TW201319479A - Cooling device for housing - Google Patents
Cooling device for housing Download PDFInfo
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- TW201319479A TW201319479A TW101134147A TW101134147A TW201319479A TW 201319479 A TW201319479 A TW 201319479A TW 101134147 A TW101134147 A TW 101134147A TW 101134147 A TW101134147 A TW 101134147A TW 201319479 A TW201319479 A TW 201319479A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0211—Control thereof of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2700/00—Means for sensing or measuring; Sensors therefor
- F25D2700/12—Sensors measuring the inside temperature
- F25D2700/123—Sensors measuring the inside temperature more than one sensor measuring the inside temperature in a compartment
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2700/00—Means for sensing or measuring; Sensors therefor
- F25D2700/14—Sensors measuring the temperature outside the refrigerator or freezer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
本發明是有關於框體用冷卻裝置,用以冷卻框體,該框體收容有控制基板等之發熱的零件(也稱為發熱體)。 The present invention relates to a cooling device for a frame for cooling a casing, and the casing houses a component (also referred to as a heating element) that controls heat generation such as a substrate.
以往,把收納有如上所述之發熱體冷卻到一定溫度以下的冷卻裝置是廣為人知的。例如,在專利文獻1中,揭示有把一體化空氣熱交換型空調機與冷媒型空調機之冷卻裝置設置在框體內之冷卻裝置。該冷卻裝置,構成為因應框體內溫度與外部氣體溫度,分別使用空氣熱交換型空調機與冷媒型空調機;這樣的冷卻裝置,乃是因應發熱負載(發熱體的數量)來做複數台設置。又,在專利文獻2中,揭示出構成有獨立配置來自框體內的內部氣體通路與來自框體外的外部氣體通路,在兩者交叉的部分配置空氣熱交換元件,同時,配置熱電元件使得吸熱部面向其後方側的內部氣體通路,散熱部面向後方側的外部氣體通路。在這樣的冷卻裝置中,當通過空氣熱交換元件的內部氣體的溫度高的時候,藉由熱電元件進行冷卻。 Conventionally, a cooling device that stores the above-described heat generating body to a constant temperature or lower is widely known. For example, Patent Document 1 discloses a cooling device in which a cooling device of an integrated air heat exchange type air conditioner and a refrigerant air conditioner is installed in a casing. The cooling device is configured to use an air heat exchange type air conditioner and a refrigerant type air conditioner in response to the temperature inside the casing and the outside air temperature. Such a cooling device is configured to perform a plurality of sets in accordance with a heat load (the number of heat generating bodies). . Further, Patent Document 2 discloses that an internal air passage from the inside of the casing and an external air passage from the outside of the casing are disposed independently, and an air heat exchange element is disposed in a portion where the two intersect, and a thermoelectric element is disposed so that the heat absorbing portion is disposed The inner gas passage faces the rear side, and the heat radiating portion faces the outer air passage on the rear side. In such a cooling device, when the temperature of the internal gas passing through the air heat exchange element is high, cooling is performed by the thermoelectric element.
又,在專利文獻3中,揭示有除了框體內的溫度以外也可以進行濕度管理之冷卻裝置。該冷卻裝置是利用熱電元件之裝置,在框體內設置濕度感測器,進行運轉控制使得當達到預先設定濕度以上時進行除濕運轉。更進一步,在專利文獻4中,揭示有相對於把熱電元件的吸熱側收容 到框體內,使其直接接觸而得到冷卻效果之冷卻裝置。 Further, Patent Document 3 discloses a cooling device that can perform humidity management in addition to the temperature inside the casing. This cooling device is a device using a thermoelectric element, and a humidity sensor is provided in the casing to perform operation control so that the dehumidification operation is performed when the predetermined humidity or higher is reached. Furthermore, in Patent Document 4, it is disclosed that the heat absorbing side of the thermoelectric element is accommodated. A cooling device that is brought into direct contact with the inside of the casing to obtain a cooling effect.
[專利文獻1]日本特開2001-193995號專利公開公報 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-193995
[專利文獻2]日本特開2005-55025號專利公開公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-55025
[專利文獻3]日本特開2008-141089號專利公開公報 [Patent Document 3] Japanese Laid-Open Patent Publication No. 2008-141089
[專利文獻4]日本特開2003-8275號專利公開公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2003-8275
但是,揭示於上述專利文獻1之冷卻裝置,乃是因應負載把一體化空氣熱交換型空調機與冷媒型空調機之冷卻裝置做複數台設置之構造的緣故,所以冷卻裝置的設置空間變大,成本也提高,冷卻時的控制也複雜化。還有,揭示於上述專利文獻2之冷卻裝置,在外部氣體溫度比內部氣體還要高的情況下,藉由空氣熱交換元件導致內部氣體被加熱,是有必要把被加熱的內部氣體藉由熱電元件來冷卻。亦即,在揭示於專利文獻2的構成中,外部氣體溫度高的話,直接藉由熱電元件冷卻內部氣體的情況下,相較之下,是一定要比較多的能源。 However, the cooling device disclosed in the above-mentioned Patent Document 1 has a structure in which a plurality of cooling devices of the integrated air heat exchange type air conditioner and the refrigerant type air conditioner are installed in accordance with the load, so that the installation space of the cooling device becomes large. The cost is also increased, and the control during cooling is complicated. Further, in the cooling device disclosed in Patent Document 2, in the case where the outside air temperature is higher than the internal gas, the internal gas is heated by the air heat exchange element, and it is necessary to pass the heated internal gas. The thermoelectric element is cooled. In other words, in the configuration disclosed in Patent Document 2, when the outside air temperature is high and the internal gas is directly cooled by the thermoelectric element, it is necessary to have a relatively large amount of energy.
還有,揭示於上述專利文獻3的冷卻裝置,是設有濕度感測器,當超過預先設定的濕度時運轉熱電元件進行除濕,但是在氣密性高的框體內會產生排液,會發生液體排出等的問題。更進一步,揭示於上述專利文獻4的冷卻裝 置,在框體內有複數個發熱體的情況下,熱電元件以及散熱器一定要同樣數目,在發熱體的設置數量或設置方法上產生了限制,同時成本也變高,冷卻時的控制也複雜化。還有,熱電元件直接接觸到發熱體的緣故,因為產生結露,也有可能對發熱體產生影響。 Further, the cooling device disclosed in Patent Document 3 is provided with a humidity sensor that operates the thermoelectric element to perform dehumidification when the humidity exceeds a predetermined humidity, but discharge occurs in a frame having high airtightness, which may occur. Problems such as liquid discharge. Further, the cooling device disclosed in the above Patent Document 4 In the case where there are a plurality of heating elements in the frame, the number of the thermoelectric elements and the heat sink must be the same, the number of the heating elements is set, or the setting method is limited, and the cost is also high, and the control during cooling is complicated. Chemical. Further, since the thermoelectric element is in direct contact with the heating element, it may also have an influence on the heating element due to condensation.
本發明乃是著眼於上述問題,其目的在於提供一種在設置於框體內的發熱體的設置樣態方面不受到影響,可以有效地冷卻框體內之冷卻裝置。還有,本發明目的在於提供一種可以有效地冷卻框體內,防止排液產生之冷卻裝置。 The present invention has been made in view of the above problems, and it is an object of the invention to provide a cooling device which can effectively cool a housing body without being affected by an installation state of a heat generating body provided in a housing. Further, it is an object of the present invention to provide a cooling device which can effectively cool a casing and prevent liquid discharge.
為了達成上述目的,有關本發明之框體用冷卻裝置,具有:空氣熱交換器,乃是設置在收容發熱體之框體,可以在與前述框體外部之間利用空氣做熱交換;和電子冷卻器,乃是分別露出在前述框體內側具備有吸熱風扇之吸熱側散熱器、在前述框體外側具備有散熱風扇之散熱側散熱器,在前述吸熱側散熱器與前述散熱側散熱器之間配設有冷卻元件;和控制部,乃是根據前述框體內部的溫度T1、外部氣體溫度T2、前述冷卻元件的冷氣溫度T3,控制驅動前述空氣熱交換器的風扇、前述吸熱風扇、前述散熱風扇、以及冷卻元件;前述控制部,乃是在預先設定之框體內的通常運轉溫度範圍內,當上升到第1設定溫度時,以(T2<T1)為條件驅動前述空氣熱交換器的風扇,當上升到比前述第1設定溫度還要高之第2設定溫度時,停止驅 動前述空氣熱交換器的風扇,同時以(T3≧SVB,SVB為預先設定的結露判定值)作為條件,冷卻驅動前述冷卻元件。 In order to achieve the above object, the cooling device for a frame body according to the present invention includes: an air heat exchanger, which is provided in a casing that houses the heat generating body, and can exchange heat with air outside the frame; and The cooler is a heat-dissipating-side heat sink provided with a heat-absorbing fan inside the casing, and a heat-dissipating heat sink having a heat-dissipating fan outside the casing, and the heat-dissipating-side heat sink and the heat-dissipating heat sink a cooling element is disposed between the control unit and the control unit, and the fan, the heat absorbing fan, and the heat absorbing fan that drive the air heat exchanger are controlled according to a temperature T1 inside the casing, an outside air temperature T2, and a cooling air temperature T3 of the cooling element. a cooling fan and a cooling element; wherein the control unit drives the air heat exchanger under the condition of (T2<T1) when the temperature rises to the first set temperature within a predetermined operating temperature range of the preset frame The fan stops driving when it rises to the second set temperature higher than the first set temperature The fan of the air heat exchanger is operated while cooling (T3≧SVB, SVB is a predetermined condensation determination value), and the cooling element is cooled and driven.
如上所述構成之框體用冷卻裝置,乃是於收容發熱體的框體,配設空氣熱交換器與電子冷卻器,控制部因應預先設定的條件切換控制運轉,所以可以有效率地冷卻框體內。在該情況下,空氣交換器與電子冷卻器之切換控制,是根據框體內部的溫度T1、外部氣體溫度T2、前述冷卻元件的冷氣溫度T3來實行的緣故,所以可以得到有效率地冷卻效果,特別是,在預先設定的框體內之通常運轉溫度範圍內,當上升到第1設定溫度時,驅動空氣熱交換器的風扇,而且,該風扇的驅動,是以(T2<T1)為條件的緣故,所以當框體內的溫度比外部氣體溫度高的時候,不需要把較高溫度的外部氣體導入到框體內,不會使框體內的溫度急遽上升。還有,更進一步,經由當上升到比第1設定溫度還要高的第2設定溫度時,停止驅動空氣熱交換器的風扇,冷卻驅動冷卻元件(切換運轉)的方式,可以有效率地冷卻框體內。尚且,冷卻元件的冷卻驅動,經由當冷卻元件的冷氣溫度比結露判定值(SVB)還要低時,停止控制該冷卻驅動的方式,可以防止在框體內產生排液。 The cooling device for a frame body configured as described above is configured such that an air heat exchanger and an electronic cooler are disposed in a casing in which the heating element is housed, and the control unit switches the control operation in accordance with a predetermined condition, so that the cooling frame can be efficiently cooled. in vivo. In this case, the switching control between the air exchanger and the electronic cooler is performed based on the temperature T1 inside the casing, the outside air temperature T2, and the cooling temperature T3 of the cooling element, so that an efficient cooling effect can be obtained. In particular, in the normal operating temperature range of the preset frame, when the temperature rises to the first set temperature, the fan of the air heat exchanger is driven, and the driving of the fan is based on (T2<T1). For this reason, when the temperature inside the casing is higher than the temperature of the outside air, it is not necessary to introduce a higher temperature external air into the casing, and the temperature inside the casing does not rise sharply. Further, when the temperature rises to a second set temperature higher than the first set temperature, the fan that drives the air heat exchanger is stopped, and the cooling element (switching operation) is cooled and cooled, and the cooling can be efficiently cooled. Inside the frame. Further, the cooling drive of the cooling element can be prevented from being discharged in the casing by stopping the control of the cooling drive when the cooling air temperature of the cooling element is lower than the condensation determination value (SVB).
在如上所述構成的框體用冷卻裝置中,前述控制部,是在通常運轉溫度範圍內,當下降到比前述第1設定溫度還要低的第3設定溫度時,控制成驅動加熱前述冷卻元件者亦佳。 In the cooling device for a frame body configured as described above, the control unit controls the heating to be the cooling when the temperature is lowered to a third set temperature lower than the first set temperature within a normal operating temperature range. The components are also good.
在該情況下,框體內的溫度既使在通常運轉溫度範圍 內,因為框體內的溫度處於下降的狀態,經由加熱驅動冷卻元件的方式,使框體內的溫度上升到適當的溫度,而可以維持。 In this case, the temperature inside the frame is within the normal operating temperature range. In the inside, since the temperature in the casing is lowered, the temperature in the casing is raised to an appropriate temperature by heating the cooling element to be maintained.
還有,在如上所述構成之框體用冷卻裝置中,將前述冷卻元件予以並列做複數個系統設置,前述控制部係因應前述框體內部的溫度T1,對每一系統進行ON/OFF驅動者亦佳。 Further, in the cooling device for a casing configured as described above, the cooling elements are arranged in parallel in a plurality of systems, and the control unit is ON/OFF driven for each system in accordance with the temperature T1 inside the casing. Also good.
在這樣的構成下,因應到收容於框體內的發熱體之負載(溫度負載),經由依序運轉每一系統的方式,可以以適應於負載之最小的構成(配合負載之最適當的能力)來進行控制運轉,可以圖求節能化。特別是,以對每一系統、階段地進行控制運轉的方式,與一次性對冷卻元件進行ON/OFF驅動之構成相比較,可以改善庫內溫度波動的程度。 With such a configuration, the load (temperature load) of the heat generating body housed in the casing can be adapted to the minimum configuration of the load (the most suitable capacity for the load) by sequentially operating each system. To control the operation, you can save energy. In particular, the degree of temperature fluctuation in the library can be improved as compared with the configuration in which the cooling element is turned ON/OFF in a manner in which the control operation is performed for each system and stage.
所以,在將前述冷卻元件予以並列做複數個系統配設之構成中,並列做複數個系統設置之冷卻元件,係各自做複數個串列連接者亦佳。 Therefore, in the configuration in which the above-described cooling elements are arranged in parallel in a plurality of systems, it is also preferable to form a plurality of cooling elements provided in a plurality of systems in parallel.
以這樣構成的方式,可以圖求冷卻以及加熱能力的提升。 In such a manner, cooling and heating ability can be improved.
還有,在如上所述構成之框體用冷卻裝置中,前述控制部,在前述通常運轉溫度範圍內,控制成維持前述吸熱風扇在驅動狀態者亦佳。 Further, in the cooling device for a frame body configured as described above, it is preferable that the control unit is controlled to maintain the driving state of the heat absorbing fan within the normal operating temperature range.
以這樣的構成的方式,在框體內,利用驅動吸熱風扇,內部氣體時常保持在循環的狀態,可以安定化框體內部 的溫度T1。 With such a configuration, by driving the heat absorption fan in the casing, the internal gas is constantly kept in a circulating state, and the inside of the casing can be stabilized. Temperature T1.
還有,在如上所述構成之框體用冷卻裝置中,前述控制部,控制成在前述通常運轉溫度範圍內,當上升到前述第1設定溫度時,驅動前述散熱風扇者亦佳。 Further, in the cooling device for a frame body configured as described above, the control unit is preferably controlled to drive the heat radiation fan when the temperature rises to the first set temperature within the normal operating temperature range.
以這樣的構成的方式,在冷卻驅動電子冷卻器的冷卻元件之前面階段,為了冷卻電子冷卻器的散熱側的散熱器,可以提高冷卻驅動電子冷卻器之際的冷卻效率,同時也可以迅速發揮冷卻效果。還有,也在停止冷卻驅動冷卻元件後,因為暫時驅動散熱風扇,可以長時間安定維持冷卻元件的性能。 With such a configuration, in order to cool the heat sink on the heat radiating side of the electronic cooler before cooling the cooling element that drives the electronic cooler, the cooling efficiency at the time of cooling and driving the electronic cooler can be improved, and the cooling efficiency can be quickly exerted. Cooling effect. Further, after the cooling and driving of the cooling element is stopped, since the heat radiating fan is temporarily driven, the performance of the cooling element can be maintained for a long period of time.
還有,在如上所述構成之框體用冷卻裝置中,前述控制部,控制成當超過通常運轉溫度範圍的上限值時,維持前述空氣熱交換器的風扇的驅動、前述吸熱風扇的驅動、前述散熱風扇的驅動、以及冷卻元件的冷卻驅動者亦佳。 Further, in the cooling device for a frame body configured as described above, the control unit controls to drive the fan of the air heat exchanger and the drive of the heat absorbing fan when the upper limit value of the normal operating temperature range is exceeded. The driving of the cooling fan and the cooling driver of the cooling element are also preferred.
以這樣的構成的方式,框體內的溫度上升超過通常運轉溫度範圍的緣故,驅動空氣熱交換器以及電子冷卻器兩者,可以快速冷卻框體內部的溫度,可以讓框體內回到通常運轉溫度範圍內。換言之,驅動空氣熱交換器以及電子冷卻器雙方,是限於上升超過通常運轉溫度範圍之際的緣故,可以實施有效率的冷卻運轉。 With such a configuration, the temperature rise in the casing exceeds the normal operating temperature range, and both the air heat exchanger and the electronic cooler can be driven to quickly cool the temperature inside the casing, and the casing can be returned to the normal operating temperature. Within the scope. In other words, both of the driving air heat exchanger and the electronic cooler are limited to increase beyond the normal operating temperature range, and an efficient cooling operation can be performed.
還有,在如上所述構成之框體用冷卻裝置中,前述控制部,控制成當降到通常運轉溫度範圍的下限值以下時,停止前述空氣熱交換器的風扇的驅動、前述吸熱風扇的驅動、前述散熱風扇的驅動、以及冷卻元件的加熱驅動者亦 佳。 Further, in the cooling device for a frame body configured as described above, the control unit controls to stop the driving of the fan of the air heat exchanger and the heat absorbing fan when the temperature is lower than the lower limit of the normal operating temperature range. The drive, the drive of the aforementioned cooling fan, and the heating driver of the cooling element are also good.
通常,框體內部的溫度,是因為發熱體的運轉而逐漸上升,但是當降到通常運轉溫度範圍的下限值以下的狀態的話,各驅動元件可能有加熱異常的緣故,以執行停止狀態的方式,可以圖求節能運轉以及安全性的提升。 Usually, the temperature inside the casing is gradually increased due to the operation of the heating element. However, when the temperature falls below the lower limit of the normal operating temperature range, the driving elements may be heated abnormally to perform the stop state. The way, you can figure out the energy-saving operation and the improvement of safety.
根據本發明,在設置於框體內的發熱體的設置樣態等方面不會受到影響,可以有效率地冷卻框體內。還有,藉由有效率地冷卻框體內,得到了可以防止排液產生之框體用冷卻裝置。 According to the present invention, the arrangement of the heat generating body provided in the casing is not affected, and the inside of the casing can be efficiently cooled. Further, by efficiently cooling the casing, a cooling device for the casing which can prevent the liquid discharge from being generated is obtained.
以下,在有關本發明之框體用冷卻裝置之其中一實施形態中,一邊參閱圖面一邊進行具體說明。 Hereinafter, in one embodiment of the cooling device for a frame body according to the present invention, a specific description will be given with reference to the drawings.
圖1是揭示具有冷卻裝置之框體的整體構成之概略圖。 Fig. 1 is a schematic view showing the overall configuration of a casing having a cooling device.
本實施形態的框體1,是構成為藉由絕熱壁材3區隔成剖面略矩形形狀的箱型;其內部空間(以下,稱為庫內)4,是藉由著裝到前面部3A之開閉門3A’而可以密閉。於庫內4,例如,可以收容通訊機器之數據機、電源裝置等之各種發熱體;在本實施形態,於庫內4,配設具有複數個棚板5a之機架(rack)5,在該棚板5a上設置各種發熱體。 The casing 1 of the present embodiment is a box shape in which the heat insulating wall member 3 is partitioned into a substantially rectangular cross section; the internal space (hereinafter referred to as "inside") 4 is attached to the front portion 3A. The door 3A' can be opened and closed to be sealed. In the case of the interior 4, for example, a plurality of heating elements such as a data machine and a power supply unit of a communication device can be housed. In the present embodiment, a rack 5 having a plurality of shelves 5a is disposed in the interior 4 Various heat generating bodies are provided on the shed plate 5a.
於前述框體1,分散配設有控制、管理框體內的溫度之冷卻裝置10。該冷卻裝置10具備有:配設於框體1的 頂板部3B且連接框體內外之空氣熱交換器20、配設於背面部3C且連接框體內外之電子冷卻器30、以及控制前述空氣熱交換器10與電子冷卻器20的運轉之控制單元40。於該情況,控制單元40可設置於框體1之任意位置,在本實施形態中,是設置在庫內4的機架5的棚板5a上。還有,冷卻裝置10具備有:測定框體內部的溫度T1之感測器S1、測定外部氣體溫度T2之感測器S2、以及測定構成前述電子冷卻器30之冷卻元件的冷氣溫度T3之感測器S3;藉由這些感測器S1~S3所檢測的溫度資訊,如後所述,是被輸入到構成控制單元40之控制部,成為控制各驅動元件運轉之觸發信號。 In the housing 1 described above, a cooling device 10 that controls and manages the temperature inside the casing is disposed in a distributed manner. The cooling device 10 is provided with: disposed in the frame 1 The top plate portion 3B is connected to the air heat exchanger 20 inside and outside the frame, the electronic cooler 30 disposed on the back surface portion 3C and connected inside and outside the frame, and a control unit that controls the operation of the air heat exchanger 10 and the electronic cooler 20 40. In this case, the control unit 40 can be provided at any position of the casing 1. In the present embodiment, it is provided on the shelf 5a of the frame 5 of the interior 4. Further, the cooling device 10 includes a sensor S1 that measures the temperature T1 inside the casing, a sensor S2 that measures the temperature of the outside air T2, and a sensory temperature T3 that measures the cooling element of the electronic cooler 30. The temperature information detected by the sensors S1 to S3 is input to the control unit constituting the control unit 40 as described later, and becomes a trigger signal for controlling the operation of each of the driving elements.
前述空氣熱交換器20具備有設置於頂板部3B上的殼體21,在該殼體21內,藉由設置在頂板部3B內側的風扇22排出內部氣體22A,同時藉由設置在殼體21的風扇23通過外部氣體23A。於該情況,本實施形態之殼體21具備有:使外部氣體23A通過之流路21A、以及使內部氣體22A通過之流路21B;各流路21A、21B最好是形成上下獨立使外部氣體與內部氣體不會混合,成為由相鄰的流路的壁面21C來進行熱交換之構造。還有,關於各流路21A、21B,構成易於散熱之鰭片形狀者為佳。 The air heat exchanger 20 is provided with a casing 21 provided on the top plate portion 3B. The inside of the casing 21 is exhausted by a fan 22 provided inside the top plate portion 3B while being disposed in the casing 21 The fan 23 passes through the outside air 23A. In this case, the casing 21 of the present embodiment includes a flow path 21A through which the outside air 23A passes and a flow path 21B through which the internal gas 22A passes. Each of the flow paths 21A and 21B is preferably formed to be independent of the outside air. It does not mix with the internal gas, and has a structure in which heat is exchanged by the wall surface 21C of the adjacent flow path. Further, it is preferable that each of the flow paths 21A and 21B constitute a fin shape that is easy to dissipate heat.
尚且,如上所述的風扇22及風扇23,係藉由前述控制單元40同步驅動。 Further, the fan 22 and the fan 23 as described above are synchronously driven by the aforementioned control unit 40.
前述電子冷卻器30具備有:配設在庫內側的吸熱側散熱器(散熱風扇)31、以及配設在庫外側之散熱側散熱器 33;這些乃是配設成通過形成在設於框體1的背面部3C之安裝用板(未圖示)之開口3d。於該情況,電子冷卻器30具備有作為冷卻元件之熱電元件35;該熱電元件35是配置在介隔著密封墊連接到前述安裝用板之金屬板36與吸熱側散熱器(散熱風扇)31之間。還有,前述散熱側散熱器33,是安裝到與安裝金屬板36的熱電元件35的面相反側的面。尚且,熱電元件35是與散熱鰭片相組合;散熱鰭片是可以構成各種相異的鰭片形狀之製品,或者是,利用熱導管之製品。 The electronic cooler 30 includes a heat absorption side heat sink (heat dissipation fan) 31 disposed inside the library, and a heat dissipation side heat sink disposed outside the library. 33; These are the openings 3d which are formed by the mounting plate (not shown) provided in the back surface part 3C of the housing 1. In this case, the electronic cooler 30 is provided with a thermoelectric element 35 as a cooling element; the thermoelectric element 35 is disposed on the metal plate 36 and the heat absorption side heat sink (heat dissipation fan) 31 which are connected to the mounting plate via a gasket. between. Further, the heat radiation side heat sink 33 is attached to a surface opposite to the surface of the thermoelectric element 35 on which the metal plate 36 is attached. Further, the thermoelectric element 35 is combined with a heat dissipating fin; the heat dissipating fin is a product which can constitute various fin shapes, or a product using a heat pipe.
在前述吸熱側散熱器31之其中一端部,設置有使庫內的內部氣體通過之吸熱風扇32;讓庫內的內部氣體32A流動在吸熱側散熱器31內,從另一端部排出。於該情況,在另一端部,如上所述,配設測定冷卻元件(熱電元件35)的冷氣溫度T3之感測器S3。還有,於前述散熱側散熱器33的其中一端側,設置有散熱風扇34讓滯留於散熱側散熱器33內的空氣排出;藉由前述熱電元件35進行冷卻而變熱的空氣34A排出到庫外。 One end portion of the heat absorbing side heat sink 31 is provided with a heat absorbing fan 32 that allows the internal gas in the chamber to pass therethrough; the internal gas 32A in the chamber flows in the heat absorbing side heat sink 31 and is discharged from the other end portion. In this case, at the other end, as described above, the sensor S3 for measuring the cold air temperature T3 of the cooling element (thermoelectric element 35) is disposed. Further, on one end side of the heat-dissipating-side heat sink 33, a heat-dissipating fan 34 is disposed to discharge air trapped in the heat-dissipating-side heat sink 33, and air 34A which is cooled by the thermoelectric element 35 is discharged to the bank. outer.
上述之冷卻元件35,以及吸熱風扇32與散熱風扇34,係藉由前述控制單元40的控制部個別驅動。於該情況,吸熱風扇32與散熱風扇34,係在各個散熱器31、33內,形成氣流為相對向之位置關係者為佳;特別是,有關於散熱風扇34,為了在上方側排出散熱側散熱器33內的空氣進行有效率的散熱,配設成自下端部使內部氣體上升者為佳。 The above-described cooling element 35, and the heat absorbing fan 32 and the heat radiating fan 34 are individually driven by the control unit of the control unit 40. In this case, it is preferable that the heat-absorbing fan 32 and the heat-dissipating fan 34 are disposed in the respective heat sinks 31 and 33 so that the airflow is relatively in a positional relationship; in particular, the heat-dissipating fan 34 is disposed on the heat-dissipating side on the upper side. The air in the radiator 33 is efficiently dissipated, and it is preferable to arrange the internal gas to rise from the lower end.
尚且,在上述的構成中,構成前述框體1的材料,乃是重視耐候性或強度,外板為不銹鋼者為佳。但是,有關於遮光板或框體內部的框架材,考慮到了輕量化,使用鋁材者為佳。還有,有關構成內部的棚板5a(機架5)等的材料,由強度以及防塵的觀點來看,使用不銹鋼者為佳。更進一步,有關上述的金屬板36,從導熱方面來看的話使用銅板者為佳,但從增加重量方面來看使用鋁材者為佳。 Further, in the above configuration, the material constituting the frame body 1 is preferably a weather resistance or strength, and the outer plate is made of stainless steel. However, there is a case where the louver or the frame material inside the casing is used, and in consideration of weight reduction, it is preferable to use aluminum. In addition, as for the material constituting the inside panel 5a (rack 5), etc., it is preferable to use stainless steel from the viewpoint of strength and dustproof. Further, as for the above-mentioned metal plate 36, it is preferable to use a copper plate from the viewpoint of heat conduction, but it is preferable to use aluminum in terms of weight increase.
圖2係揭示有運轉控制上述冷卻裝置之各驅動部之控制單元的構成之方塊圖。 Fig. 2 is a block diagram showing the configuration of a control unit that operates and controls each of the driving units of the cooling device.
控制單元40,係收納有預先設定的動作程式,具有控制部41;該控制部41具備有根據來自各感測器S1~S3所發送的檢測溫度信號,來控制驅動前述空氣熱交換器20的風扇22、23,以及前述電子冷卻器30的吸熱風扇32、散熱風扇34、以及冷卻元件(熱電元件)35之功能。換言之,空氣熱交換器20的風扇22、23,介隔著具備驅動電路之風扇驅動部42同步進行ON/OFF驅動;電子冷卻器30的吸熱風扇32以及散熱風扇34,係介隔著各自具備有驅動電路之風扇驅動部43、44個別進行ON/OFF驅動。 The control unit 40 includes a predetermined operation program and includes a control unit 41. The control unit 41 includes a control temperature signal transmitted from each of the sensors S1 to S3 to control the driving of the air heat exchanger 20. The fans 22, 23, and the heat absorbing fan 32 of the electronic cooler 30, the heat radiating fan 34, and the cooling element (thermoelectric element) 35 function. In other words, the fans 22 and 23 of the air heat exchanger 20 are synchronously turned ON/OFF via the fan drive unit 42 including the drive circuit, and the heat absorption fan 32 and the heat dissipation fan 34 of the electronic cooler 30 are provided separately. The fan drive units 43 and 44 having the drive circuits are individually turned ON/OFF.
還有,本實施形態的熱電元件35,乃是並列並做複數個系統設置(在圖2,揭示有熱電元件35A~35D之四系統);前述控制部41,係對複數個系統之熱電元件針對每一系統做ON/OFF驅動。換言之,各系統之熱電元件35A~35D,介隔著具備有可以反轉各個電流的極性之驅動電路之熱電驅動部45~48,個別地進行加熱/冷卻驅動,以及 ON/OFF驅動。 Further, the thermoelectric elements 35 of the present embodiment are arranged in parallel and in a plurality of systems (in FIG. 2, four systems of thermoelectric elements 35A to 35D are disclosed); the control unit 41 is a thermoelectric element for a plurality of systems. Do ON/OFF drive for each system. In other words, the thermoelectric elements 35A to 35D of the respective systems are individually heated/cooled and driven by the thermoelectric drive units 45 to 48 including the drive circuits having the polarity of the respective currents. ON/OFF drive.
尚且,在本實施形態中,更進一步,並列並做複數個系統設置之冷卻元件35A~35D,係構成為各個複數個熱電元件,具體而言,於各系統2個熱電元件(35A、35a1)、(35B、35b1)、(35C、35c1)、(35D、35d1)做串列連接。當然,有關熱電元件之系統數量、或是串列之熱電元件的個數,可以根據冷卻裝置的規格等,進行適當地改變。 Further, in the present embodiment, the cooling elements 35A to 35D which are provided in parallel in a plurality of systems are configured as a plurality of thermoelectric elements, specifically, two thermoelectric elements (35A, 35a1) in each system. (35B, 35b1), (35C, 35c1), (35D, 35d1) are connected in series. Of course, the number of systems of the thermoelectric elements or the number of the series of thermoelectric elements can be appropriately changed depending on the specifications of the cooling device and the like.
接著,有關利用上述控制單元40之控制運轉方法,一邊參閱圖3一邊具體說明。 Next, a control operation method by the above-described control unit 40 will be specifically described with reference to FIG. 3.
圖3係揭示有在控制單元40之控制部41中所實施的空氣熱交換器20之風扇22、23,以及電子冷卻器30之吸熱風扇32、散熱風扇34,以及熱電元件35之控制運轉之其中樣態例之控制表。 3 shows the control of the fans 22, 23 of the air heat exchanger 20 implemented in the control unit 41 of the control unit 40, and the heat absorbing fan 32 of the electronic cooler 30, the heat radiating fan 34, and the thermoelectric element 35. The control table of the example.
前述控制部41,在預先設定的框體內的通常運轉溫度範圍R內,框體內的溫度T1上升到第1設定溫度(SV2)時,把外部氣體溫度T2小於框體內的溫度T1(T2<T1)作為條件,驅動空氣熱交換器20之風扇22、23(參閱控制表(a))。還有,當框體內的溫度T1上升到比第1設定溫度(SV2)還高之第2設定溫度(SV3)時,停止驅動空氣熱交換器20的風扇22、23(參閱控制表(b)),同時把熱電元件35的冷氣溫度T3為預先已設定之結露判定值(SVB)以上作為條件(T3≧SVB),冷卻驅動熱電元件35(參閱控制表(c))。 When the temperature T1 in the casing rises to the first set temperature (SV2) in the normal operating temperature range R in the preset casing, the control unit 41 sets the outside air temperature T2 to be smaller than the temperature T1 in the casing (T2<T1). As a condition, the fans 22, 23 of the air heat exchanger 20 are driven (see the control table (a)). When the temperature T1 in the casing rises to the second set temperature (SV3) higher than the first set temperature (SV2), the fans 22 and 23 that drive the air heat exchanger 20 are stopped (see the control table (b). At the same time, the cold air temperature T3 of the thermoelectric element 35 is equal to or higher than the condensation determination value (SVB) set in advance as a condition (T3≧SVB), and the thermoelectric element 35 is cooled and driven (see the control table (c)).
如上所述,在框體1內的通常運轉溫度範圍R內,其內部溫度T1,一直上升到第1設定溫度(SV2)時,以驅動 空氣熱交換器20的風扇22、23的方式,可以冷卻已上升之庫內溫度。如此,在框體內的溫度與外部氣體溫度有差的範圍內,僅運轉空氣熱交換器20,並沒有實施電子冷卻器30的運轉,所以可以圖求節能化。於該情況,風扇22、23的驅動,係如上所述,把外部氣體溫度T2<內部氣體溫度T1作為條件的緣故,當框體內的溫度比外部氣體溫度還要高時,不會把不必要之較高的溫度之外部氣體導入到框體1內,不會使框體1內的溫度急遽上升。換言之,外部氣體溫度一直到比庫內溫度還要低為止,停止驅動空氣熱交換器20的風扇22、23,盡可能,不要把外部的熱移動到框體內部。 As described above, when the internal temperature T1 rises to the first set temperature (SV2) in the normal operating temperature range R in the casing 1, it is driven. The manner in which the fans 22, 23 of the air heat exchanger 20 cool the elevated temperature in the interior. As described above, in the range where the temperature in the casing is different from the temperature of the outside air, only the air heat exchanger 20 is operated, and the operation of the electronic cooler 30 is not performed, so that energy saving can be achieved. In this case, the driving of the fans 22 and 23 is as described above, and the external gas temperature T2 < the internal gas temperature T1 is used as a condition, and when the temperature in the casing is higher than the temperature of the outside air, it is not necessary. The external air having a high temperature is introduced into the casing 1, and the temperature in the casing 1 is not suddenly increased. In other words, until the outside air temperature is lower than the inner temperature, the fans 22 and 23 that drive the air heat exchanger 20 are stopped, and as far as possible, the external heat is not moved to the inside of the casing.
接著,藉由停止驅動風扇22、23,框體內的溫度T1上升,當上升到比第1設定溫度(SV2)還要高之第2設定溫度(SV3)時,冷卻驅動熱電元件35,控制成冷卻庫內並保持一定溫度(參閱控制表(c))。尚且,當熱電元件35關聯到整個系統故障的情況下,風扇22、23的驅動,係把外部氣體溫度T2<內部氣體溫度T1作為條件並繼續照原樣驅動,實施庫內的冷卻(參閱控制表(b)※1)。 Then, by stopping the driving of the fans 22 and 23, the temperature T1 in the casing rises, and when the temperature rises to the second set temperature (SV3) higher than the first set temperature (SV2), the thermoelectric element 35 is cooled and driven to be controlled. Cool the library and keep it at a certain temperature (see control table (c)). Further, when the thermoelectric element 35 is associated with the entire system failure, the driving of the fans 22, 23 takes the external gas temperature T2 < the internal gas temperature T1 as a condition and continues to drive as it is, performing the cooling in the library (see the control table). (b) ※1).
進行冷卻驅動該熱電元件35的情況下,當熱電元件35的冷氣溫度T3比預先設定的結露判定值(SVB)還要低時,因為在吸熱側散熱器(散熱風扇)31的部分有可能產生結露,所以停止控制冷卻驅動,防止在庫內產生排液(參閱控制表(c))。亦即,在本實施形態,有關容易產生結露的部分,控制冷卻運轉在不會產生結露的溫度區域(結露 判定值以下),控制成庫內溫度保持在一定。 In the case where the thermoelectric element 35 is driven to be cooled, when the cold air temperature T3 of the thermoelectric element 35 is lower than a predetermined condensation determination value (SVB), it is possible to generate a portion of the heat sink side (heat radiating fan) 31. Condensation, so stop controlling the cooling drive to prevent draining in the library (see control table (c)). In other words, in the present embodiment, the portion where condensation is likely to occur is controlled to cool the temperature region where condensation does not occur (condensation) The judgment value is below), and the temperature in the library is controlled to be constant.
尚且,有關於結露的判定,例如,藉由濕度感測器與庫內溫度的檢測以判定露點溫度來進行運轉控制者亦可,但如本實施形態,預先設定結露判定值(SVB),經由把該溫度以下作為露點溫度進行運轉控制的方式,可以簡單化控制項目。還有,在本實施形態中,既使檢測框體內的溫度T1之感測器S1萬一故障,也可以把測定冷氣溫度T3之感測器S3拿來代用。 Further, regarding the determination of the condensation, for example, the operation controller may be determined by detecting the dew point temperature by the humidity sensor and the temperature inside the chamber. However, in the present embodiment, the condensation determination value (SVB) is set in advance, via By controlling the operation below this temperature as the dew point temperature, the control item can be simplified. Further, in the present embodiment, even if the sensor S1 detecting the temperature T1 in the casing fails, the sensor S3 for measuring the cold air temperature T3 may be substituted.
還有,前述控制部41,係控制成當超過通常運轉溫度範圍R的上限值(SV3+10℃)時,維持空氣熱交換器20的風扇22、23的驅動,以及,電子冷卻器30的驅動部之散熱風扇32的驅動、散熱風扇34的驅動、以及熱電元件35的冷卻驅動。 Further, the control unit 41 is controlled to maintain the driving of the fans 22 and 23 of the air heat exchanger 20 when the upper limit value (SV3 + 10 ° C) of the normal operating temperature range R is exceeded, and the electronic cooler 30 The driving of the cooling fan 32 of the driving unit, the driving of the cooling fan 34, and the cooling driving of the thermoelectric element 35 are performed.
如此,框體1內的溫度T1,因為上升到超過通常運轉溫度範圍R,驅動空氣熱交換器20以及電子冷卻器30雙方,迅速冷卻框體內部的溫度,讓框體內回到通常運轉溫度範圍R。亦即,空氣熱交換器20以及電子冷卻器30之雙方驅動,乃是限制在當框體內的溫度T1上升到超過通常運轉溫度範圍R時的緣故,可以實施有效率的冷卻運轉。 As a result, the temperature T1 in the casing 1 rises above the normal operating temperature range R, and both the air heat exchanger 20 and the electronic cooler 30 are driven to rapidly cool the temperature inside the casing, and return the casing to the normal operating temperature range. R. In other words, both of the air heat exchanger 20 and the electronic cooler 30 are driven to restrict the temperature T1 in the casing from rising beyond the normal operating temperature range R, and an efficient cooling operation can be performed.
如上所述,根據上述之冷卻裝置10,於收容發熱體之框體1,配設空氣熱交換器20與電子冷卻器30,控制部40因應預先設定條件進行切換控制運轉的緣故,可以減輕運轉成本,同時可以有效率第冷卻框體內。還有,空氣熱 交換器20以及電子冷卻器30,在各個最適當的狀態下,因為可以切換任意一方的驅動、或雙方驅動,因應發熱體的負載沒有必要把一體化空氣熱交換器與電子冷卻器之冷卻裝置做複數台設置,框體內的設置空間可以變大,或者是不會讓成本高居不下。更進一步,空氣熱交換器20與電子冷卻器30之切換控制,係根據框體內的溫度T1、外部氣體溫度T2、熱電元件35的冷氣溫度T3來實行的緣故,可以得到有效率的冷卻效果;熱電元件的冷卻驅動,係當該冷氣溫度比結露判定值(SVB)還要低時,停止控制該冷卻驅動,可以防止在框體內產生排液。 As described above, according to the above-described cooling device 10, the air heat exchanger 20 and the electronic cooler 30 are disposed in the casing 1 that houses the heating element, and the control unit 40 can perform the switching control operation in accordance with the preset conditions, thereby reducing the operation. The cost, while being able to efficiently cool the inside of the frame. Also, air heat In each of the most appropriate states, the exchanger 20 and the electronic cooler 30 are capable of switching either or both of the drives, and it is not necessary to integrate the integrated air heat exchanger and the electronic cooler in response to the load of the heating element. With multiple settings, the setup space in the frame can be increased, or the cost will not be high. Further, the switching control of the air heat exchanger 20 and the electronic cooler 30 is performed according to the temperature T1 in the casing, the outside air temperature T2, and the cold air temperature T3 of the thermoelectric element 35, so that an efficient cooling effect can be obtained; The cooling drive of the thermoelectric element stops the control of the cooling drive when the temperature of the cold air is lower than the condensation determination value (SVB), thereby preventing the liquid discharge from being generated in the casing.
還有,在本實施形態中,前述控制部41,係控制成在通常運轉溫度範圍R內,當下降到比前述第1設定溫度(SV2)還要低之第3設定溫度(SV1)時,加熱驅動熱電元件35(參閱控制表(d))。 Further, in the present embodiment, the control unit 41 controls the third set temperature (SV1) to be lower than the first set temperature (SV2) in the normal operating temperature range R. The thermoelectric element 35 is heated to be driven (see control table (d)).
該情況下,既使在通常運轉溫度範圍R內,因為框體1內的溫度頗為下降,經由加熱驅動熱電元件35的方式,可以使框體1內的溫度,上升到更適當的溫度,來進行維持。尚且,利用上述熱電元件35做加熱運轉框體內的溫度也不會上升的狀況,乃是(SV1-5℃以下),變成這是不會發生在通常的運轉狀態之範圍。因此,在本實施形態中,在這樣的狀況下,可能有發生加熱異常(超過機器的規格運轉溫度範圍)的緣故,控制成停止全部的驅動元件,來提升安全性。或者是,庫內溫度變成(SV1-5℃以下)的狀況經過一定時間的情況下,當作可能產生加熱異常,控 制部41對外部發出異常警報者亦可。 In this case, even if the temperature in the casing 1 is relatively lowered in the normal operating temperature range R, the temperature in the casing 1 can be raised to a more appropriate temperature by driving the thermoelectric element 35 by heating. To maintain. In addition, the temperature in the heating operation frame by the thermoelectric element 35 does not rise (SV1-5 ° C or lower), and this does not occur in the normal operation state. Therefore, in the present embodiment, in such a situation, there is a possibility that a heating abnormality (exceeding the specification operating temperature range of the machine) may occur, and it is controlled to stop all the driving elements to improve safety. Or, if the temperature inside the library becomes (SV1-5 °C or less), the heating abnormality may be caused as a result of a certain period of time. The system 41 may also issue an abnormal alarm to the outside.
還有,前述控制部41,在通常運轉溫度範圍R內,控制成把電子冷卻器30的吸熱風扇32維持在驅動狀態者為佳。以這樣的構成,在框體1內,因為常時驅動吸熱風扇32的緣故,保持內部氣體時常循環的狀態,可以安定化框體內部的溫度T1。 Further, it is preferable that the control unit 41 is controlled to maintain the heat absorbing fan 32 of the electronic cooler 30 in the driving state in the normal operating temperature range R. With such a configuration, in the casing 1, since the internal air is constantly circulated while the heat absorbing fan 32 is constantly driven, the temperature T1 inside the casing can be stabilized.
還有,前述控制部41,在通常運轉溫度範圍R內,控制成當框體內的溫度T1上升到前述第1設定溫度(SV2)時,驅動電子冷卻器30的散熱風扇34者為佳。在此,在前述第2設定溫度(SV3)冷卻驅動熱電元件35的話,在熱電元件的加熱側(散熱側散熱器33),包含熱電元件的散熱鰭片部,既使熱電元件運轉停止後(庫內溫度下降到第1設定溫度SV2),暫時繼續較高的狀態;以及,熱電元件35,在加熱側不進行快速散熱的話,會影響到元件的性能以及壽命,所以在熱電元件35的冷卻運轉中(參閱控制表(e))以及在其前後(參閱控制表(f)),以控制散熱風扇34在驅動狀態的方式,變成在加熱側可以快速散熱,可以防止框體內的溫度T1上升並維持冷卻效果,同時可以長期安定化熱電元件35的性能。尚且,散熱風扇34的驅動,控制成連動到熱電元件35的冷卻驅動者亦可,或是從停止熱電元件的冷卻驅動開始,藉由延遲計時器等,進行一定時間驅動者亦可。 Further, in the normal operation temperature range R, the control unit 41 controls the heat radiation fan 34 of the electronic cooler 30 to be driven when the temperature T1 in the casing rises to the first set temperature (SV2). Here, when the thermoelectric element 35 is cooled and cooled at the second set temperature (SV3), the heat radiating fin portion of the thermoelectric element is included in the heating side (heat radiating side heat sink 33) of the thermoelectric element, even after the thermoelectric element is stopped ( The temperature inside the chamber drops to the first set temperature SV2), and the state continues to be high for a while; and the thermoelectric element 35 does not rapidly dissipate heat on the heating side, which affects the performance and life of the element, so the cooling of the thermoelectric element 35 is performed. During operation (refer to control table (e)) and before and after (refer to control table (f)), to control the cooling fan 34 in the driving state, it can be quickly dissipated on the heating side, which can prevent the temperature T1 in the casing from rising. The cooling effect is maintained, and the performance of the thermoelectric element 35 can be stabilized for a long period of time. Further, the driving of the cooling fan 34 may be controlled so as to be linked to the cooling driver of the thermoelectric element 35, or may be driven for a predetermined period of time by stopping the cooling drive of the thermoelectric element or by delaying the timer or the like.
更進一步,有關上述吸熱風扇32以及散熱風扇34,以控制成在驅動空氣熱交換器20的風扇22、23時進行同 步驅動的方式,可以以導熱讓框體內的溫度逃逸到外部,可以安定化庫內溫度。 Further, the heat absorbing fan 32 and the heat radiating fan 34 are controlled to be the same when the fans 22 and 23 of the air heat exchanger 20 are driven. The step-driven method can make the temperature inside the frame escape to the outside by heat conduction, and can stabilize the temperature inside the library.
還有,本實施形態的冷卻裝置,係構成電子冷卻器30的熱電元件35並列並做複數個系統設置。於該情況,前述控制部41,係控制成因應框體內的溫度T1對每一系統進行ON/OFF驅動者亦可。具體而言,例如,如圖4所示,框體內的溫度T1逐漸下降,若是從第3設定溫度(SV1)開始往下降時加熱驅動熱電元件35的話,控制部41,係控制成在從第3設定溫度(SV1)開始往下降2℃的時點驅動熱電元件35A系,在從第3設定溫度(SV1)開始往下降3℃的時點驅動熱電元件35B系,在從第3設定溫度(SV1)開始往下降4℃的時點驅動熱電元件35C系,在從第3設定溫度(SV1)開始往下降5℃的時點驅動熱電元件35D系成為最大加熱狀態。接著,藉由這樣的控制運轉框體內的溫度T1上升的情況下,同樣地,把加熱驅動對各系統依序,進行停止控制。 Further, in the cooling device of the present embodiment, the thermoelectric elements 35 constituting the electronic cooler 30 are arranged in parallel and are provided in a plurality of systems. In this case, the control unit 41 controls the ON/OFF drive for each system in response to the temperature T1 in the casing. Specifically, for example, as shown in FIG. 4, the temperature T1 in the casing gradually decreases, and when the thermoelectric element 35 is heated and driven from the third set temperature (SV1), the control unit 41 is controlled to When the set temperature (SV1) starts to decrease by 2 °C, the thermoelectric element 35A is driven, and the thermoelectric element 35B is driven at a temperature of 3 °C from the third set temperature (SV1), and the third set temperature (SV1) is driven. The thermoelectric element 35C was driven to start at a time when the temperature was lowered by 4 ° C, and the thermoelectric element 35D was driven to a maximum heating state when the temperature was lowered by 5 ° C from the third set temperature (SV1). Next, when the temperature T1 in the casing is controlled by such a control, the heating drive is sequentially controlled to stop the respective systems.
如此,以把熱電元件做複數個系統設置,對每一系統,進行階段性的控制運轉的方式,與一次性對熱電元件進行ON/OFF驅動之構成相比較,可以改善框體內的溫度的波動的程度。還有,在這樣的構成下,因應收容於框體1內的發熱體的負載(溫度負載),可以對每一系統依序進行運轉,可以以適於負載之最小的構成(配合負載之最適當的能力)來進行控制運轉,可以圖求運轉成本的降低,以及節能化。當然,這樣的階段性控制運轉,框體內的溫度 T1上升後進行,框體內的溫度為上述第2設定溫度(SV3)進行冷卻驅動熱電元件35之際也可以實施。 In this way, the thermoelectric element is provided in a plurality of system settings, and the phased control operation is performed for each system, and the temperature fluctuation in the casing can be improved as compared with the one-time ON/OFF driving of the thermoelectric element. Degree. Further, with such a configuration, it is possible to sequentially operate each system in accordance with the load (temperature load) of the heat generating body housed in the casing 1, and it is possible to have a minimum configuration suitable for the load (the most suitable load) With proper ability to perform control operations, it is possible to reduce the operating cost and save energy. Of course, such a phased control operation, the temperature inside the frame After the rise of T1, the temperature in the casing can be implemented by cooling the thermoelectric element 35 while cooling the thermoelectric element 35 at the second set temperature (SV3).
尚且,在本實施形態中,並列並做複數個系統設置之熱電元件35A~35D,係分別做複數個串列連接的緣故,可以圖求冷卻能力以及加熱能力的提升。 Further, in the present embodiment, the thermoelectric elements 35A to 35D which are arranged in parallel in a plurality of systems are connected in a plurality of series, and the cooling ability and the heating ability can be improved.
以上,說明有關本發明的實施形態,但本發明不限於上述實施形態,是可以做種種變形。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.
例如,在上述的電子冷卻器30中,把熱電元件35做複數個系統配設;關於構成階段性控制運轉方面,既使在沒有設置空氣熱交換器20的冷卻裝置中也可以實施。換言之,在這樣的構成中,可以實現對應到發熱體的負載之冷卻(加熱)驅動控制,改善波動的程度,有效率地冷卻(加熱)框體內。還有,電子冷卻器30,使用熱電元件以外,也可以使用例如一般的冷媒循環之冷卻構造。 For example, in the above-described electronic cooler 30, the thermoelectric elements 35 are arranged in a plurality of systems, and the stepwise control operation can be carried out even in a cooling device in which the air heat exchanger 20 is not provided. In other words, in such a configuration, the cooling (heating) drive control corresponding to the load of the heat generating body can be realized, the degree of the fluctuation can be improved, and the inside of the casing can be efficiently cooled (heated). Further, in addition to the thermoelectric elements, the electronic cooler 30 may use, for example, a cooling structure of a general refrigerant circulation.
還有,上述的空氣熱交換器20,係構成為內部氣體22A與外部氣體23A不直接接觸,通過區隔之壁面21C經由導熱來進行熱交換;但有關熱交換的方式可以進行種種變形。例如,在殼體21內有各種散熱鰭片,例如,設置層積構造之格子鰭片,以格子間的流路進行熱交換者亦可。 Further, in the air heat exchanger 20 described above, the internal gas 22A is not in direct contact with the outside air 23A, and the wall surface 21C of the partition is thermally exchanged by heat conduction. However, the heat exchange method can be variously modified. For example, various heat dissipation fins are provided in the casing 21. For example, a lattice fin having a laminated structure may be provided, and heat exchange may be performed by a flow path between the lattices.
更進一步,經由提高上述框體1的氣密性,構成在框體1內設置吸濕劑而具有濕度調整功能者亦佳。 Further, it is also preferable to provide a humidity-adjusting function by providing a moisture absorbent in the casing 1 by improving the airtightness of the casing 1.
1‧‧‧框體 1‧‧‧ frame
10‧‧‧冷卻裝置 10‧‧‧Cooling device
20‧‧‧空氣熱交換器 20‧‧‧Air heat exchanger
22、23‧‧‧風扇 22, 23‧‧‧ fans
30‧‧‧電子冷卻器 30‧‧‧Electronic cooler
31‧‧‧吸熱側散熱器 31‧‧‧heat side radiator
32‧‧‧吸熱風扇 32‧‧‧heating fan
33‧‧‧散熱側散熱器 33‧‧‧heat side radiator
34‧‧‧散熱風扇 34‧‧‧ cooling fan
35‧‧‧熱電元件(peltier:device) 35‧‧‧Thermal components (peltier:device)
40‧‧‧控制單元 40‧‧‧Control unit
41‧‧‧控制部 41‧‧‧Control Department
[圖1]揭示有關本發明之框體用冷卻裝置之一實施形 態的整體概略構成圖。 [Fig. 1] discloses a form of a cooling device for a frame body according to the present invention The overall outline of the state.
[圖2]揭示控制運轉框體用冷卻裝置之各驅動部的控制單元之構成的方塊圖。 FIG. 2 is a block diagram showing a configuration of a control unit that controls each drive unit of the cooling device for operating the casing.
[圖3]揭示在控制部中所實施的空氣熱交換器、以及電子冷卻器之控制運轉的樣態之控制表。 [Fig. 3] A control table showing a state in which the air heat exchanger and the electronic cooler are controlled to operate in the control unit.
[圖4]揭示框體內的溫度與電子冷卻器的控制運轉之關係的圖表。 Fig. 4 is a graph showing the relationship between the temperature inside the casing and the control operation of the electronic cooler.
1‧‧‧框體 1‧‧‧ frame
3‧‧‧絕熱壁材 3‧‧‧Insulation wall material
3A‧‧‧前面部 3A‧‧‧ front part
3A’‧‧‧開閉門 3A’‧‧‧Open and close
3B‧‧‧頂板部 3B‧‧‧Top Board
3C‧‧‧背面部 3C‧‧‧Back part
3d‧‧‧開口 3d‧‧‧ openings
4‧‧‧庫內 4‧‧‧Cune
5‧‧‧機架 5‧‧‧Rack
5a‧‧‧棚板 5a‧‧‧Shelf
10‧‧‧冷卻裝置 10‧‧‧Cooling device
20‧‧‧空氣熱交換器 20‧‧‧Air heat exchanger
21‧‧‧殼體 21‧‧‧ housing
21A、21B‧‧‧流路 21A, 21B‧‧‧ flow path
21C‧‧‧壁面 21C‧‧‧ wall
22、23‧‧‧風扇 22, 23‧‧‧ fans
22A‧‧‧內部氣體 22A‧‧‧Internal gas
23A‧‧‧外部氣體 23A‧‧‧External gases
30‧‧‧電子冷卻器 30‧‧‧Electronic cooler
31‧‧‧吸熱側散熱器 31‧‧‧heat side radiator
32‧‧‧吸熱風扇 32‧‧‧heating fan
32A‧‧‧內部氣體 32A‧‧‧Internal gas
33‧‧‧散熱側散熱器 33‧‧‧heat side radiator
34‧‧‧散熱風扇 34‧‧‧ cooling fan
34A‧‧‧空氣 34A‧‧‧Air
35‧‧‧熱電元件(peltier:device) 35‧‧‧Thermal components (peltier:device)
36‧‧‧金屬板 36‧‧‧Metal plates
40‧‧‧控制單元 40‧‧‧Control unit
S1~S3‧‧‧感測器 S1~S3‧‧‧Sensor
Claims (8)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011207695A JP5653872B2 (en) | 2011-09-22 | 2011-09-22 | Case cooling system |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201319479A true TW201319479A (en) | 2013-05-16 |
TWI497021B TWI497021B (en) | 2015-08-21 |
Family
ID=47914329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101134147A TWI497021B (en) | 2011-09-22 | 2012-09-18 | Cooling device for housing |
Country Status (4)
Country | Link |
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JP (1) | JP5653872B2 (en) |
CN (1) | CN103828500B (en) |
TW (1) | TWI497021B (en) |
WO (1) | WO2013042553A1 (en) |
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2011
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-
2012
- 2012-09-07 WO PCT/JP2012/072872 patent/WO2013042553A1/en active Application Filing
- 2012-09-07 CN CN201280046297.4A patent/CN103828500B/en not_active Expired - Fee Related
- 2012-09-18 TW TW101134147A patent/TWI497021B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103533810A (en) * | 2013-09-27 | 2014-01-22 | 山东和顺电气有限公司 | Radiating device of suspension controller of aerotrain with medium-low speed and working method thereof |
TWI644109B (en) * | 2017-05-18 | 2018-12-11 | 漢民科技股份有限公司 | Semiconductor test apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN103828500B (en) | 2016-06-08 |
WO2013042553A1 (en) | 2013-03-28 |
JP2013069890A (en) | 2013-04-18 |
TWI497021B (en) | 2015-08-21 |
JP5653872B2 (en) | 2015-01-14 |
CN103828500A (en) | 2014-05-28 |
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