TW201318812A - Injection molding machine - Google Patents
Injection molding machine Download PDFInfo
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- TW201318812A TW201318812A TW101129203A TW101129203A TW201318812A TW 201318812 A TW201318812 A TW 201318812A TW 101129203 A TW101129203 A TW 101129203A TW 101129203 A TW101129203 A TW 101129203A TW 201318812 A TW201318812 A TW 201318812A
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- clamping force
- movable member
- mold clamping
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/66—Mould opening, closing or clamping devices mechanical
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
- B29C2045/1791—Means for spacing or distancing mould supporting plates, e.g. for mould exchange
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
- B29C2045/1792—Machine parts driven by an electric motor, e.g. electric servomotor
- B29C2045/1793—Machine parts driven by an electric motor, e.g. electric servomotor by an electric linear motor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
- B29C2045/1798—Using spring tension to drive movable machine parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C2045/645—Mould opening, closing or clamping devices using magnetic means
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
本發明係有關一種射出成形機。 The present invention relates to an injection molding machine.
射出成形機是從射出裝置射出熔融樹脂並填充於模具裝置的模穴,並使其固化來成形為成形品。模具裝置由定模及動模構成。模具裝置的閉模、合模及開模藉由合模裝置進行。 The injection molding machine molds a molten resin from an injection device and fills it in a cavity of a mold device, and solidifies it to form a molded article. The mold device is composed of a fixed mold and a movable mold. The mold closing, mold clamping, and mold opening of the mold apparatus are performed by a mold clamping device.
作為合模裝置,廣泛利用使用馬達等驅動源和肘節機構之方式者,但肘節機構的特性上很難變更合模力,響應性或穩定性較差。並且,在肘節機構動作時產生彎曲力矩,可能使安裝模具裝置之安裝面等發生變形。 As a mold clamping device, a drive source such as a motor and a toggle mechanism are widely used. However, it is difficult to change the mold clamping force in the characteristics of the toggle mechanism, and the responsiveness or stability is poor. Further, a bending moment is generated when the toggle mechanism operates, and the mounting surface of the mounting mold device or the like may be deformed.
因此,針對模開閉動作使用線性馬達而針對合模動作利用電磁鐵的吸附力之合模裝置被提出(例如,參閱專利文獻1)。合模裝置中,在基於控制裝置之控制下向電磁鐵的線圈供給電流。 Therefore, a mold clamping device that uses an adsorption force of an electromagnet for a mold clamping operation using a linear motor for a mold opening and closing operation has been proposed (for example, see Patent Document 1). In the mold clamping device, a current is supplied to the coil of the electromagnet under the control of the control device.
專利文獻1:國際公開第05/090052號小冊子 Patent Document 1: International Publication No. 05/090052
模具裝置須按照成形品的種類進行更換。當安裝新的模具裝置時,用螺栓將模具裝置暫時固定於安裝面之後,進行閉模,在合模狀態下進一步緊固螺栓進行正式固定。亦可使用利用液壓或磁力之夾具裝置等來代替螺栓。 The mold unit must be replaced according to the type of molded product. When a new mold device is installed, the mold device is temporarily fixed to the mounting surface by bolts, the mold is closed, and the bolt is further fastened in the mold clamping state for formal fixing. Instead of bolts, a hydraulic or magnetic clamp device or the like can also be used.
正式固定操作是在打開設置於射出成形機的罩上之門的狀態下進行,為了排除控制裝置之誤動作,在打開門之狀態下停止向合模裝置供給電流。 The main fixing operation is performed in a state where the door provided on the cover of the injection molding machine is opened. In order to eliminate the malfunction of the control device, the supply of current to the mold clamping device is stopped while the door is opened.
在該狀態下,使用肘節機構之方式雖然能夠保持預先產生之合模力,但使用電磁鐵之方式無法保持合模力。因為控制裝置所進行之向電磁鐵的線圈的電流供給被截斷。因此,使用電磁鐵之方式中,很難進行正式固定操作。 In this state, the method of using the toggle mechanism can maintain the mold clamping force generated in advance, but the mold clamping force cannot be maintained by using an electromagnet. The current supply to the coil of the electromagnet by the control device is cut off. Therefore, in the manner of using an electromagnet, it is difficult to perform a formal fixing operation.
本發明係鑒於上述課題而完成者,其目的是為了提供一種在停止向合模裝置供給電流之狀態下實現模具裝置的安裝之射出成形機。 The present invention has been made in view of the above problems, and an object thereof is to provide an injection molding machine that realizes attachment of a mold device while stopping supply of current to a mold clamping device.
為了解決上述目的,本發明的一態樣之射出成形機的特徵在於,係具備:第1固定構件,安裝有定模;第1可動構件,安裝有動模;第2可動構件,與該第1可動構件一同移動;第2固定構件,配設於前述第1可動構件與前述第2可動構件之間;第1合模力產生機構,基於電磁鐵之吸附力在該第2固定構件與前述第2可動構件之間產生合模力;及第2合模力產生機構,在停止向該第1合模力產生機構供給電流之狀態下產生既定合模力。 In order to achieve the above object, an injection molding machine according to an aspect of the present invention includes: a first fixing member to which a fixed mold is attached; a first movable member to which a movable mold is attached; and a second movable member; (1) the movable member moves together; the second fixing member is disposed between the first movable member and the second movable member; and the first mold clamping force generating mechanism is based on the adsorption force of the electromagnet to the second fixing member and the A mold clamping force is generated between the second movable members; and the second mold clamping force generating means generates a predetermined mold clamping force in a state where the supply of current to the first mold clamping force generating means is stopped.
另外,本發明的另一態樣之射出成形機的特徵在於,係具備:第1固定構件,安裝有定模;第1可動構件,安裝有動模;第2可動構件,與該第1可動構件一同移動;第2固定構件,配設於前述第1可動構件與前述第2可動構件之間;合模力產生機構,基於電磁鐵之吸附力在該第2固定構件與前述第2可動構件之間產生合模力;及合模力維持機構,在停止向該合模力產生機構供給電流之狀態下,維持在前述第1固定構件與前述第1可動構件之間所產生之既定合模力。 Further, an injection molding machine according to another aspect of the present invention includes: a first fixing member to which a fixed mold is attached; a first movable member to which a movable mold is attached; and a second movable member to move the first movable member The member moves together; the second fixing member is disposed between the first movable member and the second movable member; and the mold clamping force generating mechanism is based on the adsorption force of the electromagnet to the second fixed member and the second movable member And a mold clamping force maintaining mechanism that maintains a predetermined mold clamping between the first fixed member and the first movable member while stopping supply of current to the mold clamping force generating mechanism force.
依本發明,提供一種在停止向合模裝置供給電流之狀態下實現模具裝置的安裝之射出成形機。 According to the present invention, there is provided an injection molding machine that realizes mounting of a mold device while stopping supply of current to the mold clamping device.
以下,參閱附圖對用於實施本發明的方式進行說明,在各附圖中對相同或對應之結構附加相同或對應之元件符號而省略說明。並且,將進行閉模時的可動壓板的移動方向設為前方、將進行開模時的可動壓板的移動方向設為後方來進行說明。 In the following, the embodiments for carrying out the invention will be described with reference to the drawings, and the same or corresponding components will be denoted by the same or corresponding elements in the drawings, and the description will be omitted. In addition, the moving direction of the movable platen when the mold is closed is set to the front, and the moving direction of the movable platen when the mold is opened is set to the rear.
第1圖係表示本發明的第1實施方式之射出成形機閉模時的狀態之圖。第2圖係表示本發明的第1實施方式之射出成形機開模時的狀態之圖。 Fig. 1 is a view showing a state at the time of mold closing in the injection molding machine according to the first embodiment of the present invention. Fig. 2 is a view showing a state at the time of mold opening of the injection molding machine according to the first embodiment of the present invention.
圖中,10為合模裝置,Fr為射出成形機的框架,Gd為由鋪設於該框架Fr上之2根導軌構成之導引件,11為固定壓板(第1固定構件)。固定壓板11可設置於能夠沿著向模開閉方向(圖中左右方向)延伸之導引件Gd移動之位置調整座Ba上。另外,固定壓板11還可以載置於框架Fr上。 In the figure, 10 is a mold clamping device, Fr is a frame of an injection molding machine, Gd is a guide member composed of two guide rails laid on the frame Fr, and 11 is a fixed pressure plate (first fixing member). The fixed platen 11 can be disposed on a position adjusting base Ba that is movable along a guide member Gd that extends in the mold opening and closing direction (the horizontal direction in the drawing). In addition, the fixed platen 11 can also be placed on the frame Fr.
與固定壓板11對置而配設可動壓板(第1可動構件)12。可動壓板12固定於可動座Bb上,可動座Bb能夠在導引件Gd上行走。藉此,可動壓板12能夠相對於固定壓板11向模開閉方向移動。 A movable platen (first movable member) 12 is disposed to face the fixed platen 11 . The movable platen 12 is fixed to the movable seat Bb, and the movable seat Bb can travel on the guide Gd. Thereby, the movable platen 12 can be moved in the mold opening and closing direction with respect to the fixed platen 11.
與固定壓板11隔著既定間隔且與固定壓板11平行地配設後壓板(第2固定構件)13。後壓板13經腳部13a固定於框架Fr。 A rear platen (second fixing member) 13 is disposed in parallel with the fixed platen 11 at a predetermined interval from the fixed platen 11. The rear platen 13 is fixed to the frame Fr via the leg portion 13a.
4根作為連結構件的繫桿14(圖中僅示出4根繫桿14中的2根)架設於固定壓板11與後壓板13之間。固定壓板11經繫桿14固定於後壓板13。沿著繫桿14進退自如地配設可動壓板12。在可動壓板12中的與繫桿14對應之部位形成用於使繫桿14貫穿之未圖示之導孔。另外,可形成缺口部代替導孔。 Four tie bars 14 (only two of the four tie bars 14 are shown in the drawing) are spanned between the fixed platen 11 and the rear platen 13 . The fixed platen 11 is fixed to the rear platen 13 via the tie bars 14. The movable platen 12 is disposed to move forward and backward along the tie rod 14. A guide hole (not shown) through which the tie rod 14 is inserted is formed in a portion of the movable platen 12 corresponding to the tie bar 14. In addition, a notch portion may be formed instead of the via hole.
繫桿14的前端部(圖中右端部)形成未圖示之螺紋 部,將螺母n1螺合緊固於該螺紋部,藉此使繫桿14的前端部固定於固定壓板11。繫桿14的後端部固定於後壓板13。 The front end portion (right end portion in the drawing) of the tie rod 14 forms a thread (not shown) In the portion, the nut n1 is screwed and fastened to the screw portion, whereby the front end portion of the tie rod 14 is fixed to the fixed pressure plate 11. The rear end portion of the tie rod 14 is fixed to the rear pressure plate 13.
定模15與動模16分別安裝於固定壓板11與可動壓板12上,定模15與動模16隨著可動壓板12的進退而接觸或分離,從而進行閉模、合模及開模。另外,隨著進行合模,定模15與動模16之間形成未圖示之模穴空間,從射出裝置17的射出噴嘴18射出之未圖示之熔融樹脂填充於模穴空間。由定模15及動模16構成模具裝置19。 The fixed mold 15 and the movable mold 16 are attached to the fixed platen 11 and the movable platen 12, respectively, and the fixed mold 15 and the movable mold 16 are contacted or separated as the movable platen 12 advances and retreats, thereby performing mold closing, mold clamping, and mold opening. Further, as the mold clamping is performed, a cavity space (not shown) is formed between the fixed mold 15 and the movable mold 16, and molten resin (not shown) which is emitted from the injection nozzle 18 of the injection device 17 is filled in the cavity space. The mold unit 19 is constituted by the fixed mold 15 and the movable mold 16.
吸附板22(第2可動構件)與可動壓板12平行地配設。吸附板22經安裝板27固定於滑動座Sb上,滑動座Sb能夠在導引件Gd上行走。藉此,吸附板22在比後壓板13更靠後方進退自如。吸附板22可由磁性材料形成。另外,亦可不設置安裝板27,此時,吸附板22直接固定於滑動座Sb上。 The suction plate 22 (second movable member) is disposed in parallel with the movable platen 12. The suction plate 22 is fixed to the slide seat Sb via the mounting plate 27, and the slide seat Sb can travel on the guide Gd. Thereby, the suction plate 22 can move forward and backward more than the rear pressure plate 13. The adsorption plate 22 may be formed of a magnetic material. Further, the mounting plate 27 may not be provided, and in this case, the suction plate 22 is directly fixed to the sliding seat Sb.
桿39配設成在後端部與吸附板22連結而在前端部與可動壓板12連結。因此,桿39在閉模時隨著吸附板22前進而前進並使可動壓板12前進,而在開模時隨著吸附板22後退而後退並使可動壓板12後退。因此,在後壓板13的中央部分形成用於使桿39貫穿之孔41。 The rod 39 is disposed to be coupled to the suction plate 22 at the rear end portion and coupled to the movable platen 12 at the front end portion. Therefore, the rod 39 advances with the advancement of the suction plate 22 at the time of mold closing, and advances the movable platen 12, and retreats as the suction plate 22 retreats at the time of mold opening, and the movable platen 12 retreats. Therefore, a hole 41 through which the rod 39 is inserted is formed in the central portion of the rear platen 13.
線性馬達28為用於使可動壓板12進退之模開閉驅動部,例如配設於與可動壓板12連結之吸附板22與框架Fr之間。另外,線性馬達28亦可配設於可動壓板12與框架Fr之間。 The linear motor 28 is a mold opening and closing drive unit for advancing and retracting the movable platen 12, and is disposed, for example, between the suction plate 22 and the frame Fr that are coupled to the movable platen 12. Further, the linear motor 28 may be disposed between the movable platen 12 and the frame Fr.
線性馬達28具備定子29及可動件31。定子29形成為在框架Fr上與導引件Gd平行且與滑動座Sb的移動範圍對應。可動件31在滑動座Sb的下端與定子29對置且遍及既定範圍而形成。 The linear motor 28 includes a stator 29 and a movable member 31. The stator 29 is formed to be parallel to the guide Gd on the frame Fr and to correspond to the range of movement of the slide seat Sb. The mover 31 is formed to face the stator 29 at the lower end of the slide seat Sb and to extend over a predetermined range.
可動件31具備磁心34及線圈35。並且,磁心34具備朝向定子29突出且以既定間距形成之複數個磁極齒33,線圈35捲繞於各磁極齒33上。另外,在相對於可動壓板12的移動方向垂直的方向上磁極齒33形成為相互平行。並且,定子29具備未圖示之磁心及在該磁心上延伸而形成之未圖示之永久磁鐵。藉由使N極及S極的各磁極交替磁化來形成該永久磁鐵。配置檢測可動件31的位置之位置感測器75。 The mover 31 includes a core 34 and a coil 35. Further, the core 34 includes a plurality of magnetic pole teeth 33 that protrude toward the stator 29 and are formed at a predetermined pitch, and the coil 35 is wound around each of the magnetic pole teeth 33. Further, the magnetic pole teeth 33 are formed to be parallel to each other in a direction perpendicular to the moving direction of the movable platen 12. Further, the stator 29 includes a core (not shown) and a permanent magnet (not shown) that is formed to extend over the core. The permanent magnet is formed by alternately magnetizing the magnetic poles of the N pole and the S pole. A position sensor 75 that detects the position of the movable member 31 is disposed.
藉由向線圈35供給既定電流來驅動線性馬達28,使可動件31進退。隨此,吸附板22及可動壓板12進退,從而能夠進行閉模及開模。依據位置感測器75的檢測結果反饋控制線性馬達28,以使可動件31的位置成為設定值。 The linear motor 28 is driven by supplying a predetermined current to the coil 35, and the movable member 31 is advanced and retracted. As a result, the suction plate 22 and the movable platen 12 advance and retreat, thereby enabling mold closing and mold opening. The linear motor 28 is feedback-controlled in accordance with the detection result of the position sensor 75 so that the position of the movable member 31 becomes a set value.
另外,本實施方式中,將永久磁鐵配設於定子29上,並將線圈35配設於可動件31上,但是亦能夠將線圈配設於定子上,並將永久磁鐵配設於可動件上。此時,線圈不會隨著線性馬達28的驅動而移動,因此能夠輕鬆地進行用於向線圈供給電力的配線。 Further, in the present embodiment, the permanent magnet is disposed on the stator 29, and the coil 35 is disposed on the movable member 31. However, the coil can be disposed on the stator, and the permanent magnet can be disposed on the movable member. . At this time, since the coil does not move with the driving of the linear motor 28, the wiring for supplying electric power to the coil can be easily performed.
另外,作為模開閉驅動部,亦可使用旋轉馬達及將旋轉馬達的旋轉運動轉換成直線運動之滾珠螺桿機構等代替 線性馬達28。 In addition, as the mold opening and closing drive unit, a rotary motor and a ball screw mechanism that converts the rotary motion of the rotary motor into a linear motion may be used instead. Linear motor 28.
電磁鐵單元37基於電磁鐵之吸附力在後壓板13與吸附板22之間產生合模力。該吸附力經桿39傳遞到可動壓板12。 The electromagnet unit 37 generates a mold clamping force between the rear platen 13 and the adsorption plate 22 based on the adsorption force of the electromagnet. This adsorption force is transmitted to the movable platen 12 via the rod 39.
另外,由固定壓板11、可動壓板12、後壓板13、吸附板22、線性馬達28、電磁鐵單元37、桿39等構成合模裝置10。並且,由電磁鐵單元37等構成第1合模力產生機構。 Further, the mold clamping device 10 is constituted by the fixed platen 11, the movable platen 12, the rear platen 13, the suction plate 22, the linear motor 28, the electromagnet unit 37, the rod 39, and the like. Further, the electromagnet unit 37 or the like constitutes a first mold clamping force generating mechanism.
電磁鐵單元37包含形成於後壓板13側之電磁鐵49、及形成於吸附板22側之吸附部51。吸附部51形成於吸附板22的前端面的既定部分,例如吸附板22中包圍桿39且與電磁鐵49對置之部分。並且,在後壓板13的後端面的既定部分,例如在桿39的周圍形成槽45,在比槽45更靠內側形成磁心46,在比槽45更靠外側形成磁軛47。並且在槽45內,在磁心46周圍捲繞線圈48。 The electromagnet unit 37 includes an electromagnet 49 formed on the side of the rear platen 13 and an adsorption portion 51 formed on the side of the adsorption plate 22. The adsorption portion 51 is formed at a predetermined portion of the front end surface of the adsorption plate 22, for example, a portion of the adsorption plate 22 that surrounds the rod 39 and faces the electromagnet 49. Further, in a predetermined portion of the rear end surface of the rear platen 13, for example, a groove 45 is formed around the rod 39, a core 46 is formed inside the groove 45, and a yoke 47 is formed outside the groove 45. And in the slot 45, the coil 48 is wound around the core 46.
另外,本實施方式中,與後壓板13分開形成電磁鐵49,與吸附板22分開形成吸附部51,但亦可作為後壓板13的一部分形成電磁鐵,作為吸附板22的一部分形成吸附部。並且,亦可相反配置電磁鐵和吸附部。例如,可在吸附板22側設置電磁鐵49,在後壓板13側設置吸附部51。 Further, in the present embodiment, the electromagnet 49 is formed separately from the rear platen 13, and the adsorption portion 51 is formed separately from the adsorption plate 22. However, an electromagnet may be formed as a part of the rear platen 13, and an adsorption portion may be formed as a part of the adsorption plate 22. Further, the electromagnet and the adsorption portion may be arranged in reverse. For example, the electromagnet 49 can be provided on the side of the adsorption plate 22, and the adsorption portion 51 can be provided on the side of the rear platen 13.
在電磁鐵單元37中,若向線圈48供給電流,則電磁鐵49被驅動而對吸附部51進行吸附,從而產生合模力。 When the current is supplied to the coil 48 in the electromagnet unit 37, the electromagnet 49 is driven to adsorb the adsorption portion 51, thereby generating a mold clamping force.
藉由控制裝置60控制合模裝置10的線性馬達28及 電磁鐵49的驅動。控制裝置60具備CPU及記憶體等,依據由CPU運算之結果向線性馬達28的線圈35或電磁鐵49的線圈48供給電流。控制裝置60與荷重檢測器55連接。荷重檢測器55設置於合模裝置10中至少1根繫桿14的既定位置(固定壓板11與後壓板13之間的既定位置),檢測施加於該繫桿14之荷重。荷重檢測器55例如包括檢測繫桿14的伸長量之感測器。由荷重檢測器55檢測出之荷重被送至控制裝置60。 Controlling the linear motor 28 of the clamping device 10 by the control device 60 and The drive of the electromagnet 49. The control device 60 includes a CPU, a memory, and the like, and supplies a current to the coil 35 of the linear motor 28 or the coil 48 of the electromagnet 49 in accordance with the result of the CPU calculation. The control device 60 is connected to the load detector 55. The load detector 55 is provided at a predetermined position (a predetermined position between the fixed platen 11 and the rear platen 13) of at least one tie rod 14 in the mold clamping device 10, and detects the load applied to the tie bar 14. The load detector 55 includes, for example, a sensor that detects the amount of elongation of the tie rod 14. The load detected by the load detector 55 is sent to the control device 60.
接著,對合模裝置10的動作進行說明。 Next, the operation of the mold clamping device 10 will be described.
藉由控制裝置60的模開閉處理部61控制閉模製程。在第2圖的狀態(開模狀態)下,模開閉處理部61向線圈35供給電流來驅動線性馬達28。如第1圖所示,可動壓板12前進而動模16與定模15抵接。此時,後壓板13與吸附板22之間,亦即電磁鐵49與吸附部51之間形成間隙δ。另外,與合模力相比,閉模所需之力非常小。 The mold closing process is controlled by the mold opening and closing processing unit 61 of the control device 60. In the state (opening state) of Fig. 2, the mold opening and closing processing unit 61 supplies a current to the coil 35 to drive the linear motor 28. As shown in Fig. 1, the movable platen 12 advances and the movable mold 16 abuts against the fixed mold 15. At this time, a gap δ is formed between the rear platen 13 and the adsorption plate 22, that is, between the electromagnet 49 and the adsorption portion 51. In addition, the force required to close the mold is very small compared to the mold clamping force.
接著,控制裝置60的合模處理部62控制合模製程。合模處理部62向電磁鐵49的線圈48供給電流,將吸附部51吸附於電磁鐵49上。隨此,合模力經吸附板22及桿39傳遞至可動壓板12,從而進行合模。 Next, the mold clamping processing unit 62 of the control device 60 controls the mold clamping process. The mold clamping unit 62 supplies a current to the coil 48 of the electromagnet 49, and adsorbs the adsorption unit 51 to the electromagnet 49. Accordingly, the mold clamping force is transmitted to the movable platen 12 via the suction plate 22 and the rod 39, thereby performing mold clamping.
合模力藉由荷重檢測器55檢測。檢測出之合模力被送至控制裝置60,合模處理部62為了使合模力成為設定值而調整供給於線圈48之電流,並進行反饋控制。在此期間,在射出裝置17中熔融之熔融樹脂從射出噴嘴18射出,填充於模具裝置19的模穴空間。 The mold clamping force is detected by the load detector 55. The detected mold clamping force is sent to the control device 60, and the mold clamping processing unit 62 adjusts the current supplied to the coil 48 in order to set the mold clamping force to the set value, and performs feedback control. During this period, the molten resin melted in the injection device 17 is emitted from the injection nozzle 18 and filled in the cavity space of the mold device 19.
若模穴空間內的樹脂冷卻固化,則模開閉處理部61控制開模製程。在第1圖的狀態下,合模處理部62停止向電磁鐵49的線圈48供給電流。隨此,線性馬達28被驅動,可動壓板12後退,如第2圖所示,動模16後退,從而進行開模。 When the resin in the cavity space is cooled and solidified, the mold opening and closing processing portion 61 controls the mold opening process. In the state of Fig. 1, the mold clamping processing unit 62 stops supplying current to the coil 48 of the electromagnet 49. Accordingly, the linear motor 28 is driven, and the movable platen 12 is retracted. As shown in Fig. 2, the movable mold 16 is retracted to perform mold opening.
接著,對更換模具裝置19時的模厚調整進行說明。 Next, the mold thickness adjustment when the mold device 19 is replaced will be described.
隨著更換模具裝置19而安裝新的模具裝置19時,模具裝置19的厚度會改變,而使閉模結束時形成於後壓板13與吸附板22之間的間隙δ發生變化。 When the new mold device 19 is mounted as the mold device 19 is replaced, the thickness of the mold device 19 is changed, and the gap δ formed between the rear platen 13 and the suction plate 22 at the end of the mold closing is changed.
於是,射出成形機具備按照模具裝置19的厚度調整間隙δ之模厚調整裝置70。模厚調整裝置70包括模厚調整用馬達71、齒輪72、螺母73、桿39等。桿39貫穿吸附板22的中央部分,螺紋43形成於桿39的後端部。螺紋43與被支承為相對吸附板22旋轉自如之螺母73相螺合。螺母73的外周面形成有未圖示之大徑齒輪,該齒輪與安裝於模厚調整用馬達71的輸出軸71a之小徑齒輪72相嚙合。由螺母73及螺紋43構成運動方向轉換部,在該運動方向轉換部中,螺母73的旋轉運動轉換成桿39的直進運動。 Then, the injection molding machine has a mold thickness adjusting device 70 that adjusts the gap δ in accordance with the thickness of the mold device 19. The mold thickness adjusting device 70 includes a mold thickness adjusting motor 71, a gear 72, a nut 73, a rod 39, and the like. The rod 39 penetrates the central portion of the suction plate 22, and the thread 43 is formed at the rear end portion of the rod 39. The thread 43 is screwed to a nut 73 that is rotatably supported by the suction plate 22. A large-diameter gear (not shown) is formed on the outer circumferential surface of the nut 73, and the gear meshes with the small-diameter gear 72 attached to the output shaft 71a of the mold thickness adjusting motor 71. The nut 73 and the screw 43 constitute a movement direction changing portion in which the rotational motion of the nut 73 is converted into the linear motion of the rod 39.
對應於模具裝置19的厚度,若驅動模厚調整用馬達71使螺母73相對螺紋43旋轉既定量,可調整桿39相對於吸附板22的位置,且調整吸附板22相對固定壓板11及可動壓板12之位置,從而能夠使間隙δ成為最佳值。亦即,藉由改變可動壓板12與吸附板22之間在模開閉方 向(圖中的左右方向)上的距離來調整模厚。 In response to the thickness of the mold device 19, when the mold thickness adjusting motor 71 is driven to rotate the nut 73 relative to the screw 43, the position of the rod 39 with respect to the suction plate 22 can be adjusted, and the suction plate 22 can be adjusted relative to the fixed platen 11 and the movable platen. The position of 12 makes it possible to make the gap δ an optimum value. That is, by changing the movable opening between the movable platen 12 and the adsorption plate 22 The mold thickness is adjusted to the distance (in the left-right direction in the drawing).
模厚調整用馬達71可為伺服馬達,亦可包括編碼器部71b。編碼器部71b檢測模厚調整用馬達71的輸出軸71a的旋轉量等,且將檢測結果發送到控制裝置60。控制裝置60反饋控制模厚調整用馬達71,而使間隙δ成為設定值。 The mold thickness adjusting motor 71 may be a servo motor or may include an encoder portion 71b. The encoder unit 71b detects the amount of rotation or the like of the output shaft 71a of the mold thickness adjustment motor 71, and transmits the detection result to the control device 60. The control device 60 feedback-controls the mold thickness adjusting motor 71 to set the gap δ to a set value.
並且,模厚調整用馬達71可為帶制動器的馬達。模厚調整用馬達71的制動部71c可為一般的結構,例如由包括電磁鐵之電磁制動器構成。電磁制動器在電磁鐵被通電時容許模厚調整用馬達71的輸出軸71a旋轉,在電磁鐵沒有被通電時限制輸出軸71a旋轉。另外,制動部71c亦可具有氣缸等作為驅動源來代替電磁鐵,不限定為電磁制動器。 Further, the mold thickness adjustment motor 71 may be a motor with a brake. The braking portion 71c of the mold thickness adjusting motor 71 may have a general configuration, and is constituted, for example, by an electromagnetic brake including an electromagnet. The electromagnetic brake allows the output shaft 71a of the mold thickness adjustment motor 71 to rotate when the electromagnet is energized, and restricts the rotation of the output shaft 71a when the electromagnet is not energized. Further, the braking portion 71c may have a cylinder or the like as a driving source instead of the electromagnet, and is not limited to an electromagnetic brake.
接著,依據第3圖對模具裝置19的安裝進行說明。第3圖表示本發明的第1實施方式之射出成形機的模具安裝時的狀態,表示在固定壓板11與可動壓板12之間產生既定合模力之狀態。 Next, the mounting of the mold device 19 will be described based on Fig. 3 . Fig. 3 is a view showing a state in which the mold of the injection molding machine according to the first embodiment of the present invention is mounted, and shows a state in which a predetermined mold clamping force is generated between the fixed pressure plate 11 and the movable platen 12.
安裝新的模具裝置19時,模具裝置19在由起重機等吊持之狀態下,由螺栓暫時固定於固定壓板11。之後,可動壓板12前進而與模具裝置19接觸,接著使模具裝置19合模。合模狀態下,定模15和動模16藉由螺栓分別正式固定於固定壓板11與可動壓板12。亦可使用利用液壓或磁力之夾具裝置等來代替螺栓。 When the new mold device 19 is mounted, the mold device 19 is temporarily fixed to the fixed platen 11 by bolts while being suspended by a crane or the like. Thereafter, the movable platen 12 advances to come into contact with the mold device 19, and then the mold device 19 is clamped. In the mold clamping state, the fixed mold 15 and the movable mold 16 are fixedly fixed to the fixed platen 11 and the movable platen 12 by bolts, respectively. Instead of bolts, a hydraulic or magnetic clamp device or the like can also be used.
正式固定操作是在打開設置於射出成形機的罩上之門 的狀態下進行,因此在停止向合模裝置10(詳細而言為第1合模力產生機構)供給電流之狀態(以下亦稱為“停止狀態”)下進行。這是為了排除控制裝置60之誤動作。 The official fixing operation is to open the door provided on the cover of the injection molding machine. In this state, the state in which the current is supplied to the mold clamping device 10 (specifically, the first mold clamping force generation mechanism) (hereinafter also referred to as "stop state") is performed. This is to eliminate the malfunction of the control device 60.
停止狀態,可為根據各種檢測器的檢測結果反饋控制其動作之驅動源(例如包括電磁鐵49、線性馬達28及模厚調整用馬達71)的驅動控制自動停止之伺服停止(servo off)狀態。 The stop state is a servo off state in which the drive control of the drive source (for example, the electromagnet 49, the linear motor 28, and the mold thickness adjustment motor 71) is automatically controlled to be stopped according to the detection results of the various detectors. .
在停止狀態下,由於控制裝置60所進行之向電磁鐵49的線圈48的電力供給被截斷,因此無法利用電磁鐵49的吸附力作為合模力。 In the stopped state, since the power supply to the coil 48 of the electromagnet 49 by the control device 60 is cut off, the suction force of the electromagnet 49 cannot be used as the mold clamping force.
因此,在停止向第1合模力產生機構供給電流之狀態下,使用產生既定合模力之第2合模力產生機構100。 Therefore, the second mold clamping force generation mechanism 100 that generates a predetermined mold clamping force is used in a state where the supply of current to the first mold clamping force generation mechanism is stopped.
第2合模力產生機構100包括抑制吸附板22後退(向開模方向移動)之移動抑制部110及模厚調整裝置70。該第2合模力產生機構100,在門關閉且停止向電磁鐵49的線圈48供給電流之狀態下產生既定合模力。 The second mold clamping force generation mechanism 100 includes a movement suppressing portion 110 and a mold thickness adjusting device 70 that suppress the suction plate 22 from retreating (moving in the mold opening direction). The second mold clamping force generation mechanism 100 generates a predetermined mold clamping force in a state where the door is closed and the supply of current to the coil 48 of the electromagnet 49 is stopped.
移動抑制部110,例如藉由將吸附板22卡止於後壓板13來抑制吸附板22後退。移動抑制部110由設置於吸附板22側(可動側)之卡止孔111及設置於後壓板13側(固定側)之卡止銷112等構成。 The movement suppressing portion 110 suppresses the suction plate 22 from retreating, for example, by locking the suction plate 22 to the rear platen 13. The movement suppressing portion 110 is constituted by a locking hole 111 provided on the suction plate 22 side (movable side) and a locking pin 112 provided on the rear platen 13 side (fixed side).
卡止孔111例如形成於與吸附板22一體化之滑動座Sb。卡止孔111可在滑動座Sb的進退方向上隔著間隔形成複數個(第3圖中僅圖示一個)。 The locking hole 111 is formed, for example, in a sliding seat Sb that is integrated with the suction plate 22. The locking hole 111 can be formed in plural in the advancing and retracting direction of the sliding seat Sb (only one of which is shown in FIG. 3).
如第3圖所示卡止銷112插入於卡止孔111時限制滑 動座Sb進退,而如第1圖及第2圖所示卡止銷112從卡止孔111拔出時容許滑動座Sb進退。 When the locking pin 112 is inserted into the locking hole 111 as shown in FIG. 3, the sliding is restricted. The movable seat Sb advances and retracts, and when the locking pin 112 is pulled out from the locking hole 111 as shown in FIGS. 1 and 2, the sliding seat Sb is allowed to advance and retreat.
另外,卡止孔111除滑動座Sb外,亦可形成於吸附板22或安裝板27等可動側的構件當中以桿39為基準配設於吸附板22側之構件。同樣地,卡止銷112除後壓板13外,亦可藉由框架Fr等固定側的構件支承成無法進退。 In addition to the sliding seat Sb, the locking hole 111 may be formed in a member on the movable side such as the suction plate 22 or the attachment plate 27, and disposed on the suction plate 22 side with respect to the rod 39 as a reference. Similarly, the locking pin 112 may be supported by the member on the fixed side such as the frame Fr in addition to the rear platen 13 so as not to advance or retreat.
另外,亦可相反配置卡止孔111和卡止銷112,亦即可將卡止孔111設置於固定側的構件且將卡止銷112設置於可動側的構件。 Further, the locking hole 111 and the locking pin 112 may be arranged in the opposite direction, and the locking hole 111 may be provided on the fixed side member and the locking pin 112 may be provided on the movable side member.
移動抑制部110可進一步包括向插拔方向導引卡止銷112之導引部113及驅動卡止銷112之驅動裝置114。導引部113及驅動裝置114例如固定於後壓板13。驅動裝置114至少在滑動座Sb進退期間,使卡止銷112離開滑動座Sb。驅動裝置114可為電動式亦可為液壓式。 The movement suppressing portion 110 may further include a guiding portion 113 that guides the locking pin 112 in the insertion and removal direction and a driving device 114 that drives the locking pin 112. The guiding portion 113 and the driving device 114 are fixed to the rear pressing plate 13, for example. The driving device 114 causes the locking pin 112 to move away from the sliding seat Sb at least during the advancement and retraction of the sliding seat Sb. The drive device 114 can be either electric or hydraulic.
另外,作為限制吸附板22的進退之方法,除銷固定以外亦有螺紋固定、真空吸附或磁性吸附等。磁性吸附時,例如使用磁性夾具、磁性支架等,亦可組合兩者來使用。磁性夾具及磁性支架可設置在固定側、亦可設置在可動側。 Further, as a method of restricting advancement and retreat of the adsorption plate 22, screw fixation, vacuum adsorption, magnetic adsorption, or the like is also provided in addition to pin fixation. In the case of magnetic adsorption, for example, a magnetic jig, a magnetic holder, or the like may be used, or both may be used in combination. The magnetic clamp and the magnetic bracket may be disposed on the fixed side or on the movable side.
接著,對設為上述結構之第2合模力產生機構100的動作進行說明。該動作在模具裝置19的暫時固定操作後進行,且藉由控制裝置60所具備之合模力施加部101控制。 Next, the operation of the second mold clamping force generation mechanism 100 having the above configuration will be described. This operation is performed after the temporary fixing operation of the mold device 19, and is controlled by the mold clamping force applying unit 101 provided in the control device 60.
首先,合模力施加部101為了進行卡止銷112與卡止孔111之間的對準而驅動線性馬達28。並且,合模力施加部101在對準後將卡止銷112插入卡止孔111。插入後,滑動座Sb、甚至吸附板22無法向前後方向移動。 First, the mold clamping force applying unit 101 drives the linear motor 28 in order to perform alignment between the locking pin 112 and the locking hole 111. Then, the mold clamping force applying unit 101 inserts the locking pin 112 into the locking hole 111 after the alignment. After the insertion, the slide seat Sb or even the suction plate 22 cannot move in the front-rear direction.
接著,合模力施加部101驅動模厚調整裝置70,使可動壓板12和吸附板22向前後方向分離。由於吸附板22的後退被限制,因此可動壓板12會前進,使動模16壓緊於定模15而產生合模力。 Next, the mold clamping force applying unit 101 drives the mold thickness adjusting device 70 to separate the movable platen 12 and the suction plate 22 in the front-rear direction. Since the retreat of the suction plate 22 is restricted, the movable platen 12 advances, and the movable mold 16 is pressed against the fixed mold 15 to generate a mold clamping force.
如此,在藉由移動抑制部110抑制吸附板22後退之狀態下,合模力施加部101藉由驅動模厚調整裝置70來將合模力施加於固定壓板11與可動壓板12之間。在停止模厚調整裝置70之後,該合模力亦藉由移動抑制部110維持。如此,由於能夠在停止狀態下維持合模力,因此能夠進行模具裝置19的正式固定操作。 In this state, the mold clamping force applying unit 101 applies the mold clamping force to the fixed pressure plate 11 and the movable platen 12 by the drive mold thickness adjusting device 70 in a state where the movement suppressing portion 110 suppresses the suction plate 22 from retracting. After the mold thickness adjusting device 70 is stopped, the mold clamping force is also maintained by the movement suppressing portion 110. In this way, since the mold clamping force can be maintained in the stopped state, the main fixing operation of the mold device 19 can be performed.
在停止狀態維持合模力時,可藉由制動部71c的制動力限制螺母73向釋放合模力之方向旋轉來維持合模力。另外,亦能夠藉由螺母73與螺紋43的摩擦力在某種程度上限制螺母73旋轉。 When the mold clamping force is maintained in the stopped state, the clamping force can be maintained by the braking force of the braking portion 71c restricting the nut 73 from rotating in the direction in which the mold clamping force is released. Further, it is also possible to restrict the rotation of the nut 73 to some extent by the frictional force of the nut 73 and the screw 43.
另外,本實施方式中,將卡止銷112插入卡止孔111之後藉由模厚調整裝置70產生合模力,但本發明不限於此。例如,可在藉由電磁鐵49產生合模力之狀態下將卡止銷112插入卡止孔111。移動抑制部110在電磁鐵49成為停止狀態之後,亦能夠維持既定合模力。此時,由移動抑制部110構成合模力維持機構,且合模力維持機構可不 包括模厚調整裝置70。並且,此時,只要將卡止孔111或卡止銷112配設於可動側的構件即可,可動側的構件可為以桿39為基準配設於吸附板22側之構件,亦可為以桿39為基準配設於可動壓板12側之構件,還可為桿39。 Further, in the present embodiment, the mold clamping force is generated by the mold thickness adjusting device 70 after the locking pin 112 is inserted into the locking hole 111, but the present invention is not limited thereto. For example, the locking pin 112 can be inserted into the locking hole 111 in a state where the mold clamping force is generated by the electromagnet 49. The movement suppressing portion 110 can maintain a predetermined clamping force even after the electromagnet 49 is in a stopped state. At this time, the movement suppressing portion 110 constitutes the mold clamping force maintaining mechanism, and the mold clamping force maintaining mechanism does not A mold thickness adjustment device 70 is included. In this case, the locking hole 111 or the locking pin 112 may be disposed on the movable side member, and the movable side member may be a member disposed on the suction plate 22 side with respect to the rod 39, or may be A member disposed on the side of the movable platen 12 with respect to the rod 39 may be a rod 39.
第4圖表示本發明的第2實施方式之射出成形機的模具安裝時的狀態,且表示在固定壓板11與可動壓板12之間產生既定合模力之狀態。 Fig. 4 is a view showing a state in which the mold of the injection molding machine according to the second embodiment of the present invention is mounted, and shows a state in which a predetermined mold clamping force is generated between the fixed platen 11 and the movable platen 12.
本實施方式之第2合模力產生機構200除模厚調整裝置70以外,還具備用於將吸附板22向前方(閉模方向)彈壓之彈壓部作為抑制吸附板22後退(向開模方向的移動)之移動抑制部。作為彈壓部,例如第4圖所示利用彈簧210等。在門關閉之狀態下,且停止向電磁鐵49的線圈48供給電流之狀態下,該第2合模力產生機構200產生既定合模力。 In addition to the mold thickness adjusting device 70, the second mold clamping force generating means 200 of the present embodiment further includes a biasing portion for biasing the suction plate 22 forward (closed mold direction) as the suction preventing plate 22 to retreat (to the mold opening direction). The movement suppression unit. As the biasing portion, for example, a spring 210 or the like is used as shown in Fig. 4 . When the door is closed and the supply of current to the coil 48 of the electromagnet 49 is stopped, the second mold clamping force generation mechanism 200 generates a predetermined mold clamping force.
彈簧210在新的模具裝置19的正式固定操作時使用。正式固定操作時,彈簧210的一端部211固定於相對框架Fr固定之彈簧安裝部220。彈簧210的另一端部212固定於與吸附板22一體化之滑動座Sb。 The spring 210 is used during the formal fixing operation of the new mold device 19. At the time of the fixing operation, the one end portion 211 of the spring 210 is fixed to the spring mounting portion 220 fixed to the frame Fr. The other end portion 212 of the spring 210 is fixed to a sliding seat Sb that is integrated with the suction plate 22.
另外,本實施方式的彈簧210的一端部211雖固定於彈簧安裝部220,但亦可固定於框架Fr,只要固定於固定側的構件即可。同樣地,彈簧210的另一端部212雖固定於滑動座Sb,但亦可固定於吸附板22,只要固定於可動 側的構件當中以桿39為基準配設於吸附板22側之構件即可。 Further, the one end portion 211 of the spring 210 of the present embodiment is fixed to the spring attachment portion 220, but may be fixed to the frame Fr as long as it is fixed to the member on the fixed side. Similarly, the other end portion 212 of the spring 210 is fixed to the sliding seat Sb, but may be fixed to the suction plate 22 as long as it is fixed to the movable plate. Among the members on the side, the member provided on the side of the suction plate 22 with respect to the rod 39 may be used.
作為彈簧210的端部211、212的固定方法例如有銷固定、螺紋固定、真空吸附、磁性吸附等。磁性吸附時,例如使用磁性夾具、磁性支架等,亦可組合兩者來使用。磁性夾具及磁性支架可設置在彈簧安裝部220側或滑動座Sb側。 The fixing method of the end portions 211, 212 of the spring 210 is, for example, pin fixing, screwing, vacuum suction, magnetic adsorption, or the like. In the case of magnetic adsorption, for example, a magnetic jig, a magnetic holder, or the like may be used, or both may be used in combination. The magnetic jig and the magnetic bracket may be disposed on the side of the spring mounting portion 220 or the side of the sliding seat Sb.
彈簧安裝部220如第4圖所示可配設於滑動座Sb的前方,亦可配設於滑動座Sb的後方。配設於後方時,彈簧的彈壓方向亦設定為前方(閉模方向)。 The spring attachment portion 220 may be disposed in front of the slide seat Sb as shown in FIG. 4 or may be disposed behind the slide seat Sb. When it is placed at the rear, the spring pressure direction is also set to the front (closed mold direction).
接著,對採用上述結構之第2合模力產生機構200的動作進行說明。該動作在模具裝置19的暫時固定操作後進行,且藉由控制裝置60所具備之合模力施加部201控制。 Next, the operation of the second mold clamping force generation mechanism 200 having the above configuration will be described. This operation is performed after the temporary fixing operation of the mold device 19, and is controlled by the mold clamping force applying portion 201 provided in the control device 60.
首先,合模力施加部201驅動線性馬達28來使可動壓板12前進,並使動模16抵接於定模15。此時,電磁鐵49與吸附部51之間形成間隙δ。又亦可無間隙δ。 First, the mold clamping force applying unit 201 drives the linear motor 28 to advance the movable platen 12 and abuts the movable mold 16 against the fixed mold 15. At this time, a gap δ is formed between the electromagnet 49 and the adsorption portion 51. There is also no gap δ.
其後,將彈簧210的一端部211固定於彈簧安裝部220,且將彈簧210的另一端部212固定於滑動座Sb。彈簧210將滑動座Sb、甚至吸附板22向前方(圖中的右方向)彈壓,藉此抑制吸附板22後退。 Thereafter, the one end portion 211 of the spring 210 is fixed to the spring attachment portion 220, and the other end portion 212 of the spring 210 is fixed to the slide seat Sb. The spring 210 biases the slide seat Sb and even the suction plate 22 toward the front (the right direction in the drawing), thereby suppressing the suction plate 22 from retreating.
接著,合模力施加部201驅動模厚調整裝置70,使可動壓板12和吸附板22向前後方向分離。由於彈簧210抑制吸附板22後退,因此可動壓板12會前進,使動模16 壓緊於定模15來產生合模力。合模力亦包括彈簧210的彈壓力。 Next, the mold clamping force applying unit 201 drives the mold thickness adjusting device 70 to separate the movable platen 12 and the suction plate 22 in the front-rear direction. Since the spring 210 suppresses the suction plate 22 from retreating, the movable platen 12 advances to move the movable mold 16 Pressing on the stationary mold 15 produces a clamping force. The clamping force also includes the spring pressure of the spring 210.
如此,合模力施加部201在藉由彈簧210抑制吸附板22後退之狀態下,藉由驅動模厚調整裝置70將合模力施加於固定壓板11與可動壓板12之間。在停止模厚調整裝置70之後,該合模力亦藉由彈簧210維持。藉此,由於能夠在停止狀態維持合模力,因此能夠進行模具裝置19的正式固定操作。 In this manner, the mold clamping force applying unit 201 applies the mold clamping force to the fixed platen 11 and the movable platen 12 by the drive mold thickness adjusting device 70 while the suction plate 22 is prevented from retracting by the spring 210. After the mold thickness adjustment device 70 is stopped, the mold clamping force is also maintained by the spring 210. Thereby, since the mold clamping force can be maintained in the stopped state, the main fixing operation of the mold device 19 can be performed.
在停止狀態下維持合模力時,可藉由制動部71c的制動力限制螺母73向釋放合模力之方向旋轉來維持合模力。另外,亦能夠藉由螺母73與螺紋43的摩擦力在某種程度上限制螺母73旋轉。 When the mold clamping force is maintained in the stopped state, the clamping force can be maintained by the braking force of the braking portion 71c restricting the nut 73 from rotating in the direction in which the mold clamping force is released. Further, it is also possible to restrict the rotation of the nut 73 to some extent by the frictional force of the nut 73 and the screw 43.
另外,本實施方式中,藉由彈簧210抑制吸附板22後退之後藉由模厚調整裝置70產生合模力,但本發明不限於此。例如,可在藉由電磁鐵49產生合模力之狀態下藉由彈簧210抑制吸附板22後退。電磁鐵49成為停止狀態之後,彈簧210亦能夠維持既定合模力。此時,由包括彈簧210之移動抑制部構成合模力維持機構,且合模力維持機構可不包括模厚調整裝置70。此時,只要將彈簧210的另一端部212固定於可動側的構件即可,可動側的構件可為以桿39為基準配設於吸附板22側之構件,亦可為以桿39為基準配設於可動壓板12側之構件,還可為桿39。 Further, in the present embodiment, the spring 210 prevents the suction plate 22 from retracting and the mold clamping force is generated by the mold thickness adjusting device 70. However, the present invention is not limited thereto. For example, the suction plate 22 can be prevented from retreating by the spring 210 while the mold clamping force is generated by the electromagnet 49. After the electromagnet 49 is in the stopped state, the spring 210 can maintain a predetermined clamping force. At this time, the mold clamping force maintaining mechanism is constituted by the movement suppressing portion including the spring 210, and the mold clamping force maintaining mechanism may not include the mold thickness adjusting device 70. In this case, the other end portion 212 of the spring 210 may be fixed to the movable side member, and the movable side member may be a member disposed on the side of the suction plate 22 with respect to the rod 39, or may be based on the rod 39. The member disposed on the side of the movable platen 12 may also be a rod 39.
第5圖表示本發明的第3實施方式之射出成形機的模具安裝時的狀態,且表示在固定壓板11與可動壓板12之間產生既定合模力之狀態。 Fig. 5 is a view showing a state in which the mold of the injection molding machine according to the third embodiment of the present invention is mounted, and shows a state in which a predetermined mold clamping force is generated between the fixed platen 11 and the movable platen 12.
藉由本實施方式之第2合模力產生機構300除模厚調整裝置70以外,還包括抑制吸附板22後退(向開模方向的移動)之移動抑制部。移動抑制部利用電磁鐵的電流供給結束後的殘留磁通量。該第2合模力產生機構300在門關閉之狀態下,且停止向電磁鐵49的線圈48供給電流之狀態下,產生既定合模力。 In addition to the mold thickness adjusting device 70, the second mold clamping force generation mechanism 300 of the present embodiment further includes a movement suppressing portion that suppresses the retraction of the suction plate 22 (movement in the mold opening direction). The movement suppressing portion uses the residual magnetic flux after the current supply of the electromagnet is completed. The second mold clamping force generation mechanism 300 generates a predetermined mold clamping force in a state where the door is closed and the supply of current to the coil 48 of the electromagnet 49 is stopped.
接著,對採用上述結構之第2合模力產生機構300的動作進行說明。該動作在模具裝置19的暫時固定操作後進行,且藉由控制裝置60所具備之合模力施加部301控制。合模力施加部301包括移動抑制部。 Next, the operation of the second mold clamping force generation mechanism 300 having the above configuration will be described. This operation is performed after the temporary fixing operation of the mold device 19, and is controlled by the mold clamping force applying unit 301 provided in the control device 60. The mold clamping force applying unit 301 includes a movement suppressing portion.
首先,合模力施加部301驅動線性馬達28及模厚調整裝置70,使電磁鐵49與吸附部51之間之間隙δ(參閱第1圖)消失。並且,合模力施加部301向電磁鐵49的線圈48供給電流,使吸附部51接觸吸附於電磁鐵49,並使吸附板22接觸吸附於後壓板13。 First, the mold clamping force applying unit 301 drives the linear motor 28 and the mold thickness adjusting device 70 to eliminate the gap δ (see FIG. 1) between the electromagnet 49 and the adsorption unit 51. Further, the mold clamping force applying unit 301 supplies a current to the coil 48 of the electromagnet 49, and the adsorption unit 51 is brought into contact with the electromagnet 49, and the adsorption plate 22 is brought into contact with the rear platen 13.
接著,合模力施加部301結束向線圈48供給電流。此時,由於沒有間隙δ(參閱第1圖),因此藉由電流供給結束後的殘留磁通量產生充分的吸附力。藉此抑制吸附板22的後退(向開模方向的移動)。如此,合模力施加部301包括移動抑制部。 Next, the mold clamping force applying unit 301 ends the supply of current to the coil 48. At this time, since there is no gap δ (see FIG. 1), a sufficient adsorption force is generated by the residual magnetic flux after the current supply is completed. Thereby, the retreat of the adsorption plate 22 (movement in the mold opening direction) is suppressed. In this manner, the mold clamping force application unit 301 includes a movement suppression unit.
接著,合模力施加部301驅動模厚調整裝置70,使可 動壓板12和吸附板22向前後方向分離。由於吸附板22接觸吸附於後壓板13而不後退,因此可動壓板12會前進,使動模16壓緊於定模15來產生合模力。 Next, the mold clamping force applying unit 301 drives the mold thickness adjusting device 70 to The movable platen 12 and the suction plate 22 are separated in the forward and backward directions. Since the suction plate 22 is in contact with the rear platen 13 without being retracted, the movable platen 12 advances, and the movable mold 16 is pressed against the fixed mold 15 to generate a mold clamping force.
如此,合模力施加部301在藉由電流供給後的殘留磁通量抑制吸附板22後退之狀態下,藉由驅動模厚調整裝置70將合模力施加於固定壓板11與可動壓板12之間。該合模力在停止模厚調整裝置70之後亦被維持。藉此,由於能夠在停止狀態維持合模力,因此能夠進行模具裝置19的正式固定操作。 In this manner, the mold clamping force applying unit 301 applies the mold clamping force to the fixed platen 11 and the movable platen 12 by the drive mold thickness adjusting device 70 in a state where the residual magnetic flux after the current supply is suppressed to retract the suction plate 22 . This mold clamping force is also maintained after stopping the mold thickness adjusting device 70. Thereby, since the mold clamping force can be maintained in the stopped state, the main fixing operation of the mold device 19 can be performed.
在停止狀態下維持合模力時,可藉由制動部71c的制動力限制螺母73向釋放合模力之方向旋轉來維持合模力。另外,亦能夠藉由螺母73與螺紋43的摩擦力在某種程度上限制螺母73旋轉。 When the mold clamping force is maintained in the stopped state, the clamping force can be maintained by the braking force of the braking portion 71c restricting the nut 73 from rotating in the direction in which the mold clamping force is released. Further, it is also possible to restrict the rotation of the nut 73 to some extent by the frictional force of the nut 73 and the screw 43.
另外,本實施方式中,藉由電磁鐵49的殘留磁通量使吸附板22接觸吸附於後壓板13之後藉由模厚調整裝置70產生合模力,但本發明不限於此。例如,可在形成微細的間隙δ之狀態(能夠由模厚調整裝置70調整間隙δ)下向電磁鐵49供給電流,藉此產生合模力並消除間隙δ。即使電磁鐵49成為停止狀態之後,仍能夠藉由殘留磁通量維持既定合模力。此時,可由包括於合模力施加部301之移動抑制部構成合模力維持機構,且合模力維持機構不包括模厚調整裝置70。 Further, in the present embodiment, the mold clamping force is generated by the mold thickness adjusting device 70 after the suction plate 22 is brought into contact with the rear platen 13 by the residual magnetic flux of the electromagnet 49, but the present invention is not limited thereto. For example, a current can be supplied to the electromagnet 49 in a state in which a fine gap δ is formed (the gap δ can be adjusted by the mold thickness adjusting device 70), thereby generating a mold clamping force and eliminating the gap δ. Even after the electromagnet 49 is in the stopped state, the predetermined clamping force can be maintained by the residual magnetic flux. At this time, the mold clamping force maintaining mechanism may be constituted by the movement suppressing portion included in the mold clamping force applying portion 301, and the mold clamping force maintaining mechanism does not include the mold thickness adjusting device 70.
第6圖表示本發明的第4實施方式之射出成形機的模具安裝時的狀態,且表示在固定壓板11與可動壓板12之間產生既定合模力之狀態。該狀態下,後壓板13與吸附板22之間形成有間隙δ。 Fig. 6 is a view showing a state in which the mold of the injection molding machine according to the fourth embodiment of the present invention is mounted, and shows a state in which a predetermined mold clamping force is generated between the fixed platen 11 and the movable platen 12. In this state, a gap δ is formed between the rear platen 13 and the suction plate 22.
第2合模力產生機構400具備拉近裝置,該拉近裝置在動模16抵接於定模15之狀態下,將相對可動壓板12固定之部分朝向相對固定壓板11固定之部分拉近。作為拉近裝置,例如第6圖所示利用彈簧410等。可設置複數個彈簧410。該第2合模力產生機構400在停止向電磁鐵49的線圈48供給電流之狀態下,產生既定合模力。由於第2合模力產生機構400不包括模厚調整裝置70,因此能夠與門的打開關閉狀態無關地產生既定合模力。 The second mold clamping force generation mechanism 400 includes a drawing device that pulls a portion fixed to the movable platen 12 toward a portion fixed to the fixed platen 11 with the movable mold 16 abutting against the fixed mold 15 . As the drawing device, for example, a spring 410 or the like is used as shown in Fig. 6. A plurality of springs 410 can be provided. The second mold clamping force generation mechanism 400 generates a predetermined mold clamping force while stopping the supply of current to the coil 48 of the electromagnet 49. Since the second mold clamping force generation mechanism 400 does not include the mold thickness adjustment device 70, it is possible to generate a predetermined mold clamping force regardless of the open and closed state of the door.
彈簧410在新的模具裝置19的正式固定操作時使用。正式固定操作時,彈簧410的一端部411固定於固定壓板11,彈簧410的另一端部412固定於可動壓板12。 The spring 410 is used during the formal fixing operation of the new mold device 19. At the time of the official fixing operation, the one end portion 411 of the spring 410 is fixed to the fixed platen 11, and the other end portion 412 of the spring 410 is fixed to the movable platen 12.
作為固定方法例如有銷固定、螺紋固定、真空吸附、磁性吸附等。磁性吸附時,例如利用磁性夾具及磁性支架等,亦可組合兩者來使用。磁性夾具及磁性支架可設置在可動壓板12側或固定壓板11側。 Examples of the fixing method include pin fixing, screw fixing, vacuum suction, magnetic adsorption, and the like. In the case of magnetic adsorption, for example, a magnetic jig, a magnetic holder, or the like may be used, or both may be used in combination. The magnetic jig and the magnetic bracket may be disposed on the side of the movable platen 12 or the side of the fixed platen 11.
藉由彈簧410的拉力在可動壓板12與固定壓板11之間產生合模力,因此在停止合模裝置10的驅動控制之狀態下產生合模力,而能夠進行模具裝置19的正式固定操作。 Since the mold clamping force is generated between the movable platen 12 and the fixed platen 11 by the tensile force of the spring 410, the mold clamping force is generated while the drive control of the mold clamping device 10 is stopped, and the mold fixing operation of the mold device 19 can be performed.
另外,本實施方式的彈簧410的一端部411雖固定於 固定壓板11,但亦可固定於框架Fr、繫桿14等,只要固定於固定側的構件即可。同樣地,彈簧410的另一端部412雖固定於可動壓板12,但亦可固定於滑動座Sb、吸附板22等,只要固定於可動側的構件即可。例如,彈簧410可與第4圖所示之彈簧210相同,一端部411固定於彈簧安裝部220,另一端部412固定於滑動座Sb。 Further, the one end portion 411 of the spring 410 of the present embodiment is fixed to The pressure plate 11 may be fixed, but may be fixed to the frame Fr, the tie rod 14, or the like as long as it is fixed to the member on the fixed side. Similarly, the other end portion 412 of the spring 410 is fixed to the movable platen 12, but may be fixed to the sliding seat Sb, the suction plate 22, and the like, and may be fixed to the movable side member. For example, the spring 410 may be the same as the spring 210 shown in FIG. 4, and the one end portion 411 is fixed to the spring mounting portion 220, and the other end portion 412 is fixed to the sliding seat Sb.
另外,本實施方式中,在停止狀態下藉由彈簧410產生合模力,但本發明不限於此。例如,可藉由電磁鐵49產生合模力之後安裝彈簧410。彈簧410在電磁鐵49成為停止狀態之後亦能夠維持既定合模力。此時,由彈簧410構成合模力維持機構。 Further, in the present embodiment, the mold clamping force is generated by the spring 410 in the stopped state, but the present invention is not limited thereto. For example, the spring 410 can be mounted after the mold clamping force is generated by the electromagnet 49. The spring 410 can maintain a predetermined clamping force even after the electromagnet 49 is in a stopped state. At this time, the spring 410 constitutes a mold clamping force maintaining mechanism.
另外,本實施方式的拉近裝置雖為利用彈簧410的彈壓力之彈簧式拉近裝置,但亦可為利用液壓或空氣壓等流體壓之流體壓式的拉近裝置、螺合式拉近裝置等。螺合式拉近裝置係具備:固定於固定壓板11且貫穿可動壓板12之軸、螺合於在該軸的後端部形成之螺紋之螺母、及使螺母旋轉之馬達。若驅動馬達使螺母向既定方向旋轉,可動壓板12會前進而產生合模力。另外,軸亦可固定於可動壓板12並貫穿固定壓板11,此時,螺紋形成於軸的前端部。並且,軸亦可貫穿可動壓板12及固定壓板11,此時,螺紋形成於軸的前端部及後端部,且螺母分別螺合於各螺紋,2個螺母相對地向反方向旋轉。 Further, although the approximating device of the present embodiment is a spring-type drawing device that uses the elastic force of the spring 410, it may be a fluid-pressure type close-up device or a screw-type approximating device that uses a fluid pressure such as a hydraulic pressure or an air pressure. Wait. The screw-type zoom-in device includes a nut that is fixed to the fixed pressure plate 11 and penetrates the movable platen 12, a nut that is screwed to a screw thread formed at a rear end portion of the shaft, and a motor that rotates the nut. When the drive motor rotates the nut in a predetermined direction, the movable platen 12 advances to generate a mold clamping force. Further, the shaft may be fixed to the movable platen 12 and penetrate the fixed platen 11, and at this time, the thread is formed at the front end portion of the shaft. Further, the shaft can also pass through the movable platen 12 and the fixed platen 11. At this time, the threads are formed at the front end portion and the rear end portion of the shaft, and the nuts are respectively screwed to the respective threads, and the two nuts are relatively rotated in opposite directions.
以上,對本發明的第1~第4實施方式進行了說明,但本發明不限於上述實施方式,在不脫離本發明的範圍內 ,能夠對上述實施方式加以各種變形或替換。 Although the first to fourth embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and does not depart from the scope of the present invention. Various modifications or substitutions can be made to the above embodiments.
例如,第1~第4實施方式的動模16安裝於可動壓板12,但亦可經可動側安裝板安裝於可動壓板12。同樣地,定模15可經固定側安裝板安裝於固定壓板11。此時,例如第4實施方式的拉近裝置可為朝向固定側安裝板拉近可動側安裝板之裝置。 For example, the movable mold 16 of the first to fourth embodiments is attached to the movable platen 12, but may be attached to the movable platen 12 via the movable side mounting plate. Similarly, the fixed mold 15 can be mounted to the fixed platen 11 via a fixed side mounting plate. At this time, for example, the drawing device of the fourth embodiment may be a device that pulls the movable side mounting plate toward the fixed side mounting plate.
並且,第1~第3實施方式的合模力施加部101~301設置於控制裝置60,但亦可設置於專用的控制裝置。 Further, the mold clamping force applying units 101 to 301 of the first to third embodiments are provided in the control device 60, but may be provided in a dedicated control device.
10‧‧‧合模裝置 10‧‧‧Molding device
11‧‧‧固定壓板(第1固定構件) 11‧‧‧Fixed platen (1st fixing member)
12‧‧‧可動壓板(第1可動構件) 12‧‧‧ movable platen (1st movable member)
13‧‧‧後壓板(第2固定構件) 13‧‧‧ Rear platen (2nd fixing member)
15‧‧‧定模 15‧‧ ‧ fixed mode
16‧‧‧動模 16‧‧‧moving
22‧‧‧吸附板(第2可動構件) 22‧‧‧Adsorption plate (2nd movable member)
37‧‧‧電磁鐵單元(第1合模力產生機構) 37‧‧‧Electromagnetic unit (1st clamping force generating mechanism)
49‧‧‧電磁鐵 49‧‧‧Electromagnet
60‧‧‧控制裝置 60‧‧‧Control device
70‧‧‧模厚調整裝置(模厚調整部) 70‧‧‧Mold thickness adjustment device (die thickness adjustment unit)
71‧‧‧模厚調整用馬達(驅動用馬達) 71‧‧‧Mould for thickness adjustment (drive motor)
71c‧‧‧制動部 71c‧‧‧Brake
100‧‧‧第2合模力產生機構 100‧‧‧2nd clamping force generating mechanism
101‧‧‧合模力施加部 101‧‧ ‧ clamping force application department
110‧‧‧移動抑制部 110‧‧‧Mobile Suppression Department
111‧‧‧卡止孔 111‧‧‧ card hole
112‧‧‧卡止銷 112‧‧‧ card sales
210‧‧‧彈簧(彈壓部) 210‧‧‧Spring (elastic part)
410‧‧‧彈簧(拉近裝置) 410‧‧‧Spring (pull closer)
第1圖係表示本發明的第1實施方式之射出成形機閉模時的狀態之圖。 Fig. 1 is a view showing a state at the time of mold closing in the injection molding machine according to the first embodiment of the present invention.
第2圖係表示本發明的第1實施方式之射出成形機開模時的狀態之圖。 Fig. 2 is a view showing a state at the time of mold opening of the injection molding machine according to the first embodiment of the present invention.
第3圖係表示本發明的第1實施方式之射出成形機的模具安裝時的狀態之圖。 Fig. 3 is a view showing a state at the time of mold mounting of the injection molding machine according to the first embodiment of the present invention.
第4圖係表示本發明的第2實施方式之射出成形機的模具安裝時的狀態之圖。 Fig. 4 is a view showing a state at the time of mold mounting of the injection molding machine according to the second embodiment of the present invention.
第5圖係表示本發明的第3實施方式之射出成形機的模具安裝時的狀態之圖。 Fig. 5 is a view showing a state at the time of mold mounting of the injection molding machine according to the third embodiment of the present invention.
第6圖係表示本發明的第4實施方式之射出成形機的模具安裝時的狀態之圖。 Fig. 6 is a view showing a state at the time of mold mounting of the injection molding machine according to the fourth embodiment of the present invention.
10‧‧‧合模裝置 10‧‧‧Molding device
11‧‧‧固定壓板(第1固定構件) 11‧‧‧Fixed platen (1st fixing member)
12‧‧‧可動壓板(第1可動構件) 12‧‧‧ movable platen (1st movable member)
13‧‧‧後壓板(第2固定構件) 13‧‧‧ Rear platen (2nd fixing member)
13a‧‧‧腳部 13a‧‧‧foot
14‧‧‧繫桿 14‧‧‧ tied
15‧‧‧定模 15‧‧ ‧ fixed mode
16‧‧‧動模 16‧‧‧moving
17‧‧‧射出裝置 17‧‧‧Injection device
18‧‧‧射出噴嘴 18‧‧‧Injection nozzle
19‧‧‧模具裝置 19‧‧‧Molding device
22‧‧‧吸附板(第2可動構件) 22‧‧‧Adsorption plate (2nd movable member)
27‧‧‧安裝板 27‧‧‧Installation board
28‧‧‧線性馬達 28‧‧‧Linear motor
29‧‧‧定子 29‧‧‧ Stator
31‧‧‧可動件 31‧‧‧ movable parts
33‧‧‧磁極齒 33‧‧‧Magnetic teeth
34‧‧‧磁心 34‧‧‧Magnetic core
35‧‧‧線圈 35‧‧‧ coil
37‧‧‧電磁鐵單元(第1合模力產生機構) 37‧‧‧Electromagnetic unit (1st clamping force generating mechanism)
39‧‧‧桿 39‧‧‧ pole
41‧‧‧孔 41‧‧‧ hole
43‧‧‧螺紋 43‧‧‧Thread
45‧‧‧槽 45‧‧‧ slots
46‧‧‧磁心 46‧‧‧Magnetic core
47‧‧‧磁軛 47‧‧‧Y yoke
48‧‧‧線圈 48‧‧‧ coil
49‧‧‧電磁鐵 49‧‧‧Electromagnet
51‧‧‧吸附部 51‧‧‧Adsorption Department
55‧‧‧荷重檢測器 55‧‧‧Load detector
60‧‧‧控制裝置 60‧‧‧Control device
61‧‧‧模開閉處理部 61‧‧‧Mold opening and closing processing department
62‧‧‧合模處理部 62‧‧‧Molding Processing Department
70‧‧‧模厚調整裝置(模厚調整部) 70‧‧‧Mold thickness adjustment device (die thickness adjustment unit)
71‧‧‧模厚調整用馬達(驅動用馬達) 71‧‧‧Mould for thickness adjustment (drive motor)
71a‧‧‧輸出軸 71a‧‧‧ Output shaft
71b‧‧‧編碼器部 71b‧‧‧Encoder Division
71c‧‧‧制動部 71c‧‧‧Brake
72‧‧‧齒輪 72‧‧‧ Gears
73‧‧‧螺母 73‧‧‧ nuts
75‧‧‧位置感測器 75‧‧‧ position sensor
100‧‧‧第2合模力產生機構 100‧‧‧2nd clamping force generating mechanism
101‧‧‧合模力施加部 101‧‧ ‧ clamping force application department
110‧‧‧移動抑制部 110‧‧‧Mobile Suppression Department
111‧‧‧卡止孔 111‧‧‧ card hole
112‧‧‧卡止銷 112‧‧‧ card sales
113‧‧‧導引部 113‧‧‧Guide
114‧‧‧驅動裝置 114‧‧‧ drive
δ‧‧‧間隙 Δ‧‧‧ gap
n1‧‧‧螺母 N1‧‧‧ nut
Ba‧‧‧位置調整座 Ba‧‧‧ position adjustment seat
Bb‧‧‧可動座 Bb‧‧‧ movable seat
Fr‧‧‧框架 Fr‧‧ frame
Gd‧‧‧導引件 Gd‧‧‧Guide
Sb‧‧‧滑動座 Sb‧‧‧ sliding seat
Claims (9)
Applications Claiming Priority (1)
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JP2011195720A JP5823218B2 (en) | 2011-09-08 | 2011-09-08 | Injection molding machine |
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TW201318812A true TW201318812A (en) | 2013-05-16 |
TWI602681B TWI602681B (en) | 2017-10-21 |
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TW101129203A TWI602681B (en) | 2011-09-08 | 2012-08-13 | Injection molding machine |
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JP (1) | JP5823218B2 (en) |
KR (1) | KR101327250B1 (en) |
CN (1) | CN102990882B (en) |
TW (1) | TWI602681B (en) |
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JP5989587B2 (en) * | 2013-03-29 | 2016-09-07 | 住友重機械工業株式会社 | Injection molding machine |
JP5800877B2 (en) * | 2013-10-04 | 2015-10-28 | ファナック株式会社 | Adjustable mechanism of movable platen |
CN103692627B (en) * | 2013-12-17 | 2015-09-23 | 浙江大学 | The energy-saving injection machine clamping of magnetic assisted lock mould |
CN105538639B (en) * | 2015-12-26 | 2017-10-10 | 宁波斯曼尔电器有限公司 | A kind of Servo Injection Molding Machine |
KR101721211B1 (en) * | 2016-03-31 | 2017-03-29 | 주식회사 엘지실트론 | Method for analyzing silicon monocrystalline wafer, the wafer manufactured by the method |
CN114274452A (en) * | 2021-12-24 | 2022-04-05 | 东莞市伟峰新材料科技有限公司 | Injection molding device and injection molding method for light-transmitting characters of display card radiator |
CN116852649B (en) * | 2023-07-12 | 2024-06-18 | 深圳市鼎盛精密工业有限公司 | Continuous injection mold of cell-phone shell |
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JP2898093B2 (en) * | 1990-11-30 | 1999-05-31 | 東芝機械株式会社 | Mold clamping device of injection molding machine |
US6010324A (en) * | 1996-01-30 | 2000-01-04 | Toshiba Kikai Kabushiki Kaisha | Mold clamping unit and method of positioning mold in mold clamping unit |
JP3910676B2 (en) * | 1997-02-12 | 2007-04-25 | 住友重機械工業株式会社 | Clamping device |
TWI280911B (en) * | 2004-09-27 | 2007-05-11 | Sumitomo Heavy Industries | Mold clamping device |
JP2008093987A (en) | 2006-10-12 | 2008-04-24 | Sumitomo Heavy Ind Ltd | Mold clamping device |
JP2008162103A (en) * | 2006-12-27 | 2008-07-17 | Toshiba Mach Co Ltd | Mold clamping device and injection molding machine equipped therewith |
JP4965372B2 (en) | 2007-07-27 | 2012-07-04 | 住友重機械工業株式会社 | Clamping device |
JP5179109B2 (en) * | 2007-07-30 | 2013-04-10 | 住友重機械工業株式会社 | Clamping device |
JP4976995B2 (en) | 2007-11-30 | 2012-07-18 | 三菱重工プラスチックテクノロジー株式会社 | Clamping device |
DE112009000674T5 (en) * | 2008-04-04 | 2011-02-10 | Sumitomo Heavy Industries, Ltd. | Form clamping or mold closing device |
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2011
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2012
- 2012-08-13 TW TW101129203A patent/TWI602681B/en not_active IP Right Cessation
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TWI602681B (en) | 2017-10-21 |
JP5823218B2 (en) | 2015-11-25 |
KR101327250B1 (en) | 2013-11-13 |
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