201216557 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種天線裝置，且特別是有關於一種 具屏蔽罩之天線裝置。 【先前技術】 隨著通訊科技中無線技術的進步，使得電子裝置增添 無線功能愈加廣泛地被使用，且憑藉各種最新資訊的無線 傳輸和處理效能，從而大幅地提升人類生活上的便利性。 Φ 請參照第1圖，係繪示習知技術中天線裝置的剖視 圖。天線裝置10位於電路板80之一容置空間81處，並與 電路板80相貼合。天線裝置10包含一基板20、至少一電 子元件30、一屏蔽罩40、一天線50及一黏合層60。基板 20位於電路板80上，並具有一貫穿孔23、相對之一第一 面21與一第二面22。電子元件30位於基板20之第二面 22上，並透過基板20電性連接電路板80。屏蔽罩40罩蓋 電子元件30，以屏蔽電磁波或訊號之干擾。 天線50位於基板20之第一面21上，用以收發無線訊 • 號，並傳送無線訊號至基板20而傳遞到電子元件30。天 線50具有一介電層51、一饋入點52與一導電元件53，饋 入點52用以饋入或傳送天線50所收發之無線訊號。導電 元件53位於介電層51中，且其一端連接饋入點52，另一 端經由一貫穿孔23穿過基板20而突出於第二面22,並利 用一銲接點70固定於第二面22。黏合層60位於天線50 的介電層51與基板20的第一面21之間，用以貼合天線 50與基板20。 在習知技術之天線裝置10 +，導電元件53及銲接點 70會佔用基板20之第二面22的部分面積，以致減少電子[s] 3 201216557 元件30在基板20上的使用空間 線裝置1G的設計方式1 置數里再者’此天 8卜以將天線褒置1〇設上形成-容置空間 81會對電路板80造成破81處’但容置空間 局(Layout) ’並影響整體的結構設計。 路佈 對此’需要-種具新賴性與進步性的天線震置，以掩 加電子讀在基板上的使用空間或設置數量，同時 = 電路板造成破壞。 【發明内容】 本發明之目的’係提供一種具屏蔽罩之天線裝置 由將電子it件、屏蔽罩與天収置於基板之同—面，並^ 屏蔽罩或接合部上形成開口，且將導電元件沿著開口處 曲地延伸至基板。藉此，除可屏蔽電磁波或訊號之干擾外， 亦可增加電子TL件在基板上的使用空間或設置數量，還能 避免對電路板造成破壞或影響線路佈局。 依據本發明之一實施態樣，具屏蔽罩之天線裝置包含 -土f、至少一電子元件、一屏蔽罩及一天線。電子元件 位=土板上。屏蔽軍罩蓋電子元件’並具有一頂面、一邊 ίι:罢第一開口’第一開口自頂面延伸至邊緣。天線位於 道觉_ i上，並具有一介電層、一第一導電元件與一第二 、車桩ΐ:道導電元件貫穿介電層，第二導電元件電性 導電元件，並沿著第一開口處彎曲地延伸至基板。 罩可具有一邊角或一側面’第一開口自屏蔽罩的 了 申至邊緣、邊角或側面。介電層可具有相對之一第 帝：第二面，第一導電元件自第一面貫穿第二面，第 二導電元件電性連接基板。 天線裝置可包含一接合部，接合部位於屏蔽罩與介電 [S ] 4 201216557 層之間並具有一第二開口，第二開口重疊於第一開口上。 天線裝置可包含一絕緣部，絕緣部位於第二導電元件與介 電層之間，並設置於第二開口處，且絕緣部具有一第一貫 穿孔。第二導電元件具有一第二貫穿孔，第一導電元件穿 過第-貫穿孔，並於第二貫穿孔處電性連接第二導電元件。 、天線可具有一導電層，導電層位於介電層之第二面， 並具有-第三貫穿孔。接合部位於導電層與屏蔽罩之間， :部=電=第二導電元件之間。第一導電元件穿 匕第一貝穿孔，並與導電層電性隔絕。 含一 實施態樣，具屏蔽罩之天線裝置包 土板至夕一電子兀件、一屏蔽罩及一天線。電子 。屏蔽罩罩蓋電子元件，並具有-頂面、- 於屏蘊！ί Η開口，第一開口自頂面延伸至邊緣。天線位 貫穿入雷爲、’並具有一介電層與一導電元件。導電元件 二3 ’並沿著第-開口處彎曲地延伸至基板。 至邊： 有一邊角或一侧面’第-開口自頂面延伸 第=電：自面第 天線穿置可勺人第貝穿第二面，並電性連接基板。 層之間^具μ # &罩與介電 =置=第一絕::處絕緣部位於導電元件與介電 孔，導電元件穿:第第：且絕緣部具有-第-貫穿 並具導電f:導電層位於介電層之第二面， 二、緣部位於導電層與導電:二 穿孔，並與導電層電性隔絕。 穿過第一貫 201216557 依據本發明之又一實施態樣，具屏蔽罩之天 含-基板、至少-電子元件、—屏蔽罩、_接合部^一天 線。電子元件位於基板上。屏蔽罩罩蓋電子元件，並具 一頂面與一邊緣。接合部位於屏蔽罩上，並具有一開口、， 開口位於頂面之上方且朝向邊緣。天線位於接合部上， 具有一介電層、一第一導電元件與一第二導電元件， 導電元件貫穿介電層，第二導電元件電性連接第一 件，並沿著開口處彎曲地延伸至基板。201216557 VI. Description of the Invention: [Technical Field] The present invention relates to an antenna device, and more particularly to an antenna device having a shield. [Prior Art] With the advancement of wireless technology in communication technology, the wireless function of electronic devices has been increasingly used, and the wireless transmission and processing performance of various latest information have greatly improved the convenience of human life. Φ Referring to Fig. 1, a cross-sectional view of an antenna device in the prior art is shown. The antenna device 10 is located at one of the housing spaces 81 of the circuit board 80 and is attached to the circuit board 80. The antenna device 10 includes a substrate 20, at least one electronic component 30, a shield 40, an antenna 50, and an adhesive layer 60. The substrate 20 is located on the circuit board 80 and has a uniform through hole 23, a first surface 21 and a second surface 22 opposite thereto. The electronic component 30 is located on the second surface 22 of the substrate 20 and electrically connected to the circuit board 80 through the substrate 20. The shield 40 covers the electronic component 30 to shield electromagnetic waves or signals from interference. The antenna 50 is located on the first side 21 of the substrate 20 for transmitting and receiving wireless signals and transmitting wireless signals to the substrate 20 for transmission to the electronic components 30. The antenna 50 has a dielectric layer 51, a feed point 52 and a conductive element 53 for feeding in or transmitting the wireless signals transmitted and received by the antenna 50. The conductive element 53 is located in the dielectric layer 51 and has one end connected to the feed point 52 and the other end protruding through the substrate 20 through the permanent via 23 to protrude from the second face 22 and secured to the second face 22 by a solder joint 70. The adhesive layer 60 is located between the dielectric layer 51 of the antenna 50 and the first surface 21 of the substrate 20 for bonding the antenna 50 and the substrate 20. In the antenna device 10 + of the prior art, the conductive element 53 and the solder joint 70 occupy a portion of the area of the second surface 22 of the substrate 20, so as to reduce the use of the space line device 1G of the electronic device [s] 3 201216557 element 30 on the substrate 20. The design method 1 is set to be the same as 'the 8th day to set the antenna to 1" - the accommodating space 81 will cause the circuit board 80 to break 81 'but the Layout' and influence The overall structural design. The road cloth needs to be equipped with a new and progressive antenna to cover the space or the number of electronic readings on the substrate, and the board is damaged. SUMMARY OF THE INVENTION An object of the present invention is to provide an antenna device with a shield cover, which is formed by placing an electronic component, a shield cover, and a shield on the same surface of the substrate, and forming an opening on the shield or the joint portion, and The conductive element extends curvedly to the substrate along the opening. In addition, in addition to shielding electromagnetic waves or signal interference, the use space or the number of electronic TL components on the substrate can also be increased, and the damage to the circuit board or the layout of the circuit can be avoided. According to an embodiment of the present invention, an antenna device with a shield includes - soil f, at least one electronic component, a shield, and an antenna. Electronic component position = soil plate. The military cover electronic component is shielded and has a top surface and a side opening. The first opening extends from the top surface to the edge. The antenna is located on the sensation _i and has a dielectric layer, a first conductive element and a second, a vehicle pile ΐ: the conductive element penetrates the dielectric layer, the second conductive element electrically conductive element, and along the An opening extends to the substrate in a curved manner. The cover may have a corner or a side' the first opening from the shield to the edge, corner or side. The dielectric layer may have a first surface: a second surface, the first conductive element penetrates the second surface from the first surface, and the second conductive element is electrically connected to the substrate. The antenna device can include a joint between the shield and the dielectric layer [S] 4 201216557 and having a second opening that overlaps the first opening. The antenna device may include an insulating portion between the second conductive member and the dielectric layer and disposed at the second opening, and the insulating portion has a first through hole. The second conductive element has a second through hole, the first conductive element passes through the first through hole, and the second conductive element is electrically connected to the second through hole. The antenna may have a conductive layer on the second side of the dielectric layer and have a third through hole. The joint is located between the conductive layer and the shield, : part = electricity = between the second conductive elements. The first conductive element passes through the first bead perforation and is electrically isolated from the conductive layer. In an embodiment, the antenna device with a shield cover covers an electronic component, a shield, and an antenna. Electronics. The shield cover covers the electronic components and has a top surface, - in the screen! ί Η opening, the first opening extends from the top surface to the edge. The antenna bit penetrates into the ground and has a dielectric layer and a conductive element. The conductive member 2 3 ' extends in a curved manner along the first opening to the substrate. To the side: There is a corner or a side. The first opening extends from the top surface. The first electric antenna is placed on the second side of the antenna and is electrically connected to the substrate. Between the layers ^μμ & hood and dielectric = set = first absolute:: the insulating part is located in the conductive element and the dielectric hole, the conductive element wears: the first: and the insulating part has - first-through and conductive f: the conductive layer is located on the second side of the dielectric layer, and the edge portion is located on the conductive layer and is electrically conductive: two perforations, and is electrically isolated from the conductive layer. Through the first pass 201216557, according to still another embodiment of the present invention, the shield includes a substrate, at least an electronic component, a shield, and a joint. The electronic components are located on the substrate. The shield covers the electronics and has a top surface and an edge. The joint is located on the shield and has an opening, the opening being above the top surface and facing the edge. The antenna is located on the joint portion, and has a dielectric layer, a first conductive element and a second conductive element. The conductive element penetrates the dielectric layer, and the second conductive element is electrically connected to the first piece and extends curvedly along the opening. To the substrate.
介電層具有相對之一第一面與一第二面，屏蔽罩且有 一側面，，一導電元件自第一面貫穿第二面，第二導^元 件依序沿著開口、頂面、邊緣與側面彎曲地延伸至基板。 天線裝置可包含一絕緣部，絕緣部位於第二導電元件 與屏蔽罩之間。天線可具有一導電層，導電層位於介電層 之第二面，並具有一貫穿孔。接合部位於導電層與屏蔽罩 之間’導電元件穿過貫穿孔，並與導電層電性隔絕。 依據本發明之再一實施態樣，具屏蔽罩之天線裝置包 含一基板、至少一電子元件、一屏蔽罩、一接合部及一天 線。電子元件位於基板上。屏蔽罩罩蓋電子元件，並具有 頂面與一邊緣。接合部位於屏蔽罩上，並具有一開口， 開口位於頂面之上方且朝向邊緣。天線位於接合部上，並 f有-介電層與-導電元件’導電元件貫穿介電層，並沿 著開口處彎曲地延伸至基板。 介電層具有相對之一第一面與一第二面，屏蔽罩具有 一侧面’導電元件自第一面貫穿第二面，並依序沿著開口、 頂面、邊緣與側面彎曲地延伸至基板。 天線裝置可包含一絕緣部，絕緣部包覆導電元件，或 位於導電元件與屏蔽罩之間。天線可具有一導電層，導電 層位於介電層之第二面，接合部位於導電層與屏蔽罩之間。⑸ 201216557 【實施方式】 以下配合圖示說明本發明之較佳實施例，詳細說明本 發明之技術特徵。 請同時參照第2A圖及第2B圖，係分別繪示本發明具 屏蔽罩之天線裝置之第一實施例的立體圖及爆炸圖。如圖 所示，天線裝置100係設置於一電路板190上，並電性連 接電路板190。天線裝置1〇〇包含一基板11〇、至少一電子 元件m、一屏蔽罩120及一天線130。The dielectric layer has a first surface and a second surface opposite to each other, the shielding cover has a side surface, a conductive element penetrates the second surface from the first surface, and the second guiding element sequentially follows the opening, the top surface and the edge It extends to the substrate in a curved manner with the side. The antenna device may include an insulating portion between the second conductive member and the shield. The antenna can have a conductive layer on the second side of the dielectric layer with consistent perforations. The joint is located between the conductive layer and the shield. The conductive element passes through the through hole and is electrically isolated from the conductive layer. According to still another embodiment of the present invention, an antenna device having a shield includes a substrate, at least one electronic component, a shield, a joint, and a day line. The electronic components are located on the substrate. The shield covers the electronics and has a top surface and an edge. The joint is located on the shield and has an opening above the top surface and toward the edge. The antenna is located on the joint and has a dielectric layer and a conductive element. The conductive element extends through the dielectric layer and extends curvedly along the opening to the substrate. The dielectric layer has a first surface and a second surface opposite to each other, and the shielding cover has a side surface. The conductive element penetrates the second surface from the first surface, and sequentially extends along the opening, the top surface, the edge and the side surface to the curved surface. Substrate. The antenna device may include an insulating portion that encloses the conductive member or is located between the conductive member and the shield. The antenna may have a conductive layer on the second side of the dielectric layer and the joint between the conductive layer and the shield. (5) 201216557 [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings, and the technical features of the present invention will be described in detail. Referring to Figures 2A and 2B, respectively, a perspective view and an exploded view of the first embodiment of the antenna device with a shield according to the present invention are shown. As shown in the figure, the antenna device 100 is disposed on a circuit board 190 and electrically connected to the circuit board 190. The antenna device 1A includes a substrate 11A, at least one electronic component m, a shield 120, and an antenna 130.
電子元件111位於基板110上，並電性連接基板110。 屏蔽罩120位於基板110或電路板190上，並罩蓋電子元 件111，以屏蔽電磁波或無線訊號的干擾。屏蔽罩120具有 一頂面121、一邊緣122與一第一開口 171，第一開口 171 自屏蔽罩120之頂面121延伸至邊緣122。 天線130位於屏蔽罩120之上方，並具有一介電層 140、一第一導電元件151與一第二導電元件152。第一導 電元件151貫穿介電層140，第二導電元件152電性連接 第一導電元件151，並沿著第一開口 Π1處彎曲地延伸呈 開 基板110。 屏蔽罩120可具有一邊角123或一側面’第 口 171自頂面121延伸至邊緣122、邊角123或側面。介 其中邊角123係指二個邊緣122或側面124相接之處第二 電層140具有相對之一第一面141與一第一面14 -j. 導電元件151自第一面141貫穿第二面142，第〆 件152電性連接基板1H^ ,，類似 第一導電元件151與第二導電元件152牙形成ι3〇 「4」字型的導電路徑。第一導電元件151位於夭線/件 之介電層140中，並垂直貫穿介電層140。第二導電70 [ 7 201216557 152可彎折成二段，第一段153位於頂面121之第一開口 171處，並電性連接第一導電元件151，第二段154可位於 侧面124之第一開口 171處，並電性連接基板u〇。 、 天線裝置100可包含一接合部16〇，接合部16〇位於 屏蔽罩120與介電層140之間，用以接合屏蔽罩12〇與天 線130。接合部160可具有一第二開口 172，第二開口 172 重疊於第一開口 171之上方。 天線裝置100亦可包含一絕緣部161，絕緣部ι61位 於第二導電元件152與介電層140之間，並設置於第二開 φ 口 172處，用以電性隔絕第二導電元件152與介電層14〇。 絕緣部161可具有一第一貫穿孔181，第二導電元件M2 具有一第二貫穿孔182’第一導電元件151穿過第一貫穿 孔181，並於第二貫穿孔182處電性連接第二導電元件152。 天線130可具有一導電層131，導電層131位於介電 層140之第二面142，並具有一第三貫穿孔183。接合部 160位於導電層131與屏蔽罩120之間’絕緣部ι61位於 導電層131與第二導電元件152之間。第一導電元件ι51 穿過第三貫穿孔183，並與導電層131電性隔絕。 • 天線丨3〇可具有一饋入點15〇 ’饋入點15〇位於介電 層140之第一面141，並電性連接第一導電元件151，用以 饋入或傳送天線130之無線訊號。 請同時參照第3A圖及第3B圖，係分別為本發明具屏 蔽罩之天線裝置之第二實施例的立體圖及爆炸圖。如圖所 示，天線裝置200係設置於一電路板290上，並電性連接 電路板290。天線裝置200包含一基板210、至少一電子元 件211、一屏蔽罩220及一天線230。 電子元件211位於基板210上，並電性連接基板210。 屏蔽罩220位於基板210或電路板290上，並罩蓋電子元 8 201216557 件211。屏蔽罩220具有一頂面221、一邊緣222與一第一 開口 271，第一開口 271自頂面221延伸至邊緣222。天線 230位於屏蔽罩220之上，並具有一介電層240與一導電 元件251，導電元件251貫穿介電層240，並沿著第一開口 271處彎曲地延伸至基板21〇。 屏蔽罩220可具有一邊角223或一侧面224 ’第一開 口 271自頂面221延伸至邊緣222、邊角223或側面224。 介電層240具有相對之一第一面241與一第二面242，導The electronic component 111 is located on the substrate 110 and electrically connected to the substrate 110. The shield 120 is located on the substrate 110 or the circuit board 190 and covers the electronic component 111 to shield electromagnetic waves or wireless signals from interference. The shield 120 has a top surface 121, an edge 122 and a first opening 171 extending from the top surface 121 of the shield 120 to the edge 122. The antenna 130 is located above the shield 120 and has a dielectric layer 140, a first conductive element 151 and a second conductive element 152. The first conductive element 151 extends through the dielectric layer 140, and the second conductive element 152 is electrically connected to the first conductive element 151 and extends along the first opening Π1 to form the substrate 110. The shield 120 can have a corner 123 or a side 'port 171 extending from the top surface 121 to the edge 122, the corner 123 or the side. The second electrical layer 140 has a first surface 141 opposite to the first surface 141 and a first surface 14 -j. The conductive element 151 extends through the first surface 141. The two sides 142, the second member 152 is electrically connected to the substrate 1H^, and the first conductive member 151 and the second conductive member 152 are formed into a conductive path of a "4" shape. The first conductive element 151 is located in the dielectric layer 140 of the germanium wire/piece and extends vertically through the dielectric layer 140. The second conductive 70 [ 7 201216557 152 can be bent into two segments, the first segment 153 is located at the first opening 171 of the top surface 121, and is electrically connected to the first conductive element 151, and the second segment 154 can be located at the side 124 An opening 171 is electrically connected to the substrate u. The antenna device 100 can include a bonding portion 16A disposed between the shield 120 and the dielectric layer 140 for engaging the shield 12 and the antenna 130. The joint portion 160 may have a second opening 172 that overlaps the first opening 171. The antenna device 100 can also include an insulating portion 161 between the second conductive member 152 and the dielectric layer 140 and disposed at the second opening 172 to electrically isolate the second conductive member 152 from The dielectric layer 14 is. The insulating portion 161 has a first through hole 181, and the second conductive member M2 has a second through hole 182'. The first conductive member 151 passes through the first through hole 181 and is electrically connected to the second through hole 182. Two conductive elements 152. The antenna 130 can have a conductive layer 131. The conductive layer 131 is located on the second surface 142 of the dielectric layer 140 and has a third through hole 183. The joint portion 160 is located between the conductive layer 131 and the shield case 120. The insulating portion ι61 is located between the conductive layer 131 and the second conductive member 152. The first conductive element ι51 passes through the third through hole 183 and is electrically insulated from the conductive layer 131. • The antenna 丨3〇 can have a feed point 15〇, the feed point 15〇 is located on the first side 141 of the dielectric layer 140, and is electrically connected to the first conductive element 151 for feeding or transmitting the wireless of the antenna 130. Signal. Please refer to FIG. 3A and FIG. 3B simultaneously, which are respectively a perspective view and an exploded view of a second embodiment of the antenna device with a shield cover of the present invention. As shown, the antenna device 200 is disposed on a circuit board 290 and electrically connected to the circuit board 290. The antenna device 200 includes a substrate 210, at least one electronic component 211, a shield 220, and an antenna 230. The electronic component 211 is located on the substrate 210 and electrically connected to the substrate 210. The shield 220 is located on the substrate 210 or the circuit board 290 and covers the electronic component 8 201216557. The shield 220 has a top surface 221, an edge 222 and a first opening 271 extending from the top surface 221 to the edge 222. The antenna 230 is disposed on the shield 220 and has a dielectric layer 240 and a conductive member 251. The conductive member 251 extends through the dielectric layer 240 and extends along the first opening 271 to the substrate 21A. The shield 220 can have a corner 223 or a side 224'. The first opening 271 extends from the top surface 221 to the edge 222, the corner 223, or the side 224. The dielectric layer 240 has a first surface 241 and a second surface 242 opposite to each other.
電元件251自第一面241貫穿第二面242，旅電性連接基 板 210 〇 導電元件251可彎折成三段，並形成類似「4」字型 的導電路徑。第一段253位於天線230之介電層240中， 並垂直貫穿介電層240，第二段254位於頂面221之第一 開口 271處，第三段255可位於側面224之第一開口 271 處’並電性連接基板210。 天線裝置200可包含一接合部260，接合部260位於 屏蔽罩220與介電層240之間，用以接合屏蔽罩220與天 線230。接合部260可具有一第二開口 272，第二開口 272 重疊於第—開σ 271上。天線裝置2GG亦可包含-絕緣部 絕緣部261位於導電元件251與介電層240之間，並 °又，於第二開口 272處，用以電性隔絕導電元件251與介 電，240。絕緣部261可具有一第一貫穿孔281，導電元件 過第一貫穿孔281，並接觸絕緣部261。 天線230可具有一導電層231，導電層231位於第二 面2=，並具有一第二貫穿孔282。接合部位於導電層 一、屏蔽罩220之間，絕緣部261位於導電層231與導 251之間，導電元件251穿過第二貫穿孔282，並 與導電層231電性隔絕。 201216557 天線230可具有一饋入點250 ’饋入點250位於介電 層240之第一面24卜並電性連接第一導電元件251，用以 饋入或傳送天線230之無線訊號。 請同時參照第4A圖及第4B圖，係分別繪示本發明具 屏蔽罩之天線裝置之第三實施例的立體圖及爆炸圖。如圖 所示，天線裝置3〇〇係設置於一電路板390上，並電性連 接電路板390。天線裝置300包含一基板310、至少一電子 元件311、一屏蔽罩32〇、一接合部360及一天線330。The electrical component 251 extends through the second surface 242 from the first surface 241. The bridging connection substrate 210 导电 the conductive element 251 can be bent into three segments and form a conductive path similar to a "4" shape. The first segment 253 is located in the dielectric layer 240 of the antenna 230 and extends vertically through the dielectric layer 240. The second segment 254 is located at the first opening 271 of the top surface 221, and the third segment 255 is located at the first opening 271 of the side surface 224. At the same time, the substrate 210 is electrically connected. The antenna device 200 can include a joint 260 between the shield 220 and the dielectric layer 240 for engaging the shield 220 and the antenna 230. The joint portion 260 may have a second opening 272 that overlaps the first opening σ 271. The antenna device 2GG can also include an insulating portion 261 between the conductive member 251 and the dielectric layer 240, and further at the second opening 272 for electrically isolating the conductive member 251 from the dielectric 240. The insulating portion 261 may have a first through hole 281 through which the conductive member passes and contacts the insulating portion 261. The antenna 230 can have a conductive layer 231, and the conductive layer 231 is located on the second surface 2 = and has a second through hole 282. The bonding portion is located between the conductive layer and the shield 220. The insulating portion 261 is located between the conductive layer 231 and the conductive layer 251. The conductive member 251 passes through the second through hole 282 and is electrically isolated from the conductive layer 231. The antenna 230 may have a feed point 250'. The feed point 250 is located on the first side 24 of the dielectric layer 240 and electrically connected to the first conductive element 251 for feeding or transmitting the wireless signal of the antenna 230. Referring to Figures 4A and 4B, respectively, a perspective view and an exploded view of a third embodiment of the antenna device with a shield according to the present invention are shown. As shown in the figure, the antenna device 3 is disposed on a circuit board 390 and electrically connected to the circuit board 390. The antenna device 300 includes a substrate 310, at least one electronic component 311, a shield 32 〇, a joint 360, and an antenna 330.
電子元件311位於基板310上，並電性連接基板310。 屏蔽罩320位於基板310或電路板390上，並罩蓋電子元 件311 ’以屏蔽電磁波或無線訊號的干擾。屏蔽罩mo具 有一頂面321與一邊緣322。接合部360位於屏蔽罩32〇 上，並具有一開口 371，開口 371位於頂面321之上方且 朝向邊緣322 » 天線330位於接合部36〇上，並具有一介電層34〇、 一第一導電元件351與一第二導電元件352。第二導電元 件351貫穿介電層34〇，第二導電元件352電性連接第一 導電元件351 ’並沿著開口 371處彎曲地 >介電層細具有相對之一第一面341/— 屏蔽罩320具有一側面324，第一導電元件35ι自第一面 341貫穿第二面342’第二導電元件352依序沿著開口 p卜 2面32卜邊緣322與側面324(或邊角323)彎曲地延伸至 基板310。 351與第二導電元件352可形成類似 上：=徑。第一導電元件351位於天線330 之電層34G + ’並垂直貫穿介電層34q 352可弯折成二段’第一段353位於接合部鳩之開口仍 201216557 處，並電性連接第一導電元件351，第二段354可位於屏 蔽罩320之側面324，並電性連接基板310。 天線裝置300可包含一絕緣部361，絕緣部361位於 第二導電元件352與屏蔽罩320之間。天線330可具有一 導電層331，導電層331位於第二面342，並具有一貫穿孔 381。接合部360位於導電層331與屏蔽罩320之間，第一 導電元件351穿過貫穿孔381，並與導電層331電性隔絕。 天線330可具有一饋入點350，饋入點350位於介電 層340之第一面34卜並電性連接第一導電元件35卜用以 φ 饋入或傳送天線33〇之無線訊號。 請同時參照第5A圖及第5B圖，係分別為本發明具屏 蔽罩之天線裝置之第四實施例的立體圖及爆炸圖。如圖所 示，天線裝置400係設置於一電路板490上，並電性連接 電路板490。天線裝置400包含一基板410、至少一電子元 件411、一屏蔽罩420、一接合部460及一天線430。 電子元件411位於基板410，並電性連接基板410。屏 蔽罩420位於基板410或電路板490上，並罩蓋電子元件 41卜屏蔽罩420具有一頂面421與一邊緣422。接合部460 • 位於屏蔽罩420上，並具有一開口 471，開口 471位於頂 面421之上方且朝向邊緣422。天線430位於接合部460 上，並具有一介電層440與一導電元件451，導電元件451 貫穿介電層440,並沿著開口 471處彎曲地延伸至基板410。 介電層440具有相對之一第一面441與一第二面442, 屏蔽罩420具有一側面424，導電元件451自第一面441 貫穿第二面442，並依序沿著開口 471、頂面421、邊緣422 與側面424(或邊角423)彎曲地延伸至基板410。 — 導電元件451可彎折成三段，並形成類似「4」字型 的導電路徑。第一段453位於天線430之介電層440中， 11 201216557 並垂直貫穿介電層440’第二段454位於接合部働之 口 47!處’第三段455可位於屏蔽罩42〇之側面424，並 電性連接基板410。 天線裝置400可包含-絕緣部461，絕緣部461 導電兀件45卜或位於導電元件451與屏蔽罩42〇之間。 天線430具有一導電層431，導電層431位於第二面442， 接合部460位於導電層431與屏蔽罩420之間。 天線430可具有一饋入點45〇，饋入點45〇位於介電 層440之第一面441，並電性連接第一導電元件451，用以 φ 饋入或傳送天線43〇之無線訊號。 上述各個實施例中，基板亦可為載板、電路板、陶瓷 基板、玻璃基板、疊層板、積層板、單層板、多層板或任 何的承載件。電子元件可為射頻晶片、高頻晶片、基頻晶 片、裸晶片、封裝晶片、封裝體、記憶體、半導體元件、 主動元件、被動元件或數位訊號處理器等。屏蔽罩可為屏 蔽盒、屏蔽殼體、遮蔽外罩、金屬蓋、隔離蓋或防磁殼罩 等。天線可為平板天線、平面天線或陶瓷天線等。介電層 之材質可為陶瓷材料、絕緣材料或非導電材料等。導電元 • 件可為饋入針、金屬針、金屬材料、導電材料、導電體或 導線等。開口可為缺口、凹槽、凹孔或溝槽等。接合部可 為接合層、黏性材料、絕緣材料、非導電材料或導電材料 等。絕緣部可為絕緣層、絕緣材料、非導電材料或黏性材 料等。 綜上所述’藉由本發明具屏蔽罩之天線裝置的結構設 計，將電子元件、屏蔽罩與天線設置於基板之同一面，ϋ 於屏蔽罩或接合部上形成開口，且將導電元件沿著開口處 彎曲地延伸至基板。藉此，除可屏蔽電磁波或訊號之干擾 外，並可增加電子元件在基板上的使用空間或設置數量’ [s】 12 201216557 亦不需形成容置空間，以避免對電路板造成破壞或影響線 路佈局。 雖然本發明已以各種實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 Φ 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示習知技術中天線裝置的剖視圖。 第2A圖係繪示本發明具屏蔽罩之天線裝置之第一實 施例的立體圖。 第2B圖係繪示本發明具屏蔽罩之天線裝置之第一實 施例的爆炸圖。 第3A圖係繪示本發明具屏蔽罩之天線裝置之第二實 施例的立體圖。 第3B圖係繪示本發明具屏蔽罩之天線裝置之第二實 φ 施例的爆炸圖。 第4A圖係繪示本發明具屏蔽罩之天線裝置之第三實 施例的立體圖。 第4B圖係繪示本發明具屏蔽罩之天線裝置之第三實 施例的爆炸圖。 第5A圖係繪示本發明具屏蔽罩之天線裝置之第四實 施例的立體圖。 第5B圖係繪示本發明具屏蔽罩之天線裝置之第四實 施例的爆炸圖。 [S] 13 201216557The electronic component 311 is located on the substrate 310 and electrically connected to the substrate 310. The shield 320 is located on the substrate 310 or the circuit board 390 and covers the electronic component 311' to shield electromagnetic waves or wireless signals from interference. The shield mo has a top surface 321 and an edge 322. The joint portion 360 is located on the shield 32 , and has an opening 371 located above the top surface 321 and facing the edge 322 » The antenna 330 is located on the joint portion 36 , and has a dielectric layer 34 一, a first Conductive element 351 and a second conductive element 352. The second conductive element 351 extends through the dielectric layer 34, and the second conductive element 352 is electrically connected to the first conductive element 351' and is bent along the opening 371. The dielectric layer has a relatively first surface 341/- The shield cover 320 has a side surface 324, and the first conductive element 35i extends from the first surface 341 through the second surface 342'. The second conductive element 352 sequentially along the opening p2 surface 32 edge 322 and side surface 324 (or corner 323 ) extends to the substrate 310 in a curved manner. 351 and second conductive element 352 can be formed similarly to: = diameter. The first conductive element 351 is located on the electrical layer 34G + ' of the antenna 330 and vertically penetrates the dielectric layer 34q 352 and can be bent into two segments. The first segment 353 is located at the opening of the joint portion and is still at 201216557, and is electrically connected to the first conductive portion. The second segment 354 can be located on the side 324 of the shield 320 and electrically connected to the substrate 310. The antenna device 300 can include an insulating portion 361 between the second conductive member 352 and the shield case 320. Antenna 330 can have a conductive layer 331 with a conductive layer 331 on second side 342 and having a uniform aperture 381. The joint portion 360 is located between the conductive layer 331 and the shield cover 320. The first conductive member 351 passes through the through hole 381 and is electrically insulated from the conductive layer 331. The antenna 330 can have a feed point 350 on the first side 34 of the dielectric layer 340 and electrically connected to the first conductive element 35 for wirelessly feeding or transmitting the antenna 33. Please refer to FIG. 5A and FIG. 5B simultaneously, which are respectively a perspective view and an exploded view of a fourth embodiment of the antenna device with a shield cover of the present invention. As shown, the antenna device 400 is disposed on a circuit board 490 and electrically connected to the circuit board 490. The antenna device 400 includes a substrate 410, at least one electronic component 411, a shield 420, a joint portion 460, and an antenna 430. The electronic component 411 is located on the substrate 410 and electrically connected to the substrate 410. The shield 420 is located on the substrate 410 or the circuit board 490, and covers the electronic component 41. The shield 420 has a top surface 421 and an edge 422. The joint 460 is located on the shield 420 and has an opening 471 above the top surface 421 and toward the edge 422. The antenna 430 is disposed on the bonding portion 460 and has a dielectric layer 440 and a conductive member 451 extending through the dielectric layer 440 and extending to the substrate 410 along the opening 471. The dielectric layer 440 has a first surface 441 and a second surface 442. The shield 420 has a side surface 424. The conductive element 451 extends through the second surface 442 from the first surface 441, and sequentially along the opening 471 and the top. Face 421, edge 422 and side 424 (or corner 423) are curvedly extended to substrate 410. — The conductive element 451 can be bent into three segments and form a conductive path similar to a "4" shape. The first segment 453 is located in the dielectric layer 440 of the antenna 430, 11 201216557 and vertically penetrates the dielectric layer 440'. The second segment 454 is located at the port 47 of the junction portion. The third segment 455 can be located on the side of the shield 42 424, and electrically connected to the substrate 410. The antenna device 400 may include an insulating portion 461, and the insulating portion 461 is disposed between the conductive member 451 and the shield 42. The antenna 430 has a conductive layer 431, the conductive layer 431 is located on the second surface 442, and the joint portion 460 is located between the conductive layer 431 and the shield 420. The antenna 430 can have a feed point 45A. The feed point 45A is located on the first surface 441 of the dielectric layer 440, and is electrically connected to the first conductive element 451 for feeding or transmitting the wireless signal of the antenna 43. . In the above embodiments, the substrate may also be a carrier, a circuit board, a ceramic substrate, a glass substrate, a laminated board, a laminated board, a single layer board, a multilayer board or any carrier. The electronic component can be a radio frequency chip, a high frequency chip, a base frequency chip, a bare chip, a package wafer, a package, a memory, a semiconductor component, an active component, a passive component, or a digital signal processor. The shield can be a shield case, a shield case, a shield cover, a metal cover, a cover or a magnetic shield. The antenna can be a flat antenna, a planar antenna or a ceramic antenna. The material of the dielectric layer may be a ceramic material, an insulating material or a non-conductive material. The conductive element can be a feed pin, a metal pin, a metal material, a conductive material, a conductor or a wire. The openings may be notches, grooves, recesses or grooves, and the like. The joint may be a bonding layer, a viscous material, an insulating material, a non-conductive material, or a conductive material. The insulating portion may be an insulating layer, an insulating material, a non-conductive material, or a viscous material. In summary, by the structural design of the antenna device with the shield of the present invention, the electronic component, the shield and the antenna are disposed on the same side of the substrate, an opening is formed on the shield or the joint, and the conductive element is along The opening extends to the substrate in a curved manner. In this way, in addition to shielding the electromagnetic wave or signal interference, and increasing the space or the number of electronic components used on the substrate '[s] 12 201216557, there is no need to form a housing space to avoid damage or influence on the circuit board. Line layout. While the present invention has been described in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention can be more clearly understood. The detailed description of the drawings is as follows: Figure 1 shows an antenna device in the prior art. Cutaway view. Fig. 2A is a perspective view showing the first embodiment of the antenna device with a shield according to the present invention. Fig. 2B is an exploded view showing the first embodiment of the antenna device with a shield of the present invention. Fig. 3A is a perspective view showing a second embodiment of the antenna device with a shield of the present invention. Fig. 3B is an exploded view showing a second embodiment of the antenna device with a shield of the present invention. Fig. 4A is a perspective view showing a third embodiment of the antenna device with a shield of the present invention. Fig. 4B is an exploded view showing a third embodiment of the antenna device with a shield of the present invention. Fig. 5A is a perspective view showing a fourth embodiment of the antenna device with a shield of the present invention. Fig. 5B is an exploded view showing a fourth embodiment of the antenna device with a shield of the present invention. [S] 13 201216557
【主要元件符號說明】 10 :天線裝置 20 :基板 21 :第一面 22 ' 第二面 23 :貫穿孔 3〇 :電子元件 40 :屏蔽罩 50 :天線 51 :介電層 52 :饋入點 53 :導電元件 60 :黏合層 70 :銲接點 80 :電路板 81 :容置空間 100,200,300,400:天線裳置 110,210,310,410 :基板 111，211，311，411 :電子元件 120,220,320,420 :屏蔽罩 121，221，321，421 :頂面 122.222.322.422 :邊緣 123.223.323.423 :邊角 124.224.324.424 :側面 130,230,330,430 :天線 131，231，331，431 :導電層 140,240,340,440 :介電層 141，241，341，441 :第一面 142,242,342,442 :第二面 150,250,350,450 :饋入點 151，351 :第一導電元件 152,352 :第二導電元件 251，451 :導電元件 153.253.353.453 :第一段 154.254.354.454 :第二段 255,455 :第三段 160,260,360,460 :接合部 161，261，361,461 :絕緣部 171，271 :第一開口 172,272 :第二開口 371，471 :開口 181，281 :第一貫穿孔 182,282 :第二貫穿孔 183 :第三貫穿孔 381 :貫穿孔 190,290,390,490 :電路板[Description of main component symbols] 10: Antenna device 20: Substrate 21: First surface 22' Second surface 23: Through hole 3: Electronic component 40: Shield 50: Antenna 51: Dielectric layer 52: Feeding point 53 : Conductive element 60: adhesive layer 70: solder joint 80: circuit board 81: housing space 100, 200, 300, 400: antenna skirt 110, 210, 310, 410: substrate 111, 211, 311, 411: electronic components 120, 220, 320, 420: shield 121, 221, 321, 421: Top surface 122.222.322.422: edge 123.223.323.423: corner 124.224.324.424: side 130, 230, 330, 430: antenna 131, 231, 331, 431: conductive layer 140, 240, 340, 440: dielectric layer 141, 241, 341, 441: first side 142, 242, 342, 442: Two sides 150, 250, 350, 450: feed point 151, 351: first conductive element 152, 352: second conductive element 251, 451: conductive element 153.2253.353.453: first paragraph 154.254.354.454: second paragraph 255, 455: third paragraph 160, 260, 360, 460: joint 161, 261, 361, 461: insulating portion 171, 271: first opening 172, 272: second opening 371, 471: opening 181, 281: first through hole 182, 282: second through hole 183: third through hole 381: through Hole 190, 290, 390, 490: circuit board