TW201245063A - Cutting method for strengthened glass plate - Google Patents
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201245063 六、發明說明: 【發明所屬之技術領域】 本發明係有關於一種強化玻璃板之切斷方法。 【先前技術】 近年來’於行動電話或 PDA(Pers〇nal Digital Assistant, 個人數位助理)等行動裝置中,為提昇顯示器(包括觸控面 板)之保護或美觀等,而多使用保護玻璃(c〇ver glass)。 又,廣泛使用玻璃基板作為顯示器之基板。 另一方面,行動裝置之薄型化、輕量化不斷發展,且行 動裝置中使用之玻璃之薄板化不斷發展。若玻璃變薄則強 度降低,因此,為彌補玻璃之強度不足而開發出具有殘留 壓縮應力之表面層及背面層之強化玻璃。強化玻璃亦用作 Ά車用窗玻璃或建築用窗玻璃。 強化玻璃係利用例如風冷強化法或化學強化法等製成。 風冷強化法係藉由自表面及背面將軟化點附近之溫度之玻 璃淬冷,使玻璃之表面及背面與内部之間具備溫度差,而 形成殘留壓縮應力之表面層及背面層。另一方面,化學強 化法係藉由將玻璃之表面及背面進行離子交換、將玻璃中 所3之較小離子半徑之離子(例如u離子、他離子)置換成 較大離子半徑之離子(例如κ離子)而形成殘留壓縮應力之 表面層及背面層。於任__方法中,均於表面層與背面層之 間形成殘留拉伸應力之中間層’作為反作用。 於製造強化玻璃之情形時’與以i片為單位對產品尺寸 之玻璃進行強化處理相比’將對與產品尺寸相比為大型之 160223.doc 201245063 玻璃在進行強化處理後,進行切斷再進行多重倒角更為有 效。 因此’作為切斷強化玻璃板之方法,提出有藉由對強化 玻璃板之表面照射雷射光,使雷射光之照射區域於強化玻 璃板之表面上進行移動而切斷強化玻璃板之方法(例如參 照專利文獻1)。 先前技術文獻 專利文獻 專利文獻1 :日本專利特開2008-247732號公報 【發明内容】 發明所欲解決之問題 且說,上述專利文獻1係使用二氧化碳雷射作為雷射光 之光源’故而’雷射光之大部分於強化玻璃板之表面附近 作為熱被吸收。因此’於玻璃背面之雷射光之照射區域之 正下方產生大於殘留拉伸應力之拉伸應力。其結果,存在 切斷時形成之裂痕越過雷射光之照射區域,且在預期以外 之方向上急劇伸展之情況,從而存在切斷線之軌跡精度惡 化、即切斷線自所需之切斷預定線偏離、或無法進行切斷 導致玻璃粉碎之情況。該傾向係隨著殘留拉伸應力變大更 明顯。 本發明係鑒於上述課題而完成者,其目的在於提供一種 切斷線之執跡精度良好之強化玻璃板之切斷方法。 解決問題之技術手段 為解決上述目的,本發明之一態樣之強化玻璃板之切斷 160223.doc 201245063 方法係藉由對包括殘留壓縮應力之表面層及背面層、以及 形成於表面層與背面層之間且殘留拉伸應力之中間層的強 化玻璃板之表面照射雷射光’且使上述雷射光之照射區域 於該表面上移動而將該強化玻璃板切斷,其特徵在於: 上述強化玻璃板與上述雷射光係於上述雷射光垂直地入 射至上述強化玻璃板之上述表面之情形時,若將上述強化 玻璃板對上述雷射光之吸收係數設為a(cm-i),將上述強化 玻璃板之厚度設為t(cm),則滿足〇<axt$ 3.0之式,且 於上述雷射光傾斜地入射至上述強化玻璃板之上述表面 之情形時,若將上述雷射光於上述強化玻璃板之上述表面 上之折射角設為γ(。),則滿足〇<aXt/c〇syS 3.〇之式, 藉由以徐冷點以下之溫度對上述雷射光之照射區域中之 上述中間層進行加熱’而控制因上述中間層之殘留拉伸應 力而產生於上述強化玻璃板上之裂痕之伸展。 又’本發明之其他態樣之強化玻璃板之切斷方法係藉由 對具有殘留壓縮應力之表面層及背面層、以及形成於表面 層與背面層之間且殘留拉伸應力之令間層的強化玻璃板積 層N片(N為2以上之自然數)而成之積層體照射雷射光,且 使上述雷射光之照射區域於上述各強化玻璃板之表面上進 行移動’而切斷上述N片強化玻璃板,其特徵在於: 上述各強化玻璃板與上述雷射光係於上述雷射光垂直地 入射至上述各強化玻璃板之上述表面之情形時,若將上述 各強化玻璃板對上述雷射光之吸收係數設為ai(cnrI),將 上述各強化玻璃板之厚度設為ti(cm),則滿足 160223.doc 201245063 〇<¥㈤.〇_以上、N以下之任意之自然數)之式且 於上述雷射光傾斜地入射至上述各強化玻璃板之上述表 面之情形時’若將上述雷射光於上料強化玻璃板之上述 表面上的折射角設為γΚ。),則滿足〇<aiXti/c〇s^ 3叩為i 以上、N以下之任意之自然數)之式, 藉由以徐冷點以下之溫度對上述雷射光之照射區域中之 上述各中間層進行加熱,而控制因上述各中間層之殘留拉 伸應力而產生於上述各強化玻璃板上之裂痕之伸展。 發明之效果 根據本發明,可提供一種切斷線之軌跡精度良好之強化 玻璃板之切斷方法。 【實施方式】 以下’參照圖式對用以實施本發明之形態進行說明。 [第1實施形態] 圖1A及圖1B係本發明第1實施形態的強化玻璃板之切斷 方法之說明圖。圖⑺係圖1A之平面圖。如圖ία及圖1B所 示,藉由對強化玻璃板10之表面(一主面)12照射雷射光 20 ’且使雷射光20之照射區域22於強化玻璃板10之表面12 上移動,而對強化玻璃板10施加應力,將強化玻璃板1〇切 斷。 強化玻璃板10係利用例如風冷強化法或化學強化法等製 作。強化用之玻璃之種類係根據用途進行選擇。例如,於 汽車用窗玻璃或建築用窗玻璃、PDP(Plasma Display Pane卜電漿顯示器)用之玻璃基板、保護玻璃之情形時, 160223.doc 201245063 使用驗石灰玻璃作為強化用之玻璃。又,於LCD(Liquid Crystal Display,液晶顯示裝置)用之玻璃基板之情形時, 使用實質上不含鹼金屬元素之無鹼玻璃作為強化用之玻 璃。 風冷強化法係自表面及背面(兩主面)將軟化點附近之溫 度之玻璃淬冷’使玻璃之表面及背面(兩主面)與内部之間 具有溫度差,藉此,形成殘留壓縮應力之表面層及背面 層。風冷強化法適合強化較厚之玻璃。 化學強化法係藉由使玻璃之表面及背面(兩主面)進行離 子父換’將玻璃中所含之較小離子半徑之離子(例如以離 子、Na離子)置換成較大離子半徑之離子(例如κ離子)而形 成殘留壓縮應力之表面層及背面層。化學強化法適合強化 包含驗金屬元素之驗石灰玻璃。 该等風冷強化法、化學強化法係於表面層與背面層之間 形成殘留拉伸應力之中間層,作為形成殘留壓縮應力之表 面層及背面層之反作用。 圖2Α係表示照射雷射光前之化學強化玻璃板之殘留應力 之分佈例之示意圖。圖2Β係表示照射雷射光前之風冷強化 玻璃板之殘留應力之分佈例之示意圖。圖3係照射雷射光 别之強化玻璃板之一例之剖面圖。於圖3中,箭線之方向 係表示應力之作用方向,箭線之大小係表示應力之大小。 如圖3所示,強化玻璃板1〇係包括殘留壓縮應力之表面 層13及背面層15、以及設置於表面層13與背面層15之間且 殘留拉伸應力之中間層17。強化玻璃板10之端面之表層既 J60223.doc 201245063 可僅包括殘留壓縮應力之層’亦可包括殘留壓縮應力之層 及殘留拉伸應力之層。 如圖2A及圖2B所示,殘留於表面層13及背面層15之壓 縮應力(>0)有自強化玻璃板1〇之表面12及背面14朝向内部 逐漸變小之傾向。於化學強化之情形時,如圖2A所示,殘 留於中間層17之拉伸應力(>〇)為大致固定。又,於風冷強 化之情形時,如圖2B所示,殘留於中間層丨7之拉伸應力 (>〇)係自玻璃之内部朝向表面12及背面14逐漸變小。 於圖2A及圖2B中,CS係表示表面層u或背面層15中之 最大殘留壓縮應力(表面壓縮應力,CT係表示中間層 1 7中之内部殘留拉伸應力(中間層1 7之殘留拉伸應力之平 均值)(>0)’ CM(參照圖2B)係表示中間層17之最大殘留拉 伸應力’ DOL係表示表面層13或背面層15之厚度》CS或 CT、CM、DOL·係於強化處理條件下可進行調節。例如於 風冷強化法之情形時’ cs或CT、CM、DOL可由玻璃之冷 卻速度等進行調節。又,於化學強化法之情形時,由於使 玻璃浸潰於處理液(例如KNO3熔鹽)中進行離子交換,故 CS或CT、CM、DOL可由處理液之濃度或溫度 '浸潰時間 等進行調節《再者,本實施形態之表面層13及背面層15具 有相同之厚度、相同之最大殘留壓縮應力,但既可具有不 同之厚度’亦可具有不同之最大殘留壓縮應力。 於強化玻璃板10之表面12並未預先沿切斷預定線形成劃 線(槽線)。亦可預先形成劃線,但於此情形時,由於步驟 ^加故作業較為繁雜。又,若預先形成劃線,則存在 160223.doc 201245063 玻璃缺失之情況。 於強化玻璃板ίο之端部,在切斷開始位置預先形成有初 始裂痕。初始裂痕之形成方法可為普通之方法,例如由切 割器或銼刀、雷射形成。為削減步驟數,亦可不預先形成 初始裂痕。尤其於在切斷前,預先利用旋轉磨石等研磨強 化玻璃板10之端部之情形時,在研磨時會形成微裂痕,故 而亦可不預先形成初始裂痕。 於強化玻璃板10之表面12上,使雷射光20之照射區域22 (例如雷射光20之照射區域22之中心)自強化玻璃板1〇之端 部朝向内側沿著切斷預定線直線狀或曲線狀移動。藉此, 自強化玻璃板10之端部朝向内側形成裂痕3〇(參照圖〖八及 圖1B),從而將強化玻璃板10切斷。亦可使雷射光2〇之照 射區域22 P字狀移動,於此情形時,移動路徑中所含之切 斷預定線之末端係與切斷預定線之中途相交。 為使雷射光20之照射區域22於強化玻璃板1〇之表面12上 移動,而可移動或旋轉支撐強化玻璃板1〇之支撐體,亦可 移動雷射光20之光源,又,亦可旋轉設置於雷射光2〇之路 徑之中途之反射鏡。 於強化玻璃板10之表面12上,雷射光2〇之照射區域22係 例如圖1A及圖1B所示形成為圓狀,但亦可為矩形或橢圓 狀荨,其形狀並無限制。再者,照射區域22之真圓度較佳 R以下。右真圓度為q . 5 R以下,則於在強化玻璃板 10之表面12上,使照射區域22之中心沿著曲線形狀之切斷 預定線移動時,照射區域22之旋轉控制之要求精度較低, 160223.doc 201245063 故而較佳。又,於照射區域22之旋轉控制之精度為同等程 度之情形時’切斷預定線之法線方向上之照射區域22之寬 度變化較小’故而切斷精度升高。例如,即便於切斷預定 線之曲率半徑較小之情形時,亦可高精度地進行切斷。真 圓度更佳為0.3 R以下。真圓度進而較佳為〇 2 R以下。此 處’如圖4所示’真圓度係作為照射區域22之外接圓C1丨及 内接圓C12的2個同心圓之半徑R、r之差。再者,r係表示 照射區域22之外接圓C11之半徑,!*係表示照射區域22之内 接圓C12之半徑。 於強化玻、璃板10之表面12上,雷射光2〇之照射區域22係 以與強化玻璃板10之厚度、最大殘留壓縮應力(cs)、内部 殘留拉伸應力(CT)、表面層13或背面層15之厚度(DOL)、 雷射光2 0之光源輸出等相應之速度進行移動。 作為雷射光20之光源,並無特別限定,但例如可列舉 UV(ultravi〇let,紫外線)雷射(波長:355 nm)、綠光雷射 (波長:532 nm)、半導體雷射(波長:808 nm、940 nm、 975 nm)、光纖雷射(波長:i〇60〜1100 nm)、YAG(yttrium aluminum garnet,釔鋁石榴石)雷射(波長:ίο" nrn、2080 nm、2940 nm)、使用中紅外光參數振盪器之雷射(波長: 2600〜3450 nm)等。雷射光20之振盪方式並無限制,可使 用使雷射光連續振盪之CW(Continuous Wave,連續波)之 雷射、使雷射光間歇振盪之脈衝雷射中之任一種。又,雷 射光20之強度分佈並無特別限制,可為高斯型,亦可為頂 帽型。 160223.doc •10· 201245063 自光源出射之雷射光2G係由聚光透鏡等聚光,從而於強 化玻璃板10之表面12上成像。 雷射光2G之聚光位置以強化玻璃板10之表面12為基準, 可為雷射光源側,亦可為背面14側。又,若為加熱溫度不 變得過高、即可保持徐冷點以下之聚光面冑,則如圖5所 不,雷射光20之聚光位置可為強化玻璃板1〇中,尤其亦可 為中間層17内。 於雷射光20之聚光位置位於中間層17内之情形時,由於 可藉由雷射光20而使產生應力之區域變為最小,故而,可 提昇切斷精度,並且可減少雷射光2〇之光源輸出。 詳細内容於將下文敍述,而雷射光2〇係於穿過強化玻璃 板10之過程中作為熱被吸收,使得強度降低。 於雷射光20之聚光位置位於背面14或其附近(例如背面 層15與中間層17之邊界)之情形時,由於背面14上之雷射 光20之每一單位面積之強度(功率密度)升高,因此,表面 12之加熱溫度與背面丨4之加熱溫度之差變小。藉此,加熱 效率較佳’且雷射光20之光源輸出減少。 雷射光20之光軸21於強化玻璃板1〇之表面π,例如圖ία 及圖5(於圖1A中省略光軸之圖示)所示,既可與表面12正 交’如圖6所示’亦可與表面12傾斜相交。於存在由表面 12反射之雷射光2〇對雷射振盪器造成影響之虞時,若雷射 光20之光軸21與表面12傾斜相交,則大部分之反射光不會 返回至雷射振盡器,故而可使影響變小。又,於在強化玻 璃板10之表面12上形成有具有吸收雷射光20之性質之膜18 160223.doc 201245063 之類的情形時,藉由利用膜18吸收雷射光2〇而使表面12不 會受到加熱’從而無法將強化玻璃板丨〇切斷。然而,如圖 6所示’右雷射光2 〇之光朝2 1與表面12傾斜相交,則即便 切斷預定線與膜1 8之緣疊合,亦可切斷。作為膜1 8,例如 可列舉用以提昇新穎性之陶瓷膜或樹脂膜、及用以提昇功 能性之透明電極膜等。 由於先前之方法以僅雷射光之作用進行切斷,故而於殘 留拉伸應力較大之強化玻璃中,中間層之殘留拉伸應力引 起之裂痕將於預期以外之方向上急劇地伸展,導致無法以 所需之形狀進行切斷。 另一方面’本實施形態係藉由強化玻璃板1〇與雷射光2〇 滿足下述之式,來利用中間層17之殘留拉伸應力引起之裂 痕之伸展而並非僅雷射光20之作用引起之裂痕之伸展,切 斷強化玻璃板1 〇 ^即,雖詳細内容於下文敍述,但藉由以 上述條件於徐冷點以下之溫度下對雷射光20之照射區域22 之中間層17進行加熱,而對因中間層17之殘留拉伸應力而 產生於強化玻璃板1 〇中之裂痕3 〇之伸展進行控制,從而可 藉由殘留拉伸應力造成之裂痕3〇切斷強化玻璃板1〇。再 者,於徐冷點以下之溫度下加熱中間層17之原因在於,若 超過徐冷點進行加熱,則即便雷射光所.穿透之短時間,亦 成為玻璃達到高溫從而成為容易產生黏性流動之狀態,故 而藉由該黏性流動而緩解因雷射光產生之壓縮應力。 穿透強化玻璃板10之雷射光20係於將強化玻璃板1 〇之表 面12之強度設為iG,且將於強化玻璃板丨〇中移動距離L(cm) 160223.doc 12201245063 VI. Description of the Invention: [Technical Field to Be Invented] The present invention relates to a method of cutting a tempered glass sheet. [Prior Art] In recent years, in mobile devices such as mobile phones or PDAs (Pers〇nal Digital Assistants), protective glasses have been used to improve the protection or aesthetics of displays (including touch panels). 〇ver glass). Further, a glass substrate is widely used as a substrate of a display. On the other hand, the thinning and weight reduction of mobile devices have been progressing, and the thinning of glass used in the driving devices has been continuously developed. When the glass is thinned, the strength is lowered. Therefore, in order to compensate for the insufficient strength of the glass, a tempered glass having a surface layer and a back layer having residual compressive stress has been developed. Tempered glass is also used as window glass for building or window glass for construction. The tempered glass system is produced by, for example, air-cooling strengthening or chemical strengthening. The air-cooling strengthening method quenches the temperature of the glass near the softening point from the surface and the back surface to form a surface layer and a back surface layer with residual compressive stress by providing a temperature difference between the surface and the back surface of the glass. On the other hand, the chemical strengthening method replaces ions of a smaller ionic radius (eg, u ions, other ions) of 3 in the glass with ions of a larger ionic radius by ion exchange of the surface and the back surface of the glass (for example, κ ions) form a surface layer and a back layer of residual compressive stress. In the __ method, the intermediate layer apos which forms a residual tensile stress between the surface layer and the back layer acts as a reaction. In the case of manufacturing tempered glass, 'Compared with the glass of the product size in units of i-pieces, 'will be larger than the product size. 160223.doc 201245063 Glass is reinforced, cut and then It is more effective to perform multiple chamfering. Therefore, as a method of cutting the tempered glass sheet, there is proposed a method of cutting the tempered glass sheet by irradiating the surface of the tempered glass sheet with laser light to move the irradiation region of the laser light on the surface of the tempered glass sheet (for example) Refer to Patent Document 1). CITATION LIST Patent Literature Patent Literature 1: JP-A-2008-247732 SUMMARY OF INVENTION Technical Problem The above-mentioned Patent Document 1 uses a carbon dioxide laser as a light source of laser light, and thus a laser light source Most of it is absorbed as heat near the surface of the tempered glass sheet. Therefore, a tensile stress greater than the residual tensile stress is generated directly under the irradiation region of the laser light on the back surface of the glass. As a result, there is a case where the crack formed at the time of cutting passes over the irradiation region of the laser light and is sharply extended in a direction other than the expected direction, so that the trajectory accuracy of the cutting line is deteriorated, that is, the cutting line is cut off from the desired one. The line is deviated or cannot be cut to cause the glass to shatter. This tendency is more pronounced as the residual tensile stress becomes larger. The present invention has been made in view of the above problems, and an object of the invention is to provide a method for cutting a tempered glass sheet having a high accuracy of cutting lines. Means for Solving the Problems In order to solve the above object, a method for cutting a tempered glass sheet according to one aspect of the present invention 160223.doc 201245063 is performed by a surface layer and a back layer including residual compressive stress, and a surface layer and a back layer. The surface of the tempered glass sheet between the layers and the intermediate layer of the residual tensile stress is irradiated with the laser light and the irradiated region of the laser light is moved on the surface to cut the tempered glass sheet, wherein the tempered glass is When the plate and the laser beam are incident on the surface of the tempered glass plate perpendicularly to the laser light, if the absorption coefficient of the tempered glass plate with respect to the laser light is a (cm-i), the reinforcement is performed. When the thickness of the glass plate is t (cm), it satisfies the formula of 〇 <axt$ 3.0, and when the laser light is obliquely incident on the surface of the tempered glass sheet, the laser light is applied to the tempered glass. If the angle of refraction on the surface of the plate is γ (.), then the formula of 〇<aXt/c〇syS 3.〇 is satisfied, and the above-mentioned laser light is irradiated by the temperature below the cold spot. The intermediate layer in the region is heated to control the stretching of the crack on the tempered glass sheet due to the residual tensile stress of the intermediate layer. Further, the cutting method of the tempered glass sheet according to another aspect of the present invention is performed by the surface layer and the back layer having residual compressive stress, and the interlaminar layer formed between the surface layer and the back layer and having residual tensile stress. The laminated body of the reinforced glass plate layer N (N is a natural number of 2 or more) irradiates the laser light, and the irradiation region of the laser light is moved on the surface of each of the tempered glass plates to cut the N a sheet tempered glass sheet, wherein each of the tempered glass sheets is incident on the surface of each of the tempered glass sheets perpendicularly to the laser light, and the tempered glass sheet is irradiated with the laser light The absorption coefficient is set to ai (cnrI), and if the thickness of each of the tempered glass sheets is ti (cm), it satisfies 160223.doc 201245063 〇<¥(5).〇_above, any natural number below N) When the laser light is obliquely incident on the surface of each of the tempered glass sheets, the angle of refraction of the laser light on the surface of the tempered glass sheet is γΚ. And satisfying the above formula in which the 〇<aiXti/c〇s^3叩 is an arbitrary number of i or more and N or less, in the irradiation region of the laser light by a temperature lower than a cold spot; The intermediate layer is heated to control the stretching of the cracks on the respective tempered glass sheets due to the residual tensile stress of each of the intermediate layers. Advantageous Effects of Invention According to the present invention, it is possible to provide a method of cutting a tempered glass sheet having a high trajectory accuracy of a cutting line. [Embodiment] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. [First Embodiment] Fig. 1A and Fig. 1B are explanatory views of a method of cutting a tempered glass sheet according to a first embodiment of the present invention. Figure (7) is a plan view of Figure 1A. As shown in FIG. 1A and FIG. 1B, by irradiating the surface (one main surface) 12 of the strengthened glass sheet 10 with the laser light 20' and moving the irradiation region 22 of the laser light 20 on the surface 12 of the strengthened glass sheet 10, Stress is applied to the tempered glass sheet 10, and the tempered glass sheet is cut 1 。. The tempered glass sheet 10 is produced by, for example, air-cooling strengthening or chemical strengthening. The type of glass used for reinforcement is selected according to the use. For example, in the case of automotive window glass or architectural window glass, glass substrates for PDP (Plasma Display Panel), and protective glass, 160223.doc 201245063 uses limestone glass as a glass for reinforcement. Further, in the case of a glass substrate for an LCD (Liquid Crystal Display), an alkali-free glass which does not substantially contain an alkali metal element is used as the glass for reinforcement. The air-cooling strengthening method quenches the glass of the temperature near the softening point from the surface and the back surface (both main faces), so that there is a temperature difference between the surface and the back surface (the two main faces) of the glass and the inside, thereby forming residual compression. The surface layer and back layer of stress. The air-cooled strengthening method is suitable for strengthening thicker glass. The chemical strengthening method replaces the ions of smaller ionic radius (for example, ions, Na ions) contained in the glass with ions of larger ionic radius by subjecting the surface and back surface of the glass (the two main faces) to ion-family replacement. A surface layer and a back layer which form residual compressive stress are formed (for example, a κ ion). The chemical strengthening method is suitable for strengthening lime glass containing metal elements. These air-cooling strengthening methods and chemical strengthening methods form an intermediate layer of residual tensile stress between the surface layer and the back layer, and act as a reaction between the surface layer and the back layer which form residual compressive stress. Fig. 2 is a schematic view showing an example of distribution of residual stress of a chemically strengthened glass plate before irradiation of laser light. Fig. 2 is a schematic view showing an example of distribution of residual stress of the air-cooled tempered glass sheet before the irradiation of the laser light. Fig. 3 is a cross-sectional view showing an example of a tempered glass plate irradiated with laser light. In Fig. 3, the direction of the arrow indicates the direction of action of the stress, and the size of the arrow indicates the magnitude of the stress. As shown in Fig. 3, the tempered glass sheet 1 includes a surface layer 13 and a back layer 15 which have residual compressive stress, and an intermediate layer 17 which is provided between the surface layer 13 and the back layer 15 and which has residual tensile stress. The surface layer of the end face of the tempered glass sheet 10 is J60223.doc 201245063, which may include only the layer of residual compressive stress, and may also include a layer of residual compressive stress and a layer of residual tensile stress. As shown in Fig. 2A and Fig. 2B, the compressive stress (>0) remaining in the surface layer 13 and the back layer 15 tends to gradually decrease from the surface 12 and the back surface 14 of the tempered glass sheet 1 toward the inside. In the case of chemical strengthening, as shown in Fig. 2A, the tensile stress (> 〇) remaining in the intermediate layer 17 is substantially constant. Further, in the case where the air-cooling is strengthened, as shown in Fig. 2B, the tensile stress (> 〇) remaining in the intermediate layer 丨 7 gradually decreases from the inside of the glass toward the surface 12 and the back surface 14. In FIGS. 2A and 2B, CS is the maximum residual compressive stress in the surface layer u or the back layer 15 (surface compressive stress, and CT is the internal residual tensile stress in the intermediate layer 17 (residue of the intermediate layer 17) The average value of the tensile stress (>0)' CM (refer to Fig. 2B) indicates the maximum residual tensile stress of the intermediate layer 17 'DOL indicates the thickness of the surface layer 13 or the back layer 15>> CS or CT, CM, DOL can be adjusted under enhanced processing conditions. For example, in the case of air-cooling strengthening method, 'cs or CT, CM, DOL can be adjusted by the cooling rate of glass, etc. Also, in the case of chemical strengthening method, The glass is immersed in the treatment liquid (for example, KNO3 molten salt) for ion exchange, so CS or CT, CM, and DOL can be adjusted by the concentration or temperature of the treatment liquid, the immersion time, etc. Further, the surface layer 13 of the present embodiment And the back layer 15 has the same thickness and the same maximum residual compressive stress, but may have different thicknesses' or different maximum residual compressive stresses. The surface 12 of the strengthened glass sheet 10 is not pre-cut along the predetermined line. Dashing It is also possible to form a scribe line in advance, but in this case, the operation is complicated due to the step addition. Further, if the scribe line is formed in advance, there is a case where the glass is missing 160 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The initial crack is formed in advance at the cutting start position. The method of forming the initial crack may be a common method, for example, by a cutter, a file, or a laser. In order to reduce the number of steps, the initial crack may not be formed in advance. Before the cutting, the end portion of the tempered glass sheet 10 is polished by a rotating grindstone or the like in advance, and micro-cracks are formed during polishing, so that initial cracks may not be formed in advance. On the surface 12 of the tempered glass sheet 10, the ray is made. The irradiation region 22 of the light beam 20 (for example, the center of the irradiation region 22 of the laser light 20) moves linearly or in a curved shape along the line to cut from the end portion of the strengthened glass sheet 1 to the inside. Thereby, the self-tempered glass sheet 10 is moved. The end portion is formed with a crack 3 朝向 (see FIG. 8 and FIG. 1B) to cut the tempered glass sheet 10. The irradiation region 22 of the laser beam 2 can also be moved in a P-shape. In this case, the end of the planned cutting line included in the moving path intersects with the line to cut. The movable area 22 of the laser beam 20 is moved on the surface 12 of the tempered glass sheet 1 to be movable. Or rotating the supporting body of the tempered glass plate, or moving the light source of the laser light 20, or rotating the mirror disposed in the middle of the path of the laser light. On the surface 12 of the tempered glass plate 10, The irradiation area 22 of the laser light 2 is formed into a circular shape as shown in, for example, FIGS. 1A and 1B, but may be a rectangular or elliptical shape, and its shape is not limited. Further, the roundness of the irradiation area 22 is preferably. R is below. When the right roundness is q. 5 R or less, the rotation of the irradiation region 22 is controlled when the center of the irradiation region 22 is moved along the curved line of the curve shape on the surface 12 of the tempered glass sheet 10. The required accuracy is lower, 160223.doc 201245063 is therefore better. Further, when the accuracy of the rotation control of the irradiation region 22 is equal to the extent that the width of the irradiation region 22 in the normal direction of the planned cutting line is small, the cutting accuracy is increased. For example, even when the radius of curvature of the cutting planned line is small, the cutting can be performed with high precision. The true roundness is preferably 0.3 R or less. The roundness is further preferably 〇 2 R or less. Here, the true roundness is the difference between the radii R and r of the two concentric circles of the circle C1 丨 and the inscribed circle C12 outside the irradiation region 22. Furthermore, r is the radius of the circle C11 outside the irradiation area 22, * indicates the radius of the inscribed circle C12 of the irradiation region 22. On the surface 12 of the reinforced glass and glass plate 10, the irradiation area 22 of the laser light is the thickness of the tempered glass plate 10, the maximum residual compressive stress (cs), the internal residual tensile stress (CT), and the surface layer 13 Or the thickness of the back layer 15 (DOL), the light source output of the laser light 20, and the like, and the corresponding speed is moved. The light source of the laser light 20 is not particularly limited, and examples thereof include UV (ultraviolet) laser (wavelength: 355 nm), green laser (wavelength: 532 nm), and semiconductor laser (wavelength: 808 nm, 940 nm, 975 nm), fiber laser (wavelength: i〇60~1100 nm), YAG (yttrium aluminum garnet) laser (wavelength: ίο" nrn, 2080 nm, 2940 nm) A laser using a mid-infrared optical parametric oscillator (wavelength: 2600 to 3450 nm). The oscillation mode of the laser light 20 is not limited, and any of a CW (Continuous Wave) laser that continuously oscillates laser light and a pulsed laser that intermittently oscillates the laser light can be used. Further, the intensity distribution of the laser light 20 is not particularly limited and may be a Gaussian type or a top hat type. 160223.doc •10· 201245063 The laser light 2G emitted from the light source is condensed by a collecting lens or the like to form an image on the surface 12 of the tempered glass sheet 10. The condensing position of the laser light 2G is based on the surface 12 of the tempered glass plate 10, and may be the laser light source side or the back surface 14 side. Further, if the heating temperature is not too high, the concentrating surface below the freezing point can be maintained. As shown in FIG. 5, the condensing position of the laser light 20 can be in the tempered glass sheet, especially It can be inside the intermediate layer 17. In the case where the condensing position of the laser light 20 is located in the intermediate layer 17, since the region where the stress is generated can be minimized by the laser light 20, the cutting accuracy can be improved, and the laser light can be reduced. Light source output. The details will be described later, and the laser light 2 is absorbed as heat during the passage through the tempered glass sheet 10, so that the strength is lowered. In the case where the condensing position of the laser light 20 is located at or near the back surface 14 (for example, the boundary between the back layer 15 and the intermediate layer 17), the intensity (power density) per unit area of the laser light 20 on the back surface 14 is increased. Therefore, the difference between the heating temperature of the surface 12 and the heating temperature of the back surface 丨 4 becomes small. Thereby, the heating efficiency is better' and the light source output of the laser light 20 is reduced. The optical axis 21 of the laser light 20 is π on the surface Φ of the tempered glass sheet, for example, as shown in FIG. 1 and FIG. 5 (illustration omitted from the optical axis in FIG. 1A), which may be orthogonal to the surface 12 as shown in FIG. The indication 'can also intersect the surface 12 obliquely. When the laser light reflected by the surface 12 has an effect on the laser oscillator, if the optical axis 21 of the laser light 20 and the surface 12 are obliquely intersected, most of the reflected light will not return to the laser. Therefore, the effect can be made smaller. Further, when a film 18160223.doc 201245063 having the property of absorbing the laser light 20 is formed on the surface 12 of the tempered glass sheet 10, the surface 12 is not caused by the absorption of the laser light by the film 18. It is heated' so that the tempered glass sheet cannot be cut. However, as shown in Fig. 6, the light of the right laser light 2 obliquely intersects the surface 12 toward the surface 12, and even if the line to be cut is overlapped with the edge of the film 18, it can be cut. The film 18 can be, for example, a ceramic film or a resin film for improving the novelty, a transparent electrode film for improving the function, and the like. Since the prior method is cut by the action of only laser light, in the tempered glass having a large residual tensile stress, the crack caused by the residual tensile stress of the intermediate layer is sharply stretched in a direction other than the expected direction, resulting in failure. Cut in the desired shape. On the other hand, in the present embodiment, the tempered glass sheet 1 〇 and the laser light 2 〇 satisfy the following formula, and the extension of the crack caused by the residual tensile stress of the intermediate layer 17 is utilized, and not only the action of the laser light 20 is caused. The crack is stretched, and the tempered glass sheet 1 is cut. That is, although the details are described below, the intermediate layer 17 of the irradiated region 22 of the laser light 20 is heated by the above conditions at a temperature below the cold spot. The extension of the crack 3 产生 generated in the tempered glass sheet 1 因 due to the residual tensile stress of the intermediate layer 17 is controlled, so that the reinforced glass sheet can be cut by the crack caused by the residual tensile stress. . Further, the reason why the intermediate layer 17 is heated at a temperature lower than the cold point is that if the heating is performed beyond the cold point, even if the laser light penetrates for a short period of time, the glass becomes high in temperature and becomes sticky. The state of flow, so the compressive stress generated by the laser light is alleviated by the viscous flow. The laser light 20 penetrating the tempered glass sheet 10 is set to the intensity of the surface 12 of the tempered glass sheet 1 and is moved to a distance L (cm) in the tempered glass sheet. 160223.doc 12
S 201245063 時之雷射光20之強度設為I時,^^xexpGaxL)之式成立。 s亥式稱為朗伯_比爾定律。α係表示強化玻璃板丨〇對雷射光 20之吸收係數(cnT1)。 雷射光20若垂直地入射至強化玻璃板1〇之表面12,則移 動與強化玻璃板ίο之厚度t(cm)相同之距離,自背面出 射。於此情形時,藉由強化玻璃板1〇與雷射光2〇滿足 〇<axt$3.0之式,而使雷射光2〇未被強化玻璃板⑺之表面 吸收而到達内部為止。強化玻璃板1〇之内部得到充分加 熱,產生於強化玻璃板10中之應力由圖3所示之狀態變為 圖7或圖8所示之狀態β 圖7係表示沿著圖1Β2Α·α線之剖面上之應力之分佈例 之不意®,且係表#包括雷射光之照射區域的剖面上之應 力之分佈例之示意圖。圖8係表示沿著圖1Β2Β_β線之剖 面上的應力之分佈例之示意圖,1係表示相較圖7所示之 剖面為後方之剖面上的應力之分佈例之示意圖。此處,所 月後方」係才日雷射光2〇之掃描方向後方。於圖7及圖8 中’箭線之方向係表示應力之作用方向,箭線之長度係表 示應力之大小。 田射光20之照射區域22中之中間層”因雷射光之強度 充分高,故溫度高於周彡’從而產生小於圖以、圖戰 圖3所示之殘留拉伸應力之拉伸應力、或壓縮應力。於產 生有小於殘留拉伸應力之拉伸應力或㈣應力之部分,裂 痕3〇之伸展受到抑制。為確實地防止裂痕30之伸展,較佳 為,如圖7所示產生壓縮應力。 I60223.doc -13· 201245063 再者,於雷射光20之照射區域22中之表面層13或背面層 15產生有大於圖2A、圖2B及圖3所示之殘留壓縮應力之壓 縮應力,故而’裂痕30之伸展得到抑制。 為實現與圖7所示之壓縮應力之平衡,相較圖7所示之剖 面為後方之剖面’如圖8所示於中間層丨7產生拉伸應力。 於該拉伸應力大於殘留拉伸應力且拉伸應力達到特定值之 部分形成有裂痕30。裂痕30係自強化玻璃板1〇之表面12貫 穿至背面14為止,本實施形態之切斷係所謂的整片切斷。 若於該狀態下,使雷射光20之照射區域22移動,則於強 化玻璃板10之内部,照射區域22之位置如上所述成為圖7 所示之應力分佈,故而,裂痕30不會偏離切斷預定線而自 由伸展,且裂痕30之前端位置以跟蹤照射區域22之位置之 方式進行移動。因此,可藉由雷射光2〇而控制裂痕3〇之伸 展。 如此般,本實施形態可藉由使axt大於〇且為3 〇以下,而 於強化玻璃板10中,利用雷射光2〇控制裂痕3〇之伸展。而 且,由於裂痕30於照射區域22之正後方伸展,因此,切斷 線按照照射區域22之移動軌跡形成,故而,可提昇切斷精 度。再者,裂痕30之前端亦可與照射區域22疊合地進行跟 蹤,而並非跟蹤照射區域22之正後方。隨著裂痕3〇之前端 接近照射區域22,或者疊合而使切斷精度進一步提昇。 由於玻璃根據用途而需要較高之透明度,因此,於使用 雷射波長接近可見光之波長區域之情形時,axt越接近〇越 好。然而,由於若axt過小則吸收效率變差,故而a><t較佳 160223.docWhen the intensity of the laser light 20 at S 201245063 is set to I, ^^xexpGaxL) holds. The s-style is called Lambert-Beer's law. The α system indicates the absorption coefficient (cnT1) of the strengthened glass plate 雷 with respect to the laser light 20. When the laser light 20 is incident perpendicularly to the surface 12 of the tempered glass sheet 1 , it is moved at the same distance as the thickness t (cm) of the tempered glass sheet, and is emitted from the back surface. In this case, the tempered glass sheet 1 〇 and the laser light 2 〇 satisfy the formula of ax <axt $ 3.0, so that the laser light 2 〇 is not absorbed by the surface of the tempered glass sheet ( 7 ) and reaches the inside. The inside of the tempered glass sheet is sufficiently heated, and the stress generated in the tempered glass sheet 10 is changed from the state shown in FIG. 3 to the state shown in FIG. 7 or FIG. 8. FIG. 7 is a diagram showing the line along the line of FIG. The distribution of the stress on the cross section is not intended to be an example of the distribution of the stress on the cross section of the irradiated area of the laser light. Fig. 8 is a view showing an example of the distribution of stress along the section of Fig. 1 Β 2 Β β line, and Fig. 1 is a view showing an example of the distribution of stress on the section rearward of the section shown in Fig. 7 . Here, the rear of the month is the rear of the scanning direction of the laser light. In Figures 7 and 8, the direction of the arrow indicates the direction of stress, and the length of the arrow indicates the magnitude of the stress. The intermediate layer in the irradiation region 22 of the field light 20 is "higher than the intensity of the laser light, so the temperature is higher than the circumference", thereby generating a tensile stress smaller than the residual tensile stress shown in FIG. Compressive stress. The extension of the crack 3 is suppressed in the portion where the tensile stress or the (4) stress is less than the residual tensile stress. To surely prevent the stretching of the crack 30, it is preferable to generate the compressive stress as shown in Fig. 7. I60223.doc -13· 201245063 Furthermore, the surface layer 13 or the back layer 15 in the irradiation region 22 of the laser light 20 generates a compressive stress greater than the residual compressive stress shown in FIGS. 2A, 2B and 3, and thus The extension of the crack 30 is suppressed. In order to achieve the balance with the compressive stress shown in Fig. 7, the cross section of the cross section shown in Fig. 7 produces a tensile stress in the intermediate layer 如图7 as shown in Fig. 8. The portion in which the tensile stress is greater than the residual tensile stress and the tensile stress reaches a specific value forms a crack 30. The crack 30 penetrates from the surface 12 of the tempered glass sheet 1 to the back surface 14, and the cutting in the present embodiment is so-called The whole piece is cut off. In this state, when the irradiation region 22 of the laser light 20 is moved, the position of the irradiation region 22 becomes the stress distribution shown in Fig. 7 as described above, so that the crack 30 does not deviate from the cutting schedule. The line is free to stretch, and the position of the front end of the crack 30 is moved to track the position of the irradiation area 22. Therefore, the extension of the crack 3 can be controlled by the laser light 2 . Thus, the present embodiment can be made by Axt is larger than 〇 and is 3 〇 or less, and in the tempered glass sheet 10, the stretching of the crack 3 〇 is controlled by the laser light 2 而且. Moreover, since the crack 30 extends right behind the irradiation region 22, the cutting line is irradiated The movement trajectory of the region 22 is formed, so that the cutting accuracy can be improved. Further, the front end of the crack 30 can be tracked in superimposed manner with the irradiation region 22, instead of tracking the rear side of the irradiation region 22. The front end is close to the illumination area 22, or it is superimposed to further improve the cutting precision. Since the glass requires high transparency depending on the application, the laser wavelength is close to visible light. When the case of the long area, the closer the better axt billion However, since too small if the axt absorption efficiency is deteriorated, and therefore a >. ≪ t preferred 160223.doc
S 201245063 為0.0005以上(雷射光吸收率為〇 〇5%以上),更佳為〇 〇〇2 以上(雷射光吸收率為0.2%以上),進而較佳為0.004以上 (雷射光吸收率為0.4%以上)。 由於玻璃根據用途相反地需要較低之透明度,因此,於 使用雷射波長接近可見光之波長區域之情形時,axt越大 越好。然而’若axt過大則雷射光之表面吸收變大,故無 法控制裂痕伸展。因此,axt較佳為3_〇以下(雷射光吸收率 為95%以下),更佳為0·105以下(雷射光吸收率為1〇%以 下),進而較佳為0.02以下(雷射光吸收率為2%以下)。 且說,根據本發明者之見解,若中間層17之内部殘留拉 伸應力(CT)達到30 MPa以上,則形成於強化玻璃板1〇中之 裂痕僅因中間層1 7之殘留拉伸應力而自然地伸展(自由伸 展)。 因此,較佳為,内部殘留拉伸應力((:丁)為15 Mpa以上, 以使用於切斷之拉伸應力中的中間層17之殘留拉伸應力相 較藉由雷射光20而產生之拉伸應力達到主導性。藉此,於 強化玻璃板10之内部,拉伸應力達到特定值之位置(即裂 痕30之前端位置)、與雷射光20之位置之間之距離變得充 分短,故而可提昇切斷精度。 中間層17之内部殘留拉伸應力(CT)更佳為3〇 Mpa以上, 進而較佳為40MPa。若内部殘留拉伸應力(cτ)為30Mpa以 上,則用於切斷之拉伸應力僅成為中間層17之殘留拉伸應 力,故可進一步提昇切斷線之執跡精度。 於本實施形態之化學強化玻璃之切斷中,内部殘留拉伸 160223.doc .15· 201245063 應力(ct)之上限值為12〇 MPa。於目前之技術下因強化 處理之技術方面原因’而僅可強化至12〇 MPa左右為止, 若可製造内部殘留拉伸應力(CT)超過l2〇 MPa之化學強化 玻璃,則勿庸置疑亦可應用本發明。 吸收係數(α)係由雷射光2〇之波長、強化玻璃板1〇之玻 璃組成等決定。例如隨著強化玻璃板10中之氧化鐵(包含S 201245063 is 0.0005 or more (laser light absorptivity is 〇〇5% or more), more preferably 〇〇〇2 or more (laser light absorptivity is 0.2% or more), further preferably 0.004 or more (laser light absorptance is 0.4) %the above). Since glass requires a lower transparency depending on the application, the larger the axt, the better the laser wavelength is used in the vicinity of the wavelength region of visible light. However, if the axt is too large, the surface absorption of the laser light becomes large, so that the crack extension cannot be controlled. Therefore, axt is preferably 3 Å or less (the laser light absorptivity is 95% or less), more preferably 0.105 or less (the laser light absorptivity is 1% by mass or less), and further preferably 0.02 or less (laser light absorption). The rate is 2% or less). Further, according to the findings of the present inventors, if the internal residual tensile stress (CT) of the intermediate layer 17 reaches 30 MPa or more, the crack formed in the reinforced glass sheet 1 仅 is only due to the residual tensile stress of the intermediate layer 17 Stretch naturally (free stretch). Therefore, it is preferable that the internal residual tensile stress ((:) is 15 Mpa or more, and the residual tensile stress of the intermediate layer 17 used in the tensile stress of the cut is compared with that by the laser light 20. The tensile stress is dominant, whereby the distance between the position where the tensile stress reaches a certain value (i.e., the position at the front end of the crack 30) and the position of the laser light 20 becomes sufficiently short inside the tempered glass sheet 10, Therefore, the internal residual tensile stress (CT) of the intermediate layer 17 is more preferably 3 〇Mpa or more, and further preferably 40 MPa. If the internal residual tensile stress (cτ) is 30 MPa or more, it is used for cutting. The tensile stress at break is only the residual tensile stress of the intermediate layer 17, so that the accuracy of the cutting line can be further improved. In the cutting of the chemically strengthened glass of the present embodiment, the internal residual stretching is 160223.doc.15 · 201245063 The upper limit of stress (ct) is 12〇MPa. It can only be strengthened to about 12〇MPa due to technical reasons for strengthening treatment in the current technology. If internal residual tensile stress (CT) can be produced Chemical strength exceeding l2〇MPa Glass, the present invention is no doubt also be applied. Absorption coefficient ([alpha]) based 2〇 wavelength laser beam, the glass composition of glass reinforced decided 1〇 the like. For example in the glass sheet 10 with reinforcing iron (comprising
Fe〇 ' Fe2〇3 ' Fe3〇4)之含量、氧化鈷(包含 CoO、Co2〇3、 C〇3〇4)之含量、氡化銅(包含Cu〇、Cu2〇)之含量變多則 1000 nm附近之近紅外線波長區域内之吸收係數變大。 進而,隨著強化玻璃板10中之稀土類元素(例如Yb)之氧化 物之3量變多,則於稀土類原子之吸收波長附近吸收係數 (α)變大。 1000 nm附近之近紅外線波長區域内之吸收係數(α)係視 用途而設定。例如於汽車用窗玻璃之情形時,吸收係數 (〇〇較佳為3 cm·1以下。又,於建築用窗玻璃之情形時,吸 收係數⑷較佳為〇_6 cm•丨以下。又,於顯示器用玻璃之情 形時,吸收係數(α)較佳為0.2 cm·丨以下。 雷射光20之波長較佳為250〜5〇〇〇 nm。可藉由使雷射光 2〇之波長為250〜5000 nm,而兼顧雷射光2〇之穿透率及雷 射光20之加熱效率。雷射光2〇之波長更佳為3〇〇〜仂⑻ nm ’進而較佳為8〇〇〜3〇〇〇 nm。 強化玻璃板10中之氧化鐵之含量係取決於構成強化玻璃 板10之玻璃之種類,但例如為0 02M 〇質量%。可藉由於 該範圍内調節氧化鐵之含量,而使用丨〇〇〇 nm附近之通用 160223.doc •16- 201245063 之近紅外線雷射,將axt調節於所需之範圍内。亦可調節 氧化鈷或氧化銅、稀土類元素之氧化物之含量而代 : 氧化鐵之含量。 ° ρ 強化玻璃板ίο之厚度⑴係根據用途而設定。 於強化破璃板10為化學強化玻璃之情形時,強化破璃板 10之厚度⑴較佳為0〇1〜〇2 em。可藉由將厚度⑴設為〇2 凡刀杈昇内部殘留拉伸應力(CT) vixx 若厚度⑴未達0,01 cm,則不易對玻璃實施化學強化處 理。厚度⑴更佳為〇.03〜0.15⑽,進而較佳為〇〇5〜〇 cm 於強化玻璃板1G為風冷強化破璃之情形時,強化玻璃板 10之厚度⑴較佳為(U〜3 eme可藉由將厚度⑴設為3⑽以 下’而充分提昇内部殘留拉伸應力叫另一方面,若厚 度⑴未達(U em,則以對玻璃實施風冷強化處理。厚度 ⑴更佳為0.15〜2 cm,進而較佳為My 5⑽。 於強化玻璃板10之表面(雷射& 私田I田射先20入射之面)12,雷射光 20之照射區域22於形成為圓形之拌 圓办之情形時,較佳為具有大於 〇.18麵、且小於強化玻璃㈣之厚度之直徑(φ)。若直徑 ⑷達到強化玻璃板1G之厚度以上,則雷射光歡照射區域 22過大,導致加熱區域過大, 因此’存在切斷面之一部分 (尤其切斷開始部分或切斷結束 果。卩分)略微彎曲之情況。直 徑(Φ)亦可小於1.03 mm。又,甚古", 右直控(Φ)為0.5 mm以下,則 可提昇裂痕30之位置控制性,因此, 更佳。另一方面,若直徑(φ)成為〇18 切斷精度提昇,故而 mm以下,則存在於 160223.doc •17- 201245063 雷射光20之功率控制中產生不均一時功率密度變得過高, 切斷面變得粗糙,形成微細之龜裂之情況。然而,例如若 αΜ較小為例如〇·1〇5以下(雷射光吸收率為1〇%以下),則即 便於功率控制中產生不均一,使功率密度升高亦不易受到 影響,故而即便直徑(φ)為018 mm以下之情形時,亦存在 切斷精度提昇之情況。又,若雷射光2〇之功率控制之精度 較高,則無論axt之值如何,只要直徑〇)為〇 18 mm以下, 亦存在切斷精度提昇之情況。 [第2實施形態] 圖9係本發明第2實施形態之強化玻璃板之切斷方法之說 明圖。於圖9中,對與圖丨八相同之構成標往同一符號並省 略其說明。 本實施形態係與第1實施形態同樣地藉由對強化玻璃板 10之表面12照射雷射光20,使雷射光2〇之照射區域22於強 化玻璃板10之表面12上移動而切斷強化玻璃板1〇。 又,本實施形態係將強化玻璃板10對雷射光2〇之吸收係 數設為cKcrn·1),將強化玻璃板1〇之厚度設為t(cm),使強 化玻璃板10與雷射光20滿足〇<axt$ 3.0之式,藉此,利用 中間層17之殘留拉伸應力引起之裂痕之伸展,切斷強化玻 璃板10。即,可藉由於徐冷點以下之溫度下加熱雷射光2〇 之照射區域22中之中間層17,而對因中間層口之殘留拉伸 應力而產生於強化玻璃板1〇中之裂痕3〇之伸展進行控制。 因此,本實施形態亦可獲得與第丨實施形態相同之效果。 除此以外,本實施形態係如圖9所示,將氣體4〇噴附至 160223.docThe content of Fe〇' Fe2〇3 'Fe3〇4), the content of cobalt oxide (including CoO, Co2〇3, C〇3〇4), and the content of copper telluride (including Cu〇, Cu2〇) become 1000 The absorption coefficient in the near-infrared wavelength region near nm becomes large. Further, as the amount of the oxide of the rare earth element (for example, Yb) in the tempered glass sheet 10 increases, the absorption coefficient (α) increases in the vicinity of the absorption wavelength of the rare earth atom. The absorption coefficient (α) in the near-infrared wavelength region around 1000 nm is set depending on the application. For example, in the case of a window glass for automobiles, the absorption coefficient (〇〇 is preferably 3 cm·1 or less. Further, in the case of a window glass for construction, the absorption coefficient (4) is preferably 〇6 cm•丨 or less. In the case of glass for display, the absorption coefficient (α) is preferably 0.2 cm·丨 or less. The wavelength of the laser light 20 is preferably 250 to 5 〇〇〇 nm. The wavelength of the laser light can be made 250~5000 nm, taking into account the transmittance of the laser light and the heating efficiency of the laser light 20. The wavelength of the laser light is preferably 3〇〇~仂(8) nm' and further preferably 8〇〇~3〇 〇〇nm The content of iron oxide in the tempered glass sheet 10 depends on the kind of the glass constituting the tempered glass sheet 10, but is, for example, 0.02 mass%, which can be used by adjusting the content of iron oxide in the range. The general infrared 160223.doc •16- 201245063 near-infrared laser near 丨〇〇〇nm adjusts the axt to the desired range. It can also adjust the content of oxides of cobalt oxide or copper oxide and rare earth elements. : The content of iron oxide. ° ρ The thickness of the tempered glass plate ίο (1) is based on When the reinforcing glass plate 10 is chemically strengthened glass, the thickness (1) of the reinforcing glass plate 10 is preferably 0〇1 to 〇2 em. The thickness (1) can be set to 〇2升 Internal residual tensile stress (CT) vixx If the thickness (1) is less than 0,01 cm, it is not easy to chemically strengthen the glass. The thickness (1) is more preferably 〇.03~0.15(10), and further preferably 〇〇5~〇 When the tempered glass sheet 1G is an air-cooled reinforced glass, the thickness (1) of the tempered glass sheet 10 is preferably (U~3 eme can sufficiently increase the internal residual tensile stress by setting the thickness (1) to 3 (10) or less. On the other hand, if the thickness (1) is not reached (U em, the glass is subjected to air-cooling strengthening treatment. The thickness (1) is more preferably 0.15 to 2 cm, and further preferably My 5 (10). On the surface of the tempered glass sheet 10 (Ray) Shot & 私田I field shot first 20 incident surface) 12, the irradiation area 22 of the laser light 20 is preferably formed to have a round shape, and is preferably larger than 〇.18 surface and smaller than the tempered glass (4) The diameter of the thickness (φ). If the diameter (4) reaches the thickness of the tempered glass plate 1G, the laser light is illuminated. If the area 22 is too large, the heating area is too large, so that there is a case where a part of the cut surface (especially the cutting start portion or the cutting end result.) is slightly curved. The diameter (Φ) may also be less than 1.03 mm. Ancient ", when the right direct control (Φ) is 0.5 mm or less, the positional controllability of the crack 30 can be improved, and therefore, it is better. On the other hand, if the diameter (φ) becomes 〇18, the cutting accuracy is improved, and thus the mm is less than In the power control of the laser light 20, the power density becomes too high, and the cut surface becomes rough and a fine crack is formed. However, for example, if αΜ is smaller than, for example, 〇·1〇5 or less (the laser light absorption rate is 1% or less), even if power generation is uneven, the power density is not easily affected, so even the diameter is small. When (φ) is 018 mm or less, the cutting accuracy is also improved. Further, if the precision of the power control of the laser light is high, regardless of the value of axt, if the diameter 〇) is 〇 18 mm or less, the cutting accuracy is also improved. [Second Embodiment] Fig. 9 is an explanatory view showing a method of cutting a tempered glass sheet according to a second embodiment of the present invention. In Fig. 9, the same components as those in Fig. 8 are denoted by the same reference numerals and their description will be omitted. In the present embodiment, as in the first embodiment, the surface of the tempered glass sheet 10 is irradiated with the laser light 20, and the irradiation region 22 of the laser beam 2 is moved on the surface 12 of the tempered glass sheet 10 to cut the tempered glass. Board 1〇. Further, in the present embodiment, the absorption coefficient of the tempered glass sheet 10 with respect to the laser light 2 is cKcrn·1), and the thickness of the tempered glass sheet 1 is t (cm), and the tempered glass sheet 10 and the laser light 20 are obtained. When the formula of 〇<axt$3.0 is satisfied, the tempered glass sheet 10 is cut by the extension of the crack caused by the residual tensile stress of the intermediate layer 17. That is, the cracks 3 generated in the strengthened glass sheet 1 due to the residual tensile stress of the intermediate layer opening can be heated by heating the intermediate layer 17 in the irradiation region 22 of the laser light 2 at a temperature lower than the cold point. The extension of the squat is controlled. Therefore, in the present embodiment, the same effects as those of the third embodiment can be obtained. In addition to this, the present embodiment is as shown in Fig. 9, and the gas 4〇 is sprayed to 160223.doc.
S 201245063 強化玻璃板10之表面12,於強化玻璃板10之表面12上使氣 體40之喷附區域42與雷射光20之照射區域22連動(與照射 區域22一併)地移動。喷附區域42可與照射區域22疊合, 亦可配置於照射區域22之附近。又,噴附區域42可超前於 照射區域22,亦可跟蹤照射區域22。作為氣體40,並無特 別限定,例如可使用壓縮空氣等。 可藉由壓縮空氣而將附著於強化玻璃板1〇之表面12上的 附著物(例如粉塵)噴散,從而防止附著物吸收雷射光2〇。 藉此,可防止強化玻璃板10之表面12出現過熱。 氣體40亦可為對強化玻璃板1〇進行局部冷卻之冷卻氣 體’於此情形時_,氣體4〇之喷附區域42亦可如圖9所示, 以位於雷射光2 〇之照射區域2 2之移動方向後方附近之方式 跟蹤照射區域22。藉此,於雷射光2〇之照射區域22之移動 方白後方附近產生較南之溫度梯度,故而,拉伸應力達.到 特疋值之位置(即裂痕3〇之前端位置)與雷射光2〇之位置之 間之距離變短。藉此,由於裂痕3〇之位置控制性提昇,故 而可進一步提昇切斷精度。 [第3實施形態] 圖10A及圖l〇B係本發明第3實施形態之強化玻璃板之切 斷方法之說明圖。圖10A係表示強化玻璃板之剖面之剖面 圖,圖10B係放大表示強化玻璃板之表面之平面圖。於圖 10A中’箭線方向係表示氣體之流動方向。於圖1 〇a及圖 10B中’對與圖1A及圖9等相同之構成標註同—符號並省 略其說明。 160223.doc 201245063 上述第2實施形態係將氣體4〇之噴附區域a配置於雷射 光20之照射區域22之後方附近,相對於此,本實施形態之 不同之處在於使雷射光2G之照射區域22相較氣體4()之喷附 區域42之外緣配置於内側。其他構成與第2實施形態形 同,故以不同之處為中心進行說明。 氣體40係局部性地冷卻強化玻璃板1〇之冷卻氣體。雷射 光20之照射區域22係相較氣體4〇之噴附區域42之外緣配置 於内側。 氣體40之喷附區域42係指將作為氣體仂之喷出口之喷嘴 50之出口 52於與噴嘴5〇之中心軸51平行之方向上投影於強 化玻璃板10之表面12所得之區域。 如圖10B所示,於強化玻璃板1〇之表面12上,相較氣體 40之喷附區域42之外緣於内惻配置雷射光2〇之照射區域 22,故而可縮小強化玻璃板1〇之加熱區域。藉此,於雷射 光20之照射區域22之後方附近產生較高之溫度梯度,因 此拉伸應力達到特疋值之位置(即裂痕3 〇之前端位置)與 雷射光20之位置之間之距離變短。藉此,裂痕默位置控 制性提昇’故可進一步提昇切斷精度。 喷嘴50係例如圖ι〇Α所示形成為筒狀,且雷射光2〇可穿 透喷嘴50之内部。噴嘴5G之中心㈣與雷射光2q之光轴21 可同軸配£自於氣體4G之喷附區域42與雷射光2〇之照射 區域22之位置關係固^ ’故而,於無需位置關係之變更之 情形時較為有效。 [第4實施形態] 160223.doc -20- 201245063 圖11A及圖11B係本發明第4實施形態之強化玻璃板之切 斷方法之說明圖。圖丨丨八係沿圖11B之A_A線之剖面圖。圓 係強化玻璃板之平面圖。於圖11A及圆11B中對與圖 1A等相同之構成標註同一符號並省略其說明。 上述第1實施形態係雷射光20垂直地入射至強化玻璃板 10之表面I2,相對於此,本實施形態之不同之處在於雷射 光20傾斜地入射至強化玻璃板10之表面12»由於其他構成 與第2實施形態相同,故以不同之處為中心進行說明。 於以雷射光20之照射區域22之移動方向觀察時,如圖 11A所示,雷射光2〇係傾斜地入射至強化玻璃板1〇之表面 12,因此,強化玻璃板1〇之切斷面變得相對板厚方向傾 斜。藉此’可實現藉由強化玻璃板10之切斷而獲得之切斷 片彼此沿板厚方向之分離。 隨著雷射光20之光轴21之入射角β變大,折射角7根據斯 奈爾定律(Snell’s law)變大,因此,強化玻璃板1〇之切斷 面相對板厚方向之傾斜變大。隨著該傾斜變大,切斷後沿 板厚方向之分離變得容易’但切斷後之切斷面之倒角加工 變得麻煩。 入射角β係根據雷射光20之光轴21與強化玻璃板1〇之表 面12上之切斷預定線11之位置關係而設定。例如圖11Β所 示’於平面視圖(自板厚方向觀察)中,雷射光2〇之光軸21 相對切斷預定線1 1垂直地配置之情形時,入射角β設定於 1〜60°之範圍内。再者,於平面視圖(自板厚方向觀察)中, 雷射光20之光軸21亦可相對切斷預定線η傾斜地配置。 I60223.doc -21· 201245063 雷射光20若相對強化玻璃板10之表面12傾斜地入射’則 移動t/cosY之距離後自背面14出射。於此情形時’由於強 化玻璃板10與雷射光20滿足0<axt/cosYS3.0之式,故雷射 光20未於強化玻璃板1 〇之表面1 2附近被吸收而到達内部。 因此,與第1實施形態同樣地,可對因中間層1 7之殘留拉 伸應力而產生於強化玻璃板10中之裂痕30之伸展進行控 制。因此,本實施形態亦可獲得與第1實施形態相同之效 果。 再者,於本實施形態中,亦可與第2及第3實施形態同樣 地對強化玻璃板10之表面12喷附氣體40,且於強化玻璃板 10之表面12上,使氣體40之噴附區域42與雷射光20之照射 區域22連動地移動。氣體40之喷附區域42可與雷射光20之 照射區域22疊合,亦可配置於雷射光20之照射區域22之附 近。又’雷射光20之照射區域22亦可相較氣體4〇之喷附區 域42之外緣配置於内側。 [第5實施形態] 圖12係本發明第5實施形態之強化玻璃板之切斷方法之 說明圖。於圖12令,對與圖1A相同或對應之構成標註同一 或對應之符號並省略其說明。 上述第1實施形態係切斷1片強化玻璃板1〇,相對於此, 本實施形態之不同之處在於,將複數片(例如3片)強化玻璃 板10A〜10C於積層之狀態下同時切斷。例如若a><t如〇 ι〇5 以下(雷射光吸收率為1〇%以下)般較小’則由於照射至各 強化玻璃板10之表面之雷射光的大部分透過,故可將積 160223.doc .. -22 -S 201245063 The surface 12 of the tempered glass sheet 10 is moved on the surface 12 of the tempered glass sheet 10 so that the blasting region 42 of the gas 40 moves in conjunction with the illuminating region 22 of the laser light 20 (together with the illuminating region 22). The spray area 42 may be overlapped with the irradiation area 22 or may be disposed in the vicinity of the irradiation area 22. Further, the spray area 42 can be advanced beyond the illumination area 22, and the illumination area 22 can also be tracked. The gas 40 is not particularly limited, and for example, compressed air or the like can be used. The deposit (e.g., dust) adhering to the surface 12 of the tempered glass sheet 1 can be sprayed by the compressed air to prevent the deposit from absorbing the laser light. Thereby, overheating of the surface 12 of the tempered glass sheet 10 can be prevented. The gas 40 may also be a cooling gas for locally cooling the tempered glass sheet 1 'in this case _, the spraying area 42 of the gas 4 亦可 may also be as shown in FIG. 9 to be in the irradiation area 2 of the laser light 2 〇 The illumination area 22 is tracked in such a manner that the direction of movement of the 2 is near the rear. Thereby, a souther temperature gradient is generated in the vicinity of the moving white rear of the irradiation region 22 of the laser light, so that the tensile stress reaches the position of the characteristic value (ie, the position of the front end of the crack 3〇) and the laser light. The distance between the positions of 2〇 becomes shorter. Thereby, since the positional controllability of the crack 3〇 is improved, the cutting accuracy can be further improved. [Third Embodiment] Figs. 10A and 10B are explanatory views of a method of cutting a tempered glass sheet according to a third embodiment of the present invention. Fig. 10A is a cross-sectional view showing a cross section of a tempered glass sheet, and Fig. 10B is an enlarged plan view showing a surface of the tempered glass sheet. In Fig. 10A, the arrow direction indicates the flow direction of the gas. The same components as those in Fig. 1A and Fig. 9 are denoted by the same reference numerals in Fig. 1 and Fig. 10B, and the description thereof will be omitted. 160223.doc 201245063 In the second embodiment, the spray region a of the gas 4 is disposed in the vicinity of the irradiation region 22 of the laser light 20, whereas the present embodiment differs in that the laser light 2G is irradiated. The region 22 is disposed on the inner side of the outer edge of the spray region 42 of the gas 4 (). The other configuration is the same as that of the second embodiment, and therefore, the description will be focused on the differences. The gas 40 partially cools the cooling gas of the tempered glass sheet. The irradiation region 22 of the laser light 20 is disposed on the inner side of the outer edge of the ejection region 42 of the gas 4〇. The spray area 42 of the gas 40 is a region obtained by projecting the outlet 52 of the nozzle 50 as the discharge port of the gas jet onto the surface 12 of the strengthened glass sheet 10 in a direction parallel to the central axis 51 of the nozzle 5A. As shown in Fig. 10B, on the surface 12 of the tempered glass sheet 1, the irradiation region 22 of the laser beam 2 is disposed on the outer edge of the blasting region 42 of the gas 40, so that the tempered glass sheet can be reduced. The heating area. Thereby, a higher temperature gradient is generated in the vicinity of the irradiation region 22 of the laser light 20, and thus the distance between the tensile stress reaching the characteristic value (ie, the position of the front end of the crack 3 )) and the position of the laser light 20 is obtained. Shortened. Thereby, the positional control of the crack is improved, so that the cutting accuracy can be further improved. The nozzle 50 is formed in a cylindrical shape as shown, for example, and the laser light 2 permeable to the inside of the nozzle 50. The center (4) of the nozzle 5G and the optical axis 21 of the laser light 2q can be coaxially matched with the positional relationship between the spray area 42 of the gas 4G and the illumination area 22 of the laser light 2, and thus the positional relationship is not required to be changed. The situation is more effective. [Fourth Embodiment] 160223.doc -20-201245063 Fig. 11A and Fig. 11B are explanatory views showing a method of cutting a tempered glass sheet according to a fourth embodiment of the present invention. Figure 8 is a cross-sectional view taken along line A_A of Figure 11B. Plan view of a round tempered glass panel. The same components as those in Fig. 1A and the like are denoted by the same reference numerals in Fig. 11A and Fig. 11B, and the description thereof will be omitted. In the first embodiment, the laser light 20 is incident perpendicularly on the surface I2 of the tempered glass sheet 10. However, the present embodiment is different in that the laser light 20 is obliquely incident on the surface of the tempered glass sheet 10. Since it is the same as that of the second embodiment, the description will be focused on the differences. When viewed in the moving direction of the irradiation region 22 of the laser light 20, as shown in Fig. 11A, the laser light 2 is obliquely incident on the surface 12 of the tempered glass sheet 1 ,, and thus, the cut surface of the tempered glass sheet 1 变It has to be inclined with respect to the thickness direction. Thereby, the separation of the cut pieces obtained by the severing of the tempered glass sheet 10 in the thickness direction can be realized. As the incident angle β of the optical axis 21 of the laser light 20 becomes larger, the refraction angle 7 becomes larger according to Snell's law, and therefore, the inclination of the cut surface of the tempered glass sheet 1 Å becomes larger with respect to the thickness direction. . As the inclination becomes larger, the separation in the thickness direction after the cutting becomes easier. However, the chamfering of the cut surface after the cutting becomes troublesome. The incident angle β is set in accordance with the positional relationship between the optical axis 21 of the laser light 20 and the line to cut 11 on the surface 12 of the tempered glass sheet 1 . For example, in the case of the plan view (viewed from the thickness direction), when the optical axis 21 of the laser beam 2 is arranged perpendicularly to the line to cut 1 1 , the incident angle β is set at 1 to 60°. Within the scope. Further, in the plan view (viewed from the thickness direction), the optical axis 21 of the laser light 20 may be disposed obliquely with respect to the planned cutting line n. I60223.doc -21· 201245063 If the laser beam 20 is incident obliquely with respect to the surface 12 of the tempered glass sheet 10, the distance t/cosY is moved and then emitted from the back surface 14. In this case, since the strengthened glass plate 10 and the laser light 20 satisfy the equation of 0 <axt/cos YS 3.0, the laser light 20 is not absorbed near the surface 12 of the tempered glass sheet 1 and reaches the inside. Therefore, similarly to the first embodiment, the extension of the crack 30 generated in the tempered glass sheet 10 due to the residual tensile stress of the intermediate layer 17 can be controlled. Therefore, this embodiment can also obtain the same effects as those of the first embodiment. Further, in the present embodiment, as in the second and third embodiments, the gas 40 may be sprayed onto the surface 12 of the tempered glass sheet 10, and the gas 40 may be sprayed on the surface 12 of the tempered glass sheet 10. The attachment area 42 moves in conjunction with the illumination area 22 of the laser light 20. The spray area 42 of the gas 40 may be overlapped with the illumination area 22 of the laser light 20 or may be disposed adjacent to the illumination area 22 of the laser light 20. Further, the irradiation region 22 of the laser light 20 may be disposed on the inner side of the outer edge of the ejection region 42 of the gas. [Fifth Embodiment] Fig. 12 is an explanatory view showing a method of cutting a tempered glass sheet according to a fifth embodiment of the present invention. The same or corresponding components as those in FIG. 1A are denoted by the same or corresponding reference numerals, and their description will be omitted. In the first embodiment, the one tempered glass sheet 1 is cut, and the difference in the present embodiment is that a plurality of sheets (for example, three sheets) of the tempered glass sheets 10A to 10C are simultaneously cut in a layered state. Broken. For example, if a><t is less than 〇ι〇5 or less (the laser light absorption rate is 1% or less), most of the laser light irradiated to the surface of each tempered glass sheet 10 is transmitted. Product 160223.doc .. -22 -
S 201245063 層而成之複數片強化玻璃板10同時切斷。由於其他構成與 第2實施形態相同,故以不同之處為中心進行說明。 本實施形態係藉由對強化玻璃板1〇A〜1〇c積層…為2 以上之自然數)而成之積層體11〇之表面(一主面)ιι2照射雷 射光20,且於各強化玻璃板1〇A〜1〇c之表面l2A〜12匸上使 雷射光20之照射區域22移動,而切斷N片強化玻璃板 10A 〜100 N片強化玻璃板i〇A〜10C亦可具有相互不同之玻璃組 成,但杈佳為具有相同之玻璃組成β N片強化玻璃板 10A〜10C亦可具有相互不同之厚度,但較佳為具有相同之 厚度。N片強化玻璃板1 〇 a〜l〇c亦可具有相互不同之熱膨 脹係數’但較佳為具有相同之熱膨脹係數。N片強化玻璃 板10A〜10C亦可具有相互不同之吸收係數α,但較佳為具 有相同之吸收係數α。 於積層體110中,相互鄰接之強化玻璃板彼此(例如強化 玻璃板10Α與強化玻璃板1 〇Β)既可相接亦可分離。又,於 積層體110中’亦可於相互鄰接之強化玻璃板彼此(例如強 化玻璃板10A與強化玻璃板10B)之間設置樹脂等間隔件。 雷射光20可垂直地入射至積層體110之表面(於圖中為上 表面)112。即,雷射光20可垂直地入射至各強化玻璃板 10A〜10C之表面12A〜12C。 各強化玻璃板10A〜10C與雷射光20係各強化玻璃板10對 雷射光20之吸收係數設為a/cm·1),各強化玻璃板1〇之厚 度設為ti(cm)時’滿足0<aiXtiS3.0(i為1以上且N以下之任 160223.doc •23- 201245063 意自然數)。 雷射光20係若垂直地入射至各強化玻璃板l〇A〜10C之表 面12A〜12C,則移動與各強化玻璃板i〇A〜10C之厚度ti(cm) 相同之距離後自背面出射。於此情形時,由於各強化玻璃 板10A〜10C與雷射光20滿足〇<aixtiS3.0之式,故雷射光20 於各強化玻璃板10A〜10C之表面12A〜12C附近未被吸收而 到達内部。因此,與第1突施形態同樣地,可對因各強化 玻璃板10A〜10C之中間層之殘留拉伸應力而產生於各強化 玻璃板1 0A〜1 0C中之裂痕之伸展進行控制。因此,本實施 形態亦可獲得與第1實施形態相同之效果。 再者’於本實施形態中,亦可與第2及第3實施形態同樣 地對積層體11〇之表面U2喷附氣體4〇,且於積層體11〇之 表面112上使氣體40之噴附區域42與雷射光20之照射區域 22連動地移動。氣體4〇之喷附區域42既可與雷射光2〇之照 射區域22疊合,亦可配置於雷射光2〇之照射區域22之附 近。又’雷射光20之照射區域22亦可相較氣體40之喷附區 域4 2之外緣配置於内側。 又’本貫施形態係雷射光2〇垂直地入射至各強化玻璃板 10A〜10C之表面12A〜12C,但與第4實施形態同樣地,雷射 光20亦可傾斜地入射至各強化玻璃板l〇A〜1〇〇之表面 12A〜12C。於此情形時,將各強化玻璃板1〇A〜1〇c之表面 12A-12C上的雷射光20之折射角設為i,各強化玻璃板1〇 與雷射光20滿足〇<aiXti/c〇SYig 3 〇(丨為i以上且N以下之任 意自然數)之式。 160223.docS 201245063 The layers of tempered glass sheets 10 are cut at the same time. Since the other configuration is the same as that of the second embodiment, the description will be focused on the differences. In the present embodiment, the laser beam 20 is irradiated onto the surface (one main surface) ιι2 of the laminated body 11 by a laminate of the tempered glass sheets 1A to 1〇c, which is a natural number of 2 or more. The surface of the glass plate 1A1 to 1〇c is moved to the irradiation area 22 of the laser light 20, and the N piece of the tempered glass plate 10A to 100N is strengthened. The mutually different glass compositions, but preferably have the same glass composition. The β N sheet tempered glass sheets 10A to 10C may have mutually different thicknesses, but preferably have the same thickness. The N sheets of tempered glass sheets 1 〇 a to l〇c may have mutually different thermal expansion coefficients' but preferably have the same coefficient of thermal expansion. The N sheets of tempered glass sheets 10A to 10C may have mutually different absorption coefficients α, but preferably have the same absorption coefficient α. In the laminated body 110, the tempered glass sheets adjacent to each other (for example, the tempered glass sheet 10 Α and the tempered glass sheet 1 〇Β) may be joined or separated. Further, in the laminated body 110, a spacer such as a resin may be provided between the tempered glass sheets adjacent to each other (for example, the tempered glass sheet 10A and the tempered glass sheet 10B). The laser light 20 is incident perpendicularly to the surface (upper surface in the drawing) 112 of the laminated body 110. That is, the laser light 20 can be incident perpendicularly to the surfaces 12A to 12C of the respective tempered glass sheets 10A to 10C. Each of the tempered glass sheets 10A to 10C and the laser beam 20 has an absorption coefficient of the laser beam 10 to the laser light 20 of a/cm·1), and when the thickness of each of the tempered glass sheets 1 设为 is ti (cm), 0<aiXtiS3.0 (i is 1 or more and N or less is 160223.doc •23- 201245063 is a natural number). When the laser beam 20 is incident perpendicularly to the surfaces 12A to 12C of the tempered glass sheets 10A to 10C, the laser beam 20 is moved at the same distance as the thickness ti (cm) of each of the tempered glass sheets i 〇 A to 10C, and then emitted from the back surface. In this case, since each of the tempered glass sheets 10A to 10C and the laser light 20 satisfy the formula of 〇<aixtiS3.0, the laser light 20 is not absorbed near the surfaces 12A to 12C of the tempered glass sheets 10A to 10C. internal. Therefore, similarly to the first embodiment, the stretching of the cracks generated in the tempered glass sheets 10A to 10C due to the residual tensile stress of the intermediate layers of the tempered glass sheets 10A to 10C can be controlled. Therefore, in the present embodiment, the same effects as those in the first embodiment can be obtained. Further, in the present embodiment, as in the second and third embodiments, the gas U 4 may be sprayed onto the surface U2 of the laminated body 11 , and the gas 40 may be sprayed on the surface 112 of the laminated body 11 . The attachment area 42 moves in conjunction with the illumination area 22 of the laser light 20. The spray region 42 of the gas may be overlapped with the irradiation region 22 of the laser beam 2 or may be disposed in the vicinity of the irradiation region 22 of the laser beam 2 . Further, the irradiation region 22 of the laser light 20 may be disposed on the inner side of the outer edge of the spraying region 4 2 of the gas 40. Further, in the present embodiment, the laser beam 2 is incident perpendicularly on the surfaces 12A to 12C of the tempered glass sheets 10A to 10C. However, as in the fourth embodiment, the laser light 20 may be obliquely incident on each of the tempered glass sheets. 〇A~1〇〇 surface 12A~12C. In this case, the angle of refraction of the laser light 20 on the surface 12A-12C of each of the tempered glass sheets 1A to 1〇c is set to i, and each of the tempered glass sheets 1〇 and the laser light 20 satisfies 〇<aiXti/ c〇SYig 3 〇 (丨 is an arbitrary number of i or more and N or less). 160223.doc
S -24· 201245063 實施例 以下,藉由實施例等而對本發明具體地進行說明,但本 發明並不受該等例之限定。 [例Μ〜例1-4] (化學強化玻璃板之製作) 藉由將混合複數種原料而製備之玻璃原料熔解,且使熔 解之熔融玻璃成形為板狀後徐冷至室溫附近為止,進行切 斷、切削、雙面鏡面研磨,而製作具有特定厚度之 mmx50 mm之玻璃板,作為化學強化用之玻璃板。玻璃原 料係以玻璃板對雷射光之吸收係數達到所需之值之方 式’改變氧化鐵(Fe2〇3)之粉末對於相同調配比之基材之添 加量而製備。 各化學強化用玻璃板係以氧化物基準之質量%表示含有S -24·201245063 EXAMPLES Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by the examples. [Examples ~ 1-4] (Production of chemically strengthened glass sheet) The glass raw material prepared by mixing a plurality of kinds of raw materials is melted, and the molten glass is formed into a plate shape and then cooled to room temperature. Cutting, cutting, and double-sided mirror polishing were performed to prepare a glass plate having a specific thickness of mm x 50 mm as a glass plate for chemical strengthening. The glass raw material was prepared by changing the absorption coefficient of the laser light to the desired value of the laser light to change the amount of the iron oxide (Fe2〇3) powder for the same blending ratio of the substrate. Each of the glass sheets for chemical strengthening is expressed by mass% of the oxide standard.
Si02 : 60.7。/〇、Al2〇3 : 9.6%、MgO : 7.0%、CaO : 〇·1〇/0、 SrO : 0.1%、BaO : 〇·1%、Na20 : 11.6%、Κ2〇 : 6.0〇/〇、Si02: 60.7. /〇, Al2〇3: 9.6%, MgO: 7.0%, CaO: 〇·1〇/0, SrO: 0.1%, BaO: 〇·1%, Na20: 11.6%, Κ2〇: 6.0〇/〇,
Zr〇2 : 4.8%,且以新增比例含有特定量氧化鐵(Fe2〇3)。 各化學強化玻璃板係藉由將上述化學強化用玻璃板浸潰 於KN〇3熔鹽中進行離子交換處理後,冷卻至室溫附近而 製作。KN〇3熔鹽之溫度或浸潰時間等處理條件係以内部 殘留拉伸應力(CT)達到所需值之方式設定。 各化學強化玻璃板之内部殘留拉伸應力(CT)係藉由表面 應力計FSM-6000(折原製作所製造)來測定表面壓縮應力 (CS)及壓縮應力層之深度(DOL),並根據該測定值、及化 學強化玻璃板之厚度(t),利用以下之數式⑴由計算求出。 160223.doc •25· 201245063 CT=(CSxDOL)/(t-2xDOL) ⑴ 再者’測定之結果為各化學強化玻璃板之表面層及背面 層具有相同之厚度、相同之最大壓縮應力。 附帶而言,於表面層及背面層具有不同之厚度、不同之 最大壓縮應力之情形時,内部殘留拉伸應力(ct)係利用下 述數式(II)由計算求出。 CT=(ClxDl/2+C2xD2/2)/(t-Dl-D2) (〇) 上述式(II)中’Cl係表示表面層之最大殘留壓縮應力, D1係表不表面層之厚度’ C2係表示背面層之最大殘留壓 縮應力,D2係表示背面層之厚度。 (化學強化玻璃板之切斷) 化學強化玻璃板之切斷係利用圖1A及圖1B所示之切斷 方法進仃。於各化學強化玻璃板之側面之切斷開始位置 上’預先利用娃刀形成初始裂痕,而於各化學強化玻璃板 之表面並未形成劃線。 雷射光之光源係設為光纖雷射(中心波帶:1〇75〜ι〇95 nm)。各化學強化玻璃板對該雷射光之吸收係數係使用紫 外可見近紅外分光光度計Lambda 950進行測定。 雷射光之光軸係以與各化學強化玻璃板之表面正交之方 式配置。 使雷射光之照射區域於各化學強化玻璃板之表面上,自 切斷預定線之一端(初始裂痕)以1〇 mm/sec2恆定速度遍佈 50 mm移動至另一端。作為移動路徑之中心線的切斷預定 線係設為與矩形化學強化玻璃板之一邊平行之直線狀且 160223.docZr〇2: 4.8%, and contains a specific amount of iron oxide (Fe2〇3) in a new ratio. Each of the chemically strengthened glass sheets was prepared by impregnating the above-mentioned chemical strengthening glass plate with KN〇3 molten salt, followed by ion exchange treatment, and then cooling to room temperature. The treatment conditions such as the temperature of the KN〇3 molten salt or the impregnation time are set such that the internal residual tensile stress (CT) reaches a desired value. The internal residual tensile stress (CT) of each chemically strengthened glass plate is measured by a surface stress meter FSM-6000 (manufactured by Ohara, Ltd.) to determine the surface compressive stress (CS) and the depth of the compressive stress layer (DOL), and according to the measurement. The value and the thickness (t) of the chemically strengthened glass plate were calculated by the following formula (1). 160223.doc •25· 201245063 CT=(CSxDOL)/(t-2xDOL) (1) As a result of the measurement, the surface layer and the back layer of each chemically strengthened glass plate have the same thickness and the same maximum compressive stress. Incidentally, when the surface layer and the back layer have different thicknesses and different maximum compressive stresses, the internal residual tensile stress (ct) is calculated by the following formula (II). CT=(ClxDl/2+C2xD2/2)/(t-Dl-D2) (〇) In the above formula (II), 'Cl is the maximum residual compressive stress of the surface layer, and D1 is the thickness of the surface layer' C2 It is the maximum residual compressive stress of the back layer, and D2 is the thickness of the back layer. (Cutting of Chemically Strengthened Glass Sheet) The cutting of the chemically strengthened glass sheet is carried out by the cutting method shown in Figs. 1A and 1B. At the cutting start position on the side of each chemically strengthened glass plate, an initial crack was formed by using a silicon knife in advance, and no scribing was formed on the surface of each chemically strengthened glass plate. The source of the laser light is a fiber laser (central band: 1〇75~ι〇95 nm). The absorption coefficient of the laser light for each chemically strengthened glass plate was measured using a violet visible near-infrared spectrophotometer Lambda 950. The optical axis of the laser light is arranged orthogonal to the surface of each chemically strengthened glass plate. The irradiation light of the laser light was applied to the surface of each chemically strengthened glass plate, and one end (initial crack) of the predetermined line was moved at a constant speed of 1 mm/sec 2 over 50 mm to the other end. The cutting line as the center line of the moving path is set to be linear parallel to one side of the rectangular chemically strengthened glass plate and 160223.doc
-26 - S 201245063 與一邊相距之距離設為1 〇 mm。雷射光之照射區域之形狀 係設為圓狀。 雷射光之聚光位置係配置於與各化學強化玻璃板之表面 (上表面)相距-10.3〜20 mm(以上表面為基準,且將上方(光 源側)設為正)之位置。雷射光之聚光角係設為14〜33 4。。 (切斷結果之評價) 切斷結果係以(1)能否切斷、(2)切斷端部品質、切斷 面品質、(4)最大偏移量進行評價。 ⑴能否切斷係將可以切斷預定線切斷化學強化玻璃板 °又為〇」,將無法控制裂痕之伸展且裂痕偏離切斷預定 線而自由伸展之情形及無法切冑導致玻璃粉碎《情形設為 「X」。 (2)切斷知質係目測觀察切斷面,且以切斷面之端 部(切斷之開始部分及結束部分)是否為平面進行評價。將 刀斷面之端„Ρ為平面設為「〇」,將切斷面之端部為彎曲 面設為「X」。 ()刀斷面σσ質係目測觀察切斷面,且以切斷面上是否 存在龜裂進行5平價。將未能辨認出裂痕設為「0」,將可 辨認出裂痕設為「X」。 再者,即便於(2)切斷端部品質或(3)切斷面品質之評價 為 」之If形時’只要切斷精度良好,便可根據用途而 使用。 (4)最大偏移量係矣_ # , 、 置係表不於化學強化玻璃板之表面上切斷 線以何種程度偏離切斷預定線’且對與切斷預线正交之 160223.doc -27- 201245063 方向上之變動幅度進行敎所得者。該最A偏移量係除切 斷開始部分及切斷結束部分以外進行測定所得者。 將S平價結果與切斷條件等一併示於表丄。 [表1] 例1-1 例1-2 例1-3 例1·4 光源輸出(W) ·— ___1 180 200 50 ~~~---- 4 雷射光 聚光角度(°) 1.4 1.4 1.4 33.4 聚光位置(mm) 12.4 12.4 12.4 ---- -0.8 φ (mm) 0.3 0.3 0.3 ----— L 0,5 強化玻璃 CT(MPa) 68.2 115 43.6 —--~~~— 65.5 t(cm) 0.05 0.05 0.14 "—----- 0.07 a(/cm) 0.09 0.09 0.48 ~383~ a(/cm)xt(cm) 0.0045 0.0045 0.0672 — 2.68 能否切斷 〇 Ο 〇 ------— 0 切斷端部品質 〇 Ο 〇 — 〇 切斷面品質 〇 〇 〇 ' 〇 最大偏移量(mm) 0 0 0 0 於表1所示之例1-1〜例1-4中,能否切斷、切斷端部品 質、切斷面品質中任一者之評價均為「〇」,最大偏移量 均為0 mm。 [例1-5〜例1-10] 例1-5〜例1-10(比較例)係與例1-1〜例1-4(實施例)不同, 使厚度(t)x吸收係數(α)之值大於3.0,試驗化學強化坡璃板 之切斷。 於例1-5中,除變更厚度⑴之外’與例1-4同樣地製作化 -28 - 160223.doc-26 - S 201245063 The distance from one side is set to 1 〇 mm. The shape of the area irradiated by the laser light is rounded. The condensing position of the laser light is disposed at a position of -10.3 to 20 mm from the surface (upper surface) of each chemically strengthened glass plate (the upper surface is the reference and the upper side (the light source side) is set to be positive). The concentration angle of the laser light is set to 14 to 33 4 . . (Evaluation of cutting result) The cutting result was evaluated by (1) cutting, (2) cutting end quality, cutting surface quality, and (4) maximum offset. (1) Whether the cutting system can cut the predetermined line and cut the chemically strengthened glass sheet is also a flaw, and it is impossible to control the stretching of the crack and the crack is freely stretched away from the cutting line and cannot be cut to cause the glass to be crushed. The situation is set to "X". (2) The cut-off surface was visually observed to cut the surface, and the end portion (the beginning portion and the end portion of the cut) of the cut surface was evaluated as a flat surface. The end of the cut surface is set to "〇", and the end of the cut surface is set to "X". () The σσ texture of the knife section was visually observed to cut the surface, and 5 cracks were performed on whether there was a crack on the cut surface. If the crack is not recognized as "0", the crack can be recognized as "X". In addition, even if the (2) cut end quality or (3) the cut surface quality is evaluated as "Iw shape", the cutting accuracy can be used depending on the application. (4) The maximum offset system 矣 _ # , , is not the extent to which the cutting line on the surface of the chemically strengthened glass plate deviates from the line to cut 'and is orthogonal to the cutting line. Doc -27- 201245063 The change in direction is the result of the increase. The most A offset amount is obtained by measuring other than the cutting start portion and the cutting end portion. The S parity result is shown together with the cutting conditions and the like. [Table 1] Example 1-1 Example 1-2 Example 1-3 Example 1·4 Light source output (W) ·— ___1 180 200 50 ~~~---- 4 Laser light concentrating angle (°) 1.4 1.4 1.4 33.4 Concentration position (mm) 12.4 12.4 12.4 ---- -0.8 φ (mm) 0.3 0.3 0.3 ----- L 0,5 tempered glass CT (MPa) 68.2 115 43.6 —--~~~— 65.5 t (cm) 0.05 0.05 0.14 "------ 0.07 a(/cm) 0.09 0.09 0.48 ~383~ a(/cm)xt(cm) 0.0045 0.0045 0.0672 — 2.68 Can I cut off 〇 ---- ---— 0 Cut end quality 〇Ο 〇 〇 〇 cut surface quality 〇〇〇 ' 〇 maximum offset (mm) 0 0 0 0 1-1 to 1-4 shown in Table 1 Among them, the evaluation of whether the cut end quality and the cut surface quality can be cut or cut is "〇", and the maximum offset is 0 mm. [Example 1-5 to Example 1-10] Example 1-5 to Example 1-10 (Comparative Example) are different from Examples 1-1 to 1-4 (Example) in making the thickness (t) x absorption coefficient ( The value of α) is greater than 3.0, and the test chemically strengthens the cutting of the slab. In Example 1-5, except for changing the thickness (1), it was produced in the same manner as in Example 1-4. -28 - 160223.doc
S 201245063 學強化玻璃板’且使雷射光之照射區域於製作之化學強化 玻璃板上進行移動。 例1-6〜例1-10係除使用二氧化碳雷射(波長:1〇6〇〇 nm) 作為雷射光之光源且變更吸收係數(α)(例丨_6〜例1-8中亦變 更厚度(t))以外,與例1-2同樣地製作化學強化玻璃板,且 ’ 使雷射光之照射區域於製作之化學強化玻璃板上進行移 動。為使雷射光之照射時間延長,確保熱傳遞時間,化與 強化玻璃板之表面上的雷射光之照射區域設為於其移動方 向上較長之橢圓形狀(長度為^^爪、寬度為3mm)。 將評價結果與切斷條件等一併示於表2。 160223.doc -29- 201245063 【<N<】 例 1-10 1 1 1 46.7 0.05 1000以上 50以上 X 1 1 例1-9 1 1 1 00 (N 0.05 1000以上 50以上 〇 X 〇 0.35 例1-8 CN 1 1 1 25.2 0.09 1000以上 90以上 X 1 1 例1-7 1 1 1 18.1 0.09 1000以上 90以上 〇 X 〇 例1-6 CN 1 1 1 15.3 0.09 1000以上 90以上 〇 X 〇 卜 例1-5 寸 33.4 00 〇 5 38.3 3.83 X 1 1 1 光源輸出(W) 聚光角度(°) 聚光位置(mm) φ (mm) CT(MPa) t(cm) a(/cm) a(/cm)xt(cm) 能否切斷 切斷端部品質 切斷面品質 最大偏移量(mm) 雷射光 強化玻璃 160223.doc -30-S 201245063 tempered glass plate' and moved the irradiated area of the laser light on the produced chemically strengthened glass plate. Example 1-6 to Example 1-10 except that a carbon dioxide laser (wavelength: 1 〇 6 〇〇 nm) is used as a light source of laser light and the absorption coefficient (α) is changed (example _6 to case 1-8 is also changed) A chemically strengthened glass plate was produced in the same manner as in Example 1-2 except for the thickness (t), and 'the irradiation region of the laser light was moved on the produced chemically strengthened glass plate. In order to extend the irradiation time of the laser light, the heat transfer time is ensured, and the irradiation area of the laser light on the surface of the tempered glass plate is set to be an elliptical shape long in the moving direction (the length is ^^ claw, the width is 3 mm) ). The evaluation results are shown in Table 2 together with the cutting conditions and the like. 160223.doc -29- 201245063 [<N<] Example 1-10 1 1 1 46.7 0.05 1000 or more 50 or more X 1 1 Example 1-9 1 1 1 00 (N 0.05 1000 or more 50 〇X 〇0.35 Example 1 -8 CN 1 1 1 25.2 0.09 1000 or more 90 or more X 1 1 Example 1-7 1 1 1 18.1 0.09 1000 or more 90 or more 〇X 〇Example 1-6 CN 1 1 1 15.3 0.09 1000 or more 90 or more 〇X 〇 1-5 inch 33.4 00 〇5 38.3 3.83 X 1 1 1 Light source output (W) Concentration angle (°) Concentration position (mm) φ (mm) CT(MPa) t(cm) a(/cm) a( /cm)xt(cm) Can cut the cut end quality cut surface quality maximum offset (mm) Laser light tempered glass 160223.doc -30-
S 201245063 根據表1及表2可知藉由將厚度(t)x吸收係數(α)之值設為 3.0以下,便可以良好之切斷精度切斷化學強化玻璃板。 若厚度(t)x吸收係數(α)之值超過3.0,則無法切斷,或即便 可切斷,最大偏移量亦較大,切斷精度較差。 [例2-1〜例2-20] 例2-1〜例2-20(實施例)係變更化學強化處理條件,調節 内部殘留拉伸應力(ct)後,分析内部殘留拉伸應力(CT)與 最大偏移量之關係。化學強化玻璃板之製作、切斷、評價 設為與例Μ〜例1-4相同。將評價結果與切斷條件一併示 於表3〜表5。 160223.doc -31 - 201245063 【εί 例2-7 〇 〇 36.3 0.07 tn 0.021 〇 〇 〇 0.15 例2-6 〇 (N m 〇 27.9 0.09 00 Ο 0.072 〇 〇 〇 <N 例2-5 % 寸· 沄 in c> 27.9 0.09 00 ο 0.072 〇 〇 〇 0.15 例2-4 寸· CN rn 27.8 0.09 ΓΛ ο 0.027 〇 〇 〇 0.15 例2-3 〇 沄 27.8 0.09 ΓΟ Ο 0.027 〇 〇 〇 1—^ 例2-2 i 〇 11.4 ΓΛ o 21.4 2.99 0.299 〇 〇 〇 例2-1 00 21.4 2.99 0.299 〇 〇 〇 (N Ο 光源輸出(W) 聚光角度(°) 聚光位置(mm) φ (mm) CT(MPa) t(cm) a(/cm) a(/cm)xt(cm) 能否切斷 切斷端部品質 切斷面品質 最大偏移量(mm) 雷射光 強化 玻璃 -32· 160223.doc 201245063 -ee· ^〇Ρ'ίΖΖ09\ 最大偏移量(mm) 切斷面品質 切斷端部品質 能否切斷 P 3 X £ P 3 強化玻璃 雷射光 星 〇 Η 2 -Θ- 聚光位置(mm) 聚光角度(°) 光源輸出(W) 〇 〇 〇 〇 0.021 〇 UJ 0.07 36.3 〇 U) to 例2-8 0.15 〇 〇 〇 0.056 〇 bo 0.07 36.5 〇 N) g 例2-9 〇 〇 〇 〇 0.056 〇 bo 0.07 36.5 〇 k) 00 例 2-10 〇 〇 〇 〇 0.0336 0.48 0.07 40.8 ο Ιλ Μ 例 2-11 〇 〇 〇 〇 0.084 l>—<· k) 0.07 40.8 ο U) »—» K> 例 2-12 〇 〇 〇 〇 0.0672 0.48 0.14 43.6 ο ▲ ON Ο 例 2-13 〇 〇 〇 〇 0.0672 0.48 0.14 43.6 ο UJ Ν> »—· Lh Ο 例 2-14 【>4】 201245063 例 2-20 〇 1 11 < <N m Ο 74.6 0.06 oo ο 0.048 〇 〇 〇 〇 例 2-19 〇 〇 CN ο 74.6 | 0.06 00 ο 0.048 〇 〇 〇 〇 例 2-18 〇 寸· (N ο 50.8 0.14 CN 0.168 〇 〇 〇 〇 例 2-17 污 ο 50.8 0.14 cs 0.168 〇 〇 〇 〇 例 2-16 卜 in cn m ο 47.4 ^—4 〇 2.99 0.299 〇 〇 〇 〇 例 2-15 卜 〇〇 ο 47.4 Ο 2.99 0.299 〇 〇 〇 〇 光源輸出(W) 聚光角度(°) 聚光位置(mm) Ν 麵 V—* CL, Ο 旦 X* 1 能否切斷 切斷端部品質 切斷面品質 最大偏移量(mm) 雷射光 強化玻璃 160223.doc -34- s 201245063 根據表3〜表5可知,藉由將内部殘留拉伸應力(CT)設為 30 MPa以上’便可使殘留拉伸應力的裂痕之伸展成為主導 性’從而可使最大偏移量為0 mm。 [例3-1〜例3-8] 雷射光之照射區域t尺寸形狀S 201245063 According to Tables 1 and 2, it is understood that the chemically strengthened glass sheet can be cut with good cutting precision by setting the value of the thickness (t) x absorption coefficient (α) to 3.0 or less. If the thickness (t) x absorption coefficient (α) exceeds 3.0, the cutting cannot be performed, or even if the cutting is possible, the maximum offset is large, and the cutting accuracy is poor. [Example 2-1 to Example 2-20] Example 2-1 to Example 2-20 (Example) The internal residual tensile stress (CT) was analyzed after changing the chemical strengthening treatment conditions and adjusting the internal residual tensile stress (ct). ) the relationship with the maximum offset. The production, cutting, and evaluation of the chemically strengthened glass plate were the same as in Examples 1-4. The evaluation results are shown together with the cutting conditions in Tables 3 to 5. 160223.doc -31 - 201245063 [εί Example 2-7 〇〇36.3 0.07 tn 0.021 〇〇〇0.15 Example 2-6 〇(N m 〇27.9 0.09 00 Ο 0.072 〇〇〇<N Example 2-5 % inch·沄in c> 27.9 0.09 00 ο 0.072 〇〇〇0.15 Example 2-4 inch · CN rn 27.8 0.09 ΓΛ ο 0.027 〇〇〇0.15 Example 2-3 〇沄27.8 0.09 ΓΟ Ο 0.027 〇〇〇1—^ Example 2 2 i 〇11.4 ΓΛ o 21.4 2.99 0.299 〇〇〇例2-1 00 21.4 2.99 0.299 〇〇〇(N Ο Light source output (W) Concentration angle (°) Concentration position (mm) φ (mm) CT(MPa ) t(cm) a(/cm) a(/cm)xt(cm) Can cut the cut end quality cut surface quality maximum offset (mm) Laser light tempered glass -32· 160223.doc 201245063 -ee· ^〇Ρ'ίΖΖ09\ Maximum offset (mm) Cut surface quality Cut end quality Can cut P 3 X £ P 3 Strengthened glass laser light star 〇Η 2 -Θ- Spot position ( Mm) Concentration angle (°) Light source output (W) 〇〇〇〇0.021 〇UJ 0.07 36.3 〇U) to Example 2-8 0.15 〇〇〇0.056 〇bo 0.07 36.5 〇N) g Example 2-9 〇〇〇 〇0.056 Bo 0.07 36.5 〇k) 00 Example 2-10 〇〇〇〇0.0336 0.48 0.07 40.8 ο Ιλ Μ Example 2-11 〇〇〇〇0.084 l>-<· k) 0.07 40.8 ο U) »—» K> 2-12 〇〇〇〇0.0672 0.48 0.14 43.6 ο ▲ ON Ο Example 2-13 〇〇〇〇0.0672 0.48 0.14 43.6 ο UJ Ν> »—· Lh Ο Example 2-14 [>4] 201245063 Example 2-20 〇1 11 <<N m Ο 74.6 0.06 oo ο 0.048 Example 2-19 〇〇CN ο 74.6 | 0.06 00 ο 0.048 Example 2-18 〇 inch · (N ο 50.8 0.14 CN 0.168 〇〇〇〇例2-17 污ο 50.8 0.14 cs 0.168 〇〇〇〇例2-16 卜 in cn m ο 47.4 ^—4 〇2.99 0.299 〇〇〇〇例2-15 卜〇〇ο 47.4 Ο 2.99 0.299 〇〇〇〇 light source output (W) concentrating angle (°) concentrating position (mm) Ν surface V—* CL, Ο X X X* 1 Can cut the cut end quality quality cut surface quality maximum offset Amount (mm) Laser light tempered glass 160223.doc -34- s 201245063 According to Table 3 to Table 5, the internal residual tensile stress (CT) is set to 30 MP. A or more can make the extension of the crack of the residual tensile stress become dominant, so that the maximum offset can be 0 mm. [Example 3-1 to Example 3-8] Irradiation area of laser light t size and shape
將#價結果與切斷條件等 例3-1〜例3·8(實施例)係變更化學強化玻璃板之表面上的 寸形狀,s平價切斷結果。化學強化 係設為與例1 - 1〜例1 -4相同。 件等一併示於表6。 160223,doc 35- 201245063 Γ--|9崦】 例3-8 卜 -10.3 S 21.4 2.99 0.299 〇 X 〇 (N 〇 例3-7 〇 1 11.4 00 寸 0.95 21.4 2.99 0.299 〇 〇 〇 CN 〇 例3-6 卜 00 21.4 T—t 2.99 0.299 〇 〇 〇 <N 〇 例3-5 〇〇 1 0.18 21.4 2.99 0.299 〇 〇 X 0.15 例3-4 -10.3 s 47.4 F· M 2.99 0.299 〇 X 〇 〇 例3-3 〇〇 Ο 47.4 2.99 0.299 〇 〇 〇 〇 例3-2 ο 47.4 r M 2.99 0.299 〇 〇 〇 〇 rA 5 卜 〇〇 1 0.18 47.4 2,99 0.299 〇 〇 X 〇 光源輸出(W) 聚光角度(°) 聚光位置(mm) φ (mm) CT(MPa) t(cm) a(/cm) a(/cm)xt(cm) 能否切斷 切斷端部品質 ----1 切斷面品質 最大偏移量(mm) 雷射光 強化玻璃 -36- 160223.doc 201245063 根據表6可知,於仆風 、予強化玻璃板之表面,雷射光之照 射區域形成為圓形之情形時,若直徑⑷大於。18襲且小 於化學強化玻璃板之厚度(1()_),則切斷端部品質或切 斷面品質較佳。於直徑Μ 為0.18出爪之情形時,於切斷面 上存在微細之裂痕。又, ;直徑(Φ)為1.03 mm之情形時, 切斷面之端部略微彎曲。 [例4-1〜例4-4] 例4]〜例4_4係對可利用切斷預定線㈣化學強化玻璃 =(不產生裂痕之自由伸展或玻璃之粉碎)之最大雷射掃描 遠度與化予強化玻璃板之表面上的雷射光之直徑之關係 進行分析。 使用以氧化物基準之質量%表示含有si〇2 : 6ι 〇%、 A1203 : 12篇、Mg0 : 6.6%、Ca〇 : G 1%、Sr〇 : 〇 2%、The valence result and the cutting condition, etc. Example 3-1 to Example 3·8 (Example) were changed to the shape of the inch on the surface of the chemically strengthened glass plate, and the result of s-cutting was cut. The chemical strengthening system was set to be the same as in Examples 1-1 to 1-4. The items are shown in Table 6. 160223,doc 35- 201245063 Γ--|9崦] Example 3-8 卜-10.3 S 21.4 2.99 0.299 〇X 〇(N 〇Example 3-7 〇1 11.4 00 inch 0.95 21.4 2.99 0.299 〇〇〇CN 〇Example 3 -6 00 00 21.4 T-t 2.99 0.299 〇〇〇<N 〇例3-5 〇〇1 0.18 21.4 2.99 0.299 〇〇X 0.15 Example 3-4 -10.3 s 47.4 F· M 2.99 0.299 〇X 〇〇Example 3-3 〇〇Ο 47.4 2.99 0.299 〇〇〇〇 Example 3-2 ο 47.4 r M 2.99 0.299 〇〇〇〇rA 5 〇〇 1 0.18 47.4 2,99 0.299 〇〇X 〇Light source output (W) Spotlight Angle (°) Concentration position (mm) φ (mm) CT(MPa) t(cm) a(/cm) a(/cm)xt(cm) Can cut off the quality of the cut end----1 The maximum offset of the cut surface quality (mm) Laser light tempered glass -36- 160223.doc 201245063 According to Table 6, it can be seen that when the irradiated area of the laser light is formed into a circular shape on the surface of the tempered glass or the tempered glass sheet If the diameter (4) is greater than 18 and less than the thickness of the chemically strengthened glass plate (1 () _), the quality of the cut end or the quality of the cut surface is better. When the diameter Μ is 0.18, the cut is cut. Broken There are fine cracks on the surface. Also, when the diameter (Φ) is 1.03 mm, the end of the cut surface is slightly curved. [Example 4-1 to Example 4-4] Example 4] ~ Example 4_4 The relationship between the maximum laser scanning distance of the chemically strengthened glass = (free stretching without cracking or pulverization of glass) and the diameter of the laser light on the surface of the strengthened glass plate is analyzed by using the cutting line (4). The mass % of the oxide standard means that si〇2 : 6 〇 、 %, A1203 : 12 articles, Mg 0 : 6.6%, Ca 〇: G 1%, Sr 〇: 〇 2%,
Ba〇 : 0.2%、Na2〇 : 12.2%、K2〇 : 5 州、Zr〇2 : i 〇% 者’作為各化學強化玻璃板。 於各化學強化玻璃板中,表面壓縮應力(cs)為735 MPa,壓縮應力層之深度φ〇Ι^512(μηι),内部拉伸應 力(CT)為 38(MPa)。 各化學強化玻璃板(300 mmx300 mmxl」mm)之切斷係 利用圖10A及圖10B所示之切斷方法進行。於各化學強化 玻璃板之侧面之切斷開始位置預先利用銼刀形成初始裂 痕’且於各化學強化玻璃板之表面並未形成劃線。 喷嘴之出口為直徑為2 mm之圓形,且配置於與各化與 160223.doc •37- 201245063 強化玻璃板之表面之間之間隙G(參照圖丨〇A)為3 mm之位 置。以100 L/min之流量將室溫之壓縮空氣自喷嘴之出口 朝向各化學強化玻璃板之表面喷射。 噴嘴之中心轴及雷射光之光軸係以與各化學強化玻璃板 之表面正交之方式同軸配置。 使用光纖雷射(中心波長:1〇7〇 nm)作為雷射光之光 源。各化學強化玻璃板對雷射光之吸收係數係使用紫外可 見近紅外分光光度計Lambda 950進行測定。 雷射光之聚光位置係配置於與各化學強化玻璃板之表面 相距0〜2.8 mm上方(背面之相反側)之位置。雷射光之聚光 角設為4°。 於與各化學強化玻璃板之表面同一之平面内,使雷射光 之中心自切斷預定線之一端遍佈3〇〇 移動至另一端為 止。作為移動路徑之切斷預定線係設為與矩形各化學強化 玻璃板之一邊(短邊)平行之直線狀,且將與一邊相距之距 離設為10 mm。 於與各化學強化玻璃板之表面同一之平面内,將雷射光 之直徑設為0.2 mm,並且使雷射光之中心自切斷開始端以 2.5 mm/sec之速度移動15 mm,繼而,於使雷射光之中、、 進而移動5 mm之期間,使雷射光之直徑為表7所示之直 徑。其後,使雷射光之移動速度加速至目標速度,且以目 標速度進行維持。將可進行切斷之最高速度示於表7。 160223.docBa〇: 0.2%, Na2〇: 12.2%, K2〇: 5 states, Zr〇2: i 〇% are as each chemically strengthened glass plate. In each chemically strengthened glass plate, the surface compressive stress (cs) was 735 MPa, the depth of the compressive stress layer was φ 〇Ι 512 (μηι), and the internal tensile stress (CT) was 38 (MPa). The cutting of each chemically strengthened glass plate (300 mm x 300 mm x 1 mm) was carried out by the cutting method shown in Figs. 10A and 10B. The initial cracks were formed in advance by the boring tool at the cutting start position of the side faces of the chemically strengthened glass sheets, and no scribe lines were formed on the surfaces of the respective chemically strengthened glass sheets. The outlet of the nozzle is a circle having a diameter of 2 mm, and is disposed at a position 3 mm from the gap G (refer to Fig. A) between the surface of each of the reinforced glass sheets of 160223.doc • 37- 201245063. The compressed air at room temperature was sprayed from the outlet of the nozzle toward the surface of each chemically strengthened glass plate at a flow rate of 100 L/min. The central axis of the nozzle and the optical axis of the laser light are coaxially arranged to be orthogonal to the surface of each of the chemically strengthened glass sheets. A fiber laser (central wavelength: 1 〇 7 〇 nm) is used as the light source of the laser light. The absorption coefficient of the laser light for each chemically strengthened glass plate was measured using an ultraviolet visible near-infrared spectrophotometer Lambda 950. The condensing position of the laser light is disposed at a position above the surface of each chemically strengthened glass plate from 0 to 2.8 mm (opposite side of the back surface). The spotlight angle of the laser light is set to 4°. In the same plane as the surface of each chemically strengthened glass plate, the center of the laser light is moved from one end to the other end from one end of the line to cut. The line to be cut as the moving path is formed in a straight line parallel to one side (short side) of each of the rectangular chemically strengthened glass sheets, and the distance from one side is set to 10 mm. In the same plane as the surface of each chemically strengthened glass plate, the diameter of the laser light is set to 0.2 mm, and the center of the laser light is moved by 15 mm at a speed of 2.5 mm/sec from the cutting start end, and then During the period of 5 mm in the laser light, and further moving 5 mm, the diameter of the laser light is the diameter shown in Table 7. Thereafter, the moving speed of the laser light is accelerated to the target speed and maintained at the target speed. The maximum speed at which the cutting can be performed is shown in Table 7. 160223.doc
S -38· 201245063 [表7] 例4-1 例4-2 例4-3 例4-4 光源輸出(W) 120 120 120 120 雷射光 聚光角度(°) 4 4 4 4 聚光位置(mm) 0 0.7 1.4 2.8 φ (mm) 0.02 0.05 0.1 0.2 強化玻璃 CT(MPa) 38 38 38 38 t(cm) 0.11 0.11 0.11 0.11 a(/cm) 0.09 0.09 0.09 0.09 a(/cm)xt(cm) 0.010 0.010 0.010 0.010 可進行切斷之最大速度(mm/s) 60 60 50 30 根據表7可知,於光源輸出恆定之情形時,在化學強化 玻璃板之表面上’可隨著雷射光之直徑變小,而提昇雷射 光之掃描速度。其原因在於:於雷射光之光源輸出恆定之 障1時’在化學強化玻璃板之表面上,隨著雷射光之直徑 變小,雷射光之功率密度(w/mm2)上升,故而可縮短加熱 時間。 [例5-1〜例5-2] 例5-1〜例5_2係對可利用切斷預定線切斷化學強化玻璃 .板(不產生裂痕之自由伸展或玻璃之粉碎)之最小光源輸 出、與噴嘴之有無使用之關係進行分析。 使用與例4-1相同之組成之玻璃(cs=699(Mpa)、 D〇L=64.8(_、CT=46.7(MPa)),作為各化學強化 板。 各化學強化玻璃板⑽_100 _χ11叫之切斷係利 160223.doc -39- 201245063 用圖10A及圖1 OB所示之切斷方法進行。於各化學強化玻 璃板板之側面之切斷開始位置預先利用銼刀形成初始裂 痕’且於各化學強化玻璃板之表面並未形成劃線。 使用光纖雷射(中心波長.1070 nm)作為雷射光之光 源。各化學強化玻璃板對雷射光之吸收係數係使用紫外可 見近紅外分光光度計Lambda 950進行測定。 雷射光之聚光位置係配置於與各化學強化玻璃板之表面 相距0 m m上方(背面之相反側)之位置。雷射光之聚光角係 設為8.9°。 於與各化學強化玻璃板之表面同一之平面内,使雷射光 之中心自切斷預定線之一端遍佈15 〇 mm移動至另一端。作 為移動路徑之切斷預定線係設為與矩形之各化學強化玻璃 板之一邊(短邊)平行之直線狀,且將與一邊相距之距離設 為 10 mm。 於與各化學強化玻璃板之表面同一之平面内,將雷射光 之直徑設為0.2 mm,並且使雷射光之中心自切斷預定線之 切斷開始端以2.5 mm/sec之速度移動15 mm,繼而,於使 雷射光之中心進而移動5 mm之期間,使雷射光之直徑由 0.2 mm縮徑為〇_1 mm。其後,將雷射光之移動速度加速至 目標速度(10 mm/Sec) ’且以目標速度維持。於切斷開始 時,移動速度較慢之原因在於裂痕之形成消耗時間。 於例5-1中不使用喷嘴,而於例5_2中使用噴嘴,對化學 強化玻璃板之表面喷附冷卻氣體。 化學強化玻璃板之表面正交之方式 喷S之中心轴係以與各 ,與雷射光之光軸同軸 160223.doc -40- 201245063 地配置。喷嘴之出〇係直徑為丨mm之圓形,且配置於與各 化學強化玻璃板之表面之間之間隙G(參照圖10A)為2 之位置。以1 5 L/min之流量’將室溫之㈣线自喷嘴之 出口朝向各化學強化玻璃板之表面喷射。將可進行切斷之 最小光源輸出示於表8。 [表8]S -38· 201245063 [Table 7] Example 4-1 Example 4-2 Example 4-3 Example 4-4 Light source output (W) 120 120 120 120 Laser light collecting angle (°) 4 4 4 4 Concentrating position ( Mm) 0 0.7 1.4 2.8 φ (mm) 0.02 0.05 0.1 0.2 tempered glass CT (MPa) 38 38 38 38 t(cm) 0.11 0.11 0.11 0.11 a(/cm) 0.09 0.09 0.09 0.09 a(/cm)xt(cm) 0.010 0.010 0.010 0.010 Maximum speed at which cutting can be performed (mm/s) 60 60 50 30 According to Table 7, when the light source output is constant, the surface of the chemically strengthened glass plate can be changed with the diameter of the laser light. Small, while improving the scanning speed of laser light. The reason is that when the output of the laser light source is constant, the obstacle is 1 "on the surface of the chemically strengthened glass plate, as the diameter of the laser light becomes smaller, the power density of the laser light (w/mm2) rises, so that the heating can be shortened. time. [Example 5-1 to Example 5-2] Example 5-1 to Example 5_2 are the minimum light source output for cutting the chemically strengthened glass sheet (free stretching without cracking or pulverization of glass) by cutting the predetermined line. Analyze with the use of the nozzle. A glass having the same composition as in Example 4-1 (cs = 699 (Mpa), D 〇 L = 64.8 (_, CT = 46.7 (MPa)) was used as each chemically strengthened plate. Each chemically strengthened glass plate (10) _100 _ χ 11 Cut off the line 160223.doc -39- 201245063 by the cutting method shown in Fig. 10A and Fig. 1 OB. The initial crack is formed by using a file in advance at the cutting start position of the side surface of each chemically strengthened glass plate. The surface of the chemically strengthened glass plate is not lined. The fiber laser (central wavelength. 1070 nm) is used as the light source of the laser light. The absorption coefficient of the laser light for each chemically strengthened glass plate is UV-visible near-infrared spectrophotometer Lambda. The measurement was performed at 950. The condensing position of the laser light was placed at a position above 0 mm (opposite side of the back surface) from the surface of each chemically strengthened glass plate. The condensing angle of the laser light was set to 8.9°. The surface of the tempered glass plate is moved in the same plane, and the center of the laser light is moved from 15 〇mm to the other end from one end of the cutting line. The cutting line for the moving path is set to be a chemically strengthened glass plate with a rectangular shape. It One side (short side) is parallel and straight, and the distance from one side is set to 10 mm. In the same plane as the surface of each chemically strengthened glass plate, the diameter of the laser light is set to 0.2 mm, and the laser light is made. The center of the cutting line is moved by 15 mm at a speed of 2.5 mm/sec from the cutting start end of the cutting line, and then the diameter of the laser light is reduced from 0.2 mm to φ during the movement of the center of the laser light by 5 mm. _1 mm. Thereafter, the moving speed of the laser light is accelerated to the target speed (10 mm/Sec)' and maintained at the target speed. At the beginning of the cutting, the slower moving speed is caused by the formation of cracks. In Example 5-1, the nozzle was not used, and in Example 5_2, the nozzle was used to spray the cooling gas on the surface of the chemically strengthened glass plate. The surface of the chemically strengthened glass plate was orthogonal to the central axis of the spray S. The optical axis of the laser light is coaxially arranged 160223.doc -40- 201245063. The nozzle has a circular diameter of 丨mm and is disposed in the gap G between the surface of each chemically strengthened glass plate (refer to FIG. 10A). Positioned to 2, at 15 L/min Amount '(iv) the temperature of the line from the outlet of the nozzle toward the surface of the glass chemically strengthened each injection would be minimal cut of the light output are shown in Table 8. [Table 8]
根據表8可知,藉由使用嗜中、人λ 仗用噴出冷部軋體之噴嘴,便可減 少光源輸出。 [例6-1〜例6-5] 例“〜例6·5係對可利用切斷預定線切斷化學強化玻璃 :(不產生裂痕之自由伸展或玻璃之粉碎)之最小光源輸 出、、雷射光之聚光位置之關係進行分析。 使用與例5-1相同細士、 ,成及相同物性之玻璃 (CS=699(MPa) ' DOL=64 sr 、… ·8(μηι)、CT=46.7(MPa))作為各化 160223.doc 201245063 學強化玻璃板。 各化學強化玻璃板(150 mmxlOO mmxl.l mm)之切斷係 利用圖10A及圖1 OB所示之切斷方法進行。於各化學強化 玻璃板之側面之切斷開始位置預先利用經刀形成初始裂 痕,且於各化學強化玻璃板之表面並未形成劃線。 使用光纖雷射(中心波長:1070 nm)作為雷射光之光 源。各化學強化玻璃板對雷射光之吸收係數係使用紫外可 見近紅外分光光度計Lambda 950進行測定。 於與各化學強化玻璃板之表面同一之平面内,使雷射光 之中心自切斷預定線的一端遍佈150 mm移動至另一端。作 為移動路徑之切斷預定線係設為與矩形之各化學強化玻璃 板之一邊(短邊)平行之直線狀,且將與一邊相距之距離設 為10 mm。 於與各化學強化玻璃板之表面同一之平面内,將雷射光 之直徑設為0.2 mm,並且使雷射光之中心自切斷預定線之 切斷開始端以2·5 mm/sec之速度移動15 mm,繼而,於使 雷射光之中心進而移動5 mm之期間,使雷射光之直徑自 〇.2 mm縮徑為ο.! mm。其後,使雷射光之移動速度加速至 目標速度(1G mm/Sec),且以目標速度維持。於切斷開始 時,移動速度較慢之原因在於裂痕之形成消耗時間。 雷射光之$光位置係力雷射光之移動&度為低速之期 間,設定於相較化學強化玻璃板之表面為l3 mm上方(背 面之相反側)之位置。#雷射光之移動速度自低速切換為 高速前,變更雷射光之聚光位置。變更後之雷射光之聚光According to Table 8, it can be seen that the discharge of the light source can be reduced by using the nozzle for ejecting the cold portion by using the middle and the human λ. [Example 6-1 to Example 6-5] Example "~Example 6.5 is the minimum light source output that can be cut by chemical cutting glass by cutting line: (free stretching without cracking or pulverization of glass), The relationship between the condensed positions of the laser light was analyzed. The glass with the same fineness, and the same physical properties as in Example 5-1 (CS=699 (MPa) ' DOL=64 sr , ... · 8 (μηι), CT= 46.7 (MPa)) as a tempering 160223.doc 201245063 tempered glass plate. The cutting of each chemically strengthened glass plate (150 mm x 100 mm x 1.1 mm) was carried out by the cutting method shown in Fig. 10A and Fig. 1 OB. The cutting start position of the side of each chemically strengthened glass plate was previously formed by a knife to form an initial crack, and no scribing was formed on the surface of each chemically strengthened glass plate. A fiber laser (central wavelength: 1070 nm) was used as the laser light. Light source. The absorption coefficient of laser light for each chemically strengthened glass plate is measured by UV-visible near-infrared spectrophotometer Lambda 950. The center of the laser light is self-cut in the same plane as the surface of each chemically strengthened glass plate. One end of the wire is moved over 150 mm to the other end The line to be cut as the moving path is formed in a straight line parallel to one side (short side) of each of the rectangular chemically strengthened glass sheets, and the distance from one side is set to 10 mm. In the same plane of the surface, the diameter of the laser light is set to 0.2 mm, and the center of the laser light is moved by 15 mm at a speed of 2·5 mm/sec from the cutting start end of the planned cutting line, and then When the center of the light is moved by 5 mm, the diameter of the laser light is reduced by ο.! mm. The movement speed of the laser light is accelerated to the target speed (1G mm/Sec), and The target speed is maintained. The reason for the slower moving speed at the start of cutting is the time required for the formation of cracks. The position of the laser light at the position of the laser light is set at a period of low speed and is set in comparison with the chemically strengthened glass. The surface of the board is at a position above l3 mm (the opposite side of the back side). #The speed of movement of the laser light is changed from low speed to high speed, and the position of the concentrated light of the laser light is changed.
S _3.doc .42. 201245063 位置係於例6-1中設定於與化學強化玻璃板之表面相距〇 4 mm上方之位置,於例6_2中設定於化學強化玻璃板之表面 上之位置,於例6-3中設定於化學強化玻璃板之板厚方向 中心之位置’於例6-4中設定於化學強化玻璃板之背面上 之位置’於例6-5中設定於與化學強化玻璃板之背面相距 0.4 mm下方之位置。 喷嘴之中心軸以與各化學強化玻璃板之表面正交之方 式’與雷射光之光轴同抽地配置。 喷嘴之出口係直徑為1 mm之圓形,且配置於與各化學 強化玻璃板之表面之間之間隙0(參照圖1〇A)為2 _之位 置。以15 L/min之流量,使室溫之壓縮空氣自噴嘴之出口 朝向各化學強化玻璃板之表面喷射。 贾耵將可進行切斷之最小 光源輸出示於表9。 160223.doc 43· 201245063 【6嵴】 例6-5 相距背面下方 46.7 0.11 0.09 0.010 〇 例6-4 r-H 46.7 0.11 0.09 0.010 〇 例6-3 ψ Η 板厚中心 46.7 0.11 0.09 0.010 〇 例6-2 表面 46.7 0.11 0.09 0.010 〇 例6-1 Η 相距表面上方 46.7 ο 0.09 0.010 〇 光源輸出(W) φ (mm) 焦點位置 CT(MPa) t(cm) a(/cm) a(/cm)xt(cm) 能否切斷 雷射光 強化玻璃 .44- 160223.doc s 201245063 根據表9可知’為減少光源輸出’較佳為雷射光之聚光 位置位於化學強化玻璃板之表面與背面之間,且儘量接近 背面為佳。 [例7-1〜例7_2] 例7-1〜例7_2係對不同玻璃組成之化學強化玻璃板之能 否切斷進行分析。 例7-1係進行與例4-1相同組成之化學強化玻璃板之切 斷。另一方面,例7-2係進行以氧化物基準之質量%表示含 有 Si02 : 62.0%、a1203 : 17.1%、MgO : 3.9%、CaO : 〇·6%、Na2〇 : 12.7%、K20 : 3.5。/。、Sn02 : 〇.3〇/0之化學強 化玻璃板之切斷。 各化學強化玻璃板(120 mmxlOO mmx〇.8 mm)之切斷係 利用圖1 0A及圖1 0B所示之切斷方法進行。於各化學強化 玻璃板之側面之切斷開始位置預先利用銼刀形成初始裂 痕’且於各化學強化玻璃板之表面未形成劃線。 使用光纖雷射(中心波長:1070 nm)作為雷射光之光 源。各化學強化玻璃板對雷射光之吸收係數係使用紫外可 見近紅外分光光度計Lambda 950進行測定。 於與各化學強化玻璃板之表面同一之平面内,使雷射光 之中心自切斷預定線之一端移動至另一端。如圖13所示, 作為移動路徑之切斷預定線11係包括2個直線狀部分(長度 為55 mm)ll-l、11-4、及配置於該2個直線狀部分1M、 11 -4之間的2個曲線狀部分(半徑為5 mm之1 /4圓孤狀部 分)11-2 、 11-3 。 I60223.doc •45- 201245063 於與各化學強化玻璃板之表面同一之平面内,將雷射光 之直徑設為0.2 mm,並且使雷射光之中心自切斷預定線之 切斷開始端以2.5 mm/sec之速度移動15 mm,繼而,於使 雷射光之中心進而移動5 mm之期間,使雷射光之直徑由 0.2 mm縮徑至〇_i mm。其後,使雷射光之移動速度加速至 目標速度(10 mm/Sec),且以目標速度維持。於切斷開始 時,移動速度較慢之原因在於裂痕之形成消耗時間β 雷射光之聚光位置係配置於與各化學強化玻璃板之表面 相距0 mm上方(背面之相反側)之位置。雷射光之聚光角設 為 8.9。。 喷嘴之中心軸係以與各化學強化玻璃板之表面正交之方 式,與雷射光之光軸同軸地配置。 喷嘴之出口係直控為2 mm之圓形,且配置於與各化學 強化玻璃板之表面之間之間隙G(參照圖1〇A)為3 mm之位 置。以50 L/min之流量,將室溫之壓縮空氣自喷嘴之出口 朝向各化學強化玻璃板之表面喷射。 將切斷之評價結果與切斷條件—併示於表丨〇。 [表 10] 例7-1 例7-2 雷射光 光源輸出(W) 37.5 200 聚光角度(°) 8.9 8.9 聚光位置(mm) 0 0 φ (mm) 0.1 0.1 強化玻璃 C1 (MPa) 37.4 48 t(cm) 0.08 0.08 a(/cm) a(/cm)xt(cm) 0.09 0.04 0.007 0.003 能否切斷 Ο 〇 •46· 160223.docS _3.doc .42. 201245063 The position is set at a position 〇4 mm from the surface of the chemically strengthened glass plate in Example 6-1, and is set on the surface of the chemically strengthened glass plate in Example 6_2. The position set in the center of the thickness direction of the chemically strengthened glass plate in Example 6-3 'the position set on the back surface of the chemically strengthened glass plate in Example 6-4' is set in the chemically strengthened glass plate in Example 6-5. The back side is located 0.4 mm below. The central axis of the nozzle is disposed in the same manner as the optical axis of the laser beam, and is disposed in the same manner as the optical axis of the laser beam. The outlet of the nozzle is a circular shape having a diameter of 1 mm, and is disposed at a position of 2 _ between the gap 0 (refer to Fig. 1A) between the surfaces of the respective chemically strengthened glass sheets. At a flow rate of 15 L/min, room temperature compressed air was sprayed from the outlet of the nozzle toward the surface of each chemically strengthened glass plate. The minimum light source output that Jia Wei will cut off is shown in Table 9. 160223.doc 43· 201245063 [6嵴] Example 6-5 46.7 0.11 0.09 0.010 from the bottom of the back side Example 6-4 rH 46.7 0.11 0.09 0.010 Example 6-3 ψ 板 Plate thickness center 46.7 0.11 0.09 0.010 Example 6-2 Surface 46.7 0.11 0.09 0.010 Example 6-1 Η 46.7 above the surface ο 0.09 0.010 〇 light source output (W) φ (mm) Focus position CT (MPa) t (cm) a (/cm) a (/cm) xt ( Cm) Can the laser light tempered glass be cut off. 44-160223.doc s 201245063 According to Table 9, it is understood that 'to reduce the light source output' is preferably the spotlight position of the laser light between the surface and the back of the chemically strengthened glass plate, and It is better to be as close as possible to the back. [Example 7-1 to Example 7_2] Examples 7-1 to 7_2 are analyses for the ability of the chemically strengthened glass sheets of different glass compositions to be cut off. Example 7-1 was a cut of a chemically strengthened glass plate having the same composition as in Example 4-1. On the other hand, Example 7-2 shows that SiO2 is contained in an amount of SiO 2 : 62.0%, a1203: 17.1%, MgO: 3.9%, CaO: 〇·6%, Na2〇: 12.7%, K20: 3.5. . /. , Sn02 : 〇.3〇/0 chemically strengthened glass plate cutting. The cutting of each chemically strengthened glass plate (120 mm x 100 mm x 〇. 8 mm) was carried out by the cutting method shown in Fig. 10A and Fig. 10B. The initial cracks were formed in advance by the boring tool at the cutting start position of the side surface of each of the chemically strengthened glass sheets, and no scribe line was formed on the surface of each of the chemically strengthened glass sheets. A fiber laser (central wavelength: 1070 nm) was used as the light source for the laser light. The absorption coefficient of the laser light for each chemically strengthened glass plate was measured using an ultraviolet visible near-infrared spectrophotometer Lambda 950. The center of the laser light is moved from one end of the line to the other end to the other end in the same plane as the surface of each of the chemically strengthened glass sheets. As shown in FIG. 13, the line to cut 11 as a moving path includes two linear portions (length 55 mm) ll-1, 11-4, and two linear portions 1M, 11-4. 2 curved parts (1 / 4 round orphans with a radius of 5 mm) 11-2, 11-3. I60223.doc •45- 201245063 Set the diameter of the laser light to 0.2 mm in the same plane as the surface of each chemically strengthened glass plate, and make the center of the laser light 2.5 mm from the cutting start end of the cut line. The speed of /sec is moved by 15 mm, and then the diameter of the laser light is reduced from 0.2 mm to 〇_i mm during the movement of the center of the laser light by 5 mm. Thereafter, the moving speed of the laser light is accelerated to the target speed (10 mm/Sec) and maintained at the target speed. At the start of cutting, the reason why the moving speed is slow is that the formation time of the cracks is β. The light collecting position of the laser light is disposed at a position above 0 mm (opposite side of the back surface) from the surface of each chemically strengthened glass plate. The spotlight angle of the laser light is set to 8.9. . The central axis of the nozzle is disposed coaxially with the optical axis of the laser light in a manner orthogonal to the surface of each of the chemically strengthened glass sheets. The outlet of the nozzle is directly controlled to have a circular shape of 2 mm, and is disposed at a position 3 mm from the gap G (refer to Fig. 1A) between the surfaces of the respective chemically strengthened glass sheets. At a flow rate of 50 L/min, room temperature compressed air was sprayed from the outlet of the nozzle toward the surface of each chemically strengthened glass plate. The evaluation results of the cut and the cutting conditions are shown in Table 丨〇. [Table 10] Example 7-1 Example 7-2 Laser light source output (W) 37.5 200 Concentration angle (°) 8.9 8.9 Condensation position (mm) 0 0 φ (mm) 0.1 0.1 Reinforced glass C1 (MPa) 37.4 48 t(cm) 0.08 0.08 a(/cm) a(/cm)xt(cm) 0.09 0.04 0.007 0.003 Can I cut off Ο 46•46· 160223.doc
S 201245063 根據表1 0可知’化學強化玻璃板之玻璃組成並無特別限 定。 [例8 -1〜例8_2] 例8-1〜例8_2係除使雷射光傾斜地入射至化學強化玻璃 板之表面(參照圊11Α及圖11Β)以外,與例5-2同樣地使雷 射光之照射區域於化學強化玻璃板之表面上進行移動。 將評價結果與切斷條件等一併示於表丨i。 [表 11] 例8-1 例8-1 光源輸出(W) 60 60 雷射光 φ (mm) 0.1 0.1 入射角β(°) 23.0 40.0 折射角γ(°) 15.1 25.4 強化玻璃 CT(MPa) 46.7 46.7 t(cm) 0.11 0.11 a(/cm) 0.09 0.09 a(/cm) χ t(cm)/cosy 0.010 0.011 能否切斷 〇 Ο 切斷面之傾斜角 14.4 23.2 根據表11可知’藉由使雷射光傾斜地入射至化學強化玻 璃板之表面’而使切斷面相對板厚方向傾斜。又,可知切 斷面之傾斜角與雷射光之折射角大致相同。 [例9] 例9係對化學強化玻璃板疊合3片而成之積層體之能否切 斷進行分析。 I60223.doc -47- 201245063 分別將與例4-1相同組成及相同物性之玻璃 (CS=735(MPa)、DOL=51.2(pm)、CT=37.7(MPa))用於 3 片 化學強化玻璃板。 3片化學強化玻璃板(1 5 〇 mmxlOO mmxl.l mm)係利用圖 12所示之切斷方法同時地進行切斷。於各化學強化玻璃板 之側面之切斷開始位置預先利用銼刀形成初始裂痕,且於 各化學強化玻璃板之表面未形成劃線。 使用光纖雷射(中心波帶:1075〜1095 nm、光源輸出: 80 W)作為雷射光之光源。各化學強化玻璃板對雷射光之 吸收係數係使用紫外可見近紅外分光光度計Lambda 950進 行測定。 雷射光之聚光位置係配置於與積層體之上表面相距9 mm上方之位置。雷射光之聚光角係設為16〇。 與各化學強化玻璃板之上表面同一平面内的雷射光之直 徑係自上方分別為0.24 mm、0.27 mm、0.30 mm。 於與各化學強化玻璃板之上表面同一之平面内,使雷射 光之中心自切斷預定線之一端以2.5 mm/sec之恆定速度遍 佈150 mm移動至另一端❶作為移動路徑之切斷預定線係設 為與矩形之化學強化玻璃板之一邊(短邊)平行之直線狀, 且將與一邊相距之距離設為丨〇 mm。 其結果,可沿著切斷預定線,將3片化學強化玻璃板同 時切斷。未發現裂痕之自由伸展或玻璃之粉碎。 [例 10-1 〜例 10-2] 例10-1〜例10-2係對風冷強化玻璃板之能否切斷進行分 160223.docS 201245063 According to Table 10, the glass composition of the chemically strengthened glass plate is not particularly limited. [Examples 8 - 1 to 8 2] Examples 8-1 to 8 2 were irradiated with laser light in the same manner as in Example 5-2 except that the laser light was obliquely incident on the surface of the chemically strengthened glass plate (see 圊11Α and Fig. 11A). The illuminated area moves on the surface of the chemically strengthened glass sheet. The evaluation results are shown in Table i together with the cutting conditions and the like. [Table 11] Example 8-1 Example 8-1 Light source output (W) 60 60 Laser light φ (mm) 0.1 0.1 Incident angle β (°) 23.0 40.0 Refraction angle γ (°) 15.1 25.4 Reinforced glass CT (MPa) 46.7 46.7 t(cm) 0.11 0.11 a(/cm) 0.09 0.09 a(/cm) χ t(cm)/cosy 0.010 0.011 Can it be cut? The angle of inclination of the cut surface is 14.4 23.2 According to Table 11, it can be seen that 'by making The laser light is incident obliquely on the surface of the chemically strengthened glass plate, and the cut surface is inclined with respect to the thickness direction. Further, it can be seen that the inclination angle of the cut surface is substantially the same as the angle of refraction of the laser light. [Example 9] Example 9 is an analysis of whether or not the laminated body obtained by laminating three sheets of chemically strengthened glass sheets can be cut. I60223.doc -47- 201245063 Three glasses of chemically strengthened glass were used for the same composition and the same physical properties as in Example 4-1 (CS=735 (MPa), DOL=51.2 (pm), CT=37.7 (MPa)). board. Three sheets of chemically strengthened glass sheets (15 〇 mm x 100 mm x 1.1 mm) were simultaneously cut using the cutting method shown in Fig. 12. The initial crack was formed in advance by the trowel at the cutting start position of the side surface of each chemically strengthened glass plate, and no scribe line was formed on the surface of each chemically strengthened glass plate. A fiber laser (central band: 1075 to 1095 nm, light source output: 80 W) is used as a light source for laser light. The absorption coefficient of the laser for each chemically strengthened glass plate was measured using an ultraviolet visible near-infrared spectrophotometer Lambda 950. The concentrating position of the laser light is disposed at a position 9 mm above the upper surface of the laminated body. The concentration angle of the laser light is set to 16 〇. The diameter of the laser light in the same plane as the upper surface of each chemically strengthened glass plate is 0.24 mm, 0.27 mm, and 0.30 mm from the top, respectively. In the same plane as the upper surface of each chemically strengthened glass plate, the center of the laser light is moved from 150 mm to one end at a constant speed of 2.5 mm/sec from one end of the predetermined line to be cut off as a moving path. The line system is formed in a straight line parallel to one side (short side) of the rectangular chemically strengthened glass plate, and the distance from one side is set to 丨〇mm. As a result, the three sheets of chemically strengthened glass sheets can be simultaneously cut along the line to be cut. No free stretching of the crack or smashing of the glass was observed. [Example 10-1 to Example 10-2] Example 10-1 to Example 10-2 are for dividing the air-cooled tempered glass sheet by 160223.doc
S •48· 201245063 析。 藉由將混合複數種原料製備而成之玻璃原料溶解,且使 熔解之熔融玻璃成形為板狀後冷卻至室溫附近,進行切 斷、切削、雙面鏡面研磨,而製作各風冷強化玻璃板。於 冷卻之過程中,對軟化點附近之溫度之玻璃自表面及背面 進行泮冷,形成殘留壓縮應力之表面層及背面層β淬冷之 條件係以内部殘留拉伸應力(CT)達到所需值之方式進行設 各風冷強化玻璃板係以氧化物基準之質量%表示含有 Si02 : 72.4% ' Al2〇3 : 1.9% ' MgO : 3.8% ' CaO : 8.3% ' Na20 : 12.7%、K20 : 1.0%。 各風冷強化玻璃板之最大殘留拉伸應力(CM)係藉由表面 應力計FSM-6000(折原製作所製造)測定表面壓縮應力 (cs),且根據該測定值’利用以下之數式(ΙΠ)由計算求 出。 CM=CS/a 一 (ΙΠ) 於數式(III)中’ a係由玻璃之淬冷開始時之溫度、玻璃 之淬冷速度、及玻璃之厚度等決定之常數,通常為2.2〜25 之範圍内。於例10-1〜例10-2中使用2.35作為a之值。 各風冷強化玻璃板(300 mmx300 nnnx5 mm)之切斷係利 用圖1A及圖1B所示之切斷方法進行。各風冷強化玻璃板 之側面係切斷前預先經旋轉磨石研磨之面,故而,於各風 160223.doc -49- 201245063 冷強化玻璃板之側面之切斷開始位置,在切斷前並未形成 初始裂痕。又,於各風冷強化玻璃板之表面未形成劃線。 使用光纖雷射(中心波長:1070 nm)作為雷射光之光 源。各風冷強化玻璃板對雷射光之吸收係數係使用紫外可 見近紅外分光光度計Lambda 950進行測定。 雷射光之光軸係以與各風冷強化玻璃抜之表面正交之方 式配置。 雷射光之聚光位置係配置於與各風冷強化玻璃板之表面 相距25.6 mm上方(背面之相反側)之位置。雷射光之聚光 角係設為8.9°。 於與各風冷強化玻璃板之表面同一之平面内,使雷射光 之中心自切斷預定線之一端遍佈3〇〇 mm移動至另一端。作 為移動路徑之切斷預定線係設為與矩形之各風冷強化玻璃 板之一邊(短邊)平行之直線狀,且將與一邊相距之距離設 為 20 mm。 於與各風冷強化玻璃板之表面同一之平面内,雷射光之 照射區域係直徑為4 mm之圓形,且以2.5 mm/sec之恆定速 度進行移動。於各風冷強化玻璃板之表面,在雷射光之中 〜位於與切斷開始端相距丨5 mm以内之位置之期間,將雷 射光之光源輸出於例1 〇_ 1中設定為2〇〇 W,於例1 〇-2中設 定為240 W,之後設定為10〇 w。 160223.docS •48· 201245063 Analysis. The glass raw material prepared by mixing a plurality of raw materials is dissolved, and the molten glass is formed into a plate shape, and then cooled to near room temperature, and then cut, cut, and double-sided mirror-polished to prepare each air-cooled tempered glass. board. During the cooling process, the surface of the glass near the softening point is quenched from the surface and the back surface to form a surface layer of residual compressive stress and the condition of the back layer β quenching is achieved by internal residual tensile stress (CT). The value of each air-cooled tempered glass plate is based on the mass% of the oxide, which means that SiO 2 : 72.4% ' Al2 〇 3 : 1.9% ' MgO : 3.8% ' CaO : 8.3% ' Na20 : 12.7% , K20 : 1.0%. The maximum residual tensile stress (CM) of each of the air-cooled tempered glass sheets was measured by a surface stress meter FSM-6000 (manufactured by Ohara, Ltd.) to measure the surface compressive stress (cs), and the following formula was used based on the measured value (ΙΠ ) is calculated by calculation. CM=CS/a (ΙΠ) In the formula (III), the constant determined by the temperature at the start of quenching of the glass, the quenching rate of the glass, and the thickness of the glass, is usually 2.2 to 25 Within the scope. In Example 10-1 to Example 10-2, 2.35 was used as the value of a. The cutting of each of the air-cooled tempered glass sheets (300 mm x 300 nnnx 5 mm) was carried out by the cutting method shown in Figs. 1A and 1B. The side surface of each of the air-cooled tempered glass sheets is previously ground by the rotating grindstone before cutting, so that the cutting start position of the side of the cold tempered glass sheet of each wind 160223.doc -49- 201245063 is before the cutting No initial cracks were formed. Further, no scribe line was formed on the surface of each of the air-cooled tempered glass sheets. A fiber laser (central wavelength: 1070 nm) was used as the light source for the laser light. The absorption coefficient of the laser light for each of the air-cooled tempered glass sheets was measured using an ultraviolet visible near-infrared spectrophotometer Lambda 950. The optical axis of the laser light is arranged orthogonal to the surface of each of the air-cooled tempered glass crucibles. The condensing position of the laser light is disposed at a position above the surface of each of the air-cooled tempered glass sheets by 25.6 mm (the opposite side of the back surface). The concentrating angle of the laser light is set to 8.9°. In the same plane as the surface of each of the air-cooled tempered glass sheets, the center of the laser light is moved from 3 〇〇 mm to the other end from one end of the line to cut. The line to be cut as the moving path is set to be linear with one side (short side) of each of the rectangular air-tempered tempered glass sheets, and the distance from one side is set to 20 mm. In the same plane as the surface of each of the air-cooled tempered glass sheets, the irradiated area of the laser light is a circular shape having a diameter of 4 mm and moved at a constant speed of 2.5 mm/sec. On the surface of each air-cooled tempered glass sheet, the laser light source output is set to 2 in Example 1 〇 1 1 during the position of the laser light within a distance of 丨 5 mm from the start end of the cut. W, set to 240 W in Example 1 〇-2, and then set to 10 〇w. 160223.doc
S •50· 201245063 [表 12] 例 10-1 例 10-2 一 — 100 光源輸出(W) 100 雷射光 聚光角度(°) 8.9 8.9 ~~ 聚光位置(mm) 25.6 25.6 φ (mm) 4 — — 4 強化玻璃 CT(MPa) 55 81 t(cm) 0.5 _ _ 0.5 a(/cm) 0.57 0.57 a(/cm)xt(cm) --------- 0.285 0.285 ~~ 能否切斷 〇 --------L --------- 根據表12可知本發明可應用於風冷強化破璃板。 以上,對本發明之實施形態及實施例進行了說明,但本 發明並不限定於上述實施形態及上述實施例,於中請專利 範圍記載之本發明之主旨之範圍内可進行各種變形、變 更。 例如上述實施形態之圖6所示,於在強化玻璃板1〇之表 面12形成有膜1 8之情形時,亦可於藉由脈衝雷射而沿著切 斷預定線去除膜18之後進行切斷。去除膜18之方法並不限 定於使用脈衝雷射等雷射光,只要為利用機械方法者等可 去除膜者即可。 本申請案係基於2011年1月11曰向曰本專利局申請之曰 本專利特願201 1-003496號、及2〇 11年8月31日向日本專利 局申請之曰本專利特願2011-190024號主張其優先權者, 且將日本專利特願2011-003496號、及日本專利特願2〇η_ 160223.doc 201245063 190024號之所有内容引用於本國際申請案中。 【圖式簡單說明】 圖1 A係本發明第1實施形態的強化玻璃板之切斷方法之 說明圖(1)。 圖1B係本發明第1實施形態的強化玻璃板之切斷方法之 說明圖(2) 〇 圖2A係表示照射雷射光前之化學強化玻璃板之殘留應力 之分佈例之示意圖。 圓2B係表示照射雷射光前之風冷強化玻璃板之殘留應力 之分佈例之示意圖。 圖3係表示照射雷射光前之強化玻璃板之—例之剖面 圖。 圖4係表示雷射光之照射區域之真圓度之一例之說明 圖。 圖5係表示雷射光之聚光位置之一例之示意圖。 圖6係表示雷射光之光軸之一例之示意圖。 圖7係表示沿圖1B之A-A線之剖面的應力分佈例之示意 圖0 圖8係表示沿圖1B之B-B線之剖面的應力分佈例之示意 圖。 圖9係本發明第2實施形態的強化玻璃板之切斷方法之說 明圖。 圖10A係本發明第3實施形態的強化玻璃板之切斷方法之 說明圖(1)。 160223.docS •50· 201245063 [Table 12] Example 10-1 Example 10-2 I—100 Light source output (W) 100 Laser light collecting angle (°) 8.9 8.9 ~~ Spotting position (mm) 25.6 25.6 φ (mm) 4 — — 4 tempered glass CT (MPa) 55 81 t(cm) 0.5 _ _ 0.5 a(/cm) 0.57 0.57 a(/cm)xt(cm) --------- 0.285 0.285 ~~ No cut--------L --------- According to Table 12, the present invention can be applied to an air-cooled reinforced glass sheet. The embodiments and examples of the present invention have been described above, but the present invention is not limited to the above-described embodiments and the above-described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. For example, as shown in Fig. 6 of the above embodiment, when the film 18 is formed on the surface 12 of the tempered glass sheet 1 , the film 18 may be removed along the line to cut by pulse laser irradiation. Broken. The method of removing the film 18 is not limited to the use of laser light such as a pulsed laser, as long as it can be removed by a mechanical method or the like. This application is based on the patent application No. 201 1-003496, which was applied to the Patent Office on January 11, 2011, and the Japanese Patent Office on August 31, 2011. No. 190024 claims the priority of the Japanese Patent Application No. 2011-003496, and Japanese Patent Application No. 2 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is an explanatory view (1) of a method of cutting a tempered glass sheet according to a first embodiment of the present invention. Fig. 1B is a schematic view showing a method of cutting a tempered glass sheet according to a first embodiment of the present invention. Fig. 2A is a schematic view showing an example of distribution of residual stress of a chemically strengthened glass sheet before irradiation with laser light. Circle 2B is a schematic view showing an example of the distribution of residual stress of the air-cooled tempered glass sheet before the irradiation of the laser light. Fig. 3 is a cross-sectional view showing an example of a tempered glass sheet before irradiation with laser light. Fig. 4 is an explanatory view showing an example of the true roundness of the irradiation region of the laser light. Fig. 5 is a view showing an example of a condensing position of laser light. Fig. 6 is a view showing an example of an optical axis of laser light. Fig. 7 is a view showing an example of the stress distribution along the line A-A of Fig. 1B. Fig. 0 is a schematic view showing an example of the stress distribution along the line B-B of Fig. 1B. Fig. 9 is an explanatory view showing a method of cutting a tempered glass sheet according to a second embodiment of the present invention. Fig. 10A is an explanatory view (1) of a method of cutting a tempered glass sheet according to a third embodiment of the present invention. 160223.doc
S 201245063 圖10B係本發明第3實施形態的強化玻璃板之切斷方法之 說明圖(2)。 圖11A係本發明第4實施形態的強化玻璃板之切斷方法之 說明圖(1)。 圖11B係本發明第4實施形態的強化玻璃板之切斷方法之 說明圖(2) » 圖12係本發明第5實施形態的強化玻璃板之切斷方法之 說明圖。 圖13係表示例7_丨〜例7_2中之強化玻璃板之表面之切斷 預定線之圖。 【主要元件符號說明】 10 強化玻璃板 11 切斷預定線 12 表面 13 表面層 14 背面 15 背面層 17 中間層 20 雷射光 21 雷射光之光軸 22 雷射光之照射區域 30 裂痕 40 氣體 42 氣體之噴附區域 160223.doc -53- 201245063 50 喷嘴 51 喷嘴之中心軸 52 喷嘴之出口 110 積層體 112 積層體之表面 160223.doc -54- sS 201245063 Fig. 10B is an explanatory view (2) of a method of cutting a tempered glass sheet according to a third embodiment of the present invention. Fig. 11A is an explanatory view (1) of a method of cutting a tempered glass sheet according to a fourth embodiment of the present invention. Fig. 11B is a view showing a method of cutting a tempered glass sheet according to a fourth embodiment of the present invention. Fig. 12 is an explanatory view showing a method of cutting a tempered glass sheet according to a fifth embodiment of the present invention. Fig. 13 is a view showing a line cut off of the surface of the tempered glass sheet in Example 7_丨 to Example 7_2. [Main component symbol description] 10 tempered glass plate 11 cut line 12 surface 13 surface layer 14 back surface 15 back layer 17 intermediate layer 20 laser light 21 laser light axis 22 laser light irradiation area 30 crack 40 gas 42 gas Spraying area 160223.doc -53- 201245063 50 Nozzle 51 Central axis of the nozzle 52 Nozzle outlet 110 Laminated body 112 Surface of the laminated body 160223.doc -54- s
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