201213148 六、發明說明： 【發明所屬之技術領域】 [0001] 本案係關於一種列印系統，尤指一種以無線傳輸方式傳 遞資料信號至喷墨頭模組之控制晶片内部之列印系統。 [先前技術] [0002] 現行噴墨列印技術曰趨複雜，各種喷墨頭模組皆有其特 定規格，可包含使用墨水、喷孔數、噴墨控制電路及識 別電路等，因此，需搭配相容的列印系統才能正確地完 成列印工作，故需要一控制電路以控制噴墨頭模組作動 ，並將控制電路做為喷墨頭模組可用於該列印系統之依 據。 [0003] 請參閲第一圖’其係為習知列印系統之示意圖，如圖所 示，習知列印系統“係與電腦1〇連接，且可由接收處理 資料單元111以及喷墨頭模組112所組成，其中，該接收 處理資料單元111係透過多組傳輸線電連接至喷墨頭模組 112之金屬接點，喷墨頭模組112内更龙含一喷墨晶片 1121 ’且喷墨晶片1:1...21内部係包含控制電路11 211以及 喷墨電路11212，其中喷墨電路11212内部包含複數個喷 墨加熱元件（未圖示）。當該列印系統丨丨内部之接收處理 資料單元111接收到電腦1 〇所傳遞之列印訊號時，接收處 理資料單元ill會將該列印訊號傳遞至噴墨頭模組112以 驅動噴墨電路1121之控制電路11211，而使控制電路 11 2 11控制喷墨電路11 21 2進行喷墨列印。 [00〇4] 然而’由於噴墨頭模組112在進行喷墨列印時，因控制電 路11211及噴墨電路11212係製作於同—喷墨晶片1121内 099133396 表單編號A0101 第4頁/共16頁 0992058388-0 201213148 ’如此會造成控制電路11 211受噴墨電路11212内部之嘴 墨加熱元件所產生之高熱影響’使控制電路11211有錯亂 或干擾現象’將造成喷墨異常’以及控制電路11211易與 墨水侵蚀的問題。 [0005] 再者，喷墨頭模組112係透過多組金屬接點與接收資料處 理單元111之傳輸線電連接，造成成本過高，且該金屬接 點亦容易因受到噴墨加熱元件所產生之高熱影響而損壞 ，致使搔收列印訊號異常，造成列印效果不佳。 0 [0006] [0007] ❹ [0008] 因此’如何發展-種可解決上述習知缺點之列印系統， 實為目前迫切需要解決之問題。 【發明内容】 / 本案之主要目的在於提供一種列印系統，解決習知列印 系統内之喷墨頭模組之金屬接點製程之高成本且容易因 受到喷墨域轉所產生之高歸響㈣壞，以及控制 電路及喷墨電路設置於同—喷墨晶片内，使得控制電路 受高熱影響’㈣觀或干祕象，造成噴墨異常 墨水侵蝕的問題。 " 099133396 …幻“ R廣我貫施態樣為提供-種列 P系統與—電子裝置連接，至少包含接收及 :理賁：：，與該電子裝置連接，用以自該電子裝置 接收一列印^號並處理成_資料 至少包含：-控制晶片 、‘頭杈組， 端處理單元、包含-天線、一前及解調變單元，供以無二:傳送時脈單元以及-調變 表單編號A0101 第5’頁/共u輪方式與該接收及處理資料 0992058388-0 201213148 單元通訊，以接收該資料信號，該控制電路係包含一控 制處理單元、一編碼及解碼處理單元以及一記憶裝置， 供以接收經由無線傳輸模組處理後之資料信號，並將該 資料信號轉換成一控制信號；一喷墨加熱晶片，與該控 制電路連接，用以因應該控制信號之驅動而進行噴墨列 【實施方式】 [0009] 體現本案特徵與優點的一些典型實施例將在後段的說明 中詳細敘述。應理解的是本案能夠在不同的態樣上具有 各種的變化，其皆不脫離本案的範圍，且其中的說明及 圖式在本質上係當作說明之用，而非用以限制本案。 請同時參閱第二圖及第三圖，其中，第二圖係為本案較 佳實施例之列印系統之結構示意圖，第三圖係為第二圖 所示之控制晶片之内部電路結構示意圖，如圖所示，本 案之列印系統21係與電子裝置20連接，電子裝置20可為 電腦、手機等電子設備，列印系統21可由接收及處理資 料單元22及喷墨頭模組23所組成，其中，接收及處理資 料單元22係與電子裝置20連接，用以接收電子裝置20所 傳9001之列印信號並將列印信號處理為一資料信號，而 噴墨頭模組23内部則可包含控制晶片231及喷墨加熱晶片 232，本案之接收及處理資料單元22可設置於例如一印表 機本體上，而噴墨頭模組23則可設置於一列印匣上。 以下就本案喷墨頭模組23内部採用包含控制晶片231及喷 墨加熱晶片232之優點做說明： 該控制晶片231作為控制喷墨頭模組23内部之控制電路， 而該噴墨加熱晶片232做為喷墨頭模組23内部之喷墨電路 099133396 表單編號 A0101 第 6 頁/共 16 頁 0992058388-0 201213148 ，其控制方式為電子裝置20 (例如電腦）給予列印系統 21 (例如：印表機）列印信號，列印系統21接收並處理 信號，送到噴墨頭模組23中，並由控制晶片231再次處理 後，送到噴墨加熱晶片2 3 2產生列印信號，則完成一列印 動作。 如此控制方式有下列優點：201213148 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a printing system, and more particularly to a printing system for transmitting data signals by wireless transmission to a control chip inside an inkjet head module. [Prior Art] [0002] The current inkjet printing technology is becoming more and more complicated, and various inkjet head modules have their specific specifications, and may include ink, number of orifices, inkjet control circuits, and identification circuits, etc., therefore, With a compatible printing system to complete the printing work correctly, a control circuit is needed to control the operation of the ink jet head module, and the control circuit can be used as the basis of the ink jet head module for the printing system. [0003] Please refer to the first figure, which is a schematic diagram of a conventional printing system. As shown in the figure, a conventional printing system is connected to a computer 1 and can receive a processing data unit 111 and an inkjet head. The module 112 is configured to be electrically connected to the metal contacts of the inkjet head module 112 through a plurality of sets of transmission lines. The inkjet head module 112 further includes an inkjet wafer 1121'. The inkjet wafer 1:1...21 internally includes a control circuit 11 211 and an inkjet circuit 11212, wherein the inkjet circuit 11212 internally includes a plurality of inkjet heating elements (not shown). When the printing system is inside the printing system When the receiving processing data unit 111 receives the printing signal transmitted by the computer 1 , the receiving processing data unit ill transmits the printing signal to the inkjet head module 112 to drive the control circuit 11211 of the inkjet circuit 1121. The control circuit 11 11 controls the ink jet circuit 11 21 2 to perform ink jet printing. [00〇4] However, since the ink jet head module 112 performs ink jet printing, the control circuit 11211 and the ink jet circuit 11212 Was produced in the same - inkjet wafer 1121 0991333 96 Form No. A0101 Page 4 of 16 0992058388-0 201213148 'This will cause the control circuit 11 211 to be affected by the high heat generated by the ink heating element inside the inkjet circuit 11212 'causing the control circuit 11211 to be confused or disturbed' The ink jet head module 112 is electrically connected to the transmission line of the receiving data processing unit 111 through a plurality of sets of metal contacts, thereby causing cost. High, and the metal contact is also easily damaged by the high heat generated by the inkjet heating element, resulting in abnormal printing signal, resulting in poor printing performance. 0 [0006] [0007] ❹ [0008] 'How to develop a kind of printing system that can solve the above-mentioned conventional shortcomings, which is an urgent problem to be solved at present. [Inventive content] / The main purpose of the present invention is to provide a printing system to solve the spray in the conventional printing system. The high cost of the metal contact process of the ink head module is easy to be caused by the high return of the ink jet domain (four), and the control circuit and the inkjet circuit are disposed in the same inkjet In the wafer, the control circuit is affected by high heat '(4) view or dry secret image, causing the problem of inkjet abnormal ink erosion. " 099133396 ... 幻" R 广 我 为 为 为 为 为 种 种 种 种 种 种 种 种 种 种 种 种 种 种The connection, comprising at least the receiving and receiving::, is connected to the electronic device, and is configured to receive a column of the printing number from the electronic device and process the data into at least: - a control chip, a 'head set, an end processing unit, Including - antenna, a front and demodulation unit, for the second: the transmission clock unit and - modulation form number A0101 5' page / common u wheel mode and the receiving and processing data 0992058388-0 201213148 unit communication, Receiving the data signal, the control circuit includes a control processing unit, an encoding and decoding processing unit, and a memory device for receiving the data signal processed by the wireless transmission module, and converting the data signal into a control signal An inkjet heating chip is connected to the control circuit for performing inkjet column driving according to the driving of the control signal [Embodiment] [0009] embodying the characteristics of the present invention Some exemplary embodiments described point will be described in detail in the subsequent stage. It is to be understood that the present invention is capable of various modifications in various aspects, and is not intended to limit the scope of the invention. Please refer to the second and third figures, wherein the second drawing is a schematic structural view of the printing system of the preferred embodiment of the present invention, and the third drawing is a schematic diagram of the internal circuit structure of the control chip shown in the second figure. As shown in the figure, the printing system 21 of the present invention is connected to the electronic device 20. The electronic device 20 can be an electronic device such as a computer or a mobile phone. The printing system 21 can be composed of a receiving and processing data unit 22 and an inkjet head module 23. The receiving and processing data unit 22 is connected to the electronic device 20 for receiving the printing signal transmitted by the electronic device 20 and processing the printing signal into a data signal, and the inkjet head module 23 can be internally The control chip 231 and the inkjet heating chip 232 are included. The receiving and processing data unit 22 of the present invention can be disposed on, for example, a printer body, and the inkjet head module 23 can be disposed on a printing pad. The following description will be made on the inside of the ink jet head module 23 of the present invention including the control wafer 231 and the ink jet heating wafer 232: The control wafer 231 serves as a control circuit for controlling the inside of the ink jet head module 23, and the ink jet heating wafer 232 As the inkjet circuit 099133396 in the inkjet head module 23, the form number A0101, page 6 of 1692058388-0 201213148, is controlled by the electronic device 20 (for example, a computer) to the printing system 21 (for example, a printing table) The printer prints the signal, and the printing system 21 receives and processes the signal, sends it to the inkjet head module 23, and processes it again by the control wafer 231, and then sends it to the inkjet heating chip 2323 to generate a printing signal, which is completed. A print action. This control method has the following advantages:
(1) 因控制電路多為數位邏輯電路，可製作成控制晶片 231，而噴墨電路則維持舊有技術製作，如此則可大大降 低數位邏輯電路在喷墨加熱晶巧上232所佔有的空間，使 付喷墨加熱晶片2 3 2.的成本降低，而控制.電路也可使用先 進技術製作成控制晶片231，:亦降低了成本。 (2) 以往控制電路與噴墨電路製作於同一噴墨晶片上，如 此則會造成數位邏輯電路受高熱影響，使數位邏輯電路 有錯亂或干擾之現象，將造成喷墨上異常，因此使用本 案方法可予以解決改善》 (3) 因控制電路使用當前先進技術製作，如此在一個小的(1) Since the control circuit is mostly a digital logic circuit, it can be made into a control chip 231, and the inkjet circuit maintains the old technology, so that the space occupied by the digital logic circuit on the inkjet heating chip 232 can be greatly reduced. The cost of the inkjet heating chip 2 3 is reduced, and the control circuit can also be fabricated into the control wafer 231 using advanced technology: the cost is also reduced. (2) In the past, the control circuit and the inkjet circuit were fabricated on the same inkjet wafer. This would cause the digital logic circuit to be affected by high heat, which would cause the digital logic circuit to be disordered or interfered, which would cause an abnormality on the inkjet. Therefore, the use of the case The method can be solved to improve" (3) because the control circuit is made using current advanced technology, so in a small
控制晶片231上’將可設置多紐控制電路，用以同時控制 多個喷墨加熱晶片232。 7 ' (4)因控制電路與喷墨電路設置在不同晶片上，故控制電 路受喷墨元件干擾（如加熱元件熱效應、墨水侵蚀）將大 大降低，甚至沒有，故可整合無線傳輸技術及控制電路 在同一晶片中’即控制晶片231 ’而無線傳輸技術用於印 表機本體及控制晶片231之間’當控制大量噴墨加熱晶片 232進行噴墨時’使用於印表機本鱧與控制晶片231間的 大量連接線將可降至最少甚至沒有。 又請再參閱第三圖，本案之控制晶片231可包含無線傳輸 099133396 表單編號A0101 第7頁/共16頁 0992058388-0 201213148 模組2311以及控制電路2312，於本實施例中，無線傳輪 模組231可包含天線23111、前端處理單元23112、調變 及解調變單元23113、指令單元23114及傳送時脈單元 23115，其係以無線傳輸方式與接收及處理資料單元通 訊，以接收該資料信號，並對資料信號進行解調變等相 關處理。而控制電路2312則可包含控制處理單元23121 、編碼及解碼處理單元231 22及記憶裝置23123，其係接 收經由無線傳輸模組2311處理後之資料信號並將該資料 信號2轉換成一控制信號。 °月同時參閱第一圖、策三圖及第四圖其:中第四圖係為 第二圖所示之喷墨加熱晶片内部所包含之加熱元件的電 路結構圖，如圖所示，本案之噴墨加熱晶片232與控制晶 片231之間係以有線傳輸方式連接，且包食有複數個加熱 元件2321，用以因應控制晶片231之控制電路2312所傳 送之控制k號的驅動而使加熱元件2 3 21進行喷墨列印。 請再參閱第四圖，噴墨加熱晶片232内部所包含之每一加 熱疋件2321係由驅動電晶體s、如熱電阻器R、輸入端點a (Address)、P (power)以及一個共接端點（c〇M)所 組成，其中加熱電阻器R一端連接於驅動電晶體5的汲極 端（Drain)，另一端連接於輸入端點p，至於共接端點 (COM)與輸入端點a分別連接於驅動電晶體5的源極端（ Source)以及閘極端（Gate)，而該共接端點（c〇M)與 接地端相連接，當欲執行喷墨動作時，會由輸入端點八傳 送一位址化號（3(1(1“33 signal)，使驅動電晶體s導通 ，同時輸入端點P會傳送一電源信號（p〇wer signal) ，如此一來，加熱電阻器R的溫度升高，而將墨水加熱使 099133396 表單編號A0101 第8頁/共16頁 0992058388-0 201213148 之產生氣泡進而將墨水喷至喷墨列印媒體上。 月再參閱第二圖及第四圖，本案之控制晶片231之控制電 路2312傳送至噴墨加熱晶片232之控制信號可包含加熱元 件2321之輸入端點▲及？所需之位址信號及電源信號，但 不以此為限，於一些實施例中，控制電路2312傳送炱喷 墨加熱晶片232之控制信號可僅為一位址信號，玄於，輸 入端點P所需之電源信號則可透過有線傳輸方式傳遞。 综上所述，本案之列印系統内部之控制晶片及喷墨加熱 ◎ 曰曰片係以二獨立晶片之方式實蜱，故當喷墨加熱晶片對 噴墨頭模組内部之墨水進行加熱時，加熱元件所產生之 鬲熱不會影響控制晶片之正常運作，再者，由於接收及 處理資料單元與噴墨頭模組之間係以無線傳輸方式傳遞 成號，故噴墨頭模組已不需要金屬接點以傳輸資料，可 大幅減低製程上之成本，同時也可避免喷墨加熱晶片之 加熱元件運作所產生之高熱，影響信號之傳遞，造成列 印欵果不佳之情形發生。 ，丨 Q 本案得由熟知此技術之人士任施匠思而為諸般修飾，然 皆不脫如附申請專利範圍所欲保護者。 【圖式簡單說明】 [〇〇1〇]第一圖：其係為習知列印系統之示意圖。 [0011] 第二圖：其係為本案較佳實施例之列印系統之結構示意 圖。 [0012] 第三圖：其係為第二圖所示之控制晶片之内部電路結構 示意圖。 099133396 第四圖：其係為第二圖所示之喷墨加熱晶片 表單編號A0101 第9頁/共16頁 内部所包含 0992058388-0 [0013] 201213148 之加熱元件的電路結構圖。 【主要元件符號說明】 [0014] 電腦：10 [0015] 列印系統：1 1、2 1 [0016] 接收及處理資料單元： 111 '22 [0017] 喷墨頭模組：112、23 [0018] 喷墨晶片：11 21 [0019] 控制電路：11211、2312 [0020] 喷墨電路：11212 [0021] 電子裝置：20 [0022} 控制晶片：231 [0023] 嘴墨加熱晶片.232 [0024] 無線傳輸模組：2311 [0025] 天線：23111 [0026] 前端處理單元：23112 [0027] 調變及解調變單元：23113 [0028] 指令單元：23114 [0029] 傳送時脈單元：23115 [0030] 控制處理單元：23121 [0031] 編碼及解碼處理單元： 23122 表單編號A0101 第10頁/共16頁 099133396 0992058388-0 201213148 [0032] [0033] [0034] [0035] [0036] ' [0037] ΟOn the control wafer 231, a multi-button control circuit can be provided for simultaneously controlling a plurality of ink-jet heating wafers 232. 7 ' (4) Because the control circuit and the inkjet circuit are placed on different wafers, the control circuit is greatly disturbed by the inkjet component (such as the heating element thermal effect, ink erosion), or even not, so the wireless transmission technology and control can be integrated. The circuit is in the same wafer 'ie control wafer 231' and the wireless transmission technology is used between the printer body and the control wafer 231 'When controlling a large number of inkjet heating wafers 232 for inkjetting' used in printers and controls A large number of connections between the wafers 231 will be minimized or even absent. Referring to the third figure, the control chip 231 of the present invention may include a wireless transmission 099133396 form number A0101 page 7 / a total of 16 pages 0992058388-0 201213148 module 2311 and a control circuit 2312. In this embodiment, the wireless transmission mode The group 231 can include an antenna 23111, a front end processing unit 23112, a modulation and demodulation unit 23113, an instruction unit 23114, and a transmission clock unit 23115, which communicate with the receiving and processing data unit in a wireless transmission manner to receive the data signal. And the data signal is demodulated and processed. The control circuit 2312 can include a control processing unit 23121, an encoding and decoding processing unit 231 22, and a memory device 23123, which receive the data signal processed by the wireless transmission module 2311 and convert the data signal 2 into a control signal. At the same time, refer to the first figure, the third picture and the fourth picture. The fourth picture is the circuit structure diagram of the heating element contained in the inkjet heating chip shown in the second figure, as shown in the figure, the case The inkjet heating chip 232 and the control wafer 231 are connected by wire transmission, and a plurality of heating elements 2321 are enriched for heating according to the driving of the control k number transmitted by the control circuit 2312 of the control wafer 231. Element 2 3 21 performs ink jet printing. Referring to the fourth figure, each heating element 2321 included in the inkjet heating chip 232 is driven by a driving transistor s, such as a thermal resistor R, an input terminal a (Address), a P (power), and a total The terminal (c〇M) is composed of one end, wherein one end of the heating resistor R is connected to the drain of the driving transistor 5, and the other end is connected to the input terminal p, and the common terminal (COM) and the input end Point a is respectively connected to a source terminal and a gate of the driving transistor 5, and the common terminal (c〇M) is connected to the ground terminal, and when the inkjet action is to be performed, the input is input. Endpoint eight transmits a bit address number (3 (1 (1" 33 signal) to make the driving transistor s turn on, and the input terminal P transmits a power signal (p〇wer signal), thus heating resistor The temperature of the device R rises, and the ink is heated to cause bubbles to be generated by the 099133396 form number A0101 page 8/16 pages 0992058388-0 201213148. The ink is sprayed onto the inkjet printing medium. In the four figures, the control circuit 2312 of the control wafer 231 of the present case is transferred to the inkjet heating chip 232. The signal may include the input terminal ▲ of the heating element 2321 and the desired address signal and power signal, but not limited thereto. In some embodiments, the control circuit 2312 transmits the control signal of the inkjet heating chip 232. It can be only a single address signal, and the power signal required for the input terminal P can be transmitted through wired transmission. In summary, the control chip and inkjet heating inside the printing system of this case ◎ The two separate wafers are implemented. Therefore, when the inkjet heating wafer heats the ink inside the inkjet head module, the heat generated by the heating component does not affect the normal operation of the control chip, and further, due to reception. The processing data unit and the inkjet head module are transmitted by wireless transmission. Therefore, the inkjet head module does not need metal contacts to transmit data, which can greatly reduce the cost of the process, and can also avoid spraying. The high heat generated by the operation of the heating element of the ink heating chip affects the transmission of the signal, which causes the printing result to be poor. 丨Q The case is made by a person familiar with the technology. For the sake of all kinds of modifications, it is not necessary to protect the scope of the patent application. [Simplified illustration] [〇〇1〇] First picture: It is a schematic diagram of the conventional printing system. [0011] Figure 2 is a schematic view showing the structure of the printing system of the preferred embodiment of the present invention. [0012] Figure 3 is a schematic diagram showing the internal circuit structure of the control chip shown in Figure 2. 099133396 It is a circuit configuration diagram of the heating element of 0992058388-0 [0013] 201213148 which is internally contained in the ink jet heating wafer form number A0101 shown in the second figure. [Main component symbol description] [0014] Computer: 10 [0015] Printing system: 1 1, 2 1 [0016] Receiving and processing data unit: 111 '22 [0017] Inkjet head module: 112, 23 [0018] Inkjet wafer: 11 21 [0019] Control circuit: 11211, 2312 [0020] Inkjet circuit: 11212 [0021] Electronic device: 20 [0022] Control wafer: 231 [0023] Mouth ink heating wafer. 232 [0024] Wireless transmission module: 2311 [0025] Antenna: 23111 [0026] Front-end processing unit: 23112 [0027] Modulation and demodulation unit: 23113 [0028] Command unit: 23114 [0029] Transmission clock unit: 23115 [0030] Control processing unit: 23121 [0031] Encoding and decoding processing unit: 23122 Form number A0101 Page 10/16 pages 099133396 0992058388-0 201213148 [0033] [0034] [0036] [0037] Ο
記憶裝置：23123 加熱元件：2321 加熱電阻器：R 驅動電晶體：S 輸入端點：A、Ρ 共接端點：COMMemory device: 23123 Heating element: 2321 Heating resistor: R Drive transistor: S Input terminal: A, Ρ Common terminal: COM
099133396 表單編號A0101099133396 Form number A0101
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