TW201305622A - Method of manufacturing light guide plate - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 5
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- 239000003292 glue Substances 0.000 claims description 4
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- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000001723 curing Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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Abstract
Description
本發明是有關於一種光學元件的製作方法,且特別是有關於一種導光板的製作方法。The present invention relates to a method of fabricating an optical component, and more particularly to a method of fabricating a light guide.
由於液晶顯示器(liquid crystal display,LCD)本身並不具有發光的功能,故在液晶顯示器下方必須提供背光系統以提供光源,進而達到顯示的功能。習知的背光系統由兩個基本部分所組成:光源以及導光板(light guide plate),其中光源又分為線光源的冷陰極燈管(cold cathode fluorescence lamp,CCFL)以及點光源的發光二極體(light emitting diode,LED)。光源所發出的光束會直接射入導光板,並被導光板導引而均勻從導光板上表面射出。Since the liquid crystal display (LCD) itself does not have the function of emitting light, a backlight system must be provided under the liquid crystal display to provide a light source to achieve the display function. The conventional backlight system is composed of two basic parts: a light source and a light guide plate, wherein the light source is further divided into a cold cathode fluorescent lamp (CCFL) of a line source and a light emitting diode of a point source. Light emitting diode (LED). The light beam emitted by the light source is directly incident on the light guide plate and guided by the light guide plate to be uniformly emitted from the surface of the light guide plate.
在習知技術中,為了提升光使用效率,會將導光板位於光源一側的入光面做得較大以充分接收發光二極體所發出的光束。然而,受限於導光板的射出機台的製程,一般很難再對大尺寸(例如7英寸以上)的導光板進行薄型化。另一方面,雖然利用壓出成形製作平板導光板的技術能將平板導光板的最小厚度控制在0.3毫米至0.6毫米,然而為了搭配平板導光板的厚度,通常選擇體積較小的發光二極體來做為光源,以與平板導光板形成光源裝置,因為壓出成形製作平板導光板的技術不能將導光板位於光源一側的入光面做得較大。如此一來,這樣的光源裝置將會有出光效能低落、壽命過低,且無法滿足大尺寸應用的缺點。In the prior art, in order to improve the light use efficiency, the light incident surface of the light guide plate on the light source side is made larger to sufficiently receive the light beam emitted by the light emitting diode. However, it is generally difficult to reduce the thickness of a large-sized (for example, 7 inches or more) light guide plate by the process of the injection table of the light guide plate. On the other hand, although the technique of forming a flat light guide plate by extrusion molding can control the minimum thickness of the flat light guide plate to 0.3 mm to 0.6 mm, in order to match the thickness of the flat light guide plate, a small-sized light-emitting diode is usually selected. As a light source, a light source device is formed with a flat light guide plate, because the technique of forming a flat light guide plate by extrusion molding cannot make the light incident surface of the light guide plate on the light source side larger. As a result, such a light source device will have the disadvantages of low light output performance, low lifetime, and inability to meet large-size applications.
除此之外,習知技術亦提供幾種相關於導光板或基板的製作技術。舉例來說,美國專利公開號20070031106揭露一種於平板上製做光吸收層的方法。中國大陸專利公開號101243355與中華民國專利號594267亦分別揭露一種相關於導光板的結構。另外,中華民國專利號I306806與I332435則是分別揭露塑料的加工方法與導光板表面圖案的加工方法。In addition, the prior art also provides several fabrication techniques related to light guide plates or substrates. For example, U.S. Patent Publication No. 20070031106 discloses a method of making a light absorbing layer on a flat sheet. A structure related to a light guide plate is also disclosed in the Chinese Patent Publication No. 101243355 and the Republic of China Patent No. 594267, respectively. In addition, the Republic of China Patent Nos. I306806 and I332435 disclose the processing method of the plastic and the processing method of the surface pattern of the light guide plate, respectively.
本發明提供一種導光板的製作方法,能有效提升薄型導光板與厚度較大之光源的搭配度。The invention provides a method for manufacturing a light guide plate, which can effectively improve the matching degree between a thin light guide plate and a light source with a large thickness.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.
為達上述之一或部份或全部目的或是其他目的,本發明之一實施例提出一種導光板的製作方法,包括以下步驟。提供透光基板。透光基板具有第一表面、第二表面與連接第一表面與第二表面的第一入光面。利用模具於透光基板之第一表面上靠近第一入光面的位置製作第一楔形部,以形成一導光板,其中第一楔型部的厚度隨著遠離第一入光面的方向而遞減。In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a method of fabricating a light guide plate, including the following steps. A transparent substrate is provided. The light transmissive substrate has a first surface, a second surface, and a first light incident surface connecting the first surface and the second surface. Forming a first wedge portion on the first surface of the light transmissive substrate adjacent to the first light incident surface by using a mold to form a light guide plate, wherein the thickness of the first wedge portion is away from the first light incident surface Decrement.
在一實施例的導光板的製作方法,其中利用模具於透光基板之第一表面上靠近第一入光面的位置製作第一楔形部的步驟包括:於模具的容置空間內填充第一材料,其中第一材料與透光基板的材料不同;將透光基板之靠近第一入光面的一端置入容置空間內,以使第一表面接觸第一材料;以及使第一材料固化於第一表面上,以形成第一楔形部。In the manufacturing method of the light guide plate of the embodiment, the step of forming the first wedge portion on the first surface of the transparent substrate by using the mold near the first light incident surface comprises: filling the first space in the housing space of the mold a material, wherein the first material is different from the material of the light-transmitting substrate; the one end of the light-transmitting substrate adjacent to the first light-incident surface is placed in the accommodating space to make the first surface contact the first material; and the first material is cured On the first surface to form a first wedge.
在一實施例的導光板的製作方法,其中使第一材料固化於第一表面上的步驟係利用光照射該容置空間內的第一材料。In a method of fabricating a light guide plate according to an embodiment, the step of curing the first material on the first surface is to irradiate the first material in the accommodating space with light.
在一實施例的導光板的製作方法,其中模具包括第一部分模仁與第二部份模仁,且導光板的製作方法更包括組合第一部分模仁與第二部份模仁以形成容置空間。In a method of manufacturing a light guide plate according to an embodiment, the mold includes a first portion of the mold core and the second portion of the mold core, and the method of manufacturing the light guide plate further comprises combining the first portion of the mold core and the second portion of the mold core to form the mold. space.
在一實施例中,導光板的製作方法更包括:分開第一部分模仁與第二部份模仁;以及使導光板與模具分離。In an embodiment, the method of manufacturing the light guide plate further comprises: separating the first portion of the mold core and the second portion of the mold core; and separating the light guide plate from the mold.
在一實施例中,導光板的製作方法更包括對模具與第一材料的接觸表面進行表面處理,以降低第一材料與模具的吸附力。In an embodiment, the method of fabricating the light guide plate further comprises surface treating the contact surface of the mold and the first material to reduce the adsorption force of the first material and the mold.
在一實施例的導光板的製作方法,其中對模具與第一材料的接觸表面進行表面處理的步驟包括於模具與第一材料的接觸表面塗佈一脫模劑。In a method of fabricating a light guide plate according to an embodiment, the step of surface-treating the contact surface of the mold with the first material comprises applying a release agent to the contact surface of the mold and the first material.
在一實施例的導光板的製作方法,更包括:利用模具於透光基板的第一入光面上形成第一入光部,其中第一入光部與第一楔形部連接。In the manufacturing method of the light guide plate of the embodiment, the method further includes: forming a first light incident portion on the first light incident surface of the light transmissive substrate by using the mold, wherein the first light incident portion is connected to the first wedge portion.
在一實施例的導光板的製作方法,其中第一入光部具有背對透光基板的迎光面,且迎光面具有複數個光學微結構。In a method of fabricating a light guide plate according to an embodiment, the first light incident portion has a light-incident surface facing away from the light-transmitting substrate, and the light-incident surface has a plurality of optical microstructures.
在一實施例的導光板的製作方法,其中利用模具於透光基板之第一表面上靠近第一入光面的位置製作第一楔形部,且於透光基板的第一入光面上形成第一入光部的步驟包括:於模具的容置空間內填充第一材料,其中第一材料與透光基板的材料不同;將透光基板之靠近第一入光面的一端置入容置空間內,並使第一入光面與模具保持一間距,以使第一表面與第一入光面接觸第一材料;以及使第一材料固化於第一表面及第一入光面上,以分別形成第一楔形部及第一入光部。In the manufacturing method of the light guide plate of the embodiment, the first wedge portion is formed on the first surface of the transparent substrate by the mold near the first light incident surface, and is formed on the first light incident surface of the transparent substrate. The step of filling the first light-injecting portion includes: filling a first material in the accommodating space of the mold, wherein the first material is different from the material of the light-transmitting substrate; and placing the end of the light-transmitting substrate adjacent to the first light-incident surface And maintaining a distance between the first light incident surface and the mold, so that the first surface and the first light incident surface contact the first material; and curing the first material on the first surface and the first light incident surface, The first wedge portion and the first light incident portion are respectively formed.
在一實施例的導光板的製作方法,其中第一材料為一光硬化樹脂或紫外光固化膠。In a method of fabricating a light guide plate according to an embodiment, the first material is a light hardening resin or an ultraviolet light curing adhesive.
在一實施例的導光板的製作方法,其中透光基板更具有相對於第一入光面的第二入光面,且導光板的製作方法更包括於第一表面上靠近第二入光面的位置製作第二楔形部,其中第二楔形部的厚度隨著遠離第二入光面的方向而遞減。In a method of fabricating a light guide plate according to an embodiment, the light-transmitting substrate further has a second light-incident surface relative to the first light-incident surface, and the method for fabricating the light guide plate further comprises: approaching the second light-incident surface on the first surface The position creates a second wedge, wherein the thickness of the second wedge decreases as it moves away from the second entrance face.
在一實施例中,導光板的製作方法更包括利用模具於透光基板的第二入光面上形成第二入光部,且第二入光部與第二楔形部連接。In one embodiment, the method for fabricating the light guide plate further includes forming a second light incident portion on the second light incident surface of the light transmissive substrate by using the mold, and connecting the second light incident portion to the second wedge portion.
在一實施例的導光板的製作方法,其中第一楔形部之折射率與透光基板之折射率的差值小於或等於0.15。In a method of fabricating a light guide plate according to an embodiment, a difference between a refractive index of the first wedge portion and a refractive index of the transparent substrate is less than or equal to 0.15.
在一實施例的導光板的製作方法,其中透光基板的厚度小於或等於0.4毫米。In a method of fabricating a light guide plate according to an embodiment, the thickness of the light transmissive substrate is less than or equal to 0.4 mm.
在一實施例的導光板的製作方法,其中透光基板的第一表面之對角線長為大於或等於7英寸。In a method of fabricating a light guide plate according to an embodiment, a diagonal length of the first surface of the light transmissive substrate is greater than or equal to 7 inches.
基於上述,本發明之實施例可達到下列優點或功效之至少其一。由於本發明之實施例之導光板的製作方法係在透光基板之第一表面上靠近第一入光面的位置製作第一楔形部,故能使導光板在靠近入光側之處有較大的厚度。因此,上述之導光板的入光側能配置較厚度較大的光源,從而能避免習知薄型導光板因使用薄型光源之出光效能低落的問題。Based on the above, embodiments of the present invention can achieve at least one of the following advantages or effects. Since the method for fabricating the light guide plate according to the embodiment of the present invention is to form the first wedge portion on the first surface of the transparent substrate near the first light incident surface, the light guide plate can be closer to the light entrance side. Large thickness. Therefore, the light-incident side of the light guide plate can be disposed with a light source having a relatively large thickness, so that the problem that the light-emitting performance of the thin light-guide plate is lowered due to the use of the thin-type light source can be avoided.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.
本實施例之導光板的製作方法主要包括兩步驟。提供一透光基板,其中透光基板具有一第一表面、一第二表面與一連接第一表面與第二表面的第一入光面。利用一模具於透光基板之第一表面上靠近第一入光面的位置製作一第一楔形部,以形成一導光板,其中第一楔型部的厚度隨著遠離第一入光面而遞減。藉由上述作法,能製作出一種適於搭配厚度較大之光源的薄型導光板。詳細製作過程的一實施例請參照圖1A至圖1I的相關敘述。The manufacturing method of the light guide plate of this embodiment mainly includes two steps. A transparent substrate is provided, wherein the transparent substrate has a first surface, a second surface, and a first light incident surface connecting the first surface and the second surface. Forming a first wedge portion on a first surface of the transparent substrate adjacent to the first light incident surface by using a mold to form a light guide plate, wherein the thickness of the first wedge portion is away from the first light incident surface Decrement. By the above method, a thin light guide plate suitable for a light source having a large thickness can be produced. For an embodiment of the detailed production process, please refer to the related description of FIGS. 1A to 1I.
圖1A至圖1I為本發明一實施例之導光板的製作方法的示意圖。請先參照圖1A與圖1B,導光板的製作方法包括將圖1A之模具100的第一部分模仁110與第二部份模仁120組合,以形成圖1B的容置空間130。在本實施例中,第一部分模仁110與第二部份模仁120例如為透光模仁。1A to 1I are schematic views showing a method of fabricating a light guide plate according to an embodiment of the present invention. Referring to FIG. 1A and FIG. 1B , the method for fabricating the light guide plate comprises combining the first portion of the mold core 110 of the mold 100 of FIG. 1A with the second portion of the mold core 120 to form the accommodating space 130 of FIG. 1B . In this embodiment, the first portion of the mold core 110 and the second portion of the mold core 120 are, for example, light transmissive mold cores.
接著,請參照圖1D,於模具100的容置空間130內填充材料M1。在本實施例中,材料M1例如為光硬化樹脂(photo-curing resin)或紫外光固化膠(ultraviolet glue,UV glue),且材料M1的填充例如是透過出膠噴嘴200來執行,惟本發明不受限於此。除此之外,如圖1C所示,為了降低材料M1與模具100的吸附力,在進行圖1D的填充材料M1步驟前,亦可先對模具100與材料M1的接觸表面S1進行表面處理。詳細來說,圖1C之進行表面處理的方法例如為在模具100與材料M1的接觸表面S1塗佈脫模劑M2,惟本發明不受限於此。應注意的是,在其他實施例中,亦可不需要於圖1D之步驟前先執行圖1C之表面處理的步驟。Next, referring to FIG. 1D, the material M1 is filled in the accommodating space 130 of the mold 100. In the present embodiment, the material M1 is, for example, a photo-curing resin or an ultraviolet glue (UV glue), and the filling of the material M1 is performed, for example, through the dispensing nozzle 200, but the present invention Not limited to this. In addition, as shown in FIG. 1C, in order to reduce the adsorption force of the material M1 and the mold 100, the contact surface S1 of the mold 100 and the material M1 may be surface-treated before the step of filling the material M1 of FIG. 1D. In detail, the method of performing the surface treatment of FIG. 1C is, for example, applying the release agent M2 to the contact surface S1 of the mold 100 and the material M1, but the invention is not limited thereto. It should be noted that in other embodiments, the step of surface treatment of FIG. 1C may not be performed prior to the step of FIG. 1D.
再來,請參照圖1E與圖1F,提供透光基板310,並將透光基板310之靠近入光面S4的一端置入容置空間130內,以使表面S2接觸材料M1。其中透光基板310例如是利用夾具400來固定或移動。另外,在本實施例中,透光基板310例如為平板基板。除此之外,如圖1F所示,本實施例之導光板的製作方法還包括使透光基板310之入光面S4與模具100保持間距G1,以使入光面S4接觸材料M1,其中間距G1大於0。在本實施例中,透光基板310的厚度T1小於或等於0.4毫米(mm),且透光基板310的表面S2之對角線L(繪示於圖2)長為大於或等於7英寸。由此可知,本實施例之透光基板310為一厚度較薄且尺寸較大的透光基板。另外,透光基板310例如是以擠出、射出或滾壓的方式製作。Referring to FIG. 1E and FIG. 1F , a transparent substrate 310 is provided, and one end of the transparent substrate 310 adjacent to the light incident surface S4 is placed in the accommodating space 130 such that the surface S2 contacts the material M1 . The light-transmitting substrate 310 is fixed or moved by, for example, a jig 400. In addition, in the present embodiment, the light-transmitting substrate 310 is, for example, a flat substrate. In addition, as shown in FIG. 1F, the method for fabricating the light guide plate of the embodiment further includes maintaining the light incident surface S4 of the transparent substrate 310 and the mold 100 at a distance G1, so that the light incident surface S4 contacts the material M1, wherein The pitch G1 is greater than zero. In the present embodiment, the thickness T1 of the transparent substrate 310 is less than or equal to 0.4 millimeters (mm), and the diagonal line L (shown in FIG. 2) of the surface S2 of the transparent substrate 310 is longer than or equal to 7 inches. Therefore, the light-transmitting substrate 310 of the present embodiment is a light-transmissive substrate having a small thickness and a large size. Further, the light-transmitting substrate 310 is produced, for example, by extrusion, ejection, or rolling.
然後,如圖1G所示,使容置空間130內的材料M1固化於表面S2上,以在透光基板310之表面S2上靠近入光面S4的位置製作楔形部320。其中楔型部320的厚度T2隨著遠離入光面S4的方向而遞減。另外,楔形部320之折射率與透光基板310之折射率的差值小於或等於0.15。除此之外,在本實施例中,導光板的製作方法還包括使材料M1固化於入光面S4上,以形成入光部330,其中入光部330與楔形部320連接。至此,便完成導光板300的製作。應注意的是,在其他實施例中,導光板300亦可不具有入光部330。舉例來說,若將透光基板310的入光面S4與容置空間130的底部緊密接觸,便有可能形成不具有入光部330的導光板。另外,使材料M1固化於表面S2或入光面S4上的方法例如是利用光500照射容置空間130內的材料M1,且光500例如為紫外光,模具100例如為一透光模具以利光500穿過。或是利用加熱烘烤容置空間130內的材料M1,使材料M1固化於表面S2或入光面S4上。Then, as shown in FIG. 1G, the material M1 in the accommodating space 130 is solidified on the surface S2, and the wedge portion 320 is formed on the surface S2 of the transparent substrate 310 near the light incident surface S4. The thickness T2 of the wedge portion 320 decreases as it goes away from the light incident surface S4. In addition, the difference between the refractive index of the wedge portion 320 and the refractive index of the transparent substrate 310 is less than or equal to 0.15. In addition, in this embodiment, the method for fabricating the light guide plate further includes curing the material M1 on the light incident surface S4 to form the light incident portion 330, wherein the light incident portion 330 is connected to the wedge portion 320. At this point, the fabrication of the light guide plate 300 is completed. It should be noted that in other embodiments, the light guide plate 300 may not have the light incident portion 330. For example, if the light incident surface S4 of the transparent substrate 310 is in close contact with the bottom of the accommodating space 130, it is possible to form a light guide plate that does not have the light incident portion 330. In addition, the method of curing the material M1 on the surface S2 or the light incident surface S4 is, for example, irradiating the material M1 in the accommodating space 130 with the light 500, and the light 500 is, for example, ultraviolet light, and the mold 100 is, for example, a light transmitting mold to facilitate light. 500 passes through. Or, the material M1 in the accommodating space 130 is heated and baked to cure the material M1 on the surface S2 or the light incident surface S4.
接著,請參照圖1H與圖1I,當完成材料M1的固化後,便可將第一部分模仁110與第二部份模仁120分開,並取出導光板300,以使導光板300與模具100分離。另外,如圖1I所示,本實施例之導光板300的入光部330具有背對透光基板310的迎光面S5,且迎光面S5具有複數個光學微結構332。這些光學微結構332例如是凸點、凹點、凸紋、凹紋或其他適當形狀的光學微結構,光學微結構332例如是由第一部分模仁110的內表面轉印而成。光學微結構332能減少一般平板基板常出現的熱點(hot spot)效應,故本實施例之導光板300適於提供均勻度較佳的面光源。上述之導光板300適於與其他光學元件搭配以形成一背光模組。Next, referring to FIG. 1H and FIG. 1I, after the curing of the material M1 is completed, the first portion of the mold core 110 and the second portion of the mold core 120 can be separated, and the light guide plate 300 can be taken out to make the light guide plate 300 and the mold 100. Separation. In addition, as shown in FIG. 1I, the light incident portion 330 of the light guide plate 300 of the present embodiment has a light incident surface S5 facing away from the transparent substrate 310, and the light incident surface S5 has a plurality of optical microstructures 332. These optical microstructures 332 are, for example, bumps, pits, ridges, indentations, or other suitable shaped optical microstructures, such as being transferred from the inner surface of the first portion of the mold core 110. The optical microstructure 332 can reduce the hot spot effect that is common in flat panel substrates. Therefore, the light guide plate 300 of the present embodiment is suitable for providing a surface light source with better uniformity. The light guide plate 300 described above is adapted to be combined with other optical components to form a backlight module.
圖3為本發明一實施例之背光模組的示意圖。請參照圖3,背光模組600包括上述之導光板300、光源610與光學元件620,其中光源610配置在導光板300之楔形部320的一側,且光學元件620配置在靠近表面S3之一側,光學元件620例如為反射片。在本實施例中,導光板300的出光面例如為表面S2。然而,在另一實施例中,導光板300的出光面亦可為表面S3,且光學元件620的位置例如配置在靠近表面S2之一側。除此之外,光源610例如為發光二極體(light emitting diode,LED)。FIG. 3 is a schematic diagram of a backlight module according to an embodiment of the invention. Referring to FIG. 3 , the backlight module 600 includes the light guide plate 300 , the light source 610 and the optical component 620 , wherein the light source 610 is disposed on one side of the wedge portion 320 of the light guide plate 300 , and the optical component 620 is disposed adjacent to one of the surfaces S3 . On the side, the optical element 620 is, for example, a reflective sheet. In the present embodiment, the light exit surface of the light guide plate 300 is, for example, the surface S2. However, in another embodiment, the light-emitting surface of the light guide plate 300 may also be the surface S3, and the position of the optical element 620 is disposed, for example, on one side of the surface S2. In addition to this, the light source 610 is, for example, a light emitting diode (LED).
值得一提的是,本實施例之透光基板310的厚度較薄且尺寸較大,故本實施例的導光板300為一大尺寸且厚度較薄的導光板。然而,由於本實施例之導光板300包括楔形部320,故導光板300在靠近楔形部320處之入光側的厚度T3較大,從而使得本實施例之導光板300適於搭配厚度較大的光源610。舉例來說,光源610的厚度T4可大於0.4毫米,其例如為0.6毫米或0.8毫米,且光源610之發光區域612的厚度T5例如大於0.3毫米。因此,由於導光板300的厚度T3比光源610之發光區域612的厚度T5大,故導光板300能充份接收發光區域612較大之光源610所發出的光束,從而能使背光模組600提供亮度較高的面光源。換句話說,本實施例之導光板300不會有習知薄型導光板因搭配薄型光源所造成之出光效能低落的問題。亦即,本實施例之導光板的製作方法能製作出大尺寸且適於搭配厚度較大與發光效率較高的光源(例如發光二極體),故採用導光板300的背光模組600提供高均勻度且高亮度的面光源。It is to be noted that the light-transmitting substrate 310 of the present embodiment has a thinner thickness and a larger size. Therefore, the light guide plate 300 of the present embodiment is a light guide plate having a large size and a small thickness. However, since the light guide plate 300 of the present embodiment includes the wedge portion 320, the thickness T3 of the light guide plate 300 on the light incident side near the wedge portion 320 is large, so that the light guide plate 300 of the embodiment is suitable for a larger thickness. Light source 610. For example, the thickness T4 of the light source 610 can be greater than 0.4 mm, which is, for example, 0.6 mm or 0.8 mm, and the thickness T5 of the light-emitting region 612 of the light source 610 is, for example, greater than 0.3 mm. Therefore, since the thickness T3 of the light guide plate 300 is larger than the thickness T5 of the light-emitting region 612 of the light source 610, the light guide plate 300 can fully receive the light beam emitted by the light source 610 having a large light-emitting area 612, so that the backlight module 600 can be provided. A brighter surface source. In other words, the light guide plate 300 of the present embodiment does not have the problem that the thin light guide plate has a low light-emitting performance due to the combination of the thin light source. That is, the manufacturing method of the light guide plate of the present embodiment can produce a large-sized light source (for example, a light-emitting diode) with a large thickness and a high luminous efficiency, so that the backlight module 600 of the light guide plate 300 is provided. Highly uniform and high brightness surface light source.
圖4為本發明另一實施例之導光板300’的示意圖。請參照圖4,在另一實施例中,導光板300’的形成方法更包括於相對於表面S2上靠近入光面S6的位置製作楔形部320’,其中楔形部320’的厚度T2’隨著遠離入光面S6的方向而遞減,且入光面S6相對於入光面S4。另外,導光板300’的形成方法還包括利用模具100(繪示於圖1A至圖1I)於透光基板310的入光面S6上形成入光部330’,且入光部330’與楔形部320’連接。亦即,導光板300’為一雙側入光的導光板。詳言之,導光板300’之靠近楔形部320與320’的兩側可分別配置如圖3所示的光源610,且亦可於導光板300’靠近表面S3的一側配置圖3的光學元件620(例如為反射片)。類似地,本實施例之導光板300’在靠近械形部320與320’的厚度T3與T3’較大,故導光板300’適於搭配較厚度較大的光源610,從而使採用導光板300’的背光模組能提供高均勻度且高亮度的面光源。由於導光板300’之楔形部320’與入光部330’的製作方式可參照圖1A至圖1I的相關敘述推知,故在此不再贅述。Fig. 4 is a schematic view of a light guide plate 300' according to another embodiment of the present invention. Referring to FIG. 4, in another embodiment, the method for forming the light guide plate 300' further includes forming a wedge portion 320' relative to the surface S2 near the light incident surface S6, wherein the thickness T2' of the wedge portion 320' follows The direction away from the light incident surface S6 is decreased, and the light incident surface S6 is opposite to the light incident surface S4. In addition, the method for forming the light guide plate 300 ′ further includes forming the light incident portion 330 ′ on the light incident surface S6 of the transparent substrate 310 by using the mold 100 (shown in FIGS. 1A to 1I ), and the light incident portion 330 ′ and the wedge shape. The part 320' is connected. That is, the light guide plate 300' is a light guide plate with double side light entrance. In detail, the light source 610 shown in FIG. 3 can be respectively disposed on the two sides of the light guide plate 300' adjacent to the wedge portions 320 and 320', and the optical light of FIG. 3 can also be disposed on the side of the light guide plate 300' near the surface S3. Element 620 (eg, a reflective sheet). Similarly, the light guide plate 300' of the present embodiment is larger than the thicknesses T3 and T3' of the mechanical portions 320 and 320', so that the light guide plate 300' is adapted to match the light source 610 having a relatively large thickness, thereby using the light guide plate. The 300' backlight module provides a high uniformity and high brightness surface source. The manner of making the wedge portion 320' and the light incident portion 330' of the light guide plate 300' can be inferred from the related description of FIGS. 1A to 1I, and thus will not be described herein.
綜上所述,本發明之實施例包括以下優點或功效之至少其中之一。由於本發明之實施例之導光板的製作方法係在透光基板之第一表面上靠近第一入光面的位置製作第一楔形部,故能使導光板在靠近楔形部之處有較大的厚度。因此,上述之導光板的入光側能配置較厚度較大的光源,從而能避免習知薄型導光板因使用薄型光源之出光效能低落的問題。In summary, embodiments of the invention include at least one of the following advantages or benefits. Since the method for fabricating the light guide plate according to the embodiment of the present invention is to form the first wedge portion on the first surface of the transparent substrate near the first light incident surface, the light guide plate can be larger near the wedge portion. thickness of. Therefore, the light-incident side of the light guide plate can be disposed with a light source having a relatively large thickness, so that the problem that the light-emitting performance of the thin light-guide plate is lowered due to the use of the thin-type light source can be avoided.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.
說明書和申請專利範圍中提及的“第一”、“第二”、....僅用以命名元件的名稱,並非用來限制元件數量上的上限或下限。The terms "first", "second", "." used in the specification and claims are merely used to name the elements and are not intended to limit the upper or lower limits of the number of elements.
100...模具100. . . Mold
110...第一部分模仁110. . . The first part of the mold
120...第二部份模仁120. . . The second part of the mold
130...容置空間130. . . Housing space
200...出膠噴嘴200. . . Glue nozzle
300、300’...導光板300, 300’. . . Light guide
310...透光基板310. . . Light transmissive substrate
320、320’...楔形部320, 320’. . . Wedge
330、330’...入光部330, 330’. . . Light entering department
332...光學微結構332. . . Optical microstructure
400...夾具400. . . Fixture
500...光500. . . Light
600...背光模組600. . . Backlight module
610...光源610. . . light source
612...發光區域612. . . Luminous area
620...光學元件620. . . Optical element
M1...材料M1. . . material
M2...脫模劑M2. . . Release agent
S1...接觸表面S1. . . Contact surface
S2、S3...表面S2, S3. . . surface
S4、S6...入光面S4, S6. . . Glossy surface
S5...迎光面S5. . . Bright side
T1~T5、T2’、T3’...厚度T1~T5, T2', T3'. . . thickness
G1...間距G1. . . spacing
L...對角線L. . . diagonal
圖1A至圖1I為本發明一實施例之導光板的製作方法的示意圖。1A to 1I are schematic views showing a method of fabricating a light guide plate according to an embodiment of the present invention.
圖2為圖1F之透光基板的表面S2的俯視示意圖。2 is a top plan view of the surface S2 of the light-transmitting substrate of FIG. 1F.
圖3為本發明一實施例之背光模組的示意圖。FIG. 3 is a schematic diagram of a backlight module according to an embodiment of the invention.
圖4為本發明另一實施例之導光板的示意圖。4 is a schematic view of a light guide plate according to another embodiment of the present invention.
100...模具100. . . Mold
110...第一部分模仁110. . . The first part of the mold
120...第二部份模仁120. . . The second part of the mold
130...容置空間130. . . Housing space
300...導光板300. . . Light guide
310...透光基板310. . . Light transmissive substrate
320...楔形部320. . . Wedge
330...入光部330. . . Light entering department
400...夾具400. . . Fixture
500...光500. . . Light
M1...材料M1. . . material
S2、S3...表面S2, S3. . . surface
S4...入光面S4. . . Glossy surface
T2...厚度T2. . . thickness
G1...間距G1. . . spacing
Claims (20)
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TW100125604A TWI439744B (en) | 2011-07-20 | 2011-07-20 | Method of manufacturing light guide plate |
CN201210206980.1A CN102890305B (en) | 2011-07-20 | 2012-06-21 | Method for manufacturing light guide plate |
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Cited By (1)
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US9776360B2 (en) | 2013-05-24 | 2017-10-03 | Coretronic Corporation | Transfer printing apparatus and manufacturing method of light guiding film |
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CN100500410C (en) * | 2003-07-26 | 2009-06-17 | 鸿富锦精密工业(深圳)有限公司 | Light guiding plate mould and its mould core |
TW200519320A (en) * | 2003-09-09 | 2005-06-16 | Mitsubishi Rayon Co | Plane light source apparatus, light guiding device for use therein and manufacturing method thereof |
CN100376951C (en) * | 2003-11-29 | 2008-03-26 | 鸿富锦精密工业(深圳)有限公司 | Light conducting plate ejection and shaping module |
CN200981328Y (en) * | 2006-11-29 | 2007-11-28 | 台湾奈普光电科技股份有限公司 | Light guiding plate forming device |
CN201072452Y (en) * | 2006-11-30 | 2008-06-11 | 台湾奈普光电科技股份有限公司 | Mold insert structure of light conducting plate and light conducting plate structure formed by the same |
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US9776360B2 (en) | 2013-05-24 | 2017-10-03 | Coretronic Corporation | Transfer printing apparatus and manufacturing method of light guiding film |
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