201230938 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種媒體 如連接電性信號電纜與光纖電 傳送媒體。 【先前技術】 作 為 進 行 電 性 信 號 電 纜 與光 換 器 已 知 具 備 如 下 元 件 者 :外 蓋 9 設 置 於 外 殼 本 體 内 部 的 基趣 之 周 壁 之 所 需 部 位 的 光 信 號 端子 [ 專 利 文 獻 ) 〔專利文獻1〕··日本特開 【發明内容】 〔發明所欲解決之課題〕 雖然媒體轉換器以10Mbps 通信者已貫用化，但是想要使其 加可進行IGbps或1Gbps的高超 有之10Mbps或1〇〇Mbps之速度 量變大’而影響構成元件的動作 本發明之目的在於提供 達成高性能化的媒體轉換器。 [解決課題之手段] 本發明之媒體轉換器，係肩 口的蓋；設置於外殼本體内部# 本體之周壁之所需部位的光信 換器，該媒體轉換器係 般用以連接不同種類的 纖電纜之連接的媒體轉 殼本體及塞住其開口的 ;以及設置於外殼本體 及電性信號端子。 2008 — 122514 號公報 及100Mbps之速度進行 達成高性能化（例如，附 .通信，而且亦可因應既 的功能）時，會擔心發熱 〇 .藉由提高散熱性，而可 -備外殼本體及塞住其開 I基板；以及設置於外殼 :端子及電性信號端子， 201230938 :複數個散熱用支柱豎設於 散熱用支柱的前端與蓋抵接 基 *玄媒體轉換器的特徵為 板，而且蓋係金屬製，各 在土板配置具有媒體轉換功能的ic，而且配置具 有媒體轉換器之高性能化所需的功能(例如可因應既有 、又而可進行1 Gbps或1 Gbps之高速通信的功能） 的1C在以往的構成（例如以} 00Mbps以下之速度進行 通信者）中’因為發熱量不太大，所以就用於散熱的構成 而5 ’雖然可藉由將複數個貫穿孔設置於外殼本體及蓋 來因應，但是當高性能化時，發熱量會增加，會有對媒 體轉換器之構成元件的動作造成不良影響的可能性。因 此’ *要散熱手段’而希望散熱手段不會造成媒體轉換 器大型化且可進行高效率的散熱。 若依據本發明的媒體轉換器，複數個散熱用支柱豎 "又於基板’而且蓋係金屬製，各散熱用支柱的前端與蓋 抵接’藉此，基板的熱經由複數個散熱用支柱及蓋散熱 至外部’因此，媒體轉換器不會大型化，且可高效率地 散熱。. 例如’電性彳g號的通信速度（例如E t h e r — N e t側的通 信速度）是設為l〇/l〇〇/1〇〇〇Mbps，在Ether— Net側切換 通信速度’而光信號的通信速度（光纖側的通信速度）相 對每些通信速度的任一種’都設為lOOOMbps(lGbps)。 外殼本體係以作成合成樹脂製較佳，散熱用支柱係 作成適當的金屬製（銅、鋁、鋼），蓋係作成例如鋁製。 外殼本體可由一個元件所形成，亦可由上部外殼及下部 外殼所構成。 -4- 201230938 散熱用支柱係作成例如由與基板之下面抵接的 柱體及與基板之上面抵接的第2柱體所構成，第1 與外殼的底壁抵接，第2柱體盥蓋抵接 主 租，、盍牴接。各柱體係為例 如於-端部設有凸狀的陽螺紋部，並於另—端部設有凹 狀的陰螺紋。在此情;兄，在基板，設置可供第"主許之 陽螺紋部插入的貫穿孔’第2柱體係在該陽螺紋部二 =蓋的陰螺紋部後載置於基板，第"主體的陽螺紋 與第2柱體的陰螺紋部螺合。 以在蓋與基板之間，設置有作為散熱手段的散熱片 具。在此情況’散熱片係例如藉由具有黏接性的片或 矽滑脂（silicone greasem Ic密接較佳。亦可作成一體形 成紹製的蓋與鋁製的散熱片。 / 較佳為蓋係藉由各散熱^柱支#成在與外殼本體 的周壁之間形成間隙。外磚太 e ? 7卜从本體採用合成樹脂製，在其 周壁的頂部，從下太洲_菩s °又置一盖之周邊部相對向的内側突 =部。雖然以往蓋的周邊部係由外殼本體之周壁支撐 2與外殼本體之間不會產生間隙，但是本發明中，藉 .^ L 文円使付盍利用散熱用支柱支撐成不 本體之周壁上面接觸。依此方式，經由在蓋的 周：部與外殼本體之間所產生的間隙，在外殼本體内被 加熱的空氣容易與外Μ 据a 卜Λ又本體外部的空氣作替換，進一步 徒两作為散熱手段之功能。 在該媒體轉換器中’較佳為設置可切換i〇〇MbpK rc度的通信與比其更高速之通信的附加高速通信功能用 201230938 藉由附加因應高速通信（lGbps、lOGbps等）且亦因應 既有速度的功能（切換功能），可一面保持以往之功能（即 可進行1 00Mbps以下之速度的通信），一面進行比以往更 高速的通信°另一方面，在搭載這種附加高速通信功能 用ic的情況’會擔心來自該ic的發熱對其他元件的動 作環境造成影響，而這點可利用上述的散熱手段來避免。 [發明之效果] 若依據本發明的媒體轉換器，因為複數個散熱用支 柱豎設於基板，而且蓋採用金屬製，各散熱用支柱的前 端與蓋抵接’所以散熱性提高，而可達成高性能化。 【實施方式】 以下’參照圖面說明本發明之貪施形態。此外，在 以下的說明中，雖然上下係指第2圖的上下，但是該上 下是權宜性的’在實際設置時，媒體轉換器的下面亦可 沿著地面或桌子的水平面，媒體轉換器的下面亦可沿著 壁等的垂直面。 如第1圖至第5圖所示’本發明之媒體轉換器（1)具 備：在上方開口的外殼本體（2);支撐於外殼（2)之底壁之 大致方形的基板（3);配置於基板（3)上的光信號端子 (4)、電性信號端子（5)、發光二極體（6)、DC插座（7)及2 個IC(8)、（9);設置於外殼（2)内部之作為散熱手段的散 熱片（10)及複數個金屬製散熱用支柱（1 1);以及蓋（12)， 係蓋住外殼本體（2)的開口。 外殼本體（2)係合成樹脂製，具有方形的底壁（2a)及 周壁（2b)，在周壁（2b)的上端，設置有與底壁（2a)的周邊 201230938 部大致平行且整體上大致方形之呈環形的内側突出緣部 (2c)。 光信號端子（4)、電性信號端子、發光二極體 及DC插座（7)係嵌入在外殼本體（2)之周壁所設置的貫穿 孔’且使其端面露出於外部。在光信號端子（4)連接光纖 電缓（POF) ’在電性信號端子（5)連接[αν用的電性信號 電緵。 2個IC(8)、（9)中，一 ic (8)為具有媒體轉換功能的 1C ’另一 1C (9)則作為附加高速通信功能用1C。附加高 速通h功能用1C(9)是自動切換電性信號的通信速度，因 此，不官電性#號的通信速度（Ether_ Net側的通信速度） 是10/1 00/1 000Mbps中的任一速度，光信號的通信速度 (光纖側的通信速度）都設為1〇〇〇Mbps(1Gbps)’可切換 100Mbps之速度的通信（包含1〇bps之速度的通信）與比 其更高速的通信（l〇〇〇Mbps)。 藉由附加該功能，可一面保持以往之功能（即可進行 Mbps以下之速度的通信），一面進行比以往更高速的 L L另方面，在附加這種高速通信功能的情況，來 自附加高速通信功^ IC(9)等的發熱變大，而擔心對構 成媒體轉換器⑴之各種電子元件的動作環境造成影響。 a作為散熱手段的散熱片（1〇)及4支散熱用支柱（ιι) 是作為藉附加高速通信功能的發熱量增加對策而設置， 散熱片(1〇)從2個IC(8)、(9)的上面側與這些元件密接。 在基板⑴上，於其四個角落除了設有供插入陽螺絲⑼ 之共4處的孔（3a)以外，在避開散熱片（ι〇)的位置還設有 201230938 用以安裝散熱用支柱（1丨）之共4處的孔（3b)，其中該陽螺 絲（1 3)係用以將基板（3)安裝於外殼本體（2)之底壁（2a)。 各散熱用支柱（1 1)係由配置於基板（3 )之下侧的第i 柱體（21)及配置於基板（3)之上侧的第2柱體（22)所構 成。如第5圖所詳示，各柱體（21)、（22)係於上端部（前 端部）設置凸狀的陽螺紋部（21a)、（22a)，並於下端部（基 端部）設置凹狀的陰螺紋部（21b)、（22b)而成。在外殼 的底壁（2a)，設置有貫穿孔（2d)，該貫穿孔（2d)係供用以 固定第1柱體（2 1)之陽螺絲（23)插入。 在進行各散熱用支柱（1丨）的組裝時，首先，藉由第2 柱體（22)的陽螺紋部（22a)與以突出狀設置於蓋（12)下面 的陰螺紋部（12a)螺合而使蓋（12)與第2柱體（22)結合， 接著，將各第2柱體（22)被載置於基板（3)上，然後，各 第1柱體（21)從基板（3)的下方與各第2柱體（22)螺合， 接著，將各第1柱體（21)載置於外殼（2)的底壁（2a)上， 然後’從外殼（2)之底壁（23)的下方所插入之陽螺絲（23) 與第1柱體（21)的陰螺紋部pi 累合。依此方式，第i 柱體（21)係其上端面與基板（3)抵接，而且其下端面與外 殼（2)的底壁（2a)抵接，第2柱體（22)係其下端面與基板（3) 抵接，而且其上端面與蓋（12)抵接。因此，基板（3)的熱 會經由第1柱體（21)及第2柱體（22)(散熱用支柱（11)而散 埶。 在此’盍（1 2)採用金屬製（例如鋁製），被賦與作為散 熱手段之功能’散熱用支柱（1 1)(第2柱體（22))的熱可經 由表面露出於外部的蓋（12)而高效率地散熱。 201230938 蓋（12)不是載置於在媒體轉換器⑴之周壁⑽上端 所設置之内側突出緣部(2c)，藉由調整散熱用支柱(⑴ 的高度，可如第2圖所示般利用各散熱用支柱（ιι)支撐 成不與外殼本體（2)之周壁（2b)的内側突出緣部（2c)接 觸。因此’於蓋（12)與區域22的周壁（2b)之間形成間隙 (G) ’在外殼本體（2)内被加熱之空氣易與外殼本體（？）外 部的空氣作替換，藉此可更提高作為散熱手段之功能。 在上述，散熱用支柱（11)只要作成暨設於基板（3)即 可，其數量、設置位置、截面形狀及材料等可進行各種 變更。例如，可省略與第丨柱體（21)螺合的陽螺絲（23)， 又，亦可作成省略第丨柱體（21)，而利用陽螺絲（23)將第 2柱體（22)固定於基板（3)。又，蓋（12)與第2柱體（22)的 結合亦可不是利用螺合的方式，而是僅利用嵌合的方 式。總之，散熱用支柱（11)只要與基板（3)接觸且與蓋（12) 接觸即可，未限定為該構成。 此外，因為蓋（12)係藉由設成具有六角頭之陽螺絲 元件的散熱用支柱（11)而可裝卸自如地安裝於外殼本體 (2)，所以在不需要散熱的情況，易於將其變更成合成樹 脂製，不是將外觀為第1圖所示的形狀者作為高速通信 (1000Mbps)用，亦可作為1〇〇 Mbps之通信用來使用。又， 散熱片（ίο)亦可作成其一部分或全部與蓋（12) 一體形 成。又，亦可作成將用以改善散熱的複數個孔設置於外 殼本體（2)的周壁（2b)。 [工業上的可應用性] 藉由使用本發明的媒體轉換器，來進行電性信號電 -9- 201230938 纜與光纖電纜的連接，可實現高速通信，可有助於提高 光通信的性能。 【圖式簡單說明】 第1圖係表示本發明之媒體轉換器的第1實施形態 之外觀的立體圖。 第2圖係本發明之媒體轉換器之第1實施形態的剖 面圖。 第3圖係沿著第2圖之皿一m線的剖面圖。 第4圖係本發明之媒體轉換器的第1實施形態之内 部構成的分解立體圖。 第5圖係本發明之媒體轉換器的第1實施形態之特 徵部分的分解圖。 【主要元件符號說明】 1 媒體轉換器 2 外殼本體 2a 底壁 2b 周壁 2c 内側突出緣部 3 基板 4 光信號端子 5 電性信號端子 6 發光二極體 9 附加高速通信功能用1C 10 散熱片 11 散熱用支柱 -10- 201230938 12 蓋 12a 陰 螺 紋 部 21 第 1 柱 體 22 第 2 柱 體 22a 陽 螺 紋 部 23 螺 絲201230938 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a medium such as a connection electrical signal cable and an optical fiber transmission medium. [Prior Art] As an electrical signal cable and an optical converter, it is known that the outer cover 9 is provided with an optical signal terminal at a desired portion of the peripheral wall of the base inside the casing body [Patent Document] [Patent Document 1] 〕···········································································速度 The speed of 〇 Mbps is increased, and the action of the constituent elements is affected. It is an object of the present invention to provide a media converter that achieves high performance. [Means for Solving the Problem] The media converter of the present invention is a cover for a shoulder; an optical converter provided at a desired portion of the peripheral wall of the main body of the casing, the media converter is generally used to connect different types of fiber cables The connected media housing body and the opening of the opening; and the housing body and the electrical signal terminal. In the case of the speed of 100 Mbps and the speed of 100 Mbps (for example, the communication is also possible, and the function is also possible), there is a concern that the heat is generated. By improving the heat dissipation, the housing body and the plug can be prepared. The I substrate is installed; and the housing is provided: the terminal and the electrical signal terminal, 201230938: a plurality of heat dissipation pillars are erected on the front end of the heat dissipation pillar and the cover abutment base * the medium media converter is characterized by a plate, and the cover It is made of metal, and each has an ic with a media conversion function on the earth plate, and is equipped with functions required for high performance of the media converter (for example, it can be used for high-speed communication of 1 Gbps or 1 Gbps. In the conventional configuration (for example, the communication is performed at a speed of 00 Mbps or less), the "heat generation is not so large, so the structure for heat dissipation 5' can be set by a plurality of through holes. The case body and the cover are adapted, but when the performance is high, the amount of heat generation increases, which may adversely affect the operation of the constituent elements of the media converter. Therefore, it is desirable to dissipate heat and reduce the size of the media converter and to efficiently dissipate heat. According to the media converter of the present invention, a plurality of heat-dissipating pillars are vertically erected on the substrate and the cover is made of metal, and the front ends of the heat-dissipating pillars are in contact with the cover, whereby the heat of the substrate passes through a plurality of heat-dissipating pillars. And the cover is radiated to the outside. Therefore, the media converter does not become large and can dissipate heat efficiently. For example, the communication speed of the electric 彳g (for example, the communication speed of the E ther-N et side) is set to l〇/l〇〇/1〇〇〇Mbps, and the communication speed is switched on the Ether-Net side. The communication speed of the signal (the communication speed on the optical fiber side) is set to 100 Mbps (1 Gbps) with respect to any of the communication speeds. The outer casing system is preferably made of a synthetic resin, and the heat-dissipating pillar is made of a suitable metal (copper, aluminum, steel), and the lid is made of, for example, aluminum. The housing body may be formed by one component or by an upper housing and a lower housing. -4- 201230938 The heat dissipation pillar is formed, for example, by a column that abuts against the lower surface of the substrate and a second column that abuts against the upper surface of the substrate, and the first column abuts against the bottom wall of the casing, and the second column 盥The cover abuts the main rent, and the connection. Each of the column systems has, for example, a convex male threaded portion at the end portion and a concave female thread at the other end portion. In this case; brother, on the substrate, set the through hole for the insertion of the first thread of the main thread. The second column system is placed on the substrate after the male thread portion of the male thread portion = the cover, the first body The male thread is screwed to the female threaded portion of the second cylinder. A heat sink as a means for dissipating heat is provided between the cover and the substrate. In this case, the heat sink is made of, for example, a sheet having adhesiveness or a grease (silicone greasem Ic is preferably used. It is also possible to integrally form a cover and an aluminum heat sink. / Preferably, the cover is The gap between the outer wall and the outer wall of the outer casing body is formed by the heat dissipation column. The outer brick is too e? 7b from the body made of synthetic resin, at the top of its peripheral wall, from the lower Taizhou _ s s ° The inner side of the cover is opposite to the inner side of the cover. Although the peripheral portion of the cover is not caused by the peripheral wall support 2 of the outer casing body and the outer casing body, in the present invention,盍 Supporting the upper surface of the peripheral wall of the body without the support by the heat-dissipating pillar. In this way, the air heated in the body of the casing is easily and externally separated by the gap generated between the circumference of the cover and the body of the casing. The air outside the body is replaced by the air, and further functions as a means of heat dissipation. In the media converter, it is preferable to set an additional high-speed communication in which communication capable of switching i〇〇MbpK rc degrees is communicated with higher speed communication. Function with 201230938 By adding a high-speed communication (lGbps, 10 Gbps, etc.) and a speed-dependent function (switching function), it is possible to maintain the previous functions (that is, to perform communication at speeds of 100 Mbps or less) while performing higher speed than ever before. On the other hand, when such an ic with a high-speed communication function is mounted, it is feared that heat from the ic may affect the operating environment of other elements, and this can be avoided by the above-described heat dissipation means. [Effects] According to the media converter of the present invention, since a plurality of heat-dissipating pillars are erected on the substrate, and the cover is made of metal, the front ends of the heat-dissipating pillars are in contact with the lids, so that heat dissipation is improved, and high performance can be achieved. [Embodiment] Hereinafter, the form of the present invention will be described with reference to the drawings. In the following description, the upper and lower parts refer to the upper and lower sides of the second drawing, but the upper and lower sides are expedient. The underside of the converter can also be along the ground level of the ground or table, and the underside of the media converter can also be along the vertical plane of the wall, etc. As shown in Fig. 1 to 5] The media converter (1) of the present invention includes: a casing body (2) that is open at the top; a substantially square substrate (3) supported on a bottom wall of the casing (2); and is disposed on the substrate (3) The optical signal terminal (4), the electrical signal terminal (5), the light emitting diode (6), the DC socket (7), and the two ICs (8) and (9) are disposed inside the casing (2). A heat sink (10) as a heat dissipating means, a plurality of metal heat dissipating pillars (11), and a lid (12) cover an opening of the casing body (2). The casing body (2) is made of synthetic resin and has The square bottom wall (2a) and the peripheral wall (2b) are provided at the upper end of the peripheral wall (2b) with an inner protruding edge portion (2c) which is substantially parallel to the periphery of the bottom wall (2a) and has a substantially square shape and is substantially square. ). The optical signal terminal (4), the electrical signal terminal, the light-emitting diode, and the DC socket (7) are fitted in the through hole ' provided in the peripheral wall of the casing body (2), and the end faces thereof are exposed to the outside. Connect the fiber optic cable (POF) to the optical signal terminal (4). Connect the electrical signal for [αν] to the electrical signal terminal (5). Among the two ICs (8) and (9), one ic (8) is 1C ’ with the media conversion function, and the other 1C (9) is used as the additional high-speed communication function 1C. The 1C (9) is used to automatically switch the communication speed of the electrical signal. Therefore, the communication speed of the non-communication ## (communication speed on the Ether_Net side) is 10/1 00/1 000 Mbps. At a speed, the communication speed of the optical signal (the communication speed on the optical fiber side) is set to 1 Mbps (1 Gbps), the communication capable of switching speeds of 100 Mbps (communication including speeds of 1 〇 bps) and higher speed Communication (l〇〇〇Mbps). By adding this function, it is possible to maintain a higher-speed LL while maintaining the functions of the past (that is, communication at a speed of Mbps or lower), and to add high-speed communication power when such a high-speed communication function is added. ^ The heat generation such as IC(9) becomes large, and there is a concern that the operating environment of various electronic components constituting the media converter (1) is affected. a heat sink (1〇) and four heat-dissipating pillars (1) are installed as measures to increase the amount of heat generated by the high-speed communication function. The heat sink (1〇) is from two ICs (8), ( The upper side of 9) is in close contact with these elements. On the substrate (1), in addition to the holes (3a) for inserting the male screws (9) at four corners thereof, 201230938 is also provided at the position to avoid the heat sink (ι) for mounting the heat dissipation pillars. (1) A total of four holes (3b) for attaching the substrate (3) to the bottom wall (2a) of the casing body (2). Each of the heat dissipation pillars (1 1) is composed of an i-th pillar (21) disposed on the lower side of the substrate (3) and a second pillar (22) disposed on the upper side of the substrate (3). As shown in Fig. 5, each of the cylinders (21) and (22) is provided with a convex male thread portion (21a) and (22a) at the upper end portion (front end portion) and at the lower end portion (base end portion). The concave female thread portions (21b) and (22b) are provided. A through hole (2d) is provided in the bottom wall (2a) of the outer casing, and the through hole (2d) is provided for inserting the male screw (23) for fixing the first cylinder (21). When assembling the heat-dissipating pillars (1), first, the male screw portion (22a) of the second cylinder (22) and the female screw portion (12a) which is protruded from the lower surface of the lid (12) are provided. The cover (12) is coupled to the second cylinder (22) by screwing, and then the second cylinders (22) are placed on the substrate (3), and then the first cylinders (21) are The lower portion of the substrate (3) is screwed to each of the second columns (22), and then the first column (21) is placed on the bottom wall (2a) of the casing (2), and then 'from the casing (2) The male screw (23) inserted under the bottom wall (23) is engaged with the female screw portion pi of the first cylinder (21). In this manner, the i-th pillar (21) has its upper end surface abutting against the substrate (3), and the lower end surface thereof abuts against the bottom wall (2a) of the outer casing (2), and the second cylinder (22) is The lower end surface abuts against the substrate (3), and the upper end surface abuts against the cover (12). Therefore, the heat of the substrate (3) is dispersed by the first column (21) and the second column (22) (heat dissipation pillars (11). Here, '盍2 (1) is made of metal (for example, aluminum) The heat applied to the heat dissipation support (1 1) (the second cylinder (22)) can be efficiently dissipated through the cover (12) whose surface is exposed to the outside. 201230938 Cover ( 12) It is not placed on the inner protruding edge portion (2c) provided at the upper end of the peripheral wall (10) of the media converter (1), and by adjusting the height of the heat-dissipating pillar ((1), the heat-dissipating pillar can be used as shown in Fig. 2 (Im) supported so as not to be in contact with the inner protruding edge portion (2c) of the peripheral wall (2b) of the outer casing body (2). Therefore, a gap (G) is formed between the cover (12) and the peripheral wall (2b) of the region 22' The air heated in the casing body (2) is easily replaced with the air outside the casing body (?), whereby the function as a heat dissipating means can be further improved. In the above, the heat dissipating strut (11) is formed and disposed on the substrate. (3) Yes, the number, setting position, cross-sectional shape, material, etc. can be variously changed. For example, it can be omitted The male screw (23) to which the second cylinder (21) is screwed, or the second cylinder (21) may be omitted, and the second cylinder (22) may be fixed to the substrate by the male screw (23) (3) Moreover, the combination of the cover (12) and the second cylinder (22) may not be by means of screwing, but only by fitting. In short, the heat-dissipating pillar (11) is only required to be combined with the substrate (3). The contact (12) is not limited to this configuration. The cover (12) is detachably attached to the heat dissipation support (11) having a male screw element having a hexagonal head. Since the case body (2) is not required to be dissipated, it is easy to change it to a synthetic resin, and it is not used for high-speed communication (1000 Mbps) or the case of 1 Mbps. The communication is used for the purpose. Further, the heat sink (ίο) may be formed as a part or all of the cover (12). Alternatively, a plurality of holes for improving heat dissipation may be disposed on the casing body (2). Peripheral wall (2b) [Industrial Applicability] Power is made by using the media converter of the present invention Signaling -9- 201230938 The connection between the cable and the fiber optic cable enables high-speed communication and helps to improve the performance of optical communication. [Description of the drawings] Fig. 1 shows the first embodiment of the media converter of the present invention. Fig. 2 is a cross-sectional view showing a first embodiment of the media converter of the present invention. Fig. 3 is a cross-sectional view taken along line m of the second drawing. Fig. 4 is a view of the medium of the present invention. Fig. 5 is an exploded perspective view showing a characteristic portion of the first embodiment of the media converter of the present invention. [Explanation of main component symbols] 1 Media converter 2 Case body 2a Bottom wall 2b Peripheral wall 2c Inner protruding edge 3 Substrate 4 Optical signal terminal 5 Electrical signal terminal 6 Light-emitting diode 9 Additional high-speed communication function 1C 10 Heat sink 11 Heat-dissipating post-10-201230938 12 Cover 12a Female thread portion 21 1st cylinder 22 2nd cylinder 22a male thread part 23 screw