201245132 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種積層陶瓷零件製造用溶劑組成物 ’其能夠使乙基纖維素等之黏著劑樹脂的黏著劑性能得 以充分地發揮，在積層陶瓷零件製造過程中難以發生片 浸触現象’且蒸發乾燥為容易，與被塗布片具優越之緊 貼性。 【先前技術】 於積層陶瓷零件中，有電容器、電感器、變阻器、 熱阻器、揚聲器、引動器、天線、固態氧化物燃料電池 (SOFC)等’藉由使陶瓷層或導體層之薄層相重疊而作成 零件》電容器、電感器、變阻器、熱阻器、揚聲器、引 動器、天線係以積層陶瓷層與導體層者為主，固態氧化 物燃料電池（SOFC)係以積層複數之陶瓷層者為主。 積層方法也能夠藉由在煅燒過的層上，重複地塗布 、般燒新的層後作成，一般而言，若考量生產性、成本 時’於锻燒前之狀態下，進行多層積層並同時進行般燒 〇 利用同時進行烺燒之方法的積層方法係採用藉由重 複進行已摻入各層組成物之液體的塗布、乾燥而作成積 層片，進一步藉由零件來相重疊、壓黏所得之片而進行 高積層化之方法。 作為積層陶瓷零件之製造方法的一例係顯示積層電 容器之製造方法。一般而言，經由如下之步驟所製造： 1:利用聚乙烯丁醛等之聚乙烯縮醛樹脂或丙稀酸樹 201245132 脂等之黏著劑樹脂與溶劑而使陶兗粉末分散後作成糊， 形成片狀後獲得軟質片。 2 :利用網板印刷法等，將以鎳、鈀等之導電性金屬 材料、乙基纖維素及薛品醇等之有機溶劑作為主要成分 之導體糊塗布於軟質片上而形成配線/塗膜。 3:使上述導體糊中之有機溶劑乾燥。 4:將已形成配線/塗膜之積層片切斷成既定尺寸， 積層複數片而加熱壓黏後作成積層體。 5 :將電極等裝設於該積層體上，若在高溫下使其煅 燒時’可獲得積層電容器。 於上述步驟中，若將導體糊塗布於軟質片上時，將 有引起導體糊中之有機溶劑溶解軟質片内所含之黏著劑 樹脂的現象之情形。此現象被稱為片浸蝕現象。片浸蝕 現象係成為使孔洞或皺紋發生於積層陶瓷電容器之陶竞 層中，因配線/塗膜形成之不良或短路等所導致的良率降 低之原因。 如此之問題係利用同樣之積層方法的積層陶瓷零件 中所發生。習知係由於各層膜之厚度厚，雖然影響並不 那麼大，但近年來隨著積層陶瓷零件之高性能化、小型 化，正尋求構成裝置之導電層、陶瓷層的薄層化。其結 果’使片浸姓現象變得顯著地被破認。 因此，作為片浸蝕現象之改善方法，有人探討各種 使用於塗布糊的有機溶劑之改善。例如，於專利文獻i 、2中，已揭示將萜品醇氫化物或是萜品醇氫化物之乙酸 酯作為有機溶劑使用。然而，於萜品醇氫化物中存在2 201245132 種異構物，而且成為原料之萜 A „ « α ^ „ 鮮席本為天然物，由於 為CX-L醇、βΐ品醇及Μ品^ % 於混合比或純度令具右#叙 ° 因產地而 現象…: 因此’發揮安定的片浸鞋 制效果為困難之觀點為問題。 又，於專利文獻，已揭示己酸 基己醋等之溶劑。然而，由於己酸乙醋、乙…基己乙 ㈣在乾燥步射之隨溫度上升而增加對被塗 片、C著劑樹脂的溶解度，將有無法有效防正 片叹蝕現象之問題。 駿樹脂Ϊ =獻4中’已揭示作為有機溶劑係對聚乙烯丁 Α乙烯縮醛樹脂或丙烯酸樹脂等之黏著劑樹 二田及對乙基纖維素為不溶性；以具有接近製造步驟上 度帶上限㈣點之三乙酸甘㈣ m素為可溶性；藉由使用以特定比例添加低 ，‘之機，合劑的溶劑組成物而改善耐片浸蝕性。然而 ::含有該溶劑組成物之塗布糊後’進行常壓加熱乾 月形下’已確認藉長時間之加熱而造成以聚乙烯 為黏著劑樹脂之被塗布片軟化、變形的問題。 右以特定比例而與三乙酸甘油酯一併混合其他特a 之〜劑後使用肖’能夠對乙基纖維素顯示可溶性，使2 :纖維素之黏著劑性能得以充分地發揮，同時也能 a乙烯縮醛樹脂顯示不溶性。亦#，發現藉由均衡對於 ^基纖維素與聚乙烯縮醛樹脂二者之優異的溶解性，並 藉由縮知'蒸發乾燥所要之時間而能夠防止被塗布片之^ 變形，且也能夠防止片浸蝕現象《然而，此= 201245132 甘由a /、八他特定溶劑之混合溶劑係對被塗布片之緊貼 性並不足。 又另方面於專利文獻5中，已揭示藉由將低分子 量低極丨生之聚乙烯縮醛樹脂[商品名「S_LEK BL_S」、 積水化子工業（股）製；聚合度360、丁縮醛化度74莫耳％ :羥f量22莫耳％]摻合於導體糊中提高與含有高分子 量间極性之聚乙烯縮醛樹脂[商品名r s_leK ΒΜ·2」 積水化學工業（股）製：聚合度850、丁縮醛化度68莫耳 %、經基量3 1莫耳％]之被塗布#的緊貼性，在實施例中 於導電糊中使用正辛醇。然而，正辛醇之情形，將有 對軟質片所用之高分子量聚乙烯丁醛樹脂的溶解性，耐 片浸蝕性則不足。因溶解低分子量、低極性之聚乙烯縮 醛樹脂，且不溶解具有同樣極性之高分子量、高極性之 聚乙烯縮醛樹脂之溶劑所導致的溶解性之控制為困難。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開平07_240340號公報 [專利文獻2]日本專利第2976268號公報 [專利文獻3]曰本特開2〇〇5·!丨65〇4號公報 [專利文獻4]日本特開2〇〇9_1472〇2號公報 [專利文獻5]日本特開2009-200009號公報 【發明内容】 [發明欲解決之課題] 因而，本發明之目的係在於提供一種積層陶竟零件 製造用溶劑組成物，其能夠使乙基纖維素等之黏著劑樹 201245132 脂的黏著劑性能得以充分發揮，與被塗布片具優越之緊 貼性，且在積層陶瓷零件製造過程所習用之藉由萜品醇 、二氫萜品醇、乙酸二氫蓋烯酯等而難以發生加熱乾燥 時之片浸蝕現象。 [解決課題之手段] 本發明人等為了解決上述課題而鑽研之結果，發現 含有特疋溶劑之溶劑組成物係對低極性之聚乙浠縮酿樹 脂具優越之溶解性’不溶解高極性之聚乙烯縮醛樹脂， 且藉由萜品醇、二氫萜品醇、乙酸二氫蓋烯酯等，從塗 布步驟直到乾燥步驟後之耐片浸蝕性高、乾燥後之表面 狀態佳。本發明係基於此等之見解而使其完成。 亦即，本發明係提供一種積層陶瓷零件製造用溶劑 組成物，其特徵為含有：溶劑A，標準沸點為2〇6t以下 ，丁縮醛化度69莫耳％以上77莫耳％以下、羥基量15莫耳 %以上28莫耳。/。以下之低極性聚乙烯丁醛樹脂的溶解度 在25°C下為5g/l〇〇g以上，且乙氧基含量45 〇至53 〇莫耳 %之乙基纖維素的溶解度在25它下為5g/1〇〇g以上；與溶 劑B，標準沸點較該溶劑a之標準沸點高，且丁縮醛化度 6 1莫耳。/。以上6 8莫耳％以下、羥基量2 9莫耳％以上3 7莫耳 %以下之高極性聚乙烯丁醛樹脂的溶解度在乃它下低於 5g/1 00g 〇 溶劑A、溶劑b較佳為顯示下列之標準沸點的溶劑； 溶劑A :具7(rc至2〇6〇c之標準沸點的化合物； 溶劑B :具75。〇至26(rc之標準沸點的化合物。 溶劑A、溶劑b更佳為由下列之溶劑所選出的至少一 201245132 種； 溶劑A:由1，2,5,6-四氫苄醇、3 -曱氧基丁醇、乙二 醇甲基醚乙酸酯、乙二醇丁基醚乙酸酯、丙二醇一甲基 醚乙酸酯、及乙酸-3 -曱氧基丁酯之中所選出的至少一種 9 溶劑B :由三乙酸甘油酯、1,3 - 丁二醇、丙二醇曱基 正丙基醚、丙.二醇甲基正丁基醚、二丙二醇曱基正丙基 醚、二丙二醇曱基正丁基醚、二乙酸-1，3 -丁二醇酯、二 乙酸-1,4 -丁二醇酯、二乙酸-1,6 -己二醇酯、二丙二醇曱 基醚乙酸酯、二乙二醇一乙基醚乙酸酯、二乙二醇一丁 基醚乙酸酯、及乙酸乳酸乙酯之中所選出的至少一種。 溶劑A進一步較佳為1，2,5,6 -四氫苄醇。 又，溶劑B進一步較佳為由下列之溶劑所選出的至少 一種； 溶劑B :由三乙酸甘油酯、1,3 - 丁二醇、丙二醇甲基 正丙基醚、丙二醇甲基正丁基醚、二丙二醇甲基正丙基 醚、二丙二醇曱基正丁基醚、二乙酸-1，3 -丁二醇酯、二 乙酸-1,4-丁二醇酯、二乙酸-1,6 -己二醇酯、及乙酸乳酸 乙酯之中所選出的至少一種。 本發明之積層陶瓷零件製造用溶劑組成物亦可更含 有下列之溶劑C ; 溶劑C :由甲醇、環己醇、環戊醇、環辛醇、曱基環 己醇、乙基環己醇、丙基環己醇、異丙基環己醇、丁基 環己醇、異丁基環己醇、二級丁基環己醇、三級丁基環 己醇、戊基環己醇、四氫呋喃曱醇、四氫呋喃、乙酸曱 201245132 酯、乙醚、乙酸環己醇酯、乙酸環戊酯、乙 乙酸曱基環己酯、乙酸乙基環己酯、乙酸丙 乙酸異丙基環己酯、乙酸丁基環己酯、乙酸 酯、乙酸二級丁基環己酯、乙酸三級丁基環 戊基環己酯、乙酸四氫呋喃甲醇酯、二氣甲 丁基卡必醇、二乙二醇一丙基醚、二乙二醇 二乙二醇一戊基醚、二丙二醇一乙基醚、二 基醚、二丙二醇一丁基醚、二丙二醇一戊基 醇一丁基醚、三乙二醇一曱基醚、三乙二醇 三乙二醇一丙基醚、三乙二醇一丁基醚、三 基醚、三丙二醇一曱基醚、三丙二醇一乙基 醇一丙基醚、三丙二醇一丁基醚、三丙二醇 二乙酸乙二醇酯、丙酮、異佛酮、正己烷、 醇、乙酸蓋醇酯、丙酸二氫蓋烯酯、檸檬烯、 荷腦之中所選出的至少一種以上。 溶劑c更佳為由下列之溶劑所選出的至d 溶劑c :由曱醇、環己醇、四氫呋喃曱醇 、乙酸曱酯、乙醚、乙酸環己醇酯、乙酸四 酯、二氣甲烷、氯仿、丁基卡必醇、三丙二 、二乙二醇一丙基醚、二乙二醇一 丁基喊、 乙基喊、二丙二醇一丙基酸、二丙二醇一丁 二醇一戊基醚、二乙酸乙二醇酯、三丙二醇 丙酮、異佛酮、正己烷、萜品醇、蓋醇、乙 丙酸二氫蓋烯酯、檸檬烯、蓋烷、及薄荷腦 的至少一種以上。 酸環辛酯、 基環己酯、 異丁基環己 己酯、乙酸 烧、氣仿、 一丁基鰱、 丙二醇一丙 鍵、三丙二 一乙基喊、 乙二醇一戊 鍵、三丙二 一戍基醚、 萜品醇、蓋 蓋炫、及薄 '、一種； ;四氫呋喃 氫呋喃甲醇 醇一曱基醚 二丙二醇一 基醚、二丙 一丁基醚、 酸蓋醇醋、 之中所選出 -10- 201245132 [發明之效果] 藉由使用本發明之積層陶瓷零件製造用溶劑組成物 而混合鎳、銀等之導電性金屬材料或乙基纖維素或低分 子之聚乙烯丁醛等之黏著劑樹脂所得之塗布糊能夠發揮 安定之片浸#現象及防止效果’蒸發乾燥為容易，而且 能夠使得對被塗布片之緊貼性成為良好。藉此，能夠防 止微細圖案之剝離，故能夠對應於配線/塗膜圖案之微細 化、高密度配線化。 【實施方式】 [實施發明之形態] [積層陶瓷零件製造用溶劑組成物] 本發明之積層陶瓷零件製造用溶劑組成物，其特徵 為含有：溶劑A，標準沸點為2〇6t以下，丁縮醛化度〇 莫耳％以上77莫耳％以下、羥基量15莫耳％以上28莫耳％ 以下之低極性聚乙烯丁醛樹脂的溶解度在25它下為 5g/H)〇g以上，且乙氧基含量45〇至53〇莫耳％之乙基纖 維素的解度在25C下為5g/l〇〇g以上；與溶劑B，標準 彿點較該溶劑A之標準沸點高，且丁縮路化度61莫耳％以 上68莫耳％以下、羥基量29莫耳％以上”莫耳❶乂以下之高 極性聚乙稀丁醛樹脂的溶解度在25t下低於5g/i〇〇g。還 有’於本專利說明書中，所謂標準彿點係指在latm之彿 點。以下，有將標準沸點簡稱為沸點之情形。 於本發明之積層陶究零件製造用溶劑組成物中，以 含有聚乙稀縮酿樹脂之具高溶解性的溶劑A與聚乙稀縮 醛樹脂之具低溶解性的溶劑B為特徵，藉由該積層陶曼零 -11- 201245132 件製造用溶劑組成物而混合鎳、銀等之導電性金屬材料 或乙基纖維素等而能形成塗布糊。還有，聚乙稀丁㈣ 脂之丁縮醛化度及羥基量係可依照日本特開平5_ιι〇9號 公報記載之方法，藉由1H核磁共振光譜測定而測得。乙 氧基含量係可依照曰本特開平u_335 137 !fe公報記載之 方法，藉由氫碘酸而分解醚，並藉由利用硫代硫酸鈉進 行滴定而測得。 由於本發明之積層陶瓷零件製造用溶劑組成物係具 ，對低極性m㈣樹脂之高溶解性與㈣基纖維素 樹脂之高溶解性，若作為導體糊之有機溶劑使用時，溶 解作為使其賦予被塗布片緊貼性之黏著劑樹脂的低極性 聚乙烯縮醛樹脂，且溶解乙基纖維素等之黏著劑樹脂。 又由於具有對尚極性聚乙稀縮搭樹脂之低溶解性，能 夠抑制、防止由高極性聚乙烯縮醛樹脂構成之被塗布片 中發生孔洞或皺紋（片浸蝕現象）。還有，於本發明專利 說月書中’所謂低極性聚乙稀縮媒樹脂係指丁縮酿化度 為69莫耳％以上77莫耳％以了、羥基量為。莫耳％以上28 莫耳/〇以下之聚乙烯縮醛樹脂；所謂高極性聚乙烯縮醛 树月日係彳日丁縮路化度為6 1莫耳％以上6 8莫耳％以下、經基 量為29莫耳％以上37莫耳％以下之聚乙烯丁醛樹脂。 <溶劑A > 作為溶劑A係使用沸點較萜品醇（標準沸點：2〇9°c至 218 c )、二氫萜品醇（標準沸點：2〇7。(：至21〇。(：）、乙酸二 氣蓋烯醋（標準沸點：220°C至225eC )為低、對低極性聚乙 稀縮搭樹脂之溶解性及對乙基纖維素之溶解度為高者。 -12- 201245132 具體而言，使用1 atm時之標準沸點為206°C以下（常壓下 沸點為2 0 6 °C以下，·例如，7 0 °C至2 0 6 eC )，丁縮盤化度6 8 莫耳％以上77莫耳％以下、羥基量1 5莫耳％以上28莫耳％ 以下之低極性聚乙烯丁醛樹脂的溶解度在25 °C下為 5g/100g以上（例如，5至l〇〇g/l〇〇g)，且乙氧基含量45 〇 至53.0莫耳％之乙基纖維素的溶解度在25°c下為5g/l〇〇g 以上（例如，5至lOOg/loOg)之溶劑作為溶劑a。 洛劑A之低極性聚乙稀丁搭樹脂的溶解度（2 5 °c )為上 述丁縮醛化度68莫耳％以上77莫耳％以下、羥基量〗5莫耳 %以上28莫耳％以下之範圍内的聚乙烯丁醛樹脂中任一 種，相對於100g之溶劑A而言，若溶解5§以上即可。同樣 地’作為乙基纖維素的溶解度（25 〇c)為上述乙氧基含量 45.0至53.0莫耳％之範圍内的乙基纖維素中任一種相對 於l〇〇g之溶劑A而言，若溶解5g以上即可。上述低極性聚 乙烯丁醛樹脂的溶解度（25〇c )較佳為8g/1 〇〇g以上。 上述低極性聚乙烯丁醛樹脂的丁縮醛化度為6 8莫耳 %以上77莫耳％以下，較佳為7〇莫耳％以上75莫耳％以下 。又’羥基量為15莫耳％以上28莫耳％以下，較佳為“ 莫耳％以上27莫耳％以下。作為上述低極性聚乙烯丁醛樹 脂較佳能使用市售的「s_lekbl_Sj [積水化學（股）製； 丁縮駿化度74莫耳％、經基量22莫耳％]等。溶劑a係針對 使濃度成為5重量％的方式來添加「s_lekbl_s」樹脂， 在液溫价下加熱溶解5小時後，靜置冷卻3至10小時日左 右之2rC的溶劑組成物’於目視觀察中，較佳為未 到不溶物且樹脂已完全溶解。 “ -13- 201245132 作為上述乙基纖維素的乙氧基含量，較佳為45 〇至 53·0莫耳％，&佳為48.0至49.5莫耳％。作為上述乙基纖 =素，佳能使用市售的r Eth〇cel STD」（D〇w epical 公司製；乙氧基含量48·〇至49_5莫耳％)等。溶劑A係針對 使濃度成為5重量％的方式來添加r Eth〇cel STD」樹脂， 在液溫651下加熱溶解5小時後，靜置冷卻3至1〇小時左 右之251的溶劑組成物，於目視觀察中，較佳為未觀察 到不溶物且樹脂已完全溶解。 還有，由於溶劑A係在塗布步驟中未乾燥而在乾燥步 驟中乾燥為容易之適度乾燥性，沸點較佳為7〇β(：以上 2〇6°C以下者。 作為溶劑A，可列舉例如：N，N-二甲基乙醯胺、ν，ν· 二曱基甲醯胺、Ν-甲基-2-吡咯啶酮等之醯胺類； 四氫苄醇、CM之烷醇（也包含直鏈、分枝）、二丙酮醇、 苄醇；二嘮烷；乙酸乙酯、乙酸異丙酯、乙酸正丁酯； 氣化丙烯、氣化乙烯；二丙二醇二甲基醚；二乙酸丙二 醇酯；曱基溶纖素、乙基溶纖素、丁基溶纖素、丙二醇 —甲基醚、丙二醇一乙基醚、丙二醇一丙基醚、丙二醇 一丁基醚、二乙二醇一甲基醚、二乙二醇一乙基醚、二 丙二醇一甲基醚、3-甲氧基丁醇等之二元醇一醚類；乙 一醇甲基醚乙酸酯、丙二醇一曱基醚乙酸酯、乙二醇一 丁基醚乙酸酯等之二元醇一醚一酯類；乙酸_3_甲氧基丁 醋等之二醇一醚一 S旨類；曱基乙基_、曱基異丁基酮、 環己鲷；甲苯、二甲苯、。比咬等之芳香族類；及二甲基 亞碾等。此等之溶劑可單獨使用，或是混合2種以上使^ -14- 201245132 於本發明中，較佳為使用由此等之中所選出的至少1 種。 作為洛劑A，其中較佳為使用1，2,5,6-四氫苄醇、3- 甲氧基丁醇、乙二醇甲基醚乙酸酯、乙二醇丁基醚乙酸 酉θ、丙一醇一曱基醚乙酸酯、與乙酸-3-甲氧基丁酯，特 佳為使用1，2,5,6 -四氫苄醇。 積層陶瓷零件製造用溶劑組成物中之溶劑Α的含量 ，例如此夠設為2至98重量。/。，較佳設為5至8〇重量％，更 佳設為5至50重量％。若溶劑a之含量在如此之範圍内時 ，能夠發揮更安定地抑制及防止片浸蝕現象之效果，蒸 發乾燥更為容易，而且能夠使得對被塗布片之緊貼性更 為良好。還有，溶劑A之含量在併用2種以上之情形下， 為此等之合計量。 <溶劑B > 將較溶劑A之沸點高且相對於高極性聚乙烯縮醛樹 脂之溶解性低者作為溶劑B使用。具體而言，使用標準沸 點較該溶劑A之標準沸點高，且丁縮醛化度6丨莫耳％以上 68莫耳％以下、羥基量29莫耳。/。以上37莫耳。/。以下之高極 性聚乙烯丁醛樹脂的溶解度在25°C下低於5g/100g(例如 ’ 0g/1 00g以上低於5 g/1 〇 〇 g)之有機溶劑作為溶劑b使用 。溶劑B之高極性聚乙烯丁醛樹脂的溶解度（25。(：）係在上 述丁縮搭化度6 1莫耳％以上6 8莫耳％以下、經基量2 9莫耳 %以上37莫耳％以下之高極性範圍内之聚乙浠丁酿樹脂 中任一種，相對於l〇〇g之溶劑B而言，若不溶解5g以上的 話即可。 -15· 201245132 上述问極性聚乙烯丁醛樹脂的丁縮醛化度為61莫耳 /〇以土 68莫耳％以下，較佳為63莫耳％以上65莫耳％以下 。又，羥基量為29莫耳％以上37莫耳％以不，較佳為3〇 莫耳/〇以上3 6莫耳。/〇以下。作為上述高極性聚乙稀丁醛樹 脂較佳能使用市售的rs_LEKBH_3」[積水化學（股）製； 丁縮醛化度65莫耳。/。、羥基量34莫耳％]等。具體而言， 溶劑B係針對例如將rs_LEK bh_3」樹脂5g添加於溶劑 100g中，在液溫65〇c下加熱溶解5小時或溶解之後，靜置 冷卻3至10小時左右之25〇c的溶劑組成物，於目視觀察中 ’若不溶物被確認、存在樹脂之溶解殘留物的話即可。 上述南極性聚乙烯丁醛樹脂之溶解度（25。〇較佳為 3g/100g以下（例如，〇至 3g/1〇〇g)。 還有，由於作為溶劑B係依照通常陶瓷零件製造之乾 燥條件所能夠使用之溶劑沸點的上限為26(rc左右，沸點 較佳為2 6 0 °C以下（例如，7 5 °C至2 6 0 °C )。 於本發明中’在乾燥步驟中，軟質片浸蝕性低的溶 劑B較溶劑a之順序為後，由於較佳必須在最後進行蒸發 ，故溶劑B必須沸點為由較所組合使用之溶劑A高者選出 。相對於所組合使用之溶劑A的沸點而言，溶劑b的沸點 較佳為高1 eC以上’進一步較佳為高5。〇以上。 作為溶劑B ’可列舉例如：三乙酸甘油酯等之三酯類 ，四氯化碳；乙二醇、二乙二醇、1，3· 丁二醇等之二元 醇類；1，3-丙二醇、1，4-丁二醇、丨，^戊二醇、丨，6_己二 醇等之二元醇類；丙二醇曱基正丙基醚、丙二醇曱基正 丁基謎、二丙二醇甲基正丙基越、二丙二醇曱基正丁基 -16- 201245132 乙酯、、 二醇酯酯 、必酸酸 醋卡乙乙 醇基醚醚 二 丁基基 丁 酸乙曱 4，乙一 一 -1，；醇醇 酸類二二 乙酯乙乙 二二二二 匕曰 一c t曰 旨 s N S 酉 醇二酸酸 二之乙乙 丁等醚醚 3SI基基 -1醇甲丁 酸二醇一 乙己二醇 二,6-丙二 •’-1二乙 醚酸、二 、、 等酸 酯酯酯乳 酸酸酸之 乙乙乙等 醚醚醚醋 基基基乙 戊丙戊酸 1 一一乳 醇醇醇酸 二二二乙 乙丙丙； 二二二烷 ' ' ' τΟ 酯酯酯環 酸酸酸； 乙乙乙類 醚醚醚酯 基基基 一 丙乙丁醚 1111 醇醇醇醇 二二二元 乙丙丙二 二二二之 醋類；及乙酸二氫蓋烯酯等。此等之溶劑可單獨使用， 或是混合2種以上而使用。於本發明中，較佳為從此等之 中所選出的至少1種。 作為溶劑B，其中較佳為能使用三乙酸甘油酯、1，3-丁二醇、丙二醇曱基正丙基醚、丙二醇甲基正丁基醚、 二丙二醇甲基正丙基醚、二丙二醇甲基正丁基醚、二乙 酸-1，3-丁二醇酯、二乙酸-1，4-丁二醇酯、二乙酸-1,6-己 二醇酯、二丙二醇甲基醚乙酸酯、二乙二醇一乙基醚乙 酸酯、二乙二醇一 丁基醚乙酸酯、乙酸乳酸乙酯、及此 等之混合物。 作為溶劑B，更佳為三乙酸甘油酯、1，3 - 丁二醇、丙 二醇甲基正丙基醚、丙二醇甲基正丁基醚、二丙二醇甲 基正丙基醚、二丙二醇曱基正丁基醚、二乙酸-1，3-丁二 醇酯、二乙酸-1，4-丁二醇酯、二乙酸-1,6-己二醇酯、乙 酸乳酸乙酯、及此等之混合物。 積層陶瓷零件製造用溶劑組成物中之溶劑B的含量 ，例如能夠設為2至98重量％，較佳設為5至95重量％，更 -17- 201245132 佳設為1〇至90重量％β若溶劑B之含量為如此之範圍内時 ’將有提高鎳、銀等之導電性金属材料分散性之傾向 還有’溶劑B之含量在併用2種以上之情形下 之合計量。 π此寻 本發明之積層陶瓷零件製造用溶劑組成物較佳為 有標準沸點丨20至丨95。(：之溶劑A、與標準沸點丨96至26〇。〇 之溶劑B，進-步較佳為含有標準沸點18〇至19代 A與標準彿點i 96至26(TC之溶劑B。較佳的溶劑a與溶劑b 之組合’可舉例：相對於作為溶劑人之^^•四氫 標準沸點188。〇而言’作為溶劑B之二丙二醇丙基甲基醚 (標準彿點203。〇、三乙酸甘油醋（標準彿點26〇。〇、^ 丁二醇（標準沸點208。(：）、二丙二醇丁基甲基峻（標準彿點 216 C)、一乙酸- ΐ，3·丁二醇酯（標準沸點232。〇、二乙酸 己，(標準彿點26〇。〇、〕丙二醇甲基喊：酸醋 (枯，沸點21 3 C )、一乙二醇一乙基醚乙酸酯(標準沸點 217 C)、二乙二醇一 丁基醚乙酸酯（標準沸點247。〇、二 乙酸-M-丁二醇酯（標準沸點22(rc)及此等之混合物。 <溶劑C > 又，於本發明中，藉由將提高或降低黏度之苴他有 機溶劑（以下’有稱為「溶劑C」之情形）混合於低極性聚 乙稀縮越樹脂t具高溶解性的溶劑讀高極㈣乙稀縮 搭樹脂之具低溶解性的溶劑B中’可更良好地作為塗布糊 之有機溶劑使用。 E作為溶劑C，可列舉例如：甲醇、環己醇、環戊醇、 環辛醇、甲基環己醇、乙基環己醇、丙基環己醇、異丙 -18- 201245132 基環己醇、丁基環己醇、異丁基環己醇、二級丁基環己 醇、三級丁基環己醇、戊基環己醇、四氫呋喃曱醇；四 氫呋喃；乙酸曱酯、乙醚、乙酸環己醇酯、乙酸環戊酯 、乙酸環辛酯、乙酸曱基環己酯、乙酸乙基環己酯、乙 酸丙基環己酯、乙酸異丙基環己酯、乙酸丁基環己酯、 乙酸異丁基環己酯、乙酸二級丁基環己酯、乙酸三級丁 基環己酯、乙酸戊基環己酯、乙酸四氫呋喃曱醇酯、二 乙酸-1，5 -戊二醇酯；二氣曱烷、氯仿；丁基卡必醇、二 乙二醇一丙基醚、二乙二醇一 丁基醚、二乙二醇一戊基 醚、二丙二醇一乙基醚、二丙二醇一丙基謎、二丙二醇 一丁基醚、二丙二醇一戊基醚、三丙二醇一丁基醚、三 乙二醇一曱基醚、三乙二醇一乙基醚、三乙二醇一丙基 醚、三乙二醇一丁基醚、三乙二醇一戊基醚、三丙二醇 一曱基謎、三丙二醇一乙基醚、三丙二醇一丙基醚、三 丙二醇一丁基醚、三丙二醇一戊基醚；二乙酸乙二醇酯 ;丙酮、異佛酮；正己烷；萜品醇、蓋醇、乙酸蓋醇酯 、丙酸二氫蓋烯酯、檸檬烯、蓋烷、及薄荷腦等。此等 之溶劑可單獨使用，或是混合2種以上而使用。 作為溶劑C，較佳能使用曱醇、環己醇、四氫呋喃曱 醇、四氫呋喃、乙酸曱酯、乙醚、乙酸環己醇酯、乙酸 四氫呋喃曱醇酯、二氣曱烷、氣仿、丁基卡必醇、三丙 二醇一曱基醚、二乙二醇一丙基醚、二乙二醇一 丁基醚 、二丙二醇一乙基鍵、二丙二醇一丙基謎、二丙二醇一 丁基醚、二丙二醇一戊基醚、二乙酸乙二醇酯、三丙二 醇一 丁基醚、丙酮、異佛酮、正己烷、萜品醇、蓋醇、 -19- 201245132 乙酸蓋醇酯、丙酸二氫蓋烯酯、檸檬烯、蓋烷、及薄荷腦 及此等之混合物》 作為溶劑c，更佳能使用甲醇、四氫呋喃甲醇；四氫 呋喃；乙酸甲酯、乙醚、乙酸環己醇酯、乙酸四氫呋喃 曱醇酯；二氣曱烷、氣仿；丁基卡必醇、三丙二醇一曱 基醚、二丙二醇一丙基醚、二丙二醇一丁基醚、三丙二 醇一丁基醚；丙酮、異佛酮；正己烷；萜品醇、蓋醇、 乙酸蓋醇酯；及此等之混合物。 [實施例] 以下’根據實施例而更詳細說明本發明，但本發明 並不受此等實施例所任何限定。 實施例1至7、比較例1至6 以下表1中記載之比例而混合^、^四氫苄醇[商 品名「THBA」Daicel化學工業（股）製] '三乙酸甘油酯[ 商品名「DRA-150」Daicel化學工業（股）製]與二丙二醇 丙基曱基醚[Daicel化學工業（股）製]而調製實施例i至7 之積層陶瓷零件製造用溶劑組成物。又，以下表2中記載 之比例而混合溶劑’調製比較例1至6之溶劑組成物。 將該溶劑組成物分為3份’使各自的樹脂濃度成為5 重量％的方式來將聚乙烯丁醛樹脂[商品名「S_Lek BL-S 」、積水化學（股）製，丁縮醛化度74莫耳％、羥基量22 莫耳。/〇]添加於第1溶劑組成物中；將聚乙烯丁醛樹脂[商 品名「S-LEK BH-3」、積水化學（股）製，丁縮醛化度65 莫耳％、經基量34莫耳％]添加於第2溶劑組成物中；將乙 基纖維素（商品名「Ethocel STD」、Dow Chemical公旬 -20- 201245132 製乙氧基含羞4 8.0至4 9 · 5莫耳％)添加於第3溶劑組成物 中，在液溫6 5 °C下加熱溶解5小時後靜置冷卻。 樹脂溶解性之評估 對於在實施例及比較例所得之溶劑組成物，在液溫 下進行5小時加熱溶解操作後，在室溫（25t：)下靜置 冷卻1〇小時左右之時點，藉由目視觀察而以下列之基準 評估各樹脂對於各溶劑組成物是否顯示溶解性，同時也 以下列之基準而综合性評估各溶劑組成物之溶劑性能。 <樹脂溶解性之評估基準> ◎ •樹脂全部溶解。 〇：樹脂幾乎溶解。 △•樹脂一部分溶解。 x :樹脂為不溶。 乾燥後之表面狀態之評估 於至溫下，將在實施例及比較例所得之溶 塗布成厚度〇,—之軟質片後，於100t下進行乾烤1 顯微鏡觀察表面’確認有無破裂、皺紋。以下列之基準 而练合性評估各溶劑組成物之乾燥後的表面狀態。 軟質片之〉谷劑乾燥後的表面狀態之評估基準> 〇：軟質片中無破裂、皺紋。 △.軟質片中一部分有破裂、皺紋。 X:軟質片中有破裂、皺紋。 谷劑組成物之溶劑性能之評估基準>201245132 VI. [Technical Field] The present invention relates to a solvent composition for manufacturing a laminated ceramic part, which is capable of sufficiently exerting an adhesive property of an adhesive resin such as ethyl cellulose in a laminate In the manufacturing process of ceramic parts, it is difficult to cause the phenomenon of sheet immersion and it is easy to evaporate and dry, and it is superior to the coated sheet. [Prior Art] Among laminated ceramic parts, there are capacitors, inductors, varistors, thermal resistors, speakers, actuators, antennas, solid oxide fuel cells (SOFC), etc. 'by making a thin layer of a ceramic layer or a conductor layer Capacitors, inductors, varistors, thermistors, speakers, actuators, and antennas are mainly composed of laminated ceramic layers and conductor layers, and solid oxide fuel cells (SOFC) are laminated with a plurality of ceramic layers. Mainly. The layering method can also be carried out by repeatedly coating and baking a new layer on the calcined layer. Generally, in consideration of productivity and cost, in the state before calcination, multilayer lamination is carried out simultaneously. The laminating method of performing the method of performing the calcination at the same time as the calcination method is to form a laminate by repeatedly applying and drying a liquid which has been incorporated into each layer composition, and further superimposing and pressure-bonding the parts by the parts. And the method of high-layering. An example of a method for producing a laminated ceramic component is a method of producing a laminated capacitor. In general, it is produced by the following steps: 1: using a polyvinyl acetal resin such as polyvinyl butyral or an adhesive resin such as acrylic acid 201245132 or the like, and dispersing the ceramic powder to form a paste, thereby forming a paste. After the sheet is obtained, a soft sheet is obtained. 2: A conductor paste containing a conductive metal material such as nickel or palladium, or an organic solvent such as ethyl cellulose or sinyl alcohol as a main component is applied onto a soft sheet by a screen printing method or the like to form a wiring/coating film. 3: Drying the organic solvent in the above conductor paste. 4: The laminated sheet in which the wiring/coating film has been formed is cut into a predetermined size, and a plurality of sheets are laminated and heated and pressure-bonded to form a laminated body. 5: An electrode or the like is mounted on the laminate, and when it is calcined at a high temperature, a build-up capacitor can be obtained. In the above step, when the conductor paste is applied to the soft sheet, there is a case where the organic solvent in the conductor paste dissolves the adhesive resin contained in the soft sheet. This phenomenon is called a sheet etch phenomenon. The chip etching phenomenon is caused by the occurrence of voids or wrinkles in the ceramic layer of the multilayer ceramic capacitor, which is caused by poor wiring or coating film formation or short circuit. Such a problem occurs in a laminated ceramic part that utilizes the same lamination method. Conventionally, the thickness of each layer of the film is not so large, but in recent years, as the high-performance and miniaturization of the laminated ceramic parts, thin layers of the conductive layer and the ceramic layer constituting the device are being sought. The result 'has made the film dip phenomenon significantly disillusioned. Therefore, as an improvement method of the sheet etching phenomenon, improvements in various organic solvents used for coating paste have been examined. For example, in Patent Documents i and 2, it has been disclosed that a terpineol hydride or a terpineol hydride acetate is used as an organic solvent. However, there are 2 201245132 isomers in the terpineol hydride, and it is a raw material. « „ « α ^ „ Fresh mat is a natural product, because it is CX-L alcohol, β-terpineol and antimony ^ In the case of the mixing ratio or the purity of the right side, the phenomenon is caused by the origin of the product. Further, in the patent literature, a solvent such as hexanoic acid hexahydrate has been disclosed. However, since ethyl hexanoic acid and ethyl bromide (IV) increase the solubility to the coated and C-coated resin as the temperature rises in the drying step, there is a problem that the positive film cannot be effectively prevented. Ϊ Ϊ Ϊ 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 献 已 已 已 已 已 已 已 已 已 已 已 已 已 已 已 已 已 已 已 作为 已 作为 作为 作为 作为 作为The upper limit (four) point of the triacetate (tetra) m is soluble; the tablet etching resistance is improved by using a solvent composition which is low in a specific ratio and is mixed. However, the coating paste containing the solvent composition was subjected to "normal pressure heating under a dry shape". It was confirmed that the coated sheet having polyethylene as the adhesive resin was softened and deformed by heating for a long period of time. The right side is mixed with triacetin in a specific ratio, and the other agent is used to display the solubility of ethyl cellulose, so that the adhesive properties of 2: cellulose can be fully exerted, and at the same time, The ethylene acetal resin showed insolubility. Also, it was found that by balancing the excellent solubility for both the base cellulose and the polyvinyl acetal resin, it is possible to prevent the deformation of the coated sheet by recognizing the time required for evaporative drying, and also Preventing the phenomenon of sheet etch. "However, this = 201245132 is not sufficient for the adhesion of the coated solvent to the coated sheet by a /, eight specific solvents. Further, in Patent Document 5, a polyvinyl acetal resin (trade name "S_LEK BL_S", manufactured by Sekisui Chemicals Co., Ltd.) having a low molecular weight and a low polarity is produced, and a polymerization degree of 360, butyral is disclosed. Degree of chemical conversion: 74% by mole: Hydroxy f amount: 22% by mole] Polyvinyl acetal resin which is blended in a conductor paste and has a high molecular weight (trade name r s_leK ΒΜ·2) Sekisui Chemical Industry Co., Ltd. The degree of polymerization 850, the degree of butyralization of 68 mol%, the basis weight of 3 1 mol%, and the adhesion of coated #, in the examples, n-octanol was used in the conductive paste. However, in the case of n-octanol, there is a solubility in the high molecular weight polyvinyl butyral resin used for the soft sheet, and the sheet etch resistance is insufficient. It is difficult to control the solubility due to the dissolution of the low molecular weight, low polarity polyvinyl acetal resin and the dissolution of the solvent of the high molecular weight, high polarity polyvinyl acetal resin having the same polarity. [PATENT DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. H07-240340 [Patent Document 2] Japanese Patent No. 2976268 [Patent Document 3] 曰本特开2〇〇5·!丨65〇4 [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 2009-200009 [Patent Document 5] [Problems to be Solved by the Invention] Therefore, the object of the present invention is Provided is a solvent composition for manufacturing a laminated ceramic component, which can fully exert adhesive performance of an adhesive resin such as ethyl cellulose 201245132, and has excellent adhesion to a coated sheet, and is laminated ceramic parts. It is difficult to occur in the manufacturing process by the use of terpineol, dihydroterpineol, dihydrofurfuryl acetate or the like in the case of heat drying. [Means for Solving the Problems] As a result of intensive studies to solve the above problems, the present inventors have found that a solvent composition containing a special solvent has superior solubility to a low-polarity polyethylene condensate resin, which does not dissolve high polarity. The polyvinyl acetal resin is excellent in sheet etch resistance from the coating step to the drying step by terpineol, dihydroterpineol, dihydrofurenyl acetate or the like, and is excellent in surface state after drying. The present invention has been completed based on these findings. That is, the present invention provides a solvent composition for producing a laminated ceramic part, which comprises a solvent A, a standard boiling point of 2〇6t or less, a degree of butyralization of 69% by mole or more and 77% by mole or less, and a hydroxyl group. The amount is 15 moles above 28 moles. /. The solubility of the following low-polarity polyvinyl butyral resin is 5 g/l g or more at 25 ° C, and the solubility of ethyl cellulose having an ethoxy group content of 45 53 to 53 〇 mol % is under 25 5g / 1〇〇g or more; and solvent B, the standard boiling point is higher than the standard boiling point of the solvent a, and the degree of butyralization is 6 1 mole. /. The solubility of the above-mentioned 6 8 mol% or less, the hydroxyl group amount of 2 9 mol% or more and 3 7 mol% or less of the highly polar polyvinyl butyral resin is less than 5 g / 100 g, and the solvent A and the solvent b are preferred. To show the following standard boiling point solvents; Solvent A: a compound having a standard boiling point of 7 (rc to 2〇6〇c; Solvent B: a compound having a normal boiling point of 75. 〇 to 26 (rc) Solvent A, solvent b More preferably at least one 201245132 selected from the following solvents; Solvent A: from 1,2,5,6-tetrahydrobenzyl alcohol, 3-methoxybutanol, ethylene glycol methyl ether acetate, At least one selected from the group consisting of ethylene glycol butyl ether acetate, propylene glycol monomethyl ether acetate, and 3-methoxypropenyl acetate. Solvent B: from triacetin, 1, 3 - Butanediol, propylene glycol decyl n-propyl ether, propane diol methyl n-butyl ether, dipropylene glycol decyl n-propyl ether, dipropylene glycol decyl n-butyl ether, diacetic acid-1,3 - butyl Alcohol ester, di-acetic acid-1,4-butanediol ester, diacetic acid-1,6-hexanediol ester, dipropylene glycol decyl ether acetate, diethylene glycol monoethyl ether acetate, diethyl Glycol monobutyl ether At least one selected from the group consisting of esters and ethyl acetate. The solvent A is further preferably 1,2,5,6-tetrahydrobenzyl alcohol. Further, the solvent B is further preferably at least selected from the following solvents. Solvent B: from triacetin, 1,3-butanediol, propylene glycol methyl n-propyl ether, propylene glycol methyl n-butyl ether, dipropylene glycol methyl n-propyl ether, dipropylene glycol decyl n-butyl At least selected from the group consisting of ethers, diacetic acid-1,3-butanediol ester, diacetic acid-1,4-butanediol ester, diacetic acid-1,6-hexanediol ester, and ethyl lactate acetate The solvent composition for producing a multilayer ceramic part of the present invention may further contain the following solvent C; Solvent C: from methanol, cyclohexanol, cyclopentanol, cyclooctanol, nonylcyclohexanol, ethylcyclohexane Alcohol, propyl cyclohexanol, isopropyl cyclohexanol, butyl cyclohexanol, isobutyl cyclohexanol, secondary butyl cyclohexanol, tertiary butyl cyclohexanol, pentyl cyclohexanol, Tetrahydrofuranol, tetrahydrofuran, hydrazine acetate 201245132 ester, diethyl ether, cyclohexyl acetate, cyclopentyl acetate, decyl cyclohexyl acetate, ethyl acetate Hexyl ester, isopropylcyclohexyl acetate, butylcyclohexyl acetate, acetate, dibutylcyclohexyl acetate, tert-butylcyclopentylcyclohexyl acetate, methanolic tetrahydrofuran acetate, Dimethyl butyl carbitol, diethylene glycol monopropyl ether, diethylene glycol diethylene glycol monopentyl ether, dipropylene glycol monoethyl ether, dialkyl ether, dipropylene glycol monobutyl ether, two Propylene glycol monopentyl alcohol monobutyl ether, triethylene glycol monodecyl ether, triethylene glycol triethylene glycol monopropyl ether, triethylene glycol monobutyl ether, trimethyl ether, tripropylene glycol monodecyl Ether, tripropylene glycol monoethyl alcohol monopropyl ether, tripropylene glycol monobutyl ether, tripropylene glycol diacetate ethylene glycol, acetone, isophorone, n-hexane, alcohol, caprolactone acetate, dihydrogen acetate propionate At least one selected from the group consisting of an enester, a limonene, and a lotus brain. The solvent c is more preferably selected from the following solvents to the d solvent c: from decyl alcohol, cyclohexanol, tetrahydrofuranol, decyl acetate, diethyl ether, cyclohexanol acetate, tetraacetate, di-methane, chloroform , butyl carbitol, tripropylene di, diethylene glycol monopropyl ether, diethylene glycol monobutyl shrine, ethyl shunt, dipropylene glycol monopropyl acid, dipropylene glycol monobutylene glycol monopentyl ether At least one or more of ethylene glycol diacetate, tripropylene glycol acetone, isophorone, n-hexane, terpineol, capitol, dihydrocapranil acetate, limonene, caprolane, and menthol. Acid cyclooctyl ester, cyclohexyl ester, isobutyl cyclohexyl ester, acetic acid burning, gas imitation, monobutyl hydrazine, propylene glycol monopropyl bond, tripropylene ethyl acrylate, ethylene glycol pentyl bond, three Propyl dimercapto ether, terpineol, geiger, and thin ', one; tetrahydrofuran hydrogen furan methanol-mercapto ether dipropylene glycol monoether, dipropyl monobutyl ether, acid cap alcohol vinegar, -10-201245132 [Effect of the Invention] A conductive metal material such as nickel or silver or ethyl cellulose or a low molecular weight polyvinyl butyral is mixed by using the solvent composition for producing a ceramic part of the present invention. The coating paste obtained by the adhesive resin can exert the stability of the tablet immersion # phenomenon and the prevention effect. Evaporation drying is easy, and the adhesion to the coated sheet can be made good. Thereby, the peeling of the fine pattern can be prevented, so that the wiring/coating pattern can be made finer and higher-density wiring can be achieved. [Embodiment] [Form of the invention] [Solvent composition for the production of a laminated ceramic part] The solvent composition for producing a laminated ceramic part according to the present invention is characterized by containing a solvent A, a standard boiling point of 2〇6t or less, and a shrinkage. The degree of hydroformylation is more than 77% by mole of the molar amount, and the solubility of the low-polarity polyvinyl butyral resin having a hydroxyl group content of 15% by mole or more and 28% by mole or less is 5 g/H) 〇g or more at 25 Å, and The degree of solution of ethyl cellulose having an ethoxy group content of 45 〇 to 53 〇 mol% is 5 g/l 〇〇g or more at 25 C; and with solvent B, the standard sputum point is higher than the standard boiling point of the solvent A, and The degree of shrinkage is 61% by mole or more and 68% by mole or less, and the amount of hydroxyl groups is 29% by mole or more. The solubility of the highly polar polyacetal butyral resin of the following moles is less than 5g/i〇〇 at 25t. In the patent specification, the standard Buddha point refers to the point of the Buddha in the lamat. Hereinafter, the standard boiling point is simply referred to as the boiling point. In the solvent composition for the manufacture of the laminated ceramic parts of the present invention, Highly soluble solvent A and polyacetal acetal containing polyethylene shrink resin It is characterized in that the solvent B having a low solubility in the fat is characterized by being mixed with a conductive metal material such as nickel or silver or ethyl cellulose by the solvent composition for the production of the ceramics of No. -11-201245132. Further, the degree of acetalization and the amount of hydroxyl groups of the poly(butylene) ester can be measured by 1H nuclear magnetic resonance spectroscopy according to the method described in JP-A-H05_ιι〇9. The ether can be decomposed by hydriodic acid and titrated by sodium thiosulfate according to the method described in Japanese Patent Laid-Open Publication No. Hei. The high-solubility of the low-polarity m (tetra) resin and the high solubility of the (tetra)-based cellulose resin, and when used as an organic solvent of the conductor paste, dissolve as an adhesive resin which imparts adhesion to the coated sheet. A low-polarity polyvinyl acetal resin, which dissolves an adhesive resin such as ethyl cellulose, and has a low solubility to a polar polyethylene shrinkage resin, thereby suppressing and preventing a high-polar polyethylene acetal tree Holes or wrinkles (slipping phenomenon) occur in the coated sheet to be formed. Also, in the patent of the present invention, the so-called low-polarity polyethylene shrinkage resin means that the degree of brewing is 69 mol% or more. 77% of the moles, the amount of hydroxyl groups is more than 80% of the moles of urethane resin below the acetal resin; the so-called high-polarity polyethylene acetal tree is the day of the day is less than 6 1 a polyvinyl butyral resin having a base content of not less than 6 8 mol% and a base amount of 29 mol% or more and 37 mol% or less. <Solvent A > As a solvent A, a boiling point is higher than terpineol (normal boiling point) : 2〇9°c to 218 c ), dihydroterpineol (standard boiling point: 2〇7. (: to 21〇. (:), acetic acid di-glycolic acid vinegar (standard boiling point: 220 ° C to 225 eC) It is low in solubility to low-polarity polyethylene shrinkage resin and high in solubility to ethyl cellulose. -12- 201245132 Specifically, the standard boiling point at 1 atm is 206 ° C or less (boiling point at atmospheric pressure is below 2 0 6 ° C, for example, 70 ° C to 2 0 6 eC), shrink disk The degree of solubility of 6 8 mol % or more and 77 mol % or less, the hydroxyl group amount of 15 mol % or more and 28 mol % or less The solubility of the low polarity polyvinyl butyral resin is 5 g / 100 g or more at 25 ° C (for example, 5 to l〇〇g/l〇〇g), and the solubility of ethyl cellulose having an ethoxy group content of 45 〇 to 53.0 mol% is 5 g/l 〇〇g or more at 25 ° C (for example, 5 to The solvent of lOOg/loOg) is used as solvent a. The solubility (25 ° C) of the low-polarity polyethylene butadiene resin of the agent A is 68 mol% or more of 77 mol% or less, and the hydroxyl group amount is 5 mol% or more and 28 mol%. Any one of the polyvinyl butyral resins in the following range may be dissolved in 5 § or more with respect to 100 g of the solvent A. Similarly, the solubility (25 〇c) of ethyl cellulose is any one of ethyl cellulose in the range of 45.0 to 53.0 mol% of the above ethoxy group content, relative to solvent A of 1 g. If it is dissolved in 5g or more. The solubility (25 〇 c ) of the above low-polarity polyvinyl butyral resin is preferably 8 g / 1 〇〇 g or more. The degree of butyralization of the low-polarity polyvinyl butyral resin is from 6 8 mol% to 77 mol%, preferably from 7 mol% to 75 mol%. Further, the amount of the hydroxyl group is 15% by mole or more and 28% by mole or less, preferably "% by mole or more and 27% by mole or less. As the low-polarity polyvinyl butyral resin, it is preferable to use commercially available "s_lekbl_Sj" (stock) system; butyl shrinkage degree: 74% by mole, basis weight: 22% by mole, etc. Solvent a is added to "s_lekbl_s" resin so as to have a concentration of 5% by weight, and is heated at a liquid temperature. After dissolving for 5 hours, the solvent composition of 2 rC which was left to cool for 3 to 10 hours was allowed to stand for visual observation. It was preferred that the insoluble matter was not obtained and the resin was completely dissolved. "-13- 201245132" as the ethoxy group content of the above ethyl cellulose, preferably 45 〇 to 53.0 mol%, & preferably 48.0 to 49.5 mol%. As the above-mentioned ethyl cellulose, the Canon A commercially available r Eth〇cel STD" (manufactured by D〇w epical Co., Ltd.; ethoxy group content: 48 〇 to 49 _5 mol%) was used. Solvent A is a solvent composition in which r Eth〇cel STD" resin is added so as to have a concentration of 5% by weight, and is heated and dissolved at a liquid temperature of 651 for 5 hours, and then left to stand for cooling for 3 to 1 hour. In the visual observation, it is preferred that no insoluble matter is observed and the resin is completely dissolved. Further, since the solvent A is not dried in the coating step and is dried in the drying step to have an appropriate degree of drying, the boiling point is preferably 7 〇β (: 2 〇 6 ° C or more.) For example: amides such as N,N-dimethylacetamide, ν, ν·dimercaptocaramine, Ν-methyl-2-pyrrolidone; tetrahydrobenzyl alcohol, CM alkanol ( Also contains linear, branched), diacetone alcohol, benzyl alcohol; dioxane; ethyl acetate, isopropyl acetate, n-butyl acetate; gasified propylene, vaporized ethylene; dipropylene glycol dimethyl ether; Propylene glycol acetate; fluorenyl fibrin, ethyl cellosolve, butyl cellosolve, propylene glycol-methyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, diethylene glycol monomethyl a glycol-ether such as an ether, diethylene glycol monoethyl ether, dipropylene glycol monomethyl ether or 3-methoxybutanol; ethyl alcohol methyl ether acetate, propylene glycol monodecyl ether a glycol-ether monoester of an acid ester, ethylene glycol monobutyl ether acetate, or the like; a glycol-ether-sodium acetate such as acetic acid_3_methoxybutyl vinegar; Base, thiol isobutyl ketone, cyclohexanone; toluene, xylene, aromatics such as biting; and dimethyl argon. etc. These solvents may be used alone or in combination of two or more. In the present invention, it is preferred to use at least one selected from among the above. As the agent A, it is preferred to use 1,2,5,6-tetrahydrobenzyl alcohol, 3-methoxybutanol, ethylene glycol methyl ether acetate, ethylene glycol butyl ether acetate 酉 θ, propanol monodecyl ether acetate, and-3-methoxybutyl acetate, It is particularly preferable to use 1,2,5,6-tetrahydrobenzyl alcohol. The content of the solvent oxime in the solvent composition for producing a ceramic part is, for example, 2 to 98 parts by weight. It is more preferably 5% by weight, more preferably 5 to 50% by weight. When the content of the solvent a is within such a range, the effect of suppressing and preventing the etch of the sheet can be more stably suppressed, and evaporating and drying is easier, and Further, the adhesion to the coated sheet is further improved. Further, when the content of the solvent A is used in combination of two or more kinds, the total amount of the solvent A is determined. The solvent A has a high boiling point and is low in solubility with respect to the high-polarity polyvinyl acetal resin, and is used as the solvent B. Specifically, the standard boiling point is higher than the standard boiling point of the solvent A, and the degree of butyralization is 6 丨. More than 68% of the ear is less than 68% by mole, and the amount of hydroxyl is 29 moles. / 37 moles above. The solubility of the following highly polar polyvinyl butyral resin is less than 5g / 100g at 25 ° C (eg '0g / An organic solvent of 1 00 g or more and less than 5 g/1 〇〇g) is used as the solvent b. The solubility of the highly polar polyvinyl butyral resin of the solvent B (25. (:) is in the above-mentioned degree of condensed degree 6 1 Mo Any one of the polybutylene styrene resins in the high polarity range of more than 6 8 mol% of the ear and more than 2 mol% or more and 37 mol% or less of the base, relative to the solvent B of l〇〇g Say, if you do not dissolve more than 5g. -15· 201245132 The above-mentioned polar polyvinyl butyral resin has a degree of butyralization of 61 mol/min to 68 mol% or less, preferably 63 mol% or more and 65 mol% or less. Further, the amount of the hydroxyl group is from 29 mol% to 37 mol%, preferably 3 莫 mol/〇 or more. /〇The following. As the above-mentioned high-polarity polyacetonitrile resin, it is preferable to use commercially available rs_LEKBH_3" [made by Sekisui Chemical Co., Ltd.; degree of butyralization of 65 moles. /. , the amount of hydroxyl groups is 34% by mole] and the like. Specifically, the solvent B is obtained by, for example, adding 5 g of rs_LEK bh_3 resin to 100 g of a solvent, and heating and dissolving at a liquid temperature of 65 〇c for 5 hours or after dissolving, and then cooling the solvent for 25 〇c for 3 to 10 hours. The composition can be visually observed as 'if the insoluble matter is confirmed, and the resin residue remains. The solubility of the above-mentioned southern polar polyvinyl butyral resin (25 is preferably 3 g/100 g or less (for example, 〇 to 3 g/1 〇〇 g). Further, since it is a solvent B, it is dried under normal ceramic parts. The upper limit of the boiling point of the solvent that can be used is about 26 (about rc, and the boiling point is preferably 260 ° C or lower (for example, 75 ° C to 260 ° C). In the present invention, 'in the drying step, soft After the solvent B having a low etch resistance is in the order of the solvent a, since it is preferred to carry out the evaporation at the end, the solvent B must have a boiling point selected from the solvent A which is used in combination, and the solvent A used in combination. The boiling point of the solvent b is preferably 1 eC or more, and more preferably 5 or more. The solvent B' may, for example, be a triester such as triacetin or carbon tetrachloride; Glycols such as ethylene glycol, diethylene glycol, 1,3-butanediol, etc.; 1,3-propanediol, 1,4-butanediol, hydrazine, pentanediol, hydrazine, 6-hexane Alcohols such as alcohols; propylene glycol decyl n-propyl ether, propylene glycol decyl n-butyl mystery, dipropylene glycol methyl n-propyl , dipropylene glycol decyl n-butyl-16- 201245132 ethyl ester, diol ester ester, succinic acid vinegar card ethyl alcohol ether ether dibutyl butyl succinate 4, ethyl 1-1, alcohol Acid Diethylene Ethyl Ethyl Ethyl Ethyl Ethyl Ethyl Ethyl Ethyl Ethyl Ethyl Ethyl Ester Diethyl Ethyl Ethyl Ethyl Ether Ether Ether 3Syl-1 Ethyl Methyl Butyrate Diethyl Ethylene Glycol Dioxide -C 2 · '-1 diethyl ether acid, di-, ester ester ester, lactate acid, ethyl ether, ether ether, ethyl valproate, 1 - lactitol aldol 2 22 Ethylene, ethylene, propylene, propylene, dihydrogen, dioxane The vinegar of 222; and the dihydrocapranyl acetate, etc. These solvents may be used singly or in combination of two or more. In the present invention, at least one selected from among these is preferred. As the solvent B, among them, triacetin, 1,3-butanediol, propylene glycol decyl n-propyl ether, propylene glycol methyl n-butyl ether, dipropylene glycol can be preferably used. Methyl n-propyl ether, dipropylene glycol methyl n-butyl ether, diacetic acid-1,3-butylene glycol ester, diacetic acid-1,4-butanediol ester, diacetic acid-1,6-hexanediol Ester, dipropylene glycol methyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, ethyl lactate acetate, and mixtures thereof. More preferred are triacetin, 1,3-butanediol, propylene glycol methyl n-propyl ether, propylene glycol methyl n-butyl ether, dipropylene glycol methyl n-propyl ether, dipropylene glycol decyl n-butyl ether, Diacetic acid-1,3-butylene glycol ester, diacetic acid-1,4-butanediol ester, diacetic acid-1,6-hexanediol ester, ethyl lactate acetate, and mixtures thereof. The content of the solvent B in the solvent composition for producing a laminated ceramic part can be, for example, 2 to 98% by weight, preferably 5 to 95% by weight, more preferably -17 to 201245132, and preferably 1 to 90% by weight. When the content of the solvent B is within such a range, there is a tendency to increase the dispersibility of the conductive metal material such as nickel or silver, and the total amount of the solvent B may be used in combination of two or more kinds. The solvent composition for the production of the laminated ceramic parts of the present invention preferably has a standard boiling point of 丨20 to 丨95. (: Solvent A, with a standard boiling point of 至96 to 26 〇. 溶剂 Solvent B, the step-by-step preferably contains a standard boiling point of 18 〇 to 19 代 A and a standard sputum i 96 to 26 (TC solvent B. A preferred combination of solvent a and solvent b can be exemplified by a standard boiling point of 188 as a solvent for humans, and a dipropylene glycol propyl methyl ether as a solvent B (standard point 203. Triacetin glycerin (standard phlegm 26 〇. 〇, ^ butane diol (standard boiling point 208. (:), dipropylene glycol butyl methyl jun (standard Buddha point 216 C), monoacetic acid - hydrazine, 3 · butanediol Ester (standard boiling point 232. 〇, diacetic acid, (standard point 26 〇. 〇,) propylene glycol methyl shout: acid vinegar (dry, boiling point 21 3 C), monoethylene glycol monoethyl ether acetate ( Standard boiling point 217 C), diethylene glycol monobutyl ether acetate (standard boiling point 247. hydrazine, diacetic acid-M-butylene glycol ester (standard boiling point 22 (rc) and mixtures of these. < solvent C > Further, in the present invention, the organic solvent (hereinafter referred to as "solvent C") is mixed with low-polarity polyethylene by increasing or decreasing the viscosity. Resin t has a high solubility solvent read high (4) Ethylene shrink resin, and has a low solubility in solvent B. 'It can be used more preferably as an organic solvent for coating paste. E As solvent C, for example, methanol, Cyclohexanol, cyclopentanol, cyclooctanol, methylcyclohexanol, ethylcyclohexanol, propylcyclohexanol, isopropyl-18- 201245132 Cyclohexanol, butylcyclohexanol, isobutyl Cyclohexanol, secondary butyl cyclohexanol, tert-butylcyclohexanol, pentylcyclohexanol, tetrahydrofuranol; tetrahydrofuran; decyl acetate, diethyl ether, cyclohexanol acetate, cyclopentyl acetate, acetic acid Cyclooctyl ester, nonylcyclohexyl acetate, ethylcyclohexyl acetate, propylcyclohexyl acetate, isopropylcyclohexyl acetate, butylcyclohexyl acetate, isobutylcyclohexyl acetate, acetic acid Butyl butyl cyclohexyl ester, tertiary butyl cyclohexyl acetate, amyl cyclohexyl acetate, tetrahydrofuranyl acetate, diacetate-1,5-pentanediol; dioxane, chloroform; butyl Carbitol, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monopentyl ether, dipropylene glycol monoethyl ether , dipropylene glycol-propyl mystery, dipropylene glycol monobutyl ether, dipropylene glycol monopentyl ether, tripropylene glycol monobutyl ether, triethylene glycol monodecyl ether, triethylene glycol monoethyl ether, triethylene glycol Alcohol monopropyl ether, triethylene glycol monobutyl ether, triethylene glycol monopentyl ether, tripropylene glycol monoterpene, tripropylene glycol monoethyl ether, tripropylene glycol monopropyl ether, tripropylene glycol monobutyl Ether, tripropylene glycol monopentyl ether; ethylene glycol diacetate; acetone, isophorone; n-hexane; terpineol, capitol, caprolactate acetate, dihydrocapranal propionate, limonene, caprolane, And menthol, etc. These solvents may be used singly or in combination of two or more. As the solvent C, decyl alcohol, cyclohexanol, tetrahydrofuranol, tetrahydrofuran, decyl acetate, diethyl ether, acetate ring can be preferably used. Hexyl alcohol ester, tetrahydrofuranyl acetate, dioxane, gas, butyl carbitol, tripropylene glycol monodecyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, two Propylene glycol monoethyl bond, dipropylene glycol monopropyl mystery, dipropylene glycol monobutyl ether, dipropylene glycol Amyl ether, ethylene glycol diacetate, tripropylene glycol monobutyl ether, acetone, isophorone, n-hexane, terpineol, capitol, -19- 201245132 captopyl acetate, dihydrocapranilate propionate , limonene, caprolane, and menthol and mixtures thereof, as solvent c, more preferably methanol, tetrahydrofuran methanol; tetrahydrofuran; methyl acetate, diethyl ether, cyclohexanol acetate, tetrahydrofuranyl acetate; Alkane, gas imitation; butyl carbitol, tripropylene glycol monodecyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether; acetone, isophorone; n-hexane; Alcohol, capitol, caprolactate acetate; and mixtures thereof. [Examples] Hereinafter, the present invention will be described in more detail based on the examples, but the present invention is not limited by the examples. Examples 1 to 7 and Comparative Examples 1 to 6 The ratios described in Table 1 below were mixed with tetrahydrobenzyl alcohol [trade name "THBA" manufactured by Daicel Chemical Industry Co., Ltd.] 'triacetin [product name" DRA-150 "Daicel Chemical Industry Co., Ltd." and dipropylene glycol propyl decyl ether [Daicel Chemical Industry Co., Ltd.] were used to prepare solvent compositions for the production of laminated ceramic parts of Examples i to 7. Further, the solvent compositions of Comparative Examples 1 to 6 were prepared by mixing the solvents in the ratios shown in Table 2 below. The solvent composition was divided into three parts, and the polyvinyl butyral resin (trade name "S_Lek BL-S", Sekisui Chemical Co., Ltd., and the degree of butyralization were prepared so that the respective resin concentrations were 5% by weight. 74% Mo, hydroxyl amount 22 Mohr. /〇] added to the first solvent composition; polyvinyl butyral resin [trade name "S-LEK BH-3", Sekisui Chemical Co., Ltd., butyralization degree 65 mol%, base amount 34 mol%] added to the second solvent composition; ethyl cellulose (trade name "Ethocel STD", Dow Chemical -20-201245132 ethoxylated shame 4 8.0 to 4 9 · 5 mol% It was added to the third solvent composition, and it was heated and dissolved at a liquid temperature of 65 ° C for 5 hours, and then allowed to stand for cooling. The evaluation of the solubility of the resin was carried out by cooling and dissolving the solvent composition obtained in the examples and the comparative examples at room temperature for 5 hours, and then standing at room temperature (25 t:) for about 1 hour. The solubility of each of the resins for each solvent composition was evaluated by visual observation on the basis of the following criteria, and the solvent properties of the respective solvent compositions were also comprehensively evaluated on the basis of the following criteria. <Evaluation criteria of resin solubility> ◎ • All the resins were dissolved. 〇: The resin is almost dissolved. △• Part of the resin is dissolved. x : The resin is insoluble. Evaluation of the surface state after drying The coatings obtained in the examples and the comparative examples were applied to a thickness of 〇, a soft sheet, and then dried at 100 Torr. The surface was observed under a microscope to confirm the presence or absence of cracks and wrinkles. The surface state after drying of each solvent composition was evaluated by the following criteria. Evaluation criteria for the surface state after drying of the soft film> 〇: There is no crack or wrinkle in the soft film. △. Some of the soft tablets have cracks and wrinkles. X: There are cracks and wrinkles in the soft sheet. Basis for evaluation of solvent properties of cereal compositions>
解性（A或X 〇：「S-LEK BH-3」中 ’且皆完全溶解Solvability (A or X: "S-LEK BH-3" is completely dissolved
，在室溫（25°C)下顯示不溶 「Ethocel STD」、「S_LEK -21- 201245132 BL-S」（◎)溶劑組成物（難以引起片浸蝕現象，且能夠使 乙基纖維素、聚乙烯丁醛之黏著性得以發揮），且塗布乾 燥後，於軟質片中不引起破裂、皺紋的溶劑組成物。 X :上述以外之溶劑組成物。 [表1] 積層電容器製造用溶劑組成物(重量％) 黏著劑樹脂 軟質片 乾燥後之 表面狀態 溶劑性能 溶劑A 溶齊 B S-LEK BL-S Ethocel STD S-LEK BH-3 THBA DRA-150 DPMNP 實施例1 10 0 90 ◎ ◎ X 〇 〇 實施例2 20 0 80 ◎ ◎ X 〇 〇 實施例3 10 5 85 ◎ ◎ X 〇 〇 實施例4 20 5 75 ◎ ◎ X 〇 〇 實施例5 10 20 70 ◎ ◎ X 〇 〇 實施例6 20 20 60 ◎ ◎ X 〇 〇 實施例7 80 20 0 ◎ ◎ X 〇 〇 [表2]At room temperature (25 ° C), it shows insoluble "Ethocel STD", "S_LEK -21- 201245132 BL-S" (◎) solvent composition (it is difficult to cause sheet etching, and can make ethyl cellulose, polyethylene A solvent composition in which the adhesiveness of butyraldehyde is exerted) and which does not cause cracking or wrinkles in the soft sheet after coating and drying. X : a solvent composition other than the above. [Table 1] Solvent composition for manufacturing a multilayer capacitor (% by weight) Surface condition of the adhesive resin soft sheet after drying. Solvent properties Solvent A Soaked B S-LEK BL-S Ethocel STD S-LEK BH-3 THBA DRA-150 DPMNP Example 1 10 0 90 ◎ ◎ X 〇〇 Example 2 20 0 80 ◎ ◎ X 〇〇 Example 3 10 5 85 ◎ ◎ X 〇〇 Example 4 20 5 75 ◎ ◎ X 〇〇 Example 5 10 20 70 ◎ ◎ X 〇〇 Example 6 20 20 60 ◎ ◎ X 〇〇 Example 7 80 20 0 ◎ ◎ X 〇〇 [Table 2]
積層電容器ί 良造用溶劑組成物(重量％) 黏著劑樹脂 軟質片 乾燥後之 表面狀態 溶劑性能 THBA n- OctOH DRA- 150 DPMNP DHTA α- ΤΡΟ S-LEK BL-S Ethocel STD S-LEK BH-3 比較例1 100 ◎ ◎ 〇 X X 比較例2 100 ◎ ◎ 〇 X X 比較例3 20 80 Δ ◎ X 〇 X 比較例4 100 X ◎ X 〇 X 比較例5 100 ◎ ◎ X Δ X 比較例6 100 ◎ ◎ ◎ X X 表中之簡稱係如下所示： • THBA : 1，2,5,6-四氫苄醇[Daicel化學工業（股）製、標 準沸點1 8 8 °C ] • n-OctOH :正辛醇[東京化成工業（股）製、試藥、標準 沸點195°C ] • DRA-150 :三乙酸甘油酯[Daicel化學工業（股）製、標 準沸點260°C、在25°C下之「S-LEK BH-3」的溶解度 lg/100g以下] -22- 201245132 • DPMNP： 二丙二醇丙基甲基醚[Daicel化學工業（股）製 、試藥、標準沸點2〇rc、在25»c下之「S_LEK BH_3」 的溶解度低於5g/100g] •DHTA:乙酸二氫蓋稀|盲[ 標準沸點225°C、在25°C下 低於 5g/100g] 曰本香料藥品（股）製、試藥、 之「S-LEK BH_3」的溶解度 • α-ΤΡΟ : α-萜品醇[東京化成 沸點21 8 °C ] 工業（股）製、試藥 標準 【圖式簡單說明】 無。 【主要元件符號說明】 無0 -23-Laminated capacitor ί Good solvent composition (% by weight) Adhesive resin soft sheet Surface condition after drying Solvent properties THBA n- OctOH DRA- 150 DPMNP DHTA α- ΤΡΟ S-LEK BL-S Ethocel STD S-LEK BH-3 Comparative Example 1 100 ◎ ◎ 〇 XX Comparative Example 2 100 ◎ ◎ 〇 XX Comparative Example 3 20 80 Δ ◎ X 〇 X Comparative Example 4 100 X ◎ X 〇 X Comparative Example 5 100 ◎ ◎ X Δ X Comparative Example 6 100 ◎ ◎ ◎ The abbreviations in the XX table are as follows: • THBA: 1,2,5,6-tetrahydrobenzyl alcohol [Daicel Chemical Industry Co., Ltd., standard boiling point 1 8 8 °C] • n-OctOH: n-octyl Alcohol [Tokyo Chemical Industry Co., Ltd., reagent, standard boiling point 195 ° C] • DRA-150: triacetin [Daicel Chemical Industry Co., Ltd., standard boiling point 260 ° C, at 25 ° C" Solubility of S-LEK BH-3" lg/100g or less] -22- 201245132 • DPMNP: Dipropylene glycol propyl methyl ether [Daicel Chemical Industry Co., Ltd., reagent, standard boiling point 2〇rc, at 25»c The solubility of "S_LEK BH_3" is lower than 5g/100g] • DHTA: dihydrogen acetate dilute | blind [standard boiling point 22 5 ° C, less than 5g / 100g at 25 ° C] 溶解 香料 香料 香料 香料 香料 香料 香料 香料 香料 香料 香料 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 21 8 °C ] Industrial (stock) system, reagent standard [simple description of the schema] None. [Main component symbol description] No 0 -23-