TW201241394A - Heat dissipation module and manufacturing method thereof - Google Patents

Heat dissipation module and manufacturing method thereof Download PDF

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Publication number
TW201241394A
TW201241394A TW100111509A TW100111509A TW201241394A TW 201241394 A TW201241394 A TW 201241394A TW 100111509 A TW100111509 A TW 100111509A TW 100111509 A TW100111509 A TW 100111509A TW 201241394 A TW201241394 A TW 201241394A
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Taiwan
Prior art keywords
heat
manufacturing
dissipation module
conducting component
heat dissipation
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TW100111509A
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Chinese (zh)
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TWI494533B (en
Inventor
Jun-Ming Wu
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Asia Vital Components Co Ltd
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Publication of TWI494533B publication Critical patent/TWI494533B/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed are a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a fixing element and at least one heat conduction element. The fixing element comprises a first clamping arm and a second clamping arm. The first clamping arm and the second clamping arm are set opposite to each other. The heat conduction element is arranged between the first and second clamping arms and is fixed by being clamped by the first and second clamping arms. At the same time when a stamping operation is applied to form an outer configuration and the structure of the fixing element, the fixing element and the heat conduction element are combined together as a unity, so that the manufacturing cost can be greatly reduced and the efficiency of heat dissipation is improved.

Description

201241394 六、發明說明: 【發明所屬之技術領域】 一種散熱触及其製造方法,尤指—種可降低生產成本的散 熱模組及其製造方法。 【先前技術】 現打散熱模_主要係由散減座搭轉設鮮所組成該 散熱基座與職管fBm叫接之方式作固定,崎兩者穩固結 合,但當兩者若為獨雜之異金屬(如導熱管為銅材f,散執雜 片為銘材質)因鱗質本身無法㈣—般焊接方式與其他材質結 合’故於進行焊接時需朗特殊焊接方式(如氬焊)此種焊接法 僅能適用於珊㈣㈣質作焊接;然而此種焊接方式確不能適 用於與銅材質之異材f作焊接,故兩者欲進行 =施以鍍層披覆,以使後續的焊接工作得以順= 另者,亦有業者係於散熱基座開設孔洞或溝槽以供熱 以^者㈣結合’但此""散賴_由餘基座接觸舞 源後吸_熱源之熱量再傳雜熱管,此 = 管直接與__物聯⑽了 === 空 質量亦較為笨重且成本高,不論是安裝或運趙 間’對於内部空間較小需要散熱之場合财_。 故習知具有下列缺點: 1. 熱傳導效率差; 2. 製造成本較高; 3. 使用場合受限。 201241394 【發明内容】 模组本發社主要目的在提供—騎_單且可快物合的散熱 造方ί發明另—目的在提供—種可降低生麵本的散熱模組之製 為達上述目的,本,係提出—種散熱模組,係包含:一固 定件、至少-導熱元件,所咖定件具有―第—㈣及一第 臂,該第-、二夾臂係相互對應;該導熱元件係設於該第一、二 夾臂間,並受該第一、二夾臂夾固。 係 為達上述目的,本發明係提出一種散熱模組之製造方法, 包含下列步驟: 提供一金屬板材及至少一導熱元件; 一第二夾 對該金屬板材施以第一次沖壓加工成型—第一 臂; 一 對該金屬板材施以第二次沖壓加卫,成型1定件之外型. 將該導熱元件放置於該已成型之固定件—侧,並對該第一,、二 夾臂^外力向稱熱雜緊靠’令該導㈣件及該固定件 兩者結合。 可輕易 本發明之散減組整體結構錄f知更為簡單輕便且 與熱管可直接結合。 再者,透過本發明所提供之製造方法係可大幅降低生產成 本,故本發明係具有下列優點: 1. 結構簡單輕便; 2. 熱傳導效率佳; 201241394 3.節省製造成本。 【實施方式】 圖 之上述目的及其結構與功能上的特性,將依據所附 式之較佳實施例予以說明。 八1 ' 2 ^ ’係為本翻散熱模組之第—實施例之立體 ^ "圖,如圖所示’本發明之散熱模組卜係包含、固定 件11、至少一導熱元件12; 所=定件u具有-第一夹臂U1及一第二夹臂ιΐ2’該第 一夾是111、112係相互對應。 述第所^―夾臂1U與該_ U間具有—第—夾_,所 述第—夾#112與該固定件U間亦具有一第二失角114。 1112戶夾臂⑴具有—第—開放侧1U1及—第二開放侧 及一第三開放側1113及一第一 1114係__411 連接知1114,该第-連接端 側i =^件丨1相連接;所述第二夾臂112具有一第四開放 端1124,j五開放側1122及—第六開放侧1123及-第二連接 "第-連接端1124係與該固定件u相連接。 _熱元件12係具有—吸熱面121,該導熱元件12係被設於 二夾臂m、112間’並受該第—、二夾臂⑴、112夹 可直接翻成—體,藉由發明之設計,可令該吸熱面121 以為陕_ 本實施例係以熱管作為說明實施例,但並不引 =戶!第3圖’係為本發職熱模組之第二實施例之立體組合圖, 不,本實施例係部分結構與前述第一實施例相同故在此 201241394 ,不再贅述’惟本實_與前述第—實補之刊處係為所述固 定件π更具有一第一延伸端115及一第二延伸端116及—第三延 伸端117及一第四延伸端118,該第一、二、三、四延伸端、 116、117、118分別由該固定件丨丨向相反該固定件u之方向延伸 所構形’該第一、二、三、四延伸端115、116、117、118分別具 有一第一透孔1151及一第二透孔丨161及一第三透孔lm及一第 四透孔1181,並用以供對應的一鎖固件4(如螺絲件)穿設固定在 一機板5上。 請參閱第4至13圖’係為本發明散熱模組之製造方法之步驟 流程圖及加工示意圖,並一併參閱第丨、2圖,如圖所示,本發明 散熱模組之製造方法,係包含下列步驟: 51 ·提供一金屬板材及至少一導熱元件; 係提供一金屬板材2及一導熱元件12,所述導熱元件12係可 為熱管及均溫板及平板式熱管及具導熱之金屬其中任一,於本實 施例係以熱管作為說明實施例,但並不引以為限。 52 .對該金屬板材施以第一次沖壓加工成型一 一及一 ; 將所述金屬板材2置於-沖壓加工機具3上進行第一次沖壓 加工,透過沖壓加工之沖縫加工於該金屬板材2成型—第一夾臂 111及一第二夾臂112。 53 .對該金屬板材施以第二次沖壓加工,成型一固定件之外 型; 對前述金屬板材2進行第二次沖壓加工,本次沖壓加工係為 下料加工,對該金屬板材2透過沖壓加工機具3之沖頭31施以快 速之衝力沿該固定件11外型輪廓由該金屬板材2上打出並獲得該 201241394 固定件11。 -、二夾以該已成型之固定件-側’並對該第 件兩者結合。λ…、元件緊靠’令該導熱元件及該固定 過::二:=臂搭::::2兩者貼合,並透 ::=:令, 再者,此一步驟亦可以人工之 對該第-夾臂m及該第二夾臂丨° •手八(圖中未示) 力,令該第—夾们u向該導熱元件12施以外 定。 "第一夾# 112對該導熱元件12夾持固 限,步沖壓加工作為朗實施例但並不引以為 限亦可為連續沖壓加工作為加工方式。 ΐ使得以熟縣合之缺點,射大m少賴独之體 夏。 發明之散熱模組i係可精簡傳統習知散熱模組需要基 積與重 、Α本發騎提供之另—優點係為職熱模組之製造方法’該製 绝方法係可縮短散熱模組之製造工時、^ ^ ^ 【圖式簡單說明】 翻^成本之目的。 1圖係為本發難組之第—實施例之立體分解圖 第2圖係為本發明散熱模組之第—實施例之立體組合圖 第3圖係為本發明散熱模組之第二實施例之立體組合圖 第4圖係林㈣散減組之製造方法之步職程圖; 第5圖係為本發明散熱模組之製造方法之加工示意圖; 201241394 發明散熱模組之製造方法之 第7圖係為本發·熱模組 第8圖係為本路w万沄之力工不意圖’ 第9圖择^ 散熱模組之製造方法之加工示意圖; 第ίο圖明散織組之製造方法之加王示意圖; =圖料本翻散細組之製造方法之加工示意圖 圖係為本發明散熱模組之製造方法之加工示意圖 第12圖係為本發明散熱模組之製造方法之加工示意圖 第13圖係為本翻散麵組之製造方法之加工示意圖 【主要元件符號說明】 散熱模組1 固定件11 第一夾臂111 第一開放側1111 第二開放侧1112 第三開放侧1113 第一連接端1114 第二夾臂112 第四開放侧1121 第五開放側1122 第六開放侧1123 第二連接端1124 第一夾角113 第二夾角114 第一延伸端115 201241394 Γ- 第一透孔1151 第二延伸端116 第二透孔1161 第三延伸端117 第三透孔1171 第四延伸端118 第四透孔1181 導熱元件12 吸熱面121 金屬板材2 沖壓加工機具3 沖頭31 鎖固件4 機板5201241394 VI. Description of the Invention: [Technical Field of the Invention] A heat-dissipating contact and a manufacturing method thereof, in particular, a heat-dissipating module capable of reducing production cost and a method of manufacturing the same. [Prior Art] The current heat-dissipating mold _ is mainly composed of a loose-reduction seat and a set-up. The heat-dissipating pedestal and the service tube fBm are connected in a fixed manner, and the two are firmly combined, but when the two are unique The different metals (such as the heat pipe is copper f, the loose film is the name material) because the scaly itself can not be (four) - the general welding method combined with other materials, so the special welding method (such as argon welding) is required for welding. This welding method can only be applied to Shan (4) (4) quality welding; however, this welding method can not be applied to welding with copper material f, so the two want to do = apply plating to make the subsequent welding work In addition, there are also some people who install holes or grooves in the cooling base to provide heat for the combination of 'four'. 'But this"" scatter _ the heat of the heat source after the pedestal contacts the source Then pass the heat pipe, this = pipe directly connected with __ (10) === The empty quality is also cumbersome and costly, whether it is installed or transported between Zhao's space for the need for heat dissipation. Therefore, the conventional disadvantages have the following disadvantages: 1. Poor heat transfer efficiency; 2. High manufacturing cost; 3. Limited use. 201241394 [Summary of the Invention] The main purpose of the module is to provide a heat-dissipating method that can be used to provide a heat-dissipating module capable of reducing the size of the dough. The purpose of the present invention is to provide a heat dissipating module comprising: a fixing member, at least a heat conducting member, the coffee member having a "-" (four) and an arm, wherein the first and second arms are mutually corresponding; The heat conducting component is disposed between the first and second clamp arms and is clamped by the first and second clamp arms. In order to achieve the above object, the present invention provides a method for manufacturing a heat dissipation module, comprising the steps of: providing a metal plate and at least one heat conducting component; and a second clamping plate applying the first stamping process to the metal plate. One arm; one metal stamping is applied to the second stamping and shaping, forming a fixed shape. The heat conducting component is placed on the side of the formed fixing member, and the first, second clamping arms are ^ The external force is said to be close to the heat and the combination of the guide member and the fixed member. It is easy to understand that the overall structure of the scatter group of the present invention is simpler and lighter and can be directly combined with the heat pipe. Furthermore, the manufacturing method provided by the present invention can greatly reduce the production cost, so the present invention has the following advantages: 1. The structure is simple and light; 2. The heat conduction efficiency is good; 201241394 3. The manufacturing cost is saved. [Embodiment] The above object and its structural and functional characteristics of the drawings will be described in accordance with the preferred embodiments of the accompanying drawings. 8 1 ' 2 ^ ' is the first embodiment of the thermal module - the embodiment of the stereo ^ " Figure, as shown in the 'thermal module of the present invention contains, the fixed member 11, at least one thermal conductive element 12; The fixed member u has a first clamp arm U1 and a second clamp arm ι 2'. The first clamps 111 and 112 correspond to each other. The first arm-shaped arm 1U and the _U have a -first clip _, and the first clip-112 and the fixing member U also have a second lost angle 114. The 1112 clamp arm (1) has a first open side 1U1 and a second open side and a third open side 1113 and a first 1114 series __411 connected to the 1114, the first connection end side i = ^ 丨 1 phase The second clamping arm 112 has a fourth open end 1124, and the fifth open side 1122 and the sixth open side 1123 and the second connection " the first connecting end 1124 are connected to the fixing member u. The heat element 12 has a heat absorbing surface 121 which is disposed between the two clamp arms m and 112 and can be directly turned into a body by the first and second clamp arms (1) and 112. The design of the heat absorbing surface 121 is such that the heat pipe is used as an illustrative embodiment, but it is not a household; the third figure is a three-dimensional combination of the second embodiment of the service heat module. Fig., not, the partial structure of the present embodiment is the same as that of the first embodiment described above. Therefore, in 201241394, the description of the "only" and the above-mentioned first-implementation is the same as the fixing member π. An extending end 115 and a second extending end 116 and a third extending end 117 and a fourth extending end 118, respectively, the first, second, third and fourth extending ends, 116, 117, 118 are respectively fixed by the fixing member The first, second, third, and fourth extending ends 115, 116, 117, and 118 have a first through hole 1151 and a second through hole 161 and a first portion respectively extending in a direction opposite to the fixing member u. The third through hole lm and the fourth through hole 1181 are used for the corresponding fixing member 4 (such as a screw member) to be fixedly fastened to the plate 5. Please refer to FIG. 4 to FIG. 13 for a flow chart and a processing diagram of the manufacturing method of the heat dissipation module of the present invention, and refer to FIG. 2 and FIG. 2 together, as shown in the figure, the manufacturing method of the heat dissipation module of the present invention, The method comprises the following steps: 51. Providing a metal plate and at least one heat conducting component; providing a metal plate 2 and a heat conducting component 12, wherein the heat conducting component 12 is a heat pipe and a temperature equalizing plate and a flat heat pipe and having heat conduction In any of the metals, the heat pipe is used as an illustrative embodiment in the present embodiment, but is not limited thereto. 52. Applying the first press forming to the metal sheet one by one; placing the metal sheet 2 on the press working tool 3 for the first press working, and processing the metal through the punching process The sheet 2 is formed by a first clamp arm 111 and a second clamp arm 112. 53. Applying a second press to the metal sheet to form a fixed part; and performing the second press processing on the metal sheet 2, the stamping processing is a blanking process, and the metal sheet 2 is passed through The punch 31 of the press machine 3 is subjected to a rapid impulse to be ejected from the metal sheet 2 along the outline of the fixing member 11 and the 201241394 fixing member 11 is obtained. -, the two clamped with the formed fixture - side' and combined with the first member. λ..., the component is close to 'the heat conduction element and the fixed:: two: = arm lap::::2, the two are attached, and the penetration::=: order, in addition, this step can also be artificial The first clamp arm m and the second clamp arm 丨° hand 8 (not shown) force the first clamp u to the heat conduction element 12 to be externally determined. "First clamp #112 holds the heat-conducting element 12 with a fixed limit, and the step press processing is a permanent embodiment, but it is not limited to continuous press processing as a processing method. ΐ Makes the shortcomings of the mature county, and shoots the big m less than the body of the summer. The invention discloses a heat dissipating module i which can simplify the conventional conventional heat dissipating module, which requires a product and a weight, and the other is provided as a manufacturing method of the occupational thermal module. Manufacturing man-hours, ^ ^ ^ [Simple description of the diagram] Turn the cost of the purpose. 1 is a perspective exploded view of a first embodiment of the present invention. FIG. 2 is a perspective view of a third embodiment of the heat dissipation module of the present invention. FIG. 3 is a second embodiment of the heat dissipation module of the present invention. Figure 3 is a schematic diagram of the manufacturing method of the manufacturing method of the heat dissipation module of the present invention; FIG. 5 is a processing diagram of the manufacturing method of the heat dissipation module of the present invention; Fig. 8 is a schematic diagram of the manufacturing method of the heat dissipation module of the ninth figure of the 发 热 热 热 ; ; ; ; ; ; ; ; ; ; 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散 散The schematic diagram of the processing method of the method of manufacturing the heat dissipation module of the present invention is the processing diagram of the manufacturing method of the heat dissipation module of the present invention. 13 is a schematic view of the manufacturing method of the turned-off quilt group [main component symbol description] heat-dissipating module 1 fixing member 11 first clamping arm 111 first open side 1111 second open side 1112 third open side 1113 first Connecting end 1114 second clamping arm 112 Four open sides 1121 Fifth open side 1122 Sixth open side 1123 Second connection end 1124 First angle 113 Second angle 114 First extension end 115 201241394 Γ - First through hole 1151 Second extension end 116 Second through hole 1161 Third extending end 117 Third through hole 1171 Fourth extending end 118 Fourth through hole 1181 Heat conducting element 12 Heat absorbing surface 121 Sheet metal 2 Stamping machine 3 Punch 31 Locking 4 Machine board 5

Claims (1)

201241394 七、申請專利範圍·· 1. 一種散熱模組,係包含·· 一ίίί應具有—第—夾臂及—第二夾臂,該第―、二央臂係 至元件,係設於該第…^ 導熱元件係 =,账連翻係第二連 1 $_之散熱模組’其中所述固定件更具 伸端,該第-巧?一延伸端及一第三延伸端及一第四延 固;件=向延“四^齡別由該固定件向相反該 具有一第-透孔及-第二透孔l第;g 分別 二定=有-第一夫角,所述第二夹== 6. -種散難組之製造方法,係包含下列步驟·· k供一金屬板材及至少一導熱元件· 對|金屬板材施以第-次沖壓加工成型一第一夾臂及一第二夾 對該金屬板材施以第二次沖壓加卫 將該導熱元件放置於該已成型之固定型, =:外力向該導熱元件緊靠,令定; 7·如申請專利範圍第6項所述之散熱模組之製造方法,其中所述 201241394 第一次沖壓加工係為沖縫加工。 8. 如申請專利範圍第6項所述之散熱模組之製造方法,其中所述 第二次沖壓加工係為下料加工。 9. 如申請專利範圍第6項所述之散熱模組之製造方法,其中所述 步驟將該導熱元件放置於該已成型之固定件一侧,並對該第 一、二夾臂施以外力向該導熱元件緊靠,令該導熱元件及該 固定件兩者結合係可透過沖壓加工完成。 10. 如申請專利範圍第6項所述之散熱模組之製造方法,其中所述 導熱元件係為熱管及均溫板及平板式熱管及具導熱之金屬其 中任一。201241394 VII. Patent Application Range·· 1. A heat dissipation module, including: · an ίίί 应 第 夹 夹 及 — — — — 及 及 及 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹The first...^ the heat-conducting component system=, the account is connected to the second connection 1$_the heat-dissipation module' wherein the fixing member has a more extended end, the first-intelligent-one extension end and a third extension end and a first Four extensions; pieces = extensions "four ages" from the fixing member to the opposite side having a first - through hole and - second through hole l; g respectively two = yes - first angle, said Two-clamp == 6. - The manufacturing method of the disperse group includes the following steps: · a metal plate and at least one heat-conducting element · a metal plate is subjected to a first press forming to form a first clamping arm and a second clamp applies a second stamping and urging to the metal plate to place the heat conducting component on the formed fixed type, =: an external force abuts the heat conducting component, and is determined; 7) as claimed in claim 6 The manufacturing method of the heat dissipation module according to the item, wherein the first press processing of the 201241394 is a punching process. The method of manufacturing the heat-dissipating module according to the sixth aspect, wherein the second-stage stamping processing is a blanking processing method. The step of placing the heat conducting component on the side of the formed fixing member, and applying an external force to the first and second clamping arms to abut the heat conducting component, so that the heat conducting component and the fixing component are combined by punching. 10. The method of manufacturing the heat dissipation module according to claim 6, wherein the heat conductive element is any one of a heat pipe and a temperature equalizing plate and a flat plate heat pipe and a metal having heat conduction.
TW100111509A 2011-04-01 2011-04-01 Heat dissipation module and manufacturing method thereof TW201241394A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567357B (en) * 2013-12-06 2017-01-21 奇鋐科技股份有限公司 Structure for holding a heat pipe to a base
CN114850811A (en) * 2022-03-15 2022-08-05 昆山品岱电子有限公司 Method for processing radiator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4204681B2 (en) * 1998-11-20 2009-01-07 住友軽金属工業株式会社 Heat pipe fixing structure
TW591363B (en) * 2001-10-10 2004-06-11 Aavid Thermalloy Llc Heat collector with mounting plate
TWM284947U (en) * 2005-09-16 2006-01-01 Chung-Shian Huang Heat dissipation module
TWM310366U (en) * 2006-09-15 2007-04-21 Golden Sun News Tech Co Ltd Assembly structure of heat pipe and heat conduction pedestal
TWM395994U (en) * 2010-07-30 2011-01-01 Guangtai Prec Pressing Suzhou Co Ltd Self-locking structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567357B (en) * 2013-12-06 2017-01-21 奇鋐科技股份有限公司 Structure for holding a heat pipe to a base
CN114850811A (en) * 2022-03-15 2022-08-05 昆山品岱电子有限公司 Method for processing radiator

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