201215494 六、發明說明： 【發明所屬之技術領域】 本發明係與印刷技術有關，特別是關於一種熱轉印方法。 【先前技術】 按，熱轉印技術，乃係將特定圖樣預先印刷於熱轉印骐上，再經由熱 能與壓力之作用使圖樣藉由轉印膜而附著於待印刷物品之表面上，此等習 知技術固已被廣泛地應用於一般之印刷產業技術範疇中，但從技術發展之 進程上來看，該等轉印技術於-般印刷產業領域中，乃係以平板印刷之方 法行之’具體而言’其乃储由平板狀之壓板提供聽與壓力，將轉印紙 與待轉印物品驗於壓板紅作平台間，透過触與壓力之侧而使轉印 紙上之圖樣隨著轉印膜附著於待轉印物品之表面。 該等平板轉印技術，由於所提供之壓力作用方面係具有特定之單一方 向’因此，僅能適用於平整表面之轉印健，而對於如曲面或立體物表面 之轉印需求，即無法適用。 籲 是以’於習知技術中遂有採用以真空方式對曲面或立體物表面進行轉 印之技術被公開，如我國第觀24892號所公開之彩膜真空轉印機即屬一 例’具體而言’該等真空轉印方法乃係將轉印紙與待轉印物置人—密閉空 間中’而以轉印紙為界，使該密閉空間區隔成上、下兩部分不相連通之空 間：並以赵泵_各該空_腿，使之形絲线，郷大氣導入該 上部空間中’使之形成壓力，迫壓轉印膜隨著待轉印物之立體輪廓而變形， 貼附於待轉印物之表面上，在此同時，由於轉印紙與待轉印物間係呈真空 狀態，因此，麵附之同時，係可避免氣體被封存於轉印紙與待轉印物表 201215494 面間，從而確保成品之品質。 、上__衬法，固可提供對—或立體物表面之適㈣印加工方 、、淮其仍有其未臻疋善之處，較為顯著者有二，一者係其先使上部空間 纟真空後再_«之技術’崎能源之有效並非理想，並有衍生製 程時間延容之缺失；再者，其透過上下部空間屋力差，而迫使轉印紙下垂 變形而覆蓋於待轉印表面之技術，將因轉印紙之變形度限制，對於待轉印 物鄰近於與承载平台表面間交接部位之表面，將無法完全覆蓋，使得轉印 • 成易產生邊緣未轉印完全之職，影響了成品之品質。 【發明内容】 因此’本發明之主要目的即係在提供一種熱轉印方法，其係可有效地 利用能源，並可雜轉物覆胁待轉印物表科之良好附著度。 本發明之另-目酬係在提供—種雜印方法，其於轉印至立體物表 面時，確保轉印之範圍得達到立體物表面之邊緣，維持產品之品質。 緣是，為達成上述目的，本發明所提供之熱轉印方法乃係使彼此貼接 而處於轉印狀態下之轉印物及受轉印物位於一處於大氣壓域態下之封閉 加壓空間中，藉由增加該加壓·内之氣歷力，使所增加之_壓力作 用於該轉印物上，俾以之迫壓該轉印物，使該轉印物受壓而緊貼於所貼接 之受轉印物表面上。 而其具體之步驟則係包含了有： a. 將片狀轉印物與受轉印物並置，且彼此相隔開來，而於該轉印物與受 轉印物間形成封閉之真空^室。 b. 提供熱能予該轉印物，並抽離該真空腔室中之氣體^ 201215494 C.以外力推動該受轉印物朝向該轉印物所在之位置移動，使之抵接於該 轉印物之-側片面，細使轉印物在受到該受轉印物之推擠下，沿著該 受轉印物之表面輪_變形呈與該受轉印物形狀相仿之凹室，俾以之使該 轉印物之-則面貼接於該受轉印物之待轉印部位之表面上，而將該轉印 物上之預定圖樣轉印至該受轉印物之待轉印部位之表面。 d·維持該轉印物與該受轉印物彼此貼接之狀態，並使之位於一為大氣壓 力狀態下之封閉加壓空間中。 e·增加該加壓空間中之氣壓值，使氣體壓力作用於該轉印物之另側片面 上，提尚該轉印物一側片面與該受轉印物表面間之貼合緊密度。 f·將各該轉印物與受轉印物移出該加壓空間，並將其彼此分離開來。 【實施方式】 以下，茲舉本發明一較佳實施例，並配合圖式作進一步說明，其中： 第一圖係本發明一較佳實施例之示意圖。 請參閱第一圖所示’在本發明一較佳實施例中所提供之熱轉印方法 (10)，係包含了有下述之步驟·· a_取用一頂端透空之載盤(2〇)，將以乙烯醋酸乙烯酯(EVA, ETHYLENE VINYL ACETATE)原料經由模外發泡製成之鞋中底之受轉印物(30)置入該載 盤(20)容納空間(21)中之一底模板(22)上，並使一片狀轉印物(40)位於該載 盤(20)開口上方；而其中，該底模板(22)上係設有多數突伸往上之載台 (221)，用以分別承載對應之一受轉印物(30)，並使各該載台(221)投影於水 平面上之形狀與所承載之受轉印物(30)投影於水平面上之形狀相同。 b.使該轉印物(40)以底側片面抵接於該載盤(20)開口端上，並以一形狀 201215494 與該健(2〇)開口形狀及尺寸均相仿之框(50)予以迫壓，使該轉印物(4〇)被 $夾於該框⑽與該載盤⑽間，用以封閉該載盤⑽之開口，使之呈密 閉，俾以於該轉印物(40)與各該受轉印物(3〇)間形成封閉之真空腔室⑽。 c_使-加熱器_位於該健⑽開口上謂#高度位置上，提供熱能 以幅射方式供給予雜印物_上，同時贿該真空腔室(23)内之氣體。 d. 移開該加熱器(60)，另以外力驅動該下模板(22)向上位移帶動各該 受轉印物(30)向上抵接於該轉印物(40)之底側片面上，使該轉印物⑽該受 • 轉印物(30)之推擠而沿著該受轉印物(3〇)之表面形狀變形呈對應之凹室 (41)，據以使該轉印物(4〇)上之圖樣轉印至所接觸之該受轉印物(3〇)表面 上，並持續向上移動適當距離，使該轉印物(4〇)頂侧片面所在之水平面低於 該各該載台(221)頂側台面所在之最低水平面，換言之，即係使凹室(々I)之 深度大於對應受轉印物(3〇)之最大厚度。 e. 移除該框(50)。 f·以一底端透空之壓力罩(70)以開口端抵壓於該轉印物(4〇)之頂侧片面 • 上，俾使該轉印物(40)封閉該壓力罩(70)之開口端，據以使該壓力罩(7〇)之 内部空間形成一處於大氣壓力狀態下之封閉加壓空間(71)。 g_提高該加壓空間(71)内之氣體壓力，使增加之氣體壓力作用於該轉印 物(40)之頂侧片面上，迫使各該凹室(41)緊貼於所容納之受轉印物(30)表面 上’增加該轉印物(40)與受轉印物(30)間貼合之緊密性，俾確保轉印之品質。 h_將各該轉印物及受轉印物(40)(30)移出該加壓空間(71)。 i_將位於各該凹室(41)中之受轉印物(30)與該轉印物(40)彼此分離開 來，以獲得已轉印之受轉印物(30)。 201215494 纟中’在該e步驟及f步驟間’乃係維持該受轉印物(3Q掩人於對應凹 t(41)内之狀態’將_印物_及該受轉印物⑽水平鑛，使之位於一 相異於4 c步驟實施時所在之位置，換言之，㈣使之位於賴力罩⑽ 所在位置之下方，俾利於該壓力罩(7G)形成該加壓空間(71)。 藉由上述方法’該熱轉印方法(10)係具有下述之功效： 其，與該步驟d相同之習用技術，由於其乃係使轉印物(4〇)及受轉 印物(30)¾之環威壓值呈真空狀態，換言之，即該轉印物㈣頂側片面所 φ 在之環境係於大氣狀態下’因此，僅得以大氣壓力作用於轉印物(4〇)之頂側 片面’使之貼抵於受轉印物(3〇)之表面上，惟，此等壓力值並無法達到良好 的轉印品質； 而本發明所提供之熱轉印方法’係進一頻供如步則及9所揭露之方 法，透過增加該轉印物(4_側片面所在環境之壓力值，以達到良佳之轉印 絲，同時’由於該步驟f中之加磨空間被形成之始，乃係處於大氣塵力狀 ‘vl下因此、續行增加之壓力所需之能源並無庸如習用技術般由真空狀態 Φ 提昇般的耗費，而可達到節省能源之功效。 此一技術上之特徵除如上揭實施例所說明對多側表面實施之立體轉印 外’縱於對受轉印物之單侧表面實施平面轉印時，亦同樣得以發揮其確保 轉印品質及節省能源之具體功效。 其二’在步驟d中，其係使受神物⑽之鶴距離受到控制，以於 該轉印物(4〇)上形成較深的凹室(41)，據此，係得以控做該凹室㈣開口 端周側之轉折部位，得以遠離該受轉印物(30)之周側底端邊緣，如此一來， 係可避免受轉印物(30)之周侧底端邊緣與該凹室(41)開口端位於同一水平 201215494 面上時，所衍生轉印物(40)因受限於轉折部位之非直角倒角角度之限制，而 無法完全轉印至受轉印物(30)周側底端邊緣之缺失，以確保產品之品質。 另外’需被特別指出者係，上開實施例固係以特定材質之鞋中底為例， 惟其實際實施上並不以之為限，而可將該方法實施於諸多不同型態與材質 之物品表面進行品肢好之鱗印加工；^，該轉印紐亦非魏於 僅得實施對娜卩狄鳩峨立_卩者，細概轉印物之單 ^表面實施單-平哪卩，軌’增__者僅軸說明本發 I之:内urr本發明之中請專利範圍所受保護範圍之限制條 二：：範圍所涵〜施，及·所製成 之物者，均應為本案所應受保護之範疇。 201215494 【圖式簡單說明】 ' 第一圖係本發明一較佳實施例之示意圖。 【主要元件符號說明】 (10)熱轉印方法 （20)載盤 (22)底模板 （221)載台 (40)轉印物 （41)凹室 (60)加熱器 （70)壓力罩 (21)容納空間 (30)受轉印物 (50)框 (71)加壓空間201215494 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to printing technology, and more particularly to a thermal transfer method. [Prior Art] According to the thermal transfer technique, a specific pattern is pre-printed on a thermal transfer cartridge, and the pattern is attached to the surface of the article to be printed by a transfer film by the action of heat and pressure. The conventional technology has been widely used in the general printing industry technology, but from the perspective of the process of technological development, the transfer technology is based on the lithography method. 'Specifically' is the storage and pressure provided by the plate-shaped pressure plate, and the transfer paper and the object to be transferred are inspected between the red plate of the platen, and the pattern on the transfer paper is rotated along with the side of the pressure. The printing film is attached to the surface of the article to be transferred. These flat transfer printing techniques have a specific single direction in terms of the pressure action provided. Therefore, they can only be applied to the transfer of a flat surface, and the transfer requirements such as curved or three-dimensional surfaces cannot be applied. . It is disclosed in the prior art that a technique for transferring a curved surface or a three-dimensional surface by vacuum is disclosed. For example, the color film vacuum transfer machine disclosed in Japanese No. 24892 is an example. The vacuum transfer method is such that the transfer paper and the object to be transferred are placed in a confined space and bounded by the transfer paper, so that the sealed space is partitioned into a space in which the upper and lower portions are not connected: With Zhao pump _ each of the empty _ legs, the shape of the wire, the atmosphere into the upper space 'to make it pressure, the pressure transfer film deformation with the three-dimensional contour of the object to be transferred, attached to On the surface of the transfer material, at the same time, since the transfer paper and the object to be transferred are in a vacuum state, the surface is attached to prevent the gas from being sealed between the transfer paper and the surface to be transferred 201215494. To ensure the quality of the finished product. , __ lining method, solid can provide the right - or the surface of the three-dimensional object (four) printing processing, and Huaiqi still has its unsatisfactory, more prominent two, one is the first to make the upper space 纟After the vacuum, the technology of _« is not ideal, and there is a lack of extension of the process time. In addition, it forces the transfer paper to sag and cover the surface to be transferred through the difference in the upper and lower space. The technology will be limited by the degree of deformation of the transfer paper, and the surface of the object to be transferred adjacent to the interface between the surface of the transfer platform and the surface of the transfer platform will not be completely covered, so that the transfer is easy to produce the edge without transfer completely, affecting The quality of the finished product. SUMMARY OF THE INVENTION Therefore, the main object of the present invention is to provide a thermal transfer method which can effectively utilize an energy source and which can protect a good adhesion of a table to be transferred. Another aspect of the present invention is to provide a method of misprinting which ensures transfer of the surface to the edge of the three-dimensional object and maintains the quality of the product when transferred to the surface of the three-dimensional object. In order to achieve the above object, the thermal transfer method provided by the present invention is a closed pressurization space in which the transfer material and the transfer material in a transfer state are attached to each other in an atmospheric pressure state. By increasing the gas pressure in the pressurization, the increased pressure is applied to the transfer material, and the transfer material is pressed to press the transfer material to be pressed against Attached to the surface of the transfer target. The specific steps include: a. juxtaposed the sheet-like transfer material and the transfer-receiving object, and are separated from each other, and form a closed vacuum chamber between the transfer material and the transfer-receiving object. . b. supplying thermal energy to the transfer material and withdrawing the gas in the vacuum chamber ^ 201215494 C. External force pushes the transfer object toward the position where the transfer object is located, so as to abut the transfer The side-side surface of the object is such that, under the push of the object to be transferred, the transfer material is deformed along the surface of the object to be transferred into an alcove similar to the shape of the object to be transferred, The surface of the transfer object is attached to the surface of the transfer target to be transferred, and the predetermined pattern on the transfer material is transferred to the transfer target of the transfer object. The surface. d. maintaining the state in which the transfer material and the transfer-receiving material are attached to each other, and is placed in a closed pressurized space in a state of atmospheric pressure. e. Increasing the pressure value in the pressurized space so that the gas pressure acts on the other side surface of the transfer material to improve the adhesion tightness between the one side of the transfer material and the surface of the transfer target. f. Each of the transfer material and the transfer-receiving material are removed from the pressurized space and separated from each other. BRIEF DESCRIPTION OF THE DRAWINGS In the following, a preferred embodiment of the present invention will be further described with reference to the drawings, wherein: FIG. 1 is a schematic view of a preferred embodiment of the present invention. Referring to the first embodiment, the thermal transfer method (10) provided in a preferred embodiment of the present invention comprises the following steps: a_taking a top-loaded carrier ( 2〇), the transfer material (30) of the midsole made of the material of the ethylene vinyl acetate (EVA, ETHYLENE VINYL ACETATE) is molded into the carrier (20) receiving space (21). One of the bottom templates (22), and a piece of the transfer material (40) is located above the opening of the carrier (20); and wherein the bottom template (22) is provided with a plurality of protrusions upwardly The stage (221) is configured to respectively carry a corresponding one of the transfer objects (30), and the shape of each of the stages (221) projected on the horizontal surface and the loaded transfer object (30) are projected on the horizontal plane. The shape is the same. b. The transfer material (40) is abutted on the open end of the carrier (20) with a bottom side surface, and has a shape (2012) similar to the shape and size of the opening (2012). Pressing the pressure to cause the transfer material (4〇) to be sandwiched between the frame (10) and the carrier (10) for closing the opening of the carrier (10) to be hermetically sealed for the transfer product ( 40) Forming a closed vacuum chamber (10) with each of the transfer-receiving members (3 turns). The c_使-heater _ is located at the height position of the health (10) opening, providing thermal energy for giving the masculine _ on the radiation while bribing the gas in the vacuum chamber (23). d. removing the heater (60), and driving the lower die plate (22) by an external force to drive the respective transfer material (30) to abut on the bottom side surface of the transfer object (40). The transfer material (10) is pushed by the transfer material (30) to deform along the surface shape of the transfer object (3) into a corresponding concave chamber (41), so that the transfer material is The pattern on (4〇) is transferred onto the surface of the transferred object (3〇) that is in contact with it, and is continuously moved upward by an appropriate distance so that the horizontal plane of the top side of the transfer material (4〇) is lower than the The lowest level of the top side of each stage (221), in other words, the depth of the recess (々I) is greater than the maximum thickness of the corresponding transfer material (3〇). e. Remove the box (50). f. The pressure cover (70) with a bottom end is vacantly pressed against the top side surface of the transfer material (4〇), so that the transfer material (40) closes the pressure cover (70) The open end of the pressure cover (7〇) is such that a closed pressurized space (71) is formed under atmospheric pressure. G_ increasing the pressure of the gas in the pressurized space (71) such that the increased gas pressure acts on the top side surface of the transfer material (40), forcing each of the recesses (41) to be in close contact with the contained On the surface of the transfer material (30), the adhesion between the transfer material (40) and the transfer target (30) is increased, and the quality of the transfer is ensured. H_ Each of the transfer material and the transfer-receiving object (40) (30) is removed from the pressurized space (71). I_ separates the transfer material (30) located in each of the recesses (41) from the transfer material (40) to obtain the transferred transfer material (30). 201215494 纟中 'Between the e step and the f step' is to maintain the transfer material (3Q is concealed in the corresponding concave t (41) state ' _ printed matter _ and the transfer material (10) horizontal mine , so that it is located at a position different from the implementation of the 4 c step, in other words, (4) is placed below the position of the reliance cover (10), so that the pressure hood (7G) forms the pressurized space (71). According to the above method, the thermal transfer method (10) has the following effects: It is the same conventional technique as the step d, because it is a transfer product (4 〇) and a transferable material (30) The ring pressure value of 3⁄4 is in a vacuum state, in other words, the top side of the transfer material (4) is in the atmosphere of the environment. Therefore, only the atmospheric pressure acts on the top side of the transfer material (4〇). The one-sided surface is attached to the surface of the transfer material (3〇), but these pressure values cannot achieve good transfer quality; and the thermal transfer method provided by the present invention is provided as a frequency supply. Steps and 9 methods disclosed, by increasing the pressure value of the transfer material (4_ side sheet surface environment, in order to achieve a good transfer yarn, the same 'Because the grinding space in this step f is formed, it is in the air dust force 'vl, so the energy required to continue the increased pressure is not as expensive as the conventional technology. The energy-saving effect can be achieved. The technical feature is that, except for the three-dimensional transfer performed on the multi-side surface as described in the above embodiments, the planar transfer is performed on the one-side surface of the transfer-receiving object. The same effect can be achieved by ensuring the transfer quality and saving energy. In the second step, the distance between the cranes of the gods (10) is controlled to form a contrast on the transfer material (4〇). a deep recess (41), whereby the turning portion of the peripheral side of the open end of the recess (4) is controlled to be away from the peripheral side edge of the peripheral side of the transferable material (30), so that When the peripheral edge of the peripheral side of the transferable material (30) is at the same level as the open end of the recess (41) on the 201215494 surface, the derivative (40) is limited by the non-right angle chamfer of the turning portion. The angle is limited and cannot be completely transferred to the bottom side of the peripheral side of the transferable material (30) The lack of to ensure the quality of the product. In addition, 'the special need to be pointed out, the upper embodiment is solid with a specific material of the shoe midsole as an example, but the actual implementation is not limited to it, but this method can be Implemented on the surface of many different types of materials and materials for the processing of the scales of the limbs; ^, the transfer button is not Wei Wei only has to implement the Nadi Di 鸠峨 _ _ _ _ _ _ _ _ _ _ _ _ Single surface implementation of single-flat, 轨 轨 增 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ • The manufactured objects should be in the scope of protection for this case. 201215494 [Simplified illustration] The first figure is a schematic view of a preferred embodiment of the present invention. [Description of main component symbols] (10) Thermal transfer method (20) Carrier disk (22) Bottom template (221) Stage (40) Transfer material (41) Alcove (60) Heater (70) Pressure cover ( 21) accommodating space (30) by the transfer material (50) frame (71) pressurized space