TW201335538A - Non-glare reflective LED lighting apparatus with heat sink mounting - Google Patents

Non-glare reflective LED lighting apparatus with heat sink mounting Download PDF

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Publication number
TW201335538A
TW201335538A TW101111452A TW101111452A TW201335538A TW 201335538 A TW201335538 A TW 201335538A TW 101111452 A TW101111452 A TW 101111452A TW 101111452 A TW101111452 A TW 101111452A TW 201335538 A TW201335538 A TW 201335538A
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Taiwan
Prior art keywords
reflector
light
heat
coupled
illuminating device
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TW101111452A
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Chinese (zh)
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TWI529344B (en
Inventor
Tin Po Chu
Wa-Hing Leung
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Huizhou Light Engine Ltd
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Priority claimed from US13/401,724 external-priority patent/US9234646B2/en
Application filed by Huizhou Light Engine Ltd filed Critical Huizhou Light Engine Ltd
Publication of TW201335538A publication Critical patent/TW201335538A/en
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Publication of TWI529344B publication Critical patent/TWI529344B/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/04Optical design
    • F21V7/048Optical design with facets structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/0008Reflectors for light sources providing for indirect lighting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/0066Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A lighting apparatus contains a main housing; a reflector disposed within the main housing, and having a front side and a rear side; a heat conducting body comprising at least two heat pipes, wherein a first portion of the at least two heat pipes are parallel to a central axis of the lighting apparatus on the front side of the reflector, and a second portion of each of the at least two heat pipes is in the rear side of the reflector and is thermally coupled to the main housing; a heat conducting head located on the front side of the reflector, and is thermally coupled to the heat conducting body; at least two light-emitting diodes (''LEDs'') thermally coupled to the heat conducting body, and being positioned to face the front side of the reflector so that light emitted from the LEDs are directed to said front side.

Description

具有散熱器安裝件的非眩光反射式發光二極體發光裝置 Non-glare reflective type light emitting diode illuminating device with radiator mounting member 相關申請案之交互參照 Cross-references to related applications

這是請求2009年5月21日申請之美國第12/470,332號之部份連續申請案之2012年2月21日申請之美國第13/401,724號之優先權的一發明申請案,且該美國第12/470,332號之部份連續申請案依35U.S.C.§119(e)請求2008年5月23日申請之美國暫時專利申請案第61/055,858號,2008年5月30日申請之美國暫時專利申請案第61/057,289號及2008年11月26日申請之美國暫時專利申請案第61/118,202號之優先權,且該等申請案全部在此加入作為參考。 An application for an invention of the priority of US Serial No. 13/401,724, filed on Feb. 21, 2012, filed on May 21, 2009. Part of the continuous application of No. 12/470, 332, in accordance with 35 USC § 119(e), requests US Provisional Patent Application No. 61/055,858, filed on May 23, 2008, and US pending on May 30, 2008 Priority is claimed in U.S. Patent Application Serial No. 61/057,289, the entire disclosure of which is incorporated herein by reference.

在整個這申請案中,參考數個專利及參考案。這些專利及參考案之揭露全部在此加入這申請案為參考。 Throughout this application, reference is made to several patents and references. The disclosures of these patents and references are incorporated herein by reference.

發明領域 Field of invention

本發明係有關於電發光設備及系統且,更詳而言之,使用至少一單晶片或多晶片發光二極體(“LED”),用於發光二極體之多數背反射收集光學元件,及提高由該發光二極體產生之熱的散逸效率同時將光阻擋及眩光減至最少之一改良散熱器安裝裝置。 The present invention relates to electroluminescent devices and systems and, more particularly, to at least one single-wafer or multi-wafer light-emitting diode ("LED") for use in most back-reflecting collection optics of light-emitting diodes, And improving the heat sinking efficiency of the light-emitting diode while minimizing light blocking and glare to improve the heat sink mounting device.

發明背景 Background of the invention

多年來,人們已使用傳統白熾或螢光發光裝置以解決他們的室內發光問題。但是,這些發光裝置具有多數缺點。例如,普遍之AR111鹵素裝置具有以下缺點-非常高功率消 耗,由於其金屬屏蔽放在該鹵素燈泡之視線上造成光分散之低效率,及其防止來自該鹵素燈泡之眩光的有限有效性。 For many years, traditional incandescent or fluorescent lighting devices have been used to solve their indoor lighting problems. However, these illuminating devices have most of the disadvantages. For example, the popular AR111 halogen device has the following disadvantages - very high power consumption It is inefficient because of the metal shield placed on the line of sight of the halogen bulb, and its limited effectiveness in preventing glare from the halogen bulb.

最近,已設計多數發光二極體發光裝置來取代該AR111鹵素裝置,以及其他傳統白熾或螢光發光裝置。通常,在這些發光二極體發光裝置中,該等發光二極體光源係設置在一反射器之中心且其光由該反射器向外放射。此外,有例如PAR38等多數發光二極體發光裝置,其使用多數發光二極體且它們的光由一或多個反射器向外放射。這些構態無法實現窄光束角,且由於沒有屏障隔開觀看者與該發光二極體光源,所以會造成相當大之眩光。又,這些構態無效率地散布熱;因此,實際上無法在這些構形中利用高功率之發光二極體。 Recently, most light-emitting diode lighting devices have been designed to replace the AR111 halogen device, as well as other conventional incandescent or fluorescent lighting devices. Generally, in these light-emitting diode light-emitting devices, the light-emitting diode light sources are disposed at the center of a reflector and their light is radiated outward from the reflector. In addition, there are many light-emitting diode light-emitting devices such as PAR38, which use a plurality of light-emitting diodes and their light is radiated outward by one or more reflectors. These configurations fail to achieve a narrow beam angle, and because there is no barrier separating the viewer from the light source, this can cause considerable glare. Moreover, these configurations dissipate heat inefficiently; therefore, it is practically impossible to utilize high power light-emitting diodes in these configurations.

為了解決這些問題,已揭露另外之發光二極體發光裝置,其使用一鏡子或反射表面以將光朝該發光二極體光源之方向反射回來。請參見,例如,McCullough等人之名稱為“具有一熱管之發光二極體反射器總成(Light-Emitting Diode Reflector Assembly Having a Heat Pipe)”之美國專利第6,976,769號,Jacobson等人之名稱為“背反射發光二極體光源(Back-Reflecting LED Light Source)”之美國專利第7,246,921號,及Magna International公司之名稱為“用於固態汽車發光之熱管理系統(Thermal Management System for Solid State Automotive Lighting)”之PCT國際公報第WO 2006/033998號。 In order to solve these problems, another light-emitting diode light-emitting device has been disclosed which uses a mirror or a reflective surface to reflect light back toward the light-emitting diode source. See, for example, U.S. Patent No. 6,976,769 to McCullough et al., entitled "Light-Emitting Diode Reflector Assembly Having a Heat Pipe," Jacobson et al. "Back-Reflecting LED Light Source" is US Patent No. 7,246,921, and Magna International is entitled "Thermal Management System for Solid State Automotive Lighting". PCT International Gazette No. WO 2006/033998.

發明概要 Summary of invention

由以上可知,需要進一步改良該技術。詳而言之,需要一種發光二極體發光裝置,其消除或減少眩光,且具有提高由該發光二極體(例如一高功率發光二極體)產生之熱之散逸效率同時減少該光徑之阻礙及在這總成中所需之組件數目的一改良緊緻導熱總成。 From the above, it is necessary to further improve the technique. In detail, there is a need for a light-emitting diode light-emitting device that eliminates or reduces glare and has the effect of increasing the dissipation efficiency of heat generated by the light-emitting diode (eg, a high-power light-emitting diode) while reducing the light path. An improved compact thermally conductive assembly that hinders and the number of components required in the assembly.

依據本發明之一態樣,一種發光裝置包含:一主殼體;一反射器,其設置在該主殼體內,且該反射器具有一前側及一後側;一導熱體,其包含至少兩熱管,其中該等至少兩熱管之一第一部份係定位成平行於該發光裝置之一中心軸且在該反射器之前側上,且該等至少兩熱管之各熱管之一第二部份係在該反射器之後側中且係與該主殼體熱耦接;一導熱頭,其設置在該反射器之前側上,且係與該導熱體熱耦接;至少兩發光二極體,其與該導熱頭及該導熱體熱耦接,且該等至少兩發光二極體係定位成面向該反射器之前側使得由該等至少兩發光二極體發射之光被導引至該反射器之前側。 According to an aspect of the present invention, a light-emitting device includes: a main casing; a reflector disposed in the main casing, the reflector having a front side and a rear side; and a heat conductor including at least two heat pipes The first portion of the at least two heat pipes is positioned parallel to a central axis of the light-emitting device and on the front side of the reflector, and the second portion of each of the heat pipes of the at least two heat pipes In a rear side of the reflector and thermally coupled to the main housing; a heat conducting head disposed on a front side of the reflector and thermally coupled to the heat conductor; at least two light emitting diodes, Thermally coupled to the heat conducting head and the heat conductor, and the at least two light emitting diode systems are positioned to face the front side of the reflector such that light emitted by the at least two light emitting diodes is directed to the reflector side.

依據本發明之另一態樣,該等至少兩熱管係實質J形,L形,或其組合。 According to another aspect of the invention, the at least two heat pipes are substantially J-shaped, L-shaped, or a combination thereof.

依據本發明之另一態樣,該導熱體提供一供熱由該等至少兩發光二極體向主殼體流動之通路。 According to another aspect of the present invention, the heat conductor provides a passage for heat to flow from the at least two light emitting diodes to the main casing.

依據本發明之另一態樣,該反射器具有至少兩中心光軸。 According to another aspect of the invention, the reflector has at least two central optical axes.

依據本發明之另一態樣,該導熱體之一端係與該等至 少兩發光二極體熱耦接,且該導熱體之另一端係與該主殼體熱耦接。 According to another aspect of the present invention, one end of the heat conductor is the same as The two light emitting diodes are thermally coupled, and the other end of the heat conductor is thermally coupled to the main housing.

依據本發明之另一態樣,該反射器係呈一對稱或非對稱形狀。 According to another aspect of the invention, the reflector is in a symmetrical or asymmetrical shape.

依據本發明之另一態樣,該主殼體係實質截頭錐形,圓柱形或立方體形,且係由一導熱材料構成。 According to another aspect of the invention, the main housing is substantially frustoconical, cylindrical or cubic in shape and is constructed of a thermally conductive material.

依據本發明之另一態樣,該主殼體包含一或多個散熱鰭片。 According to another aspect of the invention, the main housing includes one or more heat dissipation fins.

依據本發明之另一態樣,該發光裝置更包含一與該主殼體耦接之塑膠殼體;及一與該塑膠殼體耦接之燈座。 According to another aspect of the present invention, the light emitting device further includes a plastic housing coupled to the main housing; and a socket coupled to the plastic housing.

依據本發明之另一態樣,該燈座是一E26燈座,一GU10燈座,一E27燈座,或一GU24燈座。 According to another aspect of the invention, the lamp holder is an E26 lamp holder, a GU10 lamp holder, an E27 lamp holder, or a GU24 lamp holder.

依據本發明之另一態樣,該發光裝置更包含相對於該發光裝置之中心軸被定位在0度至120度之範圍內的該等至少兩發光二極體。 According to another aspect of the present invention, the light emitting device further includes the at least two light emitting diodes positioned within a range of 0 to 120 degrees with respect to a central axis of the light emitting device.

依據本發明之另一態樣,該導熱頭具有一三角形側輪廓或一不規則六邊形側輪廓,且具有分別用於該等至少兩發光二極體之至少兩安裝區域。 According to another aspect of the invention, the thermally conductive head has a triangular side profile or an irregular hexagonal side profile and has at least two mounting areas for the at least two light emitting diodes, respectively.

依據本發明之另一態樣,該導熱頭係由鋁,銅,或其組合構成。 According to another aspect of the invention, the thermally conductive head is constructed of aluminum, copper, or a combination thereof.

依據本發明之另一態樣,該發光裝置更包含一與該等至少兩發光二極體及該導熱頭耦接之印刷電路板(PCB)。 According to another aspect of the present invention, the light emitting device further includes a printed circuit board (PCB) coupled to the at least two light emitting diodes and the heat conducting head.

依據本發明之另一態樣,該發光裝置包含:一主殼體,其具有一大致截頭錐形;一反射器,其設置在該主殼體內, 且該反射器具有一前側,一後側及至少兩中心光軸;一導熱體,其包含至少兩實質J形熱管,其中該等至少兩實質J形熱管之一第一部份係呈桿狀且設置在該反射器之前側,並且與設置在或靠近該發光裝置之一中心軸之一導熱頭耦接,且該等至少兩實質J形熱管之一第二部份透過在或靠近該發光裝置之該中心軸之一開口穿過該反射器,且該等至少兩實質J形熱管之一第三部份係彎曲的並且該第三部份之至少一部份係與該主殼體耦接;及至少兩發光二極體,其與該導熱頭熱耦接且定位成相對該發光裝置之一中心軸以一傾斜角面向該反射器之前側使得由該等至少兩發光二極體發射之光被導引至該反射器之前側。 According to another aspect of the present invention, the illuminating device comprises: a main housing having a substantially frustoconical shape; and a reflector disposed in the main housing The reflector has a front side, a rear side and at least two central optical axes; a heat conductor comprising at least two substantially J-shaped heat pipes, wherein the first part of the at least two substantially J-shaped heat pipes is rod-shaped and Provided on a front side of the reflector and coupled to a heat conducting head disposed at or near a central axis of the light emitting device, and the second portion of the at least two substantially J-shaped heat pipes is transmitted at or near the light emitting device One of the central axes is open through the reflector, and one of the at least two substantially J-shaped heat pipes is curved and at least a portion of the third portion is coupled to the main housing And at least two light emitting diodes thermally coupled to the heat conducting head and positioned to face the front side of the reflector at an oblique angle with respect to a central axis of the light emitting device such that the at least two light emitting diodes are emitted Light is directed to the front side of the reflector.

依據本發明之另一態樣,該發光裝置更包含一與該導熱頭耦接之防眩光蓋。 According to another aspect of the invention, the illumination device further includes an anti-glare cover coupled to the thermal head.

圖式簡單說明 Simple illustration

為了說明本發明,該等圖式反映一目前較佳之形式;但是應了解的是本發明不限於由該等圖式所示之精確形式,其中:第1圖是由依據本發明之一態樣之一發光裝置之頂側觀看之立體圖;第2圖是由第1圖所示之發光裝置之底側觀看之立體圖;第3圖是由第3圖所示之發光裝置之底側觀看之“X光”圖;第4圖是由第1圖所示之發光裝置之頂側觀看之橫截面 立體圖;第5圖是由第1圖所示之發光裝置之底側觀看之橫截面立體圖;第6圖是第1圖所示之發光裝置之橫截面圖;第7圖是一習知熱管之橫截面圖(來自http://en.wikipedia.org/wiki/Image:Heat_Pipe_Mechanism.png);第8圖是依據本發明另一態樣之一發光裝置的立體圖;第9圖是由第8圖所示之發光裝置之底側觀看的立體圖;第10圖是第8圖所示之發光裝置的橫截面立體圖;第11圖是由第8圖所示之發光裝置的另一橫截面立體圖;第12圖是第8圖所示之發光裝置的分解立體圖;第13圖是第8圖所示之發光裝置的分解橫截面圖;第14圖是依據本發明之一態樣之具有直接耦接於其上之一發光二極體之一導熱體(經包覆之熱管)的立體圖;第15圖是依據本發明之另一態樣之具有直接耦接於其上之一發光二極體之一導熱體(未包覆之熱管)的立體圖;第16圖是依據本發明之另一態樣之一發光裝置(包括一S形導熱體)的立體圖;第17圖是第16圖所示之發光裝置之側視圖;第18圖是第16圖所示之發光裝置之橫截面立體圖;第19圖是第16圖所示之發光裝置之頂緣及一安裝裝置 (包括一金屬包覆層,一S形導熱體,一安裝平台,一安裝板,及一發光二極體)的分解立體圖;第20圖是由第16圖所示之發光裝置之頂側(沒有一玻璃蓋)觀看之立體圖;第21圖是由依據本發明之另一態樣之一發光裝置之頂側觀看之立體圖;第22圖是由第21圖所示之發光裝置之頂側觀看之分解立體圖;第23圖是第21圖所示之發光裝置的分解橫截面圖;第24圖是第21圖所示之發光裝置的橫截面圖;第25圖是第21圖所示之發光裝置的另一橫截面圖;第26圖是第21圖所示之發光裝置的橫截面圖;第27圖是由第21圖所示之發光裝置之底側觀看之立體圖;第28圖是依據本發明另一態樣之一發光裝置的立體圖;第29圖是由第28圖所示之發光裝置之底側觀看之立體圖;第30圖是第28圖所示之發光裝置的側視圖;及第31圖是第28圖所示之發光裝置的橫截面立體圖。 The drawings are intended to be illustrative of the present invention, but it is understood that the invention is not limited to the precise forms shown in the drawings, wherein: FIG. 1 is in accordance with an aspect of the invention. A perspective view of a top side of the light-emitting device; a second view of the light-emitting device shown in FIG. 1; and a third view of the bottom side of the light-emitting device shown in FIG. X-ray" diagram; Figure 4 is a cross-section viewed from the top side of the illumination device shown in Figure 1. 3 is a cross-sectional perspective view of the light-emitting device shown in FIG. 1; FIG. 6 is a cross-sectional view of the light-emitting device shown in FIG. 1; and FIG. 7 is a conventional heat pipe; Cross-sectional view (from http://en.wikipedia.org/wiki/Image:Heat_Pipe_Mechanism.png); Figure 8 is a perspective view of a light-emitting device according to another aspect of the present invention; Figure 9 is from Figure 8. 3 is a perspective view of a light-emitting device shown in FIG. 8; and FIG. 11 is another perspective view of the light-emitting device shown in FIG. 8; 12 is an exploded perspective view of the light-emitting device shown in FIG. 8; FIG. 13 is an exploded cross-sectional view of the light-emitting device shown in FIG. 8; and FIG. 14 is a direct coupling of the light-emitting device according to an aspect of the present invention. A perspective view of a heat conductor (coated heat pipe) of one of the light emitting diodes; and FIG. 15 is a view of one of the light emitting diodes directly coupled thereto according to another aspect of the present invention; A perspective view of a heat conductor (uncoated heat pipe); Fig. 16 is a light emitting device according to another aspect of the present invention Fig. 17 is a side view of the light-emitting device shown in Fig. 16; Fig. 18 is a cross-sectional perspective view of the light-emitting device shown in Fig. 16; and Fig. 19 is the 16th The top edge of the illuminating device shown in the figure and a mounting device (Decomposed perspective view of a metal cladding layer, an S-shaped heat conductor, a mounting platform, a mounting plate, and a light-emitting diode); FIG. 20 is a top side of the light-emitting device shown in FIG. FIG. 21 is a perspective view of a top side of a light-emitting device according to another aspect of the present invention; and FIG. 22 is a top view of the light-emitting device shown in FIG. 21. 23 is an exploded cross-sectional view of the light-emitting device shown in FIG. 21; FIG. 24 is a cross-sectional view of the light-emitting device shown in FIG. 21; and FIG. 25 is a light-emitting view shown in FIG. Another cross-sectional view of the device; Fig. 26 is a cross-sectional view of the light-emitting device shown in Fig. 21; and Fig. 27 is a perspective view of the bottom side of the light-emitting device shown in Fig. 21; A perspective view of a light-emitting device according to another aspect of the present invention; FIG. 29 is a perspective view of the light-emitting device shown in FIG. 28; and FIG. 30 is a side view of the light-emitting device shown in FIG. Figure 31 is a cross-sectional perspective view of the light-emitting device shown in Figure 28.

發明之詳細說明 Detailed description of the invention

如第1-6圖所示,且依據本發明之一態樣,一發光裝置1具有與一頂緣3耦接之一反射器4,其中該頂緣3係與一導 熱體2耦接。該導熱體2包含被一包覆層9包覆之一熱管8,及設置在相對地面向該反射器4前側之該導熱體2之一側上的一安裝平台5。如第3圖所示,一發光二極體6係與一金屬核心印刷電路板(“PCB”)7,且該印刷電路板7再與該安裝平台5耦接。該安裝平台5係以一方式成形(在本發明之這態樣中,是圓形)使得它提供相對現有發光裝置更多對該發光二極體之非眩光保護。 As shown in Figures 1-6, and in accordance with one aspect of the present invention, a light-emitting device 1 has a reflector 4 coupled to a top edge 3, wherein the top edge 3 is coupled to a guide The hot body 2 is coupled. The heat conductor 2 comprises a heat pipe 8 covered by a cladding layer 9 and a mounting platform 5 disposed on one side of the heat conductor 2 facing the front side of the reflector 4. As shown in FIG. 3, a light-emitting diode 6 is connected to a metal core printed circuit board ("PCB") 7, and the printed circuit board 7 is coupled to the mounting platform 5. The mounting platform 5 is shaped in a manner (in this aspect of the invention, circular) such that it provides more non-glare protection of the LED than the prior art illumination device.

在本發明之這態樣中,該發光二極體6係設置在該反射器4之一中心光軸300上方或靠近該中心光軸300,且係定位成使得由該發光二極體6發射之光實質地或完全地被引導至該反射器4之前側;因此,如第6圖所示,使該反射器4可收集及準直由發光二極體6發射之光,且反射該準直光遠離該反射器4並且通過發光二極體6及該導熱體2。由於其扁平、狹窄之構造,該導熱體2遮斷非常少之來自反射器4之存在反射準直光。如第3圖所示,該導熱體2之扁平、狹窄之構造產生一相對來自該反射器4之存在反射準直光的小橫截面10。 In this aspect of the invention, the light-emitting diode 6 is disposed above or near the central optical axis 300 of the reflector 4 and is positioned such that it is emitted by the light-emitting diode 6. The light is substantially or completely guided to the front side of the reflector 4; therefore, as shown in Fig. 6, the reflector 4 can be used to collect and collimate the light emitted by the light-emitting diode 6, and reflect the light The direct light is remote from the reflector 4 and passes through the light-emitting diode 6 and the heat conductor 2. Due to its flat, narrow configuration, the thermal conductor 2 blocks very little of the reflected collimated light from the reflector 4. As shown in Fig. 3, the flat, narrow configuration of the thermal conductor 2 produces a small cross-section 10 that reflects the collimated light relative to the presence of the reflector 4.

在本發明之這態樣中,由該發光二極體6產生之熱沿以下熱路徑移動通過該發光裝置:金屬核心印刷電路板7,安裝平台5,包覆層9,熱管8,包覆層9,及頂緣3與反射器4。由該發光二極體6產生之熱亦移動通過金屬核心印刷電路板7,安裝平台5,包覆層9,熱管8,及頂緣3與反射器4。該頂緣3及反射器4作為散熱器。 In this aspect of the invention, the heat generated by the light-emitting diode 6 moves through the light-emitting device along the following thermal path: the metal core printed circuit board 7, the mounting platform 5, the cladding layer 9, the heat pipe 8, and the cladding Layer 9, and top edge 3 and reflector 4. The heat generated by the light-emitting diode 6 also moves through the metal core printed circuit board 7, the mounting platform 5, the cladding layer 9, the heat pipe 8, and the top edge 3 and the reflector 4. The top edge 3 and the reflector 4 act as a heat sink.

本發明之另一態樣係顯示在第8-13圖中。詳而言之, 該發光裝置50包含與一頂緣52耦接之一反射器53,其中該頂緣52係與一導熱體51耦接。該導熱體51包含被一包覆層59包覆之一熱管56,及設置在相對地面向該反射器53之該導熱體51之一側上的一安裝平台54。如第11圖所示,該發光二極體55係與一金屬核心印刷電路板60,且該金屬核心印刷電路板60再與該安裝平台54耦接。 Another aspect of the invention is shown in Figures 8-13. In detail, The illuminating device 50 includes a reflector 53 coupled to a top edge 52, wherein the top edge 52 is coupled to a heat conductor 51. The heat conductor 51 includes a heat pipe 56 covered by a cladding layer 59, and a mounting platform 54 disposed on one side of the heat conductor 51 opposite to the reflector 53. As shown in FIG. 11, the light-emitting diode 55 is coupled to a metal core printed circuit board 60, and the metal core printed circuit board 60 is coupled to the mounting platform 54.

本發明之這態樣包括一主殼體57,且該主殼體57具有一或多個用以使表面積達到最大之散熱鰭片58,增加其散熱容量。該頂緣52,反射器53,及該主殼體57作為散熱器,且該主殼體57作為主要散熱器。 This aspect of the invention includes a main housing 57 having one or more heat sink fins 58 for maximizing surface area to increase its heat dissipation capacity. The top edge 52, the reflector 53, and the main housing 57 act as a heat sink, and the main housing 57 serves as a main heat sink.

如第10與11圖所示,該主殼體57係與一反射邊緣63耦接。在該反射器53與該主殼體57之間有一空氣間隙62,如第10與11圖所示。空氣間隙62之尺寸可以依據該反射器53之尺寸改變。由該發光二極體55產生之熱移動通過一包括移動通過金屬核心印刷電路板60,安裝平台54,包覆層59,熱管56,包覆層59,及頂緣52,反射器53與主殼體57之熱路徑。該熱亦可移動通過金屬核心印刷電路板60,安裝平台54,包覆層59,熱管56,及反射器53,反射器53與主殼體57。 As shown in Figures 10 and 11, the main housing 57 is coupled to a reflective edge 63. There is an air gap 62 between the reflector 53 and the main casing 57, as shown in Figs. The size of the air gap 62 may vary depending on the size of the reflector 53. The heat generated by the light-emitting diode 55 moves through a structure including moving through the metal core printed circuit board 60, the mounting platform 54, the cladding layer 59, the heat pipe 56, the cladding layer 59, and the top edge 52, the reflector 53 and the main The thermal path of the housing 57. The heat can also be moved through the metal core printed circuit board 60, the mounting platform 54, the cladding 59, the heat pipe 56, and the reflector 53, the reflector 53 and the main housing 57.

本發明之另一態樣係顯示在第18-20圖中。在此,該發光裝置500包括一主殼體501;一反射器502,其具有一前側及一後側;一頂緣503,其與該主殼體501耦接;一導熱體1000,其定位在該反射器502之前側且與該頂緣503耦接;一發光二極體504,其係定位成直接面向該反射器502之前 側使得由該發光二極體504之光實質上或完全地被導引至該反射器502之前側。 Another aspect of the invention is shown in Figures 18-20. Here, the illuminating device 500 includes a main housing 501; a reflector 502 having a front side and a rear side; a top edge 503 coupled to the main housing 501; a thermal conductor 1000 positioned On the front side of the reflector 502 and coupled to the top edge 503; a light emitting diode 504 positioned to face the reflector 502 directly The side causes light from the light emitting diode 504 to be substantially or completely guided to the front side of the reflector 502.

如第19圖所示,該導熱體1000係實質S形且包括一桿狀或實質桿狀之中間部份1001;及由該中間部份1001之各端延伸之彎曲翼部1002與1003。如第20圖所示,彎曲翼部1002與1003係與該頂緣503耦接,其中該頂緣503具有槽孔520、521,且該等槽孔520、521允許該等彎曲翼部1002與1003分別嵌合在該等槽孔520、521內;因此,允許該導熱體1000與該頂緣503耦接。該導熱體1000及該頂緣503亦可透過焊接,熱環氧樹脂或被用來耦接該導熱體1000與該頂緣503之所屬技術領域中習知的方法耦接。 As shown in Fig. 19, the heat conductor 1000 is substantially S-shaped and includes a rod-shaped or substantially rod-shaped intermediate portion 1001; and curved wings 1002 and 1003 extending from respective ends of the intermediate portion 1001. As shown in Fig. 20, the curved wings 1002 and 1003 are coupled to the top edge 503, wherein the top edge 503 has slots 520, 521, and the slots 520, 521 allow the curved wings 1002 to 1003 is respectively fitted in the slots 520, 521; therefore, the heat conductor 1000 is allowed to be coupled to the top edge 503. The heat conductor 1000 and the top edge 503 can also be coupled by soldering, a thermal epoxy or a method that is coupled to the thermal conductor 1000 and is well known in the art to the top edge 503.

該導熱體1000包括一定位成靠近或在該反射器502之中心光軸之安裝平台530,及一耦接在該安裝平台530與發光二極體504之間的安裝板531。該導熱體1000亦包括一熱管,且該熱管係設置在該中間部份1001及/或該等彎曲翼部1002與1003中之一者或兩者上。 The heat conductor 1000 includes a mounting platform 530 positioned adjacent to or at a central optical axis of the reflector 502, and a mounting plate 531 coupled between the mounting platform 530 and the LED 504. The heat conductor 1000 also includes a heat pipe disposed on one or both of the intermediate portion 1001 and/or the curved wings 1002 and 1003.

一金屬包覆層550可與該導熱體1000耦接。例如,如第19圖所示,該導熱體1000之一相當大部份係與該金屬包覆層550耦接。該金屬包覆層550可被用來固定及導引由該頂緣503沿該導熱體1000之中間部份1001延伸至該發光二極體504之電纜或電線,且係由例如不鏽鋼,鋁,銅或任何其他高導熱材料之一導熱材料構成。 A metal cladding layer 550 can be coupled to the thermal conductor 1000. For example, as shown in FIG. 19, a substantial portion of the thermal conductor 1000 is coupled to the metal cladding layer 550. The metal cladding layer 550 can be used to fix and guide a cable or wire extending from the top edge 503 along the intermediate portion 1001 of the heat conductor 1000 to the light emitting diode 504, and is made of, for example, stainless steel, aluminum, Made of copper or any other highly thermally conductive material.

如第18圖所示,本發明可包括一玻璃蓋800,且該玻璃蓋800係與該頂緣503及一蓋緣509耦接。該玻璃蓋800至少 保護該反射器502,該導熱體1000,該安裝平台530,該安裝板531及發光二極體504不受例如水及灰塵之環境危害影響。該玻璃蓋亦可與在第1-6及8-13圖中所述之多數本發明態樣一起使用。 As shown in FIG. 18, the present invention can include a glass cover 800 coupled to the top edge 503 and a cover edge 509. The glass cover 800 is at least The reflector 502 is protected, the heat conductor 1000, the mounting platform 530, the mounting plate 531 and the light emitting diode 504 are not affected by environmental hazards such as water and dust. The cover glass can also be used with most of the aspects of the invention described in Figures 1-6 and 8-13.

本發明亦可包括一與該主殼體501之底端耦接之塑膠殼體700,及一與該塑膠殼體700耦接之燈座701(例如,一E26燈座、一GU10燈座、一E27燈座、一GU24燈座)。 The present invention can also include a plastic housing 700 coupled to the bottom end of the main housing 501, and a socket 701 coupled to the plastic housing 700 (eg, an E26 socket, a GU10 socket, An E27 lamp holder, a GU24 lamp holder).

本發明之另一態樣係顯示在第21-27圖中。詳而言之,該發光裝置1200包括:一主殼體1300,一反射器1800,其具有一前側及一後側;一導熱頭1500,其設置在該反射器1800之前側且與一導熱體1600熱耦接,其中該導熱體1600係定位成平行於該裝置之一中心軸(“中心軸2000”)且在該反射器1800之前側上,且延伸穿過該反射器1800之一開口1850並到達該反射器1800之後側,並且與該主殼體1300熱耦接;至少兩發光二極體5000、5001,其與該導熱頭1500熱耦接且定位成以一相對於該中心軸2000之傾斜角或直接面向該反射器之方式面向反射器1800之前側。該等發光二極體5000、5001可以相對該中心軸2000定位在0度(垂直向下面向該反射器且平行於該中心軸2000)至120度之範圍內。 Another aspect of the invention is shown in Figures 21-27. In detail, the illuminating device 1200 includes a main casing 1300, a reflector 1800 having a front side and a rear side, and a heat conducting head 1500 disposed on the front side of the reflector 1800 and coupled to a heat conductor. 1600 thermally coupled, wherein the thermal conductor 1600 is positioned parallel to a central axis of the device ("central axis 2000") and on a front side of the reflector 1800 and extends through an opening 1850 of the reflector 1800 And reaching the rear side of the reflector 1800 and thermally coupled to the main housing 1300; at least two light emitting diodes 5000, 5001 thermally coupled to the thermal head 1500 and positioned with respect to the central axis 2000 The angle of inclination or directly facing the reflector faces the front side of the reflector 1800. The light emitting diodes 5000, 5001 can be positioned at 0 degrees (vertically facing the reflector and parallel to the central axis 2000) to 120 degrees with respect to the central axis 2000.

該發光裝置1200亦包括一防眩光蓋1700,且該防眩光蓋1700係與該導熱頭1500耦接並且覆蓋該等發光二極體5000、5001之至少一部份。如第25與28圖所示,該防眩光蓋具有覆蓋該等至少兩發光二極體5000、5001之至少一部 份的至少兩唇部1700a、1700b。藉此,該防眩光蓋有助於減少由直接觀看該等至少兩發光二極體5000、5001造成之直接眩光。該防眩光蓋亦重新導引由該至少兩發光二極體5000、5001發射之光至該反射器1800。 The illuminating device 1200 also includes an anti-glare cover 1700, and the anti-glare cover 1700 is coupled to the thermal head 1500 and covers at least a portion of the illuminating diodes 5000, 5001. As shown in FIGS. 25 and 28, the anti-glare cover has at least one portion covering the at least two light-emitting diodes 5000, 5001 At least two lips 1700a, 1700b. Thereby, the anti-glare cover helps to reduce direct glare caused by directly viewing the at least two light-emitting diodes 5000, 5001. The anti-glare cover also redirects light emitted by the at least two LEDs 5000, 5001 to the reflector 1800.

如第21與26圖所示,該反射器1800具有至少兩中心光軸,其中各中心光軸係以一產生至少30度之光束角的方式定位。該反射器1800具有產生多數相同及重疊光束之至少兩獨立光學系統(請參見第26圖)。這反射器1800具有2至60度光束半峰全幅值(“FWHM”)。 As shown in Figures 21 and 26, the reflector 1800 has at least two central optical axes, wherein each central optical axis is positioned in a manner that produces a beam angle of at least 30 degrees. The reflector 1800 has at least two independent optical systems that produce a plurality of identical and overlapping beams (see Figure 26). This reflector 1800 has a half-peak full amplitude ("FWHM") of the beam of 2 to 60 degrees.

導熱頭1500可具有一三角形或不規則六邊形側輪廓,且具有可分別直接或間接地與其耦接之至少兩安裝區域1530a、1530b。該導熱頭1500係由例如鋁,銅,任何其他高導熱材料,或其組合之一導熱材料構成。 The thermal head 1500 can have a triangular or irregular hexagonal side profile and have at least two mounting regions 1530a, 1530b that can be coupled directly or indirectly thereto. The thermal head 1500 is constructed of a thermally conductive material such as aluminum, copper, any other highly thermally conductive material, or a combination thereof.

如第22,24與25圖所示,該導熱體1600包含與該等至少兩發光二極體5000、5001,導熱頭1500及主殼體1300熱耦接之至少兩熱管1601a、1601b。主殼體1300具有一槽孔1900,且熱管1601a、1601b嵌合在該槽孔1900內;因此,允許該等熱管1601a、1601b與該主殼體1300耦接。該等熱管1601a、1601b可成形為使由該等至少兩發光二極體5000、5001至該主殼體1300之熱傳導及傳送效率最佳化。例如,如第24圖所示,該等熱管1601a、1601b呈一實質J形。該等熱管1601a、1601b亦可呈一實質L形,一實質T形,或其組合。 As shown in Figures 22, 24 and 25, the heat conductor 1600 includes at least two heat pipes 1601a, 1601b thermally coupled to the at least two light emitting diodes 5000, 5001, the heat conducting head 1500 and the main casing 1300. The main housing 1300 has a slot 1900 in which the heat pipes 1601a, 1601b are fitted; thus, the heat pipes 1601a, 1601b are allowed to couple with the main housing 1300. The heat pipes 1601a, 1601b can be shaped to optimize heat transfer and transfer efficiency from the at least two light emitting diodes 5000, 5001 to the main casing 1300. For example, as shown in Fig. 24, the heat pipes 1601a, 1601b have a substantially J shape. The heat pipes 1601a, 1601b may also have a substantially L shape, a substantially T shape, or a combination thereof.

在本發明之這態樣中,由該等至少兩發光二極體 5000、5001產生之熱沿以下熱路徑移動通過該發光裝置1200:導熱頭1500,導熱體1600,及反射器1800與主殼體1300。該反射器1800及主殼體1300作為散熱器。 In this aspect of the invention, the at least two light emitting diodes The heat generated by 5000, 5001 moves through the illumination device 1200 along the following thermal path: thermal head 1500, thermal conductor 1600, and reflector 1800 and main housing 1300. The reflector 1800 and the main casing 1300 serve as a heat sink.

本發明之另一態樣係顯示在第28-31圖中。在此,該發光裝置8000包括發光裝置1200,其中該主殼體1300之一端係與一塑膠殼體700耦接,且該塑膠殼體700與一燈座701(例如,一E26燈座、一GU10燈座、一E27燈座、一GU24燈座)耦接。該塑膠殼體700包含多數主電路板,且電絕緣這些主電路板與該主殼體1300。 Another aspect of the invention is shown in Figures 28-31. The illuminating device 8000 includes a illuminating device 1200, wherein one end of the main housing 1300 is coupled to a plastic housing 700, and the plastic housing 700 is coupled to a socket 701 (eg, an E26 socket, GU10 lamp holder, an E27 lamp holder, and a GU24 lamp holder are coupled. The plastic housing 700 includes a plurality of main circuit boards and electrically insulates the main circuit boards from the main housing 1300.

第21-31圖所示之本發明之優點中之一優點是它藉由少由一延伸通過該反射器之前側之導熱體造成的光阻礙使光效率最佳化。此外,由於該導熱體1600包含可將更多熱由該等發光二極體5000、5001導引至該反射器1800及主殼體1300之至少兩熱管1601a、1601b,所以導熱體1600可應付比導熱體2、51、1000高之熱功率。 One of the advantages of the present invention shown in Figures 21-31 is that it optimizes light efficiency by less obstructing light by a heat conductor extending through the front side of the reflector. In addition, since the heat conductor 1600 includes at least two heat pipes 1601a and 1601b that can guide more heat from the light-emitting diodes 5000 and 5001 to the reflector 1800 and the main casing 1300, the heat conductor 1600 can cope with the ratio. The thermal power of the heat conductors 2, 51, 1000 is high.

此外,一使用者可混合來自該等至少兩發光二極體5000、5001之顏色,且因此可選擇一較寬範圍顏色之光以發出該發光裝置1200、1800。 In addition, a user can mix colors from the at least two light emitting diodes 5000, 5001, and thus can select a wider range of colors of light to emit the light emitting devices 1200, 1800.

導熱體 Thermal conductor

如第4與11圖所示,該導熱體2、51包含被一包覆層9、59包覆之一熱管8、56,及設置在相對地面向該反射器4、53之該導熱體2、51之一側上的一安裝平台5、54。該包覆層9、59可由例如鋁,銅,石墨或鋅之導熱材料構成,且可包括一安裝平台5、54。該包覆層9、59可被用來增加該熱 管8、56之結構強度,協助將熱由該熱管8、56傳送及散布至該等散熱器,例如頂緣3、52,反射器4、53及主殼體57。 As shown in Figures 4 and 11, the heat conductors 2, 51 comprise a heat pipe 8, 56 covered by a cladding layer 9, 59, and the heat conductor 2 disposed opposite the reflectors 4, 53 , a mounting platform 5, 54 on one side of 51. The cladding layers 9, 59 may be constructed of a thermally conductive material such as aluminum, copper, graphite or zinc, and may include a mounting platform 5,54. The cladding layers 9, 59 can be used to increase the heat The structural strength of the tubes 8, 56 assists in transferring and distributing heat from the heat pipes 8, 56 to the heat sinks, such as the top edges 3, 52, the reflectors 4, 53 and the main housing 57.

如上所述,且如第19圖所示,該導熱體1000可與一金屬包覆層550耦接。金屬包覆層550覆蓋該導熱體1000之中間部份1001之一相當大部份,且被用來達成美化之目的,將電纜或電線固定在導熱體1000與金屬包覆層550之間,及/或將這些電纜或電線導引至該發光二極體504。該金屬包覆層550可由例如不鏽鋼,鋁,銅或任何其他高導熱材料之一導熱材料構成。 As described above, and as shown in FIG. 19, the heat conductor 1000 can be coupled to a metal cladding layer 550. The metal cladding layer 550 covers a substantial portion of the intermediate portion 1001 of the thermal conductor 1000 and is used for aesthetic purposes to secure a cable or wire between the thermal conductor 1000 and the metal cladding layer 550, and / Or direct these cables or wires to the light emitting diode 504. The metal clad layer 550 can be constructed of a thermally conductive material such as stainless steel, aluminum, copper, or any other highly thermally conductive material.

或者,如第14圖所示,該發光二極體91可以直接固定在一導熱體90上(透過包覆層93之安裝平台92)。 Alternatively, as shown in Fig. 14, the light-emitting diode 91 may be directly attached to a heat conductor 90 (through the mounting platform 92 of the cladding layer 93).

在本發明之另一態樣中,該熱管是未包覆的。例如,第15圖顯示一導熱體100,其中一發光二極體103耦接在一安裝平台102上,且該安裝平台102接著與一熱管101直接耦接。該安裝平台102可以是圓柱形,且可部份地或完全地包圍至少該熱管101之中心。 In another aspect of the invention, the heat pipe is uncoated. For example, FIG. 15 shows a heat conductor 100 in which a light emitting diode 103 is coupled to a mounting platform 102, and the mounting platform 102 is then directly coupled to a heat pipe 101. The mounting platform 102 can be cylindrical and can partially or completely surround at least the center of the heat pipe 101.

該熱管(例如熱管8、56、101、1601a、1601b)可由多孔銅構成,且該多孔銅具有充滿純水之大量空腔。如第7圖所示,在該熱管內之水在它吸收來自一熱源之熱能時蒸發成蒸氣。請參見第7圖中之400。接著該蒸發之水沿該蒸氣空腔遷移至該熱管之較冷段。請參見第7圖中之401。在此,該蒸氣快速地冷卻且冷凝回流體,且該流體被該芯材吸收,釋放熱能。請參見第7圖中之402。接著該流體沿該等內空腔返固該等受熱段(請參見第7圖中之403),且重覆上述 熱管熱循環。該熱管使用上述機構將熱能由該發光二極體傳送至散熱器,例如該頂緣3、52,反射器4、53、1800,及主殼體57、501、1300, The heat pipe (for example, the heat pipes 8, 56, 101, 1601a, 1601b) may be composed of porous copper, and the porous copper has a large number of cavities filled with pure water. As shown in Figure 7, the water in the heat pipe evaporates into a vapor as it absorbs heat from a heat source. See 400 in Figure 7. The evaporated water then migrates along the vapor cavity to the cooler section of the heat pipe. See 401 in Figure 7. Here, the vapor cools rapidly and condenses back to the fluid, and the fluid is absorbed by the core material, releasing thermal energy. See 402 in Figure 7. The fluid then reinforces the heated segments along the inner cavities (see 403 in Figure 7) and repeats the above Heat pipe thermal cycle. The heat pipe uses the above mechanism to transfer thermal energy from the light emitting diode to the heat sink, such as the top edge 3, 52, the reflector 4, 53, 1800, and the main casing 57, 501, 1300,

該熱管可以被壓扁(在一橫截面方向)成一薄帶以便減少光吸收。 The heat pipe can be flattened (in a cross-sectional direction) into a thin strip to reduce light absorption.

本發明之另一態樣包括具有一或多數熱管之一導熱體。對多數熱管而言,各熱管係與一中央轂部連接(類似在一輪上之輻條),且該中央轂部係定位在或靠近一反射器之中心光軸。該中央轂部作為用於一或多個發光二極體之一安裝平台,且係由例如例如鋁,銅或任何其他高導熱材料之導熱材料構成。 Another aspect of the invention includes a thermal conductor having one or more heat pipes. For most heat pipes, each heat pipe is coupled to a central hub (similar to a spoke on a wheel) and the central hub is positioned at or near the central optical axis of a reflector. The central hub serves as a mounting platform for one or more of the light emitting diodes and is constructed of a thermally conductive material such as, for example, aluminum, copper or any other highly thermally conductive material.

在本發明之另一態樣中,該導熱體向上延伸至或靠近一反射器之中心軸且只在一連接點(例如第1圖之連接點900或901,或第8圖之連接點910或911)與該頂緣耦接。因此,該導熱體未形成第1與8圖之頂緣的一弦或一直徑。在或靠近該反射器之中心軸,該導熱體包括具有與其直接耦接之一發光二極體之一安裝平台,或與一金屬核心印刷電路板或一安裝板耦接之一發光二極體,且該金屬核心印刷電路板或該安裝板再與該安裝平台耦接。本發明之這另一態樣減少由該導熱體造成之熱阻擋且改善透鏡效率,同時促進散熱及防眩光。 In another aspect of the invention, the heat conductor extends upwardly to or near a central axis of a reflector and is only at a connection point (e.g., connection point 900 or 901 of Figure 1, or connection point 910 of Figure 8). Or 911) coupled to the top edge. Therefore, the heat conductor does not form a string or a diameter of the top edges of the first and eighth figures. At or near the central axis of the reflector, the thermal conductor includes a mounting platform having one of the light emitting diodes directly coupled thereto, or a light emitting diode coupled to a metal core printed circuit board or a mounting board And the metal core printed circuit board or the mounting board is coupled to the mounting platform. This other aspect of the invention reduces the thermal barrier caused by the thermal conductor and improves lens efficiency while promoting heat dissipation and anti-glare.

該安裝平台5、54、102、530係由例如鋁,銅或任何其他高導熱材料之一導熱材料構成。又,如上所述,該安裝平台提供相對現有發光裝置對該發光二極體之較大非眩光 保護。在本發明中,由於(1)該發光二極體係耦接在該安裝平台上且定位成直接面向該反射器使得由該發光二極體發射之光實質上或完全地被導引至該反射器,及(2)該安裝平台係以一防止在任何視角直接觀看該發光二極體之方式成形(例如圓形),所以免除(或至少減少)來自該發光二極體之直接眩光之可能性。 The mounting platform 5, 54, 102, 530 is constructed of a thermally conductive material such as aluminum, copper or any other highly thermally conductive material. Moreover, as described above, the mounting platform provides a larger non-glare of the light-emitting diode relative to existing lighting devices. protection. In the present invention, since (1) the light emitting diode system is coupled to the mounting platform and positioned to face the reflector directly, light emitted by the light emitting diode is substantially or completely guided to the reflection. And (2) the mounting platform is shaped (eg, circular) in a manner that prevents direct viewing of the light emitting diode at any viewing angle, thereby eliminating (or at least reducing) the possibility of direct glare from the light emitting diode Sex.

反射器 reflector

該反射器4、53、502、1800係由例如鋁之一導熱材料構成,且作為一散熱器。或者,該反射器4、53、502、1800可以由例如塑膠之一非導熱材料構成。 The reflectors 4, 53, 502, 1800 are constructed of a thermally conductive material such as aluminum and serve as a heat sink. Alternatively, the reflectors 4, 53, 502, 1800 may be constructed of a non-thermally conductive material such as plastic.

如第6與26圖所示,由該等發光二極體6、5000、5001發射之光實質地或完全地被導向該反射器4、1800,其中該反射器4、1800將由該發光二極體6發射之光準直成一光束且以一特定光束角反射該光束。該光束角可在由2至60半峰全幅(“FWHM”)度之範圍內。為了消除或減少眩光,本發明之反射器4、1800係設計成實質地或完全地收集由該等發光二極體6、5000、5001發射之光且以消除(或至少減少)在一直接眩光區域(即,相對於垂直線大約45至85度)內之本發明之亮度的方式重新導引該光。 As shown in Figures 6 and 26, the light emitted by the light-emitting diodes 6, 5000, 5001 is substantially or completely directed to the reflectors 4, 1800, wherein the reflectors 4, 1800 will be illuminated by the light-emitting diodes The light emitted by body 6 is collimated into a beam and reflected at a particular beam angle. The beam angle can range from 2 to 60 full-width ("FWHM"). In order to eliminate or reduce glare, the reflectors 4, 1800 of the present invention are designed to substantially or completely collect light emitted by the light-emitting diodes 6, 5000, 5001 and to eliminate (or at least reduce) a direct glare The light is redirected in a manner that the brightness of the invention (i.e., about 45 to 85 degrees relative to the vertical line).

該反射器4、53、502、1800可採用各種形狀以實現各種光束模式。它可成形為任何錐形截面(例如,雙曲線、橢圓形或拋物線),單獨地或以各種組合使用,呈二維或三維形狀。此外,該反射器4、53、502、1800可對稱或非對稱。 The reflectors 4, 53, 502, 1800 can take a variety of shapes to achieve various beam modes. It can be shaped into any tapered section (eg, hyperbolic, elliptical or parabolic), either alone or in various combinations, in a two- or three-dimensional shape. Furthermore, the reflectors 4, 53, 502, 1800 can be symmetrical or asymmetrical.

發光二極體 Light-emitting diode

一發光二極體可以是具有一或多個晶片之一發光二極體模組。該發光二極體可以是一高功率發光二極體。在本發明中可使用一或多個發光二極體。 A light emitting diode can be a light emitting diode module having one or more wafers. The light emitting diode can be a high power light emitting diode. One or more light emitting diodes can be used in the present invention.

該發光二極體6、55、504係與一金屬核心印刷電路板7、60或一安裝板531耦接。或者,該發光二極體91、103係與安裝平台92與102耦接。相對於該等該等至少兩發光二極體5000、5001,這些發光二極體可與一接著與該導熱頭1500耦接之印刷電路板(金屬核心或以F4為基礎)耦接,或可耦接在該導熱頭1500上。 The LEDs 6, 55, 504 are coupled to a metal core printed circuit board 7, 60 or a mounting board 531. Alternatively, the light emitting diodes 91, 103 are coupled to the mounting platforms 92 and 102. The light emitting diodes may be coupled to a printed circuit board (metal core or F4 based) coupled to the thermal head 1500, or may be coupled to the at least two light emitting diodes 5000, 5001, or It is coupled to the thermal head 1500.

該發光二極體可焊接在一金屬核心印刷電路板,安裝板,或導熱頭上。熱糊,熱油脂,焊接,迴焊或在所屬技術領域中習知之任何焊接材料或技術可被用來將該發光二極體耦接在該金屬核心印刷電路板,安裝板,安裝平台,或導熱頭上。 The light emitting diode can be soldered to a metal core printed circuit board, a mounting board, or a thermal head. Hot paste, thermal grease, soldering, reflow soldering or any soldering material or technique known in the art can be used to couple the light emitting diode to the metal core printed circuit board, mounting board, mounting platform, or On the thermal head.

該等至少兩發光二極體5000、5001可為相同或不同顏色。令發光二極體5000、5001為不同顏色可容許顏色混合及改變。發光二極體5000、5001可產生2700K至5000K之色溫範圍。這些發光二極體5000、5001可藉由獨立控制發光二極體電流來程式化。電力供應及控制單元是必要的以容許這種顏色混合及改變。 The at least two light emitting diodes 5000, 5001 may be the same or different colors. The different colors of the light-emitting diodes 5000 and 5001 allow color mixing and change. The light-emitting diodes 5000, 5001 can produce a color temperature range of 2700K to 5000K. These LEDs 5000, 5001 can be programmed by independently controlling the LED current. Power supply and control units are necessary to allow for this color mixing and change.

金屬核心印刷電路板或安裝板 Metal core printed circuit board or mounting board

本發明包括一金屬核心印刷電路板(請參見第3與12圖所示之金屬核心印刷電路板7、60)。該金屬核心印刷電路板包括發光二極體電路,且作為一熱傳介質。例如,該金 屬核心印刷電路板包含一基底金屬板(銅或鋁,大約0.8至3mm厚),一介電層(積層在該基底金屬板之頂部,大約0.1mm厚),及一銅電路線路(印刷在介電層之頂部,大約0.05至0.2mm厚)。 The present invention includes a metal core printed circuit board (see metal core printed circuit boards 7, 60 shown in Figures 3 and 12). The metal core printed circuit board includes a light emitting diode circuit and functions as a heat transfer medium. For example, the gold The core printed circuit board comprises a base metal plate (copper or aluminum, approximately 0.8 to 3 mm thick), a dielectric layer (stacked on top of the base metal plate, approximately 0.1 mm thick), and a copper circuit trace (printed on The top of the dielectric layer is approximately 0.05 to 0.2 mm thick).

或者,如第15與16圖所示,一金屬核心印刷電路板不包括在本發明中以便進一步減少熱阻;因此,減少發光二極體接面溫度及增加最大發光二極體功率。 Alternatively, as shown in Figures 15 and 16, a metal core printed circuit board is not included in the present invention to further reduce thermal resistance; therefore, the junction temperature of the light emitting diode is reduced and the maximum light emitting diode power is increased.

或者,如第19圖所示,使用一安裝板531,其中該安裝板531係與該發光二極體504及該安裝平台530耦接。該安裝板係由例如銅或任何其他高導熱材料之一導熱材料構成,且大約0.8至3mm厚。所屬技術領域中習知之機械技術(例如螺絲)被用來耦接該安裝板及該安裝平台,且可在該安裝板與安裝平台之間使用一具有高導熱率之熱油脂或糊。 Alternatively, as shown in FIG. 19, a mounting plate 531 is used, wherein the mounting plate 531 is coupled to the LED 504 and the mounting platform 530. The mounting plate is constructed of a thermally conductive material such as copper or any other highly thermally conductive material and is approximately 0.8 to 3 mm thick. Mechanical techniques (e.g., screws) as known in the art are used to couple the mounting plate and the mounting platform, and a thermal grease or paste having a high thermal conductivity can be used between the mounting plate and the mounting platform.

頂緣及蓋緣 Top edge and cover edge

該頂緣3、52、503係由一例如鋁,銅或鋅或任何其他高導熱材料之一導熱材料構成。該頂緣3作為一主散熱器(例如,請參見第1圖),或,如頂緣52、503,作為一次要散熱器(例如,請參見第8與18圖)。 The top edge 3, 52, 503 is constructed of a thermally conductive material such as aluminum, copper or zinc or any other highly thermally conductive material. The top edge 3 acts as a primary heat sink (see, for example, Figure 1), or, as the top edge 52, 503, as a primary heat sink (see, for example, Figures 8 and 18).

如第16與18圖所示,本發明包括一有助於固定該玻璃蓋800與該頂緣503之蓋緣509。 As shown in Figures 16 and 18, the present invention includes a cover 509 that facilitates securing the glass cover 800 to the top edge 503.

主殼體,塑膠殼體及燈座 Main housing, plastic housing and lamp holder

該主殼體57、501、1300係由一例如鋁,銅或鋅或任何其他高導熱材料之一導熱材料構成。該主殼體57、501、1300作為一主散熱器(例如,請參見第8、17、23圖)。如第8、17、 23圖所示,該主殼體57、501、1300可具有一或多個鰭片58、570、1350及/或採用一錐狀或圓柱狀形狀以增加其表面積以便增加其散熱容量。該主殼體57、501、1300之形狀可為實質截頭錐形。該主殼體之形狀亦可為圓柱形或錐形。 The main housing 57, 501, 1300 is constructed of a thermally conductive material such as aluminum, copper or zinc or any other highly thermally conductive material. The main housing 57, 501, 1300 acts as a main heat sink (see, for example, Figures 8, 17, 23). As in the eighth, 17, As shown in Fig. 23, the main housing 57, 501, 1300 can have one or more fins 58, 570, 1350 and/or a tapered or cylindrical shape to increase its surface area to increase its heat dissipation capacity. The main casing 57, 501, 1300 may be substantially frustoconical in shape. The main housing may also be cylindrical or tapered in shape.

在本發明之一態樣中,該主殼體57、501、1300之一端係與一塑膠殼體700耦接,且該塑膠殼體700與一燈座701(例如,一E26燈座、一GU10燈座、一E27燈座、一GU24燈座)耦接。該塑膠殼體700包含主電路板,且電絕緣這些主電路板與該主殼體57、501。 In one aspect of the present invention, one end of the main housing 57, 501, 1300 is coupled to a plastic housing 700, and the plastic housing 700 is coupled to a socket 701 (eg, an E26 socket, GU10 lamp holder, an E27 lamp holder, and a GU24 lamp holder are coupled. The plastic housing 700 includes a main circuit board and electrically insulates the main circuit board from the main housing 57, 501.

所屬技術領域中具有通常知識者應了解的是該主殼體可與在第1-6圖中所述之本發明態樣一起使用,且塑膠殼體700及燈座701可與在第1-6圖,第8-13圖及第28-31圖中所述之本發明態樣一起使用。 It should be understood by those of ordinary skill in the art that the main housing can be used with the aspect of the invention described in Figures 1-6, and the plastic housing 700 and the socket 701 can be used in the first Figure 6, the aspects of the invention described in Figures 8-13 and 28-31 are used together.

雖然在此已顯示及說明多數特定實施例,所屬技術領域中具有通常知識者應了解的是在不偏離本發明之範疇的情形下,多數替代及/或等效實施例可取代所示及所述之特定實施例。本申請案意欲涵蓋在此所述之特定實施例之任何修改或變化。因此,意圖是本發明只受限於該申請專利範圍及其等效物。 Although many specific embodiments have been shown and described herein, it is understood by those of ordinary skill in the art that many alternative and/or equivalent embodiments may be substituted. Specific embodiments are described. This application is intended to cover any adaptations or variations of the specific embodiments described herein. Therefore, it is intended that the invention be limited only by the scope of the invention and its equivalents.

1‧‧‧發光裝置 1‧‧‧Lighting device

2‧‧‧導熱體 2‧‧‧ Thermal Conductor

3‧‧‧頂緣 3‧‧‧Top edge

4‧‧‧反射器 4‧‧‧ reflector

5‧‧‧安裝平台 5‧‧‧Installation platform

6‧‧‧發光二極體 6‧‧‧Lighting diode

7‧‧‧印刷電路板(“PCB”) 7‧‧‧ Printed Circuit Board ("PCB")

8‧‧‧熱管 8‧‧‧heat pipe

9‧‧‧包覆層 9‧‧‧Cladding

10‧‧‧小橫截面 10‧‧‧Small cross section

50‧‧‧發光裝置 50‧‧‧Lighting device

51‧‧‧導熱體 51‧‧‧ Thermal Conductor

52‧‧‧頂緣 52‧‧‧Top edge

53‧‧‧反射器 53‧‧‧ reflector

54‧‧‧安裝平台 54‧‧‧Installation platform

55‧‧‧發光二極體 55‧‧‧Lighting diode

56‧‧‧熱管 56‧‧‧heat pipe

57‧‧‧主殼體 57‧‧‧Main housing

58‧‧‧散熱鰭片 58‧‧‧Heat fins

59‧‧‧包覆層 59‧‧‧Cladding

60‧‧‧金屬核心印刷電路板 60‧‧‧Metal core printed circuit board

62‧‧‧空氣間隙 62‧‧‧Air gap

63‧‧‧反射邊緣 63‧‧‧ Reflection edge

90‧‧‧導熱體 90‧‧‧ Thermal Conductor

91‧‧‧發光二極體 91‧‧‧Lighting diode

92‧‧‧安裝平台 92‧‧‧Installation platform

93‧‧‧包覆層 93‧‧‧Cladding

100‧‧‧導熱體 100‧‧‧ Thermal Conductor

101‧‧‧熱管 101‧‧‧heat pipe

102‧‧‧安裝平台 102‧‧‧Installation platform

103‧‧‧發光二極體 103‧‧‧Lighting diode

500‧‧‧發光裝置 500‧‧‧Lighting device

501‧‧‧主殼體 501‧‧‧Main housing

502‧‧‧反射器 502‧‧‧ reflector

503‧‧‧頂緣 503‧‧‧Top edge

504‧‧‧發光二極體 504‧‧‧Lighting diode

509‧‧‧蓋緣 509‧‧‧ Cover

520,521‧‧‧槽孔 520,521‧‧‧ slots

530‧‧‧安裝平台 530‧‧‧Installation platform

531‧‧‧安裝板 531‧‧‧Installation board

550‧‧‧金屬包覆層 550‧‧‧Metal coating

700‧‧‧塑膠殼體 700‧‧‧Plastic shell

701‧‧‧燈座 701‧‧‧ lamp holder

800‧‧‧玻璃蓋 800‧‧‧ glass cover

900,901,910,911‧‧‧連接點 900, 901, 910, 911 ‧ ‧ connection points

1000‧‧‧導熱體 1000‧‧‧ Thermal Conductor

1001‧‧‧中間部份 The middle part of 1001‧‧

1002,1003‧‧‧彎曲翼部 1002,1003‧‧‧Bend wing

1200‧‧‧發光裝置 1200‧‧‧Lighting device

1300‧‧‧主殼體 1300‧‧‧ main housing

1500‧‧‧導熱頭 1500‧‧‧heat head

1530a,1530b‧‧‧安裝區域 1530a, 1530b‧‧‧Installation area

1600‧‧‧導熱體 1600‧‧‧ Thermal Conductor

1601a,1601b‧‧‧熱管 1601a, 1601b‧‧‧ heat pipe

1700‧‧‧防眩光蓋 1700‧‧‧Anti-glare cover

1700a,1700b‧‧‧唇部 1700a, 1700b‧‧‧ Lips

1800‧‧‧反射器 1800‧‧‧ reflector

1850‧‧‧開口 1850‧‧‧ openings

1900‧‧‧槽孔 1900‧‧‧ slots

2000‧‧‧中心軸 2000‧‧‧Center axis

5000,5001‧‧‧發光二極體 5000,5001‧‧‧Lighting diode

8000‧‧‧發光裝置 8000‧‧‧Lighting device

第1圖是由依據本發明之一態樣之一發光裝置之頂側觀看之立體圖;第2圖是由第1圖所示之發光裝置之底側觀看之立體圖; 第3圖是由第3圖所示之發光裝置之底側觀看之“X光”圖;第4圖是由第1圖所示之發光裝置之頂側觀看之橫截面立體圖;第5圖是由第1圖所示之發光裝置之底側觀看之橫截面立體圖;第6圖是第1圖所示之發光裝置之橫截面圖;第7圖是一習知熱管之橫截面圖(來自http://en.wikipedia.org/wiki/Image:Heat_Pipe_Mechanism.png);第8圖是依據本發明另一態樣之一發光裝置的立體圖;第9圖是由第8圖所示之發光裝置之底側觀看的立體圖;第10圖是第8圖所示之發光裝置的橫截面立體圖;第11圖是由第8圖所示之發光裝置的另一橫截面立體圖;第12圖是第8圖所示之發光裝置的分解立體圖;第13圖是第8圖所示之發光裝置的分解橫截面圖;第14圖是依據本發明之一態樣之具有直接耦接於其上之一發光二極體之一導熱體(經包覆之熱管)的立體圖;第15圖是依據本發明之另一態樣之具有直接耦接於其上之一發光二極體之一導熱體(未包覆之熱管)的立體圖;第16圖是依據本發明之另一態樣之一發光裝置(包括一S形導熱體)的立體圖; 第17圖是第16圖所示之發光裝置之側視圖;第18圖是第16圖所示之發光裝置之橫截面立體圖;第19圖是第16圖所示之發光裝置之頂緣及一安裝裝置(包括一金屬包覆層,一S形導熱體,一安裝平台,一安裝板,及一發光二極體)的分解立體圖;第20圖是由第16圖所示之發光裝置之頂側(沒有一玻璃蓋)觀看之立體圖;第21圖是由依據本發明之另一態樣之一發光裝置之頂側觀看之立體圖;第22圖是由第21圖所示之發光裝置之頂側觀看之分解立體圖;第23圖是第21圖所示之發光裝置的分解橫截面圖;第24圖是第21圖所示之發光裝置的橫截面圖;第25圖是第21圖所示之發光裝置的另一橫截面圖;第26圖是第21圖所示之發光裝置的橫截面圖;第27圖是由第21圖所示之發光裝置之底側觀看之立體圖;第28圖是依據本發明另一態樣之一發光裝置的立體圖;第29圖是由第28圖所示之發光裝置之底側觀看之立體圖;第30圖是第28圖所示之發光裝置的側視圖;及第31圖是第28圖所示之發光裝置的橫截面立體圖。 1 is a perspective view of a top side of a light-emitting device according to an aspect of the present invention; and FIG. 2 is a perspective view of a bottom side of the light-emitting device shown in FIG. 1; Figure 3 is a "X-ray" view of the bottom side of the light-emitting device shown in Figure 3; Figure 4 is a cross-sectional perspective view of the light-emitting device shown in Figure 1; A cross-sectional perspective view of the light-emitting device shown in Fig. 1; a cross-sectional view of the light-emitting device shown in Fig. 1; and a cross-sectional view of a conventional heat pipe (from http) ://en.wikipedia.org/wiki/Image:Heat_Pipe_Mechanism.png); FIG. 8 is a perspective view of a light-emitting device according to another aspect of the present invention; and FIG. 9 is a light-emitting device shown in FIG. 3 is a perspective view of a light-emitting device shown in FIG. 8; FIG. 11 is another perspective view of the light-emitting device shown in FIG. 8; and FIG. 12 is a view of FIG. An exploded perspective view of the light-emitting device shown in FIG. 13 is an exploded cross-sectional view of the light-emitting device shown in FIG. 8; and FIG. 14 is a light-emitting device directly coupled to one of the light-emitting devices according to an aspect of the present invention. A perspective view of a thermal conductor (coated heat pipe) of a polar body; Figure 15 is a direct view of another aspect of the present invention A perspective view of a heat conductor (an uncoated heat pipe) connected to one of the light-emitting diodes; and a perspective view of a light-emitting device (including a S-shaped heat conductor) according to another aspect of the present invention; ; Figure 17 is a side view of the light-emitting device shown in Figure 16; Figure 18 is a cross-sectional perspective view of the light-emitting device shown in Figure 16, and Figure 19 is a top edge of the light-emitting device shown in Figure 16 An exploded perspective view of the mounting device (including a metal cladding layer, an S-shaped heat conductor, a mounting platform, a mounting plate, and a light emitting diode); FIG. 20 is a top view of the light emitting device shown in FIG. A perspective view of the side (without a glass cover); a view of the top side of the light-emitting device according to another aspect of the present invention; and a view of the top of the light-emitting device shown in FIG. Fig. 23 is an exploded cross-sectional view of the light-emitting device shown in Fig. 21; Fig. 24 is a cross-sectional view of the light-emitting device shown in Fig. 21; and Fig. 25 is a view of Fig. 21 Another cross-sectional view of the illuminating device; Fig. 26 is a cross-sectional view of the illuminating device shown in Fig. 21; and Fig. 27 is a perspective view of the illuminating device shown in Fig. 21; Is a perspective view of a light-emitting device according to another aspect of the present invention; and FIG. 29 is a light-emitting view shown in FIG. The opposite side of bottom perspective view of FIG.; FIG. 30 is a side view of the section shown in FIG. 28 of the light emitting device; FIG. 31 is a second section 28 shown in FIG cross-sectional perspective view of the light emitting device.

1‧‧‧發光裝置 1‧‧‧Lighting device

2‧‧‧導熱體 2‧‧‧ Thermal Conductor

3‧‧‧頂緣 3‧‧‧Top edge

4‧‧‧反射器 4‧‧‧ reflector

5‧‧‧安裝平台 5‧‧‧Installation platform

900,901‧‧‧連接點 900,901‧‧‧ connection point

Claims (16)

一種發光裝置,包含:一主殼體;一反射器,其設置在該主殼體內,且該反射器具有一前側及一後側;一導熱體,其包含至少兩熱管,其中該等至少兩熱管之一第一部份係定位成平行於該發光裝置之一中心軸且在該反射器之前側上,且該等至少兩熱管之各熱管之一第二部份係在該反射器之後側中且係與該主殼體熱耦接;一導熱頭,其位在該反射器之前側上,且係與該導熱體熱耦接;至少兩發光二極體,其與該導熱頭及該導熱體熱耦接,且該等至少兩發光二極體係定位成面向該反射器之前側使得由該等至少兩發光二極體發射之光被導引至該反射器之前側。 A light-emitting device comprising: a main casing; a reflector disposed in the main casing, the reflector having a front side and a rear side; and a heat conductor comprising at least two heat pipes, wherein the at least two heat pipes One of the first portions is positioned parallel to a central axis of the illuminating device and on a front side of the reflector, and a second portion of each of the heat pipes of the at least two heat pipes is in a rear side of the reflector And being thermally coupled to the main casing; a heat conducting head positioned on the front side of the reflector and thermally coupled to the heat conductor; at least two light emitting diodes, the heat conducting head and the heat conducting portion The body is thermally coupled, and the at least two light emitting diode systems are positioned to face the front side of the reflector such that light emitted by the at least two light emitting diodes is directed to the front side of the reflector. 如申請專利範圍第1項之發光裝置,其中該等至少兩熱管係實質J形,L形,或其組合。 The illuminating device of claim 1, wherein the at least two heat pipes are substantially J-shaped, L-shaped, or a combination thereof. 如申請專利範圍第1項之發光裝置,其中該導熱體提供一供熱由該等至少兩發光二極體向主殼體流動之通路。 The illuminating device of claim 1, wherein the heat conductor provides a passage for heat to flow from the at least two light emitting diodes to the main casing. 如申請專利範圍第1項之發光裝置,其中該反射器具有至少兩中心光軸。 The illuminating device of claim 1, wherein the reflector has at least two central optical axes. 如申請專利範圍第1項之發光裝置,其中該導熱體之一端係與該等至少兩發光二極體熱耦接,且該導熱體之另 一端係與該主殼體熱耦接。 The illuminating device of claim 1, wherein one end of the heat conductor is thermally coupled to the at least two light emitting diodes, and the heat conductor is another One end is thermally coupled to the main housing. 如申請專利範圍第1項之發光裝置,其中該反射器係呈一對稱或非對稱形狀。 The illuminating device of claim 1, wherein the reflector has a symmetrical or asymmetrical shape. 如申請專利範圍第1項之發光裝置,其中該主殼體係實質截頭錐形,圓柱形或立方體形,且係由一導熱材料構成。 The illuminating device of claim 1, wherein the main casing is substantially frustoconical, cylindrical or cubic, and is composed of a heat conductive material. 如申請專利範圍第1項之發光裝置,其中該主殼體包含一或多個散熱鰭片。 The illuminating device of claim 1, wherein the main housing comprises one or more heat dissipating fins. 如申請專利範圍第7項之發光裝置,更包含:一塑膠殼體,其與該主殼體耦接;及一燈座,其與該塑膠殼體耦接。 The illuminating device of claim 7, further comprising: a plastic housing coupled to the main housing; and a lamp holder coupled to the plastic housing. 如申請專利範圍第9項之發光裝置,其中該燈座是一E26燈座,一GU10燈座,一E27燈座,或一GU24燈座。 The illuminating device of claim 9, wherein the lamp holder is an E26 lamp holder, a GU10 lamp holder, an E27 lamp holder, or a GU24 lamp holder. 如申請專利範圍第1項之發光裝置,更包含該等至少兩發光二極體係相對於該發光裝置之中心軸被定位在0度至120度之範圍內。 The illuminating device of claim 1, further comprising the at least two illuminating diode systems being positioned within a range of 0 to 120 degrees with respect to a central axis of the illuminating device. 如申請專利範圍第1項之發光裝置,其中該導熱頭具有一三角形側輪廓或一不規則六邊形側輪廓,且具有分別用於該等至少兩發光二極體之至少兩安裝區域。 The illuminating device of claim 1, wherein the heat conducting head has a triangular side profile or an irregular hexagonal side profile, and has at least two mounting regions for the at least two light emitting diodes, respectively. 如申請專利範圍第1項之發光裝置,其中該導熱頭係由鋁,銅,或其組合構成。 The illuminating device of claim 1, wherein the thermal head is made of aluminum, copper, or a combination thereof. 如申請專利範圍第1項之發光裝置,更包含一與該等至少兩發光二極體及該導熱頭耦接之印刷電路板(PCB)。 The illuminating device of claim 1, further comprising a printed circuit board (PCB) coupled to the at least two illuminating diodes and the thermal head. 一種發光裝置,包含: 一主殼體,其具有一大致截頭錐形;一反射器,其設置在該主殼體內,且該反射器具有一前側,一後側及至少兩中心光軸;一導熱體,其包含至少兩實質J形熱管,其中該等至少兩實質J形熱管之一第一部份係呈桿狀且位在該反射器之前側,並且與位在或靠近該發光裝置之一中心軸之一導熱頭耦接,且該等至少兩實質J形熱管之一第二部份透過在或靠近該發光裝置之該中心軸之一開口穿過該反射器,且該等至少兩實質J形熱管之一第三部份係彎曲的並且該第三部份之至少一部份係與該主殼體耦接;及至少兩發光二極體,其與該導熱頭熱耦接且定位成相對該發光裝置之一中心軸以一傾斜角面向該反射器之前側使得由該等至少兩發光二極體發射之光被導引至該反射器之前側。 A light emitting device comprising: a main housing having a substantially frustoconical shape; a reflector disposed in the main housing, the reflector having a front side, a rear side and at least two central optical axes; a heat conductor comprising at least a substantially J-shaped heat pipe, wherein the first portion of the at least two substantially J-shaped heat pipes is rod-shaped and located on a front side of the reflector, and is thermally conductive with one of the central axes of the light-emitting device The head is coupled, and the second portion of the at least two substantially J-shaped heat pipes are passed through the reflector at an opening of the central axis of the light-emitting device, and one of the at least two substantially J-shaped heat pipes The third portion is curved and at least a portion of the third portion is coupled to the main housing; and at least two light emitting diodes are thermally coupled to the thermal head and positioned opposite the light emitting device One of the central axes faces the front side of the reflector at an oblique angle such that light emitted by the at least two light emitting diodes is directed to the front side of the reflector. 如申請專利範圍第1或15項之發光裝置,更包含一與該導熱頭耦接之防眩光蓋。 The illuminating device of claim 1 or 15, further comprising an anti-glare cover coupled to the thermal head.
TW101111452A 2012-02-21 2012-03-30 Non-glare reflective led lighting apparatus with heat sink mounting TWI529344B (en)

Applications Claiming Priority (1)

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US13/401,724 US9234646B2 (en) 2008-05-23 2012-02-21 Non-glare reflective LED lighting apparatus with heat sink mounting

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EP2817562A4 (en) 2015-10-21
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HK1205783A1 (en) 2015-12-24
EP2817562A1 (en) 2014-12-31

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