TW201227852A - Manufacturing method of a solder ball - Google Patents

Abstract

The present invention relates to a manufacturing method of a solder ball 70, which includes; a first step wherein a core material 11 is applied to a surface 1a of a substrate 1 to which a first adhesive layer 5 is provided; a second step wherein a second adhesive layer 13 is applied to the surface 11a of the core material 11, a third step wherein solder particles 14 are adhered to the surface of the second adhesive layer 13; a fourth step wherein the solder particles 14 are melted to form a solder layer 15; and a fifth step wherein the core material is separated from the substrate 11 to obtain a solder ball.

Description

201227852 VI. Description of the Invention: [Technical Fields of the Invention] The contents of the present application are applied to a three-substrate, ceramic-based [circuit pattern, on the circuit board of the electronic component such as a capacitor, etc. J electronic parts for F fusion welding steps, ^ electrode bonding steps: miniaturization development. As a QFP (Package) which can realize a pitch, the present invention relates to a method of manufacturing a solder ball. The present application claims priority from Japanese Patent Application No. 2010-241029, issued on Oct. 27, 2010. [Prior Art] In recent years, as a means for forming a circuit, a method of soldering a 1C element, a semiconductor wafer, and a resistor member on a plastic plate or an insulating substrate coated with a plastic or the like has been widely used. . Wherein, as a method of connecting the terminal to a predetermined portion of the circuit board, the following steps are generally performed in sequence: the step of printing a solder paste or a flux on the surface of the conductive circuit electrode surface to form a thin layer of solder first, The step of positioning the placement, the solder thin layer and the solder paste are performed, and the solder is solidified to eject the electronic component and the conductive electric shoe. In addition, recently, with electronic products and circuit boards, electronic components that require precise pitch of electronic components, such as 细节.3mm Quad Flat Package, CSP (Chip Size 0.15mm pitch) 201227852, such as an FC (Flip Chip) and an LSI wafer of a BGA structure, is known. Further, as a method of mounting an electronic component on a circuit board, a solder bump formed on a lead terminal of an electronic component is formed on a circuit board. A method of welding a predetermined portion of solder bumps is known. In such a method, the solder bumps are required to have a fine pattern shape in order to correspond to the fine pitch of the electronic parts. Further, as a circuit A method of forming a solder bump on a substrate, a plating method, an electroless plating method, a method of soldering a solder powder paste, and the like are known. However, a solder bump manufacturing method using an electroless plating method is It is difficult to thicken the solder layer, and it is impossible to firmly bond the electronic component and the conductive circuit electrode. In addition, the solder bump is formed by electroplating. In the manufacturing method, it is difficult to make a current for electroplating flow through a complicated circuit 'and it is impossible to form a solder bump of a fine pattern shape. Moreover, the method of printing a solder paste is difficult to correspond to a fine pitch pattern, and thus it is impossible to form a fine Solder bump of pattern shape. Based on the above, as a method of forming a solder bump having a certain and uniform height corresponding to a fine pattern shape, a solder ball composed of a substantially spherical solder is used. A method of adhering to a circuit board. As a method of attaching a solder ball to a circuit, the adhesive layer is allowed to react on the surface of the conductive circuit electrode of the circuit board to impart adhesiveness, and the solder ball is attached to the adhesive portion. The method is known. After that, the solder ball is melted to form a solder bump (Patent Document 1). Further, regarding the application of the method described in Patent Document 1, a solder ball is required in a necessary portion on the electrode of the conductive circuit. Adhesion technology has also been developed (refer to Patent Document 2).

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-41803 (Patent Document 2) However, a semiconductor device such as a BGA (spherical grid array) structure Such a solder bump must have a certain height. When a conventional solder ball is used, when the semiconductor wafer and the circuit board are connected by fusion welding, the solder ball is melted and the original shape cannot be maintained. Therefore, the solder bumps cannot be maintained at a constant height, and the semiconductor wafer may be bonded in a state of uneven sinking and tilting. In response to this problem, the current method is to allow a high melting point solder ball to melt and form a solder bump, and then use a low melting point solder having a lower melting point than the high melting point solder ball to carry the semiconductor wafer and the circuit substrate. Engage. As another method, a method of using a metal ball (copper core solder ball) such as copper plated with a solder layer as a solder ball is also known. According to this method, the copper core solder balls are placed on the circuit board and then melted, whereby solder bumps can be formed, and since the core body serves as a spacer, the distance between the electronic component and the circuit board can be kept constant. However, according to the foregoing method, the material of the high melting point solder is limited, and it is necessary to use a composition containing a high concentration of lead. In addition, the high-melting-point solder that has been put to practical use is a high-concentration lead containing 95% or 80% of lead. The α-ray emitted by lead causes LSI and other malfunctions. Therefore, it is necessary to use a high-priced lead that removes only lead isotope with low alpha rays or a fully lead-free 201227852 high melting point solder. In addition, in the method of using the copper core ball, it is a difficult technique to attach the solder to the copper ball, and there is a problem that the manufacturing cost is remarkably increased, and therefore, the generalization cannot be achieved. The present invention has been made in view of the above circumstances, and an object thereof is to provide a welding method which can be formed at a low cost in accordance with a fine pattern shape. The inventors of the present invention have intensively studied the results of the present invention in order to solve the above problems. That is, the present invention employs the following technical means. [1] A method for producing a solder ball, characterized in that a tie is applied to a first adhesive layer provided on a surface of a substrate to adhere a core, and an adhesion-promoting compound is formed on a surface of the core body. a second step of adhering the layer, a third step of attaching the particles to the second adhesive layer on the surface of the core, a fourth step of melting the solder particles to form a solder layer on the surface of the precursor, and a nucleus from the core The fifth step of stripping the substrate to obtain a solder ball. [2] The method for producing a solder ball according to [1], wherein the method is Cu. [3] The method for producing a solder ball according to [1] or [2], before the first step, comprising a pre-step having an opening for exposing a part of a surface of the first adhesive layer The member is disposed on the first adhesive layer; and then, in the first step, the core body is adhered to the surface of the first adhesive layer exposed from the opening. The problem is the same. In order to achieve the ball, the second step is to make the core 9 and r'. In the core, the first 3-8-201227852 [4] is used in the method of manufacturing the solder ball described in [3]. The first member is composed of a first layer and a second layer; and the step of disposing the first member on the first adhesive layer comprises: forming a first layer of the first member having an opening a step of disposing on the first adhesive layer; and a second layer of the first member having an opening having a smaller diameter than the opening portion on the first layer of the first member, as described above in the first layer a step of disposing a central portion of the opening portion and a central portion of the opening portion of the second layer; between the first step and the second step, further having a second layer of the first member from the foregoing The step of peeling off the first layer of the first member. [5] The method for producing a solder ball according to [3], wherein the step of peeling the first member from the first adhesive layer is performed between the first step and the second step: and covering The manner of the surface of the first adhesive layer is a step of attaching a mask composed of particles; the particle diameter is smaller than the thickness of the first member. [6] The method for producing a solder ball according to [1] or [2], wherein before the first step, a plurality of the first adhesive layers having a dot shape are formed on the substrate so as to be apart from each other The surface is pre-stepped. [7] The method for producing a solder ball according to [6], wherein the step of forming the first adhesive layer comprises: -9 " 201227852 having a dot-like opening for exposing a part of the surface of the substrate a step of disposing a second member on the substrate; and coating the adhesive material for forming the first adhesive layer with the second member as a mask, thereby obtaining a plurality of the first adhesives in a dot shape The steps of the layer. [8] The method for producing a solder ball according to [6], wherein the step of forming the dot-shaped first adhesive layer comprises: forming a dot shape on a surface of the substrate for transfer from each other a step of applying a tackifying compound to the metal film, and a step of transferring the tackifying compound onto the surface of the substrate from the transfer substrate to form a first adhesive layer. [9] The method for producing a solder ball according to [8], wherein the step of forming the dot-shaped first adhesive layer comprises: covering the surface of the substrate with a mask having an opening; a step of transferring the adhesion-imparting compound from the transfer substrate on the surface of the substrate exposed from the opening portion of the mask; and in the second step, maintaining the surface of the substrate covered by a mask And forming the aforementioned second adhesive layer on the core body. [10] The method for producing a solder ball according to [6], wherein the step of forming the first adhesive layer comprises: forming a dot @ on the surface of the substrate so as to be apart from each other, and The metal film is coated with an adhesive imparting compound to form

S -10- 201227852 Adhesive layer steps. [11] The method for producing a solder ball according to [10], wherein the step of forming the first adhesive layer comprises: forming a dot-shaped metal film on the surface of the substrate; And after coating the surface of the substrate with a mask having an opening, the step of applying the adhesion-imparting compound to the surface of the metal film exposed from the opening. [12] The method for producing a solder ball according to [10] or [11], wherein the metal film is made of tungsten. [13] The method for producing a solder ball according to any one of [1] to [1], wherein the average particle diameter of the solder particles is 1/2 or less of an average particle diameter of the core body. According to the method of manufacturing a solder ball of the present invention, since the solder particles are adhered to the surface of the core body through the second adhesive layer and then the solder particles are melted, the solder layer can be uniformly formed on the surface of the core. Further, it is easier to form a solder layer than a conventional method of forming a solder layer by plating or the like. Further, since the solder layer is formed on the core body while the core body is allowed to adhere to the surface of the substrate through the first adhesive layer, more core bodies can be processed simultaneously than in the conventional method. Further, since the core body is adhered to the surface of the substrate through the first adhesive layer, the core body is easily removed from the substrate after the formation of the solder layer. According to the above description, the formation of the solder balls can be greatly simplified and the production can be performed efficiently as compared with the conventional method. Therefore, it can reduce the welding ball system -11 - 201227852 caused this. Further, the core body can function as a spacer by forming a solder bump on the surface of the core body by soldering a solder ball formed by the solder layer. Therefore, even if the solder layer is melted, the solder bumps can maintain a certain height. Therefore, even if electronic parts are mounted on the solder bumps, the electronic parts do not sink due to their own weight. In this way, the distance between the electronic component and the circuit board can be kept constant. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described, but the present invention is not limited to the examples. It is of course possible to change and add quantities, positions, sizes, numbers, and the like without departing from the scope of the invention. (First Embodiment) Hereinafter, a method of manufacturing a solder ball 7 according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1A to Fig. 1E are diagrams showing the steps of a method of manufacturing a solder ball according to the present embodiment. The method of manufacturing the solder ball 70 of the first embodiment includes a first step of attaching the core body 11 to the surface 1 of the substrate 1 on which the first adhesive layer 5 is provided, and a second step on the surface 11a of the core body 11. The second step of the adhesive layer 13 'the third step of attaching the solder particles 14 on the surface of the second adhesive layer 13 , the fourth step of melting the solder particles 14 to form the solder layer 15 on the core body 11 , and the slave core 11 The fifth step of peeling off the substrate 1. On the adhesive layer 13, before the core body 11 is attached, the member 2 1 (first member) having the opening portion of the opening 3 -12 - 201227852 is disposed, and in the first step, the adhesive is exposed in the opening portion of the member 2 1 On the surface of the layer 5, the core body 11 is attached. Each step will be described in detail below. First, the substrate 1 provided with the first adhesive layer 5 is prepared. As the substrate 1, for example, a substrate made of polyimide, a substrate made of an acid-resistant resin, a ceramic substrate, a glass substrate, or the like can be used. In addition, the base material 1 is not limited to the materials exemplified herein, and any material that can withstand the heat of the solder particles 14 to be described later can be used as the substrate of the present invention without limitation. The substrate is used. The first adhesive layer 5 is applied to the substrate 1. The material forming the first adhesive layer 5 may be any material that can be used as long as it can adhere to the core body 1 1 and can withstand melting of the solder particles 14 to be described later. Specifically, a heat-resistant adhesive such as a lanthanum-based adhesive can be used. Further, as the substrate 1 having the first adhesive layer 5, a polyimide polyimide tape can be used. Next, the first member 21 is disposed so as to cover the surface 5a of the first adhesive layer 5. The first member 21 is a member for arranging the core body 11 on the surface 5a of the first adhesive layer 5 with a space therebetween in the first step to be described later. In the first member 21, a plurality of dot-shaped first opening portions 31 are provided at intervals. The interval and arrangement of the openings can be arbitrarily selected. By arranging the first member 21 so as to cover the surface 5a of the first adhesive layer 5, a part of the surface 5a of the first adhesive layer 5 is exposed in a dot shape. Further, as the first adhesive layer 5', a material which causes the adhesion of the surface 5a to disappear by ultraviolet irradiation, heating or the like can be used. Further, in the case of using such a material from -13 to 201227852, ultraviolet irradiation, heating, or the like which causes the adhesion of the first adhesive layer 5 to disappear can be performed at an arbitrary stage. The first member 21 can be used: generally, a metal plate-like member provided with an opening portion of the core body 1 1 is disposed. Specifically, as the material of the first member 21, stainless steel or nickel having a thickness of about 60/zm can be used. Further, the material of the first member 21 is not limited to a metal, and as long as the second adhesive layer 13 is formed on the core body 11 as will be described later, the adhesiveness is not imparted to the portion covered by the first member 21, The material thereof is not particularly limited. Further, the first member 21 is not limited to the plate member, and the solder paste may be applied to the surface of the first adhesive layer 5 by screen printing. Further, the thickness Η of the first member 21 (the height difference between the one surface 1a of the substrate 1 and the upper surface of the first member 21) can be appropriately set in accordance with the particle diameter D of the core body 11, and the thickness Η is preferably set to be larger than The particle diameter D of the core body 11 is small, and is more preferably set to be in the range of 1 / 2 m or more and 1 / 2 or less of the particle diameter D. On the other hand, if the thickness Η is larger than the particle diameter D, the core body 11 does not easily enter the first opening portion 31, which is not preferable. Further, if the thickness Η is not up to lym, the core body 11 is liable to fall off, which is not preferable. Further, in order to avoid arranging two or more core bodies 11 in the first opening portion 31, it is preferable to mix the thickness Η of the first member 21 and the particle diameter D of the core body 11 in the diameter F! of the first opening portion 31. Set it appropriately. The range of the diameter F, can be expressed by the following mathematical formula (1). 3 • 14- 201227852 [Number 1] 2, /h(DH)^F ^D+ZVHCD-H) · (1) According to the above mathematical formula, specifically, for example, the particle diameter D is 100 μm, and the first When the thickness Η of the member 21 is 20 // m, the diameter of the first opening portion 31? ! It is 80/zm or more and less than 180/zm. Further, in the range of the diameter Fi of the first opening portion 31, assuming that the diameter of the solder particles 14 adhering to the surface of the core body 11 is d, it can be expressed by the following formula (2). [Number 2] D+ 2 F1SD + 4 d · ·. (2) By making the diameter? ! In the range of the mathematical formula (2), the core body 1 1 is easily attached to the first opening portion 31. Further, the interval G between the adjacent first opening portions 31 is preferably corresponding to the particle diameter D of the core body 11 and the particle diameter d of the solder particles 14 and the thickness of the first member 21, and appropriately set up. The interval Gi between the adjacent first opening portions 31 can be expressed by the following mathematical expression (3). [Equation 3] 2 d + D-2VH (DH) < G-, · · · (3) Further, the interval G between the adjacent first opening portions 31 is a better range, assuming solder particles 14 The diameter d is expressed by the following mathematical formula (4). -15- 201227852 [Equation 4] 4 d+D-2VH(DH) SG-, ^8d + D-2VH(DH) · (4) By spacing the adjacent first opening portions 31 from each other Gi can form the solder balls 70 at a high density on the substrate 1 within the range of the mathematical formula (4), and can prevent the adjacent solder balls 70 from being bonded to each other. On the other hand, if the interval G between the first openings 3 1 is smaller than the minimum 値 represented by the formula (3), the solder balls 70 may be joined to each other, which is not preferable. Further, if the interval between the first openings 3 1 is too wide, the number of solder balls 70 that can be formed at one time is reduced, and the manufacturing efficiency is lowered, which is not desirable. Further, the first opening portion 31 has a circular shape in plan view, and may have an elliptical shape or a quadrangular shape. (First Step) Next, as shown in Fig. 1A, the core body 11 is adhered to the surface 5a of the first adhesive layer 5 exposed from the first opening portion 31. At this time, 'the method of attaching the core body 11 on the first adhesive layer 5' may be selected as needed, for example, a method of directly supplying the core body 11 toward the first adhesive layer 5 in air or in an inert atmosphere; Or a method in which a core body is dispersed in a dispersion liquid (not shown) to form a slurry state, and the slurry is supplied to the first adhesive layer 5. 11 gas 11. The amount of the core body 11 at this time First, an example of a method of allowing the core body to adhere to the first adhesive layer 5 in air or in an inert gas atmosphere will be described. First, the core body 11 is placed in a container filled with an empty or inert gas. At this time, the nucleus of the nuclei

-16- 201227852 can be arbitrarily chosen. Next, the substrate 1 on which the first adhesive layer 5 is formed is placed in the container. Next, the first adhesive layer 5 is brought into contact with the core body 11 by a method of tilting or vibrating the container. Thereby, the core body 11 is attached to the surface 5a of the first adhesive layer 5. Unattached cores can be removed as needed. Next, an example of a method of attaching the core body 11 to the first adhesive layer 5 in a liquid will be described. First, a dispersion liquid such as water is placed in a container (not shown), and then the core body 1 1 is added to the dispersion liquid. Next, the container is tilted to concentrate the dispersion and the core body 11 on one side, and the substrate 1 is placed in the container so as not to come into contact with the dispersion liquid and the core body 11. Next, the container is tilted left and right, whereby the first adhesive layer 5 on the substrate 1 is brought into contact with the core body 11 in the dispersion. Thereby, the core body 11 is attached to the first adhesive layer 5. By attaching the core body U to the liquid in this manner, it is possible to prevent the core body 1 from adhering to the non-adhesive portion due to static electricity, and to prevent the core body 11 from agglomerating due to static electricity. Therefore, the method of attaching the core body 11 to the liquid is particularly preferable in the case of using the minute core body 11. The method of attaching the core body 11 to the first adhesive layer 5 is not limited to the method of adhering to the liquid, and a suitable method can be suitably employed depending on conditions such as the size of the core body 11. As the material of the core body 1, a metal can be used, and for example, tin (bn) is preferably used, and copper (Cu) is more preferably used. The material of the core ruthenium is not limited to such a material as long as it has a melting point higher than the melting point of the solder particles 4 described later, and the second adhesiveness-imparting compound can obtain adhesiveness, and conductive can also be used. Other materials such as substances and alloys. Examples of other materials other than copper and tin -17-201227852 include metals such as Ni, Ni-Au, or Au_Sl·, alloys, and the like. Further, the average particle diameter D of the core body 1 is preferably in the range of 20 Å to 20 0 /zm, preferably in the range of 30/zm to 130" „, based on workability, and more preferably In the range of 50/zm to 80/zm (Second step) Next, as shown in Fig. 1B, an adhesive adhesion-imparting compound is applied to the surface 11a of the core body 11 to form the second adhesive layer 13. First, the following At least one or two or more of the adhesion-imparting compound (first adhesion-imparting compound) are dissolved in water or acidic water, preferably to a slightly acidic pH of about 3 to 4. Thereby an adhesive solution is formed. Then, the adhesive solution is immersed in the substrate 1 obtained in the first step, or an adhesive solution is applied on the substrate 1, whereby the second adhesive layer 13 is formed on the surface 11a of the core body 11. Here, as the adhesive The property-imparting compound can be arbitrarily selected, and, for example, a naphthotriazole derivative, a benzotriazole derivative, an imidazole derivative, a benzimidazole derivative, a mercaptobenzothiazole derivative, and a benzene can be used. And thiazole sulfur fatty acids, etc. These adhesion imparting compounds, for The genus and the like have a good effect on the adhesion of copper. In addition to copper, it is also capable of imparting adhesion to other conductive materials, etc. Further, it is suitable for the benzotriazole derivative of the present invention. It can be expressed by the general formula (1). -18- 3 201227852 [Chemical 1] R3 R4

In the formula (1), R1 to R4 are independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms (preferably 5 to 16), an alkoxy group, F, Br, C1, I, a cyano group, an amine group or an OH group. base. Further, the naphthotriazole derivative which is suitable for use in the present invention can be represented by the general formula (2). [Chemical 2] R7 R8 R9 Η

In the formula (2), R5 to R10 are independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms (preferably 5 to 16), an alkoxy group, F, Br, C1, I, a cyano group, an amine group or an OH group. base. Further, it is suitable for the imidazole-based derivative of the present invention. It can be expressed by the general formula (3). I [化3]

R11—C\N/C—R12 • (3) In the formula (3), R11 and R12 are independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms (-19 to 201227852, preferably 5 to 16), and an alkane. An oxy group, F, Br, Cl, I, a cyano group, an amine group or a hydrazine H group. Further, the benzimidazole-based derivative to be used in the present invention can be represented by the general formula (4). 【化4】

(4) In the formula (4), R13 to R17 are independently a hydrogen atom, an alkyl group having 1 to 16 (preferably 5 to 16) carbon atoms, an alkoxy group, F, Br, C1, I, and cyanide. Base, amine or OH group. Further, the mercaptobenzothiazole derivative which is suitable for use in the present invention can be represented by the general formula (5). 【化5】

In the formula (5), R18 to R2 1 are independently a hydrogen atom, an alkyl group having 1 to 16 (preferably 5 to 16) carbon atoms, an alkoxy group, F, Br, C1, I, a cyano group, an amine group or OH group. Further, the benzothiazole sulfur fatty acid derivative which is suitable for use in the present invention can be represented by the general formula (6). -20- 3 • · (6) 201227852 [Chem. 6] R24 R25 R26 y^·-N COOH * R22 In the formula (6), R2 2 to R26 are independently a hydrogen atom, and the carbon number is preferably 1 or 2). Alkyl, alkoxy, F, Br, Cl, 1, base or OH group. Among these compounds, the more the carbon number of 'R1 to R4' in the benzene derivative represented by the general formula (1), the more generally the adhesion is, and the organisms represented by the general formula (3) and the general formula (4) The R11-R17 of the benzimidazole-based derivative is also such that the more the number, the stronger the adhesion. Further, in the benzothiazole thiolipate represented by the general formula (6), the carbon number of R22 to R26 is preferably 1 or 2. Further, examples of the pH adjusting agent for the adhesive solution include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid, and examples of organic acids, formic acid, lactic acid, vinegar malic acid, oxalic acid, and malonic acid can be used. Succinic acid, tartaric acid, etc. The concentration of the adhesion-imparting compound in the adhesive solution is not particularly limited, and can be appropriately adjusted in accordance with the solubility and the use condition, and is 5 mass% to 20 mass% with respect to the entire adhesive solution. By setting the concentration of the adhesion-imparting compound within this range, 11 gives sufficient adhesion. On the other hand, if it is less than 0.05% by mass relative to the total amount of the adhesive, it is impossible to impart sufficient adhesion to the range of -1 to 16 (more than the cyano group and the amine triazole system. For example, an organic acid, a propionic acid, a special, preferably a range of nucleus-producing solutions, and, in addition, 201227852, if it exceeds 20% by mass relative to the adhesive solution, a large amount of adhesiveness is consumed. The efficiency of the compound is deteriorated, which is not preferable. The treatment temperature at which the adhesiveness is applied to the surface 11a of the core body 11 is preferably higher than room temperature. Thereby, the second adhesive layer 13 has a sufficient formation speed and In addition, the optimum treatment temperature differs depending on the concentration of the adhesion-imparting compound and the type of the material of the second adhesive layer 13, and is generally in the range of about 30 ° C to 60 ° C. Preferably, the other conditions are adjusted so that the immersion time in the adhesive solution is in the range of about 5 seconds to 5 minutes. Further, in the adhesive solution, it is preferable to make the ionic form of copper 50 to 1 000 Ppm. The amount coexists. By allowing copper ions to coexist in the range of the range, the formation efficiency of the second adhesive layer 13 and the formation efficiency of the second adhesive layer 13 can be improved. (Third step) Next, as shown in Fig. 1C, on the surface of the core body 11. On the second adhesive layer 1 3, the solder particles 14 are attached as an example of a method of attaching the solder particles 14 to the second adhesive layer 13 to include a second adhesion in the air or in an inert atmosphere. The method of directly supplying the solder particles 14 to the layer 13 or the method of dispersing the solder particles 14 in a dispersion liquid (not shown) to form a slurry state, and supplying the slurry to the second adhesive layer 13. Regarding the second adhesive layer The method of attaching the solder particles 14 to the layer 13 is the same as the method of attaching the core body 11 to the surface of the substrate crucible in the first step, and thus detailed description thereof will be omitted. -22- 3 201227852 In the stage before the adhesion, the first adhesive layer 5' is used as a material which causes the adhesion of the surface 5a to disappear by ultraviolet irradiation or heating, and after the core body 11 is placed on the first adhesive layer 5, The first member 21 can also be peeled off. In the case where the first member 21 is peeled off and the adhesiveness of the surface 5a is removed by ultraviolet irradiation, heating, or the like, the solder particles 14 are prevented from adhering to the surface 5a of the first adhesive layer. The plurality of solder particles 14 are attached to the core body 1'. The particle diameter d of the solder particles 14 is set to be smaller than the average particle diameter D of the core body n. The particle diameter d of the solder particles 14 can correspond to the particles of the core body 1 1 . The diameter D is appropriately set, but is preferably 1 // m or more and 1 / 2 times or less of the particle diameter D. By making the particle diameter d of the solder particles 14 within this range, it is possible to form a core body 11 On the other hand, when the particle diameter d of the solder particles 14 is less than lym, the film thickness of the solder layer 15 becomes too thin, and the amount of solder when the formed solder balls 70 are welded is insufficient. Therefore, when the solder ball 70 is welded, the solder bumps are easily peeled off from the circuit board, which is not preferable. That is, the solder layer 15 becomes insufficient, which is not preferable. Further, when the particle diameter d of the solder particles 14 is 1/2 or more of the average particle diameter D of the core body 11, a sufficient number of solder particles 14 cannot be adhered to one core body 11, which is not preferable. Further, examples of the metal composition of the solder particles 14 include a Sn-Pb system, a Sn-Pb-Ag system, a Sn-Pb-Bi system, a Sn-Pb-Bi-Ag system, and a Sn-Pb-Cd system. Further, based on the viewpoint of excluding Pb from recent commercial waste, it is preferably a Sn-In system, a Sn-Bi system, an In-Ag system, an In-Bi-23-201227852 system, a Sn-Zn system, or a Sn-free Pb. -Ag system, S η - C u system, S η - S b system, Sn-Au system, Sn-Bi-Ag-Cu system, Sn-Ge system, S n - B i - C u system, S n - C u - S b - A g system, Sn-Ag-Zn system, Sn-Cu-Ag system, Sn-Bi-Sb system, Sn-Bi-Sb-Zn system, Sn-Bi-Cu-Zn system, Sn - Ag-Sb system, Sn.Ag-Sb-Zn system, Sn-Ag-Cu-Zn system, and Sn-Zn-Bi system. Specific examples of the metal composition described above are eutectic solders having a Sn of 63% by mass and a Pb of 37% by mass (hereinafter referred to as 63Sn/37Pb), and examples thereof include 62Sn/36Pb/2Ag and 6 2.6 S η/3 7 P b . / 0.4 A g, 60Sn/40Pb, 50Sn/50Pb, 30Sn/70Pb, 25Sn/75Pb ' 1OSn/8 8Pb/2Ag, 46Sn/8Bi/46Pb, 5 7Sn/3 Bi/40Pb, 42 Sn/42Pb/1 4Bi/ 2 Ag, 45 Sn/40Pb/15Bi, 50Sn/32Pb/1 8Cd, 48Sn/52In, 43Sn/57Bi, 97In/3Ag, 58Sn/42In, 95In/5Bi, 60Sn/40Bi, 91Sn/9Zn, 9 6.5 S n / 3.5 A g, 9 9.3 S n/0.7 C u, 95Sn/5Sb, 20Sn/80Au, 90Sn/l OAg, 9 0 S n/7.5 B i / 2 A g/0.5 C u , 97Sn/3Cu, 99Sn /lGe, 9 2 S n / 7.5 B i / 0.5 C u, 97Sn/2Cu/0.8Sb/0.2Ag, 9 5.5 S n / 3 · 5 A g/1 Z n, 95.5 Sn/4Cu/0.5 Ag ' 5 2 S n/4 5 B i / 3 S b, 5 1 S n / 4 5 B i / 3 S b /1 Z n, 85Sn/10Bi/5Sb, 84Sn/I0Bi/5Sb/lZn, 88.2Sn/l 0Bi /0.8Cu/l Zn ' 8 9 S n/4 A g/7 S b, 88Sn/4Ag/7Sb/l Zn, 98Sn/l Ag/lSb, 97Sn/1 Ag/1 Sb/1 Zn, 91.2Sn/ 2Ag/0.8Cu/6Zn, 89Sn/8Zn/3Bi, 86Sn/8Zn/6Bi, and 89.1Sn/2Ag/0.9Cu/8Zn. Further, as the solder particles 14 of the present embodiment, two or more kinds of solder particles having different compositions can be mixed. -24-201227852 (Fourth step) Next, the soldering step is performed as shown in the ID drawing to form the solder layer 15. In the third step, the solder particles 14 are attached to the core body 11 in the dispersion, first The substrate 1 was allowed to dry. Next, the core body 11 and the solder particles 14 are fixed. The fixation refers to a reaction in which the constituent material of the core body 11 is diffused toward the solder particles 14 between the core body 11 and the solder particles 14. The solder particles 14 are fixed to the core body 11 by allowing the reaction to progress. At this time, the fixing temperature is preferably in the range of -50 ° C to + 50 ° C with respect to the melting point of the solder used, more preferably -30 ° C to + 30. In the range of (: in the range where the fixing temperature is within this range, the solder particles 14 are not melted or even if they are dissolved inside, the effect of the oxide film existing on the surface can be prevented from melting and flowing out. Therefore, it can be maintained The shape of the solder particles 14 is fixed. Next, a water-soluble flux is applied to the substrate 1 on which the core body 11 (the solder particles 14 are fixed). As the water-soluble flux, for example, 曰Bent The flux described in Japanese Laid-Open Patent Publication No. 2004-282062. The water-soluble flux is applied to the substrate 1 to remove the oxide film on the surface of the solder particles 14 and the surface 11a of the core 11. Next, the solder is welded to the solder particles. 14 is melted, and the solder particles 14 are melted to form the tantalum layer 15 over the entire surface na of the core n. The heating temperature at this time is preferably 200. (:~3 00. More preferably, the melting point of the solder is +10 ° C to 50 ° C. By heating at a temperature within this range, the molten solder of the solder particles 14 can be sufficiently reacted with the surface 11a of the core body 11, and Forming a diffusion layer. (Fifth step) Next As shown in Fig. 1E, the first member 21 is peeled off from the surface 5a of the first adhesive layer 5. Then, the core body !1 is peeled off from the substrate 1. At this time, the core body 11 is peeled off from the substrate 1. The method can be appropriately selected according to the material of the first adhesive layer 5. Specifically, for example, a method of imparting vibration to the substrate 1 by an ultrasonic cleaner, and dissolving the first adhesive layer 5 by a solvent can be employed. The method of peeling the core body 11 from the substrate is not limited to the above method, and when the substrate 1 has flexibility, the core body 1 may be peeled off by bending the substrate 1 The solder ball 70 is formed by the above method. According to the manufacturing method of the solder ball 70 of the first embodiment, since the solder particles 14 are adhered after the surface 11a of the core body 11 is passed through the second adhesive layer 13, the solder particles 14 are melted. The solder layer 15 can be uniformly formed on the surface iia of the core body 11. Further, the solder layer 15 is more easily formed than the conventional method of forming a solder layer by plating or the like. Forming solder by attaching the first adhesive layer 5 to the surface la of the substrate 1 The layer 15 can process more of the core body 11 at the same time as the conventional method. Further, since the core body 11 is adhered through the first adhesive layer 5 on the surface 1a of the substrate 1, after the solder layer 15 is formed, it is easy to The core body 11 is removed from the substrate 1.

• 26- S 201227852 According to the above description, the formation process of the solder ball 70 can be greatly simplified compared to the conventional method, and production can be performed efficiently. Therefore, the manufacturing cost of the solder ball 7 () can be reduced. Further, since the surface 11a of the core body 11 is covered by the solder layer 15, when the solder bumps 70 are used to form the solder bumps, the core body 11 becomes a spacer. Therefore, even if the solder layer 15 is melted, the solder bumps can maintain a certain height. Therefore, even if electronic parts are mounted on the solder bumps, the electronic parts do not sink due to their own weight. In this way, the distance between the electronic component and the circuit board can be kept constant. Further, since the core body 11 is made of metal, when used as the solder ball 70, it is possible to ensure conduction between the electronic component and the circuit board. In particular, when the core body 1 1 is made of copper, since the resistance of copper is low, it is possible to ensure good conduction between the electronic component and the circuit board. Further, since the core body 11 is made of Cu, it is easier to apply an adhesive compound. Therefore, the second adhesive layer 13 having a sufficient thickness can be formed. Therefore, the solder particles 14 are easily adhered to the surface 11a of the core body 11 through the second adhesive layer 13. Therefore, a uniform and sufficient film thickness of the solder layer 15 can be formed. Thus, the solder ball 70 having a uniform particle diameter can be formed, and the bonding between the electronic component and the circuit board can be favorably performed. Further, since the core body 1 1 serves as a spacer, the distance between the electronic component and the substrate can be kept constant. Therefore, it is possible to solve the problem that the mounted electronic component is unevenly deposited on the substrate, and it is possible to obtain a substrate having high reliability with respect to the height of the core body 11. Further, since the solder particles 14 are adhered to the core body 11 through the second adhesive layer 13, it is not necessary to use a conventional copper core solder ball having a high price of -27 - 201227852. Therefore, cost reduction and simplification of steps can be achieved. According to the above description, the manufacturing method of the present embodiment is a method suitable for a fine substrate, and an electronic device having high integration and high reliability can be provided. Further, according to the above method, the solder ball 7 can be formed without using a high melting point solder having a high lead content. Therefore, lead-free solder ball 7〇 can be achieved. Therefore, the α rays are not emitted from the Pb contained in the solder bumps. Therefore, it is possible to prevent the alpha rays from causing erroneous actions of the electronic components. Further, since the first member 21 is made of a metal plate member, the first member can be reused in the manufacture of the solder ball 70. Therefore, the manufacturing cost of the manufacturing process of the solder ball 70 can be reduced. Further, by setting the thickness Η of the first member 21 to a range of lym or more and 1/2 or less of the particle diameter D, the core body 11 can easily enter the first opening portion 31. Therefore, the workability can be improved, and the solder ball 70 can be efficiently manufactured. Further, the side surface of the core body 1 1 can be held by the side wall of the first opening portion 3 i to prevent the core body 11 from falling off. Further, since the second adhesive layer 13' is formed on the core body in a state where the first member 21 having the first opening portion 31 is disposed on the substrate 1, the portion other than the surface 11a of the core body 11 does not A second adhesive layer 13 is formed. The reason why the second adhesive layer is not formed on the first member 21 is that the material used for the core material such as the conductive material or the metal is a material which can impart adhesiveness by the adhesive imparting substance, and the first member The material used for the first adhesive is a material that cannot impart adhesiveness by the adhesive imparting substance. Therefore, the solder particles 14 can be selectively attached to the core body 〖1. Further, since the core body is placed inside the first opening portion 31

S -28 - 201227852 Adhesion ' Even if the adhesion of the first adhesive layer 5 is weakened, the core body 11 can be prevented from falling off the outside of the first opening portion 31. Therefore, the core body π can be surely adhered to all of the first openings 31. (Second Embodiment) Next, a method of manufacturing the solder ball 70 according to the second embodiment of the present invention will be described with reference to the drawings. 2A to 2E are process diagrams illustrating a method of manufacturing the solder ball 70 of the second embodiment. The manufacturing method of the solder ball 70 of the second embodiment includes a first step of attaching the core body to the surface 5a of the first adhesive layer 5 formed on the surface 1 of the substrate 1, and forming on the surface 11a of the core body 11. a second step of the second adhesive layer 13, a third step of attaching the solder particles 14 on the surface of the second adhesive layer 13, a fourth step of melting the solder particles 14 to form the solder layer 15, and a slave core 1 The fifth step of peeling off the substrate 1. Wherein, in the first step, the first member 21 is composed of the first layer 21a (the first layer of the first member) and the second layer 21b (the second layer of the first member), and in the first step and the foregoing The step of peeling the second layer 21b from the first layer 21a between the second steps is the same as that of the first embodiment, and therefore the detailed description of the same portions will be omitted. The first step is explained below. (First Step) The first step of the second embodiment 'as a step (pre-step) of disposing the first member 21 on the first adhesive layer 5 includes: (i) -29-I·' 201227852 The step of disposing the first layer 21a of the first member having the opening portion 32a (the lower portion of the second opening) on the first adhesive layer 5, on the first layer 2 1 a of the first member, will have a diameter ratio The second layer 21b of the first member of the opening portion 32b (the second opening upper portion) having the smaller opening portion 32 has a step in which the opening portion 32a overlaps the opening portion 32b. Each step will be described in detail below. First, the first layer 21a of the first member is disposed so as to cover the surface 5a of the first adhesive layer 5. The first layer 21a of the first member is provided with an opening portion 3 2 a in which the surface 5 a of the first adhesive layer 5 is exposed at intervals. The material of the first layer 21a of the first member is not particularly limited. Specifically, for example, a paste-resistant paste can be applied to the substrate 1 by screen printing. In the range of the diameter F2a of the opening 32a of the first layer 21a, the diameter of the opening 32b of the second layer 21b to be described later is F2b, and can be expressed by the following formula (5). [Equation 5] F2b + 2d$F2a · (5) A more preferable range of the opening portion 32a can be expressed by the following formula (6). [6] F2b + 3 d^F2a^F2b + 4d . Next, the second layer 21b of the first member is placed on the first layer 21a of the first member. In the second layer 21b of the first member, an opening portion 3 2b having a smaller diameter than the opening portion 3 2a of the first layer 2 1 a is provided. In configuring the first component

S -30- 201227852 In the second layer 21b, the arrangement position is adjusted so that the opening 32a overlaps the opening 3bb. As the second layer 21b of the first member, a plate member made of metal can be used. By using such a member as the second layer 21b of the first member, the manufacturing efficiency of the solder ball 70 can be improved because it can be reused in the manufacturing steps. Further, it is assumed that the total thickness of the first layer 21a and the second layer 21b of the first member is Η, Η is 1/2 or more of the particle diameter D of the core body 11, and the range of the diameter F2b of the opening portion 32b can be mathematically described below. Expressed by the formula (7). Further, a better range of the diameter F2b of the opening portion 32b can be expressed by the following mathematical formula (8). [8] 1. 1D^F2b^1.5D (8) Further, the interval G2 between the adjacent opening portions 32b is assumed to be Hb, and the thickness of the second layer 21b of the first member is Hb. Said mathematical formula (9). [9] 2 d + D-2VHb (D-Hb)^G2^4 d+ D - 2^/H b (D - H b) · (9) By spacing the openings 3 2b from each other G2 Within the scope of the mathematical formula (9), the solder balls 70 can be formed on the substrate 1 at a high density, and the adjacent solder balls 70 can be prevented from being bonded to each other. Next, as shown in Fig. 2A, the core body 11 is attached to the surface 5a of the first adhesive layer 31. Next, as shown in Fig. 2B, the second layer 21b of the first member is peeled off from the first layer 21a of the first member. Since the diameter F2b of the opening 32b is smaller than the diameter F2a of the opening 32a, the core body 1 1 is placed in the center of the second opening lower portion 32a. (Second Step) Next, as shown in FIG. 2B, the first layer 21a of the first member covers the surface 5a of the first adhesive layer 5, and the adhesive layer is applied to the surface 11a of the core 11 to form a first Two adhesive layers 13. At this time, since the surface 5a of the first adhesive layer 5 is substantially covered by the first layer 21a of the first member, the formation of the second adhesive layer 13 outside the surface 11a of the core body 11 can be prevented. That is, the core body 11 is formed of a material which imparts adhesiveness to the adhesion-imparting compound, but the first layer 21a of the first member and the first adhesive layer are formed of a material which cannot impart adhesion by the adhesion-imparting compound. Therefore, the adhesive layer 13 is not formed on the first layer 21a. Then, the third step, the fourth step, and the fifth step are performed as shown in FIGS. 2C to 2E. Since the steps after the third step are the same as those of the first embodiment, the details after the third step are omitted. Description. According to the method of manufacturing the solder ball 70 of the second embodiment, the second layer 21b having the first member having the opening 32b having a smaller diameter than the opening portion 32a is formed on the first layer 21a of the first member as the opening portion The center of 32a is disposed so as to overlap the center of the opening 32b, whereby the opening portion 3 2b can be disposed on the center portion of the opening portion 3 2 a. In addition, due to the nuclear -32-

S 201227852 After the body II is attached to the first adhesive layer 5, the second layer 21b of the first member is peeled off from the first layer 21a of the first member, so that the first layer of the core body 11 and the first member can be sufficiently maintained the distance. That is, when the core body n is attached to the first adhesive layer 5, the core body 11 can be disposed in the center of the opening portion 3 2a. According to the method of manufacturing the solder ball 70 of the second embodiment, in addition to the effects of the first embodiment, it is possible to more effectively prevent the adjacent solder balls 7 to be joined to each other. (Third Embodiment) Next, a method of manufacturing the solder ball 70 according to a third embodiment of the present invention will be described with reference to the drawings. 3A to 3F are process diagrams illustrating a method of manufacturing the solder ball 70 of the third embodiment. The method for producing the solder ball 70 according to the third embodiment includes a first step of attaching the core body 11 to the surface 5a of the first adhesive layer 5 provided on the substrate 1, and forming a surface on the surface 11a of the core body 11. a second step of the second adhesive layer 13, a third step of attaching the solder particles 14 on the surface of the second adhesive layer 13, a fourth step of melting the solder particles 14 to form the solder layer 15, and a substrate from the core body 1 1 The fifth step of stripping. In the third embodiment, the difference from the first embodiment is that there is a step of peeling off the first member 21 between the first step and the second step, and in a manner of covering the surface 5a of the first adhesive layer 5, A particle having a diameter r (which is smaller than the thickness of the first member 21) is attached to the first adhesive layer to form a mask 41 (first mask). Therefore, the detailed description of the same steps as the first embodiment -33-201227852 will be omitted. First, as shown in Fig. 3A, in the first step, the core body u is attached to the surface 5a of the first adhesive layer 5 of the substrate 1 (provided with the first member 21). At this time, the interval G3 between the adjacent opening portions 33 (third opening portions) of the first member is preferably about 1 to 20 times the diameter d of the solder particles i 4 used in the third step. Further, the thickness Η ' of the first member 21 is preferably 丨/2 times or more the particle diameter D of the core body 11. Further, the diameter F3 of the opening portion 3 3 of the first member is preferably larger than the particle diameter D of the core body 11 and less than 2 times the particle diameter D of the core body 1 1 , preferably larger than the particle diameter D On 1 0~2 0 to m. Next, the first member 21 is peeled off from the first adhesive layer 5 as shown in Fig. 3B. Thereby, the surface 5a of the first adhesive layer 5 is exposed. Next, as shown in Fig. 3C, the mask 41 formed of the granular material is adhered so as to cover the surface 5a of the first adhesive layer 5. As the material of the mask 41, for example, glass, ceramics, polymer, or the like can be used, and the material is not dissolved in water and the second adhesive layer 13 is not formed on the surface. The material is not particularly limited. Further, the diameter r of the material of the mask 41 is smaller than the thickness of the first member 21. Further, the smaller the diameter and the height r, the better, and the point based on the work efficiency is preferably about /m to ym. As a specific example, a material having a diameter of 〇5 y m 2 is preferably used. By setting the height and the diameter r of the mask 41 within this range, the solder particles 14 can be attached in the vicinity of the contact surface between the core body n and the first adhesive layer 5. Therefore, the table that can be in the nuclei n

S -34 - 201227852 The solder layer 15 is formed on the entire surface Ua. On the other hand, when the height and the diameter r are equal to or larger than the thickness 第一 of the first member 21, it is not preferable that the solder particles 14 are sufficiently adhered in the vicinity of the contact surface between the core body 11 and the first adhesive layer 5. Further, 'when the mask 41 is attached in such a manner as to cover the surface 5a of the first adhesive layer 5', a gap may occur between the materials of the adjacent masks 41. In the third step, the surface of the first adhesive layer 5 may be present. The solder particles 14 are allowed to adhere. Therefore, in the fourth step, the solder particles 14 attached to the surface of the first adhesive layer 5 may be joined to the solder balls 70 after being melted. As a result, the particle diameter of the solder ball 70 becomes uneven, which is not preferable. Then, as shown in FIGS. 3D to 3F, the second step, the third step, the fourth step, and the fifth step are performed, and regarding the second step to the fifth step, since it is the same as the first embodiment, Detailed descriptions thereof are omitted. Further, as shown in FIG. 3F, the method of peeling off the first mask 41 from the first adhesive layer 5 can be arbitrarily selected. Specifically, for example, vibration can be applied to the substrate 1 by an ultrasonic cleaner. method. The solder ball 70 is formed by the above method. According to the method of manufacturing the solder ball 70 of the third embodiment, after the core member 11 is placed on the surface 5a of the adhesive layer 5 by using the first member 21, the first member 21 is peeled off, and the core body can be appropriately held. The interval between each other. In addition, 'because the first mask 41 is attached to the surface 5a of the first adhesive layer 5', the solder particles 14 are attached to the surface 11a of the core body 11. Therefore, the core body 11 and the first adhesive layer 5 are attached. The solder particles 14 can be attached in the vicinity of the contact surface. Thus, the solder layer 15 can be formed on the entire surface 11a of the core body 11. -35- 201227852 Further, as the material of the first mask 41, since the material which does not rotate and does not form the second adhesive layer 13 is used, in the second step, the second adhesive layer 13 is formed on the surface of the first mask 41. . Therefore, the material particles 14 are attached to the surface of the first mask 41. According to the above description, according to the solder ball 70 method of the third embodiment, in addition to the effects of the first embodiment, the thickness of the solder ball layer 15 can be uniformly formed. (Fourth embodiment) Next, a method of manufacturing the fourth embodiment 70 of the present invention will be described with reference to the drawings. 4A to 4E are diagrams showing the steps of the fourth embodiment of the manufacturing method of the ball 70. In the method of manufacturing the solder ball 70 of the fourth embodiment, the surface 5a of the first adhesive layer 5 provided by the substrate 1 is subjected to the first step of the core body 11 and the second adhesive layer is formed on the surface 11a of the core body 11. The second step of forming the solder particles 14 on the surface of the second adhesive layer 13 and melting the solder particles 14 to form the Eth of the solder layer 15 and peeling off the substrate 1 from the core body 1 is formed. In the fourth embodiment, 'before the first step, through the J adhesive layer', the plurality of first adhesive layers 5 in a dot shape are formed on the surface 1a of the substrate 1 in a mutual manner, which is Adhesion f The first embodiment of the first member is different. The detailed description of the steps related to the first embodiment will be omitted. First, the solder ball type soldering containing the surface of the substrate 1 is disposed so as to cover the surface of the substrate 1 : the third step of the adhesion 13 , the cover coating The same two components of the upper configuration

S -36- 201227852 22. As the second member 22, a plate-like member can be used. The second member 22 is provided with an opening portion 34 (fourth opening portion) so as to be apart from each other, and the opening portion 34 allows a part of the surface of the substrate 1 to be exposed in a dot shape. The second member 22 may be separated from the substrate 1 or in contact with the substrate 1. Further, the range of the diameter F4 of the opening portion 34 can be expressed by the following mathematical expression (. 〇), assuming that the thickness of the adhesive member is Η. I [10] F4 < D-27H (D-H) · · · (1 〇) Further, a more preferable range of the diameter ρ4 of the opening portion 34 can be expressed by the following mathematical formula (1 1 ). [Number 11] 0.7 (D-2Vh(DH) F4^〇. g (D-27h(DH) ) . . . (1 1) In addition, the gap between the adjacent openings 3 4 is G4, assuming adhesion The thickness of the material is Η, and the diameter of the fourth opening portion 34 is p4, which can be expressed by the following formula (12). I [number 12] 2d + D+27H(DH)<G4 ... (1 2) Further preferably, the interval G4 between the opening portions 34 can be expressed by the following mathematical formula (13). [13] 4 cI + D + 2, /h(DH) SG4^8 d + D + 27H ( DH) -37-201227852 Next, as shown in Fig. 4A, the second member 22 is used as a mask, and the adhesive substance is applied so as to fill the opening 34. A method other than coating may be employed as needed. A plurality of first adhesive layers 5 having a thickness Η and a diameter F4 are formed on the surface 1a of the substrate 1 so as to be apart from each other. Next, the second member 22 is peeled off from the surface 1a of the substrate 1 to allow the surface 1 to be removed. Then, as shown in Fig. 4B, the core body 11 is attached to the first adhesive layer 5. Then, the second step, the third step, and the fourth step are performed as shown in Figs. 4C to 4E. And the fifth step, due to the second step The detailed description is omitted here, and the detailed description thereof is omitted here. The solder ball 70 is formed by the above method. According to the fourth embodiment, the solder ball 70 is manufactured by a plurality of first adhesive layers 5 in a dot shape. After being formed on the surface 1a of the substrate 1 so as to be separated from each other, the second member 22 is peeled off from the substrate 1, thereby forming a dot-shaped first adhesive layer 5. Therefore, the core body 11 is easily attached to the first layer. Adhesive layer 5. In addition, when the solder particles 14 are attached to the surface 11a of the core body 11, since the surface la of the substrate 1 is exposed, the solder can be allowed in the vicinity of the bonding surface of the core body II and the first adhesive layer 5. The particles 14 are sufficiently adhered. Therefore, the solder layer 15 can be formed on the entire surface 11a of the core body 11. As described above, the method of manufacturing the solder ball 70 according to the fourth embodiment can be performed in addition to the effects of the first embodiment. The thickness of the solder layer 15 of the solder ball 70 is uniformly formed.

S - 38 - 201227852 (Fifth Embodiment) Next, a method of manufacturing the solder ball 70 according to the fifth embodiment of the present invention will be described with reference to the drawings. 5A to 5E are process diagrams for explaining a method of manufacturing the solder ball 70 of the fifth embodiment. The method for producing a solder ball 7 of the fifth embodiment includes a first step of attaching the core body 11 to the surface 5a of the first adhesive layer 5 provided on the substrate 1, and forming a surface 11a of the core body. a second step of the second adhesive layer 13, a third step of attaching the solder particles 14 on the surface of the second adhesive layer 13, a fourth step of melting the solder particles 14 to form the solder layer 15, and a substrate from the core 11 1 The fifth step of stripping. In the fifth embodiment, before the first step, the adhesion imparting compound is transferred to the substrate by using the transfer substrate, whereby the plurality of dot-shaped first adhesive layers are formed on the substrate in such a manner as to be separated from each other. The surface is different from the first embodiment in which the first member is formed on the adhesive layer on the substrate before the first step. The respective steps will be described below. However, detailed descriptions of the same steps as those of the first embodiment will be omitted. (First Step) The first step of the fifth embodiment includes a step of forming a plurality of dot-shaped metal films 51 (first metal films) on the surface 61a of the transfer substrate 61 so as to be apart from each other, a step of adhering the adhesion-imparting compound 5b (first adhesion-imparting compound) to the metal film 51, and transferring the adhesion-promoting compound to the surface 1a of the substrate 1 from the substrate 61 for printing -39-201227852 The step of forming the first adhesive layer 5 and the step of attaching the core body 11 to the first adhesive layer 5. Each step will be described in detail below. First, a plurality of metal films 51 having a dot thickness of 20/zm are formed on the surface 61a of the transfer substrate 61 so as to be apart from each other. The formation method can adopt any method. For the material of the metal film 51, for example, tin (Sn) is preferably used, and copper (Cu) is more preferably used. The material of the first metal film 51 is not limited thereto, and only the adhesive property can be obtained by the adhesive imparting compound, and other materials can be used. As such a material, in addition to copper or tin, for example, a material containing Ni, Ni-Au, Au-Sn alloy or the like is contained. Then, as shown in Fig. 5A, the adhesion imparting compound 5b is adhered to the first metal film 51 by any method such as coating. This step ' is substantially the same as the second step of the first embodiment, and a detailed description thereof will be omitted herein. Thereby, the adhesiveness imparting compound 5b is formed so as to cover the surface of the metal film 51. Further, unlike the second step of the first embodiment, the adhesiveness imparting compound 5b must be adhered to the metal film 51 in this step, but any method can be selected. Then, as shown in Fig. 5B, the adhesive imparting compound 5b is transferred from the transfer substrate 6 1 to the surface 1a of the substrate 1. At this time, the surface la of the substrate 1 is preferably covered by the mask 42 (second mask). As the material of the mask 42, a plate member can be used. In addition, as its material, specifically, stainless steel, nickel, glass, ceramics -40- can be used.

S 201227852, a polymer, etc.' is not particularly limited as long as it is a substance which does not dissolve in water and does not form a second viscosity. Further, the mask 42 is provided with an opening portion 35 (fifth portion) having a diameter f5. The function of the opening portion 35 is to prevent the solder 3 from falling off after the fourth step. Therefore, the flaw can be appropriately set in accordance with the diameter D of the core body 11, the diameter d of the particles 14, and the thickness Η of the mask 42. At this time, the distance ρ between the adjacent opening portions 35 of the mask 42 is assumed to be Η, the diameter of the core body 11 is D, and the diameter of the solder 14 is d'. (14) indicates. [Equation 14] 2d + D + 2VH (2d + DH)^G5 · · · In addition, the thickness 遮 of the mask 42 must be smaller than the total thickness of the thick film of the metal film 51 to give the compound 5b, but The thickness of the film 51 is the same. When the thickness of the mask 42 is larger than the total thickness of the thickness of the gold compound and the thickness of the adhesive compound 5b, the adhesion imparting compound 5b is preferably transferred to the surface la of the substrate 1. Thereby, a plurality of first adhesive layers 5 are formed in a manner of being separated from each other on the surface 1 of the substrate 1. Next, as shown in Fig. 5C, the core body 11 is attached to the surface 5a of the first layer 5. Then, as shown in FIGS. 5C to 5E, the second step, the third step, the fourth step, and the fifth step are used, since the mask 42 is used instead of the first member 21 after the second step, except for The layer opening t 7 〇 solder S g5 granules (14) degrees and the absence of adhesion to the metal film are substantially the same as in the fourth embodiment, and the detailed description is omitted here. The solder ball 70 is formed by the above method. According to the method of manufacturing the solder ball 70 of the fifth embodiment, the first adhesive layer 5 is formed by applying the adhesive imparting compound 5b to the dot-shaped metal film 51, so that the amount of the adhesive imparting compound 5b can be minimized. Further, since the substrate for transfer is used, it is possible to correspond to a finer pattern than when the first adhesive layer 5 is formed using only a mask. Further, the adhesion imparting compound 5b is transferred onto the surface 1a of the substrate 1 while maintaining the surface 1a of the substrate 1 covered by the mask 42, whereby the first adhesive layer 5 can be formed at a more correct position. . Further, the second adhesive layer 13 is formed on the core body 11 while maintaining the surface 1a of the substrate 1 covered by the mask 42, so that the second adhesive layer 13 can be prevented from adhering to the surface 1 of the substrate 1. This prevents the solder particles 14 from adhering to the surface 1 of the substrate 1. As described above, according to the manufacturing method of the solder ball 70 of the fifth embodiment, in addition to the effects of the fourth embodiment, the position of the solder ball 70 can be made to correspond to a finer pattern. (Sixth embodiment) Next, a method of manufacturing the solder ball 70 according to a sixth embodiment of the present invention will be described with reference to the drawings. 6A to 6E are diagrams showing the steps of a method of manufacturing the solder ball 70 of the sixth embodiment. The method of manufacturing the solder ball 70 of the sixth embodiment is a simplification of: attaching the core body 11 to the surface 5a of the first adhesive layer 5 provided by the substrate 1.

S-42-201227852 First step, a second step of forming the second adhesive layer 13 on the surface 11a of the core body 11, a third step of attaching the solder particles 14 to the surface of the second adhesive layer 13, and melting the solder particles 14 A fourth step of forming the solder layer 15 and a fifth step of stripping the substrate 1 from the core body 11. In the sixth embodiment, before the first step, a dot-shaped second metal film is formed on the surface of the substrate so as to be separated from each other, and an adhesion-promoting compound is applied on the second metal film to form an adhesive layer. A first embodiment different from forming a first member having an opening on a substrate provided with an adhesive layer prior to the first step. The respective steps will be described below, and the detailed description of the same steps as those of the first embodiment will be omitted. (First Step.) The first step of the sixth embodiment includes a step of attaching the core body 1 to the first adhesive layer 5 on the substrate 1, and a pre-step thereof, that is, a step of forming a plurality of dot-shaped second metal films 52 on the surface 1a of the first layer, and applying an adhesion-imparting compound (first adhesion-imparting compound) to the surface of the exposed second metal film 52 to form the first adhesive layer 5 In the following, each step will be described in detail. First, a point-shaped metal film 52 (second metal film) is formed on the surface 1 of the substrate 1 by any method to separate from each other. The material of 2 is preferably a metal having a wettability to the solder, and may be selected as needed. More preferably, tungsten is used. -43- 201227852 Next, the opening portion 36 is disposed so as to cover the surface la of the substrate 1 (sixth The mask 43 (third mask) of the opening portion. The mask 43 may be disposed after the first adhesive layer 5 is formed. The mask 43 is provided with a diameter F62 opening 36. The function of the opening 36 is After the fourth step, the solder ball 70 is prevented from falling off. Therefore, the F6 is defective. The diameter D of the core body 11 and the diameter d of the solder particles 14 and the thickness Η of the mask 43 can be appropriately set. As the material of the mask 43, it is preferable to have the property of not forming the second adhesive layer 13 on the surface. The gap G6 between the adjacent openings 36 is assumed to be Η, the diameter of the core 11 is D, and the diameter of the solder particles 14 is d, which can be expressed by the following formula (15). d + D + 2 VH(2 d + DH) ^G6 (15) Further, the thickness 遮 of the mask 43 must be smaller than the total thickness of the metal film 52 and the thickness of the first adhesive layer _ 5, and Preferably, the thickness of the second metal film 52 is about 20/m thick. If the thickness Η of the mask 43 is larger than the total thickness of the metal film 52 and the thickness of the first adhesive layer 5, the core body 11 is attached to the first layer. The surface 5a of the adhesive layer 5 becomes difficult, which is not preferable. Next, as shown in Fig. 6A, the first adhesive layer 5 is formed so as to cover the surface of the metal film 52. The first adhesive layer 5 is formed, and the fifth Similarly to the embodiment, it can be formed by applying an adhesive imparting compound or the like to the metal film 52. A mask having an opening or the like can also be used. The above technique, the surface of the substrate 1 a formed of a plurality of dot-like first adhesive layer 5 away from each other in a way.

-44 - 'S 201227852 Receiver, as shown in Fig. 6B, the core body 丨 is attached to the surface 5a of the first adhesive layer 5. Then, the first step, the second step, the fourth step, and the fifth step are performed as shown in FIGS. 6C to 6E. After the second step, the third mask 43 is used instead of the first member 21. It is substantially the same as the first embodiment, and a detailed description thereof will be omitted. The solder ball 7 is formed by the above method. According to the method of manufacturing the solder ball 70 of the sixth embodiment, the first adhesive layer 5 can be formed by applying the adhesive imparting compound 5b to the metal film 52, so that the amount of the first adhesive layer 5 can be minimized. Further, the case where the first adhesive layer 5 is formed using only the mask can correspond to a finer pattern. Further, since the first adhesive layer 5 is formed on the surface of the metal film 52 directly on the substrate 1, the positional displacement of the first adhesive layer 5 can be prevented. Further, the material used as the metal film 52 is tungsten, and when the solder layer 15 is formed in the fourth step, the solder layer 15 can be easily peeled off even if it is attached to the second metal film. Therefore, even if the solder ball 70 is formed on the second metal film 52, the solder ball 70 can be easily removed. As described above, the method of manufacturing the solder ball 70 according to the sixth embodiment can make the position of the solder ball 70 correspond to a finer pattern in addition to the effects of the fifth embodiment. [Examples] Hereinafter, the present invention will be described by way of examples, but the invention is not limited thereto. -45-201227852 (Example 1) First, as the substrate 1 provided with the first adhesive layer 5, a polyimide carrier tape was prepared. Next, as shown in FIG. 1A, the first member 21 made of metal is placed so as to cover the surface 5a of the first adhesive layer 5. The first member 21 is provided with an opening portion 31 (first opening portion) having a diameter Fi = 80 / zm. Further, the interval between the adjacent opening portions 31 is 200 // m. Further, the thickness of the member 21 is about 25 #m. Next, as shown in Fig. 1A, a core body 11 made of copper having a diameter D = 50 / zm is adhered to the surface 1 of the substrate 1 in an air atmosphere. Fig. 7A shows a state in which the core body 11 is attached to the surface la of the substrate 1. Next, as shown in Fig. 1B, the adhesive layer is applied to the surface iia of the core body 11 to form the second adhesive layer 13. In this case, the adhesive solution containing the adhesion-imparting compound is prepared as a 2% by mass aqueous solution of the imidazole-based compound in which the alkyl group of R12 in the above general formula (3) is CUH23 and R11 is a hydrogen atom. Then, the above-mentioned adhesive solution was adjusted to P Η about 4 with acetic acid, and then heated at 40 °C. Next, the substrate 1 was immersed in an adhesive solution for 3 minutes to form a second adhesive layer 13 on the surface 11a of the core body 11. Next, as shown in Fig. 1C, the solder particles 14 having a metal composition of Sn/3.5Ag diameter d = about 10/zm are adhered to the second adhesive layer 13. Next, the excess solder particles 14 are removed using an air knife. Next, the soldering step is performed as shown in Fig. 1D to form the solder layer 15. First, the substrate 1 was heated in an oven at 180 ° C for 20 minutes.

S -46- 201227852 Fixes the core body 11 and the solder particles 14. Next, a flux (manufactured by SJ-FL2000) was sprayed toward the surface of the substrate 1. Next, a welding furnace of 240 ° C was used to heat the substrate 1 in a nitrogen atmosphere for 3 minutes to form a surface having a thickness of 5 μm by covering the surface 11 a of the core body 11; Through the above method, a solder ball 70 having a diameter of about 100 is produced as shown in Fig. 1E. Figure 7B shows the solder ball 70. (Embodiment 2) Next, Embodiment 2 will be described. First, as shown in FIG. 2A, the first 5' of the base material 1 made of a glazing sheet is coated with a ruthenium-based adhesive, and then the first first layer 21a is formed by screen printing. Covered on the surface 5a of the first adhesive layer 5. At this time, the first layer 21a as the first member is an opening portion 32a (lower opening portion) of F2a = 80 // m. Next, on the first layer 21a of the first member, the second layer 21b of the first member of metal is disposed. The second layer 21b of the first member has an opening portion 32b having a diameter F2b = 60 〆m (the second opening upper portion) 'when the second layer 21b of the first member is disposed' is the first layer 2. The center of the mouth portion 32a The arrangement position of the second layer 21b of the first member is adjusted so as to overlap the opening 32b of the second layer 21b, and the interval G2 between the adjacent openings 32b is 200 vm. Next, as shown in FIG. 2A, in the air atmosphere, the surface la to the core body 11 made of copper having a diameter D = 5 〇 ym is attached, as shown in FIG. 2B, from the first member The layer 21a is a display of the diameter of the glass-adhesive layer member, which is formed by the surface of the glass-adhesive layer. In addition, the open heart of L a is heavy. In addition, the substrate is 1 . Next, the second layer 2 1 b of a member of the -47-201227852 is peeled off. Next, as shown in Fig. 2B, an adhesive adhesion-imparting compound is applied to the surface 11a of the core body 11 to form a second adhesive layer 13 . In this case, as the adhesive solution containing the adhesion-imparting compound, the alkyl group of R12 in the above general formula (3) is a 2% by mass aqueous solution of an imidazole-based compound in which C?H? and R11 are hydrogen atoms. Next, the adhesive solution was adjusted to a pH of about 4 with acetic acid, and then heated at 40 °C. Next, the substrate 1 was immersed in an adhesive solution for 3 minutes to form a second adhesive layer 13 on the surface 11a of the core body 11. Next, as shown in Fig. 2C, solder particles 14 having a metal composition of Sn/3.5Ag diameter d = about 10/m are adhered to the second adhesive layer 13. The excess solder particles 14 are then removed by an air knife. The stomach is subjected to a welding step as shown in Fig. 2D to form a solder layer. 15 ° First, the substrate 1 is heated in an oven of i8 〇t for 2 minutes to fix the core 1 1 and the solder particles 14 . Next, the flux is sprayed toward the surface of the substrate 1. Next, the substrate 1 was heated in a nitrogen atmosphere at a sintering furnace of 24 ° C for 3 minutes to form a solder layer 15 having a film thickness of 5 μm so as to cover the surface 11a of the core n. A solder ball 7 直径 having a diameter of about 60 // m was produced by the above method. (Embodiment 3) Next, Embodiment 3 will be described. First, a polyimide polyimide carrier tape is prepared as the substrate 1' on which the first adhesive layer 5 is provided. Next, as shown in FIG. 3A, the metal is formed so as to cover the surface 5a of the first adhesive layer 5.

S 201227852 A component 21. The first member 21 is provided with a first opening portion 31 of a diameter F3 = 70#. Further, the interval between the adjacent first opening portions 31 is 200 β τη. Next, as shown in Fig. 3, the core body 11 made of copper having a diameter D = 50 μm is adhered to the surface of the substrate 1 in an air atmosphere. Next, the first member 21 is peeled off as shown in Fig. 3B. Next, as shown in Fig. 3C, the first mask 41 made of glass particles having a diameter of about lym is adhered so as to cover the surface 5a of the first adhesive layer 5. Next, as shown in Fig. 3D, the adhesive layer is applied to the surface 11a of the core body 11 to form the second adhesive layer 13. In this case, as the adhesive solution containing the adhesion-imparting compound, the alkyl group of R12 in the above general formula (3) is a 2% by mass aqueous solution of an imidazole-based compound in which CuH^ and R11 are hydrogen atoms. Next, the above-mentioned adhesive solution was adjusted to a pH of about 4 with acetic acid, and then heated at 40 °C. Next, the substrate 1 was immersed in an adhesive solution for 3 minutes to form a second adhesive layer 13 on the surface 1 1 a of the core body 1 1 . Next, as shown in Fig. 3E, the solder particles 14 having a metal group of Sn/3.5Ag diameter d = about 10 μm are adhered to the second adhesive layer 13. Next, the excess solder particles 14 are removed by an air knife. Next, as shown in Fig. 3F, a soldering step is performed to form a solder layer 15 . First, the substrate 1 was heated in an oven at 180 ° C for 20 minutes to fix the core body 11 and the solder particles 14. Next, the flux is sprayed toward the surface of the substrate 1. Next, the base-49-201227852 material 1 was heated in a nitrogen atmosphere at a 240 ° C welding furnace for 3 minutes to cover the solder layer 15 of the surface 3 of the core body 11 having a film thickness of 5 vm. A solder ball 70 of diameter m is manufactured by the above method. (Embodiment 4) Next, Embodiment 4 will be described. First, 1 ° of the glass piece is prepared. Next, as shown in Fig. 4A, a member 2 2 (second member) made of a metal of 5 μm is disposed to cover the surface of the substrate 1. As the member 22, an opening portion 34 (opening portion) having a diameter F4 = 25 v m is provided. Further, the interval between the adjacent opening portions 34 is β m . Next, as shown in Fig. 4A, the enamel-based adhesive is applied as the mask accommodating opening portion 34 as shown in Fig. 4A. Thereby, the first adhesive layer 5 of H = 5 // m and diameter F4 = 25 /zm is formed on the surface 1a of the substrate. Next, as shown in Fig. 4B, a core body 11 made of copper having a diameter D = 5 0 / z m is adhered to the surface of the substrate in an air atmosphere. Next, as shown in Fig. 4C, a compound is applied to the surface 11a of the core body 11 to form a second adhesive layer 13. In this case, as an adhesive solution for the adhesion-imparting compound, the above-mentioned general 3) R 2 alkyl group is an imidazole-based 2 mass % aqueous solution in which ChH 23 and R 11 are hydrogen atoms. Next, the adhesive solution was made into p Η about 4 with acetic acid, and then heated at 40 °C. Next, the substrate 1 is immersed in a side where the 3 60 substrate is formed, and the fourth 200 is adhered to the cloth having a thickness of 1 (the adhesive is adjusted).

S -50- 201227852 Sex solution for 3 minutes, thereby forming a second adhesive layer 13 on the surface of the core body. Next, as shown in Fig. 4D, on the second adhesive layer 13, the diameter d of the composition of Sn/3 · 5 Ag is about i 〇; the solder particles of Win 14 are formed. The excess solder particles 14 are then removed by an air knife. The soldering step is performed as shown in Fig. 4E to form a solder layer. First, the substrate was heated for 2 minutes using an oven at 180 ° C to allow the core 11 and the solder particles 14 to be fixed. Next, the flux is sprayed toward the surface of the substrate. Next, the material 1 was heated in a nitrogen atmosphere for 3 minutes using a 240 ° C welding furnace to form a solder layer 15 having a film thickness of 5 / zm so as to cover the surface of the core body. A solder ball 70 having a diameter of about m is manufactured by the above method. (Example 5) Next, Example 5 will be described. First, a metal film 51 (first metal) made of copper having a thickness of 18/m is formed on the surface 61a of the substrate 61 for transfer. At this time, the pattern of the metal film 51 is a point having a diameter of 25/zm, and the interval between the patterns of the adjacent metal films 51 is 200 // m. Further, the surface 1a of the substrate 1 is covered in advance by a mask 42 (second mask 42) having a thickness of H = 18 μm. The mask 42 is provided with an opening portion 35 (fifth opening portion) of straight F5 = 7 〇 Ai m . Further, the interval between the adjacent opening portions 35 is 200 // m. Next, the adhesion imparting compound 5b is allowed to be formed on the surface of the metal film 51. In this case, as the adhesive solution containing the adhesion-imparting compound, the addition of the surface of the gold-coated 15-form surface to the 60-mask phase is prepared. -51 - 201227852 Preparation: The alkyl group of R12 in the above general formula (3) is ChH^ and R11. A 2% by mass aqueous solution of an imidazole compound of a hydrogen atom. Next, the above-mentioned adhesive solution was adjusted to a pH of about 4 with acetic acid, and then heated at 40 °C. Next, the substrate 1 was immersed in the adhesive solution for 10 minutes to adhere the adhesive imparting compound 5b to the surface of the metal film 51. Next, as shown in Fig. 5B, the adhesive imparting compound 5b is transferred from the transfer substrate 6 1 to the surface 1a of the substrate 1, whereby the first adhesive layer 5 is formed. Next, as shown in Fig. 5C, a core body 11 made of copper having a diameter D = 50 / zm is adhered to the surface of the substrate 1 in an air atmosphere. Next, an adhesive adhesion-imparting compound is applied to the surface 11a of the core body 11 to form a second adhesive layer 13. Next, as shown in Fig. 5D, solder particles 14 having a metal composition of Sn/3.5Ag diameter d = about 10 μm are adhered to the second adhesive layer 13. Next, the excess solder particles 14 are removed by an air knife. Next, as shown in FIG. 5E, the soldering step is performed to the solder layer 15. First, the substrate 1 was heated for 20 minutes using an oven at 180 ° C to fix the core body 1 1 and the solder particles 14 . Next, the flux is sprayed toward the surface of the substrate 1. Next, the substrate 1 was heated in a nitrogen atmosphere at a sintering furnace of 24 ° C for 3 minutes to form a solder layer 15 having a film thickness of 5 / zm so as to cover the surface 11a of the core body 11. A solder ball 70 having a diameter of about 60 μm is produced by the above method. (Example 6)

-52-201227852 Next, the embodiment 6 will be described. First, as shown in Fig. 6A, a tungsten paste is applied in a dot shape by screen printing on the surface la of the substrate 1 made of aluminum. Next, the tungsten paste is sintered to form a metal film 52 (second metal film) made of tungsten in a dot shape. At this time, the pattern of the metal film 52 is a dot having a diameter of 25 " m, and the interval between the adjacent metal film 52 patterns is 200 μm. Next, the mask is disposed so as to cover the surface la of the substrate 1. Cover 43 (third mask). ^ At this time, the mask 43 is an opening portion 36 (sixth opening portion) having a diameter F6 = 7 0 // m. Further, the adjacent opening portions 36 are spaced apart from each other by 200 μm. Further, the arrangement position of the mask 43 is adjusted so that the point formed by the metal film 52 is located at the center of the opening portion 36. Then, the adhesion-imparting compound (first adhesion-imparting compound) adheres to the surface of the metal film 52. In this case, as the adhesive solution containing the adhesiveness-imparting compound, the alkyl group of R12 of the above general formula (3) is a 2 mass% aqueous solution of an imidazole compound in which CuHu and R11 are hydrogen atoms. Next, the above-mentioned adhesive solution was adjusted to a pH of about 4 with acetic acid, and then heated at 40 °C. Next, the substrate 1 was immersed in the adhesive solution for 10 minutes, and the first adhesive layer 5 was formed on the surface of the metal film 52 as shown in Fig. 6A. Next, as shown in Fig. 6B, a core body 11 made of copper having a diameter D = 50 / / m is adhered to the surface of the first adhesive layer 5 in an air atmosphere. Next, as shown in Fig. 6C, an adhesive property-imparting compound is applied to the surface 11a of the core body 11 to form a second adhesive layer 13 . -53- 201227852 Next, as shown in Fig. 6D, solder particles ι4 having a metal composition of Sn/3.5Ag diameter d = about 10/z m are attached to the second adhesive layer 13. Next, the excess solder particles 14 are removed by an air knife. Next, the soldering step is performed as shown in FIG. 6E to the solder layer 15. First, the substrate 1 was heated in an oven at 180 ° C for 20 minutes to fix the core body u and the solder particles 14 . Next, the flux is sprayed toward the surface of the substrate 1. Next, the substrate 1 was heated in a nitrogen atmosphere at a sintering temperature of 24 ° C for 3 minutes to form a solder layer 15 having a film thickness of 5 / m so as to cover the surface 11 a of the core body 11 . The solder balls 70 having a diameter of about 6 μm were produced by the above method. As a result of Examples 1 to 6, no nucleus U detachment occurred. Further, the core body 11 in which the solder layer 15 is not formed is also not seen. According to the above method, it is not necessary to use a high melting point solder having a high lead content, that is, a good solder ball 70 is formed. Therefore, lead-free solder ball 70 can be achieved. Therefore, α rays are not emitted from Pb contained in the solder bumps. Therefore, it is possible to prevent the alpha rays from causing erroneous actions of the electronic components. Further, since the solder ball 70 having the core body 11 as a core can be manufactured inexpensively, the problem of height unevenness of the solder bumps and the problem of wafer sinking when the wafer is mounted and welded can be solved at low cost. This method is a method suitable for the fine substrate 1, and can provide an electronic machine with high integration and high reliability. SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method capable of forming a solder ball at a low cost in accordance with a fine pattern shape. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a view showing a step of a solder ball manufacturing step of a first embodiment of the present invention. Fig. 1 is a view showing a step of a solder ball manufacturing step of the first embodiment of the present invention. Fig. 1C is a view showing the steps of the solder ball manufacturing step of the first embodiment of the present invention. Fig. 1D is a view showing the steps of the solder ball manufacturing step of the first embodiment of the present invention. Fig. 1 is a view showing a step of a solder ball manufacturing step of the first embodiment of the present invention. Fig. 2 is a view showing the steps of the solder ball manufacturing step of the second embodiment of the present invention. Fig. 2 is a view showing the steps of the solder ball manufacturing step of the second embodiment of the present invention. Fig. 2C is a view showing the steps of the solder ball manufacturing step of the second embodiment of the present invention. Fig. 2D is a view showing the steps of the solder ball manufacturing step of the second embodiment of the present invention. Fig. 2 is a view showing the steps of the solder ball manufacturing step of the second embodiment of the present invention. Fig. 3 is a view showing the steps of the solder ball manufacturing step of the third embodiment of the present invention. Fig. 3 is a view showing the steps of the solder ball manufacturing step of the third embodiment of the present invention. -55-201227852 Fig. 3C is a view showing the steps of the solder ball manufacturing step of the third embodiment of the present invention. Fig. 3D is a view showing the steps of the solder ball manufacturing step of the third embodiment of the present invention. Fig. 3E is a view showing the steps of the solder ball manufacturing step of the third embodiment of the present invention. Fig. 3F is a view showing the steps of the solder ball manufacturing step of the third embodiment of the present invention. Fig. 4A is a view showing the steps of the solder ball manufacturing step of the fourth embodiment of the present invention. Fig. 4B is a view showing the steps of the solder ball manufacturing step of the fourth embodiment of the present invention. Fig. 4C is a view showing the steps of the solder ball manufacturing step of the fourth embodiment of the present invention. Fig. 4D is a view showing the steps of the solder ball manufacturing step of the fourth embodiment of the present invention. Fig. 4E is a view showing the steps of the solder ball manufacturing step of the fourth embodiment of the present invention. Fig. 5A is a view showing the steps of the solder ball manufacturing step of the fifth embodiment of the present invention. Fig. 5B is a view showing the steps of the solder ball manufacturing step of the fifth embodiment of the present invention. Fig. 5C is a view showing the steps of the solder ball manufacturing step of the fifth embodiment of the present invention. -56-

S 201227852 Fig. 5D is a view showing the steps of the solder ball manufacturing step of the fifth embodiment of the present invention. Fig. 5E is a view showing the steps of the solder ball manufacturing step of the fifth embodiment of the present invention. Fig. 6A is a view showing the steps of the solder ball manufacturing step of the sixth embodiment of the present invention. Fig. 6B is a view showing the steps of the solder ball manufacturing step of the sixth embodiment of the present invention. Fig. 6C is a view showing the steps of the solder ball manufacturing step of the sixth embodiment of the present invention. Fig. 6D is a view showing the steps of the solder ball manufacturing step of the sixth embodiment of the present invention. Fig. 6E is a view showing the steps of the solder ball manufacturing step of the sixth embodiment of the present invention. Fig. 7A is a view schematically showing a photograph of the core body and the solder ball of the present invention. Fig. 7B is a view schematically showing a photograph of the core body and the solder ball of the present invention. [Description of main component symbols] 1 : Substrate la : Surface of substrate 5 : First adhesive layer 5 a : Surface of first adhesive layer - 57 - 201227852 5b : First adhesive property imparting compound 1 1 : Nucleo body 1 1 a : surface 13 of the core body: second adhesive layer 1 4 : solder particles 1 5 : solder layer 2 1 : first member 2 1 a : first layer 21b of the first member: second layer 22 of the first member: Two members 3 1 : first opening portion 3 2 a : second opening lower portion 3 2 b : second opening upper portion 3 3 : third opening portion 3 4 : fourth opening portion 3 5 : fifth opening portion 3 6 : Six opening portion 41: first mask 42: second mask 43: third mask 51: first metal film 5 2 : second metal film 61: substrate for transfer 61a: surface of substrate for transfer -58-

S 201227852 7 0 : solder ball F j : diameter F2a of the first opening: diameter F2b of the lower portion of the second opening: diameter F3 of the upper portion of the second opening: diameter F4 of the third opening portion: diameter F5 of the fourth opening portion: The diameter F6 of the fifth opening portion: the diameter D of the sixth opening portion: the particle diameter d of the core body: the particle diameter of the solder particles r: the diameter of the first mask - 59 -

Claims (1)

201227852 VII. Patent application garden: 1. A method for manufacturing a solder ball, comprising: a first step of attaching a core body to a first adhesive layer provided on a surface of a substrate, and the core body a second step of applying a tackifying property to the compound to form the second adhesive layer, a third step of attaching the solder particles to the second adhesive layer on the surface of the core body, and melting the solder particles on the surface of the core body A fourth step of forming a solder layer, and a fifth step of stripping the substrate from the core body to obtain a solder ball. 2. The method of manufacturing a solder ball according to claim 1, wherein the core body is made of Cu. 3. The method of manufacturing a solder ball according to claim 1 or 2, wherein before the first step, a pre-step is provided, the pre-step having a portion of the surface of the first adhesive layer The first member of the exposed opening is disposed on the first adhesive layer. Thereafter, in the first step, the core body is adhered to the surface of the first adhesive layer exposed from the opening. 4. The method of manufacturing a solder ball according to claim 3, wherein the first member is composed of the first layer and the second layer; and the first member is disposed in the foregoing a pre-step on an adhesive layer comprising: a step of disposing a first layer of a first member having an opening portion on the first adhesive layer; and a first layer of the first member having a diameter a second layer of the first member having an opening smaller than the opening portion, wherein the central portion of the opening of the first layer overlaps with the central portion of the opening of the second layer; Between the first step and the second step, there is further provided a step of peeling the second layer of the first member from the first layer of the first member. 5. The method of manufacturing a solder ball according to claim 3, wherein, between the first step and the second step, the step of: peeling the first member from the first adhesive layer; And a step of adhering the mask formed by the particles so as to cover the surface of the first adhesive layer; the particle diameter is smaller than the thickness of the first member. 6. The method of manufacturing a solder ball according to claim 1 or 2, wherein before the first step, a plurality of the first adhesive layers having a dot shape are formed apart from each other The method of manufacturing a solder ball according to claim 6, wherein the step of forming the first adhesive layer comprises: a step of disposing a second member of the dot-shaped opening portion of the surface on the substrate; and applying an adhesive material for forming the first adhesive layer by using the second member as a mask, thereby obtaining a step of a plurality of the aforementioned first adhesive layers in a dot shape. 8. The method for producing a solder ball according to claim 6, wherein the step of forming the first adhesive layer in the form of a dot is performed by removing the surfaces of the substrate for transfer from each other. a step of forming a dot-shaped metal film; a step of applying an adhesion-imparting compound to the metal film; and a step of transferring the adhesion-imparting compound from the substrate for transfer onto the surface of the substrate to form a first adhesive layer . 9. The method of manufacturing a solder ball according to claim 8, wherein the step of forming the dot-shaped first adhesive layer comprises: covering the substrate with a mask having an opening; After the surface, the step of transferring the adhesion-imparting compound from the substrate for transfer on the surface of the substrate exposed from the opening of the mask; in the second step, maintaining the surface of the substrate by masking The cover is covered, and the aforementioned second adhesive layer is formed on the core body. The method for manufacturing a solder ball according to claim 6, wherein the step of forming the first adhesive layer comprises: separating the surfaces of the substrate from each other The step of forming a dot-like gold and the step of forming the front-first adhesive layer by applying the adhesion-imparting compound to the metal film. The method for manufacturing a solder ball according to the first aspect of the invention, wherein the step of forming the first adhesive layer comprises: forming a point-like metal on the surface of the substrate to leave each other And a step of applying the adhesion-imparting compound to the surface of the metal film exposed from the opening after covering the surface of the substrate with a mask having an opening. 1 2 The method for producing a solder ball according to claim 10, wherein the metal film is made of tungsten. The method of producing a solder ball according to claim 1 or 2, wherein the average particle diameter of the solder particles is 1/2 or less of an average particle diameter of the core body. -63 -