TW201237012A - Flux for lead-free solder and lead-free solder paste - Google Patents

Flux for lead-free solder and lead-free solder paste

Info

Publication number
TW201237012A
TW201237012A TW100146751A TW100146751A TW201237012A TW 201237012 A TW201237012 A TW 201237012A TW 100146751 A TW100146751 A TW 100146751A TW 100146751 A TW100146751 A TW 100146751A TW 201237012 A TW201237012 A TW 201237012A
Authority
TW
Taiwan
Prior art keywords
lead
free solder
flux
solder paste
formula
Prior art date
Application number
TW100146751A
Other languages
Chinese (zh)
Other versions
TWI549930B (en
Inventor
Natsuki Kubo
Eiji Iwamura
Original Assignee
Arakawa Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chem Ind filed Critical Arakawa Chem Ind
Publication of TW201237012A publication Critical patent/TW201237012A/en
Application granted granted Critical
Publication of TWI549930B publication Critical patent/TWI549930B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

The main objective of this invention is to provide a flux allowing a lead-free solder paste to be produced which has excellent viscosity stability and exhibits good wettability even when soldering is performed in the atmosphere. The flux for lead-free solder of this invention contains bromine atoms with a concentration of 400 to 20000ppm per 0.1g, and an amine compound (a) represented by formula (1): H2N-(CH2)n-X-(CH2)n-NH2 (in the formula, n represents an integer of 1 to 6, X represents -NH-CH2CH2-NH- or piperazine residual) with an amount of 0.01 to 0.7% by weight.
TW100146751A 2010-12-17 2011-12-16 Flux for lead-free solder paste and lead-free solder paste TWI549930B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010281327 2010-12-17

Publications (2)

Publication Number Publication Date
TW201237012A true TW201237012A (en) 2012-09-16
TWI549930B TWI549930B (en) 2016-09-21

Family

ID=46244780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100146751A TWI549930B (en) 2010-12-17 2011-12-16 Flux for lead-free solder paste and lead-free solder paste

Country Status (6)

Country Link
US (1) US9314879B2 (en)
JP (1) JP5737295B2 (en)
KR (1) KR20140023266A (en)
CN (1) CN103269826B (en)
TW (1) TWI549930B (en)
WO (1) WO2012081688A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500467B (en) * 2010-01-08 2015-09-21 Arakawa Chem Ind Flux composition for lead-free solder, and lead-free solder paste
KR102100292B1 (en) * 2013-04-23 2020-04-14 삼성전자주식회사 Metallic glass and conductive paste and electronic device
EP2886244A1 (en) * 2013-12-17 2015-06-24 Heraeus Deutschland GmbH & Co. KG Method for fixing a component on a substrate
CN107206552A (en) * 2015-06-12 2017-09-26 荒川化学工业株式会社 Without lead solder solder flux and leadless solder paste
WO2020138242A1 (en) 2018-12-26 2020-07-02 日東電工株式会社 Electrical displacement material, optical element using same, micro lens array, and method of developing optical element
JP6986530B2 (en) * 2019-03-25 2021-12-22 株式会社タムラ製作所 Solder composition and electronic board
JP6700570B1 (en) * 2019-09-18 2020-05-27 千住金属工業株式会社 Flux and solder paste
JP6754091B1 (en) * 2020-03-30 2020-09-09 千住金属工業株式会社 How to make flux, solder paste and soldered products
JP6928296B1 (en) * 2020-10-02 2021-09-01 千住金属工業株式会社 Solder paste

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660127A (en) * 1969-08-11 1972-05-02 Lake Chemical Co Flux for use in soldering of stainless steels
JPH06269988A (en) * 1993-03-19 1994-09-27 Asahi Glass Co Ltd Solder paste composition
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP2002086292A (en) * 2000-02-08 2002-03-26 Showa Denko Kk Solder paste
JP4369003B2 (en) * 2000-02-23 2009-11-18 ハリマ化成株式会社 Soldering flux
JP2008030103A (en) * 2006-07-31 2008-02-14 Arakawa Chem Ind Co Ltd Flux for cream solder, and cream solder
CN101077555A (en) * 2007-07-03 2007-11-28 东莞市特尔佳电子有限公司 Point coating type scaling powder for soldering tin paste
CN101176957A (en) * 2007-07-25 2008-05-14 东莞市特尔佳电子有限公司 Soft solder for SnAgCuNiGe alloy solder paste
CN101224528B (en) * 2008-01-21 2010-11-17 广州瀚源电子科技有限公司 Electronic assembly lead-free welding paste scaling powder and preparing method thereof
CN101412168B (en) * 2008-11-26 2010-12-01 华南理工大学 Scaling powder for aluminium soldering tin wire core and preparation method thereof
CN101585118A (en) * 2009-03-09 2009-11-25 郴州金箭焊料有限公司 Soldering flux for low temperature lead-free soldering paste
CN101695794B (en) * 2009-10-23 2011-09-07 东莞市特尔佳电子有限公司 Halogen-free tin-bismuth-copper soldering paste and preparation method thereof
CN101890595B (en) * 2010-07-02 2012-07-04 厦门大学 Low-rosin washing-free soldering flux for lead-free flux-cored wires and preparation method thereof

Also Published As

Publication number Publication date
CN103269826A (en) 2013-08-28
CN103269826B (en) 2016-12-07
US20130276937A1 (en) 2013-10-24
JPWO2012081688A1 (en) 2014-05-22
WO2012081688A1 (en) 2012-06-21
JP5737295B2 (en) 2015-06-17
US9314879B2 (en) 2016-04-19
KR20140023266A (en) 2014-02-26
TWI549930B (en) 2016-09-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees