201220557 六、發明說明： 特別是一種發光二極體的封 【發明所屬之技術領威】 [0001]本發明涉及一種対裝結構 裝結構。 【先前技術】 [0002] 相比於傳統的發光源，發光二極體（Light Emitting Diode，LED)具有重量輕、體積小、污染低、壽命長等 優點，其作為一種新型的發光源，已經被越來越多地應 用到各領域當中，如路燈、交通燈、信號燈、射燈及裝 飾燈等等。 [0 03]常見的發光一極體封裝結構麻常包括絕緣基板、設置在 絕緣基板上的電拓 上、發光二極體晶片、以及封裝層。然 而，習知技術中， 絶緣基板、封裝層以及電極通常採用 不同材質製成，以# 絕緣基板與封裝層、電極之間的接 合力欠佳，從而估1 尺伸發光二極體封裝結構的可靠度降低 ，直接影響到發也_ 〇 元二接體裝置的使用壽命。 【發明内容】 [0004]201220557 VI. Description of the Invention: In particular, the sealing of a light-emitting diode [Technology of the Invention] [0001] The present invention relates to an armored structure. [Previous Technology] [0002] Compared with the conventional light source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution, long life, and the like, and has been used as a new type of light source. It is increasingly used in various fields, such as street lights, traffic lights, signal lights, spot lights and decorative lights. [0103] A common light-emitting diode package structure often includes an insulating substrate, an electrical extension disposed on the insulating substrate, a light-emitting diode wafer, and an encapsulation layer. However, in the prior art, the insulating substrate, the encapsulating layer and the electrodes are usually made of different materials, and the bonding force between the insulating substrate and the encapsulating layer and the electrode is not good, thereby estimating the 1 ft. of the LED package structure. The reliability is reduced, which directly affects the service life of the hair unit. SUMMARY OF THE INVENTION [0004]
有鑒於此，有必I 戈和供一種具有較佳可靠度的發光二極 體封裝結構。 [0005] 一種發光二極 艰封裝結構，包括基板、設置在基板上的 電極及發光二極體日 二極體封裝結構還所述電極設有配合部，該發光 合部與所述電極的二:丨腳’該引腳設有卡合部’該卡 σ °卩相互卡持。 剛本發明發光二極體 I、、。構的電極的配合部與引腳的卡 099138278 表單編號Α0101 苐 頁/共17 頁 0992066691-0 201220557 合部相互卡持，使得封裝元件不易脫落，從而該發光二 極體具有較佳可靠度。 【實施方式】 [0007] [0008] [0009] [0010] 下面將結合附圖對本發明實施例作進一步的詳細說明。 請參閱圖1，本發明第一實施例提供的發光二極體封裝結 構10包括絕緣基板u、第一電極12、第二電極13、發光 二極體晶片14以及封裝層15。 該基板11的形狀可根據特定的需求而相應調整，如矩形 或圓形等。該基板丨丨利用絕緣材料製成，如陶瓷或塑膠 複合材料等。該基板11具有一第一表面1:1:1及與第一表面 111相對的第二表面112。該m板11設有二荛排相隔的容 置槽119，每一容置槽119包括一設置在第一表面ηι的 第一凹槽114、及設置在第二表面112的第二凹槽jig。 5亥第_凹槽115與第一凹槽114連通且第二凹槽115的橫 向寬度比第一凹槽114的橫向寬度大。 該第一電極12包括設置在所述基板11的第一表面U1的承 載部121、自承載部121底面延伸的嵌入部122、及連接 嵌入部122的端部123。該嵌入部122收容於基板11的第 一凹槽114中，該端部123收容於第二凹槽115中。該端 部123的橫向寬度大於嵌入部122的橫向寬度以將第—電 極12與基板11固定。所述承載部121遠離第二電極13的 側部包括一配合部，該配合部在本實施例中設有一固定 槽125 ’該固定槽125的截面内寬外窄呈圓弧狀。所述承 載部1 21於固定槽1 2 5内侧設有一切口 1 2 6。 099138278 表單編號A0101 第4頁/共17頁 0992066691-0 201220557 [0011] [0012] [0013] Ο [0014] 〇 [0015] 所述第二電極13的結構與第—電極12基本相同，包括一 承載部131、嵌入部132、及端部133，所述承載部131遠 離第一電極12的侧部設有固定槽i35及切口 136。不同之 處為承載部131比第一電極12的承載部121寬以放置所述 發光二極體晶片14。 *玄發光二極體晶片14通過二金屬線140分別與第一電極12 、第二電極13電連接。 6玄封裝層15設置在基板π的第一表面11^上，一併覆蓋發 光二極體晶片14、金屬線14〇、以及第一電極12、第二電 極13。該封裝層15採用透光材料製成，該封裝層15的内 部還可以包含光波長轉換材料，以改善發光二極體晶片 14發出光的光學特性。當然，該封裝層15的上表面也可 塗覆一層光波長轉換材料（圖未示），以起到改變光學 特性的效果。該封裝層15覆蓋延伸至第一電極12、第二 電極13的固定槽125、135中。 由於封裝層15延伸至第一電極12、第士電極13的固定槽 125、135中’封裝層15深入固定槽125、135的部分對封 裝層15起到卡持作用，使得封裝層15不易脫落，從而加 強了封裝層15與第一電極12、第二電極13之間的連接強 度。 請參閱圖2至圖4，為本發明第二實施例的發光二極體封 裝結構20 ’該發光二極體封裝結構2〇包括絕緣基板21、 第一電極22、第二電極23、發光二極體晶片24及封裝層 25。與第一實施例的發光二極體封裝結構2〇不同之處在 099138278 表單編號A0101 第5頁/共17頁 0992066691-0 201220557 第二實施例的發光二極體封裝結構還包括二分別與 第—電極22、第二電極23卡扣的引腳26。所述封裝層25 包覆所述發光二極體晶片24、基板21中部及第一電極22 '第二電極23相靠近的端部，從而留出第一電極22、第 二電極23的外側端部以供引腳26卡合。 [0016] [0017] [0018] 099138278 所述第一電極22與第一實施例的第一電極12相同，端部 一側為設有一固定槽225的配合部，該固定槽225的截面 呈圓弧狀，固定槽125内側設有一切口 226。 所述引腳26由導電材料製成，如銅材料。每一引腳26包 括一本部261、自本部261底部向下並向一側彎折延伸的 基部262、自本部261另一側延伸的卡合部263。該卡合 部263的截面與呈第一電極2 2的固定槽22 5的截面對應呈 圓弧狀。如圖3所示，當引腳26組裝至第一電極22時，引 腳26水準擠壓第一電極22，其中卡合部263嵌入第一電極 22的固定槽225。當引腳26嵌入時，由於第一電極22設 置在固定槽125的切口 226的作用，固定槽125的開口適 當地變形擴大，容置引腳26的卡合部263後恢復原狀，以 將引腳26與第一電極22固定。引腳26的本部261的底面 與基板21的頂面接合、引腳26的基部262與基板21的侧 面接合’從而增加引腳26、第一電極22、及基板21的密 合度。同理’另一引腳26卡合在第二電極23的一侧。 由於引腳26分別與第一電極22、第二電極23卡持，並與 第一電極22、第二電極23將基板21夾設固定，從而加強 了基板21與第一電極22、第二電極23之間的連接強度。 當發光二極體封裝結構20工作時，所述發光二極體晶片 表單編號A0101 第6頁/共17頁 0992066691-0 201220557 24通過金屬線240、第一電極22、 弟一電極23與引腳26 ㈣^電邮亦可起到散熱的 作用。 [0019] 可以理解地，第一電極2 2的配合部命 口砕與引腳26的卡合部263 的結構可以相互置換’即第—電極 电極22的配合部可以設置 成一凸出部，而引腳26上可以設置 u槽以對應收容第一 電極22的配合部。第二電極23的配八 σ °卩同理可以設置成 凸出部。 〇 [0020] 如圖5所示，為本發明第三實施例的發光二極體封裝結構 3。’與第二實施例的發光二極體封裝結制的不同之處 在於該發光二極體難結獅的Μ各包括至少二引腳 36，從而實現多引腳式固定。其中_ 丹甲一引腳36置於第一電 極32遠離發光二極體晶片34的同— u 側，另外二引腳36置 於第二電極33遠離發光二極體晶片34的同_側。 [0021] 〇 如圖6所示，為本發明第四實施例的發光二極體封裝結構 40，與第三實施例的發光二_封仙構如的不同之處 在於該發光：極體封裝結構4__丨腳46置於第一電極 42的相對兩側，另外二引腳46置於第二電極伽相對兩 侧。可以理解地，所述第一電極42、第二電極43沒有設 置引腳的外财可以設置固定槽，以與封裝層45配合固 定，以增加封裝層45與第一電極42、第二電極43的連接 強度。 [0022] 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 099138278 表單編號A0101 第7頁/共Π頁 0992066691-0 201220557 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0023] 圖1為本發明第一實施例的發光二極體封裝結構的剖面示 意圖。 [0024] 圖2為本發明第二實施例的發光二極體封裝結構的剖面示 意圖。 [0025] 圖3為圖2所示的發光二極體封裝結構的引腳與電極的組 裝過程示意圖。 [0026] 圖4為圖2所示的發光二極體封裝結構的俯視示意圖。 [0027] 圖5為本發明第三實施例的發光二極體封裝結構的俯視示 意圖。 [0028] 圖6為本發明第四實施例的發光二極體封裝結構的俯視示 意圖。 【主要元件符號說明】 [0029] 發光二極體封裝結構：10、20、30、40 [0030] 基板：11、21 [0031] 第一表面：111 [0032] 第二表面：112 [0033] 第一凹槽：1 1 4 [0034] 第二凹槽：115 [0035] 容置槽：119 099138278 表單編號A01O1 第8頁/共17頁 0992066691-0 201220557 [0036] [0037] [0038] [0039] [0040] [0041] [0042] Ο [0043] [0044] [0045] [0046] [0047] [0048] Ο [0049] 第一電極：12、22、32、42 承載部：121、131 嵌入部：122、132 端部：123、133 固定槽：125、135、225 切口 ： 126、136、226 第二電極：13、23、33、43 發光二極體晶片：14、24、34 金屬線：140、240 封裝層：15、25 引腳·· 26、36 本部：261 基部：262 卡合部：263 099138278 表單編號Α0101 第9頁/共17頁 0992066691-0In view of this, there is a need for a light-emitting diode package structure with better reliability. [0005] A light-emitting diode package structure comprising a substrate, an electrode disposed on the substrate, and a light-emitting diode package structure, wherein the electrode is provided with a matching portion, and the light-emitting portion and the electrode are : 丨 ' 'This pin has a snap part 'The card σ ° 卩 卩 卩. Just as the light-emitting diode of the present invention I, . The engaging portion of the electrode and the card of the pin 099138278 Form No. Α0101 苐 Page/Total 17 Page 0992066691-0 201220557 The joints are clamped to each other, so that the package components are not easily detached, so that the illuminating diode has better reliability. [Embodiment] [0007] [0010] [0010] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Referring to FIG. 1, a light emitting diode package structure 10 according to a first embodiment of the present invention includes an insulating substrate u, a first electrode 12, a second electrode 13, a light emitting diode wafer 14, and an encapsulation layer 15. The shape of the substrate 11 can be adjusted according to specific needs, such as a rectangle or a circle. The substrate is made of an insulating material such as a ceramic or plastic composite material. The substrate 11 has a first surface 1:1:1 and a second surface 112 opposite the first surface 111. The m board 11 is provided with two accommodating receiving slots 119, each accommodating slot 119 includes a first recess 114 disposed on the first surface η, and a second recess jig disposed on the second surface 112. . The fifth recess_groove 115 is in communication with the first recess 114 and the lateral width of the second recess 115 is larger than the lateral width of the first recess 114. The first electrode 12 includes a carrier portion 121 provided on the first surface U1 of the substrate 11, an embedded portion 122 extending from the bottom surface of the carrier portion 121, and an end portion 123 connecting the embedded portion 122. The embedding portion 122 is received in the first recess 114 of the substrate 11, and the end portion 123 is received in the second recess 115. The lateral width of the end portion 123 is larger than the lateral width of the embedded portion 122 to fix the first electrode 12 to the substrate 11. The side portion of the receiving portion 121 away from the second electrode 13 includes a mating portion. In the present embodiment, the engaging portion is provided with a fixing groove 125'. The fixing groove 125 has a narrow outer circumference and a narrow arc shape. The carrier portion 21 is provided with a slit 1 2 6 inside the fixing groove 1 2 5 . 099138278 Form No. A0101 Page 4 / Total 17 Page 0992066691-0 201220557 [0011] [0013] [0015] The structure of the second electrode 13 is substantially the same as that of the first electrode 12, including a The carrying portion 131, the fitting portion 132, and the end portion 133 are provided with a fixing groove i35 and a slit 136 at a side portion of the carrying portion 131 away from the first electrode 12. The difference is that the carrying portion 131 is wider than the carrying portion 121 of the first electrode 12 to place the light emitting diode wafer 14. The sinusoidal diode chip 14 is electrically connected to the first electrode 12 and the second electrode 13 via the two metal wires 140, respectively. The 6-layer encapsulation layer 15 is disposed on the first surface 11 of the substrate π, and covers the light-emitting diode wafer 14, the metal line 14A, and the first electrode 12 and the second electrode 13. The encapsulating layer 15 is made of a light transmissive material, and the inside of the encapsulating layer 15 may further comprise a light wavelength converting material to improve the optical characteristics of the light emitted by the LED wafer 14. Of course, the upper surface of the encapsulation layer 15 may also be coated with a layer of light wavelength conversion material (not shown) to effect the change of optical characteristics. The encapsulation layer 15 covers the fixing grooves 125, 135 extending to the first electrode 12 and the second electrode 13. Since the encapsulation layer 15 extends to the first electrode 12 and the fixing grooves 125 and 135 of the twelfth electrode 13 , the portion of the encapsulation layer 15 deep into the fixing grooves 125 , 135 plays a role of holding the encapsulation layer 15 , so that the encapsulation layer 15 is not easily peeled off. Thereby, the connection strength between the encapsulation layer 15 and the first electrode 12 and the second electrode 13 is enhanced. Referring to FIG. 2 to FIG. 4 , a light emitting diode package structure 20 ′ according to a second embodiment of the present invention includes an insulating substrate 21 , a first electrode 22 , a second electrode 23 , and two light emitting diodes . The polar body chip 24 and the encapsulation layer 25. The difference from the LED package structure of the first embodiment is 099138278. Form No. A0101 Page 5 / Total 17 Page 0992066691-0 201220557 The LED package structure of the second embodiment further includes two parts and a second - a pin 26 to which the electrode 22 and the second electrode 23 are snapped. The encapsulation layer 25 covers the end portions of the light-emitting diode wafer 24, the middle portion of the substrate 21, and the second electrode 23 of the first electrode 22, so as to leave the outer ends of the first electrode 22 and the second electrode 23. The part is for the pin 26 to be engaged. [0018] [0018] 099138278 The first electrode 22 is the same as the first electrode 12 of the first embodiment, and the end portion is a fitting portion provided with a fixing groove 225, and the fixing groove 225 has a circular cross section. In the shape of an arc, a groove 226 is provided inside the fixing groove 125. The lead 26 is made of a conductive material such as a copper material. Each of the leads 26 includes a base portion 261, a base portion 262 which is bent downward from the bottom of the main portion 261 and extends to one side, and an engaging portion 263 extending from the other side of the main portion 261. The cross section of the engaging portion 263 has an arc shape corresponding to the cross section of the fixing groove 22 5 of the first electrode 22. As shown in FIG. 3, when the lead 26 is assembled to the first electrode 22, the pin 26 is horizontally pressed against the first electrode 22, wherein the engaging portion 263 is fitted into the fixing groove 225 of the first electrode 22. When the pin 26 is embedded, the opening of the fixing groove 125 is appropriately deformed and expanded due to the action of the first electrode 22 disposed in the slit 226 of the fixing groove 125, and the engaging portion 263 of the pin 26 is received and restored to the original state. The foot 26 is fixed to the first electrode 22. The bottom surface of the main portion 261 of the lead 26 is bonded to the top surface of the substrate 21, and the base portion 262 of the lead 26 is bonded to the side surface of the substrate 21 to increase the adhesion of the lead 26, the first electrode 22, and the substrate 21. Similarly, the other pin 26 is engaged with one side of the second electrode 23. Since the pins 26 are respectively engaged with the first electrode 22 and the second electrode 23, and the substrate 21 is sandwiched and fixed with the first electrode 22 and the second electrode 23, the substrate 21 and the first electrode 22 and the second electrode are reinforced. The strength of the connection between 23. When the light emitting diode package structure 20 is in operation, the light emitting diode wafer form number A0101 page 6 / 17 pages 0992066691-0 201220557 24 through the metal wire 240, the first electrode 22, the first electrode 23 and the pin 26 (4) ^ Email can also play a role in cooling. [0019] It can be understood that the structure of the engaging portion 第一 of the first electrode 22 and the engaging portion 263 of the lead 26 can be replaced with each other, that is, the engaging portion of the first electrode electrode 22 can be provided as a protruding portion. On the lead 26, a u-groove may be disposed to correspond to the mating portion of the first electrode 22. The arrangement of the second electrode 23 can be similarly provided as a projection. [0020] As shown in FIG. 5, a light emitting diode package structure 3 according to a third embodiment of the present invention is shown. The difference from the light-emitting diode package of the second embodiment is that the light-emitting diodes of the lions each include at least two pins 36, thereby achieving multi-pin fixing. The pin 136 is disposed on the same side of the first electrode 32 away from the illuminating diode 34, and the other two pins 36 are disposed on the same side of the second electrode 33 away from the illuminating diode 34. [0021] As shown in FIG. 6, the LED package structure 40 according to the fourth embodiment of the present invention is different from the illumination structure of the third embodiment in that the illumination: the polar package The structure 4__foot 46 is placed on opposite sides of the first electrode 42, and the other two pins 46 are placed on opposite sides of the second electrode. It can be understood that the first electrode 42 and the second electrode 43 can be provided with a fixing groove to be fixed with the encapsulation layer 45 to increase the encapsulation layer 45 and the first electrode 42 and the second electrode 43. Connection strength. [0022] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and 099138278 Form No. A0101 Page 7 / Total Page 0992066691-0 201220557 Those skilled in the art, in the spirit of the present invention, Changes are to be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS [0023] FIG. 1 is a cross-sectional view showing a light emitting diode package structure according to a first embodiment of the present invention. 2 is a cross-sectional view showing a light emitting diode package structure according to a second embodiment of the present invention. 3 is a schematic view showing a process of assembling pins and electrodes of the light emitting diode package structure shown in FIG. 2. 4 is a top plan view of the light emitting diode package structure shown in FIG. 2. 5 is a top plan view of a light emitting diode package structure according to a third embodiment of the present invention. 6 is a top plan view of a light emitting diode package structure according to a fourth embodiment of the present invention. [Main Component Symbol Description] [0029] Light Emitting Diode Package Structure: 10, 20, 30, 40 [0030] Substrate: 11, 21 [0031] First Surface: 111 [0032] Second Surface: 112 [0033] First groove: 1 1 4 [0034] Second groove: 115 [0035] accommodating groove: 119 099138278 Form number A01O1 Page 8 / Total 17 page 0992066691-0 201220557 [0037] [0038] [0038] [0040] [0044] [0048] [0048] [0048] [0049] First electrode: 12, 22, 32, 42 carrier: 121, 131 Embedding part: 122, 132 End: 123, 133 Fixed groove: 125, 135, 225 Incision: 126, 136, 226 Second electrode: 13, 23, 33, 43 Light-emitting diode chip: 14, 24, 34 Metal wire: 140, 240 Package layer: 15, 25 pins · · 26, 36 Head: 261 Base: 262 Engagement: 263 099138278 Form number Α 0101 Page 9 / Total 17 page 0992066691-0