201226849 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種量測方法，特別是指一種貫孔量 測方法。 【先前技術】 現有微小貫孔（-蚊義孔徑在⑺〜⑽”之間的貫 孔為微小貫孔）有以下二種測量方式：201226849 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a measurement method, and more particularly to a method for measuring a through hole. [Prior Art] There are two types of measurement methods for the existing micro-perforations (the through-holes between the (7) and (10)) are the same:
1.三次元量床測量··以三次元量床的探測頭接觸微小貫 孔内壁面各量測點後，換算得知微小貫孔的孔徑。此方式 的缺點是受限於探測頭的尺寸，故無法量測孔徑尺寸小於 探測頭的貫孔’另’此方式是接觸式量測，所以在實際量 料會因為探測頭觸及貫孔内壁面而造成刮傷。再者:三 次元量床的儀器架設速度較慢、也無法直接對於加工中： 件上的貫孔進行量測。 ㈣徵化法：是以光學量測之後再搭配模擬的 '取得置測結果，因此量測到的結果是以模擬的方式呈 現，並非貫孔内的實際狀況 方式都有 ，如何改 一直是本 由上述說明可知，目前各種量測微小貫孔的 其不易克服的缺點，而造成❹上的不便。所以 善上述缺點而能夠簡單且正確地量測微小貫孔， 技術領域者持續努力的重要目標。 【發明内容】 即在k供一種建構成本低、操 因此，本發明之目的 作簡單的貫孔量測方法。 201226849 於是，本發明貫孔量測方法，包含一架設步驟、一校 準步驟、一實測步驟，以及—分析步驟。 該架設步驟是將一光源單元與一影像接收單元分別設 置於一基準貫孔的相反兩側。 該校準步冑是令g光源單元發射一發冑光束通過該基 準貫孔，而使該發散光束通過該基準貫孔時，部分光被該 基準貫孔内壁面一次反射後離開該貫孔，部分光則直接通 過該基準貫孔’之後’以該影像接收單元接收被該基準貫 孔内壁面一次反射後離開該基準貫孔的光和直接通過該基 準貫孔的光於多數預定位置產生的多數基準干涉影像。 該實測步驟是將一貫穿深度與該基準貫孔相同的待測 貫孔取代該基準貫孔，令該光源單元發射成發散的光束通 過該待測貫孔，並以該影像接收單元接收被該待測貫孔内 壁面一次反射後離開該貫孔的光和直接通過該待測貫孔的 光於所述預定位置產生的多數實測干涉影像。 該分析步驟是將每一預定位置的基準干涉影像盘實測 干涉影像進行比對與運算，得到該待測貫孔内壁面相對該 基準貫孔内壁面的變化量。 本發明的功效在於：藉由光束相互干涉所形成的干涉 條紋，並以該基準貫孔的量測結果作為基準，進而能計算 出該待測貫孔内壁面相對於該基準貫孔内壁面的變化量。 藉此能實際量測貫孔内的狀態且快速地測量出該待測 内壁面的平整度。 ' 【實施方式】 201226849 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖1與圖2，本發明貫孔量測方法的一較佳實施例 ，依序包含一架設步驟2、一校準步驟3、_實測步驟4, 以及一分析步驟5，而可非接觸地量測微小貫孔，特別適用 於孔徑在10〜lOO/zm之間，但不以此為限，深度與孔徑比 不大於10的微小貫孔。 首先進行該架設步驟2，將一光源單元21與一影像接 收單元22分別設置於-基準貫孔23的相反兩側。配合參1. Three-dimensional volume bed measurement·· The probe head of the three-dimensional measuring bed contacts the measuring points of the inner wall surface of the micro-perforated hole, and the aperture of the micro-perforated hole is converted. The disadvantage of this method is that it is limited by the size of the probe, so it is impossible to measure the aperture size smaller than the through hole of the probe. The other method is contact measurement, so the actual measurement will touch the inner wall of the through hole. And caused a scratch. Furthermore, the instrumentation speed of the three-dimensional measuring bed is slow, and it is not possible to directly measure the through-holes in the processing: (4) Enlightenment method: the optical measurement is followed by the simulation to obtain the measurement result. Therefore, the measured result is presented in a simulated manner. It is not the actual situation in the through hole. How to change it is always As can be seen from the above description, various shortcomings of the micro through holes are currently difficult to overcome, which causes inconvenience on the raft. Therefore, the above-mentioned shortcomings are good, and the micro-perforation can be measured simply and correctly, and the technical field continues to strive for an important goal. SUMMARY OF THE INVENTION The purpose of the present invention is to make a simple through-hole measurement method. 201226849 Thus, the through hole measuring method of the present invention comprises a set up step, a calibration step, a measured step, and an analysis step. The erecting step is to respectively place a light source unit and an image receiving unit on opposite sides of a reference through hole. The calibration step is such that the g light source unit emits a light beam passing through the reference through hole, and when the divergent light beam passes through the reference through hole, part of the light is reflected by the inner wall surface of the reference through hole and then leaves the through hole. The light passes directly through the reference through-hole 'after', and the image receiving unit receives the light that is once reflected by the inner wall surface of the reference through-hole and then leaves the reference through-hole and the light that passes directly through the reference through-hole is generated at a plurality of predetermined positions. Interfere with the image. The measuring step is to replace the reference through hole with a through hole having the same penetration depth as the reference through hole, so that the light source unit emits a divergent beam through the through hole to be tested, and receives the image through the image receiving unit. The light that exits the through hole after the inner wall surface of the through hole is once reflected and the majority of the measured interference image generated by the light directly passing through the through hole at the predetermined position. In the analyzing step, the reference interference image of the reference interference image disk at each predetermined position is compared and calculated, and the amount of change of the inner wall surface of the through hole to be measured with respect to the inner wall surface of the reference through hole is obtained. The effect of the present invention is that the interference fringes formed by the mutual interference of the light beams and the measurement result of the reference through holes are used as a reference, and the change of the inner wall surface of the through hole to be measured with respect to the inner wall surface of the reference through hole can be calculated. the amount. Thereby, the state inside the through hole can be actually measured and the flatness of the inner wall surface to be tested can be quickly measured. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to FIG. 1 and FIG. 2, a preferred embodiment of the method for measuring the through-hole of the present invention includes a erection step 2, a calibration step 3, a _test step 4, and an analysis step 5, and can be contactlessly The measurement of the micro-perforation is particularly suitable for a micro-perforation with a pore diameter of 10 to 100/zm, but not limited thereto, and a depth to aperture ratio of not more than 10. First, the erection step 2 is performed, and a light source unit 21 and an image receiving unit 22 are respectively disposed on opposite sides of the reference through hole 23. Matching
閱圖3，在本較佳實施例中，該光源單元21包括一光源2H ，及一設於該光源211和該基準貫孔23之間的透鏡组八 212，該透鏡組合212是由一凹透鏡2121，及一環圍該凹= 鏡2121的楔形透鏡2122所構成。該影像接收單元22具有 -電荷耦合元件221、二依序設置於該電荷耦合元件221和 該基準貫孔23之間的聚光透鏡222、—電連接於該電荷輕 合元件221的影像掘取器223、一電連接於該影像拍員取写 如的數位影像處理系統224,以及一電連接於該數位影像 處理系統224的電腦225。 參閱圖！與® 2,接著進行該校準㈣3，令該光源單 元21發射—發散光束31通過該基準貫孔23，而使該發散 光束31通過該基準貫孔23時，部分光被該基準貫孔23内 壁面-次反射後離開該貫孔，部分光則直接通過該基準貫 孔23 ’之後’以該影像接收單元22接收被該基準貫孔^ 201226849 内壁面一次反射後離開該基準貫孔23的光，與直接通過該 基準貫孔23的光於多數預定位置32產生的多數基準干涉 影像33。在本較佳實施例中，該光源單元21發射成發散的 光束通過該基準貫孔23時，至少在該基準貫孔23内壁面 的相反兩邊緣分別產生一次反射後再離開該基準貫孔23。 特別說明的是，圖2中a點為相對於A點所形成的成 像，而b點則是相對於B點所形成的成像。在本較佳實施 例中，該影像接收單元22是擷取該基準貫孔23内壁面a、 B兩點的成像，當然該影像接收單元22也能在該基準貫孔 23内壁面A、B兩點之間預設更多的成像點，以擷取該基 準貫孔23不同位置處之成像，就能測量該基準貫孔23的 真直度。 丹疋灯战耳測步驟4，將一貫穿深度與該基準貫孔 相同的待測貫孔41取代該基準貫孔23,令該光源單元 發射成發散的光束通過該待測貫41，並以該影像接收 元22接收被該待測貫孔41内壁面一次反射後離開該貫 的光’與直接通過該待測貫孔41的光於所述預定位置 產生的多數實測干涉影像42。 最後進行該分析步驟5，將每一預定位置Μ的基準 涉影像33與實測干涉影像42進行比對與運算，也就是 、/土準貫孔23内壁面A、B兩點的成像與該待測貫 41内壁® IB兩點的成像相對應進行比對，進而能得 該待測貫1 4!内壁面相對該基準貫孔23内壁面的變化 。在本較佳實施例中’是先利用該電荷輕合元件221、 201226849 擷取器223、數仿髟你士 ^ ^ ^ 像處理系統224將所述基準干涉妒傻 33與實測干涉影傻4 艾景/像 條咬，接著… 影像後再處理還原出干涉 IS貫=腦225計算干涉條紋序數而得到該 内壁面相對該基準貫孔23内壁面的變化量。 綜上所述，本發明貫孔量測方法藉由光束相互干涉所 形成的干涉條紋，並㈣基準貫孔23的㈣結果作為基準 ，進而能計算出該待測貫孔41内壁面相對於該基準貫孔^Referring to FIG. 3, in the preferred embodiment, the light source unit 21 includes a light source 2H, and a lens group ar 212 disposed between the light source 211 and the reference through hole 23. The lens assembly 212 is formed by a concave lens. 2121, and a wedge lens 2122 surrounding the concave = mirror 2121. The image receiving unit 22 has a charge coupling element 221, a collecting lens 222 disposed between the charge coupling element 221 and the reference through hole 23, and an image capturing circuit electrically connected to the charge combining element 221. The device 223 is electrically coupled to the digital image processing system 224 of the image capture processor and to a computer 225 electrically coupled to the digital image processing system 224. See the picture! And the calibration, (4) 3, the light source unit 21 emits a diverging beam 31 through the reference through hole 23, and when the divergent beam 31 passes through the reference through hole 23, part of the light is received in the reference through hole 23. After the wall-sub-reflection exits the through-hole, a portion of the light passes directly through the reference through-hole 23' and then the image receiving unit 22 receives the light that is reflected by the inner wall surface of the reference through-hole 201226849 and exits the reference through-hole 23, A plurality of reference interference images 33 generated at a plurality of predetermined positions 32 with light passing directly through the reference through-holes 23. In the preferred embodiment, when the light source unit 21 emits a diverging light beam through the reference through-hole 23, at least the opposite edges of the inner wall surface of the reference through-hole 23 respectively generate a reflection and then leave the reference through-hole 23 . Specifically, point a in Fig. 2 is an image formed with respect to point A, and point b is an image formed with respect to point B. In the preferred embodiment, the image receiving unit 22 captures two points of the inner wall surfaces a and B of the reference through hole 23, and of course, the image receiving unit 22 can also be in the inner wall surface A and B of the reference through hole 23. More imaging points are preset between the two points to capture the imaging at different positions of the reference through-hole 23, and the straightness of the reference through-hole 23 can be measured. The tantalum lamp is used in the ear test step 4, and a through hole 41 having the same penetration depth as the reference through hole is replaced by the reference through hole 23, so that the light source unit emits a divergent beam through the to-be-tested 41, and The image receiving unit 22 receives a plurality of measured interference images 42 generated by the inner wall of the through-hole 41 to be reflected and then exits the light and the light directly passing through the through-hole 41 at the predetermined position. Finally, the analyzing step 5 is performed, and the reference image 33 of each predetermined position 比 is compared with the measured interference image 42 , that is, the imaging of the two walls A and B of the ground hole 23 and the waiting The imaging of the two points of the inner wall of the measuring wall IB is correspondingly compared, and the change of the inner wall surface of the inner wall to the inner side of the reference through hole 23 can be obtained. In the preferred embodiment, the first use of the charge and light component 221, the 201226849 extractor 223, the number of imitations ^ ^ ^ image processing system 224 to the reference interference silly 33 and the measured interference shadow silly 4 Ai Jing / like a bit bit, then... After the image is processed again, the interference is calculated. The brain 225 calculates the interference fringe number to obtain the amount of change of the inner wall surface with respect to the inner wall surface of the reference through hole 23 . In summary, the through hole measuring method of the present invention calculates the interference fringes formed by the mutual interference of the light beams, and (4) the result of the (4) of the reference through holes 23 as a reference, thereby calculating the inner wall surface of the through hole 41 to be measured relative to the reference. Through hole ^
内，面的變化量。藉此能實際量測貫孔内的狀態且快速地 测量出該待測貫孔41内壁面的真直度與表面粗链度，故確 實能達成本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一流程圖’說明本發明貫孔量測方法的較佳實 施例； 圖2是一示意圖，說明該較佳實施例；以及 圖3是一剖視圖，說明該較佳實施例中的透鏡組合。 201226849 【主要元件符號說明】 2 ···.· •…架設步驟 225 ... …電腦 21.... •…光源單元 23 …基準貫孔 211 ·· —光源 3…… …校準步驟 212 ·· —透鏡組合 31 ····· …發散光束 2121 ----凹透鏡 32..... …預定位置 2122 •…楔形透鏡 33 ••… …基準干涉影像 22···· •…影像接收單元 4…… …實測步驟 221 .. •…電荷耦合元件 41 ....· …待測貫孔 111.. •…聚光透鏡 42••… …實測干涉影像 223 ·· …·影像擷取器 5…… …分析步驟 224……數位影像處理系統 8Inside, the amount of change in the face. Thereby, the state in the through hole can be actually measured and the true straightness and the surface thickness of the inner wall surface of the through hole 41 to be measured can be quickly measured, so that the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart illustrating a preferred embodiment of a method for measuring a through hole of the present invention; FIG. 2 is a schematic view showing the preferred embodiment; and FIG. 3 is a cross-sectional view illustrating the comparison The lens combination in the preferred embodiment. 201226849 [Description of main component symbols] 2 ········Setup step 225 ...computer 21.... •...light source unit 23 ...reference through hole 211 ···light source 3... calibration step 212 · Lens combination 31 ····· ... diverging beam 2121 ---- concave lens 32.....predetermined position 2122 •...wedge lens 33 ••...reference interference image 22···· •...image reception Unit 4... ...measurement step 221 .. •. Charge-coupled element 41 ..... ...through hole 111 to be tested..... Condenser lens 42••...Measured interference image 223 ····Image capture 5... Analysis step 224... Digital image processing system 8