TW201245141A - Epoxy acrylate, acrylic curable composition, cured product and manufacturing processes therefor - Google Patents

Epoxy acrylate, acrylic curable composition, cured product and manufacturing processes therefor Download PDF

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TW201245141A
TW201245141A TW101104200A TW101104200A TW201245141A TW 201245141 A TW201245141 A TW 201245141A TW 101104200 A TW101104200 A TW 101104200A TW 101104200 A TW101104200 A TW 101104200A TW 201245141 A TW201245141 A TW 201245141A
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epoxy acrylate
acrylate
acrylic
epoxy
curable composition
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TW101104200A
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Chinese (zh)
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TWI507392B (en
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Atsuhiko Katayama
Niranjan Kumar Shrestha
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Nippon Steel Chemical Co
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00Preparation of carboxylic acid esters
    • C07C67/24Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran
    • C07C67/26Preparation of carboxylic acid esters by reacting carboxylic acids or derivatives thereof with a carbon-to-oxygen ether bond, e.g. acetal, tetrahydrofuran with an oxirane ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00Systems containing only non-condensed rings
    • C07C2601/12Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/14The ring being saturated

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Provided are: an epoxy acrylate which exhibits excellent heat resistance and low thermal expansion and is useful for solder resist resins, electroless plating resist resins, hard coat materials, UV-curable coating materials, substitute materials for glass, color filters for liquid crystal displays, and so on; an acrylic composition; and a cured product. The epoxy acrylate is represented by general formula (1) [wherein Z is C1-6 alkyl; a is a number of 0 to 4; and n is an integer of 2 to 3]. The epoxy acrylate can be obtained by reacting an epoxycyclohexane compound with acrylic acid or methacrylic acid.

Description

201245141 六、發明說明: 【發明所屬之技術領域】 本發明有關耐高溫性'流動性、韌性、光敏性、抗化 學藥品性、硬度、透明性、耐氣候性優異的新穎的環氧丙 烯酸酯、丙烯酸系硬化性組成物、硬化物以及其製造法。 如使該環氧丙烯酸酯,其本身進行聚合、或者,與具有各 種不飽和鍵之化合物進行共聚合,則可製得耐高溫性、韌 性、抗化學藥品性、硬度、透明性、耐氣候性等優異的高 分子材料,而可爲塗料、層合板、黏接劑等各種用途使用 。又’如作成光硬化性樹脂組成物或熱硬化性樹脂組成物 ’則亦很適合使用爲銲阻劑(solder-resist )用樹脂、或 無電解電鍍阻劑(nonelectolytic plating resist)用樹脂、 硬質覆膜(hard coat )材料、UV (紫外線)硬化塗料、玻 璃替代材料、以及液晶的濾色片(colour filter )等的保 護膜。 【先前技術】 主要由環氧化合物與丙烯酸之反應所得之環氧丙烯酸 酯樹脂’係作爲光敏材料、交聯劑等、各種功能性高分子 材料而廣泛所使用者。由於該樹脂係在分子中具有羥基之 故’優於溶劑溶解性、耐高溫性等(非專利文獻1 )。特 別是使本身爲環氧基經直接結合於苯之環氧苯基化合物之 源自環氧乙基苯之一種環氧丙烯酯之2-羥基-2-苯基乙基 丙嫌酸酯硬化之樹脂,如與一般性的具有縮水甘油基醚基 -5- 201245141 之環氧丙烯酸酯樹脂比較時,因不持有柔軟的羥基亞甲基 部位之故,藉由硬化物的分子運動之抑制,而可期待優異 的耐高溫性、低熱膨脹性。再者,藉由與具有各種不飽和 鍵之化合物之共聚合(專利文獻η 、或能與異氰酸酯等 羥基反應之交聯(專利文獻2)而可製得耐高溫性、耐濕 性、耐化學藥品性等優異的高分子材料。 然而,有關源自環氧乙基苯之環氧丙烯酸酯之唯一的 揭示例之2-羥基-2-苯基乙基丙烯酸酯所扮的角色,係專 爲反應稀釋劑或交聯劑者,對以提升樹脂的物性作爲目的 之環氧丙烯酸酯本身的改良方面,則並未被注意到。 再者,就源自環氧乙基苯之環氧丙烯酸酯而言,由於 本身爲芳香族化合物之故,如欲適用於光學零件領域時, 則可能透明性、耐氣候性有所不足夠。 [先前技術文獻] [專利文獻1]日本專利特開昭52- 1 29735公報 [專利文獻2]日本專利特平9-595 3 5公報 [非專利文獻】]高分子化學,1 97 8年版,第25卷,第 284號,第850頁 【發明內容】 因而,本發明之目的’在於提供一種優於耐高溫性、 低熱膨脹性、透明性、耐氣候性,而爲銲阻劑用樹脂、或 者無電解電鍍阻劑用樹脂、硬質覆膜材料、UV硬化塗料 、玻璃替代材料、液晶的濾色片有用的環氧丙烯酸酯、丙 -6 - 201245141 嫌系組成物以及硬化物。特別是提供一種作爲光學材料有· 用的丙烯酸樹脂組成物及硬化物。 本發明人等’鑑於上述之在來技術之實際狀況,爲製 得優於耐局溫性、低熱膨脹性、高折射率、透明性、耐ι氣 候性,而爲銲阻劑用樹脂、或者無電解電鍍阻劑用樹脂、 硬質覆膜材料、UV硬化塗料、玻璃替代材料、液晶的據 色片等有用的丙烯酸樹脂起見專心硏究之結果發現,如作 爲環氧丙烯酸酯而採用使環氧環己烷化合物與不飽和竣酸 反應所得之環氧丙烯酸酯時,則可解決上述課題之事實, 終於完成本發明》 亦即’本發明有關一種可以下述一般式(1)表示之 環氧丙烯酸酯。 【化1】201245141 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a novel epoxy acrylate which is excellent in high temperature resistance, fluidity, toughness, photosensitivity, chemical resistance, hardness, transparency, and weather resistance. Acrylic curable composition, cured product, and a method for producing the same. When the epoxy acrylate is polymerized by itself or copolymerized with a compound having various unsaturated bonds, high temperature resistance, toughness, chemical resistance, hardness, transparency, and weather resistance can be obtained. It is excellent in polymer materials and can be used in various applications such as coatings, laminates, and adhesives. Further, 'as a photocurable resin composition or a thermosetting resin composition' is also suitably used as a resin for solder-resist, or a resin for nonelectolytic plating resist, and hard. A protective film such as a hard coat material, a UV (ultraviolet) hardening paint, a glass substitute material, and a liquid crystal color filter. [Prior Art] The epoxy acrylate resin which is mainly obtained by the reaction of an epoxy compound and acrylic acid is widely used as a photosensitive material, a crosslinking agent, and the like, and various functional polymer materials. Since the resin has a hydroxyl group in the molecule, it is superior to solvent solubility and high temperature resistance (Non-Patent Document 1). In particular, 2-hydroxy-2-phenylethyl propyl acrylate which is an epoxy acrylate derived from epoxy ethyl benzene which is an epoxy group directly bonded to benzene is hardened. When the resin is compared with the general epoxy acrylate resin having glycidyl ether group-5-201245141, the molecular motion of the cured product is inhibited because the soft hydroxymethylene moiety is not held. Excellent high temperature resistance and low thermal expansion property can be expected. Further, high temperature resistance, moisture resistance, and chemical resistance can be obtained by copolymerization with a compound having various unsaturated bonds (Patent Document η, or crosslinking with a hydroxyl group such as isocyanate (Patent Document 2)) A polymer material excellent in chemical properties, etc. However, the role of 2-hydroxy-2-phenylethyl acrylate, which is the only disclosure of epoxy acrylate derived from epoxy ethyl benzene, is The reaction diluent or the cross-linking agent has not been noticed for the improvement of the epoxy acrylate itself for the purpose of improving the physical properties of the resin. Furthermore, the epoxy acrylate derived from epoxy ethylbenzene In the case of an aromatic compound, if it is to be applied to the field of optical parts, transparency and weather resistance may be insufficient. [Prior Art Document] [Patent Document 1] Japanese Patent Laid-Open No. 52 - Japanese Patent Publication No. 9-595 3 5 [Non-Patent Literature]] Polymer Chemistry, 1987, Vol. 25, No. 284, p. 850 [Invention] The purpose of the present invention is to provide It is superior to high temperature resistance, low thermal expansion, transparency, and weather resistance, and is a resin for solder resist, or a resin for electroless plating resist, a hard coating material, a UV hard coating, a glass substitute material, or a liquid crystal. An epoxy acrylate, a C -6 - 201245 141 composition, and a cured product which are useful as a color filter. In particular, an acrylic resin composition and a cured product which are useful as an optical material are provided. In the actual situation of the technology, in order to obtain better resistance to temperature, low thermal expansion, high refractive index, transparency, and weather resistance, it is a resin for solder resist or a resin for electroless plating resist. Hard acrylic coating materials, UV hardening coatings, glass substitute materials, liquid crystal color-sensitive sheets, and the like have been found to be intensive, and it has been found that epoxycyclohexane compounds and unsaturated resins are used as epoxy acrylates. When the epoxy acrylate obtained by the reaction of decanoic acid can solve the above-mentioned problem, the present invention is finally completed, that is, the present invention can be expressed by the following general formula (1). Epoxy acrylate.

00

X (在此’ X表示氫原子或甲基。Z表示C1至C6的烷 基’可爲全部相同或不相同。η表示2至3之數。a表示〇 至4之數)。 又’本發明有關將可以上述一般式(1)表示之環氧 丙烯酸酯作爲主成分含有,將可以下述一般式(2)表示 之環氧丙燃酸酯作爲副成分而含有環氧丙烯酸酯。 201245141 【化2】X (wherein 'X represents a hydrogen atom or a methyl group. Z represents a C1 to C6 alkyl group' may be all the same or different. η represents a number from 2 to 3. a represents 〇 to 4). In the present invention, the epoxy acrylate represented by the above general formula (1) is contained as a main component, and the epoxy acrylate having the following general formula (2) is used as a subcomponent to contain an epoxy acrylate. . 201245141 【化2】

ΟΟ

XX

(3)(3)

OH 1OH 1

X ο (4) 在此’八爲可以式(3)表示之含有酯鍵之基、B爲可 以式(3)或式(4)表示之含有酯鍵之基。b表示1至2 的整數。Z、X、a係與一般式(1)同樣意義者。 又’本發明有關〜種丙烯酸系硬化性組成物,其特徵 爲:含有上述環氧丙烯酸酯、及聚合引發劑。又,本發明 有關一種丙烯酸樹脂硬化物,其特徵爲:使該丙烯酸系硬 化性組成物成型硬化所成者。 又,本發明有關一種上述環氧丙烯酸酯之製造方法, 其特徵爲:使可以一般式(5)表示之環氧環己烷化合物 與丙烯酸或甲基丙烯酸進行反應。 -8- 201245141 【化3】X ο (4) Here, 'eight' is a group containing an ester bond represented by the formula (3), and B is a group containing an ester bond represented by the formula (3) or the formula (4). b represents an integer from 1 to 2. The Z, X, and a systems have the same meaning as the general formula (1). Further, the present invention relates to an acrylic curable composition comprising the above epoxy acrylate and a polymerization initiator. Further, the present invention relates to an acrylic resin cured product which is obtained by molding and curing the acrylic hardening composition. Further, the present invention relates to a process for producing the above epoxy acrylate, which comprises reacting an epoxycyclohexane compound represented by the general formula (5) with acrylic acid or methacrylic acid. -8- 201245141 【化3】

(5) (在此,Z、a以及η’具有與—般式(i)同樣意義 )° 又,本發明係一種丙烯酸系硬化性組成物或丙烯酸樹 脂硬化物’其特徵爲:上述丙烯酸系硬化性組成物或丙烯 酸樹脂硬化物,係爲光學材料用者。 [發明之最佳實施形態] 首先’就本發明之環氧丙烯酸酯加以說明。 本發明之環氧丙烯酸酯,可以上述一般式(1)表示 。在此,X表示氫原子或甲基。Ζ表示C1至C6的烷基, 可爲全部相同或不相同。η表示2至3的整數。a表示〇 至4之整數。但,n + a不會超過6。 可以上述一般式(1)表示之環氧丙烯酸酯,如使可 以上述一般式(5)表示之環氧環己酸化合物與不飽和羧 酸(含有丙烯酸、甲基丙烯酸、或者兩者之意)進行反應 以實施丙烯酸酯化,即可製造。因而,Z的種類,係源自 作爲原料使用之環氧環己烷化合物之構造者》從環氧環己 烷化合物之取得容易性或所得環氧丙烯酸酯之特性來看, -9- 201245141 z爲Cl至C6的烷基’ 3爲〇至4,較佳爲〇至1的整數 〇 可以上述一般式(5)表示之環氧環己烷化合物,可 採取環己院骨架上經取代2個環氧乙基之構造(二取代物 )或者經取代3個之構造(三取代)。二取代物的異構物 而固’有:2-二取代物(〇_ (鄰)物)、ι,3-二取代物(m (間)物)以及1,4-取代物(p-(對)物)、而三取代物 的異構物而言,有:丨,],、三取代物、丨,2,4_三取代物、 H5-取代物。本發明之製造方法中所使用之環氧環己烷 化:合物而言’如此等異構物的混合物(可爲同樣二取代物 、同樣三取代物或二取代物與三取代物的混合物),惟在 同樣二取代物的混合物之情形,從耐高溫性及低黏度性兩 立之觀點來看,較佳爲m_物及p_物的含有率高者,含有 物及ρ·物90重置%以上,較佳爲95重量%以上者很適 合使用。又,從丙烯酸樹脂硬化物之耐高溫性的觀點來看 ’較佳爲三取代物,特佳爲1,2,4 -三取代物。 本發明之環氧丙烯酸酯,可藉由環氧環己烷化合物與 不飽和羧酸之反應而製造。於此反應中,環氧環己烷化合 物的環氧基開環(ring cleavage)後與不飽和羧酸生成酯 鍵(ester linkage)而結合。此種開環,從α位及β位之 任一均可發生,惟經於α位開環之上述一般式(1)的環 氧丙烯酸酯(α加成物)將成爲主成分,與經於β位開環 之上述一般式(2)的環氧丙烯酸酯(β加成物)將成爲副 成分。一般式(2)的環氧丙烯酸酯中有2種。亦即’有 -10- 201245141 :一般式(2)中的A及B的雙方爲可以式(3)表示之含 有酯鍵之基(β加成物)之情形,及一般式(2)中的A 爲可以式(3)表示之含有酯鍵之基(β加成物),而Β 的一部分或全部爲可以式(4)表示之含有酯鍵之基(α加 成物)之情形。將前者稱爲全β加成物,將後者稱爲半β 加成物,綜合兩者稱爲β加成物。全β加成物的生成比例 ,係較半β加成物爲十分地低。再者,如一般式(2)中 的Α及Β雙方爲可以式(3)表示之含有酯鍵之基(α加 成物)之情形,則將與一般式(1 )相同者。 於上述之製造方法中,通常α加成物與β加成物的生 成比例,以莫耳計,爲 100/0.01至 1 00/70,較佳爲 100/0.1至1 00/5 0。因而,於上述之製造方法中,通常可 製得含有本發明之α加成物與β加成物的兩者之環氧丙烯 酸酯。如欲將含有α加成物與β加成物的兩者之環氧丙烯 酸酯,與僅由一般式(1)的環氧丙烯酸酯所成之環氧丙 烯酸酯區別之情形,則將前者稱爲環氧丙烯酸酯組成物, 將後者稱爲一般式(1)的環氧丙烯酸酯,如不需要特別 加以區別之情形,則將兩者稱爲環氧丙烯酸酯。 如欲從環氧丙烯酸酯組成物分離一般式(1)的環氧 丙烯酸酯時,則可依周知之方法加以分離。再者,作爲主 成分之含有’係指含有60%以上,較佳爲含有70%以上之 意’而副成分,係指含有4〇%以下,較佳爲含有30%以下 爲宜。 於上述之製造方法中,可製得含有以一般式(1)及 -11 - 201245141 (2)表示之環氧丙烯酸酯。由於此等環氧丙烯酸酯,均 係環己院環化合物之故’有椅型(chair form)、舟型( boat form )、又,有順式(Cis )、反式(trans )異構物 、或光學異構物之故’主成分及副成分,可爲含有此等異 構物之混合物。由於依上述之製造方法所得之,以—般式 (1)及(2)所表示之環氧丙烯酸酯’均爲環氧丙烯酸酯 之故’即使含有以一般式(1)及(2)所表示之環氧丙烯 酸酯之組成物,仍然稱爲環氧丙烯酸酯。 本發明之環氧丙烯酸酯’如將環氧環己烷化合物與不 飽和羧酸’需要時在觸媒,聚合抑制劑(p〇lymerization inhibitor)的存在下’在50至200 °C下反應1至50小時 ,則可製得。 環氧環己烷化合物與不飽和羧酸的原料飼給比例,係 按環氧環己烷化合物與不飽和羧酸的莫耳計,成爲10 0/5 至5/100’較佳爲成爲100/10至ίο/loo之反應比例爲宜 〇 此時可使用之觸媒而言,可例舉:氫氧化鈉 '氫氧化 鉀等的鹼金屬氫氧化物,三乙基胺、苄基二甲基胺等的三 級胺、氯化四甲基銨等的四級銨鹽、咪唑化合物 '三苯基 膦等的膦類、四正丁基鐃四苯基硼酸酯等的鱗鹽等。此等 觸媒,可爲單獨亦可爲2種以上之倂用。觸媒使用量而言 ,雖然因所用之觸媒而有異,對環氧環己烷化合物1〇〇莫 耳、較佳爲〇.〇1至100莫耳、更佳爲0.1至80莫耳。 進行反應時可使用之聚合抑制劑而言,可爲作爲乙烯 -12- 201245141 基化合物的聚合抑制劑所周知之聚合抑制劑而言,可例舉 :啡噻哄(phenothiazine )、甲氧啡噻哄、受阻胺( hindered amine)等的胺類、苯酣、甲氧苯酣 '氣酿、第 三丁基苯二酚、丁基羥基甲苯、甲酚等的苯酚類等,惟較 佳爲苯酚類。此等聚合抑制劑,可爲單獨亦可爲2種以上 之倂用。聚合抑制劑使用量而言,雖然因所用之觸媒而有 所不同,惟對環氧環己烷化合物100莫耳,較佳爲0.001 至10莫耳,更佳爲0.01至1莫耳。 進行反應時,如需要亦可使用有機溶劑。有機溶劑而 言,可例舉:甲苯、二甲苯等的芳香族烴系溶劑、MIBK (甲基異丁基甲酮)、MEK (甲基乙基甲酮)等的酮系溶 劑等。溶劑的使用量而言,對環氧環己烷化合物及不飽和 羧酸的合計重量100重量份,通常爲50至5000重量份, 較佳爲1〇〇至2000重量份。 進行反應時,如需要亦可導入空氣或氧氣。從反應的 控制的觀點來看,較佳爲導入空氣爲宜。 由反應所得之環氧丙烯酸酯,將可製得以一般式 )的環氧丙烯酸酯作爲主成分,以一般式(2)的環氧丙 烯酸酯般的異構物作爲副成分之混合物,或者n數個相異 的混合物。此等混合物,如作爲樹脂原料使用時,則可作 爲環氧丙烯酸酯而直接使用。如作爲有機藥品等的原料時 ’亦可藉由再結晶等而加以精製或分離。 環氧環己烷化合物,可使用經將乙烯基環己基化合物 藉由過氧化物而加以環氧化者。由於不使用表氯醇之故, -13- 201245141 所得化合物之氯含量較少。過氧化物而言,可使用依 的方法所得之過氧酸(peracid)、過氧化氫、或者有 氧化物。 本發明之丙烯酸系硬化物,包含上述一般式(1 環氧丙烯酸酯或者以此作爲主成分之上述環氧丙烯酸 成物,及聚合引發劑。 作爲聚合引發劑而言,可爲作爲乙烯基化合物的 引發劑所周知之聚合引發劑,因紫外線、電子射線等 性能量射線的照射或自由基聚合引發劑之適用即可硬· 利用紫外線照射所引起之硬化時,則添加光聚合 劑(photopolymerization initiator)。光聚合引發劑 ,雖然不特別加以限定,惟可例舉:因紫外線的照射 激動並發生自由基之型式的通常的光聚合引發 photopolymerization initiator),具體上,適當的引 而言,可例舉:苯偶姻(benzoin)、苯偶姻甲醚、苯 乙醚、苯偶姻異丙醚、α-甲基苯偶姻等的苯偶姻類, 基異丁基苯酹、二苯基酚、對甲基二苯基酚、對氯二 酚、對二乙基胺基二苯基酚等的二苯基酚類,乙醯 9,10-蒽酮、1·氯蒽酮、2-氯蒽酮等的蒽酮類,二苯基 化物、四甲基硫胺甲醯基二硫化物等的含硫黃化合物 〇 此等光聚合引發劑,可以單獨或混合2種以上使 其調配量而言,對聚合性化合物之合計量,推薦0.1 : 重量%程度。 通常 機過 )的 酯組 聚合 的活 化。 引發 而言 而被 劑( 發劑 偶姻 α_羥 苯基 苯、 二硫 類等 用, g 1 0 -14- 201245141 又,爲促進使用光聚合引發劑之光聚合反應起見,亦 可添加光敏劑(Photosensitizer)。 此種光增感劑,並不特別加以限定,具體而言,可例 示:三乙基胺、三乙醇胺等的三級胺類,三苯基膦等的烷 基膦類,硫二甘醇等的硫醚類等,其調配量而言,可推薦 對聚合性化合物(上述環氧丙烯酸酯或者環氧丙烯酸酯組 成物,和因需要所添加之其他聚合性單體之意)的合計量 之0.1至5重量%程度。 紫外線的光源而言,可採用:化學燈(chemical lamp )、低壓水銀燈、高壓水銀燈、氣氣燈(x e η ο η 1 a m p )、 金屬齒化物燈(metal halide lamp)等。 利用電子射線所引起之硬化時,則並不需要採用光聚 合引發劑或光增感劑,而使用泛用之電子射線發生裝置, 以照射通常,1至20兆拉德(megarad)程度的照射劑量 (dose )之電子射線即可。 進行有關本發明之丙烯酸系硬化性組成物之自由基聚 合時所用之自由基聚合引發劑(radical polymerization initiator),並不特別加以限定,具體而言,可例示:過 氧化苯甲醯、二異丙基過氧化碳酸酯、過氧化月桂醯等的 過氧化物、偶氮雙異丁腈等的偶氮化合物,此等聚合引發 劑’可爲單獨亦可爲2種以上之倂用。聚合引發劑,較佳 爲按用途之不同而分開使用熱硬化用者,或光硬化用者。 此等聚合引發劑之使用量而言,雖然因所用之聚合抑 制劑而有所不同,惟對聚合性化合物的合計量,較佳爲 -15- 201245141 0.001至5重量份,更佳爲〇.01至1重量份。但’由於該 混合比將因所使用之硬化劑的種類而變化很大之故’需要 適當決定最適條件。 於本發明之丙烯酸系硬化性組成物中’需要時’除一 般式(1)的環氧丙烯酸酯或者以此作爲主成分之上述環 氧丙烯酸酯組成物之外,尙可添加因熱或光所生成之其他 聚合物單體。但,聚合性成分中,以合計含有上述一般式 (1)的環氧丙烯酸酯或者以此作爲主成分之上述環氧丙 烯酸酯組成物50wt (重量)%以上爲宜。其他的聚合性單 體而言,可爲周知之熱或光所生成之聚合性單體,可將下 述中所例示之各種丙烯酸酯系化合物按單獨或2種以上混 合後,作爲硬化性成分倂用。 單官能性(甲基)丙烯酸酯而言,可例示:甲基(甲 基)丙烯酸酯、乙基(甲基)丙烯酸酯、正丙基(甲基) 丙烯酸酯、丁基(甲基)丙烯酸酯、異丁基(甲基)丙烯 酸酯、正己基(甲基)丙烯酸酯、2-乙基己基(甲基)丙 烯酸酯、癸基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸 酯、硬脂基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯 、2 -羥基乙基(甲基)丙烯酸酯、2 -羥基丙基(甲基)丙 烯酸酯、二甲基胺基乙基(甲基)丙烯酸酯、二乙基胺基 乙基(甲基)丙烯酸酯、3·氯代-2-羥基丙基(甲基)丙烯 酸酯、2,3-二溴丙基(甲基)丙烯酸酯等。 一官能性(甲基)丙烯酸酯而言,可例示:乙二醇二 (甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙 -16- 201245141 一醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯 。聚乙二醇二(甲基)丙烯酸酯 '丙二醇二(甲基)丙烯 酸醋、一丙一醇二(甲基)丙烯酸酯、三丙二醇二(甲基 )丙嫌酸醋、聚丙二醇二(甲基)丙烯酸酯、丙二醇二( 甲基)丙嫌酸酯、甘油二(甲基)丙烯酸酯、〗,3_丁二醇 —(甲基)丙烯酸酯、1,4 -丁二醇二(甲基)丙烯酸酯、 1,5-戊二醇二(甲基)丙烯酸酯、丨,6_己二醇二(甲基) 丙稀酸醋、新戊二醇二(甲基)丙烯酸酯、雙(氧甲基) 三環[5.2.2.02,5]癸烷二(甲基)丙烯酸酯 '環己二醇二( 甲基)丙烯酸酯、雙[(甲基)丙烯醯氧甲基]環己烷、三 經甲基丙烷與特戊醛的縮醛的二丙烯酸酯、羥基特戊酸新 戊二醇酯二丙烯酸酯、雙酚A二(甲基)丙烯酸酯、雙酚 A的環氧烷烴加成物的二(甲基)丙烯酸酯等。 三乃至四官能性(甲基)丙烯酸酯而言,可例示:三 羥甲基丙烷三(甲基)丙烯酸酯、異戊四醇四(甲基)丙 烯酸酯、二異戊四醇五(甲基)丙烯酸酯、二異戊四醇六 (甲基)丙烯酸酯等。 丙烯酸系聚合性低聚物而言,可例示:環氧(甲基) 丙烯酸酯、聚胺基甲酸酯(甲基)丙烯酸酯、聚酯(甲基 )丙烯酸酯、聚丁二烯低聚物的(甲基)丙烯酸酯、聚醯 胺型(甲基)丙烯酸酯低聚物、三聚氰胺(甲基)丙烯酸 酯、環戊二烯低聚物的(甲基)丙烯酸酯、聚矽氧低聚物 的(甲基)丙烯酸酯等。 又,除上述之丙烯酸酯系單體外,尙可適當其他的聚 -17- 201245141 合性單體’例如,苯乙烯、醋酸乙烯、氯化乙烯、 乙烯' 丙烯腈 '乙烯基醚、丙烯醛等的乙烯基系化 乙烯、丁二烯等的烯烴等。此等熱或光所生成 物單體,可爲單獨亦可爲2種以上之併用。熱或光 之聚合性單體,較佳爲按用途之不同而分開使用。 於本發明之丙烯酸系硬化性組成物中,需要時 添加塡充劑、纖維、偶合劑(coupling agent) 、P且 脫模劑、發泡劑等的其他成分。此時的塡充劑而言 舉:聚乙烯粉末、聚丙烯粉末、石英、二氧化矽、 、碳酸銘、碳酸鎂、石資、皂土( bentnite )、蛋 氧化鈦 '炭黑、石墨、氧化鐵、鋁粉末、鐵粉、滑 母、高嶺黏土等,纖維而言,可例舉:纖維素纖維 纖維、碳纖維、芳族聚胺纖維(aramid fibre)、等 劑而言,可例舉:矽烷偶合劑、鈦偶合劑等。阻燃 ,可例舉:溴化雙酚A、三氧化銻、磷系化合物等 劑而言,可例舉:硬脂酸鹽、聚矽氧、蠟等。發泡 ,可例舉:氟隆(flon,氯氟化碳)、二氯乙烷、 二硝基五亞甲基四胺、對甲苯磺醯醯胼、或者,氟 氟乙烷、丁烷、戊烷等經塡充在氯化乙烯-氯化亞 聚物或苯乙烯-(甲基)丙烯酸酯聚合物的殻內之 熱塑性樹脂粒子等。 本發明之丙烯酸系硬化性組成物,可依與在來 方法容易作成丙烯酸樹脂硬化物。例如,將本發明 丙烯酸酯或環氧丙烯酸酯組成物、聚合引發劑,需 氯化亞 合物、 之聚合 所生成 ,尙可 燃劑、 ,可例 矽酸鹽 石、二 石、雲 、玻璃 。偶合 劑而言 。脫模 劑而言 丁烷、 隆、二 乙烯共 膨脹性 周知之 之環氧 要時熱 -18- 201245141 或光所引起之聚合性單體以及其他的添加物,需要時採用 擠壓機(extruder)、捏合機(kneader)、輥輪(roll) 等加以混合均勻爲止以製得丙烯酸樹脂組成物,使其丙烯 酸樹脂組成物熔融後塑模或採用傳遞成型機(transfer moulding machine )等加以成型,再加熱爲80至200°C則 可製得硬化物。 又,亦可使本發明之丙烯酸系硬化性組成物溶解於溶 劑,並使其含浸於玻璃纖維、炭纖維、聚酯纖維、聚醯胺 纖維、氧化鋁纖維、紙等的基材後將加熱乾燥所得之預浸 膠布(prepreg)進行熱壓塑成型(thermopress moulding )以製得硬化物。例如,將本發明之環氧丙烯酸酯或環氧 丙烯酸酯組成物、聚合引發劑以及其他添加劑等加熱、攪 拌至均勻,並經使其含浸於玻璃布且加熱半乾燥以揮發溶 劑之預浸膠布,重疊需要張數後在80至200°C下加熱壓塑 ,則可製作玻璃布層合板。 此時,可採用之稀釋用溶劑的具體例而言,較佳爲甲 苯、二甲苯、甲基乙基甲酮、甲基異丁基甲酮、甲基溶纖 劑(methyl cellosolve )等,而其使用量,係對丙烯酸系 硬化性組成物和該稀釋用溶劑的合計重量,爲1 0至70重 量%,較佳爲1 5至6 5重量%。 由於如此所得之硬化物係具有高的耐高溫性、韌性、 耐化學藥品以及硬度之故,本發明之丙烯酸樹脂硬化物, 可在光學樹脂等廣泛的領域使用。具體而言,亦很適合使 用爲銲阻劑用樹脂、或無電解電鍍阻劑用樹脂、硬質覆膜 -19- 201245141 材料、UV硬化塗料 '玻璃替代材料、以及液晶的濾 等的保護膜。特別帛’作爲透鏡、稜鏡、濾色片、或 等的保護膜等的光學材料優異者。 【實施方式】 [實施例] 接著’爲使本發明之特徵能更明確起見,舉出實 以具體加以說明。在此,文中的「份」、「%」均爲 重量基準者。 [實施例1] 於裝配有冷卻管、溫度計、空氣吹入管之300ml 璃製三頸燒瓶中’置入1,2,4-三環氧乙基環己烷10.5 50mmol(毫莫耳))、丙烯酸 18.01g( 250mmol)、 节基三乙基錢〇.23g(lmmol)、二丁基經基甲苯〇. (0.25mmol )、甲苯100ml,在吹入空氣中,在80 °C 行加熱搅拌,使其反應24小時。反應後冷卻至室溫 使用蒸餾水l〇〇ml洗滌3次。經分離甲苯層並餾除甲 ,藉由以醋酸乙酯+己烷(4 : 6 )作爲展開液(deve )之砂膠管柱(silicagel column)進行精製。製得無 明且黏稠液體的三環氧丙烯酸酯環己烷13.00g (收率 )。該三環氧丙烯酸酯環己烷係經於GC (氣相色譜 分析確認爲於一般式(1)中,a爲〇、X爲Η、η爲 以環氧丙烯酸酯作爲主成分之事實。將此三環氧丙嫌 色片 者此 施例 表示 的玻 ig ( 氯化 〇55g 下進 ,並 苯後 loper 色透 6 1 % 法) 3之 酸酯 -20- 201245141 環己烷的1H-NMR光譜表示於第1圖中。 [比較例1] 於裝配有冷卻管、溫度計、空氣吹入管之5 00ml的玻 璃製三頸燒瓶中,置入氯化苯乙烯50.0〇g ( 416mm〇l )、 丙烯酸 29.98g(416mmol)、三苯基膦 16mmol )、4-第三丁基苯二酚 0.346g(2.08mmol)、甲苯 100ml ,在吹入空氣中,在60 °C下進行加熱攪拌’使其反應24 小時。反應後冷卻至室溫,並使用蒸餾水1 0〇ml洗滌3次 。經分離甲苯層並餾除甲苯後,藉由以醋酸乙酯+氯仿(2 :8 )作爲展開液之矽膠管柱進行精製。製得無色透明的 液體的環氧丙烯酸酯苯54.37g (收率68%)。 [實施例2] 將實施例1中所得之三環氧丙烯酸酯環己烷的100重 量份,與作爲聚合引發劑之伊爾佳裘亞1 8 4 [升葉特殊藥品 <股 >製;商品名]5重量份加以捏合,以調製組成物。將此 塗佈於玻璃板或鋁皿上,並被覆脫模PET (聚苯二甲酸乙 二醇酯)薄膜’並採用高壓水銀燈’按能量射線量能成爲 6 00mJ (毫焦耳)/cm2之方式照射紫外線,藉以使其硬化 而製得膜狀的硬化物。 接著,以所得之硬化物作爲試料,依下述方法實施其 鉛筆硬度試驗(P e n s i 1 t e s t )、玻璃化溫度、以及熱膨脹 係數(αΐ)的分析。將其結果表示於表1中。 -21 - 201245141 (鉛筆硬度) 就經於玻璃板上硬化爲10至20μηι之方式之塗膜,根 據JIS Κ5 600在荷重lkg下進行測定,並依不受刮傷之最 硬的鉛筆的硬度加以表示》 (玻璃化溫度:Tg、熱膨脹係數;α i ) 就經將試料調整爲長度20mm、寬幅5mm、厚度 0.1mm ’使用SII奈米科技(股)製:熱機分析裝置( thermomechanical analyzer) (TMA/SS),在氮氣氣氛下 ,依升溫速度7 °C /分鐘的條件求得。 (YI( yellow index,透明性)値) 將厚度50μπι的薄膜作爲試料,依照JIS K7373加以 評價。 (全光線穿透率:Tt ) 將厚度50μηι的薄膜作爲試料,依照JIS K7361-1加 以評價。 [比較例2] 將比較例1中所得之環氧丙烯酸酯苯按與實施例2同 樣條件,製得膜狀的硬化物。 接著,按與實施例2同樣條件實施所得硬化物的鉛筆 -22- 201245141 硬度、玻璃化溫度、以及熱膨脹係數(α 1 )的分析。將其 結果表示於表1中。 [表1] 鉛筆硬度 Tg (t:) a 1 (ppm) YI値 Tt (%) 實施例2 2 Η 163t: 55 0. 91 94 比較例2 2 Η 158t: 58 2. 53 92 [產業上之利用可能性] 本發明之環氧丙烯酸酯,係較在來之環氧丙烯酸酯, 爲耐高溫性、低熱膨脹性、高折射率、透明性、耐氣候性 優異者’可製得爲銲阻劑用樹脂、或無電解電鍍阻劑用樹 脂、硬質覆膜材料、UV硬化塗料、玻璃替代材料、液晶 的爐色片等的光學樹脂有用的環氧丙烯酸酯、丙烯酸系組 成物以及硬化物。 【圖式簡單說明】 [第1圖]表示三環氧甲基丙烯酸環己烷之ih_nmr( 氫原子核磁共振)光譜。 -23-(5) (here, Z, a, and η' have the same meanings as in the general formula (i)). Further, the present invention is an acrylic curable composition or an acrylic cured product, which is characterized by the above acrylic The curable composition or the cured acrylic resin is used as an optical material. BEST MODE FOR CARRYING OUT THE INVENTION First, the epoxy acrylate of the present invention will be described. The epoxy acrylate of the present invention can be represented by the above general formula (1). Here, X represents a hydrogen atom or a methyl group. Ζ represents an alkyl group of C1 to C6, which may be all the same or different. η represents an integer of 2 to 3. a represents an integer from 〇 to 4. However, n + a will not exceed 6. The epoxy acrylate represented by the above general formula (1), such as an epoxycyclohexanoic acid compound represented by the above general formula (5) and an unsaturated carboxylic acid (containing acrylic acid, methacrylic acid, or both) The reaction can be carried out to carry out acrylation, that is, it can be produced. Therefore, the type of Z is derived from the structure of the epoxycyclohexane compound used as a raw material. From the easiness of obtaining an epoxycyclohexane compound or the characteristics of the obtained epoxy acrylate, -9-201245141 z The alkyl group of C to C6 is an integer of 〇 to 4, preferably 〇 to 1, and the epoxycyclohexane compound represented by the above general formula (5) may be substituted on the ring of the ring. The structure of the epoxy group (disubstituted) or the structure of three substitutions (trisubstituted). The isomer of the disubstituted product is solid with: 2-disubstituted (〇-(o)), i-, 3-disubstituted (m), and 1,4-substituted (p- (I), and the isomer of the trisubstituted product are: hydrazine, ], trisubstituted, hydrazine, 2,4_trisubstituted, H5-substituted. The cyclohexylation compound used in the production method of the present invention is a mixture of such isomers (may be the same disubstituted, same trisubstituted or a mixture of disubstituted and trisubstituted) However, in the case of a mixture of the same disubstituted materials, from the viewpoint of high temperature resistance and low viscosity, it is preferable that the content of the m_ thing and the p_ substance is high, the substance and the substance 90% or more, preferably 95% by weight or more is suitable for use. Further, from the viewpoint of high temperature resistance of the cured acrylic resin, it is preferably a trisubstituted product, particularly preferably a 1,2,4-trisubstituted product. The epoxy acrylate of the present invention can be produced by a reaction of an epoxycyclohexane compound with an unsaturated carboxylic acid. In this reaction, the epoxy group of the epoxycyclohexane compound is ring cleavage and then bonded to an unsaturated carboxylic acid to form an ester linkage. Such ring-opening can occur from either the α-position or the β-position, but the epoxy acrylate (α adduct) of the above general formula (1) which is opened at the α-position will become a main component, and The epoxy acrylate (β adduct) of the above general formula (2) which is opened at the β-position will be an accessory component. There are two kinds of epoxy acrylates of the general formula (2). In other words, there is a case where both of A and B in the general formula (2) are a group containing an ester bond (β adduct) represented by the formula (3), and a general formula (2) A is a group containing an ester bond represented by the formula (3) (β adduct), and a part or all of Β is a group containing an ester bond (α adduct) represented by the formula (4). The former is referred to as a full beta adduct, and the latter is referred to as a semi-beta adduct, which is referred to as a beta adduct. The ratio of total beta adduct formation is very low compared to the semi-beta adduct. Further, in the case where both of ruthenium and osmium in the general formula (2) are those having an ester bond (α-addition) represented by the formula (3), the same formula as (1) will be used. In the above production method, the ratio of the α adduct to the β adduct is usually from 100/0.01 to 1 00/70, preferably from 100/0.1 to 1 00/5 0. Therefore, in the above production method, an epoxy acrylate containing both the α adduct of the present invention and the β adduct can be usually obtained. If the epoxy acrylate containing both the α adduct and the β adduct is distinguished from the epoxy acrylate formed only by the epoxy acrylate of the general formula (1), the former is called The epoxy acrylate composition is referred to as an epoxy acrylate of the general formula (1), and if it is not particularly necessary to distinguish it, the two are referred to as epoxy acrylate. When the epoxy acrylate of the general formula (1) is to be separated from the epoxy acrylate composition, it can be isolated by a known method. In addition, the content of the main component is preferably 60% or more, preferably 70% or more, and the subcomponent is preferably 4% by weight or less, preferably 30% or less. In the above production method, an epoxy acrylate represented by the general formula (1) and -11 - 201245141 (2) can be obtained. Because these epoxy acrylates are all ring-ring compound compounds, there are chair forms, boat forms, and there are cis (Cis) and trans (trans) isomers. Or the main component and the subcomponent of the optical isomer may be a mixture containing such isomers. According to the above-mentioned manufacturing method, the epoxy acrylates represented by the general formulas (1) and (2) are both epoxy acrylates, even if they contain the general formulas (1) and (2). The composition of the epoxy acrylate represented is still referred to as epoxy acrylate. The epoxy acrylate of the present invention is reacted at 50 to 200 ° C in the presence of a catalyst, an unsaturated carboxylic acid, as needed, in the presence of a catalyst, a polymerization inhibitor (p〇lymerization inhibitor). It can be made up to 50 hours. The raw material feeding ratio of the epoxycyclohexane compound and the unsaturated carboxylic acid is 10 0/5 to 5/100', preferably 100, based on the molar ratio of the epoxycyclohexane compound to the unsaturated carboxylic acid. The reaction ratio of /10 to ίο/loo is preferably a catalyst which can be used at this time, and an alkali metal hydroxide such as sodium hydroxide 'potassium hydroxide, triethylamine or benzyl dimethyl hydride A tertiary amine such as a tertiary amine, a quaternary ammonium salt such as tetramethylammonium chloride, a phosphine such as an imidazole compound 'triphenylphosphine, or a scaly salt such as tetra-n-butylphosphonium tetraphenyl borate. These catalysts may be used alone or in combination of two or more. In terms of the amount of catalyst used, although it varies depending on the catalyst to be used, it is preferably 1 to 100 moles, more preferably 0.1 to 80 moles per mole of the epoxycyclohexane compound. . In the case of the polymerization inhibitor which can be used in the reaction, a polymerization inhibitor which is well known as a polymerization inhibitor of the ethylene-12-201245141-based compound may, for example, be phenothiazine or methoxymorphine. An amine such as anthracene, a hindered amine, a benzoquinone, a methoxybenzoquinone, a phenol, a butyl phenol, a butyl hydroxytoluene or a phenol such as cresol, and preferably a phenol. class. These polymerization inhibitors may be used alone or in combination of two or more. The amount of the polymerization inhibitor used is preferably from 0.001 to 10 moles, more preferably from 0.01 to 1 mole, per 100 moles of the epoxycyclohexane compound, although it varies depending on the catalyst to be used. When the reaction is carried out, an organic solvent can also be used if necessary. The organic solvent may, for example, be an aromatic hydrocarbon solvent such as toluene or xylene, or a ketone solvent such as MIBK (methyl isobutyl ketone) or MEK (methyl ethyl ketone). The amount of the solvent to be used is usually 50 to 5000 parts by weight, preferably 1 to 2000 parts by weight, based on 100 parts by weight of the total of the epoxycyclohexane compound and the unsaturated carboxylic acid. When the reaction is carried out, air or oxygen may be introduced if necessary. From the viewpoint of control of the reaction, it is preferred to introduce air. From the epoxy acrylate obtained by the reaction, an epoxy acrylate which can be obtained by the general formula) is used as a main component, and an epoxy acrylate-like isomer of the general formula (2) is used as a mixture of sub-components, or n number a different mixture. When these mixtures are used as a resin raw material, they can be used as an epoxy acrylate. When it is used as a raw material for an organic drug or the like, it can be purified or separated by recrystallization or the like. As the epoxycyclohexane compound, those obtained by subjecting a vinylcyclohexyl compound to epoxidation by a peroxide can be used. The compound obtained from -13-201245141 has a lower chlorine content because it does not use epichlorohydrin. As the peroxide, peracid, hydrogen peroxide, or an oxide obtained by the method can be used. The acrylic cured product of the present invention contains the above-mentioned general formula (1 epoxy acrylate or the above-mentioned epoxy acrylate product as a main component, and a polymerization initiator. As a polymerization initiator, it can be used as a vinyl compound. The polymerization initiator known as an initiator can be hardened by irradiation with an energy ray such as ultraviolet rays or electron beams or a radical polymerization initiator. When a curing by ultraviolet irradiation is applied, a photopolymerization initiator is added. The photopolymerization initiator is not particularly limited, and may be a photopolymerization initiator which is a type of radical which is excited by ultraviolet light and generates a radical. Specifically, an appropriate introduction can be exemplified. Benzene: benzoin (benzoin), benzoin methyl ether, phenethyl ether, benzoin isopropyl ether, α-methylbenzoin and other benzoin, isobutyl benzoquinone, diphenyl phenol , diphenylphenols such as p-methyldiphenylphenol, p-chlorophenol, p-diethylaminodiphenylphenol, acetam 9,10-fluorenone, l-chloroindanone, 2-chloro Anthrone The sulfonate-containing compound such as a ketone, a diphenylate or a tetramethylthiamine-methyl sulfonyl disulfide may be used alone or in combination of two or more kinds thereof to adjust the polymerization property. The total amount of the compound is recommended to be 0.1:% by weight. Normally the activation of the ester group polymerization. For the purpose of triggering, the agent (yield acetoin α-hydroxyphenylbenzene, disulfide, etc., g 1 0 -14- 201245141), in order to promote the photopolymerization reaction using a photopolymerization initiator, may also be added Photosensitizer. The photo sensitizer is not particularly limited, and specific examples thereof include tertiary amines such as triethylamine and triethanolamine, and alkylphosphines such as triphenylphosphine. For the amount of the thioether such as thiodiglycol, a polymerizable compound (the above epoxy acrylate or epoxy acrylate composition, and other polymerizable monomers added as needed) may be recommended. The total amount of the meaning is 0.1 to 5% by weight. For the ultraviolet light source, a chemical lamp, a low pressure mercury lamp, a high pressure mercury lamp, a gas lamp (xe η ο η 1 amp ), a metal tooth compound can be used. Metal halide lamp, etc. When curing by electron beam is used, it is not necessary to use a photopolymerization initiator or a photosensitizer, and a general-purpose electron beam generating device is used to irradiate normally, 1 to 20 megabytes. Rade (megarad) The electron beam of the dose of the dose may be used. The radical polymerization initiator used in the radical polymerization of the acrylic curable composition of the present invention is not particularly limited, specifically In other words, a peroxide such as benzamidine peroxide, diisopropyl peroxycarbonate, a peroxide such as laurel, or an azo compound such as azobisisobutyronitrile may be exemplified, and these polymerization initiators may be The polymerization initiator may be used alone or in combination with a heat-curing agent or a photo-curing agent depending on the application. The polymerization inhibitor is different, but the total amount of the polymerizable compound is preferably -15 to 201245141 0.001 to 5 parts by weight, more preferably 〇.01 to 1 part by weight, but 'because the mixing ratio is due to The type of the hardener to be used varies greatly, and it is necessary to appropriately determine the optimum conditions. In the acrylic curable composition of the present invention, when necessary, the epoxy acrylate of the general formula (1) or In addition to the above-mentioned epoxy acrylate composition as the main component, ruthenium may be added with other polymer monomers formed by heat or light. However, the polymerizable component contains the epoxy of the above general formula (1) in total. The acrylate or the epoxy acrylate composition having the above-mentioned main component is preferably 50 wt% or more. The other polymerizable monomer may be a polymerizable monomer which is formed by heat or light. The various acrylate-based compounds exemplified below are used alone or in combination of two or more kinds thereof, and are used as a curable component. Monofunctional (meth) acrylates are exemplified by methyl (meth) acrylate. Ester, ethyl (meth) acrylate, n-propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, n-hexyl (meth) acrylate, 2 -ethylhexyl (meth) acrylate, mercapto (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, 2 - Hydroxyethyl (methyl) propyl Acid ester, 2-hydroxypropyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, 3 · chloro-2- Hydroxypropyl (meth) acrylate, 2,3-dibromopropyl (meth) acrylate, and the like. The monofunctional (meth) acrylate is exemplified by ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, and triethyl-16-201245141 monool di(methyl). Acrylate, tetraethylene glycol di(meth)acrylate. Polyethylene glycol di(meth)acrylate 'propylene glycol di(meth)acrylic acid vinegar, monopropanol di(meth)acrylate, tripropylene glycol di(methyl)propyl sulphuric acid vinegar, polypropylene glycol di(a) Acrylate, propylene glycol di(methyl)propionic acid acrylate, glycerol di(meth) acrylate, 1,3-butanediol-(meth) acrylate, 1,4-butanediol bis (A) Acrylate, 1,5-pentanediol di(meth)acrylate, hydrazine, 6-hexanediol di(meth) acrylate vinegar, neopentyl glycol di(meth) acrylate, double (oxymethyl) tricyclo[5.2.2.02,5]decane di(meth)acrylate 'cyclohexanediol di(meth)acrylate, bis[(methyl)acryloxymethyl]cyclohexane Diacrylate of acetal of alkane, trimethylpropane and pivalaldehyde, neopentyl glycol hydroxypivalate diacrylate, bisphenol A di(meth) acrylate, bisphenol A alkylene oxide The di(meth)acrylate of the adduct, and the like. The tri- or tetra-functional (meth) acrylate can be exemplified by trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, diisopentaerythritol five (a) Acrylate, diisopentaerythritol hexa(meth) acrylate, and the like. Examples of the acrylic polymerizable oligomer include epoxy (meth) acrylate, polyurethane (meth) acrylate, polyester (meth) acrylate, and polybutadiene oligomerization. (meth) acrylate, polyamido type (meth) acrylate oligomer, melamine (meth) acrylate, (meth) acrylate of cyclopentadiene oligomer, low polyoxymethylene (meth) acrylate of the polymer, and the like. Further, in addition to the above acrylate-based monomer, ruthenium may be suitably used in other poly-17-201245141 conjugated monomers such as styrene, vinyl acetate, vinyl chloride, ethylene 'acrylonitrile' vinyl ether, acrolein. Examples of the vinyl group include an olefin such as ethylene or butadiene. These heat or light-generating monomers may be used alone or in combination of two or more. The heat or light polymerizable monomer is preferably used separately depending on the application. In the acrylic curable composition of the present invention, if necessary, other components such as a chelating agent, a fiber, a coupling agent, P, a releasing agent, and a foaming agent are added. In this case, the chelating agent is: polyethylene powder, polypropylene powder, quartz, cerium oxide, carbonic acid, magnesium carbonate, stone, bentonite, egg titanium oxide, carbon black, graphite, oxidation Iron, aluminum powder, iron powder, slippery mother, kaolin clay, etc., and the fiber may, for example, be a cellulose fiber fiber, a carbon fiber, an aramid fiber, or the like, and may be exemplified by decane. A coupling agent, a titanium coupling agent, and the like. The flame retardant may, for example, be brominated bisphenol A, antimony trioxide or a phosphorus compound, and examples thereof include stearate, polyfluorene oxide, and wax. For foaming, fluorocarbon (flon, chlorofluorocarbon), dichloroethane, dinitropentamethylenetetramine, p-toluenesulfonate, or fluorofluoroethane, butane, Pentane or the like is a thermoplastic resin particle or the like which is filled in a shell of a vinyl chloride-chlorinated polymer or a styrene-(meth)acrylate polymer. The acrylic curable composition of the present invention can be easily made into an acrylic cured product in accordance with the conventional method. For example, the acrylate or epoxy acrylate composition of the present invention and the polymerization initiator are formed by polymerization of a chlorinated compound, and a flammable agent, for example, strontium silicate, sillimanite, cloud, or glass. For the coupling agent. For the release agent, the co-expansion of butane, lanthanum and diethylene is known as the epoxy heat -18-201245141 or the polymerizable monomer caused by light and other additives, if necessary, an extruder is used. a kneader, a roll, or the like is mixed to obtain an acrylic resin composition, and the acrylic resin composition is melted, molded, or molded by a transfer molding machine or the like. A hardened material can be obtained by reheating at 80 to 200 °C. Further, the acrylic curable composition of the present invention may be dissolved in a solvent and impregnated with a substrate such as glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber or paper, and then heated. The prepreg obtained by drying is subjected to thermopress moulding to obtain a cured product. For example, the epoxy acrylate or epoxy acrylate composition of the present invention, a polymerization initiator, and other additives are heated and stirred until uniform, and are impregnated with a glass cloth and heated to be semi-dried to volatilize the solvent. After the number of sheets is overlapped and heated and compression molded at 80 to 200 ° C, a glass cloth laminate can be produced. In this case, specific examples of the solvent for dilution which can be used are preferably toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, etc., and are used. The amount of the acrylic curable composition and the solvent for dilution is from 10 to 70% by weight, preferably from 15 to 65 % by weight. Since the cured product thus obtained has high temperature resistance, toughness, chemical resistance, and hardness, the cured acrylic resin of the present invention can be used in a wide range of fields such as optical resins. Specifically, it is also suitably used as a protective film for a solder resist resin, a resin for electroless plating resist, a hard film -19-201245141 material, a UV curable coating material, a glass substitute material, and a liquid crystal filter. In particular, it is excellent as an optical material such as a lens, a ruthenium, a color filter, or a protective film. [Embodiment] [Embodiment] Next, in order to make the features of the present invention clearer, the details will be specifically described. Here, the "parts" and "%" in the text are all weight basis. [Example 1] In a 300 ml glass three-necked flask equipped with a cooling tube, a thermometer, and an air blowing tube, '1,2,4-triepoxyethylcyclohexane 10.5 50 mmol (mole) was placed, Acrylic acid 18.01g (250mmol), benzyl triethyl hydrazine. 23g (lmmol), dibutyl thioglycolate (0.25mmol), toluene 100ml, heated in air at 80 °C, stirring. It was allowed to react for 24 hours. After the reaction, it was cooled to room temperature and washed three times with distilled water l〇〇ml. The toluene layer was separated and the methyl group was distilled off, and purified by a silica gel column using ethyl acetate + hexane (4:6) as a deeve. 13.00 g (yield) of triepoxy acrylate cyclohexane of an ambiguous and viscous liquid was obtained. The triepoxy acrylate cyclohexane was confirmed by GC (gas chromatography analysis in the general formula (1), a is 〇, X is Η, and η is an epoxy acrylate as a main component. This tri-glycidose chrome film is the glass ig represented by this example (5 g of ruthenium chloride, and the benzene after the loter color is 6 1 % method) 3 acid ester-20- 201245141 1H-NMR of cyclohexane The spectrum is shown in Fig. 1. [Comparative Example 1] In a 500-neck three-necked flask equipped with a cooling tube, a thermometer, and an air blowing tube, styrene chloride 50.0 μg (416 mm〇l) was placed. 29.98 g (416 mmol) of acrylic acid, 16 mmol of triphenylphosphine, 0.346 g (2.08 mmol) of 4-tert-butylbenzenediol, and 100 ml of toluene were heated and stirred at 60 ° C in air. Reaction for 24 hours. After the reaction, it was cooled to room temperature, and washed three times with 10 ml of distilled water. After separating the toluene layer and distilling off toluene, it was purified by a ruthenium tube column using ethyl acetate + chloroform (2:8) as a developing solution. An epoxy acrylate benzene of 54.37 g (yield 68%) of a colorless transparent liquid was obtained. [Example 2] 100 parts by weight of the triepoxy acrylate cyclohexane obtained in Example 1 and Ilgarya 1 8 4 as a polymerization initiator [Helical special medicine <; Trade name] 5 parts by weight was kneaded to prepare a composition. This is applied to a glass plate or an aluminum dish, and is coated with a release PET (polyethylene terephthalate) film and a high-pressure mercury lamp can be used in an energy ray amount of 600 mJ (mJ)/cm 2 . Ultraviolet rays are irradiated to harden them to obtain a film-like cured product. Next, the obtained cured product was used as a sample, and the pencil hardness test (P e n s i 1 t e s t ), the glass transition temperature, and the thermal expansion coefficient (αΐ) were analyzed by the following methods. The results are shown in Table 1. -21 - 201245141 (Pencil hardness) The coating film is cured to a thickness of 10 to 20 μm on a glass plate, and is measured under a load of lkg according to JIS Κ 5 600, and is applied to the hardness of the hardest pencil which is not scratched. Representation" (glass transition temperature: Tg, coefficient of thermal expansion; α i ) The sample was adjusted to a length of 20 mm, a width of 5 mm, and a thickness of 0.1 mm. Using SII Nanotechnology Co., Ltd.: thermomechanical analyzer ( TMA/SS) was obtained under a nitrogen atmosphere at a temperature increase rate of 7 ° C /min. (YI (yellow index) 値) A film having a thickness of 50 μm was used as a sample and evaluated in accordance with JIS K7373. (Total light transmittance: Tt) A film having a thickness of 50 μm was used as a sample and evaluated in accordance with JIS K7361-1. [Comparative Example 2] A film-like cured product was obtained under the same conditions as in Example 2 except that the epoxy acrylate benzene obtained in Comparative Example 1 was used. Next, analysis of the pencil -22-201245141 hardness, glass transition temperature, and thermal expansion coefficient (α 1 ) of the obtained cured product was carried out under the same conditions as in Example 2. The results are shown in Table 1. [Table 1] Pencil hardness Tg (t:) a 1 (ppm) YI 値 Tt (%) Example 2 2 Η 163t: 55 0. 91 94 Comparative Example 2 2 Η 158t: 58 2. 53 92 [Industry Use possibility] The epoxy acrylate of the present invention is superior in resistance to high temperature, low thermal expansion, high refractive index, transparency, weather resistance, and can be obtained as a solder resist. An epoxy acrylate, an acrylic composition, and a cured product which are useful as an optical resin such as a resin for a coating agent, a resin for electroless plating resist, a hard coating material, a UV-curing coating material, a glass substitute material, or a liquid crystal coloring film. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] shows an ih_nmr (hydrogen atom nuclear magnetic resonance) spectrum of tricyclohexyl methacrylate cyclohexane. -twenty three-

Claims (1)

201245141 七、申請專利範圍: 1. 一種以下述一般式(1)表示之環氧丙烯酸酯, 【化1】201245141 VII. Patent application scope: 1. An epoxy acrylate represented by the following general formula (1), [Chemical 1] (在此’ X表不氫原子或甲基、Z表示C1至C6的院 基,可爲全部相同或不相同,η表示2至3之整數,a表 示0至4之整數)。 2.如申請專利範圍第1項之環氧丙烯酸酯,其中含 有以一般式(1)表示之環氧丙烯酸酯,及含有以下述式 (2)表示之環氧丙燃酸醋作爲副成分, 【化2】(In this case, X represents no hydrogen atom or methyl group, Z represents a group of C1 to C6, and may be all the same or different, η represents an integer of 2 to 3, and a represents an integer of 0 to 4). 2. The epoxy acrylate according to the first aspect of the invention, which comprises an epoxy acrylate represented by the general formula (1), and an epoxy glycerin represented by the following formula (2) as a subcomponent. [Chemical 2] -24- (3) 201245141-24- (3) 201245141 (在此,Z表示Cl至C6的烷基,可爲全部相同或不 相同,A爲以式(3)表示之含有酯鍵之基,B爲以式(3 )或(4)表示之含有酯鍵之基,X表示氫原子或甲基’ a 表示〇至4之整數,b表示1至2之整數)。 3. —種丙烯酸系硬化性組成物,其特徵爲:含有申 請專利範圍第1項所記載之環氧丙烯酸酯及聚合引發劑。 4. 一種丙烯酸系硬化性組成物,其特徵爲:含有申 請專利範圍第2項所記載之環氧丙烯酸酯及聚合引發劑。 5 · —種丙烯酸樹脂硬化物,其特徵爲:使申請專利 範圍第3項或第4項所記載之丙烯酸系硬化性組成物成型 硬化所成者。 6·—種申請專利範圍第1項所記載之環氧丙烯酸酯 之製方法,其特徵爲:使以下述一般式表示之環 氧環己院化合物與丙嫌酸或甲基丙烯酸進行反應, 【化3】(here, Z represents an alkyl group of Cl to C6, which may be all the same or different, A is a group containing an ester bond represented by the formula (3), and B is a compound represented by the formula (3) or (4). The base of the ester bond, X represents a hydrogen atom or a methyl group 'a represents an integer of 〇 to 4, and b represents an integer of 1 to 2). An acrylic-based curable composition comprising the epoxy acrylate and the polymerization initiator described in claim 1 of the patent application. An acrylic curable composition comprising the epoxy acrylate and the polymerization initiator described in claim 2 of the patent application. An acrylic resin cured product obtained by molding and curing an acrylic curable composition described in the third or fourth aspect of the patent application. A method for producing an epoxy acrylate according to the first aspect of the invention, characterized in that the epoxy ring compound represented by the following general formula is reacted with a propylene or methacrylic acid, 3 -25- 201245141 (在此,Z表示Cl至C6的烷基,可爲全部相同或不 相同’a表示〇至4之數,„表示2至3之數)。 7 · —種申請專利範圍第2項所記載之環氧丙烯酸醋 之製造方法,其特徵爲:使以下述—般式(5)表示之環 氧環己院化合物與丙烯酸或甲基丙烯酸進行反應, 【化4】-25- 201245141 (here, Z represents an alkyl group of Cl to C6, which may be all the same or different 'a' means 〇 to 4, „ represents 2 to 3). 7 · — Patent application scope The method for producing an epoxy acrylate vine according to the item 2, characterized in that the epoxy ring compound represented by the following general formula (5) is reacted with acrylic acid or methacrylic acid; (在此,Ζ表示C1至C6的烷基,可爲全部相同或不 相同,a表示〇至4之數,η表示2至3之數)。 8.如申請專利範圍第3項或第4項之丙烯酸系硬化 性組成物,其中丙烯酸系硬化性組成物爲光學材料用胃。 9_ 一種丙烯酸樹脂硬化物,其特徵爲:申請專利範 圍第5項所記載之丙烯酸樹脂硬化物爲光學材料用者。 -26-(Here, Ζ represents an alkyl group of C1 to C6, which may be all the same or different, a represents a number of 〇 to 4, and η represents a number of 2 to 3). 8. The acrylic curable composition according to Item 3 or 4 of the patent application, wherein the acrylic curable composition is a stomach for an optical material. 9_ An acrylic resin cured product which is characterized in that the cured acrylic resin described in the fifth aspect of the patent application is an optical material. -26-
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US3251861A (en) * 1966-05-17 Di- and triepoxtoe derivatives of trivinylcyclohexane
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