TW201302353A - High-performance chip discharge lower cover board - Google Patents

Abstract

A high-performance chip discharge lower cover board includes a substrate layer, a resin layer made of a resin material and formed on a surface of the substrate layer, and a protective layer formed on a surface of the resin layer. When a multi-layer printed circuit board (PCB) is drilled, the PCB is situated on a surface of the protective layer of the lower cover board, and an upper cover board is covered onto a surface of the PCB, so that the PCB is positioned between the lower cover board and the upper cover board to allow a drill bit to move from the top of the upper cover board towards the lower cover board, and a cutting portion at a front end of the drill bit drills through the upper cover board and the PCB sequentially. When the cutting portion is drilling the resin layer of the lower cover board, the resin material of the resin layer drops into a chip discharge groove in the drill bit and moves from the cutting portion at the front end of the drill bit towards a shank at rear to achieve the effects of lubricating the chip discharge groove, increasing the chip discharge speed of the chip discharge groove, improving the drilling quality of the PCB, and extending the life of the drill bit.

Description

High chipping composite bottom cover

The utility model relates to a high chip-removing composite bottom cover plate, in particular to a composite bottom cover plate which can be used in the process of drilling a circuit board to increase the effect of the chip removing chip to avoid chipping or broken needle.

In recent years, with the rapid development of electronic technology, many high-tech electronics industries have emerged. Various electronic products have at least one printed circuit board (PCB), which is composed of many electronic components and circuit boards, and the circuit board The function is to mount and electrically connect the electronic components so that the electronic components can be electrically connected to each other. However, when drilling the circuit board, the same processing time increases the number of layers and thickness of the drill to increase the output. It has become the focus of improvement, so the problem of the amount of chip waste, heat, needle breakage and accuracy generated at the same time is a problem that is easy to see.

Referring to the eighth figure, it can be clearly seen from the figure that the conventional circuit board D is stacked on the upper surface of the bottom cover A when the drilling process is performed, and at the top. An upper cover plate B is disposed on the surface of the circuit board D, so that the plurality of circuit boards D are positioned between the bottom cover plate A and the upper cover plate B, and a lubricating layer C is disposed on the surface of the upper cover plate B, so that the drill pin E is The cover B moves toward the bottom cover A, and when the circuit board D is drilled, the lubricating layer C can infiltrate the drill E and accelerate the chip removal effect of the drill E to avoid the problem of chipping. Broken needles, or holes made by the drill E on the board D, are poor, but this has the following drawbacks:

1. When the drilling needle E starts, the debris cut by the drilling needle E has a short path for discharging the surface of the upper cover B, so the debris will be quickly discharged, and the problem of chipping is not easily caused. However, at the end of the drilling process, the debris cut by the drill needle E needs a long path to be discharged to the surface of the upper cover B. At this time, the problem of chipping is most likely to occur, but only the drill pin E When passing through the lubricating layer C, the effect of infiltration is generated. Therefore, during the drilling process, the front end of the drilling pin E is continuously discharged due to the debris, so that the wetting effect is reduced or even failed, so during the drilling process, the drilling needle E The actual infiltration effect is only produced when the drill needle E is close to the upper cover B, and at the end of the drilling process, the drill needle E is far away from the upper cover B and hardly produces any effect of accelerating chip evacuation. It is still very easy to cause problems such as chipping and broken needles. Therefore, the user often reduces the number of stacked boards D to avoid the occurrence of such a situation, thereby reducing the cutting amount of the drill E and shortening the chip removal path. This reduces the processing yield.

2. During the drilling process of the circuit board D, in order to avoid the dirt on the surface of the circuit board D, the circuit board D is subjected to the decontamination process after the processing is completed, so the lubricating layer C can only be disposed on the upper cover. The surface of the B prevents the lubricating layer C from coming into contact with the surface of the circuit board D. Therefore, the user must pay attention to the direction in which the upper cover B is placed, which causes inconvenience to the user.

Therefore, how to solve the above-mentioned shortcomings and shortcomings of the prior art is the subject that the relevant industry players are eager to solve.

The main purpose of the present invention is to effectively avoid the problem of chipping during the drilling process, thereby prolonging the service life of the drill and increasing the yield of the product.

In order to achieve the above object, the bottom cover of the present invention is provided with a substrate layer, the upper surface of the substrate layer has a resin layer made of a resin material, and the surface of the resin layer is provided with a protective layer; when a plurality of stacked circuit boards are drilled When the hole is processed, the circuit board is placed on the surface of the protective layer of the bottom cover, and the upper cover plate is covered on the surface of the circuit board, so that the circuit board is positioned between the bottom cover and the upper cover, so that the drill is provided by the upper cover The upper portion moves toward the bottom cover plate, so that the cutting portion at the front end of the drill needle sequentially drills through the upper cover plate and the circuit board, and when the cutting portion is drilled to the resin layer of the bottom cover plate, the resin of the resin layer is at the burr In the chip flute, the cutting portion of the front end of the drill needle flows toward the shank portion of the rear end, thereby lubricating the flute groove, increasing the chip removal speed of the flute groove, improving the drilling quality of the circuit board and prolonging the life of the drill pin.

Referring to the first figure, it can be clearly seen from the figure that the bottom cover 1 of the preferred embodiment of the present invention is provided with a substrate layer 11 having a resin layer made of a resin material. 12, the surface of the resin layer 12 and the lower surface of the substrate layer 11 are provided with a protective layer 13, and the total thickness of the bottom cover 1 can be adjusted according to requirements, generally between 0.2mm and 4.0mm, wherein: the substrate layer 11 can be epoxy resin (Epoxy), phenolic resin (Phenolic), vinyl acetate (EVAc), polyvinyl alcohol (PVA), acrylic (Acrylic) and other resins and reinforcing materials or pulp, wood pulp, wood chips, etc. Or the substrate material of the pressed synthetic type may be mixed, and the reinforcing material may be paper fiber, glass fiber, cotton fiber, polymer fiber or the like, and the thickness of the substrate layer 11 is between 0.1 mm and 2.5 mm.

The resin layer 12 may be an epoxy resin (Epoxy) and a copolymer thereof with a polyol resin, a phenol resin (Phenolic), a polyethylene (PE), a polypropylene (PP), a polyester resin (PET) and a sulfonated resin thereof. , polyurethane (PU), vinyl acetate (EVAc), polyvinyl alcohol (PVA), acrylic (Acrylic) resin or polyol resin (Polyol), such as polypropylene glycol, polyethylene glycol and copolymerization thereof At least one of a copolymer of an object and an epoxy resin, and the like, and the thickness of the resin layer 12 is from 5 μm to 200 μm.

The protective layer 13 can be paper, rolled aluminum foil or aluminum foil, polyester film, polypropylene film (OPP film), polyethylene film (PE film) and other polymer film. (Polymer film) and so on.

Please refer to the first to third figures at the same time. It can be clearly seen from the first figure and the second figure that the bottom cover 1 of the present invention is prepared by laminating the resin layer 12 first. Applying or bonding to the upper surface of the substrate layer 11, and then placing the protective layer 13 on the surface of the resin layer 12 and the lower surface of the substrate layer 11, respectively, and adhering to each other to form the bottom cover 1; As can be seen from the third figure, in the preparation of the bottom cover 1 of the present invention, the resin layer 12 may be attached to the surface of the protective layer 13 by lamination, coating or bonding, and then the resin is attached. The protective layer 13 of the layer 12 is placed on the upper surface of the substrate layer 11, and the resin layer 12 is pressed against the upper surface of the substrate layer 11 by pressing, and the protective layer 13 is pressed against the lower surface of the substrate layer 11 to form the bottom cover. 1.

Referring to the fourth and fifth figures, when the circuit board 2 is drilled by the drill 4, the plurality of stacked circuit boards 2 are placed on the surface of the protective layer 13 of the bottom cover 1 and on the circuit board. 2 The surface covers the upper cover 3 so that the circuit board 2 is positioned between the bottom cover 1 and the upper cover 3, and the front end of the drill 4 has a cutting portion 41, the rear end has a shank portion 42, and the bur 4 The outer edge is recessed with a chip flute 43 which is spirally extended from the cutting portion 41 to the shank portion 42. When the boring needle 4 is drilled, the burr 4 will be moved from above the upper cover 3 toward the bottom cover. The plate 1 is moved so that the cutting portion 41 at the front end of the drill pin 4 sequentially drills through the upper cover 3 and the circuit board 2, and a predetermined hole is drilled in the circuit board 2, and when the cutting portion 41 is drilled through the circuit board 2 In order to continue to pass the cutting portion 41 of the drill 4 through the protective layer 13 of the bottom cover 1 and the resin layer 12, the resin of the resin layer 12 is placed in the chip flute 43 of the drill 4, and the front end of the drill 4 The cutting portion 41 flows toward the shank portion 42 at the rear end, thereby lubricating the chip flutes 43 and increasing the chip removal speed of the flutes 43.

Referring to the sixth and seventh figures, it can be clearly seen from the figure that the bottom cover 1 of the preferred embodiment of the present invention is provided with a substrate layer 11, and the upper and lower surfaces of the substrate layer 11 are respectively made of resin. The resin layer 12 made of the material is provided with a protective layer 13 on the surface of each of the resin layers 12, and the burr 4 only breaks the protective layer 13 and the resin layer 12 of the bottom cover 1 near the side surface of the drill 4 The substrate layer 11 of the bottom cover 1 is drilled. Therefore, when the protective layer 13 and the resin layer 12 on the surface of the bottom cover 1 are used up, the bottom cover 1 can be used on the reverse side.

Therefore, the present invention can solve the deficiencies and shortcomings of the prior art, and can improve the efficiency. The key technologies are:

1. When the drill bit 4 starts to perforate the circuit board 2, at the beginning of the drilling process, the debris cut by the cutting portion 41 of the drill pin 4 is discharged from the chip flute 43 to the surface of the upper cover 3, and the path is short. Therefore, the debris is quickly discharged, and the problem of chipping is less likely to occur, but at the end of the drilling process, the debris cut by the cutting portion 41 of the drill needle 4 is discharged from the chip flute 43 to the upper cover 3 The surface requires a long path and is liable to cause chipping. However, since the bottom cover 1 of the present invention is provided with the resin layer 12, the resin layer 12 is cut by the cutting portion 41 at the end of the drilling process. The resin of the resin layer 12 is caused to flow in the chip flute 43 of the drill needle 4, and the cutting portion 41 at the front end of the drill needle 4 flows toward the shank portion 42 at the rear end, thereby lubricating the chip flute 43 and increasing the chip flute 43. The chip removal speed is effective to avoid the problem of chipping, thereby prolonging the service life of the drill pin, and the heat generated by the drilling can be accelerated away from the drill pin 4 by the resin to reduce the accumulation of local high heat.

2. Since the bottom cover 1 is in the process of drilling, the substrate layer 11 is not drilled by the drill 4, but can be turned over. Therefore, the upper and lower surfaces of the substrate layer 11 can be provided with a resin layer 12, and the bottom cover is provided. 1 can be turned over for user convenience.

3. The present invention is to isolate the moisture in the air by the protective layer 13 provided on the bottom cover 1 so that the substrate layer 11 is not deformed by absorbing moisture, and the bottom cover 1 cannot be used. User-friendly for storage.

1. . . Bottom cover

11. . . Substrate layer

12. . . Resin layer

13. . . The protective layer

2. . . Circuit board

3. . . Upper cover

4. . . Drill

41. . . Cutting part

42. . . Knife handle

43. . . Chip flute

A. . . Bottom cover

B. . . Upper cover

C. . . Lubricating layer

D. . . Circuit board

E. . . Drill

The first figure is a side cross-sectional view of a preferred embodiment of the invention.

The second drawing is a schematic diagram (1) of the preferred embodiment of the present invention at the time of preparation.

The third figure is a schematic diagram (2) of the preferred embodiment of the present invention at the time of preparation.

The fourth figure is a schematic diagram (1) of the action of the preferred embodiment of the present invention in use.

The fifth figure is a schematic diagram of the action of the preferred embodiment of the present invention in use (2).

Figure 6 is a side cross-sectional view showing still another preferred embodiment of the present invention.

Figure 7 is a schematic view of the action of the preferred embodiment of the present invention in use.

The eighth figure is a schematic diagram of the operation of the prior art.

1. . . Bottom cover

11. . . Substrate layer

12. . . Resin layer

13. . . The protective layer

Claims (5)

A high chip-removing composite bottom cover, wherein the bottom cover is provided with a substrate layer, the upper surface of the substrate layer is a resin layer made of a resin material, and the surface of the resin layer is provided with a protective layer; When the board is drilled, the circuit board is placed on the surface of the protective layer of the bottom cover, and the upper cover plate is covered on the surface of the circuit board, so that the circuit board is positioned between the bottom cover and the upper cover, so that the drilling pin Moving from above the upper cover toward the bottom cover, the cutting portion of the front end of the drill is sequentially drilled through the upper cover and the circuit board, and a predetermined hole is drilled in the circuit board, and when the cutting portion is drilled to the bottom cover In the resin layer, the resin of the resin layer flows in the chip flute of the drill needle, and the cutting portion of the front end of the drill needle flows toward the shank portion of the rear end, thereby lubricating the flute groove and increasing the chip removing speed of the flute groove. Improve the drilling quality of the board and extend the life of the bur. The high chip-removing composite bottom cover according to claim 1, wherein the resin layer is epoxy resin (Epoxy) and a copolymer thereof with a polyol resin, a phenol resin (Phenolic), a polyethylene (PE), polypropylene (PP), polyester resin (PET) and its sulfonated resin, polyurethane (PU), vinyl acetate (EVAc), polyvinyl alcohol (PVA), acrylic (Acrylic) resin or Polyol resin (Polyol). The high chip-removing composite bottom cover according to claim 1, wherein the lower surface of the substrate layer is provided with a protective layer. A high chip-removing composite bottom cover, wherein the bottom cover is provided with a substrate layer, and the upper and lower surfaces of the substrate layer respectively have a resin layer made of a resin material, and the surface of each resin layer is respectively provided with a protective layer; When the circuit board is drilled, the circuit board is placed on the surface of the protective layer of the bottom cover, and the upper cover plate is covered on the surface of the circuit board, so that the circuit board is positioned between the bottom cover and the upper cover, so that The drill needle moves from above the upper cover plate toward the bottom cover plate, so that the cutting portion at the front end of the drill needle sequentially drills through the upper cover plate and the circuit board, and the predetermined hole is drilled on the circuit board, and when the cutting portion is drilled to the bottom When the resin layer of the cover layer is formed, the resin of the resin layer flows in the chip flute of the drill needle, and the cutting portion of the front end of the drill needle flows toward the shank portion of the rear end, thereby lubricating the flute groove and increasing the row of the flute groove. Chip speed, improve the drilling quality of the board and extend the life of the needle. The high chip-removing composite bottom cover according to claim 4, wherein the resin layer is epoxy resin (Epoxy) and copolymer with polyol resin, phenolic resin (Phenolic), polyethylene (PE), polypropylene (PP), polyester resin (PET) and its sulfonated resin, polyurethane (PU), vinyl acetate (EVAc), polyvinyl alcohol (PVA), acrylic (Acrylic) resin or Polyol resin (Polyol).