TW201309178A - Cooling system for electronic device - Google Patents
Cooling system for electronic device Download PDFInfo
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- TW201309178A TW201309178A TW100127283A TW100127283A TW201309178A TW 201309178 A TW201309178 A TW 201309178A TW 100127283 A TW100127283 A TW 100127283A TW 100127283 A TW100127283 A TW 100127283A TW 201309178 A TW201309178 A TW 201309178A
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- heat exchanger
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明涉及一種電子設備的冷卻系統。The present invention relates to a cooling system for an electronic device.
目前隨著數據中心的發展趨向靈活化，數據中心的散熱設計方式也日趨靈活化，數據中心往往需要相當大的電力去冷卻發熱源。常見的散熱方式是在數據中心內部設置空調，雖然空調可以提供較低的冷氣給數據中心進行散熱，但空調不利於節能減排。At present, as the development of data centers tends to be flexible, the heat dissipation design of data centers is becoming more flexible. Data centers often require considerable power to cool the heat sources. The common way to dissipate heat is to set up an air conditioner inside the data center. Although the air conditioner can provide lower air-conditioning to heat the data center, the air conditioner is not conducive to energy saving and emission reduction.
鑒於以上內容，有必要提供一種能有效節能的電子設備的冷卻系統。In view of the above, it is necessary to provide a cooling system for an electronic device that can effectively save energy.
一種電子設備的冷卻系統，包括一第一熱交換器、一第二熱交換器、一第三熱交換器、一第一冷媒管、一循環泵及一第二冷媒管，第一冷媒管及第二冷媒管內設有可流經第一熱交換器及第二熱交換器的冷媒，第一熱交換器設置於電子設備內以吸收電子設備產生的熱量，液化氣體經過第三熱交換器預熱後流經第二熱交換器以吸收流經第二熱交換器的冷媒的熱量而冷卻冷媒，該循環泵為冷媒的傳輸提供動力。A cooling system for an electronic device includes a first heat exchanger, a second heat exchanger, a third heat exchanger, a first refrigerant tube, a circulation pump and a second refrigerant tube, and a first refrigerant tube and The second refrigerant pipe is provided with a refrigerant that can flow through the first heat exchanger and the second heat exchanger. The first heat exchanger is disposed in the electronic device to absorb heat generated by the electronic device, and the liquefied gas passes through the third heat exchanger. After preheating, it flows through the second heat exchanger to absorb the heat of the refrigerant flowing through the second heat exchanger to cool the refrigerant, and the circulation pump provides power for the transmission of the refrigerant.
本發明電子設備的冷卻系統藉由流經第一熱交換器的冷媒吸收電子設備產生的熱量，第三熱交換器將液化氣體預熱後傳輸到第二熱交換器，第二熱交換器利用液化氣體吸收流經第二熱交換器的冷媒的熱量以冷卻該冷媒，如此，在氣化液化氣體的同時冷卻電子設備，符合當今社會節能減排的需求。The cooling system of the electronic device of the present invention absorbs heat generated by the electronic device by the refrigerant flowing through the first heat exchanger, and the third heat exchanger preheats the liquefied gas and transmits it to the second heat exchanger, and the second heat exchanger utilizes The liquefied gas absorbs the heat of the refrigerant flowing through the second heat exchanger to cool the refrigerant, so that the electronic equipment is cooled while vaporizing the liquefied gas, which meets the demand for energy saving and emission reduction in today's society.
請參閱圖1，本發明電子設備10的冷卻系統的較佳實施方式包括一第一熱交換器20、一第一冷媒管30、一循環泵31、一第二冷媒管40、一第二熱交換器50以及一第三熱交換器60。第一熱交換器20、第一冷媒管30、循環泵31、第二冷媒管40及第二熱交換器50依次相連以形成一循環系統。第一冷媒管30及第二冷媒管40內設有可流經第一熱交換器20及第二熱交換器50的冷媒。Referring to FIG. 1 , a preferred embodiment of the cooling system of the electronic device 10 of the present invention includes a first heat exchanger 20 , a first refrigerant pipe 30 , a circulation pump 31 , a second refrigerant pipe 40 , and a second heat . The exchanger 50 and a third heat exchanger 60. The first heat exchanger 20, the first refrigerant pipe 30, the circulation pump 31, the second refrigerant pipe 40, and the second heat exchanger 50 are sequentially connected to form a circulation system. The first refrigerant pipe 30 and the second refrigerant pipe 40 are provided with a refrigerant that can flow through the first heat exchanger 20 and the second heat exchanger 50.
電子設備10可為貨櫃型數據中心（container data center, 簡稱CDC）、大型的機櫃或其他大型的發熱器件，其在工作過程中會產生持續的、大量的熱量。本發明實施方式中，電子設備10為貨櫃型數據中心。The electronic device 10 can be a container data center (CDC), a large cabinet or other large heat generating device, which generates a continuous, large amount of heat during operation. In an embodiment of the invention, the electronic device 10 is a container type data center.
第一熱交換器20置於電子設備10內用來吸收電子設備10產生的熱量。The first heat exchanger 20 is placed within the electronic device 10 for absorbing heat generated by the electronic device 10.
第二熱交換器50利用液化氣體51氣化吸熱以吸收流經第二熱交換器50的冷媒的熱量以冷卻該冷媒。本實施方式中，該液化氣體51先流經第三熱交換器60經海水預熱後流經第二熱交換器50。The second heat exchanger 50 vaporizes heat by the liquefied gas 51 to absorb heat of the refrigerant flowing through the second heat exchanger 50 to cool the refrigerant. In the present embodiment, the liquefied gas 51 first flows through the third heat exchanger 60 and is preheated by seawater and then flows through the second heat exchanger 50.
第一冷媒管30置於第一熱交換器20與第二熱交換器50之間用於將經第二熱交換器50冷卻後的冷媒傳輸到第一熱交換器20。The first refrigerant pipe 30 is disposed between the first heat exchanger 20 and the second heat exchanger 50 for transferring the refrigerant cooled by the second heat exchanger 50 to the first heat exchanger 20.
第二冷媒管40置於第一熱交換器20與第二熱交換器50之間用於將吸收第一熱交換器20的熱量的冷媒傳輸到第二熱交換器50進行冷卻。The second refrigerant pipe 40 is disposed between the first heat exchanger 20 and the second heat exchanger 50 for transferring the refrigerant that absorbs the heat of the first heat exchanger 20 to the second heat exchanger 50 for cooling.
循環泵31設置於第一冷媒管30與第二熱交換器50之間。該循環泵31用於為第一熱交換器20與第二熱交換器50之間的冷媒的傳輸提供動力。本實施方式中，循環泵31將經第二熱交換器50冷卻後的冷媒泵入第一熱交換器20中。顯而易見地，在其他實施方式中，該循環泵31亦可設置於第二冷媒管40與第二熱交換器50之間，用於將經過第一熱交換器20的冷媒泵入第二熱交換器50中。The circulation pump 31 is disposed between the first refrigerant pipe 30 and the second heat exchanger 50. The circulation pump 31 is used to power the transmission of the refrigerant between the first heat exchanger 20 and the second heat exchanger 50. In the present embodiment, the circulation pump 31 pumps the refrigerant cooled by the second heat exchanger 50 into the first heat exchanger 20. Obviously, in other embodiments, the circulation pump 31 can also be disposed between the second refrigerant tube 40 and the second heat exchanger 50 for pumping the refrigerant passing through the first heat exchanger 20 into the second heat exchange. In the device 50.
該循環泵31將經第二熱交換器50冷卻的冷媒泵入第一冷媒管30並進入第一熱交換器20，冷媒流經第一熱交換器20以吸收第一熱交換器20的熱量再流入第二熱交換器50進行冷卻，如此循環往復，從而降低電子設備10的溫度，確保電子設備10內各元件的工作性能不受溫度的影響。The circulation pump 31 pumps the refrigerant cooled by the second heat exchanger 50 into the first refrigerant pipe 30 and enters the first heat exchanger 20, and the refrigerant flows through the first heat exchanger 20 to absorb the heat of the first heat exchanger 20. Then, it flows into the second heat exchanger 50 for cooling, and thus reciprocates, thereby lowering the temperature of the electronic device 10, and ensuring that the operational performance of each component in the electronic device 10 is not affected by temperature.
在本實施方式中，液化氣體51為液化天然氣。習知技術中，天然氣田生產的天然氣，需要先經淨化處理，再經一連串超低溫予以液化，使其變為液化天然氣，以便於儲存及運輸。而用戶端使用液化天然氣時需將液化天然氣進行氣化，而在此過程中，會吸收大量的熱。液化氣體51也可以是其他需要氣化後使用的液態氣體，比如液氮等。In the present embodiment, the liquefied gas 51 is liquefied natural gas. In the conventional technology, the natural gas produced in the natural gas field needs to be purified first, and then liquefied through a series of ultra-low temperature to make it into liquefied natural gas for storage and transportation. When the customer uses liquefied natural gas, it needs to gasify the liquefied natural gas, and in the process, it will absorb a large amount of heat. The liquefied gas 51 may also be another liquid gas that needs to be used after gasification, such as liquid nitrogen or the like.
第二熱交換器50內設有熱傳介質，熱傳介質用於吸收流經第二熱交換器50的冷媒的熱量。液化氣體51在第二熱交換器50中吸收熱傳介質的熱量氣化後，自液化氣體出口53排出。在本實施方式中，該熱傳介質為抗凍液。該抗凍液可以是酒精、乙二醇、丙二醇、甘油、氯化鈣溶液、氯化鎂溶液或者氯化鈉溶液等可以作為冷媒的物質。The second heat exchanger 50 is provided with a heat transfer medium for absorbing heat of the refrigerant flowing through the second heat exchanger 50. The liquefied gas 51 is vaporized by the heat absorbing the heat transfer medium in the second heat exchanger 50, and then discharged from the liquefied gas outlet 53. In the present embodiment, the heat transfer medium is an antifreeze solution. The antifreeze solution may be a substance which can be used as a refrigerant such as alcohol, ethylene glycol, propylene glycol, glycerin, calcium chloride solution, magnesium chloride solution or sodium chloride solution.
由於海水溫度高於液化氣體51的溫度，利用海水流經第三熱交換器60對液化氣體51進行預熱，以使進入第二熱交換器50內的液化氣體51之溫度適合第二熱交換器50內的熱傳介質循環。第三熱交換器60連接一海水入口61及一海水出口63。海水自海水入口61進入第三熱交換器60將經過第三熱交換器60的液化氣體51加熱，加熱後的海水自海水出口63排出。液化氣體51經第三熱交換器60加熱後進入第二熱交換器50內。顯而易見的，第三熱交換器60也可以利用其他液體來加熱液化氣體51。Since the seawater temperature is higher than the temperature of the liquefied gas 51, the liquefied gas 51 is preheated by the seawater flowing through the third heat exchanger 60, so that the temperature of the liquefied gas 51 entering the second heat exchanger 50 is adapted to the second heat exchange. The heat transfer medium within the device 50 circulates. The third heat exchanger 60 is connected to a seawater inlet 61 and a seawater outlet 63. The seawater enters the third heat exchanger 60 from the seawater inlet 61, and heats the liquefied gas 51 that has passed through the third heat exchanger 60, and the heated seawater is discharged from the seawater outlet 63. The liquefied gas 51 is heated by the third heat exchanger 60 and then enters the second heat exchanger 50. It will be apparent that the third heat exchanger 60 can also utilize other liquids to heat the liquefied gas 51.
顯而易見的，如果經過海水預熱後的液化氣體51已經被氣化，第二熱交換器50內則不需設置熱傳介質，第二熱交換器50可選用殼管式熱交換器、板式熱交換器等直接利用流經的氣化後的液化氣體51吸收流經第二熱交換器50的冷媒的熱量。Obviously, if the liquefied gas 51 after the seawater is preheated has been vaporized, the heat transfer medium is not required in the second heat exchanger 50, and the second heat exchanger 50 can be used with a shell and tube heat exchanger and a plate heat. The exchanger or the like directly absorbs the heat of the refrigerant flowing through the second heat exchanger 50 by using the vaporized liquefied gas 51 flowing therethrough.
本發明電子設備的冷卻系統藉由流經第一熱交換器20的冷媒吸收電子設備10產生的熱量，第三熱交換器60將液化氣體預熱後傳輸到第二熱交換器50，第二熱交換器50利用氣化液化氣體51吸收流經第二熱交換器50的冷媒的熱量以冷卻該冷媒，如此，在氣化液化氣體51的同時冷卻電子設備，符合當今社會節能減排的需求。The cooling system of the electronic device of the present invention absorbs the heat generated by the electronic device 10 by the refrigerant flowing through the first heat exchanger 20, and the third heat exchanger 60 preheats the liquefied gas and transmits it to the second heat exchanger 50, second. The heat exchanger 50 absorbs the heat of the refrigerant flowing through the second heat exchanger 50 by the vaporized liquefied gas 51 to cool the refrigerant, so that the electronic equipment is cooled while the liquefied gas 51 is vaporized, which meets the demand for energy saving and emission reduction in today's society. .
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10．．．電子設備10. . . Electronic equipment
20．．．第一熱交換器20. . . First heat exchanger
30．．．第一冷媒管30. . . First refrigerant tube
31．．．循環泵31. . . Circulating pump
40．．．第二冷媒管40. . . Second refrigerant tube
50．．．第二熱交換器50. . . Second heat exchanger
51．．．液化氣體51. . . Liquefied gas
53．．．液化氣體出口53. . . Liquefied gas outlet
60．．．第三熱交換器60. . . Third heat exchanger
61．．．海水入口61. . . Sea water inlet
63．．．海水出口63. . . Seawater outlet
圖1為本發明電子設備的冷卻系統的較佳實施方式的結構示意圖。1 is a schematic structural view of a preferred embodiment of a cooling system of an electronic device of the present invention.
10．．．電子設備10. . . Electronic equipment
20．．．第一熱交換器20. . . First heat exchanger
30．．．第一冷媒管30. . . First refrigerant tube
31．．．循環泵31. . . Circulating pump
40．．．第二冷媒管40. . . Second refrigerant tube
50．．．第二熱交換器50. . . Second heat exchanger
51．．．液化氣體51. . . Liquefied gas
53．．．液化氣體出口53. . . Liquefied gas outlet
60．．．第三熱交換器60. . . Third heat exchanger
61．．．海水入口61. . . Sea water inlet
63．．．海水出口63. . . Seawater outlet
Claims (12)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127283A TW201309178A (en) | 2011-08-01 | 2011-08-01 | Cooling system for electronic device |
| US13/272,238 US20130031924A1 (en) | 2011-08-01 | 2011-10-13 | Cooling system for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127283A TW201309178A (en) | 2011-08-01 | 2011-08-01 | Cooling system for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201309178A true TW201309178A (en) | 2013-02-16 |
Family
ID=47626065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100127283A TW201309178A (en) | 2011-08-01 | 2011-08-01 | Cooling system for electronic device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20130031924A1 (en) |
| TW (1) | TW201309178A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107105602B (en) * | 2017-05-05 | 2019-04-05 | 北京百度网讯科技有限公司 | Cooling water system for data center |
| SG10201706878PA (en) * | 2017-08-23 | 2019-03-28 | Keppel Offshore & Marine Tech Ct Pte Ltd | Cold Energy Recovery Apparatus for a Self-Powered Data Centre |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3720057A (en) * | 1971-04-15 | 1973-03-13 | Black Sivalls & Bryson Inc | Method of continuously vaporizing and superheating liquefied cryogenic fluid |
| US3986340A (en) * | 1975-03-10 | 1976-10-19 | Bivins Jr Henry W | Method and apparatus for providing superheated gaseous fluid from a low temperature liquid supply |
| US5660047A (en) * | 1995-09-15 | 1997-08-26 | American Air Liquide, Inc. | Refrigeration system and method for cooling a susceptor using a refrigeration system |
| JP2010267707A (en) * | 2009-05-13 | 2010-11-25 | Kobe Steel Ltd | Data center system, and cooling power generation using data center system |
-
2011
- 2011-08-01 TW TW100127283A patent/TW201309178A/en unknown
- 2011-10-13 US US13/272,238 patent/US20130031924A1/en not_active Abandoned
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| Publication number | Publication date |
|---|---|
| US20130031924A1 (en) | 2013-02-07 |
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