TW201306994A - Glass substrate surface grinding method - Google Patents

Abstract

In a glass substrate surface grinding method, a glass substrate to be grinded is fixed onto a rotating base first, such that the rotating base can drive the glass substrate to rotate, and the rotating base includes a grinding device installed thereon, and the grinding device can be a grinding disc with a diameter equal to or greater than the longest side of the glass substrate, and a start point and an end point are defined at both sides of the grinding disc respectively. When the grinding disc is used for grinding the glass substrate, the grinding disc abuts a surface of the glass substrate first, and then the start point of the grinding disc is superimposed with the central axis of rotating the glass substrate, and then the grinding disc is moved transversally. When the end point of the grinding disc is superimposed with the central axis of the glass substrate, the grinding disc is lifted away from the surface of the glass substrate, and wavy lines formed on the surface of the glass substrate can be removed effectively, so as to prevent a grinding defect produced at the center of the substrate, and improve the grinding quality and the yield rate of the glass substrate.

Description

Glass substrate surface grinding method

A method for polishing a surface of a glass substrate, especially a method for removing a wave pattern on a surface of a glass substrate.

Press, a thin film transistor display (TFT-LCD) is a display device whose image generation principle is to use a piece of glass (Color Filter color filter) coated with dense red, green and blue colors, and A piece of circuit-coated glass (TFT) is bonded, two pieces of glass are filled with liquid crystal, and a backlight is placed behind the glass plated with the circuit, and the liquid crystal is rotated by the voltage change when the light passes through the color filter. The light film will produce color changes and display images. At present, the glass substrates used in the thin film transistor display are mostly manufactured by a thin plate floating glass process, mainly because of the poor density of the liquid material, and the liquid glass is suspended in liquid metal tin. The groove uses the smooth surface of the liquid tin to pull out the glass substrate. Since the glass in the process will be in contact with the liquid tin, the surface of the glass will be wavy, and it must be processed by grinding, polishing, etc., and the current grinding process is mainly to glass. The substrate is fixed on a rotating table, and the polishing sheet is completely pressed against the surface of the glass substrate, and the rotating table drives the glass substrate to rotate. The surface of the glass substrate is ground to remove the wavy lines generated in the glass substrate process.

However, the size of the thin film transistor display is getting larger and larger, and the size of the glass substrate is relatively larger. In the grinding process of the glass substrate, the polishing sheet grinds the surface of the glass substrate in a moving manner, but uneven grinding often occurs. In the case of the creator of the present invention, it has been found that the glass substrate is often unevenly covered by the glass substrate during the polishing process, and the closer to the center of rotation of the glass substrate, the more uneven the situation is. Seriously, please refer to the seventh figure. As can be clearly seen from the figure, the glass substrate A is in a pivoting state during grinding (shown by a broken arrow in the figure), and the position of the polishing sheet B is a glass substrate. After the surface of one side A is pressed, it is moved toward the pivot center of the glass substrate A to the polishing sheet B' (shown by a solid arrow in the figure), that is, after the polishing sheet B is moved beyond the pivot center of the glass substrate A. When the grinding is stopped, only the outer portion of the glass substrate A is ground by the entire surface of the polishing sheet B, and the closer to the pivoting center of the glass substrate A, the polishing area generated by the polishing sheet B is received. Polishing amount less prone to failure of the grinding situation.

Therefore, how to improve the process of the above-mentioned glass substrate grinding process to avoid the problem that the wave surface of the glass substrate cannot be effectively removed is the subject of research and solution by the relevant industry.

The main purpose of the present invention is to form an equal polishing area on both sides of the glass substrate by using a polishing sheet by moving the polishing method, thereby effectively removing the wave pattern on the surface of the glass substrate, and preventing the occurrence of poor polishing at the center of the glass substrate. The problem is to improve the polishing quality and product yield of the glass substrate.

In order to achieve the above object, the glass substrate surface polishing method of the present invention first fixes the glass substrate to be polished to the rotating base, and rotates the rotating base to drive the glass substrate to rotate, and the polishing device is disposed above the rotating seat, and the grinding device is The grinding disc is pivoted, the diameter of the grinding disc is at least equal to the length of the longest side of the glass substrate to be polished, and the starting point and the ending point are respectively arranged on the two sides of the grinding disc, and the starting point and the ending point are connected In order to pass through the axis of the grinding disc; when the grinding disc grinds the rotating glass substrate, the grinding disc is first pressed against the surface of the glass substrate, and the starting point of the grinding disc is overlapped with the glass substrate during rotation. The central axis, and then the grinding disc is laterally displaced, the displacement direction is that the axis of the grinding disc is linearly displaced toward the central axis of the glass substrate, so that the axis of the grinding disc passes through the central axis of the glass substrate, and the glass is overlapped at the end point of the grinding disc When the center axis of the substrate is used, the grinding disc is lifted off the surface of the glass substrate.

Referring to the first figure and the second figure, it can be clearly seen from the figure that the polishing method of the present invention fixes the glass substrate 1 to be polished on the rotating base 2, so that the rotating base 2 drives the glass substrate when rotating. 1 is rotated, and a grinding device 3 is disposed above the rotating base 2. The grinding device 3 is provided with an arm 31. The arm 31 is pivotally connected to the grinding disc 32, and the diameter of the grinding disc 32 is equal to the longest length of the glass substrate 1 to be polished. The length of the edge and the starting point 321 and the ending point 322 are respectively disposed on two sides of the periphery of the grinding disc 32, and the straight line connecting the starting point 321 and the ending point 322 is the axis 323 passing through the grinding disc 32.

Referring to the second to seventh figures, as shown in the second and third figures, when the polishing apparatus 3 grinds the surface of the glass substrate 1, the rotating base 2 rotates to drive the glass substrate 1 to rotate. The glass substrate 1 is pivoted according to the central axis 11. At this time, the arm 31 of the polishing device 3 first moves the polishing disk 32 to move down against the surface of the glass substrate 1, and when the polishing disk 32 is pressed against the surface of the glass substrate 1, As shown in the fourth figure, the starting point 321 of the grinding disc 32 is overlapped with the central axis 11 of the glass substrate 1. Since the glass substrate 1 is pivotally displaced, the glass substrate 1 is passed through the grinding disc 32. The friction with the grinding disc 32 is removed, and the wave pattern on the surface of the glass substrate 1 can be removed, and since the grinding disc 32 is pivotally connected to the arm 31, the grinding disc 32 is pivoted by friction caused by friction, please refer to 4 and 5, when the grinding disc 32 is lowered against the surface of the glass substrate 1, the arm 31 of the grinding device 3 drives the grinding disc 32 to laterally displace, and the grinding disc 32 is displaced in the direction of the grinding disc 32. The axis 323 is linearly displaced toward the central axis 11 of the glass substrate 1 to cause grinding During the displacement of the disk 32, the axis 323 of the grinding disk 32 passes through the central axis 11 of the glass substrate 1. Please refer to the fifth and sixth figures simultaneously, when the grinding disk 32 is laterally displaced to its end point 322. When the central axis 11 of the glass substrate 1 is used, the arm 31 drives the polishing disk 32 to lift off the surface of the glass substrate 1, that is, the surface of the glass substrate 1 is polished.

Referring to the seventh figure, it can be clearly seen from the figure that when the polishing disk 32 of the present invention is ground on the glass substrate 1, the polishing path is formed on both sides of the central axis 11 of the glass substrate 1, and The axis 323 of the grinding disc 32 passes through the central axis 11 of the glass substrate 1. Therefore, the grinding disc 32 forms an equal grinding area on both sides of the central axis 11 of the glass substrate 1, and the grinding disc 32 passes completely through the glass substrate 1. The central axis 11 is used to cause the surface of the glass substrate 1 to be polished more evenly, thereby reducing the probability of occurrence of residual wavy on the surface of the glass substrate 1, thereby effectively improving the polishing yield.

Furthermore, the diameter of the grinding disc 32 can also be larger than the longest side of the glass substrate 1, thereby expanding the equal grinding area on both sides of the central axis 11 of the glass substrate 1, so that the diameter of the grinding disc 32 is larger than the longest side of the glass substrate 1, In addition to the same polishing effect at the center of the glass substrate 1, the polishing area at the outer periphery of the glass substrate 1 is increased, and the polishing quality at the outer periphery of the glass substrate 1 can be improved.

1. . . glass substrate

11. . . The central axis

2. . . Rotating seat

3. . . Grinding device

31. . . Arm

32. . . Grinding disc

321. . . Starting point

322. . . Termination point

323. . . Axis

A. . . glass substrate

B. . . Abrasive sheet

B’. . . Abrasive sheet

The first figure is a schematic diagram of the pivoting of the glass substrate and the rotating base.

The second figure is a schematic view of the side view of the grinding method of the present invention (1).

The third figure is a schematic view of the top view of the grinding method of the present invention (1).

The fourth figure is a schematic view of the side view of the grinding method of the present invention (2).

The fifth figure is a schematic view of the side view of the grinding method of the present invention (3).

The sixth figure is a schematic view of the side view of the grinding method of the present invention (4).

The seventh figure is a schematic diagram of the grinding range and path of the grinding disc of the present invention.

The eighth figure is a schematic diagram of a conventional grinding method.

1. . . glass substrate

11. . . The central axis

2. . . Rotating seat

3. . . Grinding device

31. . . Arm

32. . . Grinding disc

321. . . Starting point

322. . . Termination point

323. . . Axis

Claims (3)

A method for polishing a surface of a glass substrate, in particular, a method for removing a wave pattern on a surface of a glass substrate, wherein the glass substrate to be polished is fixed on a rotating base, so that the rotating base rotates the glass substrate while rotating, and A grinding device is disposed above the rotating seat, the grinding device is pivotally provided with a grinding disc, the diameter of the grinding disc is at least equal to the length of the longest side of the glass substrate to be polished, and the starting point and the ending point are respectively disposed on two sides of the grinding disc circumference, and The straight line connecting the starting point and the ending point is the axis passing through the grinding disc; by the way, when the grinding disc grinds the rotating glass substrate, the grinding disc is first pressed against the surface of the glass substrate, and The starting point of the grinding disc is overlapped with the central axis of the glass substrate during rotation, and then the grinding disc is laterally displaced. The displacement direction is that the axis of the grinding disc is linearly displaced toward the central axis of the glass substrate, and the axis of the grinding disc passes through the glass substrate. After the central axis, and the end point of the grinding disc overlaps the central axis of the glass substrate, the polishing disc is lifted off the surface of the glass substrate, that is, the surface of the glass substrate is completed. Grinding. The method for polishing a glass substrate surface according to claim 1, wherein the diameter of the polishing disk is larger than a longest side of the glass substrate. The method for polishing a glass substrate surface according to claim 1, wherein the grinding device is provided with a support arm, and the grinding disc is pivotally connected to the arm, and the arm is configured to drive the grinding disc displacement.