TW201300754A - Airtight inspection jig apparatus - Google Patents
Airtight inspection jig apparatus Download PDFInfo
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- TW201300754A TW201300754A TW100121429A TW100121429A TW201300754A TW 201300754 A TW201300754 A TW 201300754A TW 100121429 A TW100121429 A TW 100121429A TW 100121429 A TW100121429 A TW 100121429A TW 201300754 A TW201300754 A TW 201300754A
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Abstract
Description
本發明係關於一種氣密檢驗治具設備，特別是指一種用於檢測待測物是否有達到氣密規格要求之氣密檢驗設備。The invention relates to a gas-tight inspection fixture device, in particular to a gas-tight inspection device for detecting whether an object to be tested meets the requirements of airtight specifications.
一般對電路板進行測試時，必須於待測基板與測試儀之間形成一介面，以使待測基板電性連接到測試儀上，故測試人員將會使用一種介面裝置(Pin Block)來與待測基板上之接觸點接觸，並且透過測試針及其他元件使基板與PCB形成電性連接，進而將信號從測試儀經由PCB傳送到基板中，或將信號從基板傳送到測試儀中，以對基板上的電路進行偵測，而進行檢測電路板之前，該介面裝置必須能夠與該待測基板上之接觸點緊密結合，因此製造廠商為了能夠達到緊密結合之測試條件，會先進行抽真空處理，以將該介面裝置緊密結合於該待測基板上；由上述可知，該介面裝置的封裝氣密性將是非常重要，故出廠前必須進行測試封裝氣密性，因此，若能夠提供一種用於檢測介面裝置是否有達到氣密規格要求之氣密檢驗設備，如此應為一最佳解決方案。Generally, when testing a circuit board, an interface must be formed between the substrate to be tested and the tester to electrically connect the substrate to be tested to the tester, so the tester will use an interface device (Pin Block) to Contact points on the substrate to be tested are contacted, and the substrate is electrically connected to the PCB through the test pin and other components, thereby transmitting signals from the tester to the substrate via the PCB, or transmitting signals from the substrate to the tester to The circuit on the substrate is detected, and before the circuit board is inspected, the interface device must be able to be closely coupled with the contact point on the substrate to be tested, so that the manufacturer first performs vacuuming in order to achieve tightly coupled test conditions. Processing, the interface device is tightly coupled to the substrate to be tested; as can be seen from the above, the airtightness of the package of the interface device is very important, so the test package must be airtight before leaving the factory. It is an optimal solution for detecting whether the interface device has an airtight inspection device that meets the requirements of airtightness.
本發明之目的即在於提供一種氣密檢驗治具設備，係為一種能夠檢測待測物是否有達到氣密規格要求之氣密檢驗設備。The object of the present invention is to provide an airtight inspection jig device which is an airtight inspection device capable of detecting whether an object to be tested has met the requirements of airtightness specifications.
可達成上述發明目的之氣密檢驗治具設備，係包含了一氣密式蓋體、一氣密裝置及一壓力感測計，其中該氣密式蓋體係配置有一可與待測物規格相符、並覆蓋於待測物上之氣密空間，以使該待測物能夠完全被密合於該氣密空間內，另外該氣密裝置係包含有一相接至該氣密式蓋體之氣管、一真空幫浦及一真空壓力表，其中該氣管一端係與該真空幫浦及該真空壓力表相連接，而該氣管另一端則相接於該氣密式蓋體，因此當該真空幫浦向該氣密空間進行抽真空時，即可藉由該真空壓力表以及與該氣密式蓋體之氣密空間相接之壓力感測計，進行交互比對判斷該待測物是否有達到氣密規格之要求。The airtight inspection fixture device capable of achieving the above object includes an airtight cover, an airtight device and a pressure sensor, wherein the airtight cover system is configured to conform to the specifications of the object to be tested, and Covering the airtight space on the object to be tested, so that the object to be tested can be completely adhered to the airtight space, and the airtight device includes a gas pipe connected to the airtight cover, a vacuum pump and a vacuum pressure gauge, wherein one end of the gas pipe is connected to the vacuum pump and the vacuum pressure gauge, and the other end of the gas pipe is connected to the gas-tight cover body, so when the vacuum pump is directed When the airtight space is evacuated, the vacuum pressure gauge and the pressure sensor connected to the airtight space of the airtight cover body can be used for interactive comparison to determine whether the object to be tested has reached gas. Requirements for dense specifications.
更具體的說，所述氣密裝置之氣管與該真空幫浦之間係能夠設置一控制開關，用以控制該真空幫浦是否抽取真空。More specifically, a control switch can be disposed between the air pipe of the airtight device and the vacuum pump to control whether the vacuum pump draws a vacuum.
更具體的說，本發明更包括有一支撐座，該支撐座具有一可供待測物插置之連接端。More specifically, the present invention further includes a support base having a connection end into which the object to be tested is inserted.
更具體的說，所述氣密式蓋體亦能夠取代為一氣密式罩體，該氣密式罩體係能夠將該待測物罩蓋於該氣密式罩體之氣密空間內。More specifically, the hermetic cover can also be replaced by a hermetic cover that can cover the object to be tested in the airtight space of the airtight cover.
有關於本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之較佳實施例的詳細說明中，將可清楚的呈現。本發明之實施例為一種固定式氣密檢測設備，實際上，該氣密檢測設備之型態並不以此二實施範例為限，應參照申請專利範圍為主。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The embodiment of the present invention is a fixed airtight detecting device. Actually, the type of the airtight detecting device is not limited to the second embodiment, and the scope of the patent application should be mainly referred to.
請參閱圖一A、圖一B、圖二及圖三，為本發明氣密檢驗治具設備之第一實施立體組合結構圖、第一實施立體分解結構圖、待測物與支撐座連接示意圖及待測物與氣密式蓋體連接示意圖，由圖中可知，該氣密檢驗治具設備係包含：一氣密式蓋體1，係配置有一可與待測物2規格相符、並覆於待測物2上之氣密空間11，使該待測物2能夠完全被密合於該氣密空間11內。上述所指與待測物規格相符，該規格係泛指該氣密空間11與待測物之平面面積、立體體積或是形體形貌大致相符的狀況，讓待測物能夠形成待測試的狀態。Referring to FIG. 1A, FIG. 1B, FIG. 2 and FIG. 3, the first embodiment of the airtight inspection fixture device of the present invention is a three-dimensional composite structure diagram, a first embodiment three-dimensional exploded structure diagram, and a connection diagram between the object to be tested and the support base. And a schematic diagram of the connection between the object to be tested and the airtight cover body. As can be seen from the figure, the airtight test fixture device comprises: a gas-tight cover body 1 configured to conform to the specifications of the object to be tested 2 and covered with The airtight space 11 on the object 2 is such that the object 2 can be completely adhered to the airtight space 11. The above-mentioned reference is consistent with the specification of the object to be tested, and the specification generally refers to a condition that the airtight space 11 substantially conforms to the plane area, the volume of the object, or the shape of the object to be tested, so that the object to be tested can form a state to be tested. .
一氣密裝置，係包含有一相接至該氣密式蓋體1之氣管31、一真空幫浦32及一真空壓力表33，其中該氣管31一端係與該真空幫浦32及該真空壓力表33相連接，而該氣管31另一端則相接於該氣密式蓋體1，並藉由該真空幫浦32向該氣密式蓋體1之氣密空間11中進行抽氣；以及一壓力感測計4，係與該氣密式蓋體1之氣密空間11相接，用以判斷該氣密空間11內之壓力指數。An airtight device includes a gas pipe 31 connected to the airtight cover 1, a vacuum pump 32 and a vacuum pressure gauge 33, wherein the end of the gas pipe 31 is connected to the vacuum pump 32 and the vacuum pressure gauge 33 is connected, and the other end of the air pipe 31 is connected to the airtight cover 1, and the vacuum pump 32 is pumped into the airtight space 11 of the airtight cover 1; The pressure sensor 4 is in contact with the airtight space 11 of the airtight cover 1 for determining the pressure index in the airtight space 11.
因此當該待測物2固定於一支撐座5上時(如圖二所示)，由於該支撐座5係具有一可供待測物2插置之連接端51，故將該待測物2插置於該連接端51上後，可再將該氣密式蓋體1覆於該待測物2上(如圖三所示)，以使該待測物2能夠完全被密合於該氣密式蓋體1之氣密空間11內；接著，再由該氣密裝置之真空幫浦31及氣管32向該氣密式蓋體1之氣密空間11抽真空，而該真空壓力表33係會顯示出抽取之氣壓數據，同時該壓力感測計4亦會顯示出該氣密式蓋體1之氣密空間11內壓力變化數據，故能夠再將該真空壓力表33及該壓力感測計4所顯示之數據進行交互比對，用以確認該待測物2是否有達到氣密規格之要求；其中若是該真空壓力表33顯示數據為-80~-90，而該壓力感測計4顯示數據為-80~-90，在一定的數據誤差範圍內，可判斷該待測物2的確有達到氣密規格之要求；反之，若該真空壓力表33顯示數據為-20，而該壓力感測計4顯示數據為-80，則可判斷出該待測物2之氣密性明顯不足，故該待測物2沒有達到氣密規格之要求。Therefore, when the object to be tested 2 is fixed on a support base 5 (as shown in FIG. 2), since the support base 5 has a connection end 51 for inserting the object to be tested 2, the object to be tested is After being inserted into the connecting end 51, the airtight cover 1 can be overlaid on the object to be tested 2 (as shown in FIG. 3), so that the object to be tested 2 can be completely adhered to The airtight space 11 of the hermetic cover 1 is inside; then, the vacuum pump 31 and the air pipe 32 of the airtight device are vacuumed to the airtight space 11 of the airtight cover 1, and the vacuum pressure is applied. Table 33 shows the extracted air pressure data, and the pressure sensor 4 also displays the pressure change data in the airtight space 11 of the airtight cover 1, so that the vacuum pressure gauge 33 and the vacuum pressure gauge 33 can be The data displayed by the pressure sensor 4 is interactively compared to confirm whether the object to be tested 2 meets the requirements of the airtight specification; wherein if the vacuum pressure gauge 33 displays the data as -80~-90, the pressure The sensor 4 shows that the data is -80~-90. Within a certain data error range, it can be judged that the object to be tested 2 does meet the requirements of the airtight specification; otherwise, if the vacuum The force table 33 shows that the data is -20, and the pressure sensor 4 shows that the data is -80, it can be judged that the airtightness of the object to be tested 2 is obviously insufficient, so the object to be tested 2 does not reach the airtight specification. Claim.
值得一提的是，該氣密裝置之氣管31係與該真空幫浦32之間係能夠設置一控制開關34，用以控制該真空幫浦32是否抽取真空。It is worth mentioning that a control switch 34 can be disposed between the air tube 31 of the airtight device and the vacuum pump 32 for controlling whether the vacuum pump 32 draws a vacuum.
值得一提的是，該待測物2之表面係具有一環狀凹槽21，而該環狀凹槽21上係能夠套設一膠環，用以加強待測物2於該氣密空間11內之密合程度。It is worth mentioning that the surface of the object to be tested 2 has an annular groove 21, and the annular groove 21 can be sleeved with a rubber ring for reinforcing the object to be tested 2 in the airtight space. The degree of closeness within 11.
請參閱圖四，為本發明氣密檢驗治具設備之第二實施立體組合結構圖，由圖中可知，該氣密檢驗治具設備係包含：一氣密式罩體6，係配置有一罩蓋於待測物2上之氣密空間61，使待測物2能夠完全被密合於該氣密空間61內；一氣密裝置，係包含有一相接至該氣密式蓋體1之氣管31、一真空幫浦32及一真空壓力表33，其中該氣管31一端係與該真空幫浦32及該真空壓力表33相連接，而該氣管31另一端則相接於該氣密式罩體6，並藉由該真空幫浦32向該氣密式罩體6之氣密空間61中進行抽氣；以及一壓力感測計4，係與該氣密式罩體6之氣密空間61相接，用以判斷該氣密空間61內之壓力指數。Please refer to FIG. 4 , which is a perspective view of a second embodiment of the airtight inspection fixture device of the present invention. The airtight inspection fixture device includes a gas-tight cover 6 and a cover. The airtight space 61 on the object to be tested 2 enables the object to be tested 2 to be completely adhered to the airtight space 61; an airtight device includes a gas pipe 31 connected to the airtight cover 1 a vacuum pump 32 and a vacuum pressure gauge 33, wherein one end of the air tube 31 is connected to the vacuum pump 32 and the vacuum pressure gauge 33, and the other end of the air tube 31 is connected to the airtight cover 6. The vacuum pump 32 is pumped into the airtight space 61 of the airtight cover 6; and a pressure sensor 4 is connected to the airtight space 61 of the airtight cover 6. The connection is used to determine the pressure index in the airtight space 61.
而本實施例與第一實施之主要差異為該待測物2插置於該支撐座5之連接端51上後，該氣密式罩體6係僅會罩蓋於該待測物2上，故能夠使該待測物2位於該氣密式蓋體6之氣密空間61內。而此實施例之應用上，可將前述所指氣密式罩體6、氣管31、真空幫浦32、真空壓力表33及壓力感測計4整合於一可攜式箱體內(圖未示)，用以適應在大型半導體測試系統不易搬動的情況之下，透過可攜式箱體便利性的移動優勢，對大型半導體測試系統上的氣密零組件進行檢查，將氣密式罩體6套設在待測零組件區域，以判斷裝設在半導體測試系統上的零組件是否有達到氣密規格之要求。The main difference between the present embodiment and the first embodiment is that the airtight cover 6 is only covered on the object to be tested 2 after the object 2 is inserted into the connecting end 51 of the support base 5. Therefore, the object to be tested 2 can be placed in the airtight space 61 of the airtight cover 6. In the application of the embodiment, the aforementioned airtight cover 6, the air pipe 31, the vacuum pump 32, the vacuum pressure gauge 33 and the pressure sensor 4 can be integrated into a portable case (not shown). ), to adapt to the large-scale semiconductor test system is difficult to move, through the portable advantages of the portable case, the airtight components on the large semiconductor test system are inspected, the airtight cover Six sets are placed in the area of the component to be tested to determine whether the components mounted on the semiconductor test system meet the requirements of airtight specifications.
本發明所提供之氣密檢驗治具設備，與其他習用技術相互比較時，更具備下列優點：The airtight inspection fixture device provided by the invention has the following advantages when compared with other conventional technologies:
1. 本發明係能夠檢測介面裝置是否有達到氣密規格要求，因此能夠於介面裝置應用於半導體測試機台前，先行篩選出封裝氣密性不足的介面裝置。1. The present invention is capable of detecting whether or not the interface device meets the airtight specification. Therefore, before the interface device is applied to the semiconductor test machine, the interface device with insufficient package tightness can be screened out.
2. 本發明可用於解決大型半導體測試機台測試區之氣密性檢測。2. The invention can be used to solve the air tightness test of the test area of a large semiconductor test machine.
藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.
1．．．氣密式蓋體1. . . Airtight cover
11．．．氣密空間11. . . Airtight space
2．．．待測物2. . . Analyte
21．．．環狀凹槽twenty one. . . Annular groove
31．．．氣管31. . . trachea
32．．．真空幫浦32. . . Vacuum pump
33．．．真空壓力表33. . . Vacuum gauge
34．．．控制開關34. . . Control switch
4．．．壓力感測計4. . . Pressure sensor
5．．．支撐座5. . . Support base
51．．．連接端51. . . Connection end
6．．．氣密式罩體6. . . Airtight cover
61．．．氣密空間61. . . Airtight space
圖一A為本發明氣密檢驗治具設備之第一實施立體組合結構圖；Figure 1A is a perspective view showing the first embodiment of the airtight inspection fixture of the present invention;
圖一B為本發明氣密檢驗治具設備之第一實施立體分解結構圖；Figure 1B is a perspective exploded view showing the first embodiment of the airtight inspection fixture device of the present invention;
圖二為本發明氣密檢驗治具設備之待測物與支撐座連接示意圖；2 is a schematic view showing the connection between the object to be tested and the support base of the airtight test fixture device of the present invention;
圖三為本發明氣密檢驗治具設備之待測物與氣密式蓋體連接示意圖；以及Figure 3 is a schematic view showing the connection between the object to be tested and the hermetic cover of the airtight test fixture device of the present invention;
圖四為本發明氣密檢驗治具設備之第二實施立體組合結構圖。Figure 4 is a perspective view showing the second embodiment of the airtight test fixture of the present invention.
1．．．氣密式蓋體1. . . Airtight cover
11．．．氣密空間11. . . Airtight space
31．．．氣管31. . . trachea
32．．．真空幫浦32. . . Vacuum pump
33．．．真空壓力表33. . . Vacuum gauge
4．．．壓力感測計4. . . Pressure sensor
5．．．支撐座5. . . Support base
51．．．連接端51. . . Connection end
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100121429A TWI530673B (en) | 2011-06-20 | 2011-06-20 | Airtight inspection fixture equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100121429A TWI530673B (en) | 2011-06-20 | 2011-06-20 | Airtight inspection fixture equipment |
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| Publication Number | Publication Date |
|---|---|
| TW201300754A true TW201300754A (en) | 2013-01-01 |
| TWI530673B TWI530673B (en) | 2016-04-21 |
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| TW100121429A TWI530673B (en) | 2011-06-20 | 2011-06-20 | Airtight inspection fixture equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739992A (en) * | 2021-08-13 | 2021-12-03 | 长鑫存储技术有限公司 | Airtightness detection method for semiconductor machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739992A (en) * | 2021-08-13 | 2021-12-03 | 长鑫存储技术有限公司 | Airtightness detection method for semiconductor machine |
| CN113739992B (en) * | 2021-08-13 | 2024-03-26 | 长鑫存储技术有限公司 | Air tightness detection method for semiconductor machine |
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| Publication number | Publication date |
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| TWI530673B (en) | 2016-04-21 |
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