TW201251317A - Piezoelectric vibration piece, method of manufacturing piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled timepiece - Google Patents
Piezoelectric vibration piece, method of manufacturing piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled timepiece Download PDFInfo
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- TW201251317A TW201251317A TW101104521A TW101104521A TW201251317A TW 201251317 A TW201251317 A TW 201251317A TW 101104521 A TW101104521 A TW 101104521A TW 101104521 A TW101104521 A TW 101104521A TW 201251317 A TW201251317 A TW 201251317A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
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- 230000015572 biosynthetic process Effects 0.000 description 5
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- 239000010931 gold Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
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- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 244000089486 Phragmites australis subsp australis Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
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- 229910001385 heavy metal Inorganic materials 0.000 description 1
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- 239000005433 ionosphere Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G04—HOROLOGY
- G04R—RADIO-CONTROLLED TIME-PIECES
- G04R20/00—Setting the time according to the time information carried or implied by the radio signal
- G04R20/08—Setting the time according to the time information carried or implied by the radio signal the radio signal being broadcast from a long-wave call sign, e.g. DCF77, JJY40, JJY60, MSF60 or WWVB
- G04R20/10—Tuning or receiving; Circuits therefor
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
201251317 六、發明說明 【發明所屬之技術領域】 本發明係關於由水晶或钽酸裡等之壓電材料所構成之 壓電振動片之製造方法、依此所製造出之壓電振動片、具 有此之壓電振動子及具有壓電振動子之振盪器、電子機器 以及電波時鐘。 【先前技術】 近年來，在行動電話或行動資訊終端機器，使用利用 水晶等之壓電振動子以當作時刻源或控制訊號之時序源、 基準訊號源。該種壓電振動子雖然提供各種，就以其一而 言，所知的有具備音叉型之壓電振動片。該壓電振動片爲 以規定之諧振頻率使平行配置之一對振動腕部在互相接近 或間隔開之方向振動之振動片。 然而，近年來，以行動電話機等爲代表，發展出內藏 壓電振動子之各種電子機器的小型化。因此，即使關於構 成壓電振動子之壓電振動片，也被要求更進一步的小型 化。於是，關於壓電振動片，期待縮小振動腕部之長度或 基部之長度，而更縮短全長。 但是，藉由縮短基部之長度而縮短壓電振動片之全長 之時，安裝性能下降，並且振動腕部之振動容易成爲不安 定，容易通過基部而產生漏振（振動能量之洩漏）。因此， 有CI値（Crystal Impedance)上升之可能性。 於是，爲了縮短壓電振動片之全長而謀求小型化，並 -5- 201251317 非基部側，而是縮短振動腕部之長度則有效果。但是，當 振動腕部之長度變短時，R 1値（串聯諧振電阻値）變高， 振動特性有惡化之傾向。尤其，該RI値因與有效電阻値 Re呈比例關係，故數値變高，要以低電力使壓電振動片 作動爲困難》 於是，爲了降低R1値，所知的有在振動腕部之兩主 面（表背面）沿著振動腕部之長邊方向各形成溝部（參照專 利文獻1)。 該壓電振動片係藉由溝部而形成一對振動腕部各成爲 剖面Η型，使得一對勵振電極極力成爲相向。因此，比 起不形成溝部之時，效率更佳且電場更容易作用，可以降 低振動損失。因此，可以改善振動特性，能夠將R1値抑 制成較低。 如此一來，爲了一面抑制R1値之上升一面取得壓電 振動片之小型化，在振動腕部形成溝部，並且縮短該振動 腕部之長度，則爲有效之手段。 如此之勵振電極係由例如Au、Cr等所構成，配置成 以一定之間隔間隔開。然後，該配置係藉由使用光阻之光 微影技術而形成。藉由該光微影之製造工程係以濺鍍等配 置在一對之振動腕部之表面，並在其上方配置光阻膜，並 隔著光罩藉由曝光形成光阻圖案。然後，進行將該光阻圖 案當作光罩而進行蝕刻，形成一對勵振電極。 在此，光阻膜用之光阻因由具有紫外光持有感光感度 的流動性之樹脂等所構成，故要在一對振動腕部之表面均 -6 -201251317 VI. The present invention relates to a method of manufacturing a piezoelectric vibrating piece composed of a piezoelectric material such as crystal or tantalum, and a piezoelectric vibrating piece manufactured thereby, having The piezoelectric vibrator and the oscillator having the piezoelectric vibrator, the electronic device, and the radio wave clock. [Prior Art] In recent years, in a mobile phone or mobile information terminal device, a piezoelectric vibrator using a crystal or the like is used as a timing source or a reference signal source for a time source or a control signal. In view of the above, a piezoelectric vibrating piece having a tuning fork type is known. The piezoelectric vibrating piece is a vibrating piece that vibrates in a direction in which the vibrating arms are in close proximity or spaced apart from each other at a predetermined resonance frequency. However, in recent years, miniaturization of various electronic devices incorporating built-in piezoelectric vibrators has been developed, as represented by mobile phones and the like. Therefore, even with regard to the piezoelectric vibrating piece constituting the piezoelectric vibrator, further miniaturization is required. Therefore, regarding the piezoelectric vibrating piece, it is expected to reduce the length of the vibrating arm portion or the length of the base portion, and to shorten the total length. However, when the total length of the piezoelectric vibrating reed is shortened by shortening the length of the base portion, the mounting performance is lowered, and the vibration of the vibrating arm portion is likely to be unstable, and leakage vibration (leakage of vibration energy) is likely to occur through the base portion. Therefore, there is a possibility that CI値 (Crystal Impedance) will rise. Therefore, in order to shorten the overall length of the piezoelectric vibrating piece and to reduce the size, it is effective to shorten the length of the vibrating arm portion on the non-base side of the -5-201251317. However, when the length of the vibrating arm is shortened, R 1 値 (series resonance resistance 値) becomes high, and the vibration characteristics tend to deteriorate. In particular, since the RI is proportional to the effective resistance 値Re, the number 値 becomes high, and it is difficult to operate the piezoelectric vibrating piece with low power. Thus, in order to lower the R1 値, it is known that the vibration arm is The both main surfaces (back surface) form a groove along each of the longitudinal sides of the vibrating arm (see Patent Document 1). In the piezoelectric vibrating piece, a pair of vibrating arms are formed in a cross-sectional shape by the groove portion, so that the pair of vibrating electrodes are opposed to each other as much as possible. Therefore, the efficiency is better and the electric field is more likely to act than when the groove portion is not formed, and the vibration loss can be reduced. Therefore, the vibration characteristics can be improved, and R1 can be suppressed to be low. In order to reduce the size of the piezoelectric vibrating piece while suppressing the rise of R1値, it is effective to form a groove portion in the vibrating arm portion and shorten the length of the vibrating arm portion. The excitation electrodes are made of, for example, Au, Cr, or the like, and are arranged to be spaced apart at regular intervals. This configuration is then formed by photolithographic techniques using photoresist. The manufacturing process of the photolithography is performed by sputtering or the like on the surface of a pair of vibrating arms, and a photoresist film is disposed thereon, and a photoresist pattern is formed by exposure through the photomask. Then, the photoresist pattern is etched as a mask to form a pair of excitation electrodes. Here, the photoresist for the photoresist film is composed of a resin having a fluidity of sensitivity to ultraviolet light, and so on the surface of a pair of vibrating arms.
S 201251317 勻塗佈則有困難》因此，如第27圖（a)所示般，於光阻膜 2〇1局部厚（A部）之時，則如第27圖（b)所示般，於曝光 時至底面202不被曝光，如第27圖（c)所示般，於顯像 後，殘留光阻膜20 1 (B部）。然後，於如此地直接進行蝕 刻處理之時，在連結一對勵振電極之狀態下被形成，故有 引起電極短路之問題。 於是，爲了使表面均句，所知的也有於曝光之時，增 長曝光時間而充分除去厚度部分之方法。再者，提案有對 形成之光阻圖案照射雷射而調整圖案之至少一部分之形狀 的方法（參照專利文獻2)。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2004- 1 20556號公報 [專利文獻2]日本特開2003 - 1 3 3 875號公報 【發明內容】 [發明所欲解決之課題] 但是，在上述以往之（增長曝光時間）製造方法中，如 第28圖所示般，在光阻膜201之厚度在正常範圍下被成 膜之區域（C部）中，相對於本來的除去寬度L1，則以比此 寬的除去寬度L2被除去。即是，會有除去量過剩，圖案 尺寸比起期待之値變細，對R1之增加等之特性値造成影 響之問題。再者，在記載於上述專利文獻2之製造方法 中，因於顯像工程後對不均勻部之一個一個照射雷射，故 201251317 有隨著成本變高也費時之問題。 本發明係鑒於上述情形而作成，其目的爲提供不用增 加電阻値R1，可以改善電極之短路不良的電壓振動片之 製造方法’依此所製造出之壓電振動片、具有此之壓電振 動子以及具有壓電振動子之振盪器、電子機器以及電波時 鐘。 [用以解決課題之手段] 本發明爲了解決上述課題，提供以下之手段。 本發明所涉及之壓電振動片之製造方法爲利用由壓電 材料所構成之晶圓而製造壓電振動片之方法，其特徵爲： 具備藉由光微影技術蝕刻上述晶圓，而形成壓電板之外形 形狀的外形形成工程：和在上述壓電板之外表面上圖案製 作電極膜而形成一對電極的電極形成工程，該電極形成工 程具備：在上述壓電板之表面形成電極膜之電極膜形成工 程；在上述電極膜上形成光阻膜之光阻膜形成工程；用以 形成光阻圖案，藉由配置有第一開口部的光罩對上述光阻 膜進行曝光之第一曝光工程：及藉由在與上述第一開口部 之一部分重铿之位置配置有第二開口部的補正光罩，又對 上述光阻膜進行曝光之第二曝光工程，對應於上述一對電 極之間隙的上述第二開口部之開口寬度係對應於上述間隙 之上述第一開口部之開口寬度以下。 在與該發明有關之壓電振動片之製造方法中，在光阻 膜形成工程成膜之光阻膜之厚度成爲不均勻，即使有在第 -8 -S 201251317 It is difficult to apply evenly. Therefore, as shown in Fig. 27(a), when the photoresist film 2〇1 is partially thick (Part A), as shown in Fig. 27(b), At the time of exposure, the bottom surface 202 is not exposed. As shown in Fig. 27(c), after development, the photoresist film 20 1 (part B) remains. Then, when the etching process is directly performed as described above, the pair of excitation electrodes are connected to each other, so that the electrode is short-circuited. Therefore, in order to make the surface uniform, it is known that the exposure time is increased and the thickness portion is sufficiently removed at the time of exposure. Further, there has been proposed a method of irradiating a laser to the formed photoresist pattern to adjust the shape of at least a part of the pattern (see Patent Document 2). [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004- 1 20 556 [Patent Document 2] JP-A-2003-135A No. 875 (Invention) [Problems to be Solved by the Invention] However, in the above-described conventional (growth exposure time) manufacturing method, as shown in FIG. 28, in the region (C portion) where the thickness of the photoresist film 201 is formed in the normal range, the original region is When the width L1 is removed, the removal width L2 which is wider than this is removed. That is, there is a problem that the amount of removal is excessive, and the pattern size becomes thinner than expected, which affects the characteristics such as an increase in R1. Further, in the manufacturing method described in Patent Document 2, since the laser is irradiated to one of the uneven portions after the development, the 201251317 has a problem that it takes time and becomes expensive. The present invention has been made in view of the above circumstances, and an object thereof is to provide a piezoelectric vibrating piece manufactured by the piezoelectric vibrating piece manufactured by the present invention, which can improve the short-circuit defect of the electrode without increasing the resistance 値R1. Sub- and oscillators with piezoelectric vibrators, electronic equipment, and radio clocks. [Means for Solving the Problem] In order to solve the above problems, the present invention provides the following means. A method of manufacturing a piezoelectric vibrating piece according to the present invention is a method of manufacturing a piezoelectric vibrating piece using a wafer made of a piezoelectric material, characterized in that the wafer is formed by etching the wafer by photolithography. An outer shape forming process of the outer shape of the piezoelectric plate: an electrode forming process for forming an electrode film on the outer surface of the piezoelectric plate to form a pair of electrodes, the electrode forming process comprising: forming an electrode on the surface of the piezoelectric plate An electrode film forming process of the film; a photoresist film forming process of forming a photoresist film on the electrode film; forming a photoresist pattern, exposing the photoresist film by a photomask having a first opening portion An exposure project: and a second exposure project for exposing the photoresist film by a correction mask having a second opening portion disposed at a position overlapping with one of the first openings, corresponding to the pair The opening width of the second opening portion of the gap of the electrode corresponds to the opening width of the first opening portion of the gap. In the method of manufacturing a piezoelectric vibrating piece according to the invention, the thickness of the photoresist film formed in the film formation process of the photoresist film becomes uneven, even if there is a -8 -
S 201251317 一曝光工程無法充分除去光阻膜之部位，第二開口部之開 口寬度因係第一開口部之開口寬度以下，故不會刪減應殘 留之光阻膜之表面積，可以藉由第二曝光工程充分除去應 除去之光阻膜。因此，可以防止一對電極之短路不良。 再者，與本發明有關之壓電振動片之製造方法，係於 進行上述外形形成工程之時，形成壓電板之外形形狀，該 壓電板具有被平行配置之一對振動腕部、將該一對振動腕 部一體性固定之基部，和在一對振動腕部之主面上，從該 振動腕部之基端部朝向前端部形成縱長的溝部，上述一對 電極具有被形成在上述溝部內之主面電極部，和被形成在 上述振動腕部之側面上的側面電極部，上述一對電極之間 隙係上述主面電極部和上述側面電極部之間隙。 一般而言，壓電振動片中之振動腕部之側面和溝部之 間隔因將R 1値抑制成較低，故被形成極窄。因此，形成 在溝部內之主面電極部，和形成在振動腕部之側面上之側 面電極部之間隙變成極窄。 在與該發明有關之壓電振動片之製造方法中，因在對 應於主面電極部和側面電極部之間隙的區域配置第二開口 部，故可以藉由第二曝光工程確實地除去上述間隙之光阻 膜。因此，可以防止該間隙中之主面電極部和側面電極部 之短路不良。 再者，與本發明有關之壓電振動片之製造方法係上述 第二開口部之上述開口寬度爲上述第一開口部之上述開口 寬度之0.6倍以上〇.7倍以下。 201251317 與該發明有關之壓電振動片之製造方法中，用於防止 各電極間之短路，可以確保更佳之間隙。 另外，與本發明有關之壓電振動片之製造方法，係於 上述外形形成工程之時，形成壓電板之外形形狀，該壓電 板具有被平行配置之一對振動腕部，和將該一對振動腕部 —體性固定之基部，在相當於上述一對振動腕部之叉部的 區域，上述第一開口部之上述開口寬度和上述第二開口部 之上述開口寬度大略相同。 在叉部之附近，即使電極膜之除去量過剩，也不會影 響到R 1之增加等之特性値。在此，藉由使第一開口部之 開口寬度和第二開口部之開口寬度大略成爲相同，而除去 上述間隙之光阻，則可以確實地防止電極間之短路不良。 然後，若藉由該該壓電振動片之製造方法而製造出之 壓電振動片時，則可以較佳地抑制電極間之短路。 再者，與本發明有關之壓電振動子係具有上述本發明 之壓電振動片。 在與該發明有關之壓電振動子中，因具備有電極間之 短路可能性低，確保安定之作動之信賴性的壓電振動片， 故可以成爲提升信賴性之高品質的壓電振動子。 與本發明有關之振盪器係上述本發明之壓電振動子作 爲振盪子而電性連接於積體電路。 與本發明有關之電子機器係上述本發明之壓電振動子 電性連接於計時部。 與本發明有關之電波時鐘係上述本發明之壓電振動子S 201251317 The exposure film cannot fully remove the photoresist film. The opening width of the second opening is less than the opening width of the first opening. Therefore, the surface area of the photoresist film to be left is not deleted. The two exposure works sufficiently remove the photoresist film to be removed. Therefore, it is possible to prevent a short circuit failure of a pair of electrodes. Further, a method of manufacturing a piezoelectric vibrating piece according to the present invention is to form a shape of a piezoelectric plate outside the shape forming process, and the piezoelectric plate has a pair of vibrating arms arranged in parallel a base portion integrally fixed to the pair of vibrating arms, and a longitudinal groove formed on a main surface of the pair of vibrating arms from a base end portion of the vibrating arm portion toward a distal end portion, wherein the pair of electrodes are formed The main surface electrode portion in the groove portion and the side surface electrode portion formed on the side surface of the vibrating arm portion, the gap between the pair of electrodes is a gap between the main surface electrode portion and the side surface electrode portion. In general, the interval between the side surface of the vibrating arm portion and the groove portion in the piezoelectric vibrating piece is extremely narrow due to the suppression of R 1 成 to be low. Therefore, the gap between the main surface electrode portion formed in the groove portion and the side surface electrode portion formed on the side surface of the vibrating arm portion becomes extremely narrow. In the method of manufacturing a piezoelectric vibrating piece according to the present invention, since the second opening portion is disposed in a region corresponding to the gap between the main surface electrode portion and the side surface electrode portion, the gap can be surely removed by the second exposure process. Photoresist film. Therefore, it is possible to prevent short-circuit failure of the main surface electrode portion and the side surface electrode portion in the gap. Further, in the piezoelectric vibrating piece manufacturing method according to the present invention, the opening width of the second opening portion is 0.6 times or more and 0.7 times or less the width of the opening of the first opening portion. 201251317 In the method of manufacturing a piezoelectric vibrating piece according to the invention, it is possible to prevent a short circuit between the electrodes and to secure a better gap. Further, a method of manufacturing a piezoelectric vibrating piece according to the present invention is to form a piezoelectric plate outer shape when the outer shape forming process is performed, and the piezoelectric plate has a pair of vibrating arms arranged in parallel, and The pair of vibrating arms are integrally fixed to the base portion, and the opening width of the first opening portion and the opening width of the second opening portion are substantially the same in a region corresponding to the fork portion of the pair of vibrating arms. In the vicinity of the fork portion, even if the amount of removal of the electrode film is excessive, the characteristic 等 such as an increase in R 1 is not affected. Here, by making the opening width of the first opening portion and the opening width of the second opening portion substantially the same, and removing the photoresist of the gap, it is possible to reliably prevent short-circuit defects between the electrodes. When the piezoelectric vibrating reed is manufactured by the method for producing the piezoelectric vibrating reed, the short circuit between the electrodes can be preferably suppressed. Further, the piezoelectric vibrator according to the present invention has the piezoelectric vibrating piece of the present invention described above. In the piezoelectric vibrator according to the present invention, the piezoelectric vibrating piece having a low possibility of short circuit between the electrodes and ensuring the reliability of the stable operation is provided, so that it can be a high-quality piezoelectric vibrator for improving reliability. . The oscillator according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to an integrated circuit as a resonator. An electronic device according to the present invention is characterized in that the piezoelectric vibrator of the present invention is electrically connected to a time measuring portion. The radio wave clock related to the present invention is the piezoelectric vibrator of the present invention described above
-10- S 201251317 電性連接於濾波器部。 在與該發明有關之振盪器、電 因具備有上述壓電振動子，故同樣 及高品質化。 [發明效果] 若藉由本發明，不會增加電阻 不良。 【實施方式】 (壓電振動片） 以下，參照第1圖至第16圖| 電振動片之一實施型態。 本實施型態之壓電振動片1係夺 型之玻璃封裝型之壓電振動子，或'? 子等，如第1圖及第2圖所示般，j 鈮酸鋰等之壓電材料所形成之音叉I 並且，第1圖爲壓電振動片1; 2圖爲構成第1圖所示之振動腕部 放大之圖式。-10- S 201251317 is electrically connected to the filter unit. Since the oscillator and the electric device according to the present invention are provided with the piezoelectric vibrator described above, the quality and the quality are improved. [Effect of the Invention] According to the present invention, resistance defects are not increased. [Embodiment] (Piezoelectric Vibrating Piece) Hereinafter, an embodiment of the electric vibrating piece will be described with reference to Figs. 1 to 16 . The piezoelectric vibrating piece 1 of the present embodiment is a piezoelectric vibrator of a glass-encapsulated type, or a piezoelectric material such as a lithium niobate or the like as shown in Figs. 1 and 2, as shown in Figs. 1 and 2 . The tuning fork I is formed, and Fig. 1 is a piezoelectric vibrating piece 1; Fig. 2 is an enlarged view showing a vibrating wrist portion shown in Fig. 1.
壓電板2具備有配置成平行之 和一體性固定該一對振動腕部3、 5。再者，在該些一對振動腕部3、 從振動腕部3、4之基端部朝向前S 機器及電波時鐘中， 以謀求信賴性之提升 R1，可以改善短路 i明與本發明有關之壓 良組裝於例如表面安裝 (缸封裝型之壓電振動 I備有水晶、鉅酸鋰或 [之壓電板2。 [表面側之俯視圖。第 3、4之基端部爲中心 一對振動腕部3、4， 4之基端部側的基部 ♦之主面（表背面）上， 替部，以一定寬度在振 -11 - 201251317 動腕部3、4之長邊方向形成長的溝部6。該溝部6係形 成在從振動腕部3、4之基端部側越過中間部之範圍上。 依此，一對振動腕部3、4各如第3圖所示般’成爲剖面 Η型。 並且，第3圖爲沿著第2圖所示之Α-Α線的剖面 圖。 在如此形成之壓電板2之外表面上，如第1圖及第2 圖所示般，夾著叉部15形成有一對勵振電極1〇、11及一 對安裝電極12、13。其中，一對勵振電極1〇、11係於施 加電壓之時，利用特定共振頻率使一對振動腕部3、4在 互相接近或間隔開之方向振動的電極，主要在一對振動腕 部3、4之外表面，在各自電性被切離之狀態下被圖案製 造而形成。 具體而言，如第3圖所示般，一方之勵振電極10主 要形成在一方之振動腕部3之溝部6內，和另一方之振動 腕部4之側面上，另一方之勵振電極11主要形成在一方 之振動腕部3之側面上和另一方之振動腕部4之溝部6 內。 在此，針對該勵振電極10、11更詳細予以說明。 本實施型態之勵振電極1 〇、1 1係如第1圖至第3圖 所示般，各由主面電極部20、側面電極部21、連接電極 部22所構成。 主面電極部20爲形成在溝部6內，和包圍該溝部6 之振動腕部3、4之主要表面上之電極。側面電極部21爲The piezoelectric plate 2 is provided with a pair of vibrating arms 3, 5 that are arranged in parallel and integrally fixed. Further, in the pair of vibrating arms 3, from the base end portions of the vibrating arms 3, 4 toward the front S device and the radio wave clock, the reliability R1 can be improved, and the short circuit can be improved. The pressure is assembled, for example, on a surface mount (the piezoelectric vibration of the cylinder package type is provided with crystal, lithium silicate or [piezoelectric plate 2. [Top view of the surface side. The base ends of the third and fourth are centered. On the main surface (front and back) of the base portion ♦ on the base end side of the vibrating arms 3, 4, 4, the replacement portion is formed to have a long width in the longitudinal direction of the vibrating portions 1-3 - 201251317 The groove portion 6 is formed in a range beyond the intermediate portion from the base end portion side of the vibrating arms 3 and 4. Accordingly, the pair of vibrating arms 3 and 4 each become a section as shown in Fig. 3 Further, Fig. 3 is a cross-sectional view taken along the Α-Α line shown in Fig. 2. On the outer surface of the thus formed piezoelectric plate 2, as shown in Figs. 1 and 2, A pair of excitation electrodes 1A and 11 and a pair of mounting electrodes 12 and 13 are formed between the sandwiching portions 15. The pair of excitation electrodes 1A and 11 are connected to a voltage application. An electrode that vibrates in a direction in which the pair of vibrating arms 3, 4 are close to each other or spaced apart by a specific resonance frequency is mainly on the outer surfaces of the pair of vibrating arms 3, 4, and is electrically separated from each other. Specifically, as shown in Fig. 3, one of the excitation electrodes 10 is mainly formed in the groove portion 6 of one of the vibrating arms 3, and on the side of the other vibrating arm portion 4, One of the excitation electrodes 11 is mainly formed on the side surface of one of the vibrating arms 3 and the other in the groove portion 6 of the vibrating arm portion 4. Here, the excitation electrodes 10 and 11 will be described in more detail. The excitation electrodes 1 and 1 are composed of the main surface electrode portion 20, the side surface electrode portion 21, and the connection electrode portion 22 as shown in Figs. 1 to 3. The main surface electrode portion 20 is formed. In the groove portion 6, and an electrode on the main surface of the vibrating arms 3, 4 surrounding the groove portion 6. The side surface electrode portion 21 is
-12- S 201251317 形成在振動腕部3、4之側面上，和在該側面連續之振動 腕部3、4之主面上的電極。此時，被形成在振動腕部 3、4之內方（叉部1 5側）之側面的側面電極部2 1，和被形 成在朝向振動腕部3、4之外方的側面之側面電極部2 1， 係如第1圖所示般，經被形成較溝部6更前端部側之連接 電極部22而導通。 主面電極部20和側面電極部2 1係如第3圖所示般， 設置一定間隔之短路防止用之間隙W0而配置成互相分 離。該間隙W0成爲例如1 5 v m般之極窄間隔。如此一 來，藉由正確形成間隙W 0，防止主面電極部2 0和側面電 極部21之短路等。另外，在叉部15之附近，設置相當於 叉部1 5之寬度的間隙U0，使形成在一方之振動腕部3之 內側面的側面電極部2 1，和形成在另一方之振動腕部4 之內側面的側面電極部2 1配置成互相分離。 連接電極部22係如第2圖及第3圖所示般，以被連 接於側面電極部21之方式，形成在一方之振動腕部3之 主面上，並且在表面側，經由基部5之主要表面上而被拉 繞至另一方之振動腕部4側之後，連接於該振動腕部4側 之主面電極部20的電極。 藉由該連接電極部22，在表面側，連接一方之振動 腕部3側之主面電極部20和另一方振動腕部4側之側面 電極部21，並且在背面側，連接有一方之振動腕部3側 之側面電極部2 1和另一方之振動腕部4側之主面電極部 20 ° -13- 201251317 並且，第1圖、第2圖雖圖示壓電振動片1之表面 側，但是背面側之電極圖案相對於表面側之電極圖案呈左 右對稱。 —對之安裝電極12、13係如第2圖所示般，被形成 在包含基部 5之主面及側面之外表面上，經引出電極 】6，而各被電性連接於一對勵振電極1〇、11。依此，一 對之勵振電極1 0、1 1係經該安裝電極1 2、1 3而施加電 壓。 並且，上述勵振電極10、11、安裝電極12、13及引 出電極16，係例如鉻（Cr)和金（Au)之積層膜，於將與水晶 密接性佳之鉻膜當作基底而予以成膜之後，對表面施予金 的薄膜者。但是，並不限定於此時，例如即使又在例如鉻 和鎳鉻（NiCr)之積層膜表面積層金之薄膜亦可，即使爲 鉻、鎳、鋁（A1)或鈦（Ti)等之單層膜亦可。 再者，在一對振動腕部3、4之前端部，如第1圖所 示般，以本身之振動狀態在特定頻率之範圍內予以振動之 方式形成有用以執行調整（頻率調整）之配重金屬膜17(由 粗調膜17a及微調膜17b所構成）。藉由利用該配重金屬 膜17進行頻率調整，則可以將一對振動腕部3、4之頻率 限制在裝置之公稱頻率的範圍內。 於使構成如此之壓電振動片1作動之時，藉由對一對 勵振電極1 0、1 1間施加特定驅動電壓而流通電流，則可 以以特定頻率使一對振動腕部3、4在接近或間隔開之方 向振動。然後，可以將該振動當作時刻源、控制訊號之時 -14 --12-S 201251317 An electrode formed on the side faces of the vibrating arms 3, 4 and on the main faces of the vibrating arms 3, 4 continuous on the side. At this time, the side surface electrode portion 2 1 formed on the side of the inner side of the vibrating arms 3 and 4 (on the side of the fork portion 15) and the side surface electrode formed on the side other than the outer side of the vibrating arms 3 and 4 The portion 2 1 is electrically connected to the connection electrode portion 22 on the side of the tip end portion of the groove portion 6 as shown in Fig. 1 . As shown in Fig. 3, the main surface electrode portion 20 and the side surface electrode portion 21 are disposed so as to be separated from each other by providing a gap W0 for short-circuit prevention at a constant interval. This gap W0 is an extremely narrow interval such as 1 5 v m. In this manner, by correctly forming the gap W 0 , the short circuit of the main surface electrode portion 20 and the side surface electrode portion 21 is prevented. Further, in the vicinity of the fork portion 15, a gap U0 corresponding to the width of the fork portion 15 is provided, and the side surface electrode portion 2 1 formed on the inner side surface of one of the vibrating arm portions 3 and the vibrating wrist portion formed on the other side are provided. The side surface electrode portions 2 1 on the inner side of 4 are disposed to be separated from each other. As shown in FIGS. 2 and 3, the connection electrode portion 22 is formed on the main surface of one of the vibrating arms 3 so as to be connected to the side surface electrode portion 21, and is provided on the surface side via the base portion 5. After being pulled to the other side of the vibrating arm portion 4 on the main surface, the electrode is connected to the electrode of the main surface electrode portion 20 on the side of the vibrating arm portion 4. By the connection electrode portion 22, the main surface electrode portion 20 on the side of the vibrating arm portion 3 and the side surface electrode portion 21 on the other side of the vibrating arm portion 4 are connected to the front side, and one side vibration is connected to the back side. The side surface electrode portion 2 1 on the side of the wrist portion 3 and the main surface electrode portion on the side of the other side of the vibrating arm portion 4 are 20 ° -13 - 201251317. FIGS. 1 and 2 show the surface side of the piezoelectric vibrating piece 1 However, the electrode pattern on the back side is bilaterally symmetrical with respect to the electrode pattern on the surface side. The mounting electrodes 12 and 13 are formed on the outer surface including the main surface and the side surface of the base 5 as shown in Fig. 2, and are electrically connected to each other by a pair of electrodes. Electrodes 1〇, 11. Accordingly, a pair of excitation electrodes 10, 1 1 are applied with voltage via the mounting electrodes 12, 1 3 . Further, the excitation electrodes 10 and 11 and the mounting electrodes 12 and 13 and the extraction electrode 16 are, for example, a laminated film of chromium (Cr) and gold (Au), and are formed by using a chromium film having good adhesion to crystals as a base. After the film, a film of gold is applied to the surface. However, it is not limited to this, for example, even if it is a film of a laminated film surface area of, for example, chromium and nickel-chromium (NiCr), even a single one of chromium, nickel, aluminum (A1) or titanium (Ti). A film can also be used. Further, as shown in Fig. 1, the front end portions of the pair of vibrating arms 3 and 4 are formed to vibrate within a specific frequency in a vibration state of their own to form an adjustment for performing adjustment (frequency adjustment). The heavy metal film 17 (consisting of the coarse adjustment film 17a and the fine adjustment film 17b). By performing frequency adjustment using the weight metal film 17, the frequency of the pair of vibrating arms 3, 4 can be limited to the nominal frequency of the device. When the piezoelectric vibrating reed 1 is configured to operate, by applying a specific driving voltage between the pair of vibrating electrodes 10 and 1 and flowing a current, the pair of vibrating arms 3 and 4 can be made at a specific frequency. Vibrate in the direction of approach or spacing. Then, you can use the vibration as the source of time and control the signal -14 -
S 201251317 序源或基準訊號源等而予以利用。 (壓電振動片之製造方法） 接著，針對利用由壓電材料所構成之晶圓而製造上述 壓電振動件1之方法，一面參照第4圖所示之流程圖一面 如下予以說明。 首先，結束拋光，準備被高精度精硏磨成特定厚度之 晶圓s(s 1)。接著，藉由光微影技術蝕刻該晶圓s，執行 在該晶圓S形成複數壓電板2之外形形狀之外形形成工程 (S2)。針對該工程，具體性說明。 首先，如第5圖所示般，在晶圓S之雙面上，各形成 蝕刻保護膜30(S 2a)。就以該蝕刻保護膜30而言，例如形 成數# m鉻（C〇膜。接著，藉由光微影技術在蝕刻保護膜 30上圖案製作無圖示之光阻膜。此時，圖案製作成包圍 以一對振動腕部3、4和基部5所構成之壓電板2之周 圍。然後，將該光阻膜當作光罩而執行蝕刻加工，並選擇 性除去不被遮罩之蝕刻保護膜3 0。然後，於蝕刻加工後 除去光阻膜。 依此，如第6圖及第7圖所示般，可以沿著壓電板2 之外形形狀，即是一對振動腕部3、4及基部5之外形形 狀而圖案製作蝕刻保護膜30(S2b)。此時，僅以複數壓電 板2之數量執行圖案製作。並且，第7圖至第1〇圖，爲 沿著第6圖所示之B-B線的剖面圖。 接著，將被圖案製作之蝕刻保護膜3 0當作光罩，分 -15- 201251317 別蝕刻晶圓S之雙面（S2c)。依此，如第8圖所示般，在 蝕刻保護膜30選擇性除去不被光罩之區域，可以製作壓 電板2之外形形狀。在該時點，結束外形形成工程（S2)。 接著，執行在一對振動腕部3、4之主面上形成溝部 6之溝部形成工程（S3)。具體而言，與上述外形形成時相 同，在蝕刻保護膜30上形成光阻膜。然後，藉由光微影 技術，以空出溝部6之區域之方式，圖案製作光阻膜。然 後，將被圖案製作之光阻膜當作光罩而執行鈾刻加工，並 選擇性除去蝕刻保護膜30。之後，藉由除去光阻膜，如 第9圖所示般，可以在空出溝部6之區域之狀態下將已經 被圖案製作之蝕刻保護膜30又予以圖案製作。 接著，將該再次被圖案製作之蝕刻保護膜30當作光 罩，而對晶圆S蝕刻加工之後，除去當作光罩之蝕刻保護 膜30。依此，如第10圖所示般，可以在一對振動腕部 3、4之兩主面上，各形成溝部6。 並且，至執行之後所進行之切斷工程爲止，複數之壓 電板2係成爲經無圖示之連結部而連結於晶圓S之狀態。 (電極形成工程） 接著，藉由執行透過無圖示之光罩的曝光，在複數之 壓電板2之外表面上圖案製作電極膜，執行各形成勵振電 極10、11、引出電極16、安裝電極12、13之電極形成工 程（S4)。針對該工程，予以詳細說明。 電極形成工程中，首先，如第11圖所示般，在形成 -16-S 201251317 Source or reference signal source is used. (Manufacturing Method of Piezoelectric Vibrating Piece) Next, a method of manufacturing the above-described piezoelectric vibrating member 1 using a wafer made of a piezoelectric material will be described below with reference to a flowchart shown in Fig. 4 . First, the polishing is finished, and the wafer s (s 1) of a specific thickness is prepared by high precision grinding. Next, the wafer s is etched by photolithography to perform a shape forming process (S2) in which the plurality of piezoelectric plates 2 are formed on the wafer S. Specific instructions for the project. First, as shown in Fig. 5, an etching protection film 30 (S 2a) is formed on both sides of the wafer S. In the etching protection film 30, for example, a number of m chrome (C 〇 film is formed. Next, a photoresist film (not shown) is patterned on the etching protection film 30 by photolithography. At this time, patterning is performed. Surrounding the periphery of the piezoelectric plate 2 composed of a pair of vibrating arms 3, 4 and a base 5. Then, the photoresist film is etched as a mask, and the etching without masking is selectively removed. The protective film 30. Then, the photoresist film is removed after the etching process. Accordingly, as shown in FIGS. 6 and 7, the shape may be along the outer shape of the piezoelectric plate 2, that is, a pair of vibrating arms 3 The etching protection film 30 (S2b) is patterned in a shape of 4, 4 and the base 5. In this case, patterning is performed only by the number of the plurality of piezoelectric plates 2. Further, Fig. 7 to Fig. 1 are along the 6 is a cross-sectional view of the BB line shown in Fig. 6. Next, the patterned etching protective film 30 is used as a mask, and the double-sided (S2c) of the wafer S is etched by -15-201251317. As shown in Fig. 8, in the region where the etching protection film 30 selectively removes the mask, the shape of the piezoelectric plate 2 can be made. Then, the outer shape forming process is completed (S2). Next, the groove forming process for forming the groove portion 6 on the main surfaces of the pair of vibrating arms 3 and 4 is performed (S3). Specifically, the etching is performed in the same manner as in the case of forming the outer shape. A photoresist film is formed on the protective film 30. Then, by using a photolithography technique, a photoresist film is patterned by vacating the region of the groove portion 6. Then, the patterned photoresist film is used as a mask. The uranium engraving process and selectively removing the etching protection film 30. Thereafter, by removing the photoresist film, as shown in Fig. 9, the etching protective film which has been patterned can be formed in a state where the groove portion 6 is vacated Then, the etching protection film 30 which is patterned again is used as a mask, and after the wafer S is etched, the etching protection film 30 serving as a mask is removed. As shown in the figure, the groove portion 6 can be formed on each of the two main surfaces of the pair of vibrating arms 3 and 4. Further, the plurality of piezoelectric plates 2 are unillustrated until the cutting process is performed after the execution. The connection portion is shown and connected to the state of the wafer S. (Electrode forming process) Next, by performing exposure through a mask (not shown), an electrode film is patterned on the outer surfaces of the plurality of piezoelectric plates 2, and the excitation electrodes 10 and 11 and the extraction electrode 16 are formed. The electrode forming process of the electrodes 12 and 13 is performed (S4). This project will be described in detail. In the electrode forming process, first, as shown in Fig. 11, in the formation of -16-
S 201251317 有溝部6之壓電板2之外表面，藉由蒸鍍或濺鍍 極膜31(S4a)。並且，第11圖、第14圖及第15 一方之振動腕部3。 接著，進行在電極膜31上形成無圖示之光 阻膜形成工程（S4b)。該光阻爲以紫外光持有感 樹脂爲基底的化合物，在本實施型態中採用正 阻。光阻因具有流動性，故藉由噴霧塗敷等被塗 接著，如第12圖所示般，藉由形成有第一· 之光罩33，進行對無圖示之光阻膜曝光紫外光 光工程（S4c)。此時，於欲殘留電極膜31之部分 製作成藉由無圖示之光阻膜而被覆膜。在光罩3 殘留光阻膜之部分形成遮光部，在應除去光阻膜 成有第一開口部32»在此，第一開口部32在 W1形成有對應於主面電極部20和側面電極部2 W0的部分。再者，第一開口部32被形成在對應 動片1之叉部15的部分P。在此，對應於一方 部3之內側面的側面電極部2 1，和形成在另一 腕部4之內側面的側面電極部21之間隙U0的 成在開口寬度U 1 » 第16圖（a)爲第一曝光工程前之狀態，第1 第一曝光工程後之狀態。在光阻膜36被形成規 的部分（C部）中，藉由第一曝光工程曝光厚度方 但是，在光阻膜36局部厚的部分（A部），厚度 不藉由第一曝光工程被曝光，殘留了光阻膜36。 等形成電 圖僅表不 阻膜之光 光感度之 片型之光 佈。 荀口部32 的第一曝 ，被圖案 3於欲不 之部分形 開口寬度 :1之間隙 於壓電振 之振動腕 方之振動 部分，形 6圖（b)爲 定之厚度 向全體。 方向全體 -17- 201251317 (第二曝光工程） 於是，如第13圖所示般’藉由配置有第二開口部34 之補正光罩35，又進行對光阻膜曝光紫外光之第二曝光 工程（S4d)。補正光罩35之第二開口部34被形成在與光 罩33之第一開口部32之一部分重疊之位置。首先’第二 開口部34係被形成在對應於主面電極部20和側面電極部 2 1之間隙W0的部分。該部分中之第二開口部34之開口 寬度W2被形成在第一開口部3 2之開口寬度W 1以下。開 口寬度W2以形成開口寬度W1之0.6倍以上0.7倍以下 爲佳。並且，在第二曝光工程中之曝光條件係與第一曝光 工程相同。 第16圖（c)爲第二曝光工程後之狀態，第16圖（d)爲 後述之顯像工程後之狀態。即使在光阻膜36局部厚的部 分，藉由第二曝光工程使通算曝光時間延長，來曝光厚度 方向全體。依此，可以確實地除去對應於主面電極部20 和側面電極部2 1之間隙W0之部分的光阻膜。其結果， 經過後述金屬蝕刻工程，可以確保主面電極部20和側面 電極部2 1之間隙W 0。 —般而言，壓電振動片1中之振動腕部3、4之側面 和溝部6之間隔音將R 1値抑制成較低，故被形成極窄。 因此，被形成溝部6內之主面電極部2 0，和形成在振動 腕部3、4之側面上的側面電極部21之間隙W0變得極 窄。對此，若藉由本實施型態之壓電振動片之製造方法 -18-S 201251317 The outer surface of the piezoelectric plate 2 having the groove portion 6 is vapor-deposited or sputtered with the electrode film 31 (S4a). Further, the vibrating wrist portion 3 of the eleventh, fourteenth and fifteenth aspects. Next, a photoresist film forming process (S4b) (not shown) is formed on the electrode film 31. The photoresist is a compound based on an ultraviolet light-sensing resin, and a positive resistance is employed in the present embodiment. Since the photoresist has fluidity, it is coated by spray coating or the like, and as shown in Fig. 12, the photoresist mask 33 is formed to expose the photoresist film to the ultraviolet light (not shown). Light Engineering (S4c). At this time, a portion of the electrode film 31 to be left is formed so as to be coated with a photoresist film (not shown). A light blocking portion is formed in a portion of the photoresist 3 where the photoresist film remains, and the photoresist film is removed to have a first opening portion 32. Here, the first opening portion 32 is formed at W1 corresponding to the main surface electrode portion 20 and the side surface electrode. Part 2 W0 part. Further, the first opening portion 32 is formed at a portion P corresponding to the fork portion 15 of the rotor piece 1. Here, the gap U0 corresponding to the inner side surface of the one side portion 3 and the side surface electrode portion 21 formed on the inner side surface of the other arm portion 4 are in the opening width U 1 » Fig. 16 (a ) is the state before the first exposure project, the state after the first first exposure project. In the portion (C portion) where the photoresist film 36 is formed, the thickness is exposed by the first exposure process. However, in the partially thick portion (Part A) of the photoresist film 36, the thickness is not controlled by the first exposure project. After exposure, the photoresist film 36 remains. The formation of the electrogram only shows the light of the film. The first exposure of the mouth portion 32 is patterned in the shape of the opening portion of the pattern. The width of the gap is 1: the gap between the vibrations of the piezoelectric vibration and the shape of the vibration of the piezoelectric vibration, and the shape (6) is a predetermined thickness. Direction Whole -17-201251317 (Second Exposure Project) Thus, as shown in Fig. 13, 'the second exposure of the photoresist film to the ultraviolet light is performed by the correction mask 35 provided with the second opening portion 34 Engineering (S4d). The second opening portion 34 of the correction mask 35 is formed at a position partially overlapping with one of the first opening portions 32 of the reticle 33. First, the second opening portion 34 is formed at a portion corresponding to the gap W0 between the main surface electrode portion 20 and the side surface electrode portion 2 1 . The opening width W2 of the second opening portion 34 in this portion is formed below the opening width W 1 of the first opening portion 32. The opening width W2 is preferably 0.6 times or more and 0.7 times or less the opening width W1. Also, the exposure conditions in the second exposure project are the same as those in the first exposure project. Fig. 16(c) shows the state after the second exposure project, and Fig. 16(d) shows the state after the development project described later. Even in a portion where the photoresist film 36 is partially thick, the entire exposure direction is extended by the second exposure process to expose the entire thickness direction. Accordingly, the photoresist film corresponding to the portion of the gap W0 between the main surface electrode portion 20 and the side surface electrode portion 21 can be surely removed. As a result, the gap W 0 between the main surface electrode portion 20 and the side surface electrode portion 21 can be ensured by a metal etching process to be described later. In general, the sound insulation between the side faces of the vibrating arms 3, 4 and the groove portion 6 in the piezoelectric vibrating piece 1 suppresses R 1 成 to be low, so that it is formed extremely narrow. Therefore, the gap W0 between the main surface electrode portion 20 formed in the groove portion 6 and the side surface electrode portion 21 formed on the side faces of the vibrating arms portions 3, 4 is extremely narrow. In this regard, the manufacturing method of the piezoelectric vibrating piece according to the present embodiment -18-
S 201251317 時’則可以確實地防止該間隙W 0中之主面電極部2 〇和 側面電極部2 1之短路不良。 而且，補正光罩35之第二開口部34之開口寬度W2 因形成光罩33之第一開口部32之開口寬度W1以下，故 即使藉由第二曝光工程通算曝光時間延長，曝光範圍也不 會超過間隙W0。因此，可以在成爲主面電極部20及側面 電極部21之區域殘留光阻膜。其結果，因經過後述金屬 蝕刻工程，可以將主面電極部2 0及側面電極部2 1形成規 定形狀，故可以將R1値抑制成低。 返回第13圖，第二開口部34被形成在對應於壓電振 動片1之叉部15的部分P’。即是，被形成在對應於—方 之振動腕部3之內側面之側面電極部21和另一方之振動 腕部4之內側面之側面電極部21之間隙U 0的部分。該 部分中之第二開口部34之開口寬度U2被形成與第一開 口部32之開口寬度U1大略相同。因藉由使用該補正光 罩35而進行第二曝光工程，通算曝光時間延長，故叉部 15之光阻膜之全部被曝光。因此，可以確實地除去叉部 1 5之光阻膜。其結果，經過後述金屬蝕刻工程，可以確 保一方之振動腕部3之內側面之側面電極部21，和另一 方之振動腕部4之內側面之側面電極部2 1之間隙U0。 並且，在叉部15之附近，即使電極膜之除去量過 剩，也不會影響到R1之增加等之特性値。在此，藉由使 第二開口部34之開口寬度U2與第一開口部32之開口寬 度U1大略成爲相同，而除去叉部15之光阻膜，則可以 -19- 201251317 確實地防止電極間之短路不良。 曝光後，藉由顯像液除去不需要之部分而經加熱工程 等使無圖示之光阻膜固化（S4e)。然後，藉由金屬蝕刻 (S4f)，如第14圖所示般，形成依據對應於電極形成部分 之形狀之光阻膜36的光阻圖案。如此一來，藉由除去光 阻膜36(S4g)，如第15圖所示般，形成勵振電極10、 11、引出電極16、安裝電極12、13而結束電極形成工程 (54) 。 最後，切斷連結晶圓S和壓電板2之連結部，而執行 自晶圆S切離複數壓電板2使成爲小片化之切斷工程 (55) 。依此，可以從一片晶圓S，一度製造複數音叉型之 壓電振動片1。在該時點，結束壓電振動片1之製造工 程，可以取得第1圖所示之壓電振動片1。 如上述般，在與本實施型態有關之壓電振動片之製造 方法中’在光阻膜形成工程成膜之光阻膜之厚度成爲不均 勻’即使有在第一曝光工程無法充分除去光阻膜之部位， 第二開口部34之開口寬度因係第一開口部32之開口寬度 以下’故不會刪減應殘留之光阻膜之表面積，可以藉由第 ~曝光工程充分除去應除去之光阻膜。因此，可以防止— 對電極之短路不良。 (AT切割壓電振動片之製造方法） 亦可以將與本實施型態有關之壓電振動片之製造方法 適用於AT切割壓電振動片（以下稱爲r AT振動片」）。In the case of S 201251317, it is possible to reliably prevent the short-circuit failure of the main surface electrode portion 2 〇 and the side surface electrode portion 21 in the gap W 0 . Further, since the opening width W2 of the second opening portion 34 of the correcting mask 35 is equal to or smaller than the opening width W1 of the first opening portion 32 of the mask 33, even if the exposure time is extended by the second exposure project, the exposure range is not increased. Will exceed the gap W0. Therefore, the photoresist film can remain in the regions to be the main surface electrode portion 20 and the side surface electrode portion 21. As a result, the main surface electrode portion 20 and the side surface electrode portion 21 can be formed into a predetermined shape by a metal etching process which will be described later, so that R1値 can be suppressed to be low. Returning to Fig. 13, the second opening portion 34 is formed in a portion P' corresponding to the fork portion 15 of the piezoelectric vibration piece 1. That is, a portion formed in the gap U 0 of the side surface electrode portion 21 corresponding to the inner side surface of the inner side of the vibrating arm portion 3 and the side surface electrode portion 21 on the inner side surface of the other vibrating arm portion 4. The opening width U2 of the second opening portion 34 in this portion is formed to be substantially the same as the opening width U1 of the first opening portion 32. Since the second exposure process is performed by using the correction mask 35, the exposure time is extended, and all of the photoresist films of the fork portion 15 are exposed. Therefore, the photoresist film of the fork portion 15 can be surely removed. As a result, the gap U0 between the side surface electrode portion 21 on the inner side surface of the vibrating arm portion 3 and the side surface electrode portion 21 on the inner side surface of the other vibrating arm portion 4 can be ensured by a metal etching process which will be described later. Further, in the vicinity of the fork portion 15, even if the amount of removal of the electrode film is excessive, the characteristic 等 such as an increase in R1 is not affected. Here, by making the opening width U2 of the second opening portion 34 and the opening width U1 of the first opening portion 32 substantially the same, and removing the photoresist film of the fork portion 15, the electrode can be reliably prevented from -19 to 201251317. The short circuit is poor. After the exposure, the unnecessary portion is removed by the developing solution, and the photoresist film (not shown) is cured by heating (S4e). Then, by metal etching (S4f), as shown in Fig. 14, a photoresist pattern according to the photoresist film 36 corresponding to the shape of the electrode forming portion is formed. In this manner, by removing the photoresist film 36 (S4g), as shown in Fig. 15, the excitation electrodes 10, 11, the extraction electrode 16, and the mount electrodes 12, 13 are formed, and the electrode formation process (54) is completed. Finally, the connection portion between the connection wafer S and the piezoelectric plate 2 is cut, and the cutting of the plurality of piezoelectric plates 2 from the wafer S is performed to make the chipping process (55). According to this, the piezoelectric vibrating piece 1 of the complex tuning fork type can be manufactured from one wafer S at a time. At this time, the manufacturing process of the piezoelectric vibrating reed 1 is completed, and the piezoelectric vibrating reed 1 shown in Fig. 1 can be obtained. As described above, in the method of manufacturing a piezoelectric vibrating piece according to the present embodiment, the thickness of the photoresist film formed in the photoresist film forming process becomes uneven, even if the light cannot be sufficiently removed in the first exposure process. In the portion of the resist film, the opening width of the second opening portion 34 is less than the opening width of the first opening portion 32. Therefore, the surface area of the resist film to be left is not removed, and it can be removed by the first exposure process. Photoresist film. Therefore, it is possible to prevent a short circuit to the electrode. (Manufacturing method of the AT-cut piezoelectric vibrating piece) The manufacturing method of the piezoelectric vibrating piece according to the present embodiment can be applied to an AT-cut piezoelectric vibrating piece (hereinafter referred to as r AT vibrating piece).
-20- S 201251317 第24圖所示之AT振動片142具備有長方形狀之壓 電板149。在壓電板149之中央部形成有矩形狀之勵振電 極140。在壓電板149之一邊之兩端部形成有一對安裝電 極141。勵振電極140及一對安裝電極141被形成在壓電 板149之兩面。兩面安裝電極141係藉由形成在壓電板 1 4 9之側面的側面電極1 4 4而互相連接。一對之側面電極 144係隔著間隙T0而被配置》然後，壓電板149之表面 之勵振電極140被連接於一方之安裝電極141，壓電板 149之背面之勵振電極140連接於另一方之安裝電極 14卜 第一曝光工程係使用第25圖所示之光罩143而進 行。在光罩143形成有第一開口部146。第一開口部146 係在開口寬度T 1形成有對應於一對側面電極1 44之間隙 T0的部分。在第一曝光工程中，因通過該開口寬度T1， 而曝光配置在壓電板1 49之側面的光阻膜，故有配置在間 隙T0之光阻膜之一部分不被曝光而殘留之可能性。此 時，一對之側面電極144之間隙T0被連結而產生短路不 良。 於是，使用第26圖所不之補正光罩145而進行第二 曝光工程。在補正光罩145形成有第二開口部147。第二 開口部1 47係被形成在對應於一對側面電極1 44之間隙 T0的部分。該部分中之第二開口部〗47之開口寬度T2被 形成與第一開口部146之開口寬度T1大略相同。並且， 因即使在間隙T 0以外之壓電板1 4 9之側面，也有殘留光 -21 - 201251317 阻膜之可能性，故在對應於間隙το以外之側面也形成第 二開口部1 4 7。 因藉由使用該補正光罩I45而進行第二曝光工程，通 算曝光時間延長，故配置在一對側面電極1 44之間隙Τ0 的光阻膜之全部被曝光。因此，可以確實地除去間隙TO 之光阻膜。其結果，可以確保一對側面電極144之間隙 T0。並且，在一對側面電極1 44之間隙T0，即使電極膜 之除去量過剩，也不會影容到R 1之增加等之特性値。在 此，藉由使第二開口部之開口寬度T2與第一開口部 M6之開口寬度T1大略成爲相同，而除去間隙T0之光阻 膜，則可以更確實地防止一對側面電極1 44之短路不良。 (玻璃封裝型之壓電振動子） 接著，參照第17圖至第20圖說明與本發明有關之壓 電振動子之一實施型態。並且，在本實施型態中，就以壓 電振動子之一例而言，以表面安裝型之玻璃封裝型之壓電 振動子爲例予以說明。 本實施型態之壓電振動子40係如第1 7圖至第20圖 所示般，藉由基座基板41和頂蓋基板42形成疊層兩層之 箱狀，成爲在內部之空腔C內收納有上述音叉型之壓電振 動片1之壓電振動子40。 並且，第17圖爲壓電振動子40之外觀斜視圖。第 18圖爲第17圖所示之壓電振動子40之內部構造圖，在 取下頂蓋基板42之狀態下之上視圖。第1 9圖爲沿著第-20- S 201251317 The AT diaphragm 142 shown in Fig. 24 is provided with a rectangular piezoelectric plate 149. A rectangular excitation electrode 140 is formed at a central portion of the piezoelectric plate 149. A pair of mounting electrodes 141 are formed at both ends of one side of the piezoelectric plate 149. The excitation electrode 140 and the pair of mounting electrodes 141 are formed on both surfaces of the piezoelectric plate 149. The double-sided mounting electrodes 141 are connected to each other by the side electrodes 144 formed on the side faces of the piezoelectric plates 149. The pair of side electrodes 144 are disposed via the gap T0. Then, the excitation electrode 140 on the surface of the piezoelectric plate 149 is connected to one of the mounting electrodes 141, and the excitation electrode 140 on the back surface of the piezoelectric plate 149 is connected to The other mounting electrode 14 is formed by using the photomask 143 shown in Fig. 25 for the first exposure process. A first opening portion 146 is formed in the photomask 143. The first opening portion 146 is formed with a portion corresponding to the gap T0 of the pair of side surface electrodes 1 44 at the opening width T 1 . In the first exposure process, since the photoresist film disposed on the side surface of the piezoelectric plate 149 is exposed through the opening width T1, there is a possibility that a portion of the photoresist film disposed in the gap T0 is not exposed and remains. . At this time, the gap T0 of the pair of side electrodes 144 is connected to cause a short circuit. Then, the second exposure process is performed using the correction mask 145 which is not shown in Fig. 26. A second opening portion 147 is formed in the correction mask 145. The second opening portion 1 47 is formed at a portion corresponding to the gap T0 of the pair of side surface electrodes 1 44. The opening width T2 of the second opening portion 47 in this portion is formed to be substantially the same as the opening width T1 of the first opening portion 146. Further, since there is a possibility that the light is blocked from the side of the piezoelectric plate 149 except for the gap T 0 , the second opening portion 1 4 is formed on the side surface other than the gap το. . Since the second exposure process is performed by using the correction mask I45, the exposure time is extended, so that all of the photoresist films disposed in the gap Τ0 of the pair of side electrodes 1 44 are exposed. Therefore, the photoresist film of the gap TO can be surely removed. As a result, the gap T0 between the pair of side electrodes 144 can be ensured. Further, in the gap T0 between the pair of side surface electrodes 1 44, even if the amount of removal of the electrode film is excessive, the characteristic 等 such as an increase in R 1 is not affected. Here, by making the opening width T2 of the second opening portion and the opening width T1 of the first opening portion M6 substantially the same, and removing the photoresist film of the gap T0, it is possible to more reliably prevent the pair of side surface electrodes 1 44. Bad short circuit. (Plasma Mounted Piezoelectric Vibrator) Next, an embodiment of the piezoelectric vibrator according to the present invention will be described with reference to Figs. 17 to 20 . Further, in the present embodiment, a surface mount type of glass package type piezoelectric vibrator will be described as an example of a piezoelectric vibrator. The piezoelectric vibrator 40 of the present embodiment has a box shape in which two layers are laminated by the base substrate 41 and the top cover substrate 42 as shown in FIGS. 7 to 20, and becomes a cavity inside. The piezoelectric vibrator 40 of the tuning-fork type piezoelectric vibrating reed 1 is housed in C. Further, Fig. 17 is a perspective view showing the appearance of the piezoelectric vibrator 40. Fig. 18 is a view showing the internal structure of the piezoelectric vibrator 40 shown in Fig. 17, in a state in which the top cover substrate 42 is removed. Figure 19 is along the first
-22- S 201251317 18圖所示之D-D線之壓電振動子40的剖面圖。第20圖 爲壓電振動子40之分解斜視圖。並且，在第20圖中，由 壓電振動片1省略各電極之圖示。 壓電振動片1係利用金等之凸塊B，藉由凸塊接合被 安裝在基座基板41之上面。更具體而言，形成在被圖案 製作在基座基板41之上面的後述之引繞電極48、49上之 兩個凸塊B上，係在一對安裝電極12、13各接觸之狀態 下被凸塊接合。依此，壓電振動片1係在從基座基板41 之上面浮起之狀態下被支撐，並且安裝電極12、13和引 繞電極48、49成爲分別被電性連接之狀態。 頂蓋基板42爲由玻璃材料，例如鈉鈣玻璃所構成之 透明之絕緣基板，如第1 7圖、第1 9圖以及第20圖所示 般’形成板狀。然後，於接合基座基板41之接合面側， 形成有收放壓電振動片1之矩形狀之凹部42a。該凹部 42 a係於重疊兩基板41、42之時，成爲收容壓電振動片1 之空腔C的空腔用之凹部42 a。然後，頂蓋基板42係在 使該凹部42a對向於基座基板41側之狀態下，對該基座 基板41陽極接合。 基座基板4 1係與頂蓋基板4 2相同由玻璃材料，例如 鈉鈣玻璃所構成之透明絕緣基板，如第1 7圖至第20圖所 示般，以可以重疊於頂蓋基板42之大小形成板狀。 在該基座基板41形成有貫通該基座基板41之一對貫 穿孔（貫通孔）43、44。此時，一對貫穿孔43、44係被形 成收放於空腔C內。當更詳細說明時，則係被形成一方之 -23- 201251317 貫穿孔43位於被安裝之壓電振動片1之基部5側，另一 方之貫穿孔44位於振動腕部3、4之前端側。 再者，在本實施型態中，雖然以筆直貫通基座基板 4 1之貫穿孔43、44爲例而予以說明，但是並不限定於此 情形，即使形成例如朝向基座基板41之下面而逐漸縮徑 之錐形狀亦可。無論哪一種，若貫通基座基板4 1即可。 然後，在該些一對貫穿孔43、44形成有以掩埋該貫 穿孔43、44之方式形成的一對貫通電極45、46。該貫通 電極45、46係發揮完全塞住貫穿孔43 ' 44維持空腔C內 之氣密，並且使後述之外部電極50、51和引繞電極48、 49導通之任務。 在基座基板41之上面側（接合頂蓋基板42之接合面 側），藉由導電性材料（例如，鋁），圖案製作陽極接合用 之接合膜47，和一對引繞電極48、49。其中，接合膜47 以包圍被形成在頂蓋基板42之凹部42a之周圍之方式， 沿著基座基板41之周緣而形成。 再者，一對引繞電極48、49係電性連接一對貫通電 極45、46之中，一方貫通電極45和壓電振動片1之一方 的安裝電極12，並且圖案製作成電性連接另一方之貫通 電極46和壓電振動片1之另一方之安裝電極13。 當更詳細說明時，則如第1 8圖至第20圖所示般，一 方之引繞電極48以位於壓電振動片1之基部5之正下方 之方式，形成在一方貫通電極45之正上方。再者，另一 方之引繞電極49係被形成從與一方之引繞電極48鄰接之-22- S 201251317 18 is a cross-sectional view of the piezoelectric vibrator 40 of the D-D line shown in the figure. Fig. 20 is an exploded perspective view of the piezoelectric vibrator 40. Further, in Fig. 20, the piezoelectric vibrating reed 1 is omitted from illustration of each electrode. The piezoelectric vibrating reed 1 is mounted on the upper surface of the base substrate 41 by bump bonding using a bump B of gold or the like. More specifically, the two bumps B formed on the lead electrodes 48 and 49, which will be described later on the base substrate 41, are in contact with each other in a state in which the pair of mounting electrodes 12 and 13 are in contact with each other. Bump joints. As a result, the piezoelectric vibrating reed 1 is supported in a state of being floated from the upper surface of the base substrate 41, and the mount electrodes 12 and 13 and the lead electrodes 48 and 49 are electrically connected to each other. The top cover substrate 42 is a transparent insulating substrate made of a glass material such as soda lime glass, and is formed into a plate shape as shown in Figs. 7, 17 and 20. Then, a rectangular recessed portion 42a for accommodating the piezoelectric vibrating reed 1 is formed on the joint surface side of the bonded base substrate 41. The recessed portion 42a is a recessed portion 42a for a cavity in which the cavity C of the piezoelectric vibrating reed 1 is housed when the two substrates 41 and 42 are stacked. Then, the top cover substrate 42 is anodically bonded to the base substrate 41 in a state where the concave portion 42a faces the base substrate 41 side. The base substrate 41 is a transparent insulating substrate made of a glass material such as soda lime glass, similar to the top cover substrate 4 1 , as shown in FIGS. 17 to 20 , so as to be overlapped with the top cover substrate 42 . The size is formed into a plate shape. The base substrate 41 is formed with a pair of through holes (through holes) 43 and 44 penetrating through the base substrate 41. At this time, the pair of through holes 43, 44 are formed to be housed in the cavity C. When it is described in more detail, the through hole 43 is formed on the side of the base portion 5 of the piezoelectric vibrating reed 1 to be mounted, and the other through hole 44 is located on the front end side of the vibrating arms 3 and 4. In the present embodiment, the through holes 43 and 44 penetrating the base substrate 4 1 are described as an example. However, the present invention is not limited to this case, and is formed, for example, toward the lower surface of the base substrate 41. The tapered shape of the tapered diameter can also be used. Either way, it is sufficient to penetrate the base substrate 4 1 . Then, a pair of through electrodes 45, 46 formed to bury the through holes 43, 44 are formed in the pair of through holes 43, 44. The through electrodes 45 and 46 serve to completely block the through holes 43' to maintain the airtightness in the cavity C, and to open the external electrodes 50, 51 and the lead electrodes 48, 49 which will be described later. On the upper surface side of the base substrate 41 (on the bonding surface side of the bonding cap substrate 42), a bonding film 47 for anodic bonding, and a pair of routing electrodes 48, 49 are patterned by a conductive material (for example, aluminum). . The bonding film 47 is formed along the periphery of the base substrate 41 so as to surround the recess 42a formed on the top substrate 42. Further, the pair of routing electrodes 48 and 49 are electrically connected to the pair of through electrodes 45 and 46, and one of the electrodes 45 and the mounting electrode 12 of one of the piezoelectric vibrating reeds 1 are electrically connected to each other. The other one of the through electrode 46 and the piezoelectric vibrating piece 1 is mounted on the electrode 13. As will be described in more detail, as shown in FIGS. 18 to 20, one of the lead electrodes 48 is formed directly on the base 5 of the piezoelectric vibrating reed 1 so as to be formed on one of the through electrodes 45. Above. Further, the other lead electrode 49 is formed adjacent to one of the lead electrodes 48.
-24- S 201251317 位置，沿著振動腕部4而被引繞至該振動腕部4之 側之後，位於另一方之貫通電極46之正上方。 然後，在該些一對引繞電極48、49上分別形 B，利用該凸塊B安裝壓電振動片1。依此，壓電 1之一方的安裝電極12經一方之引繞電極48與一 通電極45導通，另一方之安裝電極13經另一方之 極49與另一方之貫通電極46導通。 再者，在基座基板41之下面，如第17圖、身 及第20圖所示般，形成分別電性連接於一對貫 45、46之外部電極50、51。依此，一對之外部電彳 51係經一對貫通電極45、46及一對引繞電極48 被電性連接於壓電振動片1之一對勵振電極1〇、1: 於使如此構成之壓電振動子40作動之時，則 外部電極5 0、5 1之間，施加特定驅動電壓。依此 使電流流通於壓電振動片1之勵振電極1 〇、1 1， 由特定頻率使一對振動腕部3、4在接近或間隔開 振動。然後，可以將該振動當作時刻源、控制訊號 源或基準訊號源等而予以利用。 若藉由本實施型態之壓電振動子40時，因具 線之可能性低，確保著安定之作動之信賴性的壓電 1，故可以成爲提升信賴性之高品質的壓電振動子。 再者，該壓電振動子40因爲將壓電振動片1 空腔內C之表面安裝型之玻璃封裝型’故不會受到 之影響，可以使壓電振動片1振動，並可以謀求 前端部 成凸塊 振動片 方之貫 引繞電 ! 19圖 通電極 極50、 、49而 I ° 對一對 ，可以 可以藉 之方向 之時序 備有斷 振動片 密閉在 塵埃等 闻品質 -25- 201251317 化。除此之外，因係表面安裝型，故可以容易執行安裝， 並且安裝後之安定性優良。 (振盪器） 接著，針對與本發明有關之振盪器之一實施型態，一 面參照第21圖一面予以說明。 本贾施型態之振盪器100係如第21圖所示般，將上 述壓電振動子40當作電性連接於積體電路101之振盪子 而予以構成者。並且，即使內藏壓電振動子40亦可。 該振盪器1〇〇具備有安裝電容器等之電子零件102之 基板103。在基板103安裝有振盪器用之上述積體電路 1〇1，在該積體電路101之附近，安裝有壓電振動子40之 壓電振動片1。 該些電子零件102、積體電路101及壓電振動子40 係藉由無圖示之配線圖案分別被電性連接。並且，各構成 零件係藉由無圖示之樹脂而被模製。 在如此構成之振盪器1〇〇中，當對壓電振動子40施 加電壓時，該壓電振動子40內之壓電振動片1則振動。 該振動係藉由壓電振動片1具有之壓電特性變換成電訊 號，當作電訊號被輸入至積體電路101。被輸入之電訊號 藉由積體電路101被施予各種處理，當作頻率訊號被輸 出。依此，壓電振動子40當作振盪子而發揮功能。 再者，可以將積體電路101之構成，藉由因應要求選 擇性設定例如RTC(即時鐘）模組等，附加除控制時鐘用單The position of -24-S 201251317 is guided to the side of the vibrating arm portion 4 along the vibrating arm portion 4, and is located directly above the other through electrode 46. Then, B is formed on each of the pair of routing electrodes 48, 49, and the piezoelectric vibrating reed 1 is mounted by the bumps B. Accordingly, one of the piezoelectric electrodes 1 is electrically connected to the one via electrode 45 via one of the lead electrodes 48, and the other mounting electrode 13 is electrically connected to the other through electrode 46 via the other electrode 49. Further, on the lower surface of the base substrate 41, external electrodes 50, 51 electrically connected to the pair of through portions 45, 46, respectively, are formed as shown in Fig. 17, and FIG. Accordingly, the pair of external electrodes 51 are electrically connected to one of the piezoelectric vibrating reed electrodes 1 through the pair of through electrodes 45 and 46 and the pair of routing electrodes 48, and are: When the piezoelectric vibrator 40 is configured to operate, a specific driving voltage is applied between the external electrodes 50 and 51. In response to this, an electric current is caused to flow through the excitation electrodes 1 〇 and 1 of the piezoelectric vibrating reed 1 to cause the pair of vibrating arms 3 and 4 to vibrate in close proximity or at intervals. The vibration can then be utilized as a source of time, a source of control signals, or a source of reference signals. When the piezoelectric vibrator 40 of the present embodiment is used, the piezoelectric vibrator which is highly reliable and reliable can be used because it is less likely to have a line and is reliable. In addition, the piezoelectric vibrator 40 is not affected by the surface-mounting type of the glass package type C in the cavity of the piezoelectric vibrating reed 1 , and the piezoelectric vibrating reed 1 can be vibrated, and the tip end portion can be obtained. The bump is vibrating in the direction of the bumps! 19 through the electrode poles 50, 49 and I ° to a pair, you can use the timing of the direction of the vibration sheet sealed in the dust and other quality -25 - 201251317. In addition, since it is a surface mount type, it can be easily mounted, and the stability after installation is excellent. (Oscillator) Next, an embodiment of an oscillator relating to the present invention will be described with reference to Fig. 21 on the one hand. The present embodiment of the oscillator 100 is constructed by electrically connecting the piezoelectric vibrator 40 to the resonator of the integrated circuit 101 as shown in Fig. 21. Further, even if the piezoelectric vibrator 40 is incorporated. The oscillator 1A is provided with a substrate 103 on which an electronic component 102 such as a capacitor is mounted. The integrated circuit 1〇1 for the oscillator is mounted on the substrate 103, and the piezoelectric vibrating reed 1 of the piezoelectric vibrator 40 is mounted in the vicinity of the integrated circuit 101. The electronic component 102, the integrated circuit 101, and the piezoelectric vibrator 40 are electrically connected by wiring patterns (not shown). Further, each component is molded by a resin (not shown). In the oscillator 1A configured as described above, when a voltage is applied to the piezoelectric vibrator 40, the piezoelectric vibrating reed 1 in the piezoelectric vibrator 40 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece 1, and is input as an electric signal to the integrated circuit 101. The input electric signal is subjected to various processes by the integrated circuit 101, and is output as a frequency signal. Accordingly, the piezoelectric vibrator 40 functions as a resonator. Furthermore, the configuration of the integrated circuit 101 can be arbitrarily set by, for example, an RTC (or clock) module, etc., in addition to the control clock.
-26- S 201251317 功能振盪器等之外，亦可以控制該機器或外部機器之動作 曰或時刻，或提供時刻或日曆等之功能。 若藉由本實施型態之振盪器100時，因具備有上述壓 電振動子40，故可以謀求振盪器100本身之信賴性的提 昇化及高品質化。再者，除此之外，可以取得在長期間安 定之高精度之頻率訊號。 (電子機器） 接著，針對本發明所涉及之電子機器之一實施型態， 一面參照第22圖一面予以說明。並且，作爲電子機器， 以具有上述壓電振動子40之行動資訊機器110爲例予以 說明。並且，即使內藏壓電振動子40亦可。 首先，本實施型態之行動資訊機器11 〇代表的有例如 行動電話，爲發展、改良以往技術的手錶。外觀類似手 錶，於相當於文字盤之部分配置液晶顯示器，在該畫面上 可以顯示現在之時刻等。再者，於當作通訊機利用之時， 從手腕拆下，藉由內藏在錶帶之內側部分的揚聲器及送話 器，可執行與以往技術之行動電話相同的通訊。但是’比 起以往之行動電話，格外小型化及輕量化。 接著，針對本實施型態之行動資訊機器110之構成予 以說明。 該行動資訊機器110係如第22圖所示般’具備有壓 電振動子40，和用以供給電力之電源部1 1 1。電源部1 1 1 係由例如鋰二次電池所構成。在該電源部111並列連接有 -27- 201251317 執行各種控制之控制部1 1 2、執行時刻等之計數的計時部 113、執行與外部通訊之通訊部114、顯示各種資訊之顯 示部1 1 5，和檢測出各個的功能部之電壓的電壓檢測部 1 1 6。然後，成爲藉由電源部1 1 1對各功能部供給電力。 控制部1 1 2控制各功能部而執行聲音資料之發送及接 收、現在時刻之測量或顯示等之系統全體的動作控制。再 者，控制部112具備有事先寫入程式之ROM，和讀出被 寫入該ROM之程式而加以實行之CPU，和當作該CPU之 工作區域使用之RAM等。 計時部113具備有內藏振盪電路、暫存器電路、計數 器電路及介面電路等之積體電路，和壓電振動子40。當 對壓電振動子40施加電壓時，壓電振動片1振動，該振 動藉由水晶具有之壓電特性變換成電訊號，當作電訊號被 輸入至振盪電路》振盪電路之輸出被二値化，藉由暫存器 電路和計數器電路而被計數。然後，經介面電路，而執行 控制部1 1 2和訊號之收發訊，在顯示部1 1 5顯示現在時刻 或現在日期或日曆資訊等。 通訊部114具有與以往之行動電路相同之功能，具備 有無線部1 1 7、聲音處理部1 1 8、切換部1 1 9、放大部 120、聲音輸入輸出部121、電話號碼輸入部丨22、來電鈴 產生部1 23及呼叫控制記憶部1 24。 無線部1 1 7係將聲音資料等之各種資料，經天線1 2 5 執行基地局和收發訊的處理。聲音處理部118係將自無線 部Π7或放大部120所輸入之聲音訊號予以編碼化及解碼-26- S 201251317 In addition to the function oscillator, etc., it is also possible to control the action or time of the machine or external machine, or to provide functions such as time or calendar. According to the oscillator 100 of the present embodiment, since the piezoelectric vibrator 40 is provided, the reliability of the oscillator 100 itself can be improved and the quality can be improved. Furthermore, in addition to this, it is possible to obtain a high-precision frequency signal that is stable over a long period of time. (Electronic Apparatus) Next, an embodiment of an electronic apparatus according to the present invention will be described with reference to Fig. 22 . Further, as an electronic device, the mobile information device 110 having the piezoelectric vibrator 40 described above will be described as an example. Further, even if the piezoelectric vibrator 40 is incorporated. First, the mobile information device 11 of the present embodiment represents, for example, a mobile phone, and is a watch for developing and improving the prior art. The appearance is similar to that of a hand watch, and a liquid crystal display is arranged in a portion corresponding to a dial, and the current time can be displayed on the screen. Further, when it is used as a communication device, it can be removed from the wrist, and the same communication as the conventional mobile phone can be performed by the speaker and the microphone built in the inner portion of the band. However, it is much smaller and lighter than previous mobile phones. Next, the configuration of the mobile information device 110 of the present embodiment will be described. The mobile information device 110 is provided with a piezoelectric vibrator 40 and a power supply unit 1 1 1 for supplying electric power as shown in Fig. 22 . The power supply unit 1 1 1 is composed of, for example, a lithium secondary battery. The power supply unit 111 is connected in parallel to the control unit 1 1 2 that performs various controls, the time measuring unit 113 that counts the execution time and the like, the communication unit 114 that performs external communication, and the display unit that displays various kinds of information 1 1 5 And a voltage detecting unit 1 16 that detects the voltage of each functional unit. Then, power is supplied to each functional unit by the power supply unit 1 1 1 . The control unit 1 1 2 controls each functional unit to perform operation control of the entire system such as transmission and reception of voice data, measurement or display of current time. Further, the control unit 112 includes a ROM in which a program is written in advance, a CPU that reads and executes a program written in the ROM, and a RAM that is used as a work area of the CPU. The timer unit 113 includes an integrated circuit including a built-in oscillation circuit, a register circuit, a counter circuit, and a interface circuit, and a piezoelectric vibrator 40. When a voltage is applied to the piezoelectric vibrator 40, the piezoelectric vibrating piece 1 vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristic of the crystal, and is input as an electric signal to the oscillation circuit. The count is counted by the scratchpad circuit and the counter circuit. Then, the control unit 1 1 2 and the signal transmission and reception are executed via the interface circuit, and the current time or current date or calendar information or the like is displayed on the display unit 1 15 . The communication unit 114 has the same function as the conventional mobile circuit, and includes a radio unit 1 17, a sound processing unit 1 18, a switching unit 1 19, an amplifying unit 120, an audio input/output unit 121, and a telephone number input unit 22 The call bell generating unit 1 23 and the call control storage unit 1 24 . The radio unit 1 1 7 performs processing of the base station and the transmission and reception by the antenna 1 2 5 by using various materials such as voice data. The sound processing unit 118 encodes and decodes the audio signal input from the wireless unit 7 or the amplifying unit 120.
-28- S 201251317 化。放大部120係將聲音處理部118或聲音輸入輸出部 121所輸入之訊號放大至特定位準。聲音輸入輸出部ι21 係由揚聲器或送話器等所構成，擴音來電鈴或通話聲音， 或使聲音集中。 再者，來電鈴產生部123係因應來自基地台之呼叫而 產生來電鈴。切換部119限於來電時，藉由將連接於聲音 處理部118之放大部120切換成來電鈴產生部123，在來 電鈴產生部123產生之來電鈴經放大部120而被輸出至聲 音輸入輸出部121。 並且，呼叫控制記憶部1 24儲存通訊之發送呼叫控制 所涉及之程式。再者，電話號碼輸入部1 22具備有例如從 〇至9之號碼按鍵及其他按鍵，藉由按下該些號碼鍵等， 輸入連絡人之電話號碼等。 電壓檢測部Η 6係當藉由電源部1 1 1對控制部1 1 2等 之各功能部施加之電壓低於特定値時，檢測出其電壓下降 而通知至控制部1 1 2。此時之特定電壓値係當作爲了使通 訊部114安定動作所需之最低限的電壓而事先設定之値， 例如3 V左右。從電壓檢測部1 1 6接收到電壓下降之通知 的控制部U 2係禁止無線部1 1 7、聲音處理部1 1 8、切換 部1 1 9及來電鈴產生部1 2 3之動作。尤其，必須停止消耗 電力大的無線部117之動作。並且，在顯示部115顯示由 於電池殘量不足通訊部1 1 4不能使用之訊息。 即是，藉由電壓檢測部1 1 6和控制部1 1 2，禁止通訊 部1 1 4之動作，可以將其訊息顯示於顯示部1 1 5。該顯示 -29 * 201251317 即使爲文字簡訊亦可，即使在顯示部115之顯示面上部所 顯示的電話圖示上劃上χ(叉號）以作爲更直覺性之顯示亦 可。 並且，具備有電源阻斷部126，該電源阻斷部126係 可以選擇性阻斷通訊部1 1 4之功能所涉及之部分之電源， 依此可以更確Η停止通訊部1 1 4之功能。 若藉由本贲施型態之行動資訊機器1 1 0時，因具備有 上述壓電振動子40，故可以謀求行動資訊機器本身之信 賴性的提昇化及高品質化。再者，除此之外，可以取得在 長期間安定之高精度之時鐘資訊。 (電波時鐘） 接著，針對本發明所涉及之電波時鐘130之一實施型 態，一面參照第23圖一面予以說明。本實施型態之電波 時鐘130係如第23圖所示般，具備有電性連接於濾波器 部131之壓電振動子40，接收含時鐘資訊之標準之電 波，具有自動修正成疋確時刻而予以顯示之功能的時鐘。 並且，即使內藏壓電振動子40亦可。 在日本國內在福島縣（40kHz)和佐賀縣（60kHz)有發送 標準電波之發送所（發送局），分別發送標準電波。因 40kHz或60kHz般之長波合倂傳播地表之性質，和一面反 射電離層和地表一面予以傳播之性質，故傳播範圍變寬， 以上述兩個發送所網羅全日本國內。 以下，針對電波時鐘1 3 0之功能性構成予以詳細說 -30--28- S 201251317. The amplifying unit 120 amplifies the signal input from the sound processing unit 118 or the sound input/output unit 121 to a specific level. The sound input/output unit ι21 is composed of a speaker or a microphone, and the sound of the incoming call or the call is amplified, or the sound is concentrated. Further, the incoming call ring generating unit 123 generates an incoming call bell in response to a call from the base station. When the switching unit 119 is limited to the incoming call, the switching unit 120 connected to the audio processing unit 118 is switched to the incoming call generating unit 123, and the incoming call bell generating unit 123 generated by the incoming call generating unit 123 is output to the audio input/output unit. 121. Further, the call control storage unit 1 24 stores the program related to the transmission call control of the communication. Further, the telephone number input unit 1 22 is provided with a number button and other buttons such as from 〇 to 9, and the telephone number of the contact person or the like is input by pressing the number keys or the like. When the voltage applied to each functional unit such as the control unit 1 1 2 by the power supply unit 1 1 1 is lower than the specific frequency, the voltage detecting unit 6 detects the voltage drop and notifies the control unit 1 1 2 of the voltage drop. The specific voltage 此时 at this time is set in advance as a minimum voltage required for the communication unit 114 to operate stably, for example, about 3 V. The control unit U 2 that has received the notification of the voltage drop from the voltage detecting unit 1 16 prohibits the operations of the radio unit 1 17 , the audio processing unit 1 18, the switching unit 1 1 9 and the ringer generating unit 1 2 3 . In particular, it is necessary to stop the operation of the wireless unit 117 that consumes a large amount of power. Further, the display unit 115 displays a message that the communication unit 1 1 4 cannot be used because the battery remaining amount is insufficient. In other words, the voltage detecting unit 1 16 and the control unit 1 1 2 prohibit the operation of the communication unit 1 14 and display the message on the display unit 1 15 . This display -29 * 201251317 Even if it is a text message, even a χ (cross) is displayed on the telephone icon displayed on the upper surface of the display unit 115 as a more intuitive display. Further, the power supply blocking unit 126 is provided, and the power blocking unit 126 can selectively block the power supply of the part of the function of the communication unit 141, thereby making it possible to stop the function of the communication unit 1 1 4 more reliably. . When the mobile information device 1 10 is configured by the present embodiment, the piezoelectric vibrator 40 is provided, so that the reliability of the mobile information device itself can be improved and the quality can be improved. Furthermore, in addition to this, it is possible to obtain high-precision clock information that is stable over a long period of time. (Radio Wave Clock) Next, an embodiment of the radio wave clock 130 according to the present invention will be described with reference to Fig. 23. As shown in Fig. 23, the radio wave clock 130 of the present embodiment includes a piezoelectric vibrator 40 electrically connected to the filter unit 131, and receives a standard radio wave including clock information, and has an automatic correction to a precise time. The clock that shows the function. Further, even if the piezoelectric vibrator 40 is incorporated. In Japan, there are transmission stations (transmission stations) that transmit standard radio waves in Fukushima Prefecture (40 kHz) and Saga Prefecture (60 kHz), and standard radio waves are transmitted separately. Due to the nature of the long-wavelength symmetry of 40 kHz or 60 kHz and the nature of the surface of the ionosphere and the surface, the spread range is widened, and the above two transmission stations are all available throughout Japan. Hereinafter, the functional configuration of the radio wave clock 130 will be described in detail -30-
S 201251317 明。 天線132接收40kHz或60kHz之長波之標準電波 長波之標準電波係將被稱爲時間碼之時刻資訊AM調制 40kHz或60kHZ之載波上。所接收到之長波的標準電波 藉由放大器133被放大，並藉由具有複數壓電振動子 之濾波器部1 3 1被濾波、調諧。 本實施型態中之壓電振動子40分別具備有具有與 述搬運頻率相同之40kHz及60kHz之共振頻率的水晶 動子部138、139。 並且，被濾波之特定頻率之訊號藉由檢波、整流電 1 3 4被檢波解調。 接著，經波形整形電路13 5取出時間碼，藉 CPU 136計數。在CPU 136中係讀取現在之年、積算曰 星期、時刻等之資訊。讀取之資訊反映在RTC 137，顯 正確之時刻資訊。 載波由於爲40kHz或60kHz，故水晶振動子部138 139以持有上述音叉型之構造的振動子爲佳。 並且，上述說明係表示日本國內之例，長波之標準 波之頻率在海外則不同。例如，德國係使用77.5kHz之 準電波。因此，於將即使在海外亦可以對應之電波時 1 3 0組裝於攜帶機器之時，則又需要與日本之情形不同 頻率的壓電振動子40。 若藉由本實施型態之電波時鐘130時，因具備有上 壓電振動子40，故可以謀求電波時鐘本身之信賴性的 於 40 上 振 路 由 示 電 標 鐘 之 述 提 -31 - 201251317 昇化及高品質化。除此之外，可以在長期間安定高精度計 數時刻》 並且，本發明之技術範圍並不限定於上述實施型態， 只要在不脫離本發明之主旨的範圍，亦可以作各種變更。 例如，在上述實施型態中，雖然以音叉型之壓電振動 片1及AT切割壓電振動片爲例予以說明，但是亦可以使 用與本發明有關之壓電振動片之製造方法而製造其他壓電 振動片。 【圖式簡單說明】 第1圖爲表示與本發明有關之壓電振動片之一實施型 態的上視圖。 第2圖爲構成第1圖所示之壓電振動片之放大圖，以 振動腕部之基端部爲中心放大之圖式。 第3圖爲沿著第2圖所示之A-A線之壓電振動片的 剖面圖。 第4圖爲製造第1圖所示之壓電振動片之時的流程 圖。 第5圖爲表示製造第1圖所示之壓電振動片之時之一 工程的圖式，表示在晶圓之兩面形成蝕刻保護膜之狀態的 圖式。 第6圖爲表示從第5圖所示之狀態，將蝕刻保護膜圖 案製作成壓電振動片之壓電板之外形形狀之狀態的圖式。 第7圖爲第6圖所示之剖面向視B-B圖。 -32-S 201251317 明. The standard radio wave system in which the antenna 132 receives a standard wave of a long wave of 40 kHz or 60 kHz will be referred to as a time code of the time AM modulated on a carrier of 40 kHz or 60 kHz. The received standard wave of the long wave is amplified by the amplifier 133 and filtered and tuned by the filter unit 133 having a plurality of piezoelectric vibrators. The piezoelectric vibrators 40 in the present embodiment are respectively provided with crystal mover portions 138 and 139 having resonance frequencies of 40 kHz and 60 kHz which are the same as the transfer frequency. Moreover, the signal of the filtered specific frequency is detected and demodulated by the detection and rectification electric power. Next, the time code is taken out by the waveform shaping circuit 135 and counted by the CPU 136. In the CPU 136, information such as the current year, the accumulated week, the time, and the like are read. The information read is reflected in RTC 137, showing the correct time information. Since the carrier wave is 40 kHz or 60 kHz, the crystal vibrating sub-portion 138 139 is preferably a vibrator having the above-described tuning-fork type configuration. Further, the above description is an example in Japan, and the frequency of the standard wave of the long wave is different overseas. For example, the German system uses a quasi-electric wave of 77.5 kHz. Therefore, when the radio wave that can be used in overseas can be assembled in the portable device, the piezoelectric vibrator 40 having a frequency different from that in the case of Japan is required. According to the radio-controlled timepiece 130 of the present embodiment, since the upper piezoelectric vibrator 40 is provided, it is possible to improve the reliability of the radio-controlled clock itself. And high quality. In addition, the high-precision counting time can be stabilized for a long period of time. The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the tuning-fork type piezoelectric vibrating piece 1 and the AT-cut piezoelectric vibrating piece are described as an example. However, other methods of manufacturing the piezoelectric vibrating piece according to the present invention may be used to manufacture the other. Piezoelectric vibrating piece. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top view showing an embodiment of a piezoelectric vibrating piece according to the present invention. Fig. 2 is an enlarged view showing the piezoelectric vibrating reed shown in Fig. 1, and is enlarged in the center of the base end portion of the vibrating arm. Fig. 3 is a cross-sectional view of the piezoelectric vibrating piece taken along the line A-A shown in Fig. 2. Fig. 4 is a flow chart at the time of manufacturing the piezoelectric vibrating reed shown in Fig. 1. Fig. 5 is a view showing a state in which the piezoelectric vibrating reed shown in Fig. 1 is manufactured, and shows a state in which an etching protection film is formed on both surfaces of the wafer. Fig. 6 is a view showing a state in which the etching resist pattern is formed into a shape other than the piezoelectric plate of the piezoelectric vibrating piece from the state shown in Fig. 5. Fig. 7 is a cross-sectional view taken along line B-B of Fig. 6. -32-
S 201251317 第8圖爲表示從第7圖所示之狀態’將蝕刻保護膜當 作光罩而蝕刻加工晶圓之狀態的圖式。 第9圖爲表示從第8圖所示之狀態，又圖案製作蝕刻 保護膜之狀態的圖式。 第10圖爲表示從第9圖所示之狀態，將再度被圖案 製作之蝕刻保護膜當作光罩而蝕刻加工晶圓之狀態的圖 式。 第Π圖爲表示從第10圖所示之狀態，形成有電極膜 之狀態的圖式。 第12圖爲表示從第11圖所示之狀態在電極膜上塗佈 光阻膜之後，在第一曝光工程所使用之光罩的平面圖。 第13圖爲表示於第一曝光工程結束後，在第二曝光 工程中所使用之補正光罩的俯視圖。 第14圖係表示從第11圖所示之狀態，在電極膜上形 成光阻膜，並圖案製作該光阻膜之狀態的圖式。 第1 5圖係表示從第1 4圖所示之狀態，將圖案製作之 光阻膜當作光罩，對電極膜施予蝕刻加工之狀態的圖式。 第16圖爲表示與本發明有關之電極形成工程之狀態 的圖式。 第17圖爲表示與本發明有關之壓電振動子之一實施 型態的外觀圖。 第18圖爲表示第17圖所示之壓電振動子之內部構成 圖，在取下頂蓋基板之狀態下，由上方觀看壓電振動片之 圖示。 -33- 201251317 第19圖爲沿著第18圖所示之D-D線之壓電振動子 的剖面圖。 第2 0圖爲第1 9圖所示之壓電振動子之分解斜視圖。 第21圖爲表示與本發明有關之振盪器之一實施型態 的構成圖。 第22圖爲表示與本發明有關之電子機器之一實施型 態的構成圖。 第23圖爲表示與本發明有關之電波時鐘之一實施型 態的構成圖。 第24圖爲表示AT切割壓電振動片之外觀斜視圖。 第25圖爲表示於製造第24圖所示之壓電振動片之 時，在第一曝光工程中所使用之光罩的俯視圖。 第26圖爲表示使用第25圖所示之光罩之後’在第二 曝光工程中使用之補正光罩的俯視圖。 第27圖爲表示以往之壓電振動片之製造方法中之電 極形成工程之狀態的圖式。 第28圖爲表示爲了改善第27圖所示之狀態’在以往 所進行之壓電振動片之製造方法中之電極形成工程之狀態 圖。 【主要元件符號說明】 T0、U0、W0 :間隙 Tl、Ul、W1:開 口寬度 T2、U2、W2 :開 口寬度 -34-S 201251317 Fig. 8 is a view showing a state in which the etching protective film is used as a mask and the wafer is etched from the state shown in Fig. 7. Fig. 9 is a view showing a state in which an etching protective film is patterned in a state shown in Fig. 8. Fig. 10 is a view showing a state in which the etching resist film which is again patterned is used as a mask to etch the processed wafer from the state shown in Fig. 9. The figure is a diagram showing a state in which an electrode film is formed from the state shown in Fig. 10. Fig. 12 is a plan view showing a photomask used in the first exposure process after the photoresist film is applied onto the electrode film from the state shown in Fig. 11. Figure 13 is a plan view showing the correction mask used in the second exposure process after the end of the first exposure process. Fig. 14 is a view showing a state in which a photoresist film is formed on an electrode film and the photoresist film is patterned from the state shown in Fig. 11. Fig. 15 is a view showing a state in which the patterned photoresist film is used as a mask and the electrode film is subjected to etching processing from the state shown in Fig. 14. Fig. 16 is a view showing the state of the electrode forming process relating to the present invention. Fig. 17 is a perspective view showing an embodiment of a piezoelectric vibrator according to the present invention. Fig. 18 is a view showing the internal configuration of the piezoelectric vibrator shown in Fig. 17, and the piezoelectric vibrating piece is viewed from above in a state where the top cover substrate is removed. -33- 201251317 Figure 19 is a cross-sectional view of the piezoelectric vibrator along the D-D line shown in Fig. 18. Fig. 20 is an exploded perspective view of the piezoelectric vibrator shown in Fig. 19. Fig. 21 is a view showing the configuration of an embodiment of an oscillator relating to the present invention. Fig. 22 is a view showing the configuration of an embodiment of an electronic apparatus according to the present invention. Fig. 23 is a view showing the configuration of an embodiment of a radio wave clock relating to the present invention. Fig. 24 is a perspective view showing the appearance of an AT-cut piezoelectric vibrating piece. Fig. 25 is a plan view showing the photomask used in the first exposure process when the piezoelectric vibrating reed shown in Fig. 24 is manufactured. Fig. 26 is a plan view showing the correction mask used in the second exposure process after the photomask shown in Fig. 25 is used. Fig. 27 is a view showing a state of an electrode forming process in the conventional method of manufacturing a piezoelectric vibrating piece. Fig. 28 is a view showing a state of electrode formation in the conventional method of manufacturing a piezoelectric vibrating reed in order to improve the state shown in Fig. 27; [Description of main component symbols] T0, U0, W0: Clearance Tl, Ul, W1: Opening width T2, U2, W2: Opening width -34-
S 201251317 1、1 4 2 :壓電振動片 2 :壓電板 3、4 :振動腕部 5 :基部 6 :溝部 1 5 :叉部 20 :主面電極部 2 1 :側面電極部 22 :連接電極部 3 2 :第一開口部 33、143 :光罩 3 4 :第二開口部 35、145 :補正光罩 -35-S 201251317 1,1 4 2 : Piezoelectric vibrating piece 2 : Piezoelectric plate 3 , 4 : Vibrating arm portion 5 : Base portion 6 : Groove portion 1 5 : Fork portion 20 : Main surface electrode portion 2 1 : Side electrode portion 22 : Connection Electrode portion 3 2 : first opening portion 33, 143 : photomask 3 4 : second opening portion 35, 145 : correction mask - 35 -
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011038832A JP2012175673A (en) | 2011-02-24 | 2011-02-24 | Piezoelectric vibration piece, method of manufacturing piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled timepiece |
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|---|---|
| TW201251317A true TW201251317A (en) | 2012-12-16 |
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| TW101104521A TW201251317A (en) | 2011-02-24 | 2012-02-13 | Piezoelectric vibration piece, method of manufacturing piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled timepiece |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120217218A1 (en) |
| JP (1) | JP2012175673A (en) |
| CN (1) | CN102651638A (en) |
| TW (1) | TW201251317A (en) |
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| JP6684068B2 (en) * | 2015-10-16 | 2020-04-22 | エスアイアイ・プリンテック株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| US10797681B1 (en) * | 2019-07-25 | 2020-10-06 | Zhuhai Crystal Resonance Technologies Co., Ltd. | Method of fabricating novel packages for electronic components |
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| KR0165524B1 (en) * | 1996-07-16 | 1999-03-20 | 김광호 | Exposure method of photolithography process |
| TWI235282B (en) * | 2003-07-03 | 2005-07-01 | Nanya Technology Corp | Method of correcting optical proximity effect of contact hole |
| JP4694380B2 (en) * | 2006-02-06 | 2011-06-08 | 株式会社日立製作所 | Thin film tuning fork type bending vibrator and electric signal processing element |
| WO2010026817A1 (en) * | 2008-09-02 | 2010-03-11 | 株式会社村田製作所 | Tuning-fork vibrator and method for manufacturing the same and angular speed sensor |
| US20110001394A1 (en) * | 2009-07-02 | 2011-01-06 | Eta Sa | Piezoelectric thin-film tuning fork resonator |
| JP2011160174A (en) * | 2010-02-01 | 2011-08-18 | Seiko Epson Corp | Vibrating piece substrate and tuning-fork vibrating piece |
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2011
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2012
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| US20120217218A1 (en) | 2012-08-30 |
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