TW201330607A - Camera module - Google Patents

Abstract

The present invention relates to a camera module including a first PCB (Printed Circuit Board) mounted with an image sensor, a housing unit arranged at an upper surface of the first PCB, a holder module spaced apart from an inner floor surface of the housing unit at a predetermined distance, wound at a periphery with a first coil and formed at an inside with at least one lens, a second PCB coupled to a floor surface of the holder module, a third PCB coupled to an upper surface of the holder module, a plurality of wire springs connected at one end to the second PCB and connected at the other end to the third PCB, and a buffer unit absorbing force applied to the holder module.

Description

Camera module

The present invention relates to a camera module for use in smart phones and the like.

Small camera modules mounted on small electronic products are often subjected to vibrations during use. This is due to the slight vibration caused by the shaking of the user's hand during the camera or the shaking of the camera module. In view of such shortcomings, many methods of camera modules with anti-shake have recently been disclosed.

A technique well known in the prior art, Korean Patent No. 10-0741823 (announced in 2007, 7, 16) teaches a hand shake (hand shake) compensation mechanism in which a gyroscope sensing IC (integrated circuit) or The corner speed sensor is mounted in a device such as a mobile phone with a camera module mounted thereon.

However, installing a corner speed sensor also requires a detection sensor to complete the jitter compensation function, thus causing an increase in manufacturing cost and many cumbersome processes, such as requiring space to configure and install an anti-shake device in an imaging mode. Next to the group.

Therefore, there is a need to develop techniques for improving the anti-shake or hand-shock compensation function.

Accordingly, it is an object of the present invention to provide a camera module having an Optical Image Stabilizer (OIS) function.

In order to achieve the above object, the present invention provides a camera module, the camera module includes: a first PCB (printed circuit board) is mounted with an image sensor; a housing unit is arranged on an upper surface of the first PCB; a clamping module is spaced apart from an inner bottom surface of the housing unit by a predetermined distance, a first coil is wound around a periphery thereof and at least one lens is formed in an inner portion thereof; a second PCB and the clamping portion a third surface of the module is coupled to an upper surface of the clamping module; a plurality of wire springs are coupled to one end of the second PCB and connected to the other end of the third PCB; And a buffer unit absorbs the force applied to the clamping module.

Preferably, but not necessarily, the buffer unit may be a buffer member interposed between the clamping module and the third PCB.

Preferably, but not necessarily, the buffer member may be arranged on the upper surface of the housing unit facing an entire surface of the third PCB.

Preferably, but not necessarily, wherein the cushioning member is an anti-vibration member made of microcellular polyurethane.

Preferably, but not necessarily, the third PCB may have a pad having a uniform hole in the center of the pad for the wire spring to pass through.

Preferably, but not necessarily, the cushioning member is spaced apart from an end of the through hole by a predetermined distance.

Preferably, but not necessarily, the bumper may be spaced apart from an end of the pad by a predetermined distance.

Preferably, but not necessarily, the bumper can be interposed between the end of the through hole and the end of the pad.

Preferably, but not necessarily, the housing unit includes a first housing disposed on an upper surface of the first PCB, and a second housing disposed on an upper surface of the first housing, and the first housing The third PCB is mounted on the upper surface of the second casing, a first permanent magnet and a second permanent magnet are interposed between the first casing and the second casing, and a yoke is inserted therein. Between the first permanent magnet and the second permanent magnet, or on an inner surface of the first casing and the second casing to transmit a magnetic force into the clamping module.

Preferably, but not necessarily, the yoke is protuberable toward the clamping module near its center.

Preferably, but not necessarily, the camera module further includes a protective shell having a position of a matching unit corresponding to a connecting unit between the third PCB and the line spring and a lens module And installed to cover the housing unit.

Preferably, but not necessarily, the clamping module may comprise an outer flap wound around a periphery thereof by a first coil; a bobbin is elastically supported by an elastic member An upper surface of the outer flap, vertically movably disposed on an inner surface of the outer flap, wound around a periphery thereof by a second coil, and formed on an inner surface having at least one or more lenses; An upper and a lower elastic members are respectively arranged on the upper and lower surfaces of the bobbin to elastically support the bobbin relative to the outer fin.

Preferably, but not necessarily, the wire spring can be made of a metal material And electrically connected to the second and the third PCB.

Preferably, but not necessarily, at least six or more wire springs are provided to provide bipolar power for autofocus control and for optical image stabilization through the connection of the second PCB and the third PCB Driven by four-pole power.

Preferably, but not necessarily, a total of eight wire springs are provided, each having the same length, and the two wire springs are arranged in a set at each corner of the clamping module.

Preferably, but not necessarily, the first coil may be formed with a space unit at its center to allow a magnetic force magnetized toward the second coil.

Preferably, but not necessarily, the lower spring is electrically connectable to a wire spring on the second PCB.

Preferably, but not necessarily, the wire spring movably supports the clamping module, and the buffer unit may be a buffer portion bent in a specific section of the wire spring.

Preferably, but not necessarily, the buffer portion may be formed in a position close to the connection unit between the wire spring and the third PCB.

Preferably, but not necessarily, the buffer portion may be formed at a position close to the connection unit between the line spring and the third PCB and a connection unit between the line spring and the second PCB.

Preferably, but not necessarily, the buffer portion may be formed in a position close to the connecting unit between the wire spring and the second PCB.

Preferably, but not necessarily, the buffer unit may be a shock absorber formed on a side wall of the housing unit to be elastically deformed when the housing unit generates a shock.

Preferably, but not necessarily, the housing unit can include a first housing Arranging on an upper surface of the first PCB; a second housing is arranged on an upper surface of the first housing and the third surface of the first housing is formed; a first permanent magnet and a second permanent magnet are inserted Between the first housing and the second housing; and a yoke arranged between the first permanent magnet and the second permanent magnet to transmit a magnetic force to the clamping module, wherein the shock absorption The device is formed in the second housing.

Preferably, but not necessarily, the shock absorber can be formed on a side wall of the second housing.

Preferably, but not necessarily, the shock absorber is provided by forming at least one or more recesses in the sidewall of the second housing at a predetermined depth.

Preferably, but not necessarily, the shock absorber may be provided by forming at least three or more grooves of the side wall of the second casing at a predetermined depth, and each groove has the same depth, And spaced apart from the adjacent recesses by a predetermined distance, and alternately formed on an outer side surface and an inner side surface of the second housing.

A camera module according to the present invention has the effect that a line spring is formed with a buffer unit for absorbing a repeatedly applied load and being tightly coupled to a connection unit of a PCB.

Another effect is that even if a wire spring is subjected to excessive force during assembly of the lens module, a cushioning member can absorb the excessively applied force to improve assembly and reduce component loss caused by incomplete assembly.

10‧‧‧First PCB

11‧‧‧Image Sensor

20‧‧‧Sheet unit

21‧‧‧ first housing

22‧‧‧ second housing

23‧‧‧First permanent magnet

24‧‧‧Second permanent magnet

25‧‧‧ yoke

30‧‧‧Clamping module

31‧‧‧Outer flaps

31a, 31b, 31c, 31d‧‧‧ coil

32‧‧‧Bob

33‧‧‧Fixed parts

34‧‧‧Magnetic

35, 36‧‧ ‧ spring parts

37‧‧‧Spring through hole

40‧‧‧second PCB

50‧‧‧ Third PCB

51‧‧‧ solder pads

52‧‧‧terminal unit

53‧‧‧through holes

55‧‧‧ window

60‧‧‧Line spring

70‧‧‧ protective shell

80‧‧‧Hook unit

81‧‧‧ hook

82‧‧‧ hook hole

100‧‧‧ cushioning parts

110‧‧‧First bending unit

120‧‧‧second bending unit

C, D‧‧‧ part

w, w’‧‧‧ connection unit

1 is a schematic plan view of a camera module in accordance with an exemplary embodiment of the present invention.

Figure 2 is a cross-sectional view along line A-A.

3 is a side view of a camera module in accordance with a first exemplary embodiment of the present invention.

4 is a side view showing a state in which the protective case of FIG. 3 is removed.

FIG. 5 is an enlarged schematic view showing a portion B of FIG. 2 according to the first exemplary embodiment of the present invention.

Figure 6 is a cross-sectional view taken along line A-A of Figure 1 in accordance with a second exemplary embodiment of the present invention.

Figure 7 is an enlarged schematic view of a portion C of Figure 6.

Figure 8 is a cross-sectional view along line A-A in accordance with a third exemplary embodiment of the present invention.

Figure 9 is a cross-sectional view along line A-A in accordance with a fourth exemplary embodiment of the present invention.

Figure 10 is a cross-sectional view along line A-A in accordance with a fifth exemplary embodiment of the present invention.

11 and 12 are enlarged views of a portion D of Fig. 10, and a schematic cross-sectional view showing the operation state of a shock absorber according to an exemplary embodiment of the present invention.

Best Mode

Now, a camera module according to an exemplary embodiment of the present invention will be described in detail with reference to the drawings.

1 is a schematic plan view of a camera module in accordance with an exemplary embodiment of the present invention. Figure 2 is a cross-sectional view along line A-A. 3 is a side view of a camera module in accordance with a first exemplary embodiment of the present invention. 4 is a side view showing a state in which the protective case of FIG. 3 is removed. FIG. 5 is an enlarged schematic view showing a portion B of FIG. 2 according to the first exemplary embodiment of the present invention. Figure 6 is a cross-sectional view taken along line A-A of Figure 1 in accordance with a second exemplary embodiment of the present invention.

Figure 7 is an enlarged schematic view of a portion C of Figure 6. Figure 8 is a cross-sectional view along line A-A in accordance with a third exemplary embodiment of the present invention. Figure 9 is a cross-sectional view along line A-A in accordance with a fourth exemplary embodiment of the present invention. Figure 10 is a cross-sectional view along line A-A in accordance with a fifth exemplary embodiment of the present invention. 11 and 12 are enlarged views of a portion D of Fig. 10, and a schematic cross-sectional view showing the operation state of a shock absorber according to an exemplary embodiment of the present invention.

1 is a schematic plan view of a camera module according to an exemplary embodiment of the present invention and a cross-sectional view of FIG. 2 along line AA. A camera module includes a first PCB (printed circuit board) 10, a housing unit 20, A clamping module 30, a second PCB 40, a third PCB 50, a wire spring 60, and a buffer member 100.

An image sensor 11 is mounted near the center of the first PCB 10, and is preferably provided as a PCB substrate. The PCB 10 may be arranged with a plurality of terminal units for operating the image sensor 11, or a plurality of terminal units configured to output information of the image sensor 11.

The housing unit 20 is arranged on an upper surface of the first PCB 10 to form a skeleton of the camera module. The housing unit 20 according to an exemplary embodiment of the present invention includes a first housing 21. A second housing 22, a first permanent magnet and a second permanent magnet 23, 24, and a yoke 25.

The first housing 21 is a base that is arranged on the upper surface of the first PCB 10 and is spaced apart from the image sensor 11 by a predetermined distance. The first housing 21 can be further mounted with a filter configured to filter the image incident on the image sensor 11. The second housing 22 is arranged on the upper surface of the first housing 21 to cover the first housing 21. The second housing 22 is formed with an open unit near its center position to transmit an image to one side of the image sensor 10. The second casing 22 is attached and fixed to the upper surface of the third PCB 50 (which will be described later) using a fixing member such as a double-sided tape or an adhesive, but the present invention is not limited thereto. For example, a separate third PCB having a housing or a protective case may also be provided depending on the design of the product to use the fixing member to fix the third PCB 50 to an inner side wall. In the case where a third housing is provided, the third housing can support pressing the third PCB 50 without any fasteners.

The first and second permanent magnets 23, 24 are interposed between the first and second housings 21, 22 to magnetize the clamping module 30. The first and second permanent magnets 23, 24 are preferably of the same size. Further, if possible, the first and second housings 21, 22 and the yoke 25 may be arranged on an inner side of the first and second housings 21, 22, as the design permits.

Meanwhile, in the case where the first and second permanent magnets 23, 24 are enlarged, even a small current increases an Optical Image Stabilizer Driving, and at each of the first and second permanent magnets 23 When the 24 is configured to a predetermined size, when the current flowing through the first and second coils 31a, 32a arranged at the positions corresponding to the first and second permanent magnets 23, 24 is increased, the optical image stabilization drive is finally increased. It is. It is concluded that as the dimensions of the first and second permanent magnets 23, 24 increase, the improved optical image is stably driven. Of course However, the design of the optical size is preferably within the tolerance of other designs.

The yoke 25 is interposed between the first and second permanent magnets 23, 24. The yoke 25 is formed in the vicinity of the center to allow the magnetic forces 34 of the first and second permanent magnets 23, 24 to be magnetized to the inner space of the clamp module 30. Preferably, the width of the yoke 25 is the same as the width of the first and second permanent magnets 23, 24, and the center of the yoke 25 is a protrusion to allow the permanent magnet and the yoke to be formed in an approximately "T" shape.

The clamping module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance and includes an outer blade 31 and a bobbin 32. The clamping module 30 can perform a horizontal/vertical and diagonal swing while hanging the wire spring 60. An upper surface and a lower surface of the outer flap 31 are formed with spring members 35, 36 which are elastically supported and connected by the spring member 35 to allow the bobbin 32 to move vertically.

The outer fin 31 is wound by the four first coils 31a to 31d on the periphery of the four side faces as shown in Fig. 1, and the center portions of the four side faces wound by the coils 31a to 31d are no coils. Hollow part. Therefore, it is possible to arrange a yoke 25 at a position corresponding to the hollow space, and a part of the yoke 25 can be inserted in the space.

The outer flap 31 can be fixed to the lower surface of the second PCB 40 using a fixing member 33 such as a double-sided tape or an adhesive. The outer flap 31 is suspended by a plurality of wire springs 60, and is used for front/rear, left/right, and by the interaction of the magnetic forces of the first and second permanent magnets 22, 23 with the first coil 31a. The movement of the diagonal method, as indicated by the arrows in Fig. 2, is arranged in a manner spaced apart from the lower surface of the first housing 21 by a predetermined distance. The outer flap 31 can be provided with a plurality of spring through holes 37 to allow the wire spring 60 to pass through and be coupled to the second PCB 40.

The bobbin 32 is vertically movably arranged on an inner surface having the outer fin 31 and is formed on an inner surface having at least one or more lens sheets. The bobbin 32 is wound around the periphery having the second coil 32a, wherein the second coil 32a performs an up-lifting and down-lifting operation of the bobbin 32 through a subtraction of the outer fin 31 The open spaces of the first coils 31a to 31d use the yoke 25 to interact with the magnetic force magnetized. Although the larger size yoke 25 enables an AF drive. However, the size of the yoke 25 also needs to be varied according to an optimized design value. Therefore, the image focus transmitted to the image sensor 11 can be automatically adjusted by the lifting operation of the bobbin 32.

The second PCB 40 is arranged on the lower surface of the outer fin 31, as explained before, and is connected to the wire spring 60 to supply a power to the first and second coils 31a, 32a. The joining method can be by soldering or other conductive material. However, the connection method is not limited to this. That is, a connecting unit w' of the second PCB 40, as illustrated in FIG. 2, is connected to the first and second coils 31a, 32a to allow the power received by the line spring 60 to be transmitted to the first sum. The second coils 31a, 32a are formed to form an electromagnetic force.

At this time, the second coil 32a may be directly connected to the second PCB 40 or may be connected to the lower spring 36 as shown in FIG. 2 to allow the lower spring 36 to be connected to the second PCB 40.

The third PCB 50, as explained above, is fixed to an upper surface of the second housing 22 using a fixing member such as a double-sided tape or an adhesive, and is transferred to the third PCB 50 connected to the first PCB 10. The power of a terminal unit 52 is transmitted to the second PCB 40 through the wire spring 60 connected to the second PCB 40. The joining method can be by welding or other conductive material. However, the connection method is not limited to this.

Referring to Figures 3 and 4, a third PCB 50 is provided to cover the first and second housings One of the side wall surfaces of 21, 22 is provided, wherein a surface opposite to the first and second permanent magnets 23, 24 and the yoke 32 may be formed with a window to prevent mutual interference. This configuration is for preventing the first and second permanent magnets 23, 24 and the yoke 32 from being directly attached to a protective case 70 (described later) using fixing means such as epoxy resin. Interference.

Meanwhile, the second PCB and the third PCB may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a soft and hard composite board (Rigid-FPCB), but are not limited thereto, and may be any An electrically conductive substrate. The wire spring 60 is coupled to the ends of the second and third PCBs 40, 50. At this time, one end of the wire spring 60 is connected to a pad 51 formed on the third PCB 50, wherein the center of the pad 51 forms a constant hole 53 through which the wire spring 60 passes. The joining method can be by welding or other conductive material. However, the connection method is not limited to this. At the same time, the periphery of the pad is provided with a solder register to protect the surface of the third PCB 50, and the area of the pad 51 can be connected by the open area of the solder resist.

Therefore, the wire spring 60 connected from the pad 51 supplies the received power to the second PCB 40 end, wherein the first and second coils 31a, 32a can interact with the first and second permanent magnets 23, 24. Furthermore, the other end of the wire spring 60, although not shown, is connected to a pad (not shown) formed on the second PCB 40 as the third PCB 50, wherein the center of the pad (not shown) is formed. There is an opening (not shown) through which the wire spring 60 passes. The joining method can be by welding or other conductive material. However, the connection method is not limited to this.

Illustrated according to the configuration, the outer flap 31 can hang the wire spring and is spaced apart from the lower surface of the first housing 21 by a predetermined distance. Therefore, the outer flap 31 performs a swing to reflect the interaction between the first coil 31a and the first and second permanent magnets 23, 24 to transmit between the first coil 31a and the first and second permanent magnets 23, 24. Interaction to compensate for the hand The vibration caused by the vibration of the outer flap 31. For this purpose, the wire spring 60 is preferably a resilient, electrically conductive metal material that can withstand vibration.

At the same time, although the wire spring 60 is preferably thinner for better hand shake compensation motion, the thickness of the wire spring 60 can be varied according to an ideal design value. Preferably, the wire spring 60 has a thickness of several μm to several hundreds μm, and more preferably from 1 μm to 100 μm.

In addition, preferably, at least six wire springs 60 are provided, and at least two polarity powers are required for auto focus control and four polarity power for hand shake compensation, through the second and third PCBs 40, 50. The connection is supplied to the clamping module 30.

According to an exemplary embodiment of the present invention, a total of eight wire springs 60 are uniformly provided, each of which has a same length, and two wire springs are arranged in a set at each corner of the clamping module 30, as shown in FIG. And Figure 2 shows.

Meanwhile, as shown in FIG. 2, in a case where a separate third casing, such as a protective casing 70, is further included in the camera module according to an exemplary embodiment of the present invention, the third PCB 50 is formed with a a window 55 covering a side wall surface of the first and second housings 21, 22 to avoid a coupled part between the first and second permanent magnets 23, 24 and the yoke 25 because of the first and the The two permanent magnets 23, 24 and the yoke 25 are fixedly bonded to the protective case 70 using an epoxy resin.

Meanwhile, in the case of a configuration without a protective case 70, it is possible to form a third PCB 50 having a PCB or the like, and fixedly attached to the first and second permanent magnets 23, 24 and the yoke 25 Inside (thereinside). Alternatively, the third PCB 50 may be formed with a PCB and may be provided with a window 55 in which the first and second permanent magnets 23, 24 and the yoke 25 may be inserted, and a shielding tape may be externally Used additionally to strengthen the solid set.

The buffer member 100 is interposed between the second housing 22 and the third PCB 50 to absorb the force generated on the third PCB 50 for connecting the wire spring 60 and one of the third PCB 50 pads 51, or The force generated by the wire spring 60 absorbs the load applied to a connecting unit w.

The diameter of the through hole 53 is preferably slightly larger than the diameter of the wire spring 60. Moreover, when the wire spring 60 and the pad 51 of the third PCB 50 are connected, the through hole 53 can be designed to allow a connecting material such as a solder and a conductive material to flow in and allow the wire spring 60 to be fixedly connected. On the upper and lower surfaces of the third PCB 50.

The diameter of a support hole 122 is preferably slightly larger than the diameter of the wire spring 60, which is designed to prevent interference caused by the contact of the wire spring 60 with the second holder 22 near the support hole 122.

According to an exemplary embodiment of the present invention, the cushioning member 100 is preferably arranged on an entire surface of the second casing 22 opposite to the third PCB 50. Although not shown, the cushioning member 100 may be formed at the periphery of the connecting unit w.

The cushioning member 100 can be provided with an anti-vibration member having a microcellular polyurethane foam. An example of a microcellular polyurethane foam may be PORON (a trademark of Japan INOAC and Rogers, USA). However, the present invention is not limited thereto, and any material that can be elastically deformed by an external force can be used.

The cushioning member 100 may be spaced apart from the ends of the pad 51 and the through hole 53 by a predetermined distance to prevent the third PCB 50 from being split. Referring to FIG. 5, the buffer member 100 may be interposed between one end of the through hole 53 and one end of the pad 51 to fix the third PCB 50 and the second case 22 to be reduced. Less load is directly applied to the connection unit w of the fixed wire spring 60.

Furthermore, the cushioning member 100 can perform the buffering function by being arranged at an end of the support hole 122 between the third PCB 50 and the second casing 22, or at a position separated from the end of the support hole 122 by a predetermined distance.

Meanwhile, the general assembly sequence is to first couple the bobbin 32 with the outer fin 31, connect the second housing 22, the second and third PCBs 40, 50 to the wire spring 60 using a jig, and provide A bobbin 32 having a lens barrel is coupled to the first housing 21 and then mounted to the first PCB 10. The permanent magnet and the yoke can be coupled prior to the connection of the first housing 21. This assembly sequence can be changed if needed. That is, it can be assembled directly without using a jig. In the assembly process, the cushion member 100 can absorb the excessive force even when excessive force for inserting the bobbin 32 having the lens barrel is applied to generate an unnecessary load to the connecting unit w.

That is, as shown in FIGS. 2 and 5, since the buffer member 100 is brought into surface contact with the pad 51, the load system is pulled in the direction of gravity or horizontally swayed when a load is generated to generate the wire spring 60. Initially applied to the pad 51, and the force applied to the pad 51 is sequentially applied to the bumper 100 and deformed, wherein the load energy is absorbed by the buffer 100 as the same deformed energy. Thus, the trouble of re-executing the connection work due to the destruction of the connection unit w or the useless components during the assembly process can be avoided.

Meanwhile, the camera module according to an exemplary embodiment of the present invention may further include a protective case 70 having a consistent hole at a position of the corresponding lens module 30, and the protective case 70 is surrounded by the connection unit w of the wire spring 60 and the third PCB 50. And installed to cover the housing units 21, 22. In this example, the third PCB 50, as explained above, can be fixedly attached to the protective case 70 An inner surface. However, the protective case 70 is not an essential component and may be omitted depending on the configuration of the housing units 21, 22.

Referring now to FIG. 2, the protective casing 70 may be formed with a hook unit 80 on at least one surface or four surfaces thereof for fixing the first casing 21. The location may be within a center or within a margin of allowable design, and the number of such protective shells may be one or more than one. The hook unit 80 may include a hook portion 81 protruding from the first housing 21, and a hook hole 82 passing through the protective case 70 opposite to the hook portion 81. And if necessary, can also be the opposite configuration.

Invention Mode

Hereinafter, a camera module according to a second exemplary embodiment of the present invention will be described in detail with reference to the drawings, and the same component symbols as those of the first exemplary embodiment of the present invention will be used.

The buffer unit 100 according to the second exemplary embodiment of the present invention may be integrally formed with a partial section of the wire spring 60. Referring to FIGS. 6 and 7, the buffer unit 100 may separately form a connection unit w between the wire spring 60 and the third PCB 50, and a connection unit w' adjacent to the wire spring 60 and the second PCB 40, respectively. At this time, the buffer unit 100 preferably has the first and second bending units 110, 120 in a position that does not interfere with the second housing 22. However, the present invention is not limited thereto, and if necessary, the bending unit may be bent twice to absorb the load applied to the wire spring 60 at the bending positions.

That is, as shown in FIG. 7, according to the load applied to the wire spring 60, wherein the wire spring 60 is deformed in one direction and the wire spring 60 in the deformation direction is a straight line, the first and the The two bending units 110, 120 may be the moment center of the line spring 60 of the deformation section. As such, for each of the first and second bending units 110, 120, the deformation acts to absorb the load applied to the wire spring 60, thereby being applied to the third PCB The load of the pad 51 on the 50 is alleviated, and the load applied directly to the connection unit w of the fixed wire spring 60 is also alleviated.

According to the image pickup module of the third exemplary embodiment of the present invention, the buffer unit 100 may form only a position near the connection unit w between the wire spring 60 and the third PCB 50. That is, since the connection unit w between the wire spring 60 and the third PCB 50 is at a concentrated load position of the wire spring 60 of the suspension clamp module 30, compared with the first surface mounted on the outer surface of the outer blade 31 In the case of the connection unit w' to which the two PCBs 40 are connected, a relatively large force is applied. Therefore, the cushioning member 100 can form only a position near the connection unit w between the wire spring 60 and the third PCB 50.

Furthermore, according to a fourth exemplary embodiment of the present invention, the buffer unit 100 may be formed only at a position close to the connection unit w' between the wire spring 60 and the second PCB 40, as shown in FIG.

Of course, as explained above, although the position with the concentrated load is the connection unit w between the wire spring 60 and the third PCB 50, and even the buffer unit 100 existing in the form of an extension of the load forms the wire spring 60 and the In the vicinity of the connection unit w' of the second PCB 40, load absorption will occur at this position as in the first and second exemplary embodiments of the present invention to apply the line spring 60 and the third PCB in a resultant manner. The load of the connection unit w between 50.

According to a fifth exemplary embodiment of the present invention, a shock absorber 100 may be formed on a side wall of the second casing 22. The shock absorber 100, as shown in Figures 10, 11 and 12, may be in the shape of at least one or more grooves of a predetermined depth in the side walls of the second housing 22. The shock absorber 100 formed in a groove shape may have a depth smaller than that of the second casing 22. The shock absorber 100 can have There is at least one or more recesses at a predetermined depth over the entire sidewall of the second housing 22.

At this time, each groove has the same depth and may be spaced apart from an adjacent groove by a predetermined distance. Furthermore, the shock absorbers 100 are alternately formed on an outer side surface and an inner side surface of the second housing 22 as shown in the drawing.

In the case where the shock absorber 100 is formed, and because the cross section of the side wall of the second casing 22 is formed in a zigzag shape, and when an external shock is applied to the second casing 22, each wall surface is formed as shown in FIG. The groove-shaped shock absorber 100 is closer to the two sides to elastically deform the second casing 22, whereby the external shock energy can be converted into displacement energy. Therefore, the shock absorber 100 can absorb the external vibration through the elastic deformation of the second casing 22 to reduce the load generated by the movement of the clamping module 30 to be transmitted to the connecting unit between the wire spring 60 and the third PCB 50. w, whereby the damage to the connecting unit w is minimized.

The above description of the present invention is provided to enable those skilled in the art to make or use the invention. Various modifications and variations of the present invention are apparent to those skilled in the art, and the invention can be applied to various other modifications and embodiments without departing from the spirit and scope of the invention. The invention has been described with reference to a number of illustrative embodiments, which are not intended to limit the scope of the invention.

Industrial Utilization

As apparent from the above description, the camera module according to an exemplary embodiment of the present invention has an industrial applicability, so that it can be applied to a camera module mounted on a small electronic device such as a mobile phone or a tablet computer.

10‧‧‧First PCB

11‧‧‧Image Sensor

20‧‧‧Sheet unit

21‧‧‧ first housing

22‧‧‧ second housing

23‧‧‧First permanent magnet

24‧‧‧Second permanent magnet

25‧‧‧ yoke

30‧‧‧Clamping module

31‧‧‧Outer flaps

31a‧‧‧First coil

32‧‧‧Bob

32a‧‧‧second coil

33‧‧‧Fixed parts

34‧‧‧Magnetic

35, 36‧‧ ‧ spring parts

37‧‧‧Spring through hole

40‧‧‧second PCB

50‧‧‧ Third PCB

52‧‧‧terminal unit

60‧‧‧Line spring

70‧‧‧ protective shell

80‧‧‧Hook unit

81‧‧‧ hook

82‧‧‧ hook hole

100‧‧‧ cushioning parts

w, w’‧‧‧ connection unit

Claims (20)

A camera module includes: a first PCB (printed circuit board) mounted with an image sensor; a housing unit arranged on an upper surface of the first PCB; a clamping module to be predetermined The distance is spaced apart from an inner bottom surface of the housing unit, a first coil is wound around a periphery of the clamping module, and at least one lens is formed in an interior of the clamping module; a second PCB and the a lower surface of the clamping module is coupled; a third PCB is coupled to an upper surface of the clamping module; a plurality of wire springs are coupled to one end of the second PCB and to the other end of the third PCB Connecting; and a buffer unit absorbing the force applied to the clamping module. The camera module of claim 1, wherein the buffer unit is a buffer member interposed between the clamping module and the third PCB. The camera module of claim 2, wherein the buffer member is an anti-vibration member of a microcellular polyurethane foam. The camera module of claim 2, wherein the third PCB is a solder pad having a consistent hole at a center thereof, the through hole is for the wire spring to pass through, and wherein the buffer member is at a predetermined distance And spaced apart from either end of the via and one end of the pad. The camera module of claim 4, wherein the buffer member is interposed between the end of the through hole and the end of the pad. The camera module of claim 2, wherein the housing unit comprises a first housing disposed on an upper surface of the first PCB, and a second housing disposed in the first housing. An upper surface, and the third PCB is mounted on the upper surface of the second housing, a first permanent magnet and a second permanent magnet are interposed between the first housing and the second housing, and The yoke is interposed between the first permanent magnet and the second permanent magnet or on an inner surface of the first casing and the second casing to transmit a magnetic force into the clamping module, and One of the spatial units is formed at the center of the first coil to allow the magnetic force to be transmitted to the second coil. The camera module of claim 2, further comprising a protective shell having a position of a matching unit corresponding to a connecting unit between the third PCB and the line spring and a lens module And installed to cover the housing unit. The camera module of claim 2, wherein the clamping module comprises an outer flap wound around a periphery thereof by a first coil; a bobbin is supported by an elastic member Elastically supported on an upper surface of the outer flap, vertically movably arranged on an inner surface of the outer flap, surrounded by a second coil at its periphery and formed on at least one or more lenses An inner surface; and an upper elastic member and a lower elastic member are respectively arranged on the upper surface and the lower surface of the bobbin to elastically support the bobbin relative to the outer fin. The camera module of claim 2, wherein the wire spring is made of a metal material to be electrically connected to the second PCB and the third PCB, and at least six or more wires are provided therein. The spring supplies the polarity power of the clamping module for autofocus control and the quadrupole power for optical image stabilizer driving through the connection of the second PCB and the third PCB. The camera module of claim 9, wherein a total of eight wire springs are provided, each having the same length, and the two wire springs are arranged in a set at each corner of the clamping module. The camera module of claim 8, wherein the second coil is electrically connected to the lower spring and the lower spring is electrically connected to the wire spring on the second PCB. The camera module of claim 1, wherein the wire spring movably supports the clamping module, and the buffer unit is a buffer portion bent in a predetermined section of the wire spring. The camera module of claim 12, wherein the buffer portion is formed at a position close to a connecting unit between the wire spring and the third PCB. The camera module of claim 12, wherein the buffer portion is formed between the connection unit between the line spring and the third PCB at a position and between the line spring and the second PCB. a connected unit. The camera module of claim 12, wherein the buffer portion is formed at a position close to the connecting unit between the wire spring and the second PCB. The camera module of claim 1, wherein the buffer unit is a shock absorber formed on a side wall of the housing unit to be elastically deformed when the housing unit generates vibration. The camera module of claim 16, wherein the housing unit comprises a first housing disposed on an upper surface of the first PCB; and a second housing disposed in the first housing The upper surface and the upper surface thereof is formed with the third PCB; a first permanent magnet and a second permanent magnet are interposed between the first and the second housing; and a yoke is arranged on the first permanent magnet And transmitting a magnetic force to the clamping module between the second permanent magnet, wherein the shock absorber is formed in the second housing. The camera module of claim 17, wherein the shock absorber is formed on a side wall of the second casing. The camera module of claim 18, wherein the shock absorber is provided by forming at least one or more grooves of the side wall of the second casing at a predetermined depth, and wherein each A groove has a depth value that is less than a thickness of the second casing. The camera module of claim 17, wherein the shock absorber is provided by forming at least three or more grooves of the side wall of the second casing at a predetermined depth, and each The grooves have the same depth and are spaced apart from the adjacent grooves by a predetermined distance, and are alternately formed on an outer side and an inner side of the second casing.