TW201239531A - Radiation-sensitive composition, cured film and forming method thereof - Google Patents

Radiation-sensitive composition, cured film and forming method thereof Download PDF

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TW201239531A
TW201239531A TW101109869A TW101109869A TW201239531A TW 201239531 A TW201239531 A TW 201239531A TW 101109869 A TW101109869 A TW 101109869A TW 101109869 A TW101109869 A TW 101109869A TW 201239531 A TW201239531 A TW 201239531A
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compound
radiation
group
formula
mass
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TW101109869A
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TWI483070B (en
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Yasunobu Suzuki
Akihisa Honda
Tsutomu Okuda
Jirou Ueda
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Jsr Corp
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Priority claimed from JP2012035073A external-priority patent/JP5729329B2/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C08F283/122Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes on to saturated polysiloxanes containing hydrolysable groups, e.g. alkoxy-, thio-, hydroxy-
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen

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  • General Physics & Mathematics (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
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Abstract

This invention provides a radiation-sensitive composition that is for forming a cured film, wherein properties of a protective film or interlayer insulating layer can be maintained in good balance and high level, and can be developed even in an inorganic alkali developing agent. The radiation-sensitive composition of this invention includes the following components [A1], [B] and [C]: [A1] a polysiloxane obtained by hydrolysis-condensating tetraethoxysilane or partial hydrolyte thereof, hydrolytic silane compound represented by the following formula (1) or partial hydrolyte thereof and hydrolytic silane compound represented by the following formula (2) or partial hydrolyte thereof; [B] a compound having two or more ethylene unsaturating groups (excluding component [A1]); [C] a photo radical polymerization initiator.

Description

201239531 ^1/1/pif 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種適合作為顯示元件的保護膜或層 間絕緣膜的形成材料的感放射線性組成物、以及由該感放 射線性組成物所形成的硬化膜及其形成方法。 【先前技術】 於液晶顯示元件、積體電路元件、固體攝像元件、有 機電致發光(Electroluminescence,EL)等的顯示元件中, 設有用以防止以觸控面板(t〇uch panel)為代表的電子零 件的劣化或損傷的保護膜、或用以保持以層狀而配置的配 線間的絕緣性的層間絕緣膜等硬化膜。為了形成此種硬化 膜’-直使㈣放㈣性組成物,例何於基板上形成感 放射線性組成物的塗膜,隔著具有預朗案的光罩(細〇 mask)而照射放射線(以下稱為「曝光」),__ 影液進行㈣—不需要的部分溶解去除,_進行後供 烤(post bake),藉此形成硬化膜。 " 對於被用作觸控面板的保護膜的硬化膜而言,要 觸控面板元件的配線的密接性高、膜自身二 耐擦傷性優異、於高溫條件下亦不變色而簡透明,=耐 熱透明性)、於高溫條件下亦不產生龜裂(裂 裂性)、對放射_感度«、可形成並 j 圖案(顯影性)等特性。 的良好 另-方面,在被用作層間絕緣膜的硬化膜中, 成配線用的接觸孔(contact hole)的圃电 少、^ ;旳圖案,因此除了上述 201239531 4171/pif 保護膜的要求特性以外,進一步要求能以高的解析度高精 細地形成圖案像(高解析度)等。 先前,感放射線性組成物的成分主要是使用丙烯酸系 樹脂,但近年來,相較於丙烯酸系樹脂而耐熱性及透明性 更優異的1石夕軋烧系材料受到關注(專利文獻1〜專利文 獻3)。然而,聚矽氧烷系材料與錮錫氧化物(Indium Tin Oxide,ITO)基板的密接性不充分,且容易產生龜裂因 此有作為保護膜而不耐實用的問題。另外,關於液晶顯示 元件的層間絕緣膜形成用材料,正在進行於成本方面有利 的負型感放射線性組成物的開發(專利文獻4),但此種負 型感放射線性組成物難以形成具有實用上可使用的水準 (l_=vel)的孔控的接觸孔。因此,就接觸孔形成的優越性 而言,為了形成顯示元件的層間絕緣膜而廣泛使用正型感 放射線性組成物(專利文獻5)。 〜 另外,已提出了以下的感放射線性組成物,其是使含 有=飽和It酸及/或不飽和緩酸酐與其他不飽和化合物的 共水物 '聚纽不飽和化合物及光聚合起始劑的組成物 ^,以添加劑的形式極微量含有具有氧雜環丙基 oximnyl)、氧轉了基(㈣tanyl)或祕㈣氧烧低聚 勿而成i且已錢喊放射雜喊物可以合適地用於形 成的間隔件(sp·)(專利文獻6)、然而,顯示 70 、B隔件與保護膜或層間絕緣膜的用途不同,因此難 以充分滿足對保軸或層親緣賴所有要求特性。 [先前技術文獻] 5 201239531 η / 1 /pif [專利文獻] [專利文獻1]曰本專利特開2〇〇〇 〇〇1648號公報 [專利文獻2]日本專利特開2〇〇6_178436號公報 [專利文獻3]日本專利特開2〇〇8_248239號公報 [專利文獻4]曰本專利特開2〇〇〇_162769號公報 [專利文獻5]日本專利特開2〇〇1·354822號公報 [專利文獻6]日本專利特開2〇〇8_233518號公報 對保護膜與層間絕緣膜的要求特性如上所述, 部分多’然而儘管如此’實際情況是根據其目的或步驟而 使用多種多樣的感放射線性組成物。若可用一種感放^ 性組成物來形成保護膜或層間絕緣膜等硬化膜且可使 ΓΓίί膜並將圖案轉印方式設定為負型,則於成本方面 摇有卜目此’迫切射開糾可形祕伽及層間絕 緣膜兩者的負型感放射線性組成物。 另外’於顯影時’驗顯影液通常是使用氫氧化四甲臭 銨 Tetramethyl Ammonium Hydroxide,ΤΜΑΗ),自成太 生紐提高峨點而言,期望開發出彻 影液亦可顯影的感放射線性組成物。 【發明内容】 ,此’,本發明的課題在於提供一種感放射線性組成 #問以鬲水準且以良好的平衡而兼具對保護膜或 的上述要求特性的硬化膜,且利用無機驗顯影 、筮β .,’、員衫。另外,本發明的其他課題在於提供一種以高 水準且以良好的平衡而兼具對保護膜及層間絕緣膜的上述201239531 ^1/1/pif VI. Description of the Invention: [Technical Field] The present invention relates to a radiation-sensitive composition suitable for forming a protective film or an interlayer insulating film of a display element, and the sense A cured film formed by a radioactive composition and a method of forming the same. [Prior Art] In a display element such as a liquid crystal display element, an integrated circuit element, a solid-state imaging element, or an organic electroluminescence (EL), a display element for preventing a touch panel (t〇uch panel) is provided. A cured film such as a protective film that deteriorates or damages an electronic component, or an interlayer insulating film that maintains an insulating property between wirings arranged in a layer. In order to form such a cured film, a (four)-distributing (four) composition, a coating film on which a radiation-sensitive composition is formed on a substrate, is irradiated with radiation through a mask having a pre-language ( Hereinafter, it is called "exposure"), __ shadow liquid is carried out (4) - unnecessary portions are dissolved and removed, and _ is post bake, thereby forming a cured film. " The cured film used as the protective film of the touch panel has high adhesion to the wiring of the touch panel element, excellent scratch resistance of the film itself, and no discoloration under high temperature conditions, and is transparent. Heat-resistant transparency), such as cracking (cracking property), radiation-sensitivity«, and formation of j-pattern (developability) under high-temperature conditions. On the other hand, in the cured film used as the interlayer insulating film, the contact hole for wiring is less 、, and the 旳 pattern, in addition to the required characteristics of the 201239531 4171/pif protective film described above. In addition, it is further required to form a pattern image (high resolution) or the like with high resolution with high resolution. In the past, the composition of the radiation-sensitive composition was mainly made of an acrylic resin, but in recent years, the 1st stone-rolled material which is more excellent in heat resistance and transparency than the acrylic resin has been attracting attention (Patent Document 1 to Patent) Document 3). However, the adhesion between the polyoxyalkylene-based material and the indium tin oxide (ITO) substrate is insufficient, and cracking is likely to occur, so that it is a protective film and is not practical. In addition, the material for forming an interlayer insulating film of a liquid crystal display element is being developed in the form of a negative-type radiation-sensitive composition which is advantageous in terms of cost (Patent Document 4). However, such a negative-type radiation-radiating composition is difficult to form and has practical use. A hole-controlled contact hole of the level (l_=vel) that can be used. Therefore, in order to form the interlayer insulating film of the display element, a positive-type radiation-radiating composition is widely used (Patent Document 5). In addition, the following radiation-sensitive composition has been proposed, which is a conjugated compound containing a saturated saturated acid and/or an unsaturated slow acid anhydride with other unsaturated compounds, a polyunsaturated compound and a photopolymerization initiator. The composition ^, in the form of an additive, contains a very small amount of oxiranyl oximnyl), an oxygen-transferred ((tetra)tanyl) or a secret (tetra) oxygen-burning oligomerization, and the money shouting radiation can be suitably The spacer (sp·) for forming (Patent Document 6), however, the display 70 and the B spacer are different from the use of the protective film or the interlayer insulating film, and therefore it is difficult to sufficiently satisfy all the required characteristics for the shaft or the layer. [Prior Art Document] 5 201239531 η / 1 / pif [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 2 No. Hei. [Patent Document 3] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2, No. [Patent Document 6] Japanese Patent Laid-Open Publication No. Hei. No. 2-233518 discloses that the required characteristics of the protective film and the interlayer insulating film are as described above, and in some cases, 'however, the actual situation is to use a variety of feelings according to the purpose or the step. Radiation linear composition. If a sensible composition can be used to form a cured film such as a protective film or an interlayer insulating film, and the 转印ίί film can be set to a negative type, the cost is swayed. A negative-type radiation linear composition that can be combined with both of the interlayer insulating films. In addition, the 'developing solution' is usually made of Tetramethyl Ammonium Hydroxide (ΤΜΑΗ), and it is expected to develop a radioactive linear composition that can be developed by the method of improving the temperature. Things. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a cured film having a radiation-induced linear composition and having a desired balance with a protective film or a good balance.筮β ., ', shirt. Further, another object of the present invention is to provide the above-mentioned protective film and interlayer insulating film at a high level and with a good balance.

S 6 201239531 41717pif 要求特性的硬化膜及其形成方法。 夺干四乙氧基石夕烧或其部分水解物、下述式⑴所 而獲得炫化合物或其部分水解鏡行:二 性电ΙΠίΓ題,第—,本發明提供4感放射線 H 下的成分[Al]、成分_成分[C]: (2) 所表示 L使四乙祿魏或其部分水解物、下述式(1 的水解性石夕烧化合物或其部分水解物、及下述式 分仙纖物姊基輸物(其中成 [c]光自由基聚合起始劑。 [化1] (Rl〇fcs+(CH 七 R2]m ⑴ [化2]S 6 201239531 41717pif A cured film of the required characteristics and a method of forming the same. The tetraethoxy cerium or its partial hydrolyzate is obtained by the following formula (1) to obtain a dazzling compound or a partial hydrolyzed mirror thereof: a dimorphic electric ΙΠ Γ ,, the first invention provides a component under the 4 sense radiation H [ Al], component _ component [C]: (2) The above-mentioned L is a tetrahydrocarb, or a partial hydrolyzate thereof, a hydrolyzable sulphur compound or a partial hydrolyzate thereof of the following formula (1), and the following formula Indigo fiber sulphate-based (in which [c] photoradical polymerization initiator. [Chem. 1] (Rl〇fcs+(CH VII R2]m (1) [Chemical 2]

[式(1)中’ R1表示碳數 3,基、碳數6〜14的芳基或(甲基ΓΓ1 表不1〜3的整數’ η表示〇〜“。 代12)中,R3 201239531 41717pif 表示碳數1〜6的烧基,x表示1〜3的整數,y表示1〜6 的整數,z表示0〜3的整數] 第二,本發明提供一種感放射線性組成物,其含有以 下的成分[A2]、成分[B]及成分[C]: [A2]具有Si02單元、下述式(la)所表示的結構單元、 及下述式(2a)所表示的結構單元的聚矽氧烷; [B] 具有2個以上的乙烯性不飽和基的化合物(其中成 分[A2]除外); [C] 光自由基聚合起始劑。 Η匕3] RHCH2)^;Si-〇(4-m)/2 (la) [化4][In the formula (1), R1 represents a carbon number of 3, a aryl group having a carbon number of 6 to 14 or (intermolecular η of the methyl group 1 of 1 to 3, η represents 〇~". In the case of 12), R3 201239531 41717pif An alkyl group having a carbon number of 1 to 6, x represents an integer of 1 to 3, y represents an integer of 1 to 6, and z represents an integer of 0 to 3. Second, the present invention provides a radiation sensitive composition comprising the following The component [A2], the component [B], and the component [C]: [A2] a polyfluorene having a SiO 2 unit, a structural unit represented by the following formula (la), and a structural unit represented by the following formula (2a) [B] a compound having two or more ethylenically unsaturated groups (excluding the component [A2]); [C] a photoradical polymerization initiator. Η匕3] RHCH2)^; Si-〇 ( 4-m)/2 (la) [化4]

[式(la)中,R2表示碳數1〜20的烷基、碳數6〜14 的芳基或(曱基)丙烯醯氧基,m表示1〜3的整數,η表示 0〜6的整數。式(2a)中,R4表示氫原子或碳數1〜6的 烧基,X表示1〜3的整數,y表示1〜6的整數,z表示0 〜3的整數] 201239531 41717pif 種使用上述感放射線性組成物而 第三,本發明提供— 形成的硬化膜。 πϊ二,明提供—種硬化膜的形包如 下的步驟(1 )〜步驟(4); 驟 ⑴於基板上形成上述纽射線性組成物的塗膜的步 ⑺對步驟⑴中形成的塗膜的至少—部分照射放 射線的步驟; (3)利用鹼顯影液對步驟⑵中經放射線照射的塗 膜進行顯影的步驟;以及 ()對v驟(3 )中經顯影的塗膜進行加熱的步驟。 [發明的效果] 根據本發明,可提供一種有效地形成能以高水準且以 良好的=衡喊具耐熱透明性、硬度、耐擦傷性、财熱龜 裂丨生、雄接性、感度及顯影性等各種特性的硬化膜的感放 =線性組成物H本發明的纽射線雜成物具有充 分的解析度’因此可形成微細的接觸孔,而且利用無機驗 顯影液亦可顯影。 +因此,使用本發明的感放射線性組成物而形成的硬化 膜作為顯示元件的觸控面板的保護膜、顯示元件的層間絕 緣膜極為有用。 【實施方式】 感放射線性組成物 本發明的感放射線性組成物含有成分[A1]或成分 201239531 41717pif [A2]、成分[B]及 以下的說明中將成八i下,對各成分加以詳細說明, [A]。 刀[A ]及成分[A2]總括地說明作成分 成分[A] 成分[A1]為使四 簡稱為「TEOS」)、、虱I矽烷或其部分水解物(以下亦 物或其部分水解物Γ下述式所表示的水解性矽烷化合 式⑴所表示的水^下亦稱為「化合物⑴」)、及下述 亦稱為「化合物1 ^烷化合物或其部分水解物(以下 藉由含有該成分[A1 ^沐解縮合而獲得的聚石夕氧燒。 液、特別是無機驗顯旦^^1員影步驟中使用的驗顯影 而可提高所^由f〜液的〉谷解性’可使顯影性提高,進 本說明書中所謂「部ΓΧίΓ,、耐擦傷性。此處, 合1而生成的分子中殘存至====== 炫氧基的石夕减化合物(石夕原子數為2個〜100個去 為2個〜30個左右的矽氧烷低聚物)。 [化5] (Rl〇feSi-HCH2tR2l ⑴ J m [化6] 10 201239531 4i/l/plf[In the formula (la), R2 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 14 carbon atoms or an (indenyl) acryloxy group, wherein m represents an integer of 1 to 3, and η represents 0 to 6; Integer. In the formula (2a), R4 represents a hydrogen atom or a carbon group having 1 to 6 carbon atoms, X represents an integer of 1 to 3, y represents an integer of 1 to 6, and z represents an integer of 0 to 3] 201239531 41717pif Third, the present invention provides a cured film formed. ϊ ϊ , , , 明 提供 提供 提供 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 提供 种 提供 提供 种 提供 提供 提供 种 提供 提供 提供 提供 提供 种 提供 提供 提供 提供 提供 提供 提供 提供a step of at least partially irradiating the radiation; (3) a step of developing the radiation-coated coating film in the step (2) with an alkali developing solution; and () a step of heating the developed coating film in the v (3) . [Effects of the Invention] According to the present invention, it is possible to provide an effective formation at a high level and with good heat resistance, heat resistance, hardness, scratch resistance, heat cracking, engorgage, sensitivity and The feeling of the cured film of various properties such as developability = linear composition H The neon hybrid of the present invention has sufficient resolution. Therefore, fine contact holes can be formed, and development can be performed by using an inorganic developer. Therefore, the cured film formed using the radiation sensitive composition of the present invention is extremely useful as a protective film for a touch panel of a display element and an interlayer insulating film of a display element. [Embodiment] Radiation-sensitive composition The radiation-sensitive composition of the present invention contains the component [A1] or the component 201239531 41717pif [A2], the component [B], and the following description, and the components are detailed. Description, [A]. The knives [A] and the components [A2] are collectively described as the component [A] component [A1] is simply referred to as "TEOS", 虱I decane or a partial hydrolyzate thereof (hereinafter, or a partial hydrolyzate thereof) The hydrolyzable decane compound represented by the following formula is also referred to as "compound (1)"), and the following is also referred to as "compound 1 alkyl compound or a partial hydrolyzate thereof (hereinafter referred to as This component [A1 ^ 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚'The developability can be improved, and it is called "partial ΓΧ Γ Γ 、 、 、 、 、 、 、 、 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The number of atoms is from 2 to 100 and is from 2 to 30 or so of a nonoxyl oligomer. (R 5 ) (Rl〇feSi-HCH2tR2l (1) J m [Chem. 6] 10 201239531 4i/l/plf

[式(1)中,R1表示碳數1〜6的烷基,R2表示碳數1 〜20的烷基、碳數6〜14的芳基或(曱基)丙烯醯氧基,茁 表示〜3的整數,η表示0〜6的整數。 式(2)中,R3表示碳數1〜6的烷基,χ表示丄〜] 的整數,y表示1〜6的整數,z表示〇〜3的整數。] 首先’對式(1)及式(2)中的記號的定義加以說明。 R1及R3的烷基可為直鏈狀、分支狀及環狀的任一種。 R1及R3的院基的碳數為1〜6,就水解縮合的反應性 點而言,碳數較佳為1〜4,更佳為丨或2。具體可列舉$ ί 、正丙基:異丙基、正丁基、二級丁基、三級丁 基、戊基、己基、壞己基等’其中特佳為甲基 者’於同-分子内存在多個的情形時,祕;相= 亦可不同。R3亦同樣。 一 R j相冋 二佳=環 正十二〜十:錄、、正二心 庚基、環辛基等。 土正十/、烷基、環 所明R的芳基是指碳數6〜14的單環〜三環式芳香族 11 201239531 4171 /pif 烴基,具體可列舉苯基、萘基、蒽基、菲基等。其中較佳 為苯基、萘基,更佳為苯基。 R2的烷基及芳基可具有取代基,取代基例如可舉出鹵 素原子、經基、硝基、氰基、碳數〗〜6的烷氧基等。再者, 取代基的位置及個數為任意,於具有2個以上的取代基的 情形時,該取代基可相同亦可不同。鹵素原子可列舉氟原 子”臭原子、氣原子及獅子’其中較佳為氟原子。齒素 原子可將烷基及芳基的氫原子的一部分或全部取代,較佳 為全部取代。經鹵素取代的烷基的具體例可列舉三氟曱 ,、全氟乙基、全氟丙基、全氟異丙基、全氟環丙基等全 氟烷基。另外’碳數1〜ό的烷氧基可列舉曱氧基、 正丙氧基、異丙氧基等。 土 乳土、 丙基)丙賴基為包含丙烯醞氧基及甲基 ',基或(曱基)丙烯 R2的情形時,該些 其中,R2較佳為碳數1〜6的烷基 酿氧基。再者,於同一分子内存在多個 r2可相同亦可不同。 m為1〜3的整數’較佳為1或2,更佳為1 η為〇〜6的整數’較佳為〇〜3的整數° 3 X為1〜3的整數’較佳為丨或2,更佳^ί為0或3。 y為1〜6的整數’較佳為1〜3的整數:、、、。 z為〇〜3的整數,較佳為〇或1,更隹更佳為 繼而,對成分[A1]的聚矽氧烷的構成 〔〇 成分[A1]含有TEOS作為必需成分^^以說明。 刀^〇S為具有4 12 201239531 41717pif 個水解性基的多官能性矽烷化合物。可預測,若聚矽氧烷 中含有來源於TEOS的結構單元,則藉由與ITO等金屬基 板表面的羥基的相互作用而與基板的密接性變高,另外可 進一步提高聚矽氧烷的交聯密度,所得的硬化膜可具有更 高的硬度,然而由於變脆,故容易產生龜裂,耐擦傷性差。 與此種預測相反,本發明中發現,於TEOS中組合後述的 化合物(1)及化合物(2)來構成聚矽氧烷,並使其更含 有成分[B],藉此即便以高濃度而含有TE0S,亦意外地可 獲得不僅硬度、基板密接性高,而且耐擦傷性及耐龜裂性 亦優異的硬化膜。該情況根據先前的見解完全無法預測到。 就硬度、密接性、耐擦傷性及耐熱龜裂性提高的觀點 而言,相對於原料化合物的合計量,TEOS的添加比例較 佳為5 mol% (莫耳百分比)〜75 m〇l%,更佳為1〇 m〇1% 〜70 mol% ’進而更佳為25 ^οΐ%〜65 mol%。 成分[A1]更含有化合物(1)作為必需成分。化合物(J ) 抑制由TEOS導致的過度的交聯密度增大,保持適度的交 聯密度並且有助於耐龜裂性及耐擦傷性的提高。 化合物(1)可列舉m為1的矽烷化合物、m為2的 矽烷化合物、m為3的矽烷化合物。具體可列舉以下的化 &物。再者,化合物(1 )可單獨使用一種,亦可組合使用 兩種以上。 m為1的石夕烧化合物例如可列舉: 曱基二曱氧基石夕炫< (methyl trimethoxy silane)、曱基 二乙氧基矽烷、曱基三-異丙氧基矽烷、曱基三丁氧基矽 13 201239531 Hi /1 /pif 烧、乙基二曱氧基石夕烧、乙基三乙氧基石夕烧、乙基三_異丙 氧基矽烷、乙基三丁氧基矽烷、丁基三曱氧基矽烷、癸基 三甲氧基矽烷等具有1個碳數1〜20的烷基的水解性石夕燒 化合物; 三氟丙基三曱氧基石夕烧(trifluoropropyl trimethoxy silane)等具有1個碳數1〜20的經鹵素取代的烷基的水解 性矽烷化合物; 苯基三曱氧基石夕烧(phenyl trimethoxy silane)、笨基 三乙氧基矽烷等具有1個碳數6〜14的芳基的水解性妙烧 化合物; 3-曱基丙烯醯氧基丙基三曱氧基矽烧 (3-methacryloyloxy propyl trimethoxy silane )、3 -曱基丙烯 醯氧基丙基三乙氧基矽烷、3-曱基丙烯醯氧基丙基三丙氧 基矽烷、3-丙烯醯氧基丙基三曱氧基矽烷、3-丙烯醯氧基 丙基三乙氧基石夕烧、3-丙稀醯氧基丙基三丙氧基石夕烧等具 有1個(曱基)丙稀醯氧基的水解性矽烧化合物。 m為2的矽烷化合物例如可列舉: 二甲基二曱氧基矽烷、二丁基二曱氧基矽烷等具有2 個碳數1〜20的烧基的水解性石夕烧化合物; 一本基'一甲氧基梦烧專具有2個碳數6·〜·14的芳基的 水解性矽烷化合物; 3-甲基丙烯醯氧基丙基曱基二曱氧基矽烷、3-丙烯醯 氧基丙基曱基一曱氧基石夕烧等具有(甲基)丙稀醯氧基及碳 數1〜20的烷基的烷氧基矽烷化合物;In the formula (1), R1 represents an alkyl group having 1 to 6 carbon atoms, R2 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 14 carbon atoms or an (indenyl) acryloxy group, and 茁 represents 〜 An integer of 3, η represents an integer of 0 to 6. In the formula (2), R3 represents an alkyl group having 1 to 6 carbon atoms, χ represents an integer of 丄~], y represents an integer of 1 to 6, and z represents an integer of 〇3. First, the definitions of the symbols in the equations (1) and (2) will be described. The alkyl group of R1 and R3 may be any of a linear chain, a branched chain, and a cyclic chain. The carbon number of the base of R1 and R3 is from 1 to 6, and the carbon number is preferably from 1 to 4, more preferably 丨 or 2, in terms of the reactivity of the hydrolysis condensation. Specific examples thereof include: ί, n-propyl: isopropyl, n-butyl, butyl, tributyl, pentyl, hexyl, hexyl, etc., wherein the methyl group is in the same-molecular memory. In many cases, the secret; phase = can also be different. The same is true for R3. A R j phase 冋 two good = ring positive twelve ~ ten: recorded, positive two hearts Heptyl, cyclooctyl and so on. The aryl group of R = 10, alkyl, and ring R is a monocyclic to tricyclic aromatic 11 201239531 4171 /pif hydrocarbon group having a carbon number of 6 to 14, and specific examples thereof include a phenyl group, a naphthyl group, and a fluorenyl group. Fickey and so on. Among them, a phenyl group or a naphthyl group is preferred, and a phenyl group is more preferred. The alkyl group and the aryl group of R2 may have a substituent, and examples of the substituent include a halogen atom, a trans group, a nitro group, a cyano group, and an alkoxy group having a carbon number of 1-6. Further, the position and the number of the substituents are arbitrary, and in the case of having two or more substituents, the substituents may be the same or different. Examples of the halogen atom include a fluorine atom, a "smoke atom, a gas atom, and a lion". Among them, a fluorine atom is preferable. The dentate atom may be substituted with a part or all of a hydrogen atom of an alkyl group and an aryl group, and is preferably all substituted. Specific examples of the alkyl group include a trifluoroantimony, a perfluoroalkyl group such as a perfluoroethyl group, a perfluoropropyl group, a perfluoroisopropyl group, or a perfluorocyclopropyl group. Further, an alkoxy group having a carbon number of 1 to fluorene Examples of the group include a decyloxy group, a n-propoxy group, an isopropoxy group, etc. When the soil latex and the propyl)propyl group are in the case of containing an acryloxy group and a methyl group, a group or a (fluorenyl) propylene group R2, In the above, R2 is preferably an alkyloxy group having 1 to 6 carbon atoms. Further, a plurality of r2 may be the same or different in the same molecule. m is an integer of 1 to 3, preferably 1 Or 2, more preferably 1 η is an integer of 〇~6' is preferably an integer of 〇~3 ° 3 X is an integer of 1 to 3' preferably 丨 or 2, more preferably ^ί is 0 or 3. y An integer of 1 to 6 is preferably an integer of 1 to 3: , , , . . . z is an integer of 〇 〜3, preferably 〇 or 1, more preferably, and further, for the composition of the component [A1] Oxane composition [A1] contains TEOS as an essential component to illustrate. Knife 〇S is a polyfunctional decane compound having 4 12 201239531 41717 pif hydrolyzable groups. It is predicted that if the polyoxy siloxane contains structural units derived from TEOS Further, the adhesion to the substrate by the interaction with the hydroxyl group on the surface of the metal substrate such as ITO is increased, and the crosslinking density of the polyoxyalkylene can be further increased, and the obtained cured film can have a higher hardness, however In the present invention, it is found that the compound (1) and the compound (2) described later are combined in TEOS to form a polyoxane and to make it more brittle. By containing the component [B], even if the TEOS is contained at a high concentration, it is possible to unexpectedly obtain a cured film which is excellent in not only hardness and substrate adhesion but also excellent in scratch resistance and crack resistance. It is completely unpredictable. In terms of hardness, adhesion, scratch resistance, and heat crack resistance, the TEOS addition ratio is preferably 5 mol% (mole percent) with respect to the total amount of the raw material compound. Ratio of ~75 m〇l%, more preferably 1〇m〇1% to 70 mol% 'and more preferably 25^οΐ%~65 mol%. The component [A1] further contains the compound (1) as an essential component. The compound (J ) suppresses an excessive crosslinking density increase caused by TEOS, maintains a moderate crosslinking density, and contributes to an improvement in crack resistance and scratch resistance. The compound (1) may be a decane compound having m of 1. The decane compound in which m is 2 and the decane compound in which m is 3. Specific examples include the following compounds: The compound (1) may be used singly or in combination of two or more. Examples of the sinter compound include: methyl trimethoxy silane, decyl diethoxy decane, decyl tri-isopropoxy decane, decyl tributoxy fluorene 13 201239531 Hi /1 /pif, Ethyl Dimethoxy Oxime, Ethyl Triethoxy Oxide, Ethyl Tris-Isopropoxydecane, Ethyl Tributoxydecane, Butyl Trioxetane a hydrolyzable pyroxene compound having one alkyl group having 1 to 20 carbon atoms, such as mercaptotrimethoxydecane; trifluoropropyltriazine a hydrolyzable decane compound having one halogen-substituted alkyl group having 1 to 20 carbon atoms, such as trifluoropropyl trimethoxy silane; phenyl trimethoxy silane, stupid triethoxy a hydrolyzable sulphuric acid compound having one aryl group having 6 to 14 carbon atoms such as decane; 3-methacryloyloxypropyl propyl trimethoxy silane, 3-mercaptopropene醯oxypropyl triethoxy decane, 3-mercapto propylene methoxy propyl tripropoxy decane, 3-propenyl methoxy propyl trimethoxy decane, 3- propylene methoxy propyl three A hydrolyzable calcining compound having one (indenyl) acryloxy group, such as ethoxylate or 3-propoxymethoxypropyltripropoxylate. Examples of the decane compound having a m of 2 include a hydrolyzable smelting compound having two carbon atoms of 1 to 20, such as dimethyldimethoxy decane or dibutyl decyloxydecane; 'monomethoxy-burning hydrolyzable decane compound having 2 aryl groups having 6 to 14 carbon atoms; 3-methacryloxypropyl decyl dimethoxy decane, 3-propene oxime An alkoxydecane compound having a (meth) acryloxy group and an alkyl group having 1 to 20 carbon atoms, such as a propyl fluorenyl group;

S 14 201239531 4I717pif 3-甲基⑽醯氧絲基苯基氧基魏、3_丙稀酿 ,基丙基苯基二?絲械等具#(?基)稍醯氧基及碳 數ό〜14的芳基的烷氧基矽烷化合物; 3,3’-二甲基丙稀醯氧基丙基二甲氧基梦烧、3,3,_二丙 ^氧絲基二甲氧基魏料有2個(甲基)丙烯酿氧基 的烷氧基矽烷化合物。 m為3的砍烧化合物例如可列舉: 三丁基曱氧基石夕烧、三甲基甲氧基石夕焼、三甲基乙氧 土石夕燒、三丁基乙氧基魏等具有3個魏U的烧基 的水解性矽烷化合物; 三苯基曱氧基石夕烧等具有3個礙數6〜14的芳基的水 解性矽烷化合物; 3,3’,3”-三甲基丙烯醯氧基丙基甲氧基矽烷、3 3,3”_三 丙烯酿氧絲基甲氧基魏等财3個(甲基)丙_氧^ 的水解性矽烷化合物。 該些化合物⑴中,較佳為具有碳數W的烧基的 7解性魏化合物、具有魏6〜14料基的水解性石夕烧 化合物、具有(甲基)丙_氧基的水解性石夕烧化合物,該 些化合物中,特佳為上述式⑴的m為丨的魏化合物。 合適的化合物(1)的具體例可列舉: 甲基二曱氧基石夕院、曱基三乙氧基石夕烧、乙基三甲氧 基石夕貌、乙基三乙氧基魏、丁基三甲氧基魏等具有i 個碳數1〜6的烷基的烷氧基矽烷化合物; 苯基三甲氧基魏等具有i個碳數6〜14的芳基的烧 15 201239531 *-H / 1 /pif 氧基矽烷化合物; 3一·丙烯醯氧基丙基三曱氧基矽烷、3_甲基丙烯醯氧基 丙基二曱氧基矽烷、3_丙烯醯氧基丙基三乙氧基矽烷、3_ 曱基丙烯醯氧基丙基三乙氧基矽烷等具有1個(甲基)丙烯 醯氧基的烷氧基矽烷化合物。 就耐熱透明性、硬度、耐擦傷性、耐熱龜裂性、密接 性、感度 '解析度及顯影性提高的觀點而言,相對於原料 化合物的合計量,化合物(1)的合計添加比例較佳為1〇 mol%〜80 m〇i%,更佳為 1〇 m〇1%〜75 m〇1%,進而 15 mol0/〇〜7〇m〇i%。 ‘”、 一 於本發明中,就耐擦傷性及财熱龜裂性進一步提高的 觀=而言,上述合適的化合物⑴中,較佳為使用選自具 有奴數/〜6的烷基的水解性矽烷化合物、及具有碳數石〜 14的芳基的水解性⑦烧化合物+的至少―種⑦烧化合物 j以下亦稱為「魏化合物(lbl)」),該些魏化合物(ibl) ,特佳為上述式(1)的m為1的矽烷化合物。 τι yp …又人”王進一少徒尚的觀點而言,上述 化合物⑴巾’較佳為使用具有(甲基)丙烯醯氧基 :解性魏化合物,該魏化合物中,特佳為上述式⑴ H具有基)丙刺氧基的水解性 石夕触為使㈣自具Μ基輯醯氧基的水解性 丙 亦稱為「概合物(ic1)」)、及具有 炫化合繼合物(以下亦稱為「石夕 的至y—種,更佳為併用石夕炫化合物 201239531 41717pif (lc1)及矽烷化合物(Id1)。另外,具有(曱基)丙烯醯氧 基的水解性矽烷化合物較佳為與矽烷化合物(lb1) —起使 用。 於使用矽烷化合物(lb1)作為化合物(1)的情形時, 就耐擦傷性及财熱龜裂性進一步提高的觀點而言,相對於 原料化合物的合計量,矽烷化合物(lbi)的合計添加比例 較佳為 10 mol%〜80 mol%,更佳為 15 mol%〜75 m〇1%, 進而更佳為30 mol%〜70 mol%。 就感度及解析度進一步提高的觀點而言,相對於原料 化合物的合計量,具有(曱基)丙烯醯氧基的水解性矽烷化 合物的合計添加比例較佳為5 mol%〜25 mol%,更佳為1〇 mol% 〜20 m〇l〇/0 〇 另外,於併用矽烷化合物(lci)及矽烷化合物(ldl) j情形時,就耐擦傷性及耐熱龜裂性進一步提高的觀點而 言’兩者的添加比例⑴㈣)以莫耳比計較佳為〇 〇s3, 更佳為0.2〜1·5,進而更佳為〇.3〜]_。 θ成分[Α1]更含有化合物⑵作為必需成分。化 疋抑制由TEOS導致的過度的交聯密度婵 =性及耐擦傷性的提高’並且亦有助梅二= 兩 化合物(2)可列舉χ為i的矽烷化合物、χ 烷化合物、Χ為3的矽烷化合物。具、 ::再者,化合物⑵可單獨使用—合 種以上。 &用 17 201239531 41/1 /pif x為1的矽烷化合物例如可列舉:2-三曱氧基矽烷基 乙基琥珀酸針(2-trimethoxy silyl ethyl succinic anhydride)、3-三曱氧基矽烧基丙基號珀酸酐、3-三乙氧基 矽烷基丙基琥珀酸酐、3-三苯氧基矽烷基丙基琥珀酸酐、 3-三曱氧基矽烷基丙基戊二酸酐、3-三乙氧基矽烷基丙基 戊二酸酐、3-三苯氧基矽烷基丙基戊二酸酐等。 X為2的石夕烧化合物例如可列舉:二-1-丁氧基-雙[3-(二 氫-2,5- 呋喃二酮基)丙基]矽烷 (di-l-butoxy-bis[3-(dihydro-2,5-furandionyl)propyl]silane ) 、雙[3-(二氫_2,5-呋喃二酮基)丙基]二曱氧基矽烷、雙[3-(二 1 -2H- 0比0南-2,6(5H)-二酮基)丙基]二曱氧基石夕烧 (bis[3-(dihydro-2H-pyran-2,6(5H)-dionyl)propyl]dimethox y silane)等。 x為3的石夕烧化合物例如可列舉三[3_(二氫_2,5_α夫喃二 _基)丙基]甲氧基石夕烧等。 該些化合物(2)中,較佳為X為1的石夕院化合物,合 適的化合物(2)的具體例可列舉3-三甲氧基矽烧基丙基 琥珀酸酐、3-三乙氧基矽烷基丙基水琥珀酸酐等。 就耐熱透明性、硬度、耐擦傷性、耐熱龜裂性、密接 性、感度、解析度及顯影性提高的觀點而言,相對於原料 化合物的合計量,化合物(2)的合計添加比例較佳為15 mol%以下,更佳為13 mol%以下,進而更佳為1〇m〇1%以 下,進一步更佳為7 mol%以下。再者,相對於原料化合物 的合計量,化合物(2)的合計添加比例的下限較佳為〇5S 14 201239531 4I717pif 3-methyl (10) fluorenyl phenyloxy Wei, 3- propylene, propyl phenyl di? Alkoxydecane compound having an aryl group and an aryl group having a carbon number of ό~14; a 3,3'-dimethyl propyloxypropyl dimethoxy group The 3,3,-dipropane oxomethoxydicarb has two (meth)acryloxy alkoxy decane compounds. Examples of the chopping compound having a m of 3 include tributyl decyl oxy-stone, trimethyl methoxy cerium, trimethyl ethoxylate, tributyl ethoxy, and the like. a hydrolyzable decane compound of a mercapto group; a hydrolyzable decane compound having three aryl groups of 6 to 14; 3,3',3"-trimethylpropene oxime A hydrolyzable decane compound of propyl methoxy decane, 3 3, 3" _ tripropylene oxy-oxomethoxy methoxy, etc. Among these compounds (1), a 7-decomposing Wei compound having a carbon number of ketone, a hydrolyzable zeolitic compound having a Wei 6 to 14 base group, and a hydrolyzable property having a (meth)propoxy group are preferable. In the case of these compounds, a compound of the above formula (1) wherein m is oxime is particularly preferred. Specific examples of a suitable compound (1) include methyl dimethoxy oxylithus, decyl triethoxy sulphur, ethyl trimethoxy sulphate, ethyl triethoxy wei, butyl trimethoxy An alkoxydecane compound having i alkyl groups having 1 to 6 carbon atoms; a phenyl group having a carbon number of 6 to 14 such as phenyltrimethoxywei; 15 201239531 *-H / 1 /pif Oxydecane compound; 3 - propylene methoxy propyl trimethoxy decane, 3 - methacryloxypropyl dimethoxy decane, 3 - propylene methoxy propyl triethoxy decane, An alkoxydecane compound having one (meth) propylene fluorenyloxy group such as mercapto acryloxypropyltriethoxy decane. From the viewpoint of improvement of heat-resistant transparency, hardness, scratch resistance, heat crack resistance, adhesion, sensitivity 'resolution and developability, the total addition ratio of the compound (1) is preferably based on the total amount of the raw material compounds. It is 1〇mol%~80 m〇i%, more preferably 1〇m〇1%~75 m〇1%, and further 15 mol0/〇~7〇m〇i%. In the present invention, in the case of further improving the scratch resistance and the heat cracking resistance, in the above-mentioned suitable compound (1), it is preferred to use an alkyl group selected from the group having a slave number of ~6. The hydrolyzable decane compound and the at least one type 7-sintering compound j of the hydrolyzable 7-sintering compound + having an aryl group of carbon number ~14 are also referred to as "Wei compound (lbl)"), and these Wei compounds (ibl) Particularly preferred is a decane compound in which m of the above formula (1) is 1. Τι yp ... the person "Wang Jin Yi Shao Shang Shang's point of view, the above compound (1) towel 'preferably uses (meth) propylene oxime: a decomposing Wei compound, especially in the above formula (1) Hydrolyzable stone having a thioloxy group as a base; (4) Hydrolyzable C having a fluorenyl group as a "complex (ic1)"), and having a catalyzed compound (The following is also referred to as "the shi yi to y-type, and it is more preferable to use the Shi Xixuan compound 201239531 41717pif (lc1) and the decane compound (Id1). In addition, the hydrolyzable decane compound having a (fluorenyl) propylene oxime group It is preferably used together with the decane compound (lb1). When the decane compound (lb1) is used as the compound (1), the raw material compound is improved from the viewpoint of further improvement in scratch resistance and heat cracking resistance. The total addition ratio of the decane compound (lbi) is preferably from 10 mol% to 80 mol%, more preferably from 15 mol% to 75 m〇1%, still more preferably from 30 mol% to 70 mol%. From the viewpoint of further improvement in sensitivity and resolution, relative to the combination of raw materials The total addition ratio of the hydrolyzable decane compound having a (fluorenyl) acryloxy group is preferably from 5 mol% to 25 mol%, more preferably from 1 mol% to 20 m〇l〇/0 〇 In the case of using a decane compound (lci) and a decane compound (ldl) j, the addition ratio (1) (four) of the two is preferably 〇〇s3 in terms of a molar ratio from the viewpoint of further improving the scratch resistance and the heat crack resistance. More preferably, it is 0.2 to 1.5, and more preferably 〇.3 to]. The θ component [Α1] further contains the compound (2) as an essential component. The ruthenium inhibits excessive crosslinking density caused by TEOS 婵=sex and resistance The improvement of the scratching property is also helpful to the two compounds (2), which may be exemplified by a decane compound, a decane compound or a decane compound having a ruthenium of 3. As a compound, (2), the compound (2) may be used alone. Further, the above-mentioned decane compound having 17 201239531 41/1 /pif x is exemplified by 2-trimethoxy silyl ethyl succinic anhydride, 3-tri曱 矽 矽 propyl propyl benzoic anhydride, 3-triethoxy decyl propyl succinic anhydride , 3-triphenoxydecylpropyl succinic anhydride, 3-trimethoxyoxydecyl propyl glutaric anhydride, 3-triethoxydecyl propyl glutaric anhydride, 3-triphenoxy fluorenyl And propyl glutaric anhydride, etc. The cerium compound of which X is 2 may, for example, be di-1-butoxy-bis[3-(dihydro-2,5-furandioni)propyl]decane (di) -l-butoxy-bis[3-(dihydro-2,5-furandionyl)propyl]silane ), bis[3-(dihydro-2,5-furandioni)propyl]dimethoxy decane, double [3-(di-1 -2H- 0 vs. 0-South-2,6(5H)-dione)propyl]dimethoxy oxalate (bis[3-(dihydro-2H-pyran-2,6() 5H)-dionyl)propyl]dimethox y silane) and the like. Examples of the ceramsite-containing compound having x of 3 include tris[3_(dihydro-2,5-α-pentan-2-yl)propyl]methoxylate and the like. Among these compounds (2), a Shi Xi Yuan compound wherein X is 1 is preferable, and specific examples of the suitable compound (2) include 3-trimethoxysulfonylpropyl succinic anhydride and 3-triethoxy group.矽alkylpropyl water succinic anhydride and the like. From the viewpoint of improvement in heat-resistant transparency, hardness, scratch resistance, heat crack resistance, adhesion, sensitivity, resolution, and developability, the total addition ratio of the compound (2) is preferably based on the total amount of the raw material compounds. It is 15 mol% or less, more preferably 13 mol% or less, further preferably 1 〇 m 〇 1% or less, further preferably 7 mol% or less. Further, the lower limit of the total addition ratio of the compound (2) is preferably 〇5 with respect to the total amount of the raw material compounds.

S 18 201239531 41717pif m〇1% ’更佳為1 mGl% ’進而更佳為2 mol%,特估 则1%。相對於原料化合物的合計量,化合物(2),3 添加比例的範圍較佳為0.5 mol。/。〜15 mol%,更佳:°十 mol/〇〜13m〇l〇/0,進而更佳為 2m〇1%〜1〇m〇1〇/。二」 更佳為3 mol%〜7 。 y 、化合物⑴及化合物⑺進行水解縮合 地制町方法:於溶射混合作為原料化 、〇勿的S、化合物⑴及化合物(2),於混合溶液中 添力Jc $行水解縮合。該情形時,可於反應體系内一次 I1 生,力口各原料化合物及水而以—階段來進行反應,另外亦 藉由將各原料化合物及水分數次添加至反應體系内而以 夕又來進打水解縮合反應。再者,水解縮合物不僅包含 所有的水馳基進行水解縮合㈣的產物,亦包含水解性 基的:部分未水解或縮合而赫的產物。 於水解縮合反應中,化合物(2)的酸酐基如下述流程 (sdieme)所示般開環,生成叛基。再者,式中的〇r4基 表不來源於藉由水解而生成驗基_基 與因水 解而於反應體系内生成的碳數1〜6的^的醇解 (alcoholysis)而生成的烷氧基。 [化7]S 18 201239531 41717pif m〇1% 'more preferably 1 mGl%' and further preferably 2 mol%, especially 1%. The compound (2), 3 addition ratio is preferably in the range of 0.5 mol based on the total amount of the raw material compounds. /. 〜15 mol%, more preferably: ° ten mol / 〇 ~ 13 m 〇 l 〇 / 0, and more preferably 2 m 〇 1% ~ 1 〇 m 〇 1 〇 /. The second is more preferably 3 mol%~7. y, the compound (1) and the compound (7) are hydrolyzed and condensed. The method of the pulverization method is as follows: S, the compound (1) and the compound (2) which are mixed as a raw material, and the mixture is stirred and liquefied in a mixed solution. In this case, the reaction can be carried out once in the reaction system, and each of the raw material compounds and water can be reacted in a stage, and the raw material compound and water are added to the reaction system in portions. The hydrolysis condensation reaction is carried out. Further, the hydrolysis condensate contains not only the product of the hydrolysis condensation (4) of all the water-based groups but also the hydrolyzable group: a partially unhydrolyzed or condensed product. In the hydrolysis condensation reaction, the acid anhydride group of the compound (2) is ring-opened as shown in the following scheme (sdieme) to form a thiol group. Further, the 〇r4 base table in the formula does not originate from an alkoxy group formed by hydrolysis to form an alkohyl group which has an alkyl group and a carbon number of 1 to 6 which is formed in the reaction system by hydrolysis. base. [Chemistry 7]

19 201239531 41717pif 式中,R4表示氫原子或碳數1〜6的烧基,Z與上文所 述為相同含意。R4的烧基可列舉與R1相同的基,其具體 構成如R1中所說明。 水解縮合反應中使用的溶劑並無特別限定,通常使用 與製備感放射線性組成物所用的溶劑相同的溶劑。此種溶 Μ可列舉·乙一醇單烧基_乙酸g旨(ethylene glycol monoalkylether acetate)、二乙二醇二烷基醚、丙二醇單烷 基醚(propylene glyC〇l monoalkylether)、丙二醇單烷基醚 乙酸酯、丙酸酯類。該些溶劑可單獨使用一種,亦可組合 使用兩種以上。該些溶劑中,較佳為二乙二醇二T醚、二 乙二醇乙基甲基醚、丙二醇單甲醚、丙二醇單乙醚、丙二 醇單甲醚乙酸酯、3-甲氧基丙酸曱酯。 ,解,合反應巾使用的水較佳為使用藉由逆滲透膜處 理、離子3C換處理、蒸财方法進行了純化的水。藉由使 用此種純化水’可抑彻反應,使水觸反應性提高。 相對於TE〇S、化合物⑴及化合物⑺的水解性 土的。。十量1莫耳’水的使用量較佳為❹]莫耳〜3莫耳, ,佳為0.3莫耳〜2莫耳,進而更佳為〇 5莫耳〜工$莫耳。 错由2此種$的水’可使水解縮合的反應速度最適化。 化人物縮合反應即便不特獅加觸媒,亦藉由因 但i可另添續$生成的_而以自觸_方式進行’ 草酉文、乙酸、三氟乙酸、三氟甲磺酸 201239531 41717pif (trifluoromethane sulfonic acid)等有機酸,酸性離子交換 樹脂等。 、 就促進水解縮合反應的觀點而言,相對於、化 合物(1)及化合物(2 )的会奸吾1 乃、;町σ 0卞里1昊耳,觸媒的使用量 較佳為0·2莫耳以下,更佳為〇 〇〇〇〇1莫耳〜〇」莫耳。 水解縮合反應的反應溫度及反應時間可適當設定,例 如可採用下述條件。反應溫度較佳為4(rc〜2〇(rc,更佳 為50°C〜150°C。反應時間較佳為30分鐘〜24小時,更佳 為1小時〜12小時。藉由設定為此種反應溫度及反應時 間’可最有效率地進行水解縮合反應。 水解縮合反應後添加脫水劑’繼而進行蒸發 (evaporation) ’藉此可將水及所生成的醇從反應體系中去 除。該階段中所用的脫水劑通常吸附或包合過剩的水而脫 水能力被完全消耗,或是藉由蒸發而被去除。 成分[A2] 成分[A2]具有來源於TE0S的Si〇2單元、來源於化合 物(1 )的下述式(la)所表示的結構單元(以下亦稱為「結 構單元(la)」)、及來源於化合物(2)的下述式(2a)所 表示的結構單元(以下亦稱為「結構單元。Si〇2 單元、結構單元(la)及結構單元(2a)各結構單元可為 單獨一種’亦可包含兩種以上。 [化8] RHCH2^Si-〇(4.m)/2 (la) 21 201239531 41 /1/pif [化9]19 201239531 41717pif wherein R4 represents a hydrogen atom or a carbon group having 1 to 6 carbon atoms, and Z has the same meaning as described above. The alkyl group of R4 may be the same as those of R1, and its specific constitution is as described in R1. The solvent to be used in the hydrolysis condensation reaction is not particularly limited, and a solvent similar to the solvent used for the preparation of the radiation sensitive composition is usually used. Such a solvent may, for example, be an ethylene glycol monoalkylether acetate, a diethylene glycol dialkyl ether, a propylene glycol monoalkyl ether, or a propylene glycol monoalkyl ether. Acetate, propionate. These solvents may be used alone or in combination of two or more. Among these solvents, diethylene glycol di-t-ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, and 3-methoxypropionic acid are preferred. Oxime ester. The water used for the reaction and the reaction towel is preferably water which has been purified by a reverse osmosis membrane treatment, an ion 3C exchange treatment, or a steaming method. By using such purified water, the reaction can be suppressed, and the water contact reactivity is improved. Relative to the hydrolyzable soil of TE〇S, compound (1) and compound (7). . The amount of water used in the first ten moles of water is preferably ❹]mole ~ 3 moles, preferably 0.3 moles to 2 moles, and more preferably 〇 5 moles ~ work $ moer. The wrong water of 2 such $ can optimize the reaction rate of hydrolysis condensation. The character condensation reaction, even if it is not a special lion plus a catalyst, can be carried out by means of self-touching by means of _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Organic acids such as 41717pif (trifluoromethane sulfonic acid), acidic ion exchange resins, etc. From the viewpoint of promoting the hydrolysis and condensation reaction, the use amount of the catalyst is preferably 0% with respect to the compound (1) and the compound (2), and the use of the catalyst. 2 Moel below, more preferably 〇〇〇〇〇 1 Mo Er ~ 〇 "Mer. The reaction temperature and reaction time of the hydrolysis condensation reaction can be appropriately set, and for example, the following conditions can be employed. The reaction temperature is preferably 4 (rc 2 Torr (rc, more preferably 50 ° C to 150 ° C. The reaction time is preferably 30 minutes to 24 hours, more preferably 1 hour to 12 hours. The reaction temperature and the reaction time can be carried out most efficiently in the hydrolysis condensation reaction. After the hydrolysis condensation reaction, a dehydrating agent is added, followed by evaporation, whereby water and the produced alcohol can be removed from the reaction system. The dehydrating agent used in the process generally adsorbs or entraps excess water and the dehydration ability is completely consumed or removed by evaporation. Component [A2] Component [A2] has Si〇2 unit derived from TEOS, derived from compound (1) a structural unit represented by the following formula (la) (hereinafter also referred to as "structural unit (la)"), and a structural unit represented by the following formula (2a) derived from the compound (2) (hereinafter) Also known as "structural unit. Si〇2 unit, structural unit (la) and structural unit (2a) each structural unit can be a single 'can also contain two or more. [Chemical 8] RHCH2^Si-〇 (4. m)/2 (la) 21 201239531 41 /1/pif [Chemistry 9]

[式中,R2、R4、m、n、x、y及z與上文戶斤述為相同 含意] 該些中,特別是式(la)中較佳為m為1,式(2a) 中較佳為X為1。 將式(1 a)中m為1、式(2a)中X為1的情形的結 構單元分別示於下述式(Ι-la)、式(2-la)。 [化 10] 1/2 Ο R2-(cH 士 Si—Ο 1/2 (1-la) 0 1/2 [化 ll][wherein, R2, R4, m, n, x, y, and z are the same as those described above.] In the above, especially in the formula (la), m is preferably 1, in the formula (2a) Preferably, X is 1. The structural unit in the case where m is 1 in the formula (1a) and X is 1 in the formula (2a) is shown in the following formula (Ι-la) and (2-la), respectively. 1/2 Ο R2-(cH 士 Si—Ο 1/2 (1-la) 0 1/2 [化 ll]

丫 1/2 Si—〇1/2 〇1/2 (2-la)1/2 1/2 Si—〇1/2 〇1/2 (2-la)

22 201239531 41717plf t卜插取、R、n、y&z與上文所述為相同含意] 此種^夕氣貌可藉由使TE〇s、化合物⑴及化合物 C J進仃上述水解縮合反應而 腦'化合物⑴及化合物⑺中的兩種化^由的^ 縮口 與其餘部分的化合物的水解縮合反應而獲得。即, SW2單it、結構單元(la)及結構單元㈤可分別以無 規共聚合、嵌段絲合的任-態樣而含有。 就t,、、、透明性、硬度、耐擦傷性、耐熱龜裂性、密接 性、感度。、解析度及顯影性提高的觀點而言,成分[八2]中 的S〗〇2单7L、結構單元(la)及結構單元(2a)的各含有 比例如下。 於成分[A2]的所有結構單元中,si〇2單元較佳為5 m〇1%〜75 m〇1%,更佳為10 mol%〜70 mol%,進而更佳為 25 mol0/〇〜65 mol%。 於成分[A2]的所有結構單元中,結構單元(u)較佳 為 10 m〇1%〜80 mol%,更佳為 10 mol〇/〇〜75 mol%,進而 更佳為 15 mol%〜70 mol%。 於成刀[A]的所有結構單元中,結構單元(2a)較佳 為15m〇1%以下,更佳為13mol%以下,進一步更佳為1〇 mol%以下,進而佳為7 m〇1%以下,其下限較佳為ο』 则1% ’更佳為1 ’進而更佳為2 mol%,特佳為3 mol%。關於結構單元(2a)的含有比例的範圍,於成分[a2] 的所有結構單元巾,較料Q 5福%〜15 mQl%,更佳為 1 mol%〜13 m〇l% ’進而更佳為2 m〇1%〜1〇 m〇1%,進而 23 201239531 ^1/1/pif 更佳為3 mol%〜7 mol%。 另外,就耐熱龜裂性及耐擦傷性進一步提高的觀點而 言,較佳為含有1個以上的下述式(lb)所表示的結構單 元(以下亦稱為「結構單元(lb)」)作為結構單元(la)。 [化 12] (R5_)^Si~0(4-m)/2 ⑽ 式(lb)中,R5表示碳數1〜6的烷基或碳數6〜14 的芳基’ m與上文所述為相同含意。 R5的烷基可列舉與上述R1相同的基,另外,的芳 基可列舉與上述R2相同的基。其具體構成如上述所說明。 另外’ m較佳為1。將式(lb)中m為1的情形的社 構單元示於下述式(l_lb)。 [化 13] 丫1/2 (l-lb) R5-S|i—〇1/2 01/222 201239531 41717plf t insert, R, n, y & z are the same as described above] This gas can be obtained by subjecting TE〇s, compound (1) and compound CJ to the above hydrolysis condensation reaction The two compounds in the brain 'compound (1) and the compound (7) are obtained by a hydrolysis condensation reaction of the remaining compound. That is, the SW2 single-it, the structural unit (la), and the structural unit (5) may be contained in any form of random copolymerization or block-bonding, respectively. It is t,,,, transparency, hardness, scratch resistance, heat crack resistance, adhesion, and sensitivity. In view of the improvement of the resolution and the developability, the respective ratios of S, 〇2, 7L, structural unit (la), and structural unit (2a) in the component [VIII2] are as follows. In all the structural units of the component [A2], the si〇2 unit is preferably 5 m〇1% to 75 m〇1%, more preferably 10 mol% to 70 mol%, and still more preferably 25 mol0/〇~ 65 mol%. In all the structural units of the component [A2], the structural unit (u) is preferably 10 m〇1% to 80 mol%, more preferably 10 mol〇/〇 to 75 mol%, and still more preferably 15 mol%~ 70 mol%. In all the structural units of the yoke [A], the structural unit (2a) is preferably 15 m 〇 1% or less, more preferably 13 mol % or less, still more preferably 1 〇 mol % or less, and further preferably 7 m 〇 1 Below %, the lower limit is preferably ο", then 1% 'more preferably 1' and further preferably 2 mol%, particularly preferably 3 mol%. Regarding the range of the content ratio of the structural unit (2a), in all the structural unit tissues of the component [a2], it is preferable to be more than 15 m%, more preferably 1 mol% to 13 m〇l%, and further preferably It is 2 m〇1%~1〇m〇1%, and further 23 201239531 ^1/1/pif is preferably 3 mol% to 7 mol%. In addition, it is preferable to contain one or more structural units represented by the following formula (lb) (hereinafter also referred to as "structural unit (lb)") from the viewpoint of further improving heat-resistant cracking resistance and scratch resistance. As a structural unit (la). (R5_)^Si~0(4-m)/2 (10) In the formula (lb), R5 represents an alkyl group having 1 to 6 carbon atoms or an aryl group m having a carbon number of 6 to 14 and the above Said the same meaning. The alkyl group of R5 may be the same as the above R1, and the aryl group may be the same as the above R2. The specific configuration is as described above. Further, 'm is preferably 1. The social unit in the case where m is 1 in the formula (lb) is shown in the following formula (l_lb).化 1/2 (l-lb) R5-S|i—〇1/2 01/2

L ^ τ A、六·丄又π您馮;f目问令、蒽J 於成分[A2]的所有結構單元中,結構單元( 有比例較佳為10 m〇1%〜80 m〇1%,更佳 moP/o,進而更佳為 3GmGl%〜7G_%。‘·.、m〇 /。〜7 進而’本發财,就感度及顯影性進-步提高的_ 24 201239531 /1/pif 所構早70 (la),難為含有選自下述式(lc: 的構I元(以下亦稱為「結構單元(le)」)及下 結構單元(以下亦稱為「結構單元(⑷」: 本广種’更佳為含有結構單元(1C)及結構單元(Id〕 播一,而,較佳為含有結構單^⑽)並且含有選自結 構早儿(lc)及結構單元(ld)中的至少一種。 [化 14] CH3 Ο I II , CH2=C—C-O-fCH: -Si—〇 (4 - m)/2 (lc) [化 15]L ^ τ A, 丄·丄 and π你冯; f目问令,蒽J in all the structural units of the component [A2], the structural unit (the proportion is preferably 10 m〇1%~80 m〇1%) More preferably moP/o, and more preferably 3GmGl%~7G_%. '·., m〇/.~7 and then 'this is a fortune, the sensitivity and developability are improved _ 24 201239531 /1/pif It is difficult to contain a structure I element (hereinafter also referred to as "structural unit (le)") and a lower structural unit (hereinafter also referred to as "structural unit ((4)") which are selected from the following formula (lc:) The present invention is more preferably a structural unit (1C) and a structural unit (Id), but preferably contains a structural unit (10) and contains a structure selected from the group (lc) and the structural unit (ld). At least one of them. CH14 Ο I II , CH2=C—CO-fCH: -Si—〇(4 - m)/2 (lc) [Chem. 15]

ΟII CH2=CH一C— 〇~(- 卜 〇(4婦 Od) 式(lc)及式(Id)中,m&n與上文所述為相同含 意’ m較佳為1,η較佳為3。 將式(lc)、式(Id)中m為1的情形的結構單元分 別示於下述式(Ι-lc)、式(Ι-ld)。 刀 [化 16] 〇=c H3I C——C II π2 cΟII CH2=CH-C— 〇~(- 〇 〇 (4 O Od) In the formula (lc) and (Id), m&n has the same meaning as described above, m is preferably 1, and η is preferred. 3. The structural units in the case where m is 1 in the formula (lc) and the formula (Id) are respectively shown by the following formula (Ι-lc) and the formula (Ι-ld). Knife [Chemistry 16] 〇 = c H3I C——C II π2 c

2 C T ο—si—ο /2 /2 /2 01 1C) 25 201239531 斗1 /1 /pif [化Π] ? ?1/2 CH2=CH-C-〇-(cH2);rSj--〇1/2 (1.ld) 〇1/2 [式中,n與上文所述為相同含意] 就感度及解析度進-步提高的觀點而言,於成分[A2] 的所有結構單元巾,結構單元(le)與結構單元(⑷的 合計含有比例較佳為5 mol%〜25 mol%,更佳為1〇 m〇l% 〜20 mol%。 另外,於含有結構單元(lc)及結構單元的情 形時’就哪傷性及耐龜難進—步提高峨點而言,結 構單元(le)與結構單元(ld)的含有比例(le/ld)以莫 耳比較佳為〇.〇5〜3,更佳為仏?〜;! 5,進而更佳為〇 3 〜1 〇 另外,結構單元(2a)可列舉來源於上述化合物(2) 的結構單元’其中,較佳為來源於3_三曱氧基矽烷基丙基 琥ίό酸針、3-三乙氧基矽烷基丙基琥站酸酐等的結構單元。 成分[Α]成分可單獨使用,亦可混合使用兩種以上。 成分[Α]的分子量可利用移動相使用四氫呋喃的凝膠 θ 透層析儀(Gel Permeation Chromatography,GPC),以 聚苯^烯換算的重量平均分子量的形式來測定。成分[A] 的重量平均分子量(Mw)較佳為5〇〇〜loooo,更佳為1000 〜7000。藉由使成分[A]的重量平均分子量的值為500以 26 201239531 41717pif 上’可改善感放射線性組成物的塗膜的成膜性。另一方面, 藉由使重量平均好量為10_以下,可防域放射線性 組成物的鹼顯影性下降。 另外,重量平均分子量(Mw)與藉由同樣條件而測 定的數量料分子量(Mn)之比、即分散度(Mw/Mn) 較佳為1.0〜15·〇,更佳為^〜则,進而更佳為i卜5 〇。 藉由設定為此種範圍内,可兼具鹼顯影性、密接性及耐熱 龜裂性。 成分[B] 成分[B]為具有2個以上的乙稀性不飽和基的化合 物,是藉由在後述的成分[C]光自由基聚合起始劑的存在下 照射放射線而聚合的多官能性單體。其中,成分[B]中將成 分[A]除外。 就聚合性良好,所得的硬化膜的強度提高的觀點而 言,此種化合物可較佳地使用2官能或3官能以上的(曱基) 丙埽酸酯。 2官能(曱基)丙烯酸酯可列舉:使乙二醇、丙二醇、聚 乙二醇、聚丙二醇般的二價的脂肪族多經基化合物與(曱基) 丙稀酸反應而獲付的多官能(曱基)丙稀酸g旨。具體可列 舉.乙二醇二丙稀酸醋(ethylene glycol diacrylate)、丙二 醇二丙烯酸酯、丙二醇二曱基丙烯酸酯、乙二醇二甲基丙 烯酸酯、二乙二醇二丙烯酸酯、二乙二醇二曱基丙烯酸酷、 四乙二醇二丙烯酸酯、四乙二醇二甲基丙烯酸酯、1,6_己 二醇二丙烯酸酯、1,6-己二醇二曱基丙烯酸酯、1,9_壬二醇 27 201239531 HI /1 /pif 二丙烯酸酯、1,9-壬二醇二曱基丙烯酸酯等。市售品例如 可列舉:Aronix M-210、Aronix M-240、Aronix M-6200 (以 上為東亞合成公司製造);KAYARAD HDDA、KAYARAD HX-220、KAYARAD R-604 (以上為曰本化藥公司製造); Viscoat 260、Viscoat 312、Viscoat 335HP (以上為大阪有 機化學工業公司製造);Light Acrylate 1,9-NDA(共榮社化 學公司製造)等。2 CT ο—si—ο /2 /2 /2 01 1C) 25 201239531 Buck 1 /1 /pif [Π] ? ?1/2 CH2=CH-C-〇-(cH2);rSj--〇1 /2 (1.ld) 〇 1/2 [wherein n is the same as described above] In terms of sensitivity and resolution improvement, all structural unit tissues of component [A2], The total content of the structural unit (le) and the structural unit ((4) is preferably 5 mol% to 25 mol%, more preferably 1 〇m〇l% to 20 mol%. In addition, the structural unit (lc) and the structure are contained. In the case of the unit, the ratio of the structural unit (le) to the structural unit (ld) (le/ld) is better than that of the unit in terms of which damage and resistance to the turtle are difficult to advance. 5 to 3, more preferably 仏?~;! 5, and more preferably 〇3 〜1 〇 In addition, the structural unit (2a) may be a structural unit derived from the above compound (2), preferably derived from A structural unit such as a tris(hydroxy) hydroxyalkyl propyl sulfonate or a 3-triethoxy decyl propyl succinic anhydride. The component [Α] may be used singly or in combination of two or more. The molecular weight of the component [Α] can be determined by using mobile phase using tetrahydrogen Gel permeation Chromatography (GPC) of furan is measured in the form of a polyphenylene oxide-based weight average molecular weight. The weight average molecular weight (Mw) of the component [A] is preferably 5 〇〇. The loooo is more preferably from 1000 to 7000. By setting the weight average molecular weight of the component [A] to 500 to 26 201239531 41717pif, the film formation property of the coating film of the radiation sensitive composition can be improved. When the average weight is 10% or less, the alkali developability of the anti-radiation composition can be lowered. Further, the ratio of the weight average molecular weight (Mw) to the molecular weight (Mn) of the amount measured by the same conditions, that is, The degree of dispersion (Mw/Mn) is preferably 1.0 to 15 Å, more preferably 〜2, and still more preferably i 5 5 〇. By setting it to such a range, it is possible to have both alkali developability and adhesion. And the heat-resistant cracking property. The component [B] is a compound having two or more ethylenically unsaturated groups, and is irradiated by the presence of the component [C] photoradical polymerization initiator described later. a polyfunctional monomer which is polymerized by radiation, wherein component [B] contains component [A] In view of the fact that the polymerizability is good and the strength of the obtained cured film is improved, such a compound can preferably use a bifunctional or trifunctional or higher (fluorenyl) propionate. The ester may be a polyfunctional (fluorenyl) propylene which is obtained by reacting a divalent aliphatic poly-based compound such as ethylene glycol, propylene glycol, polyethylene glycol or polypropylene glycol with (mercapto)acrylic acid. Acid g. Specific examples thereof include ethylene glycol diacrylate, propylene glycol diacrylate, propylene glycol dimercapto acrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, and diethylene glycol. Alcohol dimercapto acrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimercapto acrylate, 1 , 9_decanediol 27 201239531 HI /1 /pif diacrylate, 1,9-nonanediol dimercapto acrylate, and the like. Commercial products include, for example, Aronix M-210, Aronix M-240, Aronix M-6200 (above manufactured by East Asia Synthetic Co., Ltd.); KAYARAD HDDA, KAYARAD HX-220, KAYARAD R-604 (above is Sakamoto Chemical Co., Ltd.) Manufactured; Viscoat 260, Viscoat 312, Viscoat 335HP (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.); Light Acrylate 1, 9-NDA (manufactured by Kyoeisha Chemical Co., Ltd.).

3官能以上的(曱基)丙烯酸酯可列舉:使甘油 (glycerine)、三經曱基丙炫(trimethylol propane)、季戊 四醇(pentaerythritol)、二季戊四醇般的三價以上的脂肪族 多羥基化合物與(曱基)丙烯酸反應而獲得的多官能(曱基) 丙稀酸酯。具體可列舉:三羥甲基丙烷三丙烯酸酯、三羥 曱基丙烷三甲基丙烯酸酯、季戊四醇三丙烯酸酯、季戊四 醇三曱基丙烯酸酯、季戊四醇四丙烯酸酯、季戊四醇四曱 基丙烯酸酯、二季戊四醇五丙烯酸酯、二季戊四醇五甲基 丙烯酸酯、二季戊四醇六丙烯酸酯、二季戊四醇五丙稀酸 酉旨與二季戊四醇六丙婦酸g旨的混合物、二季戊四醇六甲基 丙烯酸酯、環氧乙烷改質二季戊四醇六丙烯酸酯等。市售 品例如可列舉:Aronix M-309、Aronix M-315、Aronix M-400、Aronix M-405、Aronix M-450、Aronix M-7100、 Aronix M-8030、Aronix M-8060、Aronix TO-1450 (以上為 東亞合成公司製造);KAYARAD TMPTA、KAYARAD DPHA、KAYARAD DPCA-20、KAYARAD DPCA-30、 KAYARAD DPCA-60 ' KAYARAD DPCA-120 > KAYARADThe trifunctional or higher (fluorenyl) acrylate may, for example, be a trihydric or higher aliphatic polyhydroxy compound such as glycerine, trimethylol propane, pentaerythritol or dipentaerythritol. A polyfunctional (fluorenyl) acrylate obtained by the reaction of acrylic acid. Specific examples thereof include trimethylolpropane triacrylate, trihydroxydecyl propane trimethacrylate, pentaerythritol triacrylate, pentaerythritol tridecyl acrylate, pentaerythritol tetraacrylate, pentaerythritol tetradecyl acrylate, dipentaerythritol. Pentaacrylate, dipentaerythritol pentamethyl acrylate, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, a mixture of dipentaerythritol hexa-butanoic acid, dipentaerythritol hexamethacrylate, ethylene oxide Modified dipentaerythritol hexaacrylate and the like. Commercially available products include, for example, Aronix M-309, Aronix M-315, Aronix M-400, Aronix M-405, Aronix M-450, Aronix M-7100, Aronix M-8030, Aronix M-8060, Aronix TO- 1450 (above manufactured by East Asia Synthetic Company); KAYARAD TMPTA, KAYARAD DPHA, KAYARAD DPCA-20, KAYARAD DPCA-30, KAYARAD DPCA-60 'KAYARAD DPCA-120 > KAYARAD

S 28 201239531 41717pif DPEA-12(以上為曰本化樂公司製造);viscoat 295、Viscoat 300、Viscoat 360、Viscoat GPT、Viscoat 3PA、Viscoat 400 (以上為大阪有機化學工業公司製造)等。 另外,除了三(2-丙烯醯氧基乙基)磷酸酯 (tri(2-acryl〇yl〇Xyethyl)ph〇sphate)、三(2-甲基丙烯醯氧基 乙基)礙酸酯、琥珀酸改質季戊四醇三丙烯酸酯、琥珀酸改 質二季戊四醇五丙烯酸酯、三(丙烯醯氧基乙基)異三聚氰 酸酉日(tri(acryloxyethyl)isocyanurate)以外,亦可使用使具 有直鏈伸烷基及脂環式結構且具有2個以上的異氰酸酯基 的化合物,與分子内具有丨個以上的羥基且具有3個、4 個或5個(甲基)丙烯醯氧基的化合物反應而獲得的多官能 丙稀酸聚胺g旨系化合物等。含有多官能丙烯酸聚胺醋系化 合物的市售品可列舉New Frontier R-ll5〇 (第一工業製藥 公司製造)、艮八丫八尺八0 0卩11八-4011(日本化藥公司製造) 等。 "亥二中較佳為1,9-壬二醇二曱基丙稀酸酉旨、三經曱 基丙烧三轉_旨、季細醇三賴酸§|、季戍四醇四丙 烯酸醋、二季戊四醇五丙騎醋、二季戊四醇六丙稀酸酷、 ί二四醇六⑽酸Sl與二季戊四醇五__的混合 、壤氧乙烧改質二季戊四醇六㈣_旨、琥紐改質季 ^四酵三—、琥雜改質二季戊四醇五丙烯酸酿、 脸妒基乙基)異二聚氣酸酿、含有多官能丙烯酸聚 Wa曰糸化5物的市售品等。其中,較佳為3官能以上、特 另1疋3官能〜6官能的(曱基)丙稀酸醋,特佳為:季戊四醇 29 201239531 41717plf 六丙烯酸酿與二季戊四醇五丙烯酸酯的混合物。 成分[B]成分可單獨使用,亦可混合使用兩種以上。相 對於成分[Αμοο㈣份’成分[B]的含錄佳為5 f量份〜 300質量份,更佳為10質量份〜2〇〇質量份,進而更佳為 15質量份〜1GG質量份,進-步更佳為2()質量份〜8〇質 里伤。藉由使成分[B]的含量在上述範圍内,硬度、耐熱性 及感度變得更良好。 ^ 成分[C] 成分[C]為光自由基聚合起始劑。光自由基聚合起始劑 是可藉由可見光線、紫外線、遠紫外線、電子束、X射線 等放射線的曝光而產生可引發上述成分[Β]的硬化反應的 活性種的化合物。 本發明中使用的光自由基聚合起始劑可列舉〇_醯基 肟化合物(O-acyl oxime compound )、苯乙酮化合物 (acetophenone compound )、醯基氧化膦化合物(aCyl phosphine oxide compound)、聯咪。坐化合物(biimidazole compound )等。 0-醯基肟化合物的具體例可列舉:乙酮,l-[9-乙基 -6-(2-甲基苯曱醯基)-9H-咔唑-3-基]-,1-(0-乙醯基肟) ( ethanone, 1 -[9-ethyl-6-(2-methyl benzoyl)-9H-carbazol-3-yl]-,l-(0-acetyl oxime)、l-[9-乙基 •6-苯曱醯基-9.H,咔唑-3-基]-辛烷-1-酮肟-〇-乙酸酯、l-[9-乙基-6-(2-甲基苯甲醯基)-9.Η·-咔唑-3-基]-乙烷-1-酮肟-〇-苯曱酸酯、1-[9-正丁基-6-(2-乙基苯曱醯基)-9·Η·-咔唑-3-S 28 201239531 41717pif DPEA-12 (above is manufactured by Sakamoto Chemical Co., Ltd.); viscoat 295, Viscoat 300, Viscoat 360, Viscoat GPT, Viscoat 3PA, Viscoat 400 (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.). In addition, in addition to tris(2-acryl〇yl〇Xyethyl)ph〇sphate, tris(2-methylpropenyloxyethyl) acetoate, amber Acid-modified pentaerythritol triacrylate, succinic acid-modified dipentaerythritol pentaacrylate, and tri(acryloxyethyl)ococyanurate may also be used to have a linear chain. a compound having an alkyl group and an alicyclic structure and having two or more isocyanate groups, and reacting with a compound having more than one hydroxyl group in the molecule and having three, four or five (meth) acryloxy groups The obtained polyfunctional acryl polyamine g is a compound or the like. Commercial products containing a polyfunctional acrylic polyamine vinegar compound can be exemplified by New Frontier R-ll5(R) (manufactured by Daiichi Kogyo Co., Ltd.), 艮八丫八尺8 0卩11 8-4011 (manufactured by Nippon Kayaku Co., Ltd.) Wait. "Hei II is preferably 1,9-nonanediol dimercapto acrylic acid, three thiol propyl hydride, quaternary alcohol lysine §|, quaternary tetraol tetraacrylic acid Vinegar, dipentaerythritol, penta-propan vinegar, dipentaerythritol hexa-acrylic acid, glutaric alcohol, sulphuric acid, sulphate, sulphate, sulphate, sulphate, sulphate, sulphate, sulphate, sulphate The quality season ^ four leave three -, aza miscellaneous modified dipentaerythritol pentaacrylic acid, face thiol ethyl) heterodimeric acid brewing, commercial products containing polyfunctional acrylic poly Wa 曰糸 5 substances. Among them, a trifunctional or higher functional group, a monofunctional 3-membered to 6-functional (fluorenyl) acrylic acid vinegar, particularly preferably: pentaerythritol 29 201239531 41717plf a mixture of hexaacrylic acid and dipentaerythritol pentaacrylate. The component [B] may be used singly or in combination of two or more. The content of the component [B] is preferably 5 parts by mass to 300 parts by mass, more preferably 10 parts by mass to 2 parts by mass, even more preferably 15 parts by mass to 1 GG parts by mass, based on the component [Αμοο(four) parts of the component [B]. The step-by-step is better for 2 () parts by mass ~ 8 enamel. When the content of the component [B] is within the above range, the hardness, heat resistance and sensitivity are further improved. ^ Component [C] Component [C] is a photoradical polymerization initiator. The photoradical polymerization initiator is a compound which can generate an active species which can initiate a hardening reaction of the above component [Β] by exposure to radiation such as visible light, ultraviolet light, far ultraviolet light, electron beam or X-ray. The photoradical polymerization initiator used in the present invention may, for example, be an O-acyl oxime compound, an acetophenone compound, a cation phosphine oxide compound or the like. mum. Sitting compound (biimidazole compound) and the like. Specific examples of the 0-fluorenyl hydrazine compound include ethyl ketone, 1-[9-ethyl-6-(2-methylphenylindenyl)-9H-indazol-3-yl]-, 1-( 0-Ethyl group) (ethanone, 1 -[9-ethyl-6-(2-methyl benzoyl)-9H-carbazol-3-yl]-, l-(0-acetyl oxime), l-[9- Ethyl 6-benzoinyl-9.H, oxazol-3-yl]-octane-1-one oxime-indole-acetate, 1-[9-ethyl-6-(2-A Benzopyridinyl)-9.Η·-oxazol-3-yl]-ethane-1-one oxime-indole-benzoate, 1-[9-n-butyl-6-(2-B Benzoyl)-9·Η·-carbazole-3-

30 201239531 41717pif 基]-乙烧-1-嗣肪-O-苯曱酸酯、乙酮乙基_6_(2_曱基_4_ 四氳咬喃基笨曱醯基)-9.H.+坐士基从⑼乙隨基月亏^乙 酮,1-[9-乙基-6-(2-曱基-4-四氫吡喃基苯曱醯基>9 H._咔唑 -3-基]-,1-(0-乙醯基肪)、乙自同,^-乙基_6_(2_甲基_5_四氫 呋喃基苯曱醯基)-9.Η·-咔唑-3-基]_,;!_(〇_乙醯基肟)、乙 酮,1-[9-乙基_6-{2_甲基冰(2,2-二曱基_U_二氧雜環戊基) 甲氧基苯曱醯基}-9.圧-咔唑_3_基Kl_(〇_6醯基肟)、乙 酉同,1-[9-乙基-6-(2-曱基-4-四氫呋喃基曱氧基苯甲醯 基)-9·Η·-η卡吐-3-基]-,l-(〇-乙醯基肟)、12_辛二嗣卜㈣苯 硫基)-,2-(0-苯甲醯基將)]等。〇_醯基肪化合物可單獨使用 或混合使用兩種以上。 該些化合物中,較佳的〇_醯基肟化合物可列舉:乙 酵I,l-[9-乙基-6-(2-曱基苯曱酿基)_姐-。卡唾-3-基]-,l-(〇-乙 醯基肟)、乙酮,1-[9-乙基-6-(2-曱基-4·四氳呋喃基甲氧基苯 曱醯基)-9.Η.-α卡。坐-3-基]-,l-(〇-乙酸基月亏)、乙酮,i_[9_乙基 -6-{2-曱基-4-(2,2-二曱基-1,3·二氧雜環戊基)曱氧基苯曱醯 基}-9.11.-°卡唾-3-基]-,1-(0-乙酿基肪)、ι,2_辛二酮山卜(苯 硫基)-,2-(0-苯甲醯基肟)]。 苯乙酮化合物例如可列舉α_胺基酮化合物、α_羥基酮 化合物。苯乙酮化合物可單獨使用或混合使用兩種以上。 α_胺基酮化合物的具體例可列舉:2-苄基-2-二曱基胺 基-1-(4-嗎啉基苯基)_ 丁烷小酮 (2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl)-butane -1-one)、2-二甲基胺基-2-(4_甲基f基)-1-(4-嗎啉-4-基-苯 31 201239531 41717pif 基)-丁烷-1-酮、2-甲基-1-(4-曱硫基苯基)-2-嗎啉基丙烷小 酉同等。 (X-羥基酮化合物的具體例可列舉:1-苯基-2-羥基-2-曱 基丙烧-1-酮(l_phenyl-2-hydroxy-2-methyl propane-l-one)、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己 基苯基綱等。 該些苯乙酮化合物中,較佳為α-胺基g同化合物,特佳 為2-一曱基胺基-2-(4-曱基卞基)-1-(4-嗎°林-4-基-苯基)-丁 烧-1-嗣、2-曱基-1-(4-曱硫基苯基)-2-嗎琳基丙烧-1-嗣。 醯基氧化膦化合物的具體例可列舉:2,4,6-三曱基苯曱 酿基·二苯基-氧化鱗 (2,4,6-trimethyl benzoyl-diphenyl-phosphine oxide)、雙(2,4,6-三甲基苯甲醯 基)-苯基氧化膦等。醯基氧化膦化合物可單獨使用或混合 使用兩種以上。 該些醯基氧化膦化合物中,較佳為雙(2,4,6-三曱基苯 甲醯基)-苯基氧化膦。 聯咪唑化合物的具體例可列舉:2,2,-雙(2-氯苯 基)-4,4’,5,5,·四(4-乙氧基羰基苯基聯咪唑 (2,2 -bis(2-chlorophenyl)-4,4',5,5'-tetrakis(4-ethoxycarbony 1 phenyl)-l,2’-biimidazole)、2,2,-雙(2-氣苯基)-4,4’,5,5’-四苯 基-1,2’-聯口米》坐、2,2’-雙(2,4-二氣苯基)-4,4,,5,5,-四苯基-1,2,-聯味唾、2,2’-雙(2,4,6-三氯苯基)_4,4,,5,5,·四苯基-1,2,·聯咪 峻等。聯喃唾化合物可單獨使用或混合使用兩種以上。30 201239531 41717pif base]-Ethylene-1-phenanthrene-O-benzoate, ethyl ketone ethyl _6_(2_曱基_4_ 四氲氲基基曱醯基)-9.H.+ Shishiji from (9) B with base month loss ^ ethyl ketone, 1-[9-ethyl-6-(2-mercapto-4-tetrahydropyranylphenyl fluorenyl) 9 H.-carbazole 3-yl]-, 1-(0-ethenyl), B, X-ethyl_6_(2_methyl_5_tetrahydrofuranylphenyl)-9.Η·-carbazole -3-yl]_,;!_(〇_乙醯基肟), ethyl ketone, 1-[9-ethyl_6-{2_methyl ice (2,2-didecyl _U_ two Oxocyclopentyl) methoxybenzoinyl}-9. 圧-carbazole _3_yl Kl_(〇_6醯 肟), acetamidine, 1-[9-ethyl-6-(2 -mercapto-4-tetrahydrofuranyl decyloxybenzhydryl)-9·Η·-η卡吐-3-yl]-,l-(〇-ethylidene 肟), 12_辛二嗣卜(四) Phenylthio)-, 2-(0-benzylidene) will, and the like. The 〇_醯 base compound may be used singly or in combination of two or more. Among these compounds, preferred 〇 醯 醯 肟 compounds are exemplified by ethyl lactate I, l-[9-ethyl-6-(2-mercaptobenzoquinone)-sister-. Carboxy-3-yl]-,l-(〇-acetamidoxime), ethyl ketone, 1-[9-ethyl-6-(2-mercapto-4·tetrahydrofuryl methoxybenzoquinone醯基)-9.Η.-α card. Sodium-3-yl]-, l-(〇-acetoxy group), ethyl ketone, i_[9_ethyl-6-{2-mercapto-4-(2,2-dimercapto-1, 3 · Dioxolyl) decyl phenyl hydrazino}-9.11.-° carbazino-3-yl]-, 1-(0-ethyl aryl), ι, 2 octyl ketone (Phenylthio)-, 2-(0-benzhydrylhydrazine)]. Examples of the acetophenone compound include an α-aminoketone compound and an α-hydroxyketone compound. The acetophenone compound may be used singly or in combination of two or more. Specific examples of the α-aminoketone compound include 2-benzyl-2-didecylamino-1-(4-morpholinylphenyl)-butane ketone (2-benzyl-2-dimethylamino- 1-(4-morpholinophenyl)-butane-1-one), 2-dimethylamino-2-(4-methylfyl)-1-(4-morpholin-4-yl-benzene 31 201239531 41717pif Ethyl butane-1-one and 2-methyl-1-(4-sulfonylphenyl)-2-morpholinylpropane are similar. (Specific examples of the X-hydroxyketone compound include 1-phenyl-2-hydroxy-2-methylpropane-l-one, 1- (4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)one, 1 - Hydroxycyclohexylphenyl group, etc. Among the acetophenone compounds, α-amino group g is the same compound, particularly preferably 2-monodecylamino-2-(4-indolyl)- 1-(4-?~lin-4-yl-phenyl)-butyrol-1-oxime, 2-mercapto-1-(4-sulfonylphenyl)-2-morphinylpropanone-1 - 嗣. Specific examples of the fluorenylphosphine oxide compound include: 2,4,6-trimethyl benzoyl-diphenyl-phosphine oxide, Bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, etc. The fluorenylphosphine oxide compound may be used singly or in combination of two or more. Among the fluorenylphosphine oxide compounds, preferably Bis(2,4,6-trimercaptobenzylidene)-phenylphosphine oxide. Specific examples of the biimidazole compound include 2,2,-bis(2-chlorophenyl)-4,4', 5,5,·tetrakis(4-ethoxycarbonylphenylbiimidazole (2,2-bis(2-) Chlorophenyl)-4,4',5,5'-tetrakis(4-ethoxycarbony 1 phenyl)-l,2'-biimidazole), 2,2,-bis(2-phenylphenyl)-4,4',5 , 5'-tetraphenyl-1,2'-linkage rice", 2,2'-bis(2,4-diphenyl)-4,4,5,5,-tetraphenyl- 1,2,-Lianwei saliva, 2,2'-bis(2,4,6-trichlorophenyl)_4,4,5,5,·tetraphenyl-1,2,·Lian Mijun, etc. The sulfonium compound may be used singly or in combination of two or more.

32 201239531 41/1/pif 該些聯咪唑化合物中,較佳為2,2'-雙(2-氣苯 基)_4,4|,5,5’-四苯基-1,2,-聯咪唑、2,2,-雙(2,4-二氣苯 基)-4,4,,5,5,-四苯基-1,2,-聯咪唑、2,2'-雙(2,4,6-三氣苯 基)-4,4’,5,5’-四苯基-1,2’-聯咪唑等。 另外,於使用聯咪唑化合物的情形時,可添加選自胺 基系增感劑及供氫化合物中的至少一種。 胺基系增感劑例如可列舉:N-曱基二乙醇胺(N_methyl diethanolamine )、4,4'-雙(二曱基胺基)二笨曱酮 (4,4’-bis(dimethylamino)benzophenone)、4,4'-雙(二乙基胺 基)二苯曱酮、對二曱基胺基苯曱酸乙酯、對二曱基胺基苯 曱酸異戊酯等。該些胺基系增感劑中,特佳為4,4,_雙(二乙 基胺基)二苯曱酮。 供氫化合物例如可列舉硫醇系化合物。硫醇系化合物 例如較佳為2-敏基苯并嗓β坐(2_mercapt〇benzothiazole )、 2-免il基本并。惡嗤(2-mercaptobenzooxazole)、2-疏基苯并口米 口坐(2-mercaptobenzoimidazole )。 成分[C]可單獨使用一種,亦可混合使用兩種以上。於 本發明中,較佳為含有〇-醯基肟化合物作為成分[q。 相對於成分[A]與成分[B]的合計量1〇〇質量份,成分 [f]的含量較佳為質量份〜30質量份,更佳為〇1質 量份二15質量份,進而更佳為1質量份〜10質量份。藉由 使f分[C]的含量在上述範圍内,即便於低曝光量的情形時 亦可顯示高的放射線感度,形成具有充分硬度的硬化膜。 另外,於選擇聯咪唑化合物作為成分[C]、且與選自胺 33 201239531 分1 / wpif 基系增感劑及供氫化合物中的至少一種併用的情形時,相 對於聯咪唑化合物100質量份,胺基系增感劑及供氫化人 物的各使用量較佳為0.1質量份〜5〇質量份,更佳為i ^ 量份〜20質量份。藉由設定為此種使用量,可提高所得的 硬化膜的表面硬度。 成分[D] 本發明中’可含有包含(Dl)具錢基的結構單元(以 下亦稱為「結構單元(D1)」)及(〇2)具有環氧基的結構 單元(以下亦稱為「結構單元(D2)」)的共聚物作為成分 [D]。藉由含有該成分[D],可提高感度,另外對顯影步驟 中使用的賴影液、制是無機驗顯影液的溶解性優異, 因此可提高顯影性,進而可提高所得的硬化膜的耐龜裂性。 結構單元(D1)較佳為來源於選自(dM)不飽和敢 酸及不飽和羧酸酐(以下將該些化合物亦稱為「化合物 (Dll)」)中的至少一種化合物的結構單元。 化合物(DM)例如可列舉:丙烯酸(acrylicadd)、 甲基丙烯酸、丁烯酸、2-丙烯醯氧基乙基琥珀酸(2_acryl〇xy ethyl succinic acid)、2-曱基丙烯醢氧基乙基琥珀酸、2_丙 烯醯氧基乙基六氫鄰苯二甲酸、2_甲基丙烯醯氧基乙基六 氳鄰苯二曱酸等單敌酸;順丁稀二酸(maleicadd)、反丁 烯二酸(fumaricacid)、甲基順丁烯二酸(cltrac〇nicadd) 等二羧酸,該二羧酸的酸酐等。該些化合物(jy—丨)中, 就共聚合反應性、所得的共聚物於驗顯影液中的溶解性的 方面而s,較佳為丙烯酸、甲基丙烯酸、2_丙烯醯氧基乙 34 201239531 41/1/pif 基琥珀酸、2-甲基丙烯醯氧基乙基琥珀酸、順丁烯二酸酐。 化合物(iy-i)可單獨使用一種或混合使用兩種以上。 土,於^有結構單元中,結構單元(Ε)1)的共聚合比例較 佳為1質量% (質量百分比)〜40質量%,更佳為2質量 =〜30 f量% ’進*更佳為3質量%〜25質量%。藉由設 定,此種共聚合比例,可獲得使感度、顯影性及保^穩定 性等^種特性以更高的轉最適化的感放射線性纟且成物。 八結構單元(D2)較佳為來源於具有環氧基的自由基聚 合性化^物(以下亦稱為「化合物(D2_2)」)的結構單元。 化α物(d2-2 )例如可列舉:丙烯酸縮水甘油酯 二yl a:?late)、丙晞酸_2_曱基縮水甘油_、,丙稀酸 3’4/衣氧丁酯(3,4_eP〇xybutyl acrylate)、丙烯酸 _6,7_ 環氧 庚,、丙烯酸-3,4-環氧環己酯、丙烯酸_3,4_環氧環己基曱 醋等丙稀酸環氧烷基酯;曱基丙烯酸縮水甘油酯、甲基丙 婦酸基縮水甘㈣、曱基丙烯酸_3,4·環氧丁 g旨、曱基 丙烯酸_6,7-環氧庚酯 '曱基丙稀酸奸環氧環己醋、甲基 丙烯酸-3:4-環氧環己基曱g旨等f基丙稀酸環氧燒基醋;α· 乙基丙烯,縮水甘油g旨、α_正丙基丙烯酸縮水甘油醋、 正丁基丙烯酸縮水甘油酯、α_乙基丙烯酸_6,7_環氧庚某等 a-烧基丙烯酸環氧絲§旨;鄰乙烯基¥基縮水甘二鍵 (o-vmylbenzyl giycidyl ethe〇、間乙烯基苄基縮水甘油 醚、對乙縣枝縮水甘油叫6烯鮮基縮水甘油鱗。 另外’亦可使用含氧雜環丁基的聚合性不飽和化合物 作為化合物(D2·2)。關於含氧轉了基㈣合性不飽和化 35 201239531 ' 1 /pif 2的具體例’例如可列舉:3_(曱基丙烯醯氧基 丁烧(3-(methacryl〇yl〇xy 一州卿咖)、土 = 烯醯氧基曱基)-3-乙基氧雜璟τ饺、3丨甲1 (曱基丙 基)_2-曱美氧雜心,丁烷(曱基丙烯醯氧基甲 ▲祕¥丁烧、3_(f絲雜氧基乙基 元_(曱基丙烯醯氧基乙基)·3_乙基氧 ;衣 ;雜環丁院、3-(丙稀酿氧基甲基)-3-乙基=,丁,基) =二甲,氧雜環丁烧、3_(=氧丁二: =丁烷、3-(丙烯醯氧基 二基乙基)氧 基士(丙烯醯氧基乙基)氧雜環丁烷 =丁烷、2-乙 烷 -2 ,雜二丁燒、2_甲“(甲基-以$基甲 。、(甲基丙烯酿氧基 基)氧雜環丁 丨(甲基丙締醯氧基^基)氧雜;^)氧_ 丁燒、4-甲基 ▼基氧雜環丁基))乙騎、、甲基丙婦酸雄(2_ ' 2·(…_氧\乙^=氧^雜環丁 (曱基丙烯醯氧基乙基)_4_ 土虱雜裱丁烷、 基_氧雜環丁貌、/基=雜環丁燒、2侦稀酿 貌、〜基-2·(丙稀酿氧基土;氧基尹基)氧雜環丁 刺氧釘基)氧雜環丁貌、f 丁跋、Μ基知 ^丁基))乙m、甲基丙烯酸土埽酸却你甲基氧雜 【曰、2-(丙_氧基乙基)_2•甲基((雜:基氧雜環丁基))乙 二^基H-f基氧雜環丁二:%丁腐、2伯婦酿氧 烯醆酯。 寻^有虱雜環丁基的(f基)丙 該些化合物(Ό2·2) f " 扰狁接性及耐熱龜裂性高, 36 201239531 41 /l/pif 基丙二酸』I::可j性的方面而言,可較佳地使用甲 曱基)冬乙基氧雜基丙稀酿氧基 丁烧等。”衣丁燒、2_(曱基丙烯醯氧基曱基)氧雜環 ==元可中單獨r:種姐合使用兩種以上。 佳為10質量%〜7二旦。(D )的共聚合比例較 、隹%争# „貝里更佳為15質量%〜70質量%, ‘、、、*量%〜65質量%。藉由設定為此種共聚合 比例,特別是共聚物的分子量的控觀容易,而且可^ 擦傷性、感度及顯影性進一步提高。 成为P亦可具有結構單元(D1)及結構單元(的以 外的結3構單元。提供此種結構單元(以下亦稱為「結構單 元(Ε>3)」)的化合物(以下亦稱為「化合物(D3-3)」)例 如可列舉·(ψ基)丙烯醯氧基丙基三烧氧基砍烧、(甲基) 丙烯酸院基^、(甲基)丙雜脂環式絲自旨、含氧原子的 不飽和雜五員環或六員環(曱基)丙烯酸酯、(曱基)丙烯酸芳 基酯、不飽和二羧酸二酯、順丁烯二醯亞胺化合物、(曱基) 丙烯酸的羥基烷基酯、(曱基)丙烯醯胺、芳香族乙烯基化 合物、1,3-丁二埽等。 (曱基)丙歸醯氧基丙基三烷氧基矽烷的具體例可列 舉· 3-曱基丙歸醯氧基丙基三曱氧基矽烷、3_丙烯醯氧基 丙基三曱氧基石夕烷、3-曱基丙烯醯氧基丙基三乙氧基矽 37 201239531 *tl / i /pif 烷、3-丙烯醯氧基丙基三乙氧基矽烷。 (甲基)丙烯酸院基酉旨的具體例可列舉:甲基丙婦酸甲 :t 土丙烯酉夂乙酉曰、甲基丙烯酸正丁酯、曱基丙烯酸第 甲基丙烯酸第二、丙烯酸甲酯、丙烯酸乙醋、 丙烯酸正丁_、丙烯酸第二丁醋、丙稀酸第三丁醋等。 (甲基)丙雜脂_錢基g旨的具體例可列舉:甲基丙 烯酸環戊自旨、曱基_酸環⑽ψ基丙烯酸_2甲基環己 醋、甲基丙_三環癸院基醋(以下亦將三 環[5/.1.〇2,6]癸烧-8-基稱$「二環戍基」)、τ基丙稀酸丨 二環戊氧基乙酯、甲基丙烯酸異冰片酯(is〇b〇rnyl methacrylate)、丙烯酸環戊酯、丙烯酸環己酯、丙稀酸_2_ 曱基環己酯、丙烯酸三環[5.2.1.02,6]癸烷_8_基酯、丙烯酸_2_ 二環戊氧基乙酯、丙烯酸異冰片酯等。 含氧原子的不飽和雜五員環或六員環曱基丙烯酸酯例 如可列舉:含有四氫呋喃(tetrahydrofUran)骨架的不飽和 化合物、含有呋喃骨架的不飽和化合物、含有四氫。比喃骨 架的不飽和化合物、含有°比喃骨架的不飽和化合物等。含 有四氫呋喃骨架的不飽和化合物的具體例可列舉:(曱基) 丙烯酸四氫糠酯(tetrahydrofurfuryl (meth)acrylate)、2-曱 基丙烯醯氧基-丙酸四氫糠酯、3-(甲基)丙烯醯氧基四氫呋 B南-2-酮等。含有吱。南骨架的不飽和化合物的具體例可列 舉:2-曱基-5-(3-呋喃基)-1-戊烯-3-酮 (2-methyl-5-(3-furyl)-l-pentene-3-one )、(曱基)丙稀酸糠 酯、1-呋喃-2-丁基-3-烯-2-酮、1-呋喃-2-丁基-3-曱氧基-3- 38 201239531 /1 /pif 烯-2-酮、6-(2-呋喃基)-2-曱基-1-己烯-3-酮、6-呋喃-2-基-己-1-細-3-S同、丙稀酸-2-σ夫喃-2-基-1-曱基-乙醋、6-(2-α夫喃 基)-6-曱基-1-庚烯-3-酮等。含有四氫吡喃骨架的不飽和化 合物的具體例可列舉:曱基丙烯酸(四氫吡喃-2-基)曱酯、 2,6-二曱基-8-(四鼠°比喃-2-基氧基)-辛-1-稀-3-酉同 (2,6-dimethyl-8-(tetrahydropyran-2-yloxy)-oct-l-ene-3-one )、2-甲基丙細酸四鼠°比α南-2- S旨、1 _(四鼠α比B南-2-氧基)-丁 基-3 -烯-2 -酮等。含有吡喃骨架的不飽和化合物的具體例可 列舉.4-(1,4-.一氧雜-5-氧代-6-庚稀基)-6-曱基-2- °比喃 (4-(l,4-dioxa-5-oxo-6-heptenyl)-6-methyl-2-pyran)'4-(1,5-二氧雜-6_氧代-7-辛烯基)-6-曱基-2-吼喃等。 (曱基)丙烯酸的羥基烷基酯的具键例可列舉:(甲基) 丙稀酸-2-經基乙自旨(2-hydroxyethyl (meth)acrylate )、(曱基) 丙烯酸-2-羥基丙酯、(曱基)丙烯酸羥基丙酯、(曱基)丙 烯酸-2,3-二羥基丙酯等。 (曱基)丙烯酸芳基酯的具體例可列舉:(曱基)丙烯酸苯 酯、(曱基)丙烯酸苄酯等。 不飽和二羧酸二酯的具體例可列舉:順丁烯二酸二乙 酯、反丁烯二酸二乙酯、衣康酸二乙酯(diethylitac〇nate) 等。 順丁埽一驢亞胺化合物的具體例可列舉:N_苯基順丁 烯一醯亞胺(N-phenyl maleimide)、N-環己基順丁烯二醯 亞胺:N·苄基順丁烯二醯亞胺、N_(4_羥基苯基)順丁烯二 醯亞胺、N-(4-羥基苄基)順丁烯二醯亞胺、N_丁二醯亞胺 39 201239531 H-l / 1 /pif 基-3-順丁 烯二醯亞胺苯曱酸酯 (N-succinimidyl-3-maleimide benzoate)、N-丁二酿亞胺基 -4-順丁烯二醯亞胺丁酸酯、N-丁二醯亞胺基-6_順丁烯二醯 亞胺己酸酯、N-丁二醯亞胺基-3-順丁烯二醯亞胺丙酸酯、 N_(9-吖啶基)順丁烯二醯亞胺等。 (曱基)丙烯醯胺的具體例可列舉:丙烯醯胺、甲基丙 烯醯胺、4-羥基苯基丙烯醯胺、4_羥基苯基甲基丙烯醯胺、 3-經基笨基丙烯醯胺、3_羥基苯基曱基丙烯醯胺等。 芳香族乙烯基化合物可列舉:苯乙烯、α_甲基苯乙烯 等。 一該些化合物(D3」)中,較佳為(曱基)丙烯醯氧基丙 基三烷氧基矽烷、芳香族乙烯基化合物、順丁烯二醯亞胺 化s物(甲基)丙婦酸脂環式烧基醋、(甲基)丙婦醯胺,特 佳為(甲基)丙烯醯氧基丙基三烷氧基矽烷。 化口物(D -3)可單獨使用一種或混合使用兩種以上。 於成分[D]的所有結構單元中,結構單元(D3)的共聚 佳為1〇 f量%〜7G f量%,更佳為15質量%〜 魏祕⑽基喊三烧氧基 3的、、·。構早兀作為結構單元(d3)的情形時 質量%。夢由^ / 50㈣%,更佳為20質量%〜4〇 種共聚合比例,特別是共聚物的分 -步提^ 另柯賴影性、紐、密接性等進 及化合物 成分_如可藉由將化合物(dLi 201239531 ^ι/ι /pir (D2-2)、視需要將化合物(D3_3)於溶劑中於自由基聚合 起始劑的存在下進行聚合而製造。 一聚合反應中所用的溶劑例如可列舉:醇類、二醇醚、 乙二醇烷基醚乙酸酯、二乙二醇單烷基醚、丙二醇單烷基 喊、丙二醇單燒細乙㈣、丙二醇單錄ϋ丙酸醋、芳 香知經類、鴨、i文所述m卜的嶋、上文所述以外的 酯類等。 ^自由基聚合起始劑可根據所使用的化合物的種類而適 當選擇,例如可列舉:2,2,_偶氮雙異丁腈 (2,2’-azobisisobmyronitrile)、2,2,-偶氮雙-(2,4-二曱基戊腈) (2,2-azobis-(2,4-dimethyl valeronitrile))、2,2'-偶氮雙-(4_ 曱氧基-2,4-二甲基戊腈)、4,4,_偶氮雙(4_氰基戊酸)、二甲 基偶氮雙(2_曱基丙酸酯)、2,2ι_偶氮雙(4_曱氧基_2,4_ ,甲基戊腈)等偶氮化合物等。該些自由基聚合起始劑中, f佳為2,2’_偶氮雙異丁腈、2,2,-偶氮雙(2,4-二曱基戊腈) 等。自由基聚合起始劑可單獨使用一種或混合使用兩種以 上。相對於單體的合計量1〇〇質量份,自由基聚合起始劑 的使用量通常為0.1質量份〜5〇質量份,較佳為αι質量 "ί刀〜20質量份。 另外’於聚合反應中,可使用分子量調整劑以調整分 子里刀子里调整劑的具體例可列舉:氯仿(chloroform )、 四/臭化石反荨鹵化煙類·’正己硫醇(n-hexylmercaptan)、正 辛硫醇、正十二硫醇、第三·十二硫醇、硫代乙醇酸等硫醇 類,石’il化一甲基黃原酸酉旨(dimethyl xanthogen sulfide)、 41 201239531 外1/1 /pif 二硫化二異丙基黃原酸酯等黃原酸類;異松油稀 (teipinolene)、α·曱基苯乙烯二聚物等。相對於單體的合 計量100質量份,分子量控制劑的使用量通常為〇丨質^ 份〜50質量份,較佳為〇 2質量份〜16質量份,= 0.4質量份〜8質量份。 ' 馬 另外,聚合溫度通常為〇°C〜15(rc,較佳為5〇它〜 120°C ’聚合時間通常為10分鐘〜20小時,較佳為3〇分 鐘〜6小時。 成分[D]的由移動相使用四氫呋喃的GPC所得的聚苯 乙烯換算的重量平均分子量(以下稱為rMw,」)較^為 2xl03〜IxlO5,更佳為5xl〇3〜5xl〇4。藉由使成分明的 Mw’為2xl03以上,可獲得感放射線性組成物的充分的顯 影谷限(margin) ’並且防止所形成的塗膜的殘膜率(圖案 狀薄膜適當殘存的比率)下降,進而保持所得的絕緣膜的 圖案形狀或耐熱性等為良好。另一方面,藉由使成分[D] 的Mw’為lxl〇5以下,可保持高度的放射線感度,獲得良 好的圖案形狀。另外,成分[D]的分子量分布(以下稱為 「Mw'/Mn’」)較佳為5.0以下,更佳為3.0以下。藉由使 成分[D]的Mw’/Mn,為5.0以下,可保持所得的絕緣膜的圖 案形狀良好。另外,含有具有如上所述的較佳範圍的 及Mw’/Mn'的成分[D]的感放射線性組成物具有高度的顯 影性,因此可於顯影步驟中容易地形成預定圖案形狀而不 產生顯影殘餘。 成分[D]可單獨使用一種或混合使用兩種以上。 42 201239531 41 /1/pif 相對於成分[A]100質量份’成分[D]的含量較佳為1 質量份〜45質量份,更佳為2質量份〜40質量份,進而更 佳為3質量份〜35質量份,進一步更佳為3質量份〜3〇 質量份,進而佳為3質量份〜25質量份。藉由使成分[D] 的含量在上述範圍内,可進一步提高感度及顯影性。 成分[E] 另外,本發明中,可含有選自有機粒子及無機粒子中 的至少一種作為成分[E]。藉由含有成分[E],可提高耐擦 傷性、财龜裂性等。 有機粒子可以合適地使用丙稀酸系微粒子等固體狀的 粒子。丙烯酸系微粒子例如可列舉甲基丙烯釀甲酯聚合 物、甲基丙烯酸與烷基化合物的共聚物等。有機粒子的市 售品例如可列舉:Zefiac F_32〇、Zefiac F 3〇1、 F-340、Zefia⑻25、Zefiac F_351 (以上為 g化成公司 製造)’丙烯酸系微粒子河!>_3〇〇(综研化學公司製造)等。 /外,無機微粒子可列舉以二^⑽(_二 二储、氧化鈦、氧化鋅、氧化錤、碳酸 -〇ntm〇rill〇nite) 成分的粒子。 紐如—氧切及氧她作為主 板狀、纖維狀、 機微粒子可為實心狀、 無機微粒子的形狀可 不定形狀的任一種,另外,該些益、 中空狀、多孔質狀。 一…' 二氧化石夕粒子可列 關於此種無機錄子的具體例 43 201239531 4Γ/1 /pif32 201239531 41/1/pif Among these biimidazole compounds, 2,2'-bis(2-phenylphenyl)-4,4|,5,5'-tetraphenyl-1,2,-linked is preferred. Imidazole, 2,2,-bis(2,4-diphenyl)-4,4,5,5,-tetraphenyl-1,2,-biimidazole, 2,2'-bis (2, 4,6-trisylphenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole. Further, in the case of using a biimidazole compound, at least one selected from the group consisting of an amine sensitizer and a hydrogen donor compound may be added. Examples of the amine-based sensitizer include N-methyl diethanolamine and 4,4'-bis(dimethylamino)benzophenone. 4,4'-bis(diethylamino)benzophenone, p-didecylaminobenzoic acid ethyl ester, p-didecylaminobenzoic acid isoamyl ester, and the like. Among these amine-based sensitizers, particularly preferred is 4,4,-bis(diethylamino)benzophenone. Examples of the hydrogen donor compound include a thiol compound. The thiol compound is preferably, for example, 2-mercaptopurine benzothiazole or 2-im il. 2-mercaptobenzooxazole, 2-mercaptobenzoimidazole. The component [C] may be used alone or in combination of two or more. In the present invention, it is preferred to contain a ruthenium-indenyl ruthenium compound as a component [q. The content of the component [f] is preferably from 10,000 parts by mass to 30 parts by mass, more preferably from 1 part by mass to 15 parts by mass, and furthermore, based on 1 part by mass of the total of the component [A] and the component [B]. Preferably, it is 1 part by mass to 10 parts by mass. By setting the content of the f component [C] within the above range, a high radiation sensitivity can be exhibited even in the case of a low exposure amount, and a cured film having sufficient hardness can be formed. Further, when the biimidazole compound is selected as the component [C] and is used in combination with at least one selected from the group consisting of the amine 33 201239531 minute 1 / wpif base sensitizer and the hydrogen donor compound, 100 parts by mass relative to the biimidazole compound. The amount of each of the amine-based sensitizer and the hydrogenated person is preferably from 0.1 part by mass to 5 parts by mass, more preferably from 1 part by mass to 20 parts by mass. By setting the amount to be used, the surface hardness of the obtained cured film can be improved. Component [D] In the present invention, 'a structural unit containing (D1) a hydroxy group (hereinafter also referred to as "structural unit (D1)") and (〇2) a structural unit having an epoxy group (hereinafter also referred to as The copolymer of "structural unit (D2)" is used as the component [D]. By containing the component [D], the sensitivity can be improved, and the solubility of the lyophobic liquid used in the development step and the inorganic developer can be improved. Therefore, the developability can be improved and the obtained cured film can be improved. Cracking. The structural unit (D1) is preferably a structural unit derived from at least one compound selected from the group consisting of (dM) unsaturated dicarboxylic acid and unsaturated carboxylic anhydride (hereinafter, these compounds are also referred to as "compound (D11)"). Examples of the compound (DM) include acrylicadd, methacrylic acid, crotonic acid, 2-propenyloxyethyl succinic acid, 2-mercaptopropenyloxyethyl Succinic acid, 2-propenyloxyethylhexahydrophthalic acid, 2-methylpropenyloxyethylhexaphthalic acid, and the like; a straight acid (maleicadd), anti a dicarboxylic acid such as fumaric acid or clstrac〇nicadd, an acid anhydride of the dicarboxylic acid or the like. Among these compounds (jy-oxime), the copolymerization reactivity and the solubility of the obtained copolymer in the developer are preferably s, preferably acrylic acid, methacrylic acid, 2-propylene propylene oxide 34. 201239531 41/1/pif-based succinic acid, 2-methylpropenyloxyethyl succinic acid, maleic anhydride. The compound (iy-i) may be used alone or in combination of two or more. In the soil, in the structural unit, the copolymerization ratio of the structural unit (Ε) 1) is preferably 1% by mass (% by mass) to 40% by mass, more preferably 2% by mass = 〜30% by volume. Good is 3% by mass to 25% by mass. By setting such a copolymerization ratio, it is possible to obtain a radiation-sensing linearity which is optimized for a higher degree of rotation, such as sensitivity, developability, and stability. The octagonal structural unit (D2) is preferably a structural unit derived from a radical polymerizable compound having an epoxy group (hereinafter also referred to as "compound (D2_2)"). Examples of the α-form (d2-2) include glycidyl acrylate diyl a: ?late, propionate 2 - fluorenyl glycidyl _, and propylene 3' 4 / oxybutyl acrylate (3) , 4_eP〇xybutyl acrylate), acrylic acid _6,7_ epoxy gypsum, acrylic acid-3,4-epoxycyclohexyl ester, acrylic acid _3,4_epoxy cyclohexyl hydrazine vinegar, etc. ; glycidyl methacrylate, methyl acetophenate glycidyl (tetra), methacrylic acid _3,4·epoxybutyl ketone, methacrylic acid _6,7-epoxyheptyl ester thioglycolic acid Epoxycyclohexyl vinegar, methacrylic acid-3:4-epoxycyclohexyl 曱g, etc. f-based acrylic acid epoxy ketone; α·ethyl propylene, glycidol g, α-n-propyl Acrylic glycidol acrylate, glycidyl butyl acrylate, α_ethyl acrylate _6,7_epoxyglycol, etc. a-alkyl acrylate epoxy §; o-vinyl ke succinyl bond (o-vmylbenzyl) Giycidyl ethe〇, m-vinylbenzyl glycidyl ether, and glycidol of the branch of the county are called 6-ene fresh glycidol scales. In addition, a polymerizable unsaturated compound containing an oxetanyl group can also be used as a compound (D2· 2) Regarding oxygen-containing transradical (tetra)-unsaturated 35 201239531 'Specific examples of 1 /pif 2', for example, 3_(mercaptopropene oxime oxybutane (3-(methacryl〇yl〇xy) ), soil = olefinic fluorenyl)-3-ethyloxazepine dumplings, 3 丨1 (mercaptopropyl) 2 - oxime oxime, butane (mercapto propylene oxime) ▲秘¥丁烧,3_(f-silyloxyethyl _(mercapto propylene methoxyethyl)·3_ethyl oxygen; clothing; heterocyclic diners, 3-(acrylic acid Base)-3-ethyl=,butyl,yl)=dimethyl, oxetane, 3_(=oxybutane: =butane, 3-(propyleneoxydiylethyl)oxyne ( Propylene oxiranyloxy) oxetane = butane, 2-ethane-2, heterodibutyl, 2-methyl" (methyl- to benzyl group, (methacrylic acid) Oxetane (methylpropyl decyloxy) oxa; ^) oxygen _ butyl, 4-methylheptyl oxetanyl)), riding, methyl acetoin male (2_ ' 2 · (..._ Oxygen / Ethyl) = Oxygen / Heterocyclic Butyryl (decyl propylene oxyethyl) _4_ 虱 虱 裱 Butane, _ oxirane, / base = heterocyclic Burning, 2 detective appearance, ~ base-2 · (acrylic Base soil; oxy-indoyl) oxetane oxo), oxetane, f-butyl, fluorenyl, butyl)), m, methacrylic acid, but methyl oxalate [曰, 2-(propionyloxyethyl)_2•methyl ((hetero: oxetanyl)) ethanediyl Hfyl oxetane 2: % butyl rot, 2 burr Isodecyl esters. (f-based) propyl-containing heterocyclic butyl groups (Ό2·2) f " high turbidity and heat crack resistance, 36 201239531 41 /l/pif propyl In the aspect of the acid "I:", it is preferable to use a methylidene group, a winter ethyl oxa propylene propylene oxybutylene or the like. "Kedding, 2_(decyl propylene oxime oxime) oxyheterocycle == yuan can be used alone or in combination with two or more types. Good for 10% by mass to 7 for two deniers. (D) The polymerization ratio is higher than that of 隹% ## „Berry is preferably 15% by mass to 70% by mass, ',, and *%% to 65% by mass. By setting such a copolymerization ratio, the molecular weight of the copolymer is particularly easy to control, and the scratch resistance, sensitivity, and developability are further improved. P may also have a structural unit (D1) and a structural unit other than the structural unit (a structural unit (hereinafter also referred to as "structural unit (Ε> 3)")) (hereinafter also referred to as " Examples of the compound (D3-3)") include (indenyl) propylene methoxy propyl trisodium oxyalkyl chopping, (meth) acrylic acid base, and (methyl) propyl fused ring. , an oxygen-containing unsaturated heteropentacyclic or six-membered ring (fluorenyl) acrylate, (mercapto) aryl acrylate, an unsaturated dicarboxylic acid diester, a maleimide compound, (曱a hydroxyalkyl acrylate, a (mercapto) acrylamide, an aromatic vinyl compound, a 1,3-butane fluorene, etc. The specificity of (mercapto) propyl methoxy propyl trialkoxy decane Examples include 3-mercaptopropenyloxypropyltrimethoxy decane, 3-propenyloxypropyltrimethoxy oxetane, 3-mercaptopropenyloxypropyltriethoxy矽37 201239531 *tl / i /pif alkane, 3-propenyloxypropyltriethoxydecane. Specific examples of the (meth)acrylic acid base are as follows: methyl propyl methacrylate A: t propylene acetonitrile, n-butyl methacrylate, methacrylic acid methacrylic acid second, methyl acrylate, ethyl acrylate, butyl acrylate, acrylic acid second vinegar, acrylic acid Tributyl vinegar, etc. Specific examples of (meth) propyl ketone _ keji g can be exemplified by methacrylic acid cyclopentane, fluorenyl-acid ring (10) decyl acrylate 2 methylcyclohexanoic vinegar, methyl propyl _Sanhuan 癸 基 基 vinegar (hereinafter also referred to as the three rings [5/.1. 〇 2,6] 癸-8-based nickname ""bicyclic fluorenyl"), τ-based acrylonitrile dicyclopentyloxy Ethyl ethyl ester, isoprene methacrylate, cyclopentyl acrylate, cyclohexyl acrylate, benzoic acid cyclohexyl acrylate, tricyclohexyl acrylate [5.2.1.02,6] Decane_8_yl ester, 2-dicyclopentyloxyethyl acrylate, isobornyl acrylate, etc. The unsaturated heteroquinone ring or the six-membered cyclodecyl acrylate containing an oxygen atom may, for example, be tetrahydrofuran. a tetrahydrofUran) unsaturated compound of a skeleton, an unsaturated compound containing a furan skeleton, an unsaturated compound containing a tetrahydrogen, a specific skeleton, and a ratio of The unsaturated compound of the shelf, etc. Specific examples of the unsaturated compound containing a tetrahydrofuran skeleton may be exemplified by (tetrahydrofurfuryl (meth)acrylate), 2-mercaptopropenyloxy-propionic acid tetrahydrogenate. An oxime ester, 3-(meth) propylene oxime tetrahydrofuran B-an-2-one, etc. Specific examples of the unsaturated compound containing ruthenium and a south skeleton include 2-mercapto-5-(3-furan 1-methyl-5-(3-furyl)-l-pentene-3-one, (decyl) decyl acrylate, 1-furan-2-butyrate 3--3-en-2-one, 1-furan-2-butyl-3-decyloxy-3- 38 201239531 /1 /pif ene-2-one, 6-(2-furyl)-2- Mercapto-1-hexen-3-one, 6-furan-2-yl-hex-1- fine-3-S, acrylic acid-2-succin-2-yl-1-yl- Ethyl vinegar, 6-(2-α-furanyl)-6-mercapto-1-hepten-3-one, and the like. Specific examples of the unsaturated compound containing a tetrahydropyran skeleton include methacrylic acid (tetrahydropyran-2-yl) decyl phthalate and 2,6-dimercapto-8- (four mouse pyran-2) -1,6-dimethyl-8-(tetrahydropyran-2-yloxy)-oct-l-ene-3-one ), 2-methylpropene The acid four mouse ratio is α-N-S, 1 _(four-mouse α-B-nan-2-oxy)-butyl-3-en-2-one, and the like. Specific examples of the unsaturated compound containing a pyran skeleton include 4-(1,4-.monooxa-5-oxo-6-heptyl)-6-fluorenyl-2-pyranyl (4). -(l,4-dioxa-5-oxo-6-heptenyl)-6-methyl-2-pyran)'4-(1,5-dioxa-6-oxo-7-octenyl)-6 - mercapto-2-pyrene and the like. Examples of the hydroxyalkyl ester of (mercapto)acrylic acid may be exemplified by (meth)acrylic acid-2-hydroxyethyl (meth)acrylate, (fluorenyl)acrylic acid-2- Hydroxypropyl ester, hydroxypropyl (meth) acrylate, 2,3-dihydroxypropyl (meth) acrylate, and the like. Specific examples of the (fluorenyl) aryl acrylate include phenyl (meth) acrylate and benzyl (meth) acrylate. Specific examples of the unsaturated dicarboxylic acid diester include diethyl maleate, diethyl fumarate, diethyl itaconate, and the like. Specific examples of the cis-indole-imine compound include N-phenyl maleimide and N-cyclohexylmethyleneimine: N-benzyl cis-butane Equinone imine, N_(4-hydroxyphenyl) maleimide, N-(4-hydroxybenzyl) maleimide, N-butaneimine 39 201239531 Hl / N/succinimidyl-3-maleimide benzoate, N-butyl iminoimine-4-methyleneimine butyrate , N-butyl quinone imino-6-m-butyleneimine hexanoate, N-butyl quinone imido-3-butylene imidate propionate, N_(9-吖Pyridyl) maleimide and the like. Specific examples of the (mercapto) acrylamide include acrylamide, methacrylamide, 4-hydroxyphenylpropenylamine, 4-hydroxyphenylmethacrylamide, 3-pyridyl propylene. Indoleamine, 3-hydroxyphenylmercaptopropenylamine, and the like. Examples of the aromatic vinyl compound include styrene and α-methylstyrene. Among these compounds (D3"), preferred are (fluorenyl) propylene methoxy propyl trialkoxy decane, aromatic vinyl compound, maleimide imidized s (meth) propyl Glycolic acid styrene vinegar, (meth) propyl sulfonamide, particularly preferably (meth) propylene methoxy propyl trialkyloxy decane. The chemical substances (D-3) may be used alone or in combination of two or more. In all the structural units of the component [D], the copolymerization of the structural unit (D3) is preferably from 1% by volume to 7% by weight, more preferably from 15% by mass to the amount of the acetoxy group. ,·. The mass % of the case of the structure as the structural unit (d3). Dream by ^ / 50 (four)%, more preferably 20% by mass ~ 4 kinds of copolymerization ratio, especially the copolymer's step-by-step extraction ^ additional ray, color, adhesion, etc. and compound ingredients _ such as It is produced by polymerizing a compound (dLi 201239531 ^ι/ι / pir (D2-2), if necessary, the compound (D3_3) in a solvent in the presence of a radical polymerization initiator. A solvent used in the polymerization reaction For example, an alcohol, a glycol ether, an ethylene glycol alkyl ether acetate, a diethylene glycol monoalkyl ether, a propylene glycol monoalkyl shout, a propylene glycol single-burning fine B (tetra), a propylene glycol single-recorded propionic acid vinegar芳香 芳香 知 、 鸭 鸭 鸭 鸭 鸭 鸭 鸭 嶋 嶋 嶋 嶋 嶋 嶋 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ , 2, azobisisobutyronitrile (2,2'-azobisisobmyronitrile), 2,2,-azobis-(2,4-dioxyl valeronitrile) (2,2-azobis-(2,4 -dimethyl valeronitrile)), 2,2'-azobis-(4_decyloxy-2,4-dimethylvaleronitrile), 4,4,-azobis(4-cyanovaleric acid), Methylazobis(2-mercaptopropionate) An azo compound such as 2,2ι_azobis(4_decyloxy-2,4_, methylvaleronitrile), etc. Among these radical polymerization initiators, f is preferably 2,2'-azo Double isobutyronitrile, 2,2,-azobis(2,4-dioxyl valeronitrile), etc. The radical polymerization initiator may be used singly or in combination of two or more. The amount of the radical polymerization initiator to be used is usually 0.1 part by mass to 5 parts by mass, preferably α1 by mass, to 20 parts by mass. In addition, 'in the polymerization reaction, molecular weight can be used. Specific examples of the adjusting agent to adjust the adjusting agent in the knives in the molecule include chloroform, tetra/small fossil ruthenium-halogenated nicotine, n-hexylmercaptan, n-octylmercaptan, and n-dodecane Mercaptans such as alcohol, tridecyl mercaptan, thioglycolic acid, dimethyl xanthogen sulfide, 41 201239531 1/1 /pif diisopropyl disulfide Xanthogen such as xanthate; teipinolene, α·mercaptostyrene dimer, etc., 100 parts by mass relative to the total amount of monomers The amount of the amount controlling agent to be used is usually from 50 parts by mass to 5% by mass, preferably from 2 parts by mass to 16 parts by mass, and from 0.4 parts by mass to 8 parts by mass. 'In addition, the polymerization temperature is usually 〇°C. ~15 (rc, preferably 5 〇 it ~ 120 ° C 'The polymerization time is usually 10 minutes to 20 hours, preferably 3 minutes to 6 hours. The polystyrene-equivalent weight average molecular weight (hereinafter referred to as rMw,") of the component [D] obtained by using GPC of the mobile phase using tetrahydrofuran is 2x10?IxlO5, more preferably 5xl?3~5xl?4. By setting the Mw' of the component to 2x10 or more, a sufficient development margin of the radiation sensitive composition can be obtained and the residual film ratio of the formed coating film (the ratio of the pattern film remaining properly) is prevented from decreasing. Further, the pattern shape, heat resistance, and the like of the obtained insulating film are kept good. On the other hand, by setting the Mw' of the component [D] to 1x10 以下 5 or less, it is possible to maintain a high degree of radiation sensitivity and obtain a good pattern shape. Further, the molecular weight distribution of the component [D] (hereinafter referred to as "Mw'/Mn'") is preferably 5.0 or less, more preferably 3.0 or less. By setting Mw'/Mn of the component [D] to 5.0 or less, the pattern of the obtained insulating film can be kept good. Further, the radiation-sensitive composition containing the component [D] having the preferred range and Mw'/Mn' as described above has high developability, so that a predetermined pattern shape can be easily formed in the developing step without generation. Development residue. The component [D] may be used alone or in combination of two or more. 42 201239531 41 /1/pif The content of the component [D] per 100 parts by mass of the component [A] is preferably 1 part by mass to 45 parts by mass, more preferably 2 parts by mass to 40 parts by mass, and still more preferably 3 The mass part is preferably 35 parts by mass, more preferably 3 parts by mass to 3 parts by mass, and further preferably 3 parts by mass to 25 parts by mass. By setting the content of the component [D] within the above range, the sensitivity and developability can be further improved. In the present invention, at least one selected from the group consisting of organic particles and inorganic particles may be contained as the component [E]. By containing the component [E], scratch resistance, cracking property, and the like can be improved. As the organic particles, solid particles such as acrylic fine particles can be suitably used. Examples of the acrylic fine particles include a methyl methacrylate methyl ester polymer, a copolymer of methacrylic acid and an alkyl compound, and the like. For example, Zefiac F_32〇, Zefiac F 3〇1, F-340, Zefia (8) 25, and Zefiac F_351 (the above is manufactured by G Chemicals Co., Ltd.) 'Acrylic Micronized Rivers>>>_3〇〇 Chemical company manufacturing) and so on. Further, examples of the inorganic fine particles include particles of a composition of two (10) (dioxide, titanium oxide, zinc oxide, cerium oxide, or carbonic acid - 〇ntm〇rill〇nite). New, Oxygen, and Oxygen, as the main plate, fibrous, and fine particles, may be solid, and the shape of the inorganic fine particles may be any shape, and these may be beneficial, hollow, or porous. A...' The dioxide dioxide particles can be listed. Specific examples of such inorganic recordings 43 201239531 4Γ/1 /pif

舉:Admafine SO-E1、Admafine SO-E2、Admafine SO-E3、 Admafine SO-E4、Admafine SO-E5、Admafine SE3200-SEJ (Admatechs 公司製造),SS01、SS03、SS15、SS35 (大 阪化成公司製造),曱醇石夕溶膠(methanol silica sol)、 IPA-ST、MEK-ST、NBA-ST、XBA-ST、DMAC-ST、ST-UP、 ST-OUP、ST-20、ST-40、ST-C、ST-N、ST-0、ST-50、ST-OL (曰產化學工業公司製造)等。另外,氧化锆粒子可列舉: HXU-110JC、HXU-210C、NZD-3101 ( Sumitomo Osaka Cement公司製造),ID191 ( Tayca公司製造), ZRPMA15WT%-E05 (C.I.Kasei 公司製造)等;進而,氧 化鈦粒子可列舉:MT-05、MT-100W、MT-100SA、 MT-100HD、MT-300HD、MT-150A、ND138、ND139、 ND140、ND154、ND165、ND177、TS-063、TS-103、TS-159 (Tayca公司製造)等。 無機微粒子亦可藉由矽烷偶合劑等進行表面處理。藉 由進行此種表面處理’可提高與其他成分的相溶性,可提 高組成物中的分散性或機械強度。 有機粒子及無機粒子的平均粒徑較佳為〇〇〇5 μιη〜 0.5 μιη的範圍。 關於成为[Ε] ’可將粉體狀的粒子直接添加、混合至其 他成分中’亦可製成溶劑分散液並添加、混合至其他成分 中後將溶劑蒸餾去除。 成分[Ε]可單獨使用一種或混合使用兩種以上。 相對於成分[A]l〇〇質量份,成分[Ε]的含量較佳為i 201239531 41717pif 貝ir份〜600質量份 只主,又住马川質量份〜買f你,進 而更佳為50質量份〜1〇〇質量份。藉由使成分[E]的含量 在上述範圍内’可進一步提高所得的保護膜及層間絕緣膜 的耐擦傷性及耐熱龜裂性。 成分fFj 本發明尹,可含有溶劍作為成分[巧。感放射線性組成 物通常是調配溶劑而以液狀組成物的形式製備。溶劑只 =散或溶解構成感放射線性組成物的各成分,且不與該此 、刀反應’具有適度的揮發性,則可適當選擇而使用。 =此種溶劑’較佳為含有作為f子性溶劑的醇 =。猎由使用醇系溶劑’可提高感放射線性組成物_ 二板=塗佈性’進而抑制塗佈不均 ^ 均、務度不均等)的產生,可進—_ 二I痕不 醇系溶劑例如可列舉: 均勻性。 丨-己醇d-hexanol)、卜辛醇、丨_壬醇、i 己二醇、认辛二醇等長鏈絲醇; 苄醇等芳香族醇; 乙二醇單甲醚、乙二醇單乙醚、 醇單丁轉等乙二醇單絲喊; —·子早_、乙二 丙二醇單甲ϋ、丙二醇單乙峻 醇單丁轉丙二醇單燒細; 4早㈣、丙二 喊;二乙二醇單甲喊、二乙二醇單乙驗等二乙二醇單燒基 二丙二醇單甲轉、二丙二醇單乙醚、二兩二醇單㈣、 45 201239531 m n /pif 二丙二醇單丁崎二丙二醇單絲喊等。 該些醇系溶劑可單獨使用或併用兩種以上。 ^溶射,制就塗佈性提高的觀點而言,較 醇單絲ϋ,特佳為丙二醇單甲醚、丙二醇單乙 成分[F]可單獨使用-種,亦可混合使用兩種以上。 相對於成分[A]l〇〇質量份,成分[F]的含量較佳 篁份〜1,2GG質量份,更佳為1G f量份〜9⑻質量份。藉 由使成分[F]的含量在上舰_,可提高於_基板等^ 的塗佈性,進而抑制塗佈不均(條狀不均、針痕不均、霧 度不均等)的產生,可進一步提高臈厚均勻性。 ♦本發明中,可與醇系溶劑一起而含有其他溶劑,例如 醚類、二乙二醇烷基醚類、乙二醇烷基醚乙酸酯類、丙二 醇單烷基醚丙酸酯類、芳香族烴類、酮類、酯類等。 添加劑 本發明的感放射線性組成物視需要可含有各種添加 劑。 添加劑例如可列舉:三笨基錡鹽(triphenylsulf〇nium salt)、四氫噻吩鏽鹽(tetrahydrothiophenium salt)等感放 射線性酸產生劑;胺基曱酸-2-硝基节基環己酉旨 (2-nitrobenzylcyclohexyl carbamate)、〇_胺曱醯基經基酿 胺(O-carbamoyl hydroxy amide)等感放射線性鹼產生劑; 非離子系界面活性劑、I系界面活性劑及石夕酮系界面活性 劑等界面活性劑;2,2-硫代雙(4-曱基三級丁基苯紛) 46 201239531 /1/pif (2,2-thiobis(4-methyl-6-t-butyl phenol))、2,6-二-三級丁基 苯酚等抗氧化劑;2-(3-三級丁基_5_曱基_2_羥基苯基)_5•氯 苯并三唑(2-(3-t-butyl-5-methyl-2-hydroxy phenyl)-5-chloro benzotriazole)、烷氧基二苯甲酮類等紫外線吸收.劑。 該些添加劑的含量可於不損及本發明的目的之範圍内 適當選擇。 本發明的感放射線性組成物可藉由適當的方法來製 備,例如藉由在[F]溶劑中將成分[A]、成分[B]及成分[c] 以及視需要將成分[D]、成分[E]或添加劑等以預定的比例 混合,可製備溶液或分散液狀態的感放射線性組成物。 硬化膜及其形成方法 、’Μ而,對使用本發明的感放射線性組成物於基板上形 成硬化膜的方法加以說明。該方法包含以下的步驟⑴〜 步驟(4 )。 (1) 將本發明的感放射線性組成物塗佈於基板上而形 成塗膜的步驟; (2) 對步驟(1)中形成的塗膜的至少—部分 射線的步驟; ⑴利用驗顯影液對步驟⑵中經放射線 膜進行顯影的步驟;以及 土 土峨對步驟(3)中經顯影的塗膜進行加熱的步驟。 ㈣2驟⑴巾,於基板上塗佈本發明的感放射線性組 成物的如絲分散液後,較佳為藉由對塗佈面進行加熱(預 47 201239531 外1 / wpif 烘烤)而將溶劑去除,形成塗膜。可使用的基板的材質例 如可列舉玻璃、石英、矽、樹脂等。樹脂的具體例可列舉: 聚對苯二甲酸乙二g旨(p〇Iyethyiene terephthalate )、聚對苯 一曱酸丁 一酉旨、聚喊石風(polyether sulfone )、聚碳酸g旨、 聚醯亞胺、環狀烯烴的開環聚合物及其氫化物等。 感放射線性組成物的溶液或分散液的塗佈方法並無特 別限定,例如可採用喷霧法、輥塗佈法、旋轉塗佈法(spin coat method)、狹縫模塗佈法、棒塗佈法等適當的方法。該 些塗佈方法中,特佳為旋塗法或狹縫模塗佈法。預烘烤的 條件亦根據各成分的種類、調配比例等而不同,較佳可設 定為70°C〜120°C且1分鐘〜κ)分鐘左右。 步驟(2) 於步驟(2)中’對步驟(1)中形成的塗膜的至少一 部分進行曝光。通常,對塗膜的一部分進行曝光時,隔著 具有預定圖案的光罩進行曝光。曝光所使用的放射線例如 可使用可見光線、紫外線、遠紫外線、電子束、X射線等。 s玄些放射線中,較佳為波長在19〇 nm〜45〇 nm的範圍内 的放射線,特佳為含有365 nm的紫外線的放射線。 該步驟的曝光量是設定為藉由照度計(〇ai modeB56、OAI Optical a獄iates Ine 製造)對放射線的波 長365 nm下的強度進行測定所得的值,較佳為1〇mj/cm2 〜1,000 mJ/cm2,更佳為 2〇 mJ/cm2〜7〇〇 ⑽一。 步驟(3) 於步驟(3)中,利用驗顯影液對曝光後的塗膜進行顯 48 201239531 41 /1 /pif 故 為負型。 驗顯影液例何縣··氫氧化鈉、絲切、碳酸納、 石„、財義、鱗無舰_黯,絲切甲基 氫氧化四乙基料有機驗顯影液。其中,就成本、^ 的觀點而言,較佳為無機驗顯影液,為氫氧化納 氧化鉀等驗金屬氫氧化物的顯影液。本發明的感放射線ς 組成物於使用無機驗顯影㈣情形時,亦能以高 高精細地形成圖案像。 另外,此種鹼顯影液中,亦可添加適當量的甲醇、乙 醇等水溶性有機溶劑或界面活性劑而使用。顯影方法例如 可利用盛液法、浸潰法(dipping meth〇d)、搖動浸潰法、 喷淋法等適當的方法。顯料間是根據感放射線性組成物 的組成而不同’較佳為1Q秒鐘〜18〇秒鐘左右。繼此種顯 影處理之後,例如進行3〇秒鐘〜90秒鐘的流水清洗後‘, 例如以壓縮空氣或壓縮氮氣進行風乾,藉此可形成所需的 圖案。 而 步驟(4) 於步驟(4)中,藉由使用熱板(hot plate)、烘箱(〇ven) 等加熱裝置對經顯影而圖案化的塗膜進行加熱,可獲得具 有所需圖案的硬化膜。加熱溫度例如為120°c〜25(rc。加 熱時間是根據加熱機器的種類而不同,例如於在熱板上進 行加熱步驟的情形時可設定為5分鐘〜30分鐘,在烘箱中 49 201239531 41717pif =熱:驟的情形時可設定為3〇分鐘〜9〇分鐘。亦可 使用進仃2次以上的加熱步驟的分步供烤法等。 =此而形成的硬化膜的膜厚較佳為Q」_〜1〇 _, 义仏為0.1 μΓη〜6 μιη,進而更佳為〇] μιη〜4哗。 好日Ϊί經過如上所述的步驟’可形賴基㈣密接性良 透明性、硬度、耐擦傷性、耐熱㈣性、感度及 各婦性«的硬化膜,並且㈣高的解析度高 形成圖案像。而且,可细無機驗顯影液對此種圖 案2仃顯影。而且’所得的硬化膜由於具備此種特性,故 可δ適地用作例如顯示元件的觸控面板的保護膜、顯示元 件的層間絕緣膜。 本發明的合適的態樣如下。 Π] —種感放射線性組成物,含有以下的成分[Ah、 分[B]及成分[C]: [A1]使四乙氧基矽烷或其部分水解物、上述式(丨)所 表示的水解性矽烷化合物或其部分水解物、及上述式(2) 所表不的水解性矽烷化合物或其部分水解物進行水解縮合 而獲得的聚石夕氧烧; [B]具有2個以上的乙烯性不飽和基的化合物(其中成 分[A1]除外); 〃 [C]光自由基聚合起始劑。 [2]如上述[1]所記載的感放射線性組成物,其中相對 於原料化合物的合計量,上述四乙氧基矽院或其部分水解 物的添加比例較佳為5 mol%〜75 mol%,更佳為1〇 m〇1% 50 201239531 41 /1 /pit 〜70 mol%,進而更佳為25 mol%〜65 mol%。 [3] 如上述[1]或[2]所記載的感放射線性組成物,其中 相對於原料化合物的合計量,上述式(1)所表示的水解性 矽烷化合物或其部分水解物的合計添加比例較佳為i 〇 mol%〜80 mol%,更佳為1〇 mol%〜75 mol%,進而更佳為 15 mol%〜70 mol%。 [4] 如上述[1]至[3]中任一項所記載的感放射線性組 成物,含有選自具有碳數丨〜6的烷基的水解性矽烷化合 物、及具有碳數6〜14的芳基的水解性矽烷化合物中的至 少一種石夕烧化合物「以下亦稱為矽烷化合物(lbi)」作為 上述式(1)所表示的水解性石夕烧化合物。 [5] 如上述[4]所記載的感放射線性組成物,其中上述 石夕烧化合物(lbl)為選自具有1個碳數1〜6的烷基的水 解性矽烷化合物、及具有丨個碳數6〜14的芳基的水解性 石夕烧化合物中的至少一種。 [6] 如上述[4]或[5]所記載的感放射線性組成物,其中 相對於原料化合物的合計量,上述矽烷化合物(lbi)的合 计添加比例較佳為10m〇1%〜80rn〇i%,更佳為15m〇l%〜 75 mol% ’ 進而更佳為 30 mol%〜70 mol%。 [7] 如上述[1]至[6]中任一項所記載的感放射線性組 成物’含有具有(曱基)丙烯醯氧基的水解性矽烷化合物作 為上述式(1)所表示的水解性矽烷化合物。 [8] 如上述[7]所記載的感放射線性組成物,其中具有 (甲基)丙烯酿氧基的水解性矽烷化合物含有選自具有甲基 51 201239531 41/I/pif 丙^酿氧基的水解性石夕炫化合物(以下亦稱為石夕炫化合物 (lc ))、及具有丙烯醯氧基的具有水解性的矽烷化合物 (以下亦稱為矽烷化合物(Id〗))中的至少一種。 [9] 如上述[7]或[8]所記載的感放射線性組成物,其中 相對於原料化合物的合計量,具有(y基)丙烯酿氧基的水 解性矽烷化合物的合計添加比例較佳為5 mol%〜25 mol% ’ 更佳為 1〇m〇1%〜2〇m〇1% 〇 [10] 如上述[8]或[9]所記載的感放射線性組成物,含 有石夕烧化合物(lcl)及魏化合物⑴1)作為具有(甲基) 丙烯酿,基的水解性矽烷化合物,兩者的添加比例 (lc/ld )以莫耳比計較佳為〇〇5〜3,更佳為〇2〜丨$, 進而更佳為0.3〜1。 如上述⑴至[1〇]中任一項所記載的感放射線性組 成物,a中相對於原料化合物的合計量,上述弋(2)所表 示的水解性魏化合物或其部分水解物的㈣關為^ 削1%以下,更佳為13mol%以下,進而更佳為i〇m〇i%以 下’進一步更佳為7 mol%以下。 ,如上述⑴至_中任—項所記载的感放射線性 組成物,其中相對於原料化合物的合計量,上述式(2)所 表示的水解性石夕烧化合物或其部分水解物的添力:比例較佳 為0.5 md%〜15 mol% ’更佳為i _%〜13则1%,進而 更佳為2 mol%〜10 mol%,進一步更佳為3 m〇1%〜7 mol%。 [13]如上述[1]至[12]中任一項所記戴的感放射線性For example: Admafine SO-E1, Admafine SO-E2, Admafine SO-E3, Admafine SO-E4, Admafine SO-E5, Admafine SE3200-SEJ (manufactured by Admatechs), SS01, SS03, SS15, SS35 (manufactured by Osaka Chemical Industry Co., Ltd.) , methanol silica sol, IPA-ST, MEK-ST, NBA-ST, XBA-ST, DMAC-ST, ST-UP, ST-OUP, ST-20, ST-40, ST- C, ST-N, ST-0, ST-50, ST-OL (manufactured by Gifu Chemical Industry Co., Ltd.). Further, examples of the zirconia particles include HXU-110JC, HXU-210C, NZD-3101 (manufactured by Sumitomo Osaka Cement Co., Ltd.), ID191 (manufactured by Tayca Co., Ltd.), ZRPMA15WT%-E05 (manufactured by CIKasei Co., Ltd.), and the like, and further, titanium oxide. The particles can be listed as: MT-05, MT-100W, MT-100SA, MT-100HD, MT-300HD, MT-150A, ND138, ND139, ND140, ND154, ND165, ND177, TS-063, TS-103, TS- 159 (manufactured by Tayca), etc. The inorganic fine particles may also be surface-treated by a decane coupling agent or the like. By performing such a surface treatment, compatibility with other components can be improved, and dispersibility or mechanical strength in the composition can be improved. The average particle diameter of the organic particles and the inorganic particles is preferably in the range of 〇〇〇5 μm to 0.5 μm. In the case of [Ε] ’, powder-like particles may be directly added and mixed into other components', or a solvent dispersion may be added, added to and mixed with other components, and the solvent may be distilled off. The components [Ε] may be used alone or in combination of two or more. Relative to the component [A] l 〇〇 by mass, the content of the component [Ε] is preferably i 201239531 41717pif ir parts ~ 600 parts by mass only, and live in Machuan mass parts ~ buy f you, and more preferably 50 Parts by mass to 1 part by mass. By making the content of the component [E] within the above range, the scratch resistance and heat crack resistance of the obtained protective film and interlayer insulating film can be further improved. Ingredient fFj The present invention Yin can contain a dissolving sword as a component [smart. The radiation sensitive composition is usually prepared by formulating a solvent in the form of a liquid composition. The solvent can be appropriately selected and used only if it dissolves or dissolves each component constituting the radiation sensitive composition and does not have a moderate volatility with the knife. = such a solvent 'preferably contains an alcohol = as a f-substance. Hunting uses an alcohol-based solvent to increase the radiation-sensitive linear composition _ two plates = coating properties, thereby inhibiting uneven coating, uniformity, etc., and can be used as a solvent. For example, uniformity can be cited. Long-chain silk alcohol such as 丨-hexanol d-hexanol, octyl octanol, 丨 壬 sterol, i hexane diol, octyl diol, etc.; aromatic alcohol such as benzyl alcohol; ethylene glycol monomethyl ether, ethylene glycol Monoethyl ether, alcohol monobutane and other ethylene glycol monofilament shouting; —·Zi early _, ethylene dipropylene glycol monomethyl hydrazine, propylene glycol monoethyl alcohol monobutane propylene glycol single burning fine; 4 early (four), C two shouting; Ethylene glycol monomethyl singer, diethylene glycol monoethyl sulphate, etc. diethylene glycol monoalkyl dipropylene glycol monomethyl trans, dipropylene glycol monoethyl ether, diethylene glycol mono (tetra), 45 201239531 mn /pif dipropylene glycol monobutraz Dipropylene glycol monofilament shouted. These alcohol solvents may be used singly or in combination of two or more. In the case of the improvement of the coating property, it is preferable that the propylene glycol monomethyl ether and the propylene glycol monoethyl component [F] may be used singly or in combination of two or more kinds. The content of the component [F] is preferably 篁1, 2 GG parts by mass, more preferably 1 gram by weight to 9 parts by mass, based on the mass of the component [A]. By setting the content of the component [F] to the upper ship _, the coating property of the _ substrate or the like can be improved, and the unevenness of coating (strip unevenness, unevenness of needle marks, uneven haze, etc.) can be suppressed. , can further improve the uniformity of thickness. ♦ In the present invention, other solvents such as ethers, diethylene glycol alkyl ethers, ethylene glycol alkyl ether acetates, propylene glycol monoalkyl ether propionates, and aromatics may be contained together with the alcohol solvent. Hydrocarbons, ketones, esters, and the like. Additive The radiation sensitive composition of the present invention may contain various additives as needed. Examples of the additive include a sensitizing radioactive acid generator such as a triphenylsulfonium salt or a tetrahydrothiophenium salt; and an amine phthalic acid-2-nitro-based cycline. 2-nitrobenzylcyclohexyl carbamate), a sensitizing radioactive linear base generator such as O-carbamoyl hydroxy amide; nonionic surfactant, I-type surfactant and interfacial activity Surfactant such as surfactant; 2,2-thiobis(4-mercaptotridecyl butylbenzene) 46 201239531 /1/pif (2,2-thiobis(4-methyl-6-t-butyl phenol)) , 2,6-di-tertiary butyl phenol and other antioxidants; 2-(3-tertiary butyl_5_indolyl-2-hydroxyphenyl)_5•chlorobenzotriazole (2-(3- Ultraviolet absorption agent such as t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzobenzoazole or alkoxybenzophenone. The content of these additives can be appropriately selected within the range not impairing the object of the present invention. The radiation sensitive composition of the present invention can be produced by a suitable method, for example, by subjecting the component [A], the component [B] and the component [c] in the [F] solvent, and optionally the component [D], The component [E] or an additive or the like is mixed in a predetermined ratio to prepare a radiation-sensitive composition in a solution or dispersion state. A cured film and a method for forming the same, and a method of forming a cured film on a substrate using the radiation sensitive composition of the present invention will be described. The method comprises the following steps (1) to (4). (1) a step of applying a radiation-sensitive composition of the present invention onto a substrate to form a coating film; (2) a step of at least partially irradiating the coating film formed in the step (1); (1) using a developer solution a step of developing the irradiated film in the step (2); and a step of heating the developed coating film in the step (3) by the soil. (4) 2 (1) towel, after applying a silk dispersion liquid of the radiation sensitive composition of the present invention on a substrate, preferably by heating the coated surface (pre-47 201239531 1 / wpif baking) Remove to form a coating film. Examples of the material of the substrate which can be used include glass, quartz, rhodium, and resin. Specific examples of the resin include: polyethylene terephthalate (p〇Iyethyiene terephthalate), poly(p-phenylene terephthalate), polyether sulfone, polycarbonate, polybendimimine a ring-opening polymer of a cyclic olefin, a hydride thereof, or the like. The coating method or the dispersion method of the radiation-sensitive composition is not particularly limited, and for example, a spray method, a roll coating method, a spin coating method, a slit die coating method, or a bar coating method can be employed. Appropriate methods such as cloth. Among these coating methods, a spin coating method or a slit die coating method is particularly preferred. The pre-baking conditions vary depending on the type of each component, the blending ratio, etc., and are preferably set to be from 70 ° C to 120 ° C for about 1 minute to about κ minutes. Step (2) In step (2), at least a portion of the coating film formed in the step (1) is exposed. Usually, when a part of the coating film is exposed, exposure is performed through a photomask having a predetermined pattern. For the radiation used for the exposure, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray or the like can be used. Among the singular radiations, radiation having a wavelength in the range of 19 〇 nm to 45 〇 nm is preferable, and radiation containing ultraviolet rays of 365 nm is particularly preferable. The exposure amount in this step is a value obtained by measuring the intensity at a wavelength of 365 nm of the radiation by an illuminometer (〇ai mode B56, manufactured by OAI Optical a prison Ines Ine), preferably 1 〇 mj/cm 2 〜1. , 000 mJ/cm2, more preferably 2〇mJ/cm2~7〇〇(10) one. Step (3) In the step (3), the exposed coating film is subjected to a test solution using a developer solution, and is negative in the form of 201239531 41 /1 /pif. For example, the developer solution, sodium hydroxide, silk cut, sodium carbonate, stone „, 财义, scales, no ship _ 黯, silk cut methyl hydroxide tetraethyl organic test developer. Among them, the cost, From the viewpoint of the above, it is preferably an inorganic test developer which is a developer for detecting a metal hydroxide such as potassium oxyhydroxide. The radiation sensitive composition of the present invention can also be used in the case of using inorganic test development (IV). A pattern image is formed in a high-definition manner. In addition, an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant may be added to the alkali developer, and the development method may be, for example, a liquid-holding method or a dipping method. Appropriate methods such as (dipping meth〇d), shaking dipping method, spray method, etc. The difference between the materials is based on the composition of the radiation-sensitive composition. It is preferably about 1Q seconds to 18 seconds. After the development treatment, for example, after 3 to 90 seconds of running water cleaning, for example, air drying with compressed air or compressed nitrogen, the desired pattern can be formed. Step (4) in step (4) By using a hot plate A heating device such as an oven can heat the coating film patterned by development to obtain a cured film having a desired pattern. The heating temperature is, for example, 120 ° C to 25 (rc. The heating time is based on the type of the heating machine. Differently, for example, when the heating step is performed on a hot plate, it can be set to 5 minutes to 30 minutes, and in the case of an oven 49 201239531 41717 pif = heat: the time can be set to 3 minutes to 9 minutes. A stepwise baking method using a heating step of two or more times is used. The thickness of the cured film formed is preferably Q"_~1〇_, and the meaning is 0.1 μΓη to 6 μιη, and further preferably 〇] μιη~4哗. Good day Ϊ 经过 through the steps described above 'the cleavable base (four) adhesion good transparency, hardness, scratch resistance, heat resistance (four), sensitivity and various degrees of hardening film, and (4) The high resolution is high to form a pattern image, and the fine inorganic developer can develop the pattern 2仃. Moreover, since the obtained cured film has such characteristics, it can be suitably used as a touch of, for example, a display element. Protective film of panel, display element Inter-insulating film. A suitable aspect of the present invention is as follows. Π] - a radiation-sensitive composition containing the following components [Ah, [B] and [C]: [A1] tetraethoxy decane or a partially hydrolyzed product, a hydrolyzable decane compound represented by the above formula (丨) or a partially hydrolyzed product thereof, and a polycondensate obtained by hydrolyzing and condensing a hydrolyzable decane compound represented by the above formula (2) or a partially hydrolyzed product thereof [B] a compound having two or more ethylenically unsaturated groups (excluding the component [A1]); 〃 [C] a photoradical polymerization initiator; [2] as described in the above [1] The radiation-sensitive linear composition, wherein the ratio of the above-mentioned tetraethoxy oxime or its partial hydrolyzate is preferably from 5 mol% to 75 mol%, more preferably 1 〇m〇1, based on the total amount of the raw material compound. % 50 201239531 41 /1 /pit ~70 mol%, and more preferably 25 mol% to 65 mol%. [3] The radiation-sensitive linear composition according to the above [1] or [2], wherein the total amount of the hydrolyzable decane compound represented by the above formula (1) or a partial hydrolyzate thereof is added to the total amount of the raw material compound. The ratio is preferably i 〇 mol% to 80 mol%, more preferably 1 〇 mol% to 75 mol%, and still more preferably 15 mol% to 70 mol%. [4] The radiation sensitive linear composition according to any one of the above [1] to [3], comprising a hydrolyzable decane compound selected from the group consisting of an alkyl group having a carbon number of 丨6, and having a carbon number of 6 to 14 At least one of the sulfonated decane compounds (hereinafter also referred to as a decane compound (lbi)) is a hydrolyzable sinter compound represented by the above formula (1). [5] The radiation-sensitive composition according to the above [4], wherein the pyroxene compound (lbl) is a hydrolyzable decane compound selected from the group consisting of one alkyl group having 1 to 6 carbon atoms, and one of At least one of the hydrolyzable cyclamate compounds having an aryl group having 6 to 14 carbon atoms. [6] The radiation-sensitive composition according to the above [4] or [5], wherein the total addition ratio of the above decane compound (lbi) is preferably from 10 m〇1% to 80 rn〇 with respect to the total amount of the raw material compounds. I%, more preferably 15 m〇l% to 75 mol%' and further preferably 30 mol% to 70 mol%. [7] The radioactive linear composition as described in any one of the above [1] to [6], which contains a hydrolyzable decane compound having a (fluorenyl) acryloxy group as the hydrolysis represented by the above formula (1) A decane compound. [8] The radiation-sensitive linear composition according to the above [7], wherein the hydrolyzable decane compound having a (meth)acryloyloxy group is selected from the group consisting of methyl group 51 201239531 41/I/pif At least one of a hydrolyzable Shixia compound (hereinafter also referred to as Shi Xixuan compound (lc)) and a hydrolyzable decane compound having an acryloxy group (hereinafter also referred to as a decane compound (Id)) . [9] The radiation-sensitive composition according to the above [7] or [8], wherein the total addition ratio of the hydrolyzable decane compound having a (y-based) acryloyloxy group is preferably based on the total amount of the raw material compounds. 5 mol% to 25 mol% ' More preferably 1〇m〇1%~2〇m〇1% 〇[10] The radiation-sensitive composition as described in [8] or [9] above contains Shi Xi The calcined compound (lcl) and the Wei compound (1) 1) are hydrolyzable decane compounds having a (meth) propylene-based group, and the addition ratio (lc/ld) of the two is preferably 〇〇5 to 3 in terms of a molar ratio, more preferably Preferably, it is 2 to 丨$, and more preferably 0.3 to 1. The radiosensitive linear composition according to any one of the above (1) to (1), wherein (a) the hydrolyzable Wei compound represented by the above ruthenium (2) or a partially hydrolyzed product thereof in a total amount of a relative to the raw material compound in a The cut is 1% or less, more preferably 13 mol% or less, and even more preferably i〇m〇i% or less, and further preferably 7 mol% or less. The radiation-sensitive composition according to the above-mentioned item (1), wherein the hydrolyzable sinter compound represented by the above formula (2) or a partial hydrolyzate thereof is added to the total amount of the raw material compound. Force: the ratio is preferably 0.5 md% to 15 mol% 'better is i _%~13, then 1%, and more preferably 2 mol% to 10 mol%, further preferably 3 m〇1%~7 mol %. [13] Radiation-sensitive radiation as recorded in any of the above [1] to [12]

52 201239531 4I/17pxf 組成物’其中上述式(2)所表示的水解性矽烷化合物為 3-三曱氧基矽烷基丙基琥珀酸酐或3-三乙氧基矽烷基丙基 琥拍酸針。 [14] 一種感放射線性組成物,含有以下的成分[A2]、 成分[B]及成分[C]: [A2]具有Si〇2單元、上述式(ia)所表示的結構單元、 及上述式(2a)所表示的結構單元的聚矽氧烷; [B] 具有2個以上的乙烯性不飽和基的化合物(其中成 分[A2]除外); [C] 光自由基聚合起始劑。 [15] 如上述[14]所記載的感放射線性組成物,其中於 成分[A·2]的所有結構單元中,上述Si02單元的含有比例較 佳為 5 mol%〜75 mol%,更佳為 1〇 m〇i〇/。〜7〇 m〇i%,進 而更佳為25 mol%〜65 mol%。 [16] 如上述[14]或[15]所記載的感放射線性組成物, 其中於成分[A2]的所有結構單元中,結構單元(la)的含 有比例較佳為10 m〇l%〜80 mol%,更佳為10 moi%〜75 m〇l% ’進而更佳為15 mol%〜70 mol%。 [Π]如上述[14]至[16]中任一項所記載的感放射線性 組成物’其中於成分[A2]的所有結構單元中,結構單元(2a) 的含有比例較佳為15 mol%以下,更佳為13 m〇1%以下, 進一步更佳為10 m〇l%以下,進而佳為7 m〇1%以下。 [18]如上述[14]至[16]中任一項所記載的感放射線性 組成物,其中於成分[A2]的所有結構單元中,結構單元(2a) 53 201239531 41 /1/pif 的έ有比例較佳為〇 5 m〇l%〜15 m〇i%,更佳為i mol%〜 13mol%,進而更佳為2m〇1%〜1〇inol%,進一步更佳為3 mol%〜7 mol% 〇 [19] 如上述[14]至[18]中任一項所記載的感放射線性 組成物’含有1個以上的上述式(lb)所表示的結構單元 (以下亦稱為結構單元(lb))作為結構單元(la)。 [20] 如上述[19]所記載的感放射線性組成物,其中於 成分[A2]的所有結構單元中,結構單元(lb)的含有比例 較佳為 10 mol%〜80 mol%,更佳為 15 mol%〜75 mol%, 進而更佳為30 mol%〜70 mol%。 P1]如上述[14]至[20]中任一項所記載的感放射線性 組成物’含有選自上述式(lc)所表示的結構單元(以下 亦稱為「結構單元(1c)」)及上述式(ld)所表示的結構 單元(以下亦稱為「結構單元(ld)」)中的至少一種作為 結構早元(1 a )。 [22] 如上述[21]所記載的感放射線性組成物’其中於 成分[A2]的所有結構單元中,結構單元(ic)與結構單元 (Id)的合計含有比例較佳為5 m〇1%〜25 mol%,更佳為 10 mol%〜20 mol% 〇 [23] 如上述[21]或[22]所記載的感放射線性組成物, 含有結構單元(lc)及結構單元(id)作為結構單元(la), 結構單元(lc)與結構單元(id)的含有比例(lc/ld)以 莫耳比計較佳為0.05〜3,更佳為0.2〜1.5,進而更佳為 0·3 〜1 〇52 201239531 4I/17pxf Composition ' wherein the hydrolyzable decane compound represented by the above formula (2) is 3-trimethoxydecyl propyl succinic anhydride or 3-triethoxydecyl propyl sulphonate. [14] A radiation sensitive composition comprising the following component [A2], component [B], and component [C]: [A2] having a Si〇2 unit, a structural unit represented by the above formula (ia), and the above a polyoxyalkylene of the structural unit represented by the formula (2a); [B] a compound having two or more ethylenically unsaturated groups (excluding the component [A2]); [C] a photoradical polymerization initiator. [15] The radiation sensitive composition according to the above [14], wherein the content of the SiO 2 unit is preferably from 5 mol% to 75 mol%, more preferably in all the structural units of the component [A·2]. It is 1〇m〇i〇/. 〜7〇 m〇i%, and more preferably 25 mol% to 65 mol%. [16] The radiation sensitive composition according to [14] or [15], wherein, in all the structural units of the component [A2], the content ratio of the structural unit (la) is preferably 10 m〇l%~ 80 mol%, more preferably 10 moi% to 75 m〇l% 'and more preferably 15 mol% to 70 mol%. The radiosensitive linear composition as described in any one of the above [14] to [16] wherein, in all the structural units of the component [A2], the content of the structural unit (2a) is preferably 15 mol. % or less, more preferably 13 m〇1% or less, still more preferably 10 m〇l% or less, and further preferably 7 m〇1% or less. [18] The radiation sensitive composition according to any one of the above [14] to [16] wherein, in all structural units of the component [A2], the structural unit (2a) 53 201239531 41 /1/pif The proportion of cerium is preferably 〇5 m〇l%~15 m〇i%, more preferably i mol% 〜13 mol%, further preferably 2 m 〇 1% 〜1 〇 inol%, further preferably 3 mol% ~7 mol% 〇 [19] The radiation sensitive composition described in any one of the above [14] to [18] contains one or more structural units represented by the above formula (lb) (hereinafter also referred to as The structural unit (lb) is taken as the structural unit (la). [20] The radiation sensitive composition according to the above [19], wherein, in all the structural units of the component [A2], the content of the structural unit (lb) is preferably from 10 mol% to 80 mol%, more preferably It is 15 mol% to 75 mol%, and more preferably 30 mol% to 70 mol%. P1] The radiation sensitive composition as described in any one of the above [14] to [20] contains a structural unit selected from the above formula (lc) (hereinafter also referred to as "structural unit (1c)") At least one of the structural unit (hereinafter also referred to as "structural unit (ld)") represented by the above formula (ld) is used as the structural element (1 a ). [22] The radiation sensitive composition as described in the above [21], wherein in all the structural units of the component [A2], the total content ratio of the structural unit (ic) to the structural unit (Id) is preferably 5 m. 1% to 25 mol%, more preferably 10 mol% to 20 mol% 〇 [23] The radiation sensitive composition as described in [21] or [22] above, which contains structural unit (lc) and structural unit (id) As the structural unit (la), the content ratio (lc/ld) of the structural unit (lc) to the structural unit (id) is preferably 0.05 to 3, more preferably 0.2 to 1.5, and still more preferably 0 in terms of a molar ratio. ·3 ~1 〇

54 201239531 /1 /pif [24] 如上述[14]至[23]中任一項所記載的感放射線性 組成物,其中結構單元(2a)為來源於3-三曱氧基矽烷基 丙基琥珀酸酐或3-三乙氧基矽烷基丙基琥珀酸酐的結構單 元。 [25] 如上述[1]至[13]中任一項所記載的感放射線性 組成物,其中上述式(1)的R1及上述式(2)的R3的烷 基的碳數較佳為1〜4,更佳為1或2。 [26] 如上述[1]至[25]中任一項所記載的感放射線性 組成物,其中上述式(1)及式(la)的R2的烷基的碳數 較佳為1〜10,更佳為1〜6。 [27] 如上述[1]至[26]中任一項所記載的感放射線性 組成物,其中上述式(1)及式(la)的R2的芳基較佳為 苯基、萘基,更佳為苯基。 [28] 如上述[1]至[27]中任一項所記載的感放射線性 組成物,其中上述式(1)、式(la)、式(lb)、式(lc) 及式(Id)的m較佳為1或2,更佳為1。 [29] 如上述[1]至[28]中任一項所記載的感放射線性 組成物,其中上述式(1)、式(la)、式(lb)、式(lc) 及式(Id)的η較佳為0〜3的整數,更佳為0或3。 [30] 如上述[1]至[29]中任一項所記載的感放射線性 組成物,其中上述式(2)及式(2a)的X較佳為1或2, 更佳為1。 [31] 如上述[1]至[30]中任一項所記載的感放射線性 組成物,其中上述式(2)及式(2a)的y較佳為1〜3的 55 201239531 41 /1/pif 整數,更佳為3。 [32]如上述[1]至[31]中任一項所記載的感放射線性 組成物,其中上述式(2)及式(2a)的z較佳為〇或1 ’ 更佳為〇。 [33] 如上述[1]至[32]中任一項所記載的感放射線性 組成物’其中成分[A1]及成分[A2]的重量平均分子量(Mw) 較佳為500〜10000,更佳為1000〜7000。 [34] 如上述[1]至[33]中任一項所記載的感放射線性 組成物,其中成分[A1]及成分[A2]的分散度(Mw/Mn)較 佳為1.0〜15.0,更佳為1.1〜ι〇·〇,進而更佳為1.1〜5.0。 [35] 如上述[1]至[34]中任一項所記載的感放射線性 組巧物,其中成分[Β]較佳為2官能或3官能以上的(曱基) 丙烯酸酯,更佳為3官能以上的(甲基)丙烯酸酯,進而更 佳為3官能〜6官能的(甲基)丙烯酸酯。 会[36]如上述[1]至[35]中任一項所記載的感放射線性 =成物,其中相對於成分[Α]100質量份,成分[Β]的含量較 怜為5質量份〜3〇〇質量份,更佳為ι〇質量份〜2〇〇質量 二二進而更佳為15質量份〜100質量份,少更佳為20 質直份〜80質量份。 組成]如上述[1 ]至[3 6 ]中任—項所記載的感放射錄 ,合有0-醯基肟化合物作為成分[c]。 組成以 -項所記載的感放_ 份,成八二 []與成分[合計量100 ^ 刀[C]的含量較佳為G.G5質量份〜3Qf量份,|The radiation sensitive composition according to any one of the above [14] to [23] wherein the structural unit (2a) is derived from 3-trimethoxyoxyalkylalkylpropyl group. A structural unit of succinic anhydride or 3-triethoxydecylpropyl succinic anhydride. [25] The radiation sensitive composition according to any one of the above [1] to [13] wherein the carbon number of R1 of the above formula (1) and the alkyl group of R3 of the above formula (2) is preferably 1 to 4, more preferably 1 or 2. [26] The radiation sensitive composition according to any one of the above [1] to [25] wherein the alkyl group of R2 of the above formula (1) and formula (la) preferably has 1 to 10 carbon atoms. More preferably 1 to 6. [27] The radiation sensitive composition according to any one of the above [1] to [26] wherein the aryl group of R2 in the above formula (1) and formula (la) is preferably a phenyl group or a naphthyl group. More preferably, it is a phenyl group. [28] The radiation sensitive composition according to any one of the above [1] to [27] wherein the above formula (1), formula (la), formula (lb), formula (lc), and formula (Id) m is preferably 1 or 2, more preferably 1. [29] The radiation sensitive composition according to any one of the above [1] to [28] wherein the above formula (1), formula (la), formula (lb), formula (lc), and formula (Id) η is preferably an integer of 0 to 3, more preferably 0 or 3. [30] The radiation sensitive composition according to any one of the above [1] to [29] wherein X of the above formula (2) and formula (2a) is preferably 1 or 2, more preferably 1. [31] The radiation sensitive composition according to any one of the above [1] to [30], wherein y of the above formula (2) and formula (2a) is preferably 1 to 3, 2012, 2012, 31, 531, 41, 1 /pif integer, more preferably 3. [32] The radiation sensitive composition according to any one of the above [1] to [31] wherein z of the above formula (2) and formula (2a) is preferably 〇 or 1 ', more preferably 〇. [33] The radiation-sensitive linear composition of any one of the above [1] to [32] wherein the weight average molecular weight (Mw) of the component [A1] and the component [A2] is preferably 500 to 10,000, more preferably Good for 1000~7000. [34] The radiation sensitive composition according to any one of [1] to [33] wherein the dispersion degree (Mw/Mn) of the component [A1] and the component [A2] is preferably 1.0 to 15.0. More preferably 1.1 to ι〇·〇, and even more preferably 1.1 to 5.0. [35] The radiation sensitive composition according to any one of the above [1] to [34] wherein the component [Β] is preferably a bifunctional or trifunctional or higher (fluorenyl) acrylate, more preferably It is a trifunctional or higher (meth) acrylate, and more preferably a trifunctional to hexafunctional (meth) acrylate. [36] The radiosensing linearity of any one of the above [1] to [35], wherein the content of the component [Β] is 5 parts by mass relative to 100 parts by mass of the component [Α]. 〜3〇〇质量份, more preferably ι〇质量份~2〇〇质量二二等更优选为15质量份~100质量份,少更更优选为20质量直份〜80质量份. Composition] The radiographic recording described in any one of the above [1] to [3 6 ] is combined with a 0-fluorenyl hydrazine compound as the component [c]. The content of the composition is _ part, the octagonal [] and the composition [the total amount of 100 ^ knives [C] is preferably G.G5 parts by mass to 3Qf parts, |

56 201239531 41717pif 為0.1質量份〜15質量份’進而更佳為i質量份〜1〇質量 份。 [39] 如上述[丨]至[38]中任一項所記載的感放射線性 組成物,更含有具有(Dl)具有羧基的結構單元 (以下亦 稱為結構單元Di)及(D2)具有環氧基的結構單元(以下 亦稱為結構單元〇2)的共聚物作為成分明。 [40] 如上述[39]所記載的感放射線性組成物,其中結 元⑺)為來源於選自⑺1·1)㈣和舰及不飽和 魏酐(以下亦將該些化合物稱為「化合物(DM)」)中 的至少一種化合物的結構單元。 1中上f上3:]或[40]所記裁的感放射線性組成物’ 早70 (D )為來源於具有環氧基的自由基聚合性 亦稱為「化合物(D2~2)」)的結構單元。 植成物it述[39]至[41]中任一項所記載的感放射線性 =成物’其中於所有結構單元中,結構單元(D1)的丘聚 量%〜4()質量%,更佳為2質量%, 貝里/〇,進而更佳為3質量%〜25質旦〇/56 201239531 41717pif is 0.1 part by mass to 15 parts by mass' and more preferably i part by mass to 1 part by mass. [39] The radiation sensitive composition according to any one of [D] to [38], further comprising (D1) a structural unit having a carboxyl group (hereinafter also referred to as structural unit Di) and (D2) having A copolymer of a structural unit of an epoxy group (hereinafter also referred to as a structural unit 〇 2) is known as a component. [40] The radiation-sensitive linear composition according to [39] above, wherein the element (7) is derived from (7)1·1) (4) and the ship and the unsaturated ferulic anhydride (hereinafter referred to as "the compound" A structural unit of at least one compound of (DM)"). 1 in the upper middle f on the 3:] or [40] recorded radioactive linear composition 'early 70 (D) is derived from the epoxy group-containing radical polymerizability also known as "compound (D2 ~ 2)" The structural unit. The sensitizing radioactivity = the product described in any one of [39] to [41], wherein in all the structural units, the amount of aggregation of the structural unit (D1) is % to 4 (% by mass), More preferably 2% by mass, Berry/〇, and more preferably 3% by mass to 25% 〇/

Ji3] 組成物,其中於所有結構單元中, _ 合比例較佳為H)質量%〜75 f量白共聚 7。質量%,進而更佳為20質;^ =。15質量%〜 二4丨ί 至’任一項所記載的感放射線性 組成物,其中成分[D]更具* (D3 5 基丙基三烷氧基矽烷的結構單元。彳’、.、土 -氣 57 201239531 n /pif u[I5] 2述[39]至[44]中任—項所記載的感放射線性 對於上述聚石夕氧燒100質量份,成分[D] ^罝㈣為1質量份〜45f量份,更佳為2質量份〜4〇 進:更,質量份〜35質量份,進-步更佳為 虞里刀〜0質讀’進而佳為3質量份〜25質量份。 2述[1]至[45]中任—項所記載的感放射線性 3有選自由有機粒子及無機粒子所組成的組群 中的至少一種作為成分[E]〇 述[45]所記載的感放射線性組成物,其中相 曰二二院刚質量份’成分[Ε]的含量較佳為1質 篁刀 冑量伤,更佳為10質量份〜200質量份,進而 更佳為50質量份〜100質量份。 如上述[1]至[47]中任一項所記載的感放射線性 組成物,更含有溶劑作為成分[F]。 μ ^9]如上述[48]所記載的感放射線性組成物,含有較 為質子性糊、更佳騎系溶劑作為成分[巧。 [5〇]如上述[48]或[49]所記載的感放射線性組成物, i 1 上述聚石夕氧燒1〇0質量份,成分[F]的含量較佳 ^質罝份叫,·質量份,更佳為1〇質量份〜_質量 A、匕η如上述⑴至[Μ中任一項所記載的感放射線性 ί时崎形賴控面板的賴臈或齡元件的層間絕 緣膜。 問種硬化膜’其是使用上述[1]至[川中任-項所 58 201239531 41717pif 。己載的感放射線性組成物而形成。 〜步種硬化膜的形成方法,包含以下的步驟⑴ 性感放射線 射線步)驟對步驟⑴中形成的塗膜的至少—部分照射放 中經放射線照射的塗 (3)利用鹼顯影液對步驟(2) 膜進行顯影的步驟;以及 (4)對步驟(3)中經顯影的塗膜進行加熱的步驟。 [54]如上述[53]所記載的形成方法,其中步驟(2)中 的放射線包含較佳為波長190 nm〜450 nm的放射線,更 佳為波長365 nm的紫外線。 [55]如上述[53]或[54]所記載的形成方法,其中使用 無:機驗顯影液作為步驟⑴中祕顯影液。 [貫例] 以下不出合成例、實例對本發明進行更具體說明,但 本發明不限定於以下的實例。 由以下的各合成例所得的聚矽氧烷的重量平均分子量 (Mw)及數量平均分子量(Mn)是藉由下述規格的凝膠 滲透層析儀(GdPermeati〇nChr〇mat〇graphy,gpc)來測 定。 装置· GPC-101 (昭和電工(股)製造) 管柱.將 GPC-KF-801、GPC-KF-802、GPC-KF-803 59 201239531 41 /l/pif 及GPC804 (昭和電工(股)製造)連結 移動相:四氫η夫喃 成分[Α]的聚矽氧烷的合成例 [合成例1] 於附有擾拌機的容器内添加丙二醇單 份i繼而添加甲基三甲氧基雜(以下稱為「MTMs = 質量份、四乙氧基魏(TE〇s) 12質量份及 」Hi 石夕烧基)丙基琥简肝(以下稱為「TMs ^:氧基 (MTMS/TEOS/TMSPS (莫耳比)=8〇/1 質量份 :盈度溶液溫度達喊後,添加碌二工 份、離子交換水質量份,加熱至听, 負里 冷卻至45<t後’添加作為脫水劑的原?酸甲_ t時。 攪拌1小時。進而將溶液溫度調整為40。匚,—貝里份, -面進行蒸發’藉此將離子交換水及因水入”度 甲醇去除。藉由以上操作而獲得聚石夕氧A 口生的 烧⑷)的固體成分濃度為30質量%:】二);^氧 (Mw)為2,500,分散度(Mw/Mn)為22。再者::篁 明書中所謂「固體成分」,是指用17穴的熱板將試樣乾= 1小時而將揮發物質去除所得的剩餘成分。 你 [合成例2] 更將3-甲基丙 MPTMS」)以 68/15/15/2 例使用,除此以外,藉由與合成例!相同的操作而獲得聚 除了 MTMS、TEOS 及 TMSPS 以外 婦醯氧基丙基三甲氧基矽烧(以下稱為 MTMS/TEOS/MPTMS/TMSPS (莫耳比) 201239531 41 /1/plf 矽氧烷(A-2)。聚矽氧烷(a-2)的固體成分濃度為30質 量%,重量平均分子量(Mw)為2,300,分散度(Mw/Mn) 為2.卜 [合成例3] 除了將 MTMS/TEOS/MPTMS/TMSPS 的比例(莫耳 比)變更為62/15/15/8以外,藉由與合成例2相同的操作 而獲得聚矽氧烷(A-3)。聚矽氧烷(A-3)的固體成分濃 度為30質量%,重量平均分子量(Mw)為2,200,分散度 (Mw/Mn)為 2.1。 [合成例4] 除了將 MTMS/TEOS/MPTMS/TMSPS 的比例(莫耳 比)變更為55/15/15/15以外,藉由與合成例2相同的操作 而獲得聚矽氧烷(A-4)。聚矽氧烷(A-4)的固體成分濃 度為30質量%,重量平均分子量(Mw)為2,200,分散度 (Mw/Mn)為 2.3。 [合成例5] 除了 MTMS、TEOS 及 TMSPS 以外,更將 MPTMS 及苯基三曱氧基矽烷(以下稱為「PTMS」)以 MTMS/TEOS/PTMS/MPTMS/TMSPS (莫耳比) =50/15/15/15/5的比例使用,除此以外,藉由與合成例1 相同的操作而獲得聚矽氧烷(A-5)。聚矽氧烷(A-6)的 固體成分濃度為30質量%,重量平均分子量(Mw)為 1,900,分散度(Mw/Mn)為 1.9。 [合成例6] 61 201239531 41 /1/pif 除了 MTMS、TEOS及TMSPS以外,更將3-丙烯醯 氧基丙基三甲氧基矽烷(以下稱為「APTMS」)以 MTMS/TEOS/APTMS/TMSPS (莫耳比)=65/15/15/5 的比 例使用,除此以外,藉由與合成例1相同的操作而獲得聚 矽氧烷(A-6)。聚矽氧烷(A-6)的固體成分濃度為30質 量%,重量平均分子量(Mw)為2,400 ’分散度(Mw/Mn) 為 2_3。 [合成例7] 除了將MTMS/TEOS/APTMS/TMSPS的比例(莫耳比) 變更為50/30/15/5以外,藉由與合成例6相同的操作而獲 得聚破氧烧(A-7)。聚梦氧烧(A-7)的固體成分濃度為 30質量%,重量平均分子量(Mw)為3,500,分散度 (Mw/Mn)為 2.4。 [合成例8] 除了 MTMS、TEOS 及 TMSPS 以外,更將 MPTMS 及 APTMS 以 MTMS/TEOS/MPTMS/APTMS/TMSPS(莫耳 比)=77/7/1/10/5的比例使用,除此以外,藉由與合成例1 相同的操作而獲得聚矽氧烷(A-8)。聚矽氧烷(A-8)的 固體成分濃度為30質量%,重量平均分子量(Mw)為 2,000,分散度(Mw/Mn)為 2.0。 [合成例9] 除了將 MTMS/TEOS/MPTMS/APTMS/TMSPS 的比例 (莫耳比)變更為50/30/5/10/5以外,藉由與合成例8相 同的操作而獲得聚矽氧烷(A-9)。聚矽氧烷(A-9)的固Ji3] The composition, wherein in all the structural units, the ratio of _ is preferably H) mass% to 75 f white copolymerization 7. % by mass, and more preferably 20 quality; ^ =. 15% by mass to 2 4丨ί to the radiation-sensitive composition of any one of the components, wherein the component [D] is more * (the structural unit of D3 5 propyltrialkoxydecane. 彳', ., Soil-gas 57 201239531 n /pif u[I5] The radiosensing linearity described in any one of [39] to [44] is 100 parts by mass of the above-mentioned polyoxoxime, and the component [D] ^ 罝 (four) is 1 part by mass to 45 parts by volume, more preferably 2 parts by mass to ~4 〇: more, parts by mass to 35 parts by mass, better in the step-by-step 〜 刀 0 ~ 0 quality reading 'and then preferably 3 parts by mass ~ 25 The mass-sensing linearity 3 described in any one of [1] to [45] has at least one selected from the group consisting of organic particles and inorganic particles as a component [E] [45] The radiation-sensitive linear composition is characterized in that the content of the component [Ε] of the mass fraction of the second and second chambers is preferably 1 mass 篁 胄, more preferably 10 parts by mass to 200 parts by mass, and further preferably The radiation sensitive composition according to any one of the above [1] to [47] further contains a solvent as the component [F]. μ ^9] as described in the above [48] Recorded radiation The linear composition contains a relatively protonic paste and a more desirable riding solvent as a component. [5〇] The radiation sensitive composition as described in [48] or [49] above, i 1 1 〇 0 parts by mass, the content of the component [F] is preferably 罝 叫 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The radiation-sensitive ί 崎 崎 赖 控 控 控 臈 臈 臈 臈 臈 臈 臈 臈 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 问 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ The method of forming the step-cured film includes the following steps (1) sexy radiation ray step), at least partial irradiation of the coating film formed in the step (1), and irradiation with the radiation (3) a step of developing the film of the step (2) with an alkali developer; and (4) a step of heating the developed film in the step (3). [54] The formation method according to the above [53], wherein the radiation in the step (2) contains radiation preferably having a wavelength of from 190 nm to 450 nm, more preferably ultraviolet light having a wavelength of 365 nm. [55] The formation method according to the above [53] or [54], wherein a non-computer-developed developer is used as the secret developer in the step (1). [Cross Example] The present invention will be more specifically described below by way of Synthesis Examples and Examples, but the present invention is not limited to the following examples. The weight average molecular weight (Mw) and the number average molecular weight (Mn) of the polyoxyalkylene obtained by each of the following synthesis examples are gel permeation chromatography (GdPermeati〇nChr〇mat〇graphy, gpc) of the following specifications. To determine. Device · GPC-101 (manufactured by Showa Denko Electric Co., Ltd.) Pipe column. Manufactured by GPC-KF-801, GPC-KF-802, GPC-KF-803 59 201239531 41 /l/pif and GPC804 (Showa Denko) Synthesis Example of Polyoxane Connecting the Mobile Phase: Tetrahydronaphthene Component [Synthesis Example 1] A single part of propylene glycol is added to a container with a scrambler, followed by addition of methyltrimethoxy ( Hereinafter, it is referred to as "MTMs = parts by mass, tetraethoxy Wei (TE〇s) 12 parts by mass, and "Hi Shixiji" propyl adenosine (hereinafter referred to as "TMs ^: oxy group (MTMS/TEOS/). TMSPS (Morby) = 8 〇 / 1 parts by mass: After the temperature of the solution reaches the temperature, add two parts of work, ion exchange water mass parts, heat to listen, negatively cool to 45 < t after 'add as dehydration When the original acid of the agent is _ t, it is stirred for 1 hour, and then the temperature of the solution is adjusted to 40. 匚, -Berry, and the surface is evaporated, thereby removing the ion-exchanged water and the methanol by the water. The solid content concentration of the calcined oxygen (4) obtained by the above operation was 30% by mass: 2); the oxygen (Mw) was 2,500, and the degree of dispersion (Mw/Mn) was 22. In addition: The term "solid component" in the book refers to the remaining component obtained by removing the volatile matter by using a 17-well hot plate to dry the sample for 1 hour. You [Synthesis Example 2] used 3-methylpropene MPTMS") in the case of 68/15/15/2, in addition to the synthesis example! The same operation was carried out to obtain a polyglycoloxypropyltrimethoxysulfonate (hereinafter referred to as MTMS/TEOS/MPTMS/TMSPS (Morbi) 201239531 41 /1/plf oxime (excluding MTMS, TEOS and TMSPS). A-2) The polysiloxane (a-2) has a solid content concentration of 30% by mass, a weight average molecular weight (Mw) of 2,300, and a degree of dispersion (Mw/Mn) of 2. [Synthetic Example 3] Polyoxane (A-3) was obtained by the same operation as in Synthesis Example 2 except that the ratio (mol ratio) of MTMS/TEOS/MPTMS/TMSPS was changed to 62/15/15/8. The solid content concentration of (A-3) was 30% by mass, the weight average molecular weight (Mw) was 2,200, and the degree of dispersion (Mw/Mn) was 2.1. [Synthesis Example 4] In addition to the ratio of MTMS/TEOS/MPTMS/TMSPS ( Polyoxane (A-4) was obtained by the same operation as in Synthesis Example 2 except that the molar ratio was changed to 55/15/15/15. The solid concentration of polyoxyalkylene (A-4) was 30% by mass, a weight average molecular weight (Mw) of 2,200, and a degree of dispersion (Mw/Mn) of 2.3. [Synthesis Example 5] In addition to MTMS, TEOS and TMSS, MPTMS and phenyltrimethoxy decane (hereinafter referred to as for PTMS") was used in the ratio of MTMS/TEOS/PTMS/MPTMS/TMSPS (Morby) = 50/15/15/15/5, except that the same operation as in Synthesis Example 1 was carried out to obtain polyfluorene oxide. The alkane (A-5). The polysiloxane (A-6) had a solid content concentration of 30% by mass, a weight average molecular weight (Mw) of 1,900, and a degree of dispersion (Mw/Mn) of 1.9. [Synthesis Example 6 ] 61 201239531 41 /1/pif In addition to MTMS, TEOS and TMSS, 3-acryloxypropyltrimethoxydecane (hereinafter referred to as "APTMS") is used as MTMS/TEOS/APTMS/TMSPS (Morbi) A polyoxane (A-6) was obtained by the same operation as in Synthesis Example 1, except that the ratio of 65/15/15/5 was used. The solid content of polyoxane (A-6) was obtained. The concentration was 30% by mass, and the weight average molecular weight (Mw) was 2,400' dispersion (Mw/Mn) was 2 to 3. [Synthesis Example 7] In addition to changing the ratio of MTMS/TEOS/APTMS/TMSPS (Mohr ratio) to 50/ A polyoxyalkylene (A-7) was obtained by the same operation as in Synthesis Example 6 except for 30/15/5. The solid concentration of polyoxymethane (A-7) was 30% by mass, and the weight average molecular weight ( Mw) is 3,500, dispersion (Mw/Mn) 2.4. [Synthesis Example 8] In addition to MTMS, TEOS, and TMSS, MPTMS and APTMS were used in the ratio of MTMS/TEOS/MPTMS/APTMS/TMSPS (Morby)=77/7/1/10/5, among other things. Polyoxane (A-8) was obtained by the same operation as in Synthesis Example 1. The polysiloxane (A-8) had a solid content concentration of 30% by mass, a weight average molecular weight (Mw) of 2,000, and a degree of dispersion (Mw/Mn) of 2.0. [Synthesis Example 9] Polyfluorene was obtained by the same operation as in Synthesis Example 8, except that the ratio (mol ratio) of MTMS/TEOS/MPTMS/APTMS/TMSPS was changed to 50/30/5/10/5. Alkane (A-9). Solidification of polyoxyalkylene (A-9)

62 201239531 41717pif 體成分濃度為30質量%,重量平均分子量(Mw)為3,400, 分散度(Mw/Mn)為2.3。 [合成例10] 除了將 MTMS/TEOS/MPTMS/APTMS/TMSPS 的比例 (莫耳比)變更為15/62/8/10/5以外,藉由與合成例8相 同的操作而獲得聚矽氧烷(A-10)。聚矽氧烷(A-10)的 固體成分濃度為30質量%,重量平均分子量(Mw)為 5,400,分散度(Mw/Mn)為 2.6。 [合成例11] 除了將 MTMS/TEOS/MPTMS/APTMS/TMSPS 的比例 (莫耳比)變更為50/30/10/5/5以外,藉由與合成例8相 同的操作而獲得聚矽氧烷(A-11)。聚矽氧烷(A-11)的 固體成分濃度為30質量%,重量平均分子量(Mw)為 3,100,分散度(Mw/Mn)為 2.3。 [合成例12] 除了將 MTMS/TEOS/MPTMS/TMSPS 的比例(莫耳 比)變更為50/30/15/5以外,藉由與合成例2相同的操作 而獲得聚矽氧烷(A-12)。聚矽氧烷(A-12)的固體成分 濃度為30質量%,重量平均分子量(Mw)為5,000,分散 度(Mw/Mn)為 2.0。 [合成例13] 除了將MTMS/TEOS/APTMS/TMSPS的比例(莫耳比) 變更為50/30/15/5以外,藉由與合成例6相同的操作而獲 得聚矽氧烷(A-13)。聚矽氧烷(A-13)的固體成分濃度 63 201239531 41 /l/pif 為30質量%,重量平均分子量(Mw)為5,000,分散度 (Mw/Mn)為 2.3。 [合成例14] 除了將MTMS/TEOS/TMSPS的比例(莫耳比)變更 為60/3(V10以外’藉由與合成例1相同的操作而獲得聚石夕 氧烷(A-14)。聚矽氧烷(A-14)的固體成分濃度為28質 量%,重量平均分子量(Mw)為5,000,分散度(Mw/Mn) 為 2.0。 [比較合成例1] 使用 APTMS 代替 TEOS ,並設定為 MTMS/APTMS/TMSPS (莫耳比)=80/15/5 的比例,除此 以外,藉由與合成例1相同的操作而獲得聚矽氧烷(a_l)。 聚矽氧烷(a-Ι)的固體成分濃度為30質量%,重量平均 分子量(Mw)為2,000 ’分散度(Mw/Mn)為1.9。 [比較合成例2] 使用MPTMS及APTMS代替TEOS,並設定為 MTMS/MPTMS/APTMS/TMSPS (莫耳比)=80/5/10/5 的比 例,除此以外,藉由與合成例1相同的操作而獲得聚石夕氧 烷(a-2)。聚矽氧烷(a-2)的固體成分濃度為3〇質量%, 重量平均分子量(Mw)為2,000,分散度(Mw/Mn)為 1,9。 [比較合成例3] 使用 APTMS 代替 TMSPS ,並設定為 MTMS/TEOS/APTMS (莫耳比)=70/15/15 的比例,除此 64 201239531 41717pif 以外,藉由與合成例丨相^ 聚石夕氧烧U-3)的固體成分濃度為%質量%, 分子量(MW)為2,_,分散度(Mw/論)為21。 [比較合成例4] 不使用TMSPS,且使用苯基三甲氧基魏(以下 「PTMS」)代替TEOS ’並設定為MTMS/pTMS (莫匕’、 =70/30的比例’除此以外,藉由與合成例6相同的操 獲得聚魏燒(a-4)。聚魏炫(a_4)的固體成分濃 29質量% ’重量平均分子量(Mw)為6,〇〇〇 声 (Mw/Mn)為 2.0。 又 [比較合成例5] 於500 mL的三口燒瓶中放入MTMS 27 2 g及巯美 丙基三曱氧基矽烷(MEPTMS) 39.2 g,於其中添加== 醇甲醚100 g並使其溶解,對所得的混合溶液一面^由: 力攪拌器(magnetic stirrer)進行攪拌一面加溫至/〇它。 MTMS/MEPTMS (莫耳比)=50/50。於其中用i小時連續 添加含有1質量%的草酸的離子交換水8_6g。然後,於6〇t 下反應4小時後’將所得的反應液冷卻至室溫。然後,將 作為反應副產物的醇成分自反應液中減壓蒸顧去除。#_ 以上操作而獲得聚矽氧烷(a-5)。聚矽氧烷(a_5)的^體 成分濃度為45質量%,重量平均分子量(mw)為j 9〇〇 : 分散度(Mw/Mn)為 2.3 ^ ’ ’ 成分[D]的共聚物的合成 [合成例15] 65 201239531 Ηί / 1 /pif 於具備冷凝管及攪拌機的燒瓶中添加2,2,-偶氮雙(2,4-二曱基戊腈)5質量份及二乙二醇曱基乙基醚220質量份。 繼而添加苯乙烯(以下稱為「ST」)18質量份、曱基丙烯 酸(以下稱為rMA」)20質量份、Ν_環己基順丁烯二醢亞 月女(以下稱為「CHMI」)22質量伤及甲基丙稀酸縮水甘油 酯(以下稱為「GMA」)40質量份,進行氮氣置換,緩緩 檀拌並且將溶液的溫度上升至70°C ’將該溫度保持5小時 而進行聚合’藉此獲得含有共聚物(D-1)的溶液。所得 的共聚物溶液的固體成分濃度為31%,共聚物(d-1)的 重量平均分子量(Mw')為12,500 ’分散度(MwVMn,)為 2.5。 [合成例16] 使用曱基丙烯酸二環戊酯(以下稱為「DCM」)及對 羥基曱基丙烯腈(以下稱為「HMAd」)代替CHMI,並設 定為 ST/GMA/MA/DCM/HMAd (重量比)=20/14/5/21/40 的比例’除此以外’藉由與合成例15相同的操作而獲得共 聚物(D-2)。共聚物(D-2)的固體成分濃度為32質量%, 重量平均分子量(Mw’)為13,〇〇〇,分散度(Mw,/Mn·)為 2.0。 [合成例17] 使用3-曱基丙烯醯氧基丙基三甲氧基矽烷(MPTMS) 代替ST及CHMI,並設定為MA/GMA/MPTMS (重量比) =5/65/30的比例,除此以外,藉由與合成例15相同的操作 而獲得共聚物(D-3)。共聚物(d-3)的固體成分濃度為62 201239531 41717pif The body component concentration was 30% by mass, the weight average molecular weight (Mw) was 3,400, and the degree of dispersion (Mw/Mn) was 2.3. [Synthesis Example 10] Polyfluorene was obtained by the same operation as in Synthesis Example 8, except that the ratio (mol ratio) of MTMS/TEOS/MPTMS/APTMS/TMSPS was changed to 15/62/8/10/5. Alkane (A-10). The polysiloxane (A-10) had a solid content concentration of 30% by mass, a weight average molecular weight (Mw) of 5,400, and a degree of dispersion (Mw/Mn) of 2.6. [Synthesis Example 11] Polyfluorene was obtained by the same operation as in Synthesis Example 8, except that the ratio (mol ratio) of MTMS/TEOS/MPTMS/APTMS/TMSPS was changed to 50/30/10/5/5. Alkane (A-11). The polysiloxane (A-11) had a solid content concentration of 30% by mass, a weight average molecular weight (Mw) of 3,100, and a degree of dispersion (Mw/Mn) of 2.3. [Synthesis Example 12] Polyoxane (A-) was obtained by the same operation as in Synthesis Example 2 except that the ratio (mol ratio) of MTMS/TEOS/MPTMS/TMSPS was changed to 50/30/15/5. 12). The polysiloxane (A-12) had a solid content concentration of 30% by mass, a weight average molecular weight (Mw) of 5,000, and a degree of dispersion (Mw/Mn) of 2.0. [Synthesis Example 13] Polyoxane (A-) was obtained by the same operation as in Synthesis Example 6, except that the ratio (mol ratio) of MTMS/TEOS/APTMS/TMSPS was changed to 50/30/15/5. 13). The solid content concentration of polyoxyalkylene (A-13) 63 201239531 41 /l/pif was 30% by mass, the weight average molecular weight (Mw) was 5,000, and the degree of dispersion (Mw/Mn) was 2.3. [Synthesis Example 14] The polyoxin (A-14) was obtained by the same operation as in Synthesis Example 1 except that the ratio (mol ratio) of MTMS/TEOS/TMSPS was changed to 60/3 (V10. The polysiloxane (A-14) had a solid content concentration of 28% by mass, a weight average molecular weight (Mw) of 5,000, and a degree of dispersion (Mw/Mn) of 2.0. [Comparative Synthesis Example 1] APTMS was used instead of TEOS, and set. Polyoxane (a-1) was obtained by the same operation as in Synthesis Example 1 except for the ratio of MTMS/APTMS/TMSPS (Morby) = 80/15/5. Polyoxane (a-) Ι) has a solid content concentration of 30% by mass, and a weight average molecular weight (Mw) of 2,000' dispersion degree (Mw/Mn) of 1.9. [Comparative Synthesis Example 2] Using MPTMS and APTMS instead of TEOS, and setting it to MTMS/MPTMS/ In addition to the ratio of APTMS/TMSPS (Morby) = 80/5/10/5, polyoxocycloalkane (a-2) was obtained by the same operation as in Synthesis Example 1. Polyoxane ( The solid content concentration of a-2) was 3% by mass, the weight average molecular weight (Mw) was 2,000, and the degree of dispersion (Mw/Mn) was 1,9. [Comparative Synthesis Example 3] APTMS was used instead of TMSS, and was set to The ratio of MTMS/TEOS/APTMS (Morby)=70/15/15, in addition to the 64 201239531 41717pif, the solid concentration of the compound by the synthesis method 聚 聚 氧 氧 氧 -3 U-3) %, molecular weight (MW) is 2, _, and the degree of dispersion (Mw/discussion) is 21. [Comparative Synthesis Example 4] TMPS was not used, and phenyltrimethoxywei (hereinafter "PTMS") was used instead of TEOS' and was set to MTMS/pTMS (proportion of Moh', = 70/30) The polysulfide (a-4) was obtained by the same operation as in Synthesis Example 6. The solid content of the polyweixuan (a-4) was 29% by mass. The weight average molecular weight (Mw) was 6, and the snoring (Mw/Mn) was obtained. 2.0. [Comparative Synthesis Example 5] In a 500 mL three-necked flask, MTMS 27 2 g and trimethoprimic acid decane (MEPTMS) 39.2 g were placed, and == alcohol methyl ether 100 g was added thereto. To dissolve it, the obtained mixed solution was heated to /〇 by stirring with a magnetic stirrer. MTMS/MEPTMS = 50/50, in which it was continuously added for 1 hour. 8 to 6 g of ion-exchanged water containing 1% by mass of oxalic acid. Then, after reacting at 6 Torr for 4 hours, the resulting reaction solution was cooled to room temperature. Then, the alcohol component as a by-product of the reaction was decompressed from the reaction solution. Steam removal. #_ The above operation gave polyoxyalkylene (a-5). The concentration of the polysiloxane (a_5) was 45 mass%. The average molecular weight (mw) is j 9 〇〇: the dispersion (Mw/Mn) is 2.3 ^ ' ' The synthesis of the copolymer of the component [D] [Synthesis Example 15] 65 201239531 Ηί / 1 /pif with a condenser tube and 5 parts by mass of 2,2,-azobis(2,4-dimercapto valeronitrile) and 220 parts by mass of diethylene glycol decyl ethyl ether were added to the flask of the stirrer. Styrene was added (hereinafter referred to as " ST") 20 parts by mass of thioglycolic acid (hereinafter referred to as rMA) 20 parts by mass, Ν_cyclohexyl-butenylene hydrazine (hereinafter referred to as "CHMI") 22 mass-damaged methacrylic acid 40 parts by mass of glycidyl ester (hereinafter referred to as "GMA"), nitrogen substitution, slow sandalwood mixing, and raising the temperature of the solution to 70 ° C. 'The temperature was maintained for 5 hours to carry out polymerization', thereby obtaining a copolymer containing A solution of (D-1). The obtained copolymer solution had a solid content concentration of 31%, and the copolymer (d-1) had a weight average molecular weight (Mw') of 12,500' dispersion (MwVMn) of 2.5. Example 16] Dicyclopentyl methacrylate (hereinafter referred to as "DCM") and p-hydroxydecyl acrylonitrile (hereinafter referred to as "HMAd") The copolymer was obtained by the same operation as in Synthesis Example 15 except that the ratio of ST/GMA/MA/DCM/HMAd (weight ratio)=20/14/5/21/40 was set instead of CHMI. D-2) The copolymer (D-2) had a solid content concentration of 32% by mass, a weight average molecular weight (Mw') of 13, and a degree of dispersion (Mw, /Mn·) of 2.0. [Synthesis Example 17] Instead of ST and CHMI, 3-mercaptopropoxypropyltrimethoxydecane (MPTMS) was used, and the ratio of MA/GMA/MPTMS (weight ratio) = 5/65/30 was set. Except that, the copolymer (D-3) was obtained by the same operation as in Synthesis Example 15. The solid content concentration of the copolymer (d-3) is

S 66 201239531 41717pif 31.5質量%,重量平均分子量(Mw’)為12,000,分散度 (Mw'/Mn,)為 2.3。 [合成例18] 使用 MPTMS 代替 CHMI , 並設定為 ST/GMA/MA/MPTMS (重量比)=10/55/5/30 的比例,除 此以外,藉由與合成例15相同的操作而獲得共聚物 (D-4)。共聚物(D-4)的固體成分濃度為31.3質量%, 重量平均分子量(Mw')為11,500,分散度(Mw,/Mn,)為 2.3。 [合成例19] 除了 ST、CHMI、GMA及MA以外,更使用MPTMS, 並設定為 ST/GMA/MA/CHMI/MPTMS (重量比) =10/45/5/10/30的比例’除此以外,藉由與合成例15相同 的操作而獲得共聚物(D-5)。共聚物(D_5)的固體成分 濃度為31.7質量% ’重量平均分子量(Mw,)為12,〇〇〇, 分散度(Mw,/Mn,)為 2.0。 [合成例20] 於具備冷凝官及授拌機的燒瓶中,添加2,2,_偶氮雙 一甲基戊腈)4.G f量份及二乙二醇曱基乙基醚245質 ΓΓ繼而添加MA 18質量份、〇嫩38質量份、ST5質 2質1份,進行氮氣置換後,緩緩麟並且 口产上以下稱$「BD」)5質量份,使所得溶液 得該溫度保持4小時而進行聚合,獲 /、♦ °共聚物(D_6)的固體成分濃度為29.3 67 201239531 ^Tl / 1 /pif 質量%,重量平均分子量(Mw,)為2〇,〇〇〇,分散度 (Mw'/Mn’)為 2.0。 感放射線性組成物的製備、以及保護膜及層間絕緣膜 的形成 ' [實例1] 於含有合成例1中所得的聚矽氧烷(Α_υ的溶液(以 固體成分換算計為100質量份)巾,添加作為成分间的 (Β-1)二季戊四醇六丙烯酸酯與二季戊四醇五丙烯酸酯的 混合物(莫耳比為50/50 ) 20質量份、作為成分[c]的(c_ j ) 乙酮,1-[9-乙基-6_(2-甲基苯甲醯基)_9Η_咔唑_3基], 乙醯基肟)3質量份,進而以固體成分濃度成為乃質量%的 方式添加丙二醇單甲醚及乙二醇單丁醚的混合溶劑(混合 比例為80/20w/w%) ’製備感放射線性組成物。 繼而,使用旋轉器(spinner)將該感放射線性組成物 塗佈於Si〇2浸潰玻璃基板上後,於熱板上於9〇它下預烘 烤2分鐘而形成塗膜(後述的IT〇密接性評價中使用附有 =〇的基板)。繼而,對所得的塗膜以3〇〇 mJ/cm2的曝光 量而曝光紫外線。接著,利用2 38質量%氫氧化四曱基銨 水洛液於25 C下顯影60秒後,以純水清洗1分鐘,進而 於230°C的烘箱中加熱6〇分鐘,藉此形成膜厚為2 〇 的保護膜。 另外,以加熱後的膜厚成為3〇μίη的方式調節塗膜形 成時的旋轉器的轉速,隔著具有2〇μιη、3〇μιη、4〇μηι、 50 μιη的尺寸的接觸孔圖案的光罩,以15〇 的曝光間隙S 66 201239531 41717 pif 31.5% by mass, weight average molecular weight (Mw') was 12,000, and degree of dispersion (Mw'/Mn,) was 2.3. [Synthesis Example 18] The same operation as in Synthesis Example 15 was carried out except that MPTMS was used instead of CHMI and set to a ratio of ST/GMA/MA/MPTMS (weight ratio) = 10/55/5/30. Copolymer (D-4). The copolymer (D-4) had a solid content concentration of 31.3% by mass, a weight average molecular weight (Mw') of 11,500, and a degree of dispersion (Mw, /Mn,) of 2.3. [Synthesis Example 19] In addition to ST, CHMI, GMA, and MA, MPTMS was used, and the ratio of ST/GMA/MA/CHMI/MPTMS (weight ratio) = 10/45/5/10/30 was set. The copolymer (D-5) was obtained by the same operation as in Synthesis Example 15 except for the same procedure. The solid content of the copolymer (D_5) was 31.7% by mass. The weight average molecular weight (Mw) was 12, and the degree of dispersion (Mw, /Mn) was 2.0. [Synthesis Example 20] 2,2,-azobis monomethylvaleronitrile)4.G f parts and diethylene glycol decyl ethyl ether 245 were added to a flask equipped with a condenser and a mixer. Then, 18 parts by mass of MA, 38 parts by mass of sputum, and 1 part of ST5 are added, and after nitrogen substitution, 5 parts by mass of the following "$BD" is produced in the mouth and the resulting solution is obtained. The polymerization was carried out for 4 hours, and the solid content concentration of the copolymer (D_6) was 29.3 67 201239531 ^Tl / 1 /pif mass%, and the weight average molecular weight (Mw,) was 2〇, 〇〇〇, dispersed. The degree (Mw'/Mn') was 2.0. [Preparation of a radiation-sensitive composition and formation of a protective film and an interlayer insulating film [Example 1] A solution containing a polysiloxane (a solution of Α_υ (100 parts by mass in terms of solid content) obtained in Synthesis Example 1 a mixture of (Β-1) dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate (mol/r ratio 50/50) as 20 mg parts by weight of (c_j) ethyl ketone as component [c], 3 parts by mass of 1-[9-ethyl-6-(2-methylbenzhydryl)_9Η-carbazole-3-yl], ethoxylated hydrazine), and further added propylene glycol so that the solid content concentration becomes mass% A mixed solvent of monomethyl ether and ethylene glycol monobutyl ether (mixing ratio of 80/20 w/w%) 'Preparation of a radiation sensitive composition. Then, the radiation sensitive composition was applied onto a Si〇2 impregnated glass substrate using a spinner, and then prebaked on a hot plate at 9 Torr for 2 minutes to form a coating film (IT described later) A substrate with =〇 was used for the evaluation of the adhesion. Then, the obtained coating film was exposed to ultraviolet rays at an exposure amount of 3 〇〇 mJ/cm 2 . Then, it was developed by using 238% by mass of tetradecyl ammonium hydroxide in water at 60 C for 60 seconds, then washed with pure water for 1 minute, and further heated in an oven at 230 ° C for 6 minutes to form a film thickness. It is a protective film of 2 inches. Further, the rotation speed of the rotator at the time of forming the coating film was adjusted so that the film thickness after heating was 3 〇 μίη, and light having a contact hole pattern having a size of 2 μm, 3 μm, 4 μm, and 50 μm was interposed therebetween. Cover with 15 曝光 exposure gap

S 68 201239531 41717pif +(基板與光罩的間隔)進行曝光,除此以外,與上述保護 膜形成同樣地形成層間絕緣膜。 對所得的保護膜、層間絕緣膜進行下述物性評價。其 結果一併示於表1中。 物性評價 1)保遵膜的耐熱透明性 葉十。具有如上所述般形成的保護膜的基板於潔淨烘箱中 於250C下加熱1小時,使用分光光度計(曰立製作所(股) 製造的150-20型雙射束)對加熱前後的波長4〇〇 nm下的 光線透射率(%)進行測定,然後依照下述式來計算耐熱 透明性(%)。該值為4%以下時,判斷保護膜的耐熱透明 性為良好。 耐熱透明性(%)=加熱前的光線透射率(%) _加熱 後的光線透射率(%) 2) 保護膜的鉛筆硬度 對具有如上所述般形成的保護膜的基板藉由rJIS K-5400-1990的8.4.1錯筆劃痕試驗」來測定保護膜的錯筆 硬度(表面硬度)。該值為4H或更大時,判斷保護膜的表 面硬度為良好。 3) 保護膜的财擦傷性 對具有如上所述般形成的保護膜的基板使用學振型磨 損試驗機’於鋼絲絨#〇〇〇〇上施加200 g的負重並往返1〇 69 201239531 T 丄 / i / jJlf" 次。以肉眼按以下判定基準來評價擦傷的狀況。當評分為 ◎或〇時,判斷具有良好的耐擦傷性。 判定基準 ◎:完全未受損傷, 〇 :有1條〜3條傷痕, △.有4條〜10條傷痕, X :有10條以上的傷痕。 4) 保護膜的耐熱龜裂 對具有如上所述般形成的保護膜的基板於30(TC下進 行30分鐘追加煅燒,然後於2;rc下放置24小時,根據以 下的判定基準,使用雷射顯微鏡(基恩斯(Keyence)製造 的VK-8500)來確認該保護膜表面是否產生了龜裂。當評 分為◎或〇時,判斷耐熱龜裂為良好。 判定基準 ◎:毫無龜裂, 〇 :有1個〜3個龜裂, △:有4個〜1〇個龜裂, x :有10個以上的龜裂。 5) 保護膜的ITO密接性 使用附有ITO的基板代替Si〇2浸潰玻璃基板,除此以 外’藉由與上述相同的操作而形成保護膜,進行壓力鍋試 驗(120°C、濕度1〇〇%、4小時)。其後,進行「JIS K-5400-1990的8.5.3附著性網格膠帶法」,求出1〇〇個網 格中殘留的網格數’評價保護膜的IT〇密接性。於1〇〇個 201239531 Hi/1/pif 網格中殘留的網格數為80個以下的情形時,判斷IT〇密 接性為不良。 6) 保護膜的感度 對藉由與上述相同的操作而形成的塗膜使用曝光機 (TME-400PRJ ’ Topcon (股)製造),隔著具有 1〇 μηι/3〇 μηι的線與間隙(line and space)的圖案的遮罩使曝光量變 化而進行曝光後,利用〇.〇4質量%的KOH水溶液於25°C 下用浸潰法顯影60秒鐘。繼而’以超純水進行1分鐘流水 清洗,加以乾燥而於玻璃基板上形成圖案。此時,對忉 μιη/30 μιη的線與間隙的圖案未剥離而殘留所需要的最小 曝光量進行測定。將該最小曝光量作為放射線感度而進 評價。最小曝光量為1〇〇 mj/cm2以下時,判斷感度為良句^ 再者’將無法形成圖案的情形評價為x。 7) 層間絕緣膜的解析度 於上述層間絕緣膜的形成中,對可解析的接觸孔 尺寸進行測定。若可解析30 μηι以下的接觸孔圖案,則李、 斷解析性為良好。再者,將無法形成圖案的情形評價為χ 1 8)保護膜的K〇H顯影性 、”。 對如上所述般形成的具有保護臈的基板形成3〇 的塗佈膜,利用Μ4 f量%的K〇H水溶液於坑下用= 潰法顯影60秒鐘。然後進行水洗,用光賴微鏡觀, 於基板上的膜殘渣的有無,按以下的判定基準進行評價召 再者,未確認到膜殘渣的情形時,判斷K〇H顯影性^ ; 子 方面,於基板全面上確認到膜殘逢的情形時, 71 201239531 Hi / i /pif 判辦無KOH顯影性,為不良。 判定基準 〇:未確認到膜殘渣 △:確認到稍許膜殘渣 x:於基板全面上確認到膜殘渣 [實例2〜實例is及比較例1〜比較例4] 除了使各調配成分的種類及調配量(質量份)如表1 所記載以外’與實例丨同樣地製備感放射線性組成物。繼 而’使用所得的感放射線性組成物,與實例1同樣地形成 保護膜及層間絕緣膜。對所得的保護膜及層間絕緣膜進行 與實例1相同的物性評價。將其結果一併示於表1中。 [實例16〜實例26及比較例5〜比較例7] 除了使各調配成分的種類及調配量(質量份)如表2 所記載以外,與實例1同樣地製備感放射線性組成物。繼 而,使用所得的感放射線性組成物,與實例1同樣地形成 保護膜及層間絕緣膜。對所得的保護膜及層間絕緣膜進行 與實例1相同的物性評價。將其結果一併示於表1中。 再者,表1及表2中,成分[A]、成分[B]、成分[C]、 成分[D]及成分[E]的各記號分別表示以下物品。 成分[A] Α-Ϊ : MTMS/TEOS/TMSPS=80/15/5 (mol%) A-2 : MTMS/TEOS/MPTMS/TMSPS=68/l 5/15/2 (m〇l%) A-3 : MTMS/TEOS/MPTMS/TMSPS=62/15/15/8 72 201239531 41/1/plf (mol% ) A-4 : MTMS/TEOS/MPTMS/TMSPS=55/l 5/15/15 (mol% ) A-5 : MTMS/TEOS/PTMS/MPTMS/TMSPS=50/15/15/15/5 (mol% ) A-6 : MTMS/TEOS/APTMS/TMSPS=65/l 5/15/5( mol% ) A-7 : MTMS/TEOS/APTMS/TMSPS=50/30/15/5( mol% ) A-8 : MTMS/TEOS/MPTMS/APTMS/TMSPS=77/7/l/10/5 (mol%) » lcVld1=0.1 A-9 : MTMS/TEOS/MPTMS/APTMS/TMSPS=50/30/5/10/5 (mol%) 5 lcVld1=0.5 A-10 :An interlayer insulating film is formed in the same manner as the above-described protective film formation except that exposure is performed in the case of the above-mentioned protective film. The obtained protective film and interlayer insulating film were evaluated for the following physical properties. The results are shown together in Table 1. Physical property evaluation 1) Heat-resistant transparency of the film according to the film. The substrate having the protective film formed as described above was heated in a clean oven at 250 C for 1 hour, and a wavelength of 4 前后 before and after heating was measured using a spectrophotometer (150-20 type double beam manufactured by Sigma). The light transmittance (%) at 〇 nm was measured, and then heat-resistant transparency (%) was calculated according to the following formula. When the value is 4% or less, it is judged that the heat-resistant transparency of the protective film is good. Heat-resistant transparency (%) = light transmittance before heating (%) _ light transmittance after heating (%) 2) Pencil hardness of protective film For a substrate having a protective film formed as described above by rJIS K- The error of the protective film (surface hardness) was measured by the 8.4.1 pen stroke test of 5400-1990. When the value is 4H or more, it is judged that the surface hardness of the protective film is good. 3) The scratch resistance of the protective film The substrate having the protective film formed as described above was subjected to a load of 200 g on a steel wool pile #〇〇〇〇 using a vibration-type wear tester's and transferred back and forth 1〇69 201239531 T 丄/i / jJlf" times. The condition of the scratch was evaluated by the naked eye according to the following criteria. When the score is ◎ or 〇, it is judged to have good scratch resistance. Judgment criteria ◎: No damage at all, 〇: There are 1 to 3 scars, △. There are 4 to 10 scars, and X: There are more than 10 scars. 4) Heat-resistant cracking of the protective film The substrate having the protective film formed as described above was additionally calcined at 30°C for 30 minutes, and then placed at 2; rc for 24 hours, and the laser was used according to the following criteria. A microscope (VK-8500 manufactured by Keyence) was used to confirm whether or not cracks were formed on the surface of the protective film. When the score was ◎ or 〇, it was judged that the heat-resistant crack was good. The criterion ◎: no crack, 〇: There are 1 to 3 cracks, △: 4 to 1 crack, x: 10 or more cracks. 5) ITO adhesion of protective film. Substrate with ITO is used instead of Si〇2 In the same manner as above, a protective film was formed and a pressure cooker test (120 ° C, humidity: 1%, 4 hours) was carried out. Then, the "8.5.3 Adhesive Mesh Tape Method of JIS K-5400-1990" was carried out, and the number of meshes remaining in one cell was determined to evaluate the IT〇 adhesion of the protective film. When the number of grids remaining in one of the 201239531 Hi/1/pif grids is 80 or less, it is judged that the IT interface is poor. 6) Sensitivity of the protective film The coating film formed by the same operation as above is an exposure machine (TME-400PRJ 'Topcon) manufactured by a line and a gap having a line of 1〇μηι/3〇μηι The mask of the pattern of the space and the exposure was exposed to light, and then developed by a dipping method at 25 ° C for 60 seconds using a 4% by mass aqueous KOH solution. Then, it was washed with ultrapure water for 1 minute, and dried to form a pattern on the glass substrate. At this time, the minimum exposure amount required for the pattern of the line and the gap of 忉 μιη/30 μηη was not peeled off and measured. This minimum exposure amount was evaluated as the radiation sensitivity. When the minimum exposure amount is 1 〇〇 mj/cm2 or less, it is judged that the sensitivity is a good sentence. Further, the case where the pattern cannot be formed is evaluated as x. 7) Resolution of interlayer insulating film In the formation of the above interlayer insulating film, the size of the resolvable contact hole was measured. If the contact hole pattern of 30 μη or less can be analyzed, the analytical resolution of Li and break is good. In addition, the case where the pattern could not be formed was evaluated as χ18) K〇H developability of the protective film,” A coating film of 3 Å was formed on the substrate having the protective ruth formed as described above, and the amount of Μ4 f was used. The %K〇H aqueous solution was developed under the pit for 60 seconds by the collapse method. Then, it was washed with water, and the presence or absence of the film residue on the substrate was evaluated by the following micro-mirror. In the case of the film residue, it is judged that the K〇H developability is sub-related, and when the film is completely confirmed on the substrate, 71 201239531 Hi / i /pif is judged to have no KOH developability, which is a bad criterion. 〇: No film residue was observed Δ: A slight film residue was confirmed: Film residue was confirmed on the entire substrate [Example 2 to Example is and Comparative Example 1 to Comparative Example 4] In addition to the type and amount of each compound (quality) In the same manner as in Example 1, a radiation sensitive composition was prepared in the same manner as in Example 1. Then, using the obtained radiation sensitive linear composition, a protective film and an interlayer insulating film were formed in the same manner as in Example 1. The obtained protective film was obtained. Interlayer insulating film The same physical properties were evaluated as in Example 1. The results are shown in Table 1. [Examples 16 to 26 and Comparative Examples 5 to 7] The types and the amounts (parts by mass) of the respective components were as follows. In the same manner as in Example 1, a radiation sensitive composition was prepared in the same manner as in Example 1. Then, a protective film and an interlayer insulating film were formed in the same manner as in Example 1 using the obtained radiation sensitive composition. The obtained protective film and interlayer insulating film were obtained. The same physical property evaluation as in Example 1 was carried out. The results are shown in Table 1. Further, in Tables 1 and 2, the components [A], the components [B], the components [C], and the components [D] and The respective symbols of the component [E] indicate the following items, respectively. Component [A] Α-Ϊ : MTMS/TEOS/TMSPS=80/15/5 (mol%) A-2 : MTMS/TEOS/MPTMS/TMSPS=68/l 5/15/2 (m〇l%) A-3 : MTMS/TEOS/MPTMS/TMSPS=62/15/15/8 72 201239531 41/1/plf (mol% ) A-4 : MTMS/TEOS/MPTMS /TMSPS=55/l 5/15/15 (mol% ) A-5 : MTMS/TEOS/PTMS/MPTMS/TMSPS=50/15/15/15/5 (mol% ) A-6 : MTMS/TEOS/ APTMS/TMSPS=65/l 5/15/5( mol% ) A-7 : MTMS/TEOS/APTMS/TMSPS=50/30/15/5( mol% ) A-8 : MTMS/TEOS/MPTMS /APTMS/TMSPS=77/7/l/10/5 (mol%) » lcVld1=0.1 A-9 : MTMS/TEOS/MPTMS/APTMS/TMSPS=50/30/5/10/5 (mol%) 5 lcVld1=0.5 A-10 :

MTMS/TEOS/MPTMS/APTMS/TMSPS= 15/62/8/10/5 (mol%),lcVldLOJ A-ll : MTMS/TEOS/MPTMS/APTMS/TMSPS=50/30/10/5/5 (mol%) > lc1/ld1=2.0 A-12 : MTMS/TEOS/MPTMS/TMSPS=50/30/15/5 (mol% ) A-13 : MTMS/TEOS/APTMS/TMSPS=50/30/15/5 (mol% ) 73 201239531 41 /1/pif A-14 : MTMS/TEOS/TMSPS=60/30/10 (mol%) a-1 : MTMS/APTMS/TMSPS=80/15/5 (mol%) a-2 : MTMS/MPTMS/APTMS/TMSPS=80/5/10/5 (mol% ) a-3 : MTMS/TEOS/APTMS=70/15/15 (mol%) a-4 : MTMS/PTMS=70/30 (mol%) a-5 : MTMS/MEPTMS=50/50 (mol%) 成分[B] B-l:二季戊四醇六丙烯酸酯與二季戊四醇五丙烯酸酯 的混合物(莫耳比為50/50),(商品名:DPHA,日本化藥 公司製造) B-2:季戊四醇三丙烯酸醋(新中村化學工業公司製造) B-3 :琥珀酸改質二季戊四醇五丙烯酸酯(商品名: AronixM-520,東亞合成公司製造) B-4 :三(丙烯醯氧基乙基)異三聚氰酸酯(商品名: AronixM-315,東亞合成公司製造) B-5 :含有多官能丙烯酸聚胺酯系化合物的市售品(商 品名:KAYRAD DPHA-40H,日本化藥公司製造) 成分[C]MTMS/TEOS/MPTMS/APTMS/TMSPS= 15/62/8/10/5 (mol%), lcVldLOJ A-ll : MTMS/TEOS/MPTMS/APTMS/TMSPS=50/30/10/5/5 (mol %) > lc1/ld1=2.0 A-12 : MTMS/TEOS/MPTMS/TMSPS=50/30/15/5 (mol% ) A-13 : MTMS/TEOS/APTMS/TMSPS=50/30/15/ 5 (mol% ) 73 201239531 41 /1/pif A-14 : MTMS/TEOS/TMSPS=60/30/10 (mol%) a-1 : MTMS/APTMS/TMSPS=80/15/5 (mol%) A-2 : MTMS/MPTMS/APTMS/TMSPS=80/5/10/5 (mol% ) a-3 : MTMS/TEOS/APTMS=70/15/15 (mol%) a-4 : MTMS/PTMS= 70/30 (mol%) a-5 : MTMS/MEPTMS=50/50 (mol%) Ingredient [B] Bl: a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate (Morby ratio 50/50) (trade name: DPHA, manufactured by Nippon Kayaku Co., Ltd.) B-2: Pentaerythritol triacrylate vinegar (manufactured by Shin-Nakamura Chemical Co., Ltd.) B-3: succinic acid-modified dipentaerythritol pentaacrylate (trade name: Aronix M-520, B-4: Tris(propylene methoxyethyl) isocyanate (trade name: Aronix M-315, manufactured by Toagosei Co., Ltd.) B-5: Polyfunctional urethane compound containing polyfunctional acrylate Available product (trade name: KAYRAD DPHA-40H, manufactured by Nippon Kayaku Corporation) Component [C]

C-1 :乙酮,1-[9-乙基-6-(2-曱基苯曱醯基)-9H_咔唑-3-基]-,l-(0-乙醯基肟)(商品名:IRGACURE 0X02,BASF 公司製造) 02 :雙(2,4,6-三曱基苯曱醯基)-苯基氧化膦 (商品名:IRGACURE 819,BASF公司製造)C-1: ethyl ketone, 1-[9-ethyl-6-(2-mercaptophenyl)-9H-indazol-3-yl]-, l-(0-ethylindenyl) ( Product name: IRGACURE 0X02, manufactured by BASF Corporation 02: Bis(2,4,6-trimercaptophenyl)-phenylphosphine oxide (trade name: IRGACURE 819, manufactured by BASF Corporation)

S 74 201239531 4Γ/1 /pif C_3 : l,2-辛二酮,i_[4_(苯硫基)_,2_(〇_苯甲醯基肟)](商 品名:IRGACURE OXE01,BASF 公司製造) C-4 : 2-曱基-1-(4-甲硫基苯基)_2_嗎啉基丙烷-1-酮 C-5 : 2,2'-雙(2-氯苯基)-4,4,,5,5,-四苯基-1,2,-聯咪唑 C-6 : 4,4'-雙(二乙基胺基)二苯曱酮 C-7 . 2-統基苯并β塞β坐 成分[D] D-1 : ST/GMA/MA/CHMI=18/40/20/22 (wt%) D-2 : ST/GMA/MA/DCM/HMAd=20/14/5/21/40 (wt%) D-3 : MA/GMA/MPTMS=5/65/30 (wt%) D-4 : ST/GMA/MA/MPTMS=10/55/5/30 (wt%) D-5 : ST/GMA/MA/CHMI/MPTMS=10/45/5/10/30 (wt% ) D-6 : ST/GMA/MA/DCM/BD=5/38/l8/34/5 (wt%) 成分[E] E-l :聚曱基丙烯酸曱酯系微粒子(商品名:MP-300, 綜研化學公司製造) E-2 :有機矽溶膠(商品名:IPA-ST,曰產化學工業公 司製造) E-3 : Zr02溶膠(商品名:ID19卜Tayca公司製造) E-4 : Ti02溶膠(商品名:TS-103,Tayca公司製造) 75 201239531 【1<】 J-a卜Ξ寸 (牟¥鉍) 比較例 寸 m tr> X 寸 < cn O m X 寸 < CS 〇 m 00 X CN X o ro r- (N X 實例 o Ο 〇 »〇 ^T) CN ffi 卜 ◎ o Ο o yn m yrt (N X v〇 ◎ ΓΟ o ο o i〇 in CO ◎ CN o ο in r〇 ο o fn m X 寸 〇 Ο o m r-H X ◎ On 1 loo 1 CO X VO ◎ 00 100 m m X 寸 〇 卜 o ο ^T) fS 寸 X ο v〇 o ο o m 寸 寸 ο »τ» o (N CN m ffi ^T) ο 寸 100 m m ◎ m 100 m cn X <n 0 CN o *—H CO ffi ο o m 寸 X 寸 〇 種類 < A-2 A-3 A-4 A-5 A-6 A-7 i A-8 A-9 A-10 A-ll cd <N cd cn cij ώ B-2 B-3 B-4 ό C-2 ! C-4 耐熱透明性(%) 鉛筆硬度 耐擦傷性 令 m 2 201239531 J-a卜£寸 ο <N |25〇J Ο X o X X X X IT) 〇 X ο ◎ ο § o ο ◎ ο § o 〇 ◎ ο i〇 〇 ◎ ο in 〇 〇 ο g 〇 ◎ Ο 〇 ◎ ο Τ~Η 〇 ο ο ο 〇 O 〇 〇 ο S o 〇 〇 ο 〇 o 1—H 〇 〇 ο 〇 o 〇 〇 ο ο 〇 00 〇 〇 100 § o 〇 〇 W") Ον § v〇 〇 Ο Ο 〇 1—^ 〇 耐熱龜裂 ιτο密接性 /^-N fN s Η 解析度(μιη) ΚΟΗ顯影性 201239531 T1 / 1 f \Jli [表2] (質量份) 成 種類 實例 比較合 分 16 17 18 19 20 21 22 23 24 25 26 5 6 7 Α-9 100 100 100 Α-12 100 100 [A] Α-13 100 100 100 Α-14 100 100 100 a-4 100 100 a-5 5 B-l 20 20 20 20 10 20 20 20 20 60 20 20 60 B-2 10 10 [B] Β·3 10 B-4 5 10 B-5 60 60 C-l .3 3 3 3 3 3 3 3 3 5 3 3 5 C-2 3 1 1 1 1 C-3 5 [C] C-4 10 C-5 5 5 C-6 5 5 C-7 2.5 2.5 D-l D-2 50 [D] D-3 50 30 10 5 5 5 5 10 D-4 5 D-5 5 D-6 5 100 E-l 100 [E] E-2 100 E-3 100 E-4 100 耐熱透明性 (%) 5 4 3 2 3 3 3 3 3 3 4 4 5 6 鉛筆硬度 4H 5H 5H 6H 6H 5H 6H 6H 6H 6H 4H 4H 4H 4H 耐擦傷性 Δ Δ o ◎ ◎ o ◎ ◎ ◎ ◎ 0 Δ Δ Δ 耐熱龜裂 0 〇 〇 ◎ o 〇 ◎ ◎ ◎ ◎ Δ Δ Δ X ITO密接性 90 90 100 100 100 100 100 100 100 100 100 90 90 95 感度 (mJ/cm2) 80. 60 60 40 30 60 60 60 60 60 80 X 200 100 解析度 (μηι) 10 10 10 10 5 10 10 10 10 10 10 X 40 15 ΚΟΗ顯影 性 o o o o o 〇 o 〇 o 〇 〇 X Δ 〇S 74 201239531 4Γ/1 /pif C_3 : l,2-octanedione, i_[4_(phenylthio)_,2_(〇_benzothymidine)] (trade name: IRGACURE OXE01, manufactured by BASF) C-4 : 2-mercapto-1-(4-methylthiophenyl)_2-morpholinopropan-1-one C-5 : 2,2'-bis(2-chlorophenyl)-4, 4,5,5,-tetraphenyl-1,2,-biimidazole C-6 : 4,4'-bis(diethylamino)benzophenone C-7. 2-phenylene塞ββ坐成分[D] D-1 : ST/GMA/MA/CHMI=18/40/20/22 (wt%) D-2 : ST/GMA/MA/DCM/HMAd=20/14/5 /21/40 (wt%) D-3 : MA/GMA/MPTMS=5/65/30 (wt%) D-4 : ST/GMA/MA/MPTMS=10/55/5/30 (wt%) D-5 : ST/GMA/MA/CHMI/MPTMS=10/45/5/10/30 (wt% ) D-6 : ST/GMA/MA/DCM/BD=5/38/l8/34/5 (wt%) Ingredient [E] El: Poly(mercapto acrylate) microparticles (trade name: MP-300, manufactured by Amika Chemical Co., Ltd.) E-2: Organic bismuth sol (trade name: IPA-ST, 曰Chemical Industry) Manufactured by the company) E-3 : Zr02 sol (trade name: ID19, manufactured by Tayca Co., Ltd.) E-4 : Ti02 sol (trade name: TS-103, manufactured by Tayca Co., Ltd.) 75 201239531 [1<] Ja Bu Ξ inch (牟¥铋) Comparative example m tr> X inch < cn O m X inch < CS 〇m 00 X CN X o ro r- (NX example o Ο 〇»〇^T) CN ffi 卜 o Ο o yn m yrt (NX v〇 ◎ ΓΟ o ο oi〇in CO ◎ CN o ο in r〇ο o fn m X inch 〇Ο om rH X ◎ On 1 loo 1 CO X VO ◎ 00 100 mm X inch oo o ο ^T) fS inch X ο v〇o ο om 寸 inch » τ» o (N CN m ffi ^T) ο inch 100 mm ◎ m 100 m cn X <n 0 CN o *—H CO ffi ο om inch X inch 〇 type < A-2 A-3 A-4 A-5 A-6 A-7 i A-8 A-9 A-10 A-ll cd <N cd cn cij ώ B-2 B-3 B-4 ό C -2 ! C-4 Heat-resistant transparency (%) Pencil hardness and scratch resistance m 2 201239531 Ja <N |25〇J Ο X o XXXX IT) 〇X ο ◎ ο § o ο ◎ ο § o 〇 ◎ ο i〇〇 ◎ ο in 〇〇ο g 〇 Ο Ο 〇 ◎ ο Τ Η 〇 ο ο 〇O 〇〇ο S o 〇〇ο 〇o 1—H 〇〇ο 〇o 〇〇ο ο 〇00 〇〇100 § o 〇〇W") Ον § v〇〇Ο Ο 〇1—^ 〇 heat resistant Cracking ιτο adhesion /^-N fN s Η Resolution (μιη) ΚΟΗ developability 201239531 T1 / 1 f \Jli [Table 2] (mass parts) Comparison of types of examples 16 17 18 19 20 21 22 23 24 25 26 5 6 7 Α-9 100 100 100 Α-12 100 100 [A] Α-13 100 100 100 Α-14 100 100 100 a-4 100 100 a-5 5 Bl 20 20 20 20 10 20 20 20 20 60 20 20 60 B-2 10 10 [B] Β·3 10 B-4 5 10 B-5 60 60 Cl .3 3 3 3 3 3 3 3 3 5 3 3 5 C-2 3 1 1 1 1 C -3 5 [C] C-4 10 C-5 5 5 C-6 5 5 C-7 2.5 2.5 Dl D-2 50 [D] D-3 50 30 10 5 5 5 5 10 D-4 5 D-5 5 D-6 5 100 El 100 [E] E-2 100 E-3 100 E-4 100 Heat-resistant transparency (%) 5 4 3 2 3 3 3 3 3 3 4 4 5 6 Pencil hardness 4H 5H 5H 6H 6H 5H 6H 6H 6H 6H 4H 4H 4H 4H Scratch resistance Δ Δ o ◎ ◎ o ◎ ◎ ◎ ◎ 0 Δ Δ Δ Heat-resistant cracking 0 〇〇 ◎ o 〇 ◎ ◎ ◎ Δ Δ Δ X ITO adhesion 90 90 100 100 100 100 100 100 100 100 100 90 90 95 Sensitivity (mJ/cm2) 80. 60 60 40 30 60 60 60 60 60 80 X 200 100 Resolution (μηι) 10 10 10 10 5 10 10 10 10 10 10 X 40 15 ΚΟΗ developability ooooo 〇o 〇o 〇〇X Δ 〇

78 201239531 41717pif 【圖式簡單說明】 jStil 〇 ”》、 【主要元件符號說明】 無078 201239531 41717pif [Simple diagram description] jStil 〇 》", [Main component symbol description] No 0

Claims (1)

201239531 Hi / 1 /pif 七、申請專利範圍: L 一種感放射線性組成物,含有以 分[B]及成分[C]: 的成分[A1]、成 [A1]使四乙氧基矽烷或其部分水解物、 表示的水解性石夕烧化合物或其部分水解物下述式(1)所 所表示的水解性矽烷化合物或其部分水.及下述式(2) 而獲得的聚矽氧烷; 進行水解縮合 [B] 具有2個以上的乙稀性不飽和基 分[A1]除外); 其中成 [C] 光自由基聚合起始劑; [化1] (Rl°fcshf(cH七r2L ⑴ [化2] (R3〇)^Si ~ -^CH2201239531 Hi / 1 /pif VII. Patent application scope: L A radiation-sensitive linear composition containing the component [A1] of [B] and the component [C]: and the tetraethoxy decane or its [A1] a hydrolyzable decane compound represented by the following formula (1) or a partial hydrolyzate thereof, and a polyhydrazin obtained by the following formula (2); Hydrolysis condensation [B] has two or more ethylenically unsaturated groups [except for [A1]); wherein [C] photoradical polymerization initiator; [Chem. 1] (Rl °fcshf (cH seven r2L) (1) [Chemical 2] (R3〇)^Si ~ -^CH2 [式⑴中, R1表示碳數1〜6的烷基, 14的芳基或(曱基) R2表示碳數1〜20的烷基、碳數6 201239531 4171/pit 丙烯醯氧基, m表示1〜3的整數, η表示〇〜6的整數; 式(2)中, R3表示碳數1〜6的炫基, X表示1〜3的整數, y表示1〜6的整數, z表示〇〜3的整數]。 2.如申請專利範圍第1項所述之感放射線性組成物, 其中相對於原料化合物的合計量,上述式(2)所表示的水 解性秒烧化合物或其部分水解物的添加比例為15 m〇1%以 下。 3.如申請專利範圍第1項或第2項所述之感放射線性 組成物’含有具有碳數1〜6的烷基或碳數6〜]4的芳基的 水解性矽烷化合物作為上述式(1)所表示的水解性矽烷化 合物。 、4·如申請專利範圍第1項或第2項所述之感放射線性 、、且成物,含有選自具有ψ基丙烯醯氧基的水解㈣烧化合 物及具有丙_氧基的水解性魏化合物巾的至少-種作 為上述式⑴所表㈣水解财烧化合物。 八「上:t感放射線性組成物’含有以下的成分[A2]、成 刀[B]及成分[C]: 及下1^·!具^1〇2單元、下述式(la)所表示的結構單元、 ( a)所表示的結構單元的聚矽氧烷; 81 201239531 41 /1/pif [B] 具有2個以上的乙烯性不飽和基的化合物(其中成 分[A2]除外); [C] 光自由基聚合起始劑; [化3] RHCH 娃 Si-〇(4-m)/2 ⑽ [化4][In the formula (1), R1 represents an alkyl group having 1 to 6 carbon atoms, an aryl group of 14 or a (fluorenyl group) R2 represents an alkyl group having 1 to 20 carbon atoms, a carbon number of 6 201239531 4171/pit propylene decyloxy group, and m represents An integer of 1 to 3, η represents an integer of 〇~6; in the formula (2), R3 represents a condensing group having a carbon number of 1 to 6, X represents an integer of 1 to 3, y represents an integer of 1 to 6, and z represents 〇 An integer of ~3]. 2. The radiation-sensitive composition according to claim 1, wherein the hydrolyzable second-burning compound represented by the above formula (2) or a partial hydrolyzate thereof is added in an amount of 15 or less based on the total amount of the raw material compound. M〇1% or less. 3. The hydrolyzable decane compound containing a fluoro group having an alkyl group having 1 to 6 carbon atoms or a carbon number of 6 to 4 as described in the first or second aspect of the invention, as the above formula (1) The hydrolyzable decane compound represented. 4. The radiation-sensitive linear composition of the first or second aspect of the patent application, comprising a hydrolyzed (tetra)-sintering compound having a mercaptopropenyloxy group and a hydrolyzable property having a propenyloxy group. At least one type of the Wei compound towel is a (four) hydrolyzed chemical compound as shown in the above formula (1). Eight "Top: t-sensing linear composition" contains the following components [A2], knives [B], and components [C]: and the following 1^·! has ^1〇2 units, and the following formula (la) a structural unit represented, (a) a polyoxyalkylene of the structural unit represented; 81 201239531 41 /1/pif [B] a compound having two or more ethylenically unsaturated groups (excluding the component [A2]); [C] photoradical polymerization initiator; [Chemical 3] RHCH silicon Si-〇(4-m)/2 (10) [Chemical 4] [式(la)中, R2表示碳數1〜20的烷基、碳數6〜14的芳基或(曱基) 丙稀酸氧基, m表示1〜3的整數, η表示0〜6的整數; 式(2b)中, R4表示氫原子或碳數1〜6的烷基, X表示1〜3的整數, y表示1〜6的整數, z表示0〜3的整數]。 6.如申請專利範圍第5項所述之感放射線性組成物, 82 201239531 41/1/plf 其中於所有結構單元中,上述式(2a)所表示的結構單元 的含有比例為15 mol%以下。 7.如申請專利範圍第5項或第6項所述之感放射線性 組成物,含有下述式(lb)所表示的結構單元作為上述式 (la)所表示的結構單元, [化5] (R+Si-O (4 - m)/2 (lb) [式(lb)中,R5表示碳數1〜6的烷基或碳數6〜14 的芳基,m與上文所述為相同含意]。 8.如申請專利範圍第5項或第6項所述之感放射線性 組成物,含有選自下述式(lc)所表示的結構單元及下述 式(Id)所表示的結構單元中的至少一種作為上述式(la) 所表示的結構單元, [化6] »2 c t I 〇=c H3一 C——C II H2 c [化7] CH 〇II =CH一C—〇—^*CH2' -Si-0 (4 - m)/2 (Id) 83 201239531 /1 /pif 意]。[式(lc)及式(ld)中’如及n與上文所述為相同含 =申明專利範圍第1 J員、第2項、第5項及第6 項所述之感放射線性組成物,更含有具有〇y) ; 物作=3厂及(〇2)具有環氧基的結構單元的共聚 10.如申請專利範圍第9項所述之感放射線性組成 物’其^上it成分[D]更具有(d3)來源於(曱基)丙烯酿氧 基丙基三烷氧基矽烷的結構單元。 11. 如申請專利範圍第9項所述之感放射線性組成 物,其中相對於上述聚矽氧烷1〇〇質量份,上述成分[D] 的含量為1質量份〜45質量份。 12. 如申請專利範圍第1項、第2項、第5項及第6 項中任一項所述之感放射線性組成物,更含有選自由有機 粒子及無機粒子所組成的組群中的至少一種作為成分I; E ]。 13. 如申請專利範圍第1項、第2項、第5項及第6 項中任一項所述之感放射線性組成物,用於形成觸控面板 的保護膜或顯示元件的層間絕緣膜。 14. 一種硬化膜,其是使用如申請專利範圍第1項至 第13項中任一項所述之感放射線性組成物而形成。 15. —種硬化膜的形成方法,包含以下的步驟(1)〜 步驟(4); (1)將申請專利範圍第1項至第13項中任一項所述 之感放射線性組成物塗佈於基板上而形成塗膜的步驟; 84 201239531 41/1/pif (2) 對步驟(1)中形成的塗膜的至少一部分照射放 射線的步驟; (3) 利用鹼顯影液對步驟(2)中經放射線照射的塗 膜進行顯影的步驟;以及 (4) 對步驟(3)中經顯影的塗膜進行加熱的步驟。 16.如申請專利範圍第15項所述之硬化膜的形成方 法,其中使用無機驗顯影液作為驗顯影液。 85 201239531 41717pif 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明: 無。 五、本案若有化學式時,請揭示最能顯示發明特徵 的化學式: 無0[In the formula (la), R2 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 14 carbon atoms or an alkyl group of (indenyl) acrylate, m represents an integer of 1 to 3, and η represents 0 to 6 In the formula (2b), R4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X represents an integer of 1 to 3, y represents an integer of 1 to 6, and z represents an integer of 0 to 3]. 6. The radiation-sensitive linear composition according to claim 5, wherein the content of the structural unit represented by the above formula (2a) is 15 mol% or less in all structural units. . 7. The radiation-sensitive linear composition according to claim 5 or 6, comprising a structural unit represented by the following formula (lb) as a structural unit represented by the above formula (la), [Chem. 5] (R+Si-O (4 - m)/2 (lb) [In the formula (lb), R5 represents an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 14 carbon atoms, m being as described above 8. The radioactive linear composition according to claim 5 or 6, comprising a structural unit selected from the following formula (lc) and represented by the following formula (Id); At least one of the structural units is a structural unit represented by the above formula (la), [Chem. 6] » 2 ct I 〇 = c H3 - C - C II H2 c [Chemical 7] CH 〇 II = CH - C - 〇—^*CH2' -Si-0 (4 - m)/2 (Id) 83 201239531 /1 /pif meaning]. [Formula (lc) and formula (ld)] as and n are as described above The radiation-sensitive linear composition described in the 1st, 2nd, 5th, and 6th paragraphs of the same claim = the scope of the patent, including the 〇 y); the object = 3 plant and (〇 2) has a ring Copolymerization of structural units of an oxy group 10. Radiation-sensitive as described in claim 9 The composition [D] further has (d3) a structural unit derived from (fluorenyl) propylene oxypropyltrialkoxy decane. 11. The radiation-sensitive linear composition according to claim 9, wherein the content of the component [D] is from 1 part by mass to 45 parts by mass based on 1 part by mass of the polysiloxane. 12. The radiation-sensitive linear composition according to any one of claims 1, 2, 5, and 6, further comprising a group selected from the group consisting of organic particles and inorganic particles. At least one as component I; E]. 13. The radiation-sensitive linear composition according to any one of the first, second, fifth, and sixth aspects of the invention, for forming a protective film of a touch panel or an interlayer insulating film of a display element . A cured film formed by using the radiation-sensitive linear composition according to any one of claims 1 to 13. A method for forming a cured film, comprising the following steps (1) to (4); (1) applying the radiation-sensitive linear composition according to any one of claims 1 to 13 a step of forming a coating film on the substrate; 84 201239531 41/1/pif (2) a step of irradiating at least a part of the coating film formed in the step (1) with radiation; (3) using an alkali developing solution for the step (2) a step of developing a coating film irradiated with radiation; and (4) a step of heating the developed coating film in the step (3). 16. The method of forming a cured film according to claim 15, wherein an inorganic developer is used as the developer. 85 201239531 41717pif IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: None. 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: No 0
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