TW201315987A - Device for deformation measurement and method thereof - Google Patents

Device for deformation measurement and method thereof Download PDF

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TW201315987A
TW201315987A TW100137210A TW100137210A TW201315987A TW 201315987 A TW201315987 A TW 201315987A TW 100137210 A TW100137210 A TW 100137210A TW 100137210 A TW100137210 A TW 100137210A TW 201315987 A TW201315987 A TW 201315987A
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light
deformation
light source
module
tested
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TW100137210A
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Jiong-Shiun Hsu
Po-Yu Chen
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Univ Nat Formosa
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Abstract

The present invention discloses a device for deformation measurement and a method thereof. The device comprises a light source module, an image capture module and a processing module. The light source module emits a light source, and the light source is split into an object light and a reference light. The image capture module captures an interference image that is interference by a reflected object light and a reflected reference light. The processing module calculates an optical path difference or a phase that the object light passes through a unit under test. The processing module calculates a deformation angle of the unit under test according to the optical path difference or the phase.

Description

變形量測裝置及其變形量測方法Deformation measuring device and deformation measuring method thereof

本發明是有關於一種變形量測裝置及其變形量測方法,特別是有關於一種得量測透明物體的變形量測裝置及其變形量測方法。
The invention relates to a deformation measuring device and a deformation measuring method thereof, in particular to a deformation measuring device for measuring a transparent object and a deformation measuring method thereof.

目前電子產品大多以便利性、輕薄及耐衝擊性等特點作為設計的目標,因此為製造具有便利性、輕薄且耐衝擊性的產品,便可使用透明高分子基板結構材料來製造相關電子產品。然而,透明高分子基板於製造時,因高溫容易造成變形,因此量測與檢測技術便相對重要。At present, most of electronic products are designed with convenience, lightness, and impact resistance. Therefore, in order to manufacture a product that is convenient, light, and impact-resistant, a transparent polymer substrate structural material can be used to manufacture related electronic products. However, when a transparent polymer substrate is easily deformed due to high temperature at the time of manufacture, measurement and detection techniques are relatively important.

一般而言,光學量測技術具有高精密(High precision)、非接觸(Noncontact)、非破壞(Nondestructive)以及全域性之優點,因此已廣泛地使用於不同領域之檢測與研究。在大部分光學量測技術中,欲量測物體之全域性變形分布,係利用光線照射量測物體,經表面反射後,將帶有物體變形資訊之反射光與參考光產生干涉現象,如中華民國專利公開第I333059號。但是,透明高分子基板結構本身具備高度透明之特性,使一般光學量測方法具有困難性。In general, optical measurement technology has the advantages of high precision, noncontact, nondestructive and global, and has been widely used in different fields of detection and research. In most optical measurement techniques, in order to measure the global deformation distribution of an object, the object is measured by light irradiation, and after reflection by the surface, the reflected light with the deformation information of the object interferes with the reference light, such as Chinese Republic of China Patent Publication No. I333059. However, the transparent polymer substrate structure itself has a highly transparent property, making the general optical measurement method difficult.

因此,2010年美國德州大學奧斯汀分校Xu和Liechti發表一利用雲紋現象量測透明乙烯對苯二甲酸酯(PET)薄膜之變形技術。雖然,此方法可針對透明物體進行量測,但若薄膜改變幾何或負載條件,而造成變形形狀與透鏡形狀不同時,便無法量測。而且,此方法僅能量測整片試片的變形曲率半徑,無法量測薄膜局部的變形。Therefore, in 2010, Xu and Liechti of the University of Texas at Austin published a technique for measuring the deformation of transparent ethylene terephthalate (PET) film by moiré phenomenon. Although this method can measure for transparent objects, if the film changes geometry or load conditions, and the deformed shape is different from the lens shape, it cannot be measured. Moreover, this method only measures the deformation radius of curvature of the test piece of the entire piece of the test piece, and cannot measure the local deformation of the film.

換句話說,雖然許多文獻上已採用上述之方法針對其力學行為進行研究,然而恐因量測技術上所無法突破之瓶頸以致無法獲得更詳實之變形特性。In other words, although many methods have been used to study the mechanical behavior of the above methods, it is feared that the bottleneck cannot be broken by the measurement technology, so that more detailed deformation characteristics cannot be obtained.

因此,為了克服對透明物體變形量測上技術的不足,設計一個變形量測裝置及其變形量測方法,以建立可量測透明物體之全域性及大變形之光學量測方法。Therefore, in order to overcome the shortcomings of the technique of measuring the deformation of transparent objects, a deformation measuring device and a deformation measuring method thereof are designed to establish an optical measuring method capable of measuring the globality and large deformation of the transparent object.

有鑑於上述習知技藝之問題,本發明之目的就是在提供一種變形量測裝置及其變形量測方法,用以量測透明物體之全域性變形。In view of the above-mentioned problems of the prior art, the object of the present invention is to provide a deformation measuring device and a deformation measuring method thereof for measuring the global deformation of a transparent object.

根據本發明之目的,提出一種變形量測裝置,其包含一光源模組、一影像擷取模組以及一處理模組。光源模組發射光源,並光源通過偏振片及空間濾波器以形成擴散光源,且擴散光源通過準直鏡以轉變為平行光,平行光通過分光鏡以取得物光或參考光。影像擷取模組擷取反射物光與反射參考光之干涉影像。處理模組電性連結影像擷取模組,處理模組計算物光通過待測單元之光程差或相位,且根據光程差或相位計算透明物體之變形角度。According to the purpose of the present invention, a deformation measuring device is provided, which comprises a light source module, an image capturing module and a processing module. The light source module emits a light source, and the light source passes through the polarizing plate and the spatial filter to form a diffused light source, and the diffused light source passes through the collimating mirror to convert into parallel light, and the parallel light passes through the beam splitter to obtain the object light or the reference light. The image capturing module captures an interference image between the reflected light and the reflected reference light. The processing module is electrically connected to the image capturing module, and the processing module calculates the optical path difference or phase of the object light passing through the unit to be tested, and calculates the deformation angle of the transparent object according to the optical path difference or phase.

其中,物光係通過待測單元,並被第一反射鏡反射以形成反射物光。Wherein, the object light passes through the unit to be tested and is reflected by the first mirror to form reflector light.

其中,參考光係通過空氣,並被第二反射鏡反射以形成反射參考光。Wherein, the reference light system passes through the air and is reflected by the second mirror to form a reflected reference light.

其中,干涉影像係反射物光及反射參考光於影像擷取模組產生干涉,以取得包含干涉條紋的干涉影像。The interference image is reflected by the reflected light and the reflected reference light in the image capturing module to obtain an interference image including interference fringes.

其中,干涉條紋係為待測單元變形角度之等高線分布,處理模組根據物體變形角度計算全域性變形分布,並滿足下列關係式:
Wi+1=Wii+1△Xi+1
其中,Wi+1為第i+1像素的面外位移,Wi為第i像素的面外位移,θi+1為第i+1像素的變形角度,△Xi+1為第i+1像素與第i像素之距離。
The interference fringe is the contour distribution of the deformation angle of the unit to be tested, and the processing module calculates the global deformation distribution according to the deformation angle of the object, and satisfies the following relationship:
W i+1 =W ii+1 △X i+1 ,
Where W i+1 is the out-of-plane displacement of the i+1th pixel, Wi is the out-of-plane displacement of the ith pixel, θ i+1 is the deformation angle of the i+1th pixel, and ΔX i+1 is the i+th The distance between 1 pixel and the ith pixel.

其中,更包含一顯示模組,電性連結處理模組,係用以顯示干涉影像、全域性變形分布。The utility model further comprises a display module and an electrical connection processing module, which is used for displaying interference images and global deformation distribution.

根據本發明之目的,再提出一種變形量測方法,係適用於一變形量測裝置,其包含下列步驟:開啟光源模組以發射光源;利用光源通過偏振片、空間濾波器、準直鏡及分光鏡以取得物光或參考光;開啟影像擷取模組擷取反射物光與反射參考光之干涉影像;透過處理模組計算物光通過待測單元之光程差及相位;利用處理模組根據光程差或相位計算待測單元之變形角度。According to the object of the present invention, a deformation measuring method is further applied to a deformation measuring device, which comprises the steps of: turning on a light source module to emit a light source; using a light source through a polarizing plate, a spatial filter, a collimating mirror, and The beam splitter is used to obtain the object light or the reference light; the image capturing module is opened to capture the interference image of the reflected object light and the reflected reference light; and the processing module calculates the optical path difference and phase of the object light passing through the unit to be tested; The group calculates the deformation angle of the unit to be tested based on the optical path difference or phase.

其中,此方法更提供物光通過待測單元;以及利用第一反射鏡反射物光,以形成反射物光。Wherein, the method further provides the object light passing through the unit to be tested; and reflects the object light with the first mirror to form the reflector light.

其中,此方法更提供參考光通過空氣;以及利用第二反射鏡反射參考光,以形成反射參考光。Wherein, the method further provides reference light to pass through the air; and the second mirror reflects the reference light to form the reflected reference light.

其中,此方法更提供反射物光及反射參考光於影像擷取模組產生干涉;以及開啟影像擷取模組擷取包含干涉條紋的干涉影像。The method further provides that the reflector light and the reflected reference light interfere with the image capturing module; and the image capturing module is opened to capture the interference image including the interference fringes.

其中,此方法之干涉條紋係為待測單元變形角度之等高線分布,利用處理模組根據變形角度計算全域性分布。The interference fringe of the method is a contour distribution of the deformation angle of the unit to be tested, and the processing module is used to calculate the global distribution according to the deformation angle.

其中,此方法更提供一顯示模組顯示干涉影像、全域性變形分布。The method further provides a display module to display an interference image and a global deformation distribution.

綜上所述,本發明之變形量測裝置及其變形量測方法,可克服習知透明物體量測上技術的不足,建立可量測透明物體全域性及大變形之光學量測方法。In summary, the deformation measuring device and the deformation measuring method thereof of the present invention can overcome the deficiencies of the conventional techniques for measuring transparent objects, and establish an optical measuring method capable of measuring the globality and large deformation of a transparent object.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;

以下將參照相關圖式,說明依本發明之變形量測裝置及其變形量測方法之實施例,為使便於理解,下述實施例中之相同元件係以相同之符號標示來說明。The embodiments of the deformation measuring device and the deformation measuring method thereof according to the present invention will be described below with reference to the related drawings. For the sake of understanding, the same components in the following embodiments are denoted by the same reference numerals.

第1圖為本發明之變形量測裝置之示意圖,如圖所示,本發明之變形量測裝置其包含一光源模組11、一影像擷取模組16、一處理模組18以及一顯示模組19。值得注意的是,本發明之變形量測裝置所量測的待測單元1較佳可為透明物體,例如:透明基板、可撓性光學透明基板或可撓性光學透明薄膜基板。同時,待測單元1可設置於承載機構2上,藉由承載機構2控制外力的大小,或者待測單元1可具有殘留變形,不需再以外力加壓。進一步地,光源模組11可發射光源,其光源可為氦氖雷射光(He-Ne Laser)、二氧化碳雷射、紫外線雷射或可見光雷射等,較佳可為氦氖雷射光。影像擷取模組16可包含感光元件如互補式金氧半導體元件(Complementary Metal-Oxide-Semiconductor,CMOS)、電荷耦合元件(Charge-Coupled-Device ,CCD)或鏡頭以及鏡組等。1 is a schematic diagram of a deformation measuring device of the present invention. As shown in the figure, the deformation measuring device of the present invention comprises a light source module 11, an image capturing module 16, a processing module 18, and a display. Module 19. It should be noted that the unit to be tested 1 measured by the deformation measuring device of the present invention may preferably be a transparent object, such as a transparent substrate, a flexible optical transparent substrate or a flexible optical transparent film substrate. At the same time, the unit to be tested 1 can be disposed on the carrying mechanism 2, and the size of the external force is controlled by the carrying mechanism 2, or the unit to be tested 1 can have residual deformation, and no external force is required. Further, the light source module 11 can emit a light source, and the light source can be He-Ne Laser, carbon dioxide laser, ultraviolet laser or visible light laser, etc., preferably 氦氖 laser light. The image capturing module 16 may include a photosensitive element such as a Complementary Metal-Oxide-Semiconductor (CMOS), a Charge-Coupled-Device (CCD) or a lens, a lens group, and the like.

本發明之變形量測裝置之光源模組11可發射光源,光源可通過偏振片12及空間濾波器13,將光源擴束且濾波以形成擴散光源,且其偏振片12具有可方便調整光強度之功效。利用準直鏡14將擴散光源轉變為平行光,平形光通過分光鏡15,可將平行光分為物光及參考光。參考光可於空氣中行進,而物光則可通過待測單元1。藉由第一反射鏡171反射可通過待測單元1且帶有變形訊息的物光,以形成反射物光,並藉由第二反射鏡172反射通過空氣的參考光,以形成反射參考光。反射光與反射參考光通過分光鏡15。藉由分光鏡15對反射物光及反射參考光進行干涉,並利用影像擷取模組16擷取具有干涉條紋的干涉影像。The light source module 11 of the deformation measuring device of the present invention can emit a light source. The light source can pass through the polarizing plate 12 and the spatial filter 13, expand and filter the light source to form a diffused light source, and the polarizing plate 12 has a light intensity adjustable. The effect. The diffusing light source is converted into parallel light by the collimating mirror 14, and the flat light passes through the beam splitter 15, and the parallel light can be divided into object light and reference light. The reference light can travel in the air, and the object light can pass through the unit to be tested 1. The object light passing through the unit to be tested 1 and having the deformation information is reflected by the first mirror 171 to form the reflector light, and the reference light passing through the air is reflected by the second mirror 172 to form the reflected reference light. The reflected light and the reflected reference light pass through the beam splitter 15. The spectroscope 15 interferes with the reflected light and the reflected reference light, and the image capturing module 16 captures the interference image with the interference fringes.

承上所述,干涉條紋是待測單元1變形角度的等高線分布,利用處理模組18可計算物光通過待測單元1時光行走的光程差或相位。進一步地,第二反射鏡172反射通過空氣的參考光,於第二反射透鏡上產生位移,根據位移可計算干涉條紋相位。利用干涉條紋相位計算物光進入待測單元1的入射角,且其物光入射的光線為平行的光,使入射角可等於待測單元1彎曲變形的變形角度。As described above, the interference fringe is a contour distribution of the deformation angle of the unit 1 to be tested, and the processing module 18 can be used to calculate the optical path difference or phase of the light traveling through the unit to be tested 1 . Further, the second mirror 172 reflects the reference light passing through the air, generates a displacement on the second reflective lens, and calculates the interference fringe phase according to the displacement. The interference fringe phase is used to calculate the incident angle of the object light entering the unit to be tested 1, and the light incident on the object light is parallel light, so that the incident angle can be equal to the deformation angle of the bending deformation of the unit 1 to be tested.

另外,顯示模組19可為液晶顯示器(Liquid Crystal Display,LCD)或觸控式液晶螢幕,並可顯示干涉影像、或全域性變形分布。In addition, the display module 19 can be a liquid crystal display (LCD) or a touch liquid crystal screen, and can display an interference image or a global deformation distribution.

所以,本發明之變形量測裝置可針對透明物體計算全域性變形分布,並同時具有可即時(Real time)量測及可量測大面積下的變形分布等功效。同時,上述之光源模組11、偏振片12、空間濾波器13、準直鏡14、分光鏡15、影像擷取模組16、第一反射鏡171、處理模組18或顯示模組19可設置並固定於光學平台3上,增加量測時的準確性。Therefore, the deformation measuring device of the present invention can calculate the global deformation distribution for the transparent object, and at the same time has the functions of real time measurement and measurable deformation distribution under a large area. The light source module 11 , the polarizing plate 12 , the spatial filter 13 , the collimating mirror 14 , the beam splitting mirror 15 , the image capturing module 16 , the first reflecting mirror 171 , the processing module 18 , or the display module 19 can be used. It is set and fixed on the optical table 3 to increase the accuracy in measurement.

順帶一提的是,在本發明所屬領域中具有通常知識者應當明瞭,於前面敘述方式之光源模組11、偏振片12、空間濾波器13、準直鏡14、分光鏡15、影像擷取模組16、第一反射鏡171或第二反射鏡172所設置位置之實施態樣僅為舉例而非限制;另外,熟悉此項技藝者當可任意結合上述之功能模組或光學元件組成一整合式模組,或分拆成各個功能細部單元,端看設計上的方便而定。Incidentally, those having ordinary knowledge in the field to which the present invention pertains should be aware of the light source module 11, the polarizing plate 12, the spatial filter 13, the collimating mirror 14, the beam splitter 15, and the image capturing method described above. The implementation of the position of the module 16, the first mirror 171 or the second mirror 172 is merely an example and not a limitation; in addition, those skilled in the art can arbitrarily combine the above functional modules or optical components. The integrated module, or split into individual functional detail units, depends on the convenience of the design.

第2圖至第4圖為本發明之變形量測裝置之第一實施例之第一、第二及第三示意圖。待測單元較佳可為透明物體,例如:透明基板、可撓性光學透明基板或可撓性光學透明薄膜基板,為便於更暸解本發明之技術特徵,底下是以光學透明基板為實施例,但並不以此為限。請參閱第2圖,其係為光通過空氣及不受外力的光學透明基板的行進路線,如圖所示,光行經光學透明基板所產生之相位為:

其中,為光行經光學透明基板所產生之相位,為光學透明基板之厚度,為光之波長,n1為空氣的折射率,n2為光學透明基板的折射率。
2 to 4 are first, second and third schematic views of the first embodiment of the deformation measuring device of the present invention. The unit to be tested is preferably a transparent object, such as a transparent substrate, a flexible optically transparent substrate or a flexible optically transparent film substrate. To facilitate a better understanding of the technical features of the present invention, an optically transparent substrate is used as an embodiment. But it is not limited to this. Please refer to FIG. 2, which is a traveling route of light passing through the air and an optical transparent substrate free from external force. As shown in the figure, the phase of the light traveling through the optical transparent substrate is:
;
Wherein, the phase generated by the optical path through the optically transparent substrate is the thickness of the optically transparent substrate, the wavelength of light, n 1 is the refractive index of air, and n 2 is the refractive index of the optically transparent substrate.

當物光進入光學透明基板時,物光所行經過之光程距離可滿足下列關係式:

其中,d為光於透明基板中所行走之距離,t為光學透明基板之厚度,θ2為折射角(圖中未繪示)。
When the object light enters the optically transparent substrate, the optical path distance through which the object light passes can satisfy the following relationship:
;
Where d is the distance traveled by the light in the transparent substrate, t is the thickness of the optically transparent substrate, and θ 2 is the angle of refraction (not shown).

接著,可進一步參閱第3圖及第4圖,當光學透明基板設置於承載機構上,並受到負載力而使光學透明基板彎曲變形時,光線通過光學透明基板的光線行進路線如第3圖及第4圖所示。進一步地,請一併參閱第1圖,當光源模組11射出光源時,經過偏振片12及空間濾波器13,將點光源擴束並濾波,以形成擴散光源,且其偏振片12具有可方便調整光強度之功效。擴散光源再通過準直鏡14,將擴散光源轉變為平行光,而後通過分光鏡15使平行光分為兩道光。其中一道光為參考光於空氣中行進,另一道光通過具有負載而變形的光學透明基板,其為物光。兩道光經由第一反射鏡171或第二反射鏡172的反射回到分光鏡15,且於影像擷取模組16產生干涉,以影像擷取模組16擷取反射物光與反射參考光的干涉影像。由於物光可通過光學透明基板兩次,故可滿足下列關係式:

其中,θ1為入射角,為光行經光學透明基板所產生之相位,為光學透明基板之厚度,為光之波長,n2為光學透明基板的折射率。
Next, referring to FIG. 3 and FIG. 4 , when the optically transparent substrate is disposed on the supporting mechanism and subjected to the load force to bend and deform the optically transparent substrate, the light traveling path of the light passing through the optical transparent substrate is as shown in FIG. 3 and Figure 4 shows. Further, please refer to FIG. 1 together, when the light source module 11 emits the light source, the polarizing plate 12 and the spatial filter 13 are used to expand and filter the point light source to form a diffused light source, and the polarizing plate 12 has Convenient to adjust the light intensity. The diffused light source is then passed through a collimating mirror 14, which converts the diffused light source into parallel light, and then passes through the beam splitter 15 to split the parallel light into two lights. One of the light travels in the air as a reference light, and the other light passes through an optically transparent substrate that is deformed by a load, which is a matter light. The two lights are reflected back to the beam splitter 15 via the first mirror 171 or the second mirror 172, and the image capturing module 16 generates interference, and the image capturing module 16 extracts the reflected light and the reflected reference light. Interfere with the image. Since the object light can pass through the optically transparent substrate twice, the following relationship can be satisfied:
;
Where θ 1 is the incident angle, which is the phase generated by the light passing through the optically transparent substrate, is the thickness of the optically transparent substrate, is the wavelength of light, and n 2 is the refractive index of the optically transparent substrate.

接著,處理模組18可獲得干涉條紋之光強,並可滿足下列關係式:

其中,φ為相位,I1為干涉條紋之光強,Io為物光之光強,Ir為參考光之光強。
Then, the processing module 18 can obtain the intensity of the interference fringes and can satisfy the following relationship:
;
Where φ is the phase, I 1 is the intensity of the interference fringes, I o is the light intensity of the object light, and Ir is the light intensity of the reference light.

值得一提的是,可利用壓電陶瓷材料(PZT)使參考光於第二反射鏡172產生位移,並可改變相位,當相位改變為π/2、π、3π/2時,光強可滿足下列關係式:



其中,φ為相位,I2為相位為π/2之干涉條紋的光強,I3為相位為π之干涉條紋的光強,I4為相位為3π/2之干涉條紋的光強,Io為物光之光強,Ir為參考光之光強。
It is worth mentioning that the piezoelectric ceramic material (PZT) can be used to shift the reference light to the second mirror 172, and the phase can be changed. When the phase is changed to π/2, π, 3π/2, the light intensity can be changed. Meet the following relationship:
;
;
;
Where φ is the phase, I 2 is the intensity of the interference fringe with a phase of π/2, I 3 is the intensity of the interference fringe with a phase of π, and I 4 is the intensity of the interference fringe with a phase of 3π/2, I o is the light intensity of the object light, and Ir is the light intensity of the reference light.

所以,處理模組18可根據相位改變後的光強求得干涉條紋的相位,並可滿足下列關係式:

其中,φ為相位,I1為干涉條紋之光強,I2為相位為π/2之干涉條紋的光強,I3為相位為π之干涉條紋的光強,I4為相位為3π/2之干涉條紋的光強。
Therefore, the processing module 18 can obtain the phase of the interference fringe according to the light intensity after the phase change, and can satisfy the following relationship:
;
Where φ is the phase, I 1 is the intensity of the interference fringe, I 2 is the intensity of the interference fringe with a phase of π/2, I 3 is the intensity of the interference fringe with a phase π, and I 4 is the phase of 3π/ 2 The intensity of the interference fringes.

由上可知,本發明所獲得干涉條紋所代表之意義係為透明物體變形角度之等高線,透過上述之計算便可獲得透明物體之全域性變形角度分布,此外,處理模組18更可根據變形角度計算全域性變形分布,並滿足下列關係式:
Wi+1=Wii+1△Xi+1
其中,Wi+1為第i+1像素的面外位移,Wi為第i像素的面外位移,θi+1為第i+1像素的變形角度,△Xi+1為第i+1像素與第i像素之距離。
It can be seen from the above that the meaning of the interference fringes obtained by the present invention is the contour line of the deformation angle of the transparent object, and the global deformation angle distribution of the transparent object can be obtained through the above calculation, and the processing module 18 can be further determined according to the deformation angle. Calculate the global deformation distribution and satisfy the following relationships:
W i+1 =W ii+1 △X i+1 ,
Where W i+1 is the out-of-plane displacement of the i+1th pixel, Wi is the out-of-plane displacement of the ith pixel, θ i+1 is the deformation angle of the i+1th pixel, and ΔX i+1 is the i+th The distance between 1 pixel and the ith pixel.

儘管前述在說明本發明之變形量測裝置的過程中,亦已同時說明本發明之變形量測方法的概念,但為求清楚起見,以下仍另繪示流程圖詳細說明。Although the foregoing description of the deformation measuring method of the present invention has been described in the course of explaining the deformation measuring apparatus of the present invention, for the sake of clarity, the detailed description of the flowchart will be further described below.

請參閱第5圖,其係為本發明之變形量測方法之流程圖,如圖所示,本發明之變形量測方法,其適用於一變形量測裝置,該變形量測裝置包含一光源模組、一影像擷取模組、一處理模組及一顯示模組。變形量測裝置之變形量測方法包含下列步驟:Please refer to FIG. 5 , which is a flowchart of a deformation measuring method according to the present invention. As shown in the figure, the deformation measuring method of the present invention is applicable to a deformation measuring device, and the deformation measuring device comprises a light source. The module, an image capture module, a processing module and a display module. The deformation measurement method of the deformation measuring device comprises the following steps:

在步驟S101中,開啟光源模組以發射光源。In step S101, the light source module is turned on to emit the light source.

在步驟S102中,利用該光源通過偏振片、空間濾波器、準直鏡及分光鏡以取得物光或參考光。In step S102, the light source is passed through a polarizing plate, a spatial filter, a collimating mirror, and a beam splitter to obtain object light or reference light.

在步驟S103中,藉由第一反射鏡或第二反射鏡反射物光或參考光,以形成反射物光或反射參考光。In step S103, the object light or the reference light is reflected by the first mirror or the second mirror to form the reflector light or the reflected reference light.

在步驟S104中,開啟影像擷取模組擷取反射物光與反射參考光之干涉影像。In step S104, the image capturing module is turned on to capture an interference image between the reflected light and the reflected reference light.

在步驟S105中,透過處理模組計算物光通過待測單元的光程差及相位。In step S105, the optical path difference and phase of the object light passing through the unit to be tested are calculated by the processing module.

在步驟S106中,利用處理模組根據物光之光強及參考光之光強,計算複數條干涉條紋之光強。In step S106, the processing module calculates the light intensity of the plurality of interference fringes according to the light intensity of the object light and the light intensity of the reference light.

在步驟S107中,藉由處理模組根據參考光於第二反射鏡之位移計算干涉條紋相位。In step S107, the interference fringe phase is calculated by the processing module according to the displacement of the reference light on the second mirror.

在步驟S108中,透過處理模組根據干涉條紋相位計算入射角或變形角度。In step S108, the transmission processing module calculates an incident angle or a deformation angle according to the interference fringe phase.

在步驟S109中,利用處理模組根據變形角度計算全域性變形分布。In step S109, the processing module is used to calculate the global deformation distribution according to the deformation angle.

在步驟S110中,使用顯示模組顯示干涉影像、全域性變形分布。In step S110, the interference image and the global deformation distribution are displayed using the display module.

本發明之變形量測裝置的變形量測方法的詳細說明以及實施方式已於前面敘述本發明之變形量測裝置時描述過,在此為了簡略說明便不再敘述。The detailed description and the embodiment of the deformation measuring method of the deformation measuring device of the present invention have been described in the foregoing description of the deformation measuring device of the present invention, and will not be described here for the sake of brevity.

綜上所述,因依本發明之變形量測裝置及其變形量測方法,其可具有一或多個下述優點:In summary, the deformation measuring device and the deformation measuring method thereof according to the present invention may have one or more of the following advantages:

(1)此發明之變形量測裝置及其變形量測方法可克服習知透明基板結構量測上技術的不足,建立可量測透明基板結構之全域性及大變形之光學量測方法。(1) The deformation measuring device and the deformation measuring method thereof of the invention can overcome the deficiencies of the conventional transparent substrate structure measuring technology, and establish an optical measuring method capable of measuring the globality and large deformation of the transparent substrate structure.

(2)此發明之變形量測裝置及其變形量測方法可應用於量測透明基板結構因製造時所產生變形以及殘留應力。(2) The deformation measuring device and the deformation measuring method thereof of the present invention can be applied to measuring deformation and residual stress generated in a transparent substrate structure due to manufacture.

以上所述僅為舉例性,而非為限制性者。任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The above is intended to be illustrative only and not limiting. Any person skilled in the art will be able to make some modifications and refinements without departing from the spirit and scope of the invention, and the scope of the invention is defined by the scope of the appended claims.

1...待測單元1. . . Unit to be tested

2...承載機構2. . . Carrying mechanism

3...光學平台3. . . Optical platform

11...光源模組11. . . Light source module

12...偏振片12. . . Polarizer

13...空間濾波器13. . . Spatial filter

14...準直鏡14. . . Collimating mirror

15...分光鏡15. . . Beam splitter

16...影像擷取模組16. . . Image capture module

171...第一反射鏡171. . . First mirror

172...第二反射鏡172. . . Second mirror

18...處理模組18. . . Processing module

19...顯示模組19. . . Display module

S101~S110...步驟流程S101~S110. . . Step flow

θ1...入射角θ 1 . . . Incident angle

θ2...折射角θ 2 . . . Refraction angle

n1...空氣的折射率n 1 . . . Air refractive index

n2...光學透明基板之折射率n 2 . . . Refractive index of optically transparent substrate

d...光於透明物體所行走之距離d. . . The distance traveled by a transparent object

t...光學透明基板之厚度t. . . Thickness of optically transparent substrate

△...光程差△. . . Optical path difference

φ...相位Φ. . . Phase

I1...干涉條紋之光強I 1 . . . Light intensity of interference fringes

I2...相位為π/2之干涉條紋的光強I 2 . . . Light intensity of interference fringes with phase π/2

I3...相位為π之干涉條紋的光強I 3 . . . Light intensity of interference fringes with phase π

I4...相位為3π/2之干涉條紋的光強I 4 . . . Light intensity of interference fringes with a phase of 3π/2

Io...物光之光強I o . . . Light of matter

Ir...參考光之光強I r . . . Reference light intensity

以及as well as

λ...光源之波長λ. . . Wavelength of the light source

第1圖 係為本發明之變形量測裝置之示意圖;
第2圖 係為本發明之變形量測裝置之第一實施例之第一示意圖;
第3圖 係為本發明之變形量測裝置之第一實施例之第二示意圖;
第4圖 係為本發明之變形量測裝置之第一實施例之第三示意圖;以及
第5圖 係為本發明之變形量測方法之流程圖。

Figure 1 is a schematic view of a deformation measuring device of the present invention;
2 is a first schematic view of a first embodiment of a deformation measuring device of the present invention;
Figure 3 is a second schematic view of the first embodiment of the deformation measuring device of the present invention;
4 is a third schematic view of the first embodiment of the deformation measuring device of the present invention; and FIG. 5 is a flow chart of the deformation measuring method of the present invention.

1...待測單元1. . . Unit to be tested

2...承載機構2. . . Carrying mechanism

3...光學平台3. . . Optical platform

11...光源模組11. . . Light source module

12...偏振片12. . . Polarizer

13...空間濾波器13. . . Spatial filter

14...準直鏡14. . . Collimating mirror

15...分光鏡15. . . Beam splitter

16...影像擷取模組16. . . Image capture module

171...第一反射鏡171. . . First mirror

172...第二反射鏡172. . . Second mirror

18...處理模組18. . . Processing module

以及as well as

19...顯示模組19. . . Display module

Claims (12)

一種變形量測裝置,其包含:
一光源模組,係發射一光源,並該光源通過一偏振片及一空間濾波器以形成一擴散光源,且該擴散光源通過一準直鏡以轉變為一平行光,該平形光通過一分光鏡以取得一物光或一參考光;
一影像擷取模組,係擷取一反射物光與一反射參考光之一干涉影像;以及
一處理模組,電性連結該影像擷取模組,該處理模組係計算該物光通過一待測單元之一光程差或一相位,且根據該光程差或該相位計算該待測單元之一變形角度。
A deformation measuring device comprising:
a light source module emits a light source, and the light source passes through a polarizing plate and a spatial filter to form a diffused light source, and the diffused light source is converted into a parallel light by a collimating mirror, and the flat light passes through a splitting light Mirror to obtain a light or a reference light;
An image capturing module is configured to capture an interference image between a reflective object and a reflective reference light; and a processing module electrically coupled to the image capturing module, wherein the processing module calculates the light passing through the image An optical path difference or a phase of one of the units to be tested, and calculating a deformation angle of the unit to be tested according to the optical path difference or the phase.
如申請專利範圍第1項所述之變形量測裝置,其中該物光係通過該待測單元,並被一第一反射鏡反射以形成該反射物光。
The deformation measuring device according to claim 1, wherein the object light passes through the unit to be tested and is reflected by a first mirror to form the reflector light.
如申請專利範圍第1項所述之變形量測裝置,其中該參考光係通過空氣,並被一第二反射鏡反射以形成該反射參考光。
The deformation measuring device of claim 1, wherein the reference light passes through the air and is reflected by a second mirror to form the reflected reference light.
如申請專利範圍第1項所述之變形量測裝置,其中該干涉影像係該反射物光及該反射參考光於該影像擷取模組產生干涉,以取得包含一干涉條紋的該干涉影像。
The deformation measuring device according to claim 1, wherein the interference image is caused by the reflection of the reflector light and the reflection reference light to obtain an interference image including an interference fringe.
如申請專利範圍第1項所述之變形量測裝置,其中該干涉條紋係為該待測單元之該變形角度之等高線分布,該處理模組根據該變形角度計算一全域性變形分布,並滿足下列關係式:
Wi+1=Wii+1△Xi+1
其中,Wi+1為第i+1像素的面外位移,Wi為第i像素的面外位移,θi+1為第i+1像素的變形角度,△Xi+1為第i+1像素與第i像素之距離。
The deformation measuring device according to claim 1, wherein the interference fringe is a contour distribution of the deformation angle of the unit to be tested, and the processing module calculates a global deformation distribution according to the deformation angle, and satisfies The following relationship:
W i+1 =W ii+1 △X i+1 ,
Where W i+1 is the out-of-plane displacement of the i+1th pixel, Wi is the out-of-plane displacement of the ith pixel, θ i+1 is the deformation angle of the i+1th pixel, and ΔX i+1 is the i+th The distance between 1 pixel and the ith pixel.
如申請專利範圍第5項所述之變形量測裝置,更包含一顯示模組,電性連結該處理模組,係用以顯示該干涉影像或該全域性變形分布。
The deformation measuring device according to claim 5, further comprising a display module electrically connected to the processing module for displaying the interference image or the global deformation distribution.
一種變形量測方法,係適用於一變形量測裝置,該變形量測方法包含下列步驟:
開啟一光源模組以發射一光源;
利用該光源通過一偏振片、一空間濾波器、一準直鏡及一分光鏡以取得一物光或一參考光;
開啟一影像擷取模組擷取一反射物光與一反射參考光之一干涉影像;
透過一處理模組計算該物光通過一待測單元之一光程差及一相位;以及
利用該處理模組根據該光程差或該相位計算該待測單元之一變形角度。
A deformation measuring method is applicable to a deformation measuring device, and the deformation measuring method comprises the following steps:
Opening a light source module to emit a light source;
Using the light source, a polarizing plate, a spatial filter, a collimating mirror and a beam splitter to obtain a light or a reference light;
Opening an image capturing module to capture an interference image between a reflector light and a reflected reference light;
Calculating, by a processing module, an optical path difference and a phase of the object passing through a unit to be tested; and calculating, by the processing module, a deformation angle of the unit to be tested according to the optical path difference or the phase.
如申請專利範圍第7項所述之變形量測方法,更包含下列步驟:
提供該物光通過該待測單元;以及
利用一第一反射鏡反射該物光,以形成該反射物光。
The deformation measurement method described in claim 7 of the patent application further includes the following steps:
Providing the object light through the unit to be tested; and reflecting the object light with a first mirror to form the reflector light.
如申請專利範圍第7項所述之變形量測方法,更包含下列步驟:
提供該參考光通過空氣;以及
利用一第二反射鏡反射該參考光,以形成該反射參考光。
The deformation measurement method described in claim 7 of the patent application further includes the following steps:
Providing the reference light through the air; and reflecting the reference light with a second mirror to form the reflected reference light.
如申請專利範圍第7項所述之變形量測方法,更包含下列步驟:
提供該反射物光及該反射參考光於該影像擷取模組產生干涉;以及
開啟該影像擷取模組擷取包含一干涉條紋的該干涉影像。
The deformation measurement method described in claim 7 of the patent application further includes the following steps:
Providing the reflector light and the reflected reference light to interfere with the image capturing module; and opening the image capturing module to capture the interference image including an interference fringe.
如申請專利範圍第7項所述之變形量測方法,其中該干涉條紋係為該待測單元之該變形角度之等高線分布,利用該處理模組根據該變形角度計算一全域性變形分布。
The deformation measurement method according to claim 7, wherein the interference fringe is a contour distribution of the deformation angle of the unit to be tested, and the processing module calculates a global deformation distribution according to the deformation angle.
如申請專利範圍第11項所述之變形量測方法,更包含下列步驟:
提供一顯示模組顯示該干涉影像或該全域性變形分布。
For example, the deformation measurement method described in claim 11 further includes the following steps:
A display module is provided to display the interference image or the global deformation distribution.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112964200A (en) * 2021-02-02 2021-06-15 西安工业大学 Method for quickly measuring included angle of transparent flat plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112964200A (en) * 2021-02-02 2021-06-15 西安工业大学 Method for quickly measuring included angle of transparent flat plate

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