201227849 六、發明說明： 【發明所屬之技術領域】 本發明疋有關於-種打線接合（wirebGnding)技術，且特別是有 關於一種打線接合設備與打線接合方法。 【先前技術】 打線接合技術疋一種常見的聯線（interconnection)技術。傳統的 φ 打線接合技術主要是利用導線（wire)來將半導體晶片（semiconductor =ip)上的接墊（pad)電性連接於封裝基板（packaging如匕加化）或 是導線架（lead frame)上的接墊。然而，隨著科技的發展，目前打線 接合技術亦普遍應用於堆疊式半導體封裝結構（stacked semic〇nd_r package structure )中各層晶片之間的電性連接。 就應用於堆疊式半導體封裝結構的打線接合技術而言，先前技術 通常會包括下列幾個步驟。首先，在導線位於一健合工具（b〇nding tool)下方的末知上燒結出（me】ting) 一個第一球體。接著，閉合接合 工具上的一個線夾（wire damper )’並且利用接合工具將第一球體壓焊 # 在—個第—晶片的—個第—接塾上。之後，張開線夾，並且向上移動 接合工具，以使接合工具與第一球體之間的導線形成一段預留區段 (reservedsegment)。然後，再度閉合線夾，並且再度向上移動接合工 具，以分離第一球體與預留區段。 接著，在預留區段的末端上燒結出一個第二球體，並且利用接合 工具將第二球體壓焊在一個第二晶片的一個第二接塾上。之後，張開 線夾，並且依照一個預定路徑（presetting route)將接合工具移動至第 接塾上方。然後，再度閉合線炎，並且利用接合工具將導線壓焊在 - 第一球體上。之後，再度張開線夾’並且向上移動接合工具，以使接 合工具與第一球體之間的導線再度形成一段預留區段。然後，再度閉 201227849 合線夾，並且再度向上移動接合工具，以分 進而完成第-接墊與第二接塾之間的電性連接。 。預留—’ 簡單來說，先前技術是先對第一接塾進行 =於導線末端的第一球輯在第一_上。接著：： =驟’以分轉-球體與導線。之後，對第二接墊進行^次 V驟’以將形餘導線末端㈣二球顏焊 =合尸依照預定路徑將導線拉回第—球體上方之後，再:: 第壓焊麵，以料線壓焊在第—球體上。最後，再進行 離第一球體與導線，進而完成第-娜與第二 2注意的是’在上述先前技射，接合工具必須對第—接塾進 仃兩:人壓焊步驟，因而導致第_受損 步驟，，每次進行分離步 低，整ml接塾上脫。因此，先前技術不僅整體良率會較 整體_=_高。糾’先她_騎_而使得 【發明内容】 為了解決上述本發明提供了 ―種打線接合設備與打線接合 万法，以縮短整體製程。 本發贿供—種打線接合設備，㈣導5丨（iead)—條導線來電性 —個第-基板的-個第-接墊與-個第二基板的—個第二接塾， 二中打線接合設備包括-_台（stage)、—辦線捲軸（_ _)、 、接5工具以及一個放電棒組件（torch electrode assembly)。載台用 令祆載第基板與第二基板。導線捲轴配置於載台上方，用以承載導 壬接口工具配置於載台與導線捲軸之間，用以帶動從導線捲抽延伸 接合工具的導線在第—接誠第二接墊之間移動，其中接合工具包^ 201227849 括—個毛細管（capillaiy)、一個活動線夾以及一個固定線夾。導線穿 過毛細官。活動線夾與固定線夾垂直地排列於毛細管上方，用以夾持 導線，其中活動線夾適於上下移動。放電棒組件配置於載台與毛細管 之間，用以在導線上燒結出一個球體。 在本發明的一實施例中，上述的放電棒組件僅包括適於上下移動 的隻放電棒，用以在導線的一個末端上燒結出一個第一球體，或者 在導線鄰近於毛細管下端的—段區段（segment)上齡個第二球 體。201227849 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a wire bonding technique, and more particularly to a wire bonding apparatus and a wire bonding method. [Prior Art] Wire bonding technology is a common interconnection technique. The traditional φ wire bonding technology mainly uses a wire to electrically connect a pad on a semiconductor chip (semiconductor = ip) to a package substrate (such as packaging) or a lead frame. The pads on the top. However, with the development of technology, the current wire bonding technology is also commonly applied to the electrical connection between the layers of the stacked semiconductor package structure (stacked semic〇nd_r package structure). In the case of wire bonding techniques applied to stacked semiconductor package structures, the prior art typically includes the following steps. First, a first sphere is sintered on the last known wire below the b〇nding tool. Next, a wire damper on the bonding tool is closed and the first ball is pressure-bonded to the first substrate of the first wafer by means of a bonding tool. Thereafter, the wire clamp is opened and the bonding tool is moved upward to form a reserved section of the wire between the bonding tool and the first ball. Then, the clamp is closed again and the engagement tool is moved up again to separate the first sphere from the reserved section. Next, a second sphere is sintered on the end of the reserved section, and the second sphere is pressure bonded to a second joint of a second wafer by means of a bonding tool. Thereafter, the clamp is opened and the bonding tool is moved over the first ridge according to a predetermined route. Then, the line inflammation is closed again, and the wire is pressure-welded to the - first ball using a bonding tool. Thereafter, the clip is opened again and the bonding tool is moved upward to cause the wire between the bonding tool and the first ball to again form a reserved section. Then, the 201227849 wire clamp is closed again, and the bonding tool is moved upward again to divide the electrical connection between the first pad and the second port. . Reserved - 'In a nutshell, the prior art first performed on the first interface = the first ball at the end of the wire was on the first _. Then:: = ’ ' to split - the sphere and the wire. After that, the second pad is subjected to a V-timer 'to make the end of the shape wire (four) two-ball joint welding = the body is pulled back to the top of the sphere according to the predetermined path, and then:: the first welding surface, the material Wire bonding is performed on the first sphere. Finally, proceeding from the first sphere and the wire, and then completing the first-and second-second note, is that in the above prior art, the bonding tool must be in contact with the first: the human pressure welding step, thus resulting in the first _ Damage step, each time the separation step is low, the whole ml is removed. Therefore, the prior art not only has a higher overall yield than the overall _=_. In order to solve the above-mentioned invention, a wire bonding apparatus and a wire bonding method are provided to shorten the overall process. This bribe is a kind of wire bonding equipment, (4) guide 5 丨 (iead) - wire incoming call - a first - substrate - a pad - and a second substrate - a second interface, two The wire bonding apparatus includes a -stage, a spool (_ _), a 5 tool, and a torch electrode assembly. The stage is used to load the first substrate and the second substrate. The wire reel is disposed above the stage, and the tool for carrying the guiding interface is disposed between the stage and the wire reel for driving the wire extending from the wire to extend the bonding tool to move between the second connection pads , the joint kit ^ 201227849 includes a capillaiy, a movable clamp and a fixed clamp. The wire passes through the captain. The movable clamp and the fixed clamp are vertically arranged above the capillary for holding the wire, wherein the movable clamp is adapted to move up and down. The discharge rod assembly is disposed between the stage and the capillary to sinter a sphere on the wire. In an embodiment of the invention, the discharge rod assembly includes only a discharge bar adapted to move up and down to sinter a first sphere on one end of the wire, or a section adjacent to the lower end of the capillary A second sphere of the age of the segment.
在本發明的一實施例中，上述的放電棒組件包括一個第一放電棒 (torchelectrode)以及一個第二放電棒。第一放電棒 配置於載台與毛細管之間’用以在導線的—個末端上燒結出一個第一 球體。第二放電棒g2)置於毛崎與第—放電棒之間，用以在導線鄰近 於毛細管下端的一段區段上燒結出一個第二球體。 在本發明的一實施例中，上述的打線接合設備更包括一個導線鬆 緊度調整器（wire tensioner)，其中導線鬆緊度調整器配置於導線捲軸 與接合工具之間，用以調整導線的鬆緊度（tensity)。 呈本發明更提供-種打線接合方法，其包括下列步驟。首先，提供 具有-個毛細管、—個活動線夾以及_個固絲失的_個接合工具， 其中士細官穿設有-條導線，並且活麟夾鋪定線爽垂直地排列於 ^細官上方，肋夾持導線。接著，在導線位於毛細管下方的一個末 端上燒，出-個第—球體^之後，閉合固定線夾關定導線，並且利 用毛細管將第—球體壓焊在—個第-基板的-個第-接塾上。然後， 2開活動線夾翻定線夾，並且賴-個預定路郷接合工具移動至 —個第二基板的-個第二接墊上方，以使毛細管與第__球體之間的導 成-段連接區段（bGndingsegment)。接著閉合活動線夾，並且 冬活動線央向下移動H距離’錢毛細管與連接區段之間的導 線形成-魏結n段（melting segment)。之後，錄_燒結區段上 201227849 燒結出一個第二球體。然後，再度閉合固定線夾以固定導線。接著， • 再度張開活動線夾，並且將活動線夾向上移動第一距離，以使活動線 - 夾回到初始位置。之後，利用毛細管將第二球體壓焊在第二接墊上。 然後，再度張開固定線夹，並且將接合工具向上移動一段第二距離， 以使毛細管與第二球體之間的導線形成—段預留區段（reserved segment)。之後，再度閉合固定線夾，並且向上移動接合工具以分離 第一球體與預留區段。 在本發明的一實施例中，上述的活動線夾配置於固定線夾上方。 φ 在本發明的一實施例中，上述的固定線夾配置於活動線夾上方。 本發明再提供另-種打線接合方法，其包括下列步驟。首先，提 供f有-個毛細管、配置於毛細管上方的一個活動線夾以及配置於毛 細官與活動線夾之間的一個固定線夾的一個接合工具，其中毛細管穿 設有一條導線，並且活動線夹與固定線夹用以夾持導線。、接著、，在導 ，位於毛細管下方的-個末端上燒結出—個第—球體。之後，閉合固 定線失以S)定導線’並且利用毛細管將第—球題焊在—個第一基板 的個第接墊上。然後，張開活動線夾與固定線夹，並且依照一個 預定，徑將接合工具移動至—個第二基板的—個第二接墊上方、，、以使 • 毛細官^第一球體之間的導線形成-段連接區段。接著，閉合活動線 夾與固定線夾，並且將活動線夾向下雜一段第—㈣，以使活動線 夾與固定線夾之間的導線職—段燒結區段。之後，張開固定線夾， 並且利用燒結區段在位於毛細管下方的導線上燒結出一個第二球體。 然後，再度閉合固定線夾以固定導線。接著，再度張開活動線夾，並 且將活動線夾向上移動第-距離，以使活動線夾_初始位置。之後， /用毛’·田g將第—球體壓焊在第二接塾上。然後，再度張咖定線夾， 並且將接合JL具向场動—段第二距離，以使毛細管與第二球體之間 的導線形成-段預留區段。之後，再度閉合固定線夾，並且向上移動 接合工具’以分離第二球體與預留區段。 201227849 台與===2=合方法包括利用配置於載 方的末端上燒結出第一破^本&轉’在導線位於毛細管下 體。 ：’或者在導線的燒龍段上燒結出第二球 台與毛細Ϊ二riH广⑽接合松_用配置於載 結出第-球體，並導線位於毛細管下方的末端上燒 放電棒在魏嫩轉偏—隻第二In an embodiment of the invention, the discharge rod assembly includes a first discharge electrode and a second discharge rod. The first discharge rod is disposed between the stage and the capillary to sinter a first sphere on the end of the wire. A second discharge rod g2) is placed between the Maosaki and the first discharge rod for sintering a second sphere on a section of the wire adjacent the lower end of the capillary. In an embodiment of the invention, the wire bonding apparatus further includes a wire tensioner, wherein the wire tension adjuster is disposed between the wire reel and the bonding tool to adjust the tightness of the wire. (tensity). Further provided by the present invention is a wire bonding method comprising the following steps. Firstly, there is provided a bonding tool having a capillary tube, a movable wire clamp, and a fixing wire, wherein the wire is placed with a wire, and the living string is arranged vertically and vertically. Above the official, the ribs hold the wires. Then, after the wire is located at one end below the capillary, after the first ball is closed, the fixed wire clamp is closed, and the first ball is pressure-welded to the first substrate by the capillary. Connected. Then, 2 open the movable clamp to align the clamp, and the predetermined-way engagement tool is moved over the second pads of the second substrate to guide the capillary between the __sphere - segment connection section (bGndingsegment). The active clamp is then closed and the winter active line is moved downward by the H distance 'the wire between the money capillary and the connected section forming a wetting knot. Thereafter, a second sphere is sintered on 201227849 on the recorded_sintered section. Then, close the retaining clip again to secure the wire. Next, • Open the active clamp again and move the active clamp up a first distance to return the active cable - clamp to its original position. Thereafter, the second ball is pressure welded to the second pad by a capillary. Then, the fixing clip is opened again, and the bonding tool is moved upward by a second distance so that the wire between the capillary and the second sphere forms a segment reserved segment. Thereafter, the fixed clip is closed again and the bonding tool is moved upward to separate the first sphere from the reserved section. In an embodiment of the invention, the movable clamp is disposed above the fixed clamp. φ In an embodiment of the invention, the fixed clamp is disposed above the movable clamp. The present invention further provides another wire bonding method comprising the following steps. First, a f-capillar, a movable clamp disposed above the capillary, and a bonding tool disposed between the capillary and the movable clamp, wherein the capillary is provided with a wire and the movable wire is provided Clips and fixed clips are used to hold the wires. Then, in the guide, a -th sphere is sintered on the end of the tube below the capillary. Thereafter, the closed fixing wire is lost by the S) wire and the first ball is welded to the first pad of the first substrate by the capillary. Then, the movable clamp and the fixed clamp are opened, and the bonding tool is moved to the top of the second substrate of the second substrate according to a predetermined path, so that the capillary is between the first spheres The wire forms a segment connection section. Next, close the movable clamp and the fixed clamp, and lower the movable clamp to the first - (4) to make the wire-spinning section between the movable clamp and the fixed clamp. Thereafter, the clamp is opened and a second sphere is sintered on the wire located below the capillary using the sintered section. Then, close the retaining clip again to secure the wire. Next, open the active clamp again and move the active clamp up by the distance - so that the active clamp _ initial position. Thereafter, the first sphere is pressure-welded to the second joint by the hair. Then, the clamp is again set and the JL is coupled to the field to a second distance so that the wire between the capillary and the second sphere forms a segment reserved section. Thereafter, the fixed clip is closed again and the bonding tool is moved up to separate the second sphere from the reserved section. The 201227849 stage and ===2= combination method includes sintering the first break & turn on the end disposed on the carrier with the wire under the capillary. : 'Or the second table and the capillary Ϊ riH wide (10) joint loose on the sinter section of the wire _ used to arrange the spheroidal body, and the wire is located at the end below the capillary. Partial - only second
損的第綱步㈣爾低第一接塾受 本發月僅進仃了一次分離步驟，因而可提高整體良 體封裝體生產成本。另外，本發明也因為步驟較少而使得整 例，==;述作==明_，下文特舉多個實施 【實施方式】 主圖1繪示出本發明-實施例中一種打線接合設備的結構示意圖。 請參考圖1所示’打線接合設備隐可用來導引__條導線細:以將 一個第-基板310上的多個第一接墊312 一對一地電性連接於一個第 二基板320上的多個第二接塾切。於此實施例中，第一基板31〇與第 二基板32〇之其-可為一個半導體晶片，而第一基板與第二基板 320之另一不僅可為一個封裝基板或是一個導線架，亦可為另一個半導 體晶片。 打線接合設備100a包括一個載台no、一個導線捲軸12〇、一個 接合工具130以及一個放電棒組件14〇a。載台11〇用以承载第一基板 310與第二基板320。再者，導線捲軸12〇配置於載台ι1〇上方，用以 201227849 承載導線200。另外，接合工具13〇配置於載台11〇與導線捲軸12〇之 間，適於相對於載台11〇移動，並且包括一個毛細管132、一個活動線 夾134以及一個固定線夾136。其中，活動線夾134與固定線夾136垂 直地排列於毛細管132上方，用以夾持導線2〇〇，並且活動線夾134適 於相對於固疋線夾136上下移動。於此實施例巾，活動線炎134配置 於固疋線爽136上方。但在其他未繪示的實施例中，活動線炎亦可配 置於毛細管與固定線夾之間。The first step of the damage (fourth) is the first one. The first step of the loss is only one separation step in the current month, which can increase the overall production cost of the good package. In addition, the present invention also makes the whole example because the steps are small, ==; is described as == Ming_, and the following is a plurality of implementations. [Embodiment] FIG. 1 illustrates a wire bonding apparatus in the present invention-embodiment Schematic diagram of the structure. Referring to FIG. 1 , the wire bonding device can be used to guide the wire splicing to electrically connect the plurality of first pads 312 on a first substrate 310 to the second substrate 320 one-to-one. A plurality of second joints on the cutting. In this embodiment, the first substrate 31 and the second substrate 32 may be one semiconductor wafer, and the other of the first substrate and the second substrate 320 may be not only a package substrate or a lead frame. It can also be another semiconductor wafer. The wire bonding apparatus 100a includes a stage no, a wire reel 12, a bonding tool 130, and a discharge bar assembly 14A. The stage 11 is used to carry the first substrate 310 and the second substrate 320. Furthermore, the wire reel 12 is disposed above the stage ι1〇 for the 201227849 carrying wire 200. Further, the bonding tool 13 is disposed between the stage 11 and the wire reel 12, adapted to move relative to the stage 11, and includes a capillary 132, a movable clamp 134, and a fixed clamp 136. The movable clamp 134 and the fixed clamp 136 are vertically arranged above the capillary 132 for clamping the wire 2, and the movable clamp 134 is adapted to move up and down with respect to the fixed clamp 136. In this embodiment, the active line inflammation 134 is disposed above the solid line 136. However, in other embodiments not shown, the actinitis can also be placed between the capillary and the fixed clip.
於此實施例中，來自於導線捲軸12〇的導線2〇〇會依序穿過活動 線夾134、固疋線夾136與毛細管丨32。因此，當接合工具13〇相對於 載台no移動時，即會帶動導線200在第一接塾312與第二接塾您 之間移動。可賴解的是，在上述活動線夾配置於毛細管熊定線央 之間的未料實關巾’來自於導線錄的導_會料穿過固定線 夾、活動線炎與毛細管。相同地’當接合工具相對於載台移動時，亦 可帶動導線在第一接墊與第二接墊之間移動。 除此之外，為了避免接合工具13〇帶動導線2〇〇相對於載台ιι〇 移動時’會導致導線2〇〇承受過大的拉力而斷裂，於此實施例中，打 線接合設備100a更可包括用以調整導線2〇〇鬆緊度的一個導線轉产 調整器150。其中，導線鬆緊度調整器150可配置於導線捲轴⑽血^ 合工具130之間。 /、设 从电悴▲仟丨4㈨配置於載台110與毛細管132之間，用 f導線2GG上燒結出-個球體。於此實施例中，放電棒組件μ 早獨-隻放電棒與適於帶動放電棒上下移動的驅紐置（未繪示 ^出因^放堇可以向下移動，以在導線細的乂末端 二出—個第一球體，亦可向上移動，以在導線200鄰近於毛細管p 下端的一段區段上燒結出一個第二球體。 - 利用上述實施例中的打線接合設備廳，即可先藉由放 4〇a在導線200的末端上燒結出第一球體並且利用毛細管成，， 201227849 -球體Μ焊在第-接墊312上。接著，在藉由接合工具13〇依照一個 預定路徑將導線200導引至第二接塾322上方之後，可再藉由活動線 夹134帶動導線200向下移動一段距離，以使導線200預留出-段燒 結區奴。之後，可再藉由放電棒組件14〇a在導線2〇〇的燒結區段上燒 結出第二球體’並且再度利用毛細管132將第二球體壓焊在第二接塾 322上。然後’再藉由固定線夾132分離導線2〇〇與第二球體，即已完 成第一接墊與第二接墊之間的電性連接。 相較於先前技術，上述實施例僅會對第一接墊進行一次壓焊步 驟，因而可降低第-接塾受損的機率。再者，上述實施例只需要進行 • 一次分離步驟，因而可降低球體從接墊上鬆脫的機率，進而提高整體 良率’同時也崎健體生產成本。另外，上述實關也因為步驟較 少而使得整體封裝速度較快。 圖2繪示出本發明另一實施例中一種打線接合設備的結構示意 圖。請參考圖2所示，此實施例中的打線接合設備刚⑽似於前一^ 施例中的打線接合設備l〇〇a，二者不同之處在於放電棒組件的結構。 在前一實施例中，放電棒組件140a是由單獨一隻放電棒與適於帶動放 電棒上下移動的驅動裝置所組成。然而，於此實施例中，放電棒组件 140b則是由一個第一放電棒142以及一個第二放電棒144所組成。第 籲-放電棒M2配置於載台110與毛細管132之間，用以在導線細的 末端上燒結出第一球體，而第二放電棒144則配置於毛細管132與第 一放電棒142之間，用以在導線2〇〇鄰近於毛細管132下端的一段區 段上燒結出第二球體。換句話說，本發明的打線接合設備可以利用單 獨一隻放電棒或是利用兩隻不同的放電棒在導線的不同位置上燒結出 兩個球體。 & ° 圖3繪示出本發明-實施例中―種打、線接合方法的流程圖，而圖 4A至圖4G則繪示出圖3中所繪示的打線接合方法的示意圖。為了讓 所屬技術領域具有通常知識者更容易據以實施以下實施例中所揭露的 打線接合方法，以下的實施例將配合圖2中所揭露出的打線接合設備κ 201227849 100b作詳細揭露。然:，打線接合設備藝僅用以輔助說明，並非用 以限定此實關。換句城，此實施綱雜合B丨切揭露出的打 線接合設備隐，或是配合其他糖摊亦具有相同或她功能的打 線接合設備據以實施。 此實施例中所揭露出的打線接合方法包括下列步驟。首先，請參 考圖3與圖4A所示，提供具有一個毛細管132、一個活動線夾134以 及一個固定線夾136的一個接合工具13〇，其中毛細管132穿設有一條 導線200 ’並且活動線夾134與固定線夾136垂直地排列於毛細管132 的上方’用以爽持導線2〇〇 (si〇〇)。而且，活動線夾134適於相對於 固定線夾136上下移動，此實施例中，活動線夾134配置於固定線 夾〗36上方。同樣地，在其他未繪示的實施例中，活動線夾亦可配置 於毛細官與固定線夾之間。接著，在導線2〇〇位於毛細管132下方的 -個末端上燒結出-個第-球體2iG (S1G5)。於此實施例中是利用第 -放電棒142錢結出第-球體2.但是在其他實施例中，亦可使用 圖1中的放電棒組件140a，或是其他可用來在導線2〇〇上燒結出第一 球體210的裝置。 之後，請參考圖3與圖4B所示，閉合固定線夾136以固定導線 200，並且利用毛細管132將第一球體21〇壓焊在一個第一基板31〇的 -個第-接墊M2上（S110)。然後，請參考圖3與圖π所示，賴 /舌動線夾134 (當活動線夾134亦呈閉合狀態時）與固定線夾136，並 且依照一個預定路徑將接合工具130移動至一個第二基板32〇的一個 第二接塾322上方，以使毛細管132與第一球體21〇之間的導線2〇〇 形成一段連接區段220 (S115)。接著，請參考圖3與圖4D所示，閉 合活動線夾134 ’並且將活動線夾134向下移動一段第一距離，以使毛 細官Π2與連接區段22〇之間的導線2〇〇形成一段燒結區段23〇 (S120)。 之後，請參考圖3與圖4E所示，在導線2〇〇的燒結區段230 (繪 示於圖4D中）上燒結出一個第二球體24〇 (S125)。於此實施例中是[$] 201227849 利用第二放電棒144來燒結出第二球體240。但是在其他實施例中，亦 ' 可使用圖1中的放電棒組件14〇a，或是其他可用來在導線200上燒結 出第二球體240的裝置。然後’請參考圖3與圖4F所示，再度閉合固 定線夾136以固定導線200 (S130)。接著，再度張開活動線夹134， 並且將活動線夾134向上移動第一距離，以使活動線夾134回到初始 位置（S135)。 之後，請參考圖3與圖4G所示，利用毛細管132將第二球體240 壓焊在第二接墊322上。然後，請參考圖3與圖4H所示，再度張開固 定線夾136，並且將接合工具130向上移動一段第二距離，以使毛細管 # 132與第二球體240之間的導線200形成一段預留區段250。之後，請 參考圖3與圖41所示，再度閉合固定線夾136，並且向上移動接合工 具130’以分離第二球體240與預留區段250。上述至此，大致上已完 成第一接墊312與第二接墊322之間的電性連接。之後，只要重複執 行上述步驟，即可一對一地將多個第一接墊312電性連接於多個第二 接墊322。 圖5缘示出本發明另一實施例中一種打線接合方法的流程圖。此 貫把例中的打線接合方法相似於前一實施例中的打線接合方法，二者 不同之處在於燒結出第二球體的詳細步驟，即圖5中的步驟S22〇與 ♦ S225不同於圖3中的步驟S120與S125。 簡單來說，如圖4D所示，在前一實施例中，在形成連接區段22〇 (S115)之後的步驟S120僅閉合了活動線夾134。因此，將活動線夾 134向下移動第一距離時所形成的燒結區段23〇應該會形成於毛細管 132下方。也因此，步驟S125即可直接在毛細管132下方將燒結區段 230燒結出如圖4E所示的第二球體240。然而，於此實施例中，在形 成連接區段220 (S215)之後的步驟S220會同時閉合活動線夹134與 固疋線夾136。因此，將活動線夾134向下移動第一距離時所形成的燒 • 結區知 就應§亥會形成於活動線夾134與固定線夾136之間。也因 此，步驟S225就必須先張開固定線夾136，才能使燒結區段23〇通過[ 12 201227849 毛細管132。如此一來，才能利用燒結區段230在位於毛細管132下方 的導線200上燒結出第二球體240。 值得注意的是’在前一實施例中’活動線夾134可配置於固定線 夾136上方，亦可配置於固定線夾136下方。然而，於此實施例_， 活動線夾Π4亦可配置於固定線夾I%上方，但是並不建議配置於固 定線夾136下方。 综合上述，本發明至少可具有下列優點： 1. 降低第一接墊受損的機率；In this embodiment, the wires 2 from the wire reel 12 turns through the movable clamp 134, the fixed clamp 136 and the capillary 32 in sequence. Therefore, when the bonding tool 13 is moved relative to the stage no, the wire 200 is driven to move between the first port 312 and the second port. It can be understood that the unconstrained towel "between the above-mentioned movable clamps disposed between the central ends of the capillary bears" comes from the guides of the wires and passes through the fixed clamps, the movable line inflammation and the capillary tubes. Similarly, when the bonding tool is moved relative to the stage, the wire can also be moved between the first pad and the second pad. In addition, in this embodiment, the wire bonding apparatus 100a can be further broken in order to prevent the bonding tool 13 from being driven to move relative to the stage ιι, which may cause the wire 2 to be subjected to excessive tensile force. A wire conversion adjuster 150 for adjusting the tightness of the wire 2 is included. Wherein, the wire tension adjuster 150 can be disposed between the wire reel (10) blood bonding tool 130. /, from the electric 悴 仟丨 仟丨 4 (9) is placed between the stage 110 and the capillary 132, and a sphere is sintered by the f-wire 2GG. In this embodiment, the discharge rod assembly μ has a single discharge-only discharge rod and a drive button suitable for driving the discharge rod up and down (not shown), the discharge can be moved downward to make the wire end of the wire The first ball is also moved upward to sinter a second sphere on a section of the wire 200 adjacent to the lower end of the capillary p. - Using the wire bonding apparatus hall in the above embodiment, the first ball can be borrowed. The first sphere is sintered on the end of the wire 200 by the discharge 4a and is formed by capillary, 201227849 - the ball is soldered on the first pad 312. Then, the wire is guided according to a predetermined path by the bonding tool 13 After the lead 200 is guided over the second port 322, the wire clamp 134 can be used to move the wire 200 downward by a distance, so that the wire 200 is reserved for the -sinter zone slave. After that, the wire can be further discharged by the discharge bar. The assembly 14〇a sinters the second sphere 'on the sintered section of the wire 2〇〇 and re-welds the second ball to the second port 322 by means of the capillary 132. Then the wire is separated by the fixed wire clamp 132 2〇〇 and the second sphere, that is, finished The electrical connection between the first pad and the second pad. Compared with the prior art, the above embodiment only performs a pressure welding step on the first pad, thereby reducing the probability of damage to the first port. Furthermore, the above embodiment only needs to perform a single separation step, thereby reducing the probability of the ball being loosened from the pad, thereby improving the overall yield' while also producing the cost of the body. In addition, the above is also because of the steps. Figure 2 is a schematic view showing the structure of a wire bonding apparatus according to another embodiment of the present invention. Referring to Figure 2, the wire bonding apparatus in this embodiment is just like the previous one. ^ Wire bonding apparatus 10a in the embodiment, the difference being the structure of the discharge bar assembly. In the previous embodiment, the discharge bar assembly 140a is composed of a single discharge bar and a discharge bar suitable for driving The moving drive device is composed of. However, in this embodiment, the discharge rod assembly 140b is composed of a first discharge rod 142 and a second discharge rod 144. The first discharge-discharge rod M2 is disposed on the stage 110 and Between the thin tubes 132, the first ball is sintered on the thin end of the wire, and the second discharge bar 144 is disposed between the capillary 132 and the first discharge bar 142 for being adjacent to the capillary 132 at the wire 2 The second sphere is sintered on a section of the lower end. In other words, the wire bonding apparatus of the present invention can sinter two spheres at different positions of the wire by using a single discharge bar or by using two different discharge bars. <° Fig. 3 is a flow chart showing a method of splicing and wire bonding in the present invention-embodiment, and Figs. 4A to 4G are views showing a wire bonding method illustrated in Fig. 3. It is easier for those skilled in the art to implement the wire bonding method disclosed in the following embodiments. The following embodiments will be disclosed in detail in conjunction with the wire bonding apparatus κ 201227849 100b disclosed in FIG. 2 . However: the wire bonding equipment is only used to assist the explanation, and is not intended to limit this. In other words, this implementation of the hybrid joints reveals that the wire bonding equipment is hidden, or that the wire bonding equipment having the same or her function in conjunction with other sugar stalls is implemented. The wire bonding method disclosed in this embodiment includes the following steps. First, referring to FIG. 3 and FIG. 4A, a bonding tool 13A having a capillary 132, a movable clamp 134 and a fixed clamp 136 is provided, wherein the capillary 132 is provided with a wire 200' and a movable clamp 134 is arranged perpendicular to the fixed clamp 136 above the capillary 132 to hold the wire 2 〇〇 (si〇〇). Moreover, the movable clamp 134 is adapted to move up and down relative to the fixed clamp 136. In this embodiment, the movable clamp 134 is disposed above the fixed clamp 36. Similarly, in other embodiments not shown, the movable clamp can also be disposed between the capillary and the fixed clamp. Next, a -th sphere 2iG (S1G5) is sintered on the end of the wire 2〇〇 located below the capillary 132. In this embodiment, the first ball is formed by the first discharge bar 142. However, in other embodiments, the discharge bar assembly 140a of FIG. 1 may be used, or other wires may be used on the wire 2 A device for sintering the first sphere 210. Thereafter, referring to FIG. 3 and FIG. 4B, the fixing clamp 136 is closed to fix the wire 200, and the first ball 21 is pressure-welded by the capillary 132 to the first pad M2 of the first substrate 31. (S110). Then, referring to FIG. 3 and FIG. 3, the lap/tongue clamp 134 (when the movable clamp 134 is also in the closed state) and the fixed clamp 136, and the engagement tool 130 is moved to a first according to a predetermined path. A second interface 322 of the two substrates 32A is disposed such that the wires 2 between the capillary 132 and the first sphere 21〇 form a connecting section 220 (S115). Next, referring to FIG. 3 and FIG. 4D, the movable wire clamp 134' is closed and the movable wire clamp 134 is moved downward by a first distance to make the wire 2 between the capillary official 2 and the connecting section 22〇. A section of the sintered section 23 is formed (S120). Thereafter, referring to Fig. 3 and Fig. 4E, a second sphere 24 (S125) is sintered on the sintered section 230 of the wire 2 (shown in Fig. 4D). In this embodiment, [$] 201227849 utilizes a second discharge rod 144 to sinter the second sphere 240. However, in other embodiments, the discharge rod assembly 14A of Figure 1 or other means for sintering the second sphere 240 on the conductor 200 may be used. Then, referring to Figs. 3 and 4F, the fixing clamp 136 is closed again to fix the wire 200 (S130). Next, the movable clamp 134 is opened again, and the movable clamp 134 is moved upward by a first distance to return the movable clamp 134 to the initial position (S135). Thereafter, referring to FIG. 3 and FIG. 4G, the second ball 240 is pressure welded to the second pad 322 by the capillary 132. Then, referring to FIG. 3 and FIG. 4H, the fixing clamp 136 is opened again, and the bonding tool 130 is moved upward by a second distance to form a wire 200 between the capillary #132 and the second sphere 240. Leave section 250. Thereafter, referring to Figures 3 and 41, the fixed clamp 136 is again closed and the engagement tool 130' is moved upward to separate the second sphere 240 from the reserved section 250. As described above, the electrical connection between the first pad 312 and the second pad 322 is substantially completed. Thereafter, the plurality of first pads 312 can be electrically connected to the plurality of second pads 322 one-to-one by repeating the above steps. Figure 5 is a flow chart showing a wire bonding method in another embodiment of the present invention. The wire bonding method in this example is similar to the wire bonding method in the previous embodiment, and the difference is in the detailed steps of sintering the second sphere, that is, steps S22 and ♦ S225 in FIG. Steps S120 and S125 in 3. Briefly, as shown in Fig. 4D, in the previous embodiment, only the movable clamp 134 is closed in step S120 after the formation of the connecting section 22 (S115). Therefore, the sintered section 23A formed when the movable wire clamp 134 is moved downward by the first distance should be formed below the capillary 132. Therefore, step S125 can directly sinter the sintered section 230 under the capillary 132 to the second sphere 240 as shown in Fig. 4E. However, in this embodiment, the step S220 after forming the connecting section 220 (S215) simultaneously closes the movable clamp 134 and the fixed clamp 136. Therefore, the firing zone formed when the movable wire clamp 134 is moved downward by the first distance is formed between the movable wire clamp 134 and the fixed wire clamp 136. Therefore, in step S225, the fixing clamp 136 must be opened before the sintering section 23 is passed through [12 201227849 capillary 132. In this manner, the second sphere 240 can be sintered using the sintered section 230 on the wire 200 located below the capillary 132. It should be noted that in the previous embodiment, the movable clamp 134 may be disposed above the fixed clamp 136 or may be disposed below the fixed clamp 136. However, in this embodiment, the movable clamp 4 can also be disposed above the fixed clamp I%, but it is not recommended to be disposed below the fixed clamp 136. In summary, the present invention can at least have the following advantages: 1. Reduce the probability of damage to the first pad;
2. 降低球體從接墊上鬆脫的機率； 3. 提南整體良率； 4. 降低整體生產成本；以及 5.提高整體封裝速度。 雖然本發明已以實施例揭露如上，然其並翻以限定本發明，任 ^所f技*領域巾具有通常知識者’在*麟本發明的精神和範圍 作些許的更動與潤飾，因此本發·保護制當視後附的申 Μ專利棘圍所界定者為準。2. Reduce the chance of the ball loosening from the pad; 3. Overall yield of the South; 4. Reduce overall production costs; and 5. Increase overall package speed. Although the present invention has been disclosed in the above embodiments by way of example, the present invention is not limited to the scope of the invention, and the subject matter of the invention has been modified and modified in the spirit and scope of the invention. The hair protection system is subject to the definition of the patent pending spine attached to the application.
13 201227849 【圖式簡單說明] 圖i㈣她—細巾— 圖2繪示出本發明另一膏祐 ’、〜、圆。 月另貫施例中一種打線接合設備的結構示意圖。 圖3繪示出本發明一實施例中—種打線接合方法的流程圖。 圖4A至圖4G緣示出圖3中所繪示的打線接合方法的示意圖。 圖5繪示出本發明另一實施例中一種打線接合方法的流程圖。 • 【主要元件符號說明】 l〇〇a、100b ·，打線接合設備 110 :載台 120 ·導線捲抽 130 :接合工具 132 :毛細管 134 :活動線夾 ® 136:固定線夾 140a、140b :放電棒組件 142、144 :放電棒 150 :導線鬆緊度調整器 200 :導線 310、320 :基板 312、322 :接墊 201227849 S100、S105、S110、S115、S120、S125、S130、S135、S140、 S145、S150、S200、S205、S210、S215、S220、S225、S230、 S235、S240、S245、S250 :步驟13 201227849 [Simple description of the drawing] Figure i (4) She - fine towel - Figure 2 illustrates another paste of the present invention, ~, circle. A structural schematic diagram of a wire bonding apparatus in a different embodiment of the month. 3 is a flow chart showing a method of wire bonding in an embodiment of the present invention. 4A to 4G are schematic views showing the wire bonding method illustrated in FIG. 3. FIG. 5 is a flow chart showing a wire bonding method in another embodiment of the present invention. • [Main component symbol description] l〇〇a, 100b ·, wire bonding equipment 110: stage 120 • wire coil 130: bonding tool 132: capillary 134: movable clamp ■ 136: fixed clamp 140a, 140b: discharge Rod assembly 142, 144: discharge rod 150: wire tightness adjuster 200: wires 310, 320: substrate 312, 322: pads 201227849 S100, S105, S110, S115, S120, S125, S130, S135, S140, S145, S150, S200, S205, S210, S215, S220, S225, S230, S235, S240, S245, S250: steps
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