TW201221482A - Recycle and treatment method for waste produced by sawing and grinding silicon wafer and equipment thereof - Google Patents

Recycle and treatment method for waste produced by sawing and grinding silicon wafer and equipment thereof Download PDF

Info

Publication number
TW201221482A
TW201221482A TW99140939A TW99140939A TW201221482A TW 201221482 A TW201221482 A TW 201221482A TW 99140939 A TW99140939 A TW 99140939A TW 99140939 A TW99140939 A TW 99140939A TW 201221482 A TW201221482 A TW 201221482A
Authority
TW
Taiwan
Prior art keywords
liquid
water
waste
polyethylene glycol
recycling
Prior art date
Application number
TW99140939A
Other languages
Chinese (zh)
Other versions
TWI504573B (en
Inventor
Jr-Jung Iang
Original Assignee
Taiwan Water Recycle Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Water Recycle Technology Co Ltd filed Critical Taiwan Water Recycle Technology Co Ltd
Priority to TW099140939A priority Critical patent/TWI504573B/en
Publication of TW201221482A publication Critical patent/TW201221482A/en
Application granted granted Critical
Publication of TWI504573B publication Critical patent/TWI504573B/en

Links

Abstract

The present invention relates to a recycle and treatment method for waste produced by sawing and grinding silicon wafer, which includes: mixing water with dehydrated sludge cake to dilute a sludge cake as a working liquid; reacting the silicon in the sludge cake with water to produce silicon dioxide and hydrogen gas; pumping and recycling the hydrogen gas; using water to carry out specific gravity separation of silicon carbide and silicon particle for convenient classification and recycle; then carrying out solid-liquid separation to obtain solid state silicon dioxide and a liquid state water and polyethylene glycol (PEG); and finally separating water and polyethylene glycol (PEG). Therefore, this invention can recycle useful silicon particles, silicon carbide, silicon dioxide and PEG from the sludge cake to reduce total amount of waste and additionally produce hydrogen gas with commercial value to promote value added usage.

Description

201221482 六、發明說明: L發明所屬之技術領域】 本發明是有關於-種處理石夕晶圓廢棄物的方法與 裝置,且特別是有關於-種能增加產品附加價值,翁 有^也解決環境污染問題_晶圓切割研磨廢棄物的匕 回收處理方法及其設備。 【先前技術】201221482 VI. Description of the Invention: Technical Field to Which L Inventions </ RTI> The present invention relates to a method and apparatus for processing Shixia wafer waste, and in particular relates to the ability to increase the added value of products, and Weng has also solved Environmental pollution problems _ Wafer cutting and grinding waste 匕 recycling processing methods and equipment. [Prior Art]

造半導體晶片及太陽能板的產業中,將矽晶棒 切割成厚薄均-_晶圓U )已屬於鮮流程之一 環,其通常使用特殊的金屬線鑛( :輔_高硬度的碳化,(SlC=)=刀 再辅以混有聚乙二醇(PEG)、_ 7 ^ (PG)等__切削冷卻液,::,(=)屬=醇 :::運行::’就可配合碳化-為介質 1=:= =成切割作用,且切割同時,係將 聚乙一知為主成伤的切削液 面除了作為冷卻及潤滑用途者切^位喷出,一方 時所產生的嫩雜質帶出切割二-=可將切割 能順利且平穩的進行,以利進=:’·使::圓切割製程 在矽晶圓被切割、研磨 、貝製程 且使用過後的切難,會〜H對切割區所嘴出 屬、雜質與被磨耗的碳化/者切削時所產生的石夕粉碎 國内 [s] 而成為粒子濃度盥,不斯地排出切割區外,進 農度/、,蜀度極高的聚狀廢油泥,以往, 3 201221482 多數的石夕晶圓切割廠商對於這些廢油泥,只能以廢棄物 f式來處理’或是以重油進行焚將錢掩埋,但 是’仍需要支出高昂的費用請廢棄物業者處理,且廢油 „焚化方式處理,也會產生大量的二氧化碳,相 田不%、保,因此,對於發晶圓㈣研磨後所產生的廢油 泥,焚化或掩埋均非理想的處理方法。In the industry of manufacturing semiconductor wafers and solar panels, the strontium bar is cut into a thin film--wafer U. It is one of the fresh processes, and it usually uses a special metal wire ore (: auxiliary _ high hardness carbonization, (SlC =) = Knife is supplemented with polyethylene glycol (PEG), _ 7 ^ (PG), etc. __ cutting coolant, ::: (=) genus = alcohol::: run:: 'can be combined with carbonization - For the medium 1 =: = = into the cutting effect, and at the same time cutting, the cutting liquid surface which is the main damage of the polyethylene is the same as the cutting liquid level which is used for cooling and lubrication, and the tender impurity band generated at one side Cutting 2 -= can cut smoothly and smoothly, to make progress =: '· Make:: Circular cutting process is difficult to cut after the wafer is cut, ground, shelled and used. In the cutting area, the impurities and the carbonized material that is worn out are crushed in the domestic [s] and become the particle concentration 盥, which is discharged outside the cutting area, and the degree of inferiority, Extremely high poly-sludge sludge, in the past, 3 201221482 Most Shixi wafer-cutting manufacturers can only treat these waste sludges with waste f-type 'or It is buried by heavy oil and buried in the money, but 'there is still a high cost to be paid to the waste industry, and the waste oil „incineration treatment will also generate a large amount of carbon dioxide, and the phase is not guaranteed, so the wafer is issued. (4) The waste sludge produced after grinding, incineration or landfill is not an ideal treatment method.

目剛’國外業者已嘗試採用過瀘設備來回收廢油泥 ^刀削油料,其通常利㈣膜技術來進行固液分離, =此方式可㈣料嶋料油,財 這些污泥中仍含有可再利用^里的巧泥(據餅)’ 醇’但並沒有再予以回收處理厌:發、隸與聚乙二 又處理,而只視同廢華 ::造成嚴重的環保問題,且僅以固液分離方式來 =行膜過,並沒有獲得良好的前處理,使得: 孔極易污堵,減_操作週期降低,成本增力”、 此外,近年來在太陽能產業 原本作為耗材_已嚴產重=,之下,使謂 滑與冷卻用途銳二醇也;=昇連:讓編 &lt;下==基於成本與環保因素的考量 業者除了自廢油泥中回收成 ::::rr—粉: 污::::成:減少廢棄物的生成與總量,俾降_ 201221482 因此,如何在回收成本與環保之間達成平衡,至今 仍沒有一有效率且符合操作成本的處理方法,使得矽晶 圓切割業者在環保改善成本負荷上愈來愈高,故如何積 極藉由提高生產品質及污染防治技術來兼顧經濟與環 保,降低生產成本,提高產業競爭力,已成為目前相關 產業迫切努力之目標。 【發明内容】 • 本發明之目的,即在提供一種可減少廢棄物生成、 相對回收成本低,不僅能有效地解決環保問題,且可自 廢棄物中分離出可回收的再生油及碳化矽等副產品的 矽晶圓切割研磨廢棄物的回收處理方法。 本發明之次要目的,是在提供一種能降低膜堵塞, 以延長膜操作壽命,且能增加回收處理效率的矽晶圓切 割研磨廢棄物的回收處理設備。 $ 根據本發明所提出之一種矽晶圓切割研磨廢棄物 的回收處理方法,包含以下步驟: 步驟(A):將預先經過脫水後的一濾餅置入一處理 槽中,該濾餅是自晶圓切割研磨後所產生的漿狀廢油泥 進行壓濾後所生成,並且至少含有矽粉(Si)、碳化矽 (SiC)以及由聚乙二醇(PEG)為主所構成的殘留切削 液。 步驟(B):在該處理槽内加入一反應劑,使該濾餅 被混合稀釋成一工作液體,且可促使工作液體中的矽與[s] 5 201221482 該反應劑產生催化反應後,以生成固態的二氧化矽 (Si〇2)及氣態的氫氣(H)。 步驟(C):將處理槽内的氫氣抽引入一集氣槽内壓 縮儲置。 步驟(D):利用比重分離方式在已稀釋污泥濃度後 的工作液體之中,更進一步地分離出其内的矽及碳化 石夕,以便選別回收。 步驟(E):將選別出矽及碳化矽的工作液體,再利 • 用膜過濾方式進行固液分離,促使該工作液體能被分離 成固態的二氧化矽及液態的水、聚乙二醇等切削液。 步驟(F):將液態的水及聚乙二醇再經過逆滲透處 理後,而獲得可再利用的水以及以聚乙二醇為主成份的 回收切削液。 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的回收處理方法,其中,其中,在步驟(B)時,所加 $ 入的反應劑可為水。 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的回收處理方法,其中,在步驟(E)時,所使用的固 液分離是採用圓型平板UF膜來進行分離。 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的回收處理方法,其中,在步驟(F)之後,可將過逆 滲透回收後的水,再引回該處理槽中,供步驟(B)之 催化劑來使用。 依照上述本發明所提出之矽晶圓切割研磨廢棄物iS] 6 201221482 的回收處理方法,其中,在步驟(F)之後,液態的聚 乙二醇可再以蒸餾方式除去其殘留水份及廢油’以形成 可供再使用的再生油。 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的扨收處理方法’其中,在步驟(F)時’是以R〇或NF 膜來進行逆滲透處理。 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的回收處理方法’其中,在步驟(B)時,尚包含有在 φ 該處理槽内打入加壓氣體,以混合成該工作液體° 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的回收處理方法’其中,在步驟(D)之後’更具有將 選別後的矽及碳化矽經過乾燥處理,以便包裝回收。 依照上述本發明所提出之矽晶圓切割研磨廢棄物 的回收處理方法,其中,在步驟(E)時,是以負壓吸 力方式來抽取工作水體中的水及聚乙二醇。 Φ 因此’本發明先以水為主成份的催化劑來混合濾 餅,使濾餅被稀釋成工作液體,進而與矽粉產生催化作 用形成二氧化矽與氫氣,然後將氫氣抽引回收,接著, 再藉由水來進行比重分離,以選別碳化矽與剩餘的石夕 粒,繼之,再進行固液分離,使工作液體被分離成固態 的二氧化矽與液態的水及聚二乙醇,最後,再來進一步 分離出水及聚乙二醇,如此,使得原本回收製程中所產 出的廢泥渣,能再回收出有用的矽粒、碳化矽、二氧化 矽及聚乙二醇,以減少廢棄物總量,降低廢棄物以掩埋 L 〇 ] 7 201221482 方式的困擾,且更附帶產出具有商業價值的氫氣,使本 發明能提昇利用的附加價值’更達成節能減廢的目的。 【實施方式】 參照第1圖至第3圖,本發明矽晶圓切割研磨廢棄 物的回收處理方法的第一實施例,包含以下步驟: 步驟(A):將預先經過壓濾脫水處理後的一濾餅100 (Filter Cake)由一投料口 21〇置入一處理槽200中’ 而該處理槽200係呈密閉狀,該濾餅1〇〇是自晶圓切割 研磨後所產生的漿狀廢油泥(Wafer Cutting Waste)進 行初步的壓濾後所生成,並且至少含有矽粉(S〇、碳化 矽(SiC)及聚乙二醇(pEG)為主所構成的殘留切削液。 在本實施例中’漿狀廢油泥是採用板框式壓濾機 (plate-frame filter press,或稱污泥脫水機)來進行脫 水’利用壓濾機的濾布來截留廢油泥中大部份的固形 物,再經由高壓空氣之二次壓縮後形成泥渣狀的濾餅, 這種濾餅除了含有矽粉(Si)、碳化矽(SiC)及雜質之 外,仍殘留少量由聚乙二醇(PEG)為主所構成的切削油 醋,本發明即是針對濾餅1〇〇中的這些組成物來進行再 處理及回收包裝。 步驟(B):在該處理槽2〇〇内泵送入一反應劑,在 本實施例中’該反應劑較佳地是為含有水成份的液體’ 更進一步地,此液體中並帶有少量的微細氣泡,如此, 可使原本呈泥潰狀的濾餅1〇〇在被稀釋後,成為帶有氣iS] 8 201221482 泡與固形物的工作液體300,而前述的微細氣泡可以採 用文氏管原理,將液、氣預先混合後再打入該處理槽2〇〇 中’一方面可加速水體與濾餅1〇〇的攪伴以產生化學反 應’另一方面,可將濾餅1〇〇中質量較輕的殘餘聚乙二 醇等油質及雜質,藉著氣泡的浮力而托昇於液面上層, 以利於後續的分離。因此,在預定時間之後’工作液體 300中的反應劑與矽粉形成催化反應,並逐漸地生成固 態的二氧化矽(Si〇2,玻璃砂)及氣態的氫氣(H),其 化學反應式為:Mugang 'foreigners have tried to use the sputum equipment to recover the waste sludge ^ cutting oil, which usually uses the (four) membrane technology for solid-liquid separation, = this way can be (4) feed oil, the sludge still contains It can be reused in the skillful mud (according to the cake) 'alcohol' but it is not recycled. The hair, the ligament and the polyethylene are treated separately, but only the same as the waste:: causing serious environmental problems, and only The solid-liquid separation method is used to pass the film, and the pre-treatment is not obtained, so that: the hole is easily fouled, the _operation cycle is reduced, and the cost is increased. In addition, in the solar energy industry, it has been used as a consumable in recent years. Strict production weight =, under, so that the use of sliding and cooling use of sharp diol also; = lianlian: let the editor &lt; = = = based on cost and environmental factors considerations in addition to recycling from the waste sludge into :::: rr —Powder: Smudge::::成:Reducing the generation and total amount of waste, 俾201221482 Therefore, how to achieve a balance between recycling cost and environmental protection, there is still no efficient and consistent operation cost treatment method. This makes the wafer cutting industry more and more environmentally friendly to improve the cost load High, so how to actively improve the production quality and pollution prevention technology to balance economic and environmental protection, reduce production costs, and improve industrial competitiveness has become an urgent goal of the relevant industries. [Invention] The purpose of the present invention is In order to reduce the cost of waste generation and reduce the cost of recovery, it is not only effective in solving environmental problems, but also the recovery of waste wafer cutting and grinding wastes such as recyclable reclaimed oil and niobium carbide which can be separated from waste. The secondary object of the present invention is to provide a recycling processing apparatus for cutting wafer grinding waste which can reduce membrane clogging, prolong membrane operating life, and increase recycling efficiency. The method for recycling the waste wafer cutting abrasive waste comprises the following steps: Step (A): placing a pre-dehydrated filter cake into a treatment tank, the filter cake is cut from the wafer The resulting slurry waste sludge is produced by pressure filtration, and contains at least tantalum powder (Si), tantalum carbide (SiC), and A residual cutting fluid composed mainly of ethylene glycol (PEG). Step (B): adding a reactant in the treatment tank to mix and dilute the filter cake into a working liquid, and promote the enthalpy in the working liquid [s] 5 201221482 The reactant generates a catalytic reaction to form solid cerium oxide (Si〇2) and gaseous hydrogen (H). Step (C): pumping hydrogen from the treatment tank into a gas collection tank Internal compression storage. Step (D): Separation of the ruthenium and carbon carbide in the working liquid after the diluted sludge concentration by the specific gravity separation method for sorting and recycling. Step (E): The working liquid of the crucible and the niobium carbide will be selected, and the solid-liquid separation will be carried out by means of membrane filtration, so that the working liquid can be separated into solid ceria and liquid water, polyethylene glycol and the like. Step (F): The liquid water and the polyethylene glycol are subjected to reverse osmosis treatment to obtain reusable water and a recycled cutting fluid containing polyethylene glycol as a main component. According to the above method of the present invention, there is provided a process for the recovery of a silicon wafer cutting abrasive waste, wherein, in the step (B), the reactant added thereto may be water. According to the above method of the present invention, there is provided a process for recovering a waste cutting waste of a wafer, wherein in the step (E), the solid-liquid separation used is carried out by using a round flat UF film. According to the above method of the present invention, the method for recovering and processing the silicon wafer cutting and polishing waste, wherein, after the step (F), the water recovered by the reverse osmosis can be returned to the treatment tank for the step (B). ) The catalyst is used. According to the above-mentioned invention, the method for recycling the wafer-cutting and polishing waste iS] 6 201221482, wherein after the step (F), the liquid polyethylene glycol can be further removed by distillation to remove residual moisture and waste. Oil 'to form a regenerable oil for reuse. According to the above-described present invention, the method for the treatment of enthalpy wafer cutting and polishing waste is carried out, wherein, in the step (F), the reverse osmosis treatment is performed by R 〇 or NF film. According to the above-mentioned invention, the method for recovering and processing the wafer-cutting and polishing wastes, wherein, in the step (B), the pressurized gas is injected into the processing tank to mix into the working liquid. According to the above-mentioned invention, the method for recovering the waste cutting waste of the wafer is 'after, after the step (D), the selected tantalum and the tantalum carbide are subjected to a drying treatment for packaging recovery. According to the above method of the present invention, there is provided a method for recovering and processing a wafer-cutting abrasive waste, wherein, in the step (E), water and polyethylene glycol in the working water body are extracted by a vacuum suction method. Φ Therefore, the present invention first uses a water-based catalyst to mix the filter cake, so that the filter cake is diluted into a working liquid, thereby catalyzing the formation of cerium oxide and hydrogen with the cerium powder, and then withdrawing the hydrogen gas, and then, The specific gravity is separated by water to select the niobium carbide and the remaining Shiki particles, and then the solid-liquid separation is performed to separate the working liquid into solid ceria and liquid water and polydiethanol. Further separating the water and polyethylene glycol, so that the waste sludge produced in the original recycling process can be recycled with useful cerium particles, tantalum carbide, cerium oxide and polyethylene glycol to reduce The total amount of waste, the reduction of waste to bury L 〇] 7 201221482 mode, and more with the production of commercial value of hydrogen, so that the present invention can enhance the added value of utilization 'more energy saving and waste reduction purposes. [Embodiment] Referring to Figures 1 to 3, a first embodiment of a method for recycling a wafer-cutting abrasive waste according to the present invention comprises the following steps: Step (A): after dewatering and dehydration in advance A filter cake 100 is placed in a processing tank 200 by a feeding port 21, and the processing tank 200 is sealed. The filter cake 1 is a slurry produced after cutting and grinding from the wafer. Waste oil sludge (Wafer Cutting Waste) is produced by preliminary pressure filtration, and contains at least a residual cutting fluid composed of tantalum powder (S〇, tantalum carbide (SiC) and polyethylene glycol (pEG). In the example, 'pulp-like waste sludge is dewatered by a plate-frame filter press (or sludge dewatering machine). The filter cloth of the filter press is used to intercept most of the solids in the waste sludge. The material is further compressed by high pressure air to form a sludge-like filter cake. In addition to containing bismuth powder (Si), tantalum carbide (SiC) and impurities, the filter cake still has a small amount of polyethylene glycol ( PEG) is mainly composed of cutting oil vinegar, and the present invention is directed to filter cake 1〇 The components in the crucible are reprocessed and recycled. Step (B): pumping a reactant in the treatment tank 2, in the present embodiment, the reactant preferably contains water. The liquid of the component ' Further, this liquid has a small amount of fine bubbles, so that the filter cake 1 which is originally mud-like is diluted and becomes a gas with iS] 8 201221482 Bubble and solid The working liquid 300 of the object, and the aforementioned fine bubbles can adopt the venturi principle, and the liquid and the gas are pre-mixed and then injected into the processing tank 2', which can accelerate the stirring of the water body and the filter cake. In order to produce a chemical reaction, on the other hand, oil and impurities such as residual polyethylene glycol, which is light in weight in the filter cake, can be lifted to the liquid surface layer by the buoyancy of the bubble to facilitate subsequent separation. Therefore, after a predetermined time, the reactant in the working liquid 300 forms a catalytic reaction with the tantalum powder, and gradually forms solid cerium oxide (Si〇2, glass sand) and gaseous hydrogen (H), and the chemical reaction thereof The formula is:

Si + 2H2〇= Si〇2(固態)+ 2H2(氣態) 在本實施例中,該反應劑是由該處理槽200近底部 的一曝氣孔220泵入,此外,上述反應劑中所含有的液 體與氣泡量的比例,是以3 : 1為最佳,且工作液體300 的液面高度係略低於該投料口 210,以提供氫氣暫存空 間。 步驟(C):在預定時間之後,將處理槽200上層的 氫氣自一排氣口 230抽引入一集氣槽400内作壓縮儲 置’其產生的氫氣可以另外分裝出售,供產生熱源再利 用。 步驟(D):由於矽粒與碳化矽的比重皆高於水(矽 比重為2.3,碳化矽比重為3.2),因此,在氫氣(H)被 抽引出處理槽200後,便可以利用比重分離方式,在該 工作液體300之中更進一步地分離出殘留矽粒及碳化 201221482 矽,在本實施例中,依序沉降在該處理槽2〇〇底部的固 Z切及雜,可再由底料—落料Π 24G排出至一 桶250中,並經過乾燥處理後,以便各自選別 (Sorting)回收。 、,步驟(E) ·將選別出石夕粒及碳化石夕的工作液體別〇, 抽运至一過遽槽_内進行固液分離,在本實施例中, “心慮槽50G具有-伸縮管51(),該伸縮管510是自外 部延伸入該處理槽_内,且底端接設有-圓錐形的吸 ^ 冑52〇 :該吸嘴52〇可隨著工作液體_的液位高度進 行活動昇降’且該吸嘴52Q底端的開孔係設有細微網目 (圖未示)’用以將工作液體300⑽水、二氧化石夕及聚 乙二醇等液體抽送至該過渡槽内5〇〇。 #而且,該過濾槽50〇内設有半沉降式的一固液分離 單兀6GG ’該固液分離單元_較佳的是採用圓型平板 UF膜’清參第4圖所示’其整體結構是將複數個UF膜 φ 610串組於—呈水平且可樞轉的集液管620上,並在該 過;慮槽5GG外部以馬達⑽來帶動UF膜⑽以集液管 62(3為中心轉動’而另-側則利用-抽油泵640,來卿取 透過UF膜61〇且匯集到該集液管mo内的液體藉著抽 油系630的負壓吸力抽引之下,使工作液體300中呈液 遙的水 '聚乙二醇等切削液’便可以通過UF膜610的過 慮而被抽送出該過澹槽500外匯集,而固態的二氧化石夕 等細小雜質等固形物則被截留在過遽槽500 Θ,且隨著 減槽500内固形物粒子漢度的不斷提高,就可以將二r 201221482 氧化石夕及雜質經過_乾料理,以回收作為二級建材 再利則例如作為燒碑、建築隔間材料或步道用 地磚… …藉此f有的該工作液體3〇〇能被分離成固態的 -氧切及液_水、聚乙二醇等切削液。Si + 2H2 〇 = Si 〇 2 (solid state) + 2H 2 (gaseous state) In the present embodiment, the reactant is pumped from an aeration hole 220 near the bottom of the treatment tank 200, and further, the above reactant contains The ratio of the liquid to the amount of bubbles is preferably 3:1, and the liquid level of the working liquid 300 is slightly lower than the feed port 210 to provide a hydrogen storage space. Step (C): After a predetermined time, the hydrogen in the upper layer of the treatment tank 200 is pumped from a gas outlet 230 into a gas collection tank 400 for compression storage. The hydrogen gas produced may be separately distributed and sold for generating a heat source. use. Step (D): Since the specific gravity of the cerium particles and the cerium carbide is higher than that of water (the specific gravity is 2.3 and the specific gravity of the cerium carbide is 3.2), after the hydrogen (H) is extracted from the treatment tank 200, the specific gravity can be separated. In the embodiment, the residual granules and the carbonized 201221482 矽 are further separated in the working liquid 300. In the embodiment, the solid Z cuts and impurities at the bottom of the processing tank 2 are sequentially settled, and the bottom can be further The material-falling Π 24G is discharged into a bucket of 250 and dried for sorting and recovery. Step (E): The working fluids selected from the stone particles and the carbonized stone are sorted and pumped to the inner tank to perform solid-liquid separation. In the present embodiment, the "heart groove 50G has - expansion and contraction a tube 51 (), the extension tube 510 extends from the outside into the treatment tank _, and the bottom end is connected with a conical suction 胄 52 〇: the nozzle 52 〇 can follow the liquid level of the working liquid _ The height is raised and lowered and the opening at the bottom end of the nozzle 52Q is provided with a fine mesh (not shown) for pumping liquid such as working liquid 300 (10) water, dioxide dioxide and polyethylene glycol into the transition tank. 5〇〇. Moreover, a semi-settling type solid-liquid separation unit 6GG is provided in the filter tank 50〇. The solid-liquid separation unit _ preferably uses a round flat UF membrane. The overall structure is that a plurality of UF membranes φ 610 are grouped on a horizontal and pivotable collecting pipe 620, and the UF membrane (10) is driven by a motor (10) to collect liquid outside the tank 5GG. The tube 62 (3 is centered to rotate 'the other side uses the -pumping pump 640 to pick up the liquid that has passed through the UF film 61 and is collected into the collecting tube mo by pumping Under the vacuum suction of the system 630, the liquid 'polyethylene glycol and the like cutting fluid' which is liquid in the working liquid 300 can be pumped out of the over-tank 500 through the UF film 610. The solid matter such as solid sulfur dioxide and other fine impurities are trapped in the over-tank 500 Θ, and as the solidity of the solid particles in the reduced tank 500 is continuously increased, the second 201221482 oxidized stone and impurities can be After _ dry cooking, recycling as a secondary building material, such as as a burnt monument, building compartment material or paving floor tiles ... ... this work liquid 3 〇〇 can be separated into a solid - oxygen cut and liquid _ Water, polyethylene glycol and other cutting fluids.

在此步驟中為了延長UF膜的操作周期,每個现 膜610之間可掛置上—刮動元件㈣,該刮動元件650 可以在UF膜㈣旋轉時,對膜面形成自動刮泥的作用, 以防止膜表面積垢、堵塞,進崎低水液濾速。 步驟(F).將液_的水及聚乙二醇再經過一逆渗透 處理單元700的逆渗透處理,該逆滲透處理單元700可 採用 NF(Nan〇Filtrati〇n)膜或 R〇(Reverse〇sm〇sis) 膜來進行,本實施例是使用肋膜,利用R〇膜只允許水 分子透析過膜孔的特性,來進—步地分離出水及濃縮的 聚乙二醇,而獲得可回收再利用的水及以聚乙二醇為主 成份的油酯,其中,回收水可以一迴水管路71〇抽送到 步驟(B)的處理槽200内,以提供作為與矽粉的催化反 應劑使用,減少處理槽200所需要的用水量。 步驟(G)·前述的液態聚乙二醇可再以蒸餾方式除 去其殘留水份及廢油,而濃縮後的聚乙二醇則可以通過 濁度計的檢測後,以形成可供回收再利用的再生油,並 送至一儲油槽800,再生油可另行包裝後供晶圓切割研 磨製程使用。 因此,本發明先利用以水為主成份的催化劑來混合 經過壓濾脫水處理後的濾餅1〇〇 (廢泥渣),使濾餅10(^ s] 201221482 成:.?的二氧化鐵態的氣氣,然後將 乳乳抽引回收,接者,爯兹 別出工作液體300中的:分離’以選 採用UF膣砧n-门、 餘的石夕粒’繼之’再 離成固^帛 ^液分離’使工作液體300被分 以::!與液態的水及聚二乙醇,最後,再 膜來進-步分離水及聚乙In this step, in order to extend the operation period of the UF film, an upper-scraping element (4) may be hung between each of the film 610, and the scraping element 650 may form an automatic scraping of the film surface when the UF film (4) is rotated. The function is to prevent the surface area of the membrane from being fouled and blocked, and to enter the low water liquid filtration rate. Step (F). The liquid_water and the polyethylene glycol are further subjected to a reverse osmosis treatment of a reverse osmosis treatment unit 700, and the reverse osmosis treatment unit 700 may adopt a NF (Nan〇Filtrati〇n) membrane or R〇 (Reverse). 〇sm〇sis) The film is carried out. In this embodiment, the rib film is used, and the R 〇 film is used to allow only water molecules to dialyze through the pores of the film, thereby further separating water and concentrated polyethylene glycol to obtain recyclable The reused water and the oil ester containing polyethylene glycol as a main component, wherein the recovered water can be pumped into the treatment tank 200 of the step (B) in a return water line 71 to provide a catalytic reactant as the tantalum powder. Used to reduce the amount of water required to process the tank 200. Step (G) · The liquid polyethylene glycol mentioned above can be further removed by distillation to remove residual water and waste oil, and the concentrated polyethylene glycol can be detected by a turbidimeter to form a recyclable product. The used reclaimed oil is sent to an oil storage tank 800, and the reclaimed oil can be separately packaged for use in a wafer cutting and polishing process. Therefore, the present invention firstly uses a catalyst containing water as a main component to mix the filter cake 1 (waste sludge) after the pressure filtration dewatering treatment, so that the filter cake 10 (^ s) 201221482 becomes: State of the air, and then the milk is pumped back and recovered, pick up, do not take out the working liquid 300: Separate 'to choose UF anvil n-door, the rest of the stone granules' followed by 're-separation Solid ^ 帛 ^ liquid separation ' so that the working liquid 300 is divided into ::! with liquid water and polydiethanol, and finally, re-film to step-by-step separation of water and polyethylene

中所產出的廢泥渣,能再回收出有 =本 二氧切及聚乙二醇,以減少廢棄物總量,降 值的:\以掩埋方式的困擾,且更附帶產出具有商業價 減二二使發明能提昇利用的附加價值’更達成節能 如上所述,相較於以往晶圓_研摩廢棄物處理方 法的問題,本發明具有町功效及優點: 本發明將原本不能再處理的廢錢、餅100 (泥 ,)’先經過加水以摧化出氫氣,再以比重分離選粒出 碳化夕與H並藉由膜61與RG膜的設置,來進 了步分離工作液體_中的二氧切、水及聚乙二醇, 最後產出可供回收使用的氫氣、雜、碳化%、二氧化 夕水及聚乙二醇,使本發明能提昇回收利用的附加價 值,且處理後剩餘的淤渣等廢棄物量相當少,以 能減廢的目的。 X即 一、本發明在進行固液分離程序前,先以比重分離 方式選取出固態的碳化矽及矽粒,來降低工作液體3〇〇 201221482 中固形物的比例,能有效地延緩後續進行固液分離時, UF膜610的積垢堵塞與工作液體3〇〇的濃度極化現象, 膜的使用周期奇命得以延長,降低作成本。 二、此外,固液分離所採用的圓型平板UF膜βίο, 利用骐轉動時同步被刮動的效果,可以大幅降低膜面結 垢與濾餅的生成,故能提高整體回收處理的效率,並延 長膜的操作壽命性,使本發明能兼顧回收效率與成本。 惟以上所述者,僅為本發明之一個實施例而已,當 不能以此限定本發明實施之範圍,即大凡依本發明申; 專利範圍及發明說明内容所作之簡單的等效變化與^ 飾’皆應仍屬本發明專利涵蓋之範圍内。 ^ 【圖式簡單說明】 第1圖係為一方塊流程圖,說明本發明矽晶圓切割 研磨廢棄物的回收處理方法的處理流程。 σΙThe waste sludge produced in the process can be recycled with = dioxotomy and polyethylene glycol to reduce the total amount of waste, the value of the reduction: \ buried by the way, and more with the output of commercial The price is reduced by two or two, so that the invention can enhance the added value of utilization. More energy-saving is achieved. As described above, the present invention has the advantages and advantages of the present invention compared with the conventional wafer-research waste disposal method: The present invention can not be processed any more. The waste money, cake 100 (mud,) 'first added water to destroy hydrogen, and then separated by gravity separation and carbonization and H and by the setting of membrane 61 and RG membrane, to separate the working fluid_ Dioxocut, water and polyethylene glycol, and finally produce hydrogen, miscellaneous, carbonic, cerium dioxide and polyethylene glycol for recycling, so that the present invention can increase the added value of recycling, and The amount of waste such as sludge remaining after the treatment is relatively small, so as to reduce waste. X. First, the present invention selects solid carbonized niobium and tantalum particles by gravity separation method before the solid-liquid separation process to reduce the proportion of solid matter in the working liquid 3〇〇201221482, which can effectively delay the subsequent solidification. When the liquid is separated, the fouling of the UF film 610 and the concentration polarization of the working liquid 3,, the life cycle of the film is prolonged, and the cost is lowered. 2. In addition, the round flat UF film βίο used for solid-liquid separation can greatly reduce the fouling of the membrane surface and the formation of the filter cake by utilizing the effect of synchronously being scraped when the crucible is rotated, so that the efficiency of the overall recycling treatment can be improved. And prolonging the operational life of the membrane, the invention can balance the recovery efficiency and cost. However, the above is only one embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and the decoration of the patent scope and the description of the invention are not limited thereto. 'All should remain within the scope of this patent. ^ [Simple Description of the Drawings] Fig. 1 is a block diagram showing the processing flow of the recycling processing method of the wafer cutting and polishing waste of the present invention. ΙΙ

第2圖係為一系統結構圖,說明本發明處理 回收系統整體配讀形。 〜餅的 第3圖係為-局部剖視圖,說明本發明的 部結構。 Λ &quot;円 第4圖係為一局部剖視圖,說明本發明的圓型 UF膜過滤裝置的剖面結構。 【主要元件符號說明】 100 濾餅 S] 13 201221482 210 投料口 220 曝氣孔 230 排氣口 240 落料口 250 碑料桶 300 工作液體 400 集氣槽 500 過濾槽 510 伸縮管 520 吸嘴 600 固液分離單元 610 UF膜 620 集液管 630 馬達 640 抽油泵 650 到動元件 700 逆滲透處理單元 710 迴水管路 800 儲油槽 [si 14Figure 2 is a system block diagram showing the overall read configuration of the process recovery system of the present invention. Fig. 3 is a partial cross-sectional view showing the structure of the present invention.円 &quot;円 Fig. 4 is a partial cross-sectional view showing the cross-sectional structure of the circular UF membrane filtration device of the present invention. [Main component symbol description] 100 filter cake S] 13 201221482 210 Feed port 220 Aeration hole 230 Exhaust port 240 Drop port 250 Stele barrel 300 Working liquid 400 Gas collecting tank 500 Filter tank 510 Telescopic tube 520 Nozzle 600 Solid Liquid separation unit 610 UF membrane 620 collection tube 630 motor 640 oil pump 650 to moving element 700 reverse osmosis treatment unit 710 return water line 800 oil storage tank [si 14

Claims (1)

201221482 七、申請專利範圍: 1 . 一種石夕晶圓切割研磨廢棄物的回收處理方法,包含 以下步驟: 步驟(A):將預先經過脫水後的一濾餅置入一處 理槽中,該濾餅是自矽晶圓切割研磨後所產生的漿狀 廢油泥進行壓濾後所生成,並且至少含有矽粉(Si)、 碳化矽(SiC)以及由聚乙二醇(PEG)為主所構成的 殘留切削液; • 步驟(B):在該處理槽内加入一反應劑,使該濾 餅被混合稀釋成一工作液體,且可促使工作液體中的 矽與該反應劑產生催化反應後,以生成固態的二氧化 矽(Si〇2)及氣態的氫氣(H); 步驟(C):將處理槽内的氫氣抽引入一集氣槽内 壓縮儲置; 步驟(D):利用比重分離方式在已稀釋污泥濃度 $ 後的工作液體之中,更進一步地分離出其内的矽及碳 化矽,以便選別回收; 步驟(E):將選別出矽及碳化矽的工作液體,再 利用膜過濾方式進行固液分離,促使該工作液體能被 分離成固態的二氧化矽及液態的水、聚乙二醇;以及 步驟(F):將液態的水及聚乙二醇再經過逆滲透 處理後,而獲得可再利用的水以及以聚乙二醇為主成 份的回收切削液。 2 .如申請專利範圍第1項所述之矽晶圓切割研磨廢棄^ si 15 201221482 物的回收處理方法,其中,在步驟(B)時,所加入 的反應劑可為水。 3 .如申請專利範圍第1項所述之矽晶圓切割研磨廢棄 物的回收處理方法,其中,在步驟(E)時,所使用 的固液分離是採用圓型平板UF膜來進行分離。 4 .如申請專利範圍第1項所述之石夕晶圓切割研磨廢棄 物的回收處理方法,其中,在步驟(F)之後,可將 經過逆滲透回收後的水,再引回該處理槽中,供步驟 鲁 (B)之催化劑來使用。 5.如申請專利範圍第1項所述之矽晶圓切割廢棄物的 回收處理方法,其中,在步驟(F)之後,液態的聚 乙二醇可再以蒸餾方式除去其殘留水份及廢油,以形 成可供再使用的再生油。 6 .如申請專利範圍第1項所述之石夕晶圓切割研磨廢棄 物的回收處理方法,其中,在步驟(F)時,是以R0 $ 或NF膜來進行逆滲透處理。 7 .如申請專利範圍第1項所述之石夕晶圓切割研磨廢棄 物的回收處理方法,其中,在步驟(B)時,尚包含 有在該處理槽内打入加壓氣體,以混合成該工作液 體。 8.第如申請專利範圍第1項所述之矽晶圓切割研磨廢 棄物的回收處理方法,其中,在步驟(D)之後,更 具有將選別後的矽及碳化矽經過乾燥處理,以便包裝 回收。 [s ] 16 201221482 9 .如申請專利範圍第1項所述之矽晶圓切割研磨廢棄 物的回收處理方法,其中,在步驟(E)時,是以負 壓吸力來抽取工作水體中的水及聚乙二醇。 1 0 . —種矽晶圓切割研磨廢棄物的回收處理設備,包 含: 一處理槽,為密閉式的容器,用以容置廢棄濾 餅及水液混後的工作液體,具有一高於液面高度的投 料口、一用以抽引氫氣的投料口,以及一鄰近底部的 氣液泵送口; 一集氣槽,用來回收產生於該處理槽内的氫氣; 一過濾槽,具有一伸縮管,該伸縮管是自外部延 伸入該處理槽内,其底端具有一活動吸嘴,用以將工 作液體内的水、二氧化矽及聚乙二醇等液體抽送至該 過濾槽内; 一固液分離單元,為圓型平板UF膜組並設置在 該過濾槽内,具有複數個UF膜、組串有前述UF膜且 呈水平可樞轉的一集液管,一位於該過濾槽外部用以 帶動UF膜以集液管為中心轉動的馬達,以及一用來 唧取透過UF膜且匯集到該集液管内液體的抽油泵; 以及 一逆滲透過遽單元,接設在該抽油泵的出水端, 用以進一步地分離出水及濃縮的聚乙二醇,而獲得可 回收再利用的水及以聚乙二醇為主成份的再生油,該 逆滲透過遽裝置具有一迴水管路,使回收的水可藉著 17 201221482 該迴水管路抽引回該處理槽内。 /&quot;V、圖式. 如次頁201221482 VII. Patent application scope: 1. A method for recycling and processing Shishi wafer cutting and grinding waste, comprising the following steps: Step (A): placing a pre-dehydrated filter cake into a treatment tank, the filter The cake is produced by pressure filtration of the slurry waste sludge produced after cutting and grinding, and contains at least tantalum powder (Si), tantalum carbide (SiC) and polyethylene glycol (PEG). Residual cutting fluid; • Step (B): adding a reactant to the treatment tank to dilute and dilute the filter cake into a working liquid, and to promote the catalytic reaction between the hydrazine in the working liquid and the reactant Forming solid cerium oxide (Si〇2) and gaseous hydrogen (H); Step (C): introducing hydrogen in the treatment tank into a gas collection tank for compression storage; Step (D): using specific gravity separation method In the working liquid after the diluted sludge concentration of $, the ruthenium and niobium carbide in the separation liquid are further separated for sorting and recycling; Step (E): the working liquid of the niobium and tantalum carbide is selected, and the membrane is reused. Filtration method for solid-liquid Separating, the working liquid can be separated into solid cerium oxide and liquid water, polyethylene glycol; and step (F): liquid water and polyethylene glycol are subjected to reverse osmosis treatment to obtain Recycled water and recycled cutting fluid containing polyethylene glycol as the main component. 2. The method for recycling a wafer cutting and polishing waste according to the first aspect of the patent application, wherein the reactant added may be water at the step (B). 3. The method for recycling a wafer-cutting abrasive waste according to the first aspect of the invention, wherein in the step (E), the solid-liquid separation used is a round-plate UF membrane for separation. 4. The method for recycling and processing the Shiyue wafer cutting and grinding waste according to the first aspect of the patent application, wherein after the step (F), the water recovered by the reverse osmosis can be returned to the treatment tank. In order to use the catalyst of step (B). 5. The method for recovering and processing wafer cutting waste according to claim 1, wherein after the step (F), the liquid polyethylene glycol can be further removed by distillation to remove residual water and waste. Oil to form a reclaimed oil that can be reused. 6. The method for recovering waste of a silicon wafer cutting abrasive according to claim 1, wherein in the step (F), the reverse osmosis treatment is performed by a R0 $ or NF membrane. 7. The method for recycling and processing the Shiyue wafer cutting abrasive waste according to the first aspect of the patent application, wherein, in the step (B), the pressurized gas is injected into the treatment tank to mix Into the working fluid. 8. The method for recycling a silicon wafer cutting and grinding waste according to the first aspect of the patent application, wherein after the step (D), the selected tantalum and tantalum carbide are dried to be packaged. Recycling. [s] 16 201221482 9. The method for recycling and processing a wafer-cutting abrasive waste according to the first aspect of the patent application, wherein, in the step (E), the water in the working water body is extracted by vacuum suction. And polyethylene glycol. 1 0. —Recycling equipment for cutting and polishing wastes, comprising: a treatment tank, which is a closed container for accommodating waste filter cake and working liquid mixed with water and liquid, having a higher than liquid a feeding opening of a surface height, a feeding port for drawing hydrogen gas, and a gas liquid pumping port adjacent to the bottom; a gas collecting groove for recovering hydrogen gas generated in the processing tank; a filter tank having a a telescopic tube extending from the outside into the treatment tank, the bottom end of which has a movable nozzle for pumping liquid, such as water, cerium oxide and polyethylene glycol, into the filter tank a solid-liquid separation unit, which is a circular flat UF membrane group and disposed in the filter tank, has a plurality of UF membranes, a cluster of the UF membrane and a horizontally pivotable liquid collection tube, one of which is located in the filtration a motor for driving the UF film to rotate around the liquid collecting tube, and a pump for picking up the liquid that is transmitted through the UF film and collected into the liquid collecting pipe; and a reverse osmosis flow unit connected thereto The outlet end of the oil pump for further use Separating water and concentrated polyethylene glycol to obtain recyclable water and regenerated oil mainly composed of polyethylene glycol, the reverse osmosis device has a water return pipe, so that the recovered water can be used 17 201221482 The return line is drawn back into the treatment tank. /&quot;V, schema. If the next page
TW099140939A 2010-11-26 2010-11-26 Method and apparatus for recycling and processing of silicon wafer cutting and grinding waste TWI504573B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099140939A TWI504573B (en) 2010-11-26 2010-11-26 Method and apparatus for recycling and processing of silicon wafer cutting and grinding waste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099140939A TWI504573B (en) 2010-11-26 2010-11-26 Method and apparatus for recycling and processing of silicon wafer cutting and grinding waste

Publications (2)

Publication Number Publication Date
TW201221482A true TW201221482A (en) 2012-06-01
TWI504573B TWI504573B (en) 2015-10-21

Family

ID=46724939

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099140939A TWI504573B (en) 2010-11-26 2010-11-26 Method and apparatus for recycling and processing of silicon wafer cutting and grinding waste

Country Status (1)

Country Link
TW (1) TWI504573B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727902B (en) * 2020-10-20 2021-05-11 凱爾迪科技股份有限公司 Gas-liquid separation and stratification independent recovery device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201000399A (en) * 2008-06-30 2010-01-01 Danen Technology Corp Method for recycling silicon materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI727902B (en) * 2020-10-20 2021-05-11 凱爾迪科技股份有限公司 Gas-liquid separation and stratification independent recovery device

Also Published As

Publication number Publication date
TWI504573B (en) 2015-10-21

Similar Documents

Publication Publication Date Title
US8734751B2 (en) Method and apparatus for recycling and treating wastes of silicon wafer cutting and polishing processes
CN101475194B (en) Method for recycling ammonia from low concentration ammonium chloride wastewater
KR101705494B1 (en) Method for separating oil using the device for separating oil from food waste with high recovery rate and high quality and method for washing the same
CN203664353U (en) Compound polluted soil treatment equipment
CN101363311A (en) Technological process for comprehensive treatment for waste drilling fluid following drill for oil-gas field
CN106968629B (en) Whole-well section drilling cuttings and waste drilling fluid non-falling treatment equipment
CN101921050A (en) Device and method for dewatering and drying mud under water
CN102009064B (en) Process and system for recovering and removing residual solvent from soil
CN203484403U (en) Kitchen garbage disposal equipment
CN102659261A (en) Oily wastewater and sludge resource treatment integrated skid-mounted device
KR101705493B1 (en) Device for separating oil from food waste with high recovery rate and high quality
CN102746934B (en) Method for recovering water-soluble cutting fluid from silicon wafer cutting fluid
CN211035588U (en) Shield mud dewatering device
CN201793456U (en) Oily sewage treatment system
CN101468857B (en) Sewage treatment method for fluorite concentration plant
CN102115285A (en) Dimethyl formamide (DMF) waste water purifying process
CN102390832A (en) Method for treating waste silicon powder produced in trichlorosilane synthesis process
CN113480116A (en) Dredged sediment solidification modification drying method
CN202430073U (en) Wastewater and waste slurry classification treatment and cyclic utilization system for drilling well site
CN210875709U (en) Carbide slag edulcoration processing system
TW201221482A (en) Recycle and treatment method for waste produced by sawing and grinding silicon wafer and equipment thereof
CN202658028U (en) Integral prying device for treating oily sewage and sludge resources
EP2664579A1 (en) Method and apparatus for recycling and treating wastes of silicon wafer cutting and polishing processes
CN105016536B (en) High saliferous fracturing outlet liquid and gas water recycle processing system and technique
CN102952621B (en) Silicon wafer cutting and grinding waste recovery processing method and equipment thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees