TW201245320A - Phenolic resin molding material - Google Patents

Phenolic resin molding material Download PDF

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TW201245320A
TW201245320A TW101105976A TW101105976A TW201245320A TW 201245320 A TW201245320 A TW 201245320A TW 101105976 A TW101105976 A TW 101105976A TW 101105976 A TW101105976 A TW 101105976A TW 201245320 A TW201245320 A TW 201245320A
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Taiwan
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weight
molding material
parts
component
phenol resin
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TW101105976A
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Chinese (zh)
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TWI568787B (en
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Shinichiro Kobayashi
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Sumitomo Bakelite Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/346Clay
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • C08K5/3492Triazines
    • C08K5/34922Melamine; Derivatives thereof

Abstract

A phenolic resin molding material, which has a flame retardancy and mechanical strength equivalent to a conventional molding material without using any one of halogen, antimony, and red phosphorus- or organic phosphorous-based flame retardant, is provided. The phenolic resin molding material includes phenolic resin, (A) metal hydroxide, (B) unfired clay, and (C) flame retardant made of a nitrogen compound. Preferably, the phenolic resin molding material includes 20 to 60 parts by weight of phenolic resin, 2 to 20 parts by weight of (A) component, 1 to 20 parts by weight of (B) component, and 0.1 to 10 parts by weight of (C) component in 100 parts by weight of the phenolic resin molding material.

Description

201245320 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種盼樹脂成形材料。 本申請案係基於2011年3月1〇日於日本提出申請之曰 本專利申請第20 1 1-052737號且主張其優先權,並將其内容 引用於本文中。 【先前技術】 酚樹脂成形材料係於機械強度、耐熱性、尺寸精度及 成本方面平衡優異之材料。因此,酚樹脂成形材料在各種 領域中得到廣泛之使用。其中,因其電絕緣性及耐熱性優 異,故而亦用於捲線軸(bobbin )等電子零件,當用於電子 零件時,必須具備阻燃性。 *獲得阻燃性之方;*,有添加含氣化合物或含漠化合物 等鹵素化合物、三氧化二銻等銻化合物之方法。 然而,就環境保護之觀點而言,使用齒素化合物及録 化合物被認為並不佳》因此,要求出現一種不用依賴函素 化合物及銻化合物之實現阻燃化之方法。 不使用函素化合物之方法,有添加㈣之方法(例如, 參照專利文獻〇。該方法尤其是對紛樹脂成形材料主要使 用之方法,其與酚樹脂本身之阻燃性組合而可獲得充分之 阻燃效果。但是’亦要求一種不使用红破 裡个优用,.工螂之貫現阻燃化之 方法》 來獲得阻燃效 存在不使用紅磷而是調配有機磷化合物 4 201245320 果之方法。該方法與上述使用紅磷之方法同樣地,係因為 在燃燒時於成形。口口表面形成碳化皮月莫阻斷熱與氧供給而獲 付阻燃性。但是’#由該有機鱗化合物獲得之效果弱於紅 磷之情形。 如上所述’就環境保護之觀點等而言,要求有一種不 含有_素化合物、銻化合物、紅磷及有機磷系化合物且可 發揮阻燃性之酚樹脂成形材料。 [專利文獻1]曰本特開平8-217953 【發明内容】 本發明之目的在於提供一種於不含有鹵素化合物、銻 化合物、紅磷及有機磷系化合物作為阻燃劑的情況下獲得 具有阻燃性之成形品的酚樹脂成形材料。 本發明之目的係藉由下述之本發明之態樣而達成。 [1] 一種盼樹脂成形材料,含有盼樹脂與由(A)金屬氫 氧化物、(B )未般燒黏土及(c )氮化合物構成之阻燃劑。 [2] 如上述[1]之酚樹脂成形材料,其中,(a)成分為氫 氧化鎂或氫氧化鋁。 [3] 如上述[1]或[2]之酚樹脂成形材料,其中,(c )成分 為三聚氰胺。 [4] 如上述[1]至[3]中任一項之酚樹脂成形材料,其中, 於1〇〇重量份之酚樹脂成形材料中,含有20〜60重量份之 盼樹脂成分、2〜20重量份之(A)成分、1〜20重量份之 (B )成分、0.1〜1 〇重量份之(C )成分。 201245320 根據本發明可獲得一種不會損害成形性、一般特性、 硬化性、#業性,不含有函素化合物、銻化合物、紅磷及 有機鱗系化合物且可發揮阻燃性之㈣脂成形材料。 【實施方式】 以下,對作為本發明之態樣之酚樹脂成形材料(以下, 有時簡稱為「本發明之成形材料」)進行詳細說明。 本發明之成形材料之特徵在於:含有酚樹脂與由(A) 金屬氫氧化物、(B)未锻燒點土及(c)氮化合物構成之阻 燃劑。 作為本發明所使用之調配於成形材料中之酚樹脂,可 例示:由酚類與醛類於酸性觸媒之存在下反應而得的酚醛 清漆型酚樹脂;由酚類與醛類於鹼性觸媒之存在下反應而 得的可溶酚醛型酚樹脂等。可將該等酚樹脂單獨使用或併 用。 於單獨使用紛酿清漆型紛樹脂之情形時,通常可使用 亞曱基四胺(hexamethylenetetramine)作為硬化劑。六亞甲 基四胺之含量雖無特別限定,但相對於1〇〇重量份之酚醛 清漆型酚樹脂,較佳為1〇〜3〇重量份,更佳為1〇〜2〇重 又於早獨使用可〉谷盼酿型盼樹脂(resol-type phenolic resin) ’或將酚醛清漆型酚樹脂與可溶酚醛型酚樹脂併用之 情形時,亦可不使用六亞甲基四胺。 於本發明之成形材料中,酚樹脂之含量係於1〇〇重量 伤之成形材料中較佳為2〇〜6〇重量份,更佳為3〇〜6〇重 6 201245320 量份。 藉由將酚樹脂之含量設為上述下限值以上,可 練成形材料,從而可提高成形材料之生產性。又, 成形時之流動性’使成形性良好。 '、 藉由將酚樹脂之含量設為上述上 形品良好之機械強度。 …下,可賦予成 本發明之成形材料係組合使用⑷ 未煅燒黏土及f 化物、(B) )氮化《物二種成分作為阻燃劑。並且, 本發明之成形材料之特徵在於:不使用齒素化 合物、以及紅磷、有機磷系化合物等阻燃劑。 . 本發明之成形材料中所使用之阻燃劑均為 ^生較高,…素化合物、錄化合物以及紅碟:;= =匕合物相比對環境之影響較小的清潔之阻燃劑 ==獲得僅使用如上所述之成分作為阻燃劑,且 成形具有良好之阻燃性之成形品的成形材料。 本發明之成形材料德含有(A)金屬氣氧化物作 :燃劑。(A)金屬氫氧化物可藉由在燃燒時分解而生成水, 奪取燃燒部位之熱而表現阻燃性。 :於本發明之成形材料之(A)金屬氫氧化物較佳為氣 =而”化紹。使用時’可考慮對阻燃性以外之特性 心影響而區分使用。 重量氫氧化物之調配量’將成形材料設為100 '較佳為2〜20重量份’特佳為5〜10重量份。 藉由將(Α)金屬氫氧化物之調配量設為上述下限值以 7 201245320 上’可表現充分之阻燃性’又,藉由設為上述上限值以下, 可抑制比重,獲得良好之機械強度。 本發明之成形材料係含有(B )未煅燒黏土作為第二阻 燃劑。(B )未烺燒黏土可於燃燒時分解生成水而奪取熱, 從而表現阻燃性。 關於(B)未煅燒黏土之調配量,將成形材料設為1〇〇 重量份時,較佳為1〜20重量份。更佳為5〜丨5重量份。 藉由將(B)未煅燒黏土之調配量設為上述下限值以 上,可表現充分之阻燃性,又’藉由設為上述上限值以下, 可使製造成形材料時之作業性或成形性良好。 本發明之成形材料係含有(c)氛化合物作為第三阻燃 劑。(C)氮化合物可藉由於燃燒時釋放出惰性氣體,稀釋 燃燒部位之氧濃度使燃燒停止,而表現阻燃性。 可用於本發明之成形材料之(C)氮化合物有三聚氰胺 單體、三峦顧胗技+ a运.β κ» μ _ 。201245320 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a resin forming material. The present application is based on Japanese Patent Application No. JP-A No. No. No. Publication No. No. No. No. No. No. No. No. No. [Prior Art] The phenol resin molding material is a material excellent in balance between mechanical strength, heat resistance, dimensional accuracy, and cost. Therefore, phenol resin molding materials are widely used in various fields. Among them, because of their excellent electrical insulation and heat resistance, they are also used for electronic parts such as bobbins. When used for electronic parts, they must have flame retardancy. * A method for obtaining flame retardancy; *, a method of adding a halogen compound such as a gas-containing compound or a desert-containing compound, or a ruthenium compound such as antimony trioxide. However, from the viewpoint of environmental protection, the use of dentate compounds and recorded compounds is considered to be poor. Therefore, there is a demand for a method of achieving flame retardancy without relying on a functional compound and a ruthenium compound. In the method of not using a functional compound, there is a method of adding (4) (for example, refer to the patent document 〇. This method is especially used for a resin molding material, which is combined with the flame retardancy of the phenol resin itself to obtain sufficient Flame-retardant effect. But 'also requires a method that does not use red-breaking, which is a good way to achieve flame-retardant effect." To obtain flame retardant effect, the use of red phosphorus instead of organophosphorus compound 4 201245320 The method is similar to the method of using red phosphorus described above, because it is formed at the time of combustion. The formation of carbonized skin on the surface of the mouth is blocked by heat and oxygen supply, and the flame retardancy is obtained. The effect of the compound is weaker than that of the red phosphorus. As described above, in terms of environmental protection, etc., it is required to have a flame retardancy without containing a γ compound, a ruthenium compound, a red phosphorus, and an organophosphorus compound. Phenolic resin molding material. [Patent Document 1] JP-A JP-A-8-217953 SUMMARY OF THE INVENTION An object of the present invention is to provide a halogen compound, a ruthenium compound, and a red phosphorus. A phenol resin molding material having a flame-retardant molded article in the case of an organic phosphorus-based compound as a flame retardant. The object of the present invention is achieved by the following aspects of the invention. [1] A resin molding And a phenol resin-forming material according to the above [1], wherein the phenol resin forming material is the same as the flame retardant of the (A) metal hydroxide, the (B) non-fired clay, and the (c) nitrogen compound. The component (a) is magnesium hydroxide or aluminum hydroxide. [3] The phenol resin molding material according to [1] or [2] above, wherein the component (c) is melamine. [4] As described above [1] to [ (3) The phenol resin molding material according to any one of the invention, wherein the phenol resin molding material contains 20 to 60 parts by weight of the resin component, and 2 to 20 parts by weight of the component (A), 1 ~20 parts by weight of the component (B) and 0.1 to 1 part by weight of the component (C). 201245320 According to the present invention, it is possible to obtain a compound which does not impair formability, general properties, hardenability, and industrial properties. And (4) a fat-forming material which exhibits flame retardancy, a bismuth compound, a red phosphorus, and an organic squama compound. [Embodiment] Hereinafter, a phenol resin molding material (hereinafter sometimes referred to simply as "the molding material of the present invention") as an aspect of the present invention will be described in detail. The molding material of the present invention is characterized by containing a phenol resin and A flame retardant composed of (A) a metal hydroxide, (B) an uncalcined earth, and (c) a nitrogen compound. The phenol resin used in the molding material used in the present invention may be exemplified by a phenol A novolac type phenol resin obtained by reacting an aldehyde with an acid catalyst; a resol type phenol resin obtained by reacting a phenol with an aldehyde in the presence of a basic catalyst, etc. The phenol resin may be used singly or in combination. When a varnish type resin is used alone, hexamethylenetetramine may be usually used as a hardener. The content of hexamethylenetetramine is not particularly limited, but is preferably from 1 to 3 parts by weight, more preferably from 1 to 2 parts by weight, based on 1 part by weight of the novolac type phenol resin. In the case where a resol-type phenolic resin or a novolac type phenol resin is used in combination with a resol type phenol resin, hexamethylenetetramine may not be used. In the molding material of the present invention, the content of the phenol resin is preferably from 2 to 6 parts by weight, more preferably from 3 to 6 inches by weight, based on 1 part by weight of the wound molding material. By setting the content of the phenol resin to be equal to or higher than the above lower limit value, the material can be molded, and the productivity of the molding material can be improved. Further, the fluidity at the time of molding was excellent in formability. ', by setting the content of the phenol resin to a good mechanical strength of the above-mentioned top product. In the following, the molding material of the present invention can be used in combination with (4) uncalcined clay and f compound, and (B) nitrided two components as a flame retardant. Further, the molding material of the present invention is characterized in that a tooth-form compound and a flame retardant such as red phosphorus or an organophosphorus compound are not used. The flame retardant used in the forming material of the present invention is a high-quality, clean compound, a compound, and a red dish:; = = a clean flame retardant having a less influence on the environment than the compound == A molding material obtained by using only the above-described components as a flame retardant and forming a molded article having good flame retardancy was obtained. The molding material of the present invention contains (A) a metal gas oxide as a fuel. (A) The metal hydroxide can be formed by decomposing at the time of combustion to generate water, and taking heat of the burning portion to exhibit flame retardancy. The (A) metal hydroxide in the molding material of the present invention is preferably gas = "return. When used" can be used in consideration of the influence of characteristics other than flame retardancy. 'The forming material is preferably 100 to 2 parts by weight, preferably 2 to 20 parts by weight, particularly preferably 5 to 10 parts by weight. By setting the amount of the (cerium) metal hydroxide to the above lower limit value to 7 201245320' Further, it is possible to exhibit sufficient flame retardancy. Further, by setting it as the above upper limit or less, it is possible to suppress the specific gravity and obtain good mechanical strength. The molding material of the present invention contains (B) uncalcined clay as the second flame retardant. (B) The unburned clay is decomposed to generate water upon combustion to take heat, thereby exhibiting flame retardancy. (B) When the amount of the uncalcined clay is set to 1 part by weight, preferably 1 to 20 parts by weight, more preferably 5 to 5 parts by weight. By setting the amount of the (B) uncalcined clay to be more than the above lower limit value, sufficient flame retardancy can be expressed, and Below the above upper limit, workability or formability at the time of producing a molding material can be improved. The molding material of the present invention contains (c) an aromatic compound as a third flame retardant. (C) The nitrogen compound exhibits flame retardancy by releasing an inert gas during combustion and diluting the oxygen concentration of the combustion site to stop the combustion. The (C) nitrogen compound which can be used in the molding material of the present invention is a melamine monomer, a trisamine compound, a a. β κ» μ _ .

使成形品之硬化性良好。 關於 量份時, 藉由, 可表現充 本發明之成形材料如上所述般 化物、(Β )未煅燒黏土、( c )氮^丨 用,而分別表現上述之阻燃機制, 阻燃效果較弱之部分,從而作.士: 匕般’藉由將(A)金屬氫氧 氮化合物三種阻燃劑組合使 從而作為成形材料 ’藉此可補償單獨使用時 成形材料而發揮較高之阻 201245320 燃效果。 進而調配棚糸化合物作 、非銻、非磷之阻燃劑, 乾淨的材料。硼化合物 中亦可使用無機填充材 於本發明之成形材料中,亦可 為阻燃劑。硼系化合物亦為非鹵素 因此即便調配該硼系化合物亦仍為 具體而言有硼酸、硼酸鋅等。 除此以外,本發明之成形材料 料。 彳為此種無機填充材料,並無特別限定,例如可列舉 玻璃纖維、黏i、碳_、二氧切、岩絨、雲母、石夕灰 石等,可將該等單獨使用或併用2種以上。 又’本發明之成形材料中可進而使用有機填充材料。 作為此種有機填充材料,並無特別限定,例如可列舉. 木粉、棉《、纖維素、碎布、„、丁腈橡料,可將該 等單獨使用或併用2種以上。 外 等 於本發明之成形材料中,除以上所說明之原材料以 亦可視需要調配硬化助劑、t色劑、脫模劑、塑化劑 本發明之成形材料係藉由通常之方法而製i^即,係 藉由以規;t之調配比例混合上述各成分,❹加熱親、雙 向捏合機(ko.kneader)、雙軸擠出機進行熔融混練後,進广 冷卻、粉碎而獲得。 丁 本發明之成形材料可藉由壓縮成形、轉注成形、射出 成形等通常之成形方法而獲得成形品。 [實施例] 9 201245320 以下’利用實施例對本發明進行詳細^月,但本發明 並不受該等實施例之任何限定。 用於實施例及比較例之各原料係如下所示。The moldability of the molded article is good. In the case of the parts, the molding material of the present invention can be expressed as described above, (Β) uncalcined clay, (c) nitrogen, and the flame retardant mechanism is respectively exhibited. The weak part, thus the workmanship: "by combining the three flame retardants of (A) metal oxyhydroxide compound as a forming material', thereby compensating the forming material alone to play a higher resistance 201245320 Burning effect. Further, the shed compound is used as a non-fluorene, non-phosphorus flame retardant, and a clean material. An inorganic filler may also be used in the boron compound in the molding material of the present invention, or may be a flame retardant. The boron-based compound is also non-halogen. Therefore, even if the boron-based compound is blended, there are specifically boric acid, zinc borate, and the like. In addition to this, the molding material of the present invention. The inorganic filler is not particularly limited, and examples thereof include glass fiber, viscous i, carbon ketone, dioxotomy, rock wool, mica, and shisha ash. These may be used alone or in combination. the above. Further, an organic filler can be further used in the molding material of the present invention. The organic filler is not particularly limited, and examples thereof include wood powder, cotton, cellulose, rag, and nitrile rubber. These may be used alone or in combination of two or more. In the molding material of the invention, in addition to the materials described above, the curing agent, the t coloring agent, the releasing agent, and the plasticizing agent may be blended as needed. The molding material of the present invention is produced by a usual method. The above components are mixed by a ratio of t and t, and are heated and kneaded by a heating, bi-directional kneader or a twin-screw extruder, and then obtained by extensive cooling and pulverization. The material can be obtained by a usual molding method such as compression molding, transfer molding, or injection molding. [Examples] 9 201245320 Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited to the examples. Any of the materials used in the examples and comparative examples are as follows.

(1 )可溶酚醛型酚樹脂:SUMit〇m〇 B AKEUTE公司 製造之 SUMILITERESIN PR (2)金屬氫氧化物:氫氧化鎂 (3 )未般燒黏土·未锻燒黏土 (4)氮化合物:三聚氰胺 (5 )無機填充劑:碳酸鈣 (6 )有機填充材料:碎布 (7)著色劑:碳黑 (8 )脫模劑:硬脂酸鈣 (9)硬化助劑:熟石灰 (1 〇 )硼化合物:硼酸鋅 (實施例1 ) 將調配有5 0重量份之可溶酚醛型酚樹脂、1 〇重量份之 金屬氫氧化物、1 5重量份之未煅燒黏土、2重量份之氮化 合物、19重量份之有機填充材料、丨重量份之著色劑、^重 量份之脫模劑、2重量份之硬化助劑的原料混合物,藉由 90°C之加熱輥進行3分鐘熔融混練,之後取出進行粉碎, 粉碎為顆粒狀而獲得成形材料。 (實施例2) 將調配有5 0重量份之可溶酚醛型酚樹脂、1 〇重量份之 金屬氫氧化物、10重量份之未煅燒黏土、5重量份之哪化 201245320 :?二2重量份之氮化合物、19重量份之有機填充材料、1 ::之著色劑、】重量份之脫模劑、2重量份之硬化助劑 的原料混合物,藉由90。0加埶輥 ^ <刀…輥進仃3分鐘熔融混練, 之後取出進行粉碎,粉碎為__獲得成形材料。 (實施例3 ) 將調配有50重量份之可溶酚醛型酚樹脂、⑺重量份之 =氨氧化物、5重量份之未锻㈣土、iq重量份之领化 重量份之氮化合物、19重量份之有機填充材料、! 重-伤之著色劑、丨重量份之脫模劑、2重量份之硬化助劑 …山…猎由90 C之加熱輥進行3分鐘熔融混練, ^ 進仃粉碎’粉碎為顆粒狀而獲得成形材料。 (比較例1 ) 將调配有5 0會暑γ合夕-ρΛ、 菫里如之可浴酚醛型酚樹脂、10重量份之 無機填充劑、15重量份之去(1) Resole type phenol resin: SUMIT〇m〇B SUMILITERESIN PR manufactured by AKEUTE Co., Ltd. (2) Metal hydroxide: Magnesium hydroxide (3) Unfired clay · Uncalcined clay (4) Nitrogen compound: Melamine (5) Inorganic filler: Calcium carbonate (6) Organic filler: rag (7) Colorant: Carbon black (8) Release agent: Calcium stearate (9) Hardening aid: Slaked lime (1 〇) Boron compound: zinc borate (Example 1) 50 parts by weight of resol type phenol resin, 1 part by weight of metal hydroxide, 15 parts by weight of uncalcined clay, 2 parts by weight of nitrogen compound 19 parts by weight of an organic filler, a by weight of a coloring agent, a part by weight of a releasing agent, and 2 parts by weight of a raw material mixture of a hardening aid, which are melt-kneaded by a heating roll at 90 ° C for 3 minutes, after which It is taken out and pulverized, and pulverized into pellets to obtain a molding material. (Example 2) 50 parts by weight of a novolak type phenol resin, 1 part by weight of a metal hydroxide, 10 parts by weight of uncalcined clay, and 5 parts by weight of a blend of 201245320: ? 2 weight a nitrogen compound, 19 parts by weight of an organic filler, a colorant of 1 :, a part by weight of a release agent, and 2 parts by weight of a raw material mixture of a hardening aid, by a 90. 0 twisting roll ^ < The knives were rolled and kneaded for 3 minutes, and then kneaded and kneaded, and then taken out and pulverized, and pulverized into __ to obtain a molding material. (Example 3) 50 parts by weight of a resol type phenol resin, (7) parts by weight of an ammonia oxide, 5 parts by weight of an unwrought (tetra) earth, and an iq part by weight of a nitrogen compound, 19 Parts by weight of organic filler material,! Heavy-injury coloring agent, bismuth parting agent, 2 parts by weight of hardening aid... Mountain... Hunting is carried out by a 90 C heating roller for 3 minutes, and it is pulverized into granules to obtain a shape. material. (Comparative Example 1) A bathing phenolic phenol resin such as 50 会 γ 合 夕 Λ Λ Λ Λ 、 、 、 、 、 、 、 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10

之未煅燒黏土、2重量份之氮化合 物、19重量份之;^她+古+ Λ L 有㈣充材料、1重量份之著色劑、i重量 份之脫模劑、2重詈份 里里 量知之硬化助劑的原料混合物,藉由9〇 C之加熱輥進行3分鐘熔融 辟U Μ “ ㈣成、練’之後取出進行粉碎,粉 碎為顆拉狀而獲得成形材料。 (比較例2) 將調配有5 〇重詈份少π 人府 里置伤之可溶酚醛型酚樹脂、10重詈柃夕 金屬氫氧化物、15番旦A 里里伤之 $里伤之無機填充劑、2重量 合物、19重量份之有 夏物之氮化 罝份之脫模劑、2重 f! 1重 之硬化助劑的原料混合物,萨由 9 0 C之加熱輥進扞q八 稽田 刀1里熔融混練,之後取出進行粉碎, 201245320 粉碎為顆粒狀而獲得成形材料。 (比較例3 ) 將凋配有50重量份之可溶酚醛型酚樹脂、丄〇 、 金屬氫氧化物、15重量份之未煅燒黏土、 直伤之 填充曰材料、19重量份之有機填充材料、丨重量份之機 I重直份之脫模劑、2重量份之硬化助劑的原料混合物 由9(TC之加熱報進行3分鐘溶融混練,之後取出進行 粉碎為顆粒狀而獲得成形材料。 ” (評價方法) (1)耐燃性 藉由壓縮 mmx 12.5 使用於實施例及比較例中獲得之成形材料, 成形而製作 125 mmxl2.5 mmx〇.l6 mm 與 125 mmx5.0 mm之試片。成形條件係設為模具溫度175它,硬 化時間2分鐘》使用該等試片,依據UL94而實施耐燃試驗。 (2 )機械強度 使用於實施例及比較例中獲得之成形材料,藉由轉注 成形而製作彎曲強度、彎曲彈性模數及夏比衝擊強度 (Charpy impact strength )之試片。成形條件係設為模具溫 度175°C ’硬化時間3分鐘。使用該等試片,依據JISI( 6911 而實施試驗。 將實施例及比較例之成形材料之原材料組成、及所獲 得之成形品的評價結果示於表1 » 12 201245320 [表l] 實施例1 實施例2 實施例3 比較例1 比較例2 比較例3 可溶酚醛型酚樹脂 50 50 50 50 50 50 金屬氫氧化物 10 10 10 10 10 未锻燒黏土 15 10 5 15 15 組成 氮化合物 2 2 2 2 2 硼化合物 5 10 無機基材 10 15 2 有機基材 19 19 19 19 19 19 其他 4 4 4 4 4 4 UL94 (厚度 0.16 mm) V-0 V-0 V-0 NG NG NG 1^94(厚度0.511111〇 V-0 V-0 V-0 V-0 NG V-0 特性 彎曲強度(MPa) 100 100 100 100 100 100 彎曲彈性模數(MPa) 7500 7500 7400 7200 7200 7500 夏比衝擊強度(kJ/m2) 3.3 3.4 3.5 3.2 3.1 3.3 上述評價之結果,實施例1係調配有由金屬氫氧化物、 未般燒黏土及氮化合物所構成之阻燃劑的本發明之成形材 料,可不使用鹵素、銻、紅磷、有機磷系阻燃劑而獲得具 有良好之阻燃性、機械強度的成形品。 實施例2、實施例3係將未煅燒黏土之一部分置換為硼 酸化合物之成形材料,該等亦可獲得具有良好之阻燃性、 機械強度之成形品。 比較例1係未調配金屬氫氧化物之成形材料,厚度較 薄之成形品的阻燃性變差,未得到V-0。 比較例2係未調配未煅燒黏土之成形材料,無論於何 種厚度下阻燃性皆變差,未得到V-0。 比較例3係未調配氮化合物之成形材料,厚度較薄之 成形品的阻燃性變差,未得到V-0。 13 201245320 由本發明而得之酚樹脂成形材料不使用鹵寺 、Ί 性、 適合 厅、''錄 填、有機碟系阻燃劑亦可獲得具有與先前同等之随離 機械強度的成形品。因此,本發明之酚樹脂成形材料 應用於捲線輛、變壓器、繼電器罩等電氣電子零件。 【圖式簡單說明】 無 【主要元件符號說明】 無Uncalcined clay, 2 parts by weight of nitrogen compound, 19 parts by weight; ^She + Gu + Λ L (4) filling material, 1 part by weight of coloring agent, i part by weight of releasing agent, 2 parts of glutinous rice The raw material mixture of the known hardening aid was melted by a heating roller of 9 ° C for 3 minutes. After the process was taken out, it was taken out and pulverized, and pulverized into a drawn shape to obtain a molding material. (Comparative Example 2) It will be formulated with 5 〇 詈 π π π 人 之 之 之 之 之 之 之 酚 酚 酚 酚 酚 酚 酚 酚 酚 酚 酚 酚 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机a weight compound, 19 parts by weight of a mold release agent having a tantalum nitride of summer, a raw material mixture of a 2 weight f! 1 weight hardening aid, and a heating roller of a 90 ° C into a 八q 八田田刀1 After melt-kneading, it was taken out and pulverized, and pulverized into a pellet shape at 201245320 to obtain a molding material. (Comparative Example 3) 50 parts by weight of a resol type phenol resin, hydrazine, metal hydroxide, and 15 parts by weight were added. Uncalcined clay, straight-filled enamel material, 19 parts by weight of organic filler, weight The raw material mixture of the parting agent I heavy-duty parting agent and 2 parts by weight of the hardening aid is melted and kneaded by heating for 9 minutes by TC, and then taken out and pulverized into pellets to obtain a molding material. (1) Flame resistance The test pieces obtained by using the molding materials obtained in the examples and the comparative examples were formed by compression mmx 12.5, and were formed into test pieces of 125 mm×l 2.5 mm×〇.l6 mm and 125 mm×5.0 mm. The mold temperature was set to 175, and the hardening time was 2 minutes. Using these test pieces, the flame resistance test was carried out in accordance with UL94. (2) Mechanical strength The molding materials obtained in the examples and the comparative examples were used to make a bend by transfer molding. A test piece of strength, flexural modulus, and Charpy impact strength. The molding conditions were set to a mold temperature of 175 ° C and a hardening time of 3 minutes. Using these test pieces, the test was carried out in accordance with JISI (6911). The raw material compositions of the molding materials of the examples and the comparative examples and the evaluation results of the obtained molded articles are shown in Table 1 » 12 201245320 [Table 1] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Solvent novolac type phenol resin 50 50 50 50 50 50 Metal hydroxide 10 10 10 10 10 Uncalcined clay 15 10 5 15 15 Composition nitrogen compound 2 2 2 2 2 Boron compound 5 10 Inorganic substrate 10 15 2 Organic substrate 19 19 19 19 19 19 Other 4 4 4 4 4 4 UL94 (thickness 0.16 mm) V-0 V-0 V-0 NG NG NG 1^94 (thickness 0.511111〇V-0 V-0 V- 0 V-0 NG V-0 Characteristic bending strength (MPa) 100 100 100 100 100 100 Flexural modulus (MPa) 7500 7500 7400 7200 7200 7500 Charpy impact strength (kJ/m2) 3.3 3.4 3.5 3.2 3.1 3.3 Above evaluation As a result, the first embodiment is a molding material of the present invention formulated with a flame retardant composed of a metal hydroxide, a non-calcined clay, and a nitrogen compound, and may be used without using a halogen, a ruthenium, a red phosphorus or an organophosphorus flame retardant. A molded article having good flame retardancy and mechanical strength is obtained. In the embodiment 2 and the embodiment 3, a part of the uncalcined clay is partially replaced with a molding material of a boric acid compound, and the molded article having good flame retardancy and mechanical strength can also be obtained. In Comparative Example 1, a molding material in which metal hydroxide was not formulated was used, and the flame retardancy of the molded article having a small thickness was deteriorated, and V-0 was not obtained. Comparative Example 2 was a molding material in which uncalcined clay was not formulated, and the flame retardancy was deteriorated regardless of the thickness, and V-0 was not obtained. In Comparative Example 3, a molding material in which a nitrogen compound was not formulated was used, and the flame retardancy of the molded article having a small thickness was deteriorated, and V-0 was not obtained. 13 201245320 The phenol resin molding material obtained by the present invention can also obtain a molded article having the same mechanical strength as the prior art without using a halogen temple, a crucible, a suitable hall, a ''recording', or an organic dish-based flame retardant. Therefore, the phenol resin molding material of the present invention is applied to electrical and electronic parts such as a coiler, a transformer, and a relay cover. [Simple diagram description] None [Main component symbol description] None

Claims (1)

201245320 七、申請專利範圍: 1 ·種朌樹脂成形材料’含有酚樹脂與由(A )金屬氣 氧化物(B )未煅燒黏土及(c )氮化合物構成之阻燃劑。 2.如申請專利範圍第1項之酚樹脂成形材料,其中,(A ) 成分為氫氧化鎂或氫氧化鋁。 3·如申請專利範圍第1項或第2項之盼樹脂成形材料, 其中’(C)成分為三聚氰胺。 ’ 4_如申請專利範圍第!項或第2項之紛樹脂成 , 其中,於100重量份之酚樹脂成形材料中,含有2〇〜M , 量份之酚樹脂成分、2〜20重量份之(A)成分、1〜2〇重 量份之(B)成分、〇」〜〗〇重量份之(c)成分。〇重 5.如申請專利範圍帛3項之酚樹脂成形材料,其中 1〇〇重量份之酚樹脂成形材料中,含有2〇〜6〇重量怜,於 樹脂成分、2〜20重量份之(A)成分、丨〜⑼重量份IT紛 成分、0.1〜10重量份之(C)成分。 B)201245320 VII. Patent application scope: 1 • A resinous resin forming material ‘containing a phenol resin and a flame retardant composed of (A) metal gas oxide (B) uncalcined clay and (c) nitrogen compound. 2. The phenol resin molding material according to claim 1, wherein the component (A) is magnesium hydroxide or aluminum hydroxide. 3. A resin molding material as claimed in claim 1 or 2, wherein the '(C) component is melamine. ‘ 4_ If you apply for a patent range! Or a resin of the second aspect, wherein the phenol resin molding material contains 2 Å to M, the phenol resin component in an amount, 2 to 20 parts by weight of the component (A), and 1 to 2 (b) component, 〇"~" 〇 by weight of component (c). 〇5. The phenol resin molding material of the patent application 帛3 item, wherein one part by weight of the phenol resin forming material contains 2 〇 to 6 〇 by weight, in the resin component, 2 to 20 parts by weight ( A) component, 丨~(9) parts by weight of IT components, and 0.1 to 10 parts by weight of component (C). B) 無 15No 15
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