TW201232698A - Method for forming trenches and trench isolation on a substrate - Google Patents
Method for forming trenches and trench isolation on a substrateInfo
- Publication number
- TW201232698A TW201232698A TW100102463A TW100102463A TW201232698A TW 201232698 A TW201232698 A TW 201232698A TW 100102463 A TW100102463 A TW 100102463A TW 100102463 A TW100102463 A TW 100102463A TW 201232698 A TW201232698 A TW 201232698A
- Authority
- TW
- Taiwan
- Prior art keywords
- trench
- substrate
- forming
- area
- trench isolation
- Prior art date
Links
Abstract
A method for forming trench isolation on a substrate includes providing a substrate having thereon a pad layer and a hard mask; forming a first shallow trench in a first area and a second trench in a second area on the substrate; forming a resist layer covering the first area while exposing the second area; etching the second shallow trench to form a deep trench; forming oxide liner within the first shallow trench and the deep trench; and filling the shallow trench and the deep trench with an oxide layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100102463A TWI508222B (en) | 2011-01-24 | 2011-01-24 | Method for forming trenches and trench isolation on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100102463A TWI508222B (en) | 2011-01-24 | 2011-01-24 | Method for forming trenches and trench isolation on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201232698A true TW201232698A (en) | 2012-08-01 |
TWI508222B TWI508222B (en) | 2015-11-11 |
Family
ID=47069678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100102463A TWI508222B (en) | 2011-01-24 | 2011-01-24 | Method for forming trenches and trench isolation on a substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI508222B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825469B (en) * | 2021-08-26 | 2023-12-11 | 南亞科技股份有限公司 | Manufacturing method of semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW588413B (en) * | 2002-11-07 | 2004-05-21 | Winbond Electronics Corp | Manufacturing method and device of memory with different depths of isolation trench |
KR100538069B1 (en) * | 2003-12-16 | 2005-12-20 | 매그나칩 반도체 유한회사 | Isolation of image sensor for reducing dark signal |
TWI300968B (en) * | 2006-06-28 | 2008-09-11 | Powerchip Semiconductor Corp | Fabrication methods of isolation structure |
-
2011
- 2011-01-24 TW TW100102463A patent/TWI508222B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI825469B (en) * | 2021-08-26 | 2023-12-11 | 南亞科技股份有限公司 | Manufacturing method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWI508222B (en) | 2015-11-11 |
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