201240544 六、發明說明： 【發明所屬之技術領域】 本發明係關於施加於貫通孔內的電鍍方法及使用此所 製造之基板。 【先前技術】 當進行形成於基板之兩面的電路彼此之連接、或是於 多層基板中之層間連接時，設置貫通該基板的孔，並藉由 將其內表面以銅等（以下以銅來進行說明）電鍍處理後的 通孔來謀求其之導通。該貫通孔，係藉由對兩面包銅層板 或是多層遮蔽板，以鑽頭等鑽孔而形成。電鍍處理，係在 去除鑽孔加工後的污跡（smear )之後，對包含有貫通孔 內表面的露出於基板表面之銅箔層進行。就電鍍處理而言 ，有電解電鑛、無電解電鏟。例如電解電鑛，係將基板浸 漬於電鍍液中，經由銅箔層供電，將銅電附著於基板兩面 及貫通孔內表面來進行表面處理。另外，在無電解電鍍中 ，基板也是被浸漬於電鍍液中。亦即，無論是電解電鍍、 或無電解電鍍，皆在施加銅電鍍於基板兩面的同時，施加 銅電鏟於貫通孔中。藉由這樣的電解電鍍，一般而言，係 將數μπι〜數十μιη的銅層形成於貫通孔的內表面。 然而，如上所述的電鍍處理，係如上述般，除了在通 孔的內表面之外，也在基板兩面施加銅電鏟。於之後的步 驟中，在電路形成時使用減色法（subtractive process)來 對基板的電路形成面進行電路形成的情況時，電路形成面 -5- 201240544 的銅厚越厚就越難形成細線，因此導致細線形成的產率降 低。形成於電路形成面的銅電鍍越厚，圖案的細線成形就 越困難。 爲了解決這樣的問題點，揭示有：在基板兩面設置乾 膜等的絕緣性保護膜，而不在基板兩面形成電鍍層的基板 之製造方法（例如參照專利文獻1 )。然而，在專利文獻 1的製造方法中，步驟係繁雜。例如，在最後，需要有將 乾膜予以剝離的步驟。 [先前技術文獻] [專利文獻] [專利文獻1 ]日本特開2 0 0 3 - 1 8 3 8 7 6號公報 【發明內容】 [發明所欲解決之課題] 本發明係提供一種：可簡易且迅速又低價地只於貫通 孔內表面施加電鍍處理的電鍍方法及使用此所製造之基板 [解決課題之手段] 本發明係提供一種貫通孔電鍍方法，其特徵爲，使用 有：具有貫通絕緣層的貫通孔之基板中間體、和具有在前 述貫通孔所對應的位置處而貫通之開口部的2枚導電性遮 罩：使前述開口部的位置配合前述貫通孔而以前述各導電 性遮罩覆蓋前述基板中間體的表背兩面的整個區域，在前 -6- 201240544 述基板中間體的表背兩面之至少一部分，使前述導電性遮 罩分別密著而形成被電鍍處理體，將該被電鍍處理體浸漬 於電鍍液，使包含前述貫通孔的內面之前述被電鍍處理體 的表面整體附著金屬而進行電鍍處理，從前述基板中間體 去除前述導電性遮罩。 較佳爲，以前述導電性遮罩覆蓋前述基板中間體之前 ，在前述絕緣層的至少單面形成導體圖案。 較佳爲，使前述導電性遮罩密著於前述基板中間體的 表背兩面之全面。 再者，本發明係提供一種基板，其係使用上述之貫通 孔電鍍方法所製造之基板，其特徵爲，具有：前述絕緣層 、前述貫通孔、以及施加於前述貫通孔內的電鍍金屬。 [發明效果] 根據本發明，由於是以導電性遮罩覆蓋基板中間體的 兩面，因此可以防止金屬因電鍍處理而附著在基板中間體 的兩面。因此，在後步驟中之處理性會提升，例如在基板 中間體形成圖案時，其作業性會提升。又，由於導電性遮 罩係在貫通孔所對應的位置處設置開口部，因此在電鍍液 內，貫通孔內面會露出。因此，可以有效率地只於貫通孔 內施加電鍍處理，並且可以只對貫通孔內的電鍍厚度進行 控制。 又，在施加電鍍金屬於貫通孔之前，可在絕緣層的至 少單面形成導體圖案。因此，即使對於預先形成有導體圖 201240544 案的基板中間體，也不會附著電鍍金屬於導體圖案，而可 以有效率地只於貫通孔內施加電鍍處理。 又，由於導電性遮罩係密著於基板中間體的表背兩面 之全面，因此可確實地防止在電鍍處理中金屬附著於基板 中間體的表背兩面。 又，電鍍金屬，係以導電性遮罩覆蓋具有絕緣層的基 板中間體之表背兩面並且貫通孔內表面爲露出的狀態下， 藉由電鍍處理而只附著在貫通孔內，因此在後步驟中之處 理性會提升，例如在基板中間體形成圖案時，其作業性會 提升。 【實施方式】 以下，參照附圖來說明本發明之方法及基板。另外， 電鍍方法雖有電解電鍍與無電解電鍍，但以下係針對使用 電解電鍍的情況進行說明。然而，本發明亦可使用無電解 電鍍來實現。 如第1圖所示，將被電鍍處理體2浸漬於電解槽1內 。電解槽1係以電鍍液3注滿。在電鍍液3中，係包含有 例如銅離子等之金屬離子。被電鍍處理體2係由基板中間 體4和導電性遮罩5所構成。基板中間體4，係具有板狀 的絕緣層6，在該絕緣層6係形成有1或複數個（圖中係 顯示3個）貫通孔7。在絕緣層6的兩面，形成有導體圖 案8。在導電性遮罩5，係貫通設置有複數個開口部9，至 少該開口部9係設置在針對形成於絕緣層6之貫通孔7所 -8- 201240544 完全對應的位置。因此，以導電性遮罩5覆蓋基板中間體 4的單面側時，開口部9與貫通孔7的位置係一致。基板 中間體4，係以導電性遮罩5挾持其表背兩面的方式被覆 蓋，並與導電性遮罩5的至少一部分密著。在第1圖中， 雖使導電性遮罩5與導體圖案8的表面密著，但在未形成 有導體圖案8的情況，導電性遮罩5係與絕緣層6 (更詳 而言之係施加於絕緣層6的表面之銅箔）的表面密著。或 是，當在絕緣層6形成有島部（land )的情況時，導電性 遮罩5係密著於島部。也就是說，導電性遮罩5係至少對 突出於基板中間體4之最外側的位置密著。另外，導電性 遮罩5，係可爲金屬，亦可爲在單面或是兩面處貼附有金 屬的樹脂。又，導電性遮罩5係可爲板狀，亦可爲銅箔等 的薄膜狀，爲樹脂的情況時，係只要不使該樹脂被電鍍液 3所侵害，則無特別限制。 如上所述而形成的被電鍍處理體2，係如上述般地浸 漬於電解槽1的電鍍液3內，並以導電性遮罩5作爲電極 而由電源10被通電。另外，在此例中進一步具備有在電 解槽1之兩側壁的電極1 1。藉由此通電操作，如第2圖所 示，將電鍍液內的電鍍金屬12作爲金屬膜而附著於被電 鍍處理體2之全面。亦即，電鍍金屬12係附著於導電性 遮罩5的露出面與貫通孔7的內面。其後，藉由將被電鍍 處理體2從電鍍液3取出，並去除導電性遮罩5，如第3 圖所示，可得到只施加電鍍處理於貫通孔7之內面的基板 13 ° 201240544 如上所述，根據上述本發明的方法，由於係以導電性 遮罩5覆蓋基板中間體4的兩面，故可防止金屬因電鍍處 理而附著在基板中間體4的表背兩面。因此，在後步驟中 之處理性會提升，例如在後步驟中於基板中間體4形成圖 案時，其作業性會提升。又，由於導電性遮罩5係在貫通 孔7所對應的位置處設置開口部9，因此在電鍍液內貫通 孔7之內面會露出。因此，可在貫通孔7內有效率地施加 電鍍處理，並可對貫通孔7內的電鍍厚度進行控制。特別 是在想形成1 ΟΟμηι單位的電鍍厚度時非常便利。導電性遮 罩5，係在爲了使電鍍金屬不附著於基板中間體4的表背 面而成爲光阻之取代物的同時，亦會成爲電極並進行供電 動作。因此，可僅藉由導電性遮罩5來簡單且低價地施加 電鍍處理於貫通孔內。又，如圖所示，在預先設置有導體 圖案8的情況，由於係能夠不附著電鍍金屬12於導體圖 案8地而可有效率的施加電鍍處理於貫通孔7內，故爲理 想。另一方面，在未形成導體圖案8的情況，由於導電性 遮罩5密著於絕緣層7的表面之全面，因此可確實地防止 在電鍍處理中電鍍金屬12附著於基板中間體4的表背兩 面。 另外，上述雖針對作爲基板〗3而在兩面形成有導體 圖案8的兩面基板進行說明，但本發明亦可適用於單面基 板、或是多層基板。 【圖式簡單說明】 -10- 201240544 [第1圖]係依序顯示本發明之貫通孔電鏟方法之槪略 圖。 [第2圖]係依序顯示本發明之貫通孔電鍍方法之槪略 圖。 [第3圖]係使用本發明之貫通孔電鍍方法所製造的基 板之槪略圖。 【主要元件符號說明】 1 :電解槽 2 :被電鍍處理體 3 :電鍍液 4 :基板中間體 5 :導電性遮罩 6 :絕緣層 7 :貫通孔 8 :導體圖案 9 :開口部 1 〇 :電源 1 1 :電極 1 2 :電鑛金屬 1 3 :基板 -11 -201240544 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a plating method applied to a through hole and a substrate produced using the same. [Prior Art] When the circuits formed on both sides of the substrate are connected to each other or to the layers in the multilayer substrate, holes penetrating the substrate are provided, and the inner surface thereof is made of copper or the like (hereinafter, copper is used) The through hole after the plating treatment is described to be turned on. The through hole is formed by drilling a drill or the like on two bread copper sheets or a plurality of shielding sheets. The plating treatment is performed after the smear after the drilling process is removed, and the copper foil layer exposed on the surface of the substrate including the inner surface of the through hole is formed. In terms of electroplating treatment, there are electrolytic electric ore and electroless electric shovel. For example, electrolytic ore is obtained by immersing a substrate in a plating solution, supplying power through a copper foil layer, and electrically attaching copper to both surfaces of the substrate and the inner surface of the through hole to perform surface treatment. Further, in electroless plating, the substrate is also immersed in the plating solution. That is, whether electrolytic plating or electroless plating is applied to both sides of the substrate while copper plating is applied to the through holes. In such electrolytic plating, generally, a copper layer of several μm to several tens of μm is formed on the inner surface of the through hole. However, the plating treatment as described above is as described above, except that the copper shovel is applied to both sides of the substrate in addition to the inner surface of the through hole. In the subsequent step, when a circuit is formed by using a subtractive process to form a circuit forming surface of the substrate, the thicker the copper thickness of the circuit forming surface -5 to 201240544, the more difficult it is to form a thin line. This leads to a decrease in the yield of fine line formation. The thicker the copper plating formed on the circuit forming surface, the more difficult it is to form thin lines of the pattern. In order to solve such a problem, a method of manufacturing a substrate in which an insulating protective film such as a dry film or the like is provided on both surfaces of the substrate without forming a plating layer on both surfaces of the substrate is disclosed (for example, see Patent Document 1). However, in the manufacturing method of Patent Document 1, the steps are complicated. For example, at the end, a step of peeling off the dry film is required. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 2 0 0 3 - 1 8 3 8 7 6 [Problems to be Solved by the Invention] The present invention provides a simple Electroplating method in which plating treatment is applied only to the inner surface of the through-hole and the substrate to be manufactured by using the substrate quickly and inexpensively. [Means for Solving the Problem] The present invention provides a through-hole plating method, characterized in that the use is: a substrate intermediate body of the through hole of the insulating layer; and two conductive masks having openings that penetrate at positions corresponding to the through holes: the positions of the openings are matched with the through holes, and the respective conductive layers are formed The mask covers the entire surface of the front and back surfaces of the substrate intermediate body, and the conductive mask is adhered to at least a part of the front and back surfaces of the substrate intermediate body in the previous paragraph -6 to 201240544, and the electroplated processed body is formed. The plated body is immersed in the plating solution, and a metal is adhered to the entire surface of the plated body including the inner surface of the through hole, and plating is performed from the middle of the substrate. The body removes the aforementioned conductive mask. Preferably, a conductor pattern is formed on at least one surface of the insulating layer before the substrate intermediate body is covered with the conductive mask. Preferably, the conductive mask is adhered to the entire surface of the front and back surfaces of the substrate intermediate body. Furthermore, the present invention provides a substrate produced by the above-described through-hole plating method, comprising: the insulating layer, the through hole, and a plating metal applied to the through hole. [Effect of the Invention] According to the present invention, since both surfaces of the substrate intermediate body are covered with a conductive mask, it is possible to prevent the metal from adhering to both surfaces of the substrate intermediate body by the plating treatment. Therefore, the rationality is improved in the latter step, for example, when the substrate intermediate is patterned, the workability is improved. Further, since the conductive mask is provided with an opening at a position corresponding to the through hole, the inner surface of the through hole is exposed in the plating solution. Therefore, it is possible to efficiently apply the plating treatment only in the through holes, and it is possible to control only the plating thickness in the through holes. Further, a conductor pattern can be formed on at least one side of the insulating layer before the plating metal is applied to the through holes. Therefore, even in the case of the substrate intermediate in which the conductor pattern 201240544 is formed in advance, the plating metal is not adhered to the conductor pattern, and the plating treatment can be efficiently applied only to the through holes. Further, since the conductive mask is adhered to both sides of the front and back surfaces of the substrate intermediate body, it is possible to surely prevent metal from adhering to both the front and back surfaces of the substrate intermediate during the plating process. Further, the plating metal is adhered to the front and back surfaces of the substrate intermediate body having the insulating layer by a conductive mask, and the inner surface of the through hole is exposed, and is adhered only to the through hole by the plating treatment. The rationality in the middle will be improved, for example, when the substrate intermediate is patterned, the workability is improved. [Embodiment] Hereinafter, a method and a substrate of the present invention will be described with reference to the drawings. Further, although the electroplating method includes electrolytic plating and electroless plating, the following description will be made on the case of using electrolytic plating. However, the invention can also be practiced using electroless plating. As shown in Fig. 1, the plated body 2 is immersed in the electrolytic cell 1. The electrolytic cell 1 is filled with the plating solution 3. In the plating solution 3, metal ions such as copper ions are contained. The plated body 2 is composed of a substrate intermediate body 4 and a conductive mask 5. The substrate intermediate body 4 has a plate-shaped insulating layer 6, and one or a plurality of (three in the figure) through holes 7 are formed in the insulating layer 6. On both sides of the insulating layer 6, a conductor pattern 8 is formed. The conductive mask 5 is provided with a plurality of openings 9 penetrating therethrough, and at least the openings 9 are provided at positions corresponding to the through holes 7 formed in the insulating layer 6 at -8 to 201240544. Therefore, when the single side of the substrate intermediate body 4 is covered with the conductive mask 5, the positions of the opening portion 9 and the through hole 7 are identical. The substrate intermediate body 4 is covered with the conductive mask 5 so as to be held on both sides of the front and back surfaces, and is adhered to at least a part of the conductive mask 5. In Fig. 1, although the conductive mask 5 is adhered to the surface of the conductor pattern 8, the conductive mask 5 and the insulating layer 6 are not formed when the conductor pattern 8 is not formed (more specifically, The surface of the copper foil applied to the surface of the insulating layer 6 is adhered. Alternatively, when an island portion is formed in the insulating layer 6, the conductive mask 5 is adhered to the island portion. That is, the conductive mask 5 is at least adhered to the outermost position of the substrate intermediate body 4. Further, the conductive mask 5 may be a metal or a resin to which a metal is attached on one side or both sides. Further, the conductive mask 5 may be in the form of a plate or a film such as a copper foil. In the case of a resin, it is not particularly limited as long as the resin is not damaged by the plating solution 3. The plated body 2 to be formed as described above is immersed in the plating solution 3 of the electrolytic cell 1 as described above, and is energized by the power source 10 with the conductive mask 5 as an electrode. Further, in this example, the electrode 11 is provided on both side walls of the electrolytic cell 1. By this energization operation, as shown in Fig. 2, the plating metal 12 in the plating solution is attached to the entire surface of the electrodeposited body 2 as a metal film. That is, the plating metal 12 adheres to the exposed surface of the conductive mask 5 and the inner surface of the through hole 7. Thereafter, the electroplated material 2 is taken out from the plating solution 3, and the conductive mask 5 is removed. As shown in FIG. 3, a substrate which is only plated on the inner surface of the through hole 7 can be obtained. 13 ° 201240544 As described above, according to the method of the present invention described above, since both surfaces of the substrate intermediate body 4 are covered with the conductive mask 5, it is possible to prevent the metal from adhering to both the front and back surfaces of the substrate intermediate body 4 by the plating treatment. Therefore, the handleability in the subsequent step is improved, for example, when the pattern is formed in the substrate intermediate 4 in the subsequent step, the workability is improved. Further, since the conductive mask 5 is provided with the opening portion 9 at a position corresponding to the through hole 7, the inner surface of the through hole 7 in the plating solution is exposed. Therefore, the plating treatment can be efficiently applied in the through hole 7, and the plating thickness in the through hole 7 can be controlled. Especially when it is desired to form a plating thickness of 1 ΟΟμηι unit. The conductive mask 5 is a substitute for the photoresist in order to prevent the plating metal from adhering to the front and back surfaces of the substrate intermediate body 4, and also serves as an electrode and performs a power supply operation. Therefore, plating treatment can be easily and inexpensively applied to the through holes only by the conductive mask 5. Further, as shown in the figure, in the case where the conductor pattern 8 is provided in advance, it is possible to efficiently apply plating treatment in the through hole 7 without adhering the plating metal 12 to the conductor pattern 8. On the other hand, in the case where the conductor pattern 8 is not formed, since the conductive mask 5 is adhered to the entire surface of the insulating layer 7, it is possible to surely prevent the plating metal 12 from adhering to the substrate intermediate 4 in the plating process. Back on both sides. In the above description, the double-sided substrate in which the conductor pattern 8 is formed on both surfaces as the substrate 3 will be described. However, the present invention is also applicable to a single-sided substrate or a multilayer substrate. BRIEF DESCRIPTION OF THE DRAWINGS -10- 201240544 [FIG. 1] A schematic diagram of a through hole shovel method of the present invention is sequentially shown. Fig. 2 is a schematic view showing the through hole plating method of the present invention in order. [Fig. 3] is a schematic view of a substrate produced by the through-hole plating method of the present invention. [Explanation of main component symbols] 1 : Electrolytic cell 2 : Electroplated material 3 : Plating solution 4 : Substrate intermediate 5 : Conductive mask 6 : Insulating layer 7 : Through hole 8 : Conductor pattern 9 : Opening 1 〇: Power supply 1 1 : Electrode 1 2 : Electro-mineral metal 1 3 : Substrate-11 -