TW201335449A - Heat treatment method of solid phase raw material and device thereof, and method of producing ingot, article and solar cell - Google Patents

Heat treatment method of solid phase raw material and device thereof, and method of producing ingot, article and solar cell Download PDF

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TW201335449A
TW201335449A TW101148493A TW101148493A TW201335449A TW 201335449 A TW201335449 A TW 201335449A TW 101148493 A TW101148493 A TW 101148493A TW 101148493 A TW101148493 A TW 101148493A TW 201335449 A TW201335449 A TW 201335449A
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Ryuichi Oishi
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Sharp Kk
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00Production of homogeneous polycrystalline material with defined structure
    • C30B28/04Production of homogeneous polycrystalline material with defined structure from liquids
    • C30B28/06Production of homogeneous polycrystalline material with defined structure from liquids by normal freezing or freezing under temperature gradient
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/003Heating or cooling of the melt or the crystallised material
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/006Controlling or regulating
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    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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    • C30B29/06Silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H01L31/182Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/546Polycrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

Provided is a heat treatment method of a solid phase raw material which heats and melts a solid phase raw material placed in a container by a heating means, then solidifies the solid phase raw material in order to obtain an ingot thereof, wherein the temperature of the solid phase raw material is detected by a temperature detecting means, and, when the temperature which remains constant just before melting of the solid phase raw material is completed is defined as a reference temperature Tm DEG C, temperature control is carried out on the basis of the reference temperature Tm DEG C.

Description

固相原料之熱處理方法及其裝置與錠塊、加工物及太陽能電池之製造方法 Method for heat-treating solid phase raw material and device thereof, and method for manufacturing ingot, processed product and solar battery

本發明係關於一種固相原料之熱處理方法及其裝置與錠塊、加工物及太陽能電池之製造方法。進而詳細而言,本發明係關於一種固相原料之熱處理方法及用於其之固相原料之熱處理裝置與如矽錠塊之錠塊(鑄造物)、加工物及太陽能電池之製造方法。 The present invention relates to a method and apparatus for heat treatment of a solid phase raw material, and an ingot, a processed product and a method of manufacturing the same. More specifically, the present invention relates to a heat treatment method for a solid phase raw material, a heat treatment device for the solid phase raw material thereof, and an ingot (casting material) such as a bismuth ingot, a processed product, and a method for producing a solar battery.

作為對地球環境引起各種問題之石油等之代替品,自然能源之利用受到關注。其中,太陽能電池由於無需較大之設備,且於運轉時不產生噪音等,因此日本或歐州等地尤為積極地導入。 As a substitute for petroleum and other problems that cause various problems in the global environment, the use of natural energy is attracting attention. Among them, solar cells do not require large equipment, and do not generate noise during operation, and therefore are particularly actively introduced in Japan or Europe.

使用有碲化鎘等化合物半導體之太陽能電池亦部分付諸實際應用,但就物質本身之安全性、此前之實績、及成本績效之方面而言,使用有多晶矽基板、單晶矽基板之矽太陽能電池佔據較大份額。 Solar cells using compound semiconductors such as cadmium telluride are also partially put into practical use, but in terms of the safety of the substance itself, previous performance, and cost performance, solar cells using polycrystalline germanium substrates and single crystal germanium substrates are used. The battery has a large share.

不僅上述矽,而且鍺或砷化鎵等III-V族化合物、硒化鋅等II-VI族化合物、其他II-IV-V2族化合物及I-III-VI2族化合物等半導體材料為脆性材料而容易破裂,且於用作太陽能電池用材料之情形時,由錯位所引起之品質降低明顯。因此,於藉由晶體成長等鑄造製造該等材料時,溫度條件之控制較為重要。 Not only the above-mentioned ruthenium, but also a III-VI compound such as lanthanum or gallium arsenide, a II-VI compound such as zinc selenide, a semiconductor material such as another II-IV-V2 group compound or a group I-III-VI2 compound, and a brittle material. It is easy to break, and when used as a material for a solar cell, the quality caused by the misalignment is significantly reduced. Therefore, when these materials are produced by casting such as crystal growth, the control of temperature conditions is important.

又,藉由鑄造而製造之金屬材料或絕緣材料於調整為所需之結晶粒徑之情形時,與半導體材料同樣地,溫度條件 之控制亦較為重要。 Further, when the metal material or the insulating material produced by casting is adjusted to a desired crystal grain size, the temperature condition is the same as that of the semiconductor material. The control is also more important.

例如,於藉由澆鑄法而製造太陽能電池用多晶矽錠塊時,通常係將在內部裝填有固相原料之容器安放於裝置內,藉由加熱器對固相原料進行加熱熔融後,降低容器底部側之溫度,從而使熔融之固相原料自容器底部至上部沿一個方向凝固,藉此製造太陽能電池用多晶矽錠塊。 For example, when a polycrystalline silicon ingot for a solar cell is produced by a casting method, a container in which a solid phase raw material is filled is usually placed in a device, and the solid phase raw material is heated and melted by a heater to lower the bottom of the container. The temperature of the side is such that the molten solid phase raw material solidifies in one direction from the bottom to the upper portion of the container, thereby producing a polycrystalline ingot for solar cells.

例如,於日本專利特開2008-063194號公報(專利文獻1)中,揭示有一種以提高多晶矽太陽能電池之特性為目的,藉由在原料中添加少量之鍺,並於晶體成長初期將容器底面之溫度於1410℃下保持40分鐘,從而於矽錠塊最下部成長(表現)沿<112>方向延伸之樹枝狀結晶之技術。 For example, in Japanese Patent Laid-Open Publication No. 2008-063194 (Patent Document 1), it is disclosed that a small amount of ruthenium is added to a raw material for the purpose of improving the characteristics of a polycrystalline silicon solar cell, and the bottom surface of the container is formed at the initial stage of crystal growth. The temperature was maintained at 1410 ° C for 40 minutes to grow (express) the dendritic crystal extending in the <112> direction at the lowermost portion of the ingot block.

先前技術文獻Prior technical literature 專利文獻Patent literature

專利文獻1:日本專利特開2008-063194號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-063194

然而,於如專利文獻1之溫度控制中,作為矽之熔點之1410℃之絕對值具有較大意義,由於存在熱電偶或放射溫度計等溫度檢測設備之經時劣化、其設置位置或溫度校準方法之偏差等各種偏差因素,因此極難再現性良好地製造多晶矽。又,於專利文獻1中,並未揭示偏差因素之具體對策。 However, in the temperature control of Patent Document 1, the absolute value of 1410 ° C which is the melting point of yttrium has a large meaning, and there is a time-dependent deterioration of a temperature detecting device such as a thermocouple or a radiation thermometer, a setting position thereof, or a temperature calibration method. Since various deviation factors such as variations occur, it is extremely difficult to reproduce polycrystalline germanium with good reproducibility. Further, in Patent Document 1, no specific countermeasure against the deviation factor is disclosed.

又,不僅限於矽,於眾多半導體材料、金屬材料、絕緣體材料之鑄造、晶體成長時,大多情況下亦同樣地迫切需 要以超過溫度檢測設備之檢測溫度之絕對值之測定精度的精度來控制材料本身之溫度之絕對值。尤其是於鑄造物為脆性材料之情形時,對熱處理時之溫度控制要求較高之精度。 Moreover, it is not limited to enamel. In many cases, when casting semiconductor materials, metal materials, and insulator materials, and crystal growth, it is also urgently required in many cases. The absolute value of the temperature of the material itself is controlled by the accuracy of the measurement accuracy exceeding the absolute value of the detected temperature of the temperature detecting device. Especially in the case where the cast material is a brittle material, the temperature control during heat treatment requires high precision.

本發明之課題在於提供一種方法,其於對固相原料進行加熱將其熔融後使其固化之熱處理中,可消除溫度檢測設備之設置狀態、劣化狀態、校準方法等之偏差問題,以超過測定精度之精度確保熱處理狀態之再現性。 An object of the present invention is to provide a method for eliminating a variation in a setting state, a deterioration state, a calibration method, and the like of a temperature detecting device by heating a solid phase raw material by heating it and then solidifying it. The precision of precision ensures the reproducibility of the heat treatment state.

本發明者重複銳意研究,結果發現:藉由向溫度檢測設備之資料導入應時之溫度檢測設備之劣化狀態、設置狀態、校準方法下之基準溫度之概念可解決上述課題,從而完成本發明。 As a result of intensive research, the inventors have found that the above problems can be solved by introducing the concept of the deterioration state of the temperature detecting device, the setting state, and the reference temperature under the calibration method to the data of the temperature detecting device, thereby completing the present invention.

如此,根據本發明,可提供一種固相原料之熱處理方法,其係藉由加熱設備對收納於容器中之固相原料進行加熱將其熔融後,使上述固相原料固化,從而獲得其錠塊者,且該方法係藉由溫度檢測設備檢測上述固相原料之溫度,將上述固相原料即將熔融結束之前固定化之溫度設為基準溫度Tm℃,並基於上述基準溫度Tm℃進行溫度控制。 As described above, according to the present invention, there is provided a method for heat-treating a solid phase raw material, which is obtained by heating a solid phase raw material contained in a container by a heating device, and then solidifying the solid phase raw material to obtain an ingot thereof. In this method, the temperature of the solid phase raw material is detected by a temperature detecting device, and the temperature at which the solid phase raw material is fixed immediately before the completion of melting is referred to as a reference temperature Tm ° C, and temperature control is performed based on the reference temperature Tm ° C.

又,根據本發明,可提供使用上述固相原料之熱處理方法製造錠塊的錠塊之製造方法、對藉由該製造方法所製造之錠塊進行加工而獲得加工物的加工物之製造方法、尤其是源自矽材料之加工物之製造方法、以及使用藉由該製造 方法所製造之加工物而獲得矽太陽能電池之太陽能電池之製造方法。 Moreover, according to the present invention, a method for producing an ingot in which an ingot is produced by a heat treatment method using the solid phase raw material, a method for producing a processed product obtained by processing an ingot produced by the production method, and a processed product can be provided. In particular, a method of producing a processed material derived from a tantalum material, and use thereof A method of manufacturing a solar cell of a tantalum solar cell by the processed article produced by the method.

進而,根據本發明,可提供一種固相原料之熱處理裝置,該裝置係用於上述固相原料之熱處理方法,且包含:收納固相原料之容器、檢測上述固相原料之溫度之溫度檢測設備、加熱設備、以及檢測上述加熱設備之溫度之溫度檢測設備。 Further, according to the present invention, it is possible to provide a heat treatment apparatus for a solid phase raw material, which is used for the heat treatment method of the solid phase raw material, and includes: a container for storing the solid phase raw material, and a temperature detecting device for detecting the temperature of the solid phase raw material. , a heating device, and a temperature detecting device that detects the temperature of the heating device.

根據本發明,可提供一種方法,其於對固相原料進行加熱將其熔融後使其固化之熱處理中,可消除溫度檢測設備之設置狀態、劣化狀態、校準方法等之偏差問題,以超過測定精度之精度來確保熱處理狀態之再現性。 According to the present invention, it is possible to provide a method for eliminating the deviation of the setting state, the deterioration state, the calibration method, and the like of the temperature detecting device in the heat treatment in which the solid phase raw material is heated and melted and solidified to exceed the measurement. The precision of precision ensures the reproducibility of the heat treatment state.

即,根據本發明,於固相原料之熱處理中,即便於難以控制溫度之條件下,亦可精度良好且再現性良好地進行控制。因此,藉由著眼於各種特性,可利用所需之條件再現性良好地對鑄造物進行鑄造。 That is, according to the present invention, in the heat treatment of the solid phase raw material, even under conditions in which it is difficult to control the temperature, the control can be performed with high precision and good reproducibility. Therefore, by focusing on various characteristics, the cast product can be cast with good reproducibility by the required conditions.

本發明之固相原料之熱處理方法於將溫度檢測設備設置於容器、或與容器具有熱導通且可檢測與固相原料之溫度具有相關關係之溫度之位置而成之情形時,可進一步發揮上述效果。 The heat treatment method of the solid phase raw material of the present invention can further exert the above aspect when the temperature detecting device is placed in a container or at a temperature which is thermally conductive with the container and can detect a temperature associated with the temperature of the solid phase raw material. effect.

又,本發明之固相原料之熱處理方法於溫度控制包含如下情形時,可進一步發揮上述效果,即於將溫度檢測設備之檢測溫度設為T℃、將與基準溫度Tm℃之差(Tm-T)℃設為△T℃、將熱處理中之所需之設定溫度差設為△Ts℃時, 以(△Ts-△T)℃修正控制用設定溫度Th。 Moreover, the heat treatment method of the solid phase raw material of the present invention can further exert the above effects when the temperature control includes the following, that is, the difference between the detection temperature of the temperature detecting device and the reference temperature Tm ° C (Tm- T) When °C is set to ΔT°C, and the required set temperature difference in the heat treatment is ΔTs°C, The control set temperature Th is corrected by (ΔTs - ΔT) °C.

進而,本發明之固相原料之熱處理方法於固相原料為錠塊用之脆性材料之情形、尤其是該脆性材料為多晶矽錠塊用之矽材料之情形時,可進一步發揮上述效果。 Further, in the heat treatment method of the solid phase raw material of the present invention, when the solid phase raw material is a brittle material for an ingot, and particularly when the brittle material is a tantalum material for a polycrystalline ingot, the above effects can be further exerted.

於本發明之錠塊及對其進行加工而獲得之加工物其等為脆性材料、尤其是源自矽材料之多晶矽錠塊及加工物之情形時,可進一步發揮上述效果。 The above effects can be further exerted in the case where the ingot of the present invention and the processed product obtained by processing the same are brittle materials, in particular, polycrystalline ingots and processed materials derived from a tantalum material.

於本發明中,所謂「源自矽材料之加工物」,係指矽塊及矽晶圓等。 In the present invention, the term "processed material derived from a tantalum material" means a tantalum block and a tantalum wafer.

又,所謂使用源自矽材料之加工物所製造之「矽太陽能電池」,係指構成最小單元之「矽太陽能電池單元」及將其複數個進行電性連接而成之「矽太陽能電池模組」。 In addition, the term "tantal solar cell" manufactured using a processed material derived from a tantalum material refers to a "tantal solar cell" which constitutes the smallest unit, and a "tan solar cell module" which is electrically connected in plurality. "."

即,根據本發明之固相原料之熱處理方法,可再現性良好地製造具有所需特性之脆性材料之錠塊及加工物、尤其是矽錠塊、組塊(block)及晶圓,進而可穩定地向市場供給具有所需特性之矽太陽能電池。 That is, according to the heat treatment method of the solid phase raw material of the present invention, the ingots and processed articles of the brittle material having the desired characteristics, particularly the ingot ingots, blocks and wafers, can be produced with good reproducibility. Stable solar cells with the required characteristics are stably supplied to the market.

(固相原料之熱處理方法) (heat treatment method of solid phase raw materials)

本發明之固相原料之熱處理方法之特徵在於:其係藉由加熱設備對收納於容器中之固相原料進行加熱將其熔融後,使上述固相原料固化,從而獲得其錠塊者,且該方法係藉由溫度檢測設備檢測上述固相原料之溫度,將上述固相原料即將熔融結束之前固定化之溫度設為基準溫度Tm℃,並基於上述基準溫度Tm℃進行溫度控制。 The heat treatment method of the solid phase raw material of the present invention is characterized in that the solid phase raw material accommodated in the container is heated by a heating device, and the solid phase raw material is solidified to obtain the ingot, and In this method, the temperature of the solid phase raw material is detected by a temperature detecting device, and the temperature at which the solid phase raw material is fixed immediately before the completion of melting is set as the reference temperature Tm ° C, and temperature control is performed based on the reference temperature Tm ° C.

使用圖式對基準溫度Tm℃(以下有時亦省略「℃」)之決定方法進行說明。 The method of determining the reference temperature Tm ° C (hereinafter sometimes "°C" is omitted) will be described using a drawing.

圖1係表示固相原料之熔融過程中之容器之檢測溫度之變化、即用以熔融容器內之固相原料而藉由加熱器進行加熱時之溫度變化之概念圖。 Fig. 1 is a conceptual diagram showing a change in temperature of a container during melting of a solid phase raw material, that is, a temperature change when a solid phase raw material in a vessel is melted and heated by a heater.

首先,若開始加熱,則溫度緩緩上升(區域I),若容器內成為固相與液相之混合狀態,則於固相原料完全熔化之前,熔融液之溫度大致於固相原料之熔點下成為固定值(區域II)。將該狀態下之溫度檢測設備之檢測溫度之平均值決定為「Tm」。即,基準溫度Tm係容器內之熔融液為固相原料之熔點時的溫度檢測設備之檢測溫度。其後若繼續加熱,則於全部熔融後,溫度再次開始上升,若停止加熱,則溫度降低(區域III)。 First, when heating is started, the temperature gradually rises (region I). If the inside of the container is in a mixed state of the solid phase and the liquid phase, the temperature of the melt is substantially at the melting point of the solid phase raw material before the solid phase raw material is completely melted. Become a fixed value (Zone II). The average value of the detected temperatures of the temperature detecting devices in this state is determined as "Tm". That is, the reference temperature Tm is the detected temperature of the temperature detecting device when the molten liquid in the container is the melting point of the solid phase raw material. When heating is continued thereafter, the temperature starts to rise again after all the melting, and if the heating is stopped, the temperature is lowered (region III).

基準溫度Tm係完全反映檢測溫度之絕對值之偏差因素之影響之值、即包含所有誤差之值。 The reference temperature Tm is a value that completely reflects the influence of the deviation factor of the absolute value of the detected temperature, that is, the value including all the errors.

例如,於溫度檢測設備為熱電偶之情形時,包含溫度校準方法之偏差、由校準後之繼續使用所引起之經時劣化、設置位置之偏差、及與周邊零件之接觸程度之偏差等因素。於熱電偶中,作為提高其測定精度之方法,有設置基準溫度接點(例如,將冰水中之0℃設為冷接點)之方法,藉此可確實地抑制冷接點之溫度偏差,但對於其他偏差(誤差)而言則無效果。 For example, when the temperature detecting device is a thermocouple, it includes factors such as deviation of the temperature calibration method, deterioration over time caused by continued use after calibration, deviation of the set position, and deviation from contact with peripheral parts. In the thermocouple, as a method for improving the measurement accuracy, there is a method of setting a reference temperature contact (for example, setting 0 ° C in ice water as a cold junction), thereby reliably suppressing temperature deviation of the cold junction. However, it has no effect on other deviations (errors).

又,於溫度檢測設備為放射溫度計之情形時,亦包含溫度校準方法之偏差、檢測元件之經時劣化、觀測點之偏 差、由溫度測定用窗之濁度狀態所引起之偏差等因素。 Moreover, when the temperature detecting device is a radiation thermometer, the deviation of the temperature calibration method, the deterioration of the detecting element over time, and the deviation of the observation point are also included. The difference, the deviation caused by the turbidity state of the window for temperature measurement, and the like.

因此,藉由以使上述基準溫度成為固定值之方式控制加熱溫度,可排除偏差因素之大部分。雖無法完全排除溫度校準方法之偏差、或由校準後之繼續使用而引起之經時劣化等,但可於相當程度上抑制接近對晶體成長而言重要之「Tm」之溫度區域之測定偏差,從而確保熱處理(鑄造)條件之再現性。 Therefore, by controlling the heating temperature so that the reference temperature becomes a fixed value, most of the deviation factor can be eliminated. Although it is not possible to completely eliminate the deviation of the temperature calibration method or the deterioration over time caused by continued use after calibration, the measurement deviation of the temperature region close to "Tm" which is important for crystal growth can be suppressed to a considerable extent. Thereby the reproducibility of the heat treatment (casting) conditions is ensured.

溫度檢測設備較佳為設置於容器、或與容器具有熱導通且可檢測與固相原料之溫度具有相關關係之溫度之位置而成,如下所述,容器下表面中央附近由於可獲得最佳地反映容器內之熔融之固相原料之溫度之值,故而尤佳。 Preferably, the temperature detecting device is disposed at a position of a container or a temperature that is thermally conductive with the container and can detect a temperature associated with the temperature of the solid phase material. As described below, the vicinity of the center of the lower surface of the container is optimally obtained. It is especially preferred to reflect the value of the temperature of the molten solid phase material in the vessel.

本發明之固相原料之熱處理方法較佳為溫度控制包含如下情況,即於將上述溫度檢測設備之檢測溫度設為T℃、將與上述基準溫度Tm℃之差(Tm-T)℃設為△T℃、將熱處理中之所需之設定溫度差設為△Ts℃時,以(△Ts-△T)℃修正控制用設定溫度Th。具體而言,於實施例中詳述。 In the heat treatment method of the solid phase raw material of the present invention, the temperature control includes a case where the detection temperature of the temperature detecting device is set to T ° C, and the difference (Tm - T) ° C from the reference temperature Tm ° C is set to ΔT ° C, when the set temperature difference required for the heat treatment is ΔTs ° C, the control set temperature Th is corrected by (ΔTs - ΔT) °C. Specifically, it is described in detail in the examples.

(固相原料) (solid phase raw material)

於本發明中,作為成為熱處理對象之固相原料,例如可列舉:如矽或鍺之半導體材料;砷化鎵等III-V族化合物、硒化鋅等II-VI族化合物、其他II-IV-V2族化合物、I-III-VI2族化合物等化合物半導體材料;鋁、銅、鈦、鉻或該等之合金等金屬材料;氧化物、氮化物、硫化物等絕緣材料。 In the present invention, examples of the solid phase raw material to be heat-treated include a semiconductor material such as ruthenium or iridium; a III-V compound such as gallium arsenide; a II-VI compound such as zinc selenide; and other II-IV. a compound semiconductor material such as a group V2 compound or a group I-III-VI2 compound; a metal material such as aluminum, copper, titanium, chromium or the like; an insulating material such as an oxide, a nitride or a sulfide.

該等之中,就充分發揮本發明之效果而言,較佳為脆性 材料,尤佳為矽材料。 Among these, in order to fully exert the effects of the present invention, brittleness is preferred. Materials, especially for enamel materials.

(固相原料之熱處理裝置) (heat treatment device for solid phase raw materials)

本發明之固相原料之熱處理裝置之特徵在於包含:收納固相原料之容器、檢測上述固相原料之溫度之溫度檢測設備、加熱設備、檢測上述加熱設備之溫度之溫度檢測設備。 The heat treatment apparatus for a solid phase raw material of the present invention includes a container for storing a solid phase raw material, a temperature detecting device for detecting a temperature of the solid phase raw material, a heating device, and a temperature detecting device for detecting a temperature of the heating device.

可用於本發明之固相原料之熱處理方法之熱處理裝置並無特別限定,只要包含上述裝置,則可轉用公知之裝置。 The heat treatment apparatus which can be used for the heat treatment method of the solid phase raw material of the present invention is not particularly limited, and as long as the above apparatus is included, a known apparatus can be used.

例如,可列舉藉由併用如下方法使容器中之熔融原料自下部起緩緩固化之方式之裝置,即藉由設置於容器之基座側之如冷媒循環之冷卻機構而冷卻容器底面;以及藉由升降驅動機構使容器遠離加熱機構。 For example, a device in which the molten raw material in the container is gradually solidified from the lower portion by a method in which the bottom surface of the container is cooled by a cooling mechanism such as a refrigerant circulation provided on the base side of the container; The container is moved away from the heating mechanism by a lifting drive mechanism.

為儘可能高精度地控制容器底部之晶體成長(固化),較佳為檢測容器底部附近之溫度。尤其是面內之容器底部中央附近由於難以直接受到加熱器等之影響,故而尤佳。 In order to control the crystal growth (solidification) at the bottom of the container as accurately as possible, it is preferred to detect the temperature near the bottom of the container. In particular, it is particularly preferable that the vicinity of the center of the bottom of the container in the surface is difficult to be directly affected by a heater or the like.

認為根據熱處理裝置之構成不同,亦存在於如上所述之位置中無法設置容器之溫度檢測設備之情況。於該情形時,可於與容器具有熱導通之位置設置容器之溫度檢測設備。 It is considered that depending on the configuration of the heat treatment apparatus, there is also a case where the temperature detecting device of the container cannot be provided in the position as described above. In this case, the temperature detecting device of the container can be provided at a position that is thermally conductive with the container.

藉由溫度檢測設備決定基準溫度Tm,測定某一時間點之容器之檢測溫度T。並且,只要將(T-Tm)設為修正後之容器檢測溫度,以使熱處理條件中之某一特定時間點之(T-Tm)之值與前次之條件(所需條件)相同之方式變更加熱器之控制用設定溫度Th即可。或者亦可使用前次之前之熱處 理時所調查之加熱器之檢測溫度與Tm之關係進行溫度控制。但,於進行容器之溫度檢測設備之交換或位置變更等情形時,由於亦包含此時所產生之偏差,故而欠佳。 The reference temperature Tm is determined by the temperature detecting device, and the detected temperature T of the container at a certain point in time is measured. Further, if (T-Tm) is set as the corrected container detection temperature, the value of (T-Tm) at a certain time point in the heat treatment condition is the same as the previous condition (required condition). It is sufficient to change the control set temperature Th for the heater. Or you can use the heat before the previous time Temperature control is performed on the relationship between the detected temperature of the heater and the Tm investigated by the time. However, when the exchange or position change of the temperature detecting device of the container is performed, the deviation generated at this time is also included, which is not preferable.

圖2係表示可應用本發明之熱處理方法的熱處理裝置之一例之概略剖面圖。 Fig. 2 is a schematic cross-sectional view showing an example of a heat treatment apparatus to which the heat treatment method of the present invention can be applied.

該裝置通常係為鑄造多晶矽錠塊而使用,包含構成電阻加熱爐之腔室(密閉容器)7。 The apparatus is generally used for casting a polycrystalline ingot block, and includes a chamber (closed container) 7 constituting a resistance heating furnace.

於腔室7之內部配置有石墨製、石英(SiO2)製等之容器1,可以密閉狀態保持腔室7之內部環境。 A container 1 made of graphite or quartz (SiO 2 ) or the like is disposed inside the chamber 7, and the internal environment of the chamber 7 can be maintained in a sealed state.

於收納有容器1之腔室7內配置有支持容器1之石墨製之容器台3。容器台3可藉由升降驅動機構12進行升降,且使冷卻槽11內之冷媒(冷卻水)於其內部進行循環。 A container table 3 made of graphite supporting the container 1 is disposed in the chamber 7 in which the container 1 is housed. The container table 3 can be raised and lowered by the elevation drive mechanism 12, and the refrigerant (cooling water) in the cooling tank 11 is circulated inside.

於容器台3之上部配置有石墨製等之外容器2,並於其中配置有容器1。亦可配置如包圍容器1之石墨製等之遮罩(cover)代替外容器2。 A container 2 other than graphite or the like is disposed on the upper portion of the container table 3, and the container 1 is disposed therein. Instead of the outer container 2, a cover made of graphite or the like surrounding the container 1 may be disposed.

以包圍外容器2之方式配置如石墨加熱器之加熱器10,進而以自上方覆蓋其等之方式配置隔熱材料8。 The heater 10 such as a graphite heater is disposed so as to surround the outer container 2, and the heat insulating material 8 is disposed so as to cover it from above.

加熱器10可自容器1之周圍進行加熱,從而熔解容器1內之固相原料4之矽。 The heater 10 can be heated from the periphery of the container 1 to melt the solid phase material 4 in the container 1.

只要可藉由利用加熱器10之加熱、利用上述冷卻槽11之自容器1下方之冷卻、以及利用升降驅動機構12之容器1之升降而控制本發明之溫度,則發熱體等加熱機構之方式或形態、配置並無特別限定。 The heating means can be controlled by the heating of the heater 10, the cooling from the lower side of the container 1 by the cooling tank 11, and the raising and lowering of the container 1 by the lifting/lowering mechanism 12. The form and arrangement are not particularly limited.

為檢測容器1之底面之溫度,分別於容器1下表面中央附 近配置容器下熱電偶5,於外容器2下表面之中央附近配置外容器下熱電偶6,藉由控制裝置9記錄溫度資料。又,加熱器溫度係藉由加熱器之溫度檢測設備(輸出控制用熱電偶13)而檢測,並控制加熱器10之加熱狀態。除上述熱電偶以外,亦可配置用以檢測溫度之熱電偶或放射溫度計。 In order to detect the temperature of the bottom surface of the container 1, respectively, attached to the center of the lower surface of the container 1 The thermocouple 5 is placed near the container, and the thermocouple 6 under the outer container is placed near the center of the lower surface of the outer container 2, and the temperature data is recorded by the control device 9. Further, the heater temperature is detected by the heater temperature detecting device (output control thermocouple 13), and the heating state of the heater 10 is controlled. In addition to the above thermocouples, thermocouples or radiation thermometers for detecting temperature can also be configured.

於本發明中,在上述容器下熱電偶5及外容器下熱電偶6中檢測固相原料即將熔融結束之前固定化之溫度,並設為基準溫度Tm。 In the present invention, in the above-described container lower thermocouple 5 and outer container lower thermocouple 6, the temperature at which the solid phase raw material is fixed immediately before the completion of melting is detected, and is set as the reference temperature Tm.

腔室7可以不流入外部之氧氣、氮氣等之方式將其內部保持為密閉狀態,通常,於投入多晶矽等矽原料之後且於其熔融之前,使腔室7內成為真空,其後導入氬氣等惰性氣體使其保持為惰性環境。 The chamber 7 can maintain the inside thereof in a sealed state without flowing into the outside of oxygen, nitrogen, or the like. Usually, after the raw material such as polycrystalline germanium is introduced and before it is melted, the inside of the chamber 7 is evacuated, and then argon gas is introduced. Wait for the inert gas to keep it in an inert environment.

藉由此種構成之裝置,且基本上藉由如下步驟進行多晶矽錠塊之熱處理,即,向容器1內填充作為固相原料4之矽;藉由脫氣(真空化)及惰性氣體之導入而置換腔室7內之氣體;藉由加熱而熔融固相原料4;熔融確認及其保持;藉由溫度控制及升降驅動機構12之動作而開始固化;固化結束確認;及退火與錠塊取出。 With such a device, the heat treatment of the polycrystalline ingot is basically carried out by filling the container 1 with the crucible as the solid phase material 4; by degassing (vacuumization) and introducing the inert gas And replacing the gas in the chamber 7; melting the solid phase raw material 4 by heating; confirming and maintaining the melting; starting the curing by the temperature control and the action of the lifting drive mechanism 12; confirming the end of the curing; and annealing and ingot removal .

以上對使用矽作為固相原料之熱處理方法及其裝置進行了說明,本發明之固相原料之熱處理方法亦可適用於方式不同之澆鑄法、用於單晶之提拉之CZ(Czochralski,丘克拉斯基)法、自熔融液直接成長晶圓狀之結晶之帶狀法(ribbon method)、藉由在氬氣等惰性氣體中滴加熔融液之液滴使其結晶化之球狀矽法等熱處理方法及熱處理裝置。 The above description has been made on a heat treatment method and a device using ruthenium as a solid phase raw material, and the heat treatment method of the solid phase raw material of the present invention can also be applied to a CZ (Czochralski, Qiu) for casting of a single crystal in a different manner. The claskin method, a ribbon method in which a wafer is directly grown from a melt, and a spheroidal method in which a droplet of a molten metal is dropped by an inert gas such as argon. The heat treatment method and the heat treatment device.

(錠塊) (ingot)

本發明之錠塊(鑄造物)係藉由本發明之固相原料之熱處理方法而製造。 The ingot (casting product) of the present invention is produced by a heat treatment method of the solid phase raw material of the present invention.

於固相原料為矽材料之情形時,可製造矽錠塊。 In the case where the solid phase raw material is a tantalum material, a tantalum ingot can be produced.

(加工物) (processed product)

本發明之加工物可對錠塊進行加工而獲得。 The processed product of the present invention can be obtained by processing an ingot.

於固相原料為矽材料之情形時,可獲得源自矽材料之加工物。 In the case where the solid phase raw material is a tantalum material, a processed material derived from the tantalum material can be obtained.

如上所述,所謂源自矽材料之加工物,係指矽塊及矽晶圓等。 As described above, the processed material derived from the tantalum material refers to a tantalum block and a tantalum wafer.

矽塊例如可藉由使用帶鋸等公知之裝置,將本發明之矽錠塊切割加工為角柱狀而獲得。 The crucible block can be obtained, for example, by cutting a crucible ingot of the present invention into a prismatic shape by using a known device such as a band saw.

又,亦可視需要對矽塊之表面進行研磨加工。 Moreover, the surface of the block can be polished as needed.

矽晶圓例如可藉由使用多線切割機等公知之裝置,將上述矽塊切片加工為所需之厚度而獲得。現狀係厚度通常為170~200 μm左右,但現狀傾向係為了削減成本,而有薄型化之傾向。 The tantalum wafer can be obtained, for example, by processing a saw piece into a desired thickness by using a known device such as a multi-wire cutter. The current thickness is usually about 170 to 200 μm, but the current tendency is to reduce the cost and to reduce the thickness.

(矽太陽能電池) (矽 solar battery)

本發明之矽太陽能電池係使用本發明之源自矽材料之加工物(矽晶圓)而製造。 The tantalum solar cell of the present invention is produced by using the processed material (ruthenium wafer) derived from the tantalum material of the present invention.

矽太陽能電池單元例如可使用本發明之矽晶圓,並藉由公知之太陽能電池單元製程而製造。即,使用公知之材料並藉由公知之方法,於摻雜有p型雜質之矽晶圓之情形時,摻雜n型雜質形成n型層而形成pn接合,並形成表面電 極及背面電極而獲得矽太陽能電池單元。相同地,於摻雜有n型雜質之矽晶圓之情形時,摻雜p型雜質形成p型層而形成pn接合,並形成表面電極及背面電極而獲得矽太陽能電池單元。或者,除利用該等矽彼此之pn接合者以外,亦有夾持較薄之絕緣層而蒸鍍金屬等之MIS(Metal-Insulator-Semiconductor,金屬絕緣半導體)型太陽能電池,例如使與晶圓相反之導電型非晶質等之矽薄膜成膜,並利用不同結構之p型、n型矽異質接合者。又,將其複數個進行電性連接而獲得矽太陽能電池模組。 The tantalum solar cell can be fabricated, for example, using the tantalum wafer of the present invention and by a known solar cell process. That is, using a known material and in a case where a p-type impurity-doped germanium wafer is doped by a known method, an n-type impurity is doped to form an n-type layer to form a pn junction, and a surface electricity is formed. The solar cell is obtained from the electrode and the back electrode. Similarly, in the case of a germanium wafer doped with an n-type impurity, a p-type impurity is doped to form a p-type layer to form a pn junction, and a surface electrode and a back surface electrode are formed to obtain a germanium solar cell. Alternatively, a MIS (Metal-Insulator-Semiconductor) type solar cell, such as a wafer, may be deposited by sandwiching a thin insulating layer and depositing a metal such as a pn bond. On the contrary, a thin film of a conductive amorphous type or the like is formed, and a p-type or n-type germanium heterojunction of a different structure is used. Further, a plurality of them are electrically connected to obtain a tantalum solar battery module.

如上所述,於本說明書中,作為包含「太陽能電池單元」與「太陽能電池模組」之概念,簡略稱作「太陽能電池」。因此,若有揭示為例如「矽太陽能電池」者,則其包含「矽太陽能電池單元」及「矽太陽能電池模組」之含義。 As described above, in the present specification, the concept of "solar battery unit" and "solar battery module" is simply referred to as "solar battery". Therefore, if it is disclosed as "a solar cell", for example, it means "a solar cell" and "a solar cell module".

實施例Example

以下,藉由試驗例對本發明具體地進行說明,但本發明並非受該等試驗例限定。 Hereinafter, the present invention will be specifically described by way of Test Examples, but the present invention is not limited by the test examples.

(試驗例1)多晶矽錠塊之結晶粒徑之偏差相關之研究 (Test Example 1) Study on the deviation of crystal grain size of polycrystalline ingots

使用圖2中所示之熱處理裝置,並藉由本發明之固相原料之熱處理方法及先前之方法,分別進行5次多晶矽錠塊之熱處理,從而評價對溫度條件敏感之結晶粒徑(結晶核產生密度)之偏差。 Using the heat treatment apparatus shown in FIG. 2, and by heat treatment of the solid phase raw material of the present invention and the prior method, heat treatment of the polycrystalline ingots was performed five times, thereby evaluating the crystal grain size (crystal nucleation generation) sensitive to temperature conditions. Deviation of density).

於圖2所示之熱處理裝置內之石墨製之容器台3(880 mm×880 mm×厚度200 mm)上設置石墨製之外容器2(內部 尺寸:900 mm×900 mm×高度460 mm,底板壁厚及側面壁厚為20 mm),並於其中設置石英製之容器1(內部尺寸:830 mm×830 mm×420 mm,底板壁厚及側面壁厚為22 mm)。又,作為容器之溫度檢測設備,於容器1下表面中央附近設置容器下熱電偶(熱電偶A)5,並於外容器2下表面中央附近(容器下20 mm)之2處設置外容器下熱電偶(熱電偶B)6。又,作為加熱器之溫度檢測設備,於距離加熱器(石墨加熱器)10為40 mm之位置設置加熱器之輸出控制用熱電偶(熱電偶H)13。對各熱電偶中之檢測溫度分別標註下標,設為Ta、Tb及Th。 A container made of graphite is provided on the graphite container table 3 (880 mm × 880 mm × thickness 200 mm) in the heat treatment apparatus shown in Fig. 2 (internal container 2 Dimensions: 900 mm × 900 mm × height 460 mm, wall thickness and side wall thickness of 20 mm), and a quartz container 1 is provided therein (internal size: 830 mm × 830 mm × 420 mm, bottom plate wall thickness and The side wall thickness is 22 mm). Further, as a temperature detecting device for the container, a thermocouple (thermocouple A) 5 under the container is placed near the center of the lower surface of the container 1, and an outer container is placed at two places near the center of the lower surface of the outer container 2 (20 mm below the container). Thermocouple (thermocouple B) 6. Further, as a temperature detecting device for the heater, a thermocouple (thermocouple H) 13 for output control of the heater is provided at a position 40 mm from the heater (graphite heater) 10. The detection temperature in each thermocouple is marked with a subscript, and is set to Ta, Tb, and Th.

藉由設定檢測溫度Th並進行加熱器10之輸出調整之方式,以控制裝置9控制溫度,並每隔10秒記錄各檢測溫度Ta、Tb及Th。 The temperature is controlled by the control device 9 by setting the detection temperature Th and adjusting the output of the heater 10, and the respective detection temperatures Ta, Tb, and Th are recorded every 10 seconds.

圖2中之圖號7及8分別表示腔室及隔熱材料。 Figures 7 and 8 in Figure 2 show the chamber and the insulating material, respectively.

以使錠塊之比電阻成為約2 Ωcm之方式將硼摻雜劑濃度經調整之固相原料(矽)4之420 kg裝入容器1中,並設置於裝置內之特定位置。繼而,將裝置內抽成真空,並以氬氣進行置換。其後,使用加熱器10熔融固相原料4,於確認全部原料之熔解後,測定即將熔融結束之前固定化之基準溫度Tm。此處,對與熱電偶A及熱電偶B對應之基準溫度Tm分別標註下標,設為Tma及Tmb。 The 420 kg of the solid phase raw material (矽) 4 having the boron dopant concentration adjusted was placed in the container 1 so that the specific resistance of the ingot became about 2 Ωcm, and was set at a specific position in the apparatus. Then, the inside of the apparatus was evacuated and replaced with argon gas. Thereafter, the solid phase raw material 4 is melted by the heater 10, and after confirming the melting of all the raw materials, the reference temperature Tm to be immobilized immediately before the completion of the melting is measured. Here, the reference temperature Tm corresponding to the thermocouple A and the thermocouple B is denoted by a subscript, and is set to Tma and Tmb.

將本發明之固相原料之熱處理方法中的溫度修正之點設為自固相原料4之熔解結束起30分鐘後、且使用有包含冷卻槽11之升降驅動機構12的容器1之下降開始之1小時前。 The temperature correction point in the heat treatment method of the solid phase raw material of the present invention is set to 30 minutes after the completion of the melting of the solid phase raw material 4, and the lowering of the vessel 1 using the elevation drive mechanism 12 including the cooling tank 11 is started. 1 hour ago.

表1中顯示作為最佳溫度條件之最佳值(℃)。 The optimum value (°C) as the optimum temperature condition is shown in Table 1.

此處,「△Ta」係表示熱電偶A之(檢測溫度-固相原料之熔融穩定時之檢測溫度)Ta-Tma,「△Tb」係表示熱電偶B之(檢測溫度-固相原料之熔融穩定時之檢測溫度)Tb-Tmb。 Here, "△Ta" means thermocouple A (detection temperature - detection temperature at the time of melting stability of solid phase raw material) Ta-Tma, and "△Tb" means thermocouple B (detection temperature - solid phase raw material) The temperature at which the melt is stable is determined by Tb-Tmb.

根據表1而明確,由於使用熱電偶A及熱電偶B之任一者之資料,均可使△Ta與△Tb於誤差範圍內一致,因此於加熱控制溫度之修正中可適當選擇。又,根據該結果,可推測於與容器1具有熱導通之部分設置溫度檢測設備時亦可同樣地進行控制。 As is clear from Table 1, since the data of either of the thermocouple A and the thermocouple B can be used, ΔTa and ΔTb can be made to coincide within the error range, and therefore, the correction can be appropriately selected in the correction of the heating control temperature. Moreover, based on the result, it is presumed that the temperature detection device can be similarly controlled when the temperature detecting device is provided in a portion where the container 1 is thermally conductive.

於理想條件下,由於設定溫度差△Ts為-20℃,因此於實施例第1~5次中,以使△Ta及△Tb分別成為-20℃之方式,根據(△Ts-△T)算出控制用設定溫度Th之修正值,並僅以修正值修正其後之熱處理條件。 Under the ideal conditions, since the set temperature difference ΔTs is -20 ° C, in the first to fifth times of the embodiment, ΔTa and ΔTb are respectively set to -20 ° C, and (ΔTs - ΔT) The correction value of the control set temperature Th is calculated, and only the subsequent heat treatment conditions are corrected by the correction value.

即,若△Ta及△Tb分別為-23℃,則由於相比理想條件之設定溫度差△Ts(-20℃)低3℃,因此將設定溫度提高了3℃。具體而言,將Th自1450℃變更為1453℃,以下同樣地均以修正值修正溫度程式。 That is, when ΔTa and ΔTb are each -23 ° C, the set temperature is increased by 3 ° C because the set temperature difference ΔTs (-20 ° C) is lower than the ideal condition by 3 ° C. Specifically, Th was changed from 1450 ° C to 1453 ° C, and the temperature program was corrected by the correction value in the same manner.

於先前例第1~5次中,如表1所示,無上述溫度修正而進行熱處理。 In the first to fifth times of the prior art, as shown in Table 1, the heat treatment was carried out without the above temperature correction.

使用帶鋸將所獲得之各矽錠塊加工為矽塊25根(各156 mm×156 mm×200 mm),進而使用線鋸進行切片,獲得矽晶圓(156 mm×156 mm×厚度0.18 mm)約12,000片。 Each of the obtained ingots was machined into 25 pieces (156 mm × 156 mm × 200 mm each) using a band saw, and then sliced using a wire saw to obtain a tantalum wafer (156 mm × 156 mm × thickness 0.18 mm). ) About 12,000 pieces.

結晶粒徑評價係針對由各錠塊所切出之25根組塊中最接 近底部之晶圓而進行,並將25片晶圓之結晶粒徑之平均值設為該錠塊之平均結晶粒徑。再者,於評價結晶粒徑時,在多晶矽晶圓表面上可清楚觀察到之Σ3晶界於此處不計數為晶界。 The crystal grain size evaluation is the most suitable for the 25 blocks cut out from each ingot. The wafer was carried out near the bottom, and the average of the crystal grain sizes of the 25 wafers was set as the average crystal grain size of the ingot. Further, when the crystal grain size is evaluated, it is clearly observed on the surface of the polycrystalline silicon wafer that the grain boundary is not counted as a grain boundary here.

所謂Σ3晶界,於重合晶格理論(coincidence site lattice theory)中,係指由重合晶格之單位晶胞相對於結晶之單位晶胞之體積比率之倒數而定義的西格瑪值為3之晶界。由於Σ3晶界係源自於由單一之結晶核而成長之結晶粒內因應力等之影響而產生之積層缺陷,於評價結晶核之產生數之情形時不應計數為晶界,因此此處不計數為晶界。 The so-called 晶3 grain boundary, in the coincidence lattice theory, refers to the grain boundary defined by the reciprocal of the volume ratio of the unit cell of the coincident crystal lattice to the unit cell of the crystal. . Since the Σ3 grain boundary is derived from a layered defect caused by stress or the like in a crystal grain grown by a single crystal nucleus, it should not be counted as a grain boundary when evaluating the number of nucleation nuclei, so here Not counted as grain boundaries.

結晶粒徑係使用數位顯微鏡(基恩斯股份有限公司製造,型式:VHX-1000)而測定。 The crystal grain size was measured using a digital microscope (manufactured by Keynes Co., Ltd., type: VHX-1000).

將所獲得之結晶粒徑之評價結果示於表2。 The evaluation results of the obtained crystal grain size are shown in Table 2.

可知,表2係將實施例之5次之平均值設為100之結果,與先前例相比,實施例之5次之標準偏差較小,平均結晶粒徑一致,再現性良好,溫度控制良好地發揮作用。 Table 2 shows that the average value of the five times of the examples was 100. Compared with the previous examples, the standard deviation of the fifth time of the examples was small, the average crystal grain size was uniform, the reproducibility was good, and the temperature control was good. The ground works.

又,將所獲得之矽晶圓投入至通常之太陽能電池單元製程中,將每個錠塊製作成12,000個太陽能電池(外形156 mm×156 mm×厚度0.18 mm)並測定其輸出(W)。於各錠塊單元中採取輸出之平均值,將實施例之5次之平均值設為100之結果示於表2。 Further, the obtained germanium wafer was put into a usual solar cell process, and each ingot was fabricated into 12,000 solar cells (outer shape: 156 mm × 156 mm × thickness 0.18 mm) and the output (W) thereof was measured. The average value of the output was taken in each of the ingot units, and the result of setting the average of the five times of the examples to 100 was shown in Table 2.

根據結果可知,與先前例相比,實施例之5次之標準偏差較小,且就太陽能電池單元特性之方面而言,偏差亦較少。於各錠塊之平均輸出中,雖亦可觀察到先前例之測定 值高於實施例之平均值,但以5次之平均值進行比較之情形時,先前例之平均值比實施例低0.32%,可認為仍然係由於偏差而引起輸出整體降低。 According to the results, the standard deviation of the fifth time of the example was small as compared with the previous example, and the deviation was small in terms of the characteristics of the solar cell. In the average output of each ingot, the measurement of the previous example can also be observed. When the value is higher than the average value of the examples, but the average value of the five times is compared, the average value of the previous example is 0.32% lower than that of the embodiment, and it is considered that the output is still lowered as a whole due to the deviation.

又,將所獲得之先前例及實施例之太陽能電池單元投入至通常之太陽能電池模組製程中而製作太陽能電池模組,結果與太陽能電池單元同樣地,實施例之太陽能電池單元之太陽能電池模組與先前例之模組相比,可獲得平均輸出較高且偏差亦較少之傾向。 Moreover, the obtained solar cells of the prior art and the examples were put into a normal solar cell module process to produce a solar cell module, and as a result, similarly to the solar cell, the solar cell module of the solar cell of the example was produced. Compared with the modules of the previous examples, the group has a tendency to have a higher average output and less deviation.

以上,例示了多晶矽錠塊作為本發明之實施例之一例,藉由使用相同之溫度控制之觀點亦可對其他材料再現性良好地控制固化。 As described above, the polycrystalline germanium ingot is exemplified as an example of the embodiment of the present invention, and it is also possible to control the curing of other materials with good reproducibility by using the same temperature control.

於金屬等延展性材料中,由於根據結晶組織之差異而顯示各種特性,因此亦可應用本發明之熱處理方法。 In the ductile material such as metal, since various characteristics are exhibited depending on the difference in crystal structure, the heat treatment method of the present invention can also be applied.

於為脆性材料之情形時,亦存在因鑄造物內部之熱應力而產生破裂之情況,又,其中為半導體材料之情形時,存在因應力而導入結晶缺陷(錯位等),從而大幅降低作為電子裝置之特性之情況,又,與矽同樣地,存在結晶粒徑對特性造成較大影響之情況,本發明之熱處理方法可進一步發揮效果。 In the case of a brittle material, there is also a case where cracking occurs due to thermal stress inside the cast material, and in the case of a semiconductor material, crystal defects (dislocation, etc.) are introduced due to stress, thereby greatly reducing electrons. In the case of the characteristics of the device, as in the case of the ruthenium, there is a case where the crystal grain size greatly affects the characteristics, and the heat treatment method of the present invention can further exert an effect.

1‧‧‧容器 1‧‧‧ container

2‧‧‧外容器 2‧‧‧ outer container

3‧‧‧容器台 3‧‧‧ container table

4‧‧‧固相原料(矽) 4‧‧‧ Solid phase raw materials (矽)

5‧‧‧容器下熱電偶(熱電偶A) 5‧‧‧ Thermocouple under the container (thermocouple A)

6‧‧‧外容器下熱電偶(容器下20 mm熱電偶B) 6‧‧‧ Thermocouple under the outer container (20 mm thermocouple B under the container)

7‧‧‧腔室 7‧‧‧ chamber

8‧‧‧隔熱材料 8‧‧‧Insulation materials

9‧‧‧控制裝置 9‧‧‧Control device

10‧‧‧加熱器(石墨加熱器) 10‧‧‧heater (graphite heater)

11‧‧‧冷卻槽 11‧‧‧Cooling trough

12‧‧‧升降驅動機構 12‧‧‧ Lifting drive mechanism

13‧‧‧加熱器之輸出控制用熱電偶 13‧‧‧Thermal output control thermocouple

圖1係表示固相原料之熔融過程中的容器之檢測溫度之變化之概念圖。 Fig. 1 is a conceptual diagram showing changes in the detection temperature of a container during melting of a solid phase raw material.

圖2係表示可應用本發明之熱處理方法的熱處理裝置之一例之概略剖面圖。 Fig. 2 is a schematic cross-sectional view showing an example of a heat treatment apparatus to which the heat treatment method of the present invention can be applied.

Claims (10)

一種固相原料之熱處理方法,其係藉由加熱設備對收納於容器中之固相原料進行加熱將其熔融後,使上述固相原料固化,從而獲得其錠塊者,且該方法係藉由溫度檢測設備檢測上述固相原料之溫度,將上述固相原料即將熔融結束之前固定化之溫度設為基準溫度Tm℃,並基於上述基準溫度Tm℃進行溫度控制。 A method for heat-treating a solid phase raw material, which is obtained by heating a solid phase raw material stored in a container by a heating device, and then solidifying the solid phase raw material to obtain an ingot thereof, and the method is The temperature detecting device detects the temperature of the solid phase raw material, sets the temperature at which the solid phase raw material is fixed immediately before the completion of melting, and sets the temperature to the reference temperature Tm ° C, and performs temperature control based on the reference temperature Tm ° C. 如請求項1之固相原料之熱處理方法,其中上述溫度檢測設備係設置於上述容器、或與上述容器具有熱導通且可檢測與上述固相原料之溫度具有相關關係之溫度之位置而成。 The method for heat-treating a solid phase material according to claim 1, wherein the temperature detecting device is provided at the container or at a position having a temperature which is thermally conductive with the container and which can detect a temperature associated with the temperature of the solid phase material. 如請求項1之固相原料之熱處理方法,其中上述溫度控制包含於將上述溫度檢測設備之檢測溫度設為T℃、將與上述基準溫度Tm℃之差(Tm-T)℃設為△T℃、將熱處理中之所需之設定溫度差設為△Ts℃時,以(△Ts-△T)℃修正控制用設定溫度Th。 The method for heat-treating a solid phase raw material according to claim 1, wherein the temperature control is performed by setting a detection temperature of the temperature detecting device to T ° C, and setting a difference (Tm - T) ° C from the reference temperature Tm ° C to ΔT. °C, when the set temperature difference required for the heat treatment is ΔTs °C, the control set temperature Th is corrected by (ΔTs - ΔT) °C. 如請求項1之固相原料之熱處理方法,其中上述固相原料係上述錠塊用之脆性材料。 The method for heat-treating a solid phase raw material according to claim 1, wherein the solid phase raw material is a brittle material for the ingot. 如請求項4之固相原料之熱處理方法,其中上述脆性材料係多晶矽錠塊用之矽材料。 The method for heat-treating a solid phase material according to claim 4, wherein the brittle material is a tantalum material for a polycrystalline ingot. 一種錠塊之製造方法,其係使用如請求項1之固相原料之熱處理方法而製造錠塊。 A method of producing an ingot, which is produced by using a heat treatment method of the solid phase raw material of claim 1. 一種加工物之製造方法,其係對藉由如請求項6之製造 方法所製造之錠塊進行加工而獲得加工物。 A method of manufacturing a processed article, which is manufactured by the method of claim 6 The ingot produced by the method is processed to obtain a processed product. 如請求項7之加工物之製造方法,其中上述加工物係源自矽材料之加工物。 The method of producing a processed article according to claim 7, wherein the processed material is derived from a processed material of a tantalum material. 一種太陽能電池之製造方法,其係使用藉由如請求項8之製造方法所製造之加工物而獲得矽太陽能電池。 A method of producing a solar cell, which is obtained by using a processed article produced by the manufacturing method of claim 8. 一種固相原料之熱處理裝置,其係用於如請求項1之固相原料之熱處理方法之熱處理裝置,且該裝置包含:收納固相原料之容器、檢測上述固相原料之溫度之溫度檢測設備、加熱設備、以及檢測上述加熱設備之溫度之溫度檢測設備。 A heat treatment device for a solid phase raw material, which is used for a heat treatment device for a heat treatment method of a solid phase raw material according to claim 1, and the device comprises: a container for storing a solid phase raw material, and a temperature detecting device for detecting a temperature of the solid phase raw material , a heating device, and a temperature detecting device that detects the temperature of the heating device.
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