TW201329006A - Method for cutting toughened glass plates and device for cutting toughened glass plates - Google Patents

Method for cutting toughened glass plates and device for cutting toughened glass plates Download PDF

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Publication number
TW201329006A
TW201329006A TW101146249A TW101146249A TW201329006A TW 201329006 A TW201329006 A TW 201329006A TW 101146249 A TW101146249 A TW 101146249A TW 101146249 A TW101146249 A TW 101146249A TW 201329006 A TW201329006 A TW 201329006A
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Taiwan
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glass sheet
tempered glass
laser light
cutting
cut
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TW101146249A
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Chinese (zh)
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Isao Saito
Yasunari Iwanaga
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Asahi Glass Co Ltd
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Priority claimed from JP2011267745A external-priority patent/JP2015034095A/en
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Publication of TW201329006A publication Critical patent/TW201329006A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04Cutting or splitting in curves, especially for making spectacle lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

In a method for cutting toughened glass plates in one embodiment of the present invention, a toughened glass plate (10) provided with a front layer and a back layer that have residual compressive stresses and a middle layer that is formed between said front and back layers and has internal residual tensile stress is cut by moving a laser-light exposure region. When doing so, the amount of laser-light energy to which the toughened glass plate is exposed per unit area is increased for a section extending from before a crack-initiation location (43) to a cutting endpoint (42). The present invention makes it possible to cut a toughened glass plate using laser light without degrading the quality of the glass plate.

Description

強化玻璃板之切斷方法、及強化玻璃板切斷裝置 Method for cutting tempered glass sheet and tempered glass sheet cutting device

本發明係關於一種強化玻璃板之切斷方法及強化玻璃板切斷裝置。 The present invention relates to a method for cutting a tempered glass sheet and a tempered glass sheet cutting device.

近年來,於行動電話或PDA(Personal Digital Assistant,個人數位助理)等行動設備中,為了提高顯示器(包含觸控面板)之保護或美觀等,使用蓋玻璃(保護玻璃)之情況變多。又,作為顯示器之基板,廣泛使用玻璃基板。 In recent years, in mobile devices such as mobile phones and PDAs (Personal Digital Assistants), in order to improve the protection or aesthetics of the display (including the touch panel), the use of cover glass (protective glass) has increased. Further, as a substrate of a display, a glass substrate is widely used.

另一方面,推進行動設備之薄型化、輕量化,推進行動設備中使用之玻璃之薄板化。若玻璃變薄則強度變低,因此,為了彌補玻璃之強度不足,而開發包含殘留壓縮應力之正面層及背面層之強化玻璃。強化玻璃亦用作汽車用窗玻璃或建築用窗玻璃。 On the other hand, the thinning and weight reduction of the mobile equipment are promoted, and the thinning of the glass used in the mobile equipment is promoted. When the glass is thinned, the strength is lowered. Therefore, in order to compensate for the insufficient strength of the glass, a tempered glass including a front layer and a back layer of residual compressive stress is developed. Tempered glass is also used as window glass for automobiles or window glass for construction.

強化玻璃利用例如風冷強化法或化學強化法等而製作。風冷強化法係使軟化點左右之溫度之玻璃自正面及背面急冷,使玻璃之正面及背面與內部之間產生溫度差,藉此形成殘留壓縮應力之正面層及背面層。另一方面,化學強化法係對玻璃之正面及背面進行離子交換,將玻璃中所包含之較小之離子半徑之離子(例如Li離子、Na離子)置換成較大之離子半徑之離子(例如K離子),藉此形成殘留壓縮應力之正面層及背面層。於任一方法中,作為反作用,均於正面層與背面層之間形成殘留拉伸應力之中間層。 The tempered glass is produced by, for example, air-cooling strengthening method or chemical strengthening method. In the air-cooling strengthening method, the glass having a temperature around the softening point is rapidly cooled from the front and the back, and a temperature difference is generated between the front surface and the back surface of the glass and the inside, thereby forming a front layer and a back layer of residual compressive stress. On the other hand, the chemical strengthening method performs ion exchange on the front and back sides of the glass, and replaces ions of a smaller ionic radius (for example, Li ions, Na ions) contained in the glass with ions having a larger ionic radius (for example, K ion), thereby forming a front layer and a back layer of residual compressive stress. In either method, as a reaction, an intermediate layer of residual tensile stress is formed between the front layer and the back layer.

於製造強化玻璃之情形時,相較逐塊地對製品大小之玻 璃進行強化處理,對較製品大小更大型之玻璃進行強化處理之後,切斷而進行多倒角的做法效率更高。因此,作為切斷強化玻璃板之方法,提出有如下方法:對強化玻璃板之正面照射雷射光,使雷射光之照射區域於強化玻璃板之正面上移動,藉此切斷強化玻璃板(參照專利文獻1、專利文獻2)。 In the case of manufacturing tempered glass, the glass size of the product is compared to the block by piece. The glazing is reinforced, and it is more efficient to cut and multi-chamfer the glass after strengthening the glass larger than the larger size of the product. Therefore, as a method of cutting the tempered glass sheet, there is proposed a method of irradiating the front surface of the tempered glass sheet with laser light and moving the irradiation region of the laser light on the front surface of the tempered glass sheet, thereby cutting the tempered glass sheet (refer to Patent Document 1 and Patent Document 2).

先前技術文獻Prior technical literature 專利文獻Patent literature

專利文獻1:日本專利特開2008-247732號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2008-247732

專利文獻2:國際公開第2010/126977號 Patent Document 2: International Publication No. 2010/126977

使用雷射光切斷非強化玻璃時,使用藉由雷射光之照射而產生之熱應力使裂紋伸展。相對於此,使用雷射光切斷強化玻璃板時,使用照射有雷射光之區域中產生之壓縮應力(或小於殘留拉伸應力之拉伸應力),一面控制存在於中間層之內部殘留拉伸應力所致之裂紋之伸展一面予以切斷。因此,必需恰當地控制裂紋之伸展,一面抑制裂紋沿意料外之方向伸展一面予以切斷。若裂紋沿意料外之方向伸展,則產生切斷線脫離切斷預定線,而切斷後之強化玻璃板之品質劣化之問題。 When the non-reinforced glass is cut by laser light, the crack is stretched using thermal stress generated by irradiation of laser light. On the other hand, when the tempered glass sheet is cut by laser light, the compressive stress generated in the region irradiated with the laser light (or the tensile stress lower than the residual tensile stress) is used to control the residual stretch existing in the intermediate layer. The extension of the crack caused by the stress is cut off. Therefore, it is necessary to appropriately control the stretching of the crack while suppressing the crack from being stretched in the unexpected direction. When the crack is stretched in the unexpected direction, there is a problem that the cut line is separated from the line to cut, and the quality of the tempered glass sheet after cutting is deteriorated.

鑒於上述課題,本發明之目的在於提供一種不使品質劣化而使用雷射光切斷強化玻璃板之強化玻璃板之切斷方法及強化玻璃板切斷裝置。 In view of the above problems, an object of the present invention is to provide a method for cutting a tempered glass sheet and a tempered glass sheet cutting device which use a laser beam to cut a tempered glass sheet without deteriorating the quality.

本發明之第1態樣之強化玻璃板之切斷方法係針對包含具有殘留壓縮應力之正面層及背面層與形成於該正面層及背面層之間且具有內部殘留拉伸應力CT(MPa)之中間層的強化玻璃板,藉由使照射於該強化玻璃板之雷射光之照射區域移動而予以切斷,且將上述正面層及上述背面層之厚度設為DOL(μm),將上述強化玻璃板之厚度設為t1(μm),將上述強化玻璃板之楊氏模數設為Y(MPa)時,將由下式表現之基於上述內部殘留拉伸應力CT之每單位面積之應變能量UCT(J/m2)設為2.5 J/m2以上,朝向位於上述強化玻璃板之側面之切斷結束點以相對於上述側面成為銳角之方式切斷上述強化玻璃板時,於自距離上述強化玻璃板之上述切斷結束點特定距離跟前之特定位置直至上述切斷結束點為止之區間內,使照射於上述強化玻璃板之每單位照射面積之雷射光之照射能量大於呈直線狀切斷上述強化玻璃板時所需之每單位照射面積之雷射光之照射能量。UCT={CT2×(t1-2×DOL)}/(2×Y)。 A method of cutting a tempered glass sheet according to a first aspect of the present invention is directed to a front layer and a back layer including residual compressive stress and formed between the front layer and the back layer and having an internal residual tensile stress CT (MPa) The tempered glass sheet of the intermediate layer is cut by moving the irradiation region of the laser light irradiated on the tempered glass sheet, and the thickness of the front layer and the back layer is set to DOL (μm), and the reinforcement is performed. The thickness of the glass plate is t 1 (μm), and when the Young's modulus of the tempered glass plate is Y (MPa), the strain energy per unit area based on the internal residual tensile stress CT expressed by the following formula is expressed by the following formula U CT (J/m 2 ) is set to 2.5 J/m 2 or more, and the tempered glass sheet is cut at a cutting end point on the side surface of the tempered glass sheet so as to be acutely angled with respect to the side surface. The irradiation end energy of the laser light per unit irradiation area of the tempered glass sheet is greater than a linear shape in a section from the specific end position of the tempered glass sheet to the predetermined position before the cutting end point. The irradiation energy of the laser light per unit irradiation area required for cutting the above tempered glass sheet. U CT = {CT 2 × (t 1 - 2 × DOL)} / (2 × Y).

本發明之第2態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中將入射至上述強化玻璃板之上述雷射光之有效之輸出設為Pe(W),將上述雷射光之掃描速度設為v(mm/s),將上述強化玻璃板相對於上述雷射光之吸收係數設為α(mm-1),將上述強化玻璃板之厚度設為t2(mm),將上述強化玻璃板之線膨脹係數設為αL(K-1),將上述強化玻璃板之密度設為ρ(g/mm3),將上述強化玻璃板 之比熱設為c(J/g/K)時,將由下式表現之切斷指數K(N/mm)設為150 N/mm以下。K=Pe/v×exp(-α×t2)×(Y×αL)/(t2×ρ×c)。 A method of cutting a tempered glass sheet according to a second aspect of the present invention is the method for cutting a tempered glass sheet, wherein an effective output of the laser light incident on the tempered glass sheet is Pe (W), The scanning speed of the laser light is set to v (mm/s), the absorption coefficient of the tempered glass sheet with respect to the laser light is α (mm -1 ), and the thickness of the tempered glass sheet is t 2 (mm). The linear expansion coefficient of the tempered glass sheet is α L (K -1 ), the density of the tempered glass sheet is ρ (g/mm 3 ), and the specific heat of the tempered glass sheet is c (J). In the case of /g/K), the cutting index K (N/mm) expressed by the following formula is set to 150 N/mm or less. K = Pe / v × exp (-α × t 2 ) × (Y × α L ) / (t 2 × ρ × c).

本發明之第3態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中上述強化玻璃板與上述雷射光係將上述強化玻璃板相對於上述雷射光之吸收係數設為α(mm-1),將上述強化玻璃板之厚度設為t2(mm)時,滿足0<α×t2≦3.0之式。 A method for cutting a tempered glass sheet according to a third aspect of the present invention is the method for cutting a tempered glass sheet, wherein the tempered glass sheet and the laser light system set an absorption coefficient of the tempered glass sheet with respect to the laser light. when α (mm -1), the thickness of the tempered glass sheet to t 2 (mm), satisfying 0 <α × t 2 ≦ 3.0 the formula.

本發明之第4態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中距離上述切斷結束點特定距離跟前之上述特定位置係位於朝向上述強化玻璃板之側面產生意料外之裂紋之裂紋產生位置跟前。 A method of cutting a tempered glass sheet according to a fourth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the specific position at a predetermined distance from the end of the cutting end is located toward a side of the tempered glass sheet. The crack of the unexpected crack is generated in the same position.

本發明之第5態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中將上述雷射光之掃描位置與上述切斷結束點連結之線段與上述強化玻璃板之側面所成之角度越小,則使照射於上述強化玻璃板之每單位照射面積之雷射光之照射能量越大。 A method of cutting a tempered glass sheet according to a fifth aspect of the present invention is the method for cutting a tempered glass sheet, wherein a line segment connecting the scanning position of the laser light to the cutting end point and a side surface of the tempered glass sheet The smaller the angle formed, the larger the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet.

本發明之第6態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中藉由使上述雷射光之照射區域之移動速度變慢,而使上述每單位照射面積之雷射光之照射能量變大。 A method of cutting a tempered glass sheet according to a sixth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the unit per unit area is irradiated by slowing a moving speed of the irradiation region of the laser light. The irradiation energy of the laser light becomes large.

本發明之第7態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中藉由使上述雷射光之輸出變大,而使上述每單位照射面積之雷射光之照射能量變大。 A method of cutting a tempered glass sheet according to a seventh aspect of the present invention is the method for cutting a tempered glass sheet, wherein the irradiation of the laser light per unit irradiation area is performed by increasing the output of the laser light. The energy is getting bigger.

本發明之第8態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中藉由使上述雷射光之照射區域之面積變小,而使上述每單位照射面積之雷射光之照射能量變大。 A method of cutting a tempered glass sheet according to an eighth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the radiant per unit irradiation area is made smaller by reducing an area of the irradiation area of the laser light. The irradiation energy of the light is increased.

本發明之第9態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中隨著上述強化玻璃板之吸收係數α變大,而使上述每單位照射面積之雷射光之照射能量變小。 A method of cutting a tempered glass sheet according to a ninth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the laser light per unit irradiation area is increased as the absorption coefficient α of the tempered glass sheet becomes larger The irradiation energy becomes smaller.

本發明之第10態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中隨著上述強化玻璃板之熱膨脹係數變大,而使上述每單位照射面積之雷射光之照射能量變小。 A method for cutting a tempered glass sheet according to a tenth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the laser light per unit irradiation area is increased as the thermal expansion coefficient of the tempered glass sheet becomes larger The irradiation energy becomes small.

本發明之第11態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中隨著上述強化玻璃板之厚度變厚,而使上述每單位照射面積之雷射光之照射能量變大。 The method for cutting a tempered glass sheet according to the eleventh aspect of the present invention is the method for cutting a tempered glass sheet, wherein the irradiation of the laser light per unit irradiation area is performed as the thickness of the tempered glass sheet becomes thicker. The energy is getting bigger.

本發明之第12態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中進而使上述雷射光之照射區域之周圍冷卻。 A method of cutting a tempered glass sheet according to a twelfth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the periphery of the irradiation region of the laser light is further cooled.

本發明之第13態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中於上述強化玻璃板之正面及背面中之至少一者中使上述雷射光之照射區域之周圍冷卻。 A method for cutting a tempered glass sheet according to a thirteenth aspect of the present invention is the method for cutting a tempered glass sheet, wherein the irradiation region of the laser light is applied to at least one of a front surface and a back surface of the tempered glass sheet Cooled around.

本發明之第14態樣之強化玻璃板之切斷方法係如上述強化玻璃板之切斷方法,其中藉由自噴嘴噴出氣體而使上述雷射光之照射區域之周圍冷卻。 A method of cutting a tempered glass sheet according to a fourteenth aspect of the present invention is the method for cutting a tempered glass sheet, wherein a periphery of an irradiation region of the laser light is cooled by ejecting a gas from a nozzle.

本發明之第15態樣之強化玻璃板切斷裝置係針對包含具有殘留壓縮應力之正面層及背面層與形成於該正面層及背面層之間且具有內部殘留拉伸應力之中間層的強化玻璃板,藉由使照射於該強化玻璃板之雷射光之照射區域移動而予以切斷,其包含:玻璃保持驅動部,其保持上述強化玻璃板,並且沿特定方向移動該強化玻璃板;雷射輸出部,其輸出用以切斷上述強化玻璃板之雷射光;控制部,其基於控制程式控制上述玻璃保持驅動部及上述雷射輸出部;及控制程式生成部,其生成上述控制程式;上述控制程式生成部生成如下之控制程式:朝向位於上述強化玻璃板之側面之切斷結束點以相對於上述側面成為銳角之方式切斷上述強化玻璃板時,於自距離上述強化玻璃板之上述切斷結束點特定距離跟前之特定位置直至上述切斷結束點為止之區內,照射於上述強化玻璃板之每單位照射面積之雷射光之照射能量大於呈直線狀切斷上述強化玻璃板時所需之每單位照射面積之雷射光之照射能量。 A tempered glass sheet cutting device according to a fifteenth aspect of the present invention is directed to a reinforcing layer comprising a front layer and a back layer having residual compressive stress and an intermediate layer formed between the front layer and the back layer and having internal residual tensile stress The glass plate is cut by moving an irradiation region of the laser light irradiated to the tempered glass sheet, and includes: a glass holding driving portion that holds the tempered glass sheet and moves the tempered glass sheet in a specific direction; a radiation output unit that outputs laser light for cutting the tempered glass sheet; a control unit that controls the glass holding drive unit and the laser output unit based on a control program; and a control program generation unit that generates the control program; The control program generation unit generates a control program for cutting the tempered glass sheet from a distance from the tempered glass sheet when the tempered glass sheet is cut toward the end of the cutting at the side surface of the tempered glass sheet at an acute angle with respect to the side surface Cutting the end point at a specific distance from the specific position up to the end point of the cutting end, and irradiating the above The laser beam irradiated per unit area of the irradiation energy is greater than the glass plate was irradiated with an energy per unit area of laser light irradiation of the time required for cutting the linearly strengthened glass sheet.

利用本發明,可提供一種不使品質劣化而使用雷射光切斷強化玻璃板之強化玻璃板之切斷方法及強化玻璃板切斷裝置。 According to the present invention, it is possible to provide a method for cutting a tempered glass sheet and a tempered glass sheet cutting device which use a laser beam to cut the tempered glass sheet without deteriorating the quality.

以下,參照圖式對應用本發明之具體之實施形態進行詳細說明。然而,本發明並不限定於以下之實施形態。又,為了使說明明確,而適當簡化以下之記載及圖式。 Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. Further, in order to clarify the description, the following description and drawings are appropriately simplified.

<強化玻璃板之構造及切斷方法之概要> <Overview of the structure and cutting method of the tempered glass sheet>

首先,參照圖1~5,對強化玻璃板之構造及強化玻璃板之切斷方法之概要進行說明。 First, an outline of a structure of a tempered glass sheet and a method of cutting a tempered glass sheet will be described with reference to Figs. 1 to 5 .

首先,參照圖1、2,對強化玻璃板之構造進行說明。圖1係照射雷射光之前之強化玻璃板10之剖面圖。於圖1中,箭頭之方向表示殘留應力之作用方向,箭頭之大小表示應力之大小。如圖1所示,強化玻璃板10包含正面層13及背面層15以及設置於正面層13與背面層15之間之中間層17。 於正面層13及背面層15,利用下述風冷強化法或化學強化法而殘留有壓縮應力。又,作為其反作用,於中間層17殘留有拉伸應力。 First, the structure of the tempered glass sheet will be described with reference to Figs. Figure 1 is a cross-sectional view of a strengthened glass sheet 10 prior to exposure to laser light. In Fig. 1, the direction of the arrow indicates the direction of action of the residual stress, and the size of the arrow indicates the magnitude of the stress. As shown in FIG. 1, the tempered glass sheet 10 includes a front layer 13 and a back layer 15, and an intermediate layer 17 disposed between the front layer 13 and the back layer 15. The front layer 13 and the back layer 15 are subjected to compressive stress by the following air-cooling strengthening method or chemical strengthening method. Further, as a reaction, tensile stress remains in the intermediate layer 17.

強化玻璃板10係利用例如風冷強化法或化學強化法等而製作。強化用之玻璃之種類係根據用途而選擇。例如,於汽車用窗玻璃或建築用窗玻璃、PDP(Plasma Display Panel,電漿顯示面板)用之玻璃基板、蓋玻璃之情形時,作為強化用之玻璃,使用鹼鋁矽酸鹽玻璃或鈉鈣玻璃。 The tempered glass sheet 10 is produced by, for example, an air cooling strengthening method or a chemical strengthening method. The type of glass used for reinforcement is selected according to the use. For example, in the case of a window glass for a car, a window glass for a building, a glass substrate for a PDP (Plasma Display Panel), or a cover glass, an alkali aluminosilicate glass or sodium is used as a glass for reinforcement. Calcium glass.

風冷強化法係使軟化點左右之溫度之玻璃自正面及背面急冷,使玻璃之正面及背面與內部之間產生溫度差,藉此形成殘留壓縮應力之正面層及背面層。風冷強化法適於使較厚之玻璃強化。 In the air-cooling strengthening method, the glass having a temperature around the softening point is rapidly cooled from the front and the back, and a temperature difference is generated between the front surface and the back surface of the glass and the inside, thereby forming a front layer and a back layer of residual compressive stress. The air-cooled strengthening method is suitable for strengthening thicker glass.

化學強化法係對玻璃之正面及背面進行離子交換,將玻璃中所包含之較小之離子半徑之離子(例如Li離子、Na離子)置換成較大之離子半徑之離子(例如K離子),藉此形成殘留壓縮應力之正面層及背面層。化學強化法適於使鹼鋁 矽酸鹽玻璃或鈉鈣玻璃強化。 The chemical strengthening method ion-exchanges the front and back sides of the glass, and replaces ions of a smaller ionic radius (such as Li ions and Na ions) contained in the glass with ions of a larger ionic radius (for example, K ions). Thereby, the front layer and the back layer of residual compressive stress are formed. Chemical strengthening method is suitable for alkali aluminum Indole glass or soda lime glass fortification.

圖2係表示照射雷射光之前之強化玻璃板之殘留應力之分佈之模式圖。 Fig. 2 is a schematic view showing the distribution of residual stress of the strengthened glass sheet before the irradiation of the laser light.

如圖2所示,殘留於正面層13及背面層15之壓縮應力(>0)有自強化玻璃板10之正面12及背面14朝向內部逐漸變小之傾向。又,殘留於中間層17之拉伸應力(>0)有自玻璃之內部朝向正面12及背面14逐漸變小之傾向。 As shown in FIG. 2, the compressive stress (>0) remaining in the front layer 13 and the back layer 15 tends to gradually decrease toward the inside from the front surface 12 and the back surface 14 of the tempered glass sheet 10. Further, the tensile stress (>0) remaining in the intermediate layer 17 tends to gradually decrease from the inside of the glass toward the front surface 12 and the back surface 14.

於圖2中,CS表示正面層13或背面層15中之最大殘留壓縮應力(表面壓縮應力)(>0),CT表示中間層17中之內部殘留拉伸應力(中間層17之殘留拉伸應力之平均值)(>0),DOL表示正面層13及背面層15之厚度,t表示強化玻璃板10之厚度。因此,中間層17之厚度成為t-2×DOL。 In Fig. 2, CS indicates the maximum residual compressive stress (surface compressive stress) (>0) in the front layer 13 or the back layer 15, and CT indicates the internal residual tensile stress in the intermediate layer 17 (residual tensile of the intermediate layer 17) The average value of the stress (>0), DOL indicates the thickness of the front layer 13 and the back layer 15, and t indicates the thickness of the tempered glass sheet 10. Therefore, the thickness of the intermediate layer 17 becomes t-2 × DOL.

又,強化玻璃板之內部殘留拉伸應力CT(MPa)係通常,測定表面壓縮應力CS(MPa)及正面層13及背面層15之厚度DOL(μm),利用其測定值與強化玻璃板之厚度t1(μm)使用以下之式1而算出。 Further, the internal residual tensile stress CT (MPa) of the tempered glass sheet is generally measured for the surface compressive stress CS (MPa) and the thickness DOL (μm) of the front layer 13 and the back layer 15, and the measured value and the tempered glass sheet are used. The thickness t 1 (μm) was calculated using the following formula 1.

CT=(CS×DOL)/(t1-2×DOL)...式1 CT=(CS×DOL)/(t 1 -2×DOL)...Form 1

而且,基於內部殘留拉伸應力CT之每單位面積之應變能量(以下,簡稱為「內部應變能量」)UCT(J/m2)可使用強化玻璃板之楊氏模數Y(MPa)根據以下之式2而求得。 Further, the strain energy per unit area of the internal residual tensile stress CT (hereinafter, simply referred to as "internal strain energy") U CT (J/m 2 ) can be determined by using the Young's modulus Y (MPa) of the tempered glass sheet. It is obtained by the following formula 2.

UCT={CT2×(t1-2×DOL)}/(2×Y)...式2 U CT ={CT 2 ×(t 1 -2×DOL)}/(2×Y)...Form 2

發明者對具有多種內部應變能量UCT之強化玻璃板調查切斷所需之雷射光之照射能量E之最小值(以下稱為臨界照射能量)Ec。其結果,發現如下情況:若設為強化玻璃板 之內部應變能量UCT<2.5 J/m2,則即便切斷條件相同,臨界照射能量Ec亦急遽(具體而言,數倍左右)上升,並且切斷精度亦變差。同時,發明者發現如下情況:若設為強化玻璃板之內部應變能量UCT≧2.5 J/m2,則只要強化玻璃板之材質、厚度及雷射波長相同,臨界照射能量Ec便大致成為固定值,切斷精度亦提高。即,發明者發現如下情況:於切斷強化玻璃板之情形時,藉由設為內部應變能量UCT≧2.5 J/m2,內部殘留拉伸應力所致之裂紋伸展占主導地位,而可以較小之照射能量精度佳地切斷。 The inventors investigated the minimum value (hereinafter referred to as critical irradiation energy) Ec of the irradiation energy E of the laser light required for cutting the tempered glass sheet having various internal strain energies U CT . As a result, it has been found that when the internal strain energy U CT <2.5 J/m 2 of the tempered glass sheet is used, the critical irradiation energy Ec is rapidly increased (specifically, several times) even if the cutting conditions are the same. And the cutting accuracy is also deteriorated. At the same time, the inventors have found that if the internal strain energy U CT ≧2.5 J/m 2 of the tempered glass sheet is used, the critical irradiation energy Ec is substantially fixed as long as the material, thickness and laser wavelength of the tempered glass sheet are the same. The value and cutting accuracy are also improved. That is, the inventors have found that when the tempered glass sheet is cut, by setting the internal strain energy U CT ≧2.5 J/m 2 , the crack extension due to the internal residual tensile stress predominates, and The smaller irradiation energy is cut off with high precision.

即,認為於內部應變能量UCT=2.5 J/m2附近產生切斷模式之轉換。具體而言,作為用以切斷強化玻璃板之裂紋伸展能量,於內部應變能量UCT<2.5 J/m2之情形時,除內部應變能量以外,亦需要雷射光之照射能量,於內部應變能量UCT≧2.5 J/m2之情形時,僅成為內部應變能量。而且,於UCT≧2.5 J/m2之情形時,不是為了使裂紋進展,相反地為了抑制並控制裂紋之伸展,而需要雷射光之照射能量。 That is, it is considered that the switching of the cut mode occurs in the vicinity of the internal strain energy U CT = 2.5 J/m 2 . Specifically, as the crack extension energy for cutting the tempered glass sheet, in the case of the internal strain energy U CT <2.5 J/m 2 , in addition to the internal strain energy, the irradiation energy of the laser light is required, and the internal strain is required. When the energy U CT ≧ 2.5 J/m 2 , it only becomes the internal strain energy. Further, in the case of U CT ≧ 2.5 J/m 2 , it is not intended to cause the crack to progress, but conversely, in order to suppress and control the stretching of the crack, the irradiation energy of the laser light is required.

此處,最大殘留壓縮應力CS或內部殘留拉伸應力CT、正面層13及背面層15之厚度DOL可利用強化處理條件而進行調節。例如,最大殘留壓縮應力CS或內部殘留拉伸應力CT、正面層13及背面層15之厚度DOL係於風冷強化法之情形時,可利用玻璃之冷卻速度等而進行調節。又,最大殘留壓縮應力CS、內部殘留拉伸應力CT、正面層13及背面層15之厚度DOL係於化學強化法之情形時,由於將玻璃浸漬於處理液(例如KNO3熔鹽)中而進行離子交換,故可利用 處理液之濃度或溫度、浸漬時間等而進行調節。再者,本實施形態之正面層13及背面層15具有相同厚度DOL及最大殘留壓縮應力CS,但亦可具有不同之厚度或最大殘留壓縮應力。 Here, the maximum residual compressive stress CS or the internal residual tensile stress CT, the thickness of the front layer 13 and the back layer 15 DOL can be adjusted by the tempering treatment conditions. For example, when the maximum residual compressive stress CS or the internal residual tensile stress CT, and the thickness DOL of the front layer 13 and the back layer 15 are in the case of the air-cooling strengthening method, the cooling rate of the glass or the like can be adjusted. Further, when the maximum residual compressive stress CS, the internal residual tensile stress CT, and the thickness DOL of the front layer 13 and the back surface layer 15 are in the case of the chemical strengthening method, the glass is immersed in the treatment liquid (for example, KNO 3 molten salt). Since ion exchange is performed, it can be adjusted by the concentration or temperature of the treatment liquid, the immersion time, and the like. Further, the front layer 13 and the back layer 15 of the present embodiment have the same thickness DOL and maximum residual compressive stress CS, but may have different thicknesses or maximum residual compressive stresses.

圖3係用以說明強化玻璃板之切斷方法之圖。如圖3所示,對強化玻璃板10之正面12照射雷射光20,使雷射光20之照射區域22於強化玻璃板10之正面12上移動(掃描),藉此對強化玻璃板10施加應力,而切斷強化玻璃板10。 Fig. 3 is a view for explaining a cutting method of a tempered glass sheet. As shown in FIG. 3, the front surface 12 of the tempered glass sheet 10 is irradiated with the laser light 20, and the irradiation region 22 of the laser light 20 is moved (scanned) on the front surface 12 of the tempered glass sheet 10, thereby applying stress to the tempered glass sheet 10. And the tempered glass sheet 10 is cut.

於強化玻璃板10之端部,於切斷開始位置預先形成有初期裂紋。初期裂紋之形成方法為一般之方法即可,利用例如切割器或銼刀、雷射而形成。再者,對於使用雷射光之內部加熱切斷,無需於強化玻璃板10之正面12形成沿著切斷預定線之劃線(槽線)。 At the end portion of the tempered glass sheet 10, initial cracks are formed in advance at the cutting start position. The method of forming the initial crack may be a general method, and it may be formed by, for example, a cutter, a file, or a laser. Further, for the internal heating cutting using the laser light, it is not necessary to form a scribe line (groove line) along the line to cut along the front surface 12 of the tempered glass sheet 10.

於強化玻璃板10之正面12上,雷射光20之照射區域22係自強化玻璃板10之端部朝向內側,沿著切斷預定線呈直線狀或曲線狀移動。藉此,使裂紋30自強化玻璃板10之端部朝向內側伸展,而切斷強化玻璃板10。 On the front surface 12 of the tempered glass sheet 10, the irradiation region 22 of the laser light 20 is moved linearly or in a curved shape along the line to cut from the end portion of the tempered glass sheet 10 toward the inside. Thereby, the crack 30 is extended from the end of the tempered glass sheet 10 toward the inside, and the tempered glass sheet 10 is cut.

為了使雷射光20之照射區域22於強化玻璃板10之正面12上移動,既可使支撐強化玻璃板10之保持器移動或旋轉,亦可使雷射光20之光源移動。又,亦可使設置於雷射光20之路徑之中途之鏡旋轉。 In order to move the irradiation region 22 of the laser light 20 on the front surface 12 of the tempered glass sheet 10, the holder supporting the tempered glass sheet 10 can be moved or rotated, and the light source of the laser light 20 can be moved. Further, the mirror provided in the middle of the path of the laser light 20 can be rotated.

於強化玻璃板10之正面12上,雷射光20之照射區域22係以與強化玻璃板10之厚度或最大殘留壓縮應力CS、內部殘留拉伸應力CT、正面層13或背面層15之厚度DOL、雷射光 20之光源之輸出等相應之速度移動。 On the front side 12 of the tempered glass sheet 10, the irradiated area 22 of the laser light 20 is the thickness or maximum residual compressive stress CS of the strengthened glass sheet 10, the internal residual tensile stress CT, the thickness of the front layer 13 or the back layer 15 DOL. ,laser The output of the light source of 20 moves at a corresponding speed.

作為雷射光20之光源,並無特別限定,列舉例如UV(Ultraviolet,紫外線)雷射(波長:355 nm)、綠光雷射(波長:532 nm)、半導體雷射(波長:808 nm、940 nm、975 nm)、纖維雷射(波長:1060~1100 nm)、YAG(Yttrium Aluminum Garnet,釔鋁石榴石)雷射(波長:1064 nm、2080 nm、2940 nm)、使用中紅外光參數振盪器之雷射(波長:2600~3450 nm)等。雷射光20之振盪方式並無限制,可使用使雷射光連續振盪之CW(Continuous Wave,連續波)雷射、使雷射光斷續振盪之脈衝雷射之任一個。又,雷射光20之強度分佈並無限制,既可為高斯型,亦可為頂帽型。 The light source of the laser light 20 is not particularly limited, and examples thereof include UV (ultraviolet) laser (wavelength: 355 nm), green laser (wavelength: 532 nm), and semiconductor laser (wavelength: 808 nm, 940). Nm, 975 nm), fiber laser (wavelength: 1060~1100 nm), YAG (Yttrium Aluminum Garnet) laser (wavelength: 1064 nm, 2080 nm, 2940 nm), oscillating with mid-infrared light parameters Laser (wavelength: 2600 ~ 3450 nm) and so on. The oscillation mode of the laser light 20 is not limited, and any of a CW (Continuous Wave) laser that continuously oscillates laser light and a pulsed laser that intermittently oscillates the laser light can be used. Further, the intensity distribution of the laser light 20 is not limited, and may be either a Gaussian type or a top hat type.

自光源射出之雷射光20係於聚光透鏡等聚光,成像於強化玻璃板10之正面12。雷射光20之聚光位置係以強化玻璃板10之正面12為基準時,既可為雷射光源側,亦可為背面14側。又,若為加熱溫度不過度變高即可保持徐冷點以下之聚光面積,則雷射光20之聚光位置亦可在強化玻璃板10中。 The laser light 20 emitted from the light source is collected by a collecting lens or the like and imaged on the front surface 12 of the tempered glass sheet 10. When the condensing position of the laser light 20 is based on the front surface 12 of the tempered glass sheet 10, it may be either the laser light source side or the back surface 14 side. Further, if the condensing area below the freezing point is maintained so that the heating temperature is not excessively high, the condensing position of the laser light 20 may be in the tempered glass sheet 10.

雷射光20之光軸係於強化玻璃板10之正面12中,例如如圖3所示,既可與正面12正交,亦可與正面12斜交。 The optical axis of the laser light 20 is attached to the front side 12 of the tempered glass sheet 10. For example, as shown in FIG. 3, it may be orthogonal to the front surface 12 or may be oblique to the front surface 12.

將強化玻璃板10相對於雷射光20之吸收係數設為α(mm-1),將強化玻璃板10之厚度設為t2(mm),而強化玻璃板10與雷射光20滿足0<α×t2≦3.0之式之情形時,不僅利用雷射光20之作用,亦可利用中間層17之殘留拉伸應力所致之裂紋之 伸展而切斷強化玻璃板10。即,於上述條件下,以徐冷點以下之溫度加熱雷射光20之照射區域22中之中間層17,藉此可利用中間層17之殘留拉伸應力控制產生於強化玻璃板10之裂紋30之伸展,而藉由殘留拉伸應力所致之裂紋30切斷強化玻璃板10。再者,以徐冷點以下之溫度加熱中間層17之原因在於:若超過徐冷點而進行加熱,則於雷射光通過之短時間內玻璃亦成為高溫而成為容易產生黏性流動之狀態,從而因該黏性流動而藉由雷射光所產生之壓縮應力被緩和。再者,強化玻璃板10之厚度(板厚)t之值t2(mm)係與式1、2中之值t1(μm)僅單位不同。 The absorption coefficient of the strengthened glass plate 10 with respect to the laser light 20 is set to α (mm -1 ), the thickness of the strengthened glass plate 10 is set to t 2 (mm), and the strengthened glass plate 10 and the laser light 20 satisfy 0 < α × t 2 when the formula of 3.0 ≦ case, the only action by a laser light 20, the intermediate layer 17 can take advantage of a tensile residual tensile stress induced cracking of the strengthened glass sheet 10 is cut. That is, under the above conditions, the intermediate layer 17 in the irradiation region 22 of the laser light 20 is heated at a temperature lower than the freezing point, whereby the crack generated in the tempered glass sheet 10 can be controlled by the residual tensile stress of the intermediate layer 17 The stretching is performed, and the tempered glass sheet 10 is cut by the crack 30 caused by the residual tensile stress. In addition, the reason why the intermediate layer 17 is heated at a temperature lower than the cold point is that if the heating is performed beyond the cold spot, the glass becomes high in a short period of time during which the laser light passes, and the viscous flow is likely to occur. Therefore, the compressive stress generated by the laser light due to the viscous flow is alleviated. Further, the value t 2 (mm) of the thickness (plate thickness) t of the tempered glass sheet 10 is different from the value t 1 (μm) in the formulas 1 and 2.

若將入射至強化玻璃板10之前之雷射光20之強度設為I0,將於強化玻璃板10中僅移動距離L(mm)時之雷射光20之強度設為I,則根據朗伯-比爾定律之法則下式成立。 If the laser is incident to strengthen the glass plate 10 before the intensity of the light 20 is set to I 0, it will increase the strength of the glass sheet 10 moves only the laser when the distance L (mm) of the light 20 is set to I, according to the Lambert - The law of Beer's law is established as follows.

I=I0×exp(-α×L) I=I 0 ×exp(-α×L)

藉由將α×t2設為大於0且3.0以下,雷射光20於強化玻璃板10之正面未被吸收而到達至內部為止,因此,可充分加熱強化玻璃板10之內部。其結果,強化玻璃板10中產生之應力係自圖1所示之狀態變化成圖4或圖5所示之狀態。 By setting α × t 2 to be larger than 0 and 3.0 or less, the laser light 20 is absorbed to the front surface of the tempered glass sheet 10 and reaches the inside, so that the inside of the tempered glass sheet 10 can be sufficiently heated. As a result, the stress generated in the tempered glass sheet 10 changes from the state shown in Fig. 1 to the state shown in Fig. 4 or Fig. 5.

圖4係沿著圖3之A-A線之剖面圖,為包含雷射光之照射區域之剖面圖。圖5係沿著圖3之B-B線之剖面圖,為圖4所示之剖面之後方之剖面。此處,所謂「後方」,係指雷射光20之掃描方向後方。於圖4及圖5中,箭頭之方向表示應力之作用方向,箭頭之長度表示應力之大小。 Figure 4 is a cross-sectional view taken along line A-A of Figure 3, which is a cross-sectional view of an irradiation area including laser light. Fig. 5 is a cross-sectional view taken along line B-B of Fig. 3, and is a cross section taken along the line of Fig. 4; Here, the term "rear" refers to the rear of the scanning direction of the laser light 20. In FIGS. 4 and 5, the direction of the arrow indicates the direction in which the stress acts, and the length of the arrow indicates the magnitude of the stress.

於雷射光20之照射區域22中之中間層17中,由於雷射光 20之強度十分高,故溫度高於周邊,產生較圖1及圖2所示之殘留拉伸應力小之拉伸應力或壓縮應力。於產生較殘留拉伸應力小之拉伸應力或壓縮應力之部分,裂紋30之伸展被抑制。為了確實地防止裂紋30之伸展,較佳為如圖4所示,產生壓縮應力。 In the intermediate layer 17 in the illumination area 22 of the laser light 20, due to the laser light The strength of 20 is very high, so the temperature is higher than the periphery, resulting in tensile stress or compressive stress which is smaller than the residual tensile stress shown in Figs. 1 and 2. The extension of the crack 30 is suppressed in the portion where the tensile stress or the compressive stress which is smaller than the residual tensile stress is generated. In order to surely prevent the extension of the crack 30, it is preferable to generate a compressive stress as shown in FIG.

再者,如圖4所示,於雷射光20之照射區域22中之正面層13或背面層15中,產生較圖1及圖2所示之殘留壓縮應力大之壓縮應力,從而裂紋30之伸展被抑制。 Furthermore, as shown in FIG. 4, in the front layer 13 or the back layer 15 in the irradiation region 22 of the laser light 20, a compressive stress larger than the residual compressive stress shown in FIGS. 1 and 2 is generated, so that the crack 30 Stretching is suppressed.

為了與圖4所示之壓縮應力之均衡,於圖4所示之剖面之後方之剖面,如圖5所示,於中間層17產生拉伸應力。該拉伸應力大於殘留拉伸應力,於拉伸應力達到特定值之部分形成裂紋30。裂紋30係自強化玻璃板10之正面12貫穿至背面14為止,圖3所示之切斷係所謂全切式切斷。 In order to balance with the compressive stress shown in FIG. 4, the cross section behind the cross section shown in FIG. 4, as shown in FIG. 5, generates tensile stress in the intermediate layer 17. The tensile stress is greater than the residual tensile stress, and the crack 30 is formed in a portion where the tensile stress reaches a specific value. The crack 30 is formed from the front surface 12 of the tempered glass sheet 10 to the back surface 14, and the cutting shown in Fig. 3 is a so-called full cut type.

於該狀態下,若使雷射光20之照射區域22移動,則裂紋30之前端位置以追隨照射區域22之位置之方式移動。即,於圖3所示之切斷方法中,當切斷強化玻璃板10時,藉由雷射光之掃描方向後方產生之拉伸應力(參照圖5)而控制裂紋30之伸展方向,使用照射有雷射光之區域中所產生之壓縮應力(參照圖4),一面抑制裂紋30之伸展一面予以切斷。即,使用藉由雷射光20之照射而產生之壓縮應力控制裂紋30之伸展。其結果,可抑制裂紋30脫離切斷預定線而自由擴散。 In this state, when the irradiation region 22 of the laser light 20 is moved, the position of the front end of the crack 30 moves so as to follow the position of the irradiation region 22. That is, in the cutting method shown in FIG. 3, when the tempered glass sheet 10 is cut, the stretching direction of the crack 30 is controlled by the tensile stress generated in the scanning direction of the laser light (see FIG. 5), and the irradiation is used. The compressive stress generated in the region having the laser light (see Fig. 4) is cut while suppressing the extension of the crack 30. That is, the stretching of the crack 30 is controlled using the compressive stress generated by the irradiation of the laser light 20. As a result, it is possible to suppress the crack 30 from being freely diffused from the line to cut.

玻璃根據用途而要求較高之透明度,因此,於使用雷射波長接近於可見光之波長區域之情形時,α×t2越是接近於 0則越佳。然而,若α×t2過小,則吸收效率變差,因此,較佳為0.0005以上(雷射光吸收率0.05%以上),更佳為0.002以上(雷射光吸收率0.2%以上),進而較佳為0.004以上(雷射光吸收率0.4%以上)。 The glass requires a high transparency depending on the use. Therefore, when the wavelength of the laser is close to the wavelength region of visible light, the closer α × t 2 is to 0, the better. However, if α × t 2 is too small, the absorption efficiency is deteriorated. Therefore, it is preferably 0.0005 or more (the laser light absorption rate is 0.05% or more), more preferably 0.002 or more (the laser light absorption rate is 0.2% or more), and further preferably. It is 0.004 or more (the laser light absorption rate is 0.4% or more).

由於玻璃根據用途反而要求較低之透明度,故於使用雷射波長接近於可見光之波長區域之情形時,α×t2越大則越佳。然而,若α×t2過大,則雷射光之表面吸收變大,從而無法控制裂紋伸展。因此,α×t2較佳為3.0以下(雷射光吸收率95%以下),更佳為0.1以下(雷射光吸收率10%以下),進而較佳為0.02以下(雷射光吸收率2%以下)。 Since glass requires a lower transparency depending on the application, when the wavelength of the laser is close to the wavelength region of visible light, the larger α × t 2 is, the better. However, if α × t 2 is too large, the surface absorption of the laser light becomes large, and the crack extension cannot be controlled. Therefore, α × t 2 is preferably 3.0 or less (the laser light absorption rate is 95% or less), more preferably 0.1 or less (the laser light absorption rate is 10% or less), further preferably 0.02 or less (the laser light absorption rate is 2% or less). ).

強化玻璃板10之厚度t2(mm)根據用途而設定,較佳為0.1~2.0 mm。於化學強化玻璃之情形時,藉由將厚度t2(mm)設為2.0 mm以下,可充分提高內部殘留拉伸應力CT。另一方面,若厚度t2(mm)未達0.1 mm,則難以對玻璃實施化學強化處理。厚度t2(mm)更佳為0.3~1.5 mm,進而較佳為0.5~1.5 mm。 The thickness t 2 (mm) of the tempered glass sheet 10 is set depending on the application, and is preferably 0.1 to 2.0 mm. In the case of chemically strengthened glass, the internal residual tensile stress CT can be sufficiently increased by setting the thickness t 2 (mm) to 2.0 mm or less. On the other hand, if the thickness t 2 (mm) is less than 0.1 mm, it is difficult to perform chemical strengthening treatment on the glass. The thickness t 2 (mm) is more preferably 0.3 to 1.5 mm, and further preferably 0.5 to 1.5 mm.

吸收係數α由雷射光20之波長、強化玻璃板10之玻璃組成等規定。 The absorption coefficient α is defined by the wavelength of the laser light 20, the glass composition of the tempered glass sheet 10, and the like.

例如1000 nm左右之近紅外線波長區域中之吸收係數α係強化玻璃板10中之氧化鐵(包含FeO、Fe2O3、Fe3O4)之含量、氧化鈷(包含CoO、Co2O3、Co3O4)之含量、氧化銅(包含CuO、Cu2O)之含量越多則越大。即,藉由調節氧化鐵等之含量,可將α×t2之值調節於所期望之範圍。強化玻璃板10中之氧化鐵之含量取決於構成強化玻璃板10之玻璃之 種類,於鈉鈣玻璃之情形時,為例如0.02~1.0質量%。然而,氧化鐵等之含量越多,則強化玻璃板10之可見光區域之透明度降低。 For example, the absorption coefficient α in the near-infrared wavelength region of about 1000 nm is the content of iron oxide (including FeO, Fe 2 O 3 , Fe 3 O 4 ) in the strengthened glass plate 10, and cobalt oxide (including CoO, Co 2 O 3 ). The content of Co 3 O 4 ) and the content of copper oxide (including CuO and Cu 2 O) increase as the content increases. That is, by adjusting the content of iron oxide or the like, the value of α × t 2 can be adjusted to a desired range. The content of the iron oxide in the tempered glass sheet 10 depends on the type of the glass constituting the tempered glass sheet 10, and is, for example, 0.02 to 1.0% by mass in the case of soda lime glass. However, the more the content of iron oxide or the like, the lower the transparency of the visible light region of the tempered glass sheet 10.

1000 nm左右之近紅外線波長區域中之吸收係數(α)根據用途而設定。例如,於汽車用窗玻璃之情形時,吸收係數(α)較佳為0.3 mm-1以下。又,於建築用窗玻璃之情形時,吸收係數(α)較佳為0.06 mm-1以下。又,於顯示器用玻璃之情形時,吸收係數(α)較佳為0.02 mm-1以下。 The absorption coefficient (α) in the near-infrared wavelength region of about 1000 nm is set according to the use. For example, in the case of a window glass for automobiles, the absorption coefficient (α) is preferably 0.3 mm -1 or less. Further, in the case of a glazing for construction, the absorption coefficient (α) is preferably 0.06 mm -1 or less. Further, in the case of glass for a display, the absorption coefficient (α) is preferably 0.02 mm -1 or less.

又,稀土類原子之吸收波長附近之吸收係數α係強化玻璃板10中之稀土類元素(例如Yb)之氧化物之含量越多則越大。 Further, the absorption coefficient α in the vicinity of the absorption wavelength of the rare earth atom increases as the content of the oxide of the rare earth element (for example, Yb) in the tempered glass sheet 10 increases.

進而,3000 nm左右之中紅外線波長區域中之吸收係數α係強化玻璃板10中之OH基之含量越多則越大。此處,OH基之含量不對可見光區域之透明度帶來影響。 Further, the absorption coefficient α in the mid-infrared wavelength region of about 3000 nm is larger as the content of the OH group in the tempered glass sheet 10 increases. Here, the content of the OH group does not affect the transparency of the visible light region.

雷射光20之波長為250~5000 nm即可,較佳為設為2500~3500 nm。於雷射光20之波長為2500~3500 nm(3000 nm左右)之情形時,如上所述,可不使可見光區域之透明度降低而提高吸收係數α。其結果,可提高雷射光20之加熱效率。雷射光20之波長進而較佳為設為2700~3200 nm。 The wavelength of the laser light 20 may be 250 to 5000 nm, preferably 2500 to 3500 nm. In the case where the wavelength of the laser light 20 is 2500 to 3500 nm (about 3000 nm), as described above, the absorption coefficient α can be increased without lowering the transparency of the visible light region. As a result, the heating efficiency of the laser light 20 can be improved. The wavelength of the laser light 20 is further preferably set to 2700 to 3200 nm.

例如於雷射光之波長為1000 nm左右之情形時,氧化鐵含量0.04質量%之強化玻璃板之吸收率係於板厚t2(mm)為1 mm之情形時,約為2%(透過率:約98%)。因此,雷射光之照射之加熱效率較差。又,由於吸收率根據Fe濃度而發生變化,故必需根據強化玻璃板之組成而大幅度變更雷射光 之照射條件。 For example, when the wavelength of the laser light is about 1000 nm, the absorption rate of the tempered glass sheet having an iron oxide content of 0.04% by mass is about 2% when the thickness t 2 (mm) is 1 mm (transmission ratio). : About 98%). Therefore, the heating efficiency of the irradiation of the laser light is inferior. Further, since the absorption rate changes depending on the Fe concentration, it is necessary to largely change the irradiation conditions of the laser light in accordance with the composition of the tempered glass sheet.

相對於此,例如於雷射光之波長為3000 nm左右之情形時,不論氧化鐵含量為多少而強化玻璃板之吸收率係於板厚為1 mm之情形時,均為約50%(透過率:約50%)。因此,與波長為1000 nm左右之情形相比,加熱效率提高,並且無需根據強化玻璃板之組成而大幅度變更雷射光之照射條件。 On the other hand, for example, when the wavelength of the laser light is about 3000 nm, the absorption rate of the tempered glass sheet is about 50% regardless of the content of the iron oxide, and is about 50% (transmission ratio). : About 50%). Therefore, the heating efficiency is improved as compared with the case where the wavelength is about 1000 nm, and it is not necessary to largely change the irradiation conditions of the laser light depending on the composition of the tempered glass sheet.

又,於波長為1000 nm左右且吸收率約為2%之情形時,例如若切斷需要2 W之吸收功率,則投入100 W,而98 W透過。因此,若台板位於雷射光通過之切斷預定線下,則台板因雷射光而受損。因此,必需設計使台板較自強化玻璃板切出之強化玻璃面板小一圈等。又,亦必需對透過之雷射光進行處理。進而,由於透過率較高,故有強化玻璃板之端面中之反射光帶來不良影響之情形。又,若因附著於正面或背面之異物而雷射光之吸收率提高,則有吸收量之變化較大,而帶來不良影響之情形。進而,於吸收率因Fe濃度而自2%向1%僅變化1%之情形時,亦必需將投入之功率自100 W向200 W而變更100 W。 Further, when the wavelength is about 1000 nm and the absorption rate is about 2%, for example, if the absorption power of 2 W is required for the cutting, 100 W is applied and 98 W is transmitted. Therefore, if the platen is placed under the cutting line through which the laser light passes, the platen is damaged by the laser light. Therefore, it is necessary to design a small lap of the tempered glass panel which is cut out from the tempered glass sheet. Also, it is necessary to process the transmitted laser light. Further, since the transmittance is high, there is a case where the reflected light in the end surface of the tempered glass sheet adversely affects. Further, when the absorption rate of the laser light is increased by the foreign matter attached to the front or the back surface, the change in the absorption amount is large, and the adverse effect is caused. Further, when the absorption rate changes by only 1% from 2% to 1% due to the Fe concentration, it is necessary to change the input power from 100 W to 200 W to 100 W.

相對於此,於波長為3000 nm左右且吸收率約為50%之情形時,若切斷需要2 W之吸收功率,則投入4 W,而2 W透過。如此,與波長為1000 nm左右之情形相比,可使投入功率急遽減少,而提高加熱效率。除此以外,透過光亦急遽減少,因此,即便台板位於雷射光通過之切斷預定線下,台板亦不會受損。因此,藉由將強化玻璃載置於較切 斷之強化玻璃板大之台板上,可於更穩定之狀態下切斷。又,亦無需對透過之雷射光進行處理。進而,強化玻璃板之端面中之反射光之功率亦較小,而不易帶來不良影響。又,即便因附著於正面或背面之異物而雷射光之吸收率提高,吸收量之變化亦較小,而不易帶來不良影響。進而,吸收率亦不會因Fe濃度而發生變動,而且,於假設吸收率自50%向40%而減少10%之情形時,將投入之功率自4 W向5 W僅變更1 W即可。 On the other hand, when the wavelength is about 3000 nm and the absorption rate is about 50%, if the absorption power of 2 W is required for the cutting, 4 W is applied and 2 W is transmitted. Thus, compared with the case where the wavelength is about 1000 nm, the input power can be drastically reduced, and the heating efficiency can be improved. In addition, the transmitted light is also drastically reduced, so that the platen is not damaged even if the platen is placed under the line of cut through which the laser light passes. Therefore, by placing the strengthened glass on the cut The platen of the tempered glass plate can be cut off in a more stable state. Moreover, there is no need to process the transmitted laser light. Further, the power of the reflected light in the end surface of the tempered glass sheet is also small, and it is not easy to cause adverse effects. Further, even if the absorption rate of the laser light is increased by the foreign matter attached to the front or the back surface, the change in the absorption amount is small, and it is not easy to cause an adverse effect. Further, the absorption rate is not changed by the Fe concentration, and when the absorption rate is reduced by 10% from 50% to 40%, the input power can be changed from 4 W to 5 W by only 1 W. .

藉由使用以上所說明之方法,可切斷強化玻璃板。 The tempered glass sheet can be cut by using the method described above.

<強化玻璃板之切斷方法之詳細說明> <Detailed description of the method of cutting the tempered glass sheet>

繼而,對本實施形態之強化玻璃板之切斷方法進行詳細說明。 Next, the method of cutting the tempered glass sheet of the present embodiment will be described in detail.

再者,上述中說明了作為雷射光之波長,較佳為3000 nm左右之波長,但於以下說明之強化玻璃板之切斷方法中,並不限定於該波長,例如可廣泛應用波長為250~5000 nm之雷射光。 In the above description, the wavelength of the laser light is preferably about 3,000 nm. However, the method for cutting the tempered glass sheet described below is not limited to this wavelength. For example, the wavelength can be widely used. ~5000 nm laser light.

圖6係用以說明本實施形態之強化玻璃板之切斷方法之圖。圖6係自上面觀察強化玻璃板10所得之圖。又,強化玻璃板10所示之虛線48表示使用上述所說明之切斷方法自強化玻璃板10切出樣品40時之切斷預定線。樣品40係包含具有特定之曲率半徑之4個拐角部及直線部分之四邊形。再者,圖6所示之樣品40為一例,於自強化玻璃板10切出具有其他任意形狀之樣品之情形時,亦可使用本實施形態之強化玻璃板之切斷方法。 Fig. 6 is a view for explaining a cutting method of the tempered glass sheet of the embodiment. Fig. 6 is a view obtained by observing the tempered glass sheet 10 from above. Further, a broken line 48 shown by the tempered glass sheet 10 indicates a line to cut when the sample 40 is cut out from the tempered glass sheet 10 by the cutting method described above. The sample 40 includes a quadrangle having four corner portions and a straight portion having a specific radius of curvature. Further, the sample 40 shown in FIG. 6 is an example. When a sample having another arbitrary shape is cut out from the tempered glass sheet 10, the method of cutting the tempered glass sheet of the present embodiment may be used.

自強化玻璃板10切出樣品40時,使雷射光以通過切斷預定線48之方式掃描。即,自切斷起點41起開始雷射光之掃描,使雷射光沿圖6所示之箭頭之方向沿著切斷預定線48掃描,於切斷結束點42結束雷射光之掃描。此時,於切斷起點41即強化玻璃板10之端部預先形成有初期裂紋。初期裂紋可利用例如切割器、銼刀、雷射而形成。 When the sample 40 is cut out from the tempered glass sheet 10, the laser light is scanned in such a manner as to pass through the cut line 48. That is, scanning of the laser light is started from the cutting start point 41, and the laser beam is scanned along the line to cut 48 in the direction of the arrow shown in FIG. 6, and the scanning of the laser beam is completed at the cutting end point 42. At this time, initial cracks are formed in advance at the end portion of the tempered glass sheet 10 at the cutting start point 41. The initial crack can be formed by, for example, a cutter, a file, or a laser.

如此,使用雷射光切斷強化玻璃板之情形時,必需使照射於強化玻璃板之雷射光之條件最佳化。即,於照射於強化玻璃板之雷射光之條件不恰當之情形時,存在裂紋沿意料外之方向伸展,切斷線脫離切斷預定線,而切斷後之強化玻璃板之品質劣化之問題。 As described above, when the tempered glass sheet is cut by laser light, it is necessary to optimize the conditions of the laser light irradiated to the tempered glass sheet. In other words, when the conditions of the laser light irradiated to the tempered glass sheet are not appropriate, there is a problem that the crack propagates in an unexpected direction, and the cutting line is separated from the line to cut, and the quality of the tempered glass sheet after cutting is deteriorated.

圖7A係表示照射於強化玻璃板之雷射光之條件不恰當之情形時之強化玻璃板之切斷狀態之一例的圖,為圖6所示之切斷結束點42之附近之放大圖。如圖7A所示,於雷射光之條件不恰當之情形時,當使雷射光沿著切斷預定線48掃描時,意料外之裂紋46自裂紋產生位置43朝向切斷線44伸展。此處,圖中之實線(切斷線44、45)表示強化玻璃板被切斷之狀態(自強化玻璃板10之正面貫穿至背面為止),虛線(切斷預定線48)表示強化玻璃板未被切斷之狀態。 Fig. 7A is a view showing an example of a state in which the tempered glass sheet is cut in a case where the conditions of the laser light irradiated to the tempered glass sheet are inappropriate, and is an enlarged view of the vicinity of the cutting end point 42 shown in Fig. 6 . As shown in FIG. 7A, when the condition of the laser light is inappropriate, when the laser light is scanned along the line to cut 48, the unexpected crack 46 extends from the crack generating position 43 toward the cutting line 44. Here, the solid line (cutting lines 44, 45) in the figure indicates a state in which the tempered glass sheet is cut (through the front surface of the tempered glass sheet 10 to the back surface), and a broken line (cut line 48) indicates tempered glass. The board is not cut off.

即,圖7A所示之切斷結束點42位於已經切斷之切斷線44上。換言之,切斷結束點42位於強化玻璃板之側面。而且,於雷射光之條件不恰當之情形時,當使雷射光朝向切斷結束點42沿著切斷預定線48掃描時,意料外之裂紋46自裂紋產生位置43朝向切斷線44伸展。因此,於自強化玻璃 板10切出之樣品40形成凸部49,切斷後之強化玻璃板(樣品40)之品質劣化。 That is, the cutting end point 42 shown in Fig. 7A is located on the cutting line 44 that has been cut. In other words, the cutting end point 42 is located on the side of the tempered glass sheet. Further, when the condition of the laser light is not appropriate, when the laser light is scanned along the line to cut 48 toward the cutting end point 42, the unexpected crack 46 extends from the crack generating position 43 toward the cutting line 44. Therefore, in self-tempered glass The sample 40 cut out from the plate 10 was formed into a convex portion 49, and the quality of the tempered glass plate (sample 40) after the cutting was deteriorated.

如上述已說明般,切斷強化玻璃板10時,使用照射有雷射光之區域中所產生之壓縮應力(參照圖4),一面抑制雷射光之掃描方向後方產生之拉伸應力(參照圖5)所致之裂紋之伸展一面予以切斷。由此,於雷射光之條件不恰當之情形時,有無法控制掃描方向後方所產生之拉伸應力所致之裂紋之伸展方向,意料外之裂紋46自裂紋產生位置43朝向切斷線44伸展,而切斷線脫離切斷預定線48之情形。 As described above, when the tempered glass sheet 10 is cut, the compressive stress generated in the region irradiated with the laser light (see FIG. 4) is used to suppress the tensile stress generated in the scanning direction of the laser light (see FIG. 5). The crack caused by the extension is cut off. Therefore, when the conditions of the laser light are not appropriate, there is a possibility that the stretching direction of the crack due to the tensile stress generated behind the scanning direction cannot be controlled, and the unexpected crack 46 is extended from the crack generating position 43 toward the cutting line 44. And the cutting line is separated from the cut line 48.

圖7B係表示使用本實施形態之強化玻璃板之切斷方法之情形時之強化玻璃板之切斷狀態之一例的圖。於本實施形態之強化玻璃板之切斷方法中,當朝向位於強化玻璃板之切斷線(側面)44之切斷結束點42以相對於切斷線44成為銳角α1之方式切斷強化玻璃板時,於自裂紋產生位置43跟前(即,距離強化玻璃板之切斷結束點42特定距離跟前之特定位置)直至切斷結束點42為止之區間內,使照射於強化玻璃板之每單位照射面積之雷射光之照射能量大於通常之照射能量。此處,所謂通常之照射能量,係指例如呈直線狀切斷強化玻璃板時所需之每單位照射面積之雷射光之照射能量。又,裂紋產生位置43係朝向切斷線44伸展之意料外之裂紋46之起點。裂紋產生位置43係根據強化玻璃板10之切斷條件(例如雷射光之掃描位置與切斷線44之距離或雷射光之照射能量等)而其位置發生變化。 Fig. 7B is a view showing an example of a state in which the tempered glass sheet is cut in a case where the tempered glass sheet cutting method of the embodiment is used. In the cutting method of the tempered glass sheet of the present embodiment, the tempered glass is cut so as to be at an acute angle α1 with respect to the cutting line 44 toward the cutting end point 42 located at the cutting line (side surface) 44 of the tempered glass sheet. In the case of the plate, each unit irradiated to the tempered glass sheet is irradiated from the crack generating position 43 (i.e., at a specific position from the cutting end point 42 of the tempered glass sheet to a specific position before the cut end point 42). The irradiation energy of the laser light of the irradiation area is larger than the usual irradiation energy. Here, the normal irradiation energy means, for example, the irradiation energy of the laser light per unit irradiation area required for cutting the tempered glass sheet in a straight line. Further, the crack generating position 43 is the starting point of the unexpected crack 46 which extends toward the cutting line 44. The crack generation position 43 changes its position depending on the cutting conditions of the tempered glass sheet 10 (for example, the distance between the scanning position of the laser light and the cutting line 44 or the irradiation energy of the laser light).

如此,藉由使照射於強化玻璃板之每單位照射面積之雷 射光之照射能量變大,可使雷射光之掃描方向後方產生之拉伸應力變大。由此,可一面精度佳地控制掃描方向後方之裂紋之伸展方向一面切斷強化玻璃板10,從而可抑制意料外之裂紋46自裂紋產生位置43朝向切斷線44伸展。藉此,可沿著切斷預定線48切斷樣品40。 Thus, by illuminating the irradiation area per unit of the tempered glass sheet The irradiation energy of the light is increased, and the tensile stress generated behind the scanning direction of the laser light can be increased. Thereby, the tempered glass sheet 10 can be cut while accurately controlling the direction in which the crack in the scanning direction is extended, and the unexpected crack 46 can be prevented from extending from the crack generating position 43 toward the cutting line 44. Thereby, the sample 40 can be cut along the line to cut 48.

此時,將雷射光之掃描位置與切斷結束點42連結之線段與切斷線44(強化玻璃板10之側面)所成之角度α1越小,則越是容易朝向切斷線44產生意料外之裂紋46。由此,例如,角度α1越小時,亦可使照射於強化玻璃板之每單位照射面積之雷射光之照射能量越大。 At this time, the smaller the angle α1 between the line segment connecting the scanning position of the laser light and the cutting end point 42 and the cutting line 44 (the side surface of the tempered glass sheet 10), the easier it is to face the cutting line 44. Crack 46 outside. Thereby, for example, the smaller the angle α1 is, the larger the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet can be.

又,每單位照射面積之雷射光之照射能量E(J/mm2)係當將雷射光之輸出設為P(W),將雷射光之掃描速度設為v(mm/s),將照射於強化玻璃板10之雷射光之光束直徑設為(mm)時,可由下式表示。 Further, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area is such that the output of the laser light is P (W), and the scanning speed of the laser light is set to v (mm/s), and the irradiation is performed. The beam diameter of the laser beam for the tempered glass plate 10 is set to When it is (mm), it can be represented by the following formula.

即,每單位照射面積之雷射光之照射能量E(J/mm2)係雷射光於單位時間(1秒鐘)內掃描強化玻璃板10之每面積之能量。以下,亦將每單位照射面積之雷射光之照射能量記載為單位能量。 That is, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area is the laser light scanning the energy per area of the tempered glass sheet 10 per unit time (one second). Hereinafter, the irradiation energy of the laser light per unit irradiation area is also described as unit energy.

例如,根據上述式3,藉由使雷射光之照射區域之移動速度(掃描速度)變慢,可使每單位照射面積之雷射光之照射能量E(J/mm2)變大。又,藉由使雷射光之輸出變大,可使每單位照射面積之雷射光之照射能量E(J/mm2)變大。又,藉由使雷射光之照射區域之面積(即,光束直徑)變 小,可使每單位照射面積之雷射光之照射能量E(J/mm2)變大。又,藉由適當組合該等方法,亦可使每單位照射面積之雷射光之照射能量E(J/mm2)變大。 For example, according to the above formula 3, by making the moving speed (scanning speed) of the irradiation region of the laser light slow, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made large. Further, by increasing the output of the laser light, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be increased. Also, by making the area of the irradiated area of the laser light (ie, the beam diameter) When it is small, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made large. Further, by appropriately combining these methods, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made large.

又,於本實施形態中,隨著強化玻璃板10之吸收係數α變大,亦可使每單位照射面積之雷射光之照射能量E(J/mm2)變小。於吸收係數α較大之情形時,由強化玻璃板10吸收之能量變多,從而相應地可使每單位照射面積之雷射光之照射能量E(J/mm2)變小。 Further, in the present embodiment, as the absorption coefficient α of the tempered glass sheet 10 is increased, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made small. When the absorption coefficient α is large, the energy absorbed by the tempered glass sheet 10 is increased, so that the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made small.

又,隨著強化玻璃板之厚度t變厚,亦可使每單位照射面積之雷射光之照射能量E(J/mm2)變大。於強化玻璃板之厚度t較厚之情形時,必需使供給至強化玻璃板10之能量變多,因此,較佳為使每單位照射面積之雷射光之照射能量E(J/mm2)變大。又,隨著強化玻璃板10之熱膨脹係數變大,亦可使每單位照射面積之雷射光之照射能量E(J/mm2)變小。當強化玻璃板10之熱膨脹係數較大時,雷射光之掃描方向後方產生之拉伸應力變大,從而相應地可使每單位照射面積之雷射光之照射能量E(J/mm2)變小。 Further, as the thickness t of the tempered glass sheet becomes thicker, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made larger. When the thickness of the glass sheets to strengthen the case of thicker t necessary energy supplied to the toughened glass plate of 10 increases, and therefore, it is preferable to make the laser beam irradiated per unit area of the irradiation energy E (J / mm 2) becomes Big. Further, as the thermal expansion coefficient of the tempered glass sheet 10 becomes large, the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made small. When the thermal expansion coefficient of the tempered glass sheet 10 is large, the tensile stress generated behind the scanning direction of the laser light becomes large, so that the irradiation energy E (J/mm 2 ) of the laser light per unit irradiation area can be made small accordingly. .

圖8A係表示照射於強化玻璃板之雷射光之條件不恰當之情形時之強化玻璃板之切斷狀態之其他例的圖。於圖8A所示之例中,切斷結束點52配置於強化玻璃板10之側面54。又,朝向切斷結束點52之切斷預定線58成為直線。如圖8A所示,於雷射光之條件不恰當之情形時,當使雷射光沿著切斷預定線58掃描時,意料外之裂紋56自裂紋產生位置53朝向強化玻璃板10之側面54伸展。因此,於自強化玻璃板 10切出之樣品50形成凸部59,而切斷後之強化玻璃板(樣品50)之品質劣化。 FIG. 8A is a view showing another example of the cut state of the tempered glass sheet when the conditions of the laser light irradiated to the tempered glass sheet are not appropriate. In the example shown in FIG. 8A, the cutting end point 52 is disposed on the side surface 54 of the tempered glass sheet 10. Further, the line to cut 58 toward the cutting end point 52 becomes a straight line. As shown in FIG. 8A, when the condition of the laser light is inappropriate, when the laser light is scanned along the line to cut 58, the unexpected crack 56 extends from the crack generating position 53 toward the side 54 of the strengthened glass sheet 10. . Therefore, in the self-strengthening glass plate The cut sample 50 was formed into the convex portion 59, and the quality of the tempered glass sheet (sample 50) after the cutting was deteriorated.

圖8B係表示使用本實施形態之強化玻璃板之切斷方法之情形時之強化玻璃板之切斷狀態之其他例的圖。於本實施形態之強化玻璃板之切斷方法中,當朝向位於強化玻璃板之側面54之切斷結束點52以相對於側面54成為銳角α2之方式切斷強化玻璃板時,於自裂紋產生位置53跟前直至切斷結束點52為止之區間內,使照射於強化玻璃板之每單位照射面積之雷射光之照射能量大於通常之照射能量。 Fig. 8B is a view showing another example of the state in which the tempered glass sheet is cut in the case where the tempered glass sheet cutting method of the embodiment is used. In the method of cutting a tempered glass sheet according to the present embodiment, when the tempered glass sheet is cut so as to be at an acute angle α2 with respect to the side surface 54 toward the cutting end point 52 of the side surface 54 of the tempered glass sheet, self-cracking occurs. In the section from the position 53 to the cutting end point 52, the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet is made larger than the normal irradiation energy.

如此,藉由使照射於強化玻璃板之每單位照射面積之雷射光之照射能量變大,可使雷射光之掃描方向後方產生之拉伸應力變大。由此,可一面精度佳地控制掃描方向後方之裂紋之伸展方向一面切斷強化玻璃板10,從而可抑制意料外之裂紋56自裂紋產生位置53朝向側面54伸展。藉此,可沿著切斷預定線58切斷樣品50。 As described above, by increasing the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet, the tensile stress generated in the scanning direction of the laser light can be increased. Thereby, the tempered glass sheet 10 can be cut while accurately controlling the direction in which the crack in the scanning direction is extended, and the unexpected crack 56 can be prevented from extending from the crack generating position 53 toward the side surface 54. Thereby, the sample 50 can be cut along the line to cut 58.

此時,將雷射光之掃描位置與切斷結束點52連結之線段與側面54(強化玻璃板10之側面)所成之角度α2越小,則越是容易朝向側面54產生意料外之裂紋56。由此,例如,角度α2越小時,亦可使照射於強化玻璃板之每單位照射面積之雷射光之照射能量越大。再者,於圖8A、圖8B所示之例中,由於切斷預定線58為直線,故角度α2亦可表現為切斷預定線58與側面54所成之角。 At this time, the smaller the angle α2 between the line segment connecting the scanning position of the laser light and the cutting end point 52 and the side surface 54 (the side surface of the tempered glass sheet 10), the more easily the unexpected crack is generated toward the side surface 56. . Thereby, for example, the smaller the angle α2 is, the larger the irradiation energy of the laser light per unit irradiation area irradiated to the tempered glass sheet can be. Further, in the example shown in Figs. 8A and 8B, since the line to cut 58 is a straight line, the angle α2 can also be expressed as an angle formed by the line to cut 58 and the side surface 54.

圖9A係表示照射於強化玻璃板之雷射光之條件不恰當之情形時之強化玻璃板之切斷狀態之其他例的圖。圖9A係自 上面觀察強化玻璃板10所得之圖。自強化玻璃板10切出樣品60時,自切斷起點61起開始雷射光之掃描,使雷射光沿圖9A所示之箭頭之方向沿著切斷預定線掃描,於切斷結束點62結束雷射光之掃描。 FIG. 9A is a view showing another example of the cut state of the tempered glass sheet when the conditions of the laser light irradiated to the tempered glass sheet are not appropriate. Figure 9A is from The graph obtained by strengthening the glass sheet 10 is observed above. When the sample 60 is cut out from the tempered glass sheet 10, the scanning of the laser light is started from the cutting start point 61, and the laser light is scanned along the line of the cutting line in the direction of the arrow shown in Fig. 9A, and ends at the cutting end point 62. Scanning of laser light.

如圖9A所示,於雷射光之條件不恰當之情形時,當使雷射光沿著切斷預定線68掃描時,意料外之裂紋66自裂紋產生位置63朝向切斷線64伸展。因此,於自強化玻璃板10切出之樣品60形成凸部69,而切斷後之強化玻璃板(樣品60)之品質劣化。 As shown in FIG. 9A, when the condition of the laser light is inappropriate, when the laser light is scanned along the line to cut 68, the unexpected crack 66 extends from the crack generating position 63 toward the cutting line 64. Therefore, the sample 60 cut out from the tempered glass sheet 10 forms the convex portion 69, and the quality of the tempered glass sheet (sample 60) after cutting is deteriorated.

圖9B係表示使用本實施形態之強化玻璃板之切斷方法之情形時之強化玻璃板之切斷狀態之其他例的圖。於本實施形態之強化玻璃板之切斷方法中,當朝向位於強化玻璃板之切斷線(側面)64之切斷結束點62以相對於切斷線64成為銳角α3之方式切斷強化玻璃板時,於自裂紋產生位置63跟前直至切斷結束點62為止之區間內,使照射於強化玻璃板之每單位照射面積之雷射光之照射能量大於通常之照射能量。 Fig. 9B is a view showing another example of the state in which the tempered glass sheet is cut in the case where the tempered glass sheet cutting method of the embodiment is used. In the method of cutting a tempered glass sheet according to the present embodiment, the tempered glass is cut so as to become an acute angle α3 with respect to the cutting line 64 toward the cutting end point 62 located at the cutting line (side surface) 64 of the tempered glass sheet. In the case of the plate, the irradiation energy of the laser light per unit irradiation area irradiated to the tempered glass sheet is larger than the normal irradiation energy in the interval from the crack generation position 63 to the cutting end point 62.

如此,藉由使照射於強化玻璃板之每單位照射面積之雷射光之照射能量變大,可使雷射光之掃描方向後方產生之拉伸應力變大。由此,可一面精度佳地控制掃描方向後方之裂紋之伸展方向一面切斷強化玻璃板10,從而可抑制意料外之裂紋66自裂紋產生位置63朝向切斷線64伸展。藉此,可沿著切斷預定線68切斷樣品60。此時,於圖9B所示之例中,隨著雷射光之掃描位置靠近切斷結束點62,切斷 線67與切斷線64(此情形時為切斷線64之切線)所成之角度α3變小。 As described above, by increasing the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet, the tensile stress generated in the scanning direction of the laser light can be increased. Thereby, the tempered glass sheet 10 can be cut while accurately controlling the direction in which the crack in the scanning direction is extended, and the unexpected crack 66 can be prevented from extending from the crack generating position 63 toward the cutting line 64. Thereby, the sample 60 can be cut along the line to cut 68. At this time, in the example shown in FIG. 9B, as the scanning position of the laser light approaches the cutting end point 62, the cutting is performed. The angle α3 formed by the line 67 and the cutting line 64 (in this case, the tangent to the cutting line 64) becomes small.

再者,圖6~圖9B所示之例為一例,本實施形態之強化玻璃板之切斷方法可廣泛應用於朝向位於強化玻璃板之側面之切斷結束點以相對於強化玻璃板之側面成為銳角之方式切斷強化玻璃板之情形。 In addition, as an example shown in FIG. 6 to FIG. 9B, the cutting method of the tempered glass sheet of the present embodiment can be widely applied to the side of the cutting end on the side of the tempered glass sheet to be opposite to the side of the tempered glass sheet. The case of sharpening the glass plate by cutting it into an acute angle.

利用以上已說明之本實施形態之強化玻璃板之切斷方法,可不使品質劣化而使用雷射光切斷強化玻璃板。 According to the cutting method of the tempered glass sheet of the present embodiment described above, the tempered glass sheet can be cut by using laser light without deteriorating the quality.

又,於本實施形態之強化玻璃板之切斷方法中,當使雷射光掃描而切斷強化玻璃板時,亦可一面使強化玻璃板尤其是雷射光之照射區域之周圍冷卻一面使雷射光掃描。圖10係用以說明本實施形態之強化玻璃板之切斷方法中使用之冷卻噴嘴之剖面圖。如圖10所示,冷卻噴嘴28係以氣體於冷卻噴嘴28之內部流動之方式形成有錐狀之空腔。此時,錐狀之空腔設為於透鏡25聚光之雷射光20可通過冷卻噴嘴28之內部般之大小。又,冷卻噴嘴28係以可與雷射光之照射區域之移動同步地(即,以與雷射光相同之掃描速度)移動之方式構成。 Further, in the method of cutting a tempered glass sheet according to the present embodiment, when the tempered glass sheet is cut by scanning the laser light, the tempered glass sheet may be cooled while being irradiated around the irradiation region of the laser light. scanning. Fig. 10 is a cross-sectional view for explaining a cooling nozzle used in the method for cutting a tempered glass sheet according to the embodiment. As shown in FIG. 10, the cooling nozzle 28 is formed with a tapered cavity in such a manner that a gas flows inside the cooling nozzle 28. At this time, the tapered cavity is set such that the laser light 20 condensed by the lens 25 can pass through the inside of the cooling nozzle 28. Further, the cooling nozzle 28 is configured to be movable in synchronization with the movement of the irradiation area of the laser light (that is, at the same scanning speed as the laser light).

作為用於冷卻之氣體,可使用例如空氣或氮氣等。又,為了提高冷卻能力,亦可包含氣體中含有微小水分之薄霧。又,作為用於冷卻之氣體,亦可使用溫度低於強化玻璃板被切斷之周圍之溫度之氣體。進而,作為用於冷卻之氣體,亦可使用熱傳係數大於空氣之熱傳係數之氣體。 As the gas for cooling, for example, air or nitrogen or the like can be used. Further, in order to increase the cooling ability, a mist containing a small amount of moisture in the gas may be contained. Further, as the gas for cooling, a gas having a temperature lower than the temperature around which the tempered glass sheet is cut may be used. Further, as the gas for cooling, a gas having a heat transfer coefficient larger than the heat transfer coefficient of air may be used.

冷卻噴嘴28之前端之開口部之直徑1、及冷卻噴嘴28之 前端與強化玻璃板10之正面12之距離Gap可任意決定。此處,冷卻噴嘴28之前端之開口部之直徑1越小,則噴出至強化玻璃板10之氣體之流速越快,因此,強化玻璃板10之正面12中之冷卻能力提高。又,冷卻噴嘴28之前端與強化玻璃板10之正面12之距離Gap越小,則強化玻璃板10之正面12中之冷卻能力提高。再者,自例如氣體供給部(未圖示)將冷卻用之氣體供給至冷卻噴嘴28。 The diameter of the opening of the front end of the cooling nozzle 28 1. The distance Gap between the front end of the cooling nozzle 28 and the front surface 12 of the tempered glass sheet 10 can be arbitrarily determined. Here, the diameter of the opening of the front end of the cooling nozzle 28 The smaller the 1 is, the faster the flow rate of the gas ejected to the tempered glass sheet 10 is, so that the cooling ability in the front surface 12 of the tempered glass sheet 10 is improved. Further, the smaller the distance Gap between the front end of the cooling nozzle 28 and the front surface 12 of the tempered glass sheet 10, the more the cooling ability in the front surface 12 of the tempered glass sheet 10 is improved. Further, the cooling gas is supplied to the cooling nozzle 28 from, for example, a gas supply unit (not shown).

如此,使雷射光掃描而切斷強化玻璃板時,藉由一面使強化玻璃板冷卻一面使雷射光掃描,可精度更佳地控制掃描方向後方之裂紋之伸展方向。由此,可更確實地抑制於切斷強化玻璃板時裂紋脫離切斷預定線而沿意料外之方向伸展。 As described above, when the laser beam is scanned and the tempered glass sheet is cut, the laser beam is scanned while cooling the tempered glass sheet, and the direction in which the crack extends in the scanning direction can be more accurately controlled. Thereby, it is possible to more reliably suppress the crack from being separated from the planned cutting line when the tempered glass sheet is cut, and extending in the unexpected direction.

圖11係表示使雷射光於強化玻璃板10上掃描時產生於強化玻璃板10之板厚中心部之應力之分佈的圖(無冷卻)。如圖11所示,於強化玻璃板10之雷射光之照射區域22產生壓縮應力33。又,於與雷射光之照射區域22之中心X1僅相距距離D1之掃描方向後方之位置X2產生拉伸應力35。於本實施形態之強化玻璃板之切斷方法中,使藉由雷射光之照射而產生之拉伸應力35作用於裂紋30之端部,並且使用在雷射光之照射區域22中發揮作用之壓縮應力33抑制裂紋之伸展,藉此一面控制掃描方向後方之裂紋30之伸展方向一面切斷強化玻璃板10。 Fig. 11 is a view showing the distribution of stress generated at the center portion of the thickness of the tempered glass sheet 10 when the laser light is scanned on the tempered glass sheet 10 (without cooling). As shown in FIG. 11, a compressive stress 33 is generated in the irradiation region 22 of the laser light of the tempered glass sheet 10. Further, the tensile stress 35 is generated at a position X2 which is only rearward of the scanning direction of the distance D1 from the center X1 of the irradiation region 22 of the laser light. In the method of cutting a tempered glass sheet according to the present embodiment, the tensile stress 35 generated by the irradiation of the laser light acts on the end portion of the crack 30, and the compression in the irradiation region 22 of the laser light is used. The stress 33 suppresses the extension of the crack, thereby cutting the tempered glass sheet 10 while controlling the extending direction of the crack 30 behind the scanning direction.

圖12係表示使雷射光於強化玻璃板10上掃描時產生於強化玻璃板10之板厚中心部之應力之分佈的圖(有冷卻)。圖 12所示之情形亦同樣地,於強化玻璃板10之雷射光之照射區域22產生壓縮應力33。又,於與雷射光之照射區域22之中心X1僅相距距離D2之掃描方向後方之位置X2'產生拉伸應力35。而且,於圖12所示之情形時,由於使強化玻璃板10之正面冷卻,故產生壓縮應力33之位置X1與產生拉伸應力之位置X2'之距離D2與未進行冷卻之情形時之距離D1(參照圖11)相比變短。因此,於使強化玻璃板10之正面冷卻之情形時,可使產生壓縮應力33之位置X1與產生拉伸應力之位置X2'靠近,從而可精度更佳地控制掃描方向後方之裂紋之伸展方向。由此,可更確實地抑制於切斷強化玻璃板時裂紋脫離切斷預定線而沿意料外之方向伸展。 Fig. 12 is a view (with cooling) showing the distribution of stress generated at the center portion of the thickness of the tempered glass sheet 10 when the laser light is scanned on the tempered glass sheet 10. Figure Similarly, in the case of 12, the compressive stress 33 is generated in the irradiation region 22 of the laser beam of the tempered glass sheet 10. Further, the tensile stress 35 is generated at a position X2' which is only rearward of the scanning direction of the distance D2 from the center X1 of the irradiation region 22 of the laser light. Further, in the case shown in Fig. 12, since the front surface of the tempered glass sheet 10 is cooled, the distance X2 between the position X1 where the compressive stress 33 is generated and the position X2' where the tensile stress is generated is the distance from the case where the cooling is not performed. D1 (refer to FIG. 11) is shorter. Therefore, when the front surface of the tempered glass sheet 10 is cooled, the position X1 at which the compressive stress 33 is generated can be made close to the position X2' at which the tensile stress is generated, so that the direction of the crack extending behind the scanning direction can be more accurately controlled. . Thereby, it is possible to more reliably suppress the crack from being separated from the planned cutting line when the tempered glass sheet is cut, and extending in the unexpected direction.

再者,於上述例中,對使強化玻璃板10之正面冷卻之情形進行了說明,但亦可使強化玻璃板10之背面冷卻,又,亦可以使強化玻璃板10之正面及背面之兩者冷卻之方式構成。於使強化玻璃板10之背面冷卻之情形時,亦可使用冷卻噴嘴。 Further, in the above example, the case where the front surface of the tempered glass sheet 10 is cooled has been described, but the back surface of the tempered glass sheet 10 may be cooled, and the front and back sides of the tempered glass sheet 10 may be also provided. The way of cooling is made up. A cooling nozzle can also be used in the case where the back surface of the tempered glass sheet 10 is cooled.

繼而,對用以實施上述已說明之本實施形態之強化玻璃板之切斷方法之強化玻璃板切斷裝置進行說明。圖13係用以說明本實施形態之強化玻璃板切斷裝置之圖。本實施形態之強化玻璃板切斷裝置70包含雷射輸出部71、玻璃保持驅動部72、控制部73及控制程式生成部74。 Next, a tempered glass sheet cutting device for carrying out the above-described cutting method of the tempered glass sheet of the present embodiment will be described. Fig. 13 is a view for explaining the tempered glass sheet cutting device of the embodiment. The tempered glass sheet cutting device 70 of the present embodiment includes a laser output unit 71, a glass holding drive unit 72, a control unit 73, and a control program generation unit 74.

雷射輸出部71輸出用以切斷強化玻璃板10之雷射光20。作為雷射光20之光源,可使用例如UV雷射(波長:355 nm)、綠光雷射(波長:532 nm)、半導體雷射(波長:808 nm、940 nm、975 nm)、纖維雷射(波長:1060~1100 nm)、YAG雷射(波長:1064 nm、2080 nm、2940 nm)、使用中紅外光參數振盪器之雷射(波長:2600~3450 nm)等。 The laser output unit 71 outputs the laser light 20 for cutting the tempered glass sheet 10. As the light source of the laser light 20, for example, a UV laser (wavelength: 355 nm), a green laser (wavelength: 532 nm), and a semiconductor laser (wavelength: 808) can be used. Nm, 940 nm, 975 nm), fiber laser (wavelength: 1060 to 1100 nm), YAG laser (wavelength: 1064 nm, 2080 nm, 2940 nm), laser using a mid-infrared optical parametric oscillator (wavelength: 2600~3450 nm) and so on.

此處,於使用近紅外之雷射光之情形時,為了使近紅外中之吸收增加而必需於強化玻璃板中添加Fe等雜質。於添加有於近紅外中具有吸收特性之雜質之情形時,亦對可見光區域之吸收特性帶來影響,因此,有對強化玻璃板之色調或透過率帶來影響之情形。為了防止如上所述之情況,作為雷射光20之光源,亦可使用波長為2500~5000 nm之中紅外之雷射。由於在波長為2500~5000 nm之頻帶中產生因玻璃本身之分子振動而引起之吸收,故無需添加Fe等雜質。 Here, in the case of using near-infrared laser light, it is necessary to add impurities such as Fe to the tempered glass sheet in order to increase the absorption in the near-infrared. When an impurity having absorption characteristics in the near-infrared is added, it also affects the absorption characteristics of the visible light region, and thus it may affect the color tone or transmittance of the tempered glass sheet. In order to prevent the above, as the light source of the laser light 20, a laser having a wavelength of 2500 to 5000 nm may be used. Since absorption due to molecular vibration of the glass itself occurs in a frequency band of 2,500 to 5,000 nm, it is not necessary to add impurities such as Fe.

雷射輸出部71包含用以調整雷射光之焦點之光學系統。雷射光之功率(雷射輸出)、雷射光之光束直徑(焦點)、雷射照射之時序等係使用控制部73而控制。又,亦可於雷射光之照射部配置圖10所示之冷卻噴嘴28。於此情形時,自冷卻噴嘴噴出之氣體之流量可使用控制部73而進行控制。 The laser output unit 71 includes an optical system for adjusting the focus of the laser light. The power of the laser light (laser output), the beam diameter (focus) of the laser beam, the timing of the laser irradiation, and the like are controlled by the control unit 73. Further, the cooling nozzle 28 shown in Fig. 10 may be disposed in the irradiation portion of the laser beam. In this case, the flow rate of the gas ejected from the cooling nozzle can be controlled by the control unit 73.

玻璃保持驅動部72係保持作為加工對象之強化玻璃板10,並且沿特定方向移動強化玻璃板10。即,玻璃保持驅動部72係以雷射光沿強化玻璃板10之切斷預定線進行掃描之方式移動強化玻璃板10。玻璃保持驅動部72係使用控制部73而控制。玻璃保持驅動部72亦可藉由使用多孔質板等吸附作為加工對象之強化玻璃板10而將其固定。又,玻璃保持驅動部72亦可包含用以決定強化玻璃板10之位置之圖 像檢測器。藉由包含定位用之圖像檢測器,可提高強化玻璃板10之加工精度。 The glass holding drive unit 72 holds the tempered glass sheet 10 as a processing target, and moves the tempered glass sheet 10 in a specific direction. In other words, the glass holding drive unit 72 moves the tempered glass sheet 10 such that the laser light is scanned along the line to cut of the tempered glass sheet 10. The glass holding drive unit 72 is controlled using the control unit 73. The glass holding drive unit 72 can also fix the tempered glass sheet 10 to be processed by using a porous plate or the like. Moreover, the glass holding drive unit 72 may also include a map for determining the position of the tempered glass sheet 10. Like a detector. The processing precision of the tempered glass sheet 10 can be improved by including an image detector for positioning.

再者,於圖13所示之強化玻璃板切斷裝置70中,以雷射光20之照射區域於強化玻璃板10上移動之方式,使用玻璃保持驅動部72移動強化玻璃板10。此時,雷射輸出部71固定。然而,亦可藉由將由玻璃保持驅動部72保持之強化玻璃板10固定,使雷射輸出部71移動,而使雷射光20之照射區域於強化玻璃板10上移動。又,亦可以由玻璃保持驅動部72保持之強化玻璃板10與雷射輸出部71之兩者移動之方式構成。 Further, in the tempered glass sheet cutting device 70 shown in FIG. 13, the tempered glass sheet 10 is moved by the glass holding drive unit 72 so that the irradiation region of the laser light 20 moves on the tempered glass sheet 10. At this time, the laser output unit 71 is fixed. However, by fixing the tempered glass sheet 10 held by the glass holding drive unit 72, the laser output unit 71 is moved, and the irradiation region of the laser light 20 is moved on the tempered glass sheet 10. Further, the tempered glass sheet 10 and the laser output unit 71 held by the glass holding drive unit 72 may be configured to move.

控制部73係根據控制程式生成部74所生成之控制程式控制雷射輸出部71及玻璃保持驅動部72。 The control unit 73 controls the laser output unit 71 and the glass holding drive unit 72 based on the control program generated by the control program generation unit 74.

控制程式生成部74係根據強化玻璃板10之熱膨脹係數、厚度、強化玻璃板相對於雷射光之吸收係數及強化玻璃板之中間層17之殘留拉伸應力之至少一個,生成控制照射於強化玻璃板之每單位照射面積之雷射光之照射能量之控制程式。 The control program generation unit 74 generates and controls the irradiation of the tempered glass based on at least one of the thermal expansion coefficient and the thickness of the tempered glass sheet 10, the absorption coefficient of the tempered glass sheet with respect to the laser light, and the residual tensile stress of the intermediate layer 17 of the tempered glass sheet. The control program for the illumination energy of the laser light per unit of illumination area of the panel.

又,控制程式生成部74生成如下之控制程式:當朝向位於強化玻璃板之側面之切斷結束點以相對於強化玻璃板之側面成為銳角之方式切斷強化玻璃板時,於自裂紋產生位置跟前直至切斷結束點為止之區間內,照射於強化玻璃板之每單位照射面積之雷射光之照射能量大於通常之照射能量。例如,控制程式生成部74係根據切斷預定線之資訊與雷射光之位置資訊(當前位置),生成控制雷射光之照射 區域之面積(即光束直徑)、雷射光之輸出及雷射光之掃描速度之控制程式。 Further, the control program generation unit 74 generates a control program for generating a self-cracking position when the tempered glass sheet is cut so as to be perpendicular to the side surface of the tempered glass sheet at the cutting end point on the side surface of the tempered glass sheet. In the interval from the front to the end of the cutting, the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass plate is larger than the normal irradiation energy. For example, the control program generation unit 74 generates an area for controlling the irradiation area of the laser light (ie, the beam diameter) based on the information of the planned cutting line and the position information (current position) of the laser light. ), the output of the laser light and the control program of the scanning speed of the laser light.

具體而言,例如,控制程式生成部74係根據預先設定之強化玻璃板10之物性(熱膨脹係數、厚度、強化玻璃板相對於雷射光之吸收係數、強化玻璃板之中間層17之殘留拉伸應力等),決定切斷直線部分時照射於強化玻璃板之每單位照射面積之雷射光之照射能量。而且,根據該決定之單位能量、切斷預定線之資訊及雷射光之位置資訊(當前位置),生成控制雷射光之照射區域之面積(即光束直徑)、雷射光之輸出及雷射光之掃描速度之控制程式。 Specifically, for example, the control program generation unit 74 is based on the physical properties of the tempered glass sheet 10 set in advance (thermal expansion coefficient, thickness, absorption coefficient of the tempered glass sheet with respect to the laser light, and residual stretching of the intermediate layer 17 of the tempered glass sheet). The stress, etc., determines the irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet when the straight line portion is cut. And, according to the determined unit energy, the information of the planned cutting line, and the position information (current position) of the laser light, an area for controlling the irradiation area of the laser light (ie, the beam diameter) is generated. ), the output of the laser light and the control program of the scanning speed of the laser light.

如以上已說明般,利用本實施形態之發明,可提供一種不使品質劣化而使用雷射光切斷強化玻璃板之強化玻璃板之切斷方法及強化玻璃板切斷裝置。 As described above, according to the invention of the present embodiment, it is possible to provide a method for cutting a tempered glass sheet and a tempered glass sheet cutting device which use a laser beam to cut the tempered glass sheet without deteriorating the quality.

<參考例1> <Reference Example 1>

繼而,參照圖14~16,對強化玻璃板之切斷方法與非強化玻璃板之切斷方法中裂紋之伸展方式不同之情況進行說明。圖14係表示關於強化玻璃板之切斷結果之表。圖15係表示關於非強化玻璃板之切斷結果之表。圖16係表示關於強化玻璃板(參考例)及非強化玻璃板(比較例)之切斷結果之表。圖16所示之切斷結果係較圖14、圖15所示之切斷結果使雷射光之光點直徑變小之情形時之切斷結果。 Next, a case where the crack stretching method is different between the method of cutting the tempered glass sheet and the method of cutting the non-reinforced glass sheet will be described with reference to Figs. 14 to 16 . Fig. 14 is a table showing the results of cutting of the tempered glass sheet. Fig. 15 is a table showing the results of cutting about the non-reinforced glass sheet. Fig. 16 is a table showing the results of cutting about the tempered glass sheet (reference example) and the non-reinforced glass sheet (comparative example). The cutting result shown in Fig. 16 is a cutting result when the diameter of the spot light of the laser light is made smaller than the cutting result shown in Figs. 14 and 15 .

於參考例101~103、106~108中,準備強化玻璃板,於比較例104~105、109~110中,準備非強化玻璃板。參考例101~103、106~108之強化玻璃板係利用化學強化法使與比 較例104~105、109~110之非強化玻璃板相同之尺寸形狀(矩形、長邊100 mm、短邊60 mm、板厚0.7 mm)、相同之化學組成之玻璃板強化而製作。強化玻璃板具有內部殘留拉伸應力(CT)30.4 MPa、最大殘留壓縮應力(CS)763 MPa、壓縮應力層(正面層或背面層)之厚度(DOL)25.8 μm。此處,內部應變能量UCT為4.04 J/m2In Reference Examples 101 to 103 and 106 to 108, a tempered glass plate was prepared, and in Comparative Examples 104 to 105 and 109 to 110, a non-reinforced glass plate was prepared. The tempered glass sheets of Reference Examples 101 to 103 and 106 to 108 were similar in size to the non-reinforced glass sheets of Comparative Examples 104 to 105 and 109 to 110 by chemical strengthening method (rectangular, long side 100 mm, short side 60 mm). Manufactured with a glass plate of the same chemical composition, with a plate thickness of 0.7 mm). The tempered glass sheet has an internal residual tensile stress (CT) of 30.4 MPa, a maximum residual compressive stress (CS) of 763 MPa, and a compressive stress layer (front layer or back layer) of thickness (DOL) of 25.8 μm. Here, the internal strain energy U CT is 4.04 J/m 2 .

於參考例101~103、106~108、比較例104~105、109~110中,除玻璃板之種類(強化、非強化之區別)、光源之輸出及雷射光點直徑以外,於相同之條件下進行切斷實驗。 In the reference examples 101 to 103, 106 to 108, and the comparative examples 104 to 105 and 109 to 110, the same conditions were used except for the type of the glass plate (the difference between the reinforcement and the non-reinforcement), the output of the light source, and the diameter of the laser spot. The cutting experiment was carried out.

(共通之條件) (common conditions)

雷射光光源:纖維雷射(波長1070 nm) Laser light source: fiber laser (wavelength 1070 nm)

雷射光朝向玻璃板之入射角:0° Angle of incidence of laser light towards the glass plate: 0°

雷射光之聚光角:2.5° Convergence angle of laser light: 2.5°

雷射光之聚光位置:於光源側與玻璃板之正面相距23 mm之位置 Spotlight position of the laser light: 23 mm away from the front side of the glass plate on the light source side

玻璃板相對於雷射光之吸收係數α:0.09 cm-1(0.009 mm-1) Absorption coefficient of glass plate relative to laser light: 0.09 cm -1 (0.009 mm -1 )

玻璃板之板厚t:0.07 cm(0.7 mm) Glass plate thickness t: 0.07 cm (0.7 mm)

玻璃板之楊氏模數Y:74000 MPa Young's modulus of glass plate Y: 74000 MPa

α×t:0.0063 α×t: 0.0063

噴嘴之出口直徑:1 mm Nozzle outlet diameter: 1 mm

來自噴嘴之冷卻氣體(室溫之壓縮空氣)之流量:30 L/min Flow rate of cooling gas from the nozzle (compressed air at room temperature): 30 L/min

目標切斷位置:與玻璃板之短邊平行之直線(與一條短邊之距離10 mm、與另一條短邊之距離90 mm) Target cut position: a line parallel to the short side of the glass plate (10 mm from one short side and 90 mm from the other short side)

切斷速度:2.5 mm/s Cutting speed: 2.5 mm/s

於圖14、圖15所示之參考例101~103及比較例104~105中,將玻璃板之正面中之雷射光點直徑設為1 mm。又,於圖16所示之參考例106~108及比較例109~110中,將玻璃板之正面中之雷射光點直徑設為0.1 mm。 In the reference examples 101 to 103 and the comparative examples 104 to 105 shown in FIG. 14 and FIG. 15, the diameter of the laser spot in the front surface of the glass plate is used. Set to 1 mm. Further, in Reference Examples 106 to 108 and Comparative Examples 109 to 110 shown in FIG. 16, the diameter of the laser spot in the front surface of the glass plate was used. Set to 0.1 mm.

切斷後,利用顯微鏡觀察玻璃板之切斷面。於玻璃板之切斷面觀察到之條紋式樣表示斷續地伸展之裂紋之前端位置之經時變化。根據條紋式樣之各線之形狀可知裂紋伸展之情況。於圖14~16所示之顯微鏡照片中,利用較粗之白線強調表示條紋式樣之代表性之線。 After cutting, the cut surface of the glass plate was observed with a microscope. The stripe pattern observed on the cut surface of the glass sheet indicates the temporal change of the position of the front end of the crack which is intermittently stretched. The crack extension is known from the shape of each line of the stripe pattern. In the micrographs shown in Figs. 14 to 16, the representative lines of the stripe pattern are emphasized by the thicker white lines.

又,目視觀察於玻璃板之切斷之中途中斷雷射照射及氣體冷卻時之裂紋之情況。 Further, it was visually observed that the cracks in the laser irradiation and the gas cooling were interrupted during the cutting of the glass sheet.

將各實驗結果示於圖14~16。於圖14~16中,將於玻璃板形成有裂紋之情形(可切斷之情形)表示為「○」,將於玻璃板未形成裂紋之情形(無法切斷之情形)表示為「×」。 The results of each experiment are shown in Figures 14-16. In FIGS. 14 to 16, the case where the glass plate is cracked (the case where it can be cut) is indicated as "○", and the case where the glass plate is not cracked (the case where the cutting is impossible) is expressed as "×". .

圖14~16之切斷面之顯微鏡照片中之條紋式樣之線表示在某時間點之裂紋之前端位置。 The stripe pattern line in the micrograph of the cut surface of Figs. 14 to 16 indicates the position of the front end of the crack at a certain point of time.

圖14~16中之「自由擴散」係指於雷射照射等中斷後,裂紋朝向玻璃板之2條短邊中距離切斷位置更近之短邊伸展。 The "free diffusion" in Figs. 14 to 16 means that after the laser irradiation or the like is interrupted, the crack extends toward the short side of the two short sides of the glass plate which is closer to the cutting position.

凸量及直線度誤差量表示切斷玻璃板時之誤差量。即,表示自上面側觀察玻璃板時,玻璃板之切斷線自切斷預定線(由圖表之X軸表示)偏移之量(由圖表之Y軸表示)。凸量及直線度誤差量(即Y軸之絕對值)越小,則玻璃板沿著切 斷預定線被切斷。 The amount of convexity and straightness error indicates the amount of error when the glass plate is cut. That is, when the glass plate is viewed from the upper side, the cutting line of the glass plate is offset from the planned cutting line (indicated by the X-axis of the graph) (indicated by the Y-axis of the graph). The smaller the amount of convexity and straightness error (that is, the absolute value of the Y-axis), the smaller the glass plate is. The broken line is cut.

如圖15所示,對於比較例104~105之非強化玻璃板之切斷,根據切斷面之顯微鏡照片可知:玻璃板之板厚方向兩端部有較玻璃板之板厚方向中央部先裂開之傾向。又,若於切斷之中途中斷雷射照射及氣體冷卻,則裂紋之伸展停止。又,於非強化玻璃板之切斷中,需要較大之光源輸出。進而,於非強化玻璃板之切斷中,凸量及直線度誤差量變大。 As shown in Fig. 15, in the cutting of the non-tempered glass sheets of Comparative Examples 104 to 105, it is understood from the micrograph of the cut surface that the both ends of the glass sheet in the thickness direction are the center of the thickness direction of the glass sheet. The tendency to split. Further, if the laser irradiation and the gas cooling are interrupted during the cutting, the extension of the crack is stopped. Moreover, in the cutting of the non-reinforced glass sheet, a large light source output is required. Further, in the cutting of the non-reinforced glass sheet, the amount of error in the amount of convexity and straightness is increased.

相對於此,對於圖14所示之參考例101~103之強化玻璃板之切斷,根據切斷面之顯微鏡照片可知:玻璃板之板厚方向中央部有較玻璃板之板厚方向兩端部先裂開之傾向。其原因在於:本來於強化玻璃板之內部存在殘留拉伸應力,裂紋藉由該內部殘留拉伸應力而伸展。又,若於切斷之中途中斷雷射照射及氣體冷卻,則裂紋沿意料外之方向自己伸展。根據該結果可知:藉由雷射光之照射,內部殘留拉伸應力所致之裂紋之伸展被抑制。又,於強化玻璃板之切斷中,凸量及直線度誤差量較非強化玻璃板之切斷之情形小。於圖16所示之參考例106~108之強化玻璃板之切斷中亦成為同樣之結果。 On the other hand, in the cutting of the tempered glass sheets of Reference Examples 101 to 103 shown in FIG. 14 , it can be seen from the micrograph of the cut surface that the center portion of the glass sheet in the thickness direction is thicker than the thickness of the glass sheet. The tendency of the ministry to split first. This is because the residual tensile stress is originally present inside the tempered glass sheet, and the crack is stretched by the internal residual tensile stress. Further, if the laser irradiation and the gas cooling are interrupted during the cutting, the crack extends in the unexpected direction. According to the results, it is understood that the stretching of the crack due to the internal residual tensile stress is suppressed by the irradiation of the laser light. Further, in the cutting of the tempered glass sheet, the amount of convexity and straightness error is smaller than that of the unreinforced glass sheet. The same result was obtained in the cutting of the tempered glass sheets of Reference Examples 106 to 108 shown in Fig. 16 .

又,如圖16所示,於使雷射光點直徑變小之情形(參考例106~108)時,可以較參考例101~103小之光源輸出切斷強化玻璃板。又,於參考例106~108中,與圖14所示之參考例101~103相比,凸量及直線度誤差量變小。即,於參考例106~108中,可相較參考例101~103精度更佳地切斷強 化玻璃板。又,如參考例106~108所示,使光源輸出越低,則凸量及直線度誤差量越小。尤其,於參考例108中,凸量成為極小之值,為15 μm。 Further, as shown in FIG. 16, when the diameter of the laser spot is made small (Reference Examples 106 to 108), the tempered glass sheet can be cut off from the light source smaller than the reference examples 101 to 103. Further, in Reference Examples 106 to 108, the amount of convexity and straightness error was smaller than those of Reference Examples 101 to 103 shown in FIG. That is, in Reference Examples 106 to 108, the accuracy can be cut off more accurately than the reference examples 101 to 103. Glass plate. Further, as shown in Reference Examples 106 to 108, the lower the light source output, the smaller the amount of convexity and straightness error. In particular, in Reference Example 108, the amount of convexity was extremely small and was 15 μm.

另一方面,於使雷射光點直徑變小之情形時,無法切斷非強化玻璃板。即,如比較例109所示,將光源之輸出設為200 W之情形時,非強化玻璃板熔融,而無法切斷。即,非強化玻璃之溫度成為徐冷點以上而無法切斷。又,如比較例110所示,將光源之輸出設為100 W之情形時,非強化玻璃板未發生變化。由此,於使雷射光點直徑變小(例如未達板厚)之情形時,不論光源之輸出為多少,均無法切斷非強化玻璃板。 On the other hand, when the diameter of the laser spot is made small, the non-reinforced glass sheet cannot be cut. That is, as shown in Comparative Example 109, when the output of the light source was set to 200 W, the non-reinforced glass sheet was melted and could not be cut. That is, the temperature of the non-reinforced glass is not more than the cold point and cannot be cut. Further, as shown in Comparative Example 110, when the output of the light source was set to 100 W, the non-reinforced glass sheet did not change. Therefore, when the diameter of the laser spot is made small (for example, the plate thickness is not reached), the unreinforced glass plate cannot be cut regardless of the output of the light source.

如此,於強化玻璃板之切斷方法與非強化玻璃板之切斷方法中,切斷之機制根本上不同,裂紋之伸展方式完全不同。因此,於本發明中,利用非強化玻璃板之切斷方法而獲得無法預測之效果。以下,對其原因進行說明。 Thus, in the method of cutting the tempered glass sheet and the method of cutting the non-reinforced glass sheet, the mechanism of cutting is fundamentally different, and the manner of stretching the crack is completely different. Therefore, in the present invention, an unpredictable effect is obtained by the cutting method of the non-reinforced glass sheet. Hereinafter, the reason will be described.

例如,於非強化玻璃板之切斷方法中,使用雷射光與冷卻液之兩者而於玻璃板中形成熱應力場,產生切斷所需之拉伸應力。更具體而言,對玻璃板照射雷射光而於玻璃板內部產生熱應力,針對藉由上述熱應力而產生之壓縮應力,利用冷卻液進行急冷,產生拉伸應力而使裂紋伸展。因此,裂紋之伸展係僅藉由雷射光之照射能量進行,而必需將照射於玻璃板之雷射之功率(W)設定為較大。 For example, in the method of cutting a non-reinforced glass sheet, a thermal stress field is formed in the glass sheet using both the laser light and the cooling liquid to generate a tensile stress required for cutting. More specifically, the glass plate is irradiated with laser light to generate thermal stress inside the glass plate, and the compressive stress generated by the thermal stress is rapidly cooled by the cooling liquid to generate tensile stress to cause crack propagation. Therefore, the extension of the crack is performed only by the irradiation energy of the laser light, and it is necessary to set the power (W) of the laser light irradiated to the glass plate to be large.

於如上所述之方法中,形成於玻璃板之割斷龜裂之前端位置係由使玻璃板冷卻之冷卻液之位置而決定。其原因在 於在冷卻液之位置上產生拉伸應力。因此,若於切斷之中途,中斷利用雷射光之加熱或利用冷卻液之冷卻,則裂紋之伸展停止。 In the method as described above, the position of the front end of the cut glass formed on the glass sheet is determined by the position of the cooling liquid for cooling the glass sheet. The reason is A tensile stress is generated at the position of the coolant. Therefore, if the heating by the laser light or the cooling by the cooling liquid is interrupted during the cutting, the extension of the crack is stopped.

圖17係用以說明使用雷射光切斷非強化玻璃板時作用之應力之圖。於圖17中,表示非強化玻璃板110之俯視圖及產生於非強化玻璃板110之板厚中心部之應力之分佈。如圖17所示,若對非強化玻璃板110照射雷射光,則於雷射光之照射區域122中壓縮應力133發揮作用。該壓縮應力133係藉由雷射光之照射而產生之熱應力。而且,為了與該壓縮應力133均衡,而於照射區域122之掃描方向後方產生拉伸應力135。藉由該拉伸應力135作用於裂紋130,而將非強化玻璃板110切斷。 Fig. 17 is a view for explaining the stress acting on cutting the non-reinforced glass sheet using laser light. In Fig. 17, a plan view of the non-reinforced glass sheet 110 and a distribution of stress generated at the center portion of the thickness of the non-reinforced glass sheet 110 are shown. As shown in FIG. 17, when the non-reinforced glass plate 110 is irradiated with laser light, the compressive stress 133 acts in the irradiation region 122 of the laser light. This compressive stress 133 is a thermal stress generated by irradiation of laser light. Further, in order to equalize the compressive stress 133, a tensile stress 135 is generated in the scanning direction of the irradiation region 122. The tensile stress 135 acts on the crack 130 to cut the non-reinforced glass sheet 110.

如圖17之圖表所示,於非強化玻璃板110中,內部殘留拉伸應力CT大致為零。因此,切斷非強化玻璃板110時作用於裂紋130之拉伸應力135係僅藉由雷射光之照射而產生。由此,為了增大拉伸應力135,而必需提高雷射光之照射能量,或增大雷射光點直徑。因此,於非強化玻璃板110中,難以切斷雷射光之吸收率較小之玻璃。 As shown in the graph of Fig. 17, in the non-reinforced glass sheet 110, the internal residual tensile stress CT is substantially zero. Therefore, the tensile stress 135 acting on the crack 130 when the non-reinforced glass sheet 110 is cut is generated only by irradiation of laser light. Therefore, in order to increase the tensile stress 135, it is necessary to increase the irradiation energy of the laser light or increase the diameter of the laser spot. Therefore, in the non-reinforced glass sheet 110, it is difficult to cut the glass having a small absorption rate of the laser light.

又,切斷非強化玻璃板110時,利用雷射光之照射能量與掃描速度控制裂紋之伸展。此時,若雷射光之照射能量小於切斷所需之照射能量,則裂紋之伸展停止。即,如圖17之圖表所示,為了使裂紋130伸展,必需使較裂紋130之伸展所需之拉伸應力S_th大之拉伸應力作用於裂紋130。由於在非強化玻璃板110中內部殘留拉伸應力CT大致為 零,故必需僅利用雷射光之照射能量產生較該拉伸應力S_th之值大之拉伸應力。 Further, when the non-reinforced glass sheet 110 is cut, the stretching of the crack is controlled by the irradiation energy of the laser light and the scanning speed. At this time, if the irradiation energy of the laser light is smaller than the irradiation energy required for the cutting, the extension of the crack stops. That is, as shown in the graph of Fig. 17, in order to stretch the crack 130, it is necessary to apply a tensile stress larger than the tensile stress S_th required for the extension of the crack 130 to the crack 130. Since the internal residual tensile stress CT in the non-reinforced glass sheet 110 is substantially Zero, it is necessary to use only the irradiation energy of the laser light to generate a tensile stress larger than the value of the tensile stress S_th.

相對於此,於強化玻璃板之切斷方法中,由於本來於玻璃板內部存在內部殘留拉伸應力,故無需如非強化玻璃板之切斷之情形般,僅利用雷射光之照射能量產生較大之拉伸應力。又,於內部殘留拉伸應力為較裂紋之伸展所需之拉伸應力S_th大之拉伸應力之情形時,若稍微使力作用於強化玻璃板而產生裂紋,則因內部殘留拉伸應力而裂紋自己伸展。另一方面,由於內部殘留拉伸應力係整體上存在於玻璃板內部,故只要不控制裂紋之伸展,裂紋便沿意料外之方向伸展。 On the other hand, in the method of cutting a tempered glass sheet, since the internal residual tensile stress is present inside the glass sheet, it is not necessary to use the irradiation energy of the laser light only when the non-reinforced glass sheet is cut. Large tensile stress. Further, when the internal residual tensile stress is a tensile stress which is larger than the tensile stress S_th required for the stretching of the crack, if a force is applied to the tempered glass sheet to cause cracks, the tensile stress is internally retained. The crack stretched by itself. On the other hand, since the internal residual tensile stress is present entirely inside the glass sheet, the crack extends in an unexpected direction as long as the crack is not controlled.

因此,於本發明中,使照射區域之中心之中間層產生較內部殘留拉伸應力之值小之拉伸應力或壓縮應力,而抑制內部殘留拉伸應力所致之裂紋之伸展。即,藉由照射雷射光,使強化玻璃板之中間層中之殘留拉伸應力小於裂紋之伸展所需之拉伸應力S_th,而控制裂紋之伸展。 Therefore, in the present invention, the intermediate layer at the center of the irradiation region is caused to have a tensile stress or a compressive stress which is smaller than the value of the internal residual tensile stress, and the crack extension due to the internal residual tensile stress is suppressed. That is, by irradiating the laser light, the residual tensile stress in the intermediate layer of the tempered glass sheet is made smaller than the tensile stress S_th required for the stretching of the crack, and the stretching of the crack is controlled.

圖18係表示使用雷射光切斷強化玻璃板時作用之應力之一例之圖。於圖18中,表示強化玻璃板10之俯視圖及產生於強化玻璃板10之板厚中心部之應力之分佈。如圖18所示,若對強化玻璃板10照射雷射光,則於雷射光之照射區域22中壓縮應力33發揮作用。又,於照射區域22之掃描方向後方產生拉伸應力35。而且,藉由對該拉伸應力35加上內部殘留拉伸應力,產生較裂紋之伸展所需之拉伸應力S_th大之拉伸應力,藉由作用於裂紋30而將強化玻璃板10 切斷。此時,藉由壓縮應力33而控制裂紋30之伸展。 Fig. 18 is a view showing an example of stress acting when the tempered glass sheet is cut by laser light. In Fig. 18, a plan view of the tempered glass sheet 10 and a distribution of stress generated at the center portion of the tempered glass sheet 10 are shown. As shown in FIG. 18, when the tempered glass sheet 10 is irradiated with laser light, the compressive stress 33 acts in the irradiation region 22 of the laser light. Further, a tensile stress 35 is generated behind the scanning direction of the irradiation region 22. Further, by adding the internal residual tensile stress to the tensile stress 35, a tensile stress larger than the tensile stress S_th required for the stretching of the crack is generated, and the tempered glass sheet 10 is applied by acting on the crack 30. Cut off. At this time, the extension of the crack 30 is controlled by the compressive stress 33.

如圖18之曲線所示,於強化玻璃板10存在內部殘留拉伸應力CT。因此,裂紋30之伸展所需之拉伸應力35亦可較小。換言之,可使藉由為了使較拉伸應力S_th(裂紋30之伸展所需之拉伸應力)大之拉伸應力作用於裂紋30所需之雷射光而產生之壓縮應力33變小。 As shown in the graph of FIG. 18, there is an internal residual tensile stress CT in the tempered glass sheet 10. Therefore, the tensile stress 35 required for the extension of the crack 30 can also be small. In other words, the compressive stress 33 generated by the laser light required to apply the tensile stress which is larger than the tensile stress S_th (the tensile stress required for the stretching of the crack 30) to the crack 30 can be made small.

此處,由於可使切斷強化玻璃板10時所需之壓縮應力33或拉伸應力35小於切斷非強化玻璃110時所需之應力,故可使雷射光之照射能量變小或使雷射光點直徑變小。因此,可提高切斷精度。又,即便為雷射光之吸收率較小之玻璃,亦可容易地切斷。 Here, since the compressive stress 33 or the tensile stress 35 required when the tempered glass sheet 10 is cut can be made smaller than the stress required when the non-reinforced glass 110 is cut, the irradiation energy of the laser light can be made small or the ray can be made The diameter of the spot is reduced. Therefore, the cutting accuracy can be improved. Further, even a glass having a small absorption rate of laser light can be easily cut.

圖19係表示使用雷射光切斷強化玻璃板時作用之應力之其他例的圖。於圖19中,表示強化玻璃板10之俯視圖及產生於強化玻璃板10之板厚中心部之應力之分佈。於圖19所示之強化玻璃板10中,內部殘留拉伸應力CT大於裂紋30之伸展所需之拉伸應力S_th。即,如圖19所示,若對強化玻璃板10照射雷射光,則於雷射光之照射區域22產生較內部殘留拉伸應力CT之值小之拉伸應力37。此處,拉伸應力37係藉由雷射光之照射而產生之壓縮應力33與內部殘留拉伸應力CT之合力。又,於照射區域22之掃描方向後方產生拉伸應力35。於此情形時,藉由使較內部殘留拉伸應力CT之值小之拉伸應力37小於裂紋30之伸展所需之拉伸應力S_th,可抑制裂紋30之伸展。 Fig. 19 is a view showing another example of stress acting when the tempered glass sheet is cut by laser light. In Fig. 19, a plan view of the tempered glass sheet 10 and a distribution of stress generated at the center portion of the tempered glass sheet 10 are shown. In the tempered glass sheet 10 shown in Fig. 19, the internal residual tensile stress CT is larger than the tensile stress S_th required for the stretching of the crack 30. That is, as shown in FIG. 19, when the tempered glass sheet 10 is irradiated with the laser light, the tensile stress 37 which is smaller than the value of the internal residual tensile stress CT is generated in the irradiation region 22 of the laser light. Here, the tensile stress 37 is a resultant force of the compressive stress 33 generated by the irradiation of the laser light and the internal residual tensile stress CT. Further, a tensile stress 35 is generated behind the scanning direction of the irradiation region 22. In this case, the stretching of the crack 30 can be suppressed by making the tensile stress 37 which is smaller than the value of the internal residual tensile stress CT smaller than the tensile stress S_th required for the stretching of the crack 30.

於圖19所示之情形時,亦可使切斷強化玻璃板10時所需 之較內部殘留拉伸應力CT之值小之拉伸應力37或拉伸應力35小於切斷非強化玻璃110時所需之應力,故可使雷射光之照射能量變小或使雷射光點直徑變小。因此,可提高切斷精度。又,即便為雷射光之吸收率較小之玻璃,亦可容易地切斷。 In the case shown in Fig. 19, it is also possible to cut the tempered glass sheet 10 The tensile stress 37 or the tensile stress 35 which is smaller than the value of the internal residual tensile stress CT is smaller than the stress required when the non-reinforced glass 110 is cut, so that the irradiation energy of the laser light can be made small or the diameter of the laser spot can be made small. Become smaller. Therefore, the cutting accuracy can be improved. Further, even a glass having a small absorption rate of laser light can be easily cut.

如上述已說明般,切斷強化玻璃板10時,藉由保持內部殘留拉伸應力CT、雷射光之照射能量及掃描速度之平衡,不會使裂紋30自由擴散而控制裂紋30之伸展。由此,若雷射光之照射能量過小,則較內部殘留拉伸應力CT之值小之拉伸應力37大於裂紋30之伸展所需之拉伸應力S_th,裂紋30之伸展不停止而自由擴散(圖19之情形)。 As described above, when the tempered glass sheet 10 is cut, the balance of the internal residual tensile stress CT, the irradiation energy of the laser light, and the scanning speed is maintained, and the crack 30 is prevented from being freely diffused to control the stretching of the crack 30. Therefore, if the irradiation energy of the laser light is too small, the tensile stress 37 which is smaller than the value of the internal residual tensile stress CT is larger than the tensile stress S_th required for the extension of the crack 30, and the extension of the crack 30 does not stop and is freely diffused ( The situation in Figure 19).

如此,於強化玻璃板之切斷方法與非強化玻璃板之切斷方法中,切斷之機制根本上不同,裂紋之伸展方式完全不同。因此,於本發明中,利用非強化玻璃板之切斷方法而獲得無法預測之效果。 Thus, in the method of cutting the tempered glass sheet and the method of cutting the non-reinforced glass sheet, the mechanism of cutting is fundamentally different, and the manner of stretching the crack is completely different. Therefore, in the present invention, an unpredictable effect is obtained by the cutting method of the non-reinforced glass sheet.

<參考例2> <Reference Example 2>

繼而,對參考例2進行說明。於參考例2中,對內部應變能量UCT與可切斷之照射能量EL之最小值即臨界照射能量Ec之關係進行說明。 Next, Reference Example 2 will be described. In Reference Example 2, the relationship between the internal strain energy U CT and the minimum value of the severable irradiation energy E L , that is, the critical irradiation energy Ec will be described.

於參考例2中,對內部應變能量UCT不同之21個樣品1~21,調查與臨界照射能量Ec之關係。再者,樣品18~21係非強化玻璃板。 In Reference Example 2, the relationship between the critical irradiation energy Ec and the 21 samples 1 to 21 in which the internal strain energy U CT was different was investigated. Furthermore, samples 18 to 21 are non-reinforced glass sheets.

圖20係表示參考例2之切斷預定線之形狀之圖。如圖20所示,參考例2之切斷預定線包含2個直線部與構成曲柄形 狀之2個拐角部(曲率半徑R=5 mm)。 Fig. 20 is a view showing the shape of a line to cut in Reference Example 2. As shown in FIG. 20, the line to cut of Reference Example 2 includes two straight portions and constitutes a crank shape. 2 corners of the shape (curvature radius R = 5 mm).

作為化學強化用之玻璃板,使混合調整複數種原料所得之玻璃原料熔解,將熔解之熔融玻璃成形為板狀。使其徐冷至室溫左右之後,進行切斷、切削、雙面鏡面研磨,藉此製作具有特定厚度之50 mm×50 mm之玻璃板。玻璃原料係以玻璃板相對於雷射光之吸收係數α成為所期望之值之方式,改變氧化鐵(Fe2O3)之粉末相對於相同調配比之基材之添加量而進行調製。 As a glass plate for chemical strengthening, a glass raw material obtained by mixing and adjusting a plurality of raw materials is melted, and the molten glass to be melted is formed into a plate shape. After it was allowed to cool to about room temperature, it was cut, cut, and double-sided mirror-polished, thereby producing a glass plate having a specific thickness of 50 mm × 50 mm. The glass raw material is prepared by changing the amount of iron oxide (Fe 2 O 3 ) powder added to the substrate of the same blending ratio so that the absorption coefficient α of the glass plate with respect to the laser light is a desired value.

各化學強化用玻璃板係以氧化物基準之質量%表示而含有SiO2:60.9%、Al2O3:12.8%、Na2O:12.2%、K2O:5.9%、MgO:6.7%、CaO:0.1%、SrO:0.2%、BaO:0.2%、ZrO2:1.0%,以外加比例而含有特定量之氧化鐵(Fe2O3)。 Each glass plate for chemical strengthening is represented by mass % of oxides, and contains SiO 2 : 60.9%, Al 2 O 3 : 12.8%, Na 2 O: 12.2%, K 2 O: 5.9%, and MgO: 6.7%. CaO: 0.1%, SrO: 0.2%, BaO: 0.2%, and ZrO 2 : 1.0%, and a specific amount of iron oxide (Fe 2 O 3 ) was contained in addition.

各強化玻璃板係藉由將上述化學強化用玻璃板浸漬於KNO3熔鹽中,進行離子交換處理之後,使其冷卻至室溫左右而製作。KNO3熔鹽之溫度或浸漬時間等處理條件係以內部殘留拉伸應力CT成為所期望之值之方式設定。 Each of the tempered glass sheets is prepared by immersing the above-mentioned glass plate for chemical strengthening in a KNO 3 molten salt, performing ion exchange treatment, and then cooling it to about room temperature. The processing conditions such as the temperature of the KNO 3 molten salt or the immersion time are set such that the internal residual tensile stress CT becomes a desired value.

強化玻璃板之內部殘留拉伸應力CT(MPa)係利用表面應力計FSM-6000(折原製作所製造)測定表面壓縮應力CS(MPa)及壓縮應力層(正面層及背面層)之厚度DOL(μm),利用其測定值與強化玻璃板之厚度t1(μm)使用以下之式1而計算。 The internal residual tensile stress CT (MPa) of the tempered glass sheet is measured by the surface stress meter FSM-6000 (manufactured by Orthogonal Separation Co., Ltd.) to measure the surface compressive stress CS (MPa) and the thickness of the compressive stress layer (front layer and back layer) DOL (μm) The calculated value and the thickness t 1 (μm) of the tempered glass sheet were calculated using the following formula 1.

CT=(CS×DOL)/(t1-2×DOL)...式1 CT=(CS×DOL)/(t 1 -2×DOL)...Form 1

內部應變能量UCT(J/m2)係使用強化玻璃板之楊氏模數Y(MPa)根據以下之式2而求得。 The internal strain energy U CT (J/m 2 ) was determined according to the following formula 2 using the Young's modulus Y (MPa) of the tempered glass sheet.

UCT={CT2×(t1-2×DOL)}/(2×Y)...式2 U CT ={CT 2 ×(t 1 -2×DOL)}/(2×Y)...Form 2

每單位照射面積之雷射光之照射能量係當將未由強化玻璃板反射而入射之有效之雷射輸出設為Pe(W),將雷射光之掃描速度設為v(mm/s),將照射於強化玻璃板10之雷射光之光束直徑設為(mm)時,可由Pe/(v×)(單位:J/mm2)表示。然而,為了判斷切斷性,較佳為使用將其乘上光束直徑(mm)所得之每單位長度之雷射光之照射能量EL(J/mm)。之後對詳細之原因進行敍述。將該照射能量EL(J/mm)示於以下之式4。再者,有效之雷射輸出Pe(W)可使用雷射輸出P(W)與強化玻璃板中之反射率r(%),表示為Pe=P×(1-r/100)。 The irradiation energy of the laser light per unit irradiation area is set to Pe (W) when the effective laser output that is not reflected by the tempered glass sheet is set, and the scanning speed of the laser light is set to v (mm/s). The beam diameter of the laser light irradiated to the tempered glass plate 10 is set to (mm), by Pe/(v× ) (Unit: J/mm 2 ) indicates. However, in order to judge the cuttability, it is preferable to use it to multiply the beam diameter. (mm) The obtained irradiation energy E L (J/mm) per unit length of the laser light. The detailed reasons are described later. This irradiation energy E L (J/mm) is shown in the following formula 4. Furthermore, the effective laser output Pe(W) can be expressed as Pe=P×(1-r/100) using the laser output P(W) and the reflectance r(%) in the strengthened glass plate.

EL=Pe/v...式4 E L =Pe/v... Equation 4

關於樣品1~11之作為照射能量EL之臨界值(critical value)之臨界照射能量Ec係藉由使照射能量EL每次改變約1(J/mm)重複進行切斷而求得。此時,在雷射光之掃描速度v(mm/s)固定之狀態下,僅使雷射輸出P(W)每次改變2.5 W。 The critical irradiation energy Ec which is the critical value of the irradiation energy E L of the samples 1 to 11 is obtained by repeatedly cutting the irradiation energy E L by about 1 (J/mm). At this time, in a state where the scanning speed v (mm/s) of the laser light is fixed, only the laser output P (W) is changed by 2.5 W each time.

又,關於非強化玻璃板之樣品18~21之臨界照射能量Ec係藉由使照射能量EL每次改變約4(J/mm)重複進行切斷而求得。此時,在雷射光之掃描速度v(mm/s)固定之狀態下,僅使雷射輸出P(W)每次改變10 W。 Further, the critical irradiation energy Ec of the samples 18 to 21 of the non-reinforced glass plate was determined by repeating the cutting by changing the irradiation energy E L by about 4 (J/mm). At this time, in a state where the scanning speed v (mm/s) of the laser light is fixed, only the laser output P (W) is changed by 10 W each time.

另一方面,關於樣品12~17之臨界照射能量Ec係藉由使照射能量EL緩慢變化重複進行切斷而求得。此時,在雷射輸出P(W)固定之狀態下,僅使雷射光之掃描速度v(mm/s) 每次改變0.25 mm/s。 On the other hand, the critical irradiation energy Ec of the samples 12 to 17 was obtained by repeating the cutting by slowly changing the irradiation energy E L . At this time, in a state where the laser output P (W) is fixed, only the scanning speed v (mm/s) of the laser light is changed by 0.25 mm/s each time.

圖21係關於樣品1~21表示雷射波長λ、內部應變能量UCT、臨界照射能量Ec及用以導出兩者之各條件之表。自表之左行起依序表示雷射波長λ(nm)、樣品編號、強化玻璃板之楊氏模數Y(MPa)、線膨脹係數αL(K-1)、密度ρ(g/mm3)、比熱c(J/g/K)、厚度t(mm)、吸收係數α(mm-1)、強化玻璃板中之反射率r(%)、表面壓縮應力CS(MPa)、正面層及背面層之厚度DOL(μm)、內部殘留拉伸應力CT(MPa)、內部應變能量UCT(J/m2)、雷射光之掃描速度v(mm/s)、雷射光之光束直徑(mm)、雷射輸出P(W)、有效之雷射輸出Pe(W)、臨界照射能量Ec(J/mm)、臨界吸收能量Ea(J/mm)、臨界切斷指數Kc(N/mm)。 Fig. 21 is a table showing the laser wavelength λ, the internal strain energy U CT , the critical irradiation energy Ec, and the conditions for deriving the two with respect to the samples 1 to 21. From the left row of the table, the laser wavelength λ (nm), the sample number, the Young's modulus Y (MPa) of the tempered glass plate, the linear expansion coefficient α L (K -1 ), and the density ρ (g/mm) are sequentially indicated. 3 ), specific heat c (J/g/K), thickness t (mm), absorption coefficient α (mm -1 ), reflectance r (%) in tempered glass sheet, surface compressive stress CS (MPa), front layer And the thickness of the back layer DOL (μm), internal residual tensile stress CT (MPa), internal strain energy U CT (J / m 2 ), scanning speed of laser light v (mm / s), beam diameter of laser light (mm), laser output P (W), effective laser output Pe (W), critical irradiation energy Ec (J / mm), critical absorption energy Ea (J / mm), critical cutoff index Kc (N / Mm).

如圖21所示,關於樣品1~11、18~21,對於雷射光之光源,使用纖維雷射(中心波段:1070 nm),關於樣品12~17,對於雷射光之光源,利用使用中紅外光參數振盪器之Cr:ZnSe雷射(中心波段:2950 nm)。 As shown in Fig. 21, regarding samples 1 to 11, 18 to 21, a fiber laser (center band: 1070 nm) is used for the light source of the laser light, and samples 12 to 17 are used for the source of the laser light. Cr:ZnSe laser (center band: 2950 nm) of the optical parametric oscillator.

又,由於任一樣品之材質均相同,故如圖21所示,為楊氏模數Y=74000 MPa、線膨脹係數αL=9.8×10-6 K-1、密度ρ=2.48×10-3 g/mm3、比熱c=0.918 J/g/K而共通。 Moreover, since the materials of any of the samples are the same, as shown in Fig. 21, the Young's modulus Y = 74000 MPa, the linear expansion coefficient α L = 9.8 × 10 -6 K -1 , and the density ρ = 2.48 × 10 - 3 g/mm 3 and specific heat c=0.918 J/g/K are common.

再者,如圖21所示,關於樣品1~11,設為光束直徑=0.1 mm,關於樣品12~17,設為光束直徑=0.2 mm。又,關於非強化玻璃板之樣品18,設為光束直徑=0.5 mm,關於樣品19,設為光束直徑=0.8 mm,關於樣品20,設為光束直徑=1.0 mm,關於樣品21,設為光束直 徑=2.0 mm。 Furthermore, as shown in FIG. 21, regarding the samples 1 to 11, the beam diameter is set. =0.1 mm, for sample 12~17, set to beam diameter = 0.2 mm. Also, regarding the sample 18 of the non-reinforced glass plate, the beam diameter is set to =0.5 mm, for sample 19, set to beam diameter =0.8 mm, for sample 20, set to beam diameter =1.0 mm, for sample 21, set to beam diameter =2.0 mm.

又,關於所有樣品,自雷射光照射側使用直徑1 mm 之噴嘴而噴出流量15 L/min之空氣。此處,強化玻璃板與噴嘴前端之距離(間隙)設為3 mm。 Also, for all samples, a diameter of 1 mm is used from the side of the laser irradiation The nozzle sprayed air at a flow rate of 15 L/min. Here, the distance (gap) between the tempered glass plate and the tip end of the nozzle is set to 3 mm.

圖22A係表示圖21之表所示之臨界照射能量Ec之內部應變能量UCT依存性之圖表。圖22A之橫軸為內部應變能量UCT(J/m2),縱軸為臨界照射能量Ec(J/mm)。於圖22A中,●標記表示樣品1~11、18~21(雷射波長λ=1070 nm),○標記表示樣品12~17(雷射波長λ=2950 nm)。 Fig. 22A is a graph showing the dependence of the internal strain energy U CT of the critical irradiation energy Ec shown in the table of Fig. 21. The horizontal axis of Fig. 22A is the internal strain energy U CT (J/m 2 ), and the vertical axis is the critical irradiation energy Ec (J/mm). In Fig. 22A, the ● mark indicates samples 1 to 11, 18 to 21 (laser wavelength λ = 1070 nm), and the mark ○ indicates samples 12 to 17 (laser wavelength λ = 2950 nm).

如圖21、圖22A所示,於雷射波長λ=1070 nm之情形時,若強化玻璃板之內部應變能量UCT≧2.5 J/m2,則臨界照射能量Ec=9~15 J/mm而穩定(樣品1~10)。相對於此,若內部應變能量UCT<2.5 J/m2,則急遽(具體而言,數倍左右)上升直至臨界照射能量Ec=56 J/mm為止(樣品11)。伴隨著該臨界照射能量Ec之上升,於樣品11中,切斷精度亦變差。根據該結果可知:於切斷強化玻璃板之情形時,藉由設為內部應變能量UCT≧2.5 J/m2,可以較小之照射能量精度佳地切斷。 As shown in FIG. 21 and FIG. 22A, when the laser beam has an internal strain energy U CT ≧2.5 J/m 2 at a laser wavelength of λ=1070 nm, the critical irradiation energy Ec=9-15 J/mm. Stable (samples 1 to 10). On the other hand, when the internal strain energy U CT <2.5 J/m 2 , the enthalpy (specifically, several times) is increased until the critical irradiation energy Ec=56 J/mm (sample 11). As the critical irradiation energy Ec rises, the cutting accuracy also deteriorates in the sample 11. From this result, it is understood that when the tempered glass sheet is cut, by setting the internal strain energy U CT ≧2.5 J/m 2 , it is possible to cut the irradiation energy with a small precision.

進而,無法對非強化玻璃板之樣品18進行切斷。即,若板厚t(=0.7 mm)以下之光束直徑=0.5 mm,則無法切斷非強化玻璃板之樣品。而且,關於光束直徑=0.8 mm之樣品19,臨界照射能量Ec=83 J/mm,關於光束直徑=1.0 mm之樣品20,臨界照射能量Ec=76 J/mm,關於光束直徑=2.0 mm之樣品21,臨界照射能量Ec=65 J/mm。即,隨 著光束直徑之增大,臨界照射能量Ec逐漸減少。此處,光束直徑越大,雷射光之中心與裂紋之前端位置越遠,從而切斷精度降低。因此,於切斷強化玻璃板時,光束直徑較佳為設為板厚t以下,進而較佳為設為板厚t之1/2以下。 Further, the sample 18 of the non-reinforced glass sheet could not be cut. That is, if the plate thickness is less than t (=0.7 mm), the beam diameter is =0.5 mm, the sample of the non-reinforced glass plate cannot be cut. Moreover, regarding the beam diameter Sample of =0.8 mm, 19, critical illumination energy Ec = 83 J/mm, with respect to beam diameter Sample 20 with =1.0 mm, critical illumination energy Ec=76 J/mm, with respect to beam diameter Sample 21 of =2.0 mm, critical illumination energy Ec = 65 J/mm. That is, as the beam diameter increases, the critical irradiation energy Ec gradually decreases. Here, the larger the beam diameter, the farther the center of the laser light is from the front end of the crack, and the cutting accuracy is lowered. Therefore, when cutting the tempered glass sheet, the beam diameter It is preferably set to have a thickness t or less, and more preferably 1/2 or less of the thickness t.

根據圖22A之圖表認為於內部應變能量UCT=2.5 J/m2左右,產生切斷模式之轉換。具體而言,作為用以切斷強化玻璃板之裂紋伸展能量,認為於內部應變能量UCT<2.5 J/m2之情形時,除內部應變能量以外,亦需要雷射光之照射能量(參照圖18),於內部應變能量UCT≧2.5 J/m2之情形時,僅成為內部應變能量(參照圖19)。 According to the graph of Fig. 22A, it is considered that the internal strain energy U CT = 2.5 J/m 2 or so, and the switching of the cut mode is generated. Specifically, as the crack extension energy for cutting the tempered glass sheet, it is considered that when the internal strain energy U CT <2.5 J/m 2 , in addition to the internal strain energy, the irradiation energy of the laser light is also required (refer to the figure). 18) In the case of the internal strain energy U CT ≧ 2.5 J/m 2 , only the internal strain energy is obtained (refer to Fig. 19).

又,藉由使雷射波長λ自1070 nm向2950 nm變更,強化玻璃板之吸收係數α自0.011 mm-1向0.59 mm-1提高。因此,如圖21、22所示,於內部應變能量UCT≧2.5 J/m2時,亦可自臨界照射能量Ec=9~15 J/mm左右(樣品1~10)降低2位直至臨界照射能量Ec=0.3~0.5 J/mm(樣品12~15)為止。 Further, by changing the laser wavelength λ from 1070 nm to 2950 nm, the absorption coefficient α of the strengthened glass plate is increased from 0.011 mm -1 to 0.59 mm -1 . Therefore, as shown in Figs. 21 and 22, when the internal strain energy U CT ≧ 2.5 J/m 2 , the critical irradiation energy Ec = 9 to 15 J/mm (sample 1 to 10) can be lowered to 2 points. The irradiation energy Ec=0.3~0.5 J/mm (sample 12~15).

如此,藉由將雷射波長設為3000 nm左右,可不使透明度降低而提高吸收係數α,而可減少照射能量。因此,加熱效率提高。而且,無需根據強化玻璃板之組成而大幅度變更雷射光之照射條件。 Thus, by setting the laser wavelength to about 3000 nm, the absorption coefficient α can be increased without lowering the transparency, and the irradiation energy can be reduced. Therefore, the heating efficiency is improved. Moreover, it is not necessary to greatly change the irradiation conditions of the laser light depending on the composition of the tempered glass sheet.

進而,如上所述,可將強化玻璃載置於較切斷之強化玻璃板大之台板上,於更穩定之狀態下切斷。又,由於透過光急遽減少,故亦無需其處理。進而,由於強化玻璃板之端面中之反射光亦急遽減少,故不易帶來不良影響。 Further, as described above, the tempered glass can be placed on a platen larger than the cut tempered glass plate, and cut in a more stable state. Moreover, since the transmission of light is reduced, there is no need for processing. Further, since the reflected light in the end surface of the tempered glass sheet is also drastically reduced, it is less likely to cause adverse effects.

又,雷射波長λ為2950 nm之情形亦與1070 nm之情形同 樣地,若內部應變能量UCT<2.5 J/m2,則急遽上升直至臨界照射能量Ec=0.9~1.2 J/mm左右或其以上為止(樣品16、17)。伴隨著該臨界照射能量Ec之上升,於樣品16、17中,切斷精度亦變差。根據該結果可知:於以雷射波長λ=2950 nm切斷強化玻璃板之情形時,藉由設為內部應變能量UCT≧2.5 J/m2,亦可以較小之照射能量精度佳地切斷。 In addition, when the laser wavelength λ is 2950 nm, as in the case of 1070 nm, if the internal strain energy U CT <2.5 J/m 2 , the temperature rises sharply until the critical irradiation energy Ec=0.9 to 1.2 J/mm or The above (samples 16 and 17). With the increase in the critical irradiation energy Ec, the cutting accuracy was also deteriorated in the samples 16 and 17. According to the results, it can be seen that when the tempered glass sheet is cut at the laser wavelength λ=2950 nm, by setting the internal strain energy U CT ≧2.5 J/m 2 , it is possible to cut the irradiation energy with a small precision. Broken.

此處,臨界照射能量Ec中用於切斷之能量係由強化玻璃板吸收之能量(以下,稱為臨界吸收能量)Ea。臨界吸收能量Ea(J/mm)可使用臨界照射能量Ec(J/mm)、吸收係數α(mm-1)、厚度t2(mm),根據朗伯-比爾定律之法則而由下式表示。 Here, the energy for cutting in the critical irradiation energy Ec is the energy (hereinafter referred to as critical absorption energy) Ea absorbed by the tempered glass sheet. The critical absorption energy Ea (J/mm) can be used as the critical irradiation energy Ec (J/mm), the absorption coefficient α (mm -1 ), and the thickness t 2 (mm), which is expressed by the following formula according to the law of Lambert-Beer law. .

Ea=Ec×exp(-α×t2)...式5 Ea=Ec×exp(-α×t 2 )... Equation 5

如圖21所示,關於臨界吸收能量Ea(J/mm)之值,即便對雷射波長λ為2950 nm之情形與1070 nm之情形進行比較,亦幾乎不存在差。 As shown in Fig. 21, regarding the value of the critical absorption energy Ea (J/mm), even when the laser wavelength λ is 2950 nm and the case of 1070 nm, there is almost no difference.

為了將由強化玻璃板之厚度或材質所引起之影響排除,而更一般化,對藉由利用臨界吸收能量Ea之內部加熱(溫度變化△T)而產生之熱應力(臨界壓縮應力)σc進行考察。該臨界壓縮應力σc係切斷所需之最小之壓縮應力。此處,臨界壓縮應力σc係因於以內部殘留拉伸應力CT為基準之情形時成為壓縮應力,故表現為「臨界壓縮應力」。然而,如圖18、圖19所示,於以產生於強化玻璃板之板厚中心部之應力進行考慮之情形時係以內部殘留拉伸應力CT與臨界 壓縮應力σc之合力表示,因此亦有成為拉伸應力之情形。 In order to eliminate the influence caused by the thickness or material of the tempered glass sheet, it is more general, and the thermal stress (critical compressive stress) σc generated by the internal heating (temperature change ΔT) using the critical absorption energy Ea is examined. . The critical compressive stress σc is the minimum compressive stress required to cut. Here, the critical compressive stress σc is a "critical compressive stress" because it is a compressive stress when it is based on the internal residual tensile stress CT. However, as shown in FIG. 18 and FIG. 19, the internal residual tensile stress CT and the criticality are considered in consideration of the stress generated at the center portion of the thickness of the tempered glass sheet. The resultant force of the compressive stress σc is expressed, and thus there is also a case where it is a tensile stress.

臨界壓縮應力σc係如圖18、19所示,具有高斯分佈般之分佈。該臨界壓縮應力σc之積分值(圖18、19中之斜線部之面積)決定可否切斷。若內部應變能量UCT相同,則認為臨界壓縮應力σc之積分值固定而不取決於強化玻璃板之厚度t、材質。由於臨界壓縮應力σc之分佈之寬度與光束直徑成比例,故可認為臨界壓縮應力σc之積分值亦與σc×成比例。 The critical compressive stress σc is as shown in Figs. 18 and 19 and has a Gaussian distribution. The integral value of the critical compressive stress σc (the area of the hatched portion in Figs. 18 and 19) determines whether or not the cut can be made. If the internal strain energy U CT is the same, it is considered that the integral value of the critical compressive stress σc is fixed without depending on the thickness t and material of the tempered glass sheet. Width and beam diameter due to the distribution of critical compressive stress σc Proportional, so the integral value of the critical compressive stress σc can also be considered as σc× Proportionate.

此處,為了簡單化,設為即便藉由內部加熱,強化玻璃板之板厚t亦不發生變化,而於正面層13與背面層15之間被約束,藉此產生該臨界壓縮應力σc。即,考慮兩端約束模型。 Here, for simplification, it is assumed that the thickness t of the tempered glass sheet does not change even by internal heating, and is restrained between the front layer 13 and the back layer 15, whereby the critical compressive stress σc is generated. That is, consider the two-end constraint model.

臨界壓縮應力σc(MPa)可使用楊氏模數Y(MPa)、線膨脹係數αL(K-1)、溫度變化△T(K),而由下式6表示。 The critical compressive stress σc (MPa) can be expressed by the following formula 6 by using Young's modulus Y (MPa), linear expansion coefficient α L (K -1 ), and temperature change ΔT (K).

σc=Y×αL×△T...式6 Σc=Y×α L ×ΔT...Form 6

又,因供給臨界吸收能量Ea而引起之強化玻璃板之溫度變化△T可根據△T=(臨界吸收能量)/(雷射照射部之強化玻璃板之熱電容)而求得。 Further, the temperature change ΔT of the tempered glass sheet caused by the supply of the critical absorption energy Ea can be obtained from ΔT = (critical absorption energy) / (thermal capacitance of the tempered glass sheet of the laser irradiation portion).

此處,若將雷射照射面積設為S1(mm2),則(臨界吸收能量)可使用將臨界吸收能量Ea(J/mm)除以(mm)所得之每單位面積之臨界吸收能量Ea/(J/mm2),而由Ea×S1/(J)表示。 Here, if the laser irradiation area is set to S 1 (mm 2 ), (critical absorption energy) can be used by dividing the critical absorption energy Ea (J/mm) by (mm) The critical absorbed energy per unit area Ea/ (J/mm 2 ), and by Ea×S 1 / (J) said.

又,若將強化玻璃板中之加熱區域之面積設為S2(mm2),則(雷射照射部之強化玻璃板之熱電容)可使用強 化玻璃板之厚度t2(mm)、密度ρ(g/mm3)、比熱c(J/g/K),而由S2×t2×ρ×c(J/K)表示。 Further, if the reinforcing area of the heating area of the glass plate is set to S 2 (mm 2), the (enhanced laser irradiated portion of the thermal capacity of the glass plate) may be used to strengthen the glass sheet of a thickness t 2 (mm), a density ρ (g/mm 3 ), specific heat c (J/g/K), and represented by S 2 × t 2 × ρ × c (J/K).

因此,溫度變化△T(K)可由下式7表示。 Therefore, the temperature change ΔT(K) can be expressed by the following formula 7.

藉由將式7代入於式6,臨界壓縮應力σc(MPa)可由下式8表示。 By substituting the formula 7 into the formula 6, the critical compressive stress σc (MPa) can be expressed by the following formula 8.

此處,為了簡單化,若考慮S1/S2=固定,則與應求出之臨界壓縮應力σc之積分值成比例之σc×可由下式9表示。 Here, for simplification, considering that S 1 /S 2 = fixed, σc × which is proportional to the integral value of the critical compressive stress σc to be obtained It can be represented by the following formula 9.

將式9之Kc命名為臨界切斷指數。表示可切斷之臨界值之該臨界切斷指數Kc之值越小,則切斷越容易,臨界切斷指數Kc之值越大,則切斷越難。如此,切斷性可根據式4所示之每單位長度之雷射光之照射能量EL(J/mm)而進行判斷。 The Kc of Formula 9 is named as the critical cutoff index. The smaller the value of the critical cutoff index Kc indicating the critical value that can be cut, the easier the cutting is, and the larger the value of the critical cutoff index Kc, the more difficult it is to cut. Thus, the cutting property can be judged based on the irradiation energy E L (J/mm) of the laser light per unit length shown in Formula 4.

構成臨界切斷指數Kc之楊氏模數Y、線膨脹係數αL、密度ρ、比熱c之任一個均具有溫度依存性,但始終使用室溫之值作為指標。 The Young's modulus Y, the linear expansion coefficient α L , the density ρ, and the specific heat c constituting the critical cutting index Kc each have temperature dependence, but the value of room temperature is always used as an index.

將臨界切斷指數Kc(N/mm)示於圖21之最右行。 The critical cutoff index Kc (N/mm) is shown in the rightmost row of FIG.

圖22B係表示圖21之表所示之臨界切斷指數Kc之內部應變能量UCT依存性之圖表。圖22B之橫軸為內部應變能量UCT(J/m2),縱軸為臨界切斷指數Kc(N/mm)。於圖22B中,●標記表示樣品1~11、18~21(雷射波長λ=1070 nm),○標記 表示樣品12~17(雷射波長λ=2950 nm)。 Fig. 22B is a graph showing the dependence of the internal strain energy U CT on the critical cutoff index Kc shown in the table of Fig. 21. The horizontal axis of Fig. 22B is the internal strain energy U CT (J/m 2 ), and the vertical axis is the critical cutoff index Kc (N/mm). In Fig. 22B, the ● mark indicates samples 1 to 11, 18 to 21 (laser wavelength λ = 1070 nm), and the mark ○ indicates samples 12 to 17 (laser wavelength λ = 2950 nm).

如圖21、圖22B所示,不論雷射波長λ為多少,若強化玻璃板之內部應變能量UCT≧2.5 J/m2,則臨界切斷指數Kc=50 N/mm左右而穩定(樣品1~10、12~15)。相對於此,若內部應變能量UCT<2.5 J/m2,則臨界切斷指數Kc=150 N/mm(樣品16)或超過200 N/mm(樣品11、17)。進而,若為非強化玻璃板,則超過250 N/mm(樣品18~21)。此處,光束直徑越小,則臨界切斷指數Kc越大,若光束直徑為0.5 mm以下,則無法切斷(樣品18)。 21, FIG. 22B, no matter how much the laser wavelength λ, if the glass sheets to strengthen internal strain energy U CT ≧ 2.5 J / m 2 , the critical cut index Kc = 50 N / mm and about stable (sample 1~10, 12~15). On the other hand, if the internal strain energy U CT is <2.5 J/m 2 , the critical cutoff index Kc=150 N/mm (sample 16) or more than 200 N/mm (samples 11 and 17). Further, in the case of a non-reinforced glass sheet, it exceeds 250 N/mm (samples 18 to 21). Here, the smaller the beam diameter, the larger the critical cutting index Kc, and if the beam diameter is 0.5 mm or less, the cutting is impossible (sample 18).

伴隨著該臨界切斷指數Kc之上升,切斷精度亦變差。根據該結果可知:於切斷強化玻璃板之情形時,藉由設為內部應變能量UCT≧2.5 J/m2,可以較小之照射能量精度佳地切斷。又,光束直徑越大,則雷射光之中心與裂紋之前端位置越遠,從而切斷精度降低。因此,光束直徑較佳為設為板厚t2(mm)以下,進而較佳為設為板厚t2(mm)之1/2以下。 As the critical cutoff index Kc rises, the cutting accuracy also deteriorates. From this result, it is understood that when the tempered glass sheet is cut, by setting the internal strain energy U CT ≧2.5 J/m 2 , it is possible to cut the irradiation energy with a small precision. Further, the larger the beam diameter, the farther the center of the laser light is from the front end of the crack, and the cutting accuracy is lowered. Therefore, the beam diameter It is preferably set to have a thickness t 2 (mm) or less, and more preferably 1/2 or less of the thickness t 2 (mm).

每單位長度之照射能量EL(J/mm)時之切斷指數K係藉由將式5中之Ec置換成EL,並且代入於式9中之Ea,而可由下式10表示。此處,若切斷指數K為臨界切斷指數Kc以上,則可切斷。 The cutting index K at the irradiation energy E L (J/mm) per unit length is represented by the following formula 10 by substituting Ec in the formula 5 with E L and substituting Ea in the formula 9. Here, if the cutting index K is equal to or greater than the critical cutting index Kc, it can be cut.

K=EL×exp(-α×t2)×(Y×αL)/(t2×ρ×c)...式10 K=E L ×exp(-α×t 2 )×(Y×α L )/(t 2 ×ρ×c) Equation 10

進而,藉由將式4代入於式10,獲得以下之式11。 Further, by substituting Formula 4 into Formula 10, the following Formula 11 is obtained.

K=Pe/v×exp(-α×t2)×(Y×αL)/(t2×ρ×c)...式11 K=Pe/v×exp(−α×t 2 )×(Y×α L )/(t 2 ×ρ×c) Equation 11

根據圖22B,若內部應變能量UCT≧2.5 J/m2,則臨界切 斷指數Kc為50 N/mm左右,因此,可以滿足切斷指數K≦150 N/mm之照射能量EL充分切斷。另一方面,根據圖22B,若內部應變能量UCT<2.5 J/m2,則臨界切斷指數Kc成為150 N/mm以上,因此,以滿足切斷指數K≦150 N/mm之照射能量EL無法切斷或難以切斷。藉由設為內部應變能量UCT≧2.5 J/m2,並且設為滿足切斷指數K≦150 N/mm之照射能量EL,可以較小之照射能量精度佳地切斷。藉由設為滿足切斷指數K≦100 N/mm之照射能量EL,可以更小之照射能量精度更佳地切斷。 According to Fig. 22B, if the internal strain energy U CT ≧ 2.5 J/m 2 , the critical cutoff index Kc is about 50 N/mm, and therefore, the irradiation energy E L which can satisfy the cutting index K≦150 N/mm is sufficiently cut. Broken. On the other hand, according to Fig. 22B, if the internal strain energy U CT < 2.5 J/m 2 , the critical cutoff index Kc becomes 150 N/mm or more, and therefore, the irradiation energy satisfying the cutoff index K≦150 N/mm is satisfied. E L cannot be cut or difficult to cut. By setting the internal strain energy U CT ≧2.5 J/m 2 and the irradiation energy E L satisfying the cutting index K≦150 N/mm, the irradiation energy can be cut with a small precision. By setting the irradiation energy E L which satisfies the cutting index K ≦ 100 N/mm, it is possible to cut the irradiation energy finer with a smaller precision.

實施例Example <實施例1> <Example 1>

以下,對本發明之實施例1進行說明。於以下所示之實施例1中,使用板厚為0.8 mm、表面壓縮應力CS為818 MPa、正面層及背面層各自之厚度DOL為27.4 μm、殘留拉伸應力CT為30 MPa之強化玻璃板。 Hereinafter, a first embodiment of the present invention will be described. In Example 1 shown below, a tempered glass sheet having a thickness of 0.8 mm, a surface compressive stress CS of 818 MPa, a thickness DOL of 27.4 μm each of the front and back layers, and a residual tensile stress CT of 30 MPa was used. .

強化玻璃板之殘留拉伸應力CT係利用表面應力計FSM-6000(折原製作所製造)測定表面壓縮應力CS及壓縮應力層(正面層及背面層)之深度DOL,利用其測定值與強化玻璃板之厚度t使用以下之式12利用計算而求得。 The residual tensile stress of the tempered glass sheet is measured by the surface stress meter FSM-6000 (manufactured by Ohara, Ltd.) to measure the surface compressive stress CS and the depth DOL of the compressive stress layer (front layer and back layer), and the measured value and the tempered glass sheet are used. The thickness t is obtained by calculation using Equation 12 below.

CT=(CS×DOL)/(t-2×DOL)...式12 CT=(CS×DOL)/(t-2×DOL)... Equation 12

於本實施例中,自強化玻璃板10切斷圖23所示之形狀之樣品80(本實施例之情形時,50 mm×90 mm)。即,自強化玻璃板10切出樣品80時,自切斷起點81起開始雷射光之掃描,使雷射光沿圖23所示之箭頭之方向沿著切斷預定線88 掃描,於切斷結束點82結束雷射光之掃描。樣品80之拐角部之曲率半徑設為R=5 mm。又,於強化玻璃板之端部之切斷起點81預先形成初期裂紋,未於強化玻璃板之正面形成劃線。雷射光之光源設為纖維雷射(中心波段:1070 nm)。 In the present embodiment, the sample 80 of the shape shown in Fig. 23 was cut from the strengthened glass plate 10 (in the case of the present embodiment, 50 mm × 90 mm). That is, when the sample 80 is cut out from the tempered glass sheet 10, scanning of the laser light is started from the cutting start point 81, and the laser light is directed along the line to cut along the direction of the arrow shown in FIG. Scanning ends the scanning of the laser light at the cutting end point 82. The radius of curvature of the corner portion of the sample 80 was set to R = 5 mm. Further, initial cracks were formed in advance at the cutting start point 81 of the end portion of the tempered glass sheet, and no scribe line was formed on the front surface of the tempered glass sheet. The source of the laser light is set to a fiber laser (central band: 1070 nm).

雷射光之光束直徑設為0.1 mm。雷射光之掃描速度係於直線區間設為5 mm/s,於拐角部設為2.5 mm/s。此處,拐角部包含自圖24之裂紋產生位置83跟前直至切斷結束點82為止之區間。又,於本實施例中,當使雷射光掃描而切斷強化玻璃板時,一面使用圖10所示之冷卻噴嘴28使強化玻璃板冷卻一面使雷射光掃描。此時使用之冷卻噴嘴之開口部之直徑1設為2 mm,冷卻噴嘴與強化玻璃板10之正面之距離Gap設為3 mm。又,於冷卻噴嘴內流動之空氣之流量設為50 L/min。 The beam diameter of the laser beam is set to 0.1 mm. The scanning speed of the laser light is set to 5 mm/s in the straight section and 2.5 mm/s in the corner. Here, the corner portion includes a section from the crack generation position 83 of FIG. 24 to the cutting end point 82. Further, in the present embodiment, when the laser beam is scanned and the tempered glass sheet is cut, the laser beam is cooled while the tempered glass sheet is cooled by using the cooling nozzle 28 shown in Fig. 10 . The diameter of the opening of the cooling nozzle used at this time 1 is set to 2 mm, and the distance Gap between the cooling nozzle and the front surface of the tempered glass plate 10 is set to 3 mm. Further, the flow rate of the air flowing in the cooling nozzle was set to 50 L/min.

於本實施例中,測定圖24所示之藉由意料外之裂紋86自裂紋產生位置83朝向切斷線84伸展而形成之凸部89之凸量P1,使用該凸量P1之量評估自強化玻璃板中切斷之樣品80之品質。 In the present embodiment, the convexity P1 of the convex portion 89 formed by the unexpected crack 86 extending from the crack generating position 83 toward the cutting line 84 as shown in Fig. 24 is measured, and the amount of the convexity P1 is used to evaluate The quality of the cut sample 80 in the tempered glass sheet is strengthened.

於圖25中表示切斷強化玻璃板時之拐角部中之每單位照射面積之雷射光之照射能量(單位能量)與凸量之關係。再者,於本實施例中,藉由使雷射輸出分別變化為40 W、50 W、75 W,而改變雷射光之單位能量。雷射光之單位能量係藉由將各雷射輸出(W)、雷射光之掃描速度(拐角部)2.5 mm/s及光束直徑0.1 mm代入於上述之式3而求得。 Fig. 25 shows the relationship between the irradiation energy (unit energy) and the convex amount of the laser light per unit irradiation area in the corner portion when the tempered glass sheet is cut. Furthermore, in the present embodiment, the unit energy of the laser light is changed by changing the laser output to 40 W, 50 W, and 75 W, respectively. The unit energy of the laser light is obtained by substituting the laser output (W), the scanning speed (corner portion) of the laser light by 2.5 mm/s, and the beam diameter of 0.1 mm into the above formula 3.

如圖25所示,於雷射光之單位能量為160 J/mm2(雷射輸出=40 W)之樣品No.1~No.3中,凸量分別成為0.4 mm、0.5 mm、0.45 mm。於雷射光之單位能量為200 J/mm2(雷射輸出=50 W)之樣品No.4~No.6中,凸量分別成為0.2 mm、0.4 mm、0.25 mm。於雷射光之單位能量為300 J/mm2(雷射輸出=75 W)之樣品No.7、No.8中,凸量分別成為0.15 mm、0.1 mm。 As shown in Fig. 25, in samples No. 1 to No. 3 in which the unit light energy of the laser light was 160 J/mm 2 (laser output = 40 W), the convexities were 0.4 mm, 0.5 mm, and 0.45 mm, respectively. In samples No. 4 to No. 6 in which the unit energy of laser light is 200 J/mm 2 (laser output = 50 W), the convexities are 0.2 mm, 0.4 mm, and 0.25 mm, respectively. In samples No. 7 and No. 8 in which the unit energy of laser light was 300 J/mm 2 (laser output = 75 W), the convexities were 0.15 mm and 0.1 mm, respectively.

於圖26中表示雷射光之單位能量與凸部89之凸量之關係。圖26所示之圖表係繪製圖25之表中之各樣品之單位能量與凸量所得之圖表。根據圖25及圖26所示之結果可知:有隨著雷射光之單位能量增加而凸部89之凸量減少之傾向。 The relationship between the unit energy of the laser light and the convexity of the convex portion 89 is shown in FIG. The graph shown in Fig. 26 is a graph obtained by plotting the unit energy and the convex amount of each sample in the table of Fig. 25. As is apparent from the results shown in FIGS. 25 and 26, there is a tendency that the convex amount of the convex portion 89 decreases as the unit energy of the laser light increases.

即,於自裂紋產生位置83跟前直至切斷結束點82為止之區間內,使照射於強化玻璃板之雷射光之單位能量越大,則雷射光之掃描方向後方產生之拉伸應力越大。而且,掃描方向後方產生之拉伸應力越大,則可精度越佳地控制掃描方向後方之裂紋之伸展方向,因此,認為凸部89之凸量減少。 In other words, the larger the unit energy of the laser light irradiated to the tempered glass sheet, the larger the tensile stress generated in the scanning direction of the laser light is in the interval from the crack generating position 83 to the cutting end point 82. Further, the larger the tensile stress generated in the scanning direction, the more accurately the direction of the crack in the scanning direction can be controlled. Therefore, it is considered that the convex amount of the convex portion 89 is reduced.

<實施例2> <Example 2>

以下,對本發明之實施例2進行說明。於以下所示之實施例2中,使用板厚為1.1 mm、表面壓縮應力CS為716 MPa、正面層及背面層各自之厚度DOL為68.8 μm、殘留拉伸應力CT為51 MPa之強化玻璃板。 Hereinafter, a second embodiment of the present invention will be described. In Example 2 shown below, a tempered glass sheet having a thickness of 1.1 mm, a surface compressive stress CS of 716 MPa, a thickness DOL of 68.8 μm for each of the front and back layers, and a residual tensile stress CT of 51 MPa was used. .

於本實施例中,自強化玻璃板10中切斷圖23所示之形狀 之樣品80(本實施例之情形時,35 mm×50 mm)。雷射光之光源設為纖維雷射(中心波段:1070 nm)。雷射光之光束直徑設為0.1 mm。雷射光之掃描速度係於直線區間內設為5 mm/s,於拐角部設為1 mm/s。此處,拐角部包含自圖24之裂紋產生位置83跟前直至切斷結束點82為止之區間。 In the present embodiment, the shape shown in FIG. 23 is cut from the tempered glass sheet 10. Sample 80 (35 mm x 50 mm in the case of this example). The source of the laser light is set to a fiber laser (central band: 1070 nm). The beam diameter of the laser beam is set to 0.1 mm. The scanning speed of the laser light is set to 5 mm/s in the straight section and 1 mm/s in the corner. Here, the corner portion includes a section from the crack generation position 83 of FIG. 24 to the cutting end point 82.

又,於本實施例中,對使雷射光掃描時使強化玻璃板冷卻之情形與不進行冷卻之情形進行實驗。於使雷射光掃描時使強化玻璃板冷卻之情形時,使用圖10所示之冷卻噴嘴28。此時使用之冷卻噴嘴之開口部之直徑1設為1 mm,冷卻噴嘴與強化玻璃板10之正面之距離Gap設為2 mm。又,於冷卻噴嘴內流動之空氣之流量設為15 L/min。 Further, in the present embodiment, an experiment was conducted in which the tempered glass sheet was cooled and the cooling was not performed when the laser light was scanned. When the tempered glass sheet is cooled while scanning the laser light, the cooling nozzle 28 shown in Fig. 10 is used. The diameter of the opening of the cooling nozzle used at this time 1 is set to 1 mm, and the distance Gap between the cooling nozzle and the front surface of the tempered glass plate 10 is set to 2 mm. Further, the flow rate of the air flowing in the cooling nozzle was set to 15 L/min.

於本實施例中,亦測定圖24所示之凸部89之凸量P1,使用該凸量P1之量評估自強化玻璃板中切斷之樣品之品質。 In the present embodiment, the convexity P1 of the convex portion 89 shown in Fig. 24 was also measured, and the quality of the sample cut from the tempered glass sheet was evaluated using the amount of the convexity P1.

於圖27中表示強化玻璃板之冷卻之有無與凸量之關係。再者,於本實施例中,由於雷射輸出為80 W,雷射光之拐角部中之掃描速度為1 mm/s,光束直徑為0.1 mm,故根據上述之式3而拐角部中之每單位照射面積之雷射光之照射能量成為800 J/mm2Fig. 27 shows the relationship between the presence or absence of cooling of the tempered glass sheet and the amount of convexity. Furthermore, in the present embodiment, since the laser output is 80 W, the scanning speed in the corner portion of the laser light is 1 mm/s, and the beam diameter is 0.1 mm, each of the corner portions is obtained according to the above formula 3. The irradiation energy of the laser light per unit irradiation area becomes 800 J/mm 2 .

如圖27所示,於樣品No.9(無冷卻)中,凸量為0.15 mm。相對於此,於樣品No.10(有冷卻)中,凸量為0.1 mm。由此,使雷射光進行掃描時使強化玻璃板冷卻之情形時凸部之凸量變少。認為其原因在於:於使強化玻璃板之正面冷卻之情形時,產生壓縮應力之位置(雷射照射區域)與產生拉伸應力之位置(雷射光之掃描方向後方)之距離 變短(參照圖12),而可精度更佳地控制掃描方向後方之裂紋之伸展方向。 As shown in Fig. 27, in sample No. 9 (without cooling), the convexity was 0.15 mm. On the other hand, in sample No. 10 (with cooling), the amount of convexity was 0.1 mm. Thereby, when the laser beam is scanned while the laser beam is being scanned, the convexity of the convex portion is reduced. The reason is considered to be the distance between the position at which the compressive stress is generated (the laser irradiation region) and the position at which the tensile stress is generated (the rear direction of the scanning direction of the laser light) when the front surface of the tempered glass sheet is cooled. Shortening (refer to FIG. 12), the direction of extension of the crack behind the scanning direction can be more accurately controlled.

以上,結合上述實施形態及實施例對本發明進行了說明,但並不僅限定於上述實施形態及實施例之構成,勿庸置疑,包含在本案申請專利範圍之技術方案之發明之範圍內業者可完成之各種變形、修正、組合。 The present invention has been described above with reference to the above-described embodiments and examples, but is not limited to the configurations of the above-described embodiments and examples, and it is needless to say that the invention can be completed within the scope of the invention of the technical solution of the scope of the patent application of the present application. Various deformations, corrections, and combinations.

該申請案係主張以2011年12月7日申請之日本申請案特願2011-267745及2012年7月9日申請之日本申請案特願2012-153400為基礎之優先權,並將其揭示之所有內容引入本文。 The application is based on the priority of Japanese Patent Application No. 2011-267745, filed on Dec. 7, 2011, and Japanese Patent Application No. 2012-153400, filed on Jul. 9, 2012. All content is incorporated herein.

10‧‧‧強化玻璃板 10‧‧‧Strengthened glass panels

12‧‧‧正面 12‧‧‧ positive

13‧‧‧正面層 13‧‧‧ front layer

14‧‧‧背面 14‧‧‧ Back

15‧‧‧背面層 15‧‧‧Back layer

17‧‧‧中間層 17‧‧‧Intermediate

20‧‧‧雷射光 20‧‧‧Laser light

22‧‧‧照射區域 22‧‧‧ illuminated area

25‧‧‧透鏡 25‧‧‧ lens

28‧‧‧冷卻噴嘴 28‧‧‧Cooling nozzle

30‧‧‧裂紋 30‧‧‧ crack

33‧‧‧壓縮應力 33‧‧‧Compressive stress

35‧‧‧拉伸應力 35‧‧‧ tensile stress

40‧‧‧樣品 40‧‧‧ samples

41‧‧‧切斷起點 41‧‧‧ cut off the starting point

42‧‧‧切斷結束點 42‧‧‧ cut end point

43‧‧‧裂紋產生位置 43‧‧‧ crack location

44‧‧‧切斷線(側面) 44‧‧‧ cut line (side)

45‧‧‧切斷線 45‧‧‧ cut line

46‧‧‧裂紋 46‧‧‧ crack

48‧‧‧切斷預定線 48‧‧‧ cut the booking line

49‧‧‧凸部 49‧‧‧ convex

50‧‧‧樣品 50‧‧‧ samples

52‧‧‧切斷結束點 52‧‧‧ cut-off point

53‧‧‧裂紋產生位置 53‧‧‧ crack location

54‧‧‧切斷線(側面) 54‧‧‧ cut line (side)

55‧‧‧切斷線 55‧‧‧ cut line

56‧‧‧裂紋 56‧‧‧ crack

58‧‧‧切斷預定線 58‧‧‧ cut the booking line

59‧‧‧凸部 59‧‧‧ convex

60‧‧‧樣品 60‧‧‧ samples

61‧‧‧切斷起點 61‧‧‧ cut off the starting point

62‧‧‧切斷結束點 62‧‧‧ cut-off point

63‧‧‧裂紋產生位置 63‧‧‧ crack location

64‧‧‧切斷線(側面) 64‧‧‧ cut line (side)

65‧‧‧切斷線 65‧‧‧ cut line

66‧‧‧裂紋 66‧‧‧ crack

68‧‧‧切斷預定線 68‧‧‧ cut the booking line

69‧‧‧凸部 69‧‧‧ convex

71‧‧‧雷射輸出部 71‧‧‧Laser output

72‧‧‧玻璃保持驅動部 72‧‧‧glass maintenance drive

73‧‧‧控制部 73‧‧‧Control Department

74‧‧‧控制程式生成部 74‧‧‧Control Program Generation Department

82‧‧‧切斷結束點 82‧‧‧ cut-off point

83‧‧‧裂紋產生位置 83‧‧‧ crack location

84‧‧‧切斷線(側面) 84‧‧‧ cut line (side)

86‧‧‧裂紋 86‧‧‧ crack

88‧‧‧切斷預定線 88‧‧‧ cut the booking line

89‧‧‧凸部 89‧‧‧ convex

α1‧‧‧銳角 11‧‧‧ acute angle

圖1係強化玻璃板之剖面圖。 Figure 1 is a cross-sectional view of a tempered glass sheet.

圖2係表示圖1所示之強化玻璃板之殘留應力之分佈之圖。 Fig. 2 is a view showing the distribution of residual stress of the tempered glass sheet shown in Fig. 1.

圖3係用以說明強化玻璃板之切斷方法之圖。 Fig. 3 is a view for explaining a cutting method of a tempered glass sheet.

圖4係沿著圖3之A-A線之剖面圖。 Figure 4 is a cross-sectional view taken along line A-A of Figure 3.

圖5係沿著圖3之B-B線之剖面圖。 Figure 5 is a cross-sectional view taken along line B-B of Figure 3.

圖6係用以說明實施形態之強化玻璃板之切斷方法之圖。 Fig. 6 is a view for explaining a method of cutting a tempered glass sheet according to an embodiment.

圖7A係表示照射於強化玻璃板之雷射光之條件不恰當之情形時之強化玻璃板之切斷狀態之一例的圖。 Fig. 7A is a view showing an example of a state in which the tempered glass sheet is cut in a case where the conditions of the laser light irradiated to the tempered glass sheet are inappropriate.

圖7B係表示使用本實施形態之強化玻璃板之切斷方法之情形時之強化玻璃板之切斷狀態之一例的圖。 Fig. 7B is a view showing an example of a state in which the tempered glass sheet is cut in a case where the tempered glass sheet cutting method of the embodiment is used.

圖8A係表示照射於強化玻璃板之雷射光之條件不恰當之 情形時之強化玻璃板之切斷狀態之其他例的圖。 Fig. 8A shows that the conditions of the laser light irradiated to the tempered glass sheet are inappropriate. In the case of the case, the other example of the cut state of the glass plate is strengthened.

圖8B係表示使用本實施形態之強化玻璃板之切斷方法之情形時之強化玻璃板之切斷狀態之其他例的圖。 Fig. 8B is a view showing another example of the state in which the tempered glass sheet is cut in the case where the tempered glass sheet cutting method of the embodiment is used.

圖9A係表示照射於強化玻璃板之雷射光之條件不恰當之情形時之強化玻璃板之切斷狀態之其他例的圖。 FIG. 9A is a view showing another example of the cut state of the tempered glass sheet when the conditions of the laser light irradiated to the tempered glass sheet are not appropriate.

圖9B係表示使用本實施形態之強化玻璃板之切斷方法之情形時之強化玻璃板之切斷狀態之其他例的圖。 Fig. 9B is a view showing another example of the state in which the tempered glass sheet is cut in the case where the tempered glass sheet cutting method of the embodiment is used.

圖10係用以說明實施形態之強化玻璃板之切斷方法中使用之冷卻噴嘴之剖面圖。 Fig. 10 is a cross-sectional view showing a cooling nozzle used in the method for cutting a tempered glass sheet according to the embodiment.

圖11係用以說明實施形態之強化玻璃板之切斷方法中之冷卻效果之圖。 Fig. 11 is a view for explaining the cooling effect in the method of cutting a tempered glass sheet according to the embodiment.

圖12係用以說明實施形態之強化玻璃板之切斷方法中之冷卻效果之圖。 Fig. 12 is a view for explaining the cooling effect in the method of cutting a tempered glass sheet according to the embodiment.

圖13係用以說明實施形態之強化玻璃板之切斷裝置之圖。 Fig. 13 is a view for explaining a cutting device for a tempered glass sheet according to an embodiment.

圖14係表示關於強化玻璃板之切斷結果之表。 Fig. 14 is a table showing the results of cutting of the tempered glass sheet.

圖15係表示關於非強化玻璃板之切斷結果之表。 Fig. 15 is a table showing the results of cutting about the non-reinforced glass sheet.

圖16係表示關於強化玻璃板及非強化玻璃板之切斷結果之表。 Fig. 16 is a table showing the results of cutting of the tempered glass sheet and the non-reinforced glass sheet.

圖17係用以說明使用雷射光切斷非強化玻璃板時作用之應力之圖。 Fig. 17 is a view for explaining the stress acting on cutting the non-reinforced glass sheet using laser light.

圖18係表示使用雷射光切斷強化玻璃板時作用之應力之一例之圖。 Fig. 18 is a view showing an example of stress acting when the tempered glass sheet is cut by laser light.

圖19係表示使用雷射光切斷強化玻璃板時作用之應力之 其他例之圖。 Figure 19 is a diagram showing the stress acting on the tempered glass sheet by laser light. A diagram of other examples.

圖20係表示參考例2之切斷預定線之形狀之圖。 Fig. 20 is a view showing the shape of a line to cut in Reference Example 2.

圖21係關於樣品1~12表示雷射波長λ、內部應變能量UCT、臨界照射能量Ec及用以導出兩者之各條件之表。 Fig. 21 is a table showing the laser wavelength λ, the internal strain energy U CT , the critical irradiation energy Ec, and the conditions for deriving the two with respect to the samples 1 to 12.

圖22A係表示圖11之表所示之臨界照射能量Ec之內部應變能量UCT依存性的圖表。 Fig. 22A is a graph showing the dependence of the internal strain energy U CT of the critical irradiation energy Ec shown in the table of Fig. 11 .

圖22B係表示圖11之表所示之臨界切斷指數Kc之內部應變能量UCT依存性的圖表。 Fig. 22B is a graph showing the dependence of the internal strain energy U CT on the critical cutting index Kc shown in the table of Fig. 11.

圖23係用以說明強化玻璃板之切斷方法之圖。 Fig. 23 is a view for explaining a cutting method of a tempered glass sheet.

圖24係用以說明強化玻璃板之切斷方法之圖。 Fig. 24 is a view for explaining a cutting method of the tempered glass sheet.

圖25係表示每單位照射面積之雷射光之照射能量與凸量之關係之表。 Fig. 25 is a table showing the relationship between the irradiation energy and the convex amount of the laser light per unit irradiation area.

圖26係表示每單位照射面積之雷射光之照射能量與凸量之關係之圖表。 Fig. 26 is a graph showing the relationship between the irradiation energy and the convex amount of the laser light per unit irradiation area.

圖27係表示強化玻璃板之冷卻之有無與凸量之關係之表。 Fig. 27 is a table showing the relationship between the presence or absence of cooling of the tempered glass sheet and the amount of convexity.

10‧‧‧強化玻璃板 10‧‧‧Strengthened glass panels

40‧‧‧樣品 40‧‧‧ samples

41‧‧‧切斷起點 41‧‧‧ cut off the starting point

42‧‧‧切斷結束點 42‧‧‧ cut end point

43‧‧‧裂紋產生位置 43‧‧‧ crack location

44‧‧‧切斷線(側面) 44‧‧‧ cut line (side)

45‧‧‧切斷線 45‧‧‧ cut line

α1‧‧‧銳角 11‧‧‧ acute angle

Claims (15)

一種強化玻璃板之切斷方法,其係針對包含具有殘留壓縮應力之正面層及背面層與形成於該正面層及背面層之間且具有內部殘留拉伸應力CT(MPa)之中間層的強化玻璃板,藉由使照射於該強化玻璃板之雷射光之照射區域移動而予以切斷,將上述正面層及上述背面層之厚度設為DOL(μm),將上述強化玻璃板之厚度設為t1(μm),將上述強化玻璃板之楊氏模數設為Y(MPa)時,將由下式表現之基於上述內部殘留拉伸應力CT之每單位面積之應變能量UCT(J/m2)設為2.5 J/m2以上,朝向位於上述強化玻璃板之側面之切斷結束點以相對於上述側面成為銳角之方式切斷上述強化玻璃板時,於自距離上述強化玻璃板之上述切斷結束點特定距離跟前之特定位置直至上述切斷結束點為止之區間內,使照射於上述強化玻璃板之每單位照射面積之雷射光之照射能量大於呈直線狀切斷上述強化玻璃板時所需之每單位照射面積之雷射光之照射能量,UCT={CT2×(t1-2×DOL)}/(2×Y)。 A method for cutting a tempered glass sheet, which is directed to strengthening a front layer and a back layer including residual compressive stress and an intermediate layer formed between the front layer and the back layer and having an internal residual tensile stress CT (MPa) The glass plate is cut by moving the irradiation region of the laser light irradiated on the tempered glass sheet, and the thickness of the front layer and the back layer is DOL (μm), and the thickness of the tempered glass sheet is set to t 1 (μm), when the Young's modulus of the tempered glass sheet is Y (MPa), the strain energy U CT per unit area based on the internal residual tensile stress CT expressed by the following formula (J/m) 2 ) when it is 2.5 J/m 2 or more, when the tempered glass sheet is cut so as to be perpendicular to the side surface at the cutting end point of the side surface of the tempered glass sheet, the tempered glass sheet is at a distance from the tempered glass sheet. The irradiation energy of the laser light irradiated per unit irradiation area of the tempered glass sheet is greater than the linear cut of the strong portion in the interval from the specific position at the end of the cutting point to the cutting end point. Laser beam irradiation energy per unit area of the irradiation of the time required for the glass sheet, U CT = {CT 2 × (t 1 -2 × DOL)} / (2 × Y). 如請求項1之強化玻璃板之切斷方法,其中將入射至上述強化玻璃板之上述雷射光之有效之輸出設為Pe(W),將上述雷射光之掃描速度設為v(mm/s),將上述強化玻璃板相對於上述雷射光之吸收係數設為α(mm-1),將上述強化玻璃板之厚度設為t2(mm),將上述強化玻璃板之線膨 脹係數設為αL(K-1),將上述強化玻璃板之密度設為ρ(g/mm3),將上述強化玻璃板之比熱設為c(J/g/K)時,將由下式表現之切斷指數K(N/mm)設為150 N/mm以下,K=Pe/v×exp(-α×t2)×(Y×αL)/(t2×ρ×c)。 The method for cutting a tempered glass sheet according to claim 1, wherein the effective output of the laser light incident on the tempered glass sheet is Pe (W), and the scanning speed of the laser light is set to v (mm/s). The absorption coefficient of the tempered glass sheet with respect to the laser light is α (mm -1 ), the thickness of the tempered glass sheet is t 2 (mm), and the linear expansion coefficient of the tempered glass sheet is set to α L (K -1 ), when the density of the tempered glass sheet is ρ (g/mm 3 ), and when the specific heat of the tempered glass sheet is c (J/g/K), the cut is expressed by the following formula The breaking index K (N/mm) is set to 150 N/mm or less, and K = Pe / v × exp (-α × t 2 ) × (Y × α L ) / (t 2 × ρ × c). 如請求項1或2之強化玻璃板之切斷方法,其中上述強化玻璃板與上述雷射光係將上述強化玻璃板相對於上述雷射光之吸收係數設為α(mm-1),將上述強化玻璃板之厚度設為t2(mm)時,滿足0<α×t2≦3.0之式。 The method for cutting a tempered glass sheet according to claim 1 or 2, wherein the tempered glass sheet and the laser light system have an absorption coefficient of the tempered glass sheet with respect to the laser light of α (mm -1 ), When the thickness of the glass plate is t 2 (mm), the formula of 0 < α × t 2 ≦ 3.0 is satisfied. 如請求項1至3中任一項之強化玻璃板之切斷方法,其中距離上述切斷結束點特定距離跟前之上述特定位置係位於朝向上述強化玻璃板之側面產生意料外之裂紋之裂紋產生位置跟前。 The method of cutting a tempered glass sheet according to any one of claims 1 to 3, wherein the specific position at a certain distance from the end of the cutting end is located at a crack originating in an unexpected crack toward the side of the tempered glass sheet. Position is ahead. 如請求項1至4中任一項之強化玻璃板之切斷方法,其中將上述雷射光之掃描位置與上述切斷結束點連結之線段與上述強化玻璃板之側面所成之角度越小,則照射於上述強化玻璃板之每單位照射面積之雷射光之照射能量越大。 The method of cutting a tempered glass sheet according to any one of claims 1 to 4, wherein an angle formed by a line segment connecting the scanning position of the laser light to the cutting end point and a side surface of the tempered glass sheet is smaller. The irradiation energy of the laser light irradiated per unit irradiation area of the above tempered glass sheet is larger. 如請求項1至5中任一項之強化玻璃板之切斷方法,其中藉由使上述雷射光之照射區域之移動速度變慢,而使上述每單位照射面積之雷射光之照射能量變大。 The method for cutting a tempered glass sheet according to any one of claims 1 to 5, wherein the irradiation energy of the laser light per unit irradiation area is increased by slowing a moving speed of the irradiation area of the laser light . 如請求項1至6中任一項之強化玻璃板之切斷方法,其中藉由使上述雷射光之輸出變大,而使上述每單位照射面積之雷射光之照射能量變大。 The method of cutting a tempered glass sheet according to any one of claims 1 to 6, wherein the irradiation energy of the laser light per unit irradiation area is increased by increasing the output of the laser light. 如請求項1至7中任一項之強化玻璃板之切斷方法,其中 藉由使上述雷射光之照射區域之面積變小,而使上述每單位照射面積之雷射光之照射能量變大。 The method for cutting a tempered glass sheet according to any one of claims 1 to 7, wherein By making the area of the irradiation region of the laser light small, the irradiation energy of the laser light per unit irradiation area is increased. 如請求項3至8中任一項之強化玻璃板之切斷方法,其中隨著上述強化玻璃板之吸收係數α變大,而使上述每單位照射面積之雷射光之照射能量變小。 The method for cutting a tempered glass sheet according to any one of claims 3 to 8, wherein the irradiation energy of the laser light per unit irradiation area is made smaller as the absorption coefficient α of the tempered glass sheet is increased. 如請求項1至9中任一項之強化玻璃板之切斷方法,其中隨著上述強化玻璃板之熱膨脹係數變大,而使上述每單位照射面積之雷射光之照射能量變小。 The method for cutting a tempered glass sheet according to any one of claims 1 to 9, wherein the irradiation energy of the laser light per unit irradiation area is made small as the thermal expansion coefficient of the tempered glass sheet is increased. 如請求項1至10中任一項之強化玻璃板之切斷方法,其中隨著上述強化玻璃板之厚度變厚,而使上述每單位照射面積之雷射光之照射能量變大。 The method for cutting a tempered glass sheet according to any one of claims 1 to 10, wherein, as the thickness of the tempered glass sheet is increased, the irradiation energy of the laser light per unit irradiation area is increased. 如請求項1至11中任一項之強化玻璃板之切斷方法,其中於上述區間內,進而使上述雷射光之照射區域之周圍冷卻。 The method of cutting a tempered glass sheet according to any one of claims 1 to 11, wherein in the interval, the periphery of the irradiation region of the laser light is further cooled. 如請求項12之強化玻璃板之切斷方法,其中於上述強化玻璃板之正面及背面中之至少一者中使上述雷射光之照射區域之周圍冷卻。 The method of cutting a tempered glass sheet according to claim 12, wherein the periphery of the irradiation region of the laser light is cooled in at least one of a front surface and a back surface of the tempered glass sheet. 如請求項12或13之強化玻璃板之切斷方法,其中藉由自噴嘴噴出氣體而使上述雷射光之照射區域之周圍冷卻。 A method of cutting a tempered glass sheet according to claim 12 or 13, wherein the periphery of the irradiation region of the laser light is cooled by ejecting gas from the nozzle. 一種強化玻璃板切斷裝置,其係針對包含具有殘留壓縮應力之正面層及背面層與形成於該正面層及背面層之間且具有內部殘留拉伸應力之中間層的強化玻璃板,藉由使照射於該強化玻璃板之雷射光之照射區域移動而予以切斷,且其包含: 玻璃保持驅動部,其保持上述強化玻璃板,並且使該強化玻璃板沿特定方向移動;雷射輸出部,其輸出用以切斷上述強化玻璃板之雷射光;控制部,其基於控制程式控制上述玻璃保持驅動部及上述雷射輸出部;及控制程式生成部,其生成上述控制程式;上述控制程式生成部生成如下之控制程式:朝向位於上述強化玻璃板之側面之切斷結束點以相對於上述側面成為銳角之方式切斷上述強化玻璃板時,於自距離上述強化玻璃板之上述切斷結束點特定距離跟前之特定位置直至上述切斷結束點為止之區間內,照射於上述強化玻璃板之每單位照射面積之雷射光之照射能量大於呈直線狀切斷上述強化玻璃板時所需之每單位照射面積之雷射光之照射能量。 A tempered glass sheet cutting device for a tempered glass sheet comprising a front layer and a back layer having residual compressive stress and an intermediate layer formed between the front layer and the back layer and having internal residual tensile stress The irradiation region of the laser light irradiated to the tempered glass sheet is moved and cut, and includes: a glass holding drive portion that holds the tempered glass sheet and moves the tempered glass sheet in a specific direction; a laser output portion that outputs laser light for cutting the tempered glass sheet; and a control portion that is controlled based on a control program The glass holding drive unit and the laser output unit; and a control program generating unit that generates the control program; the control program generating unit generates a control program that faces the cutting end point on the side surface of the tempered glass sheet When the tempered glass sheet is cut so that the side surface becomes an acute angle, the tempered glass is irradiated from a specific position at a predetermined distance from the end of the tempered glass sheet to the end of the cutting end point. The irradiation energy of the laser light per unit irradiation area of the panel is larger than the irradiation energy of the laser light per unit irradiation area required for cutting the tempered glass sheet in a straight line.
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