180, a valve element located within the chamber 180, and a solenoid that can be activated to move the chamber 180 The inner member rotates between an open position, a closed position, and/or any other suitable position therebetween, wherein fluid can flow through the chamber in the open position, in which the member blocks passage therethrough The flow of fluid.

在各種實施例中,對於上述進一步地,PCB組件179的微處理器可組態成調整在比例閥174的閥腔室180內的閥元件之位置。在使用中,假使通過後處理器供應管線164的實際流體流速比目標流體流速更高,則比例閥174的螺線管可以將閥元件往其關閉位置移動,以進一步限制通過其間的流體之流動。同樣地,假使通過後處理器供應管線164的實際流體流速比目標流體流速更低,則比例閥174的螺線管可以將閥元件往其開啟位置移動,以減低對通過其中的流體流動之限制。在各種實施例中,可以例如將閥元件從開啟位置轉到第一位置以對閥流孔限制第一量(例如約為25%)、轉到第二位置以對閥流孔限制第二量(例如約為50%)、轉到第三位置以對閥流孔限制第三量(例如約為75%) 以及轉到關閉位置(其中閥流孔約受100%限制)。在各種實施例中,可將比例閥174的閥元件置於任何適當適量的位置,以對通過閥174的流體流動提供需要的限制。在任何情況中,可藉由PCB組件179施加至閥螺線管的電壓位能來控制閥元件的位置,其中,當與施加較高電壓位能至閥螺線管而使閥元件定位在例如較接近其全開位置的位置中相比時,施加至閥螺線管的較低電壓位能會造成閥元件定位在例如較接近其全關位置的位置中。 In various embodiments, for the above, the microprocessor of PCB assembly 179 can be configured to adjust the position of the valve element within valve chamber 180 of proportional valve 174. In use, if the actual fluid flow rate through the after-processor supply line 164 is higher than the target fluid flow rate, the solenoid of the proportional valve 174 can move the valve member to its closed position to further limit the flow of fluid therethrough. . Likewise, if the actual fluid flow rate through the after-processor supply line 164 is lower than the target fluid flow rate, the solenoid of the proportional valve 174 can move the valve member to its open position to reduce the restriction on fluid flow therethrough. . In various embodiments, for example, the valve member can be rotated from the open position to the first position to limit the valve orifice to a first amount (eg, approximately 25%), to the second position to limit the valve orifice to a second amount (eg, approximately 50%), to the third position to limit the valve orifice to a third amount (eg, approximately 75%) And to the closed position (where the valve orifice is approximately 100% limited). In various embodiments, the valve member of the proportional valve 174 can be placed in any suitable suitable amount to provide the required restrictions on fluid flow through the valve 174. In any case, the position of the valve element can be controlled by the voltage potential applied to the valve solenoid by the PCB assembly 179, wherein the valve element is positioned, for example, when a higher voltage level is applied to the valve solenoid. The lower voltage level applied to the valve solenoid can cause the valve element to be positioned, for example, in a position closer to its fully closed position when compared to a position closer to its fully open position.

在各種情況中,由於上述之結果,PCB組件179可組態成連續地監測流經後處理器供應管線164的流體流速,並調整比例閥174以增加及/或減少流經後處理器供應管線164以及相應地與其流體式耦接的內視鏡通道的流體之速度。在各種實施例中,對於上述進一步地,PCB組件179可組態成將流體的流速保持於及/或接近所需流速。在被循環流體為例如消毒劑或包括消毒劑的溶液之實施例中,該消毒劑可以消毒內視鏡;然而,該消毒劑也可能會負面地影響內視鏡或使內視鏡退化。因此,鑑於以上,通道流動子系統160可組態成供應足夠的最小消毒劑流動至內視鏡,以消毒內視鏡同時限制消毒劑的最大流動至內視鏡,使得消毒劑不會使內視鏡過度退化。類似地,鑑於以上,通道流動子系統160可組態成供應足夠的最小殺菌劑流動至內視鏡,以殺菌內視鏡同時限制殺菌劑的最大流動至內視鏡,使得殺菌劑不會使內視鏡過度退化。在各種實施例中,每個內視鏡通道供應管線可以進一步包括第二差壓感測器,例如差壓感測器178,差壓感測器178亦可偵測通過後處理器供應管線164的流體之流速。在至少一個這樣的實施例中,可將控制單元組件170的第一差壓感測器172與第二差壓感測器178放置為互相平行,其中,在壓力感測器172與178供應明顯不同的電壓讀值至PCB組件179的情況下,PCB組件179可以執行例行校正動作,該例行校正動作可例如包括關閉比例閥174並/或對操作員發出控制單元組件170可能需要維修的警報或警告。 In various circumstances, due to the above results, the PCB assembly 179 can be configured to continuously monitor the fluid flow rate through the post-processor supply line 164 and adjust the proportional valve 174 to increase and/or decrease flow through the post-processor supply line. 164 and the velocity of the fluid of the endoscope channel that is fluidly coupled thereto. In various embodiments, for the above, the PCB assembly 179 can be configured to maintain the flow rate of the fluid at and/or near the desired flow rate. In embodiments where the fluid being circulated is, for example, a disinfectant or a solution comprising a disinfectant, the disinfectant can sterilize the endoscope; however, the disinfectant can also negatively affect or degrade the endoscope. Thus, in view of the above, the channel flow subsystem 160 can be configured to supply sufficient minimum disinfectant flow to the endoscope to disinfect the endoscope while limiting the maximum flow of disinfectant to the endoscope so that the disinfectant does not The mirror is excessively degraded. Similarly, in view of the above, the channel flow subsystem 160 can be configured to supply sufficient minimum sterilant flow to the endoscope to sterilize the endoscope while limiting the maximum flow of sterilant to the endoscope so that the sterilant does not The endoscope is excessively degraded. In various embodiments, each of the endoscope channel supply lines may further include a second differential pressure sensor, such as a differential pressure sensor 178, which may also be detected by the post processor supply line 164. The flow rate of the fluid. In at least one such embodiment, the first differential pressure sensor 172 and the second differential pressure sensor 178 of the control unit assembly 170 can be placed in parallel with each other, wherein the pressure sensors 172 and 178 supply significantly Where different voltages are read to the PCB assembly 179, the PCB assembly 179 can perform routine corrective actions that can include, for example, closing the proportional valve 174 and/or issuing an indication to the operator that the control unit assembly 170 may require servicing. Alert or warning.

如以上概述的,每個比例閥174可組態成控制可變流孔的狀態。在至少一個這樣的實施例中,每個比例閥174可以包含偏置元件,例如彈簧,該偏置元件可組態成將以上討論的比例閥174之閥元件 偏置成為正常關閉狀態。亦如以上討論的,可致動比例閥174的螺線管來使閥元件移動到至少部分開啟的位置。在至少一個實施例中,可以從對應的PCB組件179施加一系列的電壓脈衝至螺線管,該等電壓脈衝可以控制閥元件開啟的程度或量。在至少一個這樣的實施例中,施加至螺線管的電壓脈衝頻率愈高,則可變流孔愈大,從而允許較大的流體流速通過。相應地,施加至螺線管的電壓脈衝頻率愈低,則可變流孔愈小,從而允許較小的流體流速通過。假使不再對比例閥174的螺線管施加電壓脈衝,則偏置元件可再次移動閥元件成為關閉狀態。亦設想其他各種實施例,其中閥元件被偏置成為正常開啟的狀態,而比例閥的螺線管可以作用來偏置閥元件成為至少部分關閉的狀態。在各種其他的實施例中,用以控制流孔的閥可組態成在全開位置與全關位置之間循環閥元件,並藉由控制閥元件關閉的時間相較於閥元件開啟的時間來控制流經其間的流體速度。在至少一個這樣的實施例中,閥元件可以例如藉由螺線管快速地在其開啟與關閉狀態之間循環。 As outlined above, each proportional valve 174 can be configured to control the state of the variable orifice. In at least one such embodiment, each proportional valve 174 can include a biasing element, such as a spring, which can be configured to valve elements of the proportional valve 174 discussed above. The offset becomes a normal off state. As also discussed above, the solenoid of the proportional valve 174 can be actuated to move the valve member to an at least partially open position. In at least one embodiment, a series of voltage pulses can be applied from the corresponding PCB assembly 179 to the solenoids, which can control the extent or amount of opening of the valve elements. In at least one such embodiment, the higher the frequency of the voltage pulse applied to the solenoid, the larger the variable orifice, allowing for a larger fluid flow rate to pass. Accordingly, the lower the frequency of the voltage pulse applied to the solenoid, the smaller the variable orifice, allowing for a smaller fluid flow rate to pass. If the voltage pulse is no longer applied to the solenoid of the proportional valve 174, the biasing element can again move the valve element to the closed state. Other various embodiments are also contemplated in which the valve member is biased into a normally open state, and the solenoid of the proportional valve can act to bias the valve member into an at least partially closed state. In various other embodiments, the valve for controlling the flow orifice can be configured to circulate the valve member between the fully open position and the fully closed position, and by controlling the valve member to close for a time relative to the opening time of the valve member. Control the velocity of the fluid flowing therethrough. In at least one such embodiment, the valve element can be cycled between its open and closed states, for example, by a solenoid.

對於上述進一步地,每個後處理器供應管線164可以包括控制單元組件170,其中該控制單元組件170可組態成彼此獨立地控制通過後處理器供應管線164的流體之流動。在各種實施例中,該等控制單元組件170可不彼此處於電性及/或訊號通訊。在這樣的實施例中,每個控制單元組件170組態成監控與調整流經後處理器供應管線164的流體之流速,而不與其他的控制單元組件170通訊。在各種其他的實施例中,然而,該等控制單元組件170可彼此處於電性及/或訊號通訊,使得後處理器供應管線164內的流體之某些參數可例如互相相比較。在任一情況下,可編程控制單元170的PCB組件179來在離開控制單元170的錶壓超過預定的最大壓力(例如約21.75 psig)之情況下完全開啟其比例閥174。在各種實施例中,上述的控制單元組件170之錶壓感測器176可組態成一來偵測離開後處理器供應管線164的比例閥174之流體錶壓,以及二來傳達電壓位能至其個別的PCB組件179,PCB組件179可將電壓位能解譯為錶壓。與可偵測介於流體供應管線中的兩個點之間的流體中的壓降之差壓感測器172與178相比,錶壓感測器176可以偵測流體的實際壓力或錶壓。在各種實施例中,參照圖9與圖11,錶壓感測器176 可以包含通路185,通路185可組態成引導流體的流動通過感測元件並到達流動控制單元170的出口183。與以上類似,每個錶壓感測器176可以包含複數個電觸點187,該複數個電觸點187可以使錶壓感測器176與對應的PCB組件179處於電性及/或訊號通訊。 Further to the above, each of the post-processor supply lines 164 can include a control unit assembly 170 that can be configured to control the flow of fluid through the post-processor supply line 164 independently of each other. In various embodiments, the control unit components 170 may not be in electrical and/or signal communication with each other. In such an embodiment, each control unit assembly 170 is configured to monitor and adjust the flow rate of fluid flowing through the post-processor supply line 164 without communicating with other control unit assemblies 170. In various other embodiments, however, the control unit assemblies 170 can be in electrical and/or signal communication with one another such that certain parameters of the fluid within the post-processor supply line 164 can be compared, for example, to one another. In either case, the PCB assembly 179 of the programmable control unit 170 fully opens its proportional valve 174 when the gauge pressure exiting the control unit 170 exceeds a predetermined maximum pressure (eg, approximately 21.75 psig). In various embodiments, the gauge pressure sensor 176 of the control unit assembly 170 described above can be configured to detect the fluid gauge pressure of the proportional valve 174 exiting the post processor supply line 164, and to communicate the voltage level to Its individual PCB assembly 179, PCB assembly 179 can interpret voltage potential as gauge pressure. The gauge sensor 176 can detect the actual pressure or gauge pressure of the fluid as compared to the differential pressure sensors 172 and 178 that can detect the pressure drop in the fluid between the two points in the fluid supply line. . In various embodiments, referring to Figures 9 and 11, gauge pressure sensor 176 A passage 185 can be included that can be configured to direct the flow of fluid through the sensing element and to the outlet 183 of the flow control unit 170. Similar to the above, each gauge sensor 176 can include a plurality of electrical contacts 187 that can cause the gauge sensor 176 to be in electrical and/or signal communication with the corresponding PCB assembly 179. .

對於上述進一步地,流體循環系統160的歧管166可組態成將流經其中的流體分配至八個內視鏡後處理器供應管線164及與其相關聯的內視鏡通道。現在參照圖5,歧管166可以包括入口161、八個出口163以及位於歧管166的對側上之第二入口165。在各種實施例中,歧管166可組態成在內視鏡後處理器100的整個操作期間接收及分配幾種不同的流體。再次參照圖3,歧管166的入口161可組態成接收溶液流動,該溶液除了其他東西之外還包含來自幫浦162的水與清潔劑。在各種實施例中,可以操作一或多個閥來使幫浦162處於與水源流體連接,使得幫浦162可以將水抽進供應管線164。在某些實施例中,可以操作一或多個閥來使幫浦162處於與消毒劑來源或消毒劑溶液流體連接,使得幫浦162可以將消毒劑抽進供應管線164。在最後一個實施例中,再次參照圖5,內視鏡後處理器100可以包含一或多個閥,例如閥167,可以操作閥167來允許加壓空氣從加壓空氣源190流進例如歧管166。在至少一個這樣的實施例中,加壓空氣可以迫使任何殘餘的水、清潔劑及/或消毒劑離開內視鏡通道。在某些實施例中,內視鏡後處理器100可以進一步包含酒精供應191及幫浦,該幫浦可組態成從酒精供應191抽出酒精並將該酒精經由例如第二入口165導入歧管166。在至少一個這樣的實施例中,可將單向閥192放置於這樣的幫浦與第二入口165中間,使得來自歧管166的其他流體無法流入酒精供應191。 Further to the above, the manifold 166 of the fluid circulation system 160 can be configured to distribute fluid flowing therethrough to the eight endoscope post processor supply lines 164 and the associated endoscope channels. Referring now to FIG. 5, the manifold 166 can include an inlet 161, eight outlets 163, and a second inlet 165 on the opposite side of the manifold 166. In various embodiments, the manifold 166 can be configured to receive and dispense several different fluids throughout the operation of the endoscope processor 100. Referring again to FIG. 3, the inlet 161 of the manifold 166 can be configured to receive a solution flow that contains, among other things, water and detergent from the pump 162. In various embodiments, one or more valves may be operated to fluidly connect the pump 162 to the water source such that the pump 162 can draw water into the supply line 164. In certain embodiments, one or more valves may be operated to cause the pump 162 to be in fluid connection with a disinfectant source or disinfectant solution such that the pump 162 can draw disinfectant into the supply line 164. In the last embodiment, referring again to FIG. 5, the endoscope post processor 100 can include one or more valves, such as valve 167, which can be operated to allow pressurized air to flow from the pressurized air source 190, such as Tube 166. In at least one such embodiment, pressurized air can force any residual water, detergent, and/or disinfectant to exit the endoscope passage. In some embodiments, the endoscope post processor 100 can further include an alcohol supply 191 and a pump configurable to draw alcohol from the alcohol supply 191 and direct the alcohol to the manifold via, for example, the second inlet 165. 166. In at least one such embodiment, the one-way valve 192 can be placed intermediate such a pump and second inlet 165 such that other fluid from the manifold 166 cannot flow into the alcohol supply 191.

鑑於以上,器具後處理器可組態成供應一或多個加壓流體至器具的通道,該器具例如內視鏡。在各種實施例中,可以監控供應給內視鏡通道的流體之流速。在供應給內視鏡通道的流體之流速低於目標流速或最小可接受流速之情況下,器具後處理器可以提高流經其間的流體之流速。在供應給內視鏡通道的流體之流速高於目標流速或最大可接受流速之情況下,器具後處理器可以減低流經其間的流體之流速。在某些實施例中,器具後處理器可以包括複數個供應流體給內視鏡通道的 供應管線,其中每個供應管線可以包括可變閥流孔,可以調變該可變閥流孔來調整通過其間的流體之流速。在各種實施例中,每個供應管線的可變閥流孔可以是閉合回路配置的一部分,該閉合回路配置包括組態成感測流體的流速之固定流孔壓差感測器。在各種實施例中,可將該壓差感測器放置於該可變閥流孔上游及循環幫浦下游。在至少一個實施例中,該器具後處理器可以進一步包括用以感測離開循環幫浦的流體錶壓之錶壓感測器以及組態成相對於目標壓力調變流體壓力之壓力控制系統。在至少一個這樣的實施例中,可將該差壓感測器放置於該錶壓感測器與該壓力控制系統下游。 In view of the above, the appliance post processor can be configured to supply one or more pressurized fluids to the passage of the appliance, such as an endoscope. In various embodiments, the flow rate of fluid supplied to the endoscope channel can be monitored. The appliance post processor can increase the flow rate of the fluid flowing therethrough if the flow rate of the fluid supplied to the endoscope passage is below the target flow rate or the minimum acceptable flow rate. The appliance post processor can reduce the flow rate of the fluid flowing therethrough if the flow rate of the fluid supplied to the endoscope passage is higher than the target flow rate or the maximum acceptable flow rate. In some embodiments, the appliance post processor may include a plurality of supply fluids to the endoscope channel Supply lines, wherein each supply line may include a variable valve orifice that can be modulated to adjust the flow rate of fluid therethrough. In various embodiments, the variable valve orifice of each supply line may be part of a closed loop configuration that includes a fixed orifice differential pressure sensor configured to sense the flow rate of the fluid. In various embodiments, the differential pressure sensor can be placed upstream of the variable valve orifice and downstream of the recycle pump. In at least one embodiment, the appliance after processor can further include a gauge pressure sensor to sense fluid gauge pressure exiting the circulation pump and a pressure control system configured to modulate fluid pressure relative to the target pressure. In at least one such embodiment, the differential pressure sensor can be placed downstream of the gauge pressure sensor and the pressure control system.

如上所述,內視鏡後處理器100的流體循環系統可組態成循環流體通過內視鏡及/或噴灑該流體至內視鏡外表面上。在各種實施例中,現在參照圖8,內視鏡後處理器100可以包含流體分配系統200,流體分配系統200可組態成分配一或多種流體至流體循環系統。在各種實施例中,現在參照圖12至圖16,流體分配系統200可以包含二個或更多分開的流體分配子系統,例如流體分配子系統200a與200b,每個流體分配子系統例如組態成分配不同的流體至流體循環系統。在各種實施例中,現在參照圖16,內視鏡後處理器100可以包括儲存區,該儲存區中可組態成容納一或多個流體容器,例如消毒劑容器201a及/或清潔劑容器201b,其中內視鏡後處理器100可以進一步包括一或多個流體連接器,每個流體連接器可與該流體容器之一者密封接合。在某些實施例中,內視鏡後處理器100可以進一步包含RFID讀數器及/或條碼讀數器,其可組態成讀取流體容器上的RFID標籤及/或條碼,以確保一來使用了正確的流體,以及二來例如在某到期日期之前使用流體。在任何情況中,一旦流體連接器已與流體容器耦接,則流體分配系統200可組態成從流體容器抽出流體並將其分配於循環系統中,如以下更為進一步的詳細說明中所述。 As noted above, the fluid circulation system of the endoscope post processor 100 can be configured to circulate fluid through the endoscope and/or spray the fluid onto the outer surface of the endoscope. In various embodiments, referring now to FIG. 8, endoscope post-processor 100 can include a fluid dispensing system 200 that can be configured to dispense one or more fluids to a fluid circulation system. In various embodiments, referring now to Figures 12-16, fluid dispensing system 200 can include two or more separate fluid dispensing subsystems, such as fluid dispensing subsystems 200a and 200b, each fluid dispensing subsystem such as a configuration Distribute different fluids to the fluid circulation system. In various embodiments, referring now to Figure 16, the endoscope post-processor 100 can include a storage area configurable to receive one or more fluid containers, such as a sterilant container 201a and/or a detergent container. 201b, wherein the endoscope post processor 100 can further include one or more fluid connectors, each fluid connector being sealingly engageable with one of the fluid containers. In some embodiments, the endoscope post processor 100 can further include an RFID reader and/or a barcode reader configurable to read the RFID tag and/or barcode on the fluid container to ensure that it is used The correct fluid, and second, for example, to use the fluid before an expiration date. In any event, once the fluid connector has been coupled to the fluid container, the fluid dispensing system 200 can be configured to draw fluid from the fluid container and dispense it into the circulatory system, as described in further detailed description below. .

在各種實施例中,對於上述進一步地,流體子系統200a可以包括供應幫浦210、儲存器220以及分配幫浦230。在某些實施例中,供應幫浦210可以包括入口211,入口211與流體容器及/或任何其他適當的流體來源流體連接。在至少一個實施例中,供應幫浦210可以包含 正排量幫浦,在至少一個這樣的實施例中,該正排量幫浦可以包含活塞,該活塞組態成在活塞每抽一次即推動固定量的體積、或流體。更具體地說,主要參照圖14,供應幫浦210可以包含活塞212,活塞212可組態成在圓筒213內於第一位置(或下死點(BDC)位置)與第二位置(或上死點(TDC)位置)之間移動或往復運動,以將流體引入圓筒213並推動流體通過圓筒出口214。在某些實施例中,供應幫浦210可以進一步包含閥提升器215,活塞212可接觸閥提升器215以當活塞212到達其TDC位置時開啟閥元件並且容許流體經由幫浦出口214離開。當活塞212回到其BDC位置時,例如位於閥提升器215後方的閥彈簧可組態成使閥元件與閥提升器215回復到固定的位置,其中出口214密封關閉直到閥元件與閥提升器215在活塞212的下一次抽動中再次被活塞212提升。如以下更詳細的描述,供應幫浦210的出口214可與儲存器220流體連接,使得經供應幫浦210加壓的流體可被釋放進入儲存器220中界定的內部空腔221。 In various embodiments, for the above, the fluid subsystem 200a can include a supply pump 210, a reservoir 220, and a distribution pump 230. In certain embodiments, the supply pump 210 can include an inlet 211 that is fluidly coupled to a fluid container and/or any other suitable fluid source. In at least one embodiment, the supply pump 210 can include A positive displacement pump, in at least one such embodiment, the positive displacement pump can include a piston configured to push a fixed amount of volume, or fluid, each time the piston is pumped. More specifically, referring primarily to FIG. 14, supply pump 210 can include a piston 212 that can be configured to be within a first position (or bottom dead center (BDC) position) and a second position within cylinder 213 (or Moving or reciprocating between top dead center (TDC) positions to introduce fluid into the cylinder 213 and push fluid through the cylinder outlet 214. In certain embodiments, the supply pump 210 can further include a valve lifter 215 that can contact the valve lifter 215 to open the valve element and allow fluid to exit via the pump outlet 214 when the piston 212 reaches its TDC position. When the piston 212 returns to its BDC position, for example, a valve spring located behind the valve lifter 215 can be configured to return the valve element and valve lifter 215 to a fixed position, with the outlet 214 sealing closed until the valve element and valve lifter 215 is again lifted by piston 212 during the next draw of piston 212. As described in more detail below, the outlet 214 of the supply pump 210 can be fluidly coupled to the reservoir 220 such that fluid pressurized by the supply pump 210 can be released into the interior cavity 221 defined in the reservoir 220.

在各種實施例中,儲存器220可以包括底部部分222、殼體223以及頂部部分224,其中,在至少一個實施例中,供應幫浦210的出口214可以例如經由底部部分222的端口228與儲存器220的內部空腔221流體連接。在其他各種實施例中,供應幫浦210可以經由例如殼體223中的端口及/或頂部部分224與儲存器空腔211流體連接。在任何情況中,底部部分222與頂部部分224可以與殼體223密封接合,其中,在至少一個實施例中,底部部分222與頂部部分224可組態成例如以卡扣及/或壓接配置的方式接合殼體223。在各種實施例中,底部部分222與頂部部分224可例如由塑料組成,該塑料不會被儲存器220內容納的流體降解。在某些實施例中,儲存器220可以進一步包括可位於底部部分222與殼體223中間的封圈(例如O環229)以及位於殼體223與頂部部分224中間的封圈(例如O環229),該等封圈可防止流體漏出儲存器220。在各種實施例中,殼體223可由任何適當的材料構成,例如玻璃。在至少一個實施例中,殼體223可例如由硼矽酸鹽構成,硼矽酸鹽不會被儲存器220內容納的流體降解。 In various embodiments, the reservoir 220 can include a bottom portion 222, a housing 223, and a top portion 224, wherein, in at least one embodiment, the outlet 214 of the supply pump 210 can be stored, for example, via the port 228 of the bottom portion 222. The internal cavity 221 of the vessel 220 is fluidly connected. In other various embodiments, the supply pump 210 can be fluidly coupled to the reservoir cavity 211 via, for example, a port and/or a top portion 224 in the housing 223. In any event, the bottom portion 222 and the top portion 224 can be in sealing engagement with the housing 223, wherein, in at least one embodiment, the bottom portion 222 and the top portion 224 can be configured, for example, in a snap and/or crimp configuration The manner of engaging the housing 223. In various embodiments, the bottom portion 222 and the top portion 224 can be comprised, for example, of plastic that is not degraded by the fluid contained within the reservoir 220. In some embodiments, the reservoir 220 can further include a seal (eg, an O-ring 229) that can be intermediate the bottom portion 222 and the housing 223 and a seal (eg, an O-ring 229 intermediate the housing 223 and the top portion 224) The seals prevent fluid from leaking out of the reservoir 220. In various embodiments, the housing 223 can be constructed of any suitable material, such as glass. In at least one embodiment, the housing 223 can be constructed, for example, from borosilicate, which is not degraded by the fluid contained within the reservoir 220.

如以上所討論,供應幫浦210可組態成在供應幫浦活塞 212的每個抽動下供應固定量的流體至內部儲存器空腔221。在使用中,可以操作供應幫浦210適當的次數或循環數,以填充內部空腔221及/或填充內部空腔221至內部空腔221內的預定程度或高度以上。在某些實施例中,儲存器220可以包括溢流管線227,溢流管線227可組態成在儲存器220裝到滿溢的情況下,例如將流體排放回到流體來源。在各種實施例中,再次參照圖14,內部空腔221可以具有底部225、頂部226以及底部225與頂部226之間界定的高度。在至少一個這樣的實施例中,內部空腔221可以是圓柱型的,而且可以沿著其高度具有固定的周長,而在其他的實施例中,內部空腔221可以具有任何適當的架構。在各種實施例中,因為上述的關係,供應幫浦210的每個循環可以使內部儲存器空腔221內的流體高度提升某量或固定量。在至少一個實施例中,可以藉由操作供應幫浦210與例如已操作分配幫浦230相同的抽數來維持儲存器220中的流體量。在某些實施例中,儲存器210可以包含感測器,例如液位感測器240,液位感測器240可組態成偵測儲存器空腔221內的流體高度及/或儲存器空腔221內的流體高度之改變,如以下更詳細的描述。 As discussed above, the supply pump 210 can be configured to supply a pump piston A fixed amount of fluid is supplied to the internal reservoir cavity 221 for each twitch of 212. In use, the supply pump 210 can be operated a suitable number of cycles or cycles to fill the interior cavity 221 and/or fill the interior cavity 221 to a predetermined extent or height within the interior cavity 221. In certain embodiments, the reservoir 220 can include an overflow line 227 that can be configured to discharge the fluid back to the fluid source if the reservoir 220 is loaded to overflow. In various embodiments, referring again to FIG. 14, the interior cavity 221 can have a bottom 225, a top 226, and a height defined between the bottom 225 and the top 226. In at least one such embodiment, the inner cavity 221 can be cylindrical and can have a fixed circumference along its height, while in other embodiments, the inner cavity 221 can have any suitable architecture. In various embodiments, because of the above relationship, each cycle of the supply pump 210 can raise the fluid level within the internal reservoir cavity 221 by a certain amount or a fixed amount. In at least one embodiment, the amount of fluid in the reservoir 220 can be maintained by operating the supply pump 210 to the same number of draws as, for example, the dispensed pump 230. In some embodiments, the reservoir 210 can include a sensor, such as a level sensor 240, which can be configured to detect fluid height and/or reservoir within the reservoir cavity 221. The change in fluid height within cavity 221 is as described in more detail below.

在各種實施例中,對於上述進一步地,液位感測器240可以包含類比感測器而且可以被固定在儲存器殼體223上。在至少一個實施例中,殼體223可以由玻璃構成,而且可以例如使用至少一黏合劑將液位感測器240黏附於玻璃上。在至少一個這樣的實施例中,液位感測器可以包含電容感測器,例如線性電容感測器,該電容感測器可以具有位於或鄰接儲存器空腔221的底部225之第一端241以及位於或鄰接儲存器空腔221的頂部226之第二端242。在這樣的實施例中,當內部空腔211淨空或至少實質淨空時,液位感測器240可組態成產生第一電壓(或低電壓),並且當內部空腔211充滿或至少實質充滿時,液位感測器240可組態成產生第二電壓(或高電壓)。此外,液位感測器240可組態成產生介於該低電壓與該高電壓之間的電壓範圍,取決於儲存器空腔211內的流體液位。尤其,在各種實施例中,由液位感測器240產生的電壓可以是儲存器空腔221內的流體高度之函數,因此,當流體高度增加時電壓會增加。在至少一個這樣的實施例中,例如電壓可與流體高 度成線性比例,其中,在至少一個實施例中,例如該低電壓可以約為零伏特而該高電壓可以約為五伏特。 In various embodiments, for the above, the level sensor 240 can include an analog sensor and can be secured to the reservoir housing 223. In at least one embodiment, the housing 223 can be constructed of glass and the level sensor 240 can be adhered to the glass, for example, using at least one adhesive. In at least one such embodiment, the level sensor can include a capacitive sensor, such as a linear capacitive sensor, which can have a first end located at or adjacent the bottom 225 of the reservoir cavity 221. 241 and a second end 242 at or adjacent to the top 226 of the reservoir cavity 221. In such an embodiment, the liquid level sensor 240 can be configured to generate a first voltage (or low voltage) when the internal cavity 211 is clear or at least substantially clear, and when the internal cavity 211 is full or at least substantially full The level sensor 240 can be configured to generate a second voltage (or high voltage). Additionally, level sensor 240 can be configured to generate a range of voltages between the low voltage and the high voltage, depending on the fluid level within reservoir cavity 211. In particular, in various embodiments, the voltage generated by level sensor 240 can be a function of the height of the fluid within reservoir cavity 221, and thus, the voltage will increase as the height of the fluid increases. In at least one such embodiment, for example, the voltage can be high with the fluid The degree is linearly proportional, wherein in at least one embodiment, for example, the low voltage can be about zero volts and the high voltage can be about five volts.

在各種實施例中,流體分配子系統200a可以進一步包含分配幫浦230,分配幫浦230可與儲存器210的內部空腔211流體連接而且可組態成從儲存器空腔211抽出流體並分配該流體進入內視鏡後處理器100的流體循環系統及/或流體循環系統內的混合室。在至少一個實施例中,到分配幫浦230的入口可以經由在儲存器220底部部分222中的端口238與內部腔室221的底部225流體連接。在某些實施例中,分配幫浦230可以包含正排量幫浦,該正排量幫浦可組態成在每一抽動推動固定體積的流體。關於供應幫浦210有對正排量幫浦的詳細描述,為了簡潔之故於此不再重複這樣的討論。在一些實施例中,供應幫浦210與分配幫浦230可以是相同的或至少幾乎相同。在至少一個實施例中,分配幫浦230可組態成在每一抽動推動與供應幫浦210相同的或至少實質相同的體積量或流體量。 In various embodiments, the fluid dispensing subsystem 200a can further include a dispensing pump 230 that can be fluidly coupled to the interior cavity 211 of the reservoir 210 and configurable to draw fluid from the reservoir cavity 211 and dispense The fluid enters the fluid circulation system of the endoscope rear processor 100 and/or the mixing chamber within the fluid circulation system. In at least one embodiment, the inlet to the distribution pump 230 can be fluidly coupled to the bottom 225 of the interior chamber 221 via a port 238 in the bottom portion 222 of the reservoir 220. In some embodiments, the distribution pump 230 can include a positive displacement pump that can be configured to push a fixed volume of fluid at each twitch. The supply pump 210 has a detailed description of the positive displacement pump. For the sake of brevity, this discussion will not be repeated here. In some embodiments, the supply pump 210 and the distribution pump 230 can be the same or at least nearly identical. In at least one embodiment, the dispensing pump 230 can be configured to push the same or at least substantially the same volume or amount of fluid as each of the twitches.

在使用中,可以操作供應幫浦210以填充儲存器220的內部腔室221值到流體液位已經符合或超過腔室221內的預定高度。在各種實施例中,流體分配子系統200a可以包含電腦或微處理器,例如PCB組件250,PCB組件250可與供應幫浦210、分配幫浦230及/或液位感測器240處於電性及/或訊號通訊。在至少一個這樣的實施例中,PCB組件250可組態成偵測液位感測器240產生的電壓位能,並以電壓位能的函數計算儲存器220內的流體高度。在PCB組件250計算儲存器220內的流體液位低於預定高度的情況下,PCB組件250可以操作流體供應幫浦210直到流體液位已經符合或超過預定高度。在至少一個實施例中,當儲存器220中的流體液位低於預定高度時,PCB組件250可不操作分配幫浦230。在PCB組件250計算儲存器220中的流體液位處於或高於預定高度的情況下,PCB組件250可以操作分配幫浦230,以視需要供應流體給流體循環系統。在某些實施例中,PCB組件250可組態成在操作分配幫浦230之前操作供應幫浦210,使得在操作分配幫浦230之前儲存器220中存在充足的流體供應。在至少一個實施例中,PCB組件250可組態成在操作分配幫浦230之後操作供應幫浦210,以補充儲存器220 內的流體供應。在各種實施例中,PCB組件250可組態成同時操作分配幫浦230與供應幫浦210,使得當分配幫浦230分配儲存器220中的流體時可補充儲存器220中的流體。 In use, the supply pump 210 can be operated to fill the internal chamber 221 value of the reservoir 220 until the fluid level has met or exceeded a predetermined height within the chamber 221. In various embodiments, the fluid dispensing subsystem 200a can include a computer or microprocessor, such as a PCB assembly 250, which can be electrically coupled to the supply pump 210, the distribution pump 230, and/or the level sensor 240. And / or signal communication. In at least one such embodiment, the PCB assembly 250 can be configured to detect the voltage potential generated by the level sensor 240 and calculate the fluid level within the reservoir 220 as a function of voltage potential. Where the PCB assembly 250 calculates that the fluid level within the reservoir 220 is below a predetermined height, the PCB assembly 250 can operate the fluid supply pump 210 until the fluid level has met or exceeded a predetermined height. In at least one embodiment, PCB assembly 250 may not operate dispensing pump 230 when the fluid level in reservoir 220 is below a predetermined level. Where the PCB assembly 250 calculates that the fluid level in the reservoir 220 is at or above a predetermined height, the PCB assembly 250 can operate the dispensing pump 230 to supply fluid to the fluid circulation system as needed. In certain embodiments, the PCB assembly 250 can be configured to operate the supply pump 210 prior to operating the dispense pump 230 such that there is sufficient fluid supply in the reservoir 220 prior to operating the dispense pump 230. In at least one embodiment, the PCB assembly 250 can be configured to operate the supply pump 210 after operating the distribution pump 230 to supplement the reservoir 220 Fluid supply inside. In various embodiments, the PCB assembly 250 can be configured to operate the dispensing pump 230 and the supply pump 210 simultaneously such that the fluid in the reservoir 220 can be replenished when the dispensing pump 230 dispenses fluid in the reservoir 220.

如以上之概述,供應幫浦210可以包含正排量幫浦,而且在這樣的實施例中,PCB組件250可組態成監控供應幫浦210是否在每次幫浦活塞212的抽動時輸送正確量的流體到儲存器220。更具體地說,可將關於供應幫浦210的固定體積排量之資訊編程到PCB組件250內,使得PCB組件250可以計算在供應幫浦210的每次抽動下儲存器220內的流體體積增加(如由流體液位感測器240所測得)是否與供應幫浦210的體積排量相符。在供應幫浦210的每次抽動下儲存器220內的流體增加(如由流體液位感測器240所測得)等於或至少充分等於供應幫浦210的固定體積排量之情況下,PCB組件250可發出訊號通知內視鏡後處理器100的操作員:正以流體來源之流體充足地供應供應幫浦210。在供應幫浦210的每次抽動下儲存器220內的流體增加(如由流體液位感測器240所測得)不等於或至少充分等於供應幫浦210的固定體積排量之情況下,PCB組件250可發出訊號通知內視鏡後處理器100的操作員:未以流體來源之流體充足地供應供應幫浦210,而且可能需要檢查流體來源,因為例如流體來源可能是空的。在各種情況中,檢查流體來源可包括置換或補充流體來源。在各種實施例中,儲存器220中可含有一流體量,在操作員檢查流體供應的同時,該流體量可足以供應內視鏡後處理器100所需。在先前的內視鏡後處理器中,其流體循環系統直接從流體供應抽出流體,因此內視鏡後處理器無法確認流體來源已經用盡,直到操作循環已經開始並且流體的缺乏已經中斷操作循環。 As outlined above, the supply pump 210 can include a positive displacement pump, and in such an embodiment, the PCB assembly 250 can be configured to monitor whether the supply pump 210 is properly delivered each time the pump piston 212 is twitched. The amount of fluid is passed to the reservoir 220. More specifically, information regarding the fixed volume displacement of the supply pump 210 can be programmed into the PCB assembly 250 such that the PCB assembly 250 can calculate an increase in fluid volume within the reservoir 220 for each twitch of the supply pump 210. Whether (as measured by fluid level sensor 240) matches the volumetric displacement of supply pump 210. The PCB increases (as measured by fluid level sensor 240) equal to or at least substantially equal to the fixed volume displacement of supply pump 210 for each twitch of supply pump 210, PCB The component 250 can signal to the operator of the endoscope post processor 100 that the supply pump 210 is being adequately supplied with fluid from the fluid source. In the event that the fluid increase in reservoir 220 (as measured by fluid level sensor 240) is not equal to or at least substantially equal to the fixed volume displacement of supply pump 210 at each twitch of supply pump 210, The PCB assembly 250 can signal the operator of the endoscope post processor 100 that the supply pump 210 is not adequately supplied with fluid from the fluid source and that the source of the fluid may need to be checked because, for example, the fluid source may be empty. In various circumstances, checking the fluid source can include replacing or supplementing the fluid source. In various embodiments, the reservoir 220 can contain a quantity of fluid that can be sufficient to supply the endoscope post processor 100 while the operator is inspecting the fluid supply. In previous endoscope postprocessors, the fluid circulation system directly extracted fluid from the fluid supply, so the endoscope post processor could not confirm that the fluid source had been exhausted until the operating cycle had begun and the lack of fluid had interrupted the operating cycle. .

在各種實施例中,對於上述進一步地,內視鏡後處理器100可以包含例如二個洗槽110,可以架設每個洗槽110使得可以清洗、殺菌及/或消毒其中的內視鏡。在某些實施例中,再次參照圖16,內視鏡後處理器100可以包含分開的流體循環系統,例如循環系統290a與290b,用以供應流體至每個洗槽110。在這樣的實施例中,流體分配子系統200a可組態成供應來自流體來源201a的流體給流體循環系統290a、290b兩者,而且類似地,流體分配子系統200b可組態成供應來自流體來 源201b的流體給流體循環系統290a、290b兩者。在至少一個這樣的實施例中,內視鏡後處理器100可以包含閥280a,閥280a一來可與流體分配子系統200a的分配幫浦230流體連接,而且二來可與流體循環系統290a、290b處於選擇性流體連接,使得流體可從流體來源201a選擇性地供應給流體循環系統290a、290b。類似地,內視鏡後處理器100可以包含閥280b,閥280b一來可與流體分配子系統200b的分配幫浦230處於流體連接,而且二來可與流體循環系統290a、290b處於選擇性流體連接,使得流體可從流體來源201b選擇性地供應給流體循環系統290a、290b。在運作流體循環系統的一個操作循環之前,在某些實施例中,流體循環系統可能需要來自流體分配子系統200a之一定量的流體,該流體例如清潔劑及/或消毒劑。在這樣的的實施例中,對於上述進一步地,可編程PCB組件250來於子系統200a的儲存器220內維持一流體量,使得當需要供應流體至流體循環系統290a、290b時,流體是可得的而不需要操作供應幫浦210。在各種情況中,流體循環系統需要的來自儲存器220的流體量可多於分配幫浦230單一抽動可供應的流體體積,因此,可能需要分配幫浦230的多次抽動。在任何情況中,在器具後處理器100的操作循環之前流體循環系統需要的特定流體量可等於可編程PCB組件250來於儲存器220中維持的最小流體量。在某些實施例中,可編程PCB組件250以在儲存器220中維持足夠的流體,以供應特定流體給流體循環系統兩者開始其操作循環,而不需由對應的供應幫浦210再填充。當然,對於上述進一步地,在已經供應流體循環系統兩者足量的流體之後,可接著操作供應幫浦210來再次填充儲存器220。鑑於上述,在各種實施例中,在啟動對應的供應幫浦210再次填充儲存器220之前,儲存器220中可能容納有足夠的流體,以供應流體循環系統至少一個操作循環,其中,在供應幫浦210例如由於空的流體供應而無法再次填充儲存器220的情況下,在流體循環系統的下一個操作循環之前,內視鏡後處理器100的操作員可得到置換流體供應的機會。 In various embodiments, further to the above, the endoscope post processor 100 can include, for example, two wash tanks 110, each of which can be erected such that the endoscopes can be cleaned, sterilized, and/or sterilized. In certain embodiments, referring again to FIG. 16, endoscope post processor 100 can include separate fluid circulation systems, such as circulation systems 290a and 290b, for supplying fluid to each wash tank 110. In such an embodiment, the fluid dispensing subsystem 200a can be configured to supply fluid from the fluid source 201a to both fluid circulation systems 290a, 290b, and similarly, the fluid dispensing subsystem 200b can be configured to supply fluid from the fluid. The fluid of source 201b is supplied to both fluid circulation systems 290a, 290b. In at least one such embodiment, the endoscope post processor 100 can include a valve 280a that can be fluidly coupled to the dispensing pump 230 of the fluid dispensing subsystem 200a, and that can be coupled to the fluid circulation system 290a, 290b is in selective fluid connection such that fluid can be selectively supplied to fluid circulation system 290a, 290b from fluid source 201a. Similarly, the endoscope post processor 100 can include a valve 280b that can be in fluid connection with the dispensing pump 230 of the fluid dispensing subsystem 200b and, in addition, can be in selective fluid with the fluid circulation system 290a, 290b. The connection is such that fluid can be selectively supplied to the fluid circulation system 290a, 290b from the fluid source 201b. Prior to operating an operating cycle of the fluid circulation system, in certain embodiments, the fluid circulation system may require a quantity of fluid from one of the fluid distribution subsystems 200a, such as a cleaning agent and/or a disinfectant. In such an embodiment, further to the above, the programmable PCB assembly 250 maintains a quantity of fluid within the reservoir 220 of the subsystem 200a such that when fluid is required to be supplied to the fluid circulation system 290a, 290b, the fluid is It does not need to operate the supply pump 210. In various circumstances, the amount of fluid from the reservoir 220 required by the fluid circulation system may be greater than the volume of fluid that the distribution pump 230 can supply in a single stroke, and thus, multiple strokes of the pump 230 may need to be dispensed. In any event, the particular amount of fluid required by the fluid circulation system prior to the operational cycle of the appliance post processor 100 can be equal to the minimum amount of fluid that the programmable PCB assembly 250 maintains in the reservoir 220. In certain embodiments, the programmable PCB assembly 250 maintains sufficient fluid in the reservoir 220 to supply a particular fluid to both of the fluid circulation systems to begin its cycle of operation without refilling by the corresponding supply pump 210. . Of course, for the above further, after a sufficient amount of fluid has been supplied to the fluid circulation system, the supply pump 210 can then be operated to refill the reservoir 220. In view of the above, in various embodiments, prior to initiating the corresponding supply pump 210 to refill the reservoir 220, the reservoir 220 may contain sufficient fluid to supply at least one cycle of operation of the fluid circulation system, wherein In the event that the reservoir 210 cannot refill the reservoir 220, for example due to an empty fluid supply, the operator of the endoscope post processor 100 may have an opportunity to replace the fluid supply prior to the next operational cycle of the fluid circulation system.

對於上述進一步地,分配幫浦230可以包含正排量幫浦,而且在這樣的實施例中,PCB組件250可以監控分配幫浦230是否在每次抽動下從儲存器220抽出正確量的流體。更具體地說,可以編程 關於分配幫浦230的固定體積排量之資訊於PCB組件250內,使得PCB組件250可以評估在分配幫浦230的每次抽動下,儲存器220內的流體減少(如由流體液位感測器240所測量)是否符合分配幫浦230的固定體積排量。在分配幫浦210的每次抽動下,儲存器220內的流體減少等於或至少充分等於分配幫浦230的固定體積排量(如由流體液位感測器240所測量)之情況下,PCB組件250發出訊號通知內視鏡後處理器100的操作員:正以充足地供應來自儲存器220的流體分配幫浦230。在分配幫浦230的每次抽動下,儲存器220內的流體減少(如由流體液位感測器240所測量)不等於或至少充分等於分配幫浦230的體積排量之情況下,PCB組件250可發出訊號通知內視鏡後處理器100的操作員:未以充足地供應流體分配幫浦230,而且可能需要對流體分配子系統作一些檢查及/或維修。 Further to the above, the distribution pump 230 can include a positive displacement pump, and in such an embodiment, the PCB assembly 250 can monitor whether the dispensing pump 230 draws the correct amount of fluid from the reservoir 220 with each twitch. More specifically, you can program Information regarding the fixed volumetric displacement of the distribution pump 230 is within the PCB assembly 250 such that the PCB assembly 250 can evaluate the fluid within the reservoir 220 for each twitch of the dispense pump 230 (eg, by fluid level sensing) Whether measured by the device 240 is consistent with the fixed volume displacement of the distribution pump 230. With each twitch of the dispense pump 210, the fluid reduction within the reservoir 220 is equal to or at least substantially equal to the fixed volume displacement of the dispense pump 230 (as measured by the fluid level sensor 240), the PCB The component 250 signals to the operator of the endoscope rear processor 100 that the fluid distribution pump 230 is being supplied sufficiently from the reservoir 220. Under each twitch of the dispense pump 230, the fluid within the reservoir 220 is reduced (as measured by the fluid level sensor 240) not equal to or at least substantially equal to the volumetric displacement of the dispensed pump 230, PCB The assembly 250 can signal the operator of the endoscope post processor 100 that the fluid distribution pump 230 is not adequately supplied and that some inspection and/or repair of the fluid dispensing subsystem may be required.

如以上關於各種實施例所討論的,每個流體分配子系統200a、200b可以包含流體供應幫浦210及分開的流體分配幫浦230。亦如以上討論的,在各種實施例中,流體供應幫浦210與流體分配幫浦230可以彼此獨立操作,以分別供應流體至儲存器220並分配來自儲存器220的流體。在某些替代的實施例中,單一幫浦裝置可組態成一來從流體供應泵送流體進入儲存器220,以及二來從儲存器220泵送流體進入流體循環系統。在至少一個這樣的實施例中,幫浦裝置可以包含活塞,該活塞具有位於第一圓筒內的第一活塞頭及位於第二圓筒內的第二活塞頭,其中該活塞可線性地往復運動以分別於該第一與第二圓筒內移動該第一與第二活塞頭。在各種實施例中,該第一圓筒可與流體來源及該儲存器流體連接,同時該第二圓筒可與該儲存器及該流體循環系統流體連接,使得在該第一圓筒內移動的該第一活塞頭可泵送來自流體來源的流體進入該儲存器,而在該第二圓筒內移動的該第二活塞頭可以泵送來自該儲存器的流體進入該流體循環系統。在各種實施例中,該第一活塞頭與該第一圓筒的配置可以包含第一正排量幫浦,而該第二活塞頭與該第二圓筒的配置可以包含第二正排量幫浦。在某些實施例中,幫浦裝置可以包含閥控制系統,該閥控制系統可組態成控制或限制流體的流動進入例如該第一圓筒及/或該第二圓筒。在至少一個這樣的實施例中,閥控制系統可 組態成於流體被從該第一圓筒泵送進入該儲存器時關閉閥元件並防止流體流入該第二圓筒。類似地,該閥控制系統可組態成於流體被從該儲存器經由該第二圓筒泵送時關閉閥元件並防止流體流入該第一圓筒。在這樣的實施例中,該第一與該第二活塞頭可於其個別的第一與第二圓筒內往復運動;然而,可防止通過該等圓筒之流體流動,如上所述。在各種替代的實施例中,幫浦可以包含旋轉幫浦,該旋轉幫浦具有與流體來源處於流體連接的第一孔洞、與儲存器處於流體連接的第二孔洞以及與該流體循環系統處於流體連接的第三孔洞。在至少一個這樣的實施例中,閥控制系統可組態成於泵送流體進入該儲存器時關閉或堵住該第三孔洞,以及替代地,在從該儲存器泵送流體時堵住該第一孔洞。在某些實施例中,該閥控制系統可包括任何適當配置的一或多個例如梭動閥及/或滑軸閥。在各種實施例中,可以使用任何包括三向閥的適當正排量幫浦來從流體來源泵送流體進入儲存器220,然後從儲存器220泵送流體進入流體循環系統。 As discussed above with respect to various embodiments, each fluid distribution subsystem 200a, 200b can include a fluid supply pump 210 and a separate fluid distribution pump 230. As also discussed above, in various embodiments, the fluid supply pump 210 and the fluid distribution pump 230 can operate independently of one another to supply fluid to the reservoir 220 and dispense fluid from the reservoir 220, respectively. In certain alternative embodiments, a single pumping device can be configured to pump fluid from the fluid supply into the reservoir 220 and, in addition, to pump fluid from the reservoir 220 into the fluid circulation system. In at least one such embodiment, the pumping device can include a piston having a first piston head within the first cylinder and a second piston head located within the second cylinder, wherein the piston can linearly reciprocate Movement moves the first and second piston heads within the first and second cylinders, respectively. In various embodiments, the first cylinder can be fluidly coupled to the fluid source and the reservoir, and the second cylinder can be fluidly coupled to the reservoir and the fluid circulation system such that movement within the first cylinder The first piston head can pump fluid from the fluid source into the reservoir, and the second piston head moving within the second cylinder can pump fluid from the reservoir into the fluid circulation system. In various embodiments, the configuration of the first piston head and the first cylinder can include a first positive displacement pump, and the configuration of the second piston head and the second cylinder can include a second positive displacement Pump. In certain embodiments, the pumping device can include a valve control system configurable to control or limit the flow of fluid into, for example, the first cylinder and/or the second cylinder. In at least one such embodiment, the valve control system can It is configured to close the valve element and prevent fluid from flowing into the second cylinder as fluid is pumped from the first cylinder into the reservoir. Similarly, the valve control system can be configured to close the valve element and prevent fluid from flowing into the first cylinder as fluid is pumped from the reservoir via the second cylinder. In such an embodiment, the first and second piston heads can reciprocate within their respective first and second cylinders; however, fluid flow through the cylinders can be prevented, as described above. In various alternative embodiments, the pump can include a rotary pump having a first bore in fluid connection with the fluid source, a second bore in fluid connection with the reservoir, and a fluid with the fluid circulation system The third hole connected. In at least one such embodiment, the valve control system can be configured to close or block the third hole when pumping fluid into the reservoir, and alternatively, block the fluid as it is pumped from the reservoir The first hole. In certain embodiments, the valve control system can include one or more of a suitable configuration of, for example, a shuttle valve and/or a slide shaft valve. In various embodiments, any suitable positive displacement pump including a three-way valve can be used to pump fluid from the fluid source into the reservoir 220 and then pump fluid from the reservoir 220 into the fluid circulation system.

如以上所討論,再次參照圖16,內視鏡後處理器100可以包含流體分配系統200,流體分配系統200可組態成供應流體至一或多個流體循環系統。亦如以上討論的,流體分配系統200可以包含一個以上的流體分配子系統,例如第一子系統200a與第二子系統200b。在各種實施例中,第二子系統200b可與第一子系統200a相同或至少實質上相同,因此,為了簡潔之故,在此不重複第二子系統200b的結構與操作。在至少一個實施例中,第一子系統200a可組態成分配第一流體至一或多個流體循環系統,例如流體循環系統290a與290b,而第二子系統200b可組態成分配第二流體至例如流體循環系統290a、290b。在至少一個這樣的實施例中,第一流體分配子系統200a可組態成分配例如清潔劑至流體循環系統,而第二流體分配子系統200b可組態成分配消毒劑(例如過氧乙酸)至該流體循環系統。亦如以上討論的,可以在不同的時間操作流體分配系統200a與200b,而在操作循環過程中的不同時間供應其各別的流體至該等流體循環系統。在各種其他的情況下,可以在相同的時間操作流體子系統200a與200b,以例如供應不同的流體至相同的流體循環系統及/或在相同的時間供應不同的流體至不同的流體循環系統。 As discussed above, referring again to FIG. 16, endoscope post processor 100 can include a fluid dispensing system 200 that can be configured to supply fluid to one or more fluid circulation systems. As also discussed above, the fluid dispensing system 200 can include more than one fluid dispensing subsystem, such as the first subsystem 200a and the second subsystem 200b. In various embodiments, the second subsystem 200b can be identical or at least substantially identical to the first subsystem 200a, and thus, for the sake of brevity, the structure and operation of the second subsystem 200b are not repeated herein. In at least one embodiment, the first subsystem 200a can be configured to dispense a first fluid to one or more fluid circulation systems, such as fluid circulation systems 290a and 290b, and the second subsystem 200b can be configured to dispense a second The fluid is to, for example, fluid circulation systems 290a, 290b. In at least one such embodiment, the first fluid dispensing subsystem 200a can be configured to dispense, for example, a cleaning agent to the fluid circulation system, and the second fluid dispensing subsystem 200b can be configured to dispense a disinfectant (eg, peroxyacetic acid). To the fluid circulation system. As also discussed above, fluid dispensing systems 200a and 200b can be operated at different times while their respective fluids are supplied to the fluid circulation systems at different times during the operating cycle. In various other situations, fluid subsystems 200a and 200b can be operated at the same time to, for example, supply different fluids to the same fluid circulation system and/or supply different fluids to different fluid circulation systems at the same time.

對於上述進一步地,第一流體循環系統290a可以包含第一通道流動子系統160與第一幫浦162,用以循環流體通過第一循環系統290a,而第二流體循環系統290b可以包含第二通道流動子系統160與第二幫浦160,用以循環流體通過第二循環系統290b。在各種其他的實施例中,器具後處理器可包含任何適當數量的流體循環系統;然而,關於任一個流體循環系統,其通道流動子系統160可組態成控制該流體循環系統之初始化(或起動)程序。更具體地說,在已經將器具放置於洗槽110中並且已經關閉蓋體130之後,操作員可以初始化操作循環來清洗器具,而且在這樣的時點,通道流動子系統160可組態成控制來自幫浦162的後處理流體之初始流動。在各種實施例中,器具(例如內視鏡)可以包含複數個延伸於其間的通道或內腔,該等通道可以具有例如不同的長度、直徑及/或結構,而使該等通道具有例如不同的整體流動阻力或限制。在以全部的比例閥174處於開啟狀態及/或相同的狀態下初始化幫浦162之情況中,在填充及/或加壓具有較高流動阻力的內視鏡通道之前,流自幫浦162的流體會傾向於填充及/或加壓具有較低流動阻力的內視鏡通道。在各種情況中,這樣的處境會是短暫的,並且最終將會達到流體循環系統之所需操作條件或穩態操作條件。在一些情況中,此起動程序是完全適合的。然而,在其他的情況中,可能需要不同的起動程序。 Further to the above, the first fluid circulation system 290a can include a first channel flow subsystem 160 and a first pump 162 for circulating fluid through the first circulation system 290a, and the second fluid circulation system 290b can include a second channel flow. Subsystem 160 and second pump 160 are used to circulate fluid through second circulation system 290b. In various other embodiments, the appliance post-processor can include any suitable number of fluid circulation systems; however, with respect to any of the fluid circulation systems, its channel flow subsystem 160 can be configured to control the initialization of the fluid circulation system (or Start) program. More specifically, after the appliance has been placed in the wash tank 110 and the cover 130 has been closed, the operator can initiate an operational cycle to clean the appliance, and at such point in time, the channel flow subsystem 160 can be configured to control from The initial flow of the post-treatment fluid of the pump 162. In various embodiments, an instrument (eg, an endoscope) can include a plurality of channels or lumens extending therebetween, such channels having, for example, different lengths, diameters, and/or configurations, such that the channels have, for example, different The overall flow resistance or limit. In the case where the pump 162 is initialized with all of the proportional valves 174 in the open state and/or the same state, flow from the pump 162 before filling and/or pressurizing the endoscope passage having a higher flow resistance Fluids tend to fill and/or pressurize endoscope channels with lower flow resistance. In various situations, such a situation would be short-lived and would eventually reach the desired operating conditions or steady-state operating conditions of the fluid circulation system. In some cases, this starting procedure is perfectly suitable. However, in other situations, different starting procedures may be required.

在各種實施例中,對於上述進一步地,通道流動子系統160可以包括例如電腦及/或微處理器,該電腦及/或微處理器可以在初始化程序的過程中將閥174配置於不同的狀態中。在至少一個實施例中,子系統電腦可以操作閥174來補償例如內視鏡通道的不同流動阻力或限制。舉例來說,對於控制通過高流動阻力內視鏡通道的流體流動之閥174,子系統電腦可以將這樣的閥174置於全開的狀態中,而對於控制通過低流動阻力內視鏡通道的流體流動之閥174,子系統電腦可以將這樣的閥174置於部分關閉的狀態中。在這樣的實施例中,來自幫浦162的流體流動可傾向於同時或至少實質上同時填充及/或加壓所有的內視鏡通道。在某些情況中,可縮短將通道填充加壓流體的短暫狀態,而且可在更短的時間內達到穩態操作條件或所需的操作條件。這樣的實施例可減少進行器具後處理器100的清洗循環所需的全部時間。在例如具有八個 內視鏡通道與八個用以控制通過八個對應的通道供應管線164之流體流動的流動控制單元170之實施例中,可將其八個比例閥174全部置於不同的條件及/或相同的條件中,例如開啟、關閉、部分開啟及/或部分關閉。 In various embodiments, for further of the above, the channel flow subsystem 160 can include, for example, a computer and/or a microprocessor that can configure the valve 174 in different states during the initialization process. in. In at least one embodiment, the subsystem computer can operate the valve 174 to compensate for different flow resistances or limitations, such as endoscope channels. For example, for a valve 174 that controls fluid flow through a high flow resistance endoscope passage, the subsystem computer can place such a valve 174 in a fully open state and control fluid flow through the low flow resistance endoscope passage The flow valve 174, the subsystem computer can place such a valve 174 in a partially closed state. In such an embodiment, fluid flow from the pump 162 may tend to fill and/or press all of the endoscope channels simultaneously or at least substantially simultaneously. In some cases, the transient state of filling the channel with pressurized fluid can be shortened, and steady state operating conditions or desired operating conditions can be achieved in less time. Such an embodiment can reduce the total time required to perform the cleaning cycle of the appliance post processor 100. For example with eight In an embodiment of the endoscope channel and eight flow control units 170 for controlling the flow of fluid through the eight corresponding channel supply lines 164, all of its eight proportional valves 174 can be placed in different conditions and/or the same The conditions are, for example, on, off, partially on, and/or partially off.

在本文中描述的各種實施例中,流動子系統電腦可使用一或多個標準或參數來於初始化(或起動)程序的過程中控制流動控制單元170的閥174。對於上述進一步地,第一控制單元170的第一比例閥174可組態成控制流經第一內視鏡通道的流體,該第一內視鏡通道係由特定參數的第一值所界定,第二控制單元170的第二比例閥174可組態成控制流經第二內視鏡通道的流體,該第二內視鏡通道係由特定參數的第二值所界定,以及第三控制單元170的第三比例閥174可組態成控制流經第三內視鏡通道的流體,該第三內視鏡通道係由特定參數的第三值所界定。在各種實施例中,該參數之第一值可大於該參數的第二值,而該第二值可大於該參數之第三值,其中可將第一閥174調變為第一開啟狀態,可基於該參數之第一值與第二值之間的差異將第二閥174調變為第二開啟狀態,而且可基於該參數之第一值與第三值之間的差異將第三閥174調變為第三開啟狀態,以調節通過第一、第二及第三通道之流體流動。在至少一個這樣的實施例中,可以分別選擇第一、第二及第三閥174之第一開啟狀態、第二開啟狀態及第三開啟狀態,使得在流體循環系統的初始化(或起動)程序過程中,通過第一、第二及第三內視鏡通道的流體流動可以是均勻地或至少實質上均勻地分佈於第一、第二及第三內視鏡通道。在至少一個實施例中,可以選擇閥174之第一、第二及第三開啟狀態,使得當內視鏡通道充滿流體時,通過內視鏡通道的體積流速彼此相等的或至少實質上相等。在這樣一實施例中,在初始化程序的過程中,通過內視鏡通道的流體流速可以提高,其中每個流體流動可與其他的流體流動同時提高。在至少一個實施例中,可以選擇閥174之第一、第二及第三開啟狀態,使得當內視鏡通道充滿流體時,流經內視鏡通道的流體之錶壓彼此相等或至少實質上相等。在這樣一實施例中,在初始化程序的過程中,壓力或流經內視鏡通道的流體可以增加,其中每個流體流動之壓力可與其他的流體流動之壓力同時增加。 In various embodiments described herein, the flow subsystem computer can use one or more criteria or parameters to control the valve 174 of the flow control unit 170 during initialization (or startup) of the program. Further to the above, the first proportional valve 174 of the first control unit 170 can be configured to control fluid flowing through the first endoscope channel, the first endoscope channel being defined by a first value of a particular parameter, The second proportional valve 174 of the second control unit 170 can be configured to control fluid flowing through the second endoscope channel, the second endoscope channel being defined by a second value of a particular parameter, and a third control unit The third proportional valve 174 of 170 can be configured to control fluid flow through the third endoscope passage, the third endoscope passage being defined by a third value of a particular parameter. In various embodiments, the first value of the parameter may be greater than the second value of the parameter, and the second value may be greater than the third value of the parameter, wherein the first valve 174 may be adjusted to the first open state, The second valve 174 can be adjusted to a second open state based on a difference between the first value and the second value of the parameter, and the third valve can be based on a difference between the first value and the third value of the parameter The 174 is adjusted to a third open state to regulate fluid flow through the first, second, and third passages. In at least one such embodiment, the first open state, the second open state, and the third open state of the first, second, and third valves 174 can be selected, respectively, such that an initialization (or start) procedure in the fluid circulation system During the process, fluid flow through the first, second, and third endoscope channels may be evenly or at least substantially evenly distributed across the first, second, and third endoscope channels. In at least one embodiment, the first, second, and third open states of the valve 174 can be selected such that when the endoscope passage is filled with fluid, the volumetric flow rates through the endoscope passages are equal or at least substantially equal to one another. In such an embodiment, the fluid flow rate through the endoscope passage can be increased during the initialization process, wherein each fluid flow can be increased simultaneously with other fluid flows. In at least one embodiment, the first, second, and third open states of the valve 174 can be selected such that when the endoscope passage is filled with fluid, the gauge pressure of the fluid flowing through the endoscope passage is equal or at least substantially equal. In such an embodiment, pressure or fluid flow through the endoscope passage may be increased during the initialization process, wherein the pressure of each fluid flow may increase simultaneously with the pressure of other fluid flows.

在至少一個實施例中,對於上述進一步地,用以選擇比 例閥174的開啟狀態之參數可以包含器具通道之流動阻力值。在各種情況中,器具通道之流動阻力值會受許多變數影響;然而,器具通道之流動阻力值主要可由通道長度、通道直徑及通道路徑中的彎曲(或彎折)所決定。具有較長長度、較小直徑及/或在通道路徑中有較多彎曲的器具通道通常將比具有較短長度、較大直徑及/或在通道路徑中有較少彎曲的器具通道具有較高的流動阻力值。在任何情況中,可以選擇具有醫療器具的最高流動阻力值之器具通道作為基準,由該基準可以調整流經其他器具通道的流體。在至少一個實施例中,例如第一器具通道可以具有最高流體流動阻力,而且可以設定第一比例閥174為完全開啟狀態。在各種實施例中,可以基於第一流動阻力值與第二流動阻力值之間的差異關閉第二比例閥174之某量。類似地,可以基於第一流動阻力值與第三流動阻力值之間的差異關閉第三比例閥174的某量。在各種情況中,器具通道的流動阻力值與第一流動阻力值(或基準流動阻力值)之間的差異愈大,則相應地可關閉比例閥174的程度愈大。 In at least one embodiment, for the above, to select a ratio The parameter of the open state of the valve 174 may include the flow resistance value of the appliance passage. In each case, the flow resistance value of the appliance channel can be affected by many variables; however, the flow resistance value of the appliance channel can be primarily determined by the channel length, the channel diameter, and the bend (or bend) in the channel path. Appliance passages having longer lengths, smaller diameters, and/or more curvature in the passage path will generally have higher passages than appliance passages having shorter lengths, larger diameters, and/or less bending in the passage path. The value of the flow resistance. In any event, the appliance channel having the highest flow resistance value of the medical device can be selected as a reference from which the fluid flowing through the other appliance channels can be adjusted. In at least one embodiment, for example, the first appliance passage can have the highest fluid flow resistance, and the first proportional valve 174 can be set to a fully open state. In various embodiments, a certain amount of the second proportional valve 174 may be closed based on the difference between the first flow resistance value and the second flow resistance value. Similarly, a certain amount of the third proportional valve 174 may be closed based on the difference between the first flow resistance value and the third flow resistance value. In each case, the greater the difference between the flow resistance value of the appliance passage and the first flow resistance value (or the reference flow resistance value), the greater the degree to which the proportional valve 174 can be closed accordingly.

在任何情況中,對於上述進一步地,一旦已經達到流體循環系統的穩態操作條件或所需操作條件,則子系統電腦可以允許流動控制單元170獨立地控制並管理通過內視鏡通道供應管線164的流體之流動,如以上討論。在各種情況中,可以設計本文中所描述的裝置與方法而提供適合的後處理流體供應來清洗、殺菌及/或消毒內視鏡及/或任何其他包含具有不同流動阻力的通道之適當器具。對於上述進一步地,這些裝置與方法可組態成藉由個別控制通過每個通道的流體流動來供應適當的後處理流體供應給通道。 In any event, further to the above, once the steady state operating conditions or desired operating conditions of the fluid circulation system have been reached, the subsystem computer can allow the flow control unit 170 to independently control and manage the supply line 164 through the endoscope channel. The flow of fluid is as discussed above. In various circumstances, the devices and methods described herein can be designed to provide a suitable post-treatment fluid supply to clean, sterilize, and/or sterilize the endoscope and/or any other suitable device that includes passages having different flow resistances. Further to the above, these devices and methods can be configured to supply an appropriate post-treatment fluid supply to the channel by individually controlling fluid flow through each channel.

在各種情況中,幫浦162可以具有充足的輸出,而在操作循環的初始化及整個操作循環的過程中供應適當的後處理流體供應給全部的後處理器供應管線164及與其相關的內視鏡通道。對於上述進一步地,流動控制單元170可組態成管理向其供應的流體,使得每個後處理器供應管線164具有流經其之符合或超過最小目標流速的流速,並因此不會匱乏流體。在通過一或多個後處理器供應管線164的流體流動低於最小目標流速而且幫浦162不是操作於最大容量的情況下,可以提高幫浦162的輸出。在一些情況中,離開幫浦162的後處理流體之錶壓可 以至少暫時地提高到目標錶壓之上,例如35 psig,以使幫浦162符合後處理器供應管線164及與其關聯的內視鏡通道之供應需求。在通過一或多個後處理器供應管線164的流體流動低於最小目標流速而且幫浦162操作於最大(或接近最大)容量的情況下,可以操作至少一增壓幫浦來提高進入歧管166與後處理器供應管線164的後處理流體之流速及/或壓力。在各種實施例中,該至少一增壓幫浦可例如與幫浦162串聯及/或與幫浦162並聯,其中可以選擇性地操作該至少一增壓幫浦來協助幫浦162。 In each case, the pump 162 may have sufficient output, while supplying appropriate post-processing fluid to all of the post-processor supply lines 164 and associated endoscopes during initialization of the operating cycle and throughout the operational cycle. aisle. Further to the above, the flow control unit 170 can be configured to manage the fluid supplied thereto such that each of the after-processor supply lines 164 has a flow rate through which it meets or exceeds a minimum target flow rate, and thus does not deplete fluid. The output of the pump 162 may be increased if the fluid flow through the one or more post-processor supply lines 164 is below the minimum target flow rate and the pump 162 is not operating at the maximum capacity. In some cases, the gauge pressure of the post-treatment fluid exiting the pump 162 may To at least temporarily increase above the target gauge, such as 35 psig, the pump 162 meets the supply requirements of the post processor supply line 164 and its associated endoscope channel. In the event that fluid flow through one or more of the after-processor supply lines 164 is below a minimum target flow rate and the pump 162 is operating at a maximum (or near maximum) capacity, at least one booster pump may be operated to increase the inlet manifold The flow rate and/or pressure of the post-treatment fluid of 166 and after-processor supply line 164. In various embodiments, the at least one booster pump can be, for example, in series with the pump 162 and/or in parallel with the pump 162, wherein the at least one booster pump can be selectively operated to assist the pump 162.

在本文中討論的各種實施例中,通道流動子系統160的每個後處理器供應管線164可以包含比例閥174,比例閥174組態成控制可變流孔。在各種其他的實施例中,至少一後處理器供應管線164可以包括固定的流孔或固定的流孔閥。在至少一個實施例中,可將該固定的流孔閥置於不是開啟狀態就是關閉狀態中。在至少一個這樣的實施例中,具有固定流孔閥的後處理器供應管線164可與例如具有最高流體流動阻力的內視鏡通道耦接,其中通過這樣的內視鏡通道之流體流速可以是由幫浦162供應的後處理流體之錶壓的函數。在各種實施例中,例如當固定流孔閥處於開啟狀態時,可以就具有固定流孔閥的後處理器供應管線164來調變具有例如由比例閥174控制的可變流孔之後處理器供應管線164。 In various embodiments discussed herein, each of the post processor supply lines 164 of the channel flow subsystem 160 can include a proportional valve 174 configured to control the variable orifice. In various other embodiments, the at least one post processor supply line 164 can include a fixed orifice or a fixed orifice valve. In at least one embodiment, the fixed orifice valve can be placed in an open state or a closed state. In at least one such embodiment, a post processor supply line 164 having a fixed orifice valve can be coupled to, for example, an endoscope passage having the highest fluid flow resistance, wherein the fluid flow rate through such an endoscope passage can be A function of the gauge pressure of the post-treatment fluid supplied by the pump 162. In various embodiments, for example, when the fixed orifice valve is in the open state, the rear processor supply line 164 having a fixed orifice valve can be used to modulate the supply of the variable orifice after the control is controlled, for example, by the proportional valve 174. Line 164.

敘述為以引用方式併於此的任何專利、文獻、或其他揭露資料之全部或部分係併於此,但僅至所併之資料不與現有的定義、陳述、及在此揭露中提出的其他揭露資料起衝突的程度。由於這樣,並且在必要的範圍內,本文中明確提出的揭露取代以引用方式併入本文的任何衝突材料。敘述為以引用方式併於此、但與現有的定義、陳述、或在本文中提出的其他揭露資料起衝突的任何資料或其一部分,將僅被併入到併入的資料與現有的揭露材料之間無衝突產生的程度。 All or part of any patent, document, or other disclosure disclosed herein is hereby incorporated by reference in its entirety herein in its entirety in its entirety in the extent of Reveal the extent to which information is in conflict. As such, and to the extent necessary, the disclosure as explicitly set forth herein supersedes any conflicting material incorporated herein by reference. Any material or part thereof that is hereby incorporated by reference, but which is hereby incorporated herein by reference in its entirety herein inso There is no conflict between them.

雖然本發明已被描述為具有例示性的設計,但可以在本揭露的精神和範圍之內進一步修改本發明。因此,本申請旨在涵蓋本發明使用其一般性原則的任何變化、使用或修改。另外,本申請旨在涵蓋在本發明所屬的技術領域中習知或習慣做法的範圍內之本揭露的這種偏離。 While the invention has been described as being illustrative, the invention may be further modified within the spirit and scope of the disclosure. This application is therefore intended to cover any variations, uses, or adaptations Further, the present application is intended to cover such departures of the present disclosure within the scope of the teachings of the invention.

100‧‧‧後處理器 100‧‧‧post processor

110‧‧‧洗槽 110‧‧‧washing tank

120‧‧‧托架 120‧‧‧ bracket

130‧‧‧折疊門/蓋體 130‧‧‧Folding door/cover

140‧‧‧框架 140‧‧‧Frame

150‧‧‧控制面板 150‧‧‧Control panel

Claims (9)

一種控制通過一器具之後處理流體的流動之方法,該器具具有至少一第一及第二通道,該方法包含以下步驟:操作一與一後處理流體來源處於流體連接的幫浦;使該後處理流體流經一第一流體迴路,該第一流體迴路包含一第一閥及一第一壓差感測器,其中該第一流體迴路與該幫浦及該第一通道處於流體連接;使用該第一壓差感測器偵測流入該第一閥的該後處理流體中之一第一壓差;使用來自該第一壓差感測器的一輸出調變該第一閥,以控制通過該第一通道的後處理流體之第一流速;使該後處理流體流經一第二流體迴路,該第二流體迴路包含一第二閥及一第二壓差感測器,其中該第二流體迴路與該幫浦及該第二通道處於流體連接;使用該第二壓差感測器偵測流入該第二閥的該後處理流體中之一第二壓差;以及使用來自該第二壓差感測器的一輸出調變該第二閥,以控制通過該第二通道的後處理流體之第二流速;其中調變該第一閥之該步驟包含調變一第一可變閥流孔,以及其中調變該第二閥之該步驟包含調變一第二可變閥流孔。 A method of controlling the flow of a fluid after passing an apparatus, the apparatus having at least one first and second passages, the method comprising the steps of: operating a pump in fluid connection with a source of post-treatment fluid; The fluid flows through a first fluid circuit, the first fluid circuit includes a first valve and a first differential pressure sensor, wherein the first fluid circuit is in fluid connection with the pump and the first channel; The first differential pressure sensor detects a first differential pressure in the post-treatment fluid flowing into the first valve; and modulates the first valve using an output from the first differential pressure sensor to control passage a first flow rate of the post-treatment fluid of the first passage; flowing the post-treatment fluid through a second fluid circuit, the second fluid circuit including a second valve and a second differential pressure sensor, wherein the second a fluid circuit in fluid connection with the pump and the second passage; using the second differential pressure sensor to detect a second differential pressure in the post-treatment fluid flowing into the second valve; and using the second from the second An output modulation of the differential pressure sensor a second valve to control a second flow rate of the aftertreatment fluid passing through the second passage; wherein the step of modulating the first valve includes modulating a first variable valve orifice, and wherein the second valve is modulated This step includes modulating a second variable valve orifice. 如申請專利範圍第1項之方法,其進一步包含以下步驟:測量該後處理流體於該第一流體迴路中之一第一錶壓;比較該第一錶壓與一第一最大壓力;以及假使該第一錶壓超過該第一最大壓力,則關閉該第一閥以停止通過該第一流體迴路之該流體流動。 The method of claim 1, further comprising the steps of: measuring a first gauge pressure of the post-treatment fluid in the first fluid circuit; comparing the first gauge pressure to a first maximum pressure; and The first gauge pressure exceeds the first maximum pressure, the first valve is closed to stop the flow of fluid through the first fluid circuit. 如申請專利範圍第1項之方法,其進一步包含以下步驟:比較該第一流速與一第一目標流速;以及假使該第一流速高於該第一目標流速則至少部分地關閉該第一閥或假使該第一流速低於該第一目標流速則至少部分地開啟該第一閥; 比較該第二流速與一第二目標流速;以及假使該第二流速高於該第二目標流速則至少部分地關閉該第二閥或假使該第二流速低於該第二目標流速則至少部分地開啟該第二閥。 The method of claim 1, further comprising the steps of: comparing the first flow rate to a first target flow rate; and at least partially closing the first valve if the first flow rate is higher than the first target flow rate Or at least partially opening the first valve if the first flow rate is lower than the first target flow rate; Comparing the second flow rate to a second target flow rate; and at least partially closing the second valve if the second flow rate is higher than the second target flow rate or at least partially lowering the second flow rate below the second target flow rate The second valve is opened. 一種用於清洗一醫療器具之器具後處理器,該醫療器具包括一通路,該器具後處理器包含:一組態成容置該醫療器具之腔室;一組態成與該通路流體式耦接之供應連接器;一組態成加壓一後處理流體及供應該後處理流體至該供應連接器之幫浦,其中該幫浦包含一入口及一出口;一定位以感測流自該幫浦出口的該後處理流體之錶壓的錶壓感測器;以及一流動控制系統,包含:一與該供應連接器處於流體連接之閥,其中該閥組態成控制後處理流體通過該通路之一流速,而且其中該閥包含一入口及一出口;一壓差感測器,該壓差感測器組態成感測於一固定流孔之相對側上的該後處理流體中之一壓降,其中該壓差感測器係位於該錶壓感測器下游及該閥出口上游;以及一與該壓差感測器處於訊號通訊之處理器,其中該處理器組態成基於該壓降而解譯該流速,並且命令該閥進行至少部分關閉及至少部分開啟中之至少一者。 A post-processor for cleaning a medical device, the medical device comprising a passage, the post-processor comprising: a chamber configured to receive the medical device; a fluid coupling configured to the passage a supply connector; a pump configured to pressurize a post-treatment fluid and supply the post-treatment fluid to the supply connector, wherein the pump includes an inlet and an outlet; a positioning to sense flow from the a gauge pressure sensor for the gauge pressure of the post-treatment fluid at the outlet of the pump; and a flow control system comprising: a valve fluidly coupled to the supply connector, wherein the valve is configured to control the passage of the post-treatment fluid a flow rate of the passage, and wherein the valve includes an inlet and an outlet; a differential pressure sensor configured to sense the post-treatment fluid on opposite sides of a fixed orifice a pressure drop, wherein the differential pressure sensor is located downstream of the gauge sensor and upstream of the valve outlet; and a processor in signal communication with the differential pressure sensor, wherein the processor is configured to be based Interpreting the flow rate by the pressure drop, And commanding the valve is at least partially closed and at least a portion of the at least one opening. 一種控制通過一器具之後處理流體的流動之方法,該器具包含一通道,該方法包含以下步驟:操作一與一後處理流體來源處於流體連接的幫浦;測量流自該幫浦的該後處理流體之錶壓;調整該後處理流體的流動,以調整該後處理流體的錶壓,以將流自該幫浦的該後處理流體維持於實質上恒壓;使該後處理流體流經一流體迴路,該流體迴路包含一閥及一壓差感測器,其中該流體迴路與該幫浦及該通道處於流體連接;使用該壓差感測器來偵測流入該閥的該後處理流體中之一壓差;以及 使用來自該壓差感測器之一輸出來調變該閥,以控制後處理流體通過該通道之流速;其中調變該閥之該步驟包含調變一可變閥流孔。 A method of controlling the flow of a fluid after passing an appliance, the apparatus comprising a passage, the method comprising the steps of: operating a pump in fluid connection with a source of post-treatment fluid; measuring the post-treatment of the stream from the pump a gauge pressure of the fluid; adjusting a flow of the post-treatment fluid to adjust a gauge pressure of the post-treatment fluid to maintain the post-treatment fluid flowing from the pump at a substantially constant pressure; flowing the post-treatment fluid through a a fluid circuit comprising a valve and a differential pressure sensor, wherein the fluid circuit is in fluid connection with the pump and the channel; the differential pressure sensor is used to detect the post-treatment fluid flowing into the valve One of the pressure differences; The valve is modulated using an output from the differential pressure sensor to control the flow rate of the post-treatment fluid through the passage; wherein the step of modulating the valve includes modulating a variable valve orifice. 如申請專利範圍第5項之方法,其進一步包含計算通過該通道的該後處理流體之流速的步驟。 The method of claim 5, further comprising the step of calculating a flow rate of the post-treatment fluid through the passage. 一種控制通過一器具之後處理流體的流動之方法,該器具具有至少一第一通道及一第二通道,其中該第一通道係由一參數之一第一值所界定,而該第二通道係由該參數之一第二值所界定,該方法包含以下步驟:初始化一與一後處理流體來源處於流體連接的幫浦,以開始一操作循環;供應該後處理流體至一包含一第一閥的第一流體迴路,其中該第一流體迴路與該幫浦及該第一通道處於流體連接;供應該後處理流體至一包含一第二閥的第二流體迴路,其中該第二流體迴路與該幫浦及該第二通道處於流體連接;以及調變該第一閥以限制後處理流體之流動通過該第一通道,其中後處理流體之流動受限制之量為該參數之該第一值與該參數之該第二值之間的關係之函數,藉此,當該幫浦被啟動時,該後處理流體流經該第一通道與該第二通道;其中調變該第一閥之該步驟包含調變一第一可變閥流孔,而且其中調變該第二閥之該步驟包含調變一第二可變閥流孔。 A method of controlling the flow of a fluid after passing an appliance, the apparatus having at least a first passage and a second passage, wherein the first passage is defined by a first value of a parameter and the second passage is Defined by a second value of one of the parameters, the method includes the steps of: initializing a pump in fluid connection with a source of post-treatment fluid to initiate an operational cycle; supplying the post-treatment fluid to a first valve comprising a first fluid circuit, wherein the first fluid circuit is in fluid connection with the pump and the first channel; the post-treatment fluid is supplied to a second fluid circuit including a second valve, wherein the second fluid circuit The pump and the second passage are in fluid connection; and modulating the first valve to limit flow of the aftertreatment fluid through the first passage, wherein the flow of the aftertreatment fluid is limited by the first value of the parameter a function of a relationship with the second value of the parameter whereby the post-treatment fluid flows through the first passage and the second passage when the pump is activated; wherein the first valve is modulated The modulation step comprises a first variable orifice valve, and wherein the step of modulating the second modulating valve to include a second variable orifice valve. 如申請專利範圍第7項之方法,其中該調變步驟包含限制通過該第一通道之該後處理流體的流動,使得該後處理流體流經該第一通道之壓力與該後處理流體流經該第二通道之壓力相同。 The method of claim 7, wherein the modulating step comprises limiting a flow of the post-treatment fluid through the first passage such that a pressure of the post-treatment fluid flowing through the first passage flows through the post-treatment fluid The pressure of the second passage is the same. 如申請專利範圍第7項之方法,其進一步包含調變該第二閥以限制通過該第二通道之該後處理流體的流動之步驟,其中該後處理流體之流動受限制之量為該參數之該第二值與該參數之一目標值之間的關係之函數。 The method of claim 7, further comprising the step of modulating the second valve to restrict flow of the post-treatment fluid through the second passage, wherein the flow of the post-treatment fluid is limited by the parameter A function of the relationship between the second value and a target value of one of the parameters.
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