TW201300492A - Removable adhesive tape and manufacturing method thereof - Google Patents

Removable adhesive tape and manufacturing method thereof Download PDF

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Publication number
TW201300492A
TW201300492A TW101121401A TW101121401A TW201300492A TW 201300492 A TW201300492 A TW 201300492A TW 101121401 A TW101121401 A TW 101121401A TW 101121401 A TW101121401 A TW 101121401A TW 201300492 A TW201300492 A TW 201300492A
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weight
meth
parts
peeling
adhesive
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TW101121401A
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Chinese (zh)
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Masatsugu Higashi
Yutaka Moroishi
Shigeru Fujita
Tetsuo Inoue
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Nitto Denko Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10Definition of the polymer structure
    • C08G2261/12Copolymers
    • C08G2261/128Copolymers graft
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00Presence of graft polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00Presence of polyamide
    • C09J2477/006Presence of polyamide in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00Presence of polyamine or polyimide
    • C09J2479/08Presence of polyamine or polyimide polyimide
    • C09J2479/086Presence of polyamine or polyimide polyimide in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2481/00Presence of sulfur containing polymers
    • C09J2481/006Presence of sulfur containing polymers in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a removable adhesive tape which has with excellent heat resistance and little increase in adhesive force during removal, and which leaves no adhesive residue or contamination on the adherend. This removable adhesive tape is formed from a heat-resistant film substrate and a cured adhesive layer on one surface of said heat-resistant film substrate, wherein the cured adhesive layer is formed by photo-curing an adhesive layer formed from an adhesive composition containing 0.15-4.0 parts by weight of a photo-cationic polymerization initiator per 100 parts by weight of a graft polymer formed by graft polymerization of chains containing cyclic ether group-containing monomers onto a (meth)acrylic polymer.

Description

再剝離用黏著帶及其製造方法 Adhesive tape for peeling and manufacturing method thereof

本發明係關於一種再剝離用黏著帶及其製造方法。更詳細而言,係關於對被接著體無污染,耐熱性及再剝離性優異之再剝離用黏著帶及其製造方法。 The present invention relates to an adhesive tape for re-peeling and a method of manufacturing the same. More specifically, the adhesive tape for re-peeling which is excellent in heat resistance and re-peelability without contamination to the adherend, and a method for producing the same.

於電子設備中,使用各種基板或配線基板,於在基板上進行零件安裝、引線框架製作、焊錫加工或加熱處理時,為了保護電子零件或電路而使用遮蔽帶。於此種使用之情形時,要求於貼附遮蔽帶時,步驟上無隆起等,且於經加熱步驟等後進行剝離時接著力之上升較少,且被接著體上無糊劑殘餘或污染。 In an electronic device, various substrates or wiring boards are used, and when performing component mounting, lead frame fabrication, solder processing, or heat treatment on a substrate, a masking tape is used to protect electronic components or circuits. In the case of such use, it is required that when the masking tape is attached, there is no bulging in the step, and the peeling force is less when the peeling is performed after the heating step or the like, and there is no paste residue or contamination on the adhering body. .

對於此種要求而提出有各種提案。例如,提出有於耐熱性背襯膜層上設置使由(甲基)丙烯酸縮水甘油酯與(甲基)丙烯酸共聚而成之丙烯酸系聚合物交聯之黏著劑層的耐熱再剝離用黏著帶(專利文獻1),進而揭示有使由含有羧基之單體共聚而成之丙烯酸系聚合物藉由環氧系交聯劑進行交聯而成之黏著劑(專利文獻2)。 Various proposals have been made for such requirements. For example, it is proposed to provide an adhesive tape for heat-resistant re-peeling in which a pressure-sensitive adhesive layer obtained by crosslinking an acrylic polymer obtained by copolymerizing glycidyl (meth)acrylate and (meth)acrylic acid is provided on a heat-resistant backing film layer. (Patent Document 1) Further, an adhesive obtained by crosslinking an acrylic polymer obtained by copolymerizing a monomer having a carboxyl group by an epoxy crosslinking agent is disclosed (Patent Document 2).

先前技術文獻Prior technical literature 專利文獻Patent literature

[專利文獻1]日本專利特開2005-53975號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-53975

[專利文獻2]日本專利特開平5-163468號公報 [Patent Document 2] Japanese Patent Laid-Open No. Hei 5-163468

本發明之目的在於提供一種具有於貼附後之各種步驟中不產生隆起等之接著性,並且加熱步驟中之接著力上升較少,且被接著體上無糊劑殘餘或污染等,耐熱性優異之再剝離用黏著帶。 An object of the present invention is to provide an adhesive which does not cause bulging or the like in various steps after attachment, and which has a small increase in the adhesion force in the heating step, and which has no paste residue or contamination on the adherend, and heat resistance. Excellent adhesive tape for re-peeling.

本發明者等人為了解決上述課題而不斷努力研究,結果發現下述再剝離用黏著帶,從而完成本發明。 In order to solve the above problems, the inventors of the present invention have been working hard to find the following adhesive tape for re-peeling, and have completed the present invention.

即,本發明係關於一種再剝離用黏著帶,其係具有耐熱性膜基材及於該耐熱性膜基材之單面上設置硬化黏接著劑層而成者, 該硬化黏接著劑層係使由黏接著劑組合物形成之黏接著劑層光硬化而成者,該黏接著劑組合物係於(甲基)丙烯酸系聚合物上接枝聚合含有包含環狀醚基之單體之鏈而成的接枝聚合物100重量份中,含有光陽離子系聚合起始劑0.15~4.0重量份而成者。 That is, the present invention relates to an adhesive tape for re-peeling, which comprises a heat-resistant film substrate and a cured adhesive layer provided on one surface of the heat-resistant film substrate. The hardened adhesive layer is obtained by photohardening an adhesive layer formed of an adhesive composition, and the adhesive composition is graft-polymerized on a (meth)acrylic polymer to contain a cyclic ring. 100 parts by weight of the graft polymer of the ether group-based monomer is contained in an amount of 0.15 to 4.0 parts by weight based on the photocationic polymerization initiator.

上述黏接著劑組合物較佳為進而含有異氰酸酯系交聯劑。 The above adhesive composition preferably further contains an isocyanate crosslinking agent.

上述黏接著劑組合物可進而相對於上述接枝聚合物100重量份含有環氧樹脂及/或氧雜環丁烷樹脂5~100重量份。 The adhesive composition may further contain 5 to 100 parts by weight of the epoxy resin and/or oxetane resin with respect to 100 parts by weight of the graft polymer.

該硬化黏接著劑層之凝膠分率較佳為80~99%。 The gel fraction of the hardened adhesive layer is preferably from 80 to 99%.

上述(甲基)丙烯酸系聚合物相對於該(甲基)丙烯酸系聚合物總量可含有0.2~10重量%之包含羥基之單體作為單體單元。 The (meth)acrylic polymer may contain, as a monomer unit, 0.2 to 10% by weight of a monomer having a hydroxyl group based on the total amount of the (meth)acrylic polymer.

上述接枝聚合物可藉由於上述(甲基)丙烯酸系聚合物 100重量份上,於過氧化物0.02~5重量份之存在下接枝聚合上述包含環狀醚基之單體2~50重量份及其他單體5~50重量份而獲得。 The above graft polymer can be derived from the above (meth)acrylic polymer It is obtained by graft-polymerizing 2 to 50 parts by weight of the above-mentioned cyclic ether group-containing monomer and 5 to 50 parts by weight of the other monomer in 100 parts by weight of the peroxide in the presence of 0.02 to 5 parts by weight of the peroxide.

上述光陽離子系聚合起始劑可為光酸產生劑。 The photocationic polymerization initiator may be a photoacid generator.

上述光酸產生劑較佳為於將溶劑設為乙酸乙酯並調整成10%之濃度之情形時,不產生沈澱物而溶解。 The photoacid generator is preferably dissolved without causing a precipitate when the solvent is made into ethyl acetate and adjusted to a concentration of 10%.

上述硬化黏接著劑層於23℃下之儲存模數可為9.0×104~1.0×106 Pa。 The storage modulus of the hardened adhesive layer at 23 ° C may be 9.0 × 10 4 to 1.0 × 10 6 Pa.

上述耐熱性膜基材可選自由聚對苯二甲酸乙二酯、聚醯亞胺、芳香族聚醯胺、聚萘二甲酸乙二酯及聚苯硫醚所組成之群。 The heat resistant film substrate may be selected from the group consisting of polyethylene terephthalate, polyimide, aromatic polyamine, polyethylene naphthalate, and polyphenylene sulfide.

上述黏接著劑層之厚度可為0.5~100 μm。 The adhesive layer may have a thickness of 0.5 to 100 μm.

本發明係關於一種再剝離用黏著帶之製造方法,其係用於製造在耐熱性膜基材之單面設置硬化黏接著劑層而成之再剝離用黏著帶者,該製造方法包括: 將黏接著劑組合物塗佈於耐熱性膜基材之單面上而形成黏接著劑層之步驟,該黏接著劑組合物係於(甲基)丙烯酸系聚合物上接枝聚合含有包含環狀醚基之單體之鏈而成的接枝聚合物100重量份中,含有光陽離子系聚合起始劑0.15~4.0重量份而成者;及 對該黏接著劑層照射光而使其光硬化之步驟。 The present invention relates to a method for producing an adhesive tape for re-peeling, which is used for producing an adhesive tape for re-peeling in which a cured adhesive layer is provided on one surface of a heat-resistant film substrate, and the manufacturing method includes: The adhesive composition is applied to one surface of a heat-resistant film substrate to form an adhesive layer, and the adhesive composition is graft-polymerized on a (meth)acrylic polymer to contain a ring 100 parts by weight of the graft polymer of the monomer group of the ether group, which comprises 0.15 to 4.0 parts by weight of the photocationic polymerization initiator; The step of irradiating the adhesive layer with light to harden the light.

本發明之再剝離用黏著帶可用於電子電路基板之遮蔽用黏著帶或電子零件之暫時固定用黏著帶等。本發明之再剝 離用黏著帶係耐熱性優異,具有於各種步驟中不產生隆起等之程度之接著性,加熱步驟中之接著性不上升,尤其由於具有丙烯酸系黏著劑,故而不會附著引起電子電路之接點不良的低分子污染物而優異者。 The adhesive tape for re-peeling of the present invention can be used for an adhesive tape for shielding of an electronic circuit board or an adhesive tape for temporary fixing of an electronic component. Re-peeling of the present invention The adhesive tape is excellent in heat resistance and has an adhesiveness to such an extent that no bulging occurs in various steps, and the adhesion in the heating step does not increase, and in particular, since the acrylic adhesive is provided, the electronic circuit is not adhered. Excellent in low-molecular pollutants.

本發明之再剝離用黏著帶係具有耐熱性膜基材及於該耐熱性膜基材之單面上設置硬化黏接著劑層而成。此處,硬化黏接著劑層係使由黏接著劑組合物形成之黏接著劑層光硬化而成者,該黏接著劑組合物係於(甲基)丙烯酸系聚合物上接枝聚合含有包含環狀醚基之單體之鏈而成的接枝聚合物中,含有光陽離子系聚合起始劑0.15~4.0重量份而成者。 The adhesive tape for re-peeling of the present invention comprises a heat-resistant film substrate and a cured adhesive layer provided on one surface of the heat-resistant film substrate. Here, the hardened adhesive layer is obtained by photohardening an adhesive layer formed of an adhesive composition, and the adhesive composition is graft-polymerized on a (meth)acrylic polymer to contain The graft polymer obtained by chaining a monomer having a cyclic ether group contains 0.15 to 4.0 parts by weight of a photocationic polymerization initiator.

首先,作為(甲基)丙烯酸系聚合物所含有之單體單元,可使用任一種(甲基)丙烯酸酯,並無特別限定。此處,較佳為例如含有(甲基)丙烯酸系聚合物總體之50重量%以上的具有碳數4以上之烷基之(甲基)丙烯酸烷基酯。 First, as the monomer unit contained in the (meth)acrylic polymer, any (meth) acrylate can be used, and it is not particularly limited. Here, for example, an alkyl (meth)acrylate having an alkyl group having 4 or more carbon atoms inclusive of 50% by weight or more of the entire (meth)acrylic polymer is preferable.

於本說明書中,簡稱「(甲基)丙烯酸烷基酯」時,意指具有直鏈或分支之烷基之(甲基)丙烯酸酯。上述烷基之碳數為4以上,較佳為碳數4~9。再者,(甲基)丙烯酸酯意指丙烯酸酯及/或甲基丙烯酸酯,與本發明之(甲基)意義相同。 In the present specification, the term "alkyl (meth)acrylate" means a (meth) acrylate having a linear or branched alkyl group. The alkyl group has a carbon number of 4 or more, preferably a carbon number of 4 to 9. Further, (meth) acrylate means acrylate and/or methacrylate, and has the same meaning as (meth) of the present invention.

作為(甲基)丙烯酸烷基酯之具體例,可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基) 丙烯酸異戊酯(isopentyl(meth)acrylate)、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸異戊酯(isoamyl(meth)acrylate)、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正十四烷基酯、(甲基)丙烯酸硬脂基酯、(甲基)丙烯酸異硬脂基酯等。其中,可例示(甲基)丙烯酸正丁酯、(甲基)丙烯酸2-乙基己酯等,該等可單獨使用或組合使用。 Specific examples of the alkyl (meth)acrylate include n-butyl (meth)acrylate, second butyl (meth)acrylate, tert-butyl (meth)acrylate, and (meth)acrylic acid. Isobutyl ester, n-amyl (meth)acrylate, (methyl) Isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, isoamyl (meth)acrylate, (meth)acrylic acid 2 -ethylhexyl ester, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-decyl (meth)acrylate , isodecyl (meth)acrylate, n-dodecyl (meth)acrylate, isotetradecyl (meth)acrylate, n-tridecyl (meth)acrylate, (methyl) N-tetradecyl acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, and the like. Among them, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and the like can be exemplified, and these may be used singly or in combination.

於本發明中,上述(甲基)丙烯酸烷基酯相對於(甲基)丙烯酸系聚合物之全部單體成分為50重量%以上,較佳為80重量%以上,更佳為90重量%以上。又,雖然單體亦可全部為(甲基)丙烯酸烷基酯,但較佳為98重量%以下,亦可為97重量%以下。 In the present invention, the alkyl (meth)acrylate is 50% by weight or more, preferably 80% by weight or more, and more preferably 90% by weight or more based on the total monomer component of the (meth)acrylic polymer. . Further, although all of the monomers may be alkyl (meth)acrylate, it is preferably 98% by weight or less, and may be 97% by weight or less.

此外,本發明之(甲基)丙烯酸系聚合物中較佳為含有烷基中包含至少1個羥基的含有羥基之單體。即,該單體係含有1個以上羥基之羥烷基者。此處,羥基較佳為存在於烷基之末端。烷基之碳數較佳為4~12,更佳為4~8,進而較佳為4~6。認為藉由含有此種含有羥基之單體,對於接枝聚合時引起奪氫之位置或接枝聚合物與接枝聚合時生成之含有環狀醚基之單體的均聚物之相溶性具有較佳影響,有助於製備耐熱性良好之接枝聚合物。 Further, the (meth)acrylic polymer of the present invention preferably contains a hydroxyl group-containing monomer having at least one hydroxyl group in the alkyl group. That is, the single system contains one or more hydroxyalkyl groups of a hydroxyl group. Here, the hydroxyl group is preferably present at the end of the alkyl group. The carbon number of the alkyl group is preferably 4 to 12, more preferably 4 to 8, and further preferably 4 to 6. It is considered that by containing such a hydroxyl group-containing monomer, the compatibility of the position at which hydrogen abstraction is caused during graft polymerization or the homopolymer of the graft polymer and the monomer having a cyclic ether group formed during graft polymerization has The preferred effect is to prepare a graft polymer having good heat resistance.

作為此種單體,可無特別限制地使用含有(甲基)丙烯醯 基之具有不飽和雙鍵之聚合性官能基且具有羥基者。例如可列舉:(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸3-羥丙酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸6-羥己酯、(甲基)丙烯酸8-羥辛酯、(甲基)丙烯酸10-羥癸酯、(甲基)丙烯酸12-羥基月桂酯等(甲基)丙烯酸羥烷基酯;(甲基)丙烯酸4-羥甲基環己酯、4-羥丁基乙烯醚等。該等之中,較佳為使用(甲基)丙烯酸羥烷基酯,尤其較佳為使用(甲基)丙烯酸2-羥乙酯及(甲基)丙烯酸4-羥丁酯。 As such a monomer, (meth)acryl oxime may be used without particular limitation. A group having a polymerizable functional group having an unsaturated double bond and having a hydroxyl group. For example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (A) (6-hydroxyhexyl acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, hydroxyalkyl (meth)acrylate Ester; 4-hydroxymethylcyclohexyl (meth)acrylate, 4-hydroxybutyl vinyl ether, and the like. Among these, hydroxyalkyl (meth)acrylate is preferably used, and 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are particularly preferably used.

含有羥基之單體相對於形成(甲基)丙烯酸系聚合物之單體成分之總量,較佳為0.02重量%以上,更佳為0.05重量%以上,較佳為10重量%以下,更佳為3重量%以下。最佳為0.05重量%~3重量%。 The total amount of the hydroxyl group-containing monomer relative to the monomer component forming the (meth)acrylic polymer is preferably 0.02% by weight or more, more preferably 0.05% by weight or more, and most preferably 10% by weight or less, more preferably It is 3% by weight or less. The optimum is 0.05% by weight to 3% by weight.

除上述單體以外亦可使用含有不飽和羧酸之單體作為形成上述(甲基)丙烯酸系聚合物之單體成分。 In addition to the above monomers, a monomer containing an unsaturated carboxylic acid may be used as a monomer component for forming the above (meth)acrylic polymer.

作為含有不飽和羧酸之單體,可無特別限制地使用含有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵的聚合性官能基,且具有羧基之單體。作為含有不飽和羧酸之單體,例如可列舉:(甲基)丙烯酸、(甲基)丙烯酸羧乙酯、(甲基)丙烯酸羧戊酯、衣康酸、順丁烯二酸、反丁烯二酸、丁烯酸等。該等可單獨使用或組合使用。該等之中,較佳為使用(甲基)丙烯酸、尤其是丙烯酸。 As the monomer containing an unsaturated carboxylic acid, a monomer having a carboxyl group having a polymerizable functional group having an unsaturated double bond such as a (meth) acrylonitrile group or a vinyl group and having a carboxyl group can be used without particular limitation. Examples of the monomer containing an unsaturated carboxylic acid include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, and anti-butyl Aenedioic acid, crotonic acid, and the like. These may be used alone or in combination. Among these, (meth)acrylic acid, especially acrylic acid is preferably used.

含有不飽和羧酸之單體相對於形成(甲基)丙烯酸系聚合物之單體成分之總量,較佳為以0.01~2重量%之比例使 用,更佳為0.05~2重量%,進而較佳為0.05~1.5重量%,尤佳為0.1~1重量%。 The total amount of the monomer containing an unsaturated carboxylic acid relative to the monomer component forming the (meth)acrylic polymer is preferably 0.01 to 2% by weight. More preferably, it is 0.05 to 2% by weight, further preferably 0.05 to 1.5% by weight, and particularly preferably 0.1 to 1% by weight.

作為形成上述(甲基)丙烯酸系聚合物之單體成分,亦可於不損害本發明之目的之範圍內單獨使用或組合使用其他共聚單體。作為其他共聚單體,例如可列舉:具有碳數未達4之烷基的(甲基)丙烯酸酯或含有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵的聚合性官能基且具有芳香族環的含有芳香族環之單體。作為具有碳數未達4之烷基的(甲基)丙烯酸酯之具體例,可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯等;作為含有芳香族環之單體之具體例,可列舉:(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯、苯酚環氧乙烷改性(甲基)丙烯酸酯、(甲基)丙烯酸2-萘乙酯、(甲基)丙烯酸2-(4-甲氧基-1-萘氧基)乙酯、(甲基)丙烯酸苯氧基丙酯、苯氧基二乙二醇(甲基)丙烯酸酯、聚(甲基)丙烯酸苯乙烯酯等。 As the monomer component for forming the above (meth)acrylic polymer, other comonomers may be used singly or in combination within the range not impairing the object of the present invention. Examples of the other comonomer include a (meth) acrylate having an alkyl group having a carbon number of less than 4 or a polymerizable functional group having an unsaturated double bond such as a (meth) acrylonitrile group or a vinyl group. An aromatic ring-containing monomer having an aromatic ring. Specific examples of the (meth) acrylate having an alkyl group having a carbon number of less than 4 include methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate; Specific examples of the monomer of the aromatic ring include phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, phenol ethylene oxide modified (meth)acrylate, and (methyl). 2-naphthylethyl acrylate, 2-(4-methoxy-1-naphthalenyloxy)ethyl (meth)acrylate, phenoxypropyl (meth)acrylate, phenoxydiethylene glycol (A) Acrylate, poly(meth)acrylic acid styrene ester, and the like.

又,作為其他共聚單體,可列舉:順丁烯二酸酐、衣康酸酐等含有酸酐基之單體;丙烯酸之己內酯加成物;苯乙烯磺酸或烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含有磺酸基之單體;2-羥乙基丙烯醯基磷酸酯等含有磷酸基之單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體等。 Further, examples of the other comonomer include an acid anhydride group-containing monomer such as maleic anhydride or itaconic anhydride; a caprolactone adduct of acrylic acid; styrenesulfonic acid or allylsulfonic acid; (Methyl) acrylamide-2-methylpropanesulfonic acid, (meth)acrylamide, propanesulfonic acid, sulfopropyl (meth)acrylate, (meth)acryloxynaphthalenesulfonic acid, etc. a monomer having an acid group; a monomer having a phosphate group such as 2-hydroxyethyl acryloyl phosphate; a methoxyethyl (meth)acrylate; an ethoxyethyl (meth)acrylate; An alkoxyalkyl acrylate monomer or the like.

又,作為其他共聚單體,亦可使用:乙酸乙烯酯、丙酸 乙烯酯、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯系單體;(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸甲基縮水甘油酯、(甲基)丙烯酸3,4-環氧環己基甲酯等含有環氧基之單體;(甲基)丙烯酸聚乙二醇酯、(甲基)丙烯酸聚丙二醇酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯或丙烯酸2-甲氧基乙酯等丙烯酸酯系單體;含有醯胺基之單體、含有胺基之單體、含有醯亞胺基之單體、N-丙烯醯基啉、乙烯醚單體等。 Further, as the other comonomer, a vinyl monomer such as vinyl acetate, vinyl propionate, styrene, α-methylstyrene or N-vinyl caprolactam may be used; (meth)acrylic acid may be used. An epoxy group-containing monomer such as glycidyl ester, (meth)acrylic acid methyl glycidyl ester, (meth)acrylic acid 3,4-epoxycyclohexylmethyl ester; (meth)acrylic acid polyethylene glycol ester; Alcohol acrylate monomer such as polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate or methoxypolypropylene glycol (meth)acrylate; tetrahydrofurfuryl (meth)acrylate An acrylate monomer such as fluorine (meth) acrylate, poly methoxy (meth) acrylate or 2-methoxy ethyl acrylate; a monomer containing a guanamine group, a monomer containing an amine group, and containing Monomethylene amide monomer, N-propylene fluorenyl Porphyrin, vinyl ether monomer, and the like.

本發明之(甲基)丙烯酸系聚合物之重量平均分子量較佳為60萬以上,更佳為70萬以上200萬以下。再者,重量平均分子量係指藉由GPC(Gel Permeation Chromatography,凝膠滲透層析法)而測定並藉由聚苯乙烯換算而算出之值。 The (meth)acrylic polymer of the present invention preferably has a weight average molecular weight of 600,000 or more, more preferably 700,000 or more and 2,000,000 or less. In addition, the weight average molecular weight is a value measured by GPC (Gel Permeation Chromatography) and calculated by polystyrene conversion.

此種(甲基)丙烯酸系聚合物之製造可適當選擇溶液聚合、塊狀聚合、乳化聚合、各種自由基聚合等公知之製造方法而進行。又,所獲得之(甲基)丙烯酸系聚合物可為無規共聚物亦可為嵌段共聚物。 The production of such a (meth)acrylic polymer can be carried out by appropriately selecting a known production method such as solution polymerization, bulk polymerization, emulsion polymerization, or various radical polymerization. Further, the obtained (meth)acrylic polymer may be a random copolymer or a block copolymer.

再者,溶液聚合時例如可使用乙酸乙酯、甲苯等作為聚合溶劑。作為具體之溶液聚合例,反應可於氮氣等惰性氣體氣流下,添加聚合起始劑,通常以50~70℃左右、5~30小時左右之反應條件進行。 Further, in the solution polymerization, for example, ethyl acetate, toluene or the like can be used as the polymerization solvent. As a specific example of the solution polymerization, the reaction may be carried out under a flow of an inert gas such as nitrogen, and a polymerization initiator may be added, usually at a reaction temperature of about 50 to 70 ° C for about 5 to 30 hours.

自由基聚合所使用之聚合起始劑、鏈轉移劑、乳化劑等 並無特別限定,可適當選擇使用。再者,(甲基)丙烯酸系聚合物之重量平均分子量可根據聚合起始劑、鏈轉移劑之使用量、反應條件而控制,可根據該等之種類而調整適當之使用量。 Polymerization initiator, chain transfer agent, emulsifier, etc. used in radical polymerization It is not particularly limited and can be appropriately selected and used. Further, the weight average molecular weight of the (meth)acrylic polymer can be controlled depending on the amount of the polymerization initiator, the chain transfer agent used, and the reaction conditions, and the appropriate amount can be adjusted according to the types of the polymers.

作為聚合起始劑,例如可列舉,2,2'-偶氮二異丁腈、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮雙[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮雙(2-甲基丙脒)二硫酸鹽、2,2'-偶氮雙(N,N'-二亞甲基異丁基脒)、2,2'-偶氮雙[N-(2-羧乙基)-2-甲基丙脒]水合物(和光純藥公司製造之VA-057)等偶氮系起始劑,過硫酸鉀、過硫酸銨等過硫酸鹽,過氧化二碳酸二(2-乙基己基)酯、過氧化二碳酸二(4-第三丁基環己基)酯、過氧化二碳酸二-第二丁酯、過氧化新癸酸第三丁酯、過氧化特戊酸第三己酯、過氧化特戊酸第三丁酯、過氧化二月桂醯、過氧化二正辛醯、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯、過氧化二(4-甲基苯甲醯)、過氧化二苯甲醯、過氧化異丁酸第三丁酯、1,1-二(第三己基過氧基)環己烷、氫過氧化第三丁基、過氧化氫等過氧化物系起始劑,過硫酸鹽與亞硫酸氫鈉之組合、過氧化物與抗壞血酸鈉之組合等將過氧化物與還原劑組合而成之氧化還原系起始劑等,但並不限定於該等。 Examples of the polymerization initiator include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-amidinopropane) dihydrochloride, and 2,2'-azobis. [2-(5-Methyl-2-imidazolin-2-yl)propane] dihydrochloride, 2,2'-azobis(2-methylpropionamidine) disulfate, 2,2'- Azobis(N,N'-dimethyleneisobutylphosphonium), 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] hydrate (and pure light) An azo initiator such as VA-057) manufactured by Pharmaceutical Company, persulfate such as potassium persulfate or ammonium persulfate, di(2-ethylhexyl) peroxydicarbonate or di(dioxycarbonate) Tertiary butylcyclohexyl) ester, di-second butyl peroxydicarbonate, tert-butyl peroxy neodecanoate, third hexyl peroxypivalate, tert-butyl peroxypivalate, Dilaurin peroxide, di-n-octyl peroxide, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, bis(4-methylbenzhydryl) peroxide, Peroxides such as benzamidine oxide, tert-butyl peroxyisobutyrate, 1,1-di(trihexylperoxy)cyclohexane, tert-butyl hydroperoxide, hydrogen peroxide, etc. Starting agent, group of persulfate and sodium bisulfite , A combination of a peroxide with sodium ascorbate or the like of a peroxide with a reducing agent a combination of the redox initiator and so forth, but are not limited to such.

上述聚合起始劑可單獨使用亦可混合使用2種以上,總體之含量相對於單體成分總量100重量份,較佳為0.005~1重量份左右,更佳為0.02~0.5重量份左右。 The polymerization initiator may be used singly or in combination of two or more kinds, and the total content is preferably from 0.005 to 1 part by weight, more preferably from 0.02 to 0.5 part by weight, per 100 parts by weight of the total amount of the monomer component.

再者,例如使用2,2'-偶氮二異丁腈作為聚合起始劑而製 造上述重量平均分子量之(甲基)丙烯酸系聚合物時,聚合起始劑之使用量相對於單體成分之總量100重量份,較佳為設為0.06~0.3重量份左右,進而較佳為設為0.08~0.2重量份左右。 Further, for example, 2,2'-azobisisobutyronitrile is used as a polymerization initiator. When the (meth)acrylic polymer having a weight average molecular weight is produced, the amount of the polymerization initiator to be used is preferably from about 0.06 to 0.3 parts by weight, based on 100 parts by weight of the total of the monomer components. It is set to about 0.08 to 0.2 parts by weight.

作為鏈轉移劑,例如可列舉:月桂基硫醇、縮水甘油基硫醇、巰基乙酸、2-巰基乙醇、硫代乙醇酸、硫代乙醇酸2-乙基己酯、2,3-二巰基-1-丙醇等。鏈轉移劑可單獨使用亦可混合使用2種以上,總體之含量相對於單體成分之總量100重量份為0.1重量份左右以下。 Examples of the chain transfer agent include lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-mercaptoethanol, thioglycolic acid, 2-ethylhexyl thioglycolate, and 2,3-didecyl. -1-propanol and the like. The chain transfer agent may be used singly or in combination of two or more kinds, and the total content is about 0.1 part by weight or less based on 100 parts by weight of the total of the monomer components.

又,作為乳化聚合之情形時所使用之乳化劑,例如可列舉:月桂基硫酸鈉、月桂基硫酸銨、十二烷基苯磺酸鈉、聚氧乙烯烷基醚硫酸銨、聚氧乙烯烷基苯醚硫酸鈉等陰離子系乳化劑,聚氧乙烯烷基醚、聚氧乙烯烷基苯醚、聚氧乙烯脂肪酸酯、聚氧乙烯-聚氧丙烯嵌段聚合物等非離子系乳化劑等。該等乳化劑可單獨使用亦可併用2種以上。 Further, examples of the emulsifier used in the case of emulsion polymerization include sodium lauryl sulfate, ammonium lauryl sulfate, sodium dodecylbenzenesulfonate, polyoxyethylene alkyl ether sulfate, and polyoxyethylene oxide. Anionic emulsifier such as sodium phenyl ether sulfate, nonionic emulsifier such as polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, polyoxyethylene fatty acid ester, polyoxyethylene-polyoxypropylene block polymer Wait. These emulsifiers may be used alone or in combination of two or more.

進而,作為反應性乳化劑,作為導入有丙烯基、烯丙醚基等自由基聚合性官能基之乳化劑,具體而言,例如有:AQUALON HS-10、AQUALON HS-20、AQUALON KH-10、AQUALON BC-05、AQUALON BC-10、AQUALON BC-20(以上均為第一工業製藥公司製造)、ADEKA REASOAP SE10N(ADEKA公司製造)等。由於反應性乳化劑會於聚合後併入聚合物鏈中,故而耐水性提高而較佳。乳化劑之使用量相對於單體成分之總量100重量份為0.3~5重量份,就聚合穩定性或機械穩定性而言更佳為0.5~1重 量份。 Further, as the reactive emulsifier, as an emulsifier to which a radical polymerizable functional group such as a propenyl group or an allyl ether group is introduced, specifically, for example, AQUALON HS-10, AQUALON HS-20, AQUALON KH-10 AQUALON BC-05, AQUALON BC-10, AQUALON BC-20 (all of which are manufactured by First Industrial Pharmaceutical Co., Ltd.), ADEKA REASOAP SE10N (manufactured by Adeka Co., Ltd.), and the like. Since the reactive emulsifier is incorporated into the polymer chain after polymerization, the water resistance is improved and is preferred. The amount of the emulsifier used is 0.3 to 5 parts by weight based on 100 parts by weight of the total of the monomer components, and more preferably 0.5 to 1 weight in terms of polymerization stability or mechanical stability. Quantities.

(甲基)丙烯酸系聚合物之玻璃轉移溫度(Tg)為250 K以下,較佳為240 K以下。又,玻璃轉移溫度較佳為200 K以上。若玻璃轉移溫度為250 K以下,則會形成耐熱性良好且內部凝聚力優異之黏接著組合物。此種(甲基)丙烯酸系聚合物可藉由適當改變所使用之單體成分或組成比而進行調整。又,此種玻璃轉移溫度例如可藉由於溶液聚合中,使用偶氮二異丁腈或過氧化苯甲醯等聚合起始劑0.06~0.2份,並使用乙酸乙酯等聚合溶劑,於氮氣流下於50℃~70℃反應8~30小時而獲得。此處,玻璃轉移溫度(Tg)可根據下述Fox式算出而求得。 The glass transition temperature (Tg) of the (meth)acrylic polymer is 250 K or less, preferably 240 K or less. Further, the glass transition temperature is preferably 200 K or more. When the glass transition temperature is 250 K or less, a pressure-sensitive adhesive composition having good heat resistance and excellent internal cohesive force is formed. Such a (meth)acrylic polymer can be adjusted by appropriately changing the monomer component or composition ratio used. Further, such a glass transition temperature can be, for example, 0.06 to 0.2 parts by using a polymerization initiator such as azobisisobutyronitrile or benzoyl peroxide, and a polymerization solvent such as ethyl acetate under a nitrogen stream. It is obtained by reacting at 50 ° C ~ 70 ° C for 8 ~ 30 hours. Here, the glass transition temperature (Tg) can be calculated from the following Fox equation.

1/Tg=W1/Tg1+W2/Tg2+W3/Tg3+... 1/Tg=W1/Tg1+W2/Tg2+W3/Tg3+...

上述Tg1、Tg2、Tg3等係將共聚成分各自均聚物1、2、3等之玻璃轉移溫度以絕對溫度表示者,W1、W2、W3等為各共聚成分之重量分率。再者,均聚物之玻璃轉移溫度(Tg)係根據Polymer Handbook(4th edition,John Wiley & Sons.Inc.)而獲得。 The above Tg1, Tg2, Tg3, etc., the glass transition temperature of each of the homopolymers 1, 2, and 3 of the copolymerization component is represented by an absolute temperature, and W1, W2, W3, etc. are the weight fraction of each copolymerization component. Further, the glass transition temperature (Tg) of the homopolymer was obtained according to Polymer Handbook (4th edition, John Wiley & Sons. Inc.).

繼而,將如此獲得之(甲基)丙烯酸系聚合物直接供於接枝聚合,或將添加稀釋劑稀釋而成之溶液供於接枝聚合。 Then, the (meth)acrylic polymer thus obtained is directly supplied to the graft polymerization, or a solution obtained by diluting a diluent is supplied to the graft polymerization.

作為稀釋劑,並無特別限定,可例示乙酸乙酯或甲苯等。 The diluent is not particularly limited, and examples thereof include ethyl acetate and toluene.

接枝聚合係使(甲基)丙烯酸系聚合物、含有環狀醚基之單體、任意含有環狀醚基之單體及其他單體反應而進行。 The graft polymerization is carried out by reacting a (meth)acrylic polymer, a monomer having a cyclic ether group, a monomer having any cyclic ether group, and another monomer.

此處,含有環狀醚基之單體並無特別限定,較佳為含有 環氧基之單體、含有氧雜環丁烷基之單體或其二者之組合。 Here, the monomer having a cyclic ether group is not particularly limited, and is preferably contained. a monomer of an epoxy group, a monomer containing an oxetane group, or a combination of both.

作為含有環氧基之單體,可例示丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、丙烯酸3,4-環氧環己基甲酯、甲基丙烯酸3,4-環氧環己基甲酯或丙烯酸4-羥丁酯縮水甘油醚等,該等可單獨使用或組合使用。 Examples of the epoxy group-containing monomer include glycidyl acrylate, glycidyl methacrylate, 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate or acrylic acid. 4-hydroxybutyl ester glycidyl ether or the like, which may be used singly or in combination.

作為含有氧雜環丁烷基之單體,可例示(甲基)丙烯酸3-氧雜環丁烷基甲酯、(甲基)丙烯酸3-甲基-3-氧雜環丁烷基甲酯、(甲基)丙烯酸3-乙基-3-氧雜環丁烷基甲酯、(甲基)丙烯酸3-丁基-3-氧雜環丁烷基甲酯或(甲基)丙烯酸3-己基-3-氧雜環丁烷基甲酯,該等可單獨使用或組合使用。 Examples of the oxetane group-containing monomer include 3-oxetanylmethyl (meth)acrylate and 3-methyl-3-oxetanyl (meth)acrylate. , 3-ethyl-3-oxetanylmethyl (meth)acrylate, 3-butyl-3-oxetanyl (meth)acrylate or (meth)acrylic acid 3- Hexyl-3-oxetanylmethyl ester, these may be used singly or in combination.

含有環狀醚基之單體之量相對於(甲基)丙烯酸系聚合物100重量份,較佳為2重量份以上,更佳為3重量份以上。上限並無特別限定,較佳為100重量份以下,更佳為50重量份以下,進而較佳為30重量份以下。含有環狀醚基之單體之量若為2重量份以上,則會充分表現組合物作為黏著接著劑之功能,另一方面,若為100重量份以上,則有時黏性減少而初始黏著困難。 The amount of the monomer having a cyclic ether group is preferably 2 parts by weight or more, and more preferably 3 parts by weight or more based on 100 parts by weight of the (meth)acrylic polymer. The upper limit is not particularly limited, but is preferably 100 parts by weight or less, more preferably 50 parts by weight or less, still more preferably 30 parts by weight or less. When the amount of the monomer having a cyclic ether group is 2 parts by weight or more, the composition functions as an adhesive binder. On the other hand, when it is 100 parts by weight or more, the viscosity may be reduced and the initial adhesion may occur. difficult.

接枝聚合時,亦可與含有環狀醚基之單體一起使用共接枝之其他單體。作為此種單體,只要是不含有環狀醚基之單體,則並無特別限定,可列舉(甲基)丙烯酸碳數1~9之烷基酯等。作為(甲基)丙烯酸烷基酯之具體例,可例示:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、丙烯酸2-乙基己酯等。又,亦可使用:(甲基)丙烯酸 環己酯、(甲基)丙烯酸異酯之類的脂環式(甲基)丙烯酸酯類。該等可單獨使用或組合使用。 In the graft polymerization, other monomers which are co-grafted may also be used together with the monomer having a cyclic ether group. The monomer which is not a cyclic ether group is not particularly limited, and examples thereof include an alkyl ester having 1 to 9 carbon atoms of (meth)acrylic acid. Specific examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, and 2-ethylhexyl acrylate. Further, it is also possible to use: (meth)acrylic acid cyclohexyl ester, (meth)acrylic acid An alicyclic (meth) acrylate such as an ester. These may be used alone or in combination.

若於該等接枝時使用共接枝之其他單體,則可容易使黏接著劑硬化,例如於光硬化之情形時可減少光之照射量,又,於熱硬化之情形時可減少熱硬化觸媒之量。推測其原因在於,接枝鏈之移動性提高,或接枝鏈或副生成之未接枝鏈與乾聚合物之相溶性變好。 If other monomers which are co-grafted are used in the grafting, the adhesive can be easily cured, for example, in the case of photohardening, the amount of light can be reduced, and in the case of heat hardening, heat can be reduced. The amount of hardening catalyst. It is presumed that the reason is that the mobility of the graft chain is improved, or the compatibility between the graft chain or the by-produced ungrafted chain and the dry polymer is improved.

此種其他單體亦較佳為選自與主鏈(乾)即(甲基)丙烯酸系聚合物之成分相同之單體。 The other monomer is also preferably selected from the same monomers as those of the main chain (dry), that is, the (meth)acrylic polymer.

於調配含有環狀醚基之單體以外之單體之情形時,其他單體量與含有環狀醚基之單體之重量比以含有環狀醚基之單體:其他單體計,較佳為90:10至10:90,更佳為80:20至20:80。若其他單體之含量較少,則有時降低用以硬化之光硬化量的效果不充分,若較多,則有光硬化後之剝離阻力增加之虞。 In the case of formulating a monomer other than a monomer having a cyclic ether group, the weight ratio of the other monomer to the monomer having a cyclic ether group is calculated by using a monomer having a cyclic ether group: other monomers. The best is 90:10 to 10:90, more preferably 80:20 to 20:80. If the content of the other monomer is small, the effect of lowering the amount of photocuring for hardening may be insufficient, and if it is large, the peeling resistance after photocuring may increase.

接枝聚合條件並無特別限定,可利用從業者公知之方法而進行。聚合時,較佳為使用過氧化物作為聚合起始劑。 The graft polymerization conditions are not particularly limited and can be carried out by a method known to a person skilled in the art. In the polymerization, it is preferred to use a peroxide as a polymerization initiator.

此種聚合起始劑之量相對於(甲基)丙烯酸系聚合物100重量份為0.02~5重量份。於該聚合起始劑之量較少之情形時,接枝聚合反應需要過多之時間,於該聚合起始劑之量較多之情形時,會大量生成含有環狀醚基之單體之均聚物,故而欠佳。 The amount of such a polymerization initiator is 0.02 to 5 parts by weight based on 100 parts by weight of the (meth)acryl-based polymer. When the amount of the polymerization initiator is small, the graft polymerization reaction requires an excessive amount of time. When the amount of the polymerization initiator is large, a large amount of the monomer having a cyclic ether group is formed. The polymer is therefore not good.

關於接枝聚合,例如若為溶液聚合,則可藉由於(甲基)丙烯酸系聚合物之溶液中添加含有環狀醚基之單體及可調 整黏度之溶劑,於氮氣置換後,添加過氧化二苯甲醯之類的過氧化物系之聚合起始劑0.02~5重量份,並於50℃~80℃下加熱4~15小時而進行,但並不限定於此。 Regarding graft polymerization, for example, if it is solution polymerization, a monomer containing a cyclic ether group may be added to a solution of a (meth)acrylic polymer and may be adjusted. The solvent of the entire viscosity is 0.02 to 5 parts by weight of a peroxide-based polymerization initiator such as benzoic acid peroxide after being replaced by nitrogen, and heated at 50 to 80 ° C for 4 to 15 hours. However, it is not limited to this.

所獲得之接枝聚合物之狀態(分子量、接枝聚合物之枝部之大小等)可根據反應條件而適當選擇。 The state of the obtained graft polymer (molecular weight, the size of the branch of the graft polymer, and the like) can be appropriately selected depending on the reaction conditions.

形成本發明之再剝離用黏著帶之黏接著劑組合物含有如此獲得之接枝聚合物及光陽離子系聚合起始劑。 The adhesive composition for forming the adhesive tape for re-peeling of the present invention contains the graft polymer thus obtained and a photocationic polymerization initiator.

作為光陽離子系聚合起始劑,亦可較佳地使用從業者公知之任一種光陽離子系聚合起始劑。更具體而言,可使用選自由芳基鋶六氟磷酸鹽、三芳基鋶鹽、六氟磷酸鋶鹽類及雙(烷基苯基)錪六氟磷酸鹽所組成群中之至少1種。 As the photocationic polymerization initiator, any photocationic polymerization initiator known to a person skilled in the art can be preferably used. More specifically, at least one selected from the group consisting of arylsulfonium hexafluorophosphate, triarylsulfonium salt, hexafluorophosphonium phosphate, and bis(alkylphenyl)phosphonium hexafluorophosphate can be used.

此種光陽離子系聚合起始劑可單獨使用亦可混合使用2種以上,總體之含量相對於上述接枝聚合物100重量份為0.15~4.0重量份,較佳為0.2~3.9重量份。 The photocationic polymerization initiator may be used singly or in combination of two or more kinds, and the total content is 0.15 to 4.0 parts by weight, preferably 0.2 to 3.9 parts by weight, based on 100 parts by weight of the graft polymer.

光陽離子系起始劑於製備成乙酸乙酯10%溶液時產生渾濁而無法完全溶解,並於聚合物中混合時,若超過一定量則亦無法溶解,而可能會阻礙效果或導致污染。因此,為了更好地硬化,較佳為於聚合物溶液中溶解性良好者。尤佳為會溶解於乙酸乙酯10%溶液中之光陽離子系起始劑。作為此種光陽離子系起始劑,例如可列舉:San-Apro股份有限公司之CPI系列,或住友精化股份有限公司之TAS系列等。此外,亦可使用LAMBERTI公司製造之ESACURE1064。 The photocationic initiator is turbid when it is prepared into a 10% ethyl acetate solution and cannot be completely dissolved. When it is mixed in a polymer, if it exceeds a certain amount, it does not dissolve, and may hinder the effect or cause contamination. Therefore, in order to better harden, it is preferred to have good solubility in a polymer solution. More preferred is a photocationic initiator which will dissolve in a 10% solution of ethyl acetate. Examples of such a photocationic initiator include a CPI series of San-Apro Co., Ltd., or a TAS series of Sumitomo Seika Co., Ltd., and the like. In addition, ESACURE 1064 manufactured by LAMBERTI can also be used.

形成本發明之再剝離用黏著帶之黏接著劑組合物中,可根據需要而添加交聯劑。作為交聯劑,並無特別限定,可 例示作為於1個分子中具有2個以上異氰酸酯基(包括將異氰酸酯基藉由嵌段劑或數量體化等而暫時保護之異氰酸酯再生型官能基)之化合物的異氰酸酯系交聯劑。 In the adhesive composition for forming the adhesive tape for re-peeling of the present invention, a crosslinking agent may be added as needed. The crosslinking agent is not particularly limited and can be used. An isocyanate-based crosslinking agent which is a compound having two or more isocyanate groups (including an isocyanate-regenerating functional group temporarily protected by a block agent or a quantitative amount of an isocyanate group) in one molecule is exemplified.

作為異氰酸酯系交聯劑,可列舉:甲苯二異氰酸酯、二甲苯二異氰酸酯等芳香族異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯、六亞甲基二異氰酸酯等脂肪族異氰酸酯等。 Examples of the isocyanate crosslinking agent include aromatic isocyanates such as toluene diisocyanate and xylene diisocyanate; alicyclic isocyanates such as isophorone diisocyanate; and aliphatic isocyanates such as hexamethylene diisocyanate.

更具體而言,例如可列舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低碳脂肪族聚異氰酸酯類,伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類,2,4-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、二甲苯二異氰酸酯、聚亞甲基聚苯異氰酸酯等芳香族二異氰酸酯類,三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(NIPPON POLYURETHANE INDUSTRY公司製造、商品名Coronate L)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(NIPPON POLYURETHANE INDUSTRY公司製造、商品名Coronate HL)、六亞甲基二異氰酸酯之異氰尿酸酯體(NIPPON POLYURETHANE INDUSTRY公司製造、商品名Coronate HX)等異氰酸酯加成物,聚醚聚異氰酸酯、聚酯聚異氰酸酯、以及該等與各種多元醇之加成物,利用異氰尿酸酯鍵、縮二脲鍵、脲基甲酸酯鍵等而多官能化之聚異氰酸酯等。該等之中,就反應速度較快而言,較佳為使用脂肪族異氰酸酯。 More specifically, examples thereof include low-carbon aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate, and the like. Alicyclic diisocyanates such as alicyclic isocyanates, 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylene diisocyanate, polymethylene polyphenyl isocyanate, trimethylolpropane / Toluene diisocyanate trimer adduct (manufactured by NIPPON POLYURETHANE INDUSTRY, trade name Coronate L), trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by NIPPON POLYURETHANE INDUSTRY, trade name Coronate) HL), isocyanate ester of hexamethylene diisocyanate (manufactured by NIPPON POLYURETHANE INDUSTRY, trade name Coronate HX), polyether polyisocyanate, polyester polyisocyanate, and various An adduct of an alcohol, a polyisocyanate which is polyfunctionalized by an isocyanurate bond, a biuret bond, an allophanate bond or the like. Among these, in terms of a faster reaction rate, it is preferred to use an aliphatic isocyanate.

上述異氰酸酯系交聯劑可單獨使用1種,亦可混合使用2 種以上,總體之含量相對於上述接枝聚合物100重量份,較佳為含有上述異氰酸酯化合物交聯劑0.05~5重量份,更佳為含有0.1~4重量份,進而較佳為含有0.2~3重量份。考慮凝聚力、耐久性試驗中之剝離之阻止等而可適當含有。 The above isocyanate crosslinking agent may be used singly or in combination of two. More preferably, the total content is 0.05 to 5 parts by weight, more preferably 0.1 to 4 parts by weight, even more preferably 0.2 to 50 parts by weight of the above-mentioned isocyanate compound crosslinking agent. 3 parts by weight. It can be suitably contained in consideration of the cohesive force, the prevention of peeling in the durability test, and the like.

此種異氰酸酯系交聯劑隨著黏接著劑聚合物之主鏈的交聯,亦有助於位於接枝鏈上之環狀醚基之硬化反應,因此可較佳地使用。 Such an isocyanate crosslinking agent is preferably used because it crosslinks the main chain of the binder polymer and also contributes to the hardening reaction of the cyclic ether group located on the graft chain.

又,亦可併用有機系交聯劑或多官能性金屬螯合物作為交聯劑。作為有機系交聯劑,可列舉環氧系交聯劑(係指於1個分子中具有2個以上環氧基之化合物)。作為環氧系交聯劑,可列舉:乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、對苯二甲酸二縮水甘油酯丙烯酸酯、螺二醇二縮水甘油醚等。該等可單獨使用亦可併用2種以上。 Further, an organic crosslinking agent or a polyfunctional metal chelate compound may be used in combination as a crosslinking agent. The organic crosslinking agent is an epoxy crosslinking agent (a compound having two or more epoxy groups in one molecule). Examples of the epoxy-based crosslinking agent include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, diglycidyl phthalate acrylate, and spirodiol diglycidyl ether. These may be used alone or in combination of two or more.

多官能性金屬螯合物係多價金屬與有機化合物共價鍵結或配位鍵結者。作為多價金屬原子,可列舉:Al、Cr、Zr、Co、Cu、Fe、Ni、V、Zn、In、Ca、Mg、Mn、Y、Ce、Sr、Ba、Mo、La、Sn、Ti等。作為共價鍵結或配位鍵結之有機化合物中之原子,可列舉氧原子等,作為有機化合物,可列舉:烷基酯、醇化合物、羧酸化合物、醚化合物、酮化合物等。 Polyfunctional metal chelates are those in which a polyvalent metal is covalently bonded or coordinated to an organic compound. Examples of the polyvalent metal atom include Al, Cr, Zr, Co, Cu, Fe, Ni, V, Zn, In, Ca, Mg, Mn, Y, Ce, Sr, Ba, Mo, La, Sn, and Ti. Wait. Examples of the atom in the organic compound which is a covalent bond or a coordinate bond include an oxygen atom and the like. Examples of the organic compound include an alkyl ester, an alcohol compound, a carboxylic acid compound, an ether compound, and a ketone compound.

於本發明中,亦可進而添加唑啉系交聯劑或過氧化物作為交聯劑。 In the present invention, it may be further added An oxazoline crosslinking agent or a peroxide is used as a crosslinking agent.

作為唑啉系交聯劑,可無特別限制地使用分子內具有唑啉基者。唑啉基可為2-唑啉基、3-唑啉基、4- 唑啉基之任一者。作為唑啉系交聯劑,較佳為使加成聚合性唑啉與不飽和單體共聚而成之聚合物,尤佳為使用2-異丙烯基-2-唑啉作為加成聚合性唑啉者。例如可列舉日本觸媒股份有限公司製造之商品名「Epocros WS-500」等。 As The oxazoline crosslinking agent can be used in the molecule without any particular limitation. An oxazoline group. The oxazoline group can be 2- Oxazolinyl, 3- Oxazolinyl, 4- Any of the oxazoline groups. As An oxazoline crosslinking agent, preferably an addition polymerization property a polymer obtained by copolymerizing an oxazoline with an unsaturated monomer, particularly preferably 2-isopropenyl-2- Oxazoline as addition polymerization Oxazoline. For example, the product name "Epocros WS-500" manufactured by Nippon Shokubai Co., Ltd., and the like can be cited.

作為過氧化物,若為藉由加熱而產生自由基活性種並使黏接著劑組合物之基礎聚合物進行交聯者,則可適當使用,但考慮到操作性或穩定性,較佳為使用1分鐘半衰期溫度為80℃~160℃之過氧化物,更佳為使用1分鐘半衰期溫度為90℃~140℃之過氧化物。 As the peroxide, if a radical active species is generated by heating and the base polymer of the adhesive composition is crosslinked, it can be suitably used, but it is preferably used in consideration of workability or stability. The one-minute half-life temperature is 80 ° C ~ 160 ° C peroxide, more preferably the use of 1 minute half-life temperature of 90 ° C ~ 140 ° C peroxide.

作為可使用之過氧化物,例如可列舉:過氧化二碳酸二(2-乙基己基)酯(1分鐘半衰期溫度:90.6℃)、過氧化二碳酸二(4-第三丁基環己基)酯(1分鐘半衰期溫度:92.1℃)、過氧化二碳酸二-第二丁酯(1分鐘半衰期溫度:92.4℃)、過氧化新癸酸第三丁酯(1分鐘半衰期溫度:103.5℃)、過氧化特戊酸第三己酯(1分鐘半衰期溫度:109.1℃)、過氧化特戊酸第三丁酯(1分鐘半衰期溫度:110.3℃)、過氧化二月桂醯(1分鐘半衰期溫度:116.4℃)、過氧化二正辛醯(1分鐘半衰期溫度:117.4℃)、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯(1分鐘半衰期溫度:124.3℃)、過氧化二(4-甲基苯甲醯)(1分鐘半衰期溫度:128.2℃)、過氧化二苯甲醯(1分鐘半衰期溫度:130.0℃)、過氧化異丁酸第三丁酯(1分鐘半衰期溫度:136.1℃)、1,1-二(第三己基過氧基)環己烷(1分鐘半衰期溫度:149.2℃)等。其中尤其就交聯反應 效率優異而言,可較佳地使用過氧化二碳酸二(4-第三丁基環己基)酯(1分鐘半衰期溫度:92.1℃)、過氧化二月桂醯(1分鐘半衰期溫度:116.4℃)、過氧化二苯甲醯(1分鐘半衰期溫度:130.0℃)等。 Examples of the peroxide which can be used include di(2-ethylhexyl)peroxydicarbonate (1 minute half-life temperature: 90.6 ° C), and di(4-tert-butylcyclohexyl)peroxydicarbonate. Ester (1 minute half-life temperature: 92.1 ° C), di-second butyl peroxydicarbonate (1 minute half-life temperature: 92.4 ° C), perbutyl neodecanoate (1 minute half-life temperature: 103.5 ° C), Third hexyl peroxypivalate (1 minute half-life temperature: 109.1 ° C), third butyl peroxypivalate (1 minute half-life temperature: 110.3 ° C), dilaurin peroxide (1 minute half-life temperature: 116.4) °C), di-n-octyl peroxide (1 minute half-life temperature: 117.4 ° C), 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate (1 minute half-life temperature: 124.3 ° C) , bis(4-methylbenzhydrazide) peroxide (1 minute half-life temperature: 128.2 ° C), benzamidine peroxide (1 minute half-life temperature: 130.0 ° C), third butyl peroxybutyrate (1 Minute half-life temperature: 136.1 ° C), 1,1-di(trihexylperoxy)cyclohexane (1 minute half-life temperature: 149.2 ° C), and the like. Especially in the cross-linking reaction In terms of efficiency, bis(4-tert-butylcyclohexyl)peroxydicarbonate (1 minute half-life temperature: 92.1 ° C) and dilaurin peroxide (1 minute half-life temperature: 116.4 ° C) can be preferably used. , benzoquinone peroxide (1 minute half-life temperature: 130.0 ° C) and the like.

再者,所謂過氧化物之半衰期,係表示過氧化物之分解速度之指標,係指過氧化物之殘留量成為一半為止之時間。關於用於以任意時間獲得半衰期之分解溫度,或於任意溫度下之半衰期時間,係記載於廠商目錄等中,例如記載於日本油脂股份有限公司之「有機過氧化物目錄第9版(2003年5月)」等中。 Further, the half-life of the peroxide is an index indicating the decomposition rate of the peroxide, and means a time period until the residual amount of the peroxide is half. The decomposition temperature for obtaining the half-life at any time, or the half-life time at any temperature, is described in the manufacturer's catalog, etc., for example, in the Organic Peroxide Catalogue, 9th Edition (2003) May) and so on.

上述過氧化物可單獨使用1種,亦可混合使用2種以上,總體之含量相對於上述接枝聚合物100重量份,上述過氧化物為0.01~2重量份,較佳為含有0.04~1.5重量份,更佳為含有0.05~1重量份。為了調整加工性、二次加工性、交聯穩定性、剝離性等,而可於該範圍內適當選擇。 The peroxide may be used singly or in combination of two or more kinds, and the total content is 0.01 to 2 parts by weight, preferably 0.04 to 1.5 parts by weight based on 100 parts by weight of the graft polymer. The parts by weight are more preferably 0.05 to 1 part by weight. In order to adjust workability, secondary workability, crosslinking stability, peelability, and the like, it can be appropriately selected within this range.

再者,作為反應處理後殘留之過氧化物分解量之測定方法,例如可藉由HPLC(高效液相層析法,high performance liquid chromatograph)而測定。 Further, the method for measuring the amount of decomposition of the peroxide remaining after the reaction treatment can be measured, for example, by HPLC (high performance liquid chromatograph).

更具體而言,例如可取出反應處理後之黏接著劑組合物約各0.2 g,浸漬於乙酸乙酯10 ml中,利用振動機於25℃下、以120 rpm振動萃取3小時後,於室溫下靜置3天。繼而,添加乙腈10 ml,並於25℃下、以120 rpm振動30分鐘,將藉由薄膜過濾器(0.45 μm)過濾而獲得之萃取液約10 μl注入至HPLC中並進行分析,而作為反應處理後之過氧 化物量。 More specifically, for example, about 0.2 g of the adhesive composition after the reaction treatment can be taken out, immersed in 10 ml of ethyl acetate, and subjected to vibration extraction at 25 ° C for 3 hours at 120 rpm, and then in a chamber. Allow to stand for 3 days. Then, 10 ml of acetonitrile was added, and the mixture was shaken at 120 rpm for 30 minutes at 25 ° C, and about 10 μl of the extract obtained by filtration through a membrane filter (0.45 μm) was injected into HPLC and analyzed, and reacted as a reaction. Post-treatment oxygenation The amount of the compound.

藉由上述交聯劑而形成黏接著劑層,但於形成黏接著劑層時,需要調整交聯劑總體之添加量,並充分考慮交聯處理溫度或交聯處理時間之影響。 The adhesive layer is formed by the above-mentioned crosslinking agent. However, when the adhesive layer is formed, it is necessary to adjust the total amount of the crosslinking agent to be added, and the influence of the crosslinking treatment temperature or the crosslinking treatment time is sufficiently considered.

形成本發明之再剝離用黏著帶之黏接著劑組合物,為了進一步提高接著力或耐熱性而可含有環氧樹脂或氧雜環丁烷樹脂。 The adhesive composition for forming the adhesive tape for re-peeling of the present invention may contain an epoxy resin or an oxetane resin in order to further improve the adhesion or heat resistance.

作為環氧樹脂,例如可例示:雙酚A型、雙酚F型、雙酚S型、溴化雙酚A型、氫化雙酚A型、雙酚AF型、聯苯型、萘型、茀型、苯酚酚醛清漆型、甲酚酚醛清漆型、三羥基苯基甲烷型、四酚基乙烷型等二官能環氧樹脂或多官能環氧樹脂,及乙內醯脲型、異氰尿酸三縮水甘油酯型等縮水甘油胺型等環氧樹脂。該等環氧樹脂可單獨使用1種或併用使用2種以上。 Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, and anthracene. Type, phenol novolac type, cresol novolac type, trihydroxyphenylmethane type, tetraphenol ethane type and other difunctional epoxy resin or polyfunctional epoxy resin, and carbendazim type, isocyanuric acid An epoxy resin such as a glycidylamine type such as a glycidyl ester type. These epoxy resins may be used alone or in combination of two or more.

作為該等環氧樹脂,並無限定,可使用市售之環氧樹脂。此種市售之環氧樹脂並無限定,例如包括以下公知之環氧樹脂:作為雙酚型環氧樹脂的Japan Epoxy Resins股份有限公司之jER828、jER806等;作為脂環式環氧樹脂的Japan Epoxy Resins股份有限公司之YX8000、YX8034等;ADEKA股份有限公司之EP4000、EP4005等;作為多元醇之聚縮水甘油醚類的長瀨化成股份有限公司之DENACOL EX-313、EX-512、EX-614B、EX-810等。 The epoxy resin is not limited, and a commercially available epoxy resin can be used. Such a commercially available epoxy resin is not limited, and includes, for example, the following known epoxy resins: jER828, jER806, etc. of Japan Epoxy Resins Co., Ltd. as a bisphenol type epoxy resin; Japan as an alicyclic epoxy resin YX8000, YX8034, etc. of Epoxy Resins Co., Ltd.; EP4000, EP4005, etc. of ADEKA Co., Ltd.; DENACOL EX-313, EX-512, EX-614B of Changchun Chemical Co., Ltd., which is a polyglycidyl ether of polyhydric alcohol , EX-810, etc.

作為氧雜環丁烷樹脂,可使用:1,4-雙{[(3-乙基-3-氧雜環丁烷基)甲氧基]甲基}苯等二甲苯二氧雜環丁烷、3-乙 基-3-{[3-乙基氧雜環丁烷-3-基]甲氧基}甲基}氧雜環丁烷、3-乙基己基氧雜環丁烷、3-乙基-3-羥基氧雜環丁烷、3-乙基-3-羥甲基氧雜環丁烷等公知之氧雜環丁烷樹脂。該等氧雜環丁烷樹脂可單獨使用1種,或組合使用2種以上。 As the oxetane resin, xylene dioxetane such as 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene can be used. , 3-B 3-(3-ethyloxetan-3-yl)methoxy}methyl}oxetane, 3-ethylhexyloxetane, 3-ethyl-3 A known oxetane resin such as hydroxyoxetane or 3-ethyl-3-hydroxymethyloxetane. These oxetane resins may be used alone or in combination of two or more.

作為氧雜環丁烷樹脂,並無限定,可使用市售之樹脂。此種市售之氧雜環丁烷樹脂可例示,東亞合成股份有限公司之ARONE OXETANE OXT-121、OXT221、OXT101及OXT212等,但並不限定於該等。 The oxetane resin is not limited, and a commercially available resin can be used. Such a commercially available oxetane resin is exemplified by ARONE OXETANE OXT-121, OXT221, OXT101, and OXT212 of East Asia Synthetic Co., Ltd., but is not limited thereto.

可將此種環氧樹脂及氧雜環丁烷樹脂之任一者或組合兩者而用於形成本發明之再剝離用黏著帶之黏接著劑組合物中。 Any one or a combination of such an epoxy resin and an oxetane resin can be used in the adhesive composition for forming the adhesive tape for re-peeling of the present invention.

於本發明中,於含有環氧樹脂及/或氧雜環丁烷樹脂之情形時,其總量相對於上述接枝聚合物100重量份,較佳為5重量份以上,更佳為10重量份以上,較佳為100重量份以下,更佳為70重量份以下。若總量為5重量份以上,則於接著力提高及耐熱性提高方面可確認顯著之效果。於總量超過100重量份之情形時,有時無法充分硬化。 In the present invention, in the case of containing an epoxy resin and/or an oxetane resin, the total amount thereof is preferably 5 parts by weight or more, more preferably 10 parts by weight based on 100 parts by weight of the above graft polymer. The amount is preferably 100 parts by weight or less, more preferably 70 parts by weight or less. When the total amount is 5 parts by weight or more, a remarkable effect can be confirmed in terms of improvement in adhesion force and improvement in heat resistance. When the total amount exceeds 100 parts by weight, the curing may not be sufficiently performed.

於本發明中,若於丙烯酸系聚合物上接枝含有環狀醚基之單體而成之接枝聚合物中添加環氧樹脂,則可製備硬化前不會產生糊劑滲出等、並且可製作良好之黏接著劑層的組合物。認為其原因在於:經接枝之環狀醚基與低分子量環氧樹脂相溶,可形成牢固之黏接著劑層構造。 In the present invention, when an epoxy resin is added to a graft polymer obtained by grafting a monomer containing a cyclic ether group onto an acrylic polymer, it is possible to prepare a paste which does not bleed out before hardening, and A composition of a good adhesive layer is made. The reason is considered to be that the grafted cyclic ether group is compatible with the low molecular weight epoxy resin to form a strong adhesive layer structure.

此外,形成本發明之再剝離用黏著帶之黏接著劑組合物中,可調配黏著賦予劑或軟化劑。黏著賦予劑相對於接枝 聚合物100重量份,可使用合計10~100重量份,較佳為20~80重量份。 Further, in the adhesive composition for forming the adhesive tape for re-peeling of the present invention, an adhesion-imparting agent or a softening agent may be formulated. Adhesion-imparting agent relative to grafting The polymer may be used in an amount of 10 to 100 parts by weight, preferably 20 to 80 parts by weight, based on 100 parts by weight of the polymer.

進而,於形成本發明之再剝離用黏著帶之黏接著劑組合物中,為了提高於界面之耐水性,相對於接枝聚合物100重量份,可調配矽烷偶合劑0.01~2重量份。較佳為調配0.02至1重量份。若過多,則對液晶單元之接著力增大而再剝離性變差,若過少,則耐水性不會提高,故而欠佳。 Further, in the adhesive composition for forming the adhesive tape for re-peeling of the present invention, in order to improve the water resistance at the interface, 0.01 to 2 parts by weight of the decane coupling agent may be blended with respect to 100 parts by weight of the graft polymer. It is preferably formulated in an amount of 0.02 to 1 part by weight. If the amount is too large, the adhesion to the liquid crystal cell increases and the removability is deteriorated. If the amount is too small, the water resistance is not improved, which is not preferable.

作為矽烷偶合劑,可列舉:3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、2-(3,4環氧環己基)乙基三甲氧基矽烷等含有環氧基之矽烷偶合劑,3-胺基丙基三甲氧基矽烷、N-2(胺基乙基)3-胺基丙基甲基二甲氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺等含有胺基之矽烷偶合劑,3-丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷等含有(甲基)丙烯醯基之矽烷偶合劑,3-異氰酸酯丙基三乙氧基矽烷等含有異氰酸酯基之矽烷偶合劑等。 Examples of the decane coupling agent include 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldiethoxydecane, and 2-(3,4 epoxycyclohexyl)ethyl. An epoxy group-containing decane coupling agent such as trimethoxy decane, 3-aminopropyltrimethoxydecane, N-2 (aminoethyl) 3-aminopropylmethyldimethoxydecane, 3- Amino-containing decane coupling agent such as triethoxysulfonyl-N-(1,3-dimethyl-butylene)propylamine, 3-propenyloxypropyltrimethoxydecane, 3-methyl A decane coupling agent containing a (meth) acrylonitrile group, a decane coupling agent containing an isocyanate group such as 3-isocyanate propyl triethoxy decane, or the like, such as acryloxypropyltriethoxy decane.

進而,亦可添加抗老化或抗氧化劑。作為此種抗老化或抗氧化劑,例如可使用,BASF公司之受阻酚系抗氧化劑Irganox系列、或SORT化學股份有限公司之K-NOX系列、ADEKA股份有限公司之Adekastab等抗氧化劑,該等可單獨添加或混合添加複數種。 Further, anti-aging or antioxidants may be added. As such an anti-aging or antioxidant, for example, BASF's hindered phenol-based antioxidant Irganox series, or SORT Chemical Co., Ltd. K-NOX series, ADEKA Co., Ltd. Adekastab and the like can be used, and these can be used alone. Add or mix to add multiple species.

形成本發明之再剝離用黏著帶之黏接著劑組合物中亦可含有其他公知之添加劑,例如可根據使用用途而適當添加:著色劑、顏料等粉體、染料、界面活性劑、塑化劑、 黏著性賦予劑、表面潤滑劑、調平劑、軟化劑、抗氧化劑、抗老化劑、光穩定劑、紫外線吸收劑、聚合抑制劑、無機或有機之填充劑、金屬粉、粒子狀物、箔狀物等。又,亦可於可控制之範圍內,採用添加還原劑之氧化還原系。 The adhesive composition for forming the adhesive tape for re-peeling of the present invention may further contain other known additives, and may be appropriately added according to the use, for example, a powder such as a coloring agent or a pigment, a dye, a surfactant, and a plasticizer. , Adhesive imparting agent, surface lubricant, leveling agent, softener, antioxidant, anti-aging agent, light stabilizer, ultraviolet absorber, polymerization inhibitor, inorganic or organic filler, metal powder, particulate matter, foil And so on. Further, a redox system to which a reducing agent is added may be used within a controllable range.

本發明之再剝離用黏著帶所含有之黏接著劑層可以如下方式形成:於耐熱性膜基材之單面上塗敷上述黏接著劑組合物,於將聚合溶劑等乾燥去除並進行交聯處理後,進行光硬化而形成。或者,亦可藉由將形成於分隔件(剝離膜)上之黏著劑層移設於耐熱性膜基材上之方式等,形成耐熱性優異之再剝離用黏著帶。 The adhesive layer contained in the adhesive tape for re-peeling of the present invention can be formed by applying the above-mentioned adhesive composition to one surface of a heat-resistant film substrate, drying and removing a polymerization solvent or the like, and performing crosslinking treatment. Thereafter, it is formed by photohardening. Alternatively, the adhesive layer for re-peeling which is excellent in heat resistance can be formed by transferring the adhesive layer formed on the separator (release film) to the heat-resistant film substrate.

作為本發明之耐熱性膜基材,若加熱步驟中之溫度為160℃左右為止,則聚對苯二甲酸乙二酯膜便足夠,若為其以上,則可較佳地使用聚醯亞胺、芳香族聚醯胺、聚萘二甲酸乙二酯、聚苯硫醚等之膜。此種膜較佳為使用厚度為5~100 μm者。本發明之再剝離用黏著帶包含片狀或細長之帶狀等各種形態。 In the heat-resistant film substrate of the present invention, if the temperature in the heating step is about 160 ° C, the polyethylene terephthalate film is sufficient, and if it is at least the above, the polyimide may be preferably used. A film of aromatic polyamine, polyethylene naphthalate, polyphenylene sulfide or the like. Such a film is preferably used in a thickness of 5 to 100 μm. The adhesive tape for re-peeling of the present invention includes various forms such as a sheet shape or an elongated strip shape.

形成黏接著劑層之方法更詳細而言,例如可藉由如下方法而達成:將上述黏接著劑組合物塗佈於經剝離處理之分隔件等上,將聚合溶劑等乾燥去除並進行交聯處理而形成黏接著劑層後轉印至耐熱性膜基材之方法,或最初便於耐熱性膜基材上塗佈上述黏接著劑組合物,並將聚合溶劑等乾燥去除而形成黏接著劑層之方法。 More specifically, the method of forming the adhesive layer can be achieved, for example, by applying the above-mentioned adhesive composition to a release-treated separator or the like, drying and removing a polymerization solvent or the like, and crosslinking. After the treatment, an adhesive layer is formed and transferred to a heat-resistant film substrate, or the adhesive composition is initially applied onto a heat-resistant film substrate, and a polymerization solvent or the like is dried to form an adhesive layer. The method.

塗佈黏接著劑時,亦可適當地新加入聚合溶劑以外之一 種以上之溶劑。 When the adhesive is applied, one of the polymerization solvents may be newly added as appropriate. More than one solvent.

作為經剝離處理之分隔件,可較佳地使用聚矽氧剝離襯墊。作為剝離襯墊之構成材料,例如可列舉,聚乙烯、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、乙烯-乙酸乙烯酯共聚物膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等塑膠膜,紙、布、不織布等多孔質材料,網狀物、發泡片材、金屬箔及該等之層壓體等適當之薄片體等,就表面平滑性優異之觀點而言,可較佳地使用塑膠膜。或,可列舉:片材、網狀物、發泡體、金屬箔及該等之層壓體等適當之薄片體等。 As the release-treated separator, a polyoxynitride release liner can be preferably used. Examples of the constituent material of the release liner include polyethylene, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, and ethylene-vinyl acetate copolymerization. Plastic film such as film, polybutylene terephthalate film, polyurethane film, polypropylene, polyethylene terephthalate, polyester film, porous materials such as paper, cloth, and non-woven fabric, A plastic film can be preferably used from the viewpoint of excellent surface smoothness, such as a mesh, a foamed sheet, a metal foil, and a suitable sheet such as the laminate. Alternatively, a sheet, a mesh, a foam, a metal foil, and a suitable sheet such as the laminate may be mentioned.

於此種襯墊上或耐熱性膜基材上塗佈形成本發明之再剝離用黏著帶之黏接著劑組合物並乾燥而形成黏接著劑層的步驟中,作為使黏接著劑乾燥之方法,可根據目的而適當採用恰當之方法。較佳為使用加熱乾燥上述塗佈膜之方法。加熱乾燥溫度較佳為40℃~200℃,進而較佳為50℃~180℃,尤佳為70℃~170℃。藉由將加熱溫度設為上述範圍,可獲得具有優異之黏著特性之黏接著劑。 The method of applying the adhesive composition for forming the adhesive tape for re-peeling of the present invention onto the liner or the heat-resistant film substrate and drying to form an adhesive layer, as a method of drying the adhesive The appropriate method can be appropriately adopted depending on the purpose. It is preferred to use a method of drying the above coated film by heating. The heating and drying temperature is preferably from 40 ° C to 200 ° C, more preferably from 50 ° C to 180 ° C, and particularly preferably from 70 ° C to 170 ° C. By setting the heating temperature to the above range, an adhesive having excellent adhesive properties can be obtained.

乾燥時間可適當採用恰當之時間。上述乾燥時間較佳為5秒~20分鐘,進而較佳為5秒~10分鐘,尤佳為10秒~5分鐘。 The drying time can be appropriately adjusted to the appropriate time. The drying time is preferably from 5 seconds to 20 minutes, more preferably from 5 seconds to 10 minutes, and particularly preferably from 10 seconds to 5 minutes.

又,可於耐熱性膜基材之表面形成增黏層,或實施電暈處理、電漿處理等各種易接著處理後形成黏接著劑層。 又,黏接著劑層之表面亦可進行易接著處理。 Further, a pressure-sensitive adhesive layer may be formed on the surface of the heat-resistant film substrate, or various adhesion treatments such as corona treatment and plasma treatment may be performed to form an adhesive layer. Further, the surface of the adhesive layer can be easily treated.

作為黏接著劑層之形成方法,可使用各種方法。具體而言,例如可列舉:輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥式塗佈、棒式塗佈、刮塗、氣刀塗佈、淋幕式塗佈、唇口塗佈、利用狹縫擠壓式塗佈機等之擠壓塗佈法等方法。 As a method of forming the adhesive layer, various methods can be used. Specific examples thereof include roll coating, contact roll coating, gravure coating, reverse coating, roll coating, spray coating, dip roller coating, bar coating, blade coating, and gas coating. Knife coating, curtain coating, lip coating, and extrusion coating methods such as a slit extrusion coater.

黏接著劑層之厚度並無特別限制,例如0.5~100 μm左右。較佳為2~50 μm,更佳為3~25 μm,進而較佳為3~15 μm。 The thickness of the adhesive layer is not particularly limited, and is, for example, about 0.5 to 100 μm. It is preferably 2 to 50 μm, more preferably 3 to 25 μm, and still more preferably 3 to 15 μm.

於上述黏接著劑層露出之情形時,亦可利用經剝離處理之片材(分隔件)保護黏接著劑層直至供於實際應用。 In the case where the above adhesive layer is exposed, the adhesive layer may be protected by a release-treated sheet (separator) until it is used for practical use.

作為此種保護用分隔件之構成材料,例如可列舉,聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等塑膠膜,紙、布、不織布等多孔質材料,網狀物、發泡片材、金屬箔及該等之層壓體等適當之薄片體等,就表面平滑性優異之觀點而言可較佳地使用塑膠膜。 Examples of the constituent material of the protective separator include a plastic film such as polyethylene, polypropylene, polyethylene terephthalate or polyester film, and a porous material such as paper, cloth or non-woven fabric. A plastic film can be preferably used from the viewpoint of excellent surface smoothness, such as a foamed sheet, a metal foil, and a suitable sheet such as the laminate.

作為該塑膠膜,只要是可保護上述黏接著劑層之膜則並無特別限定,例如可列舉:聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等。 The plastic film is not particularly limited as long as it can protect the adhesive layer, and examples thereof include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, and polymethylpentene. Film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate film, etc. .

塗佈用或保護用之剝離襯墊或上述分隔件之厚度通常為5~200 μm,較佳為5~100 μm左右。對於上述分隔件,亦可根據需要而進行利用聚矽氧系、氟系、長鏈烷基系或脂肪酸醯胺系之脫模劑、二氧化矽粉等之脫模及防污處理,或 塗佈型、捏合型、蒸鍍型等之抗靜電處理。尤其是,藉由對上述分隔件之表面適當進行聚矽氧處理、長鏈烷基處理、氟處理等剝離處理,可進一步提高自上述黏接著劑層之剝離性。 The thickness of the release liner or the above-mentioned separator for coating or protection is usually 5 to 200 μm, preferably about 5 to 100 μm. The separator may be subjected to mold release and antifouling treatment using a polyfluorene-based, fluorine-based, long-chain alkyl-based or fatty acid-amide-based release agent, cerium oxide powder or the like, or Antistatic treatment such as coating type, kneading type, vapor deposition type, and the like. In particular, the peeling property from the adhesive layer can be further improved by appropriately performing a release treatment such as polyoxynitridation treatment, long-chain alkyl treatment, or fluorine treatment on the surface of the separator.

構成本發明之再剝離用黏著帶之黏接著劑組合物可藉由照射特定之光而引起硬化。本發明之再剝離用黏著帶具有光硬化之黏接著劑層,對被接著體之接著或被接著體與構件之接著較為可靠。 The adhesive composition constituting the adhesive tape for re-peeling of the present invention can be hardened by irradiating a specific light. The adhesive tape for re-peeling of the present invention has a photo-curable adhesive layer which is reliable for the adhesion of the adherend or the adhesion of the adherend to the member.

照射用之光並無特別限定,較佳為紫外線、可見光及電子束等活性能量射線。藉由紫外線照射之交聯處理可使用高壓水銀燈、低壓水銀燈、準分子雷射、金屬鹵化物燈等適當之紫外線源而進行。此時,作為紫外線之照射量,可根據所需要之交聯度而適當選擇,通常於紫外線時,較理想為於0.2~10 J/cm2之範圍內選擇。照射時之溫度並無特別限定,但考慮支持體之耐熱性,較佳為140℃左右為止。 The light for irradiation is not particularly limited, and is preferably an active energy ray such as ultraviolet rays, visible light, or electron beams. The cross-linking treatment by ultraviolet irradiation can be carried out using a suitable ultraviolet source such as a high pressure mercury lamp, a low pressure mercury lamp, an excimer laser, or a metal halide lamp. In this case, the amount of ultraviolet rays to be irradiated can be appropriately selected depending on the degree of crosslinking required, and is usually selected in the range of 0.2 to 10 J/cm 2 in the case of ultraviolet rays. The temperature at the time of irradiation is not particularly limited, but considering the heat resistance of the support, it is preferably about 140 °C.

再者,光量係以Electronic Instrumentation and Technology Inc.製造之UV Power Puck之UVA(320-390 nm)、UVB(280-320 nm)、UVC(250-260 nm)、UVV(395-445 nm)之累計量而表示。 Furthermore, the amount of light is UVA (320-390 nm), UVB (280-320 nm), UVC (250-260 nm), UVV (395-445 nm) of UV Power Puck manufactured by Electronic Instrumentation and Technology Inc. Expressed in terms of cumulative amount.

藉由照射活性能量射線,光陽離子起始劑發生分解而產生酸,而進行藉由環狀醚基之硬化反應。 By irradiating the active energy ray, the photocationic initiator is decomposed to generate an acid, and a hardening reaction by a cyclic ether group is carried out.

本發明之硬化黏接著劑層之凝膠分率較佳為80~98%,較佳為形成凝聚力非常高之黏接著劑層。其於23℃下之儲 存模數較佳為9.0×104~1.0×106 Pa,而仍具有黏著性,故而成為耐熱性優異之黏接著劑組合物及黏著片材。 The gel adhesive layer of the present invention preferably has a gel fraction of 80 to 98%, preferably an adhesive layer having a very high cohesive force. The storage modulus at 23 ° C is preferably 9.0 × 10 4 to 1.0 × 10 6 Pa, and is still adhesive, so that it is an adhesive composition and an adhesive sheet excellent in heat resistance.

此處,所謂光硬化反應後,意指藉由進行0.2 J/cm2以上之光照射所達成之狀態。 Here, the term "photohardening reaction" means a state achieved by irradiation with light of 0.2 J/cm 2 or more.

本發明之再剝離用黏著帶係以上述方式而獲得,並可用於各種遮蔽或固定之用途中。 The adhesive tape for re-peeling of the present invention is obtained in the above manner and can be used in various applications for shielding or fixing.

實施例Example

以下,利用實施例具體說明本發明,但本發明並不限定於該等實施例。再者,各例中之份及%均為重量基準。以下,未特別規定之室溫放置條件均為23℃ 65% RH(1小時或1週)。 Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the examples. Furthermore, the parts and % in each case are based on weight. Hereinafter, room temperature conditions which are not specifically defined are 23 ° C, 65% RH (1 hour or 1 week).

<重量平均分子量之測定> <Measurement of Weight Average Molecular Weight>

所獲得之(甲基)丙烯酸系聚合物之重量平均分子量係藉由GPC(凝膠滲透層析法)而測定。樣品使用將試樣溶解於二甲基甲醯胺中而形成0.1重量%之溶液,將其靜置一夜後,利用0.45 μm之薄膜過濾器過濾之濾液。 The weight average molecular weight of the obtained (meth)acrylic polymer was measured by GPC (gel permeation chromatography). The sample was dissolved in dimethylformamide to form a 0.1% by weight solution, which was allowed to stand overnight, and then filtered through a 0.45 μm membrane filter.

.分析裝置:Tosoh公司製造之HLC-8120GPC . Analytical device: HLC-8120GPC manufactured by Tosoh

.管柱:Tosoh公司製造之G7000HXL+GMHXL+GMHXL . Pipe column: G7000H XL +GMH XL +GMH XL manufactured by Tosoh

.管柱尺寸:各7.8 mmΦ×30 cm共計90 cm . Column size: 7.8 mm Φ × 30 cm each, total 90 cm

.溶析液:四氫呋喃(濃度0.1重量%) . Lysate: tetrahydrofuran (concentration 0.1% by weight)

.流量:0.8 ml/min . Flow rate: 0.8 ml/min

.檢測器:示差折射計(RI) . Detector: Differential Refractometer (RI)

.管柱溫度:40℃ . Column temperature: 40 ° C

.注入量:100 μl . Injection volume: 100 μl

.標準試樣:聚苯乙烯 . Standard sample: polystyrene

<凝膠分率之測定> <Measurement of gel fraction>

將經乾燥、交聯處理之黏接著劑(最初之重量W1)浸漬於乙酸乙酯溶液中,於室溫下放置1週後,取出不溶分,測定經乾燥之重量(W2),並以如下方式求得。 The dried and cross-linked adhesive (initial weight W1) was immersed in an ethyl acetate solution, and after standing at room temperature for 1 week, the insoluble matter was taken out, and the dried weight (W2) was measured, and the following Ways to get it.

凝膠分率=(W2/W1)×100 Gel fraction = (W2/W1) × 100

<接著力之測定方法> <Method of measuring the force>

將實施例、比較例所獲得之再剝離用黏著帶切割成寬20 mm、長度100 mm而製成樣品,藉由2 Kg之輥往復一次而貼附於無鹼玻璃板上,於23℃ * 50% RH之條件下放置30分鐘後,以剝離角度90°、剝離速度300 mm/分鐘測定剝離接著力(N/20 mm),將所得之值作為初始接著力。 The adhesive tape for re-peeling obtained in the examples and the comparative examples was cut into a width of 20 mm and a length of 100 mm to prepare a sample, which was attached to an alkali-free glass plate by reciprocating once with a 2 Kg roller at 23 ° C * After standing for 30 minutes under the conditions of 50% RH, the peeling adhesion force (N/20 mm) was measured at a peeling angle of 90° and a peeling speed of 300 mm/min, and the obtained value was used as an initial adhesion force.

將貼附之樣品於260℃之烘箱內加熱5分鐘,於23℃ * 50% RH之條件下放置30分鐘後,以剝離角度90°、剝離速度300 mm/分鐘測定剝離接著力(N/20 mm),將所得之值作為加熱後接著力。作為被接著體之污染狀態,若剝離面上有糊劑殘餘或污染則設為×,若完全未觀察到則設為○。 The attached sample was heated in an oven at 260 ° C for 5 minutes, and allowed to stand under conditions of 23 ° C * 50% RH for 30 minutes, and the peeling force was measured at a peeling angle of 90 ° and a peeling speed of 300 mm / minute (N/20). Mm), the obtained value is taken as the heating force. In the state of contamination of the adherend, if there is residual or contamination of the paste on the peeling surface, it is set to ×, and if it is not observed at all, it is set to ○.

<動態黏彈性之測定方法> <Method for measuring dynamic viscoelasticity>

裝置:TA Instruments公司製造之ARES Device: ARES manufactured by TA Instruments

變形模式:扭轉 Deformation mode: twist

測定頻率:固定頻率1 Hz Measuring frequency: fixed frequency 1 Hz

升溫速度:5℃/分鐘 Heating rate: 5 ° C / min

測定溫度:自黏接著劑之玻璃轉移溫度附近至160℃為止測定 Measuring temperature: measured from the glass transition temperature of the adhesive to 160 ° C

形狀:平行板8.0 mmΦ Shape: parallel plate 8.0 mmΦ

試樣厚度:0.5~2 mm(安裝初始) Sample thickness: 0.5~2 mm (installation initial)

讀取於23℃下之儲存模數(G') Read the storage modulus (G') at 23 ° C

(實施例1) (Example 1)

於具備攪拌翼、溫度計、氮氣導入管、冷卻器之4口燒瓶中,將丙烯酸正丁酯100重量份、丙烯酸4-羥丁酯3重量份、作為聚合起始劑之2,2'-偶氮二異丁腈0.1重量份與乙酸乙酯200重量份一同裝入,一面緩慢地攪拌一面導入氮氣進行1小時氮氣置換後,將燒瓶內之液溫保持於60℃左右並進行10小時聚合反應,而製備重量平均分子量92萬之丙烯酸系聚合物溶液。所獲得之丙烯酸系聚合物之玻璃轉移溫度為231 K。 100 parts by weight of n-butyl acrylate and 3 parts by weight of 4-hydroxybutyl acrylate in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a cooler, and 2,2'-even as a polymerization initiator. 0.1 parts by weight of nitrogen diisobutyronitrile was charged together with 200 parts by weight of ethyl acetate, and nitrogen gas was introduced while slowly stirring for 1 hour, and then the liquid temperature in the flask was maintained at about 60 ° C for 10 hours. An acrylic polymer solution having a weight average molecular weight of 20,000,000 was prepared. The glass transition temperature of the obtained acrylic polymer was 231 K.

藉由乙酸乙酯以固形物成分成為25%之方式稀釋所獲得之丙烯酸系聚合物溶液,而製備稀釋溶液(I)。於具備攪拌翼、溫度計、氮氣導入管、冷卻器之4口燒瓶中,相對於稀釋溶液(I)400重量份,添加丙烯酸4-羥丁酯縮水甘油醚20份、丙烯酸異酯20份、過氧化苯甲醯0.2份,一面緩慢地攪拌一面導入氮氣進行1小時氮氣置換後,將燒瓶內之液溫於65℃左右保持4小時,繼而於70℃下進行4小時聚合反應而獲得接枝聚合物溶液。 The obtained acrylic polymer solution was diluted with ethyl acetate in such a manner that the solid content became 25% to prepare a diluted solution (I). In a 4-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet tube, and a cooler, 20 parts of 4-hydroxybutyl acrylate glycidyl ether was added to 400 parts by weight of the diluted solution (I), and acrylic acid was added. 20 parts of ester and 0.2 part of benzamidine peroxide were introduced, and nitrogen gas was introduced while slowly stirring for 1 hour, and then the liquid temperature in the flask was maintained at about 65 ° C for 4 hours, followed by polymerization at 70 ° C for 4 hours. A graft polymer solution was obtained.

繼而,相對於以上述方式獲得之接枝聚合物溶液之固形物成分100重量份,調配三芳基鋶鹽(San-Apro公司製造之「CPI-200K」)1份、異氰酸酯系交聯劑(NCO交聯劑,三井化學公司製造之「Takenate D110N」)0.4份、抗老化劑 (受阻酚系抗老化劑,Ciba Japan公司製造之「Irganox 1010」)1.0份而製備黏著劑溶液。 Then, one part of a triarylsulfonium salt ("CPI-200K" by San-Apro Co., Ltd.) and an isocyanate type crosslinking agent (NCO) were prepared with respect to 100 parts by weight of the solid content of the graft polymer solution obtained in the above manner. Crosslinking agent, "Takenate D110N" manufactured by Mitsui Chemicals Co., Ltd. 0.4 parts, anti-aging agent An adhesive solution was prepared by dissolving 1.0 part of a hindered phenol-based anti-aging agent ("Irganox 1010" manufactured by Ciba Japan Co., Ltd.).

以乾燥後之黏接著劑層之厚度成為6 μm之方式將上述黏接著劑溶液塗佈於25 μm之聚醯亞胺膜上,於120℃下乾燥3分鐘,於黏著面貼附經聚矽氧剝離處理之38 μm之聚對苯二甲酸乙二酯膜(三菱樹脂公司製造之MRF38)。 The adhesive solution was applied to a 25 μm polyimine film by drying the adhesive layer to a thickness of 6 μm, and dried at 120 ° C for 3 minutes to adhere to the adhesive surface. 38 μm polyethylene terephthalate film (MRF38 manufactured by Mitsubishi Plastics Co., Ltd.) by oxygen stripping treatment.

繼而,利用金屬鹵化物UV(ultraviolet,紫外線)燈,自PET(Polyethylene terephthalate,聚對苯二甲酸乙二酯)膜側對該黏著劑層面進行1.2 J/cm2光照射,並於50℃下老化2日而製成本發明之再剝離用黏著帶。 Then, using a metal halide UV (ultraviolet) lamp, the adhesive layer is irradiated with 1.2 J/cm 2 from the PET (Polyethylene terephthalate) film side, and at 50 ° C. The adhesive tape for re-peeling of the present invention was prepared by aging for 2 days.

除了改變異氰酸酯系交聯劑及光陽離子聚合起始劑之量及光量以外,進行與實施例1同樣之操作,分別製作實施例2~10、12及比較例1~4之再剝離用黏著帶。其中,關於實施例11,係設為丙烯酸4-羥丁酯5重量份,而製備重量平均分子量93萬之丙烯酸系聚合物溶液(玻璃轉移溫度為235 K)。進而,於實施例11中,為了製備接枝部分而將丙烯酸4-羥丁酯縮水甘油醚與丙烯酸異酯分別設為50份。 The adhesive tape for re-peeling of Examples 2 to 10, 12 and Comparative Examples 1 to 4 was produced in the same manner as in Example 1 except that the amounts of the isocyanate-based crosslinking agent and the photocationic polymerization initiator were changed, and the amount of light was changed. . In the eleventh embodiment, about 5 parts by weight of 4-hydroxybutyl acrylate was used to prepare an acrylic polymer solution having a weight average molecular weight of 930,000 (glass transition temperature: 235 K). Further, in Example 11, 4-hydroxybutyl acrylate glycidyl ether was mixed with acrylic acid in order to prepare a graft portion. The esters were each set to 50 parts.

此處,作為光陽離子聚合起始劑,實施例1~11及比較例1~4係與實施例同樣使用三芳基鋶鹽(San-Apro公司製造之「CPI-200K」),於實施例12中使用LAMBERTI公司之ESACURE 1064。 Here, as the photocationic polymerization initiators, in Examples 1 to 11 and Comparative Examples 1 to 4, a triarylsulfonium salt ("CPI-200K" manufactured by San-Apro Co., Ltd.) was used in the same manner as in the examples, and in Example 12 LAMBERTI's ESACURE 1064 is used.

將對上述實施例及比較例所獲得之樣品進行的黏著劑層之凝膠分率、儲存模數、初始接著力、加熱接著力及污染之評價結果表示於表1中。表1中,各調配量表示相對於接 枝聚合物100重量份之重量份。 The evaluation results of the gel fraction, the storage modulus, the initial adhesion, the heating adhesion, and the contamination of the adhesive layer of the samples obtained in the above Examples and Comparative Examples are shown in Table 1. In Table 1, each deployment amount represents relative connection The branch polymer is 100 parts by weight by weight.

表1中,附有之比較例3可見糊劑殘餘。 In Table 1, the residue of Comparative Example 3 with * can be seen as a paste residue.

Claims (12)

一種再剝離用黏著帶,其特徵在於:其係具有耐熱性膜基材及於該耐熱性膜基材之單面上設置硬化黏接著劑層而成者,該硬化黏接著劑層係使由黏接著劑組合物形成之黏接著劑層光硬化而成者,該黏接著劑組合物係於(甲基)丙烯酸系聚合物上接枝聚合含有包含環狀醚基之單體之鏈而成的接枝聚合物100重量份中,含有光陽離子系聚合起始劑0.15~4.0重量份而成者。 An adhesive tape for re-peeling, which is characterized in that it has a heat-resistant film substrate and a hardened adhesive layer is provided on one surface of the heat-resistant film substrate, and the hardened adhesive layer is made of The adhesive layer formed by the adhesive composition is photocured, and the adhesive composition is obtained by graft-polymerizing a chain containing a monomer having a cyclic ether group onto a (meth)acrylic polymer. 100 parts by weight of the graft polymer contains 0.15 to 4.0 parts by weight of a photocationic polymerization initiator. 如請求項1之再剝離用黏著帶,其中上述黏接著劑組合物進而含有異氰酸酯系交聯劑。 The adhesive tape for re-peeling of claim 1, wherein the above-mentioned adhesive composition further contains an isocyanate-based crosslinking agent. 如請求項1之再剝離用黏著帶,其中上述黏接著劑組合物進而相對於上述接枝聚合物100重量份含有環氧樹脂及/或氧雜環丁烷樹脂5~100重量份。 The adhesive tape for re-peeling of claim 1, wherein the adhesive composition further contains 5 to 100 parts by weight of the epoxy resin and/or oxetane resin with respect to 100 parts by weight of the graft polymer. 如請求項1之再剝離用黏著帶,其中該硬化黏接著劑層之凝膠分率為80~99%。 The adhesive tape for re-peeling of claim 1, wherein the hardened adhesive layer has a gel fraction of 80 to 99%. 如請求項1之再剝離用黏著帶,其中上述(甲基)丙烯酸系聚合物相對於該(甲基)丙烯酸系聚合物總量而含有0.2~10重量%之含有羥基之單體作為單體單元。 The adhesive tape for re-peeling of claim 1, wherein the (meth)acrylic polymer contains 0.2 to 10% by weight of a monomer having a hydroxyl group as a monomer with respect to the total amount of the (meth)acrylic polymer unit. 如請求項1之再剝離用黏著帶,其中上述接枝聚合物係藉由於上述(甲基)丙烯酸系聚合物100重量份上,於過氧化物0.02~5重量份之存在下接枝聚合上述包含環狀醚基之單體2~50重量份及其他單體5~50重量份而獲得。 The adhesive tape for re-peeling of claim 1, wherein the graft polymer is graft-polymerized in the presence of 0.02 to 5 parts by weight of the peroxide by 100 parts by weight of the (meth)acryl-based polymer. It is obtained by 2 to 50 parts by weight of a monomer containing a cyclic ether group and 5 to 50 parts by weight of other monomers. 如請求項1之再剝離用黏著帶,其中上述光陽離子系聚 合起始劑為光酸產生劑。 The adhesive tape for re-peeling of claim 1, wherein the photocationic polymerization is carried out The starting agent is a photoacid generator. 如請求項7之再剝離用黏著帶,其中上述光酸產生劑於將溶劑設為乙酸乙酯並調整成10%之濃度之情形時,不產生沈澱物而溶解。 The adhesive tape for re-peeling of claim 7, wherein the photoacid generator is dissolved without causing a precipitate when the solvent is made into ethyl acetate and adjusted to a concentration of 10%. 如請求項1之再剝離用黏著帶,其中上述硬化黏接著劑層於23℃下之儲存模數為9.0×104~1.0×106 Pa。 The adhesive tape for re-peeling of claim 1, wherein the hardened adhesive layer has a storage modulus of from 9.0 × 10 4 to 1.0 × 10 6 Pa at 23 ° C. 如請求項1之再剝離用黏著帶,其中上述耐熱性膜基材係選自由聚對苯二甲酸乙二酯、聚醯亞胺、芳香族聚醯胺、聚萘二甲酸乙二酯及聚苯硫醚所組成之群。 The adhesive tape for re-peeling of claim 1, wherein the heat-resistant film substrate is selected from the group consisting of polyethylene terephthalate, polyimide, aromatic polyamine, polyethylene naphthalate, and poly a group of phenyl sulfides. 如請求項1之再剝離用黏著帶,其中上述黏接著劑層係以0.5~100 μm之厚度設置而成。 The adhesive tape for re-peeling of claim 1, wherein the adhesive layer is formed by a thickness of 0.5 to 100 μm. 一種再剝離用黏著帶之製造方法,其係用於製造在耐熱性膜基材之單面設置硬化黏接著劑層而成之再剝離用黏著帶者,該製造方法包括:將黏接著劑組合物塗佈於耐熱性膜基材之單面上而形成黏接著劑層之步驟,該黏接著劑組合物係於(甲基)丙烯酸系聚合物上接枝聚合含有包含環狀醚基之單體之鏈而成的接枝聚合物100重量份中,含有光陽離子系聚合起始劑0.15~4.0重量份而成者;及對該黏接著劑層照射光而使其光硬化之步驟。 A method for producing an adhesive tape for re-peeling, which is used for producing a re-peelable adhesive tape comprising a cured adhesive layer on one side of a heat-resistant film substrate, the method comprising: bonding an adhesive a step of applying a layer of an adhesive layer on a single surface of a heat-resistant film substrate, the adhesive composition being graft-polymerized on a (meth)acrylic polymer containing a single ring-containing ether group 100 parts by weight of the graft polymer obtained by the chain of the body contains 0.15 to 4.0 parts by weight of the photocationic polymerization initiator; and a step of irradiating the adhesive layer with light to cure the light.
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