TW201326470A - Composite material electroplating equipment - Google Patents

Abstract

A composite material electroplating equipment is provided. The equipment includes a homogenization tank having a stirrer disposed therein, and an electroplating tank adjacent to the homogenization tank. The homogenization tank connects to the electroplating tank through an overflow channel, and a substance inside the homogenization tank is pumped into the electroplating tank.

Description

Composite plating equipment

This case relates to composite manufacturing equipment, and more particularly to an apparatus for manufacturing composite materials by electroplating.

Composite materials usually use two or more materials with different physical or chemical properties, so that the finished product can have the characteristics of each material at the same time. In the electroplating process, the main materials are metal ions and non-metal particles, and During the electroplating process, the non-metallic particles are also mixed in the plating solution. When the metal is electroplated on the test piece, the non-metallic particles are also attached to the test piece, so that the two materials having different physicochemical properties are combined to form a composite. The effect of the material.

However, since non-metal particles are usually not charged and are not soluble in an aqueous solution such as a plating solution, if an attempt is made to uniformly attach non-metal particles to the test piece during the plating process, homogenization must be performed to make the non-metal The particles can be evenly dispersed in the plating solution, so that it is possible to uniformly adhere to the test piece during the plating process. However, in the current electroplating process of composite materials, non-metallic particles, such as ceramic particles, are homogenized in a homogenizer before being uniformly dispersed in the plating solution, and then the plating solution is transported and transported to the plating solution. Electroplating is carried out in the machine, and during this handling and transportation, non-metallic particles are gradually deposited and precipitated, and sometimes they are close to each other and agglomerate. In order to avoid these unhealthy phenomena, the conventional technology is more effective in the degree of homogenization, hoping to use a higher degree of homogenization to compensate for the precipitation and aggregation that will occur during transportation and transportation. However, there is no fundamental improvement in the handling and transportation problems.

For this reason, the applicant invented the "composite plating equipment" in the present case in view of the lack of the prior art to improve the lack of the above-mentioned conventional means.

The object of the present invention is to improve the manufacturing yield of the composite material and reduce the occurrence of defects to achieve the production result of the high-quality composite material, especially in the aspect of improving the composite material technology manufactured by the electroplating method, by the apparatus of the present invention. Significantly reduce the deposition of one of the composite materials and the uneven distribution of the whole material, so that the mixing and compounding process of each material can be integrated with the electroplating process to form a complete manufacturing process, that is, the materials are prepared from From mixing to electroplating, it can be done in one device, reducing the handling time of material handling and greatly reducing the risk of deposition and deterioration of materials during transport. In addition, the waste liquid can be immediately recovered and reused, which greatly reduces the processing time of the waste liquid, in other words, improves the use efficiency and reduces waste.

In order to achieve the above object, the present invention provides a composite plating apparatus comprising: a homogenizing tank having a stirring rod therein; and a plating tank adjacent to the homogenizing tank, wherein the homogenizing tank and the plating tank pass through The flow channels are connected to each other, and the substances in the homogenization tank are fed into the plating tank through a pump.

In order to achieve the above object, the present invention further provides a composite material manufacturing apparatus comprising: a body separated into a plating tank and a homogenizing tank; and a transport pump for transporting material in the homogenizing tank to the plating tank .

In order to achieve the above object, the present invention further provides a composite material manufacturing apparatus comprising: a homogenizing tank; and a plating tank, wherein the homogenizing tank and the upper portion of the plating tank are connected by an overflow passage inclined to the homogenous trough, The homogenous trough and the bottom of the electroplating tank are communicated through a transport passage to transport the material to the electroplating tank.

The following describes the embodiments of the "composite manufacturing equipment" of the present invention, please refer to the accompanying drawings, but the actual configuration and the method adopted do not have to completely conform to the described contents, and those skilled in the art can Various changes and modifications are made without departing from the actual spirit and scope of the case.

Please refer to FIG. 1 , which is a schematic diagram of an embodiment of the present invention. It includes a homogenizing tank 1 and a plating tank 2. The present invention is a manufacturing apparatus for composite materials. As the name implies, two or more materials of different properties are mixed and manufactured into a single structure, usually a metal material and a non-metal material such as ceramic powder, and ceramic powder. It cannot be dissolved in the plating solution. Therefore, if the ceramic powder is smoothly attached to the test piece 3, the ceramic powder must be uniformly dispersed in the electrolyte. Therefore, the homogenization tank 1 is as uniform as possible for the non-metal material. Diffusion in the electrolyte to prevent precipitation and agglomeration. Generally, the homogenizing tank 1 has a stirring motor 12 rotating a stirrer 10 for disturbing the electrolyte, so that the non-metallic material therein flows along with the electrolyte, so that the non-metal material itself is uniformly dispersed in the electrolyte. However, since the temperature of the liquid is raised while stirring the liquid, the agitator 10 does not continue to operate after the start-up, and the agitation motor 12 can be stopped as long as the uniformity reaches the demand.

Referring to FIG. 1 , when the non-metallic material in the homogenizing tank 1 is evenly dispersed, the liquid in the homogenizing tank 1 is sent into the plating tank 2 by a conveying passage 4, and there is a gang in the path of the conveying passage 4. Pu (not shown) to push the liquid. In the embodiment of FIG. 1, but not limited to, by means of spring plating, the liquid is fed upward from the lower side of the plating tank 3, thereby offsetting the precipitation effect of gravity on the non-metal material in the plating solution, but due to electroplating The liquid in the tank 2 is not as intensely stirred as in the homogenizing tank 1, so that there is still a gradual precipitation, and it is even possible to condense into a block. Therefore, a stopper 7 is provided in the plating tank 2 near the bottom to avoid The precipitated, agglomerated non-metallic material blocks the outlet of the delivery channel 4 or falls back into the delivery channel 4.

Referring to FIG. 1 , a metal block 6 is further connected to the DC positive electrode 60 in the plating tank 2 for providing metal ion plating on the test piece 3, and the test piece 3 is rotated by a motor 30 to facilitate the adhesion of the composite material. In the test strip 3, in addition, a DC negative electrode 31 is electrically connected to the test strip 3 through a circuit (not shown) between the motor 30 and the test strip 3, so that metal ions can acquire electrons and adsorb on the test strip 3. on. Since the liquid in the homogenizing tank 1 is transported into the plating tank 2, the liquid in the plating tank 2 may overflow too much. Therefore, the manufacturing apparatus of the present invention further provides an overflow passage between the homogenizing tank 1 and the plating tank 2. 5, and inclined toward the homogenizing tank 1, when the liquid level in the plating tank 2 is high to the overflow passage 5, the liquid flows into the homogenizing tank 1 at a proper rate. In addition, an electric field rectifying shutter 20 may be further added to the plating tank 2 so that the electric field is concentrated as much as possible onto the test piece 3. The electric field rectifying shutter 20 is usually a thin plate having an intermediate opening, and the diameter of the opening is matched with the length of the test piece 3, and the opening diameter is at least equal to the length of the test piece 3.

Please refer to FIG. 2, which is a schematic diagram of another embodiment of the present invention. Wherein, the composite plating apparatus of the present invention exhibits an integral shape, that is, a body but separated into a plating tank 2 and a homogeneous tank 1, and it can be said that the plating tank 2 and the homogenizing tank 1 of FIG. 1 share a tank wall. The way to reduce the lateral volume. An overflow notch 5' is also provided between the homogenizing tank 1 and the plating tank 2 for directly returning to the homogenizing tank 1 when the liquid level in the plating tank 2 is higher than the overflow notch 5', thereby achieving the effect of direct recovery. The homogenization tank 1 also has a stirring motor 12 rotating an agitator 10 for disturbing the electrolyte, so that the non-metallic material flows along with the electrolyte, so that the non-metal material itself is uniformly dispersed in the electrolyte. However, since the temperature of the liquid is raised while stirring the liquid, the agitator 10 does not continue to operate after the start-up, and the agitation motor 12 can be stopped as long as the uniformity reaches the demand. It is also possible to empirically decide to start the stirring motor 12 again after stopping the stirring for a long time.

Referring to FIG. 2, the liquid in the homogenization tank 1 is sent to the plating tank 2 through a conveying passage 4, and a pump 8 is disposed in the path of the conveying passage 4 to transport the liquid. Of course, the embodiment of FIG. 2 can still transport the liquid from the bottom of the plating tank 2 by means of the spring plating method shown in FIG. 1. However, the embodiment of FIG. 2 discloses another way of supplying the liquid, that is, The upper portion of the plating tank 2 is sprinkled through the shower hole 40 in the plating tank 2, so that the non-metal material in the liquid settles due to gravity and reaches the test piece 3, and when the composition of the metal block 6 is dissolved in the plating tank 2 When the formed metal ions are electroplated on the test piece 3, the non-metal materials are also attached to the test piece 3 together, thus achieving the effect of the composite material. In addition, a stopper 7 is also provided under the plating tank 2 for blocking the metal block 6 from falling downward. At the lower end of the plating tank 2, there is a lid body 21. After a long period of operation, the electroplating tank operated by gravity sedimentation, wherein the non-metal material is gradually deposited at the bottom of the plating tank 2, for the convenience. Therefore, a cover body 21 is disposed at the bottom of the plating tank 2, and in addition to discharging the liquid without inverting the plating tank 2, non-metallic materials can be collected in the cover body 21 for cleaning the plating tank 2 and The recycling of the non-metallic material is very simple. Preferably, the bottom of the plating tank 2 can be designed as a tapered funnel shape, so that the effect of depositing non-metallic materials in the lid body 21 can be more effectively achieved. In addition, an electric field rectifying shutter 20 may be further added to the plating tank 2 so that the electric field is concentrated as much as possible onto the test piece 3. The electric field rectifying shutter 20 is usually a thin plate having an intermediate opening, and the diameter of the opening is matched with the length of the test piece 3, and the opening diameter is at least equal to the length of the test piece 3.

In summary, the "composite material manufacturing equipment" of the present invention allows the homogenization tank to directly and directly pump the liquid into the plating tank after the homogenization operation is completed, so that the homogenized non-metal material can be electroplated. The process is attached to the test piece to prevent deposition and agglomeration during the process of transporting the homogeneous liquid. However, since the present invention directly feeds the homogeneous liquid into the plating tank, the non-metallic material is too late to precipitate. Or agglomerated. Further, the spring is plated to slow down the precipitation, or the sedimentation is used to reduce the disturbance of the liquid as much as possible to supply the non-metallic material. In addition, an overflow channel or overflow gap allows the excess liquid to be returned to the homogenization tank when there is too much liquid in the plating tank, so that the liquid can be reused immediately without the need for conventional techniques. The additional liquid is collected separately and sent back to the homogenization tank for re-homogenization. From this point of view, the manufacturing apparatus of the present invention integrates the two processes of homogenization and electroplating into nearly one step, that is, rapid electroplating after homogenization, and greatly reduces the precipitation and agglomeration of the homogeneous liquid during handling and transportation. The possibility of precipitation, deposition, or agglomeration is greatly reduced, although it is impossible to reduce to zero, but at least the present invention also reduces the extent of these undesirable phenomena to a very low level by directly supplying the homogeneous liquid to the plating tank. Since the method can greatly reduce the possibility of precipitation and agglomeration of non-metallic materials, that is, non-metallic materials can be more uniformly attached to the test piece during the electroplating process. The invention reduces the transportation time and the path of the homogeneous liquid to the shortest by the homogenization groove and the plating tank disposed adjacent to each other to avoid deposition, precipitation, or agglomeration as much as possible, thereby increasing the yield of the composite material manufacturing. It can be seen that the present invention contributes greatly to the manufacturing technology of composite materials.

Example:

A composite plating apparatus comprising: a homogenizing tank having a stirring rod therein; and a plating tank adjacent to the homogenizing tank, wherein the homogenizing tank and the plating tank communicate with each other through an overflow passage A pump feeds the contents of the homogenization tank into the plating tank.

2. The apparatus of embodiment 1, wherein the overflow passage is an upper portion that communicates the homogenous tank with the plating tank.

3. The apparatus of embodiment 1, further comprising a delivery line communicating the homogenous trough and a lower portion of the electroplating tank, wherein the pump is disposed on the delivery line.

4. A composite plating apparatus comprising: a body separated into a plating bath and a homogenizing tank; and a transport pump that transports material in the homogenizing tank to the plating tank.

5. The electroplating apparatus of embodiment 4, wherein there is an overflow gap between the plating bath and the homogenization tank, so that liquid in the plating tank can overflow to the homogenization tank.

6. The electroplating apparatus of embodiment 4, wherein the material in the homogenous trough is delivered to the electroplating bath in a spring manner.

7. The electroplating apparatus of embodiment 4, wherein the material in the homogenization tank is injected from above the plating bath.

8. A composite plating apparatus comprising: a homogenization tank; and a plating tank, wherein the homogenization tank and the upper portion of the plating tank are connected by an overflow passage inclined to the homogenization tank, and the homogenization tank and the plating tank The bottom of the bottom is communicated through a delivery channel that causes the homogenous trough to deliver material to the plating bath.

9. The electroplating apparatus of embodiment 8, wherein the homogenizing tank and the electroplating tank are combined into a double tank structure.

10. The electroplating apparatus of embodiment 8, wherein the electroplating bath is further provided with an electric field rectifying shutter.

The above-described embodiments are merely examples for the convenience of the description, and those skilled in the art will be modified as described above, and are not intended to be protected as claimed.

1. . . Homogeneous trough

10. . . Stir bar

12. . . Mixing motor

2. . . Plating tank

20. . . Electric field rectifying shutter

twenty one. . . Cover

3. . . Audition

30. . . motor

31. . . DC negative

4. . . Conveying channel

40. . . Shower hole

5. . . Flow channel

5’. . . Overflow hole

6. . . Metal block

60. . . DC positive electrode

7. . . Stop

8. . . Pump

Figure 1 is a schematic view of an embodiment of the present invention;

2 is a schematic view of another embodiment of the present invention.

1. . . Homogeneous trough

10. . . Stir bar

12. . . Mixing motor

2. . . Plating tank

20. . . Electric field rectifying shutter

3. . . Audition

30. . . motor

31. . . DC negative

4. . . Conveying channel

5. . . Overflow channel

6. . . Metal block

60. . . DC positive electrode

7. . . Stop

Claims (10)

A composite material electroplating apparatus comprising: a homogenizing tank having a stirring rod therein; and a plating tank adjacent to the homogenizing tank, wherein the homogenizing tank and the plating tank communicate with each other through an overflow passage, and through a group of Pu sent the substance in the homogenization tank to the plating tank. The apparatus of claim 1, wherein the overflow passage is an upper portion that communicates the homogenous tank with the plating tank. The apparatus of claim 1, further comprising a delivery line connecting the homogenous trough and a lower portion of the electroplating tank, wherein the pump is disposed on the delivery line. A composite plating apparatus includes: a body divided into a plating tank and a homogenizing tank; and a transport pump that transports material in the homogenizing tank to the plating tank. The electroplating apparatus of claim 4, wherein an overflow gap is formed between the plating tank and the homogenization tank, so that liquid in the plating tank can overflow to the homogenization tank. The electroplating apparatus according to claim 4, wherein the material in the homogenization tank is conveyed into the plating tank in a spring manner. The electroplating apparatus of claim 4, wherein the material in the homogenization tank is injected from above the plating tank. A composite plating apparatus comprising: a homogenization tank; and a plating tank, wherein the homogenization tank is connected to an upper portion of the plating tank by an overflow passage inclined toward the homogenization tank, and the homogenization tank and the bottom of the plating tank Then, through a conveying passage, the homogeneous tank conveys material to the plating tank. The electroplating apparatus according to claim 8, wherein the homogenizing tank and the electroplating tank are combined into a double tank structure. The electroplating apparatus of claim 8, wherein the electroplating bath is further provided with an electric field rectifying shutter.