201238424 六、發明說明： 【發明所屬之技術領域】 本發明係有關於電子產品機殼之天線的領域，尤其是 一種基材上天線之導線接線的形成方法。該基材可為電子 裝置的外殼，該電子裝置選自手機，個人數位助理器 (PDA)，筆記型電腦，平板電腦，等等。 【先前技術】 近來已開發模塑互連電路元件（Molded Interconnect Device, MID)天線的製造技術，即雙射鑄模（Two-shot Molding)及雷射直接成形（Laser Direct Structuring, LDS)法，以在行動電子裝置的機殼上配置天線。 行動電子裝置的機殼一般都是運用塑膠射出成型的方 法製作。為了使機殼表面的天線與機殼背面的電路連通， 不管是採用雙射鑄模或雷射直接成形製作天線，通常都會 在機设表面上安排連通機殼兩面之通孔’再運用化學鐘於 通孔内壁之表面產生金屬層，或使電路延伸至機殼邊緣並 繞過機殼邊緣至另一面，達成機殼兩面之電路連通。因此 以雙射鑄模或雷射直接成形方法製作天線，通常會於機殼 外表上產生孔洞，不但影響觀瞻，為了使機殼正反兩面電 路導通，製作上也必比較麻煩。以雷射直接成形法為例， 201238424 雷射光必需照射活化機殼之兩面，以及通孔内壁表面。除 了增加製作工時外，通孔内壁也必須設計安排為一定角度 以上之斜面，以利雷射光能順利照射活化通孔内壁表面， 而且基材表面存在通孔將影響觀瞻。此外，如果藉由電路 繞過機殼邊緣達成基材正反兩面電路導通，則往往必須安 排較長之線路，而且經過基材邊緣上之電路不但製作上較 困難，品質也較不易掌控，並且容易因為外力因素，如摩 擦、落摔等，而造成繞過機殼邊緣之電路的損壞。 【發明内容】 為解決上述說明的問題，本案提出一種基材上天線之 導線接線的形成方法，該方法可使得一機殼可以呈現美麗 的外觀；製作上也較簡單。而且電路不必繞過機殼邊緣以 導通正反兩面電路，所以線路較短，製作上較簡易，品質 較易掌控。並且不會因為外力因素，如摩擦、落摔等，而 造成繞過機殼邊緣之電路的損壞。 本案中係有關於一種基材上天線之導線接線的形成方 法，該方法包含下列步驟：在基材射出成型前，將連通基 材兩側之金屬導線置入於射出模具内的特定位置；在模具 内注入塑膠，金屬導線被塑膠基材包覆，金屬導線的兩端 則分別外露於基材正面及背面兩側；然後於基材表面形成 天線線路，天線線路之導電金屬層與前述金屬導線之端頭 201238424 接觸，使金屬導線與天線之導電金屬層形成通路，因此達 成基材兩側電路的連通。 【實施方式】 茲謹就本案的結構組成，及所能產生的功效與優點， 配合圖示，舉本案之一較佳實施例詳細說明如下。須了解 下列說明僅適用於本案之一例，並未用於限制本案之範圍。 為了避免上述缺點，本發明提出一種基材上天線之導 線接線的形成方法，其包含步驟如下： 請參考附圖一，在基材射出成型時，將連通基材兩側 之金屬導線110置入於射出模具120内的特定位置。在模 具内注入塑膠（如圖二所示），導電金屬被塑膠基材100包 覆，金屬導線110的兩端則分別外露於基材100正面及背 面兩側，如圖三所示，本案中所使用的基材100為熱塑性 並可濺鍍或印刷金屬的塑膠材料。在圖中本案以母模為說 明例，但此一範例並不用於限制本案的範圍，本案也可以 將該金屬導線置入公模中，再進行後續的作業。 請參考圖四，於基材表面形成天線線路130，天線線 路130之導電金屬層與前述金屬導線110之端頭接觸，使 金屬導線 110與天線130之導電金屬層形成通路，因 此達成基材100兩側電路的連通。 201238424 模塑互連電路元件（Molded Interconnect Device)已 廣泛的使在天線的製造中，其中以該方法製造天線有兩種 不同的方式：分別為雷射直接成形（Laser Direct Structuring, LDS)法以及雙射鑄模（Two Shot Molding) 法0 當運用雷射直接成形（LDS)雕刻天線圖形時，如圖五所 示，所使用的基材100為熱塑性材料並且為雷射光照射活 化後可鑛金屬之歸㈣；且金屬導線UQ端頭位於預定 之天線線路130上。 在預定形成天線處的雷射活化區域140對該基材100 進行雷射活化’成為可藉純學#練上金制的區域。 藉由化學财法於預定之天線線路上形成導電金屬 層，如圖六所料；此時該麵導線HG可連通天線導電 金屬層130至基材1〇〇另—侧， 因此無須於基材1〇〇上再 設置導電通孔。 在雷射活化區域140錢 金屬的方式，除採用化學鍍 外，尚可先採用化學鍍之後再p + χ 丹心用電鍍之兩階段方式。 另一種模塑互連電路元件 法，顧名思義即經過兩次射出*天線h方法為雙射鑄模 天線圖形時，前述金屬導線可業。S運用雙射鑄模形成 模具内，或者也可於第二:欠射：第一次射出時即置入射出 町出可鍍塑膠時再置入射出模 201238424 具内’或者也可於第一及第二次射出時，分兩階段將導電 金屬置入射出模具内。經過兩次射出即形成一基材。下文 先說明於第二次射出可鍍塑膠時再將導線置入射出模具内 的方法。 請參考附圖七，先以塑膠射出作業以模具280形成一 基材200(—般即為一電子裝置的機殼），在射出作業中同 時在該基材200上形成一凹陷區210，並在該凹陷區210 中形成一貫穿該基材的穿孔220，該穿孔220為後續作業 中用以插入導線，以連接天線者。 請參考附圖八，於第一射後打開模具，將一導線230 置入穿孔220中，而導線230的上方露出於該基材200， 較佳者’該導線230上端與該基材的上表面之非凹陷區齊 平。 然後，如圖九所示進行第二次射出作業，模具280之 半模轉換至第二次射出之半模281，並將可鍍的塑膠注入 該凹陷區210的上方表面’形成一可鑛塑膠層205用以鍍 上一層金屬。在上述步驟後，脫模取出基材200，此時， 導線230被包覆於塑膠基材200及可鍍塑膠層205中，兩 端頭分別外露於基材兩側表面，如圖十所示。 然後應用化學鍍的方式在該二次射出之可鍍塑膠205 上鍍上一層導電金屬240,此層導電金屬即為天線，請參 201238424 4鎳资勝 考附圖十一。因此以化學鍍方法於第二次射出201238424 VI. Description of the Invention: [Technical Field] The present invention relates to the field of antennas for electronic product casings, and more particularly to a method of forming conductor wirings for antennas on substrates. The substrate can be an outer casing of an electronic device selected from the group consisting of a cell phone, a personal digital assistant (PDA), a notebook computer, a tablet computer, and the like. [Prior Art] Recently, a manufacturing technique of a molded interconnected circuit component (MID) antenna, that is, a two-shot Molding and a Laser Direct Structuring (LDS) method, has been developed. An antenna is disposed on the casing of the mobile electronic device. The casing of mobile electronic devices is usually made by plastic injection molding. In order to connect the antenna on the surface of the casing to the circuit on the back of the casing, whether it is made by double-shot molding or laser direct forming, the through-holes connecting the two sides of the casing are usually arranged on the surface of the casing. The surface of the inner wall of the through hole creates a metal layer or extends the circuit to the edge of the casing and bypasses the edge of the casing to the other side to achieve electrical communication between the two sides of the casing. Therefore, the antenna is produced by the two-shot mold or the direct laser forming method, and the hole is usually formed on the outer surface of the casing, which not only affects the viewing, but also makes the circuit of the front and back of the casing conductive, and the production is also troublesome. Taking the direct laser direct forming method as an example, the 201238424 laser light must illuminate both sides of the activated casing and the inner wall surface of the through hole. In addition to increasing the manufacturing time, the inner wall of the through hole must also be designed to be inclined above a certain angle, so that the laser light can smoothly illuminate the inner surface of the activated through hole, and the presence of a through hole on the surface of the substrate will affect the viewing. In addition, if the circuit is bypassed by the edge of the casing to achieve the conduction of the front and back sides of the substrate, it is often necessary to arrange a longer circuit, and the circuit on the edge of the substrate is not only difficult to manufacture, but also difficult to control. It is easy to cause damage to the circuit that bypasses the edge of the casing due to external force factors such as friction, falling, and the like. SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention proposes a method for forming a wire connection of an antenna on a substrate, which can make a casing have a beautiful appearance and is simpler to manufacture. Moreover, the circuit does not have to bypass the edge of the casing to turn on the front and back sides of the circuit, so the line is shorter, the production is simpler, and the quality is easier to control. And it will not cause damage to the circuit that bypasses the edge of the casing due to external force factors such as friction and falling. In the present invention, there is a method for forming a wire connection of an antenna on a substrate, the method comprising the steps of: placing a metal wire connecting the two sides of the substrate into a specific position in the injection mold before the substrate is injection molded; Plastic is injected into the mold, the metal wire is covered by the plastic substrate, and the two ends of the metal wire are respectively exposed on the front and back sides of the substrate; then the antenna line is formed on the surface of the substrate, the conductive metal layer of the antenna line and the aforementioned metal wire The contact of the end 201238424 makes the metal wire form a path with the conductive metal layer of the antenna, thus achieving the communication of the circuits on both sides of the substrate. [Embodiment] In view of the structural composition of the case, and the functions and advantages that can be produced, with reference to the drawings, a preferred embodiment of the present invention is described in detail below. It should be understood that the following instructions are only applicable to one of the cases and are not intended to limit the scope of the case. In order to avoid the above disadvantages, the present invention provides a method for forming a wire connection of an antenna on a substrate, which comprises the following steps: Referring to FIG. 1, when the substrate is injection molded, the metal wires 110 on both sides of the substrate are placed. A specific position within the mold 120 is injected. The plastic is injected into the mold (as shown in FIG. 2), the conductive metal is covered by the plastic substrate 100, and the two ends of the metal wire 110 are respectively exposed on the front and back sides of the substrate 100, as shown in FIG. The substrate 100 used is a thermoplastic material that is thermoplastic and can be sputtered or printed with metal. In the figure, the parent model is used as an example, but this example is not intended to limit the scope of the case. In this case, the metal wire can also be placed in a male mold for subsequent operations. Referring to FIG. 4, an antenna line 130 is formed on the surface of the substrate. The conductive metal layer of the antenna line 130 is in contact with the end of the metal wire 110, so that the metal wire 110 forms a path with the conductive metal layer of the antenna 130, thereby achieving the substrate 100. The connection of the circuits on both sides. 201238424 Molded Interconnect Device has been widely used in the manufacture of antennas, in which the antenna is manufactured in two different ways: Laser Direct Structuring (LDS) and Two Shot Molding Method 0 When engraving an antenna pattern using Laser Direct Forming (LDS), as shown in Figure 5, the substrate 100 used is a thermoplastic material and is irradiated with laser light to activate the oreable metal. Return to (4); and the metal wire UQ terminal is located on the predetermined antenna line 130. Laser activation of the substrate 100 at a laser activation region 140 where the antenna is to be formed is an area that can be made of gold. The conductive metal layer is formed on the predetermined antenna line by the chemical method, as shown in FIG. 6; at this time, the surface wire HG can communicate with the antenna conductive metal layer 130 to the other side of the substrate, so that the substrate is not required. A conductive via is provided on the 1 〇〇. In the laser activation area of 140 money metal, in addition to the use of electroless plating, it is also possible to use the two-stage method of electroplating and then p + 丹 丹 丹. Another method of molding an interconnected circuit component, as the name suggests, is that the metal wire can be used when the two-shot* antenna h method is a two-shot mold antenna pattern. S uses a double-shot mold to form the mold, or it can also be used in the second: undershoot: when the first shot is placed, the incident can be placed in the mold and then the plastic can be placed in the mold. 201238424. At the second shot, the conductive metal is placed into the mold in two stages. After two shots, a substrate is formed. The method of placing the wire into the mold at the time of the second injection of the moldable plastic is described below. Referring to FIG. 7 , a substrate 200 (that is, a casing of an electronic device) is formed by a mold 280 in a plastic injection operation, and a recessed region 210 is simultaneously formed on the substrate 200 during the injection operation. A through hole 220 penetrating the substrate is formed in the recessed area 210, and the through hole 220 is used for inserting a wire in a subsequent operation to connect the antenna. Referring to FIG. 8, after the first shot, the mold is opened, and a wire 230 is placed in the through hole 220, and the upper side of the wire 230 is exposed on the substrate 200, preferably the upper end of the wire 230 and the upper surface of the substrate. The non-recessed area of the surface is flush. Then, as shown in FIG. 9, the second injection operation is performed, the mold half of the mold 280 is switched to the second injection mold half 281, and the plateable plastic is injected into the upper surface of the recessed area 210 to form a mineralizable plastic. Layer 205 is used to plate a layer of metal. After the above steps, the substrate 200 is demolded. At this time, the wire 230 is coated on the plastic substrate 200 and the plasticizable layer 205, and the ends of the two ends are exposed on both sides of the substrate, as shown in FIG. . Then, a layer of conductive metal 240 is plated on the second-ejectable pliable plastic 205 by means of electroless plating. The conductive metal is an antenna. Please refer to Figure 11 of 201238424 4 Nickel. Therefore, the second shot is performed by electroless plating.
友線I 表面上形成導電金屬層時，該金屬導線230玎速^ 導 導電金屬240至基材另一侧，因此無須於基村上再& 電通孔。 下文說明於第一次射出時即將導電金屬置入射出模 具内的方法。其中在模具形成過程中，必須先在模具380 内形成一插槽350，該插槽可以在公模或母模中，本案以 母模為說明例，但此一範例並不用於限制本案的範圍，本 案也可以將該插槽也可以設在該公模中。 請參考附圖十二，在第一次射出時，即將金屬導線 330插入模具380内的插槽350中，以塑膠射出作業形成 一基材300(—般即為一電子裝置的機殼X請參考圖十 三）’在射出作業中同時在該基材300上形成一凹陷區 310，此時該金屬導線330貫穿該基材300並露出於該凹陷 區310。較佳者，該導線33〇上端與該基材3〇〇的上表面 之非凹陷區齊平。 請參考圖十四，再進行第二次射出作業，模具38〇之 半模轉換至第二次射出之半模381，並將可錢的塑膠注入 該凹陷區310的上方表面以形成—可㈣膠層3Q5，用以 鍍上一層金屬。在上述步驟後，脫模取出基材，此時，導 線330被包覆於塑膠基材300及該可鍍塑膠層305中，兩 201238424 端頭分別外露於基材300的兩侧表面。 然後進行化學鍍，其方式同上述有關於圖十及圖十_ 的說明，於此不再贅述。 下文說明於第一及第二次射出時，分兩階段將導電金 屬置入射出模具内的方法。其中在模具形成過程中必須 先在模具380内形成一插槽350。 、 “ 請參考附圖十五，在第一次射出時，即將金屬導線的 半截331插入模具480内的插槽350中，以塑膠射出作業 形成一基材300(—般即為一電子裝置的機殼）（請參考圖;^ 六），在射出作業中同時在該基材3〇〇上形成一凹陷區 31〇，此時該金屬導線半戴331埋覆於基材3〇〇，其端頭並 露出於該凹陷區310下方之孔洞34〇内。 請參考圖十七，將導線另一半截332置入孔洞34〇， 其端頭並與導線半截331之端頭連接形成導電通路，再進 行第二次射出作業，模具之半模轉換至第二次射出之 半模48卜並將可鑛的塑膠注入該凹陷區则的上方表面 以形成-可鍍塑膠層305，用以鍍上一層金屬。前述導線 +截332亦可在第二次射出作業前置入半模481的槽孔 351並於射出模合模後，導線半截的端頭與導線半截 如之端頭連接形成導電通路，然後進行第二次射出。在 述步驟後’脫模取出基材，此時，導線半戴如及 201238424 被包覆於塑膠基材300及該可鍍塑膠層305中，導線半截 331及332之各一端頭分別外露於基材300的兩侧表面。 然後進行化學鍍，其方式同上述有關於圖十及圖十一 的說明，於此不再贅述。 如圖四所示，本案中當運用濺鍍、印刷等方法於基材 100表面形成天線130之導電金屬層時，導電金屬層會接 觸前述金屬導線110之端頭，因此可順利連通天線130至 基材100另一側。 如圖四及圖十八所示，如運用電鍍方法在圖四的導電 金屬層上增厚金屬層厚度150(圖十八），則包覆於基材100 上並連通基材兩側之金屬導線110亦可做為電鍍過程之導 電接點，由位於天線130背面之金屬導線110端頭連接電 鑛電源。 本案中該基材可為電子裝置的外殼，該電子裝置選自 手機，個人數位助理器（PDA)，筆記型電腦，平板電腦，等 等。 本創作的優點為不需在機殼外表產生孔洞，所以可以 呈現美麗的外觀；不需在導電通孔内壁之表面產生金屬 層，製作上也較簡單。而且電路不必繞過機殼邊緣以導通 正反兩面電路，所以線路較短，製作上較簡易，品質較易 掌控。並且不會因為外力因素，如摩擦、落摔等，而造成 11 201238424 機殼邊緣上之電路的損壞。 綜上所述，本案人性化之體貼設計，相當符合實際需 求。其具體改進現有缺失，相較於習知技術明顯具有突破 性之進步優點，確實具有功效之增進，且非易於達成。本 案未曾公開或揭露於國内與國外之文獻與市場上，已符合 專利法規定。上列詳細說明係針對本創作之一可行實施例 之具體說明，惟該實施例並非用以限制本創作之專利範 圍，凡未脫離本創作技藝精神所為之等效實施或變更，均 應包含於本案之專利範圍中。 12 201238424 【圖式簡單說明】 圖一示本案中基材射出成型時，將金屬導線置入於射 出模具的步驟。 圖二示本案中將塑料注入模具的步驟。 圖三示本案中在基材射出成型後，金屬導線包覆於基 材上。 圖四示本案中基材表面形成導電金屬層。 圖五示雷射直接成形（LDS)雕刻天線圖形，依據本案的 方法中包含有導線的基材。 圖六示雷射直接成形（LDS)後，化鍍天線金屬層的基 材。 圖七示雙射鑄模之第一種方法中的第一次射出步驟。 圖八示雙射鑄模之第一種方法中將一導線置入基材上 之穿孔的步驟。 圖九示在雙射鑄模之第一種方法中進行第二次射出作 業的步驟。 圖十示在雙射鑄模之第一種方法中脫模取出的基材。 圖十一示在雙射鑄模之第一種方法中應用化學鍍的方 式鍍上一層天線金屬層的步驟。 圖十二示雙射鑄模之第二種方法中先將金屬導線插入 模具内插槽的作業。 13 201238424 圖十三示雙射鑄模之第二種方法中的第一次射出步 驟。 圖十四示雙射鑄模之第二種方法中進行第二次射出作 業的步驟。 圖十五示雙射鑄模之第三種方法中先將金屬導線半截 插入模具内插槽的作業。 圖十六示雙射鑄模之第三種方法中的第一次射出步 驟。 圖十七示雙射鑄模之第三種方法中進行第二次射出作 業的步驟。 圖十八示運用電鍍方法增厚基材表面金屬層厚度時， 天線與金屬導線所形成的導電連結。 【主要元件符號說明】 100 基材 205 可鍍塑膠層 110 金屬導線 210 凹陷區 120 射出模具 220 穿孔 130 天線 230 導線 140 雷射活化區域 240 導電金屬 150 電鍍金屬層 280 模具 200 基材 281 半模 14 201238424 300 基材 350 插槽 305 可鍍塑膠層 351 插槽 310 凹陷區 380 模具 330 金屬導線 381 半模 331 金屬導線半截 480 模具 332 金屬導線半截 481 半模 340 孔洞 15When a conductive metal layer is formed on the surface of the friend line I, the metal wire 230 oscillates the conductive metal 240 to the other side of the substrate, so that it is not necessary to make an electric via hole on the base. The method of placing the conductive metal into the mold at the first shot is described below. In the mold forming process, a slot 350 must be formed in the mold 380. The slot can be in the male or female mold. The parent mold is used as an example, but this example is not intended to limit the scope of the present case. In this case, the slot can also be set in the male mold. Referring to FIG. 12, at the first shot, the metal wire 330 is inserted into the slot 350 in the mold 380, and a substrate 300 is formed by plastic injection (that is, the casing of an electronic device is required) Referring to FIG. 13), a recessed region 310 is formed on the substrate 300 at the same time in the projecting operation. At this time, the metal wire 330 penetrates the substrate 300 and is exposed to the recessed region 310. Preferably, the upper end of the wire 33 is flush with the non-recessed area of the upper surface of the substrate 3〇〇. Referring to FIG. 14, the second injection operation is performed, and the mold half 38 is converted to the second injection mold half 381, and the valuable plastic is injected into the upper surface of the recessed area 310 to form (4) The glue layer 3Q5 is used to plate a layer of metal. After the above steps, the substrate is demolded. At this time, the wire 330 is coated on the plastic substrate 300 and the platable plastic layer 305, and the ends of the two 201238424 are exposed on both sides of the substrate 300, respectively. Then, electroless plating is carried out in the same manner as described above with respect to FIG. 10 and FIG. 10, and details are not described herein again. The following describes the method of placing the conductive metal into the mold in two stages during the first and second shots. A slot 350 must be formed in the mold 380 prior to mold formation. Referring to Figure 15, at the first shot, a half 331 of the metal wire is inserted into the slot 350 in the mold 480 to form a substrate 300 by plastic injection (typically an electronic device). a casing (refer to the figure; ^6), in the injection operation, a recessed area 31〇 is formed on the substrate 3〇〇 at the same time, and at this time, the metal wire half-wearing 331 is buried on the substrate 3〇〇, The end is exposed in the hole 34〇 below the recessed area 310. Referring to FIG. 17, the other half of the wire 332 is placed in the hole 34〇, and the end thereof is connected with the end of the wire half 331 to form a conductive path. Then, the second injection operation is performed, and the mold half of the mold is converted to the second injection mold half 48, and the oreable plastic is injected into the upper surface of the recessed area to form a plasticizable layer 305 for plating. a layer of metal. The wire + section 332 can also be inserted into the slot 351 of the mold half 481 before the second injection operation, and after the injection mold is injected, the half end of the wire is connected with the half end of the wire to form a conductive path. And then a second shot. After the step, the mold is taken off. The substrate is exposed. At this time, the wire half-wearing and 201238424 are coated on the plastic substrate 300 and the platable plastic layer 305, and the ends of the wire halves 331 and 332 are exposed on both sides of the substrate 300, respectively. Then, electroless plating is carried out in the same manner as described above with reference to FIG. 10 and FIG. 11 , and details are not described herein. As shown in FIG. 4 , in the present case, the antenna 130 is formed on the surface of the substrate 100 by sputtering, printing, or the like. In the conductive metal layer, the conductive metal layer contacts the end of the metal wire 110, so that the antenna 130 can be smoothly connected to the other side of the substrate 100. As shown in Fig. 4 and Fig. 18, the plating method is used in Fig. 4. The thickness of the metal layer is increased by 150 (Fig. 18), and the metal wire 110 coated on the substrate 100 and connected to both sides of the substrate can also be used as a conductive contact of the electroplating process, and is located at the antenna 130. The metal wire 110 on the back end is connected to the electric power source. In the present case, the substrate may be an outer casing of an electronic device selected from the group consisting of a mobile phone, a personal digital assistant (PDA), a notebook computer, a tablet computer, and the like. The advantage of creation is It is necessary to create a hole in the outer surface of the casing, so that a beautiful appearance can be exhibited; it is not necessary to produce a metal layer on the surface of the inner wall of the conductive through hole, and the fabrication is also relatively simple. Moreover, the circuit does not have to bypass the edge of the casing to turn on the front and back sides of the circuit, so The circuit is short, the production is relatively simple, the quality is easy to control, and the circuit on the edge of the 11 201238424 casing is not damaged due to external factors such as friction and falling. In summary, the case is humanized. The thoughtful design is quite in line with the actual needs. The specific improvement of the existing defects is obviously a breakthrough improvement advantage compared with the prior art, and it has the effect of improving and is not easy to achieve. The case has not been disclosed or disclosed in China and abroad. The literature and the market have complied with the provisions of the Patent Law. The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiment is not intended to limit the scope of the patents, and the equivalent implementations or modifications that are not included in the spirit of the present invention should be included in The patent scope of this case. 12 201238424 [Simple description of the drawing] Fig. 1 shows the step of placing the metal wire in the injection mold during the injection molding of the substrate in the present case. Figure 2 shows the steps of injecting plastic into the mold in this case. Figure 3 shows the metal wire wrapped on the substrate after the substrate is injection molded. Figure 4 shows the formation of a conductive metal layer on the surface of the substrate in this case. Figure 5 shows a laser direct structuring (LDS) engraved antenna pattern in which the substrate of the wire is included in the method of the present invention. Figure 6 shows the substrate of the metal layer of the antenna after laser direct structuring (LDS). Figure 7 shows the first injection step in the first method of the two-shot mold. Figure 8 shows the step of placing a wire into a perforation in a substrate in a first method of a two-shot mold. Figure 9 shows the steps of performing the second shot operation in the first method of the two-shot mold. Figure 10 shows the substrate taken out of the mold in the first method of the two-shot mold. Figure 11 shows the step of applying an electroless plating method to a layer of an antenna metal layer in the first method of the two-shot mold. Figure 12 shows the second method of the two-shot mold in which the metal wire is first inserted into the slot in the mold. 13 201238424 Figure 13 shows the first shot in the second method of the two-shot mold. Figure 14 shows the second injection operation in the second method of the two-shot mold. Figure 15 shows the third method of the two-shot mold in which the metal wire is half inserted into the slot in the mold. Figure 16 shows the first shot in the third method of the two-shot mold. Figure 17 shows the steps of the second shot operation in the third method of the two-shot mold. Figure 18 shows the conductive connection between the antenna and the metal wire when the thickness of the metal layer on the surface of the substrate is thickened by electroplating. [Main component symbol description] 100 Substrate 205 Plastic plated layer 110 Metal wire 210 Recessed area 120 Injection mold 220 Perforation 130 Antenna 230 Wire 140 Laser activation area 240 Conductive metal 150 Electroplated metal layer 280 Mold 200 Substrate 281 Semi-mode 14 201238424 300 Substrate 350 Slot 305 Plastic coated layer 351 Slot 310 Recessed area 380 Mold 330 Metal wire 381 Half mode 331 Metal wire half 480 Mold 332 Metal wire half 481 Half die 340 Hole 15